Contact parts and inspection equipment

The contact component with varying distances and densities between tip and spring portions addresses the challenge of narrow contact areas in power semiconductor modules, ensuring stable and efficient multi-point contact with reduced processing time and noise.

JP2026061301APending Publication Date: 2026-04-09ENPLAS CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-09-30
Publication Date
2026-04-09

AI Technical Summary

Technical Problem

Conventional contact components struggle to accommodate narrow contact areas while ensuring sufficient cross-sectional area for electrical circuits, particularly in power semiconductor modules, due to parallel arrangement of contact pieces with equal thickness and spacing.

Method used

A contact component with multiple contact pieces branching from a base, featuring varying distances and densities between tip and spring portions, allowing for a narrower contact area while maintaining circuit cross-sectional area, and incorporating a rounded edge to prevent contact deterioration.

Benefits of technology

Enables stable and efficient multi-point contact in narrow areas, reducing processing time and ensuring consistent contact performance, while minimizing noise and improving productivity.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide contact components and inspection equipment that can accommodate narrow contact areas while ensuring sufficient cross-sectional area of ​​the electrical circuit. [Solution] The contact component is a contact component having a plurality of contact pieces branching from a base, each contact piece including a spring portion connected to the base and a contact portion having a contact point at its tip, and the distance between the tip sides of the contact portions of adjacent contact pieces is different from the distance between the spring portions.
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Description

Technical Field

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[0001] The present invention relates to a contact component and an inspection device used in an inspection device for electrical components such as semiconductor modules, and particularly relates to a technology suitable for inspecting power semiconductor modules.

Background Art

[0002] Conventionally, an inspection device called an IC socket has been used for inspecting electrical components such as semiconductor modules. The IC socket includes a contact portion that contacts the module terminals of the electrical component to be inspected and electrically connects, for example, the electrical component and the inspection circuit board.

[0003] Particularly, for an inspection device for a power semiconductor module, it is required that the contact portion can handle a large current. Specifically, it is preferable that the contact portion has a large cross-sectional area to suppress heat generation during energization and has a contact point that can obtain stable contact performance with the module terminal.

[0004] For example, Patent Document 1 discloses a contact probe for power semiconductor measurement. Also, for example, a contact component in which contacts are arranged side by side is known. This contact is suitable for the inspection of power semiconductor modules in that it can secure an electric circuit cross-sectional area and obtain stable contact performance by multi-point contact.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] [[ID=On the other hand, with the miniaturization of semiconductor modules and electronic devices on which they are mounted, the contact area with contact components at module terminals tends to become smaller. In the case of conventional contacts, multiple contact pieces have a certain thickness and are arranged parallel to each other at equal intervals, which may make it difficult to accommodate a narrow contact area while ensuring sufficient cross-sectional area of ​​the electrical circuit.

[0007] The object of the present invention is to provide a contact component and inspection device that can accommodate a narrow contactable area while ensuring sufficient cross-sectional area of ​​the electrical circuit. [Means for solving the problem]

[0008] The contact component according to the present invention is A contact component having multiple contact pieces branching from a base, Each of the aforementioned contact pieces includes a spring portion connected to the base and a contact portion having a contact point at its tip. The distance between the tip ends of the contact portions in adjacent contact pieces is different from the distance between the spring portions.

[0009] The contact component according to the present invention is A contact component having multiple contact pieces branching from a base, Each of the aforementioned contact pieces includes a spring portion connected to the base and a contact portion having a contact point at its tip. The electrical circuit density at the tip of the contact portion in the contact piece is different from the electrical circuit density of the spring portion.

[0010] The inspection apparatus according to the present invention is A contact portion having the contact component described in claim 1, A module holding part that holds the electrical component so that the module terminal of the electrical component to be inspected and the contact of the contact part make contact, It is equipped with. [Effects of the Invention]

[0011] According to the present invention, it is possible to correspond to a narrow contactable area while securing the circuit cross-sectional area.

Brief Description of the Drawings

[0012] [Figure 1] FIG. 1 is a perspective view showing an inspection apparatus according to a first embodiment of the present invention. [Figure 2] FIGS. 2A and 2B are diagrams showing an example of a contact component. [Figure 3] FIG. 3 is a diagram showing the shape of a contact portion of a contact piece. [Figure 4] FIGS. 4A and 4B are diagrams showing the circuit density on the tip side of the contact portion and the circuit density of the spring portion. [Figure 5] FIG. 5 is a diagram showing an example of a contact portion according to a second embodiment. [Figure 6] FIG. 6 is a diagram showing another example of a contact portion according to a second embodiment. [Figure 7] FIG. 7 is a diagram showing another example of a contact portion according to a second embodiment. [Figure 8] FIG. 8 is a diagram showing another example of a contact portion according to a second embodiment. [Figure 9] FIG. 9 is a diagram showing another example of a contact portion according to a second embodiment. <000008​​​​​​​​​​​​​​The inspection device 1 is a so-called IC socket for testing the electrical characteristics of the electrical component 100. The electrical component 100 is, for example, a power semiconductor module that controls and converts electric power, and can handle high voltage (e.g., 500V) and large current (e.g., 1000A). The electrical component 100 includes module terminals 101 to 103 for power input / output and a module body 107. The electrical component 100 may include terminals for signal input / output (not shown).

[0016] Hereinafter, when the electrical component 100 is mounted on the inspection device 1, the pressing direction will be described as the "first direction D1", the arrangement direction of the module terminals 101 as the "second direction D2", and the direction orthogonal to the first direction D1 and the second direction D2 as the "third direction D".

[0017] As shown in FIG. 1, the inspection device 1 includes a contact portion 10 and a base portion 20. The inspection device 1 may include a module holding portion (not shown), such as a pressing mechanism and a locking mechanism, on the base portion 20 for holding the electrical component 100 in a stable posture.

[0018] The contact portion 10 electrically connects the electrical component 100 and the inspection circuit board. In the inspection device 1, two contact portions 11 and 12 are arranged along the second direction D2 at one end of the third direction D3, and one contact portion 13 is arranged at the other end. The contact portions 11 to 13 correspond to the module terminals 101 to 103 of the electrical component 100 to be inspected.

[0019] The contact portions 11 to 13 each have a contact component 30 and a contact fixing portion 40. The contact component 30 is, for example, detachably fixed to the contact fixing portion 40. The contact component 30 is fixed, for example, such that its longitudinal direction coincides with the third direction D3 and its width direction coincides with the second direction D2. The contact component 30 is formed of a conductive material such as a copper alloy. The contact component 30 forms a circuit through which current flows during the inspection of the electrical component 100.

[0020] Each contact component 30 makes contact with the module terminals 101 to 103 of the electrical component 100. The contact components 30 are electrically connected to a test circuit board (not shown) via, for example, lead wires (not shown) connected to the contact fixing part 40.

[0021] During the inspection of the electrical component 100, the module terminals 101-103 of the electrical component 100 and the contact components 30 of the contact parts 11-13 are elastically in contact with each other under a predetermined contact load.

[0022] Figures 2A and 2B show examples of contact components 30. Figure 2A is a perspective view of the contact component 30, and Figure 2B is a front view of the contact component 30.

[0023] As shown in Figures 2A and 2B, the contact component 30 is a contact having a contact base 31 and contact pieces 32 to 34. The contact component 30 is formed, for example, by wire cutting a conductive plate-shaped base material. In this case, the thickness of the base material becomes the width of the contact component 30. In this embodiment, the contact component 30 is provided with three contact pieces 32 to 34, but the number of contact pieces may be two or four or more.

[0024] The contact base 31 is the part that is attached to the contact fixing part 40. The contact base 31 has an inverted T shape in a front view so as to ensure the spring length of the contact pieces 32 to 34 while suppressing the longitudinal length of the contact component 30. However, the shape of the contact base 31 is not limited to this, and may be a simple rectangular parallelepiped, for example.

[0025] The contact pieces 32-34 are formed to branch from the contact base 31 in the height direction and extend in the longitudinal direction. The contact pieces 32-34 have a plate shape with a constant plate thickness. The contact pieces 32-34 have a cantilever beam structure in which one end (the end of the spring portion 51) is connected to the contact base 31.

[0026] In the following, when distinguishing between contact pieces 32 to 34, they will be referred to as "proximal contact piece 32," "intermediate contact piece 33," and "distal contact piece 34." The proximal contact piece 32 is the contact piece whose contact with module terminals 101 to 106 is closest to the contact base 31. The distal contact piece 34 is the contact piece whose contact is furthest distal to the contact base 31. The intermediate contact piece 33 is the contact piece sandwiched between the proximal contact piece 32 and the distal contact piece 34.

[0027] Each of the contact pieces 32 to 34 has a spring portion 51 and a contact portion 52. The tip surface 52a of the contact portion 52 makes contact with the module terminals 101 to 103 of the electrical component 100 (hereinafter referred to as the "contact surface 52a"). The contact pieces 32 to 34 are arranged such that their respective spring portions 51 and contact portions 52 are aligned in the thickness direction, that is, the contact surface 52a exhibits a comb-like shape.

[0028] The spring portion 51 extends longitudinally from the contact base 31 and exerts a biasing force when the electrical component 100 is installed. The direction of extension of the spring portion 51 (the longitudinal direction of the contact component 30) intersects with the pressing direction when the electrical component 100 is installed. The spring portion 51 does not have to have a straight shape along the longitudinal direction; for example, it may have an inclined portion 54. The length and shape of the spring portion 51 are set appropriately to satisfy the required spring characteristics (contact load) of the spring portion 51. In addition, the spacing between the spring portions 51 in the contact pieces 32-34 is set to allow for the deflection that occurs in the spring portion 51 when the contact pieces 32-34 are pressed in when the electrical component 100 is installed.

[0029] The contact portion 52 is a part that bends upward from the spring portion 51 in an L-shape and extends generally along the height direction. The contact portion 52 does not exert a biasing force when the electrical component 100 is installed, or its biasing force is negligible compared to that of the spring portion 51, so functionally it can be called a "non-spring portion".

[0030] The contact component 30 is suitable for inspection equipment 1 for power semiconductor modules that handle high voltage and high current because it can secure the cross-sectional area of ​​the circuit with three contact pieces 32 to 34 and can make multi-point contact with each of the module terminals 101 to 103.

[0031] The number of contact pieces 32-34, the contact area (width, thickness) per piece, and the gap (pitch) between contact pieces 32-34 are designed taking into account the cumulative tolerance of misalignment relative to the module terminals 101-106.

[0032] Figure 3 shows the shape of the contact portion 52 of the contact pieces 32 to 34.

[0033] In conventional contacts, multiple contact pieces have a constant thickness and are arranged parallel to each other at equal intervals, which can make it difficult to accommodate a narrow contactable area while ensuring sufficient cross-sectional area of ​​the electrical circuit. In contrast, in the contact component 30 of this embodiment, as shown in Figure 3, the contact pieces 32 to 34 have a constant thickness, but are not arranged parallel to each other at equal intervals.

[0034] Specifically, the contact portions 52 of the proximal contact piece 32 and the intermediate contact piece 33 have inclined portions 53 that are bent in a crank shape to approach the distal contact piece 34. The inclination angle of the inclined portion 53 of the proximal contact piece 32 (angle relative to the extending direction of the distal contact 34) is greater than the inclination angle of the inclined portion 53 of the intermediate contact piece 33. On the other hand, the contact portion 52 of the distal contact 34 is formed in a straight shape.

[0035] In other words, in this embodiment, as shown in Figure 3, the distance L1 between the tip ends of the contact portions 52 in adjacent contact pieces 32 to 34 is different from the distance L3 between the spring portions 51.

[0036] Furthermore, the above embodiments are merely examples, and the present invention is not limited thereto. For example, the distal contact piece 34 may have an inclined portion, and its inclination angle (angle with respect to the extending direction of the proximal contact 32) may be greater than the inclination angle of the inclined portion of the intermediate contact piece 33, while the contact portion of the proximal contact 32 may be formed in a straight shape. Moreover, the intermediate contact piece 33 may be formed in a straight shape, and the proximal contact piece 32 and distal contact piece 34 may be formed in a crank-like bend so as to approach the intermediate contact piece 33.

[0037] The electrical circuit density at the tip of the contact portion 52 is different from that of the spring portion 51. The electrical circuit density at the tip of the contact portion 52 represents the ratio of the effective electrical circuit area (sum of the cross-sectional areas of the contact pieces 32 to 34) to the area S1 of the contact region at the tip of the contact portion 52 (see Figure 4A). The area S1 of the contact region is the area of ​​the outer edge shape including the three contact surfaces 52a of the contact pieces 32 to 34. The electrical circuit density in the spring portion 51 represents the ratio of the effective electrical circuit area (sum of the cross-sectional areas of the contact pieces 32 to 34) to the area S2 of the spring portion 51 (see Figure 4B). The area of ​​the spring portion 51 is the area of ​​the outer edge shape including the three spring portions 51 of the contact pieces 32 to 34.

[0038] Specifically, the spacing L1 at the tip of the contact portion 52 is narrower than the spacing L3 of the spring portion 51. The spacing L1 at the tip of the contact portion 52 is typically the spacing of the contact surfaces 52a. It can also be said that the electrical circuit density at the tip of the contact portion 52 is greater than the electrical circuit density of the spring portion 51.

[0039] In this case, the area S1 of the contact region at the tip of the contact portion 52 is smaller than the area S2 of the spring portion 51. That is, the contact component 30 has the same effective circuit area as a conventional contact, but the contact region area S1 is smaller because the gap is smaller. Therefore, the contact component 30 can accommodate a narrow contactable area while ensuring the circuit cross-sectional area.

[0040] Here, the gap at the tip of the contact portion 52 is formed using a thin wire having a first wire diameter. On the other hand, the gap in the spring portion 51 is formed using a large-diameter wire having a second wire diameter that is larger than the first wire diameter. Generally, wire cutting using thin wires takes longer than wire cutting using large-diameter wires.

[0041] Therefore, in this embodiment, the gap L1 at the tip of the contact portion 52 is narrower than the gap L2 at the base of the contact portion 52. The gap L2 at the base of the contact portion 52 is the gap near the bent portion connected to the spring portion 51, and is typically the same as the gap L3 of the spring portion 51. It can also be said that the electrical circuit density at the tip of the contact portion 52 is smaller than the electrical circuit density at the base of the contact portion 52. The gap at the base of the contact portion 52 is formed using a large-diameter wire, similar to the gap in the spring portion 51. Therefore, compared to the case where the gap of the contact portion 52 is formed using a small-diameter wire along its entire length, the processing time can be reduced.

[0042] Furthermore, on the contact surface 52a of the contact pieces 32-34, the proximal edge 52b closest to the contact base 31 is rounded. When the electrical components 100 are installed in the inspection device 1 and the contact pieces 32-34 are pressed in, the spring portion 51 bends downward with the connection point with the contact base 31 as the fixed end. As a result, the contact surface 52a of the contact pieces 32-34 rotates while rubbing (also called wiping) against the module terminals 101-103. The contact between the contact surface 52 and the module terminals 101-103 transitions from surface contact to point contact at the edge 52b.

[0043] Edge 52b rubs against module terminals 101-103, and as this rubbing progresses, there is a risk that contact performance will deteriorate over time. By applying a rounded edge (R) to edge 52b, deterioration due to rubbing with module terminals 101-103 can be prevented, and stable contact performance can be ensured.

[0044] As described above, the contact component 30 according to the embodiment is equipped with the following features individually or in appropriate combinations.

[0045] In other words, the contact component 30 is a contact component having a plurality of contact pieces 32 to 34 branching from a contact base 31, and each contact piece 32 to 34 includes a spring portion 51 connected to the contact base 31 and a contact portion 52 having a contact surface 52a (contact) at its tip. The spacing L1 at the tip side of the contact portions 52 in adjacent contact pieces 32 to 34 is different from the spacing L3 of the spring portions 51. It can also be said that the electrical circuit density at the tip side of the contact portions 52 is different from the electrical circuit density of the spring portions 51.

[0046] The contact component 30 improves the design flexibility to reduce the contact area that contacts the module terminals 101-103 while ensuring sufficient contact load and circuit cross-sectional area.

[0047] Specifically, in the contact component 30, the spacing L1 at the tip of the contact portion 52 is narrower than the spacing L3 of the spring portion 51. It can also be said that the electrical circuit density at the tip of the contact portion 52 is greater than that of the spring portion 51. This makes it easy to accommodate a narrow contactable area.

[0048] In the contact component 30, the spacing L1 at the tip of the contact portion 52 is narrower than the spacing L2 at the base of the contact portion 52. It can also be said that the electrical circuit density at the tip of the contact portion 52 is greater than the electrical circuit density at the base of the contact portion 52. The processing area by wire cutting using a thin wire can be reduced, shortening processing time and improving productivity.

[0049] In the contact component 30, the contact portion 52 has an inclined portion 53 formed by a crank-like bend, and the spacing between adjacent contact pieces 32-34 at the inclined portion 53 gradually narrows from the base side to the tip side. It can also be said that the electrical circuit density at the inclined portion 53 gradually increases from the base side to the tip side. Since the gap at the tip side and the gap at the base side of the contact portion 52 are smoothly connected without the formation of a step, it results in an electrically advantageous structure.

[0050] In the contact component 30, the inclination angles of the inclined portions 53 of adjacent contact pieces 32 to 34 are different from each other. By appropriately setting the inclination angle, the distance L1 at the tip of the contact portion 52 can be easily adjusted.

[0051] In the contact component 30, the contact surfaces 52a (contacts) of the multiple contact pieces 32 to 34 elastically contact one of the module terminals 101 to 106 of the electrical component 100 being inspected. Since multiple contact surfaces 52a elastically make multi-point contact with one of the module terminals 101 to 103, stable contact performance can be obtained.

[0052] In the contact component 30, the spring portion 51 and the contact portion 52 each have a plate shape, and the multiple contact pieces 32 to 34 are arranged such that their respective spring portions 51 and contact portions 52 are aligned in the plate thickness direction. The shape of the contact area easily conforms to the shape of the module terminals 101 to 103, and efficient contact can be made with the contactable area of ​​the module terminals 101 to 103.

[0053] In the contact component 30, the gap at the tip of the contact portion 52 between adjacent contact pieces 32-34 and the gap in the spring portion 51 are formed using wires of different diameters. This makes it easy to create gaps with different spacings.

[0054] [Second Embodiment] In the inspection device 1 of the first embodiment, each contact section 10 (11-13) has one contact component 30. That is, for one of the module terminals 101-103, the contact pieces 32-34 are arranged in a single row in the width direction.

[0055] In contrast, in the second embodiment, as shown in Figure 5, the contact section 10 has four contact components 30. The four contact components 30 are arranged side by side within the width range of one of the module terminals 101 to 103. That is, for one of the module terminals 101 to 103, the contact pieces 32 to 34 are arranged in four rows in the width direction, and all the contact pieces 32 to 34 are electrically connected in parallel. In other words, the circuit electrically connected to one of the module terminals 101 to 103 is formed by dividing it in the width direction by the four contact components 30.

[0056] By electrically connecting multiple contact pieces 32-34 in parallel to one of the module terminals 101-103, the overall inductance of the contact section 10 is reduced, significantly reducing noise generated in the output signal. Therefore, the inspection accuracy of the electrical component 100 can be improved.

[0057] The configuration of the contact component 30 is, for example, the same as the contact component 30 shown in the first embodiment. In the second embodiment, a conventional contact may be used as the contact component 30.

[0058] In the contact portion 10 of the second embodiment, the contact pieces 32 to 34 are arranged in four rows in the width direction and three rows in the thickness direction of the contact pieces. In other words, the contact points of the contact portion 10 can make contact at 4 x 3 points. If the contact pieces are arranged in N rows in the width direction and M rows in the thickness direction, then N x M points of contact will be achieved.

[0059] Furthermore, it is sufficient that the contact pieces 32-34 of the four contact components 30 are arranged in a line in the width direction, and all the contact pieces 32-34 may be formed by branching from a single contact base 31.

[0060] In the contact section 10, the widths of each contact component 30 may be different (see Figure 6). In this case, the inductance reduction effect is enhanced, and the generation of noise in the output signal can be suppressed more effectively.

[0061] Furthermore, a metal shielding plate 60 may be placed between adjacent contact components 30 in the contact section 10. Preferably, the shielding plate 60 is grounded. In this case, the influence of mutual inductance between adjacent contact components 30 can be reduced, and the generation of noise in the output signal can be suppressed more effectively.

[0062] Furthermore, as shown in Figures 8 and 9, the multiple contact components 30 arranged in the width direction may be arranged with alternating offsets in the longitudinal direction or in the height direction. In this case as well, the influence of mutual inductance between adjacent contact components 30 can be reduced, and the generation of noise in the output signal can be suppressed more effectively.

[0063] Although the present invention has been specifically described above based on embodiments, the present invention is not limited to the above embodiments and can be modified without departing from its spirit.

[0064] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims rather than by the foregoing description, and all modifications within the meaning and scope equivalent to the claims are intended to be included. [Explanation of Symbols]

[0065] 1. Inspection device 10, 11-13 Contact area 20 Base section 30 Contact parts 31 Contact base 32-34 Contact pieces 40 Contact fixing part 51 Spring section 52 Contact area 53 Slope 100 Electrical Components 101-103 Module terminals

Claims

1. A contact component having multiple contact pieces branching from a base, Each of the aforementioned contact pieces includes a spring portion connected to the base and a contact portion having a contact point at its tip. The distance between the tip ends of the contact portions in adjacent contact pieces is different from the distance between the spring portions. Contact parts.

2. The electrical circuit density at the tip of the contact portion of the contact piece is different from the electrical circuit density of the spring portion. The contact component according to claim 1.

3. The distance at the tip of the contact portion is narrower than the distance of the spring portion. The contact component according to claim 1.

4. The distance at the tip of the contact portion is narrower than the distance at the base of the contact portion. The contact component according to claim 3.

5. The contact portion has an inclined portion formed by bending in a crank shape, and the distance between adjacent contact pieces at the inclined portion gradually narrows from the base side to the tip side. The contact component according to claim 4.

6. In adjacent contact pieces, the inclination angles of the respective inclined portions are different from each other. The contact component according to claim 5.

7. The contacts of the multiple contact pieces elastically contact one terminal of the electrical component being inspected. The contact component according to claim 1.

8. The spring portion and the contact portion each have a plate shape, The multiple contact pieces are arranged such that their respective spring portions and contact portions are aligned in the thickness direction. The contact component according to claim 1.

9. The gap at the tip of the contact portion in adjacent contact pieces and the gap in the spring portion are formed using wires of different diameters. The contact component according to claim 1.

10. A contact component having multiple contact pieces branching from a base, Each of the aforementioned contact pieces includes a spring portion connected to the base and a contact portion having a contact point at its tip. The electrical circuit density at the tip of the contact portion of the contact piece is different from the electrical circuit density of the spring portion. Contact parts.

11. A contact portion having the contact component described in claim 1, A module holding part that holds the electrical component so that the module terminal of the electrical component to be inspected and the contact of the contact part make contact, An inspection device equipped with the following features.

Citation Information

Patent Citations

  • Contact probe for power semiconductor measurement

    JP2013088245A