Vacuum coating system

Abstract

This disclosure relates to a vacuum coating system for coating a strip substrate (5), comprising: - a first module (20) including a first module housing (21), the first module housing (21) including at least one of a first substrate inlet (22) and a first substrate outlet (23); a second module (40) including a second module housing (41), the second module housing (41) including at least one of a second substrate inlet (42) and a second substrate outlet (43); - a substrate transport unit (50) provided in one of the first module housing (21) and the second module housing (41); and - a substrate processing unit (60) provided in the other of the first module housing (21) and the second module housing (41), - Herein, the present invention relates to a vacuum coating system in which at least one of a substrate transport unit (50) and a substrate processing unit (70) is interchangeably arranged in one of a first module housing (21) and a second module housing (41), or - a first module (20) and a second module (40) are interchangeably connected via at least one of a first and second substrate inlet (22, 42) and at least one of a first and second substrate outlet (23, 43), respectively.

Description

Technical Field

[0001] The present invention relates to the field of coating substrates, and more particularly, to the field of coating metal substrates with metal coatings or anticorrosion coatings. Aspects of the present invention relate to vacuum coating systems and methods of constructing vacuum coating systems.

Background Art

[0002] There are various techniques for plating or coating the surface of corrosive materials such as strips or bands of steel with anticorrosion materials such as zinc or aluminum. Generally, it is known to coat the surface of corrosive metal materials with anticorrosion coatings, for example by electrogalvanizing, hot-dip galvanizing, or physical vapor deposition (PVD).

[0003] For example, Patent Document 1 discloses a vacuum coating system for coating strip materials, particularly thin metal sheets or strips.

[0004] Generally, such vacuum coating systems are designed for only one specific coating or surface treatment process. The overall design and operation of the vacuum coating system may be limited to accommodate only a clearly defined single vacuum deposition or vacuum treatment procedure for the strip material. Modifying the substrate treatment process or the coating or treatment procedure may require a fairly elaborate reconfiguration or improvement of the entire coating system. Furthermore, the overall footprint or space required for installing such a vacuum coating system is relatively large and difficult to modify. Changing or modifying the coating or treatment process may sometimes require a careful reinstallation of the coating system. Therefore, very often, such modifications to the coating or substrate treatment process may mean a complete redesign or reconstruction of the entire equipment or vacuum coating system.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

[0006] Therefore, it is desirable to provide improvements to vacuum coating systems that allow for fairly flexible and easy configuration and reconfiguration in order to adapt the vacuum coating system to different or fluctuating requirements for substrate coating or substrate processing processes. [Means for solving the problem]

[0007] The problems and defects described above are resolved by a vacuum coating system for coating a strip substrate, as defined in the independent claim, and by a method for configuring or reconfiguring the vacuum coating system. Numerous examples and embodiments are the subject matter of their respective dependent claims.

[0008] In one embodiment, a vacuum coating system for coating a strip substrate is provided. The vacuum coating system includes a first module. The first module includes a first module housing. The first module housing includes at least one of a first substrate inlet and a first substrate outlet. The vacuum coating system further includes a second module. The second module includes a second module housing. The second module housing includes at least one of a second substrate inlet and a second substrate outlet.

[0009] The vacuum coating system further includes a substrate transport unit provided in one of the first module housing and the second module housing. The vacuum coating system further includes a substrate processing unit provided in the other of the first module housing and the second module housing. The substrate transport unit can transport strip-shaped or strip-shaped substrates through at least one of the first and second modules, or through a collection of the first and second modules. The substrate processing unit can process at least the surface of the substrate according to a process performed by the vacuum coating system. For example, the substrate processing unit can prepare the substrate, coat or cover the substrate with a material layer, or process the substrate in other ways, such as annealing the substrate.

[0010] At least one of the substrate transport unit and the substrate processing unit is interchangeably or removablely arranged in one of the first module housing and the second module housing. Alternatively or additionally, the first module and the second module are interchangeably connected via at least one of the first and second substrate inlets and at least one of the first and second substrate outlets, respectively.

[0011] By providing first and second module housings for the first and second modules respectively, and by providing at least one of the substrate transport units and at least one of the substrate processing units, an interchangeable and therefore reconfigurable arrangement of substrate transport units and substrate processing units with different modules or module housings is provided. The module housings may include clearly defined fixed geometric structures. By interchangeably arranging or fastening the transport units and / or processing units to one of the first and second module housings, the overall design of the vacuum coating system can be modified and reconfigured accordingly.

[0012] Furthermore, by arranging at least one of the substrate transport unit and the substrate processing unit interchangeably in one of the first and second modules, the respective module housings, and thus each module, can be modified and reconfigured between the substrate transport module, which serves to transport substrates through its respective module or adjacent modules, and the substrate processing module, which is primarily capable of processing, i.e., preparing and / or coating, the surface of the substrate.

[0013] In some examples, the first module housing and the second module housing can be fixed to each other. Here, the roles of the first and second module housings can be changed by interchangeably arranging or fastening the substrate transport unit and / or substrate processing unit in one of the first and / or second module housings, or inside one of them; that is, by removing the substrate transport unit from the first module housing, for example, and arranging the substrate transport unit in the second module housing. The reverse is also true; a substrate processing unit initially provided in the first module housing can be removed from the first module housing and arranged in the second module housing. In this way, the roles and functions of the first and second modules can be easily changed or modified by swapping or reconfiguring the arrangement of the substrate transport unit and / or substrate processing unit in the first and second module housings, respectively.

[0014] In another example, it is conceivable to provide a number of processing units distinguished by the type of substrate processing, or a number of transport units distinguished by the type of transport. Here, starting with an initial configuration in which the first processing unit is arranged in a first module housing, each module can be reconfigured into a modified configuration, for example, by replacing the first processing unit with a second processing unit, and / or replacing the first transport unit with a second transport unit. Thus, the module housing can be individually and variably equipped with one of a wide variety of processing units or transport units to set up or configure a vacuum coating system.

[0015] For example, when a first module is equipped with a substrate processing unit together with its first module housing, each module forms or constitutes a substrate processing module. By placing a substrate transport unit within the first module housing, each module is converted into a transport module. Accordingly, one of the transport modules and substrate processing modules can be formed or constituted by using one identical housing, for example, either the first module housing or the second module housing, to receive and house each substrate processing unit or substrate transport unit. In this way, the total number of module housings with different configurations or different sizes can be reduced to a minimum, and thus the cost and expenditure for designing and redesigning such vacuum-coated systems can be reduced.

[0016] Furthermore, in a further example, a substrate transport unit may be housed in a first module housing, and a substrate processing unit may be housed in a second module housing. Here, by interchangeably connecting the first and second module housings, the positions of the respective module housings equipped with the transport and processing units can be swapped or reconfigured, thus enabling fairly easy and flexible reconfiguration of the entire vacuum coating system.

[0017] Naturally, a vacuum coating system may include not only a first and second module, but also a number of modules arranged in rows or columns to define a path that can transport strip substrates and surface-treat them.

[0018] The vacuum coating system can be divided into multiple modules, some of which are dedicated to transporting substrates via the module arrangement, and some of which are specifically dedicated to processing substrates. In some examples, modules are exclusively equipped with substrate transport units, and some modules are exclusively equipped with substrate processing units for substrate handling.

[0019] In some examples, one of the first and second modules may comprise both a substrate processing unit and a substrate transport unit, where the module fulfills or includes two functions: providing transport of substrates through its respective module housing and providing surface treatment of the substrates.

[0020] In some examples, the module housing includes standardized coupling or fastening parts for detachably receiving or detachably connecting at least one of a substrate processing unit and a substrate transport unit. The fastening structure of the module housing for fastening the substrate transport unit may be equal to the fastening structure configured for fastening the substrate processing unit; and vice versa. Thus, the substrate transport unit and the substrate processing unit may include equal or at least corresponding fastening structures, thereby enabling the substrate transport unit and the substrate processing unit to be interchangeably fastened to a first module housing and a second module housing or within them, respectively. Furthermore, the first module housing and the second module housing may include the same mechanical fastening parts for fastening the substrate transport unit and / or the substrate processing unit within the module housing.

[0021] The first and second module housings, or standardized connecting parts and fastening structures provided within them, enable the interchangeable placement and / or interchangeable fastening of substrate transport units and substrate processing units within either the first or second module housing.

[0022] Furthermore, in a further example, the first and second modules are interchangeably connected via at least one of the first and second substrate inlets, and / or at least one of the first and second substrate outlets. Thus, in one configuration, the first substrate outlet of the first module can be connected to the second substrate inlet of the second module. In another configuration, the order, and therefore the sequence, of the first and second modules, equipped with different substrate transport units and / or different substrate processing units, can be changed or swapped, for example. The second substrate outlet of the second module can then be connected to or interconnected with the first substrate inlet of the first module. Interchangeable connections between the first and second modules, i.e., between the first and second module housings, are particularly useful for rearranging existing, for example, pre-configured modules in a vacuum coating system.

[0023] In some examples, the first module housing includes a first fastening portion configured to engage with an opposing fastening portion of at least one of the substrate transport unit and the substrate processing unit. Accordingly, the second module housing includes a second fastening portion, which is similarly configured to engage with an opposing fastening portion of at least one of the substrate transport unit and the substrate processing unit. Similarly, the substrate transport unit and / or the substrate processing unit have opposing fastening portions that can engage with at least one of the first fastening portion of the first module housing and the second fastening portion of the second module housing.

[0024] In a further example, the first substrate inlet comprises a first coupling portion, and the first substrate outlet comprises a first opposing coupling portion complementary to the first coupling portion. Here, the second substrate inlet of the second module housing may also comprise the first coupling portion, and the second substrate outlet of the second module housing may also comprise the first opposing coupling portion. In this way, the first module and the second module can be interchangeably connected via their respective substrate inlets and substrate outlets.

[0025] According to some examples, the vacuum coating system is specifically configured to coat or process a strip substrate. Here, the strip substrate can extend through the first module, that is, it can extend from the first substrate inlet through the interior of the first module housing to the first substrate outlet. The strip substrate can further extend into the second module, specifically, for example, by extending through the second substrate outlet, it can extend into the second module housing through the second substrate inlet and further extend beyond the second module.

[0026] In some examples, the first substrate outlet can be aligned with the second substrate inlet. The first substrate outlet can be located on the same plane as the second substrate inlet. This provides a fairly direct transfer of the strip substrate from the first module towards and into the second module.

[0027] In some examples, the substrate transport unit can be configured to provide or execute continuous transport of the strip substrate through the first module, through the second module, and from the first module to the second module.

[0028] In some examples, for example, by an endless strip substrate, it can be provided that a first portion of the strip substrate is located within the first module housing and a second portion of the same strip substrate is located within the second module housing, and both the first and second portions of the strip substrate are processed or coated simultaneously within the first and second modules in a time - overlapping manner.

[0029] In some examples, the vacuum coating system is configured to process and / or coat the strip substrate in either the first module or the second module while the substrate is being transported or moved with respect to each module or module housing.

[0030] In further examples, the vacuum-coated system is transferable between a first operating configuration and at least one of a second and a third operating configuration. In some examples, the vacuum-coated system is transferable between a first operating configuration and a second and a third operating configuration. In the first operating configuration, the first substrate outlet is directly or indirectly connected to the second substrate inlet. In the second operating configuration, the second substrate outlet is directly or indirectly connected to the first substrate inlet. In the third operating configuration, the first substrate outlet is directly connected to the third substrate inlet of the third substrate housing of the third module. In the first operating configuration, the third substrate inlet is directly or indirectly connected to the second substrate outlet.

[0031] Starting from the first operating configuration, the first substrate exit is directly or indirectly connected to the second substrate inlet. Viewed along a series of process steps, the first module, and therefore the first module housing, precedes the second module or the second module housing. When a strip of substrate is processed, the substrate is transported through the first module to the second module and then through the second module. In the second operating configuration, the roles of the first and second modules can be reversed. Here, the second module can precede the first module. Accordingly, the second substrate exit of the second module is directly or indirectly connected to the first substrate inlet. Here, the substrate is transported through the second module along the transport direction, leaves the second module through the second substrate exit, and enters the first module through the first substrate inlet.

[0032] Transferring the vacuum-coated system from a first operating configuration to a second operating configuration means that the first and second module housings each have corresponding and / or complementary mechanical coupling structures and mechanical opposing coupling structures.

[0033] In some examples, the first and second substrate inlets are provided with standardized mechanical coupling structures that are complementary to the opposing coupling structures provided at the respective substrate outlets of the first and second modules. This allows for interchangeable arrangements of the first and second modules, i.e., the first and second module housings, respectively.

[0034] In the third operating configuration, the vacuum coating system includes at least a first module, a second module, and a third module. In the first operating configuration, the second module is located between the first module and the third module. Accordingly, the second substrate inlet of the second module is directly connected to the first substrate outlet of the first module. The second substrate outlet of the second module is directly connected to the third substrate inlet provided by the third module. In the first operating configuration, the first module precedes the second module, and the second module precedes the third module.

[0035] Sometimes, only the removal of the second module is required when transferring the vacuum-coated system from a first configuration to a third configuration. The first substrate outlet of the first module is then directly connected to the third substrate inlet of the third module. In other words, transferring the vacuum-coated system between the first and third configurations changes the total number of modules constituting the vacuum-coated system. Nevertheless, such a reconfiguration can be implemented fairly straightforwardly and easily, for example, because the mechanical coupling structures and mechanical opposing coupling structures within the substrate inlet and substrate outlet regions of each module are substantially equal or complementary in shape or structure.

[0036] This makes it possible to reconfigure the vacuum coating system to change the total number of vacuum coating modules to conform to changes or reconfigurations of the coating or processing process for the strip substrate, as well as to the function and / or order of the individual vacuum coating modules.

[0037] In some examples, modules of a vacuum coating system may include only one of the substrate inlet and substrate outlet. This is especially true for so-called end or terminal modules. Such end or terminal modules can define the start and end of the vacuum coating system when viewed along the substrate transport direction. One end module may comprise a first coil, on which a strip of substrate is wound and then unwound from the first coil for surface treatment in either the next or subsequent module. A second end or terminal module, located at the opposite end of the vacuum coating system, may also comprise a coiler for winding up the treated, for example, coated, strip of substrate.

[0038] In another example, the first module housing includes a first board inlet and a first board outlet. The same applies to the second module housing, which may include, for example, a second board inlet and a second board outlet. Such first and / or second module housings can be transferred to an end or terminal module housing by, for example, closing one of the board inlet and / or board outlet. In this way, a fairly general-purpose module housing having, for example, a first board inlet and a first board outlet can be transferred to an end or terminal module housing by closing and / or sealing one of the board inlet and / or board outlet.

[0039] In particular, when closing the substrate inlet, each module can be transferred to a first end module equipped with a coiler for unfolding the strip substrate and providing it through the first substrate outlet to the next or subsequent module of the vacuum coating system. By closing the substrate outlet of a standardized or general-purpose module housing, a second end or terminal module equipped with only a substrate inlet can be provided. Such a second end or terminal module may typically include a coiler capable of winding or unwinding a processed or coated strip substrate.

[0040] In a further example, when the first module housing includes a first board inlet and a first board outlet, the first effective distance between the first board inlet and the first board outlet can be the same as or equivalent to: i) the second effective distance between the second board inlet and the second board outlet of the second module housing, and ii) one of an integer multiple n of a fraction f of the second effective distance, where f is one of 1 / 2, 1 / 3, 1 / 4, 1 / 5, 1 / 6, 1 / 7, or 1 / 8, and n is one of 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, or 16.

[0041] Accordingly, by providing the first and second effective distances to the first and second module housings that are equivalent to each other, or by defining a clearly defined size ratio, it becomes possible to change the order and / or position of the first and second modules in an existing vacuum-coated system. Furthermore, by defining the first effective distance as an integer multiple of the second effective distance or as a fraction n / f, it becomes possible to redesign or reconfigure the vacuum-coated system, for example, by replacing two or more modules of the first configuration of the vacuum-coated system with one or a different number of modules of the vacuum-coated system in the second configuration.

[0042] The vacuum-clad system may have predetermined or clearly defined grid dimensions or module dimensions, thereby allowing individual modules to be replaced or swapped with any other modules, and / or multiple modules n to be replaced with multiple modules f, where n is not equal to f. The remaining modules then remain unchanged in their relative and / or absolute position or configuration with respect to the vacuum-clad system, without necessarily undergoing modification when the vacuum-clad system is moved from a first configuration to a second configuration and to the second configuration.

[0043] Providing the first and second module housings with first and second effective distances between their respective substrate exits and substrate inlets is particularly beneficial when reconfiguring the vacuum-coated system and replacing modules with other modules, thereby leaving the remaining modules, which are not directly involved in the reconfiguration, substantially unchanged in terms of both their position and orientation in the first and second configurations of the vacuum-coated system.

[0044] In a further example, at least one of a first module housing and a second module housing includes a first side wall having a first through recess, the first through recess extending through the first side wall and configured to receive a first substrate processing unit through the first through recess. By providing the first through recess in the first side wall, the substrate processing unit can be removably and reconfigurably connected or arranged in the first or second module housing or inside thereof. This enables interchangeable arrangement of different substrate processing units in one of the first and second module housings and / or inside thereof.

[0045] In some examples, this substrate processing unit, or substrate processing units of various different configurations, can be fastened to a first side wall and / or adjacent to a through recess. This makes it possible to install and fasten the substrate processing unit to the side wall, and therefore to the respective module housing or its interior, with considerable ease.

[0046] In a further example, at least one of the first module housing and the second module housing includes a second side wall having a second through recess, the second through recess extending through the second side wall. The second through recess and / or the second side wall is configured to receive a second substrate processing unit through the second through recess and / or the second side wall. Here, each module housing can be configured for simultaneous processing of both sides or two sides of a strip substrate, extending through each module housing, for example, from each substrate inlet to each substrate outlet and / or through each substrate outlet.

[0047] In some examples, when the first or second module housing includes first and second side walls having first and second through recesses, the two side walls or through recesses can generally be equipped with the same or identical substrate processing units or different substrate processing units. When the first and second side walls or through recesses of the same configuration have the same substrate processing units, substantially identical surface treatment can be provided for two surfaces of a strip substrate inside each of the first or second modules.

[0048] When first and second substrate processing units are equipped with first and second sidewalls having first and second through recesses, different surface treatment processes can be provided on both sides of a strip substrate. Here, the substrate processing provided by the first processing unit can support or improve the process or substrate processing provided or implemented by the second substrate unit.

[0049] In a further example, one of the first and second module housings includes a first side wall having a first through recess and a second side wall having a second through recess. The first side wall may be located on the opposite side of the second side wall, and / or the first through recess may be located on the opposite side of the second through recess.

[0050] In some examples, the first and second through recesses can be located directly opposite each other. The first and second through recesses can be located on the same plane in a direction substantially perpendicular to the surface or plane of the strip substrate being transported through the respective module housing, for example, from the first or second substrate inlet to the first or second substrate outlet.

[0051] The opposite arrangement and configuration of the first and second through recesses and / or the first and second side walls is beneficial in providing equal or at least substantially equal process conditions on both sides of the substrate.

[0052] In a further example, the substrate processing unit includes a lid configured to close and / or seal at least one of a first through-recess and a second through-recess. The lid may include a fairly planar, rigid structure. The lid may be sized to completely cover the through-hole or through-recess in at least one of the first and second side walls of each module housing. In this way, when the processing unit is placed within each module housing, the lid can cover and / or close the through-recess within the side wall of each module housing.

[0053] In some examples, the lid can be fastened to a side wall or portion of a side wall including a through recess, for example, in a removable manner. The substrate processing unit can be rigidly attached to the lid or rigidly coupled. In this way, the substrate processing unit can be easily positioned in a first or second module housing, and / or be rigidly fastened and secured, by attaching and fastening each lid of the substrate processing unit to the side wall of the module housing.

[0054] Here, the boundary region of the through recess in the first or second side wall may be equipped with a complementary fastening structure to the opposing fastening structure of each substrate processing unit.

[0055] In a further example, the substrate processing unit includes one of an evaporator, a magnetron, a plasma source, a heating unit, and a cooling unit. Thus, the substrate processing unit can be made operable to modify the temperature of the substrate. In a further example, the substrate processing unit can be configured to generate plasma within its respective module housing, thereby allowing a coating or layer of material to be deposited on the surface of a strip substrate, for example, by physical vapor deposition (PVD).

[0056] In some examples of vacuum coating systems, a number of substrate processing units are provided as described above. One or more evaporators and / or one or more plasma sources, as well as one or more heating units or one or more cooling units can be provided. Here, each module may comprise a single substrate processing unit or a number of the substrate processing units described above. In this way, the vacuum coating system can be easily and reconfigurably adapted to the fluctuating requirements of the processing process for strip substrates.

[0057] In a further example, one of the first and second modules may be equipped with a replaceable first substrate processing unit, and the first substrate processing unit may be replaced with the second substrate processing unit. Thus, each module may be equipped with different substrate processing units in a variable and reconfigurable manner.

[0058] In other examples, one identical module, for example, a first module and a second module, may comprise two or more substrate processing units. Here, at least one of the first module and the second module may comprise a first substrate processing unit and a second substrate processing unit, or even a third substrate processing unit. In this way, by providing a module with multiple identical or multiple different substrate processing units, the operability and functionality of each module can be modified in principle.

[0059] In a further example, a substrate transport unit includes one of the transport rollers, deflection rollers, tension rollers, and coilers. The coilers and the rollers mentioned above can be driven passively or actively, for example, by a drive.

[0060] In the case of transport rollers, strip substrates can be transported linearly through each module or module housing, for example, in a fairly linear and / or non-deflectional configuration. In the case of deflection rollers, the transport direction of the strip substrates can be changed within each module equipped with deflection rollers. Deflection rollers can provide reorientation or reversal of the transport direction of the strip substrates, and thus bending or deflection, for example, by about 90°, about 60°, about 45°, or about 30°.

[0061] Specifically, if a module is equipped with a transport module or configured as a transport module and includes deflection rollers, the substrate inlet is not located on the opposite side of the substrate outlet. Conversely, if, for example, the deflection rollers provide deflection in the substrate transport direction of, for example, 90°, the substrate inlet can be located within a third side wall and the substrate outlet within a fourth side wall, with the third side wall adjacent to the fourth side wall rather than on the opposite side of it. This can be particularly true for rectangular or cubic module housings.

[0062] In a further example, at least one of the first module housing and the second module housing includes a third side wall and a fourth side wall. The third side wall provides either a first or second substrate inlet, and the fourth side wall provides either a first or second substrate outlet. In some examples, the module housings of the first and second modules are cubic or rectangular. Here, when viewed in a direction traversing the substrate transport direction, the first and second side walls may be located on opposite sides of each other. The third and fourth side walls may also be located on opposite sides of each other. In some examples, the third side wall may be located between the first and second side walls, and the fourth side wall may be located on the opposite side between the first and second side walls.

[0063] However, specifically when the substrate transport unit includes deflection rollers, the third and fourth side walls are not necessarily located on opposite sides of each other. The third and fourth side walls can be positioned adjacent to each other, and each can include a surface normal extending at an angle of 30° to 60° relative to the other.

[0064] In a further example, the third side wall is located opposite the fourth side wall, and / or the third substrate inlet is located opposite the first substrate outlet, and / or the second substrate inlet is located opposite the second substrate outlet. In any case, when the third side wall is located opposite the fourth side wall, and the third side wall has a substrate inlet, and the fourth side wall has a substrate outlet, each module provides and / or supports fairly linear, and therefore unbiased, substrate transport from the substrate inlet to the substrate outlet and through the substrate outlet.

[0065] The first and second side walls may include surface normals substantially parallel to the surface normal of the strip substrate being transported through the respective module or module housing. Thus, the first and / or second through recesses provided in the first and second side walls of each housing face the surface of the strip substrate to be processed, for example, coated, by the vacuum coating system.

[0066] In further examples, the third side wall is adjacent to or near the fourth side wall. At least one of the first and second substrate inlets extends at a predetermined angle to the first and second substrate exits of the same module housing. Such examples are particularly relevant when each module or module housing is equipped with a transport unit that provides deflection or reorientation of strip substrates within each module housing.

[0067] For example, in the case of a deflection roller that changes the substrate transport direction by 90°, the substrate inlet can extend at an angle of approximately 90° to the substrate outlet of the same module housing. In other examples, when the deflection roller defines a change or deflection of the substrate transport direction by, for example, about 30° or about 45°, the substrate inlet and associated substrate outlet of the same module housing can extend at respective angles to each other to provide the respective transport of substrates through the module housing.

[0068] In a further example, the first module housing includes a first mechanical coupling structure at the first substrate inlet and further includes a first mechanical opposing coupling structure at the first substrate outlet. The second module housing includes a second mechanical coupling structure at the second substrate inlet and further includes a second mechanical opposing coupling structure at the second substrate outlet, where the first mechanical coupling structure is complementary to at least one of the first mechanical opposing coupling structure, the second mechanical coupling structure, and the second opposing coupling structure. In this way, a clearly defined and reconfigurable mechanical fastening of the first and second module housings can be provided via the respective mechanical coupling structures and mechanical opposing coupling structures.

[0069] In some examples, the second mechanical coupling structure can be substantially identical to the first mechanical coupling structure. Similarly, the second mechanical opposing coupling structure can be identical to the first mechanical opposing coupling structure. In this way, the first substrate outlet of the first module housing equipped with the first mechanical opposing coupling structure can be connected to the second coupling structure located at the second substrate inlet of the second module housing. Similarly, the second substrate outlet of the second module housing equipped with the second mechanical opposing coupling structure can be detachably connected to the first mechanical coupling structure provided at the first substrate inlet of the first module housing. In this way, the order or sequence of the first and second module housings can be changed as required.

[0070] In another example, at least one of the first module housing and the second module housing is alignable in either a horizontal or vertical orientation. In the horizontal orientation, the substrate inlet is separated from the substrate outlet along the horizontal direction. In the vertical orientation, the substrate inlet is separated from the substrate outlet along the vertical direction.

[0071] In some examples, various modules can be provided to be arranged in different orientations, for example, horizontally or along horizontal orientation, and / or vertically or in a specific direction, or along vertical orientation or direction.

[0072] In other examples, the first module and / or the second module can be positioned in either orientation. Here, the first module or the first module housing can be configured for use in both horizontal and vertical orientations. This can be widely useful in different orientations and can be reconfigurable and / or connectable or mountable to adjacent modules in order to establish or contribute to a reconfigurable vacuum-clad system.

[0073] In a further example, a vacuum coating system is configured to coat a strip metal substrate, such as steel, with a metallic material or metal alloy containing at least one or more of the following: zinc, aluminum, nickel, chromium, magnesium, or titanium, or a combination thereof, for example by physical vapor deposition (PVD).

[0074] In another aspect, the disclosure also relates to a method for configuring or reconfiguring a vacuum coating system as described above, wherein the method includes providing a first module housing and a second module housing, and providing a substrate transport unit and a substrate processing unit. The method for configuring or reconfiguring a vacuum coating system includes substitutedly arranging the substrate transport unit in either the first module housing or the second module housing, and substitutedly arranging the substrate processing unit in the other of the first module housing or the second module housing. Alternatively, the method includes substitutedly connecting the first module and the second module to at least one of a first and a second substrate inlet, and at least one of a first and a second substrate outlet, wherein the first module may be equipped with either the substrate transport unit or the substrate processing unit, and the second module may be equipped with the other of the substrate transport unit or the substrate processing unit.

[0075] It should be noted that the methods for configuring or reconfiguring a vacuum-coated system are specifically implementable by the vacuum-coated system itself, as described above. To that extent, all the effects, configurations, and benefits described above in relation to the vacuum-coated system are equally applicable to the methods for configuring the vacuum-coated system; and vice versa.

[0076] The following describes in more detail, with reference to the drawings, the vacuum coating system and its components such as individual modules, as well as numerous examples of how to configure or reconfigure the vacuum coating system. [Brief explanation of the drawing]

[0077] [Figure 1] This diagram schematically shows an example of a vacuum coating system for covering a strip-shaped substrate. [Figure 2] This figure shows another example of a vacuum coating system. [Figure 3] This figure shows an example of a vacuum coating system module. [Figure 4] This diagram schematically shows another configuration of a module for use in a vacuum coating system. [Figure 5] This diagram schematically shows a processing unit implemented as an evaporator. [Figure 6] This figure shows another example of an evaporator. [Figure 7] This figure shows further examples of evaporators. [Figure 8] This figure shows an example of another processing unit implemented as a magnetron. [Figure 9] This figure shows another example of a processing unit implemented as a plasma source. [Figure 10] This diagram schematically shows another example of a processing unit to be placed inside one of the modules of a vacuum coating system. [Figure 11] This figure shows another example of a processing unit implemented as a cooling unit. [Figure 12] This figure shows an example of a transport unit that includes multiple transport rollers. [Figure 13] This figure shows another example of a transport unit that includes tension rollers. [Figure 14] This figure shows another example of a transport unit that includes deflection rollers. [Figure 15] This figure shows another example of a transport unit that includes a coira. [Figure 16] This figure shows an example of a module housing. [Figure 17] This figure shows another example of a modular housing. [Figure 18] This figure shows another example of a modular housing. [Figure 19] This figure shows another example of a modular housing. [Figure 20] This figure shows another example of a modular housing. [Figure 21] This figure shows another example of a modular housing. [Figure 22] This figure shows another example of a modular housing. [Figure 23] This figure shows another example of a modular housing. [Figure 24] This figure shows another example of a modular housing. [Figure 25] This figure shows another example of a modular housing. [Figure 26] This figure shows another example of a modular housing. [Figure 27] This figure shows another example of a modular housing. [Figure 28] This figure shows an example of the connection and opposing connection structure of the first and second modules. [Figure 29] This figure shows further details of the corresponding connecting and opposing connecting structures of adjacent module housings. [Figure 30] This is a diagram showing the first configuration of the vacuum coating system. [Figure 31] This diagram shows the second configuration of the vacuum coating system. [Figure 32] This figure shows the third configuration of the vacuum coating system. [Figure 33] This is a flowchart illustrating the method for constructing a vacuum coating system. [Modes for carrying out the invention]

[0078] Figures 1 and 2 show two different configurations or examples of a vacuum coating system 10 according to the present invention. The vacuum coating system includes a number of modules 20, 40 that define a substrate transport path extending through an arrangement of a number of modules. The vacuum coating system 10 according to Figure 1 includes a number of modules A, B, C, D, E, F, G, H, I, J, K arranged in series. The entire vacuum coating system 10 is comprised of the arrangement of these individual modules, each of which is equipped with at least one of a substrate transport unit 50 and a substrate processing unit 60.

[0079] In the example shown in Figure 1, module A is provided, implemented as a second module 40, which is equipped with a substrate transport unit 50 in the form of a coiler 55. Module A is connected to a further module B, which is also implemented as a second module 40'. Here, the substrate exit of module A is connected to the substrate inlet of module B. Module B comprises another substrate transport unit 50, which includes deflection rollers 53. A further module C is connected to module B and implemented, for example, as a substrate processing module. The substrate exit of module B is connected to the substrate inlet of module C. Module C can be implemented as a first module 20, which includes a first module housing 21 and is equipped with a substrate processing unit 60, which can be implemented as a plasma source 64, or may include a plasma source 64.

[0080] Module C is further connected to another module D. Module D is also implemented as a kind of first module 20' and likewise does not include the transport unit 50. Module D may include another substrate processing unit 60, implemented as, for example, a magnetron 63. The substrate outlet of module C is connected to the substrate inlet of module D.

[0081] The substrate exit of module D can be directly connected to the substrate inlet of another module E. Module E can be implemented as another substrate transport module, and therefore as a second module 40''. Module E may include another transport unit 50, which may include, for example, an additional deflection roller 53. The substrate exit of module E is connected to the substrate inlet of another module F. Module F can be implemented as a substrate transfer or substrate transport module. Module F does not have to include a substrate processing unit. Alternatively, module F may be equipped with a substrate processing unit 60 and / or a substrate transport unit 50.

[0082] The substrate outlet of module F is connected to the substrate inlet of another module G, and module G is also implemented as a substrate transport module. Module G includes a transport unit 50, which has, for example, deflection rollers 53. The substrate outlet of module G is connected to the substrate inlet of another module H, and module H is implemented as another first module 20''. Module H includes a substrate processing unit 60, which includes, for example, an evaporator 62. The substrate outlet of module H is connected to the substrate inlet of a further module I, and module I is also implemented as a first module 20'''. Module I is equipped with another substrate processing unit 60, which is implemented as, for example, another evaporator 62'.

[0083] The substrate exit of module I is connected to the substrate inlet of another module J, which is mounted as a substrate transport module and includes another deflection roller 53. The substrate exit of module J is finally connected to the substrate inlet of a further module K, which comprises a transport unit 50 and includes another coiler 55.

[0084] Modules B, E, G, and J include deflection rollers 53, which can be used to modify the substrate supply or transport direction. The strip substrate 5 is initially placed on a coil, which can be unrolled by the coiler 55 of module A. Here, the initial substrate transport direction to the adjacent module B is substantially horizontal.

[0085] In the adjacent module B, the strip substrate 5 is deflected upward by the deflection roller 53. Accordingly, the next module C is positioned above module B. Module D is positioned above module C. Module E is positioned above module D. Thus, a module arrangement 11 including modules B, C, D, and E is provided, through which the substrate 5 is transported upward or vertically. The module arrangement 11 forms or constitutes a row of individual modules for transporting and / or processing the substrate 5.

[0086] In module E, the substrate 5 is again deflected horizontally. The substrate 5 is transported or supplied through module F and then deflected downward in module G. Below module G are module H and then module I, after which the substrate 5 enters transport module J below module I, where the substrate 5 is again deflected horizontally. Module arrangement 12, including modules G, H, I, and J, defines a vertically downward-facing module row, and module arrangement 11 defines a vertically upward-facing arrangement or set of modules B, C, D, and E.

[0087] After the substrate 5 is deflected in module J, the substrate 5 is further supplied and transported to terminal module K, where the strip substrate 5 is wound up by a further coiler 55.

[0088] The surface treatment of the substrate 5 is carried out using multiple processing modules C, D, H, and I, where the surface of the substrate 5 is heated, pretreated, and / or coated, for example, by physical vapor deposition. The vertical arrangement of the multiple processing modules C, D, H, and I is beneficial for the simultaneous treatment or coating of two surfaces of the substrate 5, where the effect of gravity is equal on both sides of the substrate 5.

[0089] Furthermore, vertically extending columns consisting of individual modules B, C, D, E, or G, H, I, J, and thus the respective module arrangements 11, 12, can minimize the overall occupied area and installation space of the vacuum coating system 10.

[0090] Figure 2 shows another configuration of the vacuum coating system 10, where the vacuum coating system 10 includes a single continuous horizontal arrangement consisting of modules A, B, C, D, and F. Modules A, F represent end or terminal modules, and each of these modules is equipped with coilers 55, 55. Each transport unit 50 located within or provided by these modules A, F may be further provided by tension rollers 54. The coating system 10 may include transport units 50 whose overall length can be freely changed. The coating system 10 may include a roll-to-roll arrangement, where the substrate 5 is suspended within the loading area, for example, in one of modules B, C, D, or E, without physical or mechanical contact with rollers.

[0091] Between modules A and F, a row consisting of modules B, C, D, and E is arranged. Modules B, C, D, and E are all implemented as so-called processing modules. All of these modules are equipped with processing units 60 of a type that can, in principle, provide surface treatment to the substrate 5. The substrate outlet of module A is connected to the substrate inlet of module B. The substrate outlet of module B is connected to the substrate inlet of module C. The substrate outlet of module C is connected to the substrate inlet of module D. The substrate outlet of module D is connected to the substrate inlet of module E. The substrate outlet of module E is connected to the substrate inlet of module F.

[0092] As shown in Figure 2, modules B, C, D, and E have substrate inlets and outlets located on opposite sides of each other, thereby providing fairly linear and deflection-free substrate transport from module A to module F.

[0093] Module B in Figure 2 includes, for example, a plasma source 64 for pretreatment of the substrate 5. Module C includes, for example, a magnetron 63 for surface treatment of the substrate 5 based on sputtering. Module D includes, for example, a first evaporator 62 for depositing a first evaporative material, and a subsequent module E may include, for example, another evaporator 62' for depositing another evaporative material onto the surface of the substrate 5.

[0094] The configuration of the vacuum coating system 10 shown in Figure 2 can be configured specifically for processing one side. However, the configuration of the vacuum coating system 10 according to Figure 2 can also be suitable for processing both sides of the substrate 5. The configuration shown in Figure 1 is specifically for processing both sides of the substrate 5. Modules C, D, H, and I are implemented as substrate processing modules, and therefore each comprises a processing unit 60, including a double arrangement of each processing unit. Thus, module C includes two individual plasma sources 64, which are located on both sides of the substrate 5. Module D includes two magnetrons 63, which are located on both sides of the substrate 5. Similarly, modules H and I each include two evaporators 62, 62' on both sides of the substrate 5.

[0095] As described below, individual modules, such as the first module 20 and the second module 40, are specifically configured for the reconfiguration of the entire vacuum coating system 10, in particular to facilitate the adaptation of the vacuum coating system to various requirements for the coating or surface treatment process of the substrate 5.

[0096] The end or terminal modules A and K in Figure 1 can be closed and / or sealed by a vacuum-sealed closure 51. The same can be applied to modules A and F in the configuration shown in Figure 2. Thus, the interiors of the individual modules AK and AF can be subjected to relatively low pressures, e.g., vacuum pressures, obtained by their respective connection or coupling with one or more vacuum pumps. In some examples, the interiors of all modules AK or AF shown in Figures 1 and 2 are fluid-coupled in the interest of providing a constant reduced pressure level in all chambers formed by the individual modules or module housings.

[0097] Alternatively, Coiler 55 can be replaced with an airlock, which allows for the transfer of an endless strip of substrate from atmospheric pressure outside modules AK and AF to the vacuum pressure inside the interconnected modules AK or AF.

[0098] Hereafter, terms such as "first module" and "second module" refer only to different modules of the vacuum coating system. Even when the first module is primarily described as containing a substrate processing unit and the second module as containing a substrate transport unit, such assignments are rather arbitrary and are not limited in terms of the usefulness of the first and second modules as module housings.

[0099] Typically, as is evident from the configurations shown in Figures 1 and 2, each module comprises one substrate transport unit 5 and / or one substrate processing unit 60. As an example, module H in Figure 1 can be considered the first module 20''. The first module 20'' includes a first module housing 21, which has a first substrate inlet 22 and a first substrate outlet 23.

[0100] As shown in particular in detail in Figure 16, the first module housing 21 can be somewhat rectangular or cubic in shape. The first module housing 21 includes a first side wall 24 with a first through recess 25, and further includes a second side wall 26 with a second through recess 27. The first module housing 21 further includes a third side wall 28 with a first substrate inlet 22, and further includes a fourth side wall 29 with a first substrate outlet 23. During operation, the first module 20 receives a substrate 5 through the first substrate inlet 22. The substrate 5 extends through the first module housing 21 and exits the first module housing 21 through the first substrate outlet 23. The first module housing 21 can be or may exclusively accommodate one or two processing units 60. In the example of module H, the first module 20'' may have two evaporators 62 within the through recesses 25, 27.

[0101] For example, each evaporator 62, shown in detail in Figures 5 to 7, may include a lid 61 sized and configured to close and / or seal through-holes 25, 27 in the first and second side walls 24, 26. In the example of Figure 6, the evaporator 62 or at least a portion thereof is configured to be located outside the module housings 21, 41, where only the nozzle 68 extends through the lid 61 and enters the interior of each module housing 21, 41. Both evaporators 62 shown in Figures 5 and 6 are configured exclusively for such module housings 21, through which the substrate 5 is transported vertically.

[0102] The evaporator 62 shown in Figure 7 is configured to be used with the module housings 21 and 41, through which the substrate 5 is transported horizontally.

[0103] The cooling unit 66 shown in Figure 11 may be equipped with multiple rollers that are actively or passively cooled, thereby directing their respective cooling effects onto the substrate 5.

[0104] As further shown in Figure 16, the first substrate inlet 22 includes a first connecting structure 32, which is mounted, for example, as a flange 34. The first substrate outlet 23, located on the opposite side, may include opposing connecting structures 33, which are mounted, for example, as opposing flanges 34'.

[0105] In some examples, the first mechanical coupling structure 32 can be complementary to the first mechanical opposing coupling structure 33. In this way, modular housings 21, 21' of the same shape or of the same or common type can be placed adjacent to each other and coupled, so that the first mechanical coupling structure 32 of another first modular housing 21' can be coupled to the first mechanical opposing coupling structure 33 of the first modular housing 21.

[0106] In this way, as shown in the configuration of Figure 1, the substrate inlet of module 20'', and therefore the substrate inlet of module I, can be connected to the substrate outlet of module H, and therefore to the substrate outlet of module 20''. In the example shown, modules 20'', 20'''' include a first module housing 21 of the same shape. Thus, a first mechanical coupling structure 32 provided at the substrate inlet 22 of module 20'''' can be connected to a first mechanical opposing coupling structure 33 provided at the substrate outlet 23 of module 20''.

[0107] In the same or similar manner, an example of a second module 40 equipped with a second module housing 41 also includes first and second side walls 44, 46 and third and fourth side walls 45, 47. The third side wall 45 provides a second substrate inlet 42. The fourth side wall 47 provides a second substrate outlet 43. The second substrate inlet 42 provides a second mechanical coupling structure 48, and the second substrate outlet 43 provides a second mechanical opposing coupling structure 49. Here again, the second mechanical coupling structure 48 can be complementary to the second mechanical opposing coupling structure 49. The second mechanical opposing coupling structure 49 can also be complementary to the first mechanical coupling structure 32 of the first module housing 21. Similarly, the second mechanical coupling structure 48 can be complementary to and correspond to the first mechanical opposing coupling structure 33 of the first module housing 21.

[0108] Numerous examples of the first module housing 21 shown in Figures 16 to 21 each include a first substrate inlet 22 and a first substrate outlet 23. In the examples of Figures 16 and 17, the substrate inlet 22 and substrate outlet 23 are located on both sides of the first module housing 21. In the examples of Figures 18 to 21, the substrate inlet 22 and substrate outlet 23 are located on or within a side wall, adjacent to each other. Here, the first module housing 21 can be configured not only to receive or provide housing for a substrate processing unit 60, but also to provide installation space for a substrate transport unit 50, in particular for deflection rollers 53, which can accordingly modify the orientation or direction of feeding or transporting substrates 5 through each of the first module housings 21.

[0109] In all the examples shown in Figures 16 to 21, the module housing 21 includes at least one through-recess 25, 27 configured to receive a substrate processing unit 60, for example, one of the substrate processing units shown in any of Figures 5 to 11. Most, if not all, of the substrate processing units 60 shown in Figures 5 to 10 are provided with a lid 61 of a size and shape such as to close and / or seal the through-recess 25, 27 of each first module housing 21. The through-recess 25 may be provided with a kind of flange structure, thereby facilitating the removable, and therefore reconfigurable fastening and / or placement of various substrate processing units 60 in or into each of the through-recess 25, 27.

[0110] The substrate processing unit 60 may take the form of, for example, an evaporator 62, a magnetron 63, a plasma source 64, a heating unit 65, or a cooling unit 66, and may be removably fastened to the module housing 21 through the cover 61. To that extent, the cover 61 may provide a support and / or fastening structure for removably fastening and / or positioning the substrate processing unit 60 inside the module housing 21.

[0111] Figures 22 to 27 show numerous examples of a second module 40 including a second module housing 41, the second module housing 41 equally comprising a second substrate inlet 42 and a second substrate outlet 43, similar to the first module housing 21. In the example configurations shown in Figures 22 and 23, the substrate inlet 42 is located opposite the substrate outlet 43. In other configurations or examples shown in Figures 24 to 27, the side walls of the second module housing 41, equipped with the substrate inlet 42 and the substrate outlet 43, are arranged adjacently and therefore adjacent to one another.

[0112] In the examples shown in Figures 24 to 27, each second module 40, and therefore each second module housing 41, is typically equipped with a substrate transport unit 50, which includes, for example, deflection rollers 53, by which the substrate supply or transport direction can be corrected within each module housing 41.

[0113] Figures 12 to 15 show several examples of transport units 50 configured to be placed within a first module housing 21 and / or a second module housing 41. The transport unit 50 according to Figure 12 includes a number of transport rollers 52, which can transport substrates 5 in or along a predetermined transport or supply direction.

[0114] Figure 13 shows a transport unit 50 including at least one or more tension rollers 54. Here, the multiple transport rollers 52 are positioned alternately or slightly offset from the surface normal of the substrate 5. In this way, longitudinal or transverse tension can be induced in the planar strip substrate 5.

[0115] Figure 14 shows an example of a transport unit 50 including a deflection roller 53. The deflection roller 53 can be used to adjust the transport direction of the substrate 5 as it passes through the respective first or second module housings 21, 41.

[0116] Figure 15 shows another example of a transport unit 50 including a coiler 55, which is mounted to unfold the strip substrate 5 from the coil or to wind the strip substrate 5 onto the coil, for example, as shown in the final modules A and K in Figure 1.

[0117] In some examples, for the sake of fairly easy and straightforward reconfiguration of the entire vacuum coating system 10, the size, for example, the effective distance between the substrate inlets 22, 42 and substrate outlets 23, 43 of individual modules 20, 40 is specifically intended to conform to clearly defined grid dimensions or module dimensions.

[0118] Figure 16 illustrates the first effective distance D1 between the first substrate inlet 22 and the first substrate outlet 23 of the first module 20. The respective second effective distances D2 between the second substrate inlet 42 and the second substrate outlet 43 are illustrated in Figure 22 by an example of the second module housing 41. For the general and fairly flexible reconfiguration of the vacuum coating system 10, the second effective distance D2 is intended to be identical or equivalent to the first effective distance D1. Alternatively, the first effective distance D1 is identical or equivalent to an integer multiple n of the fraction f of the second effective distance D, where f is one of 1 / 2, 1 / 3, 1 / 4, 1 / 5, 1 / 6, 1 / 7, or 1 / 8, and n is one of 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, or 16.

[0119] Thus, to obtain a configuration different from the vacuum coating system 10 shown in Figure 1, for example, the configuration shown in Figure 2, one only needs to replace one or more modules equipped with one of the transport unit and substrate processing unit with one or more other modules equipped with different substrate transport unit and different substrate processing unit. Alternatively, one could maintain the structure of the interconnected first, second and further optional module housings and replace at least one of the substrate processing unit and substrate transport unit in the module with another substrate processing unit or transport unit.

[0120] In the example in Figure 16, the first effective distance D1 is substantially the same as the second effective distance D2 of the second module housing 41 shown in Figure 22, for example. However, in the example in Figure 3, the second effective distance D2 of the second module housing 41 can be three times the size of the first effective distance D1. In the example in Figure 4, the second effective distance D2 can be twice the size of the first effective distance D1.

[0121] Since the first effective distance D1 is the same as or equivalent to n / f of the second effective distance D2, n modules or module housings having the second effective distance D2 can be replaced by f first module housings, each containing the first effective distance D1.

[0122] Figure 3 shows an example of a module arrangement 13 made from, for example, a collection of three individual module housings 21, 21', 21''. The module arrangement 13 includes a substantially equal row of first module housings 21, 21', 21''. The individual module housings 21, 21', 21'' are mounted as shown in Figure 16, but rotated by approximately 90°. The module housings 21, 21', 21'' include first and second side walls 24, 26, each of which has through recesses 25, 27, which are closed by lids 61. As shown, only the lower through recess 25 provided in the first side wall 24 houses the processing unit 60. The first module housing 21 houses a plasma source 64. The second module housing 21' houses an evaporator 62, and the third module housing 21'' houses another plasma source 64.

[0123] In the example shown in Figure 3, the third side wall 28 of the module housing 21 includes a substrate inlet 42. The side wall 29 located on the opposite side is directly connected to the third side wall 28' of the next or subsequent adjacent module housing 21'. On the opposite side of the third side wall 28', the second module housing 21' includes a fourth side wall 29', which is similarly connected to the third side wall 28' of the third module housing 21''. On the opposite side of the third side wall 28'', the second module housing 21'' includes a fourth side wall 2'', which has a substrate outlet 43.

[0124] The arrangement of the three individual first module housings 21, 21', and 21'' forms or constitutes a module arrangement 13, which can represent a second module 40 that can constitute a second module housing 41.

[0125] The effective distance D2 between the substrate inlet 42 and the substrate outlet 43 can be, for example, three times the effective distance D1.

[0126] Figure 4 shows another example of a second module 40 having a separate second module housing 41. Here, module 40 can be equipped to some extent with the same substrate processing units 60, 60', 60'' as described in relation to Figure 3. However, in Figure 4, the module housing 41 has a single body having a first side wall 24 with numerous through recesses 25, 25', and 25'' and a second side wall 26 located on the opposite side without recesses or through openings. A third side wall 45 extending between one end of the opposite side walls 24 and 26 provides a substrate inlet 42. A fourth side wall 47 providing a substrate outlet 43 is located on the opposite side of the third side wall 45. Again, the substrate inlet 42 is separated from the substrate outlet 43 by a second effective distance D2, the second effective distance D2 is equivalent to the first effective distance D1, and the first effective distance D1 is equivalent to one of the integer multiples n / f, where n and f are the integers described above.

[0127] Figures 30 to 32 show three different operating configurations of the vacuum coating system. In the first operating configuration shown in Figure 30, the first module 20 is connected to the second module 40. In particular, the first substrate outlet 23 is connected to the second substrate inlet 42. If a third module 80 is to be present, the second substrate outlet 43 of the second module 40 can be connected to the third substrate inlet 82 of the third module housing 81. As will be described in more detail in relation to Figures 28 and 29, the substrate inlets 22, 42, 82 and substrate outlets 23, 43, 83 are provided with corresponding or complementary mechanical coupling structures 32, 48 and mechanical opposing coupling structures 33, 49, thereby supporting and enabling the variable coupling of the individual modules 20, 40, 80.

[0128] Accordingly, in the second operating configuration shown in Figure 31, the positions of the first module 20 and the second module 40 are swapped. The second board outlet 43 of the second module 40 or module housing 41 is connected to the first board inlet 22 of the first module housing 21. In some cases, only when a third module 80 should be present in the second operating configuration, the first board outlet 23 of the first module housing 21 is connected to the third module 80 or the third board inlet 82 of module housing 81.

[0129] Such a configuration is made possible because the first and second substrate inlets 22, 42 and the first and second substrate outlets 23, 43 are equipped with common mechanical coupling structures 32, 48 and common mechanical opposing coupling structures 33, 49.

[0130] In the third operating configuration shown in Figure 32, the arrangement shown in Figure 30 includes three individual modules 20, 40, and 80. Here, in the first configuration, module 80, which has a third module housing 81, is connected to the second module 40. The second module 40 is positioned and arranged between the first module 20 and the third module 80. To transfer the vacuum coating system 10, and therefore the arrangement of the individual modules, from the first operating configuration shown in Figure 30 to the third operating configuration shown in Figure 32, the interconnections between the first, second, and third modules 20, 40, and 80 are temporarily deactivated or released, and the second module 40 is removed.

[0131] To transport the modules in the third operational configuration shown in Figure 32, the first substrate outlet 23 of the first module housing 21 is connected to the third substrate inlet 82 of the third module housing 81 of the third module 80. In the example shown herein, the third module 80 includes the third substrate outlet 83 within a side wall adjacent to the side wall having the third substrate inlet 82. Here, the third module 80 may be equipped with transport units 50 such as deflection rollers 53.

[0132] The variable interconnections of the individual modules 20, 40, 80 and module housings 22, 41, 81 are provided by standardized mechanical coupling structures and mechanical opposing coupling structures, respectively.

[0133] For example, an example of interconnection between the first and second housings 20 and 40 according to the second operating configuration in Figure 31 is shown in Figure 28. The first module housing 21 is located below the second module housing 41. Accordingly, the first substrate inlet 22 is connected to the second substrate outlet 43. The first substrate inlet 22 is equipped with a first mechanical coupling structure 32. The second substrate outlet 43 is equipped with a second mechanical opposing coupling structure 49.

[0134] The first mechanical coupling structure 32 and the second mechanical opposing coupling structure 49 include radially extending flanges 34, the flanges 34 extending substantially perpendicular to the substrate transport direction. More specifically, as shown in Figure 29, the first mechanical coupling structure 32 includes a flange 34, and the second mechanical opposing coupling structure 49 includes a complementary opposing flange 34'.

[0135] The flange 34 has a planar sealing or flange surface 75. The complementary opposing flange 34' has a sealing or flange surface 74. One of the sealing or flange surfaces 74, 75 has a groove 70, in which a sealing body 72, such as an O-ring, is located. The groove 70 and the entire flange can constitute a circumferentially closed structure. The sealing body 72 can protrude slightly from each sealing surface 74 and can undergo elastic deformation when both sealing surfaces 74, 75 are pressed together.

[0136] To connect flange 34 to opposing flange 34', flange 34 and opposing flange 34' each have through-holes 35, 35', and the through-holes 35, 35' are aligned longitudinally when the sealing or flange surfaces 74, 75, and thus the substrate inlet 22, are aligned with the substrate outlet 43. The channel formed by the aligned through-holes 35, 35' is sized to receive a fastening element 36, which presses together flange 34 and opposing flange 34' to provide a sealing engagement between the coupling structure 32 and the opposing coupling structure 49. In the example shown herein, the fastening element 36 includes a longitudinally extending bolt 38, the bolt 38 having a radially widened head at one longitudinal end and a screw-engageable nut 37 at the other longitudinal end. The head 39 and nut 37 are located on either side of flange 34 and opposing flange 34', facing away from each other.

[0137] In some examples, flanges 34 and opposing flanges 34' extend outward from the side walls or side wall sections of the respective module housings 21, 41. Here, the fastening elements 36 can be accessed from the outside of modules 20, 40. In other examples, the connecting structures 32, 42 and opposing connecting structures 33, 49 are located inside the respective module housings 21, 41.

[0138] In such an example, the fastening element 36 is not accessible from the outside of each module housing 21, 41. Here, the fastening element 36 can be exclusively accessible only from the inside of each module 20, 40.

[0139] It should be noted that the examples of the connecting structures 32, 48 and opposing connecting structures 33, 49 shown herein are by no means limited to interconnecting the first, second, and third module housings 21, 41, 81 with respect to each other. Numerous different methods may exist for removably interconnecting various module housings within the respective board inlet or board outlet areas.

[0140] Figure 33 shows a flowchart illustrating a method for reconfiguring the vacuum coating system 10 described herein. In step 100, at least a first module housing 21 and a second module housing 41 are provided. In step 102, at least one substrate transport unit 50 and a substrate processing unit 60 are provided. In step 104, the substrate transport unit 50 is interchangeably or removablely positioned in one of the first module housing 21 and the second module housing 41, and the substrate processing unit 60 is interchangeably or removablely positioned in the other of the first module housing 21 and the second module housing 41. The first and second module housings 21 and 41 can also be interconnected. For example, the first substrate outlet 23 of the first module housing 21 can be connected to the second substrate inlet 42 of the second module housing 41, thereby enabling the interconnection of the first and second module housings 21 and 41.

[0141] If a reconfiguration of the vacuum coating system 10 is required or desired in a subsequent step 106, for example, a substrate processing unit 60 located in the second module housing 41 can be replaced with another substrate processing unit 60'.

[0142] Alternatively, the arrangement order of such modules 20 and 40 can be modified. In this case, the reconfiguration performed in step 106 includes rearranging the module housings 21 and 41. Accordingly, the arrangement order of the first and second module housings 21 and 41 can be swapped or reversed, for example, so that the first module housing 21 precedes the second module housing with respect to the substrate transport direction. Then, unlike the initial configuration obtained in step 104, the second substrate outlet 43 of the second module housing 41 can be connected to the first substrate inlet 22 of the first module housing 21. [Explanation of symbols]

[0143] 5 circuit boards 10 Vacuum coating system 11 Module Layout 12 Module Layout 13 Module Layout 20 modules 21 Module Housing 22 Circuit board input 23 Board exit 24 Side wall 25 Through recess 26 Side wall 27 Through-recess 28 Side wall 29 Side wall 32 Connection structure 33 Opposite connection structure 34 Flange 35 Through-hole 36 Fastening Elements 37 Nuts 38 volts 39 heads 40 modules 41 Module Housing 42 Circuit board input 43 Board exit 44 Side wall 45 Side wall 46 Side wall 47 Side wall 48 Connection structure 49 Opposite connection structure 50 transport units 51 Closing part 52 Transport Rollers 53 Deflection Roller 54 Tension Roller 55 Koira 60 processing units 61 Lid 62 Evaporator 63 Magnetron 64 Plasma Source 65 Heating Unit 66 Cooling Unit 67 Laura 68 nozzles 70 groove 72 Sealing body 74 Sealing surface 75 Sealing surface 80 modules 81 Module Housing 82 Circuit board entrance 83 Board exit

Claims

1. A vacuum coating system (10) for coating a strip-shaped substrate (5): - A first module (20) including a first module housing (21), the first module housing (21) includes at least one of a first substrate inlet (22) and a first substrate outlet (23), A second module (40) including a second module housing (41), the second module housing (41) includes at least one of a second substrate inlet (42) and a second substrate outlet (43), - A substrate transport unit (50) provided in one of the first module housing (21) and the second module housing (41), - Includes a substrate processing unit (60) provided in the other of the first module housing (21) and the second module housing (41), - Here, at least one of the substrate transport unit (50) and the substrate processing unit (60) is interchangeably arranged in one of the first module housing (21) and the second module housing (41), or - The vacuum coating system wherein the first module (20) and the second module (40) are interchangeably connected via at least one of the first and second substrate inlets (22, 42) and at least one of the first and second substrate outlets (23, 43), respectively.

2. The vacuum coating system (10) is transferable between a first operating configuration and at least one of a second operating configuration and a third operating configuration. - In the first operating configuration, the first board outlet (23) is directly or indirectly connected to the second board inlet (42), - In the second operating configuration, the second board outlet (43) is directly or indirectly connected to the first board inlet (22), - In a third operating configuration, the first substrate outlet (23) is directly connected to the third substrate inlet (82) of the third substrate housing (81) of the third module (80), and in the first operating configuration, the third substrate inlet (82) is directly or indirectly connected to the second substrate outlet (43), the vacuum coating system (10) according to claim 1.

3. The first module housing (21) includes a first substrate inlet (22) and a first substrate outlet (23), and the first effective distance (D1) between the first substrate inlet (22) and the first substrate outlet (23) is: - The second effective distance (D2) between the second substrate inlet (42) and the second substrate outlet (43) of the second module housing (41), - and an integer multiple n of the fraction f of the second effective distance (D2), The vacuum coating system (10) according to claim 1 or 2, which is identical or equivalent to one of the following, where f is one of 1 / 2, 1 / 3, 1 / 4, 1 / 5, 1 / 6, 1 / 7, or 1 / 8, and n is one of 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, or 16.

4. The vacuum coating system (10) according to any one of claims 1 to 3, wherein at least one of the first module housing (21) and the second module housing (41) includes a first side wall (24) having a first through recess (25), the first through recess (25) extending through the first side wall (24) and configured to receive a first substrate processing unit (60) through the first through recess (25).

5. The vacuum coating system (10) according to any one of claims 1 to 4, wherein at least one of the first module housing (21) and the second module housing (41) includes a second side wall (26) having a second through recess (27), the second through recess (27) extending through the second side wall (26) and configured to receive a second substrate processing unit (60') through the second through recess (27).

6. The vacuum coating system (10) according to claim 4 or 5, wherein one of the first module housing (21) and the second module housing (41) includes a first side wall (24) having a first through recess (25) and a second side wall (26) having a second through recess (27), the first side wall (24) being located on the opposite side of the second side wall (26), and / or the first through recess (25) being located on the opposite side of the second through recess (27).

7. The vacuum coating system (10) according to any one of claims 4 to 6, wherein the substrate processing unit (60) includes a lid (61) configured to close and / or seal at least one of the first through recess (25) and the second through recess (27).

8. The vacuum coating system (10) according to any one of claims 1 to 7, wherein the substrate processing unit (60) includes one of an evaporator (62), a magnetron (63), a plasma source (64), a heating unit (65), and a cooling unit (66).

9. A vacuum coating system (10) according to any one of claims 1 to 8, wherein one of the first module (20) and the second module (40) is interchangeably provided with a first substrate processing unit (60), and the first substrate processing unit (60) is replaceable with a second substrate processing unit (60').

10. The vacuum coating system (10) according to any one of claims 1 to 9, wherein the substrate transport unit (50) includes one of a transport roller (52), a deflection roller (53), a tension roller (54), and a coiler (55).

11. The vacuum coating system (10) according to any one of claims 1 to 10, wherein at least one of the first module housing (21) and the second module housing (41) includes a third side wall (28, 45) and a fourth side wall (29, 47), wherein the third side wall (28, 45) is provided with either a first substrate inlet (22) or a second substrate inlet (42), and the fourth side wall (29, 47) is provided with either a first substrate outlet (23) or a second substrate outlet (43).

12. The vacuum coating system (10) according to claim 11, wherein a third side wall (28, 45) is located opposite to the fourth side wall (29, 47), and / or a first substrate inlet (22) is located opposite to the first substrate outlet (23), and / or a second substrate inlet (42) is located opposite to the second substrate outlet (43).

13. The vacuum coating system (10) according to claim 11, wherein the third side wall (28, 45) is adjacent to or close to the fourth side wall (29, 47), and at least one of the first substrate inlet (22) and the second substrate inlet (42) extends at a predetermined angle to the first substrate outlet (23) and the second substrate outlet (43) of the same module housing (21, 41).

14. The vacuum coating system (10) according to any one of claims 1 to 13, wherein the first module housing (21) includes a first mechanical coupling structure (32) located at a first substrate inlet (22) and a first mechanical opposing coupling structure (33) located at a first substrate outlet (23), and the second module housing (41) includes a second mechanical coupling structure (48) located at a second substrate inlet (42) and a second mechanical opposing coupling structure (49) located at a second substrate outlet (43), and the first mechanical coupling structure (32) is complementary to at least one of the first mechanical opposing coupling structure (33), the second mechanical coupling structure (48), and the second mechanical opposing coupling structure (49).

15. A method for constructing a vacuum coating system (10) according to any one of claims 1 to 14: - Steps include providing the first module housing (21) and the second module housing (41), - The method includes the step of providing a substrate transport unit (50) and a substrate processing unit (70): i) A step of arranging the substrate transport unit (50) interchangeably in one of the first module housing (21) and the second module housing (41), and arranging the substrate processing unit (60) interchangeably in the other of the first module housing (21) and the second module housing (41), or ii) A step of interchangeably connecting the first module (20) and the second module (40) via at least one of the first and second substrate inlets (22, 42) and at least one of the first and second substrate outlets (23, 43), respectively. The method comprising at least one of the following.

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