Display panel and method of manufacturing the same

Abstract

To provide a display panel capable of improving a display effect and a method for manufacturing the same.SOLUTION: The display panel 10 includes a substrate 111, an isolating structure disposed on a side of the substrate 111, the isolating structure including a first isolating structure 10a located in the first region 12a and provided with a plurality of first isolating openings 12e1, and a second isolating structure 10a located at a boundary between the first region 10b and the second region 12e2, a plurality of light-emitting elements 13 disposed on the side of the substrate 111 and corresponding to the plurality of first isolating openings 12a, at least a part of the light-emitting elements 13 being disposed in the corresponding first isolating openings 12a, and a protection layer 14 covering at least a part of a side of the second isolating structure 12e2 facing the second region. 10b.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present application relates to the technical field of displays, and in particular to display panels and manufacturing methods thereof. [Background technology]

[0002] Organic Light Emitting Diode (OLED) display technology is considered to be the most promising new type of flat panel display technology for the next generation. Compared to LCD technology, OLED display technology has advantages such as low energy consumption, low cost, self-luminance, wide viewing angle, and fast response time. However, current OLED display panels still have display defects. Summary of the Invention [Problem to be solved by the invention]

[0003] In view of this, it is necessary to provide a display panel and a manufacturing method thereof that can improve the display effect. [Means for solving the problem]

[0004] In a first aspect, an embodiment of the present application provides a display panel having a first region and a second region adjacent to the first region, the display panel comprising: A substrate; an isolation structure provided on one side of the substrate, the isolation structure being located in the first region and having a plurality of first isolation openings, and a second isolation structure being located at a boundary between the first region and the second region; a plurality of light emitting devices provided on one side of the substrate and corresponding to the plurality of first isolation openings, at least some of which are provided within the corresponding first isolation openings; a protection layer covering at least a portion of a sidewall of the second isolation structure facing the second region.

[0005] In the display panel according to the embodiment of the present application, a protective layer is provided to cover at least a portion of the sidewall of the second isolation structure facing the second region, thereby providing protection for the second isolation structure. In this way, the sidewall of the second isolation structure is less corroded by the process solution during the manufacturing process of the display panel, which is advantageous in preventing ions from precipitating in the second isolation structure and affecting the light-emitting element and its light-emitting performance, and in reducing the risk of sealing failure due to the corrosion of the second isolation structure, thereby improving the reliability of the display panel.

[0006] An embodiment of the present application provides another display panel having a display area and a frame area adjacent to each other, the display panel comprising: an array substrate; a plurality of light emitting elements spaced apart from one another on one side of the array substrate; a metal structure provided on one side of the array substrate, the metal structure comprising a first portion and a second portion electrically connected to each other, the first portion being located in the display area and used to separate the adjacent light-emitting elements, and the second portion being located in the frame area and electrically connected to wiring on the array substrate; and a protective layer covering at least a portion of the sidewall of the second portion.

[0007] In the display panel according to the embodiment of the present application, a protective layer is provided to cover at least a part of the sidewall of the second portion of the metal structure, thereby providing protection for the sidewall of the second portion, which is advantageous in that the corrosion of the sidewall of the second portion by the process solution is weakened during the manufacturing process of the display panel, thereby preventing ions from precipitating in the second portion and affecting the light-emitting element, thereby affecting the light-emitting performance of the light-emitting element.

[0008] An embodiment of the present application provides a method for manufacturing a display panel having a first region and a second region adjacent to the first region, the method comprising: Providing a substrate; the substrate includes an isolation structure including a first isolation structure located in the first region and having a plurality of first isolation openings, and a second isolation structure located at the boundary between the first region and the second region; a plurality of light-emitting elements provided corresponding to the plurality of first isolation openings, at least a portion of which is provided within the corresponding first isolation openings; and a protective layer formed on one side of the substrate, the protective layer covering at least a portion of a side wall of the second isolation structure facing the second region. [Effects of the Invention]

[0009] In the manufacturing method of the display panel according to the embodiment of the present application, a protective layer is provided to cover at least a part of the sidewall of the second isolation structure facing the second region, thereby providing protection for the second isolation structure. In this way, the sidewall of the second isolation structure is less corroded by the process solution during the manufacturing process of the display panel, which is advantageous in preventing ions from precipitating in the second isolation structure and affecting the light-emitting element and its light-emitting performance, and in reducing the risk of sealing failure due to the corrosion of the second isolation structure, thereby improving the reliability of the display panel. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic cross-sectional view of a local portion of a display panel according to an embodiment of the present application; [Figure 2] FIG. 2 is a schematic plan view of one of the display panels shown in FIG. [Figure 3] 1. FIG. 4 is another schematic plan view of the display panel shown in FIG. [Figure 4] 4 is a plan view schematically illustrating a local structure of the display panel shown in FIG. 3. FIG. [Figure 5] 1. FIG. 4 is yet another schematic plan view of the display panel shown in FIG. [Figure 6] 6 is a plan view schematically illustrating a local structure of the display panel shown in FIG. 5. [Figure 7] 6 is a schematic cross-sectional view of a local portion of the display panel shown in FIG. 5. [Figure 8]2 is a schematic cross-sectional view of a local portion of the display panel shown in FIG. 1. FIG. [Figure 9] FIG. 10 is a schematic cross-sectional view of a local portion of another display panel according to an embodiment of the present application. [Figure 10] FIG. 10 is a schematic cross-sectional view of a local portion of yet another display panel according to an embodiment of the present application. [Figure 11] FIG. 10 is a schematic cross-sectional view of a local portion of a display panel according to an embodiment of the present application. [Figure 12] 12 is a schematic cross-sectional view of a local portion of the display panel shown in FIG. 11. FIG. [Figure 13] 2A to 2C are schematic cross-sectional views of the display panel shown in FIG. 1 during the manufacturing process. [Figure 14] 2A to 2C are schematic cross-sectional views of the display panel shown in FIG. 1 during the manufacturing process. [Figure 15] FIG. 10 is a schematic cross-sectional view of a local portion of a display panel according to an embodiment of the present application. [Figure 16] FIG. 10 is a schematic cross-sectional view of a local portion of a display panel according to an embodiment of the present application. [Figure 17] FIG. 10 is a schematic plan view of a partial structure of yet another display panel according to an embodiment of the present application. [Figure 18] 18 is a schematic cross-sectional view of a second portion of the isolation structure and a protective layer in the display panel shown in FIG. 17. FIG. [Figure 19] 18 is another schematic cross-sectional view of the second portion of the isolation structure and the protective layer in the display panel shown in FIG. 17. FIG. [Figure 20] 18 is a schematic cross-sectional view of the second portion of the isolation structure and the protective layer of the display panel shown in FIG. 17. FIG. [Figure 21] 1 is a schematic diagram illustrating a flow of a method for manufacturing a display panel according to an embodiment of the present application. DETAILED DESCRIPTION OF THE INVENTION

[0011] To facilitate understanding of the present application, the present application will now be described more fully with reference to the associated drawings, in which preferred embodiments of the present application are provided. However, the present application is not limited to the embodiments set forth herein, but may be embodied in many different forms. On the contrary, these embodiments are provided to provide a more thorough and complete understanding of the present disclosure.

[0012] In this specification, the terms "first," "second," etc. may be used to describe various elements, but it should be understood that these do not imply any order, number, or importance, but are merely used to distinguish different components. These terms are merely used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of this application. Similar words such as "comprise" or "include" mean that the element or entity appearing before the word does not exclude other elements or entities, but covers the elements or entities listed after the word and their equivalents.

[0013] Organic light-emitting diode (OLED) display technology is considered the most promising new generation flat panel display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-luminance, wide viewing angles, and fast response times. In a related OLED display panel, a substrate is provided with an isolation structure defining first, second, and third isolation openings. Red, green, and blue subpixels are disposed within the first, second, and third isolation openings, respectively, and the cathodes of each subpixel are electrically connected to the isolation structure. The red, green, and blue subpixels are sequentially fabricated using a patterning process, and each subpixel is protected by a corresponding encapsulation during the patterning process. However, such OLED display panels suffer from display defects.

[0014] Through research by the inventors, it has been found that during the patterning process to fabricate sub-pixels, the etchant is likely to erode the sidewalls in the edge regions of the isolation structures, causing ions to precipitate in the isolation structures, and during the cleaning process, the precipitated ions are likely to flow into the isolation openings of the isolation structures. In the subsequent process of fabricating light-emitting devices, these ions are doped into the light-emitting devices, affecting the light-emitting performance and service life of the light-emitting devices and resulting in poor display.

[0015] In order to solve the above problems, embodiments of the present application provide a display panel, a manufacturing method thereof, and a display device, and each embodiment will be described below with reference to the accompanying drawings.

[0016] The configuration, manufacture, etc. of the isolation structure mentioned hereinafter are further described in Patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 100935, PCT / CN2024 / 102785, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN116685174A, the entire disclosure of which is hereby incorporated by reference.

[0017] In a first aspect, referring to FIG. 1 , an embodiment of the present application provides a display panel 10, which may be an organic light-emitting diode display panel 10 (abbreviated as OLED) or a quantum dot electroluminescence display panel 10 (abbreviated as QLED).

[0018] Specifically, the display panel 10 has a first region 10a and a second region 10b adjacent to the first region 10a. The display panel 10 includes a substrate 111, an isolation structure 12, a plurality of light-emitting elements 13, and a protective layer 14. The isolation structure 12 is provided on one side of the substrate 111 and includes a first isolation structure 12e1 located in the first region 10a and a second isolation structure 12e2 located at the boundary between the first region 10a and the second region 10b. The first isolation structure 12e1 is provided with a plurality of first isolation openings 12a. The plurality of light-emitting elements 13 are provided on one side of the substrate 111 and are provided corresponding to the plurality of first isolation openings 12a. At least some of the light-emitting elements 13 are provided in the corresponding first isolation openings 12a. The protective layer 14 covers at least some of the sidewalls of the second isolation structures 12e2 facing the second region 10b.

[0019] Here, the isolation structures 12 can be divided according to regions. For example, referring to FIG. 1, the isolation structures 12 located to the right of the dashed line (i.e., the first region 10a) are the first isolation structures 12e1, and the isolation structures 12 located to the left of the dashed line (i.e., the second region 10b) are the second isolation structures 12e2.

[0020] It is understood that the correspondence between the plurality of light-emitting elements 13 and the plurality of first isolation openings 12a may be a "multiple-to-one" or "one-to-one" relationship. In the embodiment of the present application, an example will be described in which the light-emitting elements 13 correspond one-to-one to the first isolation openings 12a.

[0021] In the display panel 10 according to the embodiment of the present application, the protective layer 14 is provided to cover at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b, thereby providing protection for the second isolation structure 12e2. In this way, the sidewall of the second isolation structure 12e2 is less eroded by a process solution (e.g., an etching solution) during the manufacturing process of the display panel 10. This is advantageous in preventing ions from precipitating in the second isolation structure 12e2 and affecting the light-emitting element 13, thereby affecting the light-emitting performance of the light-emitting element 13, while also reducing the risk of sealing failure due to erosion of the second isolation structure 12e2, thereby improving the reliability of the display panel 10.

[0022] 2, the first region 10a is the display area, and the second region 10b is the frame area. This corresponds to providing a protective layer 14 on the sidewall of the isolation structure 12 located at the boundary between the display area and the frame area, which is advantageous in preventing the sidewall of the isolation structure 12 located at the boundary between the display area and the frame area from being corroded by an etching solution, causing ions to precipitate, which may affect the light-emitting performance of the light-emitting element 13.

[0023] In one embodiment, the frame area is surrounded by the periphery of the display area.

[0024] 3 and 4, in one embodiment, the first region 10a is a display area, and the second region 10b is a holed area. The light transmittance of the holed area is greater than that of the display area. The isolation structure 12 is provided with a first light transmitting opening 12c located in the holed area.

[0025] In one embodiment, the display area is surrounded by the periphery of the drilling area.

[0026] It is understood that an under-display module may be provided in the hole-drilled area of ​​the display panel 10. The under-display module may be an under-display imaging module, an under-display fingerprint module, etc. The display panel 10 shown in FIG. 3 may further include a frame area 10e surrounding the periphery of the first region 10a.

[0027] In one embodiment, referring to those shown in Figures 5, 6 and 7, the display panel 10 has a first sub-display area 10c and a second sub-display area 10d arranged adjacent to each other, and the light transmittance of the first sub-display area 10c is smaller than that of the second sub-display area 10d, and the second sub-display area 10d has a plurality of second regions 10b arranged at intervals, and the area of ​​the second sub-display area 10d other than the plurality of second regions 10b constitutes the entire area of ​​the first sub-display area 10c and the first region 10a.

[0028] The isolation structure 12 has a plurality of second light transmitting openings 12b that correspond one-to-one to the plurality of second regions 10b, and the protective layer 14 has a plurality of protective sub-layers that correspond one-to-one to the plurality of second light transmitting openings 12b and each cover the sidewall of the corresponding second light transmitting opening 12b. It can be understood that the sidewall of the isolation structure 12 that surrounds and closes the second light transmitting opening 12b is the sidewall of the second light transmitting opening 12b.

[0029] 5 and 6, the region where the second light transmission opening 12b is to be provided is the first region 10a. Each protective sub-layer corresponds to a single protective structure and protects the sidewall of the corresponding second light transmission opening 12b. It is understood that the structure of this protective sub-layer may be the same as the structure of the protective layer 14, which will be described in detail later.

[0030] In one embodiment, the first sub-displaying area 10c is surrounded by the periphery of the second sub-displaying area 10d, and it can be understood that the first sub-displaying area 10c and the second sub-displaying area 10d together constitute the display area of ​​the display panel 10.

[0031] 7 and 8, the isolation structure 12 includes a conductive portion 121 and a blocking portion 122 stacked in a direction away from the substrate 111, and the outer contour of the blocking portion 122 as orthogonally projected onto the substrate 111 is located around the outer contour of the conductive portion 121 as orthogonally projected onto the substrate 111. The light-emitting element 13 includes a first electrode 131, a light-emitting portion 132, and a second electrode 133 stacked in a direction away from the substrate 111, and the second electrode 133 is electrically connected to the conductive portion 121.

[0032] It is understood that the isolation structure 12 may be electrically connected to the pixel circuit of the display panel 10. In the embodiment of the present application, this corresponds to connecting the second electrode 133 of the light-emitting element to the pixel circuit by the isolation structure 12. In this way, the arrangement of the wiring 1121 in the display area 10f of the display panel 10 can be further optimized.

[0033] The first electrode 131 may be an anode, and the second electrode 133 may be a cathode. The light-emitting unit 132 includes at least an emission layer (EML) and may further include one or more of a hole injection layer (HIL), a hole transport layer (HTL), an electron injection layer (EIL), an electron transport layer (ETL), a hole blocking layer (HBL), and an electron blocking layer (EBL). Alternatively, the light-emitting unit 132 may have a stacked light-emitting structure, i.e., include at least two light-emitting layers and a charge generation layer (CGL) located between adjacent light-emitting layers. It is understood that the light-emitting layers in the light-emitting units 132 of light-emitting elements 13 of different colors are different.

[0034] In one embodiment, the conductive portion 121 includes at least one metal layer. In one example, the conductive portion 121 includes one metal layer. Furthermore, the material of the conductive portion 121 includes at least one of a metal and a metal oxide. Exemplarily, the metal may be silver, copper, titanium, aluminum, or the like. The metal oxide may be tin oxide, zinc oxide, cadmium oxide, indium oxide, indium tin oxide, zinc indium oxide, zinc gallium oxide, zinc aluminum oxide, titanium tantalum oxide, or the like.

[0035] In one embodiment, the protective layer 14 covers at least a portion of the wall surface of the conductive portion 121 of the second isolation structure 12e2 facing the second region 10b, thus providing protection for the conductive portion 121 and preventing the conductive portion 121 from being eroded.

[0036] In one specific embodiment, the conductive portion 121 includes aluminum. In related art, when the isolation structure 12 is side-etched, silver ions from the cathode displace the aluminum, causing precipitated silver particles to adhere to the conductive portion 121. During a subsequent cleaning process, the precipitated silver particles are washed away in the area of ​​the anode exposed by the isolation structure 12, forming dark spots. Furthermore, during a subsequent process of fabricating the light-emitting device 13, these ions are doped into the light-emitting device 13, affecting the light-emitting performance and service life of the light-emitting device 13 and resulting in poor display. In the embodiment of the present application, the protective layer 14 protects the sidewalls of the conductive portion 121, thereby preventing corrosion of the conductive portion 121 by the etching solution and allowing the silver ions to precipitate.

[0037] In one embodiment, the material of the blocking portion 122 includes titanium or molybdenum.

[0038] 8 and 9, in one embodiment, the protective layer 14 further covers the wall surface of the blocking portion 122 of the second isolation structure 12e2 facing the second region 10b, thereby increasing the contact area between the protective layer 14 and the second isolation structure 12e2 and improving the connection stability of the protective layer 14.

[0039] In one embodiment, the protective layer 14 includes a main body 141 that covers at least a portion of a sidewall of the second isolation structure 12e2 facing the second region 10b. Specifically, the main body 141 covers a wall surface of the blocking portion 122 of the second isolation structure 12e2 facing the second region 10b and a wall surface of the conductive portion 121 of the second isolation structure 12e2 facing the second region 10b.

[0040] In one embodiment, the material of the protective layer 14 is an organic material or an inorganic material, so that the protective layer 14 can have good protective properties.

[0041] 8 , the protective layer 14 further includes a first extension 142 connected to the main body 141, the first extension 142 being provided on the side of the blocking portion 122 that is farther from the substrate 111. A gap is provided between the surface of the first extension 142 that is closer to the substrate 111 and the surface of the blocking portion 122 that is farther from the substrate 111. This is advantageous in reducing the risk of peeling of the protective layer 14 and improving the connection stability of the protective layer 14.

[0042] It is understood that an organic material may be filled between the first extending portion 142 and the blocking portion 122. This is advantageous in increasing the contact area between the protective layer 14 and other film layers in the display panel 10, and further improving the connection stability of the protective layer 14.

[0043] 9 , the second isolation structure 12e2 includes a first trench 12d located on the side of the isolation structure 12 far from the substrate 111, and the protective layer 14 further includes a second extension 143 connected to one end of the first extension 142 far from the main body 141 and covering at least a portion of the trench wall of the first trench 12d. This increases the contact area between the protective layer 14 and the isolation structure 12, which is advantageous for improving the connection stability of the protective layer 14.

[0044] In one embodiment, the first trench 12d includes a first sub-trench 12d2 and a first opening 12d1, the first opening 12d1 being located on the side of the first sub-trench 12d2 farther from the substrate 111, and its orthogonal projection on the substrate 111 falling within the range of the orthogonal projection of the first sub-trench 12d2 on the substrate 111. That is, the first trench 12d has a "small opening and large cavity" groove structure. The second extension 143 covers at least a portion of the trench wall of the first sub-trench 12d2. In this way, the first trench 12d corresponds to a "sealing structure" and can increase the contact area between the protective layer 14 and the isolation structure 12; meanwhile, even if the protective layer 14 peels off, the first opening 12d1 acts as a barrier, slowing the outward "warping" of the protective layer 14 located in the first sub-trench 12d2 and "locking" the protective layer 14, thereby reducing the risk of the protective layer 14 peeling off from the isolation structure 12.

[0045] In one embodiment, the first opening 12d1 penetrates the blocking portion 122 along the thickness direction of the substrate 111, and the first sub-trench 12d2 is provided in the surface of the conductive portion 121 on the side away from the substrate 111. In this way, it is advantageous to form the first trench 12d by utilizing the difference in material between the blocking portion 122 and the conductive portion 121.

[0046] In one embodiment, the dimension of the first opening 12d1 along the first direction is smaller than the dimension of the first sub-trench 12d2 along the first direction, and the first direction is perpendicular to the thickness direction of the substrate 111 and the extension direction of the first trench 12d. Referring to FIG. 9, the first direction is the horizontal direction, and the first trench 12d extends along a direction perpendicular to the plane of the page.

[0047] In one embodiment, a light emitting material film layer 171 and an electrode material layer 172 are provided between the first extending portion 142 and the blocking portion 122, and the light emitting material film layer 171 is located between the blocking portion 122 and the electrode material layer 172. The light emitting material film layer 171 may be provided in the same layer and made of the same material as one of the first light emitting material layer 173 of the first light emitting element 13a, the second light emitting material layer 174 of the second light emitting element 13b, and the third light emitting material layer of the third light emitting element 13c. Correspondingly, the electrode material layer 172 is provided in the same layer and made of the same material as the electrode material layer 172 of the first light emitting element 13a, the second light emitting element 13b, or the third light emitting element 13c.

[0048] 8 and 9, the protective layer 14 further includes a covering portion 144 connected to the main body portion 141, with one end of the covering portion 144 connected to an end of the main body portion 141 far from the blocking portion 122 and the other end extending in a direction away from the second isolation structure 12e2. The provision of the covering portion 144 increases the contact area between the protective layer 14 and other film layers in the display panel 10, which is advantageous in further improving the connection stability of the protective layer 14.

[0049] In one embodiment, the display panel 10 further comprises an insulating structure 15 disposed between the isolation structure 12 and the substrate 111 .

[0050] In one embodiment, at least a portion of the surface of the covering portion 144 that is closer to the substrate 111 and a surface of the insulating structure 15 that is farther from the substrate 111 are spaced apart from each other. Specifically, one end of the covering portion 144 that is farther from the main body portion 141 is warped in a direction away from the substrate 111.

[0051] It should be noted that this shape of the covering portion 144 is related to the manufacturing process of the protective layer 14, and the warping of the covering portion 144 occurs because the lower part of the covering portion 144 covers the luminescent material film layer 171 and the electrode material layer 172, and the luminescent material film layer 171 and the electrode material layer 172 are removed in the subsequent manufacturing process.

[0052] 10, there is a first gap 195 between an end of the main body 141 remote from the blocking portion 122 and a sidewall of the second isolation structure 12e2 close to the second region 10b. The entire surface of the covering portion 144 close to the substrate 111 and the surface of the insulating structure 15 remote from the substrate 111 are spaced apart from each other.

[0053] It should be noted that the first gap 195 exists between the main body 141 and the sidewall of the second isolation structure 12e2 because the edge of the electrode material layer 172 rides up onto the sidewall of the second isolation structure 12e2 and the electrode material layer 172 is removed in a subsequent manufacturing process.

[0054] In one embodiment, the display panel 10 further includes a filling layer 191, at least a portion of which fills the first gap 195 and the gap between the covering portion 144 and the insulating structure 15. The provision of the filling layer 191 increases the contact area between the protective layer 14 and the film layer of the display panel 10, further improving the connection stability of the protective layer 14 and enhancing the sealing effect of the sidewall of the second isolation structure 12e2.

[0055] In one embodiment, the filler layer 191 includes an organic material, so that it can be ensured that the filler layer 191 fills the first gap 195 well.

[0056] In one embodiment, the display panel 10 further includes an organic sealing layer 192 disposed on the side of the light-emitting element 13 far from the substrate 111 and on the side of the isolation structure 12 far from the substrate 111, and the filling layer 191 and the organic sealing layer 192 are formed in the same layer and made of the same material. In this way, the filling layer 191 and the organic sealing layer 192 can be simultaneously manufactured in the same manufacturing process, which is advantageous for reducing the manufacturing process of the display panel 10 and lowering manufacturing costs.

[0057] In one embodiment, as shown in FIG. 8, one end of the covering portion 144 closer to the main body portion 141 contacts the surface of the insulating structure 15 farther from the substrate 111, and one end farther from the main body portion 141 is spaced apart from the insulating structure 15.

[0058] By bringing the covering portion 144 into contact with the insulating structure 15, the connection bonding strength of the protective layer 14 can be improved, which is advantageous in preventing the protective layer 14 from peeling.

[0059] In one embodiment, the main body 141 covers the entire sidewall of the second isolation structure 12e2 facing the second region 10b, which is advantageous in increasing the contact area between the protective layer 14 and the isolation structure 12 and improving the connection stability of the protective layer 14.

[0060] In one embodiment, one end of the blocking portion 122 close to the first isolation opening 12a extends toward the center of the first isolation opening 12a and protrudes from the wall surface of the conductive portion 121 close to the first isolation opening 12a, and one end of the blocking portion 122 close to the second region 10b extends toward the second region 10b and protrudes from the wall surface of the conductive portion 121 close to the second region 10b.

[0061] Of these, the portion of the blocking portion 122 protruding from the wall surface of the conductive portion 121 closer to the first isolation opening 12a is a first sub-blocking portion 1221 that protrudes from the wall surface of the conductive portion 121 by a first length L1, and the portion of the blocking portion 122 protruding from the wall surface of the conductive portion 121 closer to the second region 10b is a second sub-blocking portion 1222 that protrudes from the wall surface of the conductive portion 121 by a second length L2 that is greater than the first length L1.

[0062] In this way, during the process of depositing the luminescent material film layer 171 and the electrode material layer 172, the second sub-blocking portion 1222 has a relatively large blocking area, so that the insulating structure 15 below the second sub-blocking portion 1222 is not covered by the luminescent material film layer 171 and the electrode material layer 172, and the covering portion 144 can be in contact with the insulating structure 15.

[0063] In one embodiment, the ratio of the second length L2 to the first length L1 is between 1 and 3. For example, the ratio of the second length L2 to the first length L1 may be 1, 1.5, 2, 3, or any two of the above values. In this way, the manufacturing cost of the second sub-blocking portion 1222 can be kept low, provided that it has an appropriate blocking area.

[0064] In one embodiment, the isolation structure 12 is a metal structure, and the density of the metal structure in the first region 10a is greater than the density of the metal structure in the second region 10b. In this way, when the isolation structure 12 is side-etched, the side-etching depth of the second isolation structure 12e2 on the side closer to the second region 10b can be made deeper than the side-etching depth of the first isolation opening 12a, i.e., the protruding length of the second sub-blocking portion 1222 can be made longer than the protruding length of the first sub-blocking portion 1221.

[0065] 11 and 12, in one embodiment, the insulating structure 15 located in the second region 10b is provided with a second trench 15a, and the protective layer 14 further includes a third extension 145 connected to one end of the covering portion 144 remote from the main body portion 141 and covering at least a portion of the trench wall of the second trench 15a. This increases the contact area between the protective layer 14 and the insulating structure 15, which is advantageous for improving the connection stability of the protective layer 14.

[0066] In one embodiment, the second trench 15a includes a second sub-trench 15a2 and a second opening 15a1 that is located on the side of the second sub-trench 15a2 that is farther from the substrate 111 and whose orthogonal projection on the substrate 111 falls within the range of the orthogonal projection of the second sub-trench 15a2 on the substrate 111. In other words, the second trench 15a has a groove structure with a "small opening and a large cavity."

[0067] Specifically, the third extending portion 145 covers at least a part of the trench wall of the second sub-trench 15a2.

[0068] In this way, the second trench 15a corresponds to a "sealing structure" and can increase the contact area between the protective layer 14 and the insulating structure 15, while even if the protective layer 14 peels, the second opening 15a1 acts as a barrier, slowing the outward "warping" of the protective layer 14 located in the second sub-trench 15a2 and "locking" the protective layer 14, thereby reducing the risk of the protective layer 14 peeling.

[0069] In one embodiment, the insulating structure 15 includes a planarization layer 151 and a pixel definition layer 152 that are stacked one on the other, the planarization layer 151 is provided between the substrate 111 and the pixel definition layer 152, the second opening 15a1 penetrates the pixel definition layer 152 along the thickness direction of the substrate 111, and the second sub-trench 15a2 is provided in the surface of the planarization layer 151 that faces away from the substrate 111. In this way, it is advantageous to form the second trench 15a by utilizing the difference in material between the planarization layer 151 and the pixel definition layer 152.

[0070] In one embodiment, the dimension of the second opening 15a1 along the second direction is smaller than the dimension of the second sub-trench 15a2 along the second direction, and the second direction is perpendicular to the thickness direction of the substrate 111 and the extension direction of the second trench 15a. Referring to FIG. 12, the second direction is the horizontal direction, and the second trench 15a extends along a direction perpendicular to the plane of the page.

[0071] In one embodiment, a light-emitting material film layer 171 and an electrode material layer 172 are stacked between the covering portion 144 and the insulating structure 15, and the light-emitting material film layer 171 is located between the insulating structure 15 and the electrode material layer 172.

[0072] In one embodiment, the pixel definition layer 152 is provided with a plurality of pixel openings (not shown), a plurality of first isolated openings 12a are provided through the pixel definition layer 152 corresponding to the plurality of pixel openings, and a plurality of light-emitting elements 13 are provided corresponding to the plurality of pixel openings. Exemplarily, the first isolated openings 12a are provided through the pixel definition layer 152 in one-to-one correspondence with the pixel openings, and the light-emitting elements 13 are provided in one-to-one correspondence with the pixel openings.

[0073] In one embodiment, the plurality of light-emitting elements 13 include a plurality of first light-emitting elements 13a, a plurality of second light-emitting elements 13b, and a plurality of third light-emitting elements 13c, where the first light-emitting elements 13a, the second light-emitting elements 13b, and the third light-emitting elements 13c are used to emit light of different colors, respectively. The display panel 10 further includes a plurality of first sealing portions 161 corresponding to the plurality of first light-emitting elements 13a one-to-one and provided on the side of the corresponding first light-emitting element 13a far from the substrate 111, a plurality of second sealing portions 162 corresponding to the plurality of second light-emitting elements 13b one-to-one and provided on the side of the corresponding second light-emitting element 13b far from the substrate 111, and a plurality of third sealing portions 163 corresponding to the plurality of third light-emitting elements 13c one-to-one and provided on the side of the corresponding third light-emitting element 13c far from the substrate 111.

[0074] Specifically, the first isolation opening 12a includes a first opening 12a1 in which at least a portion of the first light-emitting element 13a is provided, a second opening 12a2 in which at least a portion of the second light-emitting element 13b is provided, and a third opening 12a3 in which at least a portion of the third light-emitting element 13c is provided.

[0075] In one embodiment, the first sealing portion 161, the second sealing portion 162, and the third sealing portion 163 are all inorganic film layers, so that the first sealing portion 161, the second sealing portion 162, and the third sealing portion 163 can all have good sealing performance.

[0076] In one embodiment, any one of the first sealing portion 161, the second sealing portion 162, and the third sealing portion 163 is provided in the same layer and made of the same material as the protective layer 14. This is equivalent to manufacturing the protective layer 14 and a sealing portion (one of the three types of sealing portions) in the same manufacturing process, thereby reducing the manufacturing process of the display panel 10 and lowering manufacturing costs.

[0077] 13 and 14, the first light-emitting element 13a and the first encapsulating portion 161 are fabricated first, the second light-emitting element 13b and the second encapsulating portion 162 are fabricated next, and finally the third light-emitting element 13c and the third encapsulating portion 163 are fabricated. During fabrication of the second encapsulating portion 162, the second light-emitting material layer 174, the electrode material layer 172, and the second encapsulating material layer 176 not only cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, but also cover the isolation structure 12. Furthermore, the second encapsulating material layer 176 also covers the sidewall of the second isolation structure 12e2 near the second region 10b. Then, the second light-emitting material layer 174, the electrode material layer 172, and the second encapsulating material layer 176 in the third opening 12a3 are etched to form the structure shown in FIG. 13. Next, the second light-emitting material layer 174, the electrode material layer 172 and the second sealing material layer 176 in the first opening 12a1, and the first light-emitting material layer 173, the electrode material layer 172 and the first sealing material layer 175 in the third opening 12a3 are etched, leaving the second sealing material layer 176 on the sidewall of the second isolation structure 12e2, thereby forming the protective layer 14.

[0078] 15 , the first sealing portion 161 includes a first main portion 1611 and a first sub-portion 1612 connected to the first main portion 1611, the first main portion 1611 covering the first light-emitting element 13a and the sidewall of the first isolation opening 12a, and the first sub-portion 1612 being provided on the side of the isolation structure 12 farther from the substrate 111. In this way, the contact area between the first sealing portion 161 and the film layer of the display panel 10 can be increased, and the connection stability of the first sealing portion 161 can be improved.

[0079] In one embodiment, the first sub-portion 1612 and the surface of the isolation structure 12 that is farther from the substrate 111 are spaced apart from each other because, in the process of fabricating the first light-emitting element 13a, the first light-emitting material layer 173 and the electrode material layer 172 are formed between the first sub-portion 1612 and the isolation structure 12, and in a subsequent process, the first light-emitting material layer 173 and the electrode material layer 172 in this area are removed.

[0080] In one embodiment, the second sealing portion 162 includes a second main portion 1621 and a second sub-portion 1622 connected to the second main portion 1621, the second main portion 1621 covering the second light-emitting element 13b and the sidewall of the first isolation opening 12a, and the second sub-portion 1622 being disposed on the side of the isolation structure 12 farther from the substrate 111. In this way, the contact area between the second sealing portion 162 and the film layer of the display panel 10 can be increased, and the connection stability of the second sealing portion 162 can be improved.

[0081] In one embodiment, the second sub-portion 1622 and the surface of the isolation structure 12 that is farther from the substrate 111 are spaced apart from each other because, in the process of fabricating the second light-emitting element 13b, the second light-emitting material layer 174 and the electrode material layer 172 are formed between the second sub-portion 1622 and the isolation structure 12, and in a subsequent process, the second light-emitting material layer 174 and the electrode material layer 172 in this area are removed.

[0082] In one embodiment, the third sealing portion 163 includes a third main portion 1631 and a third sub-portion 1632 connected to the third main portion 1631, the third main portion 1631 covering the third light-emitting element 13c and the sidewall of the first isolation opening 12a, and the third sub-portion 1632 being provided on the side of the isolation structure 12 farther from the substrate 111. In this way, the contact area between the third sealing portion 163 and the film layer of the display panel 10 can be increased, and the connection stability of the third sealing portion 163 can be improved.

[0083] In one embodiment, the third sub-portion 1632 and the surface of the isolation structure 12 that is farther from the substrate 111 are spaced apart from each other because, in the process of fabricating the third light-emitting element 13c, the third light-emitting material layer and electrode material layer 172 are formed between the third sub-portion 1632 and the isolation structure 12, and the third light-emitting material layer and electrode material layer 172 in this region are removed in a subsequent process.

[0084] In one embodiment, in the adjacent first sealing portion 161 and second sealing portion 162, the orthogonal projection of the first sub-portion 1612 on the substrate 111 and the orthogonal projection of the second sub-portion 1622 on the substrate 111 overlap each other. This is equivalent to overlapping the first sealing portion 161 and the second sealing portion 162 in the thickness direction of the display panel 10, which is advantageous in reducing the probability of peeling of the first sealing portion 161 or the second sealing portion 162, and can improve the sealing reliability of the first sealing portion 161 or the second sealing portion 162.

[0085] In one embodiment, the first sub-portion 1612 and the second sub-portion 1622 in the adjacent first sealing portion 161 and second sealing portion 162 are provided with a gap therebetween.

[0086] In one embodiment, in adjacent first sealing portions 161 and second sealing portions 162, some of the second sub-portions 1622 are located on the side of the first sub-portion 1612 that is away from the substrate 111. In this way, the second sub-portion 1622 presses the first sub-portion 1612 above the first sub-portion 1612, preventing the first sub-portion 1612 from warping and peeling, and improving the sealing reliability of the first sealing portion 161.

[0087] In one embodiment, in the adjacent second sealing portion 162 and third sealing portion 163, the orthogonal projection of the second sub-portion 1622 on the substrate 111 and the orthogonal projection of the third sub-portion 1632 on the substrate 111 overlap each other. This is equivalent to overlapping the second sealing portion 162 and the third sealing portion 163 in the thickness direction of the display panel 10, which is advantageous in reducing the probability of peeling of the second sealing portion 162 or the third sealing portion 163, and can improve the sealing reliability of the second sealing portion 162 or the third sealing portion 163.

[0088] In one embodiment, the second sub-portion 1622 and the third sub-portion 1632 in the adjacent second sealing portion 162 and third sealing portion 163 are provided with a gap therebetween.

[0089] In one embodiment, in adjacent second sealing portions 162 and third sealing portions 163, some of the third sub-portions 1632 are located on the side of the second sub-portion 1622 that is away from the substrate 111. In this way, the third sub-portion 1632 presses the second sub-portion 1622 above the second sub-portion 1622, preventing the second sub-portion 1622 from warping and peeling, and improving the sealing reliability of the second sealing portion 162.

[0090] 16 , the isolation structure 12 further includes a third isolation structure 12e3 located in the frame area 10e and electrically connected to the first isolation structure 12e1. The display panel 10 further includes an array film layer 112 disposed between the substrate 111 and the isolation structure 12, and the third isolation structure 12e3 is electrically connected to a wiring 1121 in the array film layer 112. In this way, the third isolation structure 12e3 also serves as the wiring 1121, which is advantageous for reducing the number of manufacturing steps for the display panel 10 and lowering manufacturing costs.

[0091] It is understood that the third isolation structure 12e3 and the first isolation structure 12e1 may be electrically connected directly, or the electrical connection may be achieved by other components. For example, the first isolation structure 12e1 and the third isolation structure 12e3 are electrically connected by the second isolation structure 12e2. Furthermore, the first isolation structure 12e1, the second isolation structure 12e2, and the third isolation structure 12e3 may be located on the same layer, which can reduce manufacturing costs. Furthermore, the third isolation structure 12e3 and the first isolation structure 12e1 may be directly connected, or may be spaced apart.

[0092] In one embodiment, the protective layer 14 further covers at least a portion of the sidewall of the third isolation structure 12e3, which is advantageous in that the sidewall of the third isolation structure 12e3 is less susceptible to corrosion by a process solution (e.g., an etching solution) during the manufacturing process of the display panel 10, thereby preventing ions from precipitating in the third isolation structure 12e3 and affecting the light-emitting element 13, thereby affecting the light-emitting performance of the light-emitting element 13.

[0093] In one embodiment, the display panel 10 further includes a bank 194 provided in the frame area 10e and surrounded by the outer periphery of the isolation structure 12. The provision of the bank 194 can prevent overflow of the organic material in the display area.

[0094] In one embodiment, the display panel 10 further comprises an organic encapsulation layer 192 disposed on the side of the light-emitting element 13 remote from the substrate 111 and on the side of the isolation structure 12 remote from the substrate 111 .

[0095] In one such embodiment, the organic encapsulation layer 192 also covers at least a portion of the banks 194 .

[0096] In one embodiment, the display panel 10 further comprises an inorganic sealing layer 193 that covers at least the side of the organic sealing layer 192 that faces away from the substrate 111 .

[0097] The display panel 10 of the embodiment of the present application shown in FIGS. 17, 18, 19 and 20 is as follows.

[0098] Specifically, the display panel 10 has a display area 10f and a frame area 10e adjacent to each other. The display panel 10 includes an array substrate 11, a plurality of light-emitting elements 13, a metal structure 18, and a protective layer 14. The light-emitting elements 13 are spaced apart on one side of the array substrate 11. The metal structure 18 is provided on one side of the array substrate 11 and includes a first portion 181 and a second portion 182 that are electrically connected to each other. The first portion 181 is located in the display area 10f and is used to separate adjacent light-emitting elements 13. The second portion 182 is located in the frame area 10e and is electrically connected to wiring 1121 in the array substrate 11. The protective layer 14 covers at least a portion of the sidewall of the second portion 182. It can be understood that the array substrate 11 may include a substrate 111 and an array film layer 112 that is provided on the substrate 111 and has wiring 1121 provided therein.

[0099] In the display panel 10 according to the embodiment of the present application, the protective layer 14 is provided to cover at least a part of the sidewall of the second portion 182 of the metal structure 18, thereby providing protection for the sidewall of the second portion 182. In this way, during the process of manufacturing the display panel 10, the sidewall of the second portion 182 is less eroded by a process solution (e.g., an etching solution), which is advantageous in preventing ions from precipitating in the second portion 182 and affecting the light-emitting element 13, thereby affecting the light-emitting performance of the light-emitting element 13.

[0100] 18, the second portion 182 includes a first metal layer 1821 and a second metal layer 1822 stacked in a direction away from the array substrate 11, and opposite ends of the second metal layer 1822 in the first direction protrude from opposite sides of the first metal layer 1821 in the first direction. A protective layer 14 is provided on at least one sidewall of the first metal layer 1821 in the first direction, and the first direction is perpendicular to the thickness direction of the array substrate 11 and the extension direction of the second portion 182. In FIG. 18, the first direction is the horizontal direction, and the extension direction of the second portion 182 is perpendicular to the plane of the drawing.

[0101] In one embodiment, the sidewalls on both sides of the first metal layer 1821 in the first direction are covered with the protective layer 14. In this way, the erosion of the sidewalls of the second portion 182 by a process solution (e.g., an etching solution) can be further weakened.

[0102] In one embodiment, the protective layer 14 further covers the sidewalls along the first direction of the second metal layer 1822. In this way, the contact area between the protective layer 14 and the second portion 182 can be increased, and the connection stability of the protective layer 14 can be improved.

[0103] In one embodiment, the protective layer 14 includes a main body portion 141 that covers the sidewalls of the first metal layer 1821 along the first direction and the sidewalls of the second metal layer 1822 along the first direction.

[0104] In one embodiment, the material of the protective layer 14 is an organic material or an inorganic material, so that the protective layer 14 can have good protective properties.

[0105] In one embodiment, the protective layer 14 further includes a first extension 142 connected to the main body 141, and the first extension 142 is provided on a side of the second metal layer 1822 that is farther from the array substrate 11. A gap is provided between the surface of the first extension 142 that is closer to the array substrate 11 and the surface of the second metal layer 1822 that is farther from the array substrate 11. This is advantageous in reducing the risk of peeling of the protective layer 14 and improving the connection stability of the protective layer 14.

[0106] It is understood that an organic material may be filled between the first extending portion 142 and the second metal layer 1822. This is advantageous in increasing the contact area between the protective layer 14 and other film layers in the display panel 10, and further improving the connection stability of the protective layer 14.

[0107] 19, the first extensions 142 of the two protective layers 14 located on both sides of the first metal layer 1821 in the first direction are connected to each other. In this way, the two protective layers 14 are connected, which is advantageous for improving the connection stability of the protective layers 14.

[0108] 20 , the second portion 182 is provided with a third trench 182a, the third trench 182a being provided on a side of the second portion 182 that is farther from the array substrate 11, and the protective layer 14 further includes a second extension 143 that is connected to one end of the first extension 142 that is farther from the main body 141 and that covers at least a part of the trench wall of the third trench 182a. In this way, the contact area between the protective layer 14 and the second portion 182 is increased, which is advantageous in improving the connection stability of the protective layer 14.

[0109] In one embodiment, the third trench 182a includes a third sub-trench 182a2 and a third opening 182a1. The third opening 182a1 is located on the side of the third sub-trench 182a2 that is farther from the array substrate 11, and its orthogonal projection on the array substrate 11 falls within the range of the orthogonal projection of the third sub-trench 182a2 on the array substrate 11. That is, the third trench 182a has a groove structure with a "small opening and a large cavity." Specifically, the second extension 143 covers at least a portion of the trench wall of the third sub-trench 182a2. In this way, the third trench 182a corresponds to a "sealing structure" and can increase the contact area between the protective layer 14 and the second portion 182. Meanwhile, even if the protective layer 14 peels, the third opening 182a1 acts as a barrier, slowing the outward "warping" of the protective layer 14 located in the third sub-trench 182a2 and "locking" the protective layer 14, thereby reducing the risk of the protective layer 14 peeling from the second portion 182.

[0110] In one embodiment, the third opening 182a1 penetrates the second metal layer 1822 along the thickness direction of the array substrate 11, and the third sub-trench 182a2 is provided in the surface of the first metal layer 1821 on the side away from the array substrate 11. In this way, it is advantageous to form the third trench 182a by utilizing the difference in material between the first metal layer 1821 and the second metal layer 1822.

[0111] 20, the dimension of the third opening 182a1 along a first direction is smaller than the dimension of the third sub-trench 182a2 along the first direction, and the first direction is perpendicular to the thickness direction of the array substrate 11 and the extension direction of the third trench 182a. In FIG. 20, the first direction is the horizontal direction, and the third trench 182a extends along a direction perpendicular to the plane of the paper.

[0112] In one embodiment, a light emitting material film layer 171 and an electrode material layer 172 are provided between the first extending portion 142 and the second metal layer 1822, and the light emitting material film layer 171 is located between the second metal layer 1822 and the electrode material layer 172. The light emitting material film layer 171 may be provided in the same layer and made of the same material as one of the first light emitting material layer 173 of the first light emitting element 13a, the second light emitting material layer 174 of the second light emitting element 13b, and the third light emitting material layer of the third light emitting element 13c, and correspondingly, the electrode material layer 172 is provided in the same layer and made of the same material as the electrode material layer 172 of the first light emitting element 13a, the second light emitting element 13b, or the third light emitting element 13c.

[0113] In one embodiment, the protective layer 14 further includes a covering portion 144 connected to the main body portion 141, one end of the covering portion 144 being connected to an end of the main body portion 141 far from the second metal layer 1822, and the other end extending in a direction away from the second portion 182. Providing the covering portion 144 increases the contact area between the protective layer 14 and other film layers in the display panel 10, which is advantageous in further improving the connection stability of the protective layer 14.

[0114] In one embodiment, the display panel 10 further comprises an insulating structure 15 disposed between the metal structure 18 and the array substrate 11 .

[0115] 18 and 19, at least a portion of the surface of the covering portion 144 that is closer to the array substrate 11 and a surface of the insulating structure 15 that is farther from the array substrate 11 are spaced apart from each other. Specifically, one end of the covering portion 144 that is farther from the main body portion 141 is warped in a direction away from the array substrate 11.

[0116] It should be noted that this shape of the covering portion 144 is related to the manufacturing process of the protective layer 14, and the warping of the covering portion 144 occurs because the lower part of the covering portion 144 covers the luminescent material film layer 171 and the electrode material layer 172, and the luminescent material film layer 171 and the electrode material layer 172 are removed in the subsequent manufacturing process.

[0117] In one embodiment, a second gap exists between one end of the body portion 141 remote from the second metal layer 1822 and the sidewall of the first metal layer 1821, and the entire surface of the covering portion 144 close to the array substrate 11 and the surface of the insulating structure 15 remote from the array substrate 11 are spaced apart from each other. Although the second gap is not shown in the drawings according to the embodiment of the present application, reference may be made to FIG. 10 , where the first gap 195 in FIG. 10 corresponds to the second gap here. The second gap exists between the body portion 141 and the sidewall of the first metal layer 1821 because the edge of the electrode material layer 172 rides up onto the sidewall of the first metal layer 1821 and the electrode material layer 172 will be removed in a subsequent manufacturing process.

[0118] In one embodiment, the display panel 10 further includes a filling layer 191, at least a portion of which is filled in the second gap and between the covering portion 144 and the insulating structure 15. The provision of the filling layer 191 increases the contact area between the protective layer 14 and the film layer of the display panel 10, thereby further improving the connection stability of the protective layer 14.

[0119] In one embodiment, the filling layer 191 includes an organic material, so that it can be ensured that the filling layer 191 fills the second gap well.

[0120] In one embodiment, the display panel 10 further includes an organic sealing layer 192 disposed on the side of the light-emitting element 13 far from the array substrate 11 and on the side of the metal structure 18 far from the array substrate 11, and the filling layer 191 and the organic sealing layer 192 are disposed in the same layer and made of the same material. In this way, the filling layer 191 and the organic sealing layer 192 can be simultaneously manufactured in the same manufacturing process, which is advantageous for reducing the manufacturing process of the display panel 10 and lowering manufacturing costs.

[0121] In one embodiment, the display panel 10 further includes a bank 194 provided in the frame area 10e and surrounded by the outer periphery of the metal structure 18. The provision of the bank 194 can prevent overflow of the organic material in the display area 10f.

[0122] In one of the embodiments, the display panel 10 further includes an inorganic sealing layer 193 that covers at least the side of the organic sealing layer 192 that is away from the array substrate 11 .

[0123] In one embodiment, the covering portion 144 has one end closer to the main body portion 141 in contact with the surface of the insulating structure 15 farther from the array substrate 11, and one end farther from the main body portion 141 spaced apart from the insulating structure 15.

[0124] By bringing the covering portion 144 into contact with the insulating structure 15, the connection bonding strength of the protective layer 14 can be improved, which is advantageous in preventing the protective layer 14 from peeling.

[0125] In one embodiment, the first portion 181 includes a third metal layer (not shown) and a fourth metal layer (not shown) stacked along a direction away from the array substrate 11, and the first portion 181 is provided with a plurality of second isolation openings 181a, and a plurality of light-emitting elements 13 are provided corresponding to the plurality of second isolation openings 181a, with at least some of the light-emitting elements 13 being provided within the corresponding second isolation openings 181a.

[0126] In one embodiment, one end of the fourth metal layer near the second isolation opening 181a extends toward the center of the second isolation opening 181a and protrudes from a wall surface of the third metal layer on a side closer to the second isolation opening 181a. The length by which the fourth metal layer protrudes from the wall surface of the third metal layer on a side closer to the second isolation opening 181a is a first length, and the length by which the second metal layer 1822 protrudes from the wall surface on one side of the first metal layer 1821 in the first direction is a second length greater than the first length. Note that the metal structure 18 in the embodiment of the second aspect can be considered as the metal structure 18.

[0127] With the above configuration, during the process of depositing the luminescent material film layer 171 and the electrode material layer 172, the second metal layer 1822 has a relatively large blocking area, so that the insulating structure 15 below the second metal layer 1822 is not covered by the luminescent material film layer 171 and the electrode material layer 172, and the covering portion 144 can be in contact with the insulating structure 15.

[0128] In one embodiment, the ratio of the second length to the first length is between 1 and 3. Illustratively, the ratio of the second length to the first length may be 1, 1.5, 2, 3, or any two of the above values. In this way, the manufacturing cost of the second metal layer 1822 can be kept low, provided that it has an appropriate blocking area.

[0129] In one embodiment, the first metal layer 1821 and the third metal layer are formed in the same layer and made of the same material. For example, the first metal layer 1821 and the third metal layer may be made of aluminum.

[0130] In one embodiment, the second metal layer 1822 and the fourth metal layer are formed in the same layer and made of the same material. For example, the second metal layer 1822 and the fourth metal layer may be made of titanium or molybdenum.

[0131] In one embodiment, the density of the metal structures 18 in the display area 10f is greater than the density of the metal structures 18 in the frame area 10e. In this way, when the metal structures 18 are side-etched, the side-etching depth of the second portion 182 can be made deeper than the side-etching depth of the first portion 181, i.e., the protruding length of the second metal layer 1822 can be made longer than the protruding length of the fourth metal layer.

[0132] In one embodiment, the insulating structure 15 located in the frame area 10e is provided with a second trench 15a, and the protective layer 14 further includes a third extension 145 connected to one end of the covering portion 144 remote from the main body portion 141 and covering at least a portion of the trench wall of the second trench 15a. This increases the contact area between the protective layer 14 and the insulating structure 15, which is advantageous in improving the connection stability of the protective layer 14.

[0133] In one embodiment, the second trench 15a includes a second sub-trench 15a2 and a second opening 15a1. The second opening 15a1 is located on the side of the second sub-trench 15a2 that is farther from the array substrate 11, and its orthogonal projection on the array substrate 11 falls within the range of the orthogonal projection of the second sub-trench 15a2 on the array substrate 11. That is, the second trench 15a has a groove structure with a "small opening and a large cavity." Specifically, the third extension 145 covers at least a portion of the trench wall of the second sub-trench 15a2.

[0134] In one embodiment, the insulating structure 15 includes a planarization layer 151 and a pixel definition layer 152 that are stacked one on the other, the planarization layer 151 is provided between the array substrate 11 and the pixel definition layer 152, the second opening 15a1 penetrates the pixel definition layer 152 along the thickness direction of the array substrate 11, and the second sub-trench 15a2 is provided in the surface of the planarization layer 151 that faces away from the array substrate 11. In this way, it is advantageous to form the second trench 15a by utilizing the difference in material between the planarization layer 151 and the pixel definition layer 152.

[0135] In one embodiment, the dimension of the second opening 15a1 in the second direction is smaller than the dimension of the second sub-trench 15a2 in the second direction, and the second direction is perpendicular to the thickness direction of the array substrate 11 and the extension direction of the second trench 15a. Referring to Figure 20, the second direction is the horizontal direction, and the second trench 15a extends along a direction perpendicular to the plane of the paper.

[0136] In one embodiment, a light-emitting material film layer 171 and an electrode material layer 172 are stacked between the covering portion 144 and the insulating structure 15, and the light-emitting material film layer 171 is located between the insulating structure 15 and the electrode material layer 172.

[0137] In one embodiment, the plurality of second isolation openings 181a are provided to penetrate the pixel openings in a one-to-one correspondence. For example, the second isolation openings 181a penetrate the pixel openings in a one-to-one correspondence, and the light-emitting elements 13 correspond to the pixel openings in a one-to-one correspondence.

[0138] In one embodiment, the plurality of light-emitting elements 13 include a plurality of first light-emitting elements 13a, a plurality of second light-emitting elements 13b, and a plurality of third light-emitting elements 13c, and the first light-emitting elements 13a, the second light-emitting elements 13b, and the third light-emitting elements 13c are used to emit light beams of different colors, respectively, and the plurality of first light-emitting elements 13a, the plurality of second light-emitting elements 13b, and the plurality of third light-emitting elements 13c are arranged in one-to-one correspondence with the plurality of second isolation openings 181a. The display panel 10 further includes a plurality of first sealing portions 161 each corresponding to a plurality of first light-emitting elements 13a and provided on the side of the corresponding first light-emitting element 13a that is farther from the array substrate 11, a plurality of second sealing portions 162 each corresponding to a plurality of second light-emitting elements 13b and provided on the side of the corresponding second light-emitting element 13b that is farther from the array substrate 11, and a plurality of third sealing portions 163 each corresponding to a plurality of third light-emitting elements 13c and provided on the side of the corresponding third light-emitting element 13c that is farther from the array substrate 11.

[0139] 15 , the first sealing portion 161 includes a first main portion 1611 and a first sub-portion 1612 connected to the first main portion 1611, the first main portion 1611 covering the first light-emitting element 13a and the sidewall of the second isolating opening 181a, and the first sub-portion 1612 being provided on the side of the metal structure 18 farther from the array substrate 11. In this way, the contact area between the first sealing portion 161 and the film layer of the display panel 10 can be increased, and the connection stability of the first sealing portion 161 can be improved.

[0140] In one embodiment, the first sub-portion 1612 and the surface of the metal structure 18 that is farther from the array substrate 11 are spaced apart from each other because, in the process of fabricating the first light-emitting element 13a, the first light-emitting material layer 173 and the electrode material layer 172 are formed between the first sub-portion 1612 and the metal structure 18, and in a subsequent process, the first light-emitting material layer 173 and the electrode material layer 172 in this area are removed.

[0141] In one embodiment, the second sealing portion 162 includes a second main portion 1621 and a second sub-portion 1622 connected to the second main portion 1621, the second main portion 1621 covering the second light-emitting element 13b and the sidewall of the second isolating opening 181a, and the second sub-portion 1622 being disposed on the side of the metal structure 18 farther from the array substrate 11. In this way, the contact area between the second sealing portion 162 and the film layer of the display panel 10 can be increased, and the connection stability of the second sealing portion 162 can be improved.

[0142] In one embodiment, the second sub-portion 1622 and the surface of the metal structure 18 that is farther from the array substrate 11 are spaced apart from each other because, in the process of fabricating the second light-emitting element 13b, the second light-emitting material layer 174 and the electrode material layer 172 are formed between the second sub-portion 1622 and the metal structure 18, and in a subsequent process, the second light-emitting material layer 174 and the electrode material layer 172 in this area are removed.

[0143] In one embodiment, the third sealing part 163 includes a third main part 1631 and a third sub-part 1632 connected to the third main part 1631, the third main part 1631 covers the third light-emitting element 13c and the sidewall of the second isolating opening 181a, and the third sub-part 1632 is provided on the side of the metal structure 18 farther from the array substrate 11. In this way, the contact area between the third sealing part 163 and the film layer of the display panel 10 can be increased, and the connection stability of the third sealing part 163 can be improved.

[0144] In one embodiment, the third sub-portion 1632 and the surface of the metal structure 18 that is farther from the array substrate 11 are spaced apart from each other because, in the process of fabricating the third light-emitting element 13c, a third light-emitting material layer and electrode material layer 172 are formed between the third sub-portion 1632 and the metal structure 18, and in a subsequent process, the third light-emitting material layer and electrode material layer 172 in this region are removed.

[0145] In one embodiment, in the adjacent first sealing portion 161 and second sealing portion 162, the orthogonal projection of the first sub-portion 1612 on the array substrate 11 and the orthogonal projection of the second sub-portion 1622 on the array substrate 11 overlap each other. This is equivalent to overlapping the first sealing portion 161 and the second sealing portion 162 in the thickness direction of the display panel 10, which is advantageous in reducing the probability of peeling of the first sealing portion 161 or the second sealing portion 162, and can improve the sealing reliability of the first sealing portion 161 or the second sealing portion 162.

[0146] In one embodiment, in adjacent first sealing portions 161 and second sealing portions 162, some of the second sub-portions 1622 are located on the side of the first sub-portion 1612 that is away from the array substrate 11. In this way, the second sub-portion 1622 presses the first sub-portion 1612 above the first sub-portion 1612, preventing the first sub-portion 1612 from warping and peeling, and improving the sealing reliability of the first sealing portion 161.

[0147] In one embodiment, in the adjacent second sealing portion 162 and third sealing portion 163, the orthogonal projection of the second sub-portion 1622 on the array substrate 11 and the orthogonal projection of the third sub-portion 1632 on the array substrate 11 overlap each other. This is equivalent to overlapping the second sealing portion 162 and the third sealing portion 163 in the thickness direction of the display panel 10, which is advantageous in reducing the probability of peeling of the second sealing portion 162 or the third sealing portion 163, and can improve the sealing reliability of the second sealing portion 162 or the third sealing portion 163.

[0148] In one embodiment, in adjacent second sealing portions 162 and third sealing portions 163, some of the third sub-portions 1632 are located on the side of the second sub-portion 1622 that is away from the array substrate 11. In this way, the third sub-portion 1632 presses the second sub-portion 1622 above the second sub-portion 1622, preventing the second sub-portion 1622 from warping and peeling, and improving the sealing reliability of the second sealing portion 162.

[0149] Referring to FIG. 21, one embodiment of the manufacturing method for the display panel 10 of the present application specifically includes the following steps.

[0150] In S100, a substrate 111 is provided. The substrate 111 may be a rigid substrate 111 or a flexible substrate 111.

[0151] In S200, an isolation structure 12, a plurality of light-emitting elements 13, and a protective layer 14 are formed on one side of a substrate 111. The isolation structure 12 includes a first isolation structure 12e1 located in the first region 10a and a second isolation structure 12e2 located at the boundary between the first region 10a and the second region 10b. The first isolation structure 12e1 is provided with a plurality of first isolation openings 12a, and the plurality of light-emitting elements 13 are provided corresponding to the plurality of first isolation openings 12a, with at least some of the light-emitting elements 13 located in the corresponding first isolation openings 12a. At least some of the sidewalls of the second isolation structure 12e2 facing the second region 10b are covered with a protective layer 14.

[0152] In the manufacturing method of the display panel 10 according to the embodiment of the present application, the protective layer 14 is provided to cover at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b, thereby providing protection for the second isolation structure 12e2. In this way, the sidewall of the second isolation structure 12e2 is less eroded by a process solution (e.g., an etching solution) during the manufacturing process of the display panel 10. This is advantageous in preventing ions from precipitating in the second isolation structure 12e2 and affecting the light-emitting element 13, thereby affecting the light-emitting performance of the light-emitting element 13, while also being advantageous in reducing the risk of sealing failure due to erosion of the second isolation structure 12e2, thereby improving the reliability of the display panel 10.

[0153] In one embodiment, in S200, forming the isolation structure 12, the plurality of light emitting elements 13, and the protective layer 14 on one side of the substrate 111 specifically includes the following steps:

[0154] In S210A, isolation structures 12 are formed on one side of the substrate 111.

[0155] In S220A, the protective layer 14 is formed on at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b.

[0156] In S230A, a plurality of light emitting elements 13 are formed on one side of a substrate 111.

[0157] This is equivalent to completing the fabrication of the protective layer 14 before fabricating all of the light-emitting elements 13. In this way, it is possible to prevent the etching solution used in the process of fabricating various light-emitting elements 13 from corroding the sidewall of the second isolation structure 12e2 facing the second region 10b, thereby improving the protective performance of the protective layer 14.

[0158] In one embodiment, in S200, forming the isolation structure 12, the plurality of light emitting elements 13, and the protective layer 14 on one side of the substrate 111 specifically includes the following steps:

[0159] In S210B, isolation structures 12 are formed on one side of the substrate 111.

[0160] In S220B, the protective layer 14 and a plurality of light-emitting elements 13 are formed on one side of the substrate 111. In this way, the protective layer 14 is formed synchronously with the process of manufacturing the light-emitting elements 13, which reduces the manufacturing process of the display panel 10 and contributes to reducing manufacturing costs.

[0161] Note that, prior to S210B, a plurality of first electrodes 131 arranged at intervals may be formed on the substrate 111.

[0162] In one embodiment, in S220B, forming the protective layer 14 and the plurality of light emitting elements 13 on one side of the substrate 111 specifically includes the following steps:

[0163] In step S221B, the first light-emitting element 13a is formed in the first opening 12a1. Specifically, a first light-emitting material layer 173 and an electrode material layer 172 are stacked on one side of the substrate 111, and the first light-emitting material layer 173 and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 farther from the substrate 111. The first light-emitting material layer 173 and the electrode material layer 172 in the first opening 12a1 constitute the light-emitting portion 132 and the second electrode 133 of the first light-emitting element 13a.

[0164] In S222B, the first encapsulating portion 161 is formed on the first light emitting element 13a, and the protective layer 14 is formed on at least a part of the sidewall of the second isolation structure 12e2 facing the second region 10b.

[0165] Specifically, S222B may include the following steps:

[0166] In S2221B, a first encapsulating material layer 175 is formed on the electrode material layer 172. The first encapsulating material layer 175 further covers at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b.

[0167] In S2222B, the first sealing material layer 175 is patterned to form the first sealing portion 161 and the protective layer 14.

[0168] In this embodiment, step S220B may employ a "three-step etching process" or a "four-step etching process." When the "three-step etching process" is employed, the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175 in the second opening 12a2 and the third opening 12a3 are removed in step S2222B. When the "four-step etching process" is employed, only the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175 in the second opening 12a2 are removed in step S2222B, while the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175 in the third opening 12a3 remain. Alternatively, a wet etching process may be employed to remove the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175.

[0169] It can be understood that the protective layer 14 formed in this step can not only prevent the etching solution used in step S222B from corroding the second isolation structure 12e2, but also prevent the etching solution used in the subsequent fabrication process of the second light-emitting element 13b and the third light-emitting element 13c from corroding the second isolation structure 12e2.

[0170] After the protective layer 14 is formed, the following steps are then performed.

[0171] In step S223B, the second light-emitting element 13b is formed in the second opening 12a2. Specifically, a second light-emitting material layer 174 and an electrode material layer 172 are stacked on one side of the substrate 111, and the second light-emitting material layer 174 and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 farther from the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 in the second opening 12a2 constitute the light-emitting portion 132 and the second electrode 133 of the second light-emitting element 13b.

[0172] In S224B, the second sealing portion 162 is formed on the second light emitting element 13b. Specifically, S224B may include the following steps.

[0173] In S2241B, a second encapsulation material layer 176 is formed on the electrode material layer 172.

[0174] In S2242B, the second encapsulant layer 176 is patterned to form the second encapsulant 162.

[0175] When the "three-step etching process" is employed, the second light-emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 are removed in the first opening 12a1 and the third opening 12a3 in step S2242B. When the "four-step etching process" is employed, as shown in FIGS. 13 and 14 , the second light-emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 are first removed in the third opening 12a3 in step S2242B, and then the second light-emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 in the first opening 12a1, and the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175 in the third opening 12a3 are removed. Note that the second light-emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 may also be removed using a wet etching process.

[0176] After the second sealing portion 162 is formed, the following steps are then performed.

[0177] In S225B, the third light emitting element 13c is formed in the third opening 12a3. Specifically, a third light emitting material layer and an electrode material layer 172 are stacked on one side of the substrate 111, and the third light emitting material layer and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 farther from the substrate 111. The third light emitting material layer and the electrode material layer 172 in the third opening 12a3 constitute the light emitting portion 132 and the second electrode 133 of the third light emitting element 13c.

[0178] In S226B, the third sealing portion 163 is formed on the third light emitting element 13c. Specifically, S226B may include the following steps.

[0179] In S2261B, a third encapsulation material layer is formed on the electrode material layer 172.

[0180] In step S2262B, the third light-emitting material layer, the electrode material layer 172, and the third sealing material layer in the first opening 12a1 and the second opening 12a2 are removed to form the third sealing portion 163. Note that the third light-emitting material layer, the electrode material layer 172, and the third sealing material layer may be removed by using a wet etching process.

[0181] In one embodiment, in S220B, forming the protective layer 14 and the plurality of light emitting elements 13 on one side of the substrate 111 specifically includes the following steps:

[0182] In step S221B, the first light-emitting element 13a is formed in the first opening 12a1. Specifically, a first light-emitting material layer 173 and an electrode material layer 172 are stacked on one side of the substrate 111, and the first light-emitting material layer 173 and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 farther from the substrate 111. The first light-emitting material layer 173 and the electrode material layer 172 in the first opening 12a1 constitute the light-emitting portion 132 and the second electrode 133 of the first light-emitting element 13a.

[0183] In step S222B, the first sealing portion 161 is formed on the first light emitting element 13a. Specifically, step S222B may include the following steps.

[0184] In S2221B, a first encapsulating material layer 175 is formed on the electrode material layer 172.

[0185] In S2222B, the first sealing material layer 175 is patterned to form the first sealing portion 161.

[0186] When the "three-step etching process" is employed, the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175 are removed in the second opening 12a2 and the third opening 12a3 in S2222B. When the "four-step etching process" is employed, only the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175 are removed in the second opening 12a2 in S2222B, and the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175 are left in the third opening 12a3. Note that the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175 may also be removed by using a wet etching process.

[0187] After the first sealing portion 161 is formed, the following steps are then performed.

[0188] In step S223B, the second light-emitting element 13b is formed in the second opening 12a2. Specifically, a second light-emitting material layer 174 and an electrode material layer 172 are stacked on one side of the substrate 111, and the second light-emitting material layer 174 and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 farther from the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 in the second opening 12a2 constitute the light-emitting portion 132 and the second electrode 133 of the second light-emitting element 13b.

[0189] In step S224B, the second encapsulating portion 162 is formed on the second light-emitting element 13b, and the protective layer 14 is formed on at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b. Specifically, step S224B may include the following steps.

[0190] In S2241B, a second encapsulating material layer 176 is formed on the electrode material layer 172. Of which, the second encapsulating material layer 176 further covers at least a part of the sidewall of the second isolation structure 12e2 facing the second region 10b.

[0191] In S2242B, the second encapsulant layer 176 is patterned to form the second encapsulant 162 and the protective layer 14.

[0192] When the "three-step etching process" is employed, the second light-emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 are removed in the first opening 12a1 and the third opening 12a3 in step S2242B. When the "four-step etching process" is employed, as shown in FIGS. 13 and 14 , the second light-emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 are first removed in the third opening 12a3 in step S2242B, and then the second light-emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 in the first opening 12a1, and the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175 in the third opening 12a3 are removed. Note that the second light-emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 may also be removed using a wet etching process.

[0193] It can be seen that the protective layer 14 formed in this step can not only prevent the etching solution used in step S224B from corroding the second isolation structure 12e2, but also prevent the etching solution used in the subsequent manufacturing process of the third light-emitting element 13c from corroding the second isolation structure 12e2.

[0194] After the protective layer 14 is formed, the following steps are then performed.

[0195] In S225B, the third light emitting element 13c is formed in the third opening 12a3. Specifically, a third light emitting material layer and an electrode material layer 172 are stacked on one side of the substrate 111, and the third light emitting material layer and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 farther from the substrate 111. The third light emitting material layer and the electrode material layer 172 in the third opening 12a3 constitute the light emitting portion 132 and the second electrode 133 of the third light emitting element 13c.

[0196] In S226B, the third sealing portion 163 is formed on the third light emitting element 13c. Specifically, S226B may include the following steps.

[0197] In S2261B, a third encapsulation material layer is formed on the electrode material layer 172.

[0198] In step S2262B, the third light-emitting material layer, the electrode material layer 172, and the third sealing material layer in the first opening 12a1 and the second opening 12a2 are removed to form the third sealing portion 163. Note that the third light-emitting material layer, the electrode material layer 172, and the third sealing material layer may be removed by using a wet etching process.

[0199] In one embodiment, in S220B, forming the protective layer 14 and the plurality of light emitting elements 13 on one side of the substrate 111 specifically includes the following steps:

[0200] In step S221B, the first light-emitting element 13a is formed in the first opening 12a1. Specifically, a first light-emitting material layer 173 and an electrode material layer 172 are stacked on one side of the substrate 111, and the first light-emitting material layer 173 and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 farther from the substrate 111. The first light-emitting material layer 173 and the electrode material layer 172 in the first opening 12a1 constitute the light-emitting portion 132 and the second electrode 133 of the first light-emitting element 13a.

[0201] In step S222B, the first sealing portion 161 is formed on the first light emitting element 13a. Specifically, step S222B may include the following steps.

[0202] In S2221B, a first encapsulating material layer 175 is formed on the electrode material layer 172.

[0203] In S2222B, the first sealing material layer 175 is patterned to form the first sealing portion 161.

[0204] When the "three-step etching process" is employed, the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175 are removed in the second opening 12a2 and the third opening 12a3 in S2222B. When the "four-step etching process" is employed, only the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175 are removed in the second opening 12a2 in S2222B, and the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175 are left in the third opening 12a3. Note that the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175 may also be removed by using a wet etching process.

[0205] After the first sealing portion 161 is formed, the following steps are then performed.

[0206] In step S223B, the second light-emitting element 13b is formed in the second opening 12a2. Specifically, a second light-emitting material layer 174 and an electrode material layer 172 are stacked on one side of the substrate 111, and the second light-emitting material layer 174 and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 farther from the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 in the second opening 12a2 constitute the light-emitting portion 132 and the second electrode 133 of the second light-emitting element 13b.

[0207] In S224B, the second sealing portion 162 is formed on the second light emitting element 13b. Specifically, S224B may include the following steps.

[0208] In S2241B, a second encapsulation material layer 176 is formed on the electrode material layer 172.

[0209] In S2242B, the second encapsulant layer 176 is patterned to form the second encapsulant 162 and the protective layer 14.

[0210] When the "three-step etching process" is employed, the second light-emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 are removed in the first opening 12a1 and the third opening 12a3 in step S2242B. When the "four-step etching process" is employed, as shown in FIGS. 13 and 14 , the second light-emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 are first removed in the third opening 12a3 in step S2242B, and then the second light-emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 in the first opening 12a1, and the first light-emitting material layer 173, the electrode material layer 172, and the first sealing material layer 175 in the third opening 12a3 are removed. Note that the second light-emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 may also be removed using a wet etching process.

[0211] After the second sealing portion 162 is formed, the following steps are then performed.

[0212] In S225B, the third light emitting element 13c is formed in the third opening 12a3. Specifically, a third light emitting material layer and an electrode material layer 172 are stacked on one side of the substrate 111, and the third light emitting material layer and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 farther from the substrate 111. The third light emitting material layer and the electrode material layer 172 in the third opening 12a3 constitute the light emitting portion 132 and the second electrode 133 of the third light emitting element 13c.

[0213] In step S226B, a third encapsulating portion 163 is formed on the third light-emitting element 13c, and a protective layer 14 is formed on at least a portion of a sidewall of the second isolation structure 12e2 facing the second region 10b. Specifically, step S226B may include the following steps.

[0214] In S2261B, a third encapsulating material layer is formed on the electrode material layer 172. Among them, the third encapsulating material layer further covers at least a part of the sidewall of the second isolation structure 12e2 facing the second region 10b.

[0215] In step S2262B, the third light-emitting material layer, the electrode material layer 172, and the third sealing material layer in the first opening 12a1 and the second opening 12a2 are removed to form the third sealing portion 163. Alternatively, a wet etching process may be used to remove the third light-emitting material layer, the electrode material layer 172, and the third sealing material layer. It can be seen that the protective layer 14 formed in this step can prevent the etching solution used in step S226B from corroding the second isolation structure 12e2.

[0216] In one embodiment, in S200, forming the isolation structure 12, the plurality of light emitting elements 13, and the protective layer 14 on one side of the substrate 111 specifically includes the following steps:

[0217] In S210C, an isolation structure material layer is formed on one side of the substrate 111. The isolation structure material layer may comprise multiple metal layers.

[0218] In step S220C, the isolation structure material layer is subjected to a first etching process to form the first opening 12a1 and the sidewalls of the second isolation structure 12e2 extending toward the second region 10b. Specifically, this corresponds to performing a first side etching process on the isolation structure material layer to form the initial shapes of the first opening 12a1 and the second isolation structure 12e2 extending toward the second region 10b. An etching stop layer may be employed to protect regions where etching is not required.

[0219] In S230C, the first light emitting element 13a is formed in the first opening 12a1. Specifically, a first light emitting material layer 173 and an electrode material layer 172 are stacked on one side of the substrate 111, and the first light emitting material layer 173 and the electrode material layer 172 cover the inside of the first opening 12a1 and also cover the surface of the isolation structure material layer on the side farther from the substrate 111. The first light emitting material layer 173 and the electrode material layer 172 in the first opening 12a1 constitute the light emitting portion 132 and the second electrode 133 of the first light emitting element 13a.

[0220] In S240C, the first sealing portion 161 is formed on the first light emitting element 13a. Specifically, S240C may include the following steps.

[0221] In S241C, a first encapsulating material layer 175 is formed on the electrode material layer 172.

[0222] In S242C, the first sealing material layer 175 is patterned to form the first sealing portion 161.

[0223] In step S250C, side etching is performed on the sidewall of the second isolation structure 12e2 facing the second region 10b. This corresponds to performing a second side etching on the second isolation structure 12e2 to form the final shape of the second isolation structure 12e2 facing the second region 10b. In this way, the undercut opening on one side of the second isolation structure 12e2 facing the second region 10b can be made larger. An etching stop layer may be used to protect areas where etching is not required.

[0224] In step S260C, the isolation structure material layer is subjected to a second etching to form the second opening 12a2. Specifically, this corresponds to a third side etching of the isolation structure material layer to form the second opening 12a2. An etching stop layer may be employed to protect areas where etching is not required.

[0225] In step S270C, a second light-emitting element 13b is formed in the second opening 12a2. Specifically, a second light-emitting material layer 174 and an electrode material layer 172 are formed on one side of the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 cover the first opening 12a1 and the second opening 12a2 and also cover the surface of the isolation structure material layer away from the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 in the second opening 12a2 constitute the light-emitting portion 132 and the second electrode 133 of the second light-emitting element 13b. In step S280C, a second encapsulating portion 162 is formed on the second light-emitting element 13b, and a protective layer 14 is formed on at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b. Specifically, step S280C may include the following steps:

[0226] In S281C, a second encapsulating material layer 176 is formed on the electrode material layer 172. Of which, the second encapsulating material layer 176 further covers at least a part of the sidewall of the second isolation structure 12e2 facing the second region 10b.

[0227] In S282C, the second encapsulant layer 176 is patterned to form the second encapsulant 162 and the protective layer 14.

[0228] Specifically, the second light emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 in the first opening 12a1 are removed. Also, the second light emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 on the surface of the isolation structure material layer farther from the substrate 111 are removed. Alternatively, the second light emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 may be removed by a wet etching process.

[0229] It can be seen that the protective layer 14 formed in this step can not only prevent the etching solution used in step S282C from corroding the second isolation structure 12e2, but also prevent the etching solution used in the subsequent manufacturing process of the third light-emitting element 13c from corroding the second isolation structure 12e2.

[0230] In step S290C, a third etching is performed on the isolation structure material layer to form a third opening 12a3. Specifically, this corresponds to a fourth side etching of the isolation structure material layer to form the third opening 12a3. An etching stop layer may be employed to protect areas where etching is not required.

[0231] In S2100C, the third light emitting element 13c is formed in the third opening 12a3. Specifically, a third light emitting material layer and an electrode material layer 172 are stacked and formed on one side of the substrate 111. The third light emitting material layer and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 farther from the substrate 111. The third light emitting material layer and the electrode material layer 172 in the third opening 12a3 constitute the light emitting portion 132 and the second electrode 133 of the third light emitting element 13c.

[0232] In step S2110C, the third sealing portion 163 is formed on the third light emitting element 13c. Specifically, step S2110C may include the following steps.

[0233] In S2111C, a third encapsulation material layer is formed on electrode material layer 172.

[0234] In S2112C, the third light-emitting material layer, the electrode material layer 172, and the third sealing material layer in the first opening 12a1 and the second opening 12a2 are removed to form the third sealing portion 163. Note that the third light-emitting material layer, the electrode material layer 172, and the third sealing material layer may be removed by employing a wet etching process.

[0235] In one embodiment, in S200, forming the isolation structure 12, the plurality of light emitting elements 13, and the protective layer 14 on one side of the substrate 111 specifically includes the following steps:

[0236] In S210C, an isolation structure material layer is formed on one side of the substrate 111. The isolation structure material layer may comprise multiple metal layers.

[0237] In step S220C, the isolation structure material layer is subjected to a first etching process to form the first opening 12a1 and the sidewalls of the second isolation structure 12e2 extending toward the second region 10b. Specifically, this corresponds to performing a first side etching process on the isolation structure material layer to form the initial shapes of the first opening 12a1 and the second isolation structure 12e2 extending toward the second region 10b. An etching stop layer may be employed to protect regions where etching is not required.

[0238] In S230C, the first light emitting element 13a is formed in the first opening 12a1. Specifically, a first light emitting material layer 173 and an electrode material layer 172 are stacked on one side of the substrate 111, and the first light emitting material layer 173 and the electrode material layer 172 cover the inside of the first opening 12a1 and also cover the surface of the isolation structure material layer on the side farther from the substrate 111. The first light emitting material layer 173 and the electrode material layer 172 in the first opening 12a1 constitute the light emitting portion 132 and the second electrode 133 of the first light emitting element 13a.

[0239] In S240C, the first sealing portion 161 is formed on the first light emitting element 13a. Specifically, S240C may include the following steps.

[0240] In S241C, a first encapsulating material layer 175 is formed on the electrode material layer 172.

[0241] In S242C, the first sealing material layer 175 is patterned to form the first sealing portion 161.

[0242] In step S250C, the isolation structure material layer is subjected to a second etching to form the second opening 12a2. Specifically, this corresponds to performing a second side etching on the isolation structure material layer to form the second opening 12a2. Note that an etching stop layer may be employed to protect areas where etching is not required.

[0243] In S260C, the second light emitting element 13b is formed in the second opening 12a2. Specifically, a second light emitting material layer 174 and an electrode material layer 172 are stacked on one side of the substrate 111, and the second light emitting material layer 174 and the electrode material layer 172 cover the first opening 12a1 and the second opening 12a2 and also cover the surface of the isolation structure material layer on the side farther from the substrate 111. The second light emitting material layer 174 and the electrode material layer 172 in the second opening 12a2 constitute the light emitting portion 132 and the second electrode 133 of the second light emitting element 13b.

[0244] In S270C, the second sealing portion 162 is formed on the second light emitting element 13b.

[0245] Specifically, S270C may include the following steps.

[0246] In S271C, a second encapsulating material layer 176 is formed on the electrode material layer 172.

[0247] In S272C, the second encapsulant layer 176 is patterned to form the second encapsulant 162.

[0248] Specifically, the second light emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 in the first opening 12a1 are removed. Also, the second light emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 on the surface of the isolation structure material layer farther from the substrate 111 are removed. Alternatively, the second light emitting material layer 174, the electrode material layer 172, and the second sealing material layer 176 may be removed by a wet etching process.

[0249] In step S280C, side etching is performed on the sidewall of the second isolation structure 12e2 facing the second region 10b. This corresponds to performing a second side etching on the second isolation structure 12e2 to form the final shape of the second isolation structure 12e2 facing the second region 10b. In this way, the undercut opening on one side of the second isolation structure 12e2 facing the second region 10b can be made larger. An etching stop layer may be used to protect areas where etching is not required.

[0250] In step S290C, a third etch is performed on the isolation structure material layer to form a third opening 12a3, and an etch stop layer may be employed to protect areas where etching is not required.

[0251] In S2100C, the third light emitting element 13c is formed in the third opening 12a3. Specifically, a third light emitting material layer and an electrode material layer 172 are stacked and formed on one side of the substrate 111. The third light emitting material layer and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 farther from the substrate 111. The third light emitting material layer and the electrode material layer 172 in the third opening 12a3 constitute the light emitting portion 132 and the second electrode 133 of the third light emitting element 13c.

[0252] In step S2110C, the third encapsulating portion 163 is formed on the third light emitting element 13c, and the protective layer 14 is formed on at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b. Specifically, step S2110C may include the following steps.

[0253] In S2111C, a third encapsulating material layer is formed on the electrode material layer 172. Among them, the third encapsulating material layer further covers at least a part of the sidewall of the second isolation structure 12e2 facing the second region 10b.

[0254] In step S2112C, the third light-emitting material layer, the electrode material layer 172, and the third sealing material layer in the first opening 12a1 and the second opening 12a2 are removed to form the third sealing portion 163 and the protective layer 14. Alternatively, a wet etching process may be used to remove the third light-emitting material layer, the electrode material layer 172, and the third sealing material layer. It can be understood that the protective layer 14 formed in this step can prevent the etching solution used in step S2112C from corroding the second isolation structure 12e2.

[0255] A display device of the present application includes the display panel according to any one of the above embodiments.

[0256] The display device may be a laptop, a cell phone, a wireless device, a personal digital assistant (PDA), a handheld or portable computer, a GPS receiver / navigation device, a camera, an MP4 video player, a video camera, a game console, a wristwatch, a clock, a calculator, a television monitor, a flat panel display, a computer monitor, an automotive display (e.g., an odometer display, etc.), a navigator, a cockpit controller and / or display, a camera view display (e.g., a rearview camera display in a vehicle), an electronic photograph, an electronic billboard or billboard, a projector, etc.

[0257] The above-described examples merely represent some embodiments of the present application, and although the description is specific and detailed, it should not be understood as limiting the scope of the present application. It should be noted that a person skilled in the art may make further modifications and improvements without departing from the concept of the present application, and all of these fall within the scope of protection of the present application. Therefore, the scope of protection of the present application should be governed by the appended claims.

Claims

1. A first region and a second region adjacent to the first region, A substrate; an isolation structure provided on one side of the substrate, the isolation structure being located in the first region and having a plurality of first isolation openings, and a second isolation structure being located at a boundary between the first region and the second region; a plurality of light emitting devices provided on one side of the substrate and corresponding to the plurality of first isolation openings, at least some of which are provided within the corresponding first isolation openings; a protective layer covering at least a portion of a sidewall of the second isolation structure facing the second region; A display panel characterized by:

2. the first area is a display area, and the second area is a frame area; the frame area is surrounded by the periphery of the display area, the isolation structure further includes a third isolation structure located in the frame area and electrically connected to the first isolation structure; the display panel further comprises an array film layer disposed between the substrate and the isolation structure, the third isolation structure being electrically connected to a wiring in the array film layer; the protective layer further covers at least a portion of a sidewall of the third isolation structure; The display panel includes: a bank provided in the frame area and surrounded by the outer periphery of the isolation structure; an organic sealing layer provided on a side of the light-emitting element farther from the substrate and on a side of the isolation structure farther from the substrate, the organic sealing layer covering at least a part of the bank; Further provided is an inorganic sealing layer that covers at least the side of the organic sealing layer that is separated from the substrate.

2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

3. The first region is a display area, and the second region is a hole-digging area having a light transmittance higher than that of the display area, The isolation structure has a first light transmission opening located in the holed area; The display area is surrounded by the periphery of the hole digging area, Alternatively, the display panel has a first sub-display area and a second sub-display area that are adjacent to each other, the first sub-display area has a lower light transmittance than the second sub-display area, the second sub-display area has a plurality of second regions that are arranged at intervals, and the remaining region constitutes the entire region of the first sub-display area and the first region, the isolation structure includes a plurality of second light transmitting openings provided in one-to-one correspondence with the plurality of second regions, and the protective layer includes a plurality of protective sub-layers corresponding one-to-one to the plurality of second light transmitting openings, each covering a sidewall of the corresponding second light transmitting opening; The first sub-display area is surrounded by the periphery of the second sub-display area.

2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

4. the isolation structure includes a conductive portion that is stacked along a direction away from the substrate, and a blocking portion whose outer contour, as orthogonally projected on the substrate, is located around the outer contour of the conductive portion when orthogonally projected on the substrate; the light-emitting element includes a first electrode, a light-emitting portion, and a second electrode electrically connected to the conductive portion, the first electrode and the light-emitting portion being stacked in a direction away from the substrate; The protective layer is at least a part of a wall surface of the conductive portion of the second isolation structure facing the second region is covered; Furthermore, a wall surface of the blocking portion of the second isolation structure facing the second region is coated, a main body portion covering at least a portion of a side wall of the second isolation structure facing the second region; The material is an organic material or an inorganic material.

2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

5. the protective layer further includes a first extension portion connected to the main body portion and provided on a side of the blocking portion farther from the substrate, the first extension portion having a surface closer to the substrate and a surface of the blocking portion farther from the substrate spaced apart from each other; the second isolation structure has a first trench provided on a side of the isolation structure farther from the substrate, and the protection layer further includes a second extension portion connected to one end of the first extension portion farther from the main body portion and covering at least a part of a trench wall of the first trench; the first trench includes a first sub-trench and a first opening located on a side of the first sub-trench farther from the substrate, the first opening having an orthogonal projection on the substrate within a range of an orthogonal projection of the first sub-trench on the substrate; the first opening penetrates the blocking portion along a thickness direction of the substrate, and the first sub-trench is provided on a surface of the conductive portion on a side away from the substrate; a dimension of the first opening along a first direction perpendicular to a thickness direction of the substrate and an extension direction of the first trench is smaller than a dimension of the first sub-trench along the first direction; a light emitting material film layer and an electrode material layer that are stacked and disposed between the first extending portion and the blocking portion, and the light emitting material film layer is located between the blocking portion and the electrode material layer; 5. The display panel according to claim 4.

6. the protective layer further includes a covering portion connected to the main body portion, one end of the covering portion connected to an end of the main body portion far from the blocking portion, and the other end of the covering portion extending in a direction away from the second isolation structure; the display panel further comprises an insulating structure disposed between the isolation structure and the substrate; 6. The display panel according to claim 5.

7. At least a part of a surface of the covering portion on a side closer to the substrate and a surface of the insulating structure on a side farther from the substrate are spaced apart from each other, a first gap is formed between an end of the body portion far from the blocking portion and a sidewall of the second isolation structure close to the second region, and an entire surface of the covering portion close to the substrate and a surface of the insulating structure far from the substrate are spaced apart from each other; The display panel includes: a filling layer at least partially filled in the first gap and between the covering portion and the insulating structure, the filling layer including an organic material; an organic sealing layer provided on a side of the light-emitting element farther from the substrate and on a side of the isolation structure farther from the substrate, the organic sealing layer being provided in the same layer and made of the same material as the filling layer; 7. The display panel according to claim 6, wherein the first and second electrodes are arranged parallel to each other.

8. one end of the covering portion close to the main body portion contacts a surface of the insulating structure on a side farther from the substrate, and one end of the covering portion farther from the main body portion is spaced apart from the insulating structure; the main body portion covers an entire sidewall of the second isolation structure facing the second region; one end of the blocking portion close to the first isolating opening extends toward a center of the first isolating opening and protrudes from a wall surface of the conductive portion on a side closer to the first isolating opening, and one end of the blocking portion close to the second region extends toward the second region and protrudes from a wall surface of the conductive portion on a side closer to the second region, a portion of the blocking portion protruding from a wall surface of the conductive portion closer to the first isolation opening is a first sub-blocking portion protruding from the wall surface of the conductive portion by a first length, and a portion of the blocking portion protruding from a wall surface of the conductive portion closer to the second region is a second sub-blocking portion protruding from the wall surface of the conductive portion by a second length greater than the first length, a ratio of the second length to the first length is between 1 and 3; the isolation structure is a metal structure, and the metal structure density in the first region is greater than the metal structure density in the second region; 7. The display panel according to claim 6, wherein the first and second electrodes are arranged parallel to each other.

9. a second trench is provided in the insulating structure located in the second region, and the protective layer further includes a third extension portion connected to one end of the covering portion farther from the main body portion and covering at least a part of a trench wall of the second trench; the second trench includes a second sub-trench and a second opening located on a side of the second sub-trench farther from the substrate, the second opening having an orthogonal projection on the substrate within a range of an orthogonal projection of the second sub-trench on the substrate; the insulating structure includes a planarization layer and a pixel definition layer that are stacked one on the other, the planarization layer being provided between the substrate and the pixel definition layer, the second opening penetrating the pixel definition layer along a thickness direction of the substrate, and the second sub-trench being provided on a surface of the planarization layer on a side that is separated from the substrate; a dimension of the second opening along a second direction perpendicular to the thickness direction of the substrate and the extension direction of the second trench is smaller than a dimension of the second sub-trench along the second direction; a light emitting material film layer and an electrode material layer that are stacked and disposed between the covering portion and the insulating structure, the light emitting material film layer being located between the insulating structure and the electrode material layer; the pixel definition layer is provided with a plurality of pixel openings, the plurality of first isolation openings are provided through the pixel definition layer in correspondence with the plurality of pixel openings, and the plurality of light-emitting elements are all provided in correspondence with the plurality of pixel openings; 7. The display panel according to claim 6, wherein the first and second electrodes are arranged parallel to each other.

10. the plurality of light-emitting elements comprises a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light beams of different colors; the display panel further includes a plurality of first sealing portions corresponding one-to-one to the plurality of first light-emitting elements and provided on a side of the corresponding first light-emitting elements farther from the substrate, a plurality of second sealing portions corresponding one-to-one to the plurality of second light-emitting elements and provided on a side of the corresponding second light-emitting elements farther from the substrate, and a plurality of third sealing portions corresponding one-to-one to the plurality of third light-emitting elements and provided on a side of the corresponding third light-emitting elements farther from the substrate, any one of the first sealing portion, the second sealing portion, and the third sealing portion is provided in the same layer as the protective layer and made of the same material; the first sealing portion, the second sealing portion, and the third sealing portion are all inorganic film layers, the first sealing portion includes a first main portion that covers the first light emitting element and a sidewall of the first isolation opening, and a first sub portion that is connected to the first main portion and is provided on a side of the isolation structure that is farther from the substrate, the first sub-portion and a surface of the isolation structure facing away from the substrate are spaced apart from each other; the second sealing portion includes a second main portion that covers the second light emitting element and a sidewall of the first isolation opening, and a second sub portion that is connected to the second main portion and is provided on a side of the isolation structure that is farther from the substrate, the second sub-portion and the surface of the isolation structure facing away from the substrate are spaced apart from each other; the third sealing portion includes a third main portion that covers the third light emitting element and a sidewall of the first isolation opening, and a third sub portion that is connected to the third main portion and is provided on a side of the isolation structure that is farther from the substrate, the third sub-portion and a surface of the isolation structure facing away from the substrate are spaced apart from each other; In the first sealing portion and the second sealing portion that are adjacent to each other, an orthogonal projection of the first sub-portion on the substrate and an orthogonal projection of the second sub-portion on the substrate overlap each other, In the first sealing portion and the second sealing portion that are adjacent to each other, the first sub-portion and the second sub-portion are provided with a gap therebetween, In the first sealing portion and the second sealing portion that are adjacent to each other, a part of the second sub-portions is located on a side of the first sub-portion that is separated from the substrate, In the second sealing portion and the third sealing portion that are adjacent to each other, an orthogonal projection of the second sub-portion on the substrate and an orthogonal projection of the third sub-portion on the substrate overlap each other, In the second sealing portion and the third sealing portion that are adjacent to each other, the second sub-portion and the third sub-portion are provided with a gap therebetween, In the second sealing portion and the third sealing portion that are adjacent to each other, a part of the third sub-portions is located on a side of the second sub-portion that is separated from the substrate.

2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

11. having a display area and a frame area adjacent to each other, an array substrate; a plurality of light emitting elements spaced apart from one another on one side of the array substrate; a metal structure provided on one side of the array substrate, the metal structure comprising a first portion and a second portion electrically connected to each other, the first portion being located in the display area and used to separate the adjacent light-emitting elements, and the second portion being located in the frame area and electrically connected to wiring on the array substrate; a protective layer covering at least a portion of a sidewall of the second portion; A display panel characterized by:

12. the second portion includes a first metal layer and a second metal layer, the first metal layer and the second metal layer being stacked in a direction away from the array substrate, the second metal layer having opposing ends in a first direction that protrude from opposing sides of the first metal layer in the first direction, the protection layer is covered on at least one sidewall of the first metal layer along the first direction perpendicular to the thickness direction of the array substrate and the extending direction of the second portion; the protection layer covers both sidewalls of the first metal layer along the first direction, The protective layer is further covering a sidewall of the second metal layer along the first direction; a main body portion covering a sidewall of the first metal layer along the first direction and a sidewall of the second metal layer along the first direction, 12. The display panel according to claim 11.

13. the protective layer further includes a first extension portion connected to the main body portion and provided on a side of the second metal layer farther from the array substrate, the first extension portion having a surface closer to the array substrate and a surface of the second metal layer farther from the array substrate spaced apart from each other; the first extension portions of the two protective layers located on both sides of the first metal layer in the first direction are connected to each other; a third trench is provided in the second portion, the third trench being provided on a side of the second portion farther from the array substrate, and the protective layer further includes a second extension portion connected to one end of the first extension portion farther from the main body portion and covering at least a part of a trench wall of the third trench; the third trench includes a third sub-trench and a third opening located on a side of the third sub-trench farther from the array substrate, the third opening being orthogonally projected on the array substrate within a range of orthogonal projection of the third sub-trench on the array substrate; the third opening penetrates the second metal layer along a thickness direction of the array substrate, and the third sub-trench is provided in a surface of the first metal layer on a side away from the array substrate; a dimension of the third opening along a first direction perpendicular to a thickness direction of the array substrate and an extension direction of the third trench is smaller than a dimension of the third sub-trench along the first direction; a light emitting material film layer and an electrode material layer that are stacked and disposed between the first extending portion and the second metal layer, and the light emitting material film layer is located between the second metal layer and the electrode material layer; 13. The display panel according to claim 12.

14. the protective layer further includes a covering portion connected to the main body portion, one end of which is connected to an end of the main body portion far from the second metal layer, and the other end of which extends in a direction away from the second portion; the display panel further comprises an insulating structure disposed between the metal structure and the array substrate; 13. The display panel according to claim 12.

15. a surface of the insulating structure that is farther from the array substrate than at least a portion of the surface of the covering portion that is closer to the array substrate is spaced apart from the surface of the insulating structure; a second gap is provided between an end of the body portion farther from the second metal layer and a sidewall of the first metal layer, and an entire surface of the covering portion closer to the array substrate and a surface of the insulating structure farther from the array substrate are spaced apart from each other; The display panel includes: a filling layer at least partially filled in the second gap and between the covering portion and the insulating structure, the filling layer including an organic material; an organic sealing layer provided on a side of the light-emitting element farther from the array substrate and on a side of the metal structure farther from the array substrate, the organic sealing layer being provided in the same layer and made of the same material as the filling layer; Further, a bank is provided in the frame area and is surrounded by the outer periphery of the metal structure; the organic sealing layer further covers at least a portion of the bank; the display panel further includes an inorganic sealing layer that covers at least a side of the organic sealing layer that is separated from the array substrate; 15. The display panel according to claim 14.

16. the covering portion has one end close to the main body portion in contact with the surface of the insulating structure on the side farther from the array substrate, and one end farther from the main body portion and the insulating structure spaced apart from each other; the first portion includes a third metal layer and a fourth metal layer stacked along a direction away from the array substrate, the first portion is provided with a plurality of second isolation openings, the plurality of light-emitting elements are provided corresponding to the plurality of second isolation openings, and at least some of the light-emitting elements are provided in the corresponding second isolation openings; an end of the fourth metal layer close to the second isolation opening extends toward the center of the second isolation opening and protrudes from a wall surface of the third metal layer close to the second isolation opening; a length of the fourth metal layer protruding from a wall surface of the third metal layer on a side closer to the second isolation opening is a first length, and a length of the first metal layer protruding from a wall surface of one side of the second metal layer in the first direction is a second length greater than the first length; a ratio of the second length to the first length is between 1 and 3; the first metal layer and the third metal layer are provided in the same layer and made of the same material; the second metal layer and the fourth metal layer are provided in the same layer and made of the same material; the density of the metal structure in the display area is greater than the density of the metal structure in the frame area; 15. The display panel according to claim 14.

17. a second trench is provided in the insulating structure located in the frame area, and the protective layer further includes a third extension portion connected to one end of the covering portion farther from the body portion and covering at least a part of a trench wall of the second trench; the second trench includes a second sub-trench and a second opening located on a side of the second sub-trench farther from the array substrate, the second opening having an orthogonal projection on the array substrate within a range of an orthogonal projection of the second sub-trench on the array substrate; the insulating structure includes a planarization layer and a pixel definition layer that are stacked one on the other, the planarization layer being provided between the array substrate and the pixel definition layer, the second opening penetrating the pixel definition layer along a thickness direction of the array substrate, and the second sub-trench being provided on a surface of the planarization layer on a side that is away from the array substrate; a dimension of the second opening along a second direction perpendicular to the thickness direction of the array substrate and the extension direction of the second trench is smaller than a dimension of the second sub-trench along the second direction; a light emitting material film layer and an electrode material layer that are stacked and disposed between the covering portion and the insulating structure, the light emitting material film layer being located between the insulating structure and the electrode material layer; a plurality of pixel openings are provided in the pixel definition layer, a plurality of second isolation openings are provided in the first portion so as to penetrate the first portion and correspond to the plurality of pixel openings, and the plurality of light-emitting elements are all provided so as to correspond to the plurality of pixel openings; 15. The display panel according to claim 14.

18. the first portion is provided with a plurality of second isolation openings, the plurality of light emitting elements including a plurality of first light emitting elements, a plurality of second light emitting elements, and a plurality of third light emitting elements, the first light emitting elements, the second light emitting elements, and the third light emitting elements are respectively used to emit light beams of different colors, and the plurality of first light emitting elements, the plurality of second light emitting elements, and the plurality of third light emitting elements are provided in one-to-one correspondence with the plurality of second isolation openings; the display panel further includes a plurality of first sealing portions corresponding one-to-one to the plurality of first light-emitting elements and provided on a side of the corresponding first light-emitting elements farther from the array substrate, a plurality of second sealing portions corresponding one-to-one to the plurality of second light-emitting elements and provided on a side of the corresponding second light-emitting elements farther from the array substrate, and a plurality of third sealing portions corresponding one-to-one to the plurality of third light-emitting elements and provided on a side of the corresponding third light-emitting elements farther from the array substrate, any one of the first sealing portion, the second sealing portion, and the third sealing portion is provided in the same layer as the protective layer and made of the same material; the first sealing portion, the second sealing portion, and the third sealing portion are all inorganic film layers, the first sealing portion includes a first main portion that covers the first light emitting element and a sidewall of the second isolation opening, and a first sub portion that is connected to the first main portion and is provided on a side of the metal structure that is farther from the array substrate, the first sub-portion and the surface of the metal structure farther from the array substrate are spaced apart from each other; the second sealing portion includes a second main portion that covers the second light-emitting element and a sidewall of the second isolation opening, and a second sub portion that is connected to the second main portion and is provided on a side of the metal structure that is farther from the array substrate, the second sub-portion and the surface of the metal structure farther from the array substrate are spaced apart from each other; the third sealing portion includes a third main portion that covers the third light emitting element and a sidewall of the second isolation opening, and a third sub portion that is connected to the third main portion and is provided on a side of the metal structure that is farther from the array substrate, the third sub-portion and the surface of the metal structure farther from the array substrate are spaced apart from each other; In the first sealing portion and the second sealing portion adjacent to each other, the orthogonal projection of the first sub-portion on the array substrate and the orthogonal projection of the second sub-portion on the array substrate overlap each other, In the first sealing portion and the second sealing portion that are adjacent to each other, the first sub-portion and the second sub-portion are provided with a gap therebetween, In the first sealing portion and the second sealing portion adjacent to each other, a part of the second sub-portions is located on a side of the first sub-portion that is separated from the array substrate, In the second sealing portion and the third sealing portion that are adjacent to each other, the orthogonal projection of the second sub-portion on the array substrate and the orthogonal projection of the third sub-portion on the array substrate overlap each other, In the second sealing portion and the third sealing portion that are adjacent to each other, the second sub-portion and the third sub-portion are provided with a gap therebetween, In the second sealing portion and the third sealing portion that are adjacent to each other, a part of the third sub-portions is located on a side of the second sub-portion that is separated from the array substrate.

12. The display panel according to claim 11.

19. A method for manufacturing a display panel, comprising: the display panel has a first region and a second region adjacent to the first region, The manufacturing method includes: Providing a substrate; an isolation structure including: a first isolation structure located in the first region and having a plurality of first isolation openings; and a second isolation structure located at a boundary between the first region and the second region; a plurality of light emitting elements provided corresponding to the plurality of first isolation openings, at least a portion of which is provided in the corresponding first isolation openings; and a protective layer formed on one side of the substrate, and the protective layer covering at least a portion of a side wall of the second isolation structure facing the second region. A manufacturing method characterized by:

20. The above-mentioned forming the isolation structure, the plurality of light emitting devices, and the protective layer on one side of the substrate may include: forming an isolation structure on one side of the substrate; forming a protective layer on at least a portion of a sidewall of the second isolation structure toward the second region; forming a plurality of light emitting devices on one side of the substrate; 20. The method of claim 19.

21. The above-mentioned forming the isolation structure, the plurality of light emitting devices, and the protective layer on one side of the substrate may include: forming an isolation structure on one side of the substrate; forming a protective layer and a plurality of light emitting elements on one side of the substrate; 20. The method of claim 19.

22. the plurality of light-emitting elements include a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are used to emit light beams of different colors, respectively; the plurality of first isolated openings include a plurality of first openings, a plurality of second openings, and a plurality of third openings; The above-mentioned forming a protective layer and a plurality of light emitting elements on one side of the substrate is forming the first light emitting element in the first opening; forming a first sealing portion on the first light emitting element, and forming a protective layer on at least a part of a sidewall of the second isolation structure facing the second region; forming a second light emitting element in the second opening; forming a second sealing portion on the second light emitting element; forming a third light emitting element in the third opening; forming a third sealing portion on the third light emitting element; 22. The method of claim 21 .

23. the plurality of light-emitting elements include a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are used to emit light beams of different colors, respectively; the plurality of first isolated openings include a plurality of first openings, a plurality of second openings, and a plurality of third openings; The above-mentioned forming a protective layer and a plurality of light emitting elements on one side of the substrate is forming the first light emitting element in the first opening; forming a first sealing portion on the first light emitting element; forming a second light emitting element in the second opening; forming a second sealing portion on the second light emitting element, and forming a protective layer on at least a part of a sidewall of the second isolation structure facing the second region; forming a third light emitting element in the third opening; forming a third sealing portion on the third light emitting element; 22. The method of claim 21 .

24. the plurality of light-emitting elements include a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are used to emit light beams of different colors, respectively; the plurality of first isolated openings include a plurality of first openings, a plurality of second openings, and a plurality of third openings; The above-mentioned forming a protective layer and a plurality of light emitting elements on one side of the substrate is forming the first light emitting element in the first opening; forming a first sealing portion on the first light emitting element; forming a second light emitting element in the second opening; forming a second sealing portion on the second light emitting element; forming a third light emitting element in the third opening; forming a third sealing portion on the third light emitting element, and forming a protective layer on at least a part of a sidewall of the second isolation structure facing the second region; 22. The method of claim 21 .

25. the plurality of light-emitting elements include a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are used to emit light beams of different colors, respectively; the plurality of first isolated openings include a plurality of first openings, a plurality of second openings, and a plurality of third openings; The above-mentioned forming the isolation structure, the plurality of light emitting devices, and the protective layer on one side of the substrate may include: forming an isolation structure material layer on one side of the substrate; performing a first etch on the isolation structure material layer to form a first opening and a sidewall toward the second region of the second isolation structure; forming a first light emitting element within the first opening; forming a first sealing portion on the first light emitting element; performing side etching on a sidewall of the second isolation structure toward the second region; performing a second etching on the isolation structure material layer to form a second opening; forming a second light emitting element in the second opening; forming a second sealing portion on the second light emitting element, and forming the protective layer on at least a part of a sidewall of the second isolation structure facing the second region; performing a third etching on the isolation structure material layer to form a third opening; forming a third light emitting element in the third opening; forming a third sealing portion on the third light emitting element; 20. The method of claim 19.

26. the plurality of light-emitting elements include a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are used to emit light beams of different colors, respectively; the plurality of first isolated openings include a plurality of first openings, a plurality of second openings, and a plurality of third openings; The above-mentioned forming the isolation structure, the plurality of light emitting devices, and the protective layer on one side of the substrate may include: forming an isolation structure material layer on one side of the substrate; performing a first etch on the isolation structure material layer to form a first opening and a sidewall toward the second region of the second isolation structure; forming a first light emitting element within the first opening; forming a first sealing portion on the first light emitting element; performing a second etching on the isolation structure material layer to form a second opening; forming a second light emitting element in the second opening; forming a second sealing portion on the second light emitting element; performing side etching on a sidewall of the second isolation structure toward the second region; performing a third etching on the isolation structure material layer to form a third opening; forming a third light emitting element in the third opening; forming a third sealing portion on the third light emitting element, and forming the protective layer on at least a part of a sidewall of the second isolation structure facing the second region.

20. The method of claim 19.

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