Intake system for semiconductor process equipment, semiconductor process equipment, and intake method

Abstract

This application relates to the semiconductor technology field, and more specifically to an intake system for semiconductor process equipment, semiconductor process equipment, and an intake method. The intake system includes a water storage tank, a gas storage tank, a water vapor transport pipeline, and a gas supply pipeline. The water storage tank has a water supply connection port that can be connected and disconnected, and a first heating device is provided in the water storage tank. Both ends of the water vapor transport pipeline communicate with the exhaust port of the water storage tank and the intake port of the gas storage tank, respectively. The gas storage tank communicates with the process chamber of the semiconductor process equipment via the gas supply pipeline in a way that allows it to be connected and disconnected, and when one of the water supply connection port and the water vapor transport pipeline is in a connected state, the other is in a disconnected state.

Description

Technical Field

[0001] This application belongs to the technical field of semiconductors, and specifically relates to an intake system of semiconductor process equipment, semiconductor process equipment, and an intake method.

Background Art

[0002] With the rapid development of semiconductor process equipment and semiconductor processing processes, metal etching is becoming increasingly widely used in the semiconductor industry. After the surface of the wafer is processed in the metal etching process, it is likely to generate process gases (such as chlorine gas) and by-products, and the chlorine gas remaining on the wafer makes the metal (such as aluminum) in the wafer prone to corrosion. Therefore, wafers processed in the metal etching process need to be processed by the intake system of ashing equipment before being sent to the next process.

[0003] The process gases commonly used in the intake system of ashing equipment include oxygen gas, water vapor, nitrogen gas, etc. Due to the action of high temperature and microwaves in the chamber of the intake system of ashing equipment, oxygen gas removes the photoresist and by-products remaining on the surface of the wafer to form volatile carbon dioxide and carbon monoxide gases. On the other hand, water vapor combines with the by-product chlorine gas to form hydrogen chloride gas with higher volatility, and the residual chlorine can be removed. When the intake flow rate of water vapor becomes unstable during the ashing process, the dechlorination effect of the intake system of ashing equipment is likely to decrease, and the ashing speed also becomes slow. As a result, the problem of photoresist remaining on the wafer occurs. Therefore, improving the intake stability of water vapor is one of the important technologies in semiconductor process equipment such as the intake system of ashing equipment.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The object of the embodiments of this application is to provide an intake system for semiconductor process equipment, semiconductor process equipment, and an intake method that can improve the intake stability of water vapor. [Means for solving the problem]

[0005] To solve the above technical problems, this invention is achieved as follows.

[0006] In a first embodiment, the present invention provides an intake system for semiconductor process equipment, comprising a water storage tank, a gas storage tank, a water vapor transport pipeline, and a gas supply pipeline, wherein the water storage tank has a water supply connection port that can be connected and disconnected, a first heating device is provided in the water storage tank, both ends of the water vapor transport pipeline communicate with an exhaust port of the water storage tank and an intake port of the gas storage tank, respectively, the gas storage tank communicates with a process chamber of semiconductor process equipment via a gas supply pipeline in a way that can be connected and disconnected, and when one of the water supply connection port and the water vapor transport pipeline is in a connected state, the other is in a disconnected state.

[0007] In a second aspect, the present invention provides semiconductor process equipment comprising a process chamber and the above-mentioned intake system, wherein the intake system is electrically and electrically connected to the process chamber.

[0008] In a third aspect, the present invention provides an intake method applicable to the above intake system, comprising the steps of: introducing liquid water into a water storage tank until the amount of water stored in the water storage tank reaches a preset amount; heating the liquid water to a preset temperature and controlling the water vapor transport pipeline to be open and the water supply connection port to be closed; controlling the gas supply pipeline to be open and the water vapor transport pipeline to be closed when the pressure in the gas storage tank reaches a preset pressure; controlling the water vapor transport pipeline to be closed and the water supply connection port to be open when the amount of water stored in the water storage tank is less than the water replenishment storage amount; and controlling the water supply connection port to be closed and the water vapor transport pipeline to be open when the pressure in the gas storage tank is lower than the gas replenishment pressure. [Effects of the Invention]

[0009] In the embodiment of the present invention, the intake system of the semiconductor process equipment includes a water storage tank and a gas storage tank. When in use, the water supply port of the water storage tank is connected to an external water supply pipeline, thereby allowing liquid water to be injected into the water storage tank. When the liquid water in the water storage tank reaches a preset volume, the water supply port and the water vapor transport pipeline are controlled to be shut off. Next, the first heating device is activated to heat the liquid water in the water storage tank to a preset temperature. At this time, water vapor that meets the process requirements can be generated in the water storage tank. Subsequently, the water vapor transport pipeline can be opened and the gas supply pipeline can be controlled to be shut off. As a result, the water vapor in the water storage tank enters the gas storage tank, and when the pressure in the gas storage tank reaches a preset pressure, the gas supply pipeline is controlled to be opened. In this way, the water vapor can enter the process chamber and participate in the process.

[0010] In the embodiments of this invention, when either the water supply connection port or the steam transport pipeline is in a conductive state, the other is in a blocked state. In other words, the water supply connection port and the steam transport pipeline cannot be conductive at the same time. Specifically, when the amount of water in the water storage tank is less than the amount of water replenishment stored, the steam transport pipeline is controlled to be blocked and the water supply connection port is opened. When the pressure in the gas storage tank is lower than the gas replenishment pressure, the water supply connection port is blocked and the steam transport pipeline is opened. If the water storage tank and the gas storage tank are conductive at the same time, during the process of replenishing water in the water storage tank, liquid water at room temperature enters the water storage tank, lowering the temperature of the water storage tank. As a result, some of the water vapor in the water storage tank condenses, and the concentration of water vapor decreases. This causes the flow rate of water vapor in the water storage tank to become unstable when it enters the gas storage tank, and consequently, the flow rate of water vapor in the gas storage tank to become unstable when it enters the process chamber. In the embodiment of the present invention, since the water supply connection port and the steam transport pipeline are not simultaneously open, it is possible to prevent the unstable flow rate of steam generated when replenishing water in the water storage tank from entering the gas storage tank, thereby preventing the unstable flow rate of steam from entering the process chamber. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic diagram of the structure of the intake system disclosed in the embodiment of the present application. [Figure 2] This is a partial cross-sectional view of the intake system disclosed in the embodiments of the present application. [Figure 3] This is a flowchart of the intake method disclosed in the embodiments of the present application. [Figure 4] This is a flowchart of another intake method disclosed in the embodiments of the present application. [Figure 5] This is a flowchart of the gas tank initialization step disclosed in the embodiment of the present application. [Figure 6] This is a structural block diagram of the semiconductor process equipment disclosed in the embodiments of the present application. [Modes for carrying out the invention]

[0012] The technical solutions in the embodiments of this application will be described clearly and completely below with reference to the drawings of the embodiments of this application, although it is clear that the embodiments described are only a part of the embodiments of this application and not all of them. All other embodiments that a person skilled in the art could obtain without creative effort based on the embodiments of this application are within the scope of protection of this application.

[0013] The terms “first,” “second,” etc., in the specification and claims of this application are for distinguishing similar subjects and are not intended to indicate a specific order or priority. It should be understood that the data used in this manner may be interchangeable where appropriate so that the embodiments of this application may be carried out in an order other than that illustrated or described herein, and the subjects distinguished by “first,” “second,” etc., are generally of one type, and the number of subjects is not limited; for example, there may be one first subject or more. Furthermore, “and / or” in the specification and claims means at least one of the connected subjects, and the symbol “ / ” generally indicates that the preceding and following related subjects are in an “or” relationship.

[0014] The following describes in detail, with reference to the drawings, the intake system for semiconductor process equipment, the semiconductor process equipment, and the intake method according to the embodiments of this application, using specific embodiments and their application scenarios.

[0015] As shown in Figures 1 and 2, an embodiment of the present invention discloses an intake system for semiconductor process equipment, which includes a water storage tank 100, a gas storage tank 200, a water vapor transport pipeline 300, and a gas supply pipeline 400. The water storage tank 100 has a water supply connection port that can be connected and disconnected, and a first heating device 260 is provided in the water storage tank 100. Both ends of the water vapor transport pipeline 300 are connected to the exhaust port of the water storage tank 100 and the intake port of the gas storage tank 200, respectively, in a way that can be connected and disconnected. The exhaust port of the gas storage tank 200 is connected to the process chamber 500 of the semiconductor process equipment via the gas supply pipeline 400, in a way that can be connected and disconnected. When one of the water supply connection port and the water vapor transport pipeline 300 is connected, the other is disconnected.

[0016] In the embodiment of the present invention, the intake system for semiconductor process equipment includes a water storage tank 100 and a gas storage tank 200. When in use, the water supply connection port of the water storage tank 100 is connected to an external water supply pipeline 700, thereby allowing liquid water to be injected into the water storage tank 100 via the water supply pipeline 700. When the liquid water in the water storage tank 100 reaches a preset storage volume, the water supply connection port and the steam transport pipeline 300 are controlled to be shut off. Next, the first heating device 260 is activated to heat the liquid water in the water storage tank 100 to a preset temperature. At this time, steam that meets the process requirements can be generated in the water storage tank 100. Subsequently, the steam transport pipeline 300 can be opened and the gas supply pipeline 400 can be controlled to be shut off. As a result, the steam in the water storage tank 100 enters the gas storage tank 200, and when the pressure in the gas storage tank 200 reaches a preset pressure, the gas supply pipeline 400 is controlled to be open. In this way, water vapor can enter the process chamber 500 and participate in the process.

[0017] Optionally, in the embodiments of this application, both the water supply connection and the steam transport pipeline 300 may be in a closed state during process execution. If one of the water supply connection and the steam transport pipeline 300 is in a conductive state, the other is in a closed state. In other words, the water supply connection and the steam transport pipeline 300 cannot be conductive at the same time. That is, if the amount of water in the water storage tank 100 is less than the amount of water replenishment stored, the steam transport pipeline 300 is controlled to be in a closed state and the water supply connection is opened. If the pressure in the gas storage tank 200 is lower than the gas replenishment pressure, the water supply connection is closed and the steam transport pipeline 300 is opened. When the water storage tank 100 and the gas storage tank 200 are simultaneously connected, during the process of replenishing water in the water storage tank 100, room temperature liquid water enters the water storage tank 100, lowering the temperature of the water storage tank 100. As a result, some of the water vapor in the water storage tank 100 condenses, reducing the water vapor concentration. This causes the flow rate of water vapor in the water storage tank 100 to become unstable when it enters the gas storage tank 200, and consequently, the flow rate of water vapor in the gas storage tank 200 to become unstable when it enters the process chamber 500. In the embodiment of the present invention, since the water supply connection port and the water vapor transport pipeline 300 are not simultaneously connected, it is possible to avoid the unstable flow rate of water vapor generated when replenishing water in the water storage tank 100 entering the gas storage tank 200, and thereby avoid the unstable flow rate of water vapor entering the process chamber 500.

[0018] Optionally, the steam transport pipeline 300 may be provided with a fifth on-off valve 310 or other devices that can open or close the pipeline. For example, a shut-off plate may be slidably provided within the steam transport pipeline 300, and the opening and closing of the steam pipeline may be controlled by adjusting the position of the shut-off plate, thereby enabling the opening and closing of both ends of the steam transport pipeline 300 to open and close to the exhaust port of the water storage tank 100 and the intake port of the gas storage tank 200, respectively.

[0019] In any embodiment, the gas supply pipeline 400 is provided with a flow control device 410, a first shut-off valve 420, and a second shut-off valve 430, where the flow control device 410 is located downstream of the first shut-off valve 420 and the second shut-off valve 430 is located downstream of the flow control device 410. When the process is idle, the second shut-off valve 430 and the flow control device 410 need to be turned off, but if the first shut-off valve 420 is not provided, the flow control device 410 cannot be completely shut off, meaning that water vapor in the gas storage tank 200 passes through the flow control device 410 and leaks into the first pipe section of the gas supply pipeline 400 between the second shut-off valve 430 and the flow control device 410, causing the pressure in the first pipe section to continuously rise. When the second shut-off valve 430 and the flow control device 410 are turned on to execute the next process, the high-pressure steam accumulated in the first pipe section enters the process chamber 500 directly, resulting in a momentary increase in the pressure in the process chamber 500. This causes the intake ratio of steam to other process gases to become uncontrollable, negatively impacting the process outcome and potentially triggering a false alarm indicating excessive pressure in the process chamber 500, leading to equipment shutdown. Therefore, in this embodiment, the first shut-off valve 420 is provided upstream of the flow control device 410. After the first shut-off valve 420 is turned off, the steam is completely shut off when the process is idle, thereby preventing steam from the gas storage tank 200 from leaking into the first pipe section of the gas supply pipeline 400 between the second shut-off valve 430 and the flow control device 410, and further avoiding the occurrence of the above-mentioned problems. Optionally, the flow control device 410 may be a flow control fan (MFC) or another device capable of controlling the flow rate. The first shut-off valve 420, the second shut-off valve 430, and the third shut-off valve 610, fourth shut-off valve 710, fifth shut-off valve 310, sixth shut-off valve 810, seventh shut-off valve 911, and eighth shut-off valve 921, which will be described later, may all be valves capable of opening and closing the piping, such as ball valves, gate valves, stop valves, and butterfly valves.

[0020] Optionally, the intake system further includes a gas mixing pipeline 910. The first end of the gas mixing pipeline 910 is communicably and cut-offably connected to the gas supply pipeline 400, and the first end of the gas mixing pipeline 910 is located downstream of the second on-off valve 430. Process gases such as oxygen gas and nitrogen gas can be introduced into the gas supply pipeline 400 through the gas mixing pipeline 910. After the water vapor and the process gas form mixed water vapor, they enter the process chamber 500. Further, a seventh on-off valve 911 is provided in the gas mixing pipeline 910.

[0021] In any embodiment, the intake system further includes a suction line 600, the first end of which is electrically and intermittently connected to the gas supply line 400, and the first end of which is located between the flow control device 410 and the second on-off valve 430. In embodiments of the present application, the suction line 600 is provided, and in use, the second end of which is connected to a negative pressure device or a negative pressure space. When the process is idle, the first on-off valve 420 and the second on-off valve 430 must be turned off, and even when the two on-off valves are turned off, some of the water vapor remains in the second pipe section of the gas supply line 400 between the first on-off valve 420 and the second on-off valve 430, and when the suction line 600 is opened, the water vapor remaining in the second pipe section may be drawn out to the outside, thereby avoiding the problem that the remaining water vapor instantaneously increases the pressure in the process chamber 500 in the next process. Furthermore, by drawing air from inside the water storage tank 100 via the suction pipeline 600, during the process of injecting water into the water storage tank 100, the pressure inside the water storage tank 100 increases as liquid water enters the tank. This prevents the problem of being unable to supply water once the amount of water in the water storage tank 100 reaches a predetermined level, thus preventing the tank from being filled for an extended period of time. In addition, by drawing air from inside the gas storage tank 200 to the outside via the suction pipeline 600, the pressure inside the gas storage tank 200 is reduced, allowing water vapor generated in the water storage tank 100 to enter the gas storage tank 200. At the same time, the air inside the gas storage tank 200 is drawn to the outside, ensuring the purity of the water vapor. Optionally, a third on-off valve 610 may be provided in the suction pipeline 600. Of course, other devices that can connect and disconnect the pipeline may be provided so that the first end of the suction pipeline 600 can connect to and disconnect the gas supply pipeline 400. Furthermore, a first check valve 620 is provided in the suction pipeline 600, and the direction of conduction of the first check valve 620 is from the first end to the second end of the suction pipeline 600. This prevents the problem of gas in the suction pipeline 600 flowing back into the gas supply pipeline 400 and contaminating the gas supply pipeline 400 if an abnormality occurs in the suction pipeline 600.

[0022] In any embodiment, the intake system further includes a water supply pipeline 700, which is electrically and electrically connected to a water supply connection port, and the water supply pipeline 700 is provided with a flow rate detection device 720, and the water storage tank 100 is provided with a liquid level detection device 110, both of which are used to obtain the amount of water stored in the water storage tank 100. Of course, in actual use, the flow rate detection device 720 is also used to obtain other relevant parameters by detecting the water supply flow rate of the water storage tank 100, and the liquid level detection device 110 is also used to obtain other relevant parameters by detecting the liquid level in the water storage tank 100, but the present invention is not limited to these. Specifically, the flow rate detection device 720 is used to detect the water supply flow rate to the water storage tank 100 and to obtain the amount of water stored in the water storage tank 100 from the water supply flow rate and water supply time, while the liquid level detection device 110 is used to detect the liquid level in the water storage tank 100 and to obtain the amount of water stored in the water storage tank 100 from the height of the liquid level in the water storage tank 100. When in use, the amount of water stored obtained by the flow rate detection device 720 and the amount of water stored obtained by the liquid level detection device 110 are checked against each other, thereby improving the accuracy of determining the amount of water stored. In addition, it is possible to determine whether the flow rate detection device 720 and the liquid level detection device 110 are in a normal state from the parameters detected by the flow rate detection device 720 and the parameters detected by the liquid level detection device 110. The specific determination is as follows. If the factory's water supply is normal and the water storage tank 100 is being refilled with water, and the flow detection device 720 detects that the water supply flow rate is stable, but the liquid level detection device 110 detects that the liquid level in the water storage tank 100 has not changed, then the liquid level detection device 110 may be in an abnormal state. If the factory's water supply is not normal and the water supply flow rate detected by the flow detection device 720 is zero, and the liquid level detection device 110 detects that the liquid level in the water storage tank 100 is still gradually rising, then the liquid level detection device 110 may be in an abnormal state.Optionally, a fourth on-off valve 710 or another device capable of opening and closing the pipeline may be provided in the water supply pipeline 700 so that the water supply pipeline 700 can be communicatively connected to and disconnected from the water supply connection port. The flow rate detection device 720 may be a flow rate sensor, and the liquid level detection device 110 may be a liquid level sensor. Further, a ninth on-off valve 730 is further provided in the water supply pipeline 700, and the ninth on-off valve 730 is located upstream of the fourth on-off valve 710.

[0023] Optionally, the intake system further includes a purge pipeline 920 and a drainage pipeline 800. The first end of the purge pipeline 920 is communicatively connected to and disconnected from the water supply pipeline 700, the first end of the drainage pipeline 800 is communicatively connected to and disconnected from the discharge connection port of the water storage tank 100, the second end of the purge pipeline 920 is used to connect to a purge gas source, and the purge gas may be nitrogen gas. When cleaning the water storage tank 100, the drainage pipeline 800 and the purge pipeline 920 are connected to drain the liquid water in the water storage tank 100, and the purge gas is introduced into the purge pipeline 920 to balance the air pressure in the water storage tank 100. Also, by introducing the purge gas into the purge pipeline 920, the water vapor transport pipeline 300, the gas storage tank 200, and the gas supply pipeline 400 can be purged. Further, an eighth on-off valve 921 and a second check valve 922 are provided in the purge pipeline 920, and a sixth on-off valve 810 is provided in the drainage pipeline 800. The conduction direction of the second check valve 922 is the direction extending from the second end of the drainage pipeline 800 to the first end of the drainage pipeline 800.

[0024] Optionally, the first heating device 260 may be a conventional electric heater, but conventional electric heaters cannot heat liquid water uniformly, meaning that some of the liquid water in the water storage tank 100 may be heated while the rest remains unheated. Therefore, in any embodiment, the first heating device 260 surrounds the water storage tank 100, thereby enabling the first heating device 260 to heat the liquid water uniformly. The intake system further includes a second heating device 210, which surrounds the steam transport pipeline 300, the gas storage tank 200, and the gas supply pipeline 400, with the heating temperature of the second heating device 210 being equal to or greater than the heating temperature of the first heating device 260. If the second heating device 210 is not provided, when steam passes through the steam transport pipeline 300, the gas storage tank 200, and the gas supply pipeline 400, the temperatures of the steam transport pipeline 300, the gas storage tank 200, and the gas supply pipeline 400 are relatively low, which can cause the steam to liquefy upon encountering low temperatures, and furthermore, the flow rate of steam entering the process chamber 500 may become unstable. In the embodiment of the present invention, the second heating device 210 is provided, and the heating temperature of the second heating device 210 is equal to or higher than the heating temperature of the first heating device 260, so that the steam does not liquefy upon encountering low temperatures. In addition, the second heating device 210 can be divided into three heating sections, and each of the three heating sections surrounds the steam transport pipeline 300, the gas storage tank 200, and the gas supply pipeline 400 in a one-to-one correspondence, thereby allowing the heating temperature of each heating section to be controlled independently. Naturally, the second heating device 210 can also be divided into two heating sections. Both the first heating device 260 and the second heating device 210 can heat liquid water through electric heating or heat exchange.

[0025] In any embodiment, the intake system further includes a first temperature detection member, a second temperature detection member 230, a first overheat protection switch 240, and a second overheat protection switch 250, wherein the first temperature detection member and the first overheat protection switch 240 are provided in the water storage tank 100, and the second temperature detection member 230 and the second overheat protection switch 250 are provided in the gas storage tank 200. The first temperature detection member may be provided in close contact with the outer wall of the water storage tank 100 and is used to detect the temperature of the water storage tank 100, and the second temperature detection member 230 may be provided in close contact with the outer wall of the gas storage tank 200 and is used to detect the temperature of the gas storage tank 200. If the temperature of the water storage tank 100 is too high, the first overheat protection switch 240 may output an alarm signal and turn off the first heating device 260, and if the temperature of the gas storage tank 200 is too high, the second overheat protection switch 250 may output an alarm signal and turn off the second heating device 210. In this way, damage to the first heating device 260 and the second heating device 210 can be avoided, and potential safety risks can be reduced.

[0026] Optionally, the gas storage tank 200 is equipped with a pressure detection device 220 for detecting the pressure inside the gas storage tank 200.

[0027] As shown in Figure 6, embodiments of the present application also disclose semiconductor process equipment comprising a process chamber 500 and an intake system as described in any of the above embodiments, wherein the intake system is electrically and non-electrically connected to the process chamber 500, that is, a gas storage tank 200 may be electrically and non-electrically connected to the process chamber 500 via a gas supply pipeline 400.

[0028] In any embodiment, the semiconductor process equipment includes a machine body 930, a processing module 931, a communication module 932, an analog quantity input module 933, a digital quantity input module 934, a digital quantity output module 935, and a temperature control module 936, wherein the processing module 931 is electrically connected to the machine body 930 via the communication module 932, the processing module 931 is electrically connected to the analog quantity input module 933, the digital quantity input module 934, and the digital quantity output module 935, respectively, and the temperature control module 936 is electrically connected to the first heating device 260. The digital quantity input module 934 may be electrically connected to the first overheat protection switch 240 and the second overheat protection switch 250, respectively; the temperature control module 936 may be electrically connected to the first heating device 260 and the second heating device 210, respectively; the digital quantity output module 935 may be electrically connected to the first on-off valve 420, the fourth on-off valve 710, the fifth on-off valve 310, and the sixth on-off valve 810; the digital quantity input module 934 may be electrically connected to the flow rate detection device 720, the liquid level detection device 110, the pressure detection device 220, the first temperature detection member, and the second temperature detection member 230, respectively; and the flow rate control device 410 may be electrically connected to the communication module 932. Specifically, the processing module 931 may be based on a 16-bit MSP430F series microcontroller and be responsible for signal processing and logic operations. It communicates with the main unit 930 of the semiconductor process equipment via the communication module 932, receives control information transmitted from the main unit 930, and feeds back the state of the system itself to the main unit 930. Furthermore, the communication module 932 can support multiple communication protocols such as Ethernet®, Devicenet, and RS485, thus facilitating connection with the main unit 930 or other debugging computers.Furthermore, the processing module 931 receives analog quantity signals fed back from the liquid level detection device 110, pressure detection device 220, first temperature detection member, second temperature detection member 230, and flow rate detection device 720 via the analog quantity input module 933, converts these analog quantity signals into corresponding information such as liquid level, pressure, temperature, and flow rate, receives overheat signals from the first overheat protection switch 240 and second overheat protection switch 250 via the digital quantity input module 934, and controls the on or off of each on-off valve, such as the first on-off valve 420, fourth on-off valve 710, fifth on-off valve 310, and sixth on-off valve 810, via the digital quantity output module 935. The machine base body 930 is controlled through manual and automatic flows, thereby controlling the on or off of the first on-off valve 420, fourth on-off valve 710, fifth on-off valve 310, and sixth on-off valve 810, respectively, and can control the intake of water vapor in the intake system in cooperation with the processing module 931. The temperature control module 936 can control the temperatures of the first heating device 260 and the second heating device 210, respectively. Furthermore, the semiconductor process equipment further includes a power supply module 937 and a machine base power box 938, the machine base power box 938 being electrically connected to the power supply module 937 and the machine base body 930, respectively. The machine base power box 938 can supply power to the machine base body 930 and the power supply module 937, and the power supply module 937 can supply power to each module.

[0029] Optionally, the second on-off valve 430, the third on-off valve 610, the seventh on-off valve 911, the eighth on-off valve 921, and the ninth on-off valve 730 may be pneumatic valves, and the machine body 930 is electrically connected to each of the above pneumatic valves. The first on-off valve 420, the fourth on-off valve 710, the fifth on-off valve 310, and the sixth on-off valve 810 may be solenoid valves. Furthermore, the semiconductor process equipment further includes a group of solenoid valves 940, with a second on-off valve 430, a third on-off valve 610, a seventh on-off valve 911, an eighth on-off valve 921, and a ninth on-off valve 730 being electrically connected to the group of solenoid valves 940, respectively. The machine body 930 controls and operates the group of solenoid valves 940, and can also control the on / off state of the second on-off valve 430, the third on-off valve 610, the seventh on-off valve 911, the eighth on-off valve 921, and the ninth on-off valve 730.

[0030] As shown in Figures 3 to 5, embodiments of the present application also disclose an intake method applicable to the intake system described in any of the above embodiments, comprising the following steps S100 to S500.

[0031] S100: Liquid water is introduced into the water storage tank 100 until the amount of water stored in the water storage tank 100 reaches a preset amount.

[0032] Liquid water can be introduced through the water supply connection port of the water storage tank 100. The preset water storage volume here may be determined according to the requirements of the process, but it is between the overflow storage volume and the water replenishment storage volume.

[0033] S200: Heats liquid water to a preset temperature and controls the steam transport pipeline 300 to be in a conductive state while keeping the water supply connection port closed.

[0034] The preset temperature here may be the temperature at which the liquid water can generate steam that meets the process requirements, and may be determined according to the process requirements, for example, 85 to 95°C. Optionally, the preset temperature is 95°C or lower. If the temperature of the liquid water exceeds 95°C, the liquid level in the water storage tank 100 will fluctuate, and as a result, the liquid level detected by the liquid level detection device 110 will be inaccurate. By turning on the fifth on-off valve 310 and turning off the fourth on-off valve 710, the steam transport pipeline 300 can be made conductive and the water supply connection port can be shut off. At this time, the water supply connection port of the water storage tank 100 stops the introduction of liquid water, and the steam in the water storage tank 100 is introduced to the gas storage tank 200 via the steam transport pipeline 300.

[0035] S300: When the pressure inside the gas storage tank 200 reaches a preset pressure, the gas supply pipeline 400 is controlled to be open and the steam transport pipeline 300 is controlled to be closed.

[0036] The preset pressures here are lower than the gas pressure in the water storage tank 100 and higher than the gas replenishment pressure, the gas replenishment pressure is higher than the starting pressure of the flow control device 410, and the starting pressure of the flow control device 410 is higher than the operating pressure of the process chamber 500. These may be specifically determined according to the requirements of the process. By turning on the first on-off valve 420, the flow control device 410, and the second on-off valve 430, and turning off the fifth on-off valve 310, the gas supply pipeline 400 can be controlled to be in a conductive state and the steam transport pipeline 300 to be in a closed state. At this time, the introduction of steam into the gas storage tank 200 via the steam transport pipeline 300 is stopped, and the steam in the gas storage tank 200 is introduced into the process chamber 500 via the gas supply pipeline 400.

[0037] S400: If the amount of water stored in the water storage tank 100 is less than the amount of water to be replenished, the steam transport pipeline 300 is shut off and the water supply connection port is controlled to be open.

[0038] The amount of water to be stored for replenishment may be determined according to the requirements of the process.

[0039] S500: If the pressure inside the gas storage tank 200 is lower than the gas supply pressure, the water supply connection port is shut off and the steam transport pipeline 300 is controlled to be open.

[0040] The gas supply pressure may be determined according to the process requirements.

[0041] Furthermore, according to the relationship between temperature and saturated water vapor pressure, the ideal gas equation pV=nRT (where p is gas pressure, V is gas volume, n is the amount of gaseous substance, T is the temperature of the system, and R is the proportionality constant), and the relationship between gas mass and amount of substance m=M×n (where m is the mass of the gas, M is the molar mass, and n is the amount of gaseous substance), it was found that in the process, water vapor gradually enters the process chamber 500 from the gas storage tank 200, and the volume of water vapor entering the process chamber 500 from the gas storage tank 200 can be calculated from the flow rate and time set by the flow rate control device 410. Calculating the water vapor in the gas storage tank 200 from the above equations can support the process time (t1) of the water vapor flow rate required for the process. Furthermore, the time (t2) for water replenishment and heating of the water storage tank 100 can be calculated from the feedwater flow rate, the latent heat of vaporization of the liquid water, and the heating power of the first heating device 260, and t1 > t2 can be obtained. In other words, the sum of the water replenishment time and the heating and evaporation time until the liquid water in the water storage tank 100 goes from the water replenishment amount to a preset amount is shorter than the time it takes for the process chamber 500 to consume water vapor, so the embodiment of the present invention is feasible.

[0042] In the embodiments of this invention, when the process is executed, both the water supply connection and the steam transport pipeline 300 may be in a closed state. If one of the water supply connection and the steam transport pipeline 300 is in a conductive state, the other is in a closed state; that is, the water supply connection and the steam transport pipeline 300 cannot be conductive at the same time. Specifically, if the amount of water in the water storage tank 100 is less than the amount of water stored in the water supply tank 100, the steam transport pipeline 300 is closed and controlled to open the water supply connection, and if the pressure in the gas storage tank 200 is lower than the gas supply pressure, the water supply connection is closed and the steam transport pipeline 300 is opened. When the water storage tank 100 and the gas storage tank 200 are simultaneously connected, during the process of replenishing water in the water storage tank 100, room temperature liquid water enters the water storage tank 100, lowering the temperature of the water storage tank 100. As a result, some of the water vapor in the water storage tank 100 condenses, reducing the water vapor concentration. This causes the flow rate of water vapor in the water storage tank 100 to become unstable when it enters the gas storage tank 200, and consequently, the flow rate of water vapor in the gas storage tank 200 to become unstable when it enters the process chamber 500. In the embodiment of the present invention, since the water supply connection port and the water vapor transport pipeline 300 are not simultaneously connected, it is possible to avoid the unstable flow rate of water vapor generated when replenishing water in the water storage tank 100 entering the gas storage tank 200, and thereby avoid the unstable flow rate of water vapor entering the process chamber 500.

[0043] In any embodiment, the intake system includes a suction line 600, and step S100 specifically includes the following steps S110 to S130.

[0044] S110: The water supply connection port and the steam transport pipeline 300 are in a conductive state, and the suction pipeline 600 is controlled to communicate with the gas supply pipeline 400. In other words, the suction pipeline 600 is connected to the section of the gas supply pipeline 400 located upstream of the second shut-off valve 430, and gas is drawn from the water storage tank 100 via the suction pipeline 600, thereby introducing liquid water into the water storage tank 100.

[0045] In this process, by turning on the fourth shut-off valve 710, the fifth shut-off valve 310, the first shut-off valve 420, the flow rate control device 410, and the third shut-off valve 610, gas in the water storage tank 100 is drawn out, and water is injected into the water storage tank 100. However, as liquid water enters the water storage tank 100, the pressure inside the tank increases. Therefore, when the amount of water stored in the water storage tank 100 reaches a predetermined amount, water supply becomes impossible, preventing the problem of being unable to fill the tank for an extended period of time.

[0046] S120: The amount of water stored in the water storage tank 100 is detected.

[0047] The amount of water stored in the water storage tank 100 may be obtained by the flow rate detection device 720 alone, by the liquid level detection device 110 alone, or by both the flow rate detection device 720 and the liquid level detection device 110, thereby improving the accuracy of detecting the amount of water stored.

[0048] S130: When the water storage volume reaches a preset volume, the water supply connection port and the steam transport pipeline 300 are controlled to be shut off. At this time, the fourth shut-off valve 710 and the fifth shut-off valve 310 may also be turned off. Note that if the gas tank initialization step described later does not need to be performed after step S130, the gas supply pipeline 400 and the suction pipeline 600 need to be shut off, but if the gas tank initialization step needs to be performed after step S130, the suction pipeline 600 can remain connected to the gas supply pipeline 400.

[0049] In any embodiment, step S200 further includes a gas tank initialization step before the step of controlling the steam transport pipeline 300 to be in a conductive state. The gas tank initialization step may occur before the step of controlling the steam transport pipeline 300 to be in a conductive state, or before the step of heating the liquid water to a preset temperature.

[0050] The gas tank initialization step includes the following steps S201 to S203.

[0051] S201: Control the suction pipeline 600 to communicate with the gas supply pipeline 400 and the steam transport pipeline 300 to be in a shut-off state. At this time, the flow rate control device 410, the first shut-off valve 420, and the third shut-off valve 610 may be turned on, and the fifth shut-off valve 310 may be turned off.

[0052] S202: Gas is drawn from the gas storage tank 200 via the suction pipe 600. In this way, the pressure inside the gas storage tank 200 is reduced, allowing the water vapor generated in the water storage tank 100 to enter the gas storage tank 200, and also allowing the air inside the gas storage tank 200 to be drawn out to ensure the purity of the water vapor.

[0053] S203: When the pressure inside the gas storage tank 200 reaches a first preset threshold, control is performed to shut off both the suction line 600 and the gas supply line 400. The first preset threshold here may be selected according to the actual situation. Optionally, the first preset threshold is the background pressure, meaning that when suction is performed on the gas storage tank 200, the pressure inside the gas storage tank 200 does not change, and this pressure is the background pressure. In this way, more air can be drawn from the gas storage tank 200, further ensuring the purity of the water vapor.

[0054] In any embodiment, the water storage tank 100 is further provided with an overflow connection port, and the intake method further includes the following step S600.

[0055] S600: If the amount of water stored in the water storage tank 100 exceeds the overflow storage amount, the overflow connection port is controlled to remain open. If the amount of water stored in the water storage tank 100 is too much, the liquid water will occupy space for water vapor, reducing the amount of water vapor stored. A portion of the water in the water storage tank 100 can be discharged through the overflow connection port, bringing the amount of water stored to a preset level, thereby avoiding the problem of liquid water occupying space for water vapor.

[0056] Before initially storing and heating water in the water storage tank 100, or if it is necessary to detect the sealing performance of the intake system, a leak rate may be detected for the intake system. In any embodiment, step S100 includes a leak rate detection step before introducing liquid water into the water storage tank 100, and the leak rate detection step includes the following steps S101 to S106.

[0057] S101: Control the water supply connection port to be in a shut-off state, the steam transport pipeline 300 to be in a conductive state, and the suction pipeline 600 to be in communication with the gas supply pipeline 400. At this time, the fourth shut-off valve 710 may be turned off, and the fifth shut-off valve 310, the first shut-off valve 420, the flow rate control device 410, and the third shut-off valve 610 may be turned on.

[0058] S102: Gas is drawn in through the suction pipeline 600 from the water storage tank 100, the steam transport pipeline 300, the gas storage tank 200, and the gas supply pipeline 400 (specifically, the pipe section located upstream of the third shut-off valve 610).

[0059] S103: When the pressure in the gas storage tank 200 reaches a second preset threshold, the suction pipeline 600 is controlled to be shut off.

[0060] S104: Measure the first pressure inside the gas storage tank 200 and set the first pressure as P11. The first pressure here may or may not be equal to the second preset threshold.

[0061] S105: After a predetermined time has elapsed, the second pressure in the water storage tank 100 is measured, with the predetermined time being t and the second pressure being P12.

[0062] S106: The leakage rate of the intake system is obtained from the first pressure, the second pressure, and a preset time. The leakage rate of the intake system LR = (P12 - P11) / t. In the embodiment of the present invention, the leakage rate of the intake system can be determined in advance, and if the leakage rate meets the requirements, the step of injecting water into the water storage tank 100 is performed.

[0063] In any embodiment, the intake method further includes a temperature detection step, the temperature detection step includes the following steps S710 to S730.

[0064] S710: Detects the temperature of water storage tank 100.

[0065] S720: If the temperature is lower than the first preset temperature, shut off the steam transport pipeline 300 and increase the power of the first heating device 260.

[0066] S730: If the temperature is higher than the second preset temperature, reduce the power of the first heating device 260 or turn off the first heating device 260. In the embodiment of the present invention, the temperature of the liquid water in the water storage tank 100 is controlled to be maintained between the first preset temperature and the second preset temperature, thereby enabling the generation of steam that satisfies the requirements of the process.

[0067] The above embodiments of the present invention have been described in detail, focusing on the differences between each embodiment. While the different optimization features of each embodiment can be combined to form a superior embodiment, as long as they are not contradictory, this will not be repeated here for the sake of brevity.

[0068] The above description is merely an example of the present invention and is not intended to limit the invention. The present invention is open to various modifications and variations for those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of the claims. [Explanation of Symbols]

[0069] 100 water storage tanks 110 Liquid level detection device 200 gas storage tanks 210 Second heating device 220 Pressure detection device 230 Second temperature detection member 240 First overheat protection switch 250 Second overheat protection switch 260 1st heating device 300 Steam transport pipeline 310 Fifth shut-off valve 400 Gas supply pipeline 410 Flow control device 420 First shut-off valve 430 Second shut-off valve 500 process chambers 600 Suction line 610 Third shut-off valve 620 First check valve 700 Water supply pipeline 710 Fourth shut-off valve 720 Flow detection device 730 9th Shut-off Valve 800 Drainage line 810 Sixth shut-off valve 910 Gas mixing pipeline 911 7th Shut-off Valve 920 Purge pipeline 921 No. 8 Shut-off Valve 922 Second check valve 930 Machine body 931 Processing Module 932 Communication Module 933 Analog Quantity Input Module 934 Digital Quantitative Input Module 935 Digital Output Module 936 Temperature Control Module 937 Power Module 938 Unit Power Box 940 Solenoid valve group

Claims

1. An intake system for semiconductor process equipment, The system includes a water storage tank, a gas storage tank, a steam transport pipeline, and a gas supply pipeline, wherein the water storage tank has a water supply connection port that can be connected and disconnected, and the water storage tank is provided with a first heating device. Both ends of the steam transport pipeline are connected to the exhaust port of the water storage tank and the intake port of the gas storage tank, respectively, in a manner that allows for electrical and shutoff. The exhaust port of the gas storage tank is connected to the process chamber of the semiconductor process equipment via the gas supply pipeline, in a manner that allows for electrical and shutoff. An intake system for semiconductor process equipment, characterized in that when one of the water supply connection port and the water vapor transport pipeline is in a conductive state, the other is in a blocked state.

2. The intake system according to claim 1, wherein the gas supply pipeline is provided with a flow control device, a first on-off valve, and a second on-off valve, the flow control device is located downstream of the first on-off valve, and the second on-off valve is located downstream of the flow control device.

3. The intake system according to claim 2, further comprising a suction line, wherein the first end of the suction line is in communication with the gas supply line in a manner that allows for electrical and non-electrical connection, and the first end of the suction line is located between the flow rate control device and the second on-off valve.

4. The intake system according to claim 2, further comprising a gas mixing pipeline, wherein the first end of the gas mixing pipeline is in a manner that allows for electrical and shut-off to the gas supply pipeline, and the first end of the gas mixing pipeline is located downstream of the second on-off valve.

5. The intake system according to claim 1, further comprising a water supply pipeline, wherein the water supply pipeline is electrically and electrically connected to the water supply connection port, a flow rate detection device is provided in the water supply pipeline, a liquid level detection device is provided in the water storage tank, and both the flow rate detection device and the liquid level detection device are used to obtain the amount of water stored in the water storage tank.

6. The first heating device encloses the water storage tank, the intake system further includes a second heating device, the second heating device encloses the steam transport pipeline, the gas storage tank, and the gas supply pipeline. The intake system according to claim 1, characterized in that the heating temperature of the second heating device is equal to or greater than the heating temperature of the first heating device.

7. The intake system according to claim 6, further comprising a first temperature detection member, a second temperature detection member, a first overheat protection switch, and a second overheat protection switch, wherein the first temperature detection member and the first overheat protection switch are both provided in the water storage tank, and the second temperature detection member and the second overheat protection switch are both provided in the gas storage tank.

8. Semiconductor process equipment, A semiconductor process apparatus comprising the process chamber and an intake system according to any one of claims 1 to 7, wherein the intake system is electrically and non-conductively connected to the process chamber.

9. The system further includes a main unit, a processing module, a communication module, an analog quantity input module, a digital quantity input module, a digital quantity output module, and a temperature control module. The semiconductor process equipment according to claim 8, wherein the processing module is electrically connected to the machine body via the communication module, the processing module is electrically connected to the analog quantity input module, the digital quantity input module, and the digital quantity output module, respectively, and the temperature control module is electrically connected to the first heating device.

10. An intake method applicable to the intake system described in any one of claims 1 to 7, The steps include introducing liquid water into the water storage tank until the amount of water stored in the water storage tank reaches a predetermined amount, The steps include: heating the liquid water to a preset temperature, controlling the steam transport pipeline to be in a conductive state and the water supply connection port to be in a closed state; When the pressure in the gas storage tank reaches a preset pressure, the gas supply pipeline is controlled to be open and the steam transport pipeline is shut off. If the amount of water stored in the water storage tank is less than the amount of water replenishment stored, the step of controlling the water vapor transport pipeline to be in a closed state and the water supply connection port to be in a conductive state, A method for intake air, characterized by comprising the step of controlling the water supply connection port to be in a closed state and the water vapor transport pipeline to be in a conductive state when the pressure in the gas storage tank is lower than the gas supply pressure.

11. Including the suction conduit, The step of introducing liquid water into the water storage tank until the amount of water stored in the water storage tank reaches a predetermined amount is, specifically, The steps include: ensuring that the water supply connection port and the steam transport pipeline are in a conductive state, controlling the suction pipeline to communicate with the gas supply pipeline, drawing gas from the water storage tank through the suction pipeline, thereby introducing liquid water into the water storage tank; The steps include detecting the amount of water stored in the water storage tank, The intake method according to claim 10, further comprising the step of controlling the water supply connection port and the steam transport pipeline to be in a shut-off state when the amount of stored water reaches a preset amount of stored water.

12. Including the suction conduit, Prior to the step of controlling the steam transport pipeline to be in a conductive state, the further step includes a gas tank initialization step, The gas tank initialization step is, The steps include controlling the suction pipeline to communicate with the gas supply pipeline and the water vapor transport pipeline to be in a shut-off state, The steps include: drawing gas from the gas storage tank through the aforementioned suction pipeline; The intake method according to claim 10, comprising the step of controlling both the suction line and the gas supply line to be in a shut-off state when the pressure in the gas storage tank reaches a first preset threshold.

13. The water storage tank is further provided with an overflow connection port, and the intake method is The intake method according to claim 10, further comprising the step of controlling the overflow connection port to be in a conductive state when the amount of water stored in the water storage tank is greater than the overflow storage amount.

14. The intake system includes a suction line, Prior to the step of introducing liquid water into the water storage tank, the leak rate detection step is included, and the leak rate detection step is: The steps include controlling the water supply connection port to be in a shut-off state, controlling the steam transport pipeline to be in a conductive state, and controlling the suction pipeline to be in communication with the gas supply pipeline, The steps include drawing gas from the water storage tank, the steam transport pipeline, the gas storage tank, and the gas supply pipeline through the suction pipeline, The steps include controlling the suction pipeline to be in a shut-off state when the pressure in the gas storage tank reaches a second preset threshold, The steps include measuring the first pressure inside the gas storage tank, The steps include: measuring the second pressure inside the water storage tank after a predetermined time has elapsed; The intake method according to claim 10, comprising the step of obtaining the leakage rate of the intake system from the first pressure, the second pressure, and the preset time.

15. The method further includes a temperature detection step, the temperature detection step is The steps include detecting the temperature of the water storage tank, If the temperature is lower than a first preset temperature, the steam transport pipeline is shut off and the power of the first heating device is increased. The intake method according to claim 10, further comprising the step of reducing the power of the first heating device or turning off the first heating device if the temperature is higher than a second preset temperature.

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