Carrier tape backing for chip-shaped electronic components and method for manufacturing the same

Abstract

To provide a carrier tape backing for chip-shaped electronic components and a method for manufacturing the same, which offers high peel strength when removing the cover tape and suppresses fuzzing from the backing surface and the loading area. [Solution] A carrier tape backing for chip-shaped electronic components, characterized in that it is a multilayer paper made with pulp as the main component, with 25% or more by mass of the total pulp used being dry pulp, and having two or more paper layers.

Description

[Technical Field]

[0001] This disclosure relates to a carrier tape backing for chip-shaped electronic components and a method for manufacturing the same. More specifically, it relates to a carrier tape backing for chip-shaped electronic components that has high peel strength when removing the cover tape, suppresses fuzzing from the backing surface and from the loading area, and is difficult to separate between layers. [Background technology]

[0002] Conventionally, in order to automate the production of various electronic devices, chip-shaped electronic components have been automatically mounted onto printed circuit boards. In the automated mounting process for chip-shaped electronic components, chip-shaped electronic components are supplied one by one to the printed circuit board using a chip component mounting machine and automatically mounted onto the printed circuit board. In this automated mounting process, in order to facilitate the handling of chip-shaped electronic components, taped packaging is used in which individual chip-shaped electronic components are wrapped in a tape-like conveyor.

[0003] The aforementioned taped packaging is formed by creating recessed or perforated loading sections (hereinafter sometimes simply referred to as "loading sections") for loading chip-shaped electronic components at regular intervals on a carrier tape backing for chip-shaped electronic components, loading the predetermined chip-shaped electronic components into the loading sections, and then sealing it with cover tape. The loading sections are generally provided in a rectangular shape and may also be referred to as press pockets, pockets, or cavities.

[0004] Taped packaging containing chip-shaped electronic components is transported on a reel, and an automated machine for mounting chip-shaped electronic components continuously peels off the cover tape, sequentially removing the chip-shaped electronic components from the carrier tape backing and automatically mounting them in their designated positions on a printed circuit board.

[0005] Carrier tape backings for chip-shaped electronic components are broadly classified into plastic and paper types. Paper backings are considered preferable in terms of manufacturing cost, non-static properties, and ease of disposal after use. Paper carrier tape backings for chip-shaped electronic components are known to be made of single-layer or multi-layer cardboard (see, for example, Patent Documents 1 to 3). [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2007-326596 [Patent Document 2] Japanese Patent Publication No. 2008-207878 [Patent Document 3] Japanese Patent Publication No. 2011-213419 [Patent Document 4] Japanese Patent Application Publication No. 8-171227 [Patent Document 5] Japanese Patent Application Publication No. 9-111695 [Patent Document 6] Japanese Patent Application Publication No. 10-221876 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] In the paper carrier tape backings for chip-shaped electronic components disclosed in Patent Documents 1 to 3, there is a requirement for high peel strength of the cover tape and suppression of fuzzing on the backing surface. However, this problem cannot be solved simply by increasing the penetration depth of the chemical applied to the surface, nor can it be addressed by changing the bonding temperature, pressure, or speed. Furthermore, balancing quality, such as generating fuzz when increasing peel strength, is difficult and poses a major operational problem. In addition, the miniaturization of chips has led to problems with chip ejection failures caused by internal fuzzing during processing of the loading section.

[0008] Furthermore, although the prior art documents disclosed in Patent Documents 4 to 6 describe the use of dry pulp, they do not refer to carrier tape backings for chip-shaped electronic components, and the problems they address are also different.

[0009] In view of these problems, this disclosure aims to provide a carrier tape backing for chip-shaped electronic components and a method for manufacturing the same, which has high peel strength when removing the cover tape and suppresses fuzzing from the backing surface and the loading area. Furthermore, this disclosure also aims to provide a carrier tape backing for chip-shaped electronic components and a method for manufacturing the same, which is difficult to separate between layers.

[0010] Other purposes and effects of this disclosure will be readily apparent to those skilled in the art by referring to the following description. [Means for solving the problem]

[0011] To solve the above problems, the carrier tape backing for chip-shaped electronic components according to the present invention is a multilayer paper made of pulp as the main component, with 25% by mass or more of the total pulp used being dry pulp, and having two or more paper layers.

[0012] The inventors have discovered that by making 25% or more of the pulp contained in the carrier tape backing for chip-shaped electronic components dry pulp, the backing acquires properties suitable for use as a carrier tape backing for chip-shaped electronic components, and have completed the present invention. Specifically, such a carrier tape backing for chip-shaped electronic components has increased peel strength when the cover tape is peeled off, and fuzzing from the backing surface and the loading area is suppressed.

[0013] In a preferred embodiment of the present invention, a water-soluble polymer is applied to at least one surface.

[0014] With this configuration, the peel strength when removing the cover tape is high, fuzzing from the surface and from the loading area is suppressed, making it preferable as a carrier tape backing for chip-shaped electronic components.

[0015] In a preferred embodiment of the present invention, it is preferable that 25% by mass or more of the total used pulp is dry pulp of LBKP. According to such a configuration, keva from the surface of the base paper and the loading portion is further suppressed, and the peel strength becomes even better.

[0016] The present invention can also be regarded as a method for manufacturing a carrier tape base paper for chip-shaped electronic components. The method for manufacturing a carrier tape base paper for chip-shaped electronic components according to the present invention includes a step of preparing a papermaking raw material mainly composed of pulp, a step of papermaking a multi-layered paper having two or more paper layers using the papermaking raw material, and a step of drying the multi-layered paper, and 25% by mass or more of the total used pulp contained in the papermaking raw material is dry pulp. According to such a configuration, the air permeability is improved by the dry pulp, thereby suppressing the generation of blisters during manufacturing. In addition, the manufactured carrier tape base paper for chip-shaped electronic components has high peel strength and is less likely to have keva standing.

[0017] In another preferred embodiment of the present invention, the method for manufacturing a carrier tape base paper for chip-shaped electronic components in the present invention includes a step of preparing a papermaking raw material mainly composed of pulp, a step of papermaking a multi-layered paper having two or more paper layers using the papermaking raw material, a step of drying the multi-layered paper, a step of preparing an aqueous solution of a water-soluble polymer, and a step of applying and drying the aqueous solution of the water-soluble polymer on at least one surface of the dried multi-layered paper, and 25% by mass or more of the total used pulp contained in the papermaking raw material is dry pulp.

[0018] In a preferred embodiment of the present invention, the method for manufacturing a carrier tape base paper for chip-shaped electronic components in the present invention is characterized in that 25% by mass or more of the total used pulp is dry pulp of LBKP.

Advantages of the Invention

[0019] According to this disclosure, it is possible to provide a carrier tape backing for chip-shaped electronic components and a method for manufacturing the same, which has high peel strength when removing the cover tape and suppresses fuzzing from the backing surface and the loading portion. [Brief explanation of the drawing]

[0020] [Figure 1] This diagram shows the configuration of the carrier tape backing for chip-shaped electronic components according to the examples and comparative examples. [Figure 2] This figure and table show the evaluation results of carrier tape backings for chip-shaped electronic components according to the examples and comparative examples. [Modes for carrying out the invention]

[0021] Next, the present invention will be described in detail with reference to embodiments, but the present invention is not to be construed as being limited to these descriptions. Various modifications of the embodiments are possible as long as the effects of the present invention are achieved.

[0022] The carrier tape backing for chip-shaped electronic components according to the present invention has a base paper mainly composed of pulp. Here, "main component" refers to the component that is present in the largest quantity by mass among the components constituting the base paper. In the present invention, 25% by mass or more of the pulp constituting the base paper is dry pulp. It is preferable that the dry pulp is 50% by mass or more, more preferable that it is 70% by mass or more, and best if it is 100% by mass.

[0023] In the present invention, the raw pulp used for the base paper is not particularly limited, but wood pulp can be suitably used. Examples of wood pulp include chemical pulps such as bleached softwood kraft pulp (NBKP), unbleached softwood kraft pulp (NUKP), bleached hardwood kraft pulp (LBKP), and unbleached hardwood kraft pulp (LUKP), mechanical pulps such as crushed wood pulp (GP) and thermomechanical pulp (TMP), and recycled paper pulp such as deinked pulp. One or more types of dry pulp made from these raw pulps can be used. Among these raw pulps, LBKP has a fiber length that does not easily generate fuzz, and the fibers intertwine appropriately, so a base paper containing a large amount of LBKP has suppressed fuzz generation and sufficient strength can be obtained. Therefore, it is preferable that the pulp contains 65 to 100% by mass of LBKP, more preferably 70 to 100% by mass, even more preferably 80 to 100% by mass, and most preferably 100% by mass. By setting the proportion of LBKP in the pulp to 65% by mass or more, the generation of fuzzy fibers can be further suppressed.

[0024] NBKP has longer fibers than LBKP, making it an effective pulp for maintaining the strength of the backing paper itself. However, it is more easily pulled out of the backing paper, making it less suitable than LBKP in terms of preventing fuzzing. Therefore, in this invention, it is preferable that the proportion of NBKP in the pulp be below a certain amount, for example, 35% by mass or less. Cotton has longer fibers than NBKP and is therefore more easily pulled out. Also, mechanical pulps such as GP and TMP have short, rigid fibers, so the fibers do not intertwine. If they are included in large quantities in the backing paper, the density and strength may decrease. Therefore, it is preferable that the pulp does not contain pulps with longer fibers than NBKP or short, rigid pulps such as mechanical pulps, that is, that the pulp contains only LBKP and NBKP. This minimizes fuzzing and strength reduction. Furthermore, in the carrier tape backing paper for chip-shaped electronic components according to this embodiment, it is preferable that the pulp contains only LBKP. By containing only LBKP as the pulp, fuzzing can be further suppressed and sufficient strength can be maintained.

[0025] Dry pulp, having been dried once, has high internal fiber bonding and reduced swelling due to keratinization. Therefore, paper made with dry pulp is less likely to become dense due to fewer contact points between fibers, resulting in better adhesion of the cover tape's adhesive to the voids. In addition, its sparseness provides high breathability, making it easier to dry wet paper with a dryer and facilitating operation. Conversely, if dry pulp is not included in the papermaking raw materials, breathability will be low, making it difficult for moisture to escape from the surface, causing the layers to swell and potentially resulting in blistering. Even if blistering does not occur, the presence of signs of blistering indicates a decrease in interlayer strength.

[0026] Recycled paper pulp made from unprinted waste paper and self-recirculating waste paper does not require deinking, kneading, or bleaching; it can be used as pulp after only dust removal and disintegration, thus reducing the load on the pulp and providing the benefits of dry pulp. However, caution is necessary because if processes that loosen the internal bonds of the fibers are carried out in the waste paper processing, such as using alkali during disintegration, performing kneading by finely grinding the dust, using surfactants such as deinking agents in the deinking process, or using alkali in the bleaching process, the effectiveness as dry pulp will be reduced.

[0027] The raw pulp is preferably prepared as a pulp slurry with an appropriate degree of beating using a disintegrator and a beater. The pulp slurry adjusted to an appropriate degree of beating is used as the raw material slurry and is used to form a carrier tape base for chip-shaped electronic components by papermaking using a paper machine. A known paper machine can be used, and papermaking can be performed using a long-wire paper machine, a cylinder-wire paper machine, a hybrid former, a gap former, etc. In the present invention, the degree of beating of the pulp slurry is preferably set to a CSF of 300 ml to 600 ml according to the Canadian standard filtration efficiency (JIS P 8121:1995 method for testing the filtration efficiency of pulp). More preferably, it is CSF of 350 to 500 ml, and even more preferably CSF of 390 to 440 ml. If it is less than 300 ml, water drainage on the wire will be poor, which may result in blistering. On the other hand, if it exceeds 600 ml, the entanglement of the fibers will decrease, which may lead to a decrease in strength such as the generation of fuzz.

[0028] In this invention, the base paper is made of two or more layers. When papermaking is done in a single layer with a certain thickness, irregularities tend to occur in the paper layers. Therefore, dividing the papermaking raw materials into several layers and combining them makes it easier to produce smooth paper even if the overall thickness is the same. If irregularities occur in the paper, the peel strength in the recessed areas will be low, which will cause variations in the peel strength when peeling off the cover tape, and there is a risk that the chips will fly out of the loading section or the machine will stop.

[0029] In this invention, the papermaking raw materials that constitute each layer of the base paper are basically the same, but different configurations may be used depending on the application. Since the interlayer strength is increased by making the pulp composition and freeness configuration of each layer similar, it is desirable to make the configurations similar even if the configurations of each layer are not identical.

[0030] In the present invention, it is preferable to add a paper strength enhancer to the base paper. By adding a paper strength enhancer, sufficient interlaminar strength can be ensured, and the occurrence of fuzz and creases can be suppressed. The paper strength enhancer is not particularly limited, but it is preferable to use starch, modified starch, or polyacrylamide resin. It is especially preferable to use cationic starch or amphoteric starch. Furthermore, it is preferable to use the paper strength enhancer by adding it internally to the raw material slurry. By adding the paper strength enhancer internally, it is possible to suppress not only surface fuzz but also paper dust from the walls of the mounting section of chip-shaped electronic components and the cut surface. The amount of paper strength enhancer to add is preferably 0.8 to 1.8 parts by mass per 100 parts by mass of pulp, and more preferably 1.0 to 1.5 parts by mass. In addition, other papermaking additives such as internal sizing agents, fillers, yield improvers, dyes, and aluminum sulfate can also be used. However, from the viewpoint of suppressing fluff and paper dust, it is preferable to limit the amount of filler to 1 part by mass or less per 100 parts by mass of pulp, and more preferably 0.5 parts by mass or less.

[0031] The method for drying the base paper is not particularly limited, and known drying methods such as hot air drying, infrared drying, and drum drying can be used as appropriate. On the paper machine, cylinder dryers can be used individually or in combination, and the drying temperature is preferably set in the range of 80 to 200°C, and more preferably in the range of 80 to 160°C.

[0032] Furthermore, it is preferable that the carrier tape backing for chip-shaped electronic components of the present invention be made of neutral paper so as not to cause adverse effects such as metal corrosion to the chip-shaped electronic components loaded into the loading section.

[0033] The surface of the carrier tape backing for chip-shaped electronic components that comes into contact with the cover tape is either the front or back surface of the backing. In the following, the surface that comes into contact with the cover tape will be conveniently referred to as the "front surface of the backing," and the other surface as the "back surface of the backing." In this invention, it is preferable to coat the surface of the backing with a water-soluble polymer such as polyvinyl alcohol or starch. However, among water-soluble polymers, polyacrylamide resins have the problem of high permeability and not remaining on the surface of the backing even when applied. For this reason, if polyacrylamide resin is used alone as the water-soluble polymer, the adhesive of the cover tape penetrates too much, resulting in high adhesion to the cover tape, but insufficient surface strength may not be obtained, and as a result, fuzz may form on the surface. Therefore, when using polyacrylamide resin, it is desirable to mix it with other water-soluble polymers rather than using it alone. For example, when used in combination with polyvinyl alcohols, it is preferable to use a ratio of polyvinyl alcohols to polyacrylamide resin in the range of 80:20 to 20:80, and more preferably in the range of 65:35 to 35:65. By using a ratio within this range, it is easier to adjust the balance between the effects of polyvinyl alcohols, which tend to localize on the surface, and polyacrylamide resins, which tend to penetrate into the interior.

[0034] Furthermore, in this invention, a water-soluble polymer such as polyvinyl alcohol or starch may also be applied to the back surface of the cardboard backing. Applying a water-soluble polymer to both sides of the cardboard backing suppresses the generation of fuzz from the back layer in the loading area during die-cutting. In addition, in the case of embossing, the bottom surface can be formed more effectively.

[0035] The method of applying the water-soluble polymer is not particularly limited, and a two-roll size press, a gate roll size press, or a metering size press can be used. Among these, a two-roll size press is preferable from the viewpoint of manufacturing efficiency, processability, improved surface strength, and improved paper layer strength. The amount of water-soluble polymer applied is 0.5 to 5 g / m² in terms of solid content per side of the base paper. 2 Preferably, it is 1.0 to 3.5 g / m2 If it is within the range, it is more preferable. The coating amount of the water-soluble polymer on the surface of the base paper is 0.25 to 3.0 g / m in terms of solid content 2 It is preferably in the range of, and more preferably in the range of 0.7 to 2.5 g / m 2 If it is within the range, it is more preferable, and particularly preferably in the range of 1.0 to 1.75 g / m 2 within the range.

[0036] As an example, when using modified starch alone as the water-soluble polymer, the coating amount of the water-soluble polymer on the surface of the base paper is 0.7 to 3.0 g / m in terms of solid content 2 It is preferably in the range of, and more preferably in the range of 1.0 to 2.3 g / m 2 If it is within the range, it is more preferable. Also, when using a polyvinyl alcohol-based resin alone as the water-soluble polymer, the coating amount of the water-soluble polymer on the surface of the base paper is 0.7 to 1.8 g / m in terms of solid content 2 It is preferably in the range of, and more preferably in the range of 0.9 to 1.4 g / m 2 If it is within the range, it is more preferable. Further, when using a mixture of two or more of starch, modified starch and polyvinyl alcohol-based resin as the water-soluble polymer, the coating amount of the water-soluble polymer on the surface of the base paper is 1.3 to 3.0 g / m in terms of solid content 2 It is preferably in the range of, and more preferably in the range of 1.7 to 2.4 g / m 2 If it is within the range, it is more preferable.

[0037] Also, in this embodiment, the dried base paper may be smoothed as necessary. The method of smoothing is not particularly limited, and a machine cinder, a soft calender, a super calender, etc. can be used. When heating the base paper during the smoothing process, it is also possible to adjust the moisture content of the base paper here.

[0038] The thickness of the carrier tape backing for chip-shaped electronic components varies depending on the size of the chip-shaped electronic components to be loaded. When a bottomed recess is formed by embossing, the thickness is preferably 50 to 550 μm, and more preferably 250 to 500 μm. On the other hand, when through holes are formed by punching, the thickness is preferably 280 to 1200 μm, and more preferably 500 to 1200 μm. The loading area in this thickness class is 0.6 × 0.3 mm or 0.4 × 0.2 mm square, and because it is very small and light, chip ejection failures are likely to occur, and fuzz suppression inside the loading area is required. The present invention is also effective in preventing fuzz inside the loading area, and is therefore particularly effective for backings with a 0.4 × 0.2 mm square loading area.

[0039] Taping packaging is manufactured through processes such as raw material manufacturing, slitting, loading section formation, chip loading, and chip encapsulation. The raw material manufacturing process is generally carried out by paper manufacturers, where paper that will become the carrier tape backing for chip-shaped electronic components is produced and wound into rolls of raw material with a width of 500 to 3000 mm. The slitting process is generally carried out by slitting companies, where the raw material is slit to a width suitable for the carrier tape backing for chip-shaped electronic components (for example, 8 mm wide). Here, generally, the raw material is not directly slit to a width suitable for the carrier tape backing for chip-shaped electronic components, but rather undergoes a process of first slitting to a predetermined width (for example, 70 to 170 mm wide) (called primary slitting) before being slit to a width suitable for the carrier tape backing for chip-shaped electronic components (called final slitting). Note that the primary slitting may be performed not just once, but two or more times. The loading section formation process is often carried out by a slitting company following the slitting process. This process involves forming loading sections at regular intervals on the carrier tape backing for chip-shaped electronic components after the final slitting. The chip loading and chip encapsulation processes are generally carried out by electronic chip manufacturers. These processes involve loading the specified chip-shaped electronic components into the loading sections and then encapsulating them with cover tape. Because the carrier tape backing for chip-shaped electronic components is handled while being held on a roll during each process, there is a risk of delamination if the interlayer strength is low. The interlayer strength can be expressed by an accelerated load test.

[0040] The carrier tape backing for chip-shaped electronic components according to this embodiment has loading sections formed at regular intervals for loading chip-shaped electronic components. After loading the chip-shaped electronic components into the loading sections, the backing is sealed with cover tape and used as a carrier tape for chip-shaped electronic components (also called a taped packaging). The loading sections may be either bottomed recesses formed by embossing or through holes formed by punching. If through holes are used, a bottom tape is attached to one side of the carrier tape backing for chip-shaped electronic components to close one of the holes and form the loading section.

[0041] In the case of a bottomed recess formed by embossing, the depth of the loading section is preferably such that the bottom surface is located at approximately 60-70% of the paper thickness. For example, if the thickness of the carrier tape backing for chip-shaped electronic components is 215-585 μm, the depth of the loading section is 150-350 μm. In the case of a through-hole formed by die-cutting, the depth is equal to the thickness of the carrier tape backing for chip-shaped electronic components. For example, if the thickness of the carrier tape backing for chip-shaped electronic components is 280-1200 μm, the depth is 280-1200 μm. [Examples]

[0042] Next, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples. In the examples, "parts" and "%" refer to "parts by mass" and "% by mass," respectively, unless otherwise specified. Note that the number of added parts is the value on a solid content basis. <Example 1> A pulp slurry consisting of 100 parts of dry pulp LBKP from 420 ml of Canadian Standard Freeness (CSF) was prepared by adding 0.3 parts of aluminum sulfate, 1 part of cationic starch (product name: Neotack #30T / manufactured by Nippon Shokuhin Kako Co., Ltd.), and 0.4 parts of rosin emulsion sizing agent (product name: CC-1404 / manufactured by Seikou PMC Co., Ltd.) to obtain a raw material slurry. Using the obtained raw material slurry, four layers of wet paper consisting of one surface layer, two middle layers, and one back layer were formed by combining them using a cylinder paper machine. After that, the paper was sieved in a press section and dried to obtain a base paper. After drying, a sizing solution prepared using carboxyl-modified polyvinyl alcohol (Gosenex T-350 / manufactured by Mitsubishi Chemical Corporation) as a water-soluble polymer at a mass percentage concentration of 6% of the polymer in an aqueous solution was applied to both sides of the base paper in a solid content equivalent to 2.4 g / m². 2 The material was applied in this manner, dried with a cylinder dryer, and then subjected to multi-stage calendering to obtain a carrier tape base for chip-shaped electronic components. The amount of water-soluble polymer applied to the surface in contact with the cover tape was 1.2 g / m² in terms of solid content. 2 The basis weight of each layer was 75 g / m² for the surface layer. 2, the middle layer 75g / m 2 Two layers for a total of 150g / m² 2 The back layer is 75g / m 2 The thickness of the base paper was 310 μm.

[0043] <Example 2> A carrier tape base for chip-shaped electronic components was obtained in the same manner as in Example 1, except that a mixture of 90 parts dry pulp LBKP and 10 parts dry pulp NBKP was mixed and beaten to create a pulp slurry with a Canadian Standard Freeness (CSF) of 420 ml.

[0044] <Example 3> A carrier tape base for chip-shaped electronic components was obtained in the same manner as in Example 1, except that a mixture of 70 parts dry pulp LBKP and 30 parts dry pulp NBKP was mixed and beaten to create a pulp slurry with a Canadian Standard Freeness (CSF) of 420 ml.

[0045] <Example 4> A carrier tape base for chip-shaped electronic components was obtained in the same manner as in Example 1, except that 50 parts of dry pulp LBKP with a Canadian Standard Freeness (CSF) of 420 ml were changed to a pulp slurry by adding 50 parts of self-recirculating waste paper, which is also dry pulp. The CSF of the self-recirculating waste paper was 420 ml.

[0046] <Example 5> A carrier tape base for chip-shaped electronic components was obtained in the same manner as in Example 1, except that a mixture of 50 parts dry pulp LBKP and 50 parts wet pulp LBKP was mixed and beaten to create a pulp slurry with a Canadian Standard Freeness (CSF) of 420 ml.

[0047] <Example 6> A carrier tape base for chip-shaped electronic components was obtained in the same manner as in Example 1, except that a mixture of 25 parts dry pulp LBKP and 75 parts wet pulp LBKP was mixed and beaten to create a pulp slurry with a Canadian Standard Freeness (CSF) of 420 ml.

[0048] <Example 7> A carrier tape base for chip-shaped electronic components was obtained in the same manner as in Example 1, except that 50 parts of deinked and bleached recycled paper pulp were added to 50 parts of dry pulp LBKP with 420 ml of Canadian Standard Freeness (CSF) to change it to a pulp slurry. The amount of deinked and bleached CSF was 420 ml.

[0049] <Example 8> A carrier tape base for chip-shaped electronic components was obtained in the same manner as in Example 5, except that the sizing liquid was changed from 6% carboxyl-modified polyvinyl alcohol to a mixture of 3% carboxyl-modified polyvinyl alcohol and 3% polyacrylamide resin (ST5000 (30% in form) / manufactured by Seikoh PMC Co., Ltd.).

[0050] <Example 9> A carrier tape base for chip-shaped electronic components was obtained in the same manner as in Example 6, except that the sizing liquid was changed from 6% carboxyl-modified polyvinyl alcohol to a mixture of 3% carboxyl-modified polyvinyl alcohol and 3% polyacrylamide resin (ST5000 (30% in form) / manufactured by Seikoh PMC Co., Ltd.).

[0051] <Comparative Example 1> A carrier tape base for chip-shaped electronic components was obtained in the same manner as in Example 1, except that 100 parts of wet pulp LBKP were beaten and the resulting pulp slurry was changed to one containing 420 ml of Canadian Standard Freeness (CSF).

[0052] <Comparative Example 2> A carrier tape base for chip-shaped electronic components was obtained in the same manner as in Example 1, except that 100 parts of deinked and bleached recycled paper pulp were replaced with a pulp slurry. The Canadian Standard Freeness (CSF) of the deinked and bleached recycled paper pulp was 420 ml.

[0053] <Cover Tape Peel Strength Measurement> Cover tape (No. 381H-14A: manufactured by Nitto Denko) was adhered to the chip-shaped electronic component carrier tape backing obtained in the examples and comparative examples using a taping device (PST-150Air, manufactured by PALMEC), and the peel strength was measured using a peel strength tester (PFT-50S, manufactured by PALMEC). Taping conditions: adhesion temperature 160℃, 4mm x 50 stamps / seal length 200mm. Peel strength measurement conditions: peel speed 300mm / 30 seconds, peel angle 170 degrees. The minimum value of the obtained peel strength was calculated. The evaluation criteria are as follows.

[0054] <Surface fuzz evaluation> The surface of the samples after measuring the peel strength of the cover tape was visually inspected. The evaluation criteria were as follows: ◎: No fuzz was observed at all; excellent condition. (Practical level) ○: Almost no fuzz was observed; good condition. (Practical level) △: Slight fuzziness is observed. (Lower limit for practical use) ×: Clearly visible fuzziness. (Unsuitable for practical use)

[0055] <Evaluation of loading mechanism fuzz> The internal surface, where the loading area was formed by embossing, was visually inspected. The evaluation criteria were as follows: ◎: No fuzz was observed at all; excellent condition. (Practical level) ○: Almost no fuzz was observed; good condition. (Practical level) △: Slight fuzziness is observed. (Lower limit for practical use) ×: Clearly visible fuzziness. (Unsuitable for practical use)

[0056] <Accelerated Load Test> Carrier tape backing for chip-shaped electronic components was slit into 8mm wide x 1800mm long tapes, and then subjected to a load of 1580g using a φ20mm diameter roll. The evaluation was based on the number of passes until the interlayer peel length reached 5mm. The evaluation criteria were as follows: ◎: No peeling even after being used more than 200 times. (Practical level) ○: Peeling occurs after 150-200 uses. (Practical level) △: Peeling occurs after 100-150 cycles. (Lower limit for practical use) ×: Peeling occurred after less than 100 uses. (Not practical level)

[0057] <Blister Pack Evaluation> The blister pack was evaluated by visually inspecting the interlayers from the side of the carrier tape backing for chip-shaped electronic components. ◎: No blistering was observed, and the item is in good, usable condition. ○: There are slight signs of blistering, but it is still usable. △: There are signs of blistering, but it is at the lower limit for practical use. ×: The blister packaging is so bad it's unusable.

[0058] Figure 1 shows the configuration of the carrier tape backing for chip-shaped electronic components for each example and comparative example, and Figure 2 shows the evaluation results. In Figure 1, "PVA" means polyvinyl alcohol and "PAM" means polyacrylamide. As shown in Figure 2, the carrier tape backings for chip-shaped electronic components obtained in Examples 1 to 9 all showed good evaluations of the peel strength of the cover tape, surface fuzziness, and fuzziness of the loading area. The peel strength in the accelerated load test was also good, and the blister evaluation was also good. In contrast, the carrier tape backings for chip-shaped electronic components obtained in Comparative Examples 1 and 2 had a surface that was too dense, so the heat sealant of the top tape did not penetrate the backing surface, resulting in low peel strength. In addition, the sizing liquid did not penetrate easily, and the fuzziness of the loading area worsened. Furthermore, during the drying process in production, moisture did not evaporate easily from the surface, causing blistering. [Industrial applicability]

[0059] As described above, the present invention provides a carrier tape backing for chip-shaped electronic components that has high peel strength and suppressed fuzzing.

Claims

1. A carrier tape backing for chip-shaped electronic components, characterized by being primarily composed of pulp, with at least 25% by mass of the total pulp used being dry pulp, and having two or more paper layers.

2. The carrier tape backing for chip-shaped electronic components according to claim 1, characterized in that a water-soluble polymer is coated on at least one surface.

3. The carrier tape backing for chip-shaped electronic components according to either claim 1 or 2, characterized in that 25% by mass or more of the total pulp used is LBKP dry pulp.

4. The steps include preparing papermaking raw materials, which are mainly composed of pulp, The steps include: making multilayer paper having two or more paper layers using the aforementioned papermaking raw materials; The step includes drying the multilayer paper, A method for manufacturing a carrier tape backing for chip-shaped electronic components, characterized in that 25% by mass or more of the total pulp used in the papermaking raw materials is dry pulp.

5. The steps include preparing papermaking raw materials, which are mainly composed of pulp, The steps include: making multilayer paper having two or more paper layers using the aforementioned papermaking raw materials; The steps include drying the aforementioned multilayer paper, The steps include preparing an aqueous solution of a water-soluble polymer, The process includes the step of applying the aqueous solution of the water-soluble polymer to at least one surface of the dried multilayer paper and drying it, A method for manufacturing a carrier tape backing for chip-shaped electronic components, characterized in that 25% by mass or more of the total pulp used in the papermaking raw materials is dry pulp.

6. A method for manufacturing a carrier tape backing for chip-shaped electronic components according to either 4 or 5, characterized in that 25% by mass or more of the total pulp used is LBKP dry pulp.

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