Component cooler for a computing device

Abstract

The apparatus for cooling a component includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. Each of the plurality of heat transfer paths is configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage that provides a first portion of a heat transfer fluid in thermal contact with the first heat transfer element and a second fluid passage that provides a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.

Description

[Background technology]

[0001] Computing devices include various components, including processors and graphics processing units (GPUs), that generate heat. To dissipate the heat generated by such components, computing devices often include one or more cooling elements. Such cooling elements include, for example, fluid cooling systems, heat pipes, vapor chambers, heat sinks, fans, etc. [Brief explanation of the drawings]

[0002] [Figure 1] FIG. 1 is a diagram of a non-limiting exemplary component cooling arrangement according to some embodiments of the present disclosure. [Figure 2] FIG. 2 is a side view of the component cooling apparatus of FIG. 1 according to an embodiment of the present disclosure. [Figure 3] 2 is a perspective view of a portion of the component cooling apparatus of FIG. 1 according to an embodiment of the present disclosure. [Figure 4] FIG. 4 is an exploded view of a portion of the component cooling apparatus of FIG. 3 according to an embodiment of the present disclosure. [Figure 5] 4 is another exploded view of a portion of the component cooling apparatus of FIG. 3 according to an embodiment of the present disclosure. [Figure 6] 1 is an embodiment of a fluid manifold according to an embodiment of the present disclosure. [Figure 7] 1 is an embodiment of a heat pipe assembly according to an embodiment of the present disclosure. [Figure 8] 1 is another embodiment of a heat pipe assembly according to an embodiment of the present disclosure. [Figure 9] 1 is another embodiment of a heat pipe assembly according to an embodiment of the present disclosure. [Figure 10] 1 is another exemplary component cooling apparatus according to some embodiments of the present disclosure. [Figure 11] 1 is another exemplary component cooling apparatus according to some embodiments of the present disclosure. [Figure 12] FIG. 2 is a block diagram of an exemplary computing device for a component cooling apparatus, according to some embodiments. [Figure 13] 1 is a flowchart illustrating an exemplary method for component cooling, according to some embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0003] Removing heat from integrated circuits (ICs), such as central processing units (CPUs), accelerated processing units (APUs), graphics processing units (GPUs), application-specific ICs (ASICs), and field programmable gate arrays (FPGAs), is becoming more difficult as the demand for greater processing power increases. There is a continuing effort to increase power consumption and power density in ICs. For example, in processors, higher power consumption often correlates with higher performance. Furthermore, as processor technology advances, the number and density of transistors within a processor generally increases, resulting in faster and more power-efficient processors. As transistor density increases, heat generation becomes more concentrated in certain areas, making heat removal from the processor more difficult. Similar advances are occurring in other types of ICs, resulting in similarly concentrated and increased heat generation.

[0004] Thermal cooling solutions are typically used to help remove heat from computing device components, such as ICs. Maintaining a cooler IC potentially equates to higher performance. A more efficient thermal solution (such as a chiller) for removing heat typically results in a lower IC temperature. Computing devices often include one or more cooling elements to dissipate heat generated by various ICs, such as processor cores. Such cooling elements include, for example, heat sinks, fluid cooling systems (e.g., water cooling systems), vapor chambers, heat pipes, fans, and the like, which conduct heat generated by the computing device's ICs to a fan that dissipates the heat from the computing device. However, existing solutions may not adequately cool computing system components due to the use of ambient temperature air for cooling and / or a lack of sufficient thermal contact between heat-generating and heat-dissipating components.

[0005] This specification describes a component cooler for a computing device. In one or more embodiments, the component cooler utilizes multiple heat pipes to divide the heat load generated by the component through multiple conduction paths between multiple heat transfer elements to facilitate heat removal from the component. The component cooler includes multiple fluid flow paths across multiple surfaces to facilitate heat removal from the component. The component cooler may also incorporate one or more thermoelectric coolers (TECs) in contact with one or more of the heat transfer elements to provide sub-ambient cooling to the heat transfer elements and facilitate heat removal from the component. Thus, more effective and efficient cooling of components within a computing device is provided by utilizing multiple heat transfer paths and a manifold having multiple fluid flow paths to more effectively remove heat from the computing device components.

[0006] In some embodiments, an apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, a second heat transfer element, and a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element, each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.

[0007] In some embodiments, the heat-generating electronic component comprises a processor. In some embodiments, the plurality of heat transfer paths comprises at least one heat pipe. In some embodiments, the plurality of heat transfer paths comprises at least one vapor chamber.

[0008] In some embodiments, the first heat transfer element includes at least one of a first base plate and a second base plate. In some embodiments, some of the plurality of heat transfer paths are disposed between the first base plate and the second base plate. In some embodiments, the apparatus further includes a first thermoelectric cooler thermally coupled to the first heat transfer element. In some embodiments, the apparatus further includes a first cold plate, the first thermoelectric cooler configured to transfer heat from the first heat transfer element to the first cold plate. In some embodiments, the first fluid passage passes through the first cold plate.

[0009] In some embodiments, the second heat transfer element includes at least one of a third base plate and a fourth base plate, and a portion of the plurality of heat transfer paths is disposed between the third base plate and the fourth base plate.

[0010] In some embodiments, the apparatus further includes a second thermoelectric cooler thermally coupled to the second heat transfer element. In some embodiments, the apparatus further includes a second cold plate, the second thermoelectric cooler configured to transfer heat from the second heat transfer element to the second cold plate. In some embodiments, the second fluid passage passes through the second cold plate.

[0011] In some embodiments, an apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, a second heat transfer element, and a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element, each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a cooling block including a passageway for providing a heat transfer fluid in thermal contact with the first heat transfer element.

[0012] In some embodiments, the apparatus further includes a cooling fan assembly coupled to the second heat-transfer element. In some embodiments, the heat-generating electronic component comprises a processor. In some embodiments, the plurality of heat-transfer paths includes at least one heat pipe. In some embodiments, the first heat-transfer element includes at least one of a first base plate and a second base plate. In some embodiments, the second heat-transfer element comprises a cold plate.

[0013] Various embodiments of a component cooling apparatus are described with reference to the drawings, beginning with FIG. 1. FIG. 1 is a diagram of a non-limiting exemplary component cooling apparatus 100, according to some embodiments of the present disclosure. The exemplary component cooling apparatus 100 of FIG. 1 is shown in cross-section. The exemplary component cooling apparatus 100 can be implemented in a variety of computing devices, including desktop computing devices, mobile computing devices, laptops, tablets, hybrid laptop / tablet computing devices, gaming devices, set-top boxes, etc.

[0014] The exemplary component cooling apparatus 100 of FIG. 1 includes a substrate 102. The substrate 102 of FIG. 1 may be, for example, a printed circuit board (PCB), such as a motherboard of a computing device. The substrate 102 is coupled to an IC socket 104, which is further coupled to a bottom surface of a processor 106. While a processor is used herein as an example of a heat-generating component, readers skilled in the art will recognize that components that can benefit from the exemplary cooling apparatus described herein can include any type of IC. In various examples, the processor 106 includes a CPU, APU, GPU, FPGA, ASIC, or digital signal processor (DSP).

[0015] The top surface of the processor 106 is thermally coupled to the bottom surface of a first base plate 108A. The base plate is a component of a heat pipe assembly through which various heat pipes conduct heat. The first base plate 108A is connected to the substrate 102 via a mounting plate 107. The top surface of the first base plate 108A is coupled to the bottom surface of a second base plate 108B. The first base plate 108A and the second base plate 108B can be constructed of a conductive metal such as copper. In some embodiments, the first base plate 108A and the second base plate 108B are replaced by a single base plate.

[0016] The top surface of the second base plate 108B is thermally coupled to the bottom surface of a first thermoelectric cooler (TEC) 110A. A TEC is a semiconductor device with two sides that functions to transfer heat from one side to the other when an electric current is passed through the TEC. The top surface of the first TEC 110A is thermally coupled to a first cold plate 112A. A cold plate is a device that uses a fluid to transfer heat from the device to a remote heat exchanger. While various embodiments are described as using a cold plate as the heat transfer element, other suitable heat transfer elements, such as a base plate or heat sink, are used in other embodiments.

[0017] The component cooling system 100 also includes a second cold plate 112B having a top surface thermally coupled to the bottom surface of the second TEC 110B. The top surface of the second TEC 110B is thermally coupled to the bottom surface of a third base plate 108C. The top surface of the third base plate 108C is coupled to the bottom surface of a fourth base plate 108D. The third base plate 108C and the fourth base plate 108D are constructed of a conductive metal such as copper. In one embodiment, the third base plate 108C and the fourth base plate 108D are replaced by a single base plate.

[0018] 1 also includes a third cold plate 112C having a bottom surface thermally coupled to a top surface of the fourth base plate 108D. In one embodiment, the first cold plate 112A, the second cold plate 112B, and the third cold plate 112C each include a plurality of fins to facilitate the transfer of heat to a heat transfer medium, such as fluid air.

[0019] The component cooling system 100 also includes a plurality of heat pipes 114A, 114B, 114C, and 114D. Each of the heat pipes 114A-114D has a first end disposed between and in thermal contact with the first and second base plates 108A, 108B, and a second end disposed between and in thermal contact with the third and fourth base plates 108C, 108D. Each of the heat pipes 114A, 114B, 114C, and 114D includes an intermediate portion between the first and second ends that is external to each of the base plates 108A, 108B, 108C, and 108D. In one or more embodiments, each of the heat pipes 114A, 114B, 114C, and 114D is formed in a half-loop configuration, as further shown in FIG. 2. 1, heat pipes 114A-114D have substantially circular cross sections. In certain embodiments, heat pipes 114A and 114C extend from one side of component cooling apparatus 100, and heat pipes 114B and 114D extend from the opposite side of component cooling apparatus 100. Although various embodiments are described as using heat pipes as the heat transfer structure, other embodiments may utilize other suitable heat transfer structures, such as, for example, vapor chambers.

[0020] The component cooling system 100 also includes a fluid manifold. The fluid manifold includes a manifold inlet portion 116A and a manifold outlet portion 116B disposed on opposite sides of the component cooling system 100. The manifold inlet portion 116A includes a fluid inlet 118A, and the manifold outlet portion 116B includes a fluid outlet 118B. In one embodiment, the fluid inlet 118A and the fluid outlet 118B are positioned in opposite directions. In other embodiments, the fluid inlet 118A and the fluid outlet 118B are positioned in the same direction or in any direction.

[0021] The fluid manifold includes a first fluid passage 120A extending from a manifold inlet portion 116A to a manifold outlet portion 116B. The first fluid passage 120A is in thermal contact with the first cold plate 112A. The fluid manifold includes a second fluid passage 120B extending from the manifold inlet portion 116A to the manifold outlet portion 116B and in thermal contact with the second cold plate 112B. The fluid manifold also includes a third fluid passage 120C extending from the manifold inlet portion 116A to the manifold outlet portion 116B and in thermal contact with the third cold plate 112C. During operation of the component cooling system 100, a fluid loop including a fluid pump and a radiator (not shown) is coupled between the fluid inlet 118A and the fluid outlet 118B via piping or the like. The fluid pump induces a flow of cooling fluid within the fluid manifold to the manifold inlet portion 116A. The cooling fluid is split through first fluid passage 120A, second fluid passage 120B, and third fluid passage 120C. The split flows combine in manifold outlet section 116B and are output to the radiator through fluid outlet 118B.

[0022] In one embodiment, the flow of fluid through each of the first, second, and third fluid paths 120A, 120B, and 120C is varied by configuring one or more of the first, second, and third fluid paths 120A, 120B, and 120C to be differently sized to achieve a desired flow rate through each of the fluid paths 120A, 120B, and 120C. In a particular example, the first fluid path 120A is sized to have a greater flow rate than the second and third fluid paths 120B and 120C because the amount of heat transferred to the first fluid path 120A is expected to be greater than the amount of heat transferred to the second and third fluid paths 120B and 120C. In one embodiment, the diameter of the first fluid path 120A is larger than the diameter of either the second or third fluid path 120B or 120C. In another embodiment, one or more controllable valves are positioned in one or more of the first fluid passage 120A, the second fluid passage 120B, and the third fluid passage 120C to allow for variation of the flow rate through the fluid passages. While the embodiment shown in Figure 1 includes three fluid passages, other embodiments have fewer than three or more than three fluid passages in the fluid manifold.

[0023] The component cooling apparatus 100 includes a first spring mechanism 122A and a second spring mechanism 122B. The first spring mechanism 122A is disposed between the manifold inlet section 116A and the third cold plate 112C. The first spring mechanism 122A is rigidly coupled to a sidewall of the manifold inlet section 116A and applies a first upward force to the manifold inlet section 116A and a first downward force to the third cold plate 112C. The terms "upward" and "downward" are used herein for ease of explanation only and are relative to the example shown in FIG. 1 . The second spring mechanism 122B is disposed between the manifold outlet section 116B and the third cold plate 112C. The second spring mechanism 122B is rigidly coupled to the sidewall of the manifold outlet section 116B and applies a second upward force to the manifold outlet section 116B and a second downward force to the third cold plate 112C. The forces applied to the third cold plate 112C by the first and second spring mechanisms cause the third cold plate to maintain thermal contact with the fourth base plate 108D. In the embodiment of FIG. 1, the first and second spring mechanisms are positioned at opposite ends of the third cold plate 112C and urge the third cold plate toward the fourth base plate 108D. Being at opposite ends, the forces applied to the third cold plate by both springs are effectively balanced, urging (and thermally coupling) the third cold plate to the fourth cold plate with a relatively equal distribution across the surface areas of the third and fourth cold plates.

[0024] 1 also includes a third spring mechanism 122C and a fourth spring mechanism 122D disposed between the second cold plate 112B and the first cold plate 112A. The third spring mechanism 122C and the fourth spring mechanism 122D are configured to apply a force between the first cold plate 112A and the second cold plate 112B to maintain thermal contact between the first cold plate 112A and the first TEC 110A and to maintain thermal contact between the second cold plate 112B and the second TEC 110B.

[0025] Each of the first spring mechanism 122A, the second spring mechanism 122B, the third spring mechanism 122C, and the fourth spring mechanism 122D is coupled to a side of the fluid manifold. In the embodiment shown in Figure 1, the first spring mechanism 122A and the third spring mechanism 122C are coupled to a side of the manifold inlet section 116A, and the second spring mechanism 122B and the fourth spring mechanism 122D are coupled to a side of the manifold outlet section 116B. In various embodiments, the spring mechanisms 122A-122D include one or more of, for example, leaf springs, coil springs, pneumatic (e.g., gas and / or fluid) springs, or leaf springs.

[0026] The third spring mechanism 122C has a rigid connection to the sidewall of the manifold inlet section 116A and applies an upward force to the second cold plate 112B and a downward force to the first cold plate 112A. Similarly, the fourth spring mechanism 122D has a rigid connection to the sidewall of the manifold outlet section 116B and applies an upward force to the second cold plate 112B and a downward force to the first cold plate 112A. As a result, thermal contact is maintained between the first cold plate 112A and the first TEC 110A, and between the second cold plate 112B and the second TEC 110B.

[0027] Typical thermal solutions that utilize spring mechanisms to maintain thermal contact between surfaces do not rigidly attach the spring mechanisms to the surfaces. As a result, maintaining the positioning of the spring mechanisms during assembly of the component cooler is more difficult. Additionally, if the spring mechanisms are not rigidly attached to the surfaces, they are more likely to become displaced during use of the component cooler. In the component cooler of FIG. 1 , the rigid coupling of the first spring mechanism 122A, the second spring mechanism 122B, the third spring mechanism 122C, and the fourth spring mechanism 122D to the fluid manifold facilitates easier assembly of the component cooling device 100. In an exemplary embodiment, the first spring mechanism 122A, the second spring mechanism 122B, the third spring mechanism 122C, and the fourth spring mechanism 122D are rigidly attached to the fluid manifold prior to installation of the cold plates 112A-112C so that the position of the spring mechanisms is maintained during assembly. Additionally, the rigid coupling of the spring mechanism to the fluid manifold helps maintain the position of the spring mechanism during use of the component cooling system 100 .

[0028] In this example, the spring mechanisms all have substantially the same width and spring constant so that the distance between two objects to which they exert a force is substantially the same. The spring constant defines the ratio of the force acting on the spring to the displacement caused by the spring. If two springs have the same spring constant and width, the two springs will exert substantially the same force on two objects of similar mass, creating the same distance between the two objects. For example, the first spring mechanism 122A has a substantially similar width and spring constant as the third spring mechanism 122C. Therefore, the distance between the manifold inlet portion 116A and the third cold plate 112C (maintained by the force of the first spring mechanism) is substantially equal to the distance between the second cold plate 112B and the first cold plate 112A (maintained by the force of the second spring mechanism). The width and spring constant of the spring mechanism can be selected so that when the spring mechanism is compressed, the distance between the cold plates and the distance between the manifold portion and the cold plate can provide gaps of various sizes according to the desired thermal characteristics. A larger gap, for example, provides additional airflow across a surface (such as a cold plate surface), which in some cases results in additional cooling through greater heat dissipation relative to a smaller gap. In other cases, a smaller gap between two components (such as two cold plates) can result in additional cooling efficiency of the components.

[0029] 1 provides multiple heat conduction paths between heat-transfer elements for removing heat generated by the processor 106, as described further below. During operation of the processor 106, an amount of heat generated by the processor is transferred to a first base plate 108A thermally coupled to the processor 106, and a portion of the heat transferred to the first base plate 108A is further transferred to a second base plate 108B. Each of the heat pipes 114A, 114B, 114C, 114D is configured to transfer a portion of the heat received from the first base plate 108A and the second base plate 108B to the third base plate 108C and the fourth base plate 108D. In certain embodiments, the heat pipes 114A, 114B, 114C, 114D transfer heat from the first base plate 108A and the second base plate 108B to the third base plate 108C and the fourth base plate 108D using a phase transition between heat transfer fluids within the heat pipes 114A, 114B, 114C, 114D.

[0030] The first TEC 110A is controlled to remove an amount of heat from the second baseplate 108B and transfer that heat to the first cold plate 112A. In one embodiment, the amount of heat transferred by the first TEC 110A is controlled by adjusting the current supplied to the first TEC 110A. The first TEC 110A provides sub-ambient temperature cooling to the second baseplate 108B. The second TEC 110B is controlled to remove an amount of heat from the third baseplate 108C and transfer that heat to the second cold plate 112B. The amount of heat transferred by the second TEC 110B is controlled by adjusting the current supplied to the second TEC 110B. The second TEC 110B provides sub-ambient temperature cooling to the third baseplate 108C. In one or more embodiments, the amount of power provided to one or more of the first TEC 110A or the second TEC 110B is adapted based on monitored system parameters, such as processor activity, to control the amount of cooling provided by each TEC.

[0031] A fluid pump (not shown) directs a flow of cooling fluid into the manifold inlet portion 116A through the fluid inlet 118A. The fluid is divided to flow through a first fluid passage 120A, a second fluid passage 120B, and a third fluid passage 120C. The first fluid passage 120A is in thermal contact with the first cold plate 112A, the second fluid passage 120B is in thermal contact with the second cold plate 112B, and the third fluid passage 120C is in thermal contact with the third cold plate 112C. As the fluid flows through the first fluid passage 120A, a portion of heat is transferred from the first cold plate 112A to the fluid. Similarly, as the fluid flows through the second fluid passage 120B, a portion of heat is transferred from the second cold plate 112B to the fluid. As the fluid flows through the third fluid passage 120C, a portion of the heat is transferred to the fluid from the third cold plate 112C. The split flows from each of the first fluid passage 120A, second fluid passage 120B, and third fluid passage 120C combine in the manifold outlet portion 116B and are output through fluid outlet 118B to one or more radiators (not shown).

[0032] For further explanation, Figure 2 illustrates a side view of the component cooling apparatus 100 of Figure 1 in accordance with an embodiment of the present disclosure. Figure 2 illustrates heat pipes 114A, 114B, 114C, and 114D formed in a loop configuration. A first end of each of the heat pipes 114A, 114B, 114C, and 114D is in thermal contact with the first and second base plates 108A, 108B. A second end of each of the heat pipes 114B, 114C, and 114D is in thermal contact with the third and fourth base plates 108C, 108D.

[0033] For further explanation, Figure 3 illustrates a perspective view of a portion of the component cooling apparatus 100 of Figure 1, in accordance with an embodiment of the present disclosure. Figure 3 illustrates the component cooling apparatus decoupled from the processor 106 and the substrate 102.

[0034] For further explanation, FIG. 4 shows an exploded view of a portion of the component cooling apparatus of FIG. 3 in accordance with an embodiment of the present disclosure. FIG. 4 shows the manifold inlet portion 116A and the manifold outlet portion 116B separated from the first cold plate 112A, the second cold plate 112B, and the third cold plate 112C. FIG. 4 also shows the first cold plate 112A, the second cold plate 112B, and the third cold plate 112C separated from the heat pipe assembly 402. The heat pipe assembly includes the heat pipes 114A-114D and the base plates 108A-108D shown in FIG. 1. Additionally, FIG. 4 shows the first fluid passage 120A through the first cold plate 112A, the second fluid passage 120B through the second cold plate 112B, and the third fluid passage 120C through the third cold plate 112C.

[0035] For further explanation, Figure 5 shows another exploded view of a portion of the component cooling apparatus of Figure 3 in accordance with an embodiment of the present disclosure. Figure 5 shows the manifold inlet portion 116A and the manifold outlet portion 116B separated from the first cold plate 112A, the second cold plate 112B, and the third cold plate 112C. Figure 5 also shows the first cold plate 112A, the second cold plate 112B, and the third cold plate 112C coupled to the heat pipe assembly 402.

[0036] For further explanation, FIG. 6 illustrates another embodiment of a fluid manifold 600 in accordance with an embodiment of the present disclosure. FIG. 6 illustrates a cross-sectional view of the fluid manifold 600 including a manifold inlet portion 602A and a manifold outlet portion 602B. The manifold inlet portion 602A includes a fluid inlet 604A, and the manifold outlet portion 602B includes a fluid outlet 604B. In one embodiment, the fluid inlet 604A and the fluid outlet 604B are each positioned in the same direction. In other embodiments, the fluid inlet 604A and the fluid outlet 604B are each positioned in any desired direction. The fluid manifold includes a first fluid passage 606A connecting the manifold inlet portion 602A to the manifold outlet portion 116B and in thermal contact with the first cold plate 112A. The fluid manifold includes a second fluid passage 606B connecting the manifold inlet portion 602A to the manifold outlet portion 602B and in thermal contact with the second cold plate 112B. The fluid manifold further includes a third fluid passage 606C connecting the manifold inlet portion 602A to the manifold outlet portion 602B and in thermal contact with the third cold plate 112C. In the embodiment shown in Figure 6, the manifold inlet portion 602A and the manifold outlet portion 602B are positioned behind the first cold plate 112A, the second cold plate 112B, and the third cold plate 112C and are not in direct contact with them.

[0037] For further explanation, FIG. 7 illustrates another embodiment of a heat pipe assembly 700 in accordance with an embodiment of the present disclosure. The heat pipe assembly 700 includes a first heat pipe 702A, a second heat pipe 702B, a third heat pipe 702C, a fourth heat pipe 702D, a first base plate 108A, a second base plate 108B, a third base plate 108C, and a fourth base plate 108D. In the embodiment illustrated in FIG. 7, the heat pipes 702A-702D have substantially rectangular cross-sections. Each of the heat pipes 702A-702D includes a first end in thermal contact with the first base plate 108A and the second base plate 108B, and a second end in thermal contact with the third base plate 108C and the fourth base plate 108D. While various embodiments illustrate heat pipes having substantially circular and substantially rectangular cross-sections, other embodiments include heat pipes having any suitable cross-section.

[0038] For further explanation, FIG. 8 illustrates another embodiment of a heat pipe assembly 800 in accordance with an embodiment of the present disclosure. The heat pipe assembly 800 includes a first heat pipe 114A, a second heat pipe 114B, a third heat pipe 114C, a fourth heat pipe 114D, a first base plate 108A, a second base plate 108B, a third base plate 108C, and a fourth base plate 108D. In the embodiment illustrated in FIG. 8, the heat pipes 114A-114D have a substantially circular cross-section. Each of the heat pipes 114A-114D includes a first end in thermal contact with the first base plate 108A and the second base plate 108B, and a second end in thermal contact with the third base plate 108C and the fourth base plate 108D.

[0039] For further explanation, FIG. 9 illustrates another embodiment of a heat pipe assembly 900 in accordance with an embodiment of the present disclosure. The heat pipe assembly 900 includes a first heat pipe 902A, a second heat pipe 902B, a third heat pipe 902C, a fourth heat pipe 902D, a first base plate 904A, a second base plate 904B, and a third base plate 904C. In the embodiment illustrated in FIG. 8, the heat pipes 902A-902D have substantially circular cross sections. In one embodiment, the third base plate 904C has a larger surface area than the first base plate 904A and the second base plate 904B. Each of the heat pipes 902A-902D includes a first end in thermal contact with the first base plate 904A and the second base plate 904B and a second end in thermal contact with the third base plate 904C.

[0040] For further explanation, Figure 10 illustrates another exemplary component cooling apparatus 1000 according to some embodiments of the present disclosure. As shown in Figure 10, the component cooling apparatus 1000 includes the fluid manifold 600 shown in Figure 6 coupled to the heat pipe assembly 700 of Figure 7.

[0041] For further explanation, FIG. 11 illustrates another exemplary component cooling apparatus 1100 according to some embodiments of the present disclosure. The exemplary component cooling apparatus 1100 of FIG. 11 includes a substrate 1102 coupled to an IC socket 1104, which is further coupled to a processor 1106. The substrate 1102 includes a PCB, such as a motherboard of a computing device. In various examples, the processor 1106 includes one or more of a CPU, APU, GPU, FPGA, ASIC, or DSP. The top surface of the processor 1106 is thermally coupled to the bottom surface of a first baseplate 1108A. In one embodiment, the first baseplate 1108A is connected to the substrate 1102 via one or more standoffs. The top surface of the first baseplate 1108A is coupled to the bottom surface of a second baseplate 1108B. In one or more embodiments, the first baseplate 1108A and the second baseplate 1108B are constructed from a conductive metal, such as copper. In one embodiment, the first base plate 1108A and the second base plate 1108B are replaced by a single base plate.

[0042] The top surface of the second base plate 1108B is thermally coupled to the bottom surface of the fluid block 1110. The fluid block 1110 includes a fluid inlet 1112A and a fluid outlet 1112B. The fluid block 1110 includes a fluid passage extending from the fluid inlet 1112A to the fluid outlet 1112B and in thermal contact with the second base plate 1108B. During operation of the component cooling apparatus 1100, a fluid loop including a fluid pump and a radiator (not shown) is coupled between the fluid inlet 1112A and the fluid outlet 1112B via piping or the like. The fluid pump induces a flow of a heat transfer medium, such as water, within the fluid block 1110 from the fluid inlet 1112A to the fluid outlet 1112B to facilitate the removal of heat from the second base plate 1108B to the radiator.

[0043] The component cooling apparatus 1100 further includes a heat sink fin stack 1114 having a top surface coupled to a bottom surface of a cooling fan assembly 1116 configured to direct airflow onto the heat sink fin stack 1114. In one embodiment, the heat sink fin stack 1114 includes a plurality of fins to facilitate removal of heat from the heat sink fin stack 1114 via the airflow. The heat sink fin stack 1114 is supported from the substrate 1102 via a support frame 1118. In one embodiment, the heat sink fin stack 1114 is substantially larger than either the first base plate 1108A or the second base plate 1108B.

[0044] The component cooling apparatus 1100 further includes a plurality of heat pipes 1120A, 1120B, 1120C, and 1120D. Each of the heat pipes 1120A, 1120B, 1120C, and 1120D has a first end disposed between and in thermal contact with the first and second base plates 1108A and 1108B, and a second end in thermal contact with the heat sink fin stack 1114. Each of the heat pipes 1120A, 1120B, 1120C, and 1120D includes an intermediate portion between the first and second ends that is external to each of the base plates 1108A, 1108B and the heat sink fin stack 1114.

[0045] In one or more embodiments, each of the heat pipes 1120A, 1120B, 1120C, and 1120D is formed in a half-loop configuration. In the embodiment shown in FIG. 11, the heat pipes 1120A-1120D have a substantially circular cross-section. In particular embodiments, the heat pipes 1120A and 1120B extend from one side of the component cooling device 1100, and the heat pipes 1120C and 1120D extend from the opposite side of the component cooling device 1100. While various embodiments are described as using heat pipes as the heat transfer structure, other embodiments utilize other suitable heat transfer structures, such as vapor chambers.

[0046] 11 provides multiple heat conduction paths between heat-transfer elements to remove heat generated by the processor 1106, as described further below. During operation of the processor 1106, heat generated by the processor 1106 is transferred to a first base plate 1108A thermally coupled to the processor 1106, and a portion of the heat transferred to the first base plate 1108A is transferred to a second base plate 1108B. Each of the heat pipes 1120A, 1120B, 1120C, 1120D is configured to transfer a portion of the heat received from the first base plate 1108A and the second base plate 1108B to the heat sink fin stack 1114. The heat pipes 1120A, 1120B, 1120C, 1120D transfer heat from the first base plate 1108A and the second base plate 1108B to the heat sink fin stack 1114 using a phase transition between the heat transfer fluids in the heat pipes 1120A, 1120B, 1120C, 1120D.

[0047] In another embodiment, the component cooling apparatus 1100 further includes a TEC positioned between and in thermal contact with the second base plate 1108B and the fluid block 1110. In another embodiment, the component cooling apparatus 1100 further includes a TEC positioned between and in thermal contact with the heat sink fin stack 1114 and the cooling fan assembly 1116.

[0048] 12 is a block diagram of an exemplary computing device 1200 for a component cooling system, according to some embodiments. The computing device 1200 includes an APU 1202. The APU 1202 is a microprocessor including a CPU 1204 and an integrated graphics processing unit (iGPU) 1207 on a single die. The computing device 1200 also includes a discrete graphics processing unit (dGPU) 1208. While the techniques described herein are described in the context of a computing device 1200 including a dGPU 1208 and an APU 1202 with an iGPU 1207, it should be understood that the techniques described herein are applicable to any system or device incorporating both an integrated GPU and a discrete GPU. The dGPU 1208 is a peripheral or additional component of the computing device 1200 operably coupled to the APU 1202. For example, in some embodiments, the dGPU 1208 is operably coupled to the APU 1202 by a Peripheral Component Interface Express (PCIe) bus. Thus, in such embodiments, the dGPU 1208 is installed in a PCIe port on the motherboard or other PCB on which the APU 1202 is installed. The operative connection between the APU 1202 and the dGPU 1208 enables the APU 1202 to issue instructions, rendering jobs, etc. to the dGPU 1208. In some embodiments, the dGPU 1208 includes a display interface 1210. The display interface 1210 is a port or socket to which an external monitor or display is connected. The display interface 1210 provides a video signal to the external display for presentation.Display interface 1210 may include, for example, a High Definition Multimedia Interface (HDMI) port, a Video Graphics Array (VGA) port, a Digital Visual Interface (DVI) port, a Universal Serial Bus C (USB-C) port, or other display port as may be understood.

[0049] Each of iGPU 1207 and dGPU 1208 includes one or more video cores 1212. Video cores 1212 are discrete processing units, cores, or other units of hardware resources dedicated to encoding and decoding video data. For example, each video core 1212 facilitates video encoding or decoding operations, such as decoding streaming video content, encoding video for video conferencing applications, encoding video files for later playback, etc. In some embodiments, video core 1212 implements a specific hardware architecture or configuration for video encoding and decoding, such as Video Core Next (VCN).

[0050] Each of the iGPU 1207 and dGPU 1208 also includes one or more compute units 1214. Each compute unit 1214 includes one or more cores that share a local cache, allowing parallel processing and cache access for each core within a given compute unit 1214. The compute units 1214 facilitate various computational and processing jobs submitted to the iGPU 1207 and dGPU 1208, including rendering operations, machine learning operations, etc.

[0051] Each of the iGPU 1207 and the dGPU 1208 also includes a display engine 1216. Each display engine 1216 manages the presentation of video or image content to a display of the computing device 1200 (e.g., an internal mobile device display or an external display coupled to the display interface 1210). In some embodiments, the display engine 1216 implements a display core technology such as Display Core Next (DCN). The APU 1202 also includes an audio co-processor (ACP) 1206. The ACP 1206 is a core, processor, or other allocation of a hardware component dedicated to audio encoding and decoding.

[0052] Computing device 1200 also includes memory 1220, such as random access memory (RAM). Memory 1220 stores an operating system 1222 and a voltage configuration module 1224. While operating system 1222 and voltage configuration module 1224 in the example of FIG. 12 are shown in memory 1220, many components of such software are typically also stored in non-volatile memory, such as a disk drive or other storage medium. Operating systems 1222 useful in computing device 1200, according to certain embodiments, include UNIX, Linux, Microsoft Windows, and others as will occur to those skilled in the art.

[0053] The voltage configuration module 1224 controls the voltages allocated to the APU 1202 and the dGPU 1208. For example, the voltage configuration module 1224 implements SmartShift technology, which allocates voltages to increase performance for specific applications. Depending on the specific workload running in the computing device 1200, the voltage configuration module 1224 increases or decreases the voltages used by the APU 1202 and the dGPU 1208. As an example, for a workload that relies heavily on the dGPU 1208, such as complex graphics rendering, the voltage configuration module 1224 increases the voltage to the dGPU 1208. As another example, for a workload that relies more on the APU 1202 than the dGPU 1208, such as audio encoding, or when the computing device 1200 is in a low power consumption state, the voltage configuration module 1224 increases the voltage to the APU 1202. In some embodiments, an increase in voltage to one component (e.g., APU 1202 and dGPU 1208) causes or corresponds to a decrease in voltage to the other component.

[0054] In some embodiments, a modification to the voltage of a given component causes or corresponds to a modification of the operating frequency of the given component. For example, assume that a command or request is issued to increase the operating frequency of the dGPU 1208 in response to a rendering job being submitted to the dGPU 1208. The voltage configuration module 1224 then increases the voltage provided to the dGPU 1208 so that the dGPU 1208 can operate at the increased frequency. In some embodiments, the frequency of a given component is defined according to a frequency-voltage curve. The frequency-voltage curve defines the relationship between the frequency of a component and its corresponding voltage. In other words, the frequency-voltage curve defines the corresponding voltage for a component for a given frequency.

[0055] Those skilled in the art will appreciate that voltage configuration module 1224 operates within various constraints regarding voltage within computing device 1200. For example, in some embodiments, APU 1202 and dGPU 1208 have defined minimum and maximum safe voltages. Those skilled in the art will appreciate that the specific voltage limits for APU 1202 and dGPU 1208 depend on the particular cooling and thermal solutions implemented within computing device 1200.

[0056] Those skilled in the art will also appreciate that the approaches described herein for component cooling provide increased cooling capacity for the APU 1202 and dGPU 1208, and allow for an increase in the maximum safe operating voltage for both the APU 1202 and dGPU 1208. Accordingly, increased computational performance is achieved through the improved cooling approaches described herein.

[0057] For further explanation, Figure 13 shows a flowchart illustrating an exemplary method for component cooling, according to some embodiments. The method includes thermally coupling (1302) a first heat-transfer element to a heat-generating electronic component. The method further includes thermally coupling (1304) multiple heat-transfer paths between the first heat-transfer element and a second heat-transfer element. Each of the multiple heat-transfer structures is configured to provide a separate heat-conduction path from the first heat-transfer element to the second heat-transfer element. The method further includes providing (1306) a first portion of a heat-transfer fluid in thermal contact with the first heat-transfer element and a second portion of the heat-transfer fluid in thermal contact with the second heat-transfer element.

[0058] Exemplary embodiments of the present disclosure are described primarily in the context of a computer system fully functional for a component cooler for a computing device. However, readers skilled in the art will recognize that the present disclosure may be embodied in a computer program product disposed on a computer-readable storage medium for use with any suitable data processing system. Such a computer-readable storage medium may be any storage medium for machine-readable information, including magnetic, optical, or other suitable media. Examples of such media include magnetic disks in hard drives or diskettes, compact discs for optical drives, magnetic tape, and others as will occur to those skilled in the art. Those skilled in the art will readily recognize that any computer system with suitable programming means is capable of executing the steps of the disclosed methods embodied in a computer program product. Those skilled in the art will also recognize that while some of the exemplary embodiments described herein are directed to software installed and executed on computer hardware, alternative embodiments implemented as firmware or as hardware are nevertheless well within the scope of the present disclosure.

[0059] The present disclosure may be a system, a method, and / or a computer program product, which may include a computer-readable storage medium having computer-readable program instructions for causing a processor to perform aspects of the present disclosure.

[0060] A computer-readable storage medium may be a tangible device that can hold and store instructions for use by an instruction-execution device. A computer-readable storage medium may be, for example, but is not limited to, an electronic storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the above. A non-exhaustive list of more specific examples of computer-readable storage media includes portable computer diskettes, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), portable compact disc read-only memory (CD-ROM), digital versatile disk (DVD), memory sticks, floppy disks, mechanically encoded devices such as punch cards or ridge structures in grooves having instructions recorded thereon, and any suitable combination of the above. As used herein, a computer-readable storage medium should not be construed as being an electromagnetic wave, such as an electric wave or other freely propagating electromagnetic wave, propagating through a waveguide or other transmission medium (e.g., light pulses passing through a fiber optic cable), or a transitory signal per se, such as an electrical signal transmitted through a wire.

[0061] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to each computing / processing device or to an external computer or external storage device via a network (e.g., the Internet, a local area network, a wide area network, and / or a wireless network). The network can include copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface within each computing / processing device receives the computer-readable program instructions from the network and transmits the computer-readable program instructions to a computer-readable storage medium within the respective computing / processing device for storage.

[0062] The computer-readable program instructions for carrying out the processes of the present disclosure can be either assembler instructions, instruction-set-architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state-setting data, or source or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk, C, and traditional procedural programming languages ​​such as the "C" programming language or similar programming languages. The computer-readable program instructions can execute completely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer, partially on a remote computer, or completely on a remote computer or server. In the latter scenario, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (e.g., via the Internet using an Internet Service Provider). In some embodiments, electronic circuitry including, for example, a programmable logic circuit, a field-programmable gate array (FPGA), or a programmable logic array (PLA) can execute computer-readable program instructions by utilizing state information of the computer-readable program instructions to individualize the electronic circuitry to implement aspects of the present disclosure.

[0063] Aspects of the present disclosure are described herein with reference to flowcharts and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the present disclosure. It will be understood that each block of the flowcharts and / or block diagrams, and combinations of blocks in the flowcharts and / or block diagrams, can be implemented by computer-readable program instructions.

[0064] These computer-readable program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, or other programmable data processing apparatus to manufacture a machine, such that the instructions, executed by the processor of the computer or other programmable data processing apparatus, generate means for performing the functions / acts specified in one or more blocks of the flowcharts and / or block diagrams. These computer-readable program instructions can also be stored on a computer-readable storage medium that can direct a computer, programmable data processing apparatus, and / or other device to function in a particular way, such that the computer-readable storage medium having stored instructions comprises an article of manufacture containing instructions that perform aspects of the functions / acts specified in one or more blocks of the flowcharts and / or block diagrams.

[0065] Furthermore, the computer-readable program instructions can be loaded into a computer, other programmable data processing apparatus, or other device to cause a series of processing steps to be performed on the computer, other programmable apparatus, or other device to generate a computer-implemented process, such that the instructions executing on the computer, other programmable apparatus, or other device perform the functions / acts specified in one or more blocks of the flowcharts and / or block diagrams.

[0066] The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and processing of possible implementations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowcharts or block diagrams may represent a module, segment, or portion of instructions, including one or more executable instructions for implementing a specified logical function. In some alternative embodiments, the functions noted in the blocks may occur out of the order noted in the figures. For example, two blocks shown in succession may in fact be executed substantially concurrently, or the blocks may be executed in the reverse order, depending on the functionality involved. It should also be noted that each block of the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented by a dedicated hardware-based system that performs the specified functions or acts or a combination of dedicated hardware and computer instructions.

[0067] It will be understood from the foregoing description that modifications and variations can be made in various embodiments of the present disclosure. The description herein is for illustrative purposes only and should not be construed in a limiting sense. The scope of the present disclosure is limited only by the language of the following claims.

Claims

1. 1. An apparatus for cooling a component, comprising: a first heat transfer element configured to be thermally coupled to a heat-generating electronic component; a second heat transfer element; and a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element, each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element; a manifold including a first fluid passageway providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element and a second fluid passageway providing a second portion of a heat transfer fluid in thermal contact with the second heat transfer element; Device.

2. the heat-generating electronic component comprises a processor; 10. The apparatus of claim 1.

3. the plurality of heat transfer paths includes at least one heat pipe; 10. The apparatus of claim 1.

4. the plurality of heat transfer paths includes at least one vapor chamber; 10. The apparatus of claim 1.

5. the first heat transfer element includes at least one of a first base plate and a second base plate; 10. The apparatus of claim 1.

6. some of the heat transfer paths are disposed between the first base plate and the second base plate; 6. The apparatus of claim 5.

7. a first thermoelectric cooler thermally coupled to the first heat transfer element; 10. The apparatus of claim 1.

8. a first cold plate; the first thermoelectric cooler is configured to transfer heat from the first heat transfer element to the first cold plate; 8. The apparatus of claim 7.

9. the first fluid passageway passes through the first cold plate; 9. The apparatus of claim 8.

10. the second heat transfer element includes at least one of a third base plate and a fourth base plate; 10. The apparatus of claim 1.

11. some of the plurality of heat transfer paths are disposed between the third base plate and the fourth base plate; The apparatus of claim 10.

12. a second thermoelectric cooler thermally coupled to the second heat transfer element; 10. The apparatus of claim 1.

13. a second cold plate; the second thermoelectric cooler is configured to transfer heat from the second heat transfer element to the second cold plate; 13. The apparatus of claim 12.

14. the second fluid passageway passes through the second cold plate; 14. The apparatus of claim 13.

15. 1. An apparatus for cooling a component, comprising: a first heat transfer element configured to be thermally coupled to a heat-generating electronic component; a second heat transfer element; and a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element, each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element; a cooling block including a passageway for providing a heat transfer fluid in thermal contact with the first heat transfer element; Device.

16. a cooling fan assembly coupled to the second heat transfer element; 16. The apparatus of claim 15.

17. the heat-generating electronic component comprises a processor; 16. The apparatus of claim 15.

18. the plurality of heat transfer paths includes at least one heat pipe; 16. The apparatus of claim 15.

19. the first heat transfer element includes at least one of a first base plate and a second base plate; 16. The apparatus of claim 15.

20. the second heat transfer element comprises a cold plate; 16. The apparatus of claim 15.

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