Pedestal Assembly

Abstract

A pedestal assembly is disclosed. In at least one implementation, the pedestal assembly comprises a pedestal having a platen and a stem attached to the platen. An adapter tube is attached to the stem. In at least one implementation, a cooling collar is coupled to the adapter tube. A transition conduit is coupled to the cooling collar. In at least one implementation, an electrical enclosure is coupled to the transition conduit. In at least one implementation, the electrical enclosure comprises a radio frequency (RF) connector block and a heater connector block. In at least one implementation, the RF connector block is coupled to the platen. In at least one implementation, the heater connector block is coupled to the platen.

Description

Technical Field

[0001] Priority Claim This application claims the priority of U.S. Provisional Patent Application No. 63 / 495,048, entitled "Pedestal Assembly", filed on April 7, 2023, the entire content of which is incorporated herein by reference for all purposes.

Background Art

[0002] Process tools in the semiconductor industry provide the essential manufacturing capabilities for semiconductor device fabrication. Many processes involving layer deposition require heating a semiconductor substrate (e.g., a wafer) to a high temperature (above 600 °C) to drive several surface reactions for layer formation and etching processes. The high temperature generated in the wafer chuck can be somewhat problematic because heat can be readily transferred by conduction and radiation from the wafer chuck to the wafer pedestal under the wafer chuck. Temperature-sensitive components and temperature-sensitive components on and within the pedestal can be adversely affected unless modifications are made to reduce the impact of using a high wafer chuck temperature.

[0003] The materials described herein are shown by way of example and are not limited to the accompanying drawings. For simplicity and clarity of explanation, the elements shown in the figures are not necessarily drawn to scale or in their exact positions. For example, the dimensions of some elements may be exaggerated relative to other elements for clarity. Also, for clarity of explanation, various physical features may be represented in a "perfect" form and geometric shape that has been simplified, but it should be understood that the actual implementation forms can only approximate the ideal shown in the figures. For example, the smooth surfaces and orthogonal intersections may be depicted by ignoring the finite roughness, rounded corners, and intersections at imperfect angles characteristic of structures formed by nanomachining techniques. Further, reference labels are repeated between the drawings to indicate corresponding elements or similar elements where appropriate.

Brief Description of the Drawings

[0004] [Figure 1A] This is a side view of a pedestal assembly in at least one implementation form. [Figure 1B] Figure 1A is a cross-sectional view of the pedestal assembly shown, illustrating its internal components in at least one implementation configuration. [Figure 2A] This is a plan view of a cooling collar in at least one implementation configuration. [Figure 2B] This is a 3D perspective view of one half of the cooling collar shown in Figure 2A, representing at least one implementation configuration. [Figure 3A] This is a plan view of a cooling collar in at least one implementation configuration. [Figure 3B] This is a 3D perspective view of the cooling collar shown in Figure 3A, in at least one implementation configuration. [Figure 4] A 3D perspective view of a transition conduit in at least one implementation form. [Figure 5] A 3D perspective view of an orientation ring in at least one implementation form. [Figure 6A] This is a plan view of the mounting flange as seen from above, in at least one implementation configuration. [Figure 6B] This is a plan view of the mounting flange shown in Figure 6A, as seen from below, in at least one implementation configuration. [Figure 6C] This is a 3D perspective view of the mounting flange shown in Figure 6B, viewed from above, in at least one implementation configuration. [Figure 7A] This is a plan view of the electrical enclosure as seen from the top panel, representing at least one implementation configuration. [Figure 7B] This is a plan view of the electrical enclosure shown in Figure 7A, as seen from the bottom panel, in at least one implementation configuration. [Figure 7C] Figure 7A is a plan view from below of the electrical enclosure shown, with the bottom panel removed to show the inside of the electrical enclosure and circuitry in at least one implementation configuration. [Figure 8A] This is a 3D perspective view of a filter board subassembly from the rear, showing at least one implementation configuration. [Figure 8B] This is a 3D perspective view from the front of the filter board subassembly shown in Figure 8A, in at least one implementation configuration. [Figure 9] This is a block diagram of an electronic circuit contained within an electrical enclosure, in at least one implementation configuration. [Figure 10A] A 3D perspective view of a partially assembled RF connector in at least one implementation configuration. [Figure 10B] Figure 10A is a 3D perspective view of a fully assembled RF connector in at least one implementation configuration. [Figure 10C] Figure 10B is a 3D perspective view of the RF connector's implementation configuration, using at least one implementation form. [Modes for carrying out the invention]

[0005] In at least one implementation, a pedestal assembly is described having improved cooling performance and subassembly design that simplifies installation. In at least one implementation, the pedestal assembly can be part of a process tool for manufacturing a semiconductor device. In at least one implementation, the process tool may include a vacuum chamber. In at least one implementation, the pedestal assembly may be at least partially housed within the vacuum chamber and extend through the walls of the vacuum chamber into the ambient atmosphere. In at least one implementation, the pedestal assembly comprises a platen and a stem descending from the platen. In at least one implementation, the stem may be a tubular structure having a tubular wall surrounding a hollow interior. In at least one implementation, the platen includes an electrostatic chuck for electrostatically securing a semiconductor substrate to the platen.

[0006] In at least one configuration, the platen and stem include, but are not limited to, a high thermal conductivity (k) ceramic material such as aluminum nitride (k ~ 300 W / mK). During operation, the wafer pedestal may heat to a temperature of 650°C or higher. Heat may be transferred to other parts of the pedestal assembly by longitudinal conduction (e.g., vertical) through the walls of the stem, and by radiation to radio frequency (RF) and low frequency (e.g., 60 Hz) alternating current conductors or direct current (DC) conductors disposed through the stem. In at least one configuration, the pedestal assembly further comprises an adapter tube coupled to the base of the stem, providing a transition from the wafer pedestal to a cooling collar coupled to the base of the adapter tube. In at least one configuration, the adapter tube may also include a metal such as stainless steel or aluminum. In at least one configuration, the adapter tube includes a ceramic material such as aluminum nitride. In at least one configuration, an O-ring may be used for a gas seal at the joint between the neck of the cooling collar and the adapter tube. In at least one implementation, the O-ring may be positioned within a groove in the neck. In at least one implementation, the O-ring may contain an elastomer that may begin to melt at temperatures above 150°C.

[0007] In at least one implementation, the cooling collar is provided with a circular flange at the base of the neck. In at least one implementation, an internal conduit extends within the flange for flowing a cooling fluid, such as water, through the flange. During operation, the cooling fluid can improve heat removal from the pedestal assembly by convective heat transfer from the solid portion of the cooling collar to the moving fluid. In at least one implementation, the cooling fluid flowing within the flange can absorb enough heat to cool the neck to a temperature below the critical or maximum temperature that may be within the thermal tolerance of the O-ring. In at least one implementation, the cooling collar includes a material having high thermal conductivity (e.g., greater than 200 W / mK), such as copper and / or aluminum. During operation, the high thermal conductivity of the solid material of the cooling collar can ensure rapid heat transfer from the adapter tube and neck of the cooling collar to the cooling fluid.

[0008] In at least one implementation, the pedestal assembly further comprises an electrical subassembly. In at least one implementation, the electrical subassembly comprises an electrical enclosure and a tubular transition conduit attached (e.g., by fasteners) to the top panel of the electrical enclosure. In addition to providing connection and distribution means for external RF and DC power supplies and the pedestal assembly, the electrical enclosure can house circuitry operable to perform RF filtering and impedance matching functions. In at least one implementation, the circuitry can provide low-pass filtering or RF choke functions. These filtering functions may be operable to attenuate any RF voltages and RF currents that may appear in the DC heater conductors due to electromagnetic coupling to nearby RF conductors. In at least one implementation, the electrical housing subassembly can be mechanically coupled to the pedestal assembly by the transition conduit. In at least one implementation, the transition conduit extends between the electrical enclosure and the cooling collar. In at least one implementation, the transition conduit can be fastened to the top panel of the electrical enclosure by a flange.

[0009] In at least one implementation, the transition conduit can be fastened to the flange of the cooling collar. In at least one implementation, electrical conductors extending from the electrical subassembly to the pedestal enter the adapter tube and stem through the transition conduit. In at least one implementation, electrical conductors carrying RF power and / or DC power are routed to RF electrodes and electrostatic chuck electrodes embedded within the pedestal. In at least one implementation, conductors carrying DC power or low-frequency AC power to a resistive heater or heating element embedded within the pedestal are also routed via the adapter tube and stem, originating from the electrical housing subassembly.

[0010] In at least one implementation, the electrical conductor comprises rigid RF conductor rods and DC heater conductor rods extending through a column of pedestal assembly (e.g., a column including a transition conduit, cooling collar, adapter tube, and stem). In at least one implementation, the electrical subassembly comprises an electrical connector block extending through the top panel of the electrical enclosure. In at least one implementation, the connector block provides an interface between the RF conductor rods and DC heater conductor rods and the circuitry within the electrical enclosure. In at least one implementation, the connector block is coupled to a circuit board housed within the electrical enclosure. In at least one implementation, the connector block extends into the transition conduit through an opening in the top panel of the electrical enclosure and flanges the transition conduit to the electrical enclosure. In at least one implementation, the connector block may comprise a bank of plug-in or bayonet-type terminals, allowing the RF conductor rods and heater conductor rods to dock securely to the electrical enclosure for both mechanical and electrical coupling. In at least one implementation, a dedicated first connector block for transmitting heater power from the electrical enclosure to the pedestal may have four terminals for arranging four heater conductor rods. In at least one implementation, a dedicated second connector block for transmitting RF power from the electrical enclosure to the pedestal may have three terminals for arranging three RF conductor rods.

[0011] In at least one implementation, the pedestal assembly can be physically suspended from the outer surface of the bottom wall of the vacuum chamber by a frame (e.g., an articulated framework). In at least one implementation, the frame comprises several extendable members that can be independently controlled to extend and retract. In at least one implementation, the frame may comprise three to six extendable members. In at least one implementation, each extendable member may be equipped with a linear drive actuator. In at least one implementation, the extendable members are mounted to an upper mount attached to the outer surface of the bottom wall of the vacuum chamber and to a lower mount on the upper panel of the electrical enclosure. In at least one implementation, the extendable members of the frame may be operable to retract and extend together to move the entire pedestal assembly up and down. In at least one implementation, in addition to vertical movement, the frame may be able to move the pedestal assembly laterally by individualized control of the extendable members. In at least one implementation, the frame can also tilt the pedestal assembly by the individual extension and contraction of the expandable members.

[0012] In at least one implementation, the adapter tube of the pedestal assembly extends through an opening in the floor of the vacuum chamber. In at least one implementation, the pedestal (including the electrostatic chuck) and the stem may be within the vacuum chamber, and the cooling collar, the transfer conduit, and the electrical subassembly may be outside (e.g., below) the vacuum chamber. In at least one implementation, the opening in the floor of the vacuum chamber can be made wider than the diameter of the adapter tube to allow free movement of the pedestal assembly, including lateral movement and tilting of the pedestal assembly for each frame. In at least one implementation, a vacuum bellows through which the adapter tube can pass can be fastened to the bottom wall of the vacuum chamber and can be fastened to the cooling collar. In at least one implementation, a gasket or seal can be placed between the edge of the adapter tube base and the base flange of the vacuum bellows to provide a vacuum seal against the atmosphere. In at least one implementation, the opening in the base flange of the vacuum bellows allows the neck of the cooling collar to be coupled to the adapter tube.

[0013] In at least one implementation, a mounting ring can be included around the base flange of the vacuum bellows. In at least one implementation, the mounting ring can be fastened to the base flange by bolts extending from the cooling collar. In at least one implementation, the lateral extensions from the mounting ring can enable the use of fasteners to firmly secure together the lower part of the pedestal assembly, including the cooling collar, the transfer conduit, and the electrical subassembly.

[0014] In at least one implementation, the pedestal assembly includes a gas inlet port for introducing an inert gas into an inner portion of the pedestal assembly to displace air that may penetrate through the vent holes in the electrical enclosure. In at least one implementation, the gas inlet port extends through the wall of the transfer conduit. In at least one implementation, the gas delivery tube can be coupled to the gas inlet port that is inside the transfer conduit and extend to the upper part of the pedestal assembly through the adapter tube and the stem. In at least one implementation, the gas delivery tube can transport an inert gas such as nitrogen or argon to the inner surfaces of the stem and the platen.

[0015] Air may penetrate the pedestal assembly through the electrical enclosure. At the high temperatures that occur inside the upper part of the pedestal assembly (e.g., inside the stem), the ceramic composition of the stem and the exposed surface of the platen can react with gaseous oxygen and water vapor contained in the air, potentially shortening the useful life of the pedestal. During operation, the inert gas introduced through the gas inlet port can fill the inside of the stem, create a positive pressure at the upper part of the pedestal assembly, and move oxygen and moisture away from the stem.

[0016] During operation, the replacement of air in the heated upper part of the pedestal assembly by an inert gas can mitigate the ingress of oxygen into the ceramic composition (e.g., aluminum nitride) of the stem and the platen, and extend the life of the pedestal. For example, at high temperatures (above 500 °C), gaseous oxygen may move into the bulk of the aluminum nitride, replacing nitride ions in the bulk of the particles or accumulating at grain boundaries to form domains of aluminum oxide or oxygen-rich regions. The integrity of the aluminum nitride can be compromised, and macroscopic cracks may ultimately occur within the stem and at the junction between the stem and the platen, requiring replacement of the pedestal.

[0017] In at least one implementation, the pedestal assembly includes a thermocouple port extending through the wall of the transition conduit. In at least one implementation, a long lead wire from a thermocouple coupled to the platen is routed through a shielding tube that can be electrically coupled to the thermocouple port. In at least one implementation, the shielding tube and thermocouple port can be electrically grounded to the electrical enclosure via the transition conduit and bottom cover. In at least one implementation, the electrically grounded shielding tube can prevent RF pickup due to electromagnetic coupling to RF from nearby RF conductors by the long thermocouple lead (and thermocouple). Thus, in at least one implementation, accurate temperature readings from a thermocouple placed in a strong RF environment can be enabled without the need for electronic filtering.

[0018] Here, numerous specific details, such as structural schemes, are described in order to provide a complete understanding of at least one implementation. It will be apparent to those skilled in the art that the implementations of this disclosure can be carried out without these specific details. In other examples, well-known features are not described in detail so as not to unnecessarily obscure at least one implementation. Furthermore, it will be understood that at least one implementation shown in the figures may be illustrative and may not necessarily be drawn to scale.

[0019] In some cases, to avoid obscuring at least one implementation, well-known methods and apparatus are not shown in detail but are represented in block diagram form. Throughout this specification, references to “one implementation,” “at least one implementation,” “one implementation,” or “several implementations” mean that certain features, structures, functions, or characteristics described in relation to an implementation may be included in at least one implementation. Thus, appearances of “in one implementation,” “in one implementation,” “at least one implementation,” or “several implementations” in various parts of this specification do not necessarily refer to the same implementation. Furthermore, certain features, structures, functions, or characteristics can be combined in any suitable way in at least one implementation. For example, a first implementation can be combined with a second implementation, provided that the certain features, structures, functions, or characteristics related to the first and second implementations are not mutually exclusive.

[0020] Here, “combined” and “connected,” along with their derivatives, can be used to describe functional or structural relationships between constituent elements. These terms are not intended to be synonymous with each other. Rather, in certain implementations, “connected” can be used to indicate that two or more elements are in direct physical, optical, or electrical contact with one another. Here, “combined” can be used to indicate that two or more elements are in direct or indirect physical, electrical, or magnetic contact with one another (along with other intervening elements between them), and / or that two or more elements cooperate or interact with one another (e.g., causally).

[0021] Here, “over,” “under,” “between,” and “on” can generally refer to the relative position of one component or material to other components or other materials of note in such physical relationship. Unless these terms are modified by “directly” or “indirectly,” there may be one or more intervening components or materials. A similar distinction should be made with respect to component assemblies. As used throughout this specification and the claims, a list of items joined by “at least one” or “one or more of the ~” can mean any combination of the enumerated terms.

[0022] Here, "adjacent" generally refers to a position where one thing is next to another (for example, immediately next to it, or close to it with one or more things in between), or adjacent to it (for example, touching it).

[0023] Unless explicitly specified in the context of their use, "substantially equal," "nearly equal," and "approximately equal" generally mean that there can only be accidental variation between the two things described in this way. In at least one implementation, such variation may be less than + / - 10% of the reference value.

[0024] Here, "process tool" generally refers to one of the pieces of equipment used in semiconductor manufacturing, and is also called a "semiconductor process tool" for semiconductor processing. In at least one implementation, the process tool may generally include a vacuum chamber on which processes such as substrate plasma etching or plasma-enhanced material deposition are performed. In at least one implementation, non-plasma-related processes may also be performed on the process tool.

[0025] Here, "vacuum chamber" can generally refer to a chamber capable of operating to maintain a high vacuum (e.g., less than 10 Torre). In at least one implementation, the vacuum chamber can be part of a process tool used in semiconductor device manufacturing. In at least one implementation, processes such as thin-film deposition and etching can be performed within the vacuum chamber.

[0026] Here, "processing chamber" generally refers to a vacuum chamber of a process tool into which a substrate can be introduced for processing. In at least one configuration, the processing chamber may include a chuck for holding the substrate. In at least one configuration, the processing chamber may be a plasma etching chamber.

[0027] Here, “substrate” can generally refer to a wafer containing a semiconductor (e.g., silicon) or an insulator (e.g., aluminum nitride, silicon carbide, silicon nitride, aluminum oxide, float glass, borosilicate glass, etc.). In at least one configuration, the wafer may be a slice of a single-crystal semiconductor or insulator. In at least one configuration, the wafer may also contain polycrystalline or amorphous (glassy) material. In at least one configuration, the wafer may generally have a diameter in the range of 100 mm to 500 mm and a thickness in the range of 100 microns to 1 mm.

[0028] Here, "pedestal" can generally refer to a processing component device within a vacuum chamber. In at least one implementation, the pedestal may comprise a platen and a stem supporting the platen. In at least one implementation, the platen may hold a wafer substrate for processing within the vacuum chamber. In at least one implementation, the platen may embed electrodes therein that are operable to function, for example, as a plasma coupling electrode and an electrostatic chuck electrode.

[0029] Here, "platen" can generally refer to the flat, wide portion of a pedestal on which a wafer substrate can be mounted.

[0030] Here, "stem" can generally refer to a tubular member extending below the platen. In at least one implementation, the stem can accommodate electrical conductors and piping that may be routed from components within the pedestal assembly to the platen.

[0031] Here, “pedestal assembly” can generally refer to an assembly that includes a pedestal. In at least one implementation, the pedestal assembly may include components and subassemblies that are sequentially mounted below the stem. In at least one implementation, the pedestal may be the topmost component of the pedestal assembly.

[0032] Here, "adapter tube" can generally refer to a cylindrical housing attached to the stem. In at least one implementation, the adapter tube can move the pedestal assembly from the pedestal to other components below the pedestal within the pedestal assembly.

[0033] Here, "O-ring" can generally refer to a gasket or seal containing an elastomer.

[0034] Here, "joint" can generally refer to the joint between two tubular structures.

[0035] Here, "inner wall" generally refers to the inner surface of a tubular structure.

[0036] Here, “cooling collar” can generally refer to a component of the pedestal assembly that can be located beneath the adapter tube. In at least one implementation, the cooling collar can provide piping for circulating a cooling fluid to facilitate heat transfer from a portion of the pedestal assembly. In at least one implementation, the cooling collar comprises a first half and a second half.

[0037] Here, "flange" can generally refer to a ring structure having multiple bolt holes. In at least one implementation, a flange can be used to mount components of a pedestal assembly. In at least one implementation, in the context of a cooling collar, the flange can be the flat cylindrical portion of the cooling collar.

[0038] Here, the "neck" can generally refer to the extended cylindrical portion of the cooling collar. In at least one implementation, the neck may extend from the inner wall of the flange of the cooling collar.

[0039] Here, "internal conduit" can generally refer to a conduit that can be embedded within the flange of the cooling collar. In at least one implementation, the internal conduit can carry a circulating cooling fluid.

[0040] Here, "groove" can generally refer to an elongated trench on the surface of the flange of the cooling collar. In at least one implementation, the groove can accommodate an external conduit, such as a pipe of a certain length, which may be placed within the groove.

[0041] Here, “transition conduit” can generally refer to a component of the pedestal assembly that can be located beneath the cooling collar. In at least one implementation, the transition conduit can provide housing for conductors and piping extending within the pedestal assembly. In at least one implementation, the transition conduit may include a slot in the wall for defining the insertion direction of a rigid conductor extending through the transition conduit.

[0042] Here, the “orientation ring” can generally refer to a component of a pedestal assembly that can be located within a transition conduit. In at least one implementation, the orientation ring can provide a bracket for uniquely orienting a conductor, such as an RF conductor, that is to be deployed into the pedestal assembly.

[0043] Here, “keying strip” can generally refer to a component of a pedestal assembly that can be attached to an orientation ring. In at least one implementation, the keying strip can provide a means for orienting the orientation ring to face a particular direction on the transition conduit. In at least one implementation, the keying strip can be inserted into a slot in the wall of the transition conduit.

[0044] Here, “mounting flange” can generally refer to a component of the pedestal assembly that can be located beneath the transition conduit. In at least one implementation, the mounting flange can connect the transition conduit to the electrical enclosure beneath it.

[0045] Here, "RF conductor guide" can generally refer to a component of a pedestal assembly that can be attached to the orientation ring. In at least one implementation, the RF conductor guide can stabilize the RF conductor extending into the transition conduit.

[0046] Here, “electrical enclosure” can generally refer to a box or enclosure that houses electronic circuitry, which may include electronic filters and tuning circuits. In at least one implementation, the electrical enclosure may have several electrical connectors for coupling an external power supply. In at least one implementation, the electrical enclosure may be mounted as the lowest component of a pedestal assembly.

[0047] Here, “frame” can generally refer to a support framework comprising an extendable member. In at least one implementation, the extendable member may include actuators that allow the frame member to articulate by lengthening and contracting. In at least one implementation, the frame may be attached to the bottom wall or floor of the vacuum chamber and to lower components of the pedestal assembly, such as an electrical enclosure. In at least one implementation, the frame may suspend the pedestal assembly from below the vacuum chamber. In at least one implementation, the frame may be moved to tilt the pedestal assembly.

[0048] Here, "anchor" can generally refer to a structure on an extendable member of a frame that functions as a foot or other type of mounting structure.

[0049] Here, "stretchable member" can generally refer to a frame member that can be stretched or retracted. In at least one implementation, the stretchable member may include, for example, a small linear motor.

[0050] Here, “vacuum bellows” can generally refer to a vacuum containment housing with flexible walls. In at least one implementation, the flexible walls have a series of accordion-like folds that allow the walls to be flexible enough to stretch, compress, and move laterally in various directions. In at least one implementation, the vacuum bellows can contain a high vacuum. In at least one implementation, the vacuum bellows can be used as a flexible housing surrounding components of a vacuum chamber system located outside the vacuum chamber. In at least one implementation, the movement of the external components can be made possible by the vacuum bellows.

[0051] Here, "radio frequency" generally refers to frequencies from 10 kilohertz (kHz) to 1 terahertz (THz or 10 kHz). 15Radio frequency can refer to electromagnetic radiation that oscillates at frequencies in the spectrum that can substantially include frequencies of Hz. In at least one implementation, the upper limit of the radio frequency spectrum can reach several hundred gigahertz (GHz). The term radio frequency can commonly be abbreviated as "RF".

[0052] Here, "RF signal source" can generally refer to an electronic device capable of generating electrical signals at radio frequencies. In at least one implementation, an RF signal source may be capable of outputting a fairly large RF current (e.g., 1 ampere rms or more) at a fairly large voltage. In at least one implementation, an RF signal source for an ICP antenna can generally output up to several hundred volts and up to several hundred amperes, generating a fairly large amount of power.

[0053] Here, "RF conductor" can generally refer to a rigid conductor that conducts RF current. In at least one implementation, the RF conductor may be arranged within a pedestal assembly, from the electrical enclosure to the electrodes in the platen.

[0054] Here, “heater conductor” can generally refer to a rigid or flexible conductor capable of conducting DC current or very low frequency AC current to a heater within the platen.

[0055] Here, "RF connector" can generally refer to a connector capable of connecting an RF supply line, such as a coaxial transmission cable, to a mating socket on a device such as an electrical enclosure. In at least one implementation, the RF connector may include a coaxial socket.

[0056] Here, "mountable bracket" can generally refer to a bracket for an RF connector that can be mounted on an electrical enclosure.

[0057] Here, “retaining bracket” can generally refer to a small plate that may be attached to the mountable bracket of the RF connector. In at least one implementation, the retaining bracket can hold the RF cable within the mountable bracket.

[0058] Here, “locking plate” can generally refer to a pivotable plate that can be attached to the mountable bracket of an RF connector. In at least one implementation, the locking plate can be swung upward to close the mountable bracket. In at least one implementation, the locking plate can restrict access to the coaxial connector plug that can be held within the mountable bracket.

[0059] Here, “lock tab” can generally refer to a tab, strip, or bar attached to a lock plate. In at least one implementation, the lock strip may allow the lock plate to be secured to the electrical enclosure by fasteners.

[0060] Here, “heater connector” can generally refer to a connector capable of connecting cable-conducted DC current or very low frequency (e.g., 60 Hz) AC current intended to supply power to a heater within the platen of a pedestal assembly.

[0061] Here, “printed circuit board” can generally refer to a dielectric substrate capable of receiving mounted electrical and electronic components. In at least one implementation, a printed circuit board (PCB) may have etched traces that replace wiring for compact and rigid designs.

[0062] Here, "tunable element" generally refers to a circuit element that can be adjusted mechanically or electrically. In at least one implementation, the tunable element may be a variable capacitor or a variable inductor.

[0063] Here, “variable capacitor” can generally refer to a variable capacitor having a set of stator plates and a set of movable plates arranged alternately with the stator plates. In at least one implementation, the movable plates may be rotated to align with or offset the stator plates. In at least one implementation, the movable plates may move linearly to align with or offset the stator plates. In at least one implementation, the variable capacitor may be a solid-state varactor diode. In at least one implementation, the variable capacitor may be part of an adjustment circuit comprising one or more inductors. In at least one implementation, the variable capacitor can be adjusted by rotating the rotor plates relative to the stator plates.

[0064] Here, "variable inductor" generally refers to a tunable inductor such as a roller inductor that mechanically changes the tap point on a fixed coil, or a slug tunable inductor that has a movable rod-shaped core that moves in and out of a fixed coil.

[0065] Here, “motor” can generally refer to a motor that may be capable of operating to drive the tuning structure of a tuning element. In at least one implementation, the motor can be mechanically coupled to a variable capacitor to linearly drive or rotate the movable plate of the variable capacitor. In at least one implementation, the motor can be mechanically coupled to the shaft of a variable capacitor or roller inductor. In at least one implementation, the motor can also be coupled to a screw drive or worm gear that linearly drives the core slug in a slug-adjustable inductor.

[0066] Here, “partition” can generally refer to a wall within an enclosure, such as an electrical enclosure. In at least one implementation, the partition can provide electromagnetic shielding to the circuitry within the electrical enclosure and can also provide a mounting surface for the mechanical mounting of a PCB-like structure.

[0067] Here, "RF connector block" can generally refer to a rigid dielectric block having two or more receptacles for plugging in RF conductors.

[0068] Here, "heater connector block" can generally refer to a rigid dielectric block having two or more receptacles for plugging in heater conductors.

[0069] Figure 1A shows a profile diagram of the pedestal assembly 100 in at least one mounting configuration. In at least one mounting configuration, the pedestal assembly 100 comprises a pedestal 102. In at least one mounting configuration, the pedestal 102 comprises a platen 104 and a stem 106. In at least one mounting configuration, the stem 106 can be integrally formed with the platen 104. In at least one mounting configuration, the pedestal 102 includes, but is not limited to, a ceramic material such as aluminum nitride. Aluminum nitride (AlN) may be an electrical insulator (6.42 eV bandgap) but can have a high thermal conductivity of at least 300 W / mK. In at least one mounting configuration, the high thermal conductivity of aluminum nitride allows for rapid and uniform heating of the platen 104 to temperatures above 600°C (the melting point of AlN is 2200°C). In at least one implementation, since the stem 106 contains AlN, heat can be easily transferred by conduction to the lower components of the pedestal assembly 100 below the stem 106. In at least one implementation, some components within the pedestal assembly 100 may have a maximum temperature tolerance.

[0070] In at least one implementation, the stem 106 includes a base portion (indicated by a hidden line extending below the stem 106) that is captured within the clamp 108. In at least one implementation, the clamp 108 includes an upper clamp ring 110 and a lower clamp ring 112. In at least one implementation, the upper clamp ring 110 and the lower clamp ring 112 are bolted to the flange 114 of the adapter tube 116. In at least one implementation, the stem 106 includes a lip (shown in Figure 1B) that compresses a compression seal located inside the flange 114 when clamped.

[0071] In at least one implementation, the pedestal assembly 100 may be partially inside the vacuum chamber 118 and partially outside the vacuum chamber 118. In at least one implementation, the pedestal 102, clamp 108, and flange 114 are fully housed inside the vacuum chamber 118. In at least one implementation, the adapter tube 116 extends through an opening (not shown) in the floor 120 of the vacuum chamber 118. In at least one implementation, the vacuum bellows 122 (indicated by a dotted box) accommodates the lower part of the adapter tube 116. In at least one implementation, during operation, the vacuum bellows 122 maintains a flexible vacuum compartment below the vacuum chamber 118. In at least one implementation, the vacuum bellows 122 includes an upper flange (not shown) that can be fastened to the outer surface 124 of the floor 120. In at least one implementation, the floor 120 may be the bottom wall of the vacuum chamber 118. In at least one implementation, a vacuum seal can be provided by including a gasket in the subassembly. In at least one implementation, the vacuum bellows 122 includes a flexible wall extending below the floor 120, which allows movement of the pedestal assembly 100 by an actuator in the frame 126. In at least one implementation, the frame 126 is indicated by a dashed outline so as not to obscure the pedestal assembly 100. In at least one implementation, the frame 126 is described below.

[0072] Referring again to the pedestal assembly 100, in at least one configuration, the adapter tube 116 terminates within the vacuum bellows 122. In at least one configuration, the vacuum bellows 122 includes a lower flange (not shown) above the flange 128 of the cooling collar 130, which can be fastened to a retainer ring (e.g., retainer flange 190, see Figure 1B). In at least one configuration, a vacuum seal can be provided by including a gasket in the assembly. In at least one configuration, the cooling collar 130 includes a neck 132 extending into the adapter tube 116, forming a joint with the adapter tube 116. In at least one configuration, an O-ring 134 can be positioned below the edge 136 of the adapter tube 116, forming a seal at the joint between the adapter tube 116 and the neck 132. In at least one configuration, the O-ring 134 includes a suitable elastomer. In at least one configuration, the elastomer may have a maximum temperature rating. In at least one implementation, the O-ring 134 does not need to be heated above 150°C.

[0073] In at least one implementation, the cooling collar 130 contains a cooling fluid flowing within the flange 128 or in piping in contact with the flange 128. In at least one implementation, the cooling fluid may be water. In at least one implementation, during operation, the flow rate of the cooling fluid can be adjusted to maximize convective heat transfer from the solid portion of the cooling collar 130. In at least one implementation, the cooling collar 130 includes a material having a high thermal conductivity k (e.g., k is greater than 200 W / mK). In at least one implementation, the cooling collar 130 includes aluminum (k approximately 250 W / mK) or copper (k approximately 400 W / mK). In at least one implementation, the high thermal conductivity of the solid portion of the cooling collar 130 allows for sufficient cooling of the neck 132 and adapter tube 116 and protects the O-ring 134 from exposure to temperatures exceeding its thermal rating. The cooling collar 130 is described further below.

[0074] In at least one implementation, the flange 128 of the cooling collar can be fastened to the transition conduit 138. In at least one implementation, the transition conduit 138 can be part of an electrical subassembly 140. In at least one implementation, the transition conduit 138 provides a transition housing for electrical conductors arranged to extend through a pedestal assembly 100. In at least one implementation, both RF conductors and DC conductors (not shown) extend upward through a pedestal column including a cooling collar 130, an adapter tube 116, and a stem 106. In at least one implementation, the electrical conductors are drawn out from within an electrical enclosure 142 and attached to a mounting flange 144 between the transition conduit 138 of the electrical subassembly 140 and the electrical enclosure 142. The transition conduit 138 and the mounting flange 144 are described further below.

[0075] In at least one implementation, the electrical enclosure 142 provides means for connecting an external power supply to conductors that transmit RF power and DC power to the RF plasma coupling electrode, electrostatic chuck electrode, and heater within the platen 104. In at least one implementation, the electrical enclosure 142 houses a circuit for filtering RF that can be coupled to the DC heater conductor and for adjusting the impedance between the RF power supply and the RF plasma electrode within the platen 104. In at least one implementation, the electrical subassembly 140 also includes an RF connector 146 mounted on the side panel 148 of the electrical enclosure 142. In at least one implementation, the RF connector 146 includes features to prevent loosening and tampering. The RF connector 146 is described further below. In at least one implementation, the electrical subassembly 140 includes a tuning motor 150 mounted on the side panel 148. In at least one implementation, the tuning motor 150 can be coupled to a variable capacitor or variable inductor mounted within the electrical enclosure 142. Tuning elements such as variable capacitors or variable inductors are described below. In at least one implementation, the electrical subassembly 140 can also include a heater connector 152 mounted within the electrical enclosure 142.

[0076] In at least one implementation, cooling fans 154 and 156 are provided for the air cooling circuit within the electrical enclosure 142. In at least one implementation, cooling fans 154 and 156 may comprise one or more cooling fans mounted on the lower panel 158 of the electrical enclosure 142. In at least one implementation, the forced airflow from cooling fans 154 and 156 can enter the interior of the electrical enclosure 142 through vents in the lower panel 158.

[0077] In at least one implementation, the electrical subassembly 140 may further include a lower anchor 162 on the upper panel 160 of the electrical enclosure 142. In at least one implementation, the lower anchor 162 attaches the frame 126 to the electrical enclosure 142. In at least one implementation, the frame 126 allows the pedestal assembly 100 to be suspended from the floor 120 of the vacuum chamber 118. In at least one implementation, the frame 126 may be operable to move the pedestal assembly vertically (z-direction) and laterally (x and y-directions) and to pivot or tilt the pedestal assembly by a small angle. In at least one implementation, the vacuum bellows 122 can accommodate the positional changes of the pedestal assembly 100 while maintaining the vacuum in the chamber 118. In at least one implementation, the tilt angle of the pedestal assembly 100 can be limited to less than 1 or 2 degrees. In at least one implementation configuration, the x, y, z, and theta positions of the pedestal assembly 100 can be adjusted to optimize the uniformity of the film deposited on the wafer substrate mounted on the platen 104.

[0078] In at least one implementation, the electrical subassembly 140 may further include a thermocouple connector 164 mounted on the transition conduit 138. In at least one implementation, the thermocouple connector 164 terminates thermocouple leads routed within the transition conduit 138. In at least one implementation, the thermocouple leads are routed via a shielding tube that can be mechanically coupled to the thermocouple connector 164. In at least one implementation, the thermocouple connector 164 can be electrically grounded to the electrical enclosure 142 via the transition conduit 138, and the shielding tube can also be grounded to the electrical enclosure 142. In at least one implementation, shielding the thermocouple leads can mitigate or eliminate RF noise interference to the thermocouple signal from nearby RF conductors, enabling more accurate temperature readings.

[0079] Figure 1B shows a cross-sectional view of a pedestal assembly 100 showing its internal components in at least one implementation configuration. In at least one implementation configuration, the pedestal assembly 100 comprises an RF conductor 170 extending from an electrical enclosure 142 to a platen 104. The RF conductor 170 passes through a transition conduit 138, an adapter tube 116, and a stem 106, and terminates with an electrode 172 embedded in the platen 104. In at least one implementation configuration, the RF conductor is a rigid structure. In at least one implementation configuration, the RF conductor 170 comprises a solid rod portion 174 and a hollow tubular portion 176. In at least one implementation configuration, the hollow tubular portion 176 can act as a thermal choke to prevent conductive heat transfer from the platen 104. In at least one implementation configuration, a ceramic sleeve (not shown) can cover a portion of the RF conductor 170 to limit radiative heat transfer and restrict arc discharge between conductors.

[0080] In at least one implementation, the RF conductor 170 is laterally constrained within a hole in a clamp 178 positioned at the base of the adapter tube. In at least one implementation, the clamp 178 can be molded to fit into the adapter tube 116 in a specific orientation. In at least one implementation, the adapter tube 116 may have an internal contour (not shown) that complements the shape of the clamp 178, allowing for the orientation of the clamp 178 within the adapter tube 116. In at least one implementation, the RF conductor 170 can be stabilized by a spacer 180 positioned near the top of the adapter tube 116. In at least one implementation, the spacer 180 can avoid arc discharge between individual RF conductors 170 by ensuring a minimum distance between them.

[0081] In at least one implementation, the RF conductor 170 is connected by a connector block 182 to a circuit housed within an electrical enclosure 142. In at least one implementation, the base 184 of the RF conductor 170 is located within a receptacle 186 embedded in the connector block 182. In at least one implementation, the base 184 has a bayonet shape for insertion into and locking into the connector block 182. In at least one implementation, the base 184 can be inserted into a spring-loaded terminal receptacle to create a reliable electrical and mechanical connection. In at least one implementation, the connector block 182 may be equipped with a threaded cap on the receptacle 186, which can be tightened around the RF conductor 170 to secure them in place. In at least one implementation, the connector block 182 may be mounted on a printed circuit board (PCB) (shown by concealed contour) within the electrical enclosure 142. In at least one implementation, the connector block 182 can extend into the transition conduit 138 through an opening (not shown) in the upper panel 160 of the electrical enclosure 142 and through the mounting flange 144.

[0082] In at least one implementation, the heater conductor (not shown) comprises a rigid rod extending from the electrical enclosure 142 to a contact heater (not shown) in the platen 104. In at least one implementation, during operation, the heater conductor can carry a current smaller than the current carried by the RF conductor 170 (e.g., an RF current of 20 amperes rms) and can accordingly have a smaller diameter than the RF conductor 170. In at least one implementation, the heater conductor can be coupled to a circuit in the electrical enclosure 142 by a separate connector block adjacent to the connector block 182, as described below.

[0083] In at least one implementation, the inert gas inlet 166 passes through the wall of the transition conduit 138. In at least one implementation, the duct 168 can extend into the adapter tube 116 and be routed into the stem 106 (indicated by the dashed arrow). In at least one implementation, the duct 168 can carry the inert gas into the stem 106 to avoid oxidative decomposition of the stem 106 and platen 104. In at least one implementation, the thermocouple connector 164 penetrates the wall of the transition conduit 138. In at least one implementation, a shield tube 188, which similarly extends through the transition conduit 138 into the adapter tube 116 and stem 106, can be mechanically and electrically coupled to the thermocouple connector 164. In at least one implementation, the shield tube can be electrically grounded to the electrical enclosure 142 via the transition conduit 138 and mounting flange 144. In at least one implementation configuration, the thermocouple leads can be routed inside the shielding tube 188 to prevent RF pickup from near the RF conductor 170.

[0084] In at least one implementation, the frame 126 can be attached to the upper panel 160 of the electrical enclosure 142 by a lower anchor 162. In at least one implementation, the lower anchor 162 can be fastened to the upper panel 160 by screws or bolts. In at least one implementation, the pedestal assembly 100 may include a retainer flange 190 above the cooling collar 130. In at least one implementation, the retainer flange 190 prevents relative movement of the components at the bottom of the pedestal assembly 100, including the cooling collar 130, the transition conduit 138, and the electrical enclosure 142, by providing a lateral extension 192 that provides a passage hole for a long bolt 194. In at least one implementation, these components are securely attached to the vacuum bellows 122 by the retainer flange 190. In at least one implementation, the frame 126 includes an upper anchor 196 for attachment to the floor 120 of the vacuum chamber 118.

[0085] Figure 2A shows a plan view of the cooling collar 200 in at least one implementation configuration. In at least one implementation configuration, the cooling collar 200 can be an exemplary implementation configuration of the cooling collar 130 shown in Figure 1B. In at least one implementation configuration, the cooling collar 200 includes two substantially identical halves, half 200A and half 200B. In at least one implementation configuration, the cooling collar comprises a flange 128 and a neck 132. In at least one implementation configuration, the flange 128 and the neck 132 are equally divided by half 200A and 200B. In at least one implementation configuration, the flange 128 has a diameter D1 which may be substantially the same as an adjacent component such as a transition conduit 138 in the pedestal assembly 100. In at least one implementation configuration, half 200A can be joined to half 200B by bringing both halves into contact with each other during the assembly of the pedestal assembly 100. In at least one implementation, halves 200A and 200B comprise internal conduits 202A and 202B (shown by hidden lines), respectively. In at least one implementation, internal conduits 202A and 202B are independent of each other. In at least one implementation, internal conduits 202A and 202B are operable to carry a flowing cooling fluid, such as water, and provide convective heat transfer from the solid portion of the cooling collar 130. In at least one implementation, internal conduits 202A and 202B comprise ports 204A / B and 206A / B, respectively. In at least one implementation, ports 204A / B and 206A / B may be symmetrical and can function, for example, as either an inlet or an outlet for connecting a circulating cooling water source. In at least one implementation, ports 204A / B and 206A / B can be connected to fittings mounted on flange 128, as shown in Figure 2B. In at least one implementation, the cooling collar 130 includes, but is not limited to, a high thermal conductivity (k) material such as copper or aluminum and their alloys (e.g., k > 200 W / mK). In at least one implementation, the cooling collar 130 includes a high thermal conductivity (e.g., k > 300 W / mK) ceramic material such as aluminum nitride.

[0086] In at least one implementation, the neck 132 has a diameter D2 which may be approximately the same as the inner diameter of the adapter tube 116, allowing the neck 132 to fit inside the base of the adapter tube 116 within the assembly. In at least one implementation, the neck 132 includes an intricately shaped inner wall 208. In at least one implementation, the inner wall 208 has a symmetrical (as shown) or asymmetrical contour which allows the insertion direction of the RF conductor and heater conductor (e.g., RF conductor 170) extending through the cooling collar 130 within the pedestal assembly 100. In at least one implementation, a hole 210 is provided in the flange 128 to allow the passage of bolts or other types of fasteners for securing the cooling collar 130 to the vacuum bellows 122 and the transition conduit 138 (see Figure 1B).

[0087] Figure 2B shows a 3D perspective view of one of the halves of the cooling collar 200 shown in Figure 2A (e.g., half 200B) in at least one implementation configuration. In at least one implementation configuration, fittings 212 and 214 are attached to the flange 128 at ports 204B and 206B. In at least one implementation configuration, fittings 212 and 214 are substantially identical. Fittings 212 and 214 can be fastened to the flange 128 by bolts or screws. In at least one implementation configuration, the fittings include compression nuts 216 and 218 as shown. In at least one implementation configuration, fittings 212 and 214 include other suitable connector types such as quick-disconnect connectors. In at least one implementation configuration, fittings 212 and 214 can connect a circulating fluid source to the cooling collar 130.

[0088] Figure 3A shows a plan view of the cooling collar 300 in at least one mounting configuration. In at least one mounting configuration, the cooling collar 300 can be an exemplary mounting configuration of the cooling collar 130 shown in Figure 1B. In at least one mounting configuration, the cooling collar 300 includes two halves, half 300A and half 300B. In at least one mounting configuration, the cooling collar 300 comprises a flange 128 and a neck 132 extending from the inner wall of the flange 128. In at least one mounting configuration, the flange 128 and the neck 132 are equally divided by both halves 300A and 300B. In at least one mounting configuration, the flange 128 and the neck 132 may have dimensions similar to those of the cooling collar 200 (e.g., D1 and D2).

[0089] In at least one implementation, the cooling collar 300 is provided with grooves 302 and 304 on the upper surface 306 of the flange 128, respectively. In at least one implementation, grooves 302 and 304 may be substantially identical. In at least one implementation, grooves 302 and 304 provide a concave path for arranging external fluid transport piping across the flange 128, in contrast to the internal conduits 202A / B used in the cooling collar 200. In at least one implementation, grooves 302 and 304 are shown to follow a gentle arc, but grooves 302 and 304 may have more intricate shapes, such as serpentine shapes, to extend surface contact. In at least one implementation, grooves 302 and 304 may have diameters and depths that can be adjusted for optimal heat transfer.

[0090] In at least one implementation, the neck 132 comprises an inner wall 308. In at least one implementation, the inner wall 308 may have a symmetrical or asymmetrical contour to allow insertion of a conductor, such as an RF conductor 170, through the neck 132, with a defined insertion direction. The hole 310 may be aligned with fastening holes of adjacent components, such as the transition conduit 138 and the vacuum bellows 122, to allow the cooling collar 300 to be attached to the pedestal assembly 100, as described above.

[0091] Figure 3B shows a 3D perspective view of the cooling collar 300 in at least one implementation configuration. In at least one implementation configuration, piping segments 312 and 314 extend into grooves 302 and 304, respectively. In at least one implementation configuration, piping segments 312 and 314 are molded to follow the contours of grooves 302 and 304. In at least one implementation configuration, piping segments 312 and 314 follow the simple arcs of grooves 302 and 304, but piping segments 312 and 314 may have more intricate geometric shapes to increase surface contact, such as geometric shapes that meander to match the intricate geometric shapes of grooves 302 and 304.

[0092] In at least one implementation configuration, the cooling collar 300 may include a gasket (not shown) on the flange 128, providing an interface between the cooling collar 300 (or generally the cooling collar 130) and the retainer flange 190, as shown in Figure 1B.

[0093] Figure 4 shows a 3D perspective view of the transition conduit 138 in at least one implementation configuration. In at least one implementation configuration, the transition conduit 138 comprises a cylindrical body having a height h, an overall diameter D1, and an inner diameter D3. In at least one implementation configuration, the transition conduit 138 can be a conductive metal structure that can be part of the electrical subassembly 140 (see Figure 1A). In at least one implementation configuration, the transition conduit 138 can function as a transition element between the electrical enclosure 142 and the top of the pedestal assembly 100, starting from the cooling collar 130 (see Figure 1B). In at least one implementation configuration, the transition conduit 138 can provide a protective enclosure for RF and DC conductors leading from the electrical enclosure 142 to the top of the pedestal assembly 100.

[0094] In at least one implementation, the transition conduit 138 may have one or more flat portions 402 on the outer surface of the outer side wall 404. In at least one implementation, the slot 406 extends perpendicularly (in the z-direction) along the outer side wall 404. In at least one implementation, the slot 406 can be positioned in the flat portion 402. In at least one implementation, the slot 406 provides a keying function for the orientation of a connector block extending from the electrical enclosure 142 into the transition conduit 138, as described later. In at least one implementation, as shown in Figure 5, the slot 406 can also provide a position for a thermocouple through-connector.

[0095] In at least one implementation, the transition conduit 138 includes a gas feedthrough connector 408. In at least one implementation, the gas feedthrough connector 408 extends into the interior of the transition conduit 138 through the outer side wall 404 and the inner wall 410. In at least one implementation, during operation, the gas feedthrough connector 408 can be connected to an external source of an inert gas, such as nitrogen or argon. In at least one implementation, within the transition conduit 138, the gas feedthrough connector 408 can be connected to a tube (e.g., tube 188, Figure 1B) that extends into the stem 106 through the cooling collar 130 and adapter tube 116. In at least one implementation, during operation, an inert gas such as nitrogen can be transported into the stem 106 by the tube (e.g., tube 188). In at least one implementation, the inert gas can move air away from the stem 106, thereby mitigating or avoiding potential oxidative damage to the aluminum nitride composition of the stem 106 wall.

[0096] Figure 5 shows a 3D perspective view of the orientation ring 500 in at least one implementation configuration. In at least one implementation configuration, the orientation ring 500 has an outer diameter D4 which can be approximately equal to the inner diameter D3 of the transition conduit 138. In at least one implementation configuration, the orientation ring 500 is inserted into the transition conduit 138. In at least one implementation configuration, the orientation ring 500 includes a keyed inner wall 502. In at least one implementation configuration, the inner wall 502 has a contour which can conform to the shape of the connector block. In at least one implementation configuration, the inner wall 502 includes an extension 504 for attaching the RF conductor guide 506. In at least one implementation configuration, the RF conductor guide 506 includes a hole 508 through which the RF conductor 170 (see Figure 1B) can be inserted. The RF conductor guide 506 can stabilize the RF conductor 170.

[0097] In at least one implementation, the orientation ring 500 comprises a keying strip 510. In at least one implementation, the keying strip 510 is inserted into a slot 406 of the transition conduit 138. In at least one implementation, when the orientation ring 500 can be assembled with the transition conduit 138, the keying strip 510 and slot 406 can enable the correct orientation of the RF conductor guide 506, for example, so that the RF conductor 170 can be oriented along a specific orientation. In at least one implementation, the keying strip 510 comprises a notch 512 for mounting a thermocouple connector 514. In at least one implementation, the keying strip 510 comprises a conductive material such as aluminum, copper, or steel. In at least one implementation, the thermocouple connector 514 can be electrically grounded to the transition conduit 138 by the keying strip 510, which is in mechanical contact with the slot 406.

[0098] Figure 6A shows a plan view of the mounting flange 144 as seen from the top surface 602 in at least one implementation configuration. In at least one implementation configuration, the mounting flange 144 attaches the lower edge of the transition conduit 138 and the upper portion of the pedestal assembly 100, which includes the cooling collar 130, adapter tube 116, stem 106 and platen 104, to the electrical enclosure 142 (see Figure 1B). In at least one implementation configuration, the mounting flange 144 has an outer diameter D5 which can be approximately equal to the diameter D1 of the transition conduit 138. In at least one implementation configuration, the mounting flange 144 includes a conductive material such as aluminum, copper or steel. In at least one implementation configuration, the mounting flange 144 includes a plurality of bolt holes 604 for the passage of bolts between the electrical enclosure 142 and the transition conduit 138. In at least one implementation configuration, the mounting flange 144 includes a notch 606. In at least one implementation, the notch 606 may be approximately the same size and shape as the connector blocks (e.g., connector block 182 in Figure 1B) when the connector blocks are adjacent to each other, as described below. In at least one implementation, the connector block mounted on the upper panel 160 of the electrical enclosure 142 extends into the notch 606 when assembled.

[0099] Figure 6B shows a plan view of the mounting flange 144 as seen from the bottom surface 608, according to at least one mounting configuration. In at least one mounting configuration, the bottom surface 608 may have an opening 610 immediately below the notch 606. In at least one mounting configuration, the opening 610 may have a rectangular shape. In at least one mounting configuration, the opening 610 may extend through a portion of the thickness h3 (e.g., the height of the side wall 612) of the mounting flange 144 (see Figure 6C).

[0100] Figure 6C shows a 3D perspective view of the mounting flange 144 as seen from the top surface 602, according to at least one mounting configuration. In at least one mounting configuration, the notch 606 extends in the z direction by a distance h2, which can be part of the overall thickness h3 of the mounting flange 144 (e.g., the height of the side wall 612).

[0101] Figure 7A shows a plan view of the electrical enclosure 142 as seen from the upper panel 160 in at least one implementation configuration. In at least one implementation configuration, the electrical enclosure 142 comprises the upper panel 160 and side panels 702, 704, 706, 708, 710, 712, and 714. In at least one implementation configuration, the upper panel 160, the lower panel, and the side panels (described later) are made of sheet metal. In at least one implementation configuration, connector blocks 182 and 183 extend through an opening (not shown) in the upper panel 160.

[0102] In at least one implementation, the upper panel 160 includes vents 716, 718, and 720. In at least one implementation, three vents are shown, but the upper panel 160 may include any appropriate number. In at least one implementation, the vents 716, 718, and 720 include a plurality of perforations 722 that allow airflow from a cooling fan mounted on the lower panel to be blown over and cool the frame (e.g., frame 126) and components of the pedestal assembly 100 that can be heated. In at least one implementation, the vents 716-720 may include nozzles 724, 726, and 728 surrounding the perforated area of ​​the vents. In at least one implementation, the nozzles may be shaped similarly to nozzle 724 shown in the inset. The nozzles 724-728 have raised walls (e.g., wall 730) that can concentrate the forced air exiting the vents 716-720 onto the structure above. In at least one implementation, the nozzles 724-728 can also be used as guide structures for aligning the lower anchors 162 of the frame 126, which are attached to the upper panel 160. In at least one implementation, the heater connector 152 and tuning motor 150, described later, are attached to the side panels 706 and 710, respectively.

[0103] Figure 7B shows a plan view of the electrical enclosure 142 as seen from the lower panel 158, according to at least one implementation configuration. In at least one implementation configuration, the lower panel 158 includes ventilation openings (not shown) and mounting holes (not shown) for cooling fans 732 and 734. Although two cooling fans are shown in at least one implementation configuration, any appropriate number of cooling fans can be utilized. In at least one implementation configuration, the cooling fans 732 and 734 can provide forced air cooling to electrical components installed inside the electrical enclosure 142 that are subject to heating. In at least one implementation configuration, the forced air can also exit through ventilation openings 716-720 of the upper panel 160 to help cool the external components of the pedestal assembly 100 and the frame 126. In at least one implementation configuration, the RF connector 146 can be mounted on the side panel 710 above the tuning motor 150. In at least one implementation configuration, the RF connector 146 may be connected to a socket 735.

[0104] Figure 7C shows a plan view of the electrical enclosure 142, viewed from below with the lower panel 158 removed to show the interior and circuitry of the electrical enclosure 142, according to at least one implementation configuration. In at least one implementation configuration, the upper panel 160 is shown below the plane of the figure in the plan view. In at least one implementation configuration, the electrical enclosure 142 includes a partition 736. In at least one implementation configuration, the partition 736 has a structure similar to or identical to that of the electrical enclosure 142. In at least one implementation configuration, a printed circuit board (PCB) 738 can be mounted on a first side of the partition 736. In at least one implementation configuration, a PCB 740 can be mounted on a second side (opposite the first side) of the partition 736. In at least one implementation configuration, the partition 736 can provide electromagnetic shielding for confining RF energy to one compartment (RF side) within the electrical enclosure 142.

[0105] In at least one implementation, the tunable element 742 can be mounted on PCB 738. In at least one implementation, the tunable element 742 is electrically connected to PCB 738 via copper straps (not shown) or wires that couple tuning capacitors to traces on PCB 738. In at least one implementation, the tunable element 742 can be a vacuum variable capacitor enclosed in a hermetically sealed housing. In at least one implementation, a tuning motor 150 can be coupled to the shaft of the tunable element 742. In at least one implementation, the tuning motor 150 can actuate the tunable element 742 for tuning purposes (e.g., to rotate a rotor plate or to drive a plate that can move linearly parallel to a fixed stator plate). In at least one implementation, the tunable element 742 can be tuned to help match the impedance between the RF supply line coupled to RF connector 146 and the RF conductor 170. In at least one implementation, the tuning motor 150 can be a stepper motor commanded, for example, by a controller. In at least one implementation, other suitable types of variable capacitors can be used as tuning element 742.

[0106] In at least one implementation, the adjustable element 742 can be an adjustable inductor. Examples of adjustable inductors include roller inductors or slug-adjusting inductors. In at least one implementation, other suitable variable inductors can be used. In at least one implementation, the tuning motor 150 is coupled to a screw drive unit or worm gear mechanism that can linearly drive the shaft of the roller inductor tuning mechanism or the rod-shaped core slug in the slug-adjusting inductor.

[0107] In at least one implementation, the RF connector 146 can be coupled to the tunable element 742 and PCB 738 via a large cross-section conductor 744, such as a copper strap mounted on a socket 735, to accommodate large RF currents (e.g., greater than 20 amperes). In at least one implementation, traces on PCB 738 couple the tunable element 742 to other components mounted on PCB 738. In at least one implementation, the RF connector block 182 can be mounted on the top surface of PCB 738 (e.g., below the plane in the figure) (see Figure 8B). In at least one implementation, the RF connector block 182 can be coupled to a tuning circuit comprising the RF connector 146 and the tunable element 742 via traces on PCB 738.

[0108] In at least one implementation, PCB 740 includes a filter circuit for suppressing RF voltages that can be electromagnetically coupled to the heater supply circuit. In at least one implementation, the filter circuit includes inductors 746 and 748. Inductors 746 and 748 can be air-wound coils. In at least one implementation, the heater connector block 183 can be mounted on the top surface of PCB 740 (e.g., below the plane in the figure) (see Figure 8B). In at least one implementation, the heater connector block 183 can be coupled to the filter circuit on PCB 740.

[0109] In at least one implementation, a low-frequency (LF, submegahertz frequency) filter circuit board (PCB750) can be mounted on partition 752. In at least one implementation, partition 752 can be a sheet metal wall extending perpendicularly from partition 736. In at least one implementation, partition 752 can shield the LF filter circuit on PCB750 from RF that may be radiated from the circuit on PCB740. In at least one implementation, the LF filter circuit may include a filter choke 754. In at least one implementation, a conductor 756, which can be a flexible wire or a rigid conductor, can be routed from the heater connector 152 to PCB750. In at least one implementation, four conductors 756 can be used to power a heater circuit to carry a heater current that may nominally be a DC current (it can be understood that the heater current may also be a low-frequency (e.g., 60Hz) AC).

[0110] In at least one implementation, an LF circuit on PCB 750 can be coupled to an RF filter circuit on PCB 740 to send DC current to PCB 740. In at least one implementation, an ESC connector 758 can be provided to supply DC power to electrostatic chuck electrodes embedded in the platen 104. In at least one implementation, the ESC connector 758 can be coupled to PCB 740. In at least one implementation, the DC power can be combined with RF power by a circuit on PCB 740 and delivered to the electrodes in the platen 104 by an RF conductor 170.

[0111] Figure 8A shows a 3D perspective view of the filter board subassembly 800 as seen from the rear side 802 of partition 736, in at least one mounting configuration. In this perspective view, the rear edge 804 of PCB 738 may be near the observer. In at least one mounting configuration, PCB 738 and PCB 740 are mounted on either side of partition 736. In at least one mounting configuration, the adjustable element 742 has been removed from PCB 738 to show the RF connector block 182 mounted on the front edge 806 of PCB 738. In at least one mounting configuration, the ESC connector 758 can be mounted on tab 808 of the rear side 802 of partition 736.

[0112] Figure 8B shows a 3D perspective view of the filter board subassembly 800 as seen from the front of partition 736, in at least one mounting configuration. In this perspective view, the leading edge 806 of PCB 738 may be near the observer. In at least one mounting configuration, the heater connector block 183 can be mounted on PCB 740 by solder leads 810. In at least one mounting configuration, the RF connector block 182 can be similarly mounted on PCB 738.

[0113] In at least one implementation configuration, the RF connector block 182 and the heater connector block 183 are adjacent to each other. In at least one implementation configuration, the RF connector block 182 and the heater connector block 183 extend through an opening in the upper panel 160 when assembled.

[0114] Figure 9 shows a block diagram 900 of the electronic circuitry contained within the electrical enclosure 142 in at least one implementation configuration. The arrow connectors between blocks indicate the direction of the signals. In at least one implementation configuration, the circuitry within the electrical enclosure 142 can be distributed across the "RF&ESC" board 902, the "LF filter" board 904, and the "HF filter" board 906. In at least one implementation configuration, the "RF&ESC" board 902 can correspond to PCB 738 shown in Figures 7C and 8A. In at least one implementation configuration, the "LF filter" board 904 can correspond to PCB 750 shown in Figure 7C. In at least one implementation configuration, the "HF filter" board 906 can correspond to PCB 740 shown in Figures 7C and 8B.

[0115] In at least one implementation, the substrate 902 can be coupled to an "RF power" input connector 908 and an "ESC power" input connector 910. In at least one implementation, the "RF power" input connector 908 can correspond to the RF connector 146 shown in Figure 7C. In at least one implementation, the "ESC power" input connector 910 can correspond to the ESC connector 758 also shown in Figure 7C. In at least one implementation, the raw RF power can be adjusted, for example, by tuning the phase angle between the RF voltage and current on the substrate 902 (e.g., by tuning the tunable element 742). In at least one implementation, the DC power for the electrostatic chuck of the semiconductor wafer on the platen 104 can be combined with the RF power on the substrate 902 (e.g., by a bias tee circuit). In at least one implementation, the adjusted RF power can be output to an "RF connector" block 912 and then to an RF conductor 914 (e.g., RF conductor 170).

[0116] In at least one implementation, the "LF filter" board 904 can be coupled to the "heater power" input connector 916. In at least one implementation, the "heater power" input connector 916 can correspond to the heater connector 152. LF frequencies appearing on the heater power conductor (e.g., frequencies below 1 MHz) can be suppressed by a low-pass filter circuit on board 904 designed for very low frequencies (e.g., 60 Hz) or DC output. In at least one implementation, the heater conductor is passed directly from board 904 to the "HF filter" board 906. In at least one implementation, board 906 can suppress any RF that may be coupled to the heater conductor by providing a choke or low-pass filter. The regulated heater power can be output to the "heater connector" block 918 and the heater conductor 920.

[0117] Figure 10A shows a 3D perspective view of a partially assembled RF connector 146 in at least one implementation configuration. In at least one implementation configuration, the RF connector comprises a mountable bracket 1002 and a coaxial connector 1004 positioned within the mountable bracket 1002. In at least one implementation configuration, the coaxial connector 1004 terminates a coaxial cable 1006. In at least one implementation configuration, the RF connector 146 includes a retainer plate 1008 for holding the coaxial connector 1004 within the mountable bracket 1002.

[0118] Figure 10B shows a 3D perspective view of a fully assembled RF connector 146 in at least one implementation configuration. In at least one implementation configuration, a power module 1010 can be attached to the coaxial connector 1004 and placed within the mountable bracket 1002. In at least one implementation configuration, the power module 1010 can be fastened to the mountable bracket 1002. In at least one implementation configuration, the power module 1010 includes an output connector plug 1012 that can be connected to a receptacle socket on the electrical enclosure 142.

[0119] In at least one implementation, the RF connector 146 includes a locking plate 1014. In at least one implementation, the locking plate 1014 can be pivotably attached to the mountable bracket 1002 by fasteners 1016. In at least one implementation, a locking tab 1018 can be attached to the locking plate 1014. In at least one implementation, the locking tab 1018 may be operable to be attached to the electrical enclosure 142 by fasteners 1020. In at least one implementation, the locking tab 1018 may be a strip or bar structure that locks the locking plate 1014 in place.

[0120] Figure 10C shows a 3D perspective view of an RF connector 146 in an implementation configuration 1000, in at least one implementation configuration. The RF connector 146 is shown in its intended implementation configuration. In at least one implementation configuration, the locking plate 1014 can be pivoted to a locked position. In at least one implementation configuration, the locking tab can be fastened to cover the coaxial connector 1004 and the power module 1010 when assembled, preventing contact with or unintentional loosening of the coaxial connector 1004. In at least one implementation configuration, the locking tab 1018 can be fastened to the side panel 710 of the electrical enclosure 142 by fasteners 1020, securing the mountable bracket 1002, and preventing twisting of the coaxial connector 1004. In at least one implementation configuration, the mountable bracket 1002 can be further retained by fastening the locking plate 1014 to a tab 1022 extending from the side panel 708.

[0121] The following embodiments illustrating various implementation configurations are provided. Here, the embodiments can be combined with other embodiments. Therefore, the various implementation configurations can be combined with other implementation configurations without changing the scope of the disclosure.

[0122] Embodiment 1 is a pedestal assembly comprising a pedestal having a platen and a stem attached to the platen, an adapter tube attached to the stem, a cooling collar coupled to the adapter tube, a transition conduit coupled to the cooling collar, and an electrical enclosure coupled to the transition conduit, wherein the electrical enclosure comprises a radio frequency (RF) connector block and a heater connector block, the RF conductor extending from the RF connector block to the platen, and the heater conductor extending from the heater connector block to the platen.

[0123] Example 2 is a pedestal assembly according to any embodiment of the specification, in particular Example 1, wherein the electrical enclosure comprises a first printed circuit board (PCB) having at least one RF circuit and at least one DC circuit.

[0124] Example 3 is a pedestal assembly according to any embodiment of this specification, in particular Example 2, wherein at least one RF circuit comprises a tunable element, and a motor is mechanically coupled to the tunable element.

[0125] Example 4 is a pedestal assembly according to any embodiment of this specification, in particular Example 3, wherein the tunable element is a variable capacitor.

[0126] Example 5 is a pedestal assembly according to any embodiment of this specification, in particular Example 3, wherein the tunable element is a variable inductor.

[0127] Example 6 is a pedestal assembly according to any embodiment of this specification, in particular Example 2, wherein the RF connector block is coupled to a first PCB.

[0128] Example 7 is a pedestal assembly according to any embodiment of this specification, in particular Example 1, wherein the electrical enclosure comprises a second PCB, and the second PCB comprises a filter circuit.

[0129] Example 8 is a pedestal assembly according to any embodiment of this specification, in particular Example 7, wherein the heater connector block is coupled to a second PCB.

[0130] Example 9 incorporates all the features of Example 1, wherein the RF connector block extends through the upper panel of the electrical enclosure.

[0131] Example 10 is a pedestal assembly according to any embodiment of this specification, in particular Example 9, wherein the heater connector block is a pedestal assembly that extends through the upper panel of the electrical enclosure.

[0132] Example 11 is a pedestal assembly according to any embodiment of this specification, in particular Example 1, wherein the electrical enclosure comprises an RF connector.

[0133] Example 12 is a pedestal assembly according to any embodiment of this specification, in particular Example 11, wherein the RF connector is mounted to an RF socket on the side panel of an electrical enclosure.

[0134] Example 13 is a pedestal assembly in any embodiment of this specification, particularly in the pedestal assembly according to Example 11, wherein the RF connector comprises a mountable bracket, a retaining bracket attached to the mountable bracket and operable to hold a cable connector within the mountable bracket, a locking plate pivotably attached to the mountable bracket, and a locking tab attached to the locking plate.

[0135] Example 14 is a pedestal assembly according to any embodiment of this specification, in particular Example 1, wherein the transition conduit comprises an orientation ring, and the orientation ring comprises a keying strip.

[0136] Example 15 is a pedestal assembly according to any embodiment of this specification, in particular Example 14, wherein the transition conduit has a slot in its side wall and the keying strip is positioned within the slot.

[0137] Example 16 is a pedestal assembly according to any embodiment of this specification, in particular Example 14, wherein an RF conductor guide is attached to an orientation ring.

[0138] Example 17 is a pedestal assembly according to any embodiment of this specification, in particular Example 1, wherein a mounting flange is coupled to a transition conduit, and the transition conduit is coupled to an electrical enclosure.

[0139] Example 18 is a pedestal assembly according to any embodiment of this specification, in particular Example 1, wherein the cooling collar comprises a flange and a neck, the neck extending from the inner wall of the flange.

[0140] Example 19 is a pedestal assembly according to any embodiment of this specification, in particular Example 18, wherein the neck is inserted into an adapter tube and an O-ring is positioned at the joint between the adapter tube and the neck.

[0141] Example 20 is a pedestal assembly according to any embodiment of this specification, in particular Example 1, wherein the cooling collar comprises a first part and a second part, the first part comprising a first internal conduit and the second part comprising a second internal conduit.

[0142] Example 21 is a pedestal assembly according to any embodiment of this specification, in particular Example 1, wherein the cooling collar comprises a first portion and a second portion, the first portion having a first groove on its first surface and the second portion having a second groove on its second surface.

[0143] Example 22 is a pedestal assembly according to any embodiment of this specification, in particular Example 21, wherein a first pipe is located in a first groove and a second pipe is located in a second groove.

[0144] Example 23 is a semiconductor tool comprising a vacuum chamber and a pedestal assembly, the pedestal assembly comprising a pedestal comprising a platen and a stem attached to the platen, an adapter tube attached to the stem, a cooling collar coupled to the adapter tube, a transition conduit coupled to the cooling collar, and an electrical enclosure coupled to the transition conduit, the electrical enclosure comprising a radio frequency (RF) connector block and a heater connector block, the RF conductor extending from the RF connector block to the platen, and the heater conductor extending from the heater connector block to the platen, the semiconductor process tool further comprising a frame attached to the vacuum chamber, the frame being coupled to the pedestal assembly.

[0145] Example 24 is a semiconductor tool according to any embodiment of this specification, in particular Example 23, wherein the frame comprises an upper anchor and a lower anchor, the upper anchor being attached to the bottom wall of a vacuum chamber and the lower anchor being attached to the electrical enclosure of a pedestal assembly.

[0146] Example 25 is a semiconductor tool according to any embodiment of this specification, in particular Example 24, wherein the pedestal assembly extends through the bottom wall of a vacuum chamber.

[0147] Example 26 is a semiconductor tool according to any embodiment of this specification, in particular Example 25, wherein a vacuum bellows is attached to the bottom wall of a vacuum chamber, and the vacuum bellows is coupled to a retainer ring above the cooling collar of a pedestal assembly.

[0148] In addition to those described herein, various modifications can be made to the disclosed implementations and their implementations without departing from their scope. Therefore, the examples of implementations described herein should be construed as illustrative examples and not as limiting the scope of this disclosure. [Explanation of Symbols]

[0149] 100 Pedestal assembly, 102 Pedestal, 104 Platen, 106 Stem, 108 Clamp, 110 Upper clamp, 112 Lower clamp, 114 Flange, 116 Adapter tube, 118 Vacuum chamber, 120 Floor, 122 Vacuum bellows, 124 Floor exterior, 126 Frame, 128 Flange, 130 Cooling collar, 132 Neck, 134 O-ring, 136 Edge of adapter tube, 138 Transition conduit, 140 Electrical subassembly, 142 Electrical enclosure, 144 Mounting flange, 146 RF connector, 148 Side panel, 150 Tuning motor, 152 Heater connector, 154 Cooling fan, 156 Cooling fan, 158 Lower panel, 160 Upper panel, 162 Lower anchor, 164 Thermocouple connector, 166 Inert gas inlet, 168 duct, 170 RF conductor, 172 electrode, 174 solid rod section, 176 hollow tubular section, 178 clamp, 180 spacer, 182 RF connector block, 183 heater connector block, 184 RF conductor base, 186 receptacle, 188 shield tube, 190 retainer flange, 192 lateral extension, 194 long bolt, 196 upper anchor, 200 cooling collar, 200A half section, 200B half section, 202A internal conduit, 202B internal conduit, 204A port, 204B port, 206A port, 206B port, 208 inner wall, 210 hole, 212 fitting, 214 fitting, 216 compression nut, 218 compression nut, 300 cooling collar, 300A Half section, 300B Half section, 302 Groove, 304 Groove, 306 Top surface of flange, 308 Inner wall, 310 Hole, 312 Segment, 314 Segment, 402 Flat section, 404 Outer side wall, 406 Slot, 408 Gas feedthrough connector, 410 Inner wall, 500 Orientation ring, 502 Inner wall, 504 Extension, 506 RF conductor guide, 508 Hole, 510 Keying strip, 512 Notch, 514 Thermocouple connector, 602 Top surface of mounting flange, 604 Bolt hole, 606 Notch, 608 Bottom surface of mounting flange, 610 Opening, 612 Side wall, 702 Side panel of electrical enclosure, 704 Side panel of electrical enclosure, 706Side panel of electrical enclosure, 708 Side panel of electrical enclosure, 710 Side panel of electrical enclosure, 712 Side panel of electrical enclosure, 714 Side panel of electrical enclosure, 716 Vent, 718 Vent, 720 Vent, 722 Perforation, 724 Nozzle, 726 Nozzle, 728 Nozzle, 730 Raised wall, 732 Cooling fan, 734 Cooling fan, 735 Socket, 736 Partition, 752 Partition, 738 Printed circuit board, 740 Printed circuit board, 750 Printed circuit board, 742 Adjustable element / tuning element, 744 Conductor, 756 Conductor, 746 Inductor, 748 Inductor, 754 Filter choke, 758 ESC connector, 800 Filter board subassembly, 802 Rear side, 804 Trailing edge, 806 Leading edge, 808 Tab, 810 Solder lead, 900 Block diagram of electronic circuit, 902 RF & ESC board, 904 LF filter board, 906 HF filter board, 908 RF power input connector, 910 ESC power input connector, 912 RF connector block, 914 RF conductor, 916 Heater power input connector, 918 Heater connector block, 920 Heater conductor, 1000 Mounting configuration of RF connector 146, 1002 Mountable bracket, 1004 Coaxial connector, 1006 Coaxial cable, 1008 Retainer plate, 1010 Power module, 1012 Output connector plug, 1014 Locking plate, 1016 Fastener, 1018 Locking tab, 1020 Fastener, 1022 Tab, D1 Cooling collar diameter, D2 Neck diameter, D3 Transition conduit inner diameter, D4 Orientation ring outer diameter, D5 Mounting flange outer diameter, h Transition conduit length, h2 Notch extension distance, h3 Overall flange thickness

Claims

1. A pedestal comprising a platen and a stem attached to the platen, The adapter tube attached to the aforementioned stem, A cooling collar coupled to the adapter tube, A transition conduit coupled to the cooling collar, The electrical enclosure connected to the aforementioned transition conduit and A pedestal assembly comprising an electrical enclosure comprising a radio frequency (RF) connector block and a heater connector block, wherein the RF connector block is coupled to the platen and the heater connector block is coupled to the platen. Pedestal assembly.

2. The pedestal assembly according to claim 1, wherein the electrical enclosure comprises a first printed circuit board (PCB) having at least one RF circuit and at least one DC circuit.

3. The pedestal assembly according to claim 2, wherein the at least one RF circuit comprises a tunable element, and a motor is mechanically coupled to the tunable element.

4. The pedestal assembly according to claim 3, wherein the adjustable element is a variable capacitor.

5. The pedestal assembly according to claim 3, wherein the adjustable element is a variable inductor.

6. The pedestal assembly according to claim 2, wherein the RF connector block is coupled to the first PCB.

7. The pedestal assembly according to claim 1, wherein the electrical enclosure comprises a second PCB, and the second PCB comprises a filter circuit.

8. The pedestal assembly according to claim 7, wherein the heater connector block is coupled to the second PCB.

9. The pedestal assembly according to claim 1, wherein the RF connector block extends through the upper panel of the electrical enclosure.

10. The pedestal assembly according to claim 9, wherein the heater connector block extends through the upper panel of the electrical enclosure.

11. The pedestal assembly according to claim 1, wherein the electrical enclosure comprises an RF connector.

12. The pedestal assembly according to claim 11, wherein the RF connector is mounted to an RF socket on the side panel of the electrical enclosure.

13. The RF connector is Mountable bracket and A retaining bracket attached to the mountable bracket, the retaining bracket being operable to hold a cable connector within the mountable bracket, A locking plate pivotably attached to the aforementioned mountable bracket, The lock tab attached to the aforementioned lock plate and The pedestal assembly according to claim 11, comprising:

14. The pedestal assembly according to claim 1, wherein the transition conduit comprises an orientation ring, and the orientation ring comprises a keying strip.

15. The pedestal assembly according to claim 14, wherein the transition conduit has a slot in its side wall, and the keying strip is positioned within the slot.

16. The pedestal assembly according to claim 14, wherein the RF conductor guide is attached to the orientation ring.

17. The pedestal assembly according to claim 1, wherein a mounting flange is connected to the transition conduit, and the transition conduit is connected to the electrical enclosure.

18. The pedestal assembly according to claim 1, wherein the cooling collar comprises a flange and a neck, the neck extending from the inner wall of the flange.

19. The pedestal assembly according to claim 18, wherein the neck is inserted into the adapter tube and an O-ring is positioned at the joint between the adapter tube and the neck.

20. The pedestal assembly according to claim 1, wherein the cooling collar comprises a first portion and a second portion, the first portion comprising a first internal conduit and the second portion comprising a second internal conduit.

21. The pedestal assembly according to claim 1, wherein the cooling collar comprises a first portion and a second portion, the first portion having a first groove on its first surface, and the second portion having a second groove on its second surface.

22. The pedestal assembly according to claim 21, wherein a first pipe is disposed in a first groove and a second pipe is disposed in the second groove.

23. Vacuum chamber and Pedestal assembly and A semiconductor process tool comprising, the pedestal assembly, A pedestal comprising a platen and a stem attached to the platen, The adapter tube attached to the aforementioned stem, A cooling collar coupled to the adapter tube, A transition conduit coupled to the cooling collar, The electrical enclosure connected to the aforementioned transition conduit and The electrical enclosure comprises a radio frequency (RF) connector block and a heater connector block, the RF connector block being coupled to the platen, the heater connector block being coupled to the platen, and the semiconductor process tool further comprises a frame attached to the vacuum chamber, the frame being coupled to the pedestal assembly. Semiconductor process tools.

24. The semiconductor process tool according to claim 23, wherein the frame comprises an upper anchor and a lower anchor, the upper anchor being attached to the bottom wall of the vacuum chamber and the lower anchor being attached to the electrical enclosure of the pedestal assembly.

25. The semiconductor process tool according to claim 24, wherein the pedestal assembly extends through the bottom wall of the vacuum chamber, a vacuum bellows is attached to the bottom wall of the vacuum chamber, and the vacuum bellows is coupled to a retainer ring above the cooling collar of the pedestal assembly.

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