Image acquisition device

Abstract

The present invention provides an image acquisition device that can suppress the effects of radio waves generated by a radio wave source while suppressing an increase in the size of the device. [Solution] The image acquisition device comprises a transport path that slopes downward from an upstream position to a downstream position in the media transport direction, a first imaging unit that captures an image of the media, a circuit board located below the transport path and on which a plurality of electronic components of different heights are arranged, and a first shielding member located above the plurality of electronic components to attenuate radio waves generated by the first imaging unit. The first electronic component located below the upstream position in the media transport direction is mounted on the upstream portion of the circuit board, and the second electronic component located below a position downstream of the upstream position in the media transport direction is mounted on the downstream portion of the circuit board. The second electronic component is shorter than the first electronic component, and the first shielding member slopes downward from the first electronic component to the second electronic component, covering the upper side of the plurality of electronic components.

Description

Technical Field

[0001] The present invention relates to an image pickup apparatus.

Background Art

[0002] Patent Document 1 discloses an image pickup apparatus including an image reading unit that reads an image of a document being conveyed along a document conveyance path, a display unit that can display the read image of the document, and a circuit board having at least one of functions of driving and controlling the image reading unit. In this image pickup apparatus, the display unit and the circuit board are disposed substantially parallel to the document conveyance path, respectively.

[0003] Patent Document 2 discloses a document reading apparatus including an automatic document feeder, a reading unit of a reduction optical system disposed inside the automatic document feeder, a scanner frame that partitions the inside and outside of the reading unit, and a conversion unit disposed inside the scanner frame that converts an image signal read by the reading unit.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] In an image pickup apparatus, it is required to suppress an increase in the size of the apparatus and to suppress the influence of radio waves generated by a radio wave generation source.

[0006] [[ID=4,7]]An object of the present invention is to provide an image pickup apparatus capable of suppressing an increase in the size of the apparatus and suppressing the influence of radio waves generated by a radio wave generation source.

Means for Solving the Problems

[0007] An image capturing device according to one aspect of the present invention is an image capturing device for capturing an image of a medium being transported, comprising: a transport path that slopes downward from an upstream position to a downstream position in the medium transport direction; a first imaging unit for capturing an image of the medium; a circuit board disposed below the transport path and on which a plurality of electronic components of different heights are arranged; and a first shielding member disposed above the plurality of electronic components for attenuating radio waves generated by the first imaging unit, wherein the first electronic component located below the upstream position in the medium transport direction is mounted on the upstream portion of the circuit board, and the second electronic component located below a position downstream of the upstream position in the medium transport direction is mounted on the downstream portion of the circuit board, the second electronic component is shorter than the first electronic component, and the first shielding member slopes downward from the first electronic component to the second electronic component and covers the upper side of the plurality of electronic components. [Effects of the Invention]

[0008] According to the present invention, the image acquisition device can suppress the influence of radio waves generated by a radio wave source while suppressing an increase in the size of the device. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view showing an image acquisition device according to an embodiment. [Figure 2] This is a diagram illustrating the transport path inside the image acquisition device. [Figure 3] This is a schematic diagram illustrating the processing circuit board and shielding member. [Figure 4] This is a schematic diagram illustrating the processing circuit board and shielding member. [Figure 5] This is a schematic diagram illustrating the processing circuit board and shielding member. [Figure 6] This is a schematic diagram to explain straight lines. [Figure 7] This is a schematic diagram showing a modified example of the second imaging device. [Figure 8]It is a perspective view of a processing circuit board or the like seen from above and upstream. [Figure 9] It is a perspective view of a processing circuit board or the like seen from the side. [Figure 10] It is a block diagram showing a schematic configuration of an image pickup device. [Figure 11] It is a diagram showing a schematic configuration of a storage device and a processing circuit. [Figure 12] It is a flowchart showing an example of the operation of media reading processing. [[ID=第十四条]] [Figure 13] It is a schematic diagram showing another image pickup device. [Figure 14] It is a diagram for explaining the internal structure of an image pickup device. [Figure 15] It is a diagram showing a schematic configuration of another processing circuit. [Figure 16A] It is a diagram showing the arrangement of electronic components on a processing circuit board. [Figure 16B] It is a diagram showing the arrangement of electronic components on a processing circuit board. [Figure 16C] It is a diagram showing the arrangement of electronic components on a processing circuit board.

Mode for Carrying Out the Invention

[0010] Hereinafter, an image pickup device according to one aspect of the present invention will be described with reference to the drawings. However, it should be noted that the technical scope of the present invention is not limited to those embodiments, and extends to the invention described in the claims and its equivalents.

[0011] FIG. 1 is a perspective view showing an image pickup device configured as an image scanner.

[0012] The image pickup device 100 has a function of picking up an image while conveying a medium which is an original, and a function of picking up an image without conveying a medium placed on a transparent placement surface. The medium is paper, cardboard, card, booklet, passport, or the like. The image pickup device 100 may be a facsimile or the like.

[0013] In Figure 1, arrow A1 indicates the media transport direction, arrow A2 indicates the width direction perpendicular to the media transport direction, and arrow A3 indicates the height direction perpendicular to the media transport path. Arrow A4 indicates the horizontal direction, and arrow A5 indicates the vertical direction. Hereafter, "upstream" refers to the direction upstream of the media transport direction A1, and "downstream" refers to the direction downstream of the media transport direction A1. The width direction A2 is an example of a direction intersecting the media transport direction.

[0014] The image acquisition device 100 includes a first housing 101, a second housing 102, a first mounting base 103, a cover 104, an operating device 105, and a display device 106, etc.

[0015] The first housing 101 and the parts provided within the first housing 101 are examples of an automatic document feeder (ADF) type imaging device and scanner unit, which capture images while transporting the medium. The second housing 102 and the parts provided within the second housing 102 are examples of a flatbed device and scanner unit, which capture images of a medium placed on a transparent mounting surface without transporting it. The first housing 101 is positioned on top of the second housing 102. The first housing 101 has a lower housing 101a and an upper housing 101b. The upper housing 101b is positioned to cover the top surface of the image capturing device 100 and is engaged with the lower housing 101a by a hinge so that it can be opened and closed when the medium is jammed, when cleaning the inside of the image capturing device 100, etc.

[0016] The first mounting platform 103 engages with the lower housing 101a and places the medium to be transported in the first housing 101 on it.

[0017] The cover 104 engages with the second housing 102 by a hinge so that it can be opened and closed relative to the second housing 102. When closed relative to the second housing 102, the cover 104 covers the top surface of the second housing 102 and functions as a discharge platform for placing media discharged from the first housing 101. On the other hand, when open relative to the second housing 102, the cover 104 opens the top surface of the second housing 102 so that a user can place media on the top surface of the second housing 102.

[0018] The operating device 105 has input devices such as mechanical buttons and an interface circuit that acquires signals from the input devices, accepts operations from the user, and outputs signals corresponding to the user's operations. The display device 106 has output devices such as LEDs (Light-Emitting Diodes) and an interface circuit that controls the output devices, and turns the LEDs on or off according to instructions from the processing circuit described later. Instead of LEDs, the display device 106 may have output devices such as displays made of liquid crystal, organic EL (Electro-Luminescence), etc., and an interface circuit that outputs image data to the output devices, and may display a predetermined image according to instructions from the processing circuit. In that case, the operating device 105 may have input devices such as touch panels and an interface circuit that acquires signals from the input devices instead of mechanical buttons.

[0019] Figure 2 is a diagram illustrating the internal structure of the image acquisition device.

[0020] The image acquisition device 100 further includes a first medium sensor 110, a feeding roller 111, a separation roller 112, a first transport roller 113, a second transport roller 114, a second medium sensor 115, a first image acquisition device 116, a first discharge roller 117, a second discharge roller 118, a second mounting base 119, and a second image acquisition device 120. The first medium sensor 110, the feeding roller 111, the separation roller 112, the first transport roller 113, the second transport roller 114, the second medium sensor 115, the first image acquisition device 116, the first discharge roller 117, and the second discharge roller 118 are provided in the first housing 101. The second mounting base 119 and the second image acquisition device 120 are provided in the second housing 102.

[0021] The feeding roller 111, separating roller 112, first conveying roller 113, second conveying roller 114, first discharge roller 117, and second discharge roller 118 are an example of a conveying section that conveys a medium along the conveying path. The number of each of the feeding roller 111, separating roller 112, first conveying roller 113, second conveying roller 114, first discharge roller 117, and / or second discharge roller 118 is not limited to one, but may be multiple. In that case, the multiple feeding rollers 111, separating roller 112, first conveying roller 113, second conveying roller 114, first discharge roller 117, and / or second discharge roller 118 are arranged side by side with a gap in the width direction A2.

[0022] The upper surface of the lower housing 101a forms the lower guide 101c of the medium transport path, and the lower surface of the upper housing 101b forms the upper guide 101d of the medium transport path. The medium transport path has a so-called straight path mechanism in which the vertical positional relationship between the front and back surfaces of the medium does not change between the state before transport when the medium is placed on the first mounting stage 103 and the state after discharge when the medium is placed on the cover 104. The medium transport path is inclined such that the upstream side in the medium transport direction A1 is at a higher position in the height direction A3, and the downstream side in the medium transport direction A1 is at a lower position in the height direction A3. That is, the medium transport path is inclined downward from the upstream position to the downstream position in the medium transport direction A1. In addition, the supply port and discharge port of the medium transport path are inclined in the same direction so as to face downstream and downward, respectively. Because the media transport path has a straight-path mechanism, the image acquisition device 100 can efficiently transport media with thickness, such as cardboard, cards, or passports. Furthermore, because the media transport path has a straight-path mechanism, the image acquisition device 100 can place a large quantity of media on the first loading platform 103 at once and transport them continuously.

[0023] The first medium sensor 110 is positioned upstream of the feeding roller 111 and the separation roller 112. The first medium sensor 110 has a contact detection sensor and detects whether or not a medium is placed on the first mounting base 103. The first medium sensor 110 generates and outputs a first medium signal whose signal value changes depending on whether or not a medium is placed on the first mounting base 103. Note that the first medium sensor 110 is not limited to a contact detection sensor, and any other sensor capable of detecting the presence or absence of a medium, such as a light detection sensor, may be used as the first medium sensor 110.

[0024] The feeding roller 111 and the separating roller 112 are examples of a feeding unit and a separating unit. The feeding roller 111 is provided on the lower housing 101a and separates and feeds the medium placed on the first mounting base 103 from the bottom up. The separating roller 112 is a so-called brake roller or retard roller and is positioned on the upper housing 101b opposite to the feeding roller 111 and separates the medium placed on the first mounting base 103. The separating roller 112 is provided so as to be rotatable or stoppable in the opposite direction A6 of the medium feeding direction. Alternatively, the feeding roller 111 may be located on the upper housing and the separating roller 112 on the lower housing, and the feeding roller 111 may separate and feed the medium placed on the first mounting base 103 from the top up. Also, a separating pad may be used instead of the separating roller 112.

[0025] The first transport roller 113 and the second transport roller 114 are examples of transport units. The first transport roller 113 and the second transport roller 114 are arranged facing each other downstream of the feeding roller 111 and the separation roller 112 in the medium transport direction A1. The first transport roller 113 and the second transport roller 114 transport the medium fed by the feeding roller 111 and the separation roller 112 to the first imaging device 116.

[0026] The second medium sensor 115 is positioned downstream of the first transport roller 113 and the second transport roller 114 and upstream of the first imaging device 116, and detects the leading and trailing ends of the medium transported to that position. The second medium sensor 115 includes a light emitter and a light receiver provided on one side of the medium transport path, and a light guide member provided opposite the light emitter and light receiver across the medium transport path. The light guide member is a light guide tube such as a U-shaped prism. The light emitter is an LED or the like, which emits light toward the transport path. On the other hand, the light receiver is a photodiode or the like, which receives the light emitted by the light emitter and guided by the light guide member. When the medium is located opposite the second medium sensor 115, the light emitted from the light emitter is blocked by the medium, so the light receiver does not detect the light emitted from the light emitter. The light receiver generates and outputs a second medium signal whose signal value changes depending on whether a medium is present or absent at the position of the second medium sensor 115, based on the intensity of the received light.

[0027] Furthermore, a reflective member such as a mirror may be used instead of the light guide member. Also, the light emitter and light receiver may be positioned opposite each other across the transport path. In addition, the second medium sensor 115 may detect the presence of the medium by using a contact detection sensor or the like that which supplies a predetermined current when the medium is in contact or when the medium is not in contact.

[0028] The first imaging device 116 images the medium transported by the first transport roller 113 and the second transport roller 114. The first imaging device 116 includes a lower imaging device 116a and an upper imaging device 116b, which are arranged opposite each other across the medium transport path. Details of the first imaging device 116 will be described later.

[0029] The first discharge roller 117 and the second discharge roller 118 are examples of discharge sections. The first discharge roller 117 and the second discharge roller 118 are arranged facing each other downstream from the first imaging device 116. The first discharge roller 117 and the second discharge roller 118 are conveyed by the first transport roller 113 and the second transport roller 114, and discharge the medium imaged by the first imaging device 116 onto the cover 104.

[0030] The media placed on the first loading platform 103 is transported between the lower guide 101c and the upper guide 101d toward the media transport direction A1 by the rotation of the feeding roller 111 in the media feeding direction. The separation roller 112 rotates or stops in the opposite direction to the media feeding direction during media feeding. Due to the action of the feeding roller 111 and the separation roller 112, when multiple media are placed on the first loading platform 103, only the media that are in contact with the feeding roller 111 are separated. This restricts the transport of media other than the separated media (preventing double feeding).

[0031] The medium is fed between the first transport roller 113 and the second transport roller 114, guided by the lower guide 101c and the upper guide 101d. The medium is then fed between the lower imaging device 116a and the upper imaging device 116b as the first transport roller 113 and the second transport roller 114 rotate. The medium read by the first imaging device 116 is discharged onto the cover 104 as the first discharge roller 117 and the second discharge roller 118 rotate.

[0032] The second mounting platform 119 is provided on the upper surface of the second housing 102 so that a medium can be placed on it. The second mounting platform 119 is made of a light-transmitting material such as transparent glass or plastic. The mounting surface of the second mounting platform 119 is provided so as to extend in the same direction as the bottom surface of the second housing 102, that is, so as to extend in the same direction as horizontal A4.

[0033] The second imaging device 120 is provided to move horizontally along the extending direction of the mounting surface of the second mounting table 119 and images the medium placed on the second mounting table 119. Details of the second imaging device 120 will be described later.

[0034] Figures 3 to 5 are schematic diagrams illustrating the processing circuit board and shielding member.

[0035] As shown in Figures 3 to 5, the image acquisition device 100 further includes a processing circuit board 121, a first shielding member 122, and a second shielding member 123. The processing circuit board 121, the first shielding member 122, and the second shielding member 123 are provided in the lower housing 101a.

[0036] The lower imaging device 116a includes a lower imaging sensor 116c and a lower imaging sensor circuit board 116e, etc. The lower imaging sensor 116c is a 1:1 optical system type CIS (Contact Image Sensor) imaging sensor having CMOS (Complementary Metal Oxide Semiconductor) image elements arranged linearly in the main scanning direction. The lower imaging device 116a further includes a lens that forms an image on the image element and an A / D converter that amplifies the electrical signal output from the image element and performs analog-to-digital (A / D) conversion. The lower imaging sensor 116c and the A / D converter capture the surface of the transported medium to generate and output a first input image. The lower imaging sensor circuit board 116e is a printed circuit board on which electronic components and / or conductors, including the lower imaging sensor 116c and the A / D converter, are mounted. Electronic components include CPUs (Central Processing Units), ICs (Integrated Circuits), LSIs (Large Scale Integrations), SoCs (System on a Chip), RAMs (Random Access Memory), ROMs (Read Only Memory), resistors, coils, capacitors, and other components. Conductors include wiring patterns or bonding wires formed on a circuit board by printing.

[0037] Similarly, the upper imaging device 116b includes an upper imaging sensor 116d and an upper imaging sensor circuit board 116f, etc. The upper imaging sensor 116d is a CIS imaging sensor of the 1:1 optical system type, having CMOS image sensors arranged linearly in the main scanning direction. The upper imaging device 116b further includes a lens that forms an image on the image sensor and an A / D converter that amplifies the electrical signal output from the image sensor and performs analog-to-digital (A / D) conversion. The upper imaging sensor 116d and the A / D converter capture the back surface of the transported medium to generate and output a first input image. The upper imaging sensor circuit board 116f is a printed circuit board on which electronic components and / or conductors, including the upper imaging sensor 116d and the A / D converter, are mounted.

[0038] The lower image sensor 116c and the upper image sensor 116d are examples of image sensors provided in the first imaging unit and scanner unit of the automatic document transport device, and capture images of the transported medium. The electronic components and / or conductors mounted on the lower image sensor circuit board 116e and the electronic components and / or conductors mounted on the upper image sensor circuit board 116f are examples of first radio wave sources, and generate predetermined radio waves. The image acquisition device 100 may also have only one of the lower image sensor 116a and the upper image sensor 116b, and read only one side of the medium. Furthermore, a line sensor with a CIS of the 1:1 optical system type equipped with a CCD (Charge Coupled Device) image sensor may be used as the image sensor. Alternatively, a line sensor with a reduction optical system type equipped with a CMOS or CCD image sensor may be used as the image sensor.

[0039] The second imaging device 120 includes a second imaging sensor 120a, a second imaging sensor circuit board 120b, and an interface circuit board 120c, etc. The second imaging sensor 120a is a reduction optical system type imaging sensor having image elements made of CCD arranged linearly in the main scanning direction. The second imaging device 120 further includes one or more mirrors that reflect incident light, a lens that forms an image on the image element, and an A / D converter that amplifies the electrical signal output from the image element and performs analog-to-digital (A / D) conversion. The second imaging sensor 120a and the A / D converter capture images of the medium placed on the second mounting stage 119 to generate a second input image and output it to the interface circuit board 120c. The second imaging sensor circuit board 120b is a printed circuit board on which electronic components and / or conductors, including the second imaging sensor 120a and the A / D converter, are mounted. The interface circuit board 120c has an interface circuit that outputs (relays) the input information, and outputs the second input image output from the second image sensor 120a and the A / D converter, i.e., from the second image sensor circuit board 120b, to the processing circuit board 121. The interface circuit board 120c is a printed circuit board on which electronic components and / or conductors, including the interface circuit, are mounted.

[0040] The second imaging sensor 120a is an example of a second imaging unit provided in a flatbed apparatus, and captures an image of the medium. The electronic components and / or conductors mounted on the second imaging sensor circuit board 120b and the electronic components and / or conductors mounted on the interface circuit board 120c are an example of a second radio wave source, and generate predetermined radio waves. A reduction optical system type line sensor equipped with a CMOS image sensor may be used as the imaging sensor. Alternatively, a 1:1 optical system type CIS line sensor equipped with a CCD or CMOS image sensor may be used as the imaging sensor.

[0041] The second imaging device 120 is provided so as to be movable in the horizontal direction A4, i.e., in the sub-scanning direction, by a second drive device described later. Figures 3 to 5 show the second imaging device 120 in its upstream position (right side in Figures 3 to 5). The second imaging sensor circuit board 120b is always located downstream of the processing circuit board 121. The second imaging sensor circuit board 120b is also provided below the processing circuit board 121.

[0042] The processing circuit board 121 is an example of a circuit board. The processing circuit board 121 is placed below the transport path for the medium. Interface devices, memory devices, and processing circuits, etc., which will be described later, are mounted on the processing circuit board 121. As an example, the processing circuit board 121 is provided so as to extend parallel to the bottom surface of the second housing 102, that is, so as to extend parallel to the horizontal direction A4. The processing circuit board 121 does not have to be provided so as to extend parallel to the bottom surface of the second housing 102. In the medium transport direction A1, the processing circuit board 121 is provided so as to overlap at least a part of the lower image sensor circuit board 116e or the upper image sensor circuit board 116f. In addition, in the horizontal direction A4, the processing circuit board 121 is provided so as to overlap at least a part of the second image sensor circuit board 120b or the interface circuit board 120c.

[0043] The first shielding member 122 is positioned above a plurality of electronic components arranged on the processing circuit board 121. The first shielding member 122 is positioned opposite the processing circuit board 121 so as to cover the upper surface of the processing circuit board 121, shielding the processing circuit board 121 and blocking (or attenuating) radio waves directed towards the processing circuit board 121 from above. The first shielding member 122 has a surface resistance value of 10 10 Made of a resin with a surface resistance of Ω or less, a component coated to form an electrically conductive film, or a metal (surface resistance value of 10 10(This includes resins with a resistance of Ω or less, members coated to form an electrically conductive film, or metals.) By being formed from these materials, the first shield member 122 can effectively block (or attenuate) radio waves emitted from the lower image sensor circuit board 116e and the upper image sensor circuit board 116f. In particular, the first shield member 122 can attenuate radio waves generated by the lower image sensor 116c and the upper image sensor 116d. By forming the first shield member 122 from resin, the image acquisition device 100 can be made lighter and have greater design flexibility. On the other hand, by forming the first shield member 122 from metal, the image acquisition device 100 can reduce the surface resistance of the first shield member 122 and further improve the radio wave blocking (or attenuation) performance.

[0044] The first shielding member 122 is provided between the lower image sensor circuit board 116e and the upper image sensor circuit board 116f and the processing circuit board 121. That is, the first shielding member 122 is provided between the lower image sensor 116c and the upper image sensor 116d and the electronic components and / or conductors mounted on the processing circuit board 121. In the medium transport direction A1, the first shielding member 122 is positioned to overlap with at least a portion of the lower image sensor circuit board 116e or the upper image sensor circuit board 116f. As a result, the first shielding member 122 can effectively suppress the arrival of radio waves emitted from the lower image sensor circuit board 116e and the upper image sensor circuit board 116f to the processing circuit board 121.

[0045] As shown in Figure 3, the first shield member 122 is positioned to intersect with a straight line L1, which connects the upstream end of an electronic component or conductor (right end in Figure 3) mounted on the lower image sensor circuit board 116e to the upstream end of an electronic component or conductor mounted on the processing circuit board 121, when viewed from the width direction A2. In Figure 3, the end of the straight line L1 points to the upstream end of the lower image sensor circuit board 116e, not the lower image sensor 116c mounted on the lower image sensor circuit board 116e. This is because, generally, conductors (e.g., wiring patterns) mounted on a circuit board extend to the vicinity of the edge of the circuit board. When multiple objects, each being an electronic component or conductor, are mounted on a circuit board, the starting or ending point of the straight line L1 is the upstream end of the most upstream of those multiple objects. This also applies to other straight lines described later. Furthermore, the first shielding member 122 is positioned so as to intersect with a straight line L2 that connects the downstream end (left end in Figure 3) of an electronic component or conductor mounted on the lower image sensor circuit board 116e to the downstream end of an electronic component or conductor mounted on the processing circuit board 121, when viewed from the width direction A2. Straight lines L1 and L2 are examples of the first and second straight lines. As a result, the first shielding member 122 can suppress the arrival of radio waves emitted from the lower image sensor circuit board 116e to the processing circuit board 121.

[0046] The upstream end, downstream end, top end, bottom end, left end, and right end of an electronic component or conductor mounted on each circuit board are the most upstream, downstream, top, bottom, left, and right positions, respectively, among the locations on each circuit board where electronic components and conductors are mounted. The upstream end, downstream end, top end, bottom end, left end, and right end of an electronic component or conductor mounted on each circuit board may also be the most upstream, downstream, top, bottom, left, and right positions, respectively, among the locations on each circuit board where electronic components are mounted. The upstream end, downstream end, top end, bottom end, left end, and right end of an electronic component or conductor mounted on each circuit board may also be the most upstream, downstream, top, bottom, left, and right positions, respectively, among the locations on each circuit board where major electronic components (CPU, LSI, SoC, ROM, or RAM) are mounted. The upstream, downstream, upper, lower, left, and right ends of electronic components or conductors mounted on each circuit board may also be the upstream, downstream, upper, lower, left, and right end positions of each electronic component mounted on each circuit board. The upstream, downstream, upper, lower, left, and right ends of electronic components or conductors mounted on each circuit board may also be the upstream, downstream, upper, lower, left, and right end positions of each major electronic component mounted on each circuit board. The upstream, downstream, upper, lower, left, and right ends of electronic components or conductors mounted on each circuit board may also be the most upstream, downstream, upper, lower, left, and right positions, respectively, of the positions where conductors are mounted on each circuit board. The upstream end, downstream end, upper end, lower end, left end, and right end of an electronic component or conductor mounted on each circuit board may also be the upstream, downstream, upper, lower, left, and right end positions of a continuous conductor mounted on each circuit board, respectively.

[0047] Furthermore, the first shielding member 122 is positioned so as to intersect with a straight line L3 connecting the upstream end of an electronic component or conductor mounted on the upper image sensor circuit board 116f and the upstream end of an electronic component or conductor mounted on the processing circuit board 121, when viewed from the width direction A2. Also, the first shielding member 122 is positioned so as to intersect with a straight line L4 connecting the downstream end of an electronic component or conductor mounted on the upper image sensor circuit board 116f and the downstream end of an electronic component or conductor mounted on the processing circuit board 121, when viewed from the width direction A2. Straight lines L3 and L4 are examples of the first and second straight lines. As a result, the first shielding member 122 can suppress the arrival of radio waves emitted from the upper image sensor circuit board 116f to the processing circuit board 121.

[0048] Figure 6 is a schematic diagram illustrating the concept of a straight line.

[0049] As shown in Figure 6, the straight line L1 may be set to connect the lower end of the upstream end of the electronic component or conductor mounted on the lower image sensor circuit board 116e and the upper end of the upstream end of the electronic component or conductor mounted on the processing circuit board 121, when viewed from the width direction A2. Similarly, the straight line L2 shown in Figure 3 may be set to connect the lower end of the downstream end of the electronic component or conductor mounted on the lower image sensor circuit board 116e and the upper end of the downstream end of the electronic component or conductor mounted on the processing circuit board 121, when viewed from the width direction A2. Similarly, the straight line L3 shown in Figure 3 may be set to connect the lower end of the upstream end of the electronic component or conductor mounted on the upper image sensor circuit board 116f and the upper end of the upstream end of the electronic component or conductor mounted on the processing circuit board 121, when viewed from the width direction A2. Similarly, the straight line L4 shown in Figure 3 may be set to connect the lower end of the downstream end of an electronic component or conductor mounted on the upper imaging sensor circuit board 116f and the upper end of the downstream end of an electronic component or conductor mounted on the processing circuit board 121, when viewed from the width direction A2. The ends of straight line L1 and straight line L3 may be located at the upper ends of the upstream ends of electronic components or conductors mounted on each circuit board, and the ends of straight line L2 and straight line L4 may be located at the upper ends of the downstream ends of electronic components or conductors mounted on each circuit board.

[0050] Furthermore, as shown in Figure 4, the first shielding member 122 is provided so as to intersect with a straight line L11 that extends from the upstream end of an electronic component or conductor mounted on the lower image sensor circuit board 116e in a direction perpendicular to the extending direction of the lower image sensor circuit board 116e, when viewed from the width direction A2. Also, the first shielding member 122 is provided so as to intersect with a straight line L12 that extends from the downstream end of an electronic component or conductor mounted on the lower image sensor circuit board 116e in a direction perpendicular to the extending direction of the lower image sensor circuit board 116e, when viewed from the width direction A2. Straight lines L11 and L12 are examples of the first and second straight lines. As a result, the first shielding member 122 can suppress the arrival of radio waves emitted from the lower image sensor circuit board 116e to the processing circuit board 121.

[0051] Furthermore, the first shielding member 122 is positioned so as viewed from the width direction A2, that it intersects with a straight line L13 extending from the upstream end of an electronic component or conductor mounted on the upper image sensor circuit board 116f in a direction perpendicular to the extending direction of the upper image sensor circuit board 116f. Also, the first shielding member 122 is positioned so as to intersect with a straight line L14 extending from the downstream end of an electronic component or conductor mounted on the upper image sensor circuit board 116f in a direction perpendicular to the extending direction of the upper image sensor circuit board 116f. Straight lines L13 and L14 are examples of the first and second straight lines. As a result, the first shielding member 122 can suppress the arrival of radio waves emitted from the upper image sensor circuit board 116f to the processing circuit board 121.

[0052] Furthermore, as shown in Figure 5, the first shield member 122 is provided so as to intersect a straight line L21 that extends perpendicular to the extending direction of the processing circuit board 121, from the upstream end of the electronic components or conductors mounted on the processing circuit board 121 toward the lower image sensor circuit board 116e and the upper image sensor circuit board 116f, when viewed from the width direction A2. Also, the first shield member 122 is provided so as to intersect a straight line L22 that extends perpendicular to the extending direction of the processing circuit board 121, from the downstream end of the electronic components or conductors mounted on the processing circuit board 121 toward the lower image sensor circuit board 116e and the upper image sensor circuit board 116f, when viewed from the width direction A2. Straight lines L21 and L22 are examples of the first and second straight lines. As a result, the first shielding member 122 can suppress the arrival of radio waves emitted from the lower image sensor circuit board 116e and the upper image sensor circuit board 116f to the processing circuit board 121.

[0053] Furthermore, the first shield member 122 only needs to be positioned to satisfy at least one of the above-described positioning conditions.

[0054] As described above, the transport path for the medium is inclined such that the upstream side in the medium transport direction A1 is at a higher position in the vertical direction A5, and the downstream side in the medium transport direction A1 is at a lower position in the vertical direction A5. On the other hand, the processing circuit board 121 is provided, for example, to extend parallel to the horizontal direction A4. Therefore, the transport path is inclined such that the distance from the processing circuit board 121 is greater on the upstream side in the medium transport direction A1, and the distance is smaller on the downstream side in the medium transport direction A1. The direction in which the distance from the processing circuit board 121 is greater on the upstream side in the medium transport direction A1 and smaller on the downstream side in the medium transport direction A1 is an example of a predetermined direction.

[0055] The first shield member 122 is inclined with respect to the processing circuit board 121 such that the distance increases towards the upstream side in the medium transport direction A1 and decreases towards the downstream side in the medium transport direction A1. That is, the first shield member 122 has an inclined surface 122a that is inclined with respect to the processing circuit board 121 in the same direction as the medium transport path is inclined. The first shield member 122 is provided such that the angle it makes with the processing circuit board 121 is greater than 5° and 50° or less.

[0056] Multiple electronic components of different heights are arranged on the processing circuit board 121. If the first shield member 122 is provided parallel to the processing circuit board 121, the first shield member 122 must be positioned so that it is located at a distance from the processing circuit board 121 greater than the height of the tallest component, from the upstream end to the downstream end. On the other hand, since the upper surface of the lower housing 101a is inclined to form a straight path, the upstream portion of the upper surface of the lower housing 101a must be positioned higher than the downstream portion. The downstream portion of the upper surface of the lower housing 101a must be taller than the height of the tallest component, and the upstream portion of the upper surface of the lower housing 101a must be taller than the downstream portion, so the overall height of the device becomes significantly larger.

[0057] On the other hand, in the image acquisition device 100, the first shield member 122 is inclined with respect to the processing circuit board 121 in the same direction as the medium transport path. Therefore, in the image acquisition device 100, by arranging taller components on the upstream side and shorter components on the downstream side of the processing circuit board 121, it is possible to sufficiently reduce the height of the downstream portion of the first shield member 122. As a result, the height of the downstream portion of the lower housing 101a is sufficiently reduced, and the height of the upstream portion of the lower housing 101a can be suppressed, so the overall height of the image acquisition device 100 can be reduced.

[0058] The second shielding member 123 is positioned opposite the processing circuit board 121 so as to cover the lower surface of the processing circuit board 121, shielding the processing circuit board 121 and blocking (or attenuating) radio waves directed towards the processing circuit board 121 from below. The second shielding member 123 has a surface resistance value of 10 10 Made of a resin with a surface resistance of Ω or less, a component coated to form an electrically conductive film, or a metal (surface resistance value of 10 10 (This includes resins with a resistance of Ω or less, members coated to form an electrically conductive film, or metals.) By being formed from these materials, the second shielding member 123 can effectively block (or attenuate) radio waves emitted from the second image sensor circuit board 120b and the interface circuit board 120c. In particular, the second shielding member 123 can attenuate radio waves from the second image sensor 120a. By forming the second shielding member 123 from resin, the image acquisition device 100 can be made lighter and have greater design flexibility. On the other hand, by forming the second shielding member 123 from metal, the image acquisition device 100 can reduce the surface resistance of the second shielding member 123 and further improve the radio wave blocking (or attenuation) performance.

[0059] The second shielding member 123 is provided between the second image sensor circuit board 120b and the interface circuit board 120c and the processing circuit board 121. That is, the second shielding member 123 is provided between the second image sensor 120a and the electronic components and / or conductors mounted on the processing circuit board 121. The second shielding member 123 is positioned so as to overlap at least a portion of the second image sensor circuit board 120b or the interface circuit board 120c in the horizontal direction A4. As a result, the second shielding member 123 can suppress the arrival of radio waves emitted from the second image sensor circuit board 120b and the interface circuit board 120c to the processing circuit board 121.

[0060] As shown in Figure 3, the second shielding member 123 is positioned so as to intersect with a straight line L5 connecting the upstream end of an electronic component or conductor mounted on the interface circuit board 120c and the upstream end of an electronic component or conductor mounted on the processing circuit board 121, when viewed from the width direction A2. The second shielding member 123 is also positioned so as to intersect with a straight line L6 connecting the downstream end of an electronic component or conductor mounted on the interface circuit board 120c and the downstream end of an electronic component or conductor mounted on the processing circuit board 121, when viewed from the width direction A2. Straight lines L5 and L6 are examples of the third and fourth straight lines. As a result, the second shielding member 123 can suppress the arrival of radio waves emitted from the interface circuit board 120c to the processing circuit board 121.

[0061] Furthermore, the second shielding member 123 is positioned so as to intersect with a straight line L7 connecting the lower end of an electronic component or conductor mounted on the second image sensor circuit board 120b and the upstream end of an electronic component or conductor mounted on the processing circuit board 121, when viewed from the width direction A2. Also, the second shielding member 123 is positioned so as to intersect with a straight line L8 connecting the upper end of an electronic component or conductor mounted on the second image sensor circuit board 120b and the downstream end of an electronic component or conductor mounted on the processing circuit board 121, when viewed from the width direction A2. Straight lines L7 and L8 are examples of a third and fourth straight line. As a result, the second shielding member 123 can suppress the arrival of radio waves emitted from the second image sensor circuit board 120b to the processing circuit board 121.

[0062] Similar to the example of line L1 explained using Figure 6, line L5 may be set to connect the upper or lower end of the upstream end of an electronic component or conductor mounted on the interface circuit board 120c to the lower end of the upstream end of an electronic component or conductor mounted on the processing circuit board 121, as viewed from width direction A2. Similarly, line L6 may be set to connect the upper or lower end of the downstream end of an electronic component or conductor mounted on the interface circuit board 120c to the lower end of the downstream end of an electronic component or conductor mounted on the processing circuit board 121, as viewed from width direction A2. Similarly, line L7 may be set to connect the upstream or downstream end of the lower end of an electronic component or conductor mounted on the second imaging sensor circuit board 120b to the lower end of the upstream end of an electronic component or conductor mounted on the processing circuit board 121, as viewed from width direction A2. Similarly, the straight line L8 may be set to connect the upstream or downstream end of the upper end of an electronic component or conductor mounted on the second imaging sensor circuit board 120b to the lower end of the downstream end of an electronic component or conductor mounted on the processing circuit board 121, as viewed from the width direction A2.

[0063] Furthermore, as shown in Figure 4, the second shielding member 123 is positioned so as to intersect with a straight line L15 that extends perpendicular to the direction of extension of the interface circuit board 120c from the upstream end of an electronic component or conductor mounted on the interface circuit board 120c, when viewed from the width direction A2. The second shielding member 123 is also positioned so as to intersect with a straight line L16 that extends perpendicular to the direction of extension of the interface circuit board 120c from the downstream end of an electronic component or conductor mounted on the interface circuit board 120c, when viewed from the width direction A2. Straight lines L15 and L16 are examples of the third and fourth straight lines. As a result, the second shielding member 123 can suppress the arrival of radio waves emitted from the interface circuit board 120c to the processing circuit board 121.

[0064] Furthermore, the second shielding member 123 does not intersect with the straight line L17 that extends from the lower end of an electronic component or conductor mounted on the second image sensor circuit board 120b in a direction perpendicular to the extending direction of the second image sensor circuit board 120b, as viewed from the width direction A2. Also, the second shielding member 123 does not intersect with the straight line L18 that extends from the upper end of an electronic component or conductor mounted on the second image sensor circuit board 120b in a direction perpendicular to the extending direction of the second image sensor circuit board 120b, as viewed from the width direction A2. However, since the straight lines L17 and L18 do not intersect with the processing circuit board 121, the second shielding member 123 can suppress the arrival of radio waves emitted from the second image sensor circuit board 120b to the processing circuit board 121, even though it does not intersect with the straight lines L17 and L18.

[0065] Figure 7 is a schematic diagram showing a modified version of the second imaging device.

[0066] As shown in Figure 7, the extension direction of the second imaging sensor circuit board 120b of the second imaging device 120 is inclined with respect to the vertical direction. The second shielding member 123 is provided so as to intersect with a straight line L17 that extends perpendicular to the extension direction of the second imaging sensor circuit board 120b from the upstream end of the electronic components or conductors mounted on the second imaging sensor circuit board 120b, when viewed from the width direction A2. The second shielding member 123 is also provided so as to intersect with a straight line L18 that extends perpendicular to the extension direction of the second imaging sensor circuit board 120b from the downstream end of the electronic components or conductors mounted on the second imaging sensor circuit board 120b, when viewed from the width direction A2. Straight lines L17 and L18 are examples of the third and fourth straight lines. As a result, the second shielding member 123 can suppress the arrival of radio waves emitted from the second imaging sensor circuit board 120b to the processing circuit board 121.

[0067] Furthermore, as shown in Figure 5, the second shielding member 123 is provided so as to intersect a straight line L23 that extends perpendicular to the extending direction of the processing circuit board 121, from the upstream end of the electronic components or conductors mounted on the processing circuit board 121 toward the interface circuit board 120c and the second image sensor circuit board 120b, when viewed from the width direction A2. Also, the second shielding member 123 is provided so as to intersect a straight line L24 that extends perpendicular to the extending direction of the processing circuit board 121, from the downstream end of the electronic components or conductors mounted on the processing circuit board 121 toward the interface circuit board 120c and the second image sensor circuit board 120b, when viewed from the width direction A2. Straight lines L23 and L24 are examples of the third and fourth straight lines. As a result, the second shielding member 123 can suppress the arrival of radio waves emitted from the interface circuit board 120c and the second image sensor circuit board 120b on the processing circuit board 121.

[0068] Furthermore, the second shield member 123 only needs to be positioned to satisfy at least one of the above-described positioning conditions.

[0069] The second shield member 123 is provided substantially parallel to the processing circuit board 121. "Subject to approximate parallelism" does not mean perfectly parallel, but includes forming an angle of less than or equal to a predetermined angle (e.g., 5°).

[0070] As described above, by arranging tall components on the upstream side of the upper surface of the processing circuit board 121 and mounting only short components on the lower surface of the processing circuit board 121, the image capturing device 100 can sufficiently reduce the distance between the processing circuit board 121 and the bottom surface of the first housing 101, thereby reducing the overall height of the device.

[0071] Furthermore, by arranging the processing circuit board 121 and the second shielding member 123 substantially parallel to each other, the image acquisition device 100 can obtain the radio wave effect due to parallel plate resonance, thereby reducing the influence of radio waves.

[0072] Figure 8 is a perspective view of the processing circuit board, the first shield member, and the second shield member from above and the upstream side.

[0073] As shown in Figure 8, the first shield member 122 covers the upper surface of the processing circuit board 121 across both ends of the processing circuit board 121 in the width direction A2. The second shield member 123 covers the lower surface of the processing circuit board 121 across both ends of the processing circuit board 121 in the width direction A2. The first shield member 122 may be provided with one or more holes 122b. Similarly, the second shield member 123 may be provided with one or more holes. As a result, the image capturing device 100 can release the heat emitted from the processing circuit board 121 from the area surrounded by the first shield member 122 and the second shield member 123, thereby suppressing malfunctions caused by heat.

[0074] The image acquisition device 100 further includes an upstream shielding member 124, a downstream shielding member 125, and a lateral shielding member 126. The upstream shielding member 124 covers the upstream side of the processing circuit board 121, shielding the processing circuit board 121 and blocking (or attenuating) radio waves traveling from the upstream side to the processing circuit board 121. The downstream shielding member 125 covers the downstream side of the processing circuit board 121, shielding the processing circuit board 121 and blocking (or attenuating) radio waves traveling from the downstream side to the processing circuit board 121. The lateral shielding member 126 covers both ends of the processing circuit board 121 in the width direction A2, shielding the processing circuit board 121 and blocking (or attenuating) radio waves traveling from the side to the processing circuit board 121. The upstream shielding member 124, the downstream shielding member 125, and / or the lateral shielding member 126 have a surface resistance value of 10 10 It is made of a resin with a density of Ω or less, a material coated to form an electrically conductive film, or a metal. The upstream shield member 124, the downstream shield member 125, and / or the lateral shield member 126 may be provided with holes or gaps to release heat emitted from the processing circuit board 121. The upstream shield member 124, the downstream shield member 125, and / or the lateral shield member 126 may be omitted.

[0075] Figure 9 is a side view of the processing circuit board with the first shielding member removed.

[0076] Various circuit components are mounted on the processing circuit board 121. In particular, among the components mounted on the processing circuit board 121, components 121a with a height of a predetermined height or more, such as connectors and capacitors, are placed on the upstream side of the upper surface of the processing circuit board 121. Each component 121a is placed in an area where the distance from the first shield member 122 is a predetermined distance or more. The predetermined height is set to a height higher than that of a typical IC or LSI (e.g., 1 cm). The predetermined distance is set to the height of each component 121a plus a margin (e.g., 1 cm). On the other hand, only components with a height less than the predetermined height are placed on the downstream side of the upper surface of the processing circuit board 121 and on the lower surface of the processing circuit board 121. For example, the first receiving circuit that receives the first medium signal from the first medium sensor 110 and / or the second receiving circuit that receives the second medium signal from the second medium sensor 115, as described later, are placed on the lower surface of the processing circuit board 121, i.e., the surface on the second shield member 123 side. By arranging the circuits that process the first and second medium signals, which are susceptible to radio wave interference, on the lower surface of the processing circuit board 121, the image capturing device 100 can suppress the occurrence of malfunctions.

[0077] As described above, the first shield member 122 is inclined with respect to the processing circuit board 121 in the same direction as the medium transport path. The first shield member 122 is positioned at an inclination such that the size of the space between the processing circuit board 121 and the first shield member 122 is minimized while components are mounted on the processing circuit board 121. Alternatively, the first shield member 122 is positioned at an inclination such that the sum of the distances between the first shield member 122 and the upper surfaces of the components mounted on the processing circuit board 121 is minimized. As a result, the image capturing device 100 can efficiently utilize the space inside the lower housing 101a by placing components 121a with a height of a predetermined height or more on the upstream side of the upper surface of the processing circuit board 121, thereby reducing the overall height of the device. Furthermore, the image capturing device 100 can reduce the overall height of the device by placing components with a height less than the predetermined height on the lower surface of the processing circuit board 121, thereby reducing the distance between the processing circuit board 121 and the bottom surface of the lower housing 101a.

[0078] Furthermore, by positioning the first shielding member 122 such that the size of the space between the processing circuit board 121 and the first shielding member 122 is minimized, the image capturing device 100 can suppress the occurrence of cavity resonance and reduce the effects of radio waves.

[0079] Figures 16A, 16B, and 16C show the arrangement of electronic components of different heights on the processing circuit board, viewed from a direction intersecting the media transport direction.

[0080] Figures 16A, 16B, and 16C show examples of the arrangement of electronic components 121a-1 to 121a-7, in which taller electronic components are mounted on the upstream portion of the processing circuit board 121, positioned below the upstream position in the media transport direction A1, and shorter electronic components are mounted on the downstream portion of the processing circuit board 121, positioned below the downstream position in the media transport direction A1. Specifically, the first electronic component located below the upstream position in the media transport direction A1 is mounted on the upstream portion of the upstream part of the processing circuit board 121, and the second electronic component, which is shorter than the first component and located below the downstream position downstream of the upstream position in the media transport direction A1, is mounted on the downstream portion of the processing circuit board 121, further downstream than the upstream part.

[0081] The angle of the media transport direction A1 in Figures 16A to 16C with respect to the installation surface on which the image acquisition device 100 is installed is gentler compared to other drawings such as Figure 3, and is approximately parallel to the first shield member 122. However, the first shield member 122 and the media transport direction A1 only need to be inclined in the same direction, and the first shield member 122 does not need to be approximately parallel to the first shield member 122.

[0082] In Figure 16A, in the media transport direction A1, the tallest electronic component 121a-1 is located furthest upstream of the electronic components 121a-1 to 121a-7, the electronic components 121a-2 to 121a-6 are arranged in descending order toward the downstream side, and the shortest electronic component 121a-7 is located furthest downstream of the electronic components 121a-1 to 121a-7.

[0083] In Figure 16B, the tallest electronic component 121a-1 is located furthest upstream, while the shorter electronic components 121a-2 to 121a-7 are located downstream of 121a-1. The electronic components 121a-2 to 121a-7, despite their different heights, do not need to be arranged in order of height.

[0084] In Figure 16C, the tallest electronic component 121a-1 is located furthest upstream, and the relatively short electronic component 121a-7 is located furthest downstream. Electronic components 121a-2 to 121a-6, positioned between them, are shorter than electronic components 121a-1 and 121a-7.

[0085] The electronic component located furthest upstream in the media transport direction A1 does not necessarily have to be the tallest of multiple electronic components. The number of electronic components is not limited to the illustrated example, and any desired number of electronic components can be mounted.

[0086] As shown in Figures 16A, 16B, and 16C, the first shielding member 122 is inclined downward from taller electronic components to shorter electronic components, covering the upper side of each electronic component.

[0087] Figure 10 is a block diagram showing the schematic configuration of an image acquisition device.

[0088] In addition to the configuration described above, the image capturing device 100 further includes a first receiving circuit 131, a second receiving circuit 132, a first drive unit 133, a second drive unit 134, an interface device 135, a storage device 140, and a processing circuit 150, among others.

[0089] The first receiving circuit 131 includes an A / D converter, etc., which amplifies analog electrical signals and performs analog-to-digital (A / D) conversion. The first receiving circuit 131 receives the analog first medium signal output from the first medium sensor 110, converts the received first medium signal into a digital signal, and outputs it to the processing circuit 150.

[0090] The second receiving circuit 132 includes an A / D converter, etc., which amplifies the analog electrical signal and performs analog-to-digital (A / D) conversion. The second receiving circuit 132 receives the analog second medium signal output from the second medium sensor 115, converts the received second medium signal into a digital signal, and outputs it to the processing circuit 150.

[0091] The first drive unit 133 is an example of a drive unit. The first drive unit 133 includes one or more motors. The first drive unit 133 generates driving force to rotate the feed roller 111, the separation roller 112, the first transport roller 113, the second transport roller 114, the first discharge roller 117 and / or the second discharge roller 118 in response to a control signal from the processing circuit 150. The first drive unit 133 is, for example, a DC motor. The first drive unit 133 may also be a stepping motor. The second transport roller 114 and / or the second discharge roller 118 may be driven rollers that rotate in accordance with the first transport roller 113 and the first discharge roller 117, respectively. Alternatively, the first transport roller 113 and / or the first discharge roller 117 may be driven rollers that rotate in accordance with the second transport roller 114 and the second discharge roller 118, respectively.

[0092] The second drive unit 134 is an example of a drive unit. The second drive unit 134 includes one or more motors. The second drive unit 134 generates a driving force to move the second imaging device 120 horizontally based on a control signal from the processing circuit 150. The second drive unit 134 is, for example, a DC motor. The second drive unit 134 may also be a stepping motor.

[0093] Interface device 135 is an example of a communication unit. Interface device 135 has an interface circuit equivalent to a serial bus such as USB (Universal Serial Bus). Interface device 135 electrically connects to an external information processing device (e.g., a personal computer, a portable information terminal, etc.) to transmit and receive a first input image, a second input image, and various types of information. Interface device 135 may have an antenna for transmitting and receiving wireless signals and a wireless communication interface circuit for transmitting and receiving signals through a wireless communication line according to a predetermined communication protocol. The predetermined communication protocol is, for example, a wireless LAN (Local Area Network). Interface device 135 may also have a wired communication interface circuit for transmitting and receiving signals through a wired communication line according to a communication protocol such as a wired LAN.

[0094] The storage device 140 includes memory devices such as RAM and ROM, fixed disk devices such as hard disks, or portable storage devices such as flexible disks and optical disks. The storage device 140 also stores computer programs, databases, tables, etc., used for various processes of the image acquisition device 100. The computer programs may be installed into the storage device 140 from a computer-readable portable recording medium using a known setup program. Examples of portable recording media include CD-ROMs (compact disc read-only memory) and DVD-ROMs (digital versatile disc read-only memory). Furthermore, the computer programs may be distributed from a server or the like and installed into the storage device 140.

[0095] The processing circuit 150 operates based on a program pre-stored in the memory device 140. The processing circuit is, for example, a CPU. A DSP (Digital Signal Processor), LSI, ASIC (Application Specific Integrated Circuit), FPGA (Field-Programmable Gate Array), etc., may be used as the processing circuit 150.

[0096] The processing circuit 150 is connected to the operating device 105, display device 106, first imaging device 116, second imaging device 120, first receiving circuit 131, second receiving circuit 132, first drive device 133, second drive device 134, interface device 135, and storage device 140, and controls each of these components. Based on the operation signals received from the operating device 105 or the interface device 135 and / or the media signals received from each receiving circuit, the processing circuit 150 performs drive control of each drive device, imaging control of each imaging device, etc. The processing circuit 150 acquires each input image from each imaging device and transmits it to the information processing device via the interface device 135.

[0097] The first receiving circuit 131, the second receiving circuit 132, the interface device 135, the storage device 140, and / or the processing circuit 150 are mounted on the processing circuit board 121. The first receiving circuit 131, the second receiving circuit 132, the interface device 135, the storage device 140, and / or the processing circuit 150 are mounted on the downstream side of the upper surface of the processing circuit board 121, or on the lower surface of the processing circuit board 121. The connector connected to the interface device 135 is mounted on the upstream side of the upper surface of the processing circuit board 121.

[0098] Figure 11 shows a schematic configuration of the memory device and processing circuit.

[0099] As shown in Figure 11, the storage device 140 stores the control program 141, the image acquisition program 142, and the like. Each of these programs is a functional module implemented by software running on the processor. The processing circuit 150 reads each program stored in the storage device 140 and operates according to each program it has read. As a result, the processing circuit 150 functions as the control unit 151 and the image acquisition unit 152.

[0100] Figure 12 is a flowchart showing an example of the operation of the media reading process of an image acquisition device.

[0101] The following describes an example of the operation of the media reading process of the image acquisition device 100, referring to the flowchart shown in Figure 12. The operation flow described below is mainly executed by the processing circuit 150 in cooperation with each element of the image acquisition device 100, based on a program that is pre-stored in the storage device 140.

[0102] First, the control unit 151 determines whether or not it has received a first operation signal instructing the ADF to read the medium (step S101). The control unit 151 determines whether or not the user has input an instruction to read the medium using the ADF via the operating device 105 or information processing device, and whether or not it has received a first operation signal from the operating device 105 or interface device 135.

[0103] When the first operation signal is received, the control unit 151 acquires a first medium signal from the first receiving circuit 131 and determines whether or not a medium is placed on the first mounting stage 103 based on the acquired first medium signal (step S102). If no medium is placed on the first mounting stage 103, the control unit 151 proceeds to step S108. In this case, as will be described later, the control unit 151 causes the second imaging device 120 to image the medium placed on the second mounting stage 119, and the image acquisition unit 152 acquires a second input image from the second imaging device 120.

[0104] On the other hand, when a medium is placed on the first mounting table 103, the control unit 151 controls the first drive unit 133 to rotate each roller and transport the medium (step S103). The control unit 151 drives the first drive unit 133 to rotate the feeding roller 111, the separating roller 112, the first transport roller 113, the second transport roller 114, the first discharge roller 117 and / or the second discharge roller 118.

[0105] Next, the image acquisition unit 152 causes the first imaging device 116 to image the medium and acquires a first input image from the first imaging device 116. The image acquisition unit 152 outputs the acquired first input image by transmitting it to the information processing device via the interface device 135 (step S104). The image acquisition unit 152 periodically acquires a second medium signal from the second receiving circuit 132. When the signal value of the second medium signal changes from a value indicating the absence of medium to a value indicating the presence of medium, the image acquisition unit 152 determines that the leading edge of the medium has passed the position of the second medium sensor 115 and causes the first imaging device 116 to start imaging the medium. On the other hand, when the signal value of the second medium signal changes from a value indicating the presence of medium to a value indicating the absence of medium, the image acquisition unit 152 determines that the trailing edge of the medium has passed the position of the second medium sensor 115. The image acquisition unit 152 determines that the rear end of the medium has passed the position of the second medium sensor 115, and when a predetermined time has elapsed, it instructs the first imaging device 116 to terminate imaging of the medium. The predetermined time is set to the time required for the medium to move from the position of the second medium sensor 115 to the imaging position of the first imaging device 116.

[0106] Next, the control unit 151 acquires a first medium signal from the first receiving circuit 131 and determines whether or not there is any medium remaining on the first mounting tray 103 based on the acquired first medium signal (step S105). If there is any medium remaining on the first mounting tray 103, the control unit 151 returns to step S104 and repeats the processing from step S104 onward.

[0107] On the other hand, if there is no medium remaining on the first mounting table 103, the control unit 151 controls the first drive unit 133 to stop each roller (step S106) and returns the process to step S101. The control unit 151 stops the first drive unit 133 and stops the separation roller 112, the first transport roller 113, the second transport roller 114, the first discharge roller 117 and / or the second discharge roller 118.

[0108] If the first operation signal was not received in step S101, the control unit 151 determines whether or not it has received a second operation signal instructing the flatbed to read the medium (step S107). The control unit 151 determines whether or not the user has input an instruction to read the medium using the flatbed via the operating device 105 or information processing device, and whether or not it has received a second operation signal from the operating device 105 or interface device 135.

[0109] If a second operation signal is received from the operating device 105, or if no medium was placed on the first mounting table 103 in step S102, the control unit 151 controls the second drive unit 134 to move the second imaging device 120 in the sub-scanning direction (step S108). The control unit 151 drives the second drive unit 134 to move the second imaging device 120 from the initial position (the leftmost position in Figure 2) to the imaging completion position (the position of the second imaging device 120 in Figure 2).

[0110] Next, the image acquisition unit 152 causes the second imaging device 120 to image the medium placed on the second mounting stage 119, and acquires a second input image from the second imaging device 120. The image acquisition unit 152 outputs the acquired second input image by transmitting it to the information processing device via the interface device 135 (step S109).

[0111] Next, the control unit 151 controls the second drive unit 134 to return the second imaging device 120 to its initial position and stop it (step S110), and then returns to step S101. The control unit 151 drives the second drive unit 134 to move the second imaging device 120 from the imaging end position to the initial position, and then stops the second drive unit 134 to stop the second imaging device 120.

[0112] In step S102, if no medium is placed on the first mounting stage 103, the control unit 151 may return to step S101 without performing imaging of the medium.

[0113] As described in detail above, the image capturing device 100 includes a first shielding member 122 provided between the first radio wave source and the processing circuit board 121, and a second shielding member 123 provided between the second radio wave source and the processing circuit board 121. The first shielding member 122 has an inclined surface that is tilted in the same direction as the medium transport path with respect to the processing circuit board 121. As a result, the image capturing device 100 can efficiently utilize the space inside the device by placing components 121a with a height of a predetermined height or more on the upstream side of the upper surface of the processing circuit board 121, making it possible to reduce the overall height of the device. Therefore, the image capturing device 100 is able to suppress the influence of radio waves generated by each radio wave source while suppressing an increase in the size of the device.

[0114] In recent years, image acquisition devices have been required to have various functions such as detecting transport abnormalities such as skew, jams, and double feeds of the medium, and correcting the skew of the medium. In the image acquisition device 100, numerous components are mounted on the processing circuit board 121 to realize these functions, which increases the size of the processing circuit board 121. On the other hand, the image acquisition device 100 with a so-called straight-path mechanism is compactly designed. Therefore, it is difficult to position the processing circuit board 121 within the image acquisition device 100 so as not to be affected by radio waves from each radio wave source. In the image acquisition device 100, by positioning the first shielding member 122 and the second shielding member 123 between the processing circuit board 121 and each radio wave source, the influence of radio waves from each radio wave source on the processing circuit board 121 is suppressed. Furthermore, by tilting the first shielding member 122 in the same direction as the transport path of the medium with respect to the processing circuit board 121, the image acquisition device 100 can suppress the influence of radio waves generated by each radio wave source while suppressing an increase in the size of the device.

[0115] Furthermore, the image acquisition device 100 supports both ADF-type and flatbed-type imaging, while suppressing malfunctions caused by radio waves emitted from the imaging sensors used for each type of imaging or from the circuit board on which each imaging sensor is mounted.

[0116] Figure 13 is a schematic diagram showing an image acquisition device according to another embodiment.

[0117] The image acquisition device 200 according to this embodiment has the function of capturing an image while transporting a medium that is a document, the function of capturing an image without transporting a medium placed on a transparent mounting surface, and the function of forming an image on a medium that is a sheet of paper while transporting it. The image acquisition device 200 may be a copier, a printer / multifunction device (MFP, Multifunction Peripheral), etc.

[0118] The image acquisition device 200 includes a first housing 201, a second housing 202, a first mounting platform 203, a first discharge platform 204, an operation display device 205, a third housing 206, a third mounting platform 207, a third discharge platform 208, and the like.

[0119] The first housing 201 and the components provided within it are examples of an automatic document transport device and scanner unit, performing ADF-type imaging while transporting the medium. The second housing 202 and the components provided within it are examples of a flatbed device and scanner unit, performing flatbed-type imaging without transporting the medium placed on a transparent mounting surface. The third housing 206 and the components provided within it are examples of an automatic document transport device and printer unit, performing image formation on the medium while transporting it.

[0120] The first housing 201 is positioned on top of the second housing 202, and the second housing 202 is positioned on top of the third housing 206. The first housing 201 is engaged with the second housing 202 by a hinge so that it can be opened and closed relative to the second housing 202. When closed, the first housing 201 covers the top surface of the second housing 202, and when open, it opens the top surface of the second housing 202 so that a user can place a medium on the top surface of the second housing 202.

[0121] The first mounting platform 203 engages with the first housing 201 and places the medium being transported within the first housing 201 on it. The first discharge platform 204 engages with the first housing 201 and places the medium discharged from the first housing 201 on it.

[0122] The operation display device 205 has an output device such as a liquid crystal display or organic EL display and an interface circuit that outputs image data to the output device, and displays a predetermined image according to instructions from the processing circuit. The operation display device 205 also has an input device such as a touch panel and an interface circuit that acquires signals from the input device, accepts operations from the user and outputs a signal corresponding to the user's operations. The operation display device 205 is installed in the third housing 206, that is, below the first housing 201 and the second housing 202. The operation display device 205 has an operation display device circuit board. The operation display device circuit board is a printed circuit board on which electronic components and / or conductors, including the interface circuit described above, are mounted. The electronic components and / or conductors mounted on the operation display device circuit board are an example of a second radio wave source and generate predetermined radio waves.

[0123] The third mounting platform 207 is retractably provided in the third housing 206 and is used to place (store) media being transported within the third housing 206. The third discharge platform 208 engages with the third housing 206 and is used to place media discharged from the third housing 206.

[0124] Figure 14 is a diagram illustrating the internal structure of the image acquisition device.

[0125] The image acquisition device 200 includes a first medium sensor 210, a feeding roller 211, a separation roller 212, a first transport roller 213, a second transport roller 214, a second medium sensor 215, a first image acquisition device 216, a first discharge roller 217, a second discharge roller 218, a second mounting base 219, a second image acquisition device 220, a processing circuit board 221, a first shielding member 222, a second shielding member 223, a third transport roller 224, a fourth transport roller 225, a printing device 226, a third discharge roller 227, and a fourth discharge roller 228, among others. The first medium sensor 210, feeding roller 211, separation roller 212, first transport roller 213, second transport roller 214, second medium sensor 215, first imaging device 216, first discharge roller 217, second discharge roller 218, processing circuit board 221, first shield member 222, and second shield member 223 are provided in the first housing 201. The second mounting platform 219 and second imaging device 220 are provided in the second housing 202. The third transport roller 224, fourth transport roller 225, printing device 226, third discharge roller 227, and fourth discharge roller 228 are provided in the third housing 206.

[0126] The first housing 201 is provided with a medium transport path. As shown in Figure 14, the medium transport path has a so-called U-turn path mechanism in which the vertical positional relationship between the front and back surfaces of the medium changes between the pre-transport state when the medium is placed on the first mounting stage 203 and the post-discharge state when the medium is placed on the first discharge stage 204. The portion of the medium transport path surrounding the first imaging device 216 is inclined such that the upstream side in the medium transport direction A1 is located at a lower position in the height direction A3, and the downstream side in the medium transport direction A1 is located at a higher position in the height direction A3.

[0127] The first medium sensor 210, feeding roller 211, separation roller 212, first transport roller 213, second transport roller 214, second medium sensor 215, first imaging device 216, first discharge roller 217, second discharge roller 218, second mounting base 219, second imaging device 220, processing circuit board 221, first shield member 222, and second shield member 223 each have the same functions and structure as the first medium sensor 110, feeding roller 111, separation roller 112, first transport roller 113, second transport roller 114, second medium sensor 115, first imaging device 116, first discharge roller 117, second discharge roller 118, second mounting base 119, second imaging device 120, processing circuit board 121, first shield member 122, and second shield member 123 of the image imaging device 100.

[0128] However, the feeding roller 211 is located above the separating roller 212 and separates and feeds the medium placed on the first mounting base 103 from the top in order. In addition, multiple first transport rollers 213 and second transport rollers 214 are provided along the medium transport direction A1.

[0129] The third housing 206 is provided with a medium transport path. As shown in Figure 14, the medium transport path has a so-called U-turn path mechanism in which the vertical positional relationship between the front and back surfaces of the medium changes between the state before transport, when the medium is placed on the third mounting platform 207, and the state after discharge, when the medium is placed on the third discharge platform 208.

[0130] The third transport roller 224 and the fourth transport roller 225 are examples of transport units. The third transport roller 224 and the fourth transport roller 225 are arranged facing each other and transport the medium to the printing device 226.

[0131] The printing device 226 is an example of a printing unit. The printing device 226 prints predetermined information onto a medium transported by the third transport roller 224 and the fourth transport roller 225. The printing device 226 prints an image specified by the user using the operation display device 205, or an image read by the first imaging device 216 or the second imaging device 220. The printing device 226 includes an image forming apparatus 226a and an image forming apparatus circuit board 226b, etc. The image forming apparatus 226a is an inkjet type printer with a printer head having multiple ink nozzles, and prints predetermined information onto the medium by spraying ink onto the medium as it passes through the position of the printing device 226. The image forming apparatus 226a may be a laser type or other type of printer. The image forming apparatus circuit board 226b is a printed circuit board on which electronic components including the image forming apparatus 226a or image forming conductors (wiring patterns for image formation, etc.) are mounted (arranged).

[0132] The image forming apparatus circuit board 226b is an example of an image forming substrate. The image forming apparatus 226a is an example of an image forming electronic component provided in the printer section. The electronic component or conductor mounted on the image forming apparatus circuit board 226b is an example of a second radio wave source, which generates a predetermined radio wave.

[0133] The third discharge roller 227 and the fourth discharge roller 228 are examples of discharge sections. The third discharge roller 227 and the fourth discharge roller 228 are arranged facing each other and are conveyed by the third transport roller 224 and the fourth transport roller 225 to discharge the medium on which the image has been formed by the printing device 226 onto the third discharge table 208.

[0134] The processing circuit board 221 is positioned so as to overlap with at least a portion of the image forming apparatus circuit board 226b or the operation and display device circuit board in the horizontal direction A4.

[0135] The second shielding member 223 is provided between the second imaging sensor circuit board and interface circuit board and the processing circuit board 221, and also between the image forming apparatus circuit board 226b and operation / display device circuit board and the processing circuit board 221. The second shielding member 223 is positioned so as to overlap at least a portion of the image forming apparatus circuit board 226b or the operation / display device circuit board in the horizontal direction A4. As a result, the second shielding member 223 can effectively suppress the arrival of radio waves emitted from the image forming apparatus circuit board 226b and the operation / display device circuit board to the processing circuit board 221. In other words, the second shielding member 223 attenuates radio waves generated from the image forming electronic components and image forming conductors of the image forming apparatus circuit board 226b.

[0136] The second shielding member 223 is positioned so as to intersect with a straight line L31, which connects the left end of the electronic component or conductor mounted on the image forming apparatus circuit board 226b in Figure 14 to the left end of the electronic component or conductor mounted on the processing circuit board 221, when viewed from the width direction intersecting with the medium transport direction A1. Furthermore, the second shielding member 223 is positioned so as to intersect with a straight line L32, which connects the right end of the electronic component or conductor mounted on the image forming apparatus circuit board 226b to the right end of the electronic component or conductor mounted on the processing circuit board 121, when viewed from the width direction. Straight lines L31 and L32 are examples of the third and fourth straight lines. As a result, the second shielding member 223 can suppress the arrival of radio waves emitted from the image forming apparatus circuit board 226b to the processing circuit board 221.

[0137] Similarly, the second shielding member 223 is positioned so as to intersect with a straight line connecting the left end of an electronic component or conductor mounted on the operation / display circuit board and the left end of an electronic component or conductor mounted on the processing circuit board 221, when viewed from the width direction. Furthermore, the second shielding member 223 is positioned so as to intersect with a straight line connecting the right end of an electronic component or conductor mounted on the operation / display circuit board and the right end of an electronic component or conductor mounted on the processing circuit board 221, when viewed from the width direction. These straight lines are examples of the third and fourth straight lines. As a result, the second shielding member 223 can suppress the arrival of radio waves emitted from the operation / display circuit board to the processing circuit board 221.

[0138] Furthermore, the second shielding member 223 is provided so as to intersect a straight line L33 that extends from the left end of an electronic component or conductor mounted on the image forming apparatus circuit board 226b in a direction perpendicular to the extending direction of the image forming apparatus circuit board 226b, when viewed from the width direction. Also, the second shielding member 223 is provided so as to intersect a straight line L34 that extends from the right end of an electronic component or conductor mounted on the image forming apparatus circuit board 226b in a direction perpendicular to the extending direction of the image forming apparatus circuit board 226b, when viewed from the width direction. Straight lines L33 and L34 are examples of a third and fourth straight line. As a result, the second shielding member 223 can suppress the arrival of radio waves emitted from the image forming apparatus circuit board 226b to the processing circuit board 221.

[0139] Similarly, the second shielding member 223 is positioned so as to intersect with a straight line extending perpendicular to the direction of extension of the operation and display circuit board from the left end of the electronic component or conductor mounted on the operation and display circuit board, when viewed from the width direction. Furthermore, the second shielding member 223 is positioned so as to intersect with a straight line extending perpendicular to the direction of extension of the operation and display circuit board from the right end of the electronic component or conductor mounted on the operation and display circuit board, when viewed from the width direction. These straight lines are examples of the third and fourth straight lines. As a result, the second shielding member 223 can suppress the arrival of radio waves emitted from the operation and display circuit board to the processing circuit board 221.

[0140] Furthermore, the second shielding member 223 is provided such that, when viewed from the width direction, it intersects with a straight line L35 that extends from the left end of the electronic components or conductors mounted on the processing circuit board 221 toward the image forming apparatus circuit board 226b and the operation and display device circuit board, in a direction perpendicular to the extending direction of the processing circuit board 221. Also, when viewed from the width direction, the second shielding member 223 is provided such that it intersects with a straight line L36 that extends from the right end of the electronic components or conductors mounted on the processing circuit board 221 toward the image forming apparatus circuit board 226b and the operation and display device circuit board, in a direction perpendicular to the extending direction of the processing circuit board 221. Straight lines L35 and L36 are examples of the third and fourth straight lines. As a result, the second shielding member 223 can suppress the arrival of radio waves emitted from the image forming apparatus circuit board 226b and the operation and display device circuit board to the processing circuit board 221.

[0141] Furthermore, the second shield member 223 only needs to be positioned to satisfy at least one of the above-described positioning conditions.

[0142] The image acquisition device 200 has the same components as the image acquisition device 100 shown in Figure 10 and performs the media reading process shown in Figure 12. The image acquisition device 200 also has a third drive device that generates driving force to rotate the third transport roller 224, the fourth transport roller 225, the third discharge roller 227, and the fourth discharge roller 228. When the control unit of the image acquisition device 200 receives a third operation signal instructing printing from the operation display device 205, it controls the third drive device to rotate the third transport roller 224, the fourth transport roller 225, the third discharge roller 227, and the fourth discharge roller 228. When a user inputs a printing instruction using the operation display device 205 or an information processing device, the control unit receives a third operation signal from the operation display device 205 or an interface device. The control unit controls the printing device 226 to perform printing according to the configuration specified by the user.

[0143] In addition, the second housing 202 may be omitted in the image acquisition device 200, and the image acquisition device 200 may not have a flatbed device.

[0144] As detailed above, even when the image acquisition device 200 has a printer unit, it is possible to suppress the influence of radio waves generated by each radio wave source while suppressing an increase in the size of the device.

[0145] Furthermore, the image acquisition device 200 supports both imaging of the medium and forming images on the medium, while suppressing malfunctions caused by radio waves emitted from the imaging sensor, the circuit board on which the imaging sensor is mounted, the printer, or the circuit board on which the printer is mounted.

[0146] Figure 15 shows a schematic configuration of a processing circuit in an image acquisition device according to yet another embodiment.

[0147] The processing circuit 350 is used in place of the processing circuit 150 and performs media reading and other processes instead. The processing circuit 350 includes a control circuit 351 and an image acquisition circuit 352, etc. Each of these parts may be composed of an independent integrated circuit, microprocessor, firmware, etc.

[0148] The control circuit 351 is an example of a control unit and has the same functions as the control unit 151. The control circuit 351 receives operation signals from the operating device 105, the operation display device 205, or the interface device 135, and a first medium signal from the first receiving circuit 131. Based on the received signals, the control circuit 351 controls the first drive unit 133, the second drive unit 134, the third drive unit, or the printing device 226.

[0149] The image acquisition circuit 352 is an example of an image acquisition unit and has the same functions as the image acquisition unit 152. The image acquisition circuit 352 receives a second medium signal from the second receiving circuit 132 and controls the first imaging devices 116, 216 or the second imaging devices 120, 220 based on the received second medium signal. The image acquisition circuit 352 acquires each input image from the first imaging devices 116, 216 or the second imaging devices 120, 220 and outputs it to the interface device 135.

[0150] As detailed above, even when using the processing circuit 350, the image acquisition device can suppress the effects of radio waves generated by each radio wave source while keeping the device size from increasing. [Explanation of Symbols]

[0151] 100, 200 Image acquisition device, 111, 211 Feeding rollers, 112, 212 Separation rollers, 113, 213 First transport rollers, 114, 214 Second transport rollers, 116c Lower imaging sensor, 116d Upper imaging sensor, 116e Lower imaging sensor circuit board, 116f Upper imaging sensor circuit board, 117, 217 First discharge rollers, 118, 218 Second discharge rollers, 120a Second imaging sensor, 120b Second imaging sensor circuit board, 120c Interface circuit board, 121, 221 Processing circuit boards, 122, 222 First shielding member, 123, 223 Second shielding member, 226a Image forming apparatus, 226b Image forming apparatus circuit board

Claims

1. An image acquisition device that captures an image of a medium being transported, A transport path that slopes downward from the upstream position to the downstream position in the media transport direction, A first imaging unit that captures an image of the medium, A circuit board is placed below the aforementioned transport path and has multiple electronic components of different heights arranged on it, It includes a first shielding member positioned above the plurality of electronic components for attenuating radio waves generated by the first imaging unit, A first electronic component located below the upstream position in the media transport direction is mounted on the upstream portion of the circuit board, and a second electronic component located below a position downstream of the upstream position in the media transport direction is mounted on the downstream portion of the circuit board. The second electronic component is shorter than the first electronic component. The first shielding member is inclined downward from the first electronic component toward the second electronic component and covers the upper side of the plurality of electronic components. An image acquisition device characterized by the following features.

2. A second imaging unit is provided below the circuit board, The device includes a second shielding member provided between the second imaging unit and the circuit board to attenuate the radio waves from the second imaging unit, The image capturing apparatus according to claim 1, wherein the second shielding member is provided substantially parallel to the circuit board.

3. The first imaging unit is provided in the automatic document transport device, The image acquisition apparatus according to claim 2, wherein the second imaging unit is provided on a flatbed apparatus.

4. An image forming substrate on which image forming electronic components and image forming conductors are arranged in the printer section, The image capturing apparatus according to claim 1 or 2, further comprising: a second shielding member provided between the circuit board and the image forming substrate for attenuating radio waves generated from the image forming electronic components and the image forming conductor of the image forming substrate.

5. The first shield member and the second shield member have a surface resistance value of 10 １０ The image imaging apparatus according to claim 2, comprising a resin having a capacitance of Ω or less, a member coated to form an electrically conductive coating, or a metal.

6. The first shielding member is provided between the first imaging unit and the electronic components and conductors mounted on the circuit board. The image imaging apparatus according to claim 2, wherein the second shielding member is provided between the second imaging unit and the electronic components and conductors mounted on the circuit board.

Images