Method for manufacturing a sensor device and multiple sensor devices

Abstract

The present invention relates to a sensor device comprising a core component (100) having a pressure sensor element (104), a circuit carrier (102), and a support element (103), and an upper housing element (200) surrounding the core component (100), wherein the upper housing element (200) abuts against the upper side of the support element (103), the circuit carrier (102) has a central region (113) and a peripheral region (114) surrounding the central region (113), and the support element (103) is positioned in the central region (113) of the circuit carrier (102) and above the circuit carrier (102). A further embodiment relates to a method for manufacturing a plurality of sensor devices.

Description

Technical Field

[0001] The present invention relates to a sensor device comprising a pressure sensor element and a method for manufacturing a plurality of sensor devices.

[0002] Many applications in the fields of industrial engineering and automotive engineering, such as heat engines, filters, cooling circuits, and air conditioning systems, require simultaneous measurements based on the pressure and temperature positions of fluids. The sensor devices used for this purpose can be exposed to high pressure loads of up to, for example, 100 bar, as well as high temperatures of up to, for example, 180 °C and cryogenic temperatures of up to -40 °C.

[0003] The object of the present invention is to provide an advantageous sensor device.

[0004] This object is solved by the sensor device according to claim 1. The dependent claims relate to preferred embodiments of the sensor device.

[0005] A sensor device comprising a core component and an upper housing element is proposed. The core component comprises a pressure sensor element, a circuit carrier, and a support element. The upper housing element surrounds the core component. The upper housing element abuts on the upper side of the support element. The circuit carrier comprises a central region and a peripheral region surrounding the central region. The support element is arranged in the central region of the circuit carrier. The support element is arranged on the upper side of the circuit carrier.

[0006] The peripheral region of the circuit carrier may not have a support element. In particular, the support element may comprise a stop surface that abuts on a stop surface of the upper housing element. The force applied to the core component is transmitted to the upper housing element via the stop surface of the support element.

[0007] The outer circumference of the support element may extend along the boundary between the peripheral region and the central region of the circuit carrier.

[0008] By positioning the support elements in the central region of the circuit carrier, the force transmission from the core component to the upper housing element can be configured such that the bending moment experienced by the core component is minimized. Thus, the force can be transmitted through the central region located in the center of the circuit carrier, and this central region is large enough to prevent dome-shaped deformation of the circuit carrier.

[0009] This minimizes the bending stress generated in the core component. Reducing bending stress can enable improved miniaturization and increased measurement accuracy of the sensor device. It also allows for a more compact design and reduced material usage.

[0010] The upper housing element may be part of the housing for the sensor device. In particular, the upper housing element and the lower housing element to which the upper housing element can be connected may form the housing for the sensor device. The fluid whose pressure is measured by the pressure sensor element may be guided to the pressure sensor element via the lower housing element.

[0011] The distance of each support element from the edge point of the circuit carrier may be at least 5%, preferably at least 10%, or at least 20%, of the length of a straight line connecting the edge point to the opposite edge point of the circuit carrier and passing through the center of the circuit carrier. This arrangement of support elements in the central region of the circuit carrier ensures that forces applied to the core component by the fluid are transmitted by regions of the core component that are sufficiently far from the edges of the core component. This prevents bending moments in the plate or circuit carrier caused by forces applied to the edges.

[0012] The outer periphery of the support element may extend along the boundary between the central and peripheral regions of the circuit carrier. The central region may occupy at least 10% of the circuit carrier's area, preferably at least 25%. This ensures that the support element is large enough to transmit force to the upper housing element over an area rather than at a single point. This avoids force peaks that could lead to measurement inaccuracies and shorten the lifespan of the component.

[0013] The central region should not occupy more than 80% of the circuit carrier's area, and preferably, it should occupy less than 60% of the circuit carrier's area. This ensures that the force acts sufficiently far from the edges of the circuit carrier, and as a result, the circuit carrier does not bend.

[0014] The support element may comprise a frame that encloses the internal region where the pressure sensor element is located. Since the support element is positioned above the circuit carrier, forces to the upper housing element are not transmitted by the circuit carrier itself or the pressure sensor element. Instead, the support element is used for this purpose. Because the support element has a purely mechanical function, the elements with measuring functions, namely the circuit carrier and the pressure sensor element, are protected from force peaks.

[0015] The frame design ensures that forces are transmitted to the upper housing elements over an area rather than at a single point, resulting in the elimination of point-like deformation of the core components.

[0016] The support element may include a crossbar extending through the internal region. Alternatively or additionally, the support element may include at least one projection protruding into the internal region. The stopping surface of the support element may be formed by the frame, the crossbar, and the upper side of the at least one projection. Thus, the crossbar and the at least one projection also contribute to the transmission of forces to the upper housing element, and in addition, distribute the forces over a larger area, thereby preventing the occurrence of mechanical stress peaks and overloading of the materials used.

[0017] The sensor device may include a lower housing element that forms a medium connection channel configured to supply fluid to the underside of the core component. In particular, the sensor device may be configured so that the fluid is directed towards a pressure sensor element, thereby enabling the pressure sensor element to determine the fluid pressure.

[0018] The axial direction can be defined as the direction toward the core component along the medium connection channel. The lower housing element may extend beyond the core component in the axial direction. The lower housing element may include a flange that surrounds the axial lower end of the upper housing element. The lower and upper housing elements may be configured such that forces transmitted from the core component to the stop surface of the upper housing element are transmitted from the upper housing element to the flange of the lower housing element. This allows the force to be diverted away from the core component, thus avoiding bending moments in the core component. The core component may be configured to transmit forces to the upper housing element via a support element, and the upper housing element is configured to divert the forces absorbed by the core component to the flange of the medium supply section. For this purpose, the upper housing element is configured to be sufficiently rigid.

[0019] The upper housing element may abut directly against the flange. The flange may be sealed with potting.

[0020] The pressure sensor element may be a piezoresistive silicon MEMS element. Compared to other pressure sensor elements, such as ceramic pressure sensor elements, piezoresistive silicon MEMS elements are characterized by smaller design and lower cost. By using a piezoresistive MEMS silicon element, the effective area over which the fluid acts on the pressure sensor element can be designed to be very small, and therefore the force acting on the core component can be kept small. This can also help reduce the required installation space and the weight of the sensor device.

[0021] Piezoresistive silicon MEMS elements can be sensitive in a pressure range between 50 millibars and 50 bar. Piezoresistive silicon MEMS elements can output a maximum output signal of 120 mV. Compared to capacitive pressure sensors, piezoresistive silicon MEMS elements can therefore cover a larger measurement range and generate a stronger output signal that is less sensitive to interference.

[0022] Piezoresistive silicon MEMS devices can be used for both absolute and relative pressure measurements. They can be used in temperatures ranging from -40°C to +180°C.

[0023] The sensor device may further include a temperature sensor element. The temperature sensor element may be an NTC thermistor. The temperature sensor element may be mounted on the circuit carrier of the core component.

[0024] The core component may include a plate positioned below the circuit carrier, with a pressure sensor element mounted above the plate. The plate includes a channel, and the pressure sensor element is positioned at one end of the channel. Fluid can be supplied to the pressure sensor element through the channel and through the plate. The plate may seal the medium connection channel formed by the lower housing element against the circuit carrier. The plate may include or be made of a medium-resistant material, such as steel, ceramic, glass, or plastic.

[0025] The temperature sensor element may include two connecting wires, each passing through a through-hole in the plate, which is sealed with potting material. The upper housing element may include at least one contact element electrically connected to the circuit carrier.

[0026] Another embodiment relates to a method for manufacturing the aforementioned plurality of sensor devices, wherein the core components are manufactured and calibrated within a panel. [Brief explanation of the drawing]

[0027] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. [Figure 1] It is an exploded view showing a sensor device for measuring pressure and temperature. [Figure 2] It is a view showing the upper side of the core component. [Figure 3] It is a view showing the lower side of the core component. [Figure 4] It is a view showing a circuit carrier. [Figure 5] It is a cross-sectional view of the upper housing element. [Figure 6] It is a cross-sectional view of the lower housing element. [Figure 7] It is a view showing the flow of force in the sensor device.

Mode for Carrying Out the Invention

[0028] FIG. 1 shows an exploded view of a sensor device for measuring pressure and temperature. The sensor device includes a core component 100, an upper housing element 200, and a lower housing element 300.

[0029] The core component 100 includes a pressure sensor element 104 configured to determine the absolute or relative pressure of a fluid, i.e., a liquid or a gas. The pressure sensor element 104 is configured to convert the applied pressure into an electrical signal capable of determining the pressure level. The medium is supplied to the back of the pressure sensor element 104 facing the medium connection channel. The pressure sensor element 104 may include a bending plate whose area and thickness are selected with respect to the desired measurement range. The pressure sensor element 104 is a piezoresistive silicon MEMS element.

[0030] In the embodiment shown in the drawings, the core component 100 further includes a temperature sensor element 105 configured to determine the temperature of the fluid. In an alternative embodiment, the core component does not include the temperature sensor element 105. Further, the core component includes a circuit carrier 102 through which the sensor elements 104, 105 are contacted.

[0031] The temperature sensor element 105 is configured to generate an electrical signal whose magnitude depends on the temperature of the fluid. The temperature sensor element 105 may also be an NTC thermistor. The temperature sensor element 105 can protrude into the measurement medium in order to detect the temperature with as little error as possible and to ensure the shortest possible response time.

[0032] The lower housing element 300 forms a medium connection channel into which a fluid whose pressure and temperature are to be measured can be supplied to the sensor elements 104 and 105 of the core component 100.

[0033] The upper housing element 200 is connected to the lower housing element 300 and surrounds the core component 100, thereby protecting it from environmental influences, while the lower side of the core component is not covered by the upper housing element 200. The sensor device is configured so that forces applied to the core component 100 by a fluid can be transmitted to the lower housing element 300 via the upper housing element 200.

[0034] Axial axis A is defined as the direction extending along the medium connection channel and pointing from the lower side 110 of the core component 100 to the upper side 111 of the core component 100. Hereinafter, elements located in the direction opposite to the direction in which the fluid is supplied to the core component 100 will be referred to as "lower side in axial axis A". Hereinafter, elements located in the direction in which the fluid is supplied to the core component 100 will be referred to as "upper side in axial axis A".

[0035] The core component 100 is described below. Figure 2 shows the upper part 111 of the core component 100. Figure 3 shows the lower part 110 of the core component 100. Figure 4 shows the circuit carrier 102 of the core component 100.

[0036] The core component 100 includes a pressure sensor element 104, a temperature sensor element 105, a circuit carrier 102, a support element 103, and a plate 101.

[0037] The upper side 102a of the circuit carrier 102 is oriented away from the media connection channel of the lower housing element 300. The lower side 102b of the circuit carrier 102 is oriented towards the media connection channel of the lower housing element 300.

[0038] The support element 103 and at least one electronic component 106 are positioned on the upper side 102a of the circuit carrier 102. The circuit carrier 102 includes a recess 107 in which a pressure sensor element 104 is positioned. The recess 107 is an opening that extends axially A through the circuit carrier and is large enough to accommodate the pressure sensor element 104. The pressure sensor element 104 is connected to the circuit carrier 102 via bonding wires that span the recess 107.

[0039] The support element 103 comprises a frame 103a that surrounds the pressure sensor element 104 and the recess 107 of the circuit carrier 102. The support element 103 further comprises a crossbar 103b that divides the internal region surrounded by the frame 103a into two chambers. The support element 103 comprises two projections 103c that protrude into the internal region.

[0040] The pressure sensor element 104 is placed in the first of two chambers formed by the frame 103a and the crossbar 103b. The chamber in which the pressure sensor element 104 is placed may be filled with passivation that can cover the pressure sensor element 104.

[0041] The support element 103 extends axially upward from the circuit carrier 102 and forms a stopping surface against which the upper housing element 200 abuts and which transmits force to the upper housing element 200. The upper side of the frame 103a, the upper side of the crossbar 103b, and the upper side of the projection 103c protruding into the internal region abut against the upper housing element 200.

[0042] The electrical contacts 108 of the temperature sensor element 105 are located in the second of the two chambers formed by the frame 103a and the crossbar 103b.

[0043] The electronic components 106 arranged on the circuit carrier 102 form control and evaluation electronics connected to the pressure sensor element 104 and the temperature sensor element 105. The circuit carrier 102 includes a printed circuit board material, such as FR4.

[0044] Plate 101 is positioned on the lower side 102b of the circuit carrier 102 and is made of a media-resistant material, such as ceramic, steel, glass, or plastic. Plate 101 is positioned to seal the media connection channel formed by the lower housing element 300 to the circuit carrier 102. Plate 101 includes a channel 109 through which fluid can flow from the media connection channel to the pressure sensor element 104. The pressure sensor element 104 is positioned on the side of channel 109 facing away from the media connection channel.

[0045] The plate 101 includes a through-hole 112 for connecting wires to the temperature sensor element 105. Once the connecting wires are placed in the through-hole 112, the through-hole 112 is closed and sealed with potting material. Further electronic components 106, which are components of control and evaluation electronics, may be placed on the underside 102b of the circuit carrier 102.

[0046] The circuit carrier 102 enables mechanical and electrical connections between the electronic component 106 and the sensor elements 104 and 105. Furthermore, the circuit carrier 102 is electrically and mechanically connected to the contact element 202 located on the upper housing element 200.

[0047] The support element 103 and the plate 101 can be connected to the circuit carrier 102 by adhesive, respectively.

[0048] Figure 4 shows a circuit carrier 102 with a central region 113 and a peripheral region 114. Support elements 103 are exclusively located in the central region 113. They are not located in the peripheral region 114. The peripheral region 114 surrounds the central region 113.

[0049] The central region 113 includes the geometric center of the circuit carrier. The central region 113 has at least 10% of the area of ​​the circuit carrier 102, preferably at least 25% of the area of ​​the circuit carrier 102. The outer contour of the central region 113 is defined by a frame 103a formed by the support element 103, and the outer edge of the frame 103a forms the boundary between the central region 113 and the peripheral region 114.

[0050] Each distance AA of the support element 103 from the edge point P1 of the circuit carrier 102 is at least 5%, preferably 10% or 20%, of the length L of the straight line connecting edge point P1 to the opposite edge point P2 of the circuit carrier 102 and passing through the center point MP of the circuit carrier 102. The length of the straight line represents the diameter of the circuit carrier 102. The described configuration allows the support element 103 to be centrally located on the circuit carrier 102 and to be at a sufficient distance from the edge of the circuit carrier 102.

[0051] The force applied to the core component 100 by the fluid is transmitted to the upper housing element 200 via the support element 103. The placement of the support element 103 in the central region 113 of the circuit carrier 102 ensures that the bending moment applied to the core component 100 by the force is minimized. The force is transmitted by the support element 103 to the upper housing element 200 via the central region 113 and therefore also via the center point of the core component 100. Because the central region 113 is used for force transmission, bending of the core component 100 that may occur if the force were transmitted through the peripheral region 114 can be avoided.

[0052] The central region 113 has at least 10%, preferably 25%, of the area of ​​the circuit carrier 102 and is defined by the frame 103a, so that the force is transmitted over a sufficiently large area and not transmitted at nearly a single point, thereby avoiding the occurrence of a single force peak in the core component 100, which could lead to measurement inaccuracies and / or reduced long-term stability.

[0053] The upper housing element 200 is described below. Figure 5 shows a cross-sectional view of the upper housing element 200.

[0054] The upper housing element 200 comprises a plastic element 201 and a contact element 202. The plastic element 201 extends substantially in the axial direction A. In the lower region, the plastic element 201 has a collar 203, i.e., a region having a larger cross-section than the rest of the upper housing element 200.

[0055] The collar 203 of the upper housing element 200 has sufficient rigidity to redirect the axial force A to the flange 301 of the lower housing element 300, which abuts the collar 203 in the axial direction.

[0056] The collar 203 surrounds the core component 100 and is configured to extend downward beyond the core component 100 in the axial direction A. A stop surface 204 is formed inside the collar 203, and the support element 104 of the core component 100 abuts against it. Forces are transmitted from the support element 104 to the upper housing element 200 via the stop surface 204. The upper housing element 200 is configured to transmit these forces to the flange 301 of the lower housing element 300.

[0057] Furthermore, the upper housing element includes contact elements 202 electrically connected to the circuit carrier 102. The contact elements 202 enable electrical contact between the circuit carrier 102 and external electronics. The contact elements 202 are designed as metal spring contact pins. They are inserted into the contact connections of the circuit carrier 102 and are therefore configured to position the core components 100 during assembly.

[0058] Each contact element 202 has two bends, and the contact elements 202 extend parallel to each other at a small distance in the upper region of the upper housing element 200 in the axial direction A, and are positioned further apart from each other within the collar 203 of the upper housing element 200. The two bends cause the contact elements 202 to be spring-biased. The plastic part 201 defines the path of the contact elements 202 and includes a guide element with a recess, thus enabling the contact elements 202 to be spring-biased. This makes it possible to compensate for manufacturing tolerances.

[0059] Potting 206 is also applied to the outer surface 205 of the collar 203 that abuts against the flange 301 of the lower housing element 300, connecting and sealing the upper housing element 200 and the lower housing element 300. Potting 206 seals the interior of the upper housing element 200 and the lower housing element 300 against environmental impacts. Furthermore, potting 206 provides mechanical stability to the connection between the housing elements 200 and 300. Potting 206 may also contain a sealing compound that compensates for the difference in thermal expansion coefficients of the upper and lower housing elements 200 and 300. This reduces or avoids the generation of mechanical stress and ensures a long-term stable seal between the flange and the collar.

[0060] Figure 6 shows a cross-sectional view of the lower housing element 300.

[0061] The lower housing element 300 is configured to connect to the upper housing element 200. The lower housing element includes a first seal ring 302 located inside it, and may also include a second seal ring 303 located outside the lower housing element. The lower housing element may further include a nozzle-shaped protective element 304.

[0062] The lower housing element 300 has an upper region with a large cross-section, which is configured to surround the core component 100 and further surround the collar 203 of the upper housing element 200. The upper region has an inward-facing flange 301 at its upper end, which abuts the outer surface 205 of the collar 203 of the upper housing element 200, either directly or via potting 206.

[0063] The first inner seal ring 302 seals the media connection channel against the plate 101. The inner seal ring 302 forms an axial seal between the lower housing element 300 and the plate 101.

[0064] The lower region of the lower housing element 300 has a smaller diameter than the upper region. The lower region is tubular in design and hollow inside. The interior of the lower region forms a medium connection channel through which fluid is supplied to the core component 100. The outer wall of the lower region may be designed as a thread. The second seal ring 303 may be located outside the lower housing element 300 at the transition from the lower region to the upper region. It is configured to seal the lower housing element 300 when the sensor device is installed. Alternative designs for the sealing region of the lower housing element 300 are possible.

[0065] The protective element 304 can be configured to surround the temperature sensor element 105 and thus mechanically protect it. At the same time, it must allow good access to the temperature sensor element 105 of the measuring medium.

[0066] Furthermore, the protective element 304 can electrically and thermally insulate the temperature sensor element 105 from the lower housing element 300, thereby improving measurement accuracy.

[0067] The protective element 304 may be a plastic part, which can be fixed to the lower housing element 300 by shape fitting. Since the protective element 304 is not attached to the core part 100, no mechanical stress is applied to the core part 100 by the protective element 304. A bidirectional shape fitting between the protective element 304 and the lower region of the lower housing element 300 ensures that the protective element 304 is held in place by the lower housing element 300. The shape fitting can be formed by deformation, such as thermal riveting. In alternative embodiments, the sensor device may not include the protective element 304.

[0068] Figure 7 shows the force flow in the sensor device. The force flow is schematically indicated by arrows. This figure is intended to show only the basic force distribution. The length and density of the arrows do not allow for conclusions to be drawn about the magnitude of each force acting.

[0069] Within the media connection channel formed in the lower housing element 300, the arrows indicate pressure p acting in both the radial and axial directions. Within the core component 100 and the upper housing element 200, the arrows indicate force f.

[0070] The fluid flowing through the media connection section exerts an upward force on the core component 100 in the axial direction A due to its pressure. This force is first applied to the plate 101 that seals the media connection channel. The force is transmitted to the support element 103 via the plate 101 and the circuit carrier 102. The support element 103 forms a stop surface that abuts against the stop surface 204 of the upper housing element 200, and as a result, the force is transmitted from the support element 103 to the upper housing element 200. The upper housing element 200 is configured such that the force is transmitted to the flange 301 of the lower housing element 300, against which the collar 203 of the upper housing element 200 abuts in the axial direction.

[0071] In the circuit carrier 102, the force acts on the central region 113. The force does not act on the peripheral region 114 of the circuit carrier 102. The support element 103 is positioned in the central region 113 of the circuit carrier 102 and abuts against the stop surface 204 of the upper housing element 200, so the support element 103 absorbs the force and transmits it to the upper housing element 200. This prevents the circuit carrier 102 from bending. Support in the peripheral region 114 of the circuit carrier 102 is not necessary. The peripheral region 114 of the circuit carrier 102 can be used for electronic components.

[0072] Core components are manufactured and calibrated within the panel. This improves the manufacturing process, making it more cost-effective in particular. [Explanation of symbols]

[0073] 100 core components 101 Plate 102 Circuit Carrier 102a Upper side of the circuit carrier 102b Lower side of the circuit carrier 103 Support elements 103a frame 103b Crossbar 103c protrusion 104 Pressure sensor element 105 Temperature sensor element 106 Electronic Components 107 Recess 108 Electrical contacts of temperature sensor elements 109 channels 110 Lower side of core component 111 Upper part of the core component 112 Penetration 113 Central area 114 Peripheral area 200 Upper housing element 201 Plastic elements 202 Contact elements 203 Colors 204 Stop surface 205 Color exterior 206 Potting 300 Lower housing element 301 Flange 302 First seal ring 303 Second seal ring 304 Protective elements A-axis AA Distance between the support element and the edge point P1 Edge point P2 edge point MP center point Length of the straight line from P1 to P2

Claims

1. A core component (100) comprising a pressure sensor element (104), a circuit carrier (102), and a support element (103), An upper housing element (200) surrounds the core component (100), A sensor device comprising, The upper housing element (200) abuts against the upper side of the support element (103), The circuit carrier (102) comprises a central region (113) and a peripheral region (114) surrounding the central region (113). The support element (103) is positioned in the central region (113) of the circuit carrier (102) and above the circuit carrier (102). Sensor device.

2. Each distance (AA) from the edge point (P1) of the circuit carrier (102) to the support element (103) is at least 5%, preferably at least 10%, or at least 20% of the length (L) of the straight line connecting the edge point (P1) to the opposite edge point (P2) of the circuit carrier (102) and passing through the center point (MP) of the circuit carrier (102). The sensor device according to claim 1.

3. The outer circumference of the support element (103) extends along the boundary between the central region (113) and the peripheral region (114) of the circuit carrier (102), The central region (113) occupies at least 10% of the area of ​​the circuit carrier (102). The sensor device according to claim 1 or 2.

4. The support element (103) comprises a frame (103a) that surrounds the internal region in which the pressure sensor element (104) is located. The sensor device according to any one of claims 1 to 3.

5. The support element (103) comprises a crossbar (103b) extending through the internal region, and / or The support element (103) is provided with at least one projection (103c) that protrudes into the internal region. The sensor device according to claim 4.

6. The sensor device includes a lower housing element (300) that forms a medium connection channel configured to supply fluid to the lower side (110) of the core component (100). The sensor device according to any one of claims 1 to 5.

7. The axial direction (A) is oriented toward the core component (100) along the media connection channel, The lower housing element (300) extends beyond the core component (100) in the axial direction (A), The lower housing element (300) includes a flange (301) that surrounds the lower end of the upper housing element (200) in the axial direction (A). The sensor device according to claim 6.

8. The core component (100) is configured to transmit force to the upper housing element (200) via the support element (103), The upper housing element (200) is configured to transmit the force received by the core component (100) to the flange (301) of the lower housing element (300). The sensor device according to claim 7.

9. The upper side of the circuit carrier (102) is facing away from the medium connection channel. The sensor device according to any one of claims 6 to 8.

10. The upper housing element (200) is provided with a collar (203) at its lower end in the axial direction (A), and the collar abuts against the inside of the flange (301) of the lower housing element (300). The sensor device according to any one of claims 6 to 9.

11. The upper housing element (200) and the flange (301) are connected to each other and sealed to each other by potting (206). The sensor device according to any one of claims 6 to 10.

12. The pressure sensor element (104) is a piezoresistive silicon MEMS element. The sensor device according to any one of claims 1 to 11.

13. The sensor device further includes a temperature sensor element (105). The sensor device according to any one of claims 1 to 12.

14. The core component (100) includes a plate (101) positioned on the lower side (102b) of the circuit carrier (102), The pressure sensor element (104) is mounted on the upper side of the plate (101). The plate (101) includes a channel (109), and the pressure sensor element (104) is positioned at one end of the channel (109). The sensor device according to any one of claims 1 to 13.

15. The plate (101) includes steel, ceramic, glass, or plastic. The sensor device according to claim 13.

16. The temperature sensor element (105) is equipped with two connecting wires, each connecting wire passing through a penetration (112) in the plate (101). The through-hole (112) within the plate (101) is sealed with potting material. The sensor device according to claim 14 or 15, as dependent on claim 13.

17. A method for manufacturing a plurality of sensor devices according to any one of claims 1 to 16, A method by which the core component (100) is manufactured and calibrated within the panel.

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