Liquid discharge head, discharge device, and liquid discharge apparatus

Abstract

To provide a liquid discharge head, a discharge unit, and a liquid discharge device capable of increasing rigidity of a common passage member.SOLUTION: The liquid discharge head includes a nozzle plate 110 having a plurality of nozzles 111 for discharging a liquid, a first substrate 171 forming a plurality of pressure chambers 121 respectively communicating with at least the plurality of nozzles 111, and a second substrate 170 forming a common-supply main channel 156 communicating with the plurality of pressure chambers 121, in which a reinforcing portion 190 in a direction intersecting a longitudinal direction of the common-supply main channel 156 is provided in a region forming the common-supply main channel 156 of the second substrate 170, and a thickness t2 portion of the reinforcing portion 171 is thinner than a thickness t1 portion of the second substrate 170.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present invention relates to a liquid ejection head, an ejection unit, and an apparatus for ejecting liquid. [Background technology]

[0002] Some liquid ejection heads for ejecting liquid include a nozzle plate having a plurality of nozzles for ejecting liquid, individual flow path members that form a plurality of pressure chambers that are each connected to the plurality of nozzles, and a common flow path member that forms a common flow path that communicates with the plurality of pressure chambers.

[0003] Conventionally, there has been known a method for manufacturing a liquid jet head having a flow path forming substrate and a bonding substrate bonded to the flow path forming substrate and made of a material different from the flow path forming substrate, and having a low-rigidity portion on one side of the outer edge of the flow path forming substrate that is lower in rigidity than other portions of the outer edge, the method comprising the steps of integrally forming a plurality of flow path forming substrates on a silicon wafer and forming a break pattern in which a plurality of through holes are arranged in a row at predetermined intervals between each of the flow path forming substrates on the silicon wafer, bonding the bonding substrate to the flow path forming substrate, and dividing the silicon wafer into a plurality of flow path forming substrates along the break pattern, and wherein when forming the break pattern, through holes are formed continuously in portions of the silicon wafer that correspond to the low-rigidity portion (Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-036238 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the common flow path member has an opening formed therein that serves as a long common flow path leading to a plurality of pressure chambers, which reduces the rigidity of the common flow path member.

[0006] The present invention has been made in view of the above-mentioned problems, and has an object to increase the rigidity of a common flow path member. [Means for solving the problem]

[0007] In order to solve the above problems, the liquid ejection head according to the present invention comprises: a nozzle plate having a plurality of nozzles for ejecting liquid; a first substrate forming a plurality of pressure chambers each communicating with at least the plurality of nozzles; a second substrate that forms a common flow path that communicates with the plurality of pressure chambers; a reinforcing portion is provided in a region of the second substrate where the common flow path is formed, the reinforcing portion being in a direction intersecting with a longitudinal direction of the common flow path; The thickness of the reinforcing portion is smaller than the thickness of the second substrate. The composition was as follows. [Effects of the Invention]

[0008] According to the present invention, the rigidity of the common flow path member can be increased. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is an explanatory perspective view of the appearance of a liquid ejection head according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional explanatory view of the same. [Figure 3] FIG. 4 is an explanatory plan view of a second substrate. [Figure 4] 10 is an explanatory view showing a state in which a second substrate and a damper member are joined together. FIG. [Figure 5] FIG. 2 is an explanatory plan view of a first substrate. [Figure 6] FIG. 2 is a perspective explanatory view of a state in which a first substrate and a second substrate are joined together. [Figure 7] FIG. 10 is a perspective view illustrating a state in which the second substrate is bonded to the dicing tape. [Figure 8] FIG. 10 is a plan view illustrating the expanding process. [Figure 9]FIG. 4 is an explanatory plan view of the second substrate of the first embodiment, illustrating the effect of providing a reinforcing portion. [Figure 10] FIG. 10 is an explanatory plan view of a second substrate of Comparative Example 1. [Figure 11] FIG. 10 is a perspective explanatory view showing a second substrate of a liquid ejection head according to a second embodiment of the present invention together with a dicing tape. [Figure 12] FIG. 10 is an explanatory plan view of a second substrate in a liquid ejection head according to a third embodiment of the present invention. [Figure 13] FIG. 10 is an explanatory perspective view of the appearance of a liquid ejection head according to a fourth embodiment of the present invention. [Figure 14] FIG. 10 is an explanatory perspective view of the exterior of the ink jet head as viewed from the opposite side to the nozzle surface. [Figure 15] FIG. [Figure 16] FIG. [Figure 17] FIG. 17 is an enlarged perspective view illustrating a main part of FIG. 16. [Figure 18] FIG. [Figure 19] 1 is a schematic side view illustrating an example of a printing apparatus as a liquid ejecting apparatus according to the present invention. [Figure 20] FIG. 2 is an explanatory plan view of a discharge unit of the printing apparatus. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. A first embodiment of the present invention will be described with reference to FIGS. 1 to 7. FIG. 1 is an explanatory perspective view of the appearance of a liquid ejection head according to the embodiment, and FIG. 2 is an explanatory cross-sectional view of the same. FIG. 3 is an explanatory plan view of the second substrate, and FIG. 4 is an explanatory view of the second substrate and the damper member bonded together. Note that FIG. 4(a) is an explanatory plan view, and FIG. 4(b) is an explanatory cross-sectional view taken along line AA in FIG. 5(a). FIG. 5 is an explanatory plan view of the first substrate, FIG. 6 is an explanatory perspective view of the first substrate and the second substrate bonded together, and FIG. 7 is an explanatory perspective view of the second substrate bonded to a dicing tape. Note that the damper member is omitted from FIG. 6. is.

[0011] The head 100 includes a nozzle plate 110, a first substrate 190, a second substrate 170, a damper member 160, a frame member 180, a wiring member (flexible wiring board) 145, and the like.

[0012] The nozzle plate 110 has a plurality of nozzles 111 for ejecting liquid. The plurality of nozzles 111 are arranged in a two-dimensional matrix.

[0013] The first substrate 190 forms a plurality of pressure chambers (individual liquid chambers, individual flow paths) 121 each connected to a plurality of nozzles 111, and a plurality of common supply flow path tributaries 152 which are common flow path tributaries connected to two or more pressure chambers 121, and has piezoelectric elements 140 arranged thereon to pressurize the pressure chambers 121.

[0014] Furthermore, the first substrate 190 is formed with one or more parts 156a of the common supply channel main stream 156 that communicate with the plurality of common supply channel branch streams 152.

[0015] The second substrate 170 is a common flow path main stream member, and forms a common supply flow path main stream 156, which is a common flow path that communicates with multiple common supply flow path tributaries 152. In this embodiment, the second substrate 170 is configured such that the common supply flow path main streams 156, which serve as common flow paths, are arranged on both sides of the second substrate 170 in the short side direction.

[0016] The frame member 180 is formed with a supply port 181 and a supply passage 183 that connects the supply port 181 with the common supply flow path main stream 156 .

[0017] In this liquid ejection head 100, as shown in Figures 3, 6 and 7, multiple reinforcing portions 171 are provided in the area of ​​the second substrate 170 that forms the common supply flow path main stream 156, in a direction that intersects with the longitudinal direction of the common supply flow path main stream 156.

[0018] In this embodiment, the thickness t2 of the reinforcing portion 171 is set to be the same as the thickness t1 of the second substrate 170. Therefore, the common supply channel main stream 156 is divided into a plurality (here, three) of openings (channel portions) 156A by the reinforcing portion 171 in the longitudinal direction of the common supply channel main stream 156.

[0019] This makes the thin second substrate 170 more rigid than when one long opening is formed as the common flow path (here, the common supply flow path main stream 156).

[0020] In this way, when the rigidity of the second substrate 170 is increased, damage due to expansion (division) during the manufacturing process of the liquid ejection head 100 can be reduced.

[0021] In addition, a damper member 160 is bonded to the bonding surface of the second substrate 170 that is bonded to the first substrate 190. A recess 178 that serves as a damper chamber is formed on the bonding surface of the second substrate 170 that is bonded to the first substrate 190.

[0022] The damper member 160 forms a deformable wall surface of the common supply flow path branch 152. The damper member 160 also serves as a filter member, and as shown in FIG. 4(a), the region of the second substrate 170 corresponding to the common supply flow path main 156 is a filter region 163 in which a large number (plurality) of filter holes 164 are formed.

[0023] Next, the expanding will be described with reference to Fig. 8. Fig. 8 is a plan view for explaining the same.

[0024] A large number of second substrates 170a before being divided into second substrates 170 are formed on silicon wafer 914. Cracks that become division lines 913 are made in silicon wafer 914 using a dicer or the like.

[0025] Thereafter, the dicing tape 915 to which the silicon wafer 914 is attached is pulled in a 360° direction as shown by the arrows, thereby separating the silicon wafer 914 along the separation lines 913 into the second substrate 170 in the form of individual chips.

[0026] At this time, if the second substrate 170 has a pattern with low rigidity, it may deform in accordance with the expansion of the dicing tape 915. Therefore, by providing a reinforcing portion 171 at the opening that forms the common supply flow path main stream 156 of the second substrate 170, it is possible to suppress deformation during expansion, and prevent damage to the chips on the second substrate 170 and the chips rubbing against each other to generate silicon dust.

[0027] The effect of providing a reinforcing portion will now be described with reference to Fig. 9 and Fig. 10. Fig. 9 is an explanatory plan view of the second substrate of the first embodiment, and Fig. 10 is an explanatory plan view of the second substrate of Comparative Example 1. In each figure, (a) shows the state of the second substrate before expansion, and (b) shows the state of the second substrate after expansion.

[0028] 9, the second substrate 170a of the first embodiment is provided with a reinforcing portion 171 in the common supply flow path main stream 156. As shown in FIG. 10, the second substrate 170a of the comparative example 1 forms the common supply flow path main stream 156 consisting of one elongated opening.

[0029] Therefore, a wafer on which the second substrate 170a of the first embodiment was formed and a wafer on which the second substrate 170a of Comparative Example 1 was formed were prepared, and it was confirmed whether deformation occurred during actual expanding, whether damage to parts occurred, or whether dust generation of foreign matter occurred. In addition, a Si membrane that would become the damper member 160 was formed on each of the second substrates 170a.

[0030] As a result, in Comparative Example 1, five wafers were prepared and expanded, and deformation of the chips on the second substrate 170b after expansion was observed in all chips on all wafers, as shown in Fig. 10(b). The largest deformation was approximately 350 µm in the short direction.

[0031] In addition, regarding the damper member 160 formed on the second substrate 170, membrane breakage was confirmed in about 60% of the chips. Furthermore, when five chips were extracted for foreign matter inspection, it was confirmed that up to about 50 foreign matters of 10 μm or more were attached per chip at most.

[0032] In contrast, in the first embodiment, when five wafers were prepared and expanded, no significant deformation of the chips of the second substrate 170b after expansion was observed in all chips of all wafers as shown in FIG. 9(b). The maximum deformation was about 10 μm at most in the short side direction, which is a significant improvement compared to Comparative Example 1.

[0033] In addition, membrane breakage could not be confirmed for the damper member 160 formed on the second substrate 170. Furthermore, when five chips were extracted for foreign matter inspection, foreign matters of 10 μm or more could not be confirmed.

[0034] Next, a second embodiment of the present invention will be described with reference to FIG. 11. FIG. 11 is a perspective explanatory view showing a second substrate together with a dicing tape in the liquid ejection head according to this embodiment.

[0035] Also in this embodiment, a plurality of reinforcing portions 171 in a direction intersecting the longitudinal direction of the common supply flow path main flow 156 are provided in the region forming the common supply flow path main flow 156 of the second substrate 170.

[0036] And in this embodiment, the thickness t2 of the reinforcing portion 171 is made thinner than the thickness t1 of the second substrate 170 (t2 < t1). Furthermore, the reinforcing portion 171 is provided so as to be biased toward the bonding surface side with the first substrate 190.

[0037] Thereby, a flow path in the longitudinal direction is secured for the common supply flow path main flow 156, and the volume of the common supply flow path main flow 156 can be secured. In other words, since the larger the volume of the reinforcing portion 171, the greater the fluid resistance, the fluid resistance due to the provision of the reinforcing portion 171 is reduced by reducing the volume of the reinforcing portion 171 as much as possible.

[0038] Furthermore, by positioning the reinforcing portion 171 biased toward the bonding surface with the first substrate 190, a structure can be created in which the dicing tape 915 and the reinforcing portion 171 come into contact when expanded, which also provides a sufficient effect of preventing deformation.

[0039] In this embodiment, a wafer was prepared in the same manner as in the first embodiment, and the deformation, damage, and foreign matter of the second substrate 170 during expansion were checked. As a result, it was confirmed that the deformation amount of the second substrate 170 was about 10 μm at most, and that there was no damage to the membrane of the damper member 160 or any foreign matter larger than 10 μm.

[0040] Next, a third embodiment of the present invention will be described with reference to Fig. 12. Fig. 12 is an explanatory plan view of a second substrate in a liquid ejection head according to this embodiment, where (a) is an overall explanatory plan view and (b) is a partially enlarged explanatory plan view.

[0041] In this embodiment, a large number (plurality) of holes 174 are provided in an area 373 of the second substrate 170 that forms the common main flow channel, and the common supply main flow channel 156 is formed by the plurality of holes 174.

[0042] This allows the rigidity of the second substrate 170 to be increased.

[0043] Furthermore, the opening area of ​​the hole portion 174 can be set to be the same as the opening area of ​​the filter hole 164 of the filter region 163 of the damper member 160 of the first embodiment.

[0044] This allows the second substrate 170 to double as a filter member, and the filter region 163 of the damper member 160 in the first embodiment can be made into a simple opening.

[0045] In this embodiment, a wafer was prepared in the same manner as in the first embodiment, and deformation, damage, and foreign matter of the second substrate 170 during expansion were checked. The diameter of the hole 174 was set to 24 μm, the same as the diameter of the filter hole 164 in the filter region 163 of the damper member 160 in the first embodiment. The filter region 163 of the damper member 160 was simply an opening.

[0046] As a result, it was confirmed that the deformation of the second substrate 170 was approximately 1.2 μm, which was within the measurement error level, and that the membrane of the damper member 160, which has a filter region 163 as a simple opening, was not damaged and there were no foreign objects larger than 10 μm.

[0047] Next, a fourth embodiment of the present invention will be described with reference to Figures 13 to 18. Figure 13 is an explanatory perspective view of the exterior of a liquid ejection head according to this embodiment, as seen from the nozzle surface side, Figure 14 is an explanatory perspective view of the same, as seen from the opposite side of the nozzle surface, Figure 15 is an exploded perspective view of the same, Figure 16 is an exploded perspective view of flow path components of the same, Figure 17 is an enlarged perspective view of the main parts of Figure 16, and Figure 18 is a cross-sectional perspective view of the flow path portion of the same.

[0048] The head 100 is a circulation type liquid ejection head, and includes a nozzle plate 110, a flow path plate (individual flow path member) 120, a vibration plate member 130 including a piezoelectric element 140, a common flow path tributary member 150, a damper member 160, a second substrate 170 serving as a common flow path mainstream member, a frame member 180, and a wiring member (flexible wiring board) 145. A head driver (driver IC) 146 is mounted on the wiring member 145.

[0049] In this embodiment, the flow path plate 120 and the vibration plate member 130 constitute an actuator substrate 102 on which a piezoelectric element 140 is arranged. The flow path plate 120 and the common flow path branch member 150 correspond to the first substrate 190 in the first embodiment.

[0050] The nozzle plate 110 has a plurality of nozzles 111 for ejecting liquid. The plurality of nozzles 111 are arranged in a two-dimensional matrix.

[0051] The flow path plate 120 forms a plurality of pressure chambers (individual liquid chambers) 121 each communicating with a plurality of nozzles 111, a plurality of individual supply flow paths 122 each communicating with the plurality of pressure chambers 121, and a plurality of individual recovery flow paths 123 each communicating with the plurality of pressure chambers 121.

[0052] The vibration plate member 130 forms a vibration plate 131 which is a deformable wall surface of the pressure chamber 121, and a piezoelectric element 140 is integrally provided on the vibration plate 131. The vibration plate member 130 also has a supply side opening 132 which communicates with the individual supply flow path 122, and a recovery side opening 133 which communicates with the individual recovery flow path 123. The piezoelectric element 140 is a pressure generating means (pressure generating element) which deforms the vibration plate 131 to pressurize the liquid in the pressure chamber 121.

[0053] The common flow path branch member 150 forms a plurality of common supply flow path branches 152 that communicate with two or more individual supply flow paths 122 and a plurality of common recovery flow path branches 153 that communicate with two or more individual recovery flow paths 123, which are alternately arranged adjacent to each other.

[0054] The common flow path tributary member 150 has a through hole which serves as a supply port 154 connecting the supply side opening 132 of the individual supply flow path 122 and the common supply flow path tributary 152, and a through hole which serves as a recovery port 155 connecting the recovery side opening 133 of the individual recovery flow path 123 and the common recovery flow path tributary 153.

[0055] In addition, the common flow path tributary member 150 forms a portion 156a of one or more common supply flow path main streams 156 that communicate with multiple common supply flow path tributaries 152, and a portion 157a of one or more common return flow path main streams 157 that communicate with multiple common return flow path tributaries 153.

[0056] The damper member 160 has a supply-side damper facing (opposite) the supply port 154 of the common supply flow path branch 152, and a recovery-side damper facing (opposite) the recovery port 155 of the common recovery flow path branch 153. The damper member 160 can be provided with the filter region 163 described in the first embodiment.

[0057] Here, the common supply flow path tributary 152 and the common recovery flow path tributary 153 are formed by sealing grooves arranged alternately in the same member, the common flow path tributary member 150, with a damper member 160 that forms a deformable wall surface.

[0058] The second substrate 170 is a common flow path main member, and forms a common supply flow path main 156 as a common flow path that leads to multiple common supply flow path tributaries 152, and a common recovery flow path main 157 as a common flow path that leads to multiple common recovery flow path tributaries 153.

[0059] In the frame member 180, a portion 156b of the common supply main flow channel 156 and a portion 157b of the common return main flow channel 157 are formed.

[0060] A portion 156 b of the common supply main flow path 156 communicates with a supply port 181 provided in a frame member 180 , and a portion 157 b of the common return main flow path 157 communicates with a return port 182 provided in the frame member 180 .

[0061] In this head 100, when a drive pulse is applied to the piezoelectric element 140, the piezoelectric element 140 is flexibly deformed and pressurizes the liquid in the pressure chamber 121, causing the liquid to be ejected from the nozzle 111 in droplet form.

[0062] Furthermore, when the head 100 is not discharging liquid, or when the liquid is not discharged from the nozzles 111, it circulates through a circulation path to which the recovery port 182 and the supply port 181 are connected.

[0063] Also in this embodiment, the second substrate 170 is provided with reinforcing portions 171 at the portions forming the common supply channel main stream 156 and the common recovery channel main stream 157. The reinforcing portions 171 may have the same thickness as in the first embodiment or the second embodiment. The common supply channel main stream 156 and the common recovery channel main stream 157 may also have the configuration of the third embodiment.

[0064] This also makes it possible to increase the rigidity of the second substrate 170 in this embodiment.

[0065] Next, an example of a printing device as a device for ejecting liquid according to the present invention will be described with reference to Figures 19 and 20. Figure 19 is a schematic side view of the printing device, and Figure 20 is a plan view of the ejection unit of the printing device.

[0066] The printing device 1 is a device that ejects liquid, and includes an input section 10 that inputs a sheet material P, a pre-processing section 20, a printing section 30, a drying section 40, an inversion mechanism section 60, and an output section 50.

[0067] The printing device 1 applies (coats) pretreatment liquid to the sheet material P transported (supplied) from the transport section 10 as needed in the pretreatment section 20, which is a pretreatment means, applies liquid in the printing section 30 to perform the required printing, dries the liquid adhering to the sheet material P in the drying section 40, and then discharges the sheet material P to the transport section 50.

[0068] The loading section 10 includes an input tray 11 (lower input tray 11A, upper input tray 11B) that stores multiple sheet materials P, and a feeding device 12 (12A, 12B) that separates and sends out the sheet materials P one by one from the input tray 11, and supplies the sheet materials P to the pre-processing section 20.

[0069] The pre-treatment unit 20 includes an application unit 21 which is a treatment liquid application unit that applies a treatment liquid to the printing surface of the sheet material P, which has the effect of, for example, aggregating ink and preventing show-through.

[0070] The printing unit 30 includes a drum 31, which is a support member (rotating member) that supports the sheet material P on its circumferential surface and rotates, and a liquid ejection unit 32 that ejects liquid toward the sheet material P supported on the drum 31.

[0071] The printing section 30 also includes a transfer cylinder 34 that receives the sheet material P sent from the pre-processing section 20 and transfers the sheet material P between the drum 31, and a transfer cylinder 35 that receives the sheet material P transported by the drum 31 and transfers it to the drying section 40.

[0072] The sheet material P transported from the pre-processing section 20 to the printing section 30 has its leading edge gripped by a gripping means (sheet gripper) provided on the transfer drum 34, and is transported as the transfer drum 34 rotates. The sheet material P transported by the transfer drum 34 is delivered to the drum 31 at a position opposite the drum 31.

[0073] A gripping means (sheet gripper) is also provided on the surface of the drum 31, and the leading edge of the sheet material P is gripped by the gripping means (sheet gripper). A plurality of suction holes are formed in a dispersed manner on the surface of the drum 31, and the suction means generates a suction airflow that flows inward from the required suction holes of the drum 31.

[0074] The sheet material P transferred from the transfer cylinder 34 to the drum 31 has its leading edge gripped by the sheet gripper, and is adsorbed and supported on the drum 31 by the suction airflow of the suction means, and is transported as the drum 31 rotates.

[0075] The liquid discharge section 32 is equipped with discharge units 33 (33A to 33D) which are liquid discharge means. For example, the discharge unit 33A discharges cyan (C) liquid, the discharge unit 33B discharges magenta (M) liquid, the discharge unit 33C discharges yellow (Y) liquid, and the discharge unit 33D discharges black (K) liquid. In addition, discharge units that discharge special liquids such as white, gold (silver), etc. can also be used.

[0076] The ejection unit 33 is, for example, a full-line type head in which a plurality of liquid ejection heads (heads) 100 according to the present invention, each having a plurality of nozzles 111 arranged in a two-dimensional matrix, are arranged in a staggered pattern on a base member 331, as shown in FIG.

[0077] The discharge operation of each discharge unit 33 of the liquid discharge section 32 is controlled by a drive signal corresponding to the printing information. When the sheet material P carried on the drum 31 passes through an area facing the liquid discharge section 32, liquid of each color is discharged from the discharge unit 33, and an image corresponding to the printing information is printed.

[0078] The sheet material P to which the liquid has been applied by the liquid discharge unit 32 is delivered from the drum 31 to a delivery drum 35, and then delivered by the delivery drum 35 to a conveying mechanism unit 41 that transports the sheet material P to a drying unit 40.

[0079] The drying section 40 uses a heating means 42 to heat the sheet material P being conveyed by the conveying mechanism section 41, thereby drying the liquid adhering to the sheet material P. This causes the water content and other liquid components in the liquid to evaporate, the colorant contained in the liquid to be fixed on the sheet material P, and also prevents the sheet material P from curling.

[0080] The reversing mechanism section 60 is a mechanism that reverses the sheet material P using a switchback method when performing double-sided printing on the sheet material P that has passed through the drying section 40, and the reversed sheet material P is sent back upstream of the transfer drum 34 through the double-sided conveying path 61.

[0081] The discharge section 50 is provided with a discharge tray 51 on which a plurality of sheet materials P are stacked. The sheet materials P conveyed from the drying section 40 via the reversing mechanism section 60 are sequentially stacked and held on the discharge tray 51.

[0082] In the present application, the liquid to be ejected may have a viscosity and surface tension that allows it to be ejected from the head, and is not particularly limited, but preferably has a viscosity of 30 mPa·s or less at room temperature and normal pressure, or upon heating or cooling. More specifically, the liquid may be a solution, suspension, emulsion, or the like containing a solvent such as water or an organic solvent, a colorant such as a dye or pigment, a polymerizable compound, a resin, a surfactant, or the like, a biocompatible material such as DNA, amino acids, proteins, or calcium, or an edible material such as a natural colorant, and the like. These liquids can be used, for example, as inkjet inks, surface treatment liquids, liquids for forming components of electronic devices or light-emitting elements, or electronic circuit resist patterns, and material liquids for 3D modeling.

[0083] Energy sources for ejecting liquid include piezoelectric actuators (laminated piezoelectric elements and thin-film piezoelectric elements), thermal actuators that use electrothermal conversion elements such as heating resistors, and electrostatic actuators consisting of a vibration plate and an opposing electrode.

[0084] A "liquid ejection unit" is a liquid ejection head integrated with functional parts and mechanisms, and includes a collection of parts related to ejecting liquid. For example, a "liquid ejection unit" includes a liquid ejection head combined with at least one of the following components: a head tank, a carriage, a supply mechanism, a maintenance and recovery mechanism, a main scanning movement mechanism, and a liquid circulation device.

[0085] Here, "integrated" includes, for example, a liquid ejection head and a functional part or mechanism that are fixed to each other by fastening, bonding, engaging, etc., or one that is held movably relative to the other. The liquid ejection head, functional part, or mechanism may also be configured to be detachable from each other.

[0086] For example, some liquid ejection units have a liquid ejection head and a head tank integrated together, while others have a liquid ejection head and a head tank integrated together by being connected to each other by a tube, etc. Here, a unit including a filter can be added between the head tank and the liquid ejection head of these liquid ejection units.

[0087] Furthermore, there is a liquid ejection unit in which the liquid ejection head and the carriage are integrated.

[0088] In some liquid ejection units, the liquid ejection head is movably held by a guide member that constitutes part of the scanning movement mechanism, and the liquid ejection head and the scanning movement mechanism are integrated together. In other liquid ejection units, the liquid ejection head, the carriage, and the main scanning movement mechanism are integrated together.

[0089] Furthermore, there is a liquid ejection unit in which a cap member, which is part of the maintenance and recovery mechanism, is fixed to a carriage on which a liquid ejection head is attached, thereby integrating the liquid ejection head, carriage, and maintenance and recovery mechanism.

[0090] In some liquid ejection units, a tube is connected to a liquid ejection head equipped with a head tank or flow path components, integrating the liquid ejection head with a supply mechanism. Liquid is supplied from a liquid storage source to the liquid ejection head via this tube.

[0091] The main scanning movement mechanism includes the guide member alone, and the supply mechanism includes the tube alone and the loading unit alone.

[0092] Here, the "liquid ejection unit" is described in combination with a liquid ejection head, but the "liquid ejection unit" also includes a head module or head unit that includes the liquid ejection head described above, and that integrates the functional components and mechanisms described above.

[0093] "Liquid ejection devices" include devices that are equipped with a liquid ejection head, a liquid ejection unit, a head module, a head unit, etc., and that eject liquid by driving the liquid ejection head. Liquid ejection devices include not only devices that can eject liquid onto objects to which the liquid can adhere, but also devices that eject liquid into air or liquid.

[0094] This "liquid ejecting device" can also include means for feeding, transporting, and discharging items onto which liquid can be attached, as well as pre-processing devices and post-processing devices.

[0095] For example, examples of "liquid ejecting devices" include image forming devices that eject ink to form images on paper, and three-dimensional modeling devices (three-dimensional modeling devices) that eject modeling liquid onto a powder layer formed from layers of powder in order to create a three-dimensional object (a three-dimensional model).

[0096] Furthermore, the term "liquid ejection device" is not limited to devices that use ejected liquid to visualize meaningful images such as letters and figures. For example, it also includes devices that form patterns that have no meaning in themselves, and devices that create three-dimensional images.

[0097] The above-mentioned "object onto which a liquid can adhere" means an object onto which a liquid can adhere at least temporarily, an object onto which the liquid can adhere and stick, an object onto which the liquid can penetrate, etc. Specific examples include media such as paper, recording paper, film, and cloth, electronic circuit boards, electronic components such as piezoelectric elements, powder layers, organ models, and test cells, and unless otherwise specified, includes all objects onto which a liquid can adhere.

[0098] The material of the "substance to which a liquid can adhere" may be any material to which a liquid can adhere, even temporarily, such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, or ceramics.

[0099] Furthermore, the "liquid ejection device" may be a device in which a liquid ejection head and an object onto which liquid can be attached move relatively, but is not limited to this. Specific examples include a serial type device in which a liquid ejection head moves, and a line type device in which a liquid ejection head does not move.

[0100] Other examples of "liquid ejecting devices" include a treatment liquid application device that ejects a treatment liquid onto paper to apply the treatment liquid to the surface of the paper for purposes such as modifying the surface of the paper, and an injection granulation device that ejects a composition liquid in which raw materials are dispersed through a nozzle to granulate fine particles of the raw materials.

[0101] In the present application, the terms image formation, recording, printing, copying, printing, modeling, etc. are all synonymous. [Explanation of symbols]

[0102] 1. Printing device (device that ejects liquid) 30 Printing Department 33 Discharge unit 100 Liquid ejection head 102 Actuator board 110 nozzle plate 111 Nozzle 120 Individual flow path components 121 Pressure Chamber 122 Individual supply channel 123 Individual collection channel 128 Individual supply flow path 129 Individual recovery flow path 130 Diaphragm member 140 Piezoelectric element 150 Common flow channel tributary member 152 Common Supply Channel Tributaries 153 Common Collection Channel Tributary 156 Common supply channel main stream 157 Common recovery channel main stream 160 Damper member 170 Second board 171 Reinforcement 174 Hole 190 First board

Claims

1. a nozzle plate having a plurality of nozzles for ejecting liquid; a first substrate forming a plurality of pressure chambers each communicating with at least the plurality of nozzles; a second substrate that forms a common flow path that communicates with the plurality of pressure chambers, a reinforcing portion is provided in a region of the second substrate where the common flow path is formed, the reinforcing portion extending in a direction intersecting with a longitudinal direction of the common flow path; The thickness of the reinforcing portion is smaller than the thickness of the second substrate. A liquid ejection head characterized by:

2. The reinforcing portion is provided offset in the thickness direction of the second substrate.

2. The liquid ejection head according to claim 1.

3. A plurality of liquid ejection heads according to claim 1 or 2 are arranged. A discharge unit characterized by:

4. A liquid ejection head according to claim 1 or 2, and an ejection unit according to claim 3. A liquid ejection device comprising:

Images