Onboard charger and inverter

Abstract

The objective is to enable heat dissipation of heat-generating electronic components while suppressing an increase in size, by using a heat dissipation mechanism that is integrally molded in a box shape and has an opening on only one side. [Solution] The heat dissipation structure 1 for heat-generating electronic components comprises a circuit board 9, electronic components 5a and 5b having lead wires 6a and 6b that self-heat when energized and are connected to the circuit board 9, an aluminum block 3 on which the heat dissipation surfaces of the electronic components 5a and 5b are in contact and on which the electronic components 5a and 5b are arranged, and a heat sink 2 which is integrally molded into a box shape and has a bottom surface F2 on which the aluminum block 3 is arranged, and an opening surface F1 facing the bottom surface F2, and dissipates heat from the aluminum block 3. The electronic components 5a and 5b are fixed to the aluminum block 3 from a direction other than the vertical direction D with respect to the bottom surface F2. The aluminum block 3 and the circuit board 9 are arranged along the vertical direction D, in the order of aluminum block 3 and circuit board 9 from the bottom surface F2.

Description

Technical Field

[0001] The present invention relates to an in-vehicle charger and an inverter.

Background Art

[0002] Conventionally, it is known to store a substrate and electronic components in a substantially rectangular parallelepiped housing formed of a heat dissipation member, and dissipate the heat generated from the electronic components through the housing. As a manufacturing method of such a structure of a substantially rectangular parallelepiped housing, there are two methods: a method of covering a housing with an upper surface and side surfaces integrally formed in a box shape and an opening formed in a lower surface from above, and a method of covering a housing with a lid member (upper surface) in a housing in which a lower surface (bottom surface) and side surfaces are integrally formed in a box shape and an upper surface is opened.

[0003] When using the method of covering a housing with an upper surface and side surfaces integrally formed in a box shape and an opening formed in a lower surface from above, when attaching a substrate or electronic components to the lower surface, since there are no side surfaces, it is possible to screw the electronic components from the side. However, on the other hand, there are restrictions on the arrangement of terminals (connectors) for electrically connecting the electronic components stored in the housing to the electronic components outside the housing.

[0004] Generally, when providing a connector on the side surface, it is preferable to use the method of covering a housing with a lid member (upper surface) in a housing in which a lower surface and side surfaces are integrally formed in a box shape and an upper surface is opened.

[0005] However, in the method of covering a housing with a lid member (upper surface) in a housing in which a lower surface and side surfaces are integrally formed in a box shape and an upper surface is opened, since the lower surface and side surfaces are integrally formed in a box shape, it is impossible to screw the electronic components from the side, and it is necessary to screw from the opened upper surface.

[0006] One possible method for securing electronic components with screws from the open top surface is to bend the lead wires of the heat-generating electronic component so that its heat-dissipating surface is in direct contact with the bottom surface, and then, for example, to screw an elastic member from above so that the elastic member disclosed in Patent Document 1 presses against the surface opposite to the heat-dissipating surface. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2002-217343 [Overview of the Initiative] [Problems that the invention aims to solve]

[0008] However, in the method of placing heat-generating electronic components on the bottom surface of the heat dissipation mechanism described above, the area of ​​the part where the heat-dissipating surface of the heat-generating electronic component makes contact with the bottom surface of the heat dissipation mechanism and the area where the elastic member is installed are required in order to ensure the heat dissipation effect. This may lead to an increase in the bottom surface area, and consequently, an increase in the overall size of the device.

[0009] The objective of the present invention is to provide an in-vehicle charger and inverter that can handle heat dissipation of heat-generating electronic components while suppressing an increase in size, by using a heat dissipation mechanism that is integrally molded in a box shape and has an opening on only one side. [Means for solving the problem]

[0010] An in-vehicle charger according to one aspect of the present invention includes a heat-generating electronic component, a heat transfer body on which the heat-generating electronic component is arranged, the heat transfer body having a housing portion provided with a space for housing a reactor component, the reactor component being thermally connected to a heat-dissipating component, and a potting material being filled between the reactor component and the housing portion so that the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body being thermally connected to the reactor component via the potting material via the third surface, and the heat-generating electronic component being fixed to the heat transfer body such that its longitudinal direction is parallel to a first direction perpendicular to the first surface of the heat-dissipating component. The invention provides a heat-generating electronic component, a heat transfer body on which the heat-generating electronic component is arranged, the heat transfer body having a housing portion provided with a space for housing a reactor component, the reactor component being thermally connected to a heat dissipation component, and a potting material being filled between the reactor component and the housing portion so that the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body being thermally connected to the reactor component via the potting material via the third surface, and a heat dissipation member being arranged between the heat transfer body and a circuit board. The invention provides a heat-generating electronic component, a heat transfer body on which the heat-generating electronic component is arranged, the heat transfer body having a housing portion provided with a space for housing a reactor component, the reactor component being thermally connected to a heat dissipation component, and a potting material being filled between the reactor component and the housing portion so as to thermally connect the reactor component and the heat transfer body by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body being thermally connected to the reactor component via the potting material via the third surface, an insulating and heat-dissipating member being arranged between the heat transfer body and a circuit board, and a pattern being formed on the circuit board at a location corresponding to the insulating and heat-dissipating member.

[0011] An inverter according to one aspect of the present invention includes a heat-generating electronic component, a heat transfer body on which the heat-generating electronic component is arranged, the heat transfer body having a housing portion provided with a space for housing a reactor component, the reactor component being thermally connected to a heat dissipation component, and the reactor component and the heat transfer body being thermally connected by the potting material by filling the space between the reactor component and the housing portion, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body being thermally connected to the reactor component via the potting material via the third surface, and the heat-generating electronic component being fixed to the heat transfer body such that its longitudinal direction is parallel to a first direction perpendicular to the first surface of the heat dissipation component. The invention provides a heat-generating electronic component, a heat transfer body on which the heat-generating electronic component is arranged, the heat transfer body having a housing portion provided with a space for housing a reactor component, the reactor component being thermally connected to a heat dissipation component, and the reactor component and the heat transfer body being thermally connected by the potting material by filling the space between the reactor component and the housing portion, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body being thermally connected to the reactor component via the potting material via the third surface, and the heat-generating electronic component being fixed to the heat transfer body such that its longitudinal direction is parallel to a first direction perpendicular to the first surface of the heat dissipation component. The circuit board comprises a heat-generating electronic component, a heat transfer body on which the heat-generating electronic component is arranged, the heat transfer body having a housing portion provided with a space for housing a reactor component, the reactor component being thermally connected to a heat-dissipating component, and a potting material being filled between the reactor component and the housing portion so as to thermally connect the reactor component and the heat transfer body by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body being thermally connected to the reactor component via the potting material via the third surface, an insulating and heat-dissipating member being arranged between the heat transfer body and the circuit board, and a pattern being formed on the circuit board at a location corresponding to the insulating and heat-dissipating member. [Effects of the Invention]

[0012] According to the present invention, when a heat dissipation mechanism is used that is integrally molded in a box shape and has an opening on only one side, it is possible to dissipate heat from heat-generating electronic components while suppressing an increase in size. [Brief explanation of the drawing]

[0013] [Figure 1] A perspective view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention. [Figure 2] Front view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention. [Figure 3] Side view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention. [Figure 4] A top perspective view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention. [Figure 5] A top perspective view showing an example of the heat dissipation structure configuration for a heat-generating electronic component according to Modification 1 of the present invention. [Figure 6] A top perspective view showing an example of the heat dissipation structure configuration for a heat-generating electronic component according to Modification 2 of the present invention. [Modes for carrying out the invention]

[0014] (Embodiment) Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0015] First, using FIGS. 1 to 4, a configuration example of a heat dissipation structure 1 of a heat-generating electronic component according to this embodiment will be described. FIG. 1 is a perspective view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. FIG. 2 is a front view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. FIG. 3 is a side view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. FIG. 4 is a top perspective view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. In FIGS. 1 and 2, the front part of the heat sink 2 is not shown, and in FIG. 3, the side part of the heat sink 2 is not shown. Also, in FIG. 4, the circuit board 9 shown in FIGS. 1 to 3 is not shown.

[0016] The heat dissipation structure 1 of the heat-generating electronic component is used, for example, in chargers, inverters, etc. mounted on vehicles. The heat dissipation structure 1 of the heat-generating electronic component includes a heat sink 2, an aluminum block 3, electronic components 5a, 5b, and a circuit board 9.

[0017] The heat sink 2 (an example of a heat dissipation mechanism) is integrally formed in a box shape, and an opening is provided only on one side. F1 is the opening surface (an example of the second surface), and F2 is the bottom surface (an example of the first surface) facing the opening surface F1.

[0018] At the four corners of the bottom surface F2 of the heat sink 2, columns 2a, 2b, 2c, and 2d are provided along the vertical direction D with respect to the bottom surface F2 (hereinafter simply referred to as the "vertical direction"). Thread holes (not shown) are formed in the columns 2a to 2d, and the circuit board 9 described later is screwed thereto.

[0019] The aluminum block 3 (an example of a heat transfer body) is a substantially rectangular parallelepiped member made of aluminum. The aluminum block 3 is disposed inside the heat sink 2 such that its longitudinal direction is along the vertical direction D.

[0020] The aluminum block 3 has a roughly rectangular fastening portion 3a at its lower end. This fastening portion 3a is screwed to the bottom surface F2 with screws 4a and 4b (an example of a fixing member). In this way, the aluminum block 3 is fixed in contact with the bottom surface F2.

[0021] Electronic components 5a and 5b (examples of heat-generating electronic components) are electronic components that generate heat on their own when current is applied, such as discrete components and FETs (Field Effect Transistors). Electronic components 5a and 5b each have lead wires 6a and 6b, respectively.

[0022] The electronic components 5a and 5b are attached to the aluminum block 3 such that their respective heat dissipation surfaces are in contact with the side surface of the aluminum block 3. For example, the electronic components 5a and 5b are pressed against the side surface of the aluminum block 3 by springs 7a and 7b (an example of retaining members), respectively, and are fixedly held in place by the side surface of the aluminum block 3. The springs 7a and 7b are screwed to the side surface of the aluminum block 3 by screws 8a and 8b, respectively.

[0023] The electronic components 5a and 5b, fixed to the aluminum block 3, are in an upright position along the vertical direction D. Furthermore, the electronic components 5a and 5b, fixed to the aluminum block 3, do not come into contact with the heatsink 2.

[0024] As described above, the heat generated from the electronic components 5a and 5b fixed to the aluminum block 3 is transferred to the heat sink 2 via the aluminum block 3. This enables heat dissipation from the electronic components 5a and 5b.

[0025] In Figures 1 to 4, two electronic components are shown as examples of being fixed to the aluminum block 3, but there may be one or three or more. Furthermore, multiple electronic components may be fixed not only to one surface but to multiple surfaces of the aluminum block 3.

[0026] The circuit board 9 is a printed circuit board on which patterns are formed and predetermined semiconductor elements (not shown) are mounted. The circuit board 9 is placed on the support pillars 2a to 2d described above. The circuit board 9 is then screwed to the pillars 2a to 2d with screws 10a, 10b, 10c, and 10d. In this way, the circuit board 9 is fixed to the support pillars 2a to 2d.

[0027] Furthermore, the circuit board 9 is connected to the lead wires 6a of electronic component 5a and the lead wires 6b of electronic component 5b, for example, by soldering.

[0028] The aluminum block 3 and the circuit board 9 are arranged along the vertical direction D, starting from the bottom surface F2, in the order of aluminum block 3 and circuit board 9.

[0029] Furthermore, the aluminum block 3 and the circuit board 9 are bonded and fixed to each other using adhesives 11a and 11b (an example of adhesive material). This increases the number of fixing points on the circuit board 9, preventing the lead wires 6a and 6b from breaking. This is particularly effective when the support columns 2a to 2d are high and vibrations are significant.

[0030] Furthermore, it is preferable that bonds 11a and 11b have at least one of either insulating or heat-dissipating properties. If bonds 11a and 11b have insulating properties, patterns can be formed or semiconductor elements can be mounted on the circuit board 9 at locations corresponding to bonds 11a and 11b. Also, if bonds 11a and 11b have heat-dissipating properties, heat generated on the circuit board 9 can be transferred to the aluminum block 3 via bonds 11a and 11b.

[0031] Although not shown in Figures 1 to 4, a cover that closes the opening surface F1 may be provided above the circuit board 9.

[0032] As described above, the heat dissipation structure 1 for heat-generating electronic components in this embodiment is arranged so that the heat dissipation surfaces of the electronic components 5a and 5b are in contact with the aluminum block 3 which is placed in contact with the heat sink 2. Therefore, compared to the case where the heat dissipation surfaces of the electronic components 5a and 5b are in contact with the bottom surface F2 of the heat sink 2, it is possible to handle heat dissipation of the electronic components while suppressing an increase in size.

[0033] The above describes an example of the configuration of the heat dissipation structure 1 for heat-generating electronic components.

[0034] Next, the manufacturing method for the heat dissipation structure 1 of the heat-generating electronic component will be explained using Figures 1 to 4.

[0035] First, the electronic components 5a and 5b are fixed and bonded to the aluminum block 3 using springs 7a and 7b and screws 8a and 8b. At this time, the heat dissipation surfaces of the electronic components 5a and 5b are brought into contact with the aluminum block 3. If the electronic components 5a and 5b are of a type that requires insulation, it is preferable to provide a heat dissipation insulating sheet (not shown) between the heat dissipation surfaces of the electronic components 5a and 5b and the aluminum block 3.

[0036] Next, the aluminum block 3 to which the electronic components 5a and 5b are fixed is placed inside the heat sink 2 through the opening F1 of the heat sink 2, and the aluminum block 3 is placed on the bottom surface F2. Then, the fastening portion 3a is screwed to the bottom surface F2 using screws 4a and 4b.

[0037] Next, the circuit board 9 is placed inside the heatsink 2 through the opening of the heatsink 2 and positioned on the support pillars 2a to 2d. At this time, the lead wires 6a and 6b are soldered to the circuit board 9. Then, the circuit board 9 is screwed to the support pillars 2a to 2d using screws 10a to 10d.

[0038] By the above manufacturing method, the heat dissipation structure 1 for the heat-generating electronic component shown in Figures 1 to 4 is manufactured.

[0039] Furthermore, after screwing the circuit board 9 in place, a cover (not shown) that closes the opening F1 may be provided above the circuit board 9.

[0040] Although embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications are possible. Modifications will be described below.

[0041] (Variation 1) The heat dissipation structure 1 for the heat-generating electronic component according to this modified example will be explained with reference to Figure 5. Figure 5 is a top perspective view showing an example of the heat dissipation structure 1 for the heat-generating electronic component according to this modified example. In Figure 5, the same reference numerals are used for the same components as in Figures 1 to 4, and their descriptions are omitted. Also, in Figure 5, the circuit board 9 shown in Figures 1 to 3 is not shown.

[0042] In this modified example, as shown in Figure 5, the heat sink 2 differs from those in Figures 1 to 4 in that it includes an aluminum block 30 and electronic components 32.

[0043] The aluminum block 30 has a roughly rectangular fastening portion 30a at its lower end. Although Figure 5 only shows the fastening portion 30a between support columns 2a and 2b, a similar fastening portion 30a also exists between support columns 2d and 2c.

[0044] The fastening portion 30a is screwed to the bottom surface F2 by a screw 31. As a result, the aluminum block 30 is fixed in contact with the bottom surface F2.

[0045] Furthermore, the aluminum block 30 has a housing section 30b which is a roughly rectangular parallelepiped space. Electronic components 32 (for example, reactor components; an example of a tall component) are housed in this housing section 30b. The bottom surface of the electronic components 32 are in contact with and fixed to the bottom surface F2 of the heat sink 2. Although not shown in the illustration, potting material is filled between the electronic components 32 and the housing section 30b.

[0046] The electronic component 32 is positioned upright between the bottom surface F2 and the circuit board 9 (see Figures 1 to 3) such that its longitudinal direction aligns with the vertical direction D (see Figures 1 to 3). Furthermore, the length of the electronic component 32 in the vertical direction D (the longitudinal length of the electronic component 32) is longer than the length of the electronic components 5a and 5b in the vertical direction D (the longitudinal length of the electronic components 5a and 5b).

[0047] In this way, by placing the electronic component 32 on the bottom surface F2, a space is created between the circuit board 9 and the bottom surface F2, allowing the aluminum block 3 to be placed in that space. Therefore, the heat dissipation structure 1 for the heat-generating electronic component does not become larger in the height direction (vertical direction D).

[0048] According to this modified example, in addition to the effects described in Embodiment 1, it is also possible to fix (vibration countermeasure) the electronic components 32 placed on the bottom surface F2 of the heat sink 2. Furthermore, if the potting material is a heat-dissipating potting material, both the fixing (vibration countermeasure) and heat dissipation of the electronic components 32 can be achieved.

[0049] (Modification 2) The heat dissipation structure 1 for the heat-generating electronic component according to this modified example will be explained with reference to Figure 6. Figure 6 is a top perspective view showing an example of the heat dissipation structure 1 for the heat-generating electronic component according to this modified example. In Figure 6, the same reference numerals are used for the same components as in Figures 1 to 4, and their descriptions are omitted. Also, in Figure 6, the circuit board 9 shown in Figures 1 to 3 is not shown.

[0050] In this modified example, as shown in Figure 6, the heat sink 2 is equipped with electronic components 33 and 34, which is different from Figures 1 to 4.

[0051] The electronic components 33 and 34 (for example, reactor components; an example of a tall component) are each fixed in contact with the bottom surface F2 of the heatsink 2.

[0052] Electronic components 33 and 34 are positioned upright between the bottom surface F2 and the circuit board 9 (see Figures 1 to 3) such that their longitudinal directions are aligned with the vertical direction D (see Figures 1 to 3). Furthermore, the length of electronic components 33 and 34 in the vertical direction D (the longitudinal length of electronic components 33 and 34) is longer than the length of electronic components 5a and 5b in the vertical direction D (the longitudinal length of electronic components 5a and 5b).

[0053] In this way, by arranging the electronic components 33 and 34 on the bottom surface F2, a space is created between the circuit board 9 and the bottom surface F2, allowing the aluminum block 3 to be placed in that space. Therefore, the heat dissipation structure 1 for the heat-generating electronic components does not become larger in the height direction (vertical direction D).

[0054] In this modified example, in addition to the effects described in Embodiment 1, heat can also be dissipated from the electronic components 33 and 34 located on the bottom surface F2 of the heat sink 2.

[0055] (Variation 3) In this embodiment, the case where air cooling is performed using the heatsink 2 was described as an example, but water cooling may be applied instead of air cooling.

[0056] (Modification 4) In the embodiment, the use of screws for fastening the aluminum block 3 to the bottom surface F2, fastening the springs 7a and 7b to the aluminum block 3, and fastening the circuit board 9 to the support pillars 2a to 2d was explained as an example, but adhesive may be used instead of screws. Also, in the embodiment, the use of springs for fixing the electronic components 5a and 5b to the aluminum block 3 was explained as an example, but screws may be used instead of springs.

[0057] (Variation 5) Furthermore, although the aluminum block 3 and the circuit board 9 were described as being fixed to each other by bonding with bonds 11a and 11b (an example of adhesive material), a heat dissipation material that does not have adhesive properties, such as grease or gap filler (an example of a heat dissipation material), may be provided between the aluminum block 3 and the circuit board 9. This allows heat generated on the circuit board 9 to be transferred to the aluminum block 3 via the grease or gap filler. In addition, if the grease or gap filler has insulating properties, patterns can be formed or semiconductor elements can be mounted on the circuit board 9 in the areas corresponding to the grease or gap filler. [Industrial applicability]

[0058] This invention is useful for in-vehicle chargers and inverters. [Explanation of Symbols]

[0059] 1. Heat dissipation structure for heat-generating electronic components 2 Heatsink 2a, 2b, 2c, 2d posts 3.30 Aluminum Block 3a, 30a fastening section 4a, 4b, 8a, 8b, 10a, 10b, 10c, 10d, 31 screws 5a, 5b Electronic components 6a, 6b lead wires 7a, 7b Springs 9 Circuit board 30b Storage area 32, 33, 34 Electronic components

Claims

1. Heat-generating electronic components, A heat transfer body on which the heat-generating electronic component is arranged, The heat transfer body has a housing section provided with a space for housing reactor components, The aforementioned reactor component is thermally connected to the heat dissipation component. The potting material is filled between the reactor component and the housing, so that the reactor component and the heat transfer element are thermally connected by the potting material. The heat transfer element has a second surface and a third surface. The heat transfer element is thermally connected to the heat-generating electronic component via the second surface. The heat transfer element is thermally connected to the reactor component by the potting material via the third surface. The heat-generating electronic component is fixed to the heat transfer body such that its longitudinal direction is parallel to a first direction perpendicular to the first surface of the heat dissipation component. On-board charger.

2. The heat transfer body is It is attached and fixed to the circuit board by an adhesive material. The in-vehicle charger according to claim 1.

3. The adhesive member is Having at least one of the properties of insulation or heat dissipation, The on-board charger according to claim 2.

4. A heat dissipation member is placed between the heat transfer element and the circuit board. An in-vehicle charger according to any one of claims 1 to 3.

5. A component having insulating and heat-dissipating properties is placed between the heat transfer element and the circuit board. In the circuit board, a pattern is formed in the location corresponding to the insulating and heat-dissipating member. An in-vehicle charger according to any one of claims 1 to 4.

6. The aforementioned insulating and heat-dissipating member also has adhesive properties. The on-board charger according to claim 5.

7. The aforementioned reactor component is a tall component, The length of the tall component in the first direction is longer than the length of the heat-generating electronic component in the first direction. The in-vehicle charger according to claim 1.

8. The reactor component is thermally connected to the heat dissipation component by the heat-dissipating potting material. The in-vehicle charger according to claim 1.

9. The heat transfer body holds the reactor component by a housing portion provided with a space for housing the reactor component. The in-vehicle charger according to claim 1.

10. The reactor component is thermally connected to the heat dissipation component via the housing. The on-board charger according to claim 9.

11. Heat-generating electronic components, A heat transfer body on which the heat-generating electronic component is arranged, The heat transfer body has a housing section provided with a space for housing reactor components, The aforementioned reactor component is thermally connected to the heat dissipation component. The potting material is filled between the reactor component and the housing, so that the reactor component and the heat transfer element are thermally connected by the potting material. The heat transfer element has a second surface and a third surface. The heat transfer element is thermally connected to the heat-generating electronic component via the second surface. The heat transfer element is thermally connected to the reactor component by the potting material via the third surface. A heat dissipation member is placed between the heat transfer element and the circuit board. On-board charger.

12. A component having insulating and heat-dissipating properties is placed between the heat transfer element and the circuit board. In the circuit board, a pattern is formed in the location corresponding to the insulating and heat-dissipating member. The in-vehicle charger according to claim 11.

13. The aforementioned insulating and heat-dissipating member also has adhesive properties. The in-vehicle charger according to claim 12.

14. Heat-generating electronic components, A heat transfer body on which the heat-generating electronic component is arranged, The heat transfer body has a housing section provided with a space for housing reactor components, The aforementioned reactor component is thermally connected to the heat dissipation component. The potting material is filled between the reactor component and the housing, so that the reactor component and the heat transfer element are thermally connected by the potting material. The heat transfer element has a second surface and a third surface. The heat transfer element is thermally connected to the heat-generating electronic component via the second surface. The heat transfer element is thermally connected to the reactor component by the potting material via the third surface. A component having insulating and heat-dissipating properties is placed between the heat transfer element and the circuit board. In the circuit board, a pattern is formed in the location corresponding to the insulating and heat-dissipating member. On-board charger.

15. The aforementioned insulating and heat-dissipating member also has adhesive properties. The in-vehicle charger according to claim 14.

16. Heat-generating electronic components, A heat transfer body on which the heat-generating electronic component is arranged, The heat transfer body has a housing section provided with a space for housing reactor components, The aforementioned reactor component is thermally connected to the heat dissipation component. By filling the space between the reactor component and the housing with potting material, the reactor component and the heat transfer element are thermally connected by the potting material. The heat transfer element has a second surface and a third surface. The heat transfer element is thermally connected to the heat-generating electronic component via the second surface. The heat transfer element is thermally connected to the reactor component by the potting material via the third surface. The heat-generating electronic component is fixed to the heat transfer body such that its longitudinal direction is parallel to a first direction perpendicular to the first surface of the heat dissipation component. Inverter.

17. Heat-generating electronic components, A heat transfer body on which the heat-generating electronic component is arranged, The heat transfer body has a housing section provided with a space for housing reactor components, The aforementioned reactor component is thermally connected to the heat dissipation component. By filling the space between the reactor component and the housing with potting material, the reactor component and the heat transfer element are thermally connected by the potting material. The heat transfer element has a second surface and a third surface. The heat transfer element is thermally connected to the heat-generating electronic component via the second surface. The heat transfer element is thermally connected to the reactor component by the potting material via the third surface. The heat-generating electronic component is fixed to the heat transfer body such that its longitudinal direction is parallel to a first direction perpendicular to the first surface of the heat dissipation component. Inverter.

18. Heat-generating electronic components, A heat transfer body on which the heat-generating electronic component is arranged, The heat transfer body has a housing section provided with a space for housing reactor components, The aforementioned reactor component is thermally connected to the heat dissipation component. By filling the space between the reactor component and the housing with potting material, the reactor component and the heat transfer element are thermally connected by the potting material. The heat transfer element has a second surface and a third surface. The heat transfer element is thermally connected to the heat-generating electronic component via the second surface. The heat transfer element is thermally connected to the reactor component by the potting material via the third surface. A component having insulating and heat-dissipating properties is placed between the heat transfer element and the circuit board. In the circuit board, a pattern is formed in the location corresponding to the insulating and heat-dissipating member. Inverter.

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