Antenna Board

Abstract

The antenna substrate of the embodiment includes an insulating layer, a circuit layer disposed on the insulating layer, and a protective layer disposed on the insulating layer and the circuit layer, the protective layer being disposed to cover an upper surface of the insulating layer, a side surface of the circuit layer, and an upper surface of the circuit layer, and has a dielectric constant Dk of 20 to 40.

Description

[Technical field]

[0001] The embodiments relate to an antenna substrate and an antenna device including the antenna substrate. [Background technology]

[0002] Recently, efforts have been made to develop improved 5G (fifth generation) or pre-5G communication systems to meet the demands of wireless data traffic.

[0003] To achieve high data transmission rates, 5G communication systems use ultra-high frequency (mmWave) bands (sub6 GHz, 28 GHz, 38 GHz or higher). These high frequency bands are called mmWave due to the length of their wavelengths.

[0004] In order to mitigate the path loss of radio waves in the ultra-high frequency band and increase the transmission distance of radio waves, integration technologies such as beamforming, massive MIMO, and array antennas are being developed in 5G communication systems.

[0005] Considering that active antennas can consist of hundreds of wavelengths in such frequency bands, the antenna systems may be relatively large.

[0006] This means that the multiple boards that make up the active antenna system, namely the antenna board, the antenna feed board, the transceiver board, and the baseband board, must be integrated into one compact unit.

[0007] Recently, a technique has been developed in which the resonant frequency of an antenna is formed by using a dielectric layer having a high dielectric constant.

[0008] Specifically, in a conventional antenna substrate, a dielectric layer having a high dielectric constant is disposed on the top or bottom side of the substrate, and the high dielectric constant dielectric layer is used to enable an antenna patch included in the antenna substrate to resonate in a specific resonant frequency band.

[0009] However, the high dielectric constant dielectric layer applied to the conventional antenna substrate has a structure including an epoxy molding compound (EMC) formed using a molding process.

[0010] At this time, the conventional antenna substrate including the epoxy molding compound has a problem of increasing the overall thickness, and also has various process problems in forming the EMC layer. Summary of the Invention [Problem to be solved by the invention]

[0011] The embodiments provide an antenna substrate having a new structure and an antenna device including the same.

[0012] Furthermore, the embodiments provide an antenna substrate that allows the substrate to be slimmed down and the resonant frequency to be shifted, and an antenna device including the antenna substrate.

[0013] Also, the embodiments provide an antenna substrate capable of reducing the distance between a plurality of antenna patches, and an antenna device including the same.

[0014] The technical problems to be solved in the embodiments are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary skill in the art to which the present invention pertains from the following description. [Means for solving the problem]

[0015] The antenna substrate of the embodiment includes an insulating layer, a circuit layer disposed on the insulating layer, and a protective layer disposed on the insulating layer and the circuit layer, the protective layer being disposed to cover an upper surface of the insulating layer, a side surface of the circuit layer, and an upper surface of the circuit layer, and has a dielectric constant Dk of 20 to 40.

[0016] The circuit layer is an antenna section disposed on the uppermost side of the antenna substrate, and the protective layer is the insulating layer and a solder resist disposed on the antenna section.

[0017] The protective layer also includes a resin and a filler disposed in the resin, the filler comprising at least one of TiO2, Al2O3, BaTiO3, and CaTiO3.

[0018] The content of the filler in the protective layer falls within the range of 35 wt % to 85 wt %.

[0019] The circuit layer includes a plurality of antenna parts disposed on the insulating layer at a distance from each other, and two adjacent antenna parts among the plurality of antenna parts are spaced apart from each other by a distance of 0.5 mm to 1.5 mm.

[0020] The antenna portions are arranged alternately or in a zigzag pattern in a diagonal direction on the insulating layer, and the interval is a diagonal separation distance between two antenna portions arranged adjacent to each other.

[0021] The protective layer includes a first region overlapping the circuit layer in a thickness direction and a second region excluding the first region, and the thickness of the first region of the protective layer falls within a range of 5 μm to 25 μm.

[0022] Furthermore, the upper surface of the first region of the protective layer is flush with the upper surface of the second region of the protective layer.

[0023] Further, the upper surface of the first region of the protective layer has a step with respect to the upper surface of the second region of the protective layer.

[0024] On the other hand, the antenna substrate of the embodiment includes an insulating layer, a circuit layer arranged on the insulating layer, a first protective layer arranged on the insulating layer, and a second protective layer arranged on the circuit layer, the first protective layer having a first dielectric constant, the second protective layer having a second dielectric constant larger than the first dielectric constant, and the second dielectric constant being in the range of 4 to 14 times the first dielectric constant.

[0025] Moreover, the circuit layer is an antenna section disposed on the uppermost side of the antenna substrate, and the first and second protective layers are solder resists disposed on the insulating layer or the antenna section, respectively.

[0026] The first protective layer is disposed on the upper surface of the insulating layer and on the circuit layer, and the second protective layer is disposed in a region of the upper surface of the first protective layer that overlaps with the circuit layer in a thickness direction.

[0027] Moreover, the width of the second protective layer is greater than the width of the circuit layer.

[0028] The circuit layer further includes a plurality of antenna portions disposed on the insulating layer, and the second protective layer includes a plurality of patterns vertically overlapping the plurality of antenna portions, respectively.

[0029] Moreover, the first protective layer includes an opening overlapping the circuit layer in a thickness direction, and the second protective layer is disposed within the opening of the first protective layer in direct contact with an upper surface of the circuit layer.

[0030] Moreover, the width of the opening of the first protective layer is larger than the width of the circuit layer, and the second protective layer is disposed to enclose the upper surface and side surfaces of the circuit layer.

[0031] Moreover, an upper surface of the first protective layer is located lower than an upper surface of the second protective layer, and at least a portion of the second protective layer is disposed on the upper surface of the first protective layer.

[0032] In addition, the first protective layer includes a first filler, and the second protective layer includes a second filler of a material different from the first filler, and the second filler includes at least one of TiO2, Al2O3, BaTiO3, and CaTiO3.

[0033] Furthermore, the first filler in the first protective layer has a first content, and the second filler in the second protective layer has a second content greater than the first content, and the second content satisfies the range of 35 wt% to 85%.

[0034] The circuit layer further includes a plurality of antenna parts arranged alternately or in a zigzag pattern in a diagonal direction on the insulating layer, and the diagonal spacing between two adjacent antenna parts among the plurality of antenna parts is in the range of 0.5 mm to 1.5 mm. Effect of the Invention

[0035] The antenna substrate of the embodiment includes an insulating layer, a circuit layer disposed on the insulating layer, and a protective layer. In this case, the protective layer includes a first region that vertically overlaps the circuit layer and a second region that does not vertically overlap the circuit layer. The protective layer has a dielectric constant in the range of 20 to 40. The first region of the protective layer can function to shift the resonance frequency of a radiation beam emitted by the circuit layer. In addition, the second region of the protective layer can function to reduce the interval between a plurality of antenna parts that constitute the circuit layer.

[0036] As a result, in the embodiment, the EMC layer included in the antenna substrate of the comparative example can be removed, and the problems associated with the EMC layer can be solved.

[0037] Furthermore, in the embodiment, the size of the circuit layer (specifically, the planar area) can be reduced by shifting the resonant frequency using the first region of the protective layer. As a result, in the embodiment, the horizontal width of the antenna substrate can be reduced. In addition, in the embodiment, the circuit layer included in the antenna substrate can be integrated. In addition, in the embodiment, the number of antenna parts arranged in the same area can be increased compared to the comparative example. In addition, in the embodiment, the electronic device including the antenna substrate can be miniaturized.

[0038] In addition, in the embodiment, the interval between the plurality of antenna units can be reduced by using the second region of the protective layer. Specifically, in the embodiment, even if the interval between the plurality of antenna units is reduced compared to the comparative example, signal interference that may occur between the plurality of antenna units can be prevented. As a result, in the embodiment, mutual signal interference between the plurality of antenna units can be prevented, and antenna characteristics and performance can be improved. In addition, in the embodiment, the circuit layer included in the antenna substrate can be integrated. In addition, in the embodiment, the number of antenna units arranged in the same area can be increased compared to the comparative example.

[0039] Meanwhile, the circuit layer in the embodiment includes a plurality of antenna parts arranged on an insulating layer. In this case, in the embodiment, the first region and the second region of the protective layer are used to arrange the plurality of antenna parts on the insulating layer in an alternating or zigzag manner. That is, in the embodiment, the plurality of antenna parts are arranged on the insulating layer in an alternating or zigzag manner, thereby further improving the integration degree of the antenna parts. As a result, in the embodiment, the antenna characteristics and performance can be further improved.

[0040] Meanwhile, the protective layer in the embodiment includes a first protective layer and a second protective layer, the first protective layer being a protective layer having a relatively low dielectric constant, and the second protective layer being a protective layer having a relatively high dielectric constant.

[0041] The second protective layer may be disposed in an area vertically overlapping the circuit layer. The first protective layer may be selectively disposed in an area where the second protective layer is not disposed. This allows the antenna characteristics and performance to be maximized while minimizing the area in which the second protective layer is disposed in the embodiment. [Brief description of the drawings]

[0042] [Figure 1] FIG. 13 is a diagram showing an antenna substrate according to a comparative example. [Diagram 2] 1A and 1B are diagrams for explaining the layout structure of an antenna substrate according to an embodiment of the present invention; [Diagram 3] 3 is a cross-sectional view showing the antenna substrate of FIG. 2. [Figure 4] 2 is a cross-sectional view showing some layers of the antenna substrate in accordance with the first embodiment. FIG. [Diagram 5] 5 is a plan view showing some layers of the antenna substrate of FIG. 4. [Figure 6] FIG. 4 is a diagram for explaining the characteristics of a protective layer applied to the first embodiment. [Figure 7] FIG. 4 is a diagram for explaining the resonant frequency characteristics of the antenna substrate according to the first embodiment. [Figure 8] 4A and 4B are diagrams for comparing a circuit layer according to the first embodiment with a circuit layer of a comparative example. [Figure 9] FIG. 11 is a diagram showing a modified example of the layout structure of the circuit layers according to the first embodiment. [Figure 10] FIG. 11 is a diagram showing an antenna substrate according to a second embodiment. [Figure 11] FIG. 13 is a diagram showing an antenna substrate according to a third embodiment. [Figure 12] FIG. 13 is a diagram showing an antenna substrate according to a fourth embodiment. [Figure 13] FIG. 13 is a diagram showing an antenna substrate according to a fifth embodiment. [Figure 14] FIG. 13 is a diagram showing an antenna substrate according to a sixth embodiment. [Figure 15] FIG. 13 is a diagram showing an antenna substrate according to a seventh embodiment. [Figure 16]FIG. 13 is a diagram showing an antenna substrate according to an eighth embodiment. [Figure 17] FIG. 13 is a diagram showing an antenna substrate according to a ninth embodiment. [Figure 18] FIG. 23 is a diagram showing an antenna substrate according to a tenth embodiment. [Figure 19] FIG. 1 is a diagram illustrating an antenna device according to a first embodiment. [Figure 20] FIG. 11 is a diagram illustrating an antenna device according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0043] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0044] However, the technical concept of the present invention is not limited to the described embodiments and may be realized in various different forms, and one or more of the components of the embodiments may be selectively combined or substituted within the scope of the technical concept of the present invention.

[0045] Furthermore, unless otherwise clearly defined and described, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that may be commonly understood by a person having ordinary knowledge in the technical field to which the present invention belongs, and commonly used terms, such as terms defined in a dictionary, may be interpreted in light of the contextual meaning of the relevant art.

[0046] In addition, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention. In the present specification, the singular form can include the plural form unless otherwise specified in the phrase, and when it is described as "A and (and) at least one (or more) of B and C", it can include one or more of all combinations that can be combined with A, B, and C.

[0047] In addition, in describing components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. Such terms are merely used to distinguish the components from other components, and do not determine the essence, order, or procedure of the components. Furthermore, when a component is described as being "coupled," "coupled," or "connected" to another component, it may include not only the case where the component is directly coupled, coupled, or connected to the other component, but also the case where the component is "coupled," "coupled," or "connected" between the other component and the other component or by another component.

[0048] In addition, when described as being formed or disposed "above or below" each component, "above" or "below" includes not only the case where two components are in direct contact with each other, but also the case where one or more other components are formed or disposed between the two components. In addition, when described as "above or below," it can include not only the upper direction based on one component, but also the lower direction.

[0049] Before describing the antenna substrate of the present application and the antenna device including the same, an antenna substrate according to a comparative example will be described.

[0050] -Comparative Example-

[0051] FIG. 13 is a diagram showing an antenna substrate according to a comparative example.

[0052] FIG. 1(a) is a cross-sectional view of an antenna substrate according to a comparative example, and FIG. 1(b) is a plan view of a partial configuration of the antenna substrate according to the comparative example.

[0053] With reference to (a) and (b) of FIGS. 1, the antenna substrate of the comparative example includes an insulating layer 10. As shown in FIG.

[0054] The antenna substrate of the comparative example also includes a circuit layer 20 disposed on the insulating layer 10. The circuit layer 20 refers to an antenna patch disposed on the insulating layer 10.

[0055] In the antenna substrate of the comparative example, the insulating layer 10 has a multi-layer structure. As a result, the circuit layer 20 is disposed on each insulating layer having the multi-layer structure. The circuit layer 20 in FIG. 1 indicates the circuit layer disposed on the uppermost side of the antenna substrate among the multiple circuit layers.

[0056] The circuit board of the comparative example includes a protective layer 30 disposed on an insulating layer 10. The protective layer 30 is a solder resist. The protective layer 30 of the comparative example has a dielectric constant Dk of 3.0 to 5.0.

[0057] In this case, in the comparative example, the circuit layer 20 is an antenna patch that resonates in a specific resonant frequency band. In this case, the antenna substrate of the comparative example includes a dielectric layer 40 disposed on the protective layer 30 so that the circuit layer 20 resonates in the specific resonant frequency band. In this case, the dielectric layer 40 of the comparative example has a dielectric constant Dk in the range of 10 to 20. In the comparative example, the dielectric layer 40 is used to enable the circuit layer 20 to radiate a radiation beam in a target resonant frequency band.

[0058] At this time, the dielectric layer 40 of the comparative example is an epoxy mold compound layer (EMC layer) formed by using a molding process. At this time, there is a limit to the minimum thickness of the EMC layer that can be formed by using the molding process. For example, the EMC layer of the comparative example has a thickness of 300 μm or more. As a result, there is a problem that the antenna substrate of the comparative example has an overall thickness that is increased by the thickness of the dielectric layer 40. As a result, there is a problem that the thickness of the antenna device to which the antenna substrate of the comparative example is applied increases, and therefore the thickness of the electronic device corresponding to the antenna device increases.

[0059] In addition, the dielectric layer 40 having a high dielectric constant is more expensive than a dielectric layer having a lower dielectric constant, and therefore, the antenna substrate of the comparative example has a problem that the thickness of the dielectric layer 40 is relatively thick, which increases the manufacturing cost of the antenna substrate.

[0060] Furthermore, when an EMC layer corresponding to the dielectric layer 40 is formed using a mold processor, there is a problem that the mold resin flows out of the mold due to the characteristics of the manufacturing processor, resulting in a problem of reduced yield.

[0061] Meanwhile, a plurality of circuit layers 20 in the comparative example may be arranged on the insulating layer 10 at intervals in the longitudinal or width direction. For example, the circuit layer 20 includes a first antenna patch 20-1 and a second antenna patch 20-2 that are spaced apart from each other. At this time, the protective layer 30 is arranged between the first antenna patch 20-1 and the second antenna patch 20-2 in the comparative example. Specifically, the dielectric layer 40 in the comparative example does not overlap the first antenna patch 20-1 and the second antenna patch 20-2 in the horizontal direction.

[0062] As a result, the first antenna patch 20-1 and the second antenna patch 20-2 in the comparative example are spaced apart by a constant distance D1. At this time, the first antenna patch 20-1 and the second antenna patch 20-2 in the comparative example are spaced apart from each other with a distance D1 of 1.7 mm or more. That is, in the comparative example, only the protective layer 30 having a relatively low dielectric constant is disposed between the first antenna patch 20-1 and the second antenna patch 20-2. As a result, in the comparative example, the first antenna patch 20-1 and the second antenna patch 20-2 are disposed with a distance of 1.7 mm or more between them, thereby solving the mutual interference between the first antenna patch 20-1 and the second antenna patch 20-2. At this time, in the comparative example, there is a problem that the space in which the circuit layer 20 is disposed increases due to the distance d1 between the first antenna patch 20-1 and the second antenna patch 20-2. As a result, in the comparative example, there is a problem that the width of the antenna substrate in the horizontal direction increases.

[0063] Meanwhile, in the comparative example, instead of the dielectric layer 40 having a high dielectric constant, one of the insulating layers having a multi-layer structure is made of a prepreg having a high dielectric constant. However, when the insulating layer is made of a prepreg having a high dielectric constant, there is a problem that the warpage characteristics are deteriorated. For example, the antenna substrate of the comparative example has a problem that the warpage characteristics of the substrate are deteriorated due to the difference in dielectric constant between the prepreg having a high dielectric constant and the other insulating layers except the prepreg during the process of laminating multiple insulating layers in the manufacturing process of the antenna substrate.

[0064] In addition, when manufacturing antenna substrates containing high dielectric constant prepregs, static electricity and out-gas that are harmful to the product can be generated, which can cause voids and lead to physical or electrical reliability problems.

[0065] Meanwhile, in the case of an antenna device applied to a 5G communication system, more data is transmitted and received than in a conventional communication system, and in order to transmit and receive more data as described above, the battery capacity must be increased as the battery consumption increases. In order to increase the battery capacity, the battery size must be increased, and therefore the space for arranging the battery must be increased.

[0066] As a result, in a typical 5G communication system, the thickness of the antenna package substrate is reduced in order to maintain the size of the antenna device (e.g., a mobile terminal device) while increasing the size of the battery.

[0067] At this time, there is a limit to how much the thickness of the insulating layer or the circuit layer can be reduced in order to reduce the thickness of the antenna package substrate, and when the thickness of the antenna pattern is randomly reduced, there is a problem that communication performance is degraded (for example, the transmission strength of the transmission signal or the reception strength of the reception signal is reduced).

[0068] As a result, in the embodiment, the thickness of the antenna substrate can be reduced compared to the comparative example, while the area on the antenna substrate where the antenna patch is disposed can be reduced.

[0069] An antenna substrate according to an embodiment will be described below.

[0070] FIG. 2 is a diagram for roughly explaining the arrangement structure of the antenna substrate of the embodiment, FIG. 3 is a cross-sectional view showing the antenna substrate of FIG. 2, FIG. 4 is a cross-sectional view showing some layers of the antenna substrate of the first embodiment, FIG. 5 is a plan view showing some layers of the antenna substrate of FIG. 4, FIG. 6 is a diagram for explaining the characteristics of the protective layer applied to the first embodiment, FIG. 7 is a diagram for explaining the resonant frequency characteristics of the antenna substrate of the first embodiment, FIG. 8 is a diagram for comparing the circuit layer of the first embodiment with the circuit layer of the comparative example, and FIG. 9 is a diagram showing a modified arrangement structure of the circuit layer of the first embodiment.

[0071] The antenna substrate according to the first embodiment will be specifically described below with reference to FIGS.

[0072] The antenna substrate of the embodiment may include an insulating layer 110 , a circuit layer 120 , a through electrode 130 , and a protective layer 140 .

[0073] The insulating layer 110 may be provided for feeding and supporting the antenna substrate. The insulating layer 110 may have a flat plate structure. The insulating layer 110 may be formed of a single layer, or may include a plurality of layers in which a plurality of layers are stacked.

[0074] The insulating layer 110 may include a first insulating layer 111, a second insulating layer 112, and a third insulating layer 113. However, the embodiment is not limited thereto. For example, the insulating layer 110 may have two or less layers, or alternatively, may have four or more layers.

[0075] The insulating layer 110 may include a prepreg (PPG). The prepreg may be formed by impregnating a fiber layer in the form of a fabric sheet, such as a glass fabric woven with glass fiber yarn, with epoxy resin, and then performing thermal compression. However, the embodiment is not limited thereto, and the prepreg constituting the insulating layer 110 may include a fiber layer in the form of a fabric sheet woven with carbon fiber yarn.

[0076] For example, the insulating layer 110 may be rigid or flexible.

[0077] Each of the insulating layers constituting the insulating layer 110 may have a thickness in the range of 10 μm to 60 μm. Preferably, each of the insulating layers constituting the insulating layer 110 may have a thickness in the range of 12 μm to 50 μm. More preferably, each of the insulating layers constituting the insulating layer 110 may have a thickness in the range of 15 μm to 40 μm.

[0078] If the thickness of each insulating layer constituting the insulating layer 110 is less than 10 μm, the circuit layer included in the antenna substrate may not be stably protected. If the thickness of each insulating layer constituting the insulating layer 110 exceeds 60 μm, the thickness of the antenna substrate, antenna device, and electronic device may increase. If the thickness of each insulating layer constituting the insulating layer 110 exceeds 60 μm, the thickness of the circuit layer and the through electrode may increase accordingly. In addition, if the thickness of the circuit layer and the through electrode increase, the signal transmission loss may increase.

[0079] A circuit layer 120 may be disposed on a surface of the insulating layer 110. The circuit layer 120 may refer to a circuit layer that performs an antenna function. For example, the circuit layer 120 may refer to an antenna pattern layer. For example, the circuit layer 120 may refer to an antenna patch.

[0080] The circuit layer 120 may have a number of layers.

[0081] For example, the circuit layer 120 may include a first circuit layer 121 disposed on a first insulating layer 111, a second circuit layer 122 disposed on a second insulating layer 112, and a third circuit layer 123 disposed on a third circuit layer 113.

[0082] In this case, in the drawings, the circuit layer 120 includes the first to third circuit layers 121, 122, and 123, but is not limited thereto.

[0083] The circuit layer 120 may include a ground layer (not shown) for grounding, a power supply layer (not shown) for power supply, and a radiation layer (not shown) for signal radiation. As an example, the ground layer, the power supply layer, and the radiation layer may be disposed on different insulating layers.

[0084] However, the embodiment is not limited thereto, and the circuit layer corresponding to the antenna part among the circuit layers 120 of the embodiment may be disposed on the surface of any one of the insulating layers, but not disposed on the surface of at least one other insulating layer. For example, when the insulating layers of the embodiment include the first to third insulating layers, the circuit layer 120 may be disposed on the upper surface or lower surface of any one of the first to third insulating layers, but not disposed on the upper surface or lower surface of at least one other insulating layer.

[0085] The circuit layer 120 of the embodiment may be provided on an antenna substrate for transmitting and receiving signals. The circuit layer 120 may transmit and receive signals in a predetermined resonant frequency band. For example, the circuit layer 120 may operate in a predetermined resonant frequency band to transmit and receive electromagnetic waves. The circuit layer 120 may be operated by power supplied from a power supply unit (not shown).

[0086] In this case, the circuit layer 120 can resonate in at least one resonant frequency band.

[0087] As an example, the circuit layer 120 may be a resonant antenna that resonates in a first frequency band of 24.03 GHz to 25.81 GHz and a second frequency band of 27.07 GHz to 28.80 GHz.

[0088] As another example, the circuit layer 120 may be a dual resonant antenna that resonates in different resonant frequency bands, for example, the circuit layer 120 may be a dual resonant antenna that resonates in a first frequency band of 24.03 GHz to 25.81 GHz and a second frequency band of 27.07 GHz to 28.80 GHz.

[0089] Meanwhile, the circuit layer 120 in Fig. 4 may refer to an antenna patch arranged on the outermost edge (clearly, the uppermost or lowermost side) of the antenna substrate among a plurality of circuit layers. Specifically, unlike the circuit layers 120 of the embodiment, which are arranged on different insulating layers, the circuit layers 120 may be arranged on only one insulating layer. In this case, the arrangement structure of the circuit layer 120 may be determined based on the resonant frequency band.

[0090] The circuit layer 120 may be formed on the insulating layer 110 to have a thickness of 10 μm to 25 μm. Preferably, the circuit layer 120 may be formed on the insulating layer 110 to have a thickness of 12 μm to 23 μm. More preferably, the circuit layer 120 may be formed on the insulating layer 110 to have a thickness of 15 μm to 20 μm.

[0091] The circuit layer 120 may include a conductive material. For example, the circuit layer 120 may include at least one metal material selected from the group consisting of gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Preferably, the circuit layer 120 may be formed of copper (Cu), which has high electrical conductivity and is relatively inexpensive.

[0092] The circuit layer 120 can be formed by a typical circuit board manufacturing process such as an additive process, a subtractive process, a modified semi-additive process (MSAP), or a semi-additive process (SAP), and a detailed description thereof will be omitted here.

[0093] The antenna substrate may include a through electrode 130. The through electrode 130 may penetrate the insulating layer 110. For example, the through electrode 130 may electrically connect circuit layers disposed on different layers.

[0094] The through electrode 130 may include a first through electrode (not shown) that penetrates the first insulating layer 111 , a second through electrode 131 that penetrates the second insulating layer 112 , and a third through electrode 132 that penetrates the third insulating layer 113 .

[0095] Meanwhile, a protective layer 140 may be disposed on the insulating layer 110 in the first embodiment. Preferably, when the insulating layer 110 has a multi-layer structure, the protective layer 140 may be disposed on the insulating layer disposed on the uppermost or lowermost side of the insulating layers. Also, when the circuit layer 120 has a multi-layer structure, the protective layer 140 may be disposed on the circuit layer disposed on the insulating layer disposed on the uppermost or lowermost side.

[0096] The protective layer 140 may be a solder resist.

[0097] The planar area of ​​the protective layer 140 in the first embodiment may be the same as or smaller than the planar area of ​​the insulating layer 110. For example, the entire area of ​​the protective layer 140 in the first embodiment may overlap with the insulating layer 110 in the thickness direction (z-axis). For example, the entire area of ​​the insulating layer 110 in the first embodiment may overlap with the protective layer 140 in the thickness direction (z-axis direction).

[0098] Thus, the protective layer 140 can be divided into a plurality of regions.

[0099] The protective layer 140 may include a first region R1 overlapping the circuit layer 120 in a thickness direction (z-axis direction). That is, the protective layer 140 may include a first region R1 in which a lower surface of the protective layer 140 directly contacts an upper surface of the circuit layer 120.

[0100] At this time, the circuit layer 120 may be disposed on the insulating layer 110 at a distance from each other in a first direction (x-axis direction) or a second direction (y-axis direction). For example, the circuit layer 120 includes a first antenna unit 120-1 and a second antenna unit 120-2 disposed at a distance from each other on the insulating layer 110. At this time, in the drawings, the planar shape of the first antenna unit 120-1 and the second antenna unit 120-2 corresponding to the circuit layer 120 is shown to be a quadrangle, but is not limited thereto. For example, the planar shape of the first antenna unit 120-1 and the second antenna unit 120-2 may have various shapes such as a triangle, a circle, an ellipse, a polygon, a star, a sector, a cross, an X-shape, a diamond, a trapezoid, etc.

[0101] The first region R1 of the protective layer 140 may overlap the first antenna portion 120-1 and the second antenna portion 120-2 in the thickness direction (z-axis direction).

[0102] In addition, the protective layer 140 may include a second region R2 that does not overlap with the circuit layer 120 in the thickness direction (z-axis direction). That is, the protective layer 140 may include a second region R2 whose lower surface does not contact the circuit layer 120. For example, the protective layer 140 may include a second region R2 whose lower surface directly contacts the upper surface of the insulating layer 110. For example, the second region R2 of the protective layer 140 may be disposed on the upper surface of the insulating layer 110 in a region on one side of the first antenna unit 120-1, the upper surface of the insulating layer 110 in a region on the other side of the second antenna unit 120-2, and the upper surface of the insulating layer 110 in a region between the other side of the first antenna unit 120-1 and one side of the second antenna unit 120-2, respectively. For example, the second region R2 of the protective layer 140 may be disposed on the upper surface of the insulating layer 110 while contacting at least one side of the first antenna part 120-1 and the second antenna part 120-2.

[0103] In this case, the protective layer 140 of the first embodiment may have a relatively high dielectric constant. For example, the protective layer 140 may have a higher dielectric constant than the protective layer 30 of the comparative example. For example, the dielectric constant Dk of the protective layer 140 may be in the range of 20 to 40. Preferably, the dielectric constant Dk of the protective layer 140 may be in the range of 20.5 to 40. More preferably, the dielectric constant Dk of the protective layer 140 may be in the range of 21 to 40.

[0104] If the dielectric constant Dk of the protective layer 140 is less than 20, the effect of reducing the interval between the antenna units in the embodiment may be insufficient. For example, if the dielectric constant Dk of the protective layer 140 is less than 20, the effect of reducing the size (e.g., planar area) of the antenna units in the embodiment may be insufficient. Specifically, if the dielectric constant Dk of the protective layer 140 is less than 20, there is a limit to reducing the size (thickness in the z-axis direction, width in the x-axis direction, length in the y-axis direction) of the antenna substrate. Also, if the dielectric constant Dk of the protective layer 140 is greater than 40, there may be a problem that the rigidity of the antenna substrate is reduced. Also, if the dielectric constant Dk of the protective layer 140 is greater than 40, there is a problem that the manufacturing cost of the antenna substrate increases due to the use of a relatively expensive protective layer.

[0105] That is, the protective layer 140 in the example can have a higher dielectric constant than the protective layer 30 in the comparative example. For example, the dielectric constant Dk of the protective layer 140 in the example can be in the range of 4 to 14 times the dielectric constant of the protective layer 30 in the comparative example. For example, the dielectric constant Dk of the protective layer 140 in the example can be in the range of 4.1 to 14 times the dielectric constant of the protective layer 30 in the comparative example. For example, the dielectric constant Dk of the protective layer 140 in the example can be in the range of 4.2 to 14 times the dielectric constant of the protective layer 30 in the comparative example.

[0106] For this reason, the filler content in the protective layer 140 of the embodiment may be greater than the filler content in the protective layer 30 of the comparative example.

[0107] Specifically, the protective layer 140 of the embodiment may include a resin and a filler dispersed in the resin. The resin applied to the protective layer 140 may have various forms such as a thermosetting resin, a photosensitive resin, and an ink.

[0108] The filler disposed in the resin of the protective layer 140 may include a different material from the filler disposed in the resin of the protective layer 30 of the comparative example.

[0109] For example, the filler contained in the protective layer 30 of the comparative example may include SiO2.

[0110] Alternatively, the protective layer 140 of the embodiment may include a filler including at least one selected from the group consisting of TiO2, Al2O3, BaTiO3, and CaTiO3. In this case, the dielectric constants of TiO2, Al2O3, BaTiO3, and CaTiO3 are greater than that of SiO2, and the dielectric constant of the protective layer 140 of the embodiment may be greater than that of the protective layer 30 of the comparative example.

[0111] For example, the protective layer 140 of the embodiment may include at least one filler selected from TiO2, Al2O3, BaTiO3, and CaTiO3 in a resin, which may further include SiO2.

[0112] That is, the protective layer 140 of the embodiment may include at least one selected from TiO2, Al2O3, BaTiO3, and CaTiO3. Alternatively, the protective layer 140 of the embodiment may include at least one selected from TiO2, Al2O3, BaTiO3, and CaTiO3, and further include SiO2.

[0113] At this time, as shown in FIG. 6(a), the results of the TGA (thermogravimetric analysis, thermogravimetry) analysis confirmed that the protective layer 30 (SR#1) of the comparative example contained 17.48 wt% of filler, and thus the protective layer 30 (SR#1) of the comparative example had a lower dielectric constant than the protective layer of the example.

[0114] Moreover, the protective layer 30 of the comparative example generally contains a filler content of 34.67 wt % or less, and thus has a relatively low dielectric constant.

[0115] In contrast, as shown in Fig. 6(b), the protective layer 140 (SR#2) of the embodiment contains 65.33 wt% of filler as a result of TGA (thermogravimetric analysis, thermogravimetry) analysis. Specifically, in the present application, the protective layer 140 (SR#2) of the embodiment contains a higher filler content than the comparative example, and therefore, it is confirmed that the protective layer 140 has a higher dielectric constant than the protective layer 30 (SR#1) of the comparative example.

[0116] Furthermore, in an embodiment, the protective layer 140 may contain a filler with a content of 82.52 wt %, so that the protective layer 140 may have a dielectric constant of 30 or more.

[0117] This allows the protective layer 140 of the embodiment to have a higher dielectric constant than the protective layer of the comparative example.

[0118] Specifically, the protective layer 140 of the embodiment has a higher dielectric constant than the protective layer 30 of the comparative example. This may be because the protective layer 140 of the embodiment contains a filler selected from TiO2, Al2O3, BaTiO3, and CaTiO3, which have relatively high dielectric constants. This may also be because the content of the filler contained in the protective layer 140 of the embodiment is higher than the content of the filler contained in the protective layer 30 of the comparative example.

[0119] For example, the protective layer 140 of the embodiment contains a filler content in the range of 35 wt% to 85 wt%. Preferably, the protective layer 140 of the embodiment contains a filler content in the range of 36 wt% to 84 wt%. More preferably, the protective layer 140 of the embodiment contains a filler content in the range of 37 wt% to 83 wt%.

[0120] If the content of the filler in the protective layer 140 is less than 35 wt%, a problem may occur in that the protective layer 140 does not have a required level of dielectric constant. If the content of the filler in the protective layer 140 is more than 84 wt%, a problem may occur in that the product cost increases or the rigidity of the antenna substrate decreases.

[0121] The protective layer 140 of the above embodiment has a dielectric constant Dk in the range of 20 to 40 and a dielectric loss Df in the range of 0.015 to 0.05 by having a filler content of 35 wt% to 85 wt% selected from TiO2, Al2O3, BaTiO3, and CaTiO3.

[0122] On the other hand, the average size of the filler contained in the protective layer 140 of the embodiment may be different from the average size of the filler contained in the protective layer 30 of the comparative example. For example, the average size of the filler contained in the protective layer 30 of the comparative example may be more than 5 μm. In contrast, the average size of the filler contained in the protective layer 140 of the embodiment may be 4 μm or less or 3 μm or less.

[0123] As described above, the embodiment includes a protective layer 140 including a filler having a content of 35 wt% to 85 wt% including at least one of TiO2, Al2O3, BaTiO3, and CaTiO3. The protective layer 140 has a dielectric constant Dk in the range of 20 to 40. The protective layer 140 includes a first region R1 overlapping the circuit layer 120 in the thickness direction (z-axis direction) as shown in the drawing.

[0124] Thus, the radiation beam emitted from the circuit layer 120 can pass through the first region R1 of the protective layer 140 having a high dielectric constant. Therefore, in the embodiment, the radiation beam in the circuit layer 120 passes through the first region R1 of the protective layer 140, so that the resonant frequency band formed by the circuit layer 120 can be shifted to a desired target frequency band.

[0125] At this time, as shown in FIG. 7(a), in the case of the structure including the protective layer 30 (SR#1) of the comparative example, it was confirmed that the peak frequency of the resonance frequency was formed at 26.3 GHz.

[0126] In contrast, in the case of the structure in which the protective layer 140 (SR#2) of the embodiment is applied, as shown in FIG. 7(b), it was confirmed that the peak frequency of the resonance frequency is formed at 25.10 GHz. In other words, it was confirmed that when the protective layer 140 of the embodiment is applied, the resonance frequency formed by the circuit layer 120 is shifted downward by about 1200 MHz with respect to the resonance frequency formed by the circuit layer of the comparative example.

[0127] In the embodiment, by shifting the resonant frequency as described above, the planar area of ​​the circuit layer 120 can be reduced compared to the comparative example.

[0128] In other words, the planar area of ​​the circuit layer 120 increases in proportion to the resonant frequency of the circuit layer 120. In this case, the embodiment can shift the resonant frequency downward by about 1200 MHz compared to the comparative example, and accordingly, the planar area of ​​the circuit layer 120 can be reduced compared to the comparative example.

[0129] Specifically, the width W1 of the circuit layer 120 of the embodiment may be smaller than the width w1 of the circuit layer 20 of the comparative example. For example, due to the shift in the resonant frequency, the width W1 of the circuit layer 120 of the embodiment may be in the range of 50% to 90% of the width w1 of the circuit layer 20 of the comparative example. For example, due to the shift in the resonant frequency, the width W1 of the circuit layer 120 of the embodiment may be in the range of 50% to 87% of the width w1 of the circuit layer 20 of the comparative example. For example, due to the shift in the resonant frequency, the width W1 of the circuit layer 120 of the embodiment may be in the range of 50% to 85% of the width w1 of the circuit layer 20 of the comparative example.

[0130] As a result, in the embodiment, the area of ​​the antenna substrate occupied by the circuit layer 120 can be reduced, and thus the horizontal width of the antenna substrate can be reduced. Furthermore, in the embodiment, the number of circuit layers 120 arranged in an antenna substrate having the same area as the comparative example can be increased. For example, in the embodiment, the number of circuit layers arranged in the same area can be increased compared to the comparative example. For example, in the embodiment, the integration degree of the circuit layers 120 can be improved.

[0131] Meanwhile, the first region R1 of the protective layer 140 in the embodiment functions to collect the radiation beam emitted from the circuit layer 120 as described above. For example, the first region R1 of the protective layer 140 in the embodiment functions to shift the resonant frequency of the circuit layer 120.

[0132] Moreover, the protective layer 140 of the embodiment further includes a second region R2 other than the first region R1.

[0133] At this time, the second region R2 is disposed between a plurality of circuit layers. Specifically, a first antenna unit 120-1 and a second antenna unit 120-2 spaced apart from each other are disposed on the insulating layer 110. The second region R2 of the protective layer 140 is disposed in a region between the first antenna unit 120-1 and the second antenna unit 120-2 on the upper surface of the insulating layer 110. For example, the second region R2 of the protective layer 140 is disposed between the other side surface of the first antenna unit 120-1 adjacent to the second antenna unit 120-2 and one side surface of the second antenna unit 120-2 adjacent to the first antenna unit 120-1.

[0134] At this time, the second region R2 of the protective layer 140 has a dielectric constant Dk in the range of 20 to 40, similar to the first region R1. As a result, in the embodiment, since the second region R2 of the protective layer 140 has a high dielectric constant, the distance D1 between the first antenna portion 120-1 and the second antenna portion 120-2 can be reduced.

[0135] For example, the first antenna unit 120-1 and the second antenna unit 120-2 must be spaced apart from each other to prevent signal interference between them. In the comparative example, the antenna units (e.g., antenna patches) are spaced apart from each other by a distance D1 of 1.7 mm or more. This is because a high dielectric constant protective layer, as in the embodiment, is not disposed between the antenna units in the comparative example.

[0136] In contrast, in the embodiment, the second region R2 of the protective layer 140 can reduce the distance D1 between the first antenna part 120-1 and the second antenna part 120-2 compared to the comparative example.

[0137] For example, the distance D1 between the first antenna unit 120-1 and the second antenna unit 120-2 of the embodiment may be 1.5 mm or less. For example, the distance D1 between the first antenna unit 120-1 and the second antenna unit 120-2 of the embodiment may be 1.2 mm or less. For example, the distance D1 between the first antenna unit 120-1 and the second antenna unit 120-2 of the embodiment may be 1.0 mm or less.

[0138] For example, the distance D1 between the first antenna unit 120-1 and the second antenna unit 120-2 in the embodiment may be in the range of 0.5 mm to 1.5 mm. Preferably, the distance D1 between the first antenna unit 120-1 and the second antenna unit 120-2 in the embodiment may be in the range of 0.6 mm to 1.5 mm. More preferably, the distance D1 between the first antenna unit 120-1 and the second antenna unit 120-2 in the embodiment may be in the range of 0.8 mm to 1.5 mm.

[0139] If the distance D1 between the first antenna unit 120-1 and the second antenna unit 120-2 is less than 0.5 mm, interference between the first antenna unit 120-1 and the second antenna unit 120-2 may occur. For example, if the distance D1 between the first antenna unit 120-1 and the second antenna unit 120-2 is less than 0.5 mm, the dielectric constant of the protective layer 140 must be 50 or more to solve the interference, and this may cause problems.

[0140] If the distance D1 between the first antenna unit 120-1 and the second antenna unit 120-2 exceeds 1.5 mm, the integration density of the circuit layer 120 may decrease. For example, if the distance D1 between the first antenna unit 120-1 and the second antenna unit 120-2 exceeds 1.5 mm, the area in which the circuit layer 120 is disposed may increase, and thus the horizontal width of the antenna substrate may increase.

[0141] Meanwhile, the protective layer 140 of the embodiment may have a certain thickness and be disposed on the insulating layer 110 and the circuit layer 120 .

[0142] For example, the second region R2 of the protective layer 140 may have a first thickness T1. In this case, the first thickness T1 of the second region R2 may be determined based on the thickness of the circuit layer 120. For example, the first thickness T1 of the second region R2 may be greater than the thickness of the circuit layer 120. In this case, the thickness of the circuit layer 120 may be in the range of 10 μm to 25 μm as described above.

[0143] As a result, the first thickness T1 of the second region R2 of the protective layer 140 may be in the range of 15 μm to 40 μm. For example, the first thickness T1 of the second region R2 of the protective layer 140 may be in the range of 18 μm to 38 μm. For example, the first thickness T1 of the second region R2 of the protective layer 140 may be in the range of 20 μm to 35 μm.

[0144] As a result, the second thickness T2 of the first region R1 of the protective layer 140 can be in the range of 5 μm to 25 μm. For example, the second thickness T2 of the first region R1 of the protective layer 140 can be in the range of 8 μm to 23 μm. For example, the second thickness T2 of the first region R2 of the protective layer 140 can be in the range of 10 μm to 20 μm.

[0145] If the second thickness T2 of the first region R1 of the protective layer 140 is less than 5 μm, the degree of shift in the resonant frequency of the circuit layer 120 due to the first region R1 of the protective layer 140 may be insufficient. If the second thickness T2 of the first region R1 of the protective layer 140 exceeds 25 μm, the overall thickness of the antenna substrate may increase by the thickness of the protective layer 140. In addition, if the second thickness T2 of the first region R1 of the protective layer 140 exceeds 25 μm, the product unit price may increase.

[0146] Meanwhile, in the drawings, the upper surface of the first region R1 and the upper surface of the second region R2 of the protective layer 140 are shown to be disposed on the same plane, but are not limited thereto. For example, the upper surfaces of the first region R1 and the second region R2 of the protective layer 140 may have a step. For example, the upper surface of the first region R1 of the protective layer 140 may be positioned higher than the upper surface of the second region R2. For example, the upper surface of the second region R2 of the protective layer 140 may be positioned on the same plane as the upper surface of the circuit layer 120. For example, the upper surface of the second region R2 of the protective layer 140 may be positioned higher than the upper surface of the circuit layer 120 and lower than the upper surface of the first region R1 of the protective layer 140. That is, the second region R2 of the protective layer 140 serves to prevent signal interference between a plurality of antenna units of the circuit layer 120. Thus, when the height of the second region R2 of the protective layer 140 is not lower than the height of the circuit layer 120, the signal interference prevention function can be normally performed. Therefore, in the embodiment, the height of the second region R2 of the protective layer 140 is set to be equal to or slightly higher than the height of the circuit layer 120. As a result, in the embodiment, the layout area of ​​the protective layer 140 can be reduced by the reduction in the height of the second region R2, thereby reducing the unit price of the product.

[0147] As described above, the antenna substrate of the first embodiment includes an insulating layer, a circuit layer and a protective layer disposed on the insulating layer. In this case, the protective layer includes a first region that vertically overlaps with the circuit layer and a second region that does not vertically overlap with the circuit layer. The protective layer has a dielectric constant in the range of 20 to 40. The first region of the protective layer can function to shift the resonance frequency of the radiation beam emitted by the circuit layer. In addition, the second region of the protective layer can function to reduce the interval between the multiple antenna parts that constitute the circuit layer.

[0148] As a result, in the embodiment, the EMC layer included in the antenna substrate of the comparative example can be removed, and the problems associated with the EMC layer can be solved.

[0149] Furthermore, in the embodiment, the size of the circuit layer (specifically, the planar area) can be reduced by shifting the resonant frequency using the first region of the protective layer. As a result, in the embodiment, the horizontal width of the antenna substrate can be reduced. In addition, in the embodiment, the circuit layer included in the antenna substrate can be integrated. In addition, in the embodiment, the number of antenna parts arranged in the same area can be increased compared to the comparative example. In addition, in the embodiment, the electronic device including the antenna substrate can be miniaturized.

[0150] In addition, in the embodiment, the interval between the plurality of antenna units can be reduced by using the second region of the protective layer. Specifically, in the embodiment, even if the interval between the plurality of antenna units is reduced compared to the comparative example, signal interference that may occur between the plurality of antenna units can be prevented. As a result, in the embodiment, mutual signal interference between the plurality of antenna units can be prevented, and antenna characteristics and performance can be improved. In addition, in the embodiment, the circuit layer included in the antenna substrate can be integrated. In addition, in the embodiment, the number of antenna units arranged in the same area can be increased compared to the comparative example.

[0151] Meanwhile, in the embodiment, the size and interval D1 of the first antenna portion 120-1 and the second antenna portion 120-2 of the circuit layer 120 can be reduced by using the first region R1 and the second region R2 of the protective layer 140. As a result, in the embodiment, a plurality of antenna portions can be arranged in a zigzag pattern on the insulating layer 110.

[0152] For example, as shown in FIG. 9, the circuit layer 120 of the embodiment includes a plurality of antenna portions.

[0153] At this time, the plurality of antenna parts include a plurality of first groups 120a arranged in a first direction (x-axis direction) on the insulating layer 110. The plurality of antenna parts also include a second group 120b on the insulating layer 110 spaced apart from the plurality of first groups 120a in a second direction (y-axis direction) and spaced apart from each other in the first direction (x-axis direction).

[0154] In this case, the first groups 120a and the second groups 120b may be arranged alternately or in a zigzag pattern.

[0155] For example, any one of the antenna units included in the first group 120a may be spaced apart from an adjacent antenna unit included in the second group 120b in a diagonal direction (eg, a direction between a first direction and a second direction).

[0156] For example, any one of the antenna units included in the second group 120b may be spaced apart from an adjacent antenna unit included in the first group 120a in a diagonal direction (eg, a direction between a first direction and a second direction).

[0157] For example, a particular antenna portion comprising the first group 120a may be spaced apart in the second direction from a region between two antenna portions of the second group 120b disposed adjacent thereto.

[0158] For example, a particular antenna unit included in the second group 120b may be spaced apart in the second direction from a region between two adjacent antenna units in the first group 120a.

[0159] For example, the first antenna unit included in the first group 120a may be disposed adjacent to the second antenna unit included in the second group 120b. In this case, the first antenna unit of the first group 120a and the second antenna unit of the second group 120b may be spaced apart in a diagonal direction on the insulating layer 110. For example, the first antenna unit of the first group 120a and the second antenna unit of the second group 120b may be spaced apart by a distance D1 in a diagonal direction on the insulating layer 110.

[0160] As described above, in the embodiment, the integration density of the antenna units can be further improved by arranging the multiple antenna units alternately or in a zigzag pattern on the insulating layer, thereby further improving the antenna characteristics and performance in the embodiment.

[0161] Meanwhile, in the drawings, the antenna parts of the first group 120a and the second group 120b are shown to have a rectangular shape, but the shape of the antenna parts is not limited thereto and may be modified into various shapes.

[0162] Additional embodiments of the antenna substrate are described below.

[0163] At this time, in the antenna board of the additional embodiment, detailed description of the configuration substantially the same as that of the antenna board of the first embodiment will be omitted.

[0164] FIG. 10 is a diagram showing an antenna substrate according to the second embodiment.

[0165] Referring to FIG. 10, the antenna substrate includes an insulating layer 210, a circuit layer 220, and a protective layer.

[0166] The insulating layer 210 and the circuit layer 220 may be substantially the same as the insulating layer and the circuit layer of the first embodiment, so detailed descriptions of the insulating layer 210 and the circuit layer 220 will be omitted.

[0167] The circuit layer 220 may include a first antenna portion 220-1 and a second antenna portion 220-2 spaced apart from each other on the insulating layer 210.

[0168] The antenna substrate of the second embodiment may differ from that of the first embodiment in the structure of the protective layer disposed on the insulating layer 210 .

[0169] For example, the antenna substrate of the second embodiment may have a plurality of protective layers disposed on the insulating layer 210 .

[0170] For example, the antenna substrate may include a first protective layer 241 formed on the insulating layer 210 and the circuit layer 220. The antenna substrate may also include a second protective layer 242 disposed on the first protective layer 241. In this case, the second protective layer 242 may be partially disposed on the first protective layer 241.

[0171] The first protective layer 241 may be disposed to cover the entire surfaces of the insulating layer 210 and the circuit layer 220 .

[0172] For example, the circuit layer 220 may include a plurality of antenna units 220-1 and 220-2 spaced apart from each other, and the first protective layer 241 may be disposed to cover all of the upper surfaces of the plurality of antenna units spaced apart from each other and the upper surface of the insulating layer.

[0173] Also, the second protective layer 242 may be disposed on the first protective layer 241 or the circuit layer 220 at regular intervals. That is, the first protective layer 241 is formed in a region vertically overlapping the circuit layer 220. At this time, the circuit layer 220 includes a plurality of antenna parts spaced apart from each other on the insulating layer 210. Therefore, the second protective layer 242 may be formed in a regular pattern on the first protective layer 241 or the circuit layer 220 at regular intervals to correspond to the circuit layer 220.

[0174] The first protective layer 241 and the second protective layer 242 may have different areas. For example, the area of ​​the first protective layer 241 may be larger than the area of ​​the second protective layer 242. As a result, the second protective layer 242 may not be formed on at least a portion of the upper surface of the first protective layer 241. For example, the second protective layer 242 may be selectively disposed only in a region of the upper surface of the first protective layer 241 that vertically overlaps with the circuit layer 220.

[0175] A width W2 of the second protective layer 242 may be greater than a width W1 of the circuit layer 220. Thus, the second protective layer 242 may include a first portion that overlaps the circuit layer 220 in the vertical direction, and a second portion other than the first portion that does not overlap the circuit layer 220. However, the embodiment is not limited thereto, and the second protective layer 242 may have the same width as the circuit layer 220 and the entire area may overlap the circuit layer 220 in the vertical direction.

[0176] The first protective layer 241 may be formed on the insulating layer 210 to have a first thickness T1a. The second protective layer 242 may be formed on the first protective layer 241 to have a second thickness T2a. For example, the second thickness T2a of the second protective layer 242 may be in the range of 5 μm to 25 μm. For example, the second thickness T2a of the second protective layer 242 may be in the range of 8 μm to 23 μm. For example, the second thickness T2a of the second protective layer 242 may be in the range of 10 μm to 20 μm. If the second thickness T2a of the second protective layer 242 is less than 5 μm, the shift of the resonance frequency of the circuit layer 220 caused by the second protective layer 242 may be insufficient. If the second thickness T2a of the second protective layer 242 is more than 25 μm, the overall thickness of the antenna substrate may be increased by the thickness of the second protective layer 242. Furthermore, if the second thickness T2a of the second protective layer 242 exceeds 25 μm, the product cost may increase.

[0177] For this reason, a first thickness T1a of the first protective layer 241 may be greater than the thickness of the circuit layer 220. For example, the first thickness T1a of the first protective layer 241 may be 10.2 μm to 28 μm. Preferably, the first thickness T1a of the first protective layer 241 may be 12.2 μm to 26 μm. More preferably, the first thickness T1a of the first protective layer 241 may be 15.2 μm to 23 μm.

[0178] A first thickness T1a of the first protective layer 241 may be a thickness from an upper surface of the insulating layer 210 to an upper surface of the first protective layer 241. More specifically, the first thickness T1a of the first protective layer 241 may be a thickness of a thickest portion of the entire region of the first protective layer 241. Similarly, a second thickness T2a of the second protective layer 242 may be a thickness of a thickest portion of the entire region of the second protective layer 242.

[0179] The first thickness T1a of the first protective layer 241 is greater than the thickness of the circuit layer 220, so that the first protective layer 241 can be disposed on the circuit layer 220 with a constant thickness.

[0180] For example, the first protective layer 241 may be formed between the second protective layer 242 and the circuit layer 220. That is, the first protective layer 241 may be disposed between the circuit layer 220 and the second protective layer 242 with a certain thickness.

[0181] A third thickness T3a of the first protective layer 241 between the circuit layer 220 and the second protective layer 242 may be 0.2 μm to 3 μm. If the third thickness T3a is greater than 3 μm, the frequency shift effect of the second protective layer 242 may be insufficient. Also, if the third thickness T3a is greater than 3 μm, the overall thickness of the antenna substrate may increase due to an increase in the thickness of the first protective layer 241.

[0182] Meanwhile, the thickness of the first protective layer 241 means the thickness from the lower surface of the circuit layer 220 to the upper surface of the first protective layer 241. The thickness of the first protective layer 241 may include the thickness of the circuit layer 220 and the thickness of the first protective layer 241 on the circuit layer 220.

[0183] 10, a portion of the first protective layer 241 formed between the circuit layers 220 may be located lower than the circuit layers 220. For example, the first protective layer 241 in the modified example of FIG. 10 may include a first region disposed on the circuit layer 220 and a second region disposed on the insulating layer 210 between the circuit layers 220. The thickness of the first protective layer 241 may be a total thickness of the circuit layer 220 and the first region of the first protective layer 241. The thickness of the second region of the first protective layer 241 may be thinner than the thickness of the circuit layer 220.

[0184] Meanwhile, the first protective layer 241 and the second protective layer 242 may have different dielectric constants. Specifically, the dielectric constant of the second protective layer 242 may be higher than the dielectric constant of the first protective layer 241.

[0185] Preferably, the first protective layer 241 may correspond to the protective layer 30 described in the comparative example.

[0186] The second protective layer 242 may have a higher dielectric constant than the first protective layer 241. Specifically, the second protective layer 242 may correspond to the protective layer 140 described in the first embodiment.

[0187] According to the second embodiment, the antenna substrate includes a first protective layer and a second protective layer. The first protective layer may be disposed in a region of the antenna substrate that does not vertically overlap with a circuit layer. The second protective layer may be disposed in a region that vertically overlaps with the circuit layer. According to the second embodiment, the resonant frequency of the circuit layer can be efficiently shifted while minimizing the arrangement area of ​​the second protective layer.

[0188] FIG. 11 is a diagram showing an antenna substrate according to the third embodiment.

[0189] Referring to FIG. 11, the antenna substrate includes an insulating layer 310, a circuit layer 320, and a protective layer.

[0190] The insulating layer 310 and the circuit layer 320 may be substantially the same as the insulating layer and the circuit layer of the second embodiment, so a detailed description of the insulating layer 310 and the circuit layer 320 will be omitted.

[0191] The circuit layer 320 may include a first antenna portion 320-1 and a second antenna portion 320-2 spaced apart from each other on the insulating layer 310.

[0192] In the antenna substrate of the third embodiment, a plurality of protective layers may be disposed on the insulating layer 310 .

[0193] For example, the antenna substrate may include a first protective layer 341 formed on the insulating layer 310 and the circuit layer 320. The antenna substrate may also include a second protective layer 342 disposed on the first protective layer 341. In this case, the second protective layer 342 may be partially disposed on the first protective layer 341.

[0194] The first protective layer 341 may be disposed to cover the entire surface of the insulating layer 310. For example, the circuit layer 320 may include a plurality of antenna units 320-1 and 320-2 spaced apart from each other, and the first protective layer 341 may be disposed on the upper surface of the insulating layer in a region between the plurality of antenna units spaced apart from each other.

[0195] Also, the second protective layer 342 may be disposed on the first protective layer 341 or the circuit layer 320 at regular intervals. That is, the first protective layer 341 is formed in a region vertically overlapping the circuit layer 320. In this case, the circuit layer 320 includes a plurality of antenna parts spaced apart from each other on the insulating layer 310. Therefore, the second protective layer 342 may be formed in a regular pattern on the first protective layer 341 or the circuit layer 320 to correspond to the circuit layer 320 at regular intervals.

[0196] The second protective layer 342 may be selectively disposed in a region of the upper surface of the first protective layer 341 that vertically overlaps with the circuit layer 320. In addition, the second protective layer 342 may be selectively disposed on the upper surface of the first protective layer 341.

[0197] A width W2 of the second protective layer 342 may be greater than a width W1 of the circuit layer 320. Thus, the second protective layer 342 may include a first portion in direct contact with an upper surface of the circuit layer 320 and a second portion in direct contact with an upper surface of the first protective layer 341.

[0198] The first protective layer 341 may be formed on the insulating layer 310 to have a first thickness T1b. Also, the second protective layer 342 may be formed on the first protective layer 341 to have a second thickness T2b. For example, the second thickness T2b of the second protective layer 342 may be in the range of 5 μm to 25 μm. For example, the second thickness T2b of the second protective layer 342 may be in the range of 8 μm to 23 μm. For example, the second thickness T2b of the second protective layer 342 may be in the range of 10 μm to 20 μm.

[0199] For this purpose, the first thickness T1b of the first protective layer 341 may be the same as the thickness of the circuit layer 320. For example, the first thickness T1b of the first protective layer 341 may be 10 μm to 25 μm. Preferably, the first thickness T1b of the first protective layer 341 may be 12 μm to 23 μm. More preferably, the first thickness T1b of the first protective layer 341 may be 15 μm to 20 μm.

[0200] However, the embodiment is not limited thereto. For example, the thickness of the first protective layer 341 may be thinner than the thickness of the circuit layer 320. As a result, the upper surface of the first protective layer 341 and the upper surface of the circuit layer 320 may have a step. The second protective layer 342 may be disposed on a part of the upper surface of the first protective layer 341 having the step and on the upper surface of the circuit layer 320. As a result, the lower surface of the second protective layer 342 may have a step.

[0201] FIG. 12 is a diagram showing an antenna substrate according to the fourth embodiment.

[0202] Referring to FIG. 12, the antenna substrate includes an insulating layer 410, a circuit layer 420, and a protective layer.

[0203] The insulating layer 410 and the circuit layer 420 may be substantially the same as the insulating layer and the circuit layer of the third embodiment, so detailed descriptions of the insulating layer 410 and the circuit layer 420 will be omitted.

[0204] The circuit layer 420 may include a first antenna portion 420-1 and a second antenna portion 420-2 spaced apart from each other on the insulating layer 410.

[0205] In the antenna substrate of the fourth embodiment, a plurality of protective layers may be disposed on the insulating layer 410 .

[0206] For example, the antenna substrate may include a first protective layer 441 disposed on the insulating layer 410. The antenna substrate may also include a second protective layer 442 disposed on the insulating layer 410 and the circuit layer 420.

[0207] The first protective layer 441 may have the same material or dielectric constant as the first protective layer in the second and third embodiments, and the second protective layer 442 may have the same material or dielectric constant as the second protective layer in the second and third embodiments.

[0208] At this time, the second protective layer in the second and third examples was disposed only in the area vertically overlapping with the circuit layer. For example, the second protective layer in the second and third examples was not disposed in the area horizontally overlapping with the circuit layer. As a result, the antenna substrate in the second and third examples had only the resonant frequency shift characteristic.

[0209] Differently, the second protective layer in the fourth embodiment may be formed not only in the area vertically overlapping the circuit layer 420 but also in the area horizontally overlapping the circuit layer 420 .

[0210] Specifically, the first protective layer 441 may include an opening 441O. For example, the first protective layer 441 may be disposed on the insulating layer 410. In this case, the first protective layer 441 may not vertically overlap the circuit layer 420. Preferably, the first protective layer 441 may include an opening 441O that vertically overlaps the circuit layer 420.

[0211] In this case, the width of the opening 441O may be greater than the width of the circuit layer 420.

[0212] As a result, the opening 441O of the first protective layer 441 includes a first portion that vertically overlaps the circuit layer 420. In addition, the opening 441O of the first protective layer 441 includes a second portion that vertically overlaps an upper surface of the insulating layer 410 adjacent to the circuit layer 420.

[0213] Then, a second protective layer 442 may be disposed in the opening 441O of the first protective layer 441.

[0214] Specifically, the second protective layer 442 may be disposed within the opening 441O of the first protective layer 441 to surround the circuit layer 420.

[0215] The second protective layer 442 may be disposed over the top and side surfaces of the circuit layer 420 .

[0216] Therefore, in the fourth embodiment, the second protective layer 442 is disposed not only in the area vertically overlapping the circuit layer 420 but also in the area horizontally overlapping the circuit layer 420 .

[0217] Therefore, the second protective layer 442 of the antenna substrate in the fourth embodiment not only shifts the resonance frequency of the circuit layer 420, but also reduces the distance between a plurality of antenna parts to prevent signal interference.

[0218] Furthermore, in the fourth embodiment, compared to the first embodiment, it is possible to minimize the layout area of ​​the relatively expensive second protective layer 442 while achieving both the resonant frequency shift function and the signal interference prevention function.

[0219] Meanwhile, in the drawings, the first protective layer 441 is illustrated as having the same height or thickness as the second protective layer 442, but is not limited thereto.

[0220] FIG. 13 is a diagram showing an antenna substrate according to the fifth embodiment.

[0221] Referring to FIG. 13, the antenna substrate includes an insulating layer 510, a circuit layer 520, and a protective layer.

[0222] The insulating layer 510 and the circuit layer 520 may be substantially the same as the insulating layer and the circuit layer of the fourth embodiment, so detailed descriptions of the insulating layer 510 and the circuit layer 520 will be omitted.

[0223] The circuit layer 520 may include a first antenna portion 520-1 and a second antenna portion 520-2 spaced apart from each other on the insulating layer 510.

[0224] The antenna substrate of the fifth embodiment may have a plurality of protective layers disposed on the insulating layer 510. For example, the antenna substrate may include a first protective layer 541 disposed on the insulating layer 510. The antenna substrate may also include a second protective layer 542 disposed on the insulating layer 510 and the circuit layer 520.

[0225] The first protective layer 541 may have the same material or dielectric constant as the first protective layer in the fourth embodiment, and the second protective layer 542 may have the same material or dielectric constant as the second protective layer in the fourth embodiment.

[0226] The first protective layer 541 may include the opening 541O. For example, the first protective layer 541 is disposed on the insulating layer 510. In this case, the first protective layer 541 may not vertically overlap the circuit layer 520. Preferably, the first protective layer 541 may include the opening 541O that vertically overlaps the circuit layer 520.

[0227] In this case, the width of the opening 541O may be larger than the width of the circuit layer 520. Thus, the opening 541O of the first protective layer 541 includes a first portion vertically overlapping the circuit layer 520. In addition, the opening 541O of the first protective layer 541 includes a second portion vertically overlapping an upper surface of the insulating layer 510 adjacent to the circuit layer 520.

[0228] Then, the second protective layer 542 may be disposed in the opening 541O of the first protective layer 541. Specifically, the second protective layer 542 may be disposed in the opening 541O of the first protective layer 541 to surround the circuit layer 520.

[0229] The second protective layer 542 may be disposed over the top and side surfaces of the circuit layer 520 .

[0230] Therefore, in the fifth embodiment, the second protective layer 542 is disposed not only in the area vertically overlapping the circuit layer 520 but also in the area horizontally overlapping the circuit layer 520 .

[0231] In this case, the height or thickness of the first protective layer 541 may be equal to or smaller than the height or thickness of the circuit layer 520 .

[0232] The upper surface of the second protective layer 542 is disposed on the upper surface of the circuit layer 520 and thus may be located higher than the upper surface of the first protective layer 541 .

[0233] Thus, the second protective layer 542 may include a first portion disposed within the opening 541O to surround the circuit layer 520, and a second portion extending from the first portion. The second portion of the second protective layer 542 may be disposed on an upper surface of the first protective layer 541 having a relatively low height.

[0234] However, the embodiment is not limited thereto. For example, the second protective layer 542 may be disposed only in a region that is higher than the upper surface of the first protective layer 541 and vertically overlaps the opening 541O and the circuit layer 520. The second protective layer 542 in the fifth embodiment may be disposed on a plurality of antenna portions, each having a pattern shape.

[0235] FIG. 14 is a diagram showing an antenna substrate according to the sixth embodiment.

[0236] Referring to FIG. 14, the antenna substrate includes an insulating layer 610, a circuit layer 620, and a protective layer.

[0237] The insulating layer 610 and the circuit layer 620 may be substantially the same as the insulating layer and the circuit layer of the fifth embodiment, so detailed descriptions of the insulating layer 610 and the circuit layer 620 will be omitted.

[0238] The circuit layer 620 may include a first antenna portion 620-1 and a second antenna portion 620-2 spaced apart from each other on the insulating layer 610.

[0239] The antenna substrate of the sixth embodiment may have a plurality of protective layers disposed on the insulating layer 610. For example, the antenna substrate may include a first protective layer 641 disposed on the insulating layer 610. The antenna substrate may also include a second protective layer 642 disposed on the insulating layer 610 and the circuit layer 620.

[0240] At this time, the second protective layer 542 in the fifth embodiment was disposed in a pattern shape on the circuit layer 520 .

[0241] Alternatively, the second protective layer 642 in the sixth embodiment may be integrally formed. For example, the second protective layer 642 in the sixth embodiment may be entirely disposed on the first protective layer 641, the opening 641O of the first protective layer 641, and the antenna units of the circuit layer 620. For example, the second protective layer 642 in the sixth embodiment may be integrally formed on the antenna units so as to be interconnected rather than patterned.

[0242] FIG. 15 is a diagram showing an antenna substrate according to the seventh embodiment.

[0243] Referring to FIG. 15, the antenna substrate includes an insulating layer 710, a circuit layer 720, and a protective layer.

[0244] The insulating layer 710 and the circuit layer 720 may be substantially the same as the insulating layer and the circuit layer in Examples 4 to 6. Therefore, detailed description of the insulating layer 710 and the circuit layer 720 will be omitted.

[0245] The circuit layer 720 may include a first antenna portion 720-1 and a second antenna portion 720-2 spaced apart from each other on the insulating layer 710.

[0246] The antenna substrate of the seventh embodiment may have a plurality of protective layers disposed on the insulating layer 710. For example, the antenna substrate may include a first protective layer 741 disposed on the insulating layer 710. The antenna substrate may also include a second protective layer 742 disposed on the circuit layer 720.

[0247] In this case, the antenna substrate of the seventh embodiment may differ from the antenna substrate of the fourth embodiment in the width of the opening in the first protective layer and the resulting arrangement structure of the second protective layer.

[0248] For example, the opening in the first protective layer in the fourth embodiment had a width greater than the width of the circuit layer.

[0249] Alternatively, the opening 741O of the first protective layer 741 in the seventh embodiment may have the same width as the circuit layer 720.

[0250] Thereby, the second protective layer 742 can be disposed only on the upper surface of the circuit layer 720 within the opening 741O of the first protective layer 741.

[0251] FIG. 16 is a diagram showing an antenna substrate according to the eighth embodiment.

[0252] Referring to FIG. 16, the antenna substrate includes an insulating layer 810, a circuit layer 820, and a protective layer.

[0253] The insulating layer 810 and the circuit layer 820 may be substantially the same as the insulating layer and the circuit layer of the seventh embodiment, so detailed descriptions of the insulating layer 810 and the circuit layer 820 will be omitted.

[0254] The circuit layer 820 may include a first antenna portion 820-1 and a second antenna portion 820-2 spaced apart from each other on the insulating layer 810.

[0255] The antenna substrate of the eighth embodiment may have a plurality of protective layers disposed on an insulating layer 810. For example, the antenna substrate may include a first protective layer 841 disposed on the insulating layer 810. The antenna substrate may also include a second protective layer 842 disposed on the circuit layer 820.

[0256] In this case, the antenna substrate of the eighth embodiment may differ from the antenna substrates of the fourth and seventh embodiments in the width of the opening in the first protective layer and the resulting arrangement structure of the second protective layer.

[0257] For example, the opening in the first protective layer in the fourth embodiment had a width larger than that of the circuit layer, and the opening in the first protective layer in the seventh embodiment had a width equal to that of the circuit layer.

[0258] Alternatively, the opening 841O of the first protective layer 841 in the eighth embodiment may have a width smaller than that of the circuit layer 820.

[0259] Thereby, the second protective layer 842 can be partially disposed on the upper surface of the circuit layer 820 .

[0260] For example, the first protective layer 841 may be disposed on the insulating layer 810 to cover at least a portion of the upper surface of the circuit layer 820. For example, an edge region of the upper surface of the circuit layer 820 may be covered with the first protective layer 841. And the second protective layer 842 may be disposed within the opening 841O of the first protective layer 841 to cover a central region of the upper surface of the circuit layer 820.

[0261] FIG. 17 is a diagram showing an antenna substrate according to the ninth embodiment.

[0262] Referring to FIG. 17, the antenna substrate includes an insulating layer 910, a circuit layer, and a protective layer.

[0263] The upper surface of the insulating layer 910 may be divided into a plurality of regions. For example, the upper surface of the insulating layer 910 may include a first antenna region and a second antenna region.

[0264] A first circuit layer 920a including a plurality of antenna portions may be disposed in a first antenna region on the upper surface of the insulating layer 910.

[0265] In addition, a second circuit layer 920b including a plurality of antenna portions may be disposed in a second antenna region of the insulating layer 910.

[0266] In this case, the first circuit layer 920a and the second circuit layer 920b may be classified according to antenna characteristics. For example, the first circuit layer 920a may include an antenna unit that requires a relatively low degree of integration, and the second circuit layer 920b may include an antenna unit that requires a relatively high degree of integration.

[0267] Thus, in this embodiment, a plurality of protective layers are disposed on the insulating layer 910 according to the characteristics required for the antenna portion of each circuit layer.

[0268] For example, in an embodiment, the first protective layer 941 may be disposed over the first circuit layer 920a on the first antenna region of the insulating layer 910. The first protective layer 941 may correspond to the first protective layer having a relatively low dielectric constant described in the previous embodiment.

[0269] In addition, in an embodiment, a second protective layer 942 may be disposed on the second antenna region of the insulating layer 910, covering the second circuit layer 920b. The second protective layer 942 may correspond to the second protective layer having a relatively high dielectric constant described in the previous embodiment.

[0270] In the ninth embodiment, the upper region of the insulating layer is divided into a plurality of antenna regions according to the required characteristics of the antenna unit. Then, a circuit layer including a plurality of antenna units is disposed in each of the antenna regions. Then, a protective layer having a different dielectric constant is disposed on the plurality of antenna regions to cover each of the antenna units. As a result, in the embodiment, it is possible to provide an antenna substrate that efficiently satisfies the required characteristics of the antenna unit while minimizing the arrangement area of ​​the second protective layer having a relatively high dielectric constant.

[0271] FIG. 18 is a diagram showing an antenna substrate according to the tenth embodiment.

[0272] Referring to FIG. 18, the antenna substrate includes an insulating layer 1010, a circuit layer 1020, and a protective layer 1040.

[0273] The circuit layer 1020 may be disposed on both sides of the insulating layer 1010 .

[0274] For example, the circuit layers may include an upper circuit layer 1020 a disposed on an upper surface of the insulating layer 1010 and a lower circuit layer 1020 b disposed on a lower surface of the insulating layer 1010 .

[0275] That is, the antenna substrate of the tenth embodiment may be a double-sided antenna substrate that radiates radiation beams from both the upper and lower sides of the insulating layer 1010 as the center.

[0276] For example, the upper circuit layer 1020a can emit a first beam of radiation to an upper region of the insulating layer 1010. For example, the lower circuit layer 1020b can emit a second beam of radiation, different from the first beam of radiation, to a lower region of the insulating layer 1010.

[0277] In addition, the protective layer 1040 may include a first high dielectric constant protective layer 1040a disposed on the upper surface of the insulating layer 1010 to cover the upper circuit layer 1020a.

[0278] In addition, the protective layer 1040 may include a second high dielectric constant protective layer 1040b disposed on the lower surface of the insulating layer 1010 to cover the lower circuit layer 1020b.

[0279] The first high dielectric constant protective layer 1040a and the second high dielectric constant protective layer 1040b may correspond to the protective layer 140 or the second protective layer described in the previous embodiment. For example, the first high dielectric constant protective layer 1040a and the second high dielectric constant protective layer 1040b may have a dielectric constant Dk in the range of 20-40.

[0280] Meanwhile, the antenna substrates of the first to tenth embodiments have been described above. In this case, the antenna substrate of the present application may have a structure in which at least two of the structures of the antenna substrates of the first to tenth embodiments are mixed. As an example, the arrangement structure of the second protective layer arranged in the second antenna region of Fig. 17 may have any one of the structures of the protective layers arranged in the antenna substrates of the first to eighth embodiments.

[0281] In the following, an antenna device according to an embodiment will be described.

[0282] The antenna device of the embodiment may include any one of the antenna substrates shown in Fig. 5 and Fig. 11 to Fig. 18. In the following, the antenna substrate applied to the antenna device of the embodiment will be described as including the antenna substrate according to the first embodiment of Fig. 5. However, the antenna device of the embodiment is not limited thereto, and may include an antenna substrate according to an embodiment other than the first embodiment.

[0283] FIG. 19 is a diagram showing an antenna device according to a first embodiment, and FIG. 20 is a diagram showing an antenna device according to a second embodiment.

[0284] Referring to FIG. 19, the antenna device according to the first embodiment may include an antenna substrate 1100 and a driving substrate 1200.

[0285] The antenna substrate 1100 may correspond to any one of the first to tenth embodiments of the present application.

[0286] The drive substrate 1200 may be manufactured separately from the antenna substrate 1100. For example, the drive substrate 1200 may be a substrate separated from the antenna substrate 1100.

[0287] In the antenna device of the first embodiment, the separated antenna substrate 1100 and driving substrate 1200 can be manufactured in separate processes, and a process of combining them can be performed through this.

[0288] The driving substrate 1200 may include a plurality of insulating layers 1210. For example, the driving substrate 1200 may include, but is not limited to, three insulating layers. That is, the driving substrate 1200 may include two or less insulating layers, or alternatively, may include four or more insulating layers.

[0289] The driving substrate 1200 may include a circuit pattern layer 1220 formed on a surface of at least one insulating layer 1210 .

[0290] The driving substrate 1200 may include a through electrode 1230 that penetrates at least one insulating layer 1210. The through electrode 1230 of the driving substrate 1200 may electrically connect between circuit pattern layers 1220 disposed on different layers.

[0291] The driving substrate 1200 may include a first connection part 1240 disposed on a circuit pattern layer disposed at the bottom of the circuit pattern layers 1220. The first connection part 1240 may be, but is not limited to, a solder ball.

[0292] The driving substrate 1200 may include an element attached to the first connection portion 1240. In this case, the driving substrate 1200 includes a plurality of first connection portions spaced apart from each other. The driving substrate 1200 may include a plurality of elements mounted on the plurality of first connection portions, respectively.

[0293] For example, the driving substrate 1200 may include a driving element mounted on at least one of the first connection parts. The driving element may be a driving element for driving an antenna unit of a circuit layer included in the antenna substrate 1100. For example, the driving element may transmit a transmission signal to the antenna substrate 1100 so that a wireless signal corresponding to the transmission signal can be transmitted to the outside. In addition, the driving element may receive a reception signal received via the antenna substrate 1100 and analyze the same to obtain reception information.

[0294] In addition, the driving substrate 1200 may include a passive element mounted on at least another one of the first connection parts. The passive element may be an element for supporting or assisting the operation of the driving element. For example, the passive element may include a resistor, a capacitor, an inductor, etc.

[0295] Meanwhile, the antenna device may include a second connection part 1260 disposed between the driving substrate 1200 and the antenna substrate 1100. The second connection part 1260 may be, but is not limited to, a solder ball.

[0296] Meanwhile, although not shown in the drawings, the antenna device may further include a molding layer disposed between the antenna substrate 1100 and the driving substrate 1200 to mold the second connection part 1260.

[0297] On the other hand, as shown in FIG. 20, the antenna device according to the second embodiment includes a first substrate layer 1300 and a second substrate layer 1400. As shown in FIG.

[0298] In this case, the first substrate layer 1300 and the second substrate layer 1400 may form one substrate.

[0299] For example, in the antenna device of the second embodiment, the first substrate layer 1300 corresponding to the antenna substrate is preferentially manufactured, and then the insulating layer 1310, the circuit pattern layer 1320, the through electrode 1330, the first connection portion 1340, and the element 1350 corresponding to the second substrate layer 1400 are formed thereon, so that an antenna device consisting of one substrate can be manufactured. Compared to the first embodiment, the antenna device of the second embodiment can omit the second connection portion, and the antenna substrate and the driving substrate can be provided as one integrated substrate.

[0300] The antenna substrate of the embodiment includes an insulating layer, a circuit layer disposed on the insulating layer, and a protective layer. In this case, the protective layer includes a first region that vertically overlaps the circuit layer and a second region that does not vertically overlap the circuit layer. The protective layer has a dielectric constant in the range of 20 to 40. The first region of the protective layer can function to shift the resonance frequency of the radiation beam emitted by the circuit layer. In addition, the second region of the protective layer can function to reduce the interval between the multiple antenna parts that constitute the circuit layer.

[0301] As a result, in the embodiment, the EMC layer included in the antenna substrate of the comparative example can be removed, and the problems associated with the EMC layer can be solved.

[0302] Furthermore, in the embodiment, the size of the circuit layer (specifically, the planar area) can be reduced by shifting the resonant frequency using the first region of the protective layer. As a result, in the embodiment, the horizontal width of the antenna substrate can be reduced. In addition, in the embodiment, the circuit layer included in the antenna substrate can be integrated. In addition, in the embodiment, the number of antenna parts arranged in the same area can be increased compared to the comparative example. In addition, in the embodiment, the electronic device including the antenna substrate can be miniaturized.

[0303] In addition, in the embodiment, the interval between the plurality of antenna units can be reduced by using the second region of the protective layer. Specifically, in the embodiment, even if the interval between the plurality of antenna units is reduced compared to the comparative example, signal interference that may occur between the plurality of antenna units can be prevented. As a result, in the embodiment, mutual signal interference between the plurality of antenna units can be prevented, and antenna characteristics and performance can be improved. In addition, in the embodiment, the circuit layer included in the antenna substrate can be integrated. In addition, in the embodiment, the number of antenna units arranged in the same area can be increased compared to the comparative example.

[0304] Meanwhile, the circuit layer in the embodiment includes a plurality of antenna parts arranged on an insulating layer. In this case, in the embodiment, the first region and the second region of the protective layer are used to arrange the plurality of antenna parts on the insulating layer in an alternating or zigzag manner. That is, in the embodiment, the plurality of antenna parts are arranged on the insulating layer in an alternating or zigzag manner, thereby further improving the integration degree of the antenna parts. As a result, in the embodiment, the antenna characteristics and performance can be further improved.

[0305] Meanwhile, the protective layer in the embodiment includes a first protective layer and a second protective layer, the first protective layer being a protective layer having a relatively low dielectric constant, and the second protective layer being a protective layer having a relatively high dielectric constant.

[0306] The second protective layer may be disposed in an area vertically overlapping the circuit layer. The first protective layer may be selectively disposed in an area where the second protective layer is not disposed. This allows the antenna characteristics and performance to be maximized while minimizing the area in which the second protective layer is disposed in the embodiment.

[0307] Meanwhile, the antenna device of the embodiment may be applied to an electronic device. In this case, the electronic device may be a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer, a monitor, a tablet, a laptop, a netbook, a television, a video game, a smart watch, an automotive, etc. However, it goes without saying that the electronic device is not limited to these and may be any other electronic device that processes data.

[0308] Meanwhile, when the antenna substrate having the above-mentioned inventive features is used in IT devices and home appliances such as smartphones, server computers, and TVs, it can stably perform functions such as signal transmission or power supply. For example, when the antenna substrate having the features of the present invention functions as a semiconductor package, it can safely protect the semiconductor chip from external moisture and contaminants, and can solve the problems of leakage current or electrical short circuit between terminals, or electrical open of terminals supplying power to the semiconductor chip. In addition, when it functions as a signal transmission, it can solve the noise problem. As a result, the antenna substrate having the above-mentioned inventive features can maintain stable functions of IT devices and home appliances, and the entire product and the antenna substrate to which the present invention is applied can be functionally integrated or technically linked with each other.

[0309] When the antenna substrate having the above-mentioned features of the present invention is used in a transportation device such as a vehicle, it can solve the problem of distortion of signals transmitted to the transportation device, safely protect the semiconductor chip that controls the transportation device from the outside, and solve the problems of leakage current or electrical short circuit between terminals, or electrical open of terminals that supply power to the semiconductor chip, thereby further improving the stability of the transportation device. Therefore, the transportation device and the antenna substrate to which the present invention is applied can be functionally integrated or technically linked with each other.

[0310] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified in other embodiments by a person having ordinary skill in the art to which the embodiment belongs. Therefore, the contents related to such combinations and modifications should be interpreted as being included in the scope of the embodiment.

Claims

1. An insulating layer; a circuit layer disposed on the insulating layer; a protective layer disposed on the insulating layer and the circuit layer; The protective layer is an antenna substrate disposed vertically and horizontally overlapping the circuit layer, the antenna substrate having a dielectric constant Dk of 20-40;

2. the circuit layer is an antenna portion disposed on the uppermost side of the antenna substrate, The antenna substrate according to claim 1 , wherein the protective layer is a solder resist disposed on the insulating layer and the antenna portion.

3. The protective layer is Resin and TiO ２ , Al ２ O ３ , BaTiO ３ , and CaTiO ３ and a filler consisting of at least one of the following:

4. The antenna substrate according to claim 3 , wherein the content of the filler in the protective layer satisfies the range of 35 wt % to 85 wt %.

5. The circuit layer includes: a plurality of antenna portions disposed on the insulating layer at a distance from each other; 3. The antenna substrate according to claim 1, wherein two adjacent antenna portions among the plurality of antenna portions are spaced apart from each other with a gap of 0.5 mm to 1.5 mm.

6. The plurality of antenna units include are arranged diagonally alternately or zigzag on the insulating layer; The antenna substrate according to claim 5 , wherein the interval is a diagonal separation distance between two antenna portions disposed adjacent to each other.

7. The protective layer is A first region overlapping the circuit layer in a thickness direction; a second region excluding the first region, 3. The antenna substrate according to claim 1, wherein the thickness of the first region of the protective layer is in the range of 5 μm to 25 μm.

8. The antenna substrate according to claim 7 , wherein an upper surface of the first region of the protective layer is flush with an upper surface of the second region of the protective layer.

9. The antenna substrate according to claim 7 , wherein an upper surface of the first region of the protective layer has a step with an upper surface of the second region of the protective layer.

10. An insulating layer; a circuit layer disposed on the insulating layer; a first protective layer disposed on the insulating layer; a second protective layer disposed on the circuit layer; the first protective layer has a first dielectric constant; the second protective layer has a second dielectric constant greater than the first dielectric constant; The second dielectric constant is in the range of 4 to 14 times the first dielectric constant.

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