Heat sinks and electronic devices

Abstract

To be applicable to various installation forms. [Solution] A heat sink (40B) that is a radiator includes a plurality of pins (46) and a heat dissipation bracket (41B) that has a plurality of wall portions, at least one of which is in surface contact with an integrated circuit (20) that is a heat source of electronic device (1). A plurality of pin holes (45, 45B) that can attach pins (46) are arranged in at least one of the wall portions that is not in contact with the integrated circuit (20) that is a heat source of electronic device (1). The pin holes (45, 45B) are arranged in the plurality of wall portions, and the axial inclination of the pin hole (45) with respect to the wall portion in which it is arranged differs from the axial inclination of the pin holes (45B) arranged in the other wall portions with respect to the other wall portions.

Description

[Technical Field]

[0001] The present invention relates to a heat sink and an electronic device. [Background technology]

[0002] A support body made of a highly thermally conductive material that is fixed to the object to be cooled with a gap secured. and a cylindrical body erected on a support body (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-219575 Summary of the Invention [Problem to be solved by the invention]

[0004] The structures of the electronic devices to which heat sinks are attached vary from product to product, so each electronic device requires a heat sink that suits its installation configuration.

[0005] The present invention has been made in view of the above, and has an object to make it possible to apply the present invention to various installation forms. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the heat sink of the present invention comprises a plurality of pins and a heat dissipation bracket having a plurality of wall portions, at least one of the plurality of wall portions being in surface contact with a heat source of an electronic device, at least one of the plurality of wall portions that is not in contact with the heat source of the electronic device has a plurality of pin holes to which the pins can be attached, the pin holes are arranged in the plurality of wall portions, and the axial inclination of the pin holes relative to the wall portion in which they are arranged is different from the axial inclination of the pin holes arranged in other wall portions relative to the other wall portions.

[0007] In order to solve the above-mentioned problems and achieve the object, an electronic device according to the present invention includes a substrate and the above-mentioned heat sink. [Effects of the Invention]

[0008] The present invention has the effect of being applicable to various installation configurations. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing an example of a heat sink according to the first embodiment. [Figure 2] FIG. 2 is a side view showing an example of the heat sink according to the first embodiment. [Figure 3] FIG. 3 is a perspective view showing another example of the heat sink according to the first embodiment. [Figure 4] FIG. 4 is a side view showing an example of a heat sink according to the second embodiment. [Figure 5] FIG. 5 is a side view showing another example of the heat sink according to the second embodiment. [Figure 6] FIG. 6 is a side view showing another example of the heat sink according to the second embodiment. [Figure 7] FIG. 7 is a side view showing an example of a heat sink according to the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of an electronic device including a heat sink 10 according to the present invention will be described in detail with reference to the accompanying drawings. Note that the present invention is not limited to the following embodiment.

[0011] [First embodiment] <Electronic equipment> FIG. 1 is a perspective view showing an example of a heat sink according to the first embodiment. FIG. 2 is a side view showing an example of a heat sink according to the first embodiment. FIG. 3 is a perspective view showing another example of a heat sink according to the first embodiment. The electronic device 1 is, for example, an AV-integrated car navigation system or car audio. The electronic device 1 includes a substrate 2 and a heat sink (heat radiator) 40.

[0012] The substrate 2 is a plate-shaped printed circuit board. More specifically, the substrate 2 is configured by electrically connecting electronic components such as an integrated circuit (IC) 20, which is a heat source, resistors, capacitors, and transistors, arranged on a plate material made of an insulating material. The substrate 2 outputs control signals to each part of the electronic device 1. The substrate 2 is formed with engagement holes (not shown) for positioning the support bracket 30 and through holes (not shown) for inserting terminals of the integrated circuit 20.

[0013] The integrated circuit 20 is configured such that a substrate on which heat-generating electronic components are mounted is housed in a thin, rectangular box-shaped case (not shown). The heat generated by the mounted electronic components causes the case of the integrated circuit 20 to become hot. A plurality of terminals 22 protrude downward from the downward-facing surface of the case. The terminals 22 output electrical signals generated on the substrate within the integrated circuit 20. The terminals 22 are inserted into through-holes in the substrate 2 and soldered.

[0014] The support bracket 30 is a case that covers the integrated circuit 20 and supports it on a housing (not shown) of the electronic device 1. The support bracket 30 is formed by bending a plate material. The support bracket 30 is made of a material that has lower thermal conductivity than the case of the integrated circuit 20 and the heat sink 40. Therefore, in the assembled state, heat generated in the integrated circuit 20 is not easily conducted to the support bracket 30. The support bracket 30 has a main body 31 and side walls 32, 33, and 34 that stand upright from the end of the main body 31.

[0015] The main body 31 is formed in a rectangular shape having an area larger than the main surface of the case of the integrated circuit 20. The main body 31 is in close contact with one of the main surfaces of the case of the integrated circuit 20 in the assembled state.

[0016] The side wall 32 is formed in a rectangular shape having an area larger than the top surface of the case of the integrated circuit 20. The side wall 32 is disposed at a distance from the top surface of the case of the integrated circuit 20 in an assembled state.

[0017] The side wall 33 is formed in a rectangular shape having an area larger than the left side surface of the case of the integrated circuit 20. The side wall 33 is disposed apart from the left side surface of the case of the integrated circuit 20 in the assembled state.

[0018] The side wall 34 is disposed on a plane parallel to the side wall 33. The side wall 34 is formed in a rectangular shape having an area larger than the right side surface of the case of the integrated circuit 20. The side wall 34 is disposed at a distance from the right side surface of the case of the integrated circuit 20 in the assembled state.

[0019] <Heat sink> The heat sink 40 is a radiator that dissipates heat from the integrated circuit 20. The heat sink 40 is made of a material that has higher thermal conductivity than the case of the integrated circuit 20, the support bracket 30, and the housing. Therefore, when the heat sink 40 is at a lower temperature than the case of the integrated circuit 20 in the assembled state, the heat generated in the integrated circuit 20 is conducted to the heat sink 40. The heat sink 40 includes a heat dissipation bracket 41 and pins 46.

[0020] The heat dissipation bracket 41 is formed by bending a single rectangular plate material. The heat dissipation bracket 41 is made of, for example, aluminum. The heat dissipation bracket 41 has multiple wall portions, at least one of which is in surface contact with the integrated circuit 20 of the electronic device 1. In this embodiment, the heat dissipation bracket 41 has multiple wall portions, each of which is a rectangular first wall portion 42, a second wall portion 43, and a third wall portion 44. The shape of the heat dissipation bracket 41 shown in FIG. 3 is the same as the shape of the heat dissipation bracket 41 shown in FIGS. 1 and 2. The heat dissipation bracket 41 shown in FIG. 3 is rotated forward by 90° when viewed in the left-right direction from the heat dissipation bracket 41 shown in FIGS. 1 and 2. The heat dissipation bracket 41 will be described assuming the position shown in FIGS. 1 and 2.

[0021] The first wall portion 42 is disposed in a plane parallel to the left-right direction and the up-down direction. The first wall portion 42 is disposed in a plane having a normal parallel to the front-rear direction. A lower end portion of the first wall portion 42, which is an end portion corresponding to one of the four sides, is connected to a front end portion of the second wall portion 43, which is an end portion corresponding to one of the four sides. The first wall portion 42 is erected in a direction perpendicular to the second wall portion 43. The first wall portion 42 is erected upward from the front end portion of the second wall portion 43.

[0022] The second wall 43 is disposed in a plane parallel to the left-right direction and the front-rear direction. The second wall 43 is disposed in a plane having a normal parallel to the up-down direction. A rear end of the second wall 43, which is the end opposite to the end connected to the first wall 42, is connected to an upper end of the third wall 44, which is the end corresponding to one of the four sides of the third wall 44.

[0023] The third wall portion 44 is disposed in a plane parallel to the left-right direction and the up-down direction. The third wall portion 44 is disposed in a plane having a normal parallel to the front-rear direction. The third wall portion 44 stands in a vertical direction opposite to the direction in which the first wall portion 42 stands with respect to the second wall portion 43. The third wall portion 44 stands downward from the rear end portion of the second wall portion 43.

[0024] At least one of the first wall portion 42, the second wall portion 43, and the third wall portion 44, which is in surface contact with the integrated circuit 20 of the electronic device 1, is formed in a rectangular shape having an area larger than the main surface of the main body portion 31 of the support bracket 30 and the case of the integrated circuit 20.

[0025] At least one of the plurality of wall portions is arranged to face in a different direction from the other wall portions. In this embodiment, the second wall portion 43 is arranged to face in a different direction from the first wall portion 42 and the third wall portion 44.

[0026] At least one of the wall portions that is not in contact with the heat source of the electronic device has a plurality of pin holes 45 arranged therein, into which pins 46 can be attached. In this embodiment, at least one of the first wall portion 42, the second wall portion 43, and the third wall portion 44 has a plurality of pin holes 45 arranged therein.

[0027] The pin holes 45 are holes for attaching pins 46. The pin holes 45 are arranged, for example, in a grid pattern on the wall portion. The pin holes 45 are through-holes that penetrate the wall portion in the thickness direction. An appropriate number of pins 46 are arranged in the pin holes 45 in an appropriate arrangement depending on the required cooling performance of the heat sink 40 or the installation form of the heat sink 40.

[0028] The pin 46 can be attached to at least one of the multiple wall portions of the heat dissipation bracket 41. The pin 46 is made of a material that has higher thermal conductivity than the heat dissipation bracket 41. The pin 46 is made of, for example, brass.

[0029] A plurality of pins 46 are arranged. The number of pins 46 that can be attached depends on the cooling performance of the heat sink 40.

[0030] The pins 46 are, for example, cylindrical. The pins 46 can be attached in a combination of different lengths, thicknesses, materials, etc. depending on the cooling performance of the heat sink 40. In this embodiment, the pins 46 include a long pin 47 and a short pin 48 that is shorter in axial length than the long pin 47.

[0031] The pin 46 is fixed, for example, by crimping with the tip inserted into the pin hole 45. The method for fixing the pin 46 is not limited to this.

[0032] When attached to the pin hole 45, the pin 46 stands upright from one surface or the other surface of the wall portion in which the pin hole 45 is arranged. For example, in FIG. 1 , the pin 46 inserted into the pin hole 45 of the first wall portion 42 stands upright toward the rear from the surface of the first wall portion 42 facing rearward. The pin 46 inserted into the pin hole 45 of the first wall portion 42 may also stand upright toward the front from the surface of the first wall portion 42 facing forward.

[0033] The fastening members 101 and 102 fasten the case of the integrated circuit 20 between the wall portion of the heat sink 40 that comes into surface contact with the integrated circuit 20 of the electronic device 1 and the main body 31 of the support bracket 30. The fastening members 101 and 102 assemble the integrated circuit 20 to the support bracket 30 and the heat sink 40 with one main surface of the case of the integrated circuit 20 in close contact with the support bracket 30 and the other main surface of the case of the integrated circuit 20 in close contact with the heat sink 40.

[0034] <Assembly method and function> Next, a method for assembling the heat sink 40 of the electronic device 1 configured as above and its function will be described.

[0035] The worker determines which of the first wall portion 42, second wall portion 43, and third wall portion 44 of the heat dissipation bracket 41 the case of the integrated circuit 20 will contact, depending on the installation configuration, such as the relative positions of the heat sink 40, the integrated circuit 20, and surrounding components. The worker attaches multiple pins 46 to pin holes 45 located in at least one of the first wall portion 42, second wall portion 43, and third wall portion 44 of the heat dissipation bracket 41 of the heat sink 40 other than the wall portion that will contact the case of the integrated circuit 20. The number of pins 46 is determined depending on the required cooling performance. Depending on the installation configuration, such as the relative positions of the heat sink 40, the integrated circuit 20, and surrounding components, long pins 47 and short pins 48 may be attached in combination.

[0036] The worker sandwiches the case of the integrated circuit 20 between the support bracket 30 and the heat sink 40. More specifically, the worker brings one main surface of the case of the integrated circuit 20 into contact with the main body 31 of the support bracket 30. The worker brings the other main surface of the case of the integrated circuit 20 into contact with one of the first wall 42, second wall 43, and third wall 44 of the heat sink 40. In this state, the heat sink 40 and the integrated circuit 20 are fastened together using the fastening members 101 and 102.

[0037] In this way, the integrated circuit 20, the support bracket 30, and the heat sink 40 are assembled with the case of the integrated circuit 20 sandwiched between the support bracket 30 and the heat sink 40. In this state, the main surface of the body 31 of the support bracket 30 is in close contact with the main surface of the case of the integrated circuit 20. In addition, the main surface of the case of the integrated circuit 20 is in close contact with any one of the first wall 42, second wall 43, and third wall 44 of the heat sink 40.

[0038] The worker assembles the assembled integrated circuit 20, support bracket 30, and heat sink 40 onto the substrate 2. More specifically, the worker inserts the terminals 22 of the integrated circuit 20 into the through holes in the substrate 2 and fixes them by soldering. The worker then engages the lower ends of the side walls 33 and 34 of the support bracket 30 with the engaging holes in the substrate 2 and fixes them by soldering. In this way, the assembled integrated circuit 20, support bracket 30, and heat sink 40 are assembled onto the substrate 2.

[0039] The worker then assembles the integrated circuit 20, the support bracket 30, and the heat sink 40, which are assembled on the substrate 2, into the housing of the electronic device 1.

[0040] A specific example of assembling the heat sink 40 will be described with reference to FIGS.

[0041] A specific example of assembling the heat sink 40 shown in Figures 1 and 2 will be described. In the example shown in Figures 1 and 2, the case of the integrated circuit 20 is brought into contact with the third wall portion 44. In the assembled state, the third wall portion 44 is in close contact with the other main surface of the case of the integrated circuit 20. In the assembled state, the third wall portion 44 is disposed on a plane parallel to the main body portion 31 of the support bracket 30. In the assembled state, the case of the integrated circuit 20 is disposed between the third wall portion 44 and the main body portion 31 of the support bracket 30.

[0042] 1 and 2, a plurality of pin holes 45 are arranged in at least the first wall portion 42. A long pin 47 and a short pin 48 are attached to the first wall portion 42. A pin 46 is erected rearward from the rearward-facing surface of the first wall portion 42.

[0043] A specific example of assembling the heat sink 40 shown in FIG. 3 will be described. In FIG. 3, the first wall 42 and the third wall 44 are arranged in a plane having a normal parallel to the up-down direction, and the second wall 43 is arranged in a plane having a normal parallel to the front-rear direction. In the example shown in FIG. 3, the case of the integrated circuit 20 is brought into contact with the second wall 43. In the assembled state, the second wall 43 is in close contact with the other main surface of the case of the integrated circuit 20. In the assembled state, the second wall 43 is arranged in a plane parallel to the main body 31 of the support bracket 30. In the assembled state, the case of the integrated circuit 20 is arranged between the second wall 43 and the main body 31 of the support bracket 30.

[0044] 3, a plurality of pin holes 45 are arranged in at least the first wall portion 42 and the third wall portion 44. Long pins 47 and short pins 48 are attached to the first wall portion 42 and the third wall portion 44. Pins 46 are erected upward from the upward-facing surfaces of the first wall portion 42 and the third wall portion 44.

[0045] Next, the operation of the heat sink 40 assembled in this manner will be described. In the assembled state, the main body 31 of the support bracket 30 is in close contact with the main surface of the case of the integrated circuit 20. The support bracket 30 is made of a material with lower thermal conductivity than the case of the integrated circuit 20. Therefore, even if the support bracket 30 is at a lower temperature than the case of the integrated circuit 20, the heat generated in the integrated circuit 20 is not easily conducted to the support bracket 30.

[0046] In the assembled state, any one of the first wall portion 42, the second wall portion 43, and the third wall portion 44 of the heat sink 40 is in close contact with the main surface of the case of the integrated circuit 20. The heat sink 40 is made of a material that has higher thermal conductivity than the case of the integrated circuit 20. Therefore, when the heat sink 40 is at a lower temperature than the case of the integrated circuit 20, the heat generated in the integrated circuit 20 is conducted to the heat sink 40.

[0047] In this way, the heat generated in the integrated circuit 20 is dissipated by the heat sink 40, and the integrated circuit 20 is cooled.

[0048] <Effects> As described above, in this embodiment, at least one of the multiple wall portions of the heat dissipation bracket 41 is arranged facing a different direction from the other wall portions. In this embodiment, at least one of the multiple wall portions has multiple pin holes 45 arranged therein. In this embodiment, by changing the wall portion of the heat dissipation bracket 41 that comes into contact with the heat source of the electronic device 1, the heat dissipation bracket 41 can be appropriately attached according to various installation forms. In this way, this embodiment can be applied to various installation forms.

[0049] In this embodiment, the heat dissipation bracket 41 of the same shape can be used to attach the integrated circuit 20 as shown in Figures 1 and 2, or as shown in Figure 3. According to this embodiment, the heat dissipation bracket 41 can be appropriately attached according to various installation forms.

[0050] In the embodiment, the pins 46 can be attached in combination with different lengths, thicknesses, materials, etc. depending on the cooling performance of the heat sink 40. According to the embodiment, the pins 46 can be applied to various electronic devices 1.

[0051] In this embodiment, the number of pins 46 can be determined depending on the cooling performance of the heat sink 40. This embodiment can be applied to various electronic devices 1.

[0052] In this embodiment, the pins 46 are installed upright from one surface or the other surface of the wall portion while being attached to the pin holes 45. According to this embodiment, the heat dissipation bracket 41 can be appropriately attached according to various installation forms.

[0053] [Second embodiment] A heat sink 40A according to this embodiment will be described with reference to Figs. 4 to 6. Fig. 4 is a side view showing an example of a heat sink according to a second embodiment. Fig. 5 is a side view showing another example of a heat sink according to the second embodiment. Fig. 6 is a side view showing another example of a heat sink according to the second embodiment. To simplify the description, the support bracket 30 is not shown in Figs. 4 to 6.

[0054] The heat sink 40A of this embodiment differs from the first embodiment in the shape of the heat dissipation bracket 41A. The other configuration is the same as that of the heat sink 40 of the first embodiment. In the following description, detailed description of the same components as those of the heat sink 40 will be omitted.

[0055] The heat dissipation bracket 41A includes a rectangular first wall portion 42A, a second wall portion 43A, and a third wall portion 44A. The first wall portion 42A, the second wall portion 43A, and the third wall portion 44A are arranged in a cup shape that is open at the top when viewed in the front-to-rear direction.

[0056] The first wall portion 42A is disposed in a plane parallel to the front-rear direction and the up-down direction. The first wall portion 42A is disposed in a plane having a normal parallel to the left-right direction. A lower end portion of the first wall portion 42A, which is an end portion corresponding to one of the four sides, is connected to a left end portion of the second wall portion 43A, which is an end portion corresponding to one of the four sides. The first wall portion 42A stands upright in a direction perpendicular to the second wall portion 43A. The first wall portion 42A stands upright from the left end portion of the second wall portion 43A.

[0057] The second wall portion 43A is disposed in a plane parallel to the left-right direction and the front-rear direction. The second wall portion 43A is disposed in a plane having a normal parallel to the up-down direction. The right end of the second wall portion 43A, which is the end opposite to the end connected to the first wall portion 42A, is connected to a lower end of the third wall portion 44A, which is the end corresponding to one of the four sides of the third wall portion 44A.

[0058] The third wall portion 44A is disposed in a plane parallel to the front-rear direction and the up-down direction. The third wall portion 44A is disposed in a plane having a normal parallel to the left-right direction. The third wall portion 44A is disposed opposite the first wall portion 42A. The third wall portion 44A stands upright in the vertical direction on the same side as the first wall portion 42A with respect to the second wall portion 43A. The third wall portion 44A stands upright from the right end of the second wall portion 43A.

[0059] At least one of the first wall portion 42A, the second wall portion 43A, and the third wall portion 44A has a plurality of pin holes 45 (not shown). In the example shown in Figures 4 to 6, the first wall portion 42A and the third wall portion 44A have a plurality of pin holes 45 (not shown).

[0060] A specific example of the assembly of the heat sink 40A will be described with reference to FIG. 4. In the example shown in FIG. 4, a device 110 attached to a side plate 100 of the housing of the electronic device 1 is disposed above the integrated circuit 20. The device 110 is positioned below the side plate 100. Therefore, the heat sink 40A shown in FIG. 4 is disposed in a position that avoids the device 110 attached to the side plate 100 of the housing of the electronic device 1. The device 110 is disposed in a space surrounded by a first wall portion 42A, a second wall portion 43A, and a third wall portion 44A of the heat sink 40A. The downward-facing surface of the second wall portion 43A is in contact with the main surface of the case of the integrated circuit 20. A pin 46 is attached to the first wall portion 42A and the third wall portion 44A with the pin 46 facing outward. The pin 46 attached to a pin hole 45 (not shown) of the first wall portion 42A extends leftward. The pin 46 attached to the pin hole 45 (not shown) of the third wall portion 44A extends to the right. In this way, the heat sink 40A can be placed in a position that avoids the device 110 attached to the side panel 100 of the housing of the electronic device 1.

[0061] Another example of the assembly of the heat sink 40A will be described with reference to FIG. 5. In the example shown in FIG. 5, the fan 120 is disposed above the integrated circuit 20, toward the depth of the page. The heat sink 40A shown in FIG. 5 is disposed so that the pins 46 are positioned in the space surrounded by the first wall 42A, second wall 43A, and third wall 44A of the heat sink 40A, which is the air passage for the fan 120. The pins 46 are attached to the first wall 42A and the third wall 44A, facing inward. The pins 46 attached to the first wall 42A extend to the right. The pins 46 attached to the third wall 44A extend to the left. In this way, the pins 46 can be positioned in the air passage for the fan 120.

[0062] Another example of assembling the heat sink 40A will be described using Figure 6. The heat dissipation bracket 41A of the heat sink 40A shown in Figure 6 is rotated 90 degrees to the right when viewed from the front to back relative to the heat dissipation bracket 41A shown in Figure 5. The downward surface of the third wall portion 44A is in contact with the main surface of the case of the integrated circuit 20. The left surface of the second wall portion 43A is fixed to the side panel 100 of the housing of the electronic device 1 via a heat dissipation sheet 130. Pins 46 are attached to the first wall portion 42A and the third wall portion 44A, facing inward. The pins 46 attached to the first wall portion 42A extend downward. The pins 46 attached to the third wall portion 44A extend upward.

[0063] <Effects> As described above, according to this embodiment, the heat dissipation bracket 41A of the same shape can be used to attach the integrated circuit 20 as shown in Figures 4, 5, and 6. According to this embodiment, the heat dissipation bracket 41A can be appropriately attached according to various installation forms.

[0064] [Third embodiment] A heat sink 40B according to this embodiment will be described with reference to Fig. 7. Fig. 7 is a side view showing an example of a heat sink according to a third embodiment.

[0065] The heat sink 40B of this embodiment differs from the first embodiment in that pin holes 45B formed in a heat dissipation bracket 41B, but the other configurations are the same as those of the heat sink 40 of the first embodiment.

[0066] The pin holes 45 are arranged in a plurality of wall portions. In the example shown in Fig. 7, a plurality of pin holes 45 are arranged in the first wall portion 42, and a plurality of pin holes 45B are arranged in the third wall portion 44B.

[0067] The pin hole 45 is a hole for attaching the pin 46 perpendicularly to the first wall portion 42. The axial direction of the pin hole 45 is perpendicular to the first wall portion 42.

[0068] The pin hole 45B is a hole for attaching the pin 46 at an angle to the third wall portion 44B. The axial direction of the pin hole 45B is inclined obliquely with respect to the third wall portion 44B. The axial direction of the pin hole 45B inclines upward as it becomes farther away from the third wall portion 44B.

[0069] The inclination of the pin hole 45 in the axial direction relative to the wall portion in which the pin hole 45 is arranged differs from the inclination of the pin holes 45B arranged in other wall portions relative to the other wall portions in the axial direction. In the example shown in Fig. 7, the inclination of the pin hole 45 arranged in the first wall portion 42 in the axial direction relative to the first wall portion 42 differs from the inclination of the pin hole 45B arranged in the third wall portion 44B in the axial direction relative to the third wall portion 44B.

[0070] <Effects> As described above, according to this embodiment, the axial inclination of pin hole 45 relative to the wall portion in which pin hole 45 is arranged differs from the axial inclination of pin hole 45B arranged in another wall portion relative to the other wall portion. According to this embodiment, heat dissipation bracket 41B can be appropriately attached in accordance with various installation forms.

[0071] The heat sink 10 and the electronic device 1 according to the present invention have been described above, but they may be embodied in various different forms other than the above-described embodiment. The configuration of the heat sink 40 described above is an example and is not intended to be limiting.

[0072] The configuration of the heat dissipation bracket 41 described in the above embodiment is an example, and the bracket may have three or more walls. [Explanation of symbols]

[0073] 1 Electronic equipment 2 boards 20 Integrated Circuits 22 terminals 30 Support bracket 40B Heat sink (heat sink) 41B Heat Dissipation Bracket 42 First wall 43 Second wall section 44B Third wall 45 pin hole 45B pin hole 46 pins 47 Long Pin 48 short pin 101 Fastening members 102 Fastening members

Claims

1. Multiple pins and a heat dissipation bracket including a plurality of wall portions, at least one of the plurality of wall portions being in surface contact with a heat source of an electronic device; Equipped with a plurality of pin holes into which the pins can be attached are arranged in at least one wall portion out of the plurality of wall portions that is not in contact with a heat source of the electronic device; The pin holes are disposed in a plurality of wall portions, an inclination of the pin hole in the axial direction with respect to the wall portion in which the pin hole is arranged is different from an inclination of the pin hole in the axial direction with respect to the other wall portion in which the pin hole is arranged; radiator.

2. The pins can be attached in combination with different types of pins having different lengths, thicknesses, or materials depending on the cooling performance of the heat sink. The heat sink of claim 1 .

3. The number of the pins to be attached can be determined according to the cooling performance of the heat sink. The heat sink of claim 1 .

4. the pin hole is a through hole that penetrates the wall portion in a thickness direction, The pin is provided upright from one surface or the other surface of the wall portion in a state where the pin is attached to the pin hole. The heat sink of claim 1 .

5. A substrate; The heat sink according to claim 1 ; An electronic device comprising:

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