Transfer method and MEMS manufacturing method

Abstract

The objective is to provide a stamp-based transfer method that minimizes distortion of the transferred molded pattern. [Solution] A transfer method for picking up minute components with a stamp and transferring them to a substrate, wherein the stamp is made of a resin molded product formed on a substrate 2, and the resin molded product has a surface having a pattern, a side surface extending from the surface having the pattern toward the substrate, and a portion extending from the substrate-side end of the side surface toward the outer edge of the substrate toward the surface of the substrate.

Description

Technical Field

[0001] The present invention relates to a transfer method and a manufacturing method of MEMS.

Background Art

[0002] Conventionally, in the field of MEMS (Micro Electro Mechanical Systems), in order to enhance functions or added value, high integration or compounding has been carried out, in which minute parts having the same or different functions are integrated on one substrate.

[0003] There are various methods for performing such high integration. For example, there is a method of transferring minute parts using a stamp made of an elastic material and having a plurality of protrusions (for example, Patent Document 1). In this case, the adhesion force to the minute parts can be controlled by the pressure and speed between the protrusions of the stamp and the minute parts when picking up the minute parts.

[0004] On the other hand, forming the stamp by an imprint method has been considered. The imprint method is a method in which a mold having a fine pattern is pressed against a molded object such as a resin, and the pattern is transferred to the molded object using light or heat (see, for example, Patent Document 2).

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Disclosure of the Invention

Problems to be Solved by the Invention

[0006] However, conventional imprint methods have a problem in that when the mold is pressurized, the center of the mold warps, as shown in Figure 8. In this case, the position of the tip of the protrusion of the molded stamp will be different. As a result, the pressure between the stamp protrusion and the minute part when picking up the minute part becomes uneven, making it difficult to control the adhesion force with the minute part.

[0007] Therefore, the present invention aims to provide a method for manufacturing stamps in which the transferred molded pattern is less distorted. [Means for solving the problem]

[0008] To achieve the above objective, the present invention provides a method for manufacturing a stamp in which a resin molded product is formed on a substrate, wherein a fluid resin is hardened while being pressed between a mold and the substrate, the mold having a molded pattern to be transferred to the resin molded product and a wall surrounding the molded pattern, and the pressing is performed in a state in which the mold and the substrate can move freely in a direction toward each other.

[0009] Another stamp manufacturing method of the present invention is a method for manufacturing a stamp in which a resin molded product is formed on a substrate, wherein a fluid resin is hardened while being pressed while sandwiched between a mold and the substrate, the mold having a molded pattern to be transferred to the resin molded product and a wall portion surrounding the molded pattern, and the pressing is performed while the mold or the substrate is substantially floating on the resin.

[0010] It is preferable to apply the pressure while preventing the mold and the substrate from sliding.

[0011] Furthermore, the resin is either a photocurable resin or a thermosetting resin.

[0012] Furthermore, the wall portion forms the side surface of the resin molded product. It is preferable that the height of the wall portion relative to the surface having the molded pattern is 1 μm or more. It is also preferable that the difference between the maximum and minimum heights of the wall portion relative to the surface having the molded pattern is 1 μm or less.

[0013] Furthermore, the first imprint apparatus according to the present invention is for transferring the molding pattern of a mold to a workpiece by pressing the workpiece with a mold and a substrate, and is characterized by comprising: a stage for placing either the mold or the substrate on it; a positioning means for positioning the mold or the substrate that is not placed on the stage at a position where the workpiece is sandwiched between the mold and the substrate, and at a position where it can be freely moved in a direction in which the mold and the substrate are approaching each other; a pressure regulating unit having a pressure regulating chamber capable of enclosing the mold and the substrate; a pressure reducing means for reducing the pressure inside the pressure regulating chamber; a pressure pressing means for increasing the pressure inside the pressure regulating chamber within a range in which the mold and the substrate can be freely moved in a direction in which they are approaching each other; and a fixing means for fixing the workpiece to the molding pattern.

[0014] In this case, it is preferable to provide a slide prevention means to prevent the mold and the substrate from sliding. Alternatively, the placement means may be used as the slide prevention means. In this case, the placement means is formed to be movable to a position that prevents the mold and the substrate from sliding.

[0015] Furthermore, the arrangement means may include a position detection means for detecting the relative position of the mold with respect to the substrate.

[0016] Furthermore, the system may include control means that controls at least one of the placement means or the pressurizing means based on detection information from the position detection means.

[0017] Furthermore, it is preferable that the arrangement means be arranged so that the mold and the substrate are parallel to each other.

[0018] Furthermore, it is preferable to include a mold having a wall portion surrounding the molding pattern. In this case, it is preferable that the height of the wall portion relative to the surface having the molding pattern be 1 μm or more. Also, it is preferable that the difference between the maximum and minimum heights of the wall portion relative to the surface having the molding pattern be 1 μm or less.

[0019] Furthermore, the fixing means may be a light irradiation means for irradiating the molded object with light to solidify it, or a temperature control means for adjusting the temperature of the molded object.

[0020] Furthermore, the first imprint method according to the present invention is a method for transferring a molded pattern of a mold to a workpiece by pressurizing the workpiece with a mold and a substrate, and is characterized by comprising: a depressurization step of removing gas between the mold and the workpiece; an arrangement step of arranging the mold and the substrate in a position where they can move freely in a direction toward proximity with the workpiece sandwiched between them during depressurization; a pressurization step of pressurizing the mold and the workpiece with gas within a range where they can move freely in a direction toward proximity; and a fixing step of fixing the workpiece to the molded pattern.

[0021] It is preferable to perform the pressurization step while preventing the mold and the substrate from sliding.

[0022] Furthermore, it is preferable that the arrangement step be performed so that the mold and the substrate are parallel to each other.

[0023] Furthermore, the fixing step may be a step of irradiating the workpiece with light to solidify it and fixing the molding pattern to the workpiece, or a step of adjusting the temperature of the workpiece to solidify it and fixing the molding pattern to the workpiece.

[0024] In this case, it is preferable that the mold has a wall portion surrounding the periphery of the molding pattern. It is preferable to use a wall portion having a height of 1 μm or more with respect to the surface having the molding pattern. Further, it is preferable to use a wall portion having a difference between the maximum value and the minimum value of the height with respect to the surface having the molding pattern of 1 μm or less.

Advantages of the Invention

[0025] The method for manufacturing a stamp of the present invention can transfer a molding pattern without distortion to the stamp by uniformly pressurizing the mold.

Brief Description of the Drawings

[0026] [Figure 1] It is a cross-sectional view showing an imprint apparatus during the decompression step of the present invention. [Figure 2] It is a cross-sectional view showing an imprint apparatus during the placement step of the present invention. [Figure 3] It is a cross-sectional view showing another imprint apparatus during the placement step of the present invention. [Figure 4] It is a cross-sectional view showing an imprint apparatus during the pressurization step of the present invention. [Figure 5] It is a cross-sectional view showing another imprint apparatus during the pressurization step of the present invention. [Figure 6] It is a cross-sectional view showing an imprint apparatus during the fixing step of the present invention. [Figure 7] It is a cross-sectional view showing a molded object after molding according to the present invention. [Figure 8] It is a cross-sectional view showing a conventional molding method.

Modes for Carrying Out the Invention

[0027] The imprint apparatus of the present invention will be described with reference to Figures 1 to 7. As shown in Figure 1, the imprint apparatus of the present invention is for transferring the molding pattern of the mold 1 to the molded object 3 by pressurizing the object to be molded 3 with a mold 1 and a substrate 2, and mainly consists of a stage 4, a placement means 5, a pressure adjustment unit 6, a depressurization means 71, a pressurization means 72, and a fixing means 8.

[0028] Furthermore, the mold 1 used in the imprint apparatus and imprint method of the present invention is preferably made of a rigid body so as not to cause distortion in the molded pattern. For example, resins such as PET or COP, or inorganic materials such as glass may be used. In the optical imprint process, when the light source is placed on the mold 1 side, a transparent material is selected. Also, when used in thermal imprinting, a material with heat resistance to the operating temperature is selected.

[0029] The molded patterns include not only geometric shapes consisting of bumps and depressions, but also those for transferring a predetermined surface state, such as transferring a mirror-like surface with a predetermined surface roughness. Furthermore, the molded patterns are formed with minimum dimensions of the width of the protrusions and recesses of various sizes, such as 100 μm or less, 10 μm or less, 2 μm or less, 1 μm or less, 100 nm or less, and 10 nm or less. The dimensions in the depth direction are also formed with various sizes, such as 10 nm or more, 100 nm or more, 200 nm or more, 500 nm or more, 1 μm or more, 10 μm or more, and 100 μm or more.

[0030] Furthermore, when transferring a molding pattern with a high aspect ratio, or when the thickness of the base supporting the molding pattern is large, there is a problem that the molded material 3 leaks out in the lateral direction of the mold 1, resulting in insufficient molding pressure to fill the molding pattern with the molded material 3. Therefore, the mold 1 may have a wall portion 11 surrounding the molding pattern. This suppresses leakage of the molded material 3 in the lateral direction of the mold 1 when the mold 1 pressurizes the molded material 3, and allows the molded pattern to be sufficiently filled with the molded material 3. The height of the wall portion 11 relative to the surface having the molding pattern should be, for example, 1 μm or more. Also, if the height of the wall portion varies, in the pressurizing step of the imprint method described later, the degree of flow of the molded material near the wall portion will differ, causing the parallelism between the mold and the substrate to be disturbed by the pressurizing. Therefore, it is preferable to have less variation in the height of the wall portion. For example, it is preferable to make the difference between the maximum and minimum values ​​of the height of the wall portion relative to the surface having the molding pattern 1 μm or less.

[0031] The substrate 2 can be anything that can support the molded object 3, and for example, resin, inorganic compound, or metal can be used.

[0032] The molded object 3 is onto which the molding pattern of the mold 1 is transferred, and it is sufficient that it is held by at least one of the mold 1 or the substrate 2. Examples of resins used for the molded object 3 include photocurable resins, thermosetting resins, or thermoplastic resins.

[0033] The photocurable resin used for the molded object 3 is a fluid resin that hardens with light of a specific wavelength, and any resin used in photoimprint technology can be used. For example, silicone rubber such as polydimethylsiloxane (PDMS), epoxide-containing compounds, (meth)acrylic acid ester compounds, vinyl ether compounds, and compounds containing unsaturated hydrocarbon groups such as vinyl and allyl groups, such as bis-allylnadiimide compounds, can be used. In this case, a photoreactive initiator may be added to allow the polymerization reaction to proceed by light irradiation and form a molded pattern. Suitable photoreactive radical initiators include acetophenone derivatives, benzophenone derivatives, benzoin ether derivatives, and xanthone derivatives. Furthermore, the reactive monomer may be used without a solvent, or it may be dissolved in a solvent and then desolvented after coating.

[0034] The thermosetting resin used for the molded object 3 is a fluid resin that hardens when heated, and any resin used in thermal imprint technology can be used. For example, silicone rubber such as polydimethylsiloxane (PDMS), epoxide-containing compounds, (meth)acrylic acid ester compounds, vinyl ether compounds, and compounds containing unsaturated hydrocarbon groups such as vinyl and allyl groups, such as bis-allylnadiimide compounds, can be used. In this case, it is possible to use polymerization-reactive group-containing compounds alone for thermal polymerization, or to add a thermally reactive initiator to improve thermosetting properties. Suitable thermally reactive radical initiators include organic peroxides and azo compounds, while suitable photoreactive radical initiators include acetophenone derivatives, benzophenone derivatives, benzoin ether derivatives, and xanthone derivatives. Furthermore, the reactive monomer may be used without a solvent, or it may be dissolved in a solvent and desolvented after coating.

[0035] Furthermore, the thermoplastic resin used for the molded object 3 is a resin that becomes fluid when it reaches its glass transition temperature or melting point and solidifies when cooled, and any resin that is used in thermal imprint technology can be used. For example, cyclic olefin resins such as cyclic olefin ring-opening polymerization / hydrogenated products (COP) and cyclic olefin copolymers (COC), acrylic resins, polycarbonates, vinyl ether resins, fluororesins such as perfluoroalkoxyalkanes (PFA) and polytetrafluoroethylene (PTFE), polystyrene, polyimide resins, polyester resins, etc. can be used.

[0036] Stage 4, as shown in Figure 2 or Figure 3, is for mounting either mold 1 or substrate 2. It is preferable that the mold 1 and substrate 2 be mounted so that they are parallel to each other, and more preferably, that the surface of mold 1 with the molding pattern and the opposing surface of substrate 2 be mounted horizontally. The material of stage 4 can be any material that is suitable for the molding conditions, but it is preferable to use a material that has, for example, pressure resistance and heat resistance for the molding conditions, and metals such as stainless steel can be used. Also, in the optical imprint process, if the light source is placed on the stage 4 side, a transparent material such as glass may be used.

[0037] The placement means 5 positions the mold 1 and the substrate 2, whichever is not placed on the stage 4, at a position where the mold 1 and the substrate 2 sandwich the workpiece 3, and where the mold 1 and the substrate 2 can move freely in a direction that brings them closer together. In this specification, "the mold 1 and the substrate 2 sandwich the workpiece 3" means that the workpiece 3 is in contact with both the mold 1 and the substrate 2. Also in this specification, "the mold 1 and the substrate 2 can move freely in a direction that brings them closer together" means that the mold 1 or the substrate 2 is placed on the fluid workpiece 3 and is substantially floating, and the entire mold 1 or substrate 2 is subjected to uniform pressure. Specifically, as shown in Figure 2, when the substrate 2 is placed on the stage 4, the mold 1 is placed at a position where the mold 1 and the substrate 2 can move freely in a direction that brings them closer together. That is, the mold 1 is placed on the workpiece 3 on the substrate 2 and is substantially floating. Furthermore, as shown in Figure 3, when mold 1 is placed on stage 4, the substrate 2 is positioned so that it can move freely in a direction that brings mold 1 and substrate 2 closer together. In other words, the substrate 2 is placed on the molded object 3 on mold 1, so that it is essentially floating.

[0038] Furthermore, the arrangement means 5 is preferably one that can arrange the mold 1 and the substrate 2 so that they are parallel to each other. The arrangement means 5 can be any one that can be positioned so that the molded object 3 is sandwiched between the mold 1 and the substrate 2, and so that either the mold 1 or the substrate 2 can be freely moved in a direction that brings them closer together. For example, it may consist of a holding part that holds the mold 1 or the substrate 2 horizontally, a lifting means for raising and lowering the holding part, and a separating means for separating the holding part laterally from the mold 1. As the holding part, for example, a protruding part 15 that protrudes horizontally from the side surface of the mold 1 may be provided, and the protruding part 15 may be formed to be able to be placed on. The movement of the holding part by the lifting means and the separating means may be by a hydraulic or pneumatic cylinder, or by an electric motor and a ball screw, although these are not shown in the figures.

[0039] Furthermore, the placement means 5 may have a position detection means for detecting the relative position of the mold 1 with respect to the substrate 2. This makes it possible to determine the position where the mold 1 and the workpiece 3 or the substrate 2 and the workpiece 3 come into contact, and the position where the mold 1 and the substrate 2 can move freely in the direction of proximity. Also, during pressurization, the mold 1 and the substrate 2 can be pressurized within a range where they can move freely in the direction of proximity. As the position detection means, any well-known means may be used; for example, a laser length measuring device provided on the stage 4 may be used to measure the position of the mold 1. Alternatively, if an electric motor is used in the placement means 5, an encoder provided on the electric motor may be used to calculate the position of the mold 1 from the displacement.

[0040] The pressure regulating unit 6 constitutes a pressure regulating chamber 61 capable of enclosing the mold 1 and the substrate 2. By adjusting the air pressure in the pressure regulating chamber 61, it is possible to suppress the retention of gas within the molding pattern of the mold 1 and to pressurize the molded object 3 with the mold 1 and the substrate 2. The pressure regulating chamber 61 can be of any size and shape as long as it can enclose the mold 1 and the substrate 2, and should be designed considering the air pressure and adjustment time within the pressure regulating chamber 61. For example, as shown in Figure 4, a bottomed cylindrical housing 62 can be used to constitute the pressure regulating chamber 61 together with the stage 4. In this case, in order to transport the mold 1 and the substrate 2 into the pressure regulating chamber 61, a lifting mechanism may be provided that allows the housing 62 to be raised and lowered relative to the stage 4, thereby opening the space between the housing 62 and the stage 4, or an opening and closing part may be provided on the housing 62 for transporting the mold 1 and the substrate 2 into the pressure regulating chamber 61. Furthermore, the pressure regulating unit 6 may be configured to have a pressure regulating chamber 61 that also encloses the stage 4.

[0041] The depressurization means 71 removes the gas between the mold 1 and the workpiece 3 and reduces the pressure inside the pressure regulating chamber 61 to a pressure that does not cause problems in pattern formation. A pressure that does not cause problems in pattern formation means a pressure that prevents gas from remaining as bubbles in the molded pattern and causing transfer defects, for example, 1000 Pa or less, preferably 100 Pa or less. As the depressurization means 71, for example, a well-known depressurization pump connected to the pressure regulating chamber 61 and capable of removing gas from inside the pressure regulating chamber 61 may be used.

[0042] Furthermore, the pressurizing means 72 is used to pressurize the inside of the pressure regulating chamber 61 in order to fill the molded object 3 into the molding pattern of the mold 1. The pressure required to fill the molded object 3 into the molding pattern of the mold 1 is appropriately set depending on the viscosity of the molded object 3, etc. The pressurizing means 72 pressurizes the inside of the pressure regulating chamber 61 within a range in which it can move freely in the direction in which the mold 1 and the substrate 2 are close together. This allows uniform pressure to be applied to the mold 1, the substrate 2, and the molded object 3, thereby preventing distortion of the molded object 3. As the pressurizing means 72, for example, a cylinder that supplies a gas such as air or an inert gas that can pressurize the inside of the pressure regulating chamber 61, or a pressurizing pump can be used. Also, if atmospheric pressure is sufficient to pressurize, an opening valve connecting the inside and outside of the pressure regulating chamber 61 may be used, as shown in Figure 4.

[0043] Furthermore, the system may have a control means that controls the placement means 5 and the pressurizing means 72 based on the detection information from the position detection means. This allows the placement means 5 to position the mold 1 or the substrate 2 in a location where the mold 1 and the substrate 2 sandwich the workpiece 2, and where the mold 1 and the substrate 2 can move freely in the direction of proximity, and the pressurizing means 72 to pressurize the mold 1 and the workpiece 3 within a range where the mold 1 and the substrate 2 can move freely in the direction of proximity. Any control means that can control the placement means 5 and the pressurizing means 72 is acceptable, and a well-known computer can be used.

[0044] The fixing means 8 is for fixing the workpiece 3 to the molding pattern. When used in optical imprinting, the light irradiation means 81 may be used as the fixing means 8. When used in thermal imprinting, the temperature control means may be used.

[0045] The light irradiation means 81 is used to solidify the molded object 3, which is made of a photocurable resin, by irradiating it with light. Any light irradiation means 81 can be used as long as it can cure the molded object 3 by irradiating it with electromagnetic waves of a predetermined wavelength, but for example, an ultraviolet irradiation device that irradiates the molded object 3 with ultraviolet light can be used. Here, the light irradiation means 81 can be single or multiple as long as it can irradiate the molded object 3. When multiple means are arranged, it is preferable to arrange them so that the illuminance distribution on the molded object 3 is as uniform as possible.

[0046] The temperature control means adjusts the temperature of the molded object 3, which is made of a thermosetting resin or thermoplastic resin, to give the molded object 3 fluidity or solidify it. As the temperature control means, a heating means can be used to directly or indirectly heat the molded object 3. Alternatively, a cooling means can be used to directly or indirectly cool the molded object 3.

[0047] The heating means can be any means capable of heating either the mold 1 or the workpiece 3, or both, to a predetermined temperature, for example, above the glass transition temperature or melting point of the thermoplastic resin constituting the workpiece 3, or above the curing temperature of the thermosetting resin. Furthermore, the workpiece 3 may be heated from either the stage 4 side or the mold 1 side. For example, a system can be used in which a heater is installed inside the stage 4 to heat the mold 1 and the workpiece 3. Heating can also be performed using a heated liquid or gas.

[0048] The cooling means can be any means that can cool either the mold 1 or the workpiece 3, or both, to a predetermined temperature, for example, below the glass transition temperature or melting point of the thermoplastic resin constituting the workpiece 3, or below the curing temperature of the thermosetting resin. The workpiece 3 may be cooled from the stage 4 side or from the mold 1 side. For example, a cooling fan or a cooling water channel formed in the stage 4 that cools the mold 1 and the workpiece 3 by flowing liquid can be used.

[0049] Furthermore, the temperature control means may include a temperature detection means for detecting the temperatures of the mold 1, substrate 2, molded object 3, stage 4, etc., and the temperature of the molded object 3 may be adjusted based on the detected temperature information.

[0050] Furthermore, in the imprint apparatus of the present invention, since either the mold 1 or the substrate 2 is floating above the workpiece 3 in a position where it can move freely in the direction of proximity between the mold 1 and the substrate 2, there is a problem that the mold 1 and the substrate 2 are prone to sliding when pressure is applied to them. Therefore, a slide prevention means 9 may be provided to prevent the sliding movement of the mold 1 and the substrate 2. The slide prevention means 9 can be anything that does not hinder the movement of the mold 1 or the substrate 2 floating above the workpiece 3 in the direction of proximity, but prevents sliding movement in a direction perpendicular to the direction of proximity. For example, as shown in Figure 4, a guide-shaped slide prevention means 9 may be provided on the side of the mold 1 floating above the workpiece 3 with a predetermined gap. Also, if it is the substrate 2 that is floating above the workpiece 3, a guide-shaped slide prevention means may be provided on the side of the substrate 2 with a predetermined gap (not shown). Also, as shown in Figure 5, the placement means 5 may be used as the slide prevention means. In this case, the positioning means 5 should be formed to be movable to a position that prevents sliding movement between the mold 1 and the substrate 2 when the mold 1 and the workpiece 3 are pressed together. The size of the gap between the sliding prevention means 9 and the side surface of the mold 1 or substrate 2 is not particularly limited as long as it is large enough to allow sliding movement between the mold 1 and the substrate 2, but for example, it should be within 0.5 mm.

[0051] Next, the imprint method of the present invention will be described. The imprint method of the present invention is a method for transferring the molding pattern of the mold 1 to the molded object 3 by pressing the molded object 3 with the mold 1 and the substrate 2, and mainly consists of a depressurization step, a placement step, a pressurization step, and a fixing step.

[0052] The depressurization step is for removing gas between the mold and the workpiece. As shown in Figure 1, the pressure inside the pressure regulating chamber 61 is reduced by leaving a gap between the mold 1 and the workpiece 3, and the gas inside the pressure regulating chamber 61 is removed. This prevents gas from remaining as bubbles in the molded pattern, which would cause transfer defects. The pressure in the depressurization step is not particularly limited as long as the pressure inside the pressure regulating chamber 61 is reduced to a pressure that does not cause problems in pattern formation, but for example, 1000 Pa or less, preferably 100 Pa or less is preferable.

[0053] The placement process, as shown in Figure 2 or Figure 3, involves positioning the mold 1 and substrate 3 in a location where they can move freely in a direction that brings them closer together, with the workpiece 3 sandwiched between them during the reduced pressure stage. Specifically, as shown in Figure 2, when the substrate 2 is placed on the stage 4, the mold 1 is positioned so that it can move freely in a direction that brings the mold 1 and substrate 2 closer together. That is, the mold 1 is placed on the workpiece 3 on the substrate 2, creating a state where it is substantially floating. Also, as shown in Figure 3, when the mold 1 is placed on the stage 4, the substrate 2 is positioned so that it can move freely in a direction that brings the mold 1 and substrate 2 closer together. That is, the substrate 2 is placed on the workpiece 3 on the mold 1, creating a state where it is substantially floating. It is preferable that the mold 1 and substrate 2 be positioned parallel to each other during the placement process.

[0054] As shown in Figure 4, the pressurization process involves applying gas pressure to the mold 1 and the molded object 3 within a range where the mold 1 and the substrate 2 can move freely in a direction that brings them close together. This allows for uniform pressure to be applied to the mold 1, substrate 2, and molded object 3, thereby preventing distortion in the molded object 3.

[0055] During the pressurization process, as described above, the mold 1 and the substrate 2 are in a position where they can move freely in a direction that brings them closer together, and either the mold 1 or the substrate 2 is floating above the molded object 3. Therefore, the mold 1 and the substrate 2 are prone to sliding when pressurized. For this reason, it is preferable to perform the pressurization process while preventing the sliding movement of the mold 1 and the substrate 2 (see Figure 4 or Figure 5).

[0056] The fixing process involves fixing the molded object 3 to the molded pattern. In the case of photoimprinting, as shown in Figure 6, the fixing process involves irradiating the molded object 3, which is made of a photocurable resin, with light to solidify it and fix the molded pattern to the molded object 3. Any light that can cure the photocurable resin used for the molded object 3 can be used, for example, ultraviolet light. In the case of thermal imprinting, the molded object 3 is solidified by adjusting its temperature and fixing the molded pattern to the molded object 3. For example, if the molded object 3 is made of a thermosetting resin, the molded object 3 can be heated to a temperature above the curing temperature of the resin to solidify it. If the molded object 3 is made of a thermoplastic resin, the molded object 3 can be cooled to a temperature below the glass transition temperature or melting point of the resin to solidify it.

[0057] In the case of thermal imprinting, a temperature control step may be required before the pressurizing step to adjust the temperature of the molded object 3 so that it is fluid. For example, if the molded object 3 is made of a thermoplastic resin, the molded object 3 is heated to a temperature above the glass transition temperature or melting point of the resin. If the molded object 3 is made of a thermosetting resin, the temperature of the molded object 3 is maintained below the temperature at which the resin does not harden. The temperature control step may be performed either before or after the depressurization step.

[0058] Finally, as shown in Figure 7, by releasing the mold 1 from the workpiece 3, a workpiece 3 can be formed in which the molding pattern of the mold 1 has been transferred without distortion. [Explanation of Symbols]

[0059] 1 mold 2 circuit boards 3 Object to be molded 4 stages 5 Arrangement means 6. Pressure Regulating Section 8 Fixing means 9. Anti-slide means 11 Wall 15 Protrusion 61 Pressure Regulating Room 62 cabinets 71 Depressurization means 72 Pressurizing means 81 Light irradiation means

Claims

1. This is a transfer method that picks up tiny components with a stamp and transfers them to a circuit board. The aforementioned stamp is formed by creating a resin molded product on a substrate. The aforementioned resin molded product is A surface having a pattern, A side surface extending toward the substrate from the surface having the aforementioned pattern, A transfer method characterized by having a portion that extends from the end of the side surface on the substrate side toward the outer edge of the substrate toward the surface of the substrate.

2. The transfer method according to claim 1, characterized in that the resin molded product is not formed on the outer edge of the substrate.

3. The transfer method according to claim 1 or 2, characterized in that the resin molded product is a cured resin product.

4. The transfer method according to any one of claims 1 to 3, characterized in that the pattern has convex and concave portions.

5. A method for manufacturing a MEMS in which minute components having the same or different functions are integrated on a single substrate, The process includes transferring the minute components picked up by the stamp to the substrate, The aforementioned stamp is formed by creating a resin molded product on a substrate. The aforementioned resin molded product is A surface having a pattern, A side surface extending toward the substrate from the surface having the aforementioned pattern, A method for manufacturing MEMS, characterized by having a portion that extends from the substrate-side end of the side surface toward the outer edge of the substrate toward the surface of the substrate.

6. The method for manufacturing MEMS according to claim 5, characterized in that the resin molded product is not formed on the outer edge of the substrate.

7. The method for manufacturing MEMS according to claim 5 or 6, characterized in that the resin molded product is a cured resin product.

8. The method for manufacturing MEMS according to any one of claims 5 to 7, characterized in that the pattern has convex and concave portions.

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