Wiring board and method for manufacturing a wiring board

Abstract

This invention discloses a technology that can suppress the generation of metal burrs on the cut surface of the plain portion when a base substrate containing multiple product areas is cut along a cutting line. [Solution] One aspect of the invention is a wiring board comprising a plurality of conductive layers and a plain portion disposed on each of the plurality of conductive layers and exposed on the outer edge of the wiring board, wherein each of the plain portions has an uneven surface formed thereon along its outer edge, with recesses and protrusions arranged alternately.

Claims

1. Multiple conductive layers, A wiring board comprising: a plane portion disposed on each of the plurality of conductive layers and exposed on the outer edge of the wiring board, Each of the aforementioned plain portions has an uneven surface formed along its outer edge, in which recesses and protrusions are arranged alternately.

2. A wiring board according to claim 1, When viewed from the thickness direction of the wiring board, the recesses and protrusions are arranged alternately.

3. A wiring board according to claim 1, The protrusions formed on adjacent plain portions in the stacking direction are arranged so as not to overlap when viewed from the stacking direction.

4. A wiring board according to claim 2, In the direction in which the recesses and protrusions are aligned, the lengths of each recess and each protrusion are approximately the same.

5. A wiring board according to claim 1, The recess is filled with insulating resin.

6. A wiring board according to claim 1, The uneven portions of the plurality of conductive layers are offset from the thickness direction of the wiring board such that the number of protrusions that overlap in the uneven portions when viewed from the thickness direction of the wiring board is less than the total number of the plurality of conductive layers.

7. A method for manufacturing a wiring board, wherein a base substrate having multiple conductive layers is cut on a dicing line and divided into multiple wiring boards, A solid conductor is arranged across the plurality of conductive layers, and the dicing line is crossed by a solid conductor. Multiple through holes are formed in the solid conductor, arranged along the dicing line. This includes the arrangement of the through holes being offset between adjacent conductive layers among the plurality of conductive layers.

8. A method for manufacturing a wiring board according to claim 7, The base substrate is cut using a dicing blade.

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