Conductive device for plating and plating device

Abstract

The present application relates to a conductive device for plating (100) and a plating device (300). The conductive device for plating (100) includes a frame (110) and two conductive mechanisms (120). A plating tank is provided in the frame (110). The conductive mechanism (120) includes a conductive roller (121), a titanium basket (122), and a rectifier (123). The positive electrode of the rectifier (123) is electrically connected to the titanium basket (122), and the negative electrode of the rectifier (123) is electrically connected to the conductive roller (121). At least a portion of the titanium basket (122) is immersed in a plating solution. The conductive roller (121) has a cylindrical body at both ends thereof, and the conductive roller (121) has a cylindrical cross section that is perpendicular to the cross section of the titanium basket (122). The diameter is d1, the maximum diameter of the middle part of the conductive roller (121) is d2, and d2 is smaller than d1, the conductive roller (121) is partially immersed in the plating solution, and the conductive roller (121) is installed such that the middle part of the conductive roller (121) does not contact either the plating solution or the middle part of the plated product (200) during the plating process, and when the plated product (200) passes through the conductive mechanism (120), one side of the plated product (200) contacts one of the two conductive rollers (121), and the other side contacts the other conductive roller (121).

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to a Chinese patent application filed on February 24, 2022, bearing application number 202210177516.8 and entitled "Conductive Apparatus for Plating and Plating Apparatus", and to an international patent application filed on May 25, 2022, bearing application number PCT / CN2022 / 094873 and entitled "Conductive Apparatus for Plating and Plating Apparatus", the entire contents of which are incorporated herein by reference.

[0002] The present application relates to the technical field of electrolytic plating of thin films, and in particular to conductive devices for plating and plating apparatus. [Background technology]

[0003] Electrolytic plating is an important process in the production of copper film on a composite current collector. A rectifier is connected to a conductive roller and a titanium basket. Electric current flows from the positive electrode of the rectifier through the titanium basket, through the plating solution, the conductive mechanism and the negative electrode of the rectifier, so that the entire plating system forms a complete circuit to form a thin film on the plated product.

[0004] Conventionally, conductive rollers are generally tubular structures with the same diameter. In the plating process, the conductive roller comes into contact with the plating product and also comes into direct or indirect contact with the plating solution (copper-containing solution), resulting in the phenomenon of forming copper reverse plating or copper deposition on the conductive roller. In the long-term copper plating process, after the copper plated on the conductive roller accumulates to a certain extent, an irregularly shaped copper crystal layer is formed on its surface, and this copper crystal layer is distributed extremely unevenly on the conductive roller, forming copper slugs or copper spikes at local positions on the conductive roller. When the plating product comes into contact with the conductive roller, the copper slugs or copper spikes formed on the conductive roller will damage the copper film deposited on the surface of the plating product, seriously affecting the plating quality of the copper film on the surface of the plating product. In addition, if the copper crystal layer on the conductive roller is too thick, it will also affect the chromaticity and uniformity of the copper film on the surface of the plating product. Summary of the Invention [Problem to be solved by the invention]

[0005] According to various embodiments of the present application, a plating conductive apparatus and a plating apparatus are provided. [Means for solving the problem]

[0006] In a first aspect, the present application provides a conductive plating apparatus for plating a thin film on a surface of a plated product, comprising: a frame provided with a plating tank that contains a plating solution; two conductive mechanisms fixed to the frame and installed opposite to each other with a gap therebetween along a depth direction of the plating tank, the conductive mechanisms including a conductive roller, a titanium basket and a rectifier, a positive electrode of the rectifier being electrically connected to the titanium basket and a negative electrode of the rectifier being electrically connected to the conductive roller, and the titanium basket being at least partially immersed in the plating solution; the conductive roller has two cylindrical bodies at both ends, a diameter of a cross-sectional circle of the cylindrical body being d1, a maximum diameter of a cross section perpendicular to the axial direction of a middle part of the conductive roller being d2, and d2 being smaller than d1; the conductive roller is partially immersed in the plating solution, and the conductive roller includes two conductive mechanisms that are installed such that the middle part of the conductive roller does not contact either the plating solution or the middle part of a plated product during a plating process; When the plated product passes through the conductive mechanism, one surface of the plated product contacts one of the two conductive rollers, and the other surface of the plated product contacts the other conductive roller.

[0007] In the present application, the conductive roller is installed in an electrolytic plating process such that the middle part of the conductive roller does not come into contact with either the plating solution or the middle part of the plated product, thereby preventing the middle part of the conductive roller from directly or indirectly coming into contact with the plating solution, reducing the occurrence of copper reverse plating or copper deposition on the conductive roller, reducing the risk that the conductive roller will damage the thin film deposited on the surface of the plated product, and significantly improving the plating quality of the plated product.

[0008] In the present application, both ends of the conductive roller are cylindrical, the diameter of the cross-sectional circle of the cylinder is d1, and the maximum diameter of the cross section perpendicular to the axial direction of the middle part of the conductive roller is d2, and d2 is smaller than d1.

[0009] In one embodiment, the diameter d1 of the cross-sectional circle of the cylindrical body at both ends of the conductive roller is in the range of about 5 cm to about 20 cm.

[0010] In another embodiment, the diameter d1 of the cross-sectional circle of the cylindrical body at both ends of the conductive roller is in the range of about 10 cm to about 15 cm.

[0011] In one embodiment, the difference between d1 and d2 is in the range of about 1 cm to about 3 cm, ie, 1 cm≦d1−d2≦3 cm.

[0012] In one embodiment, the intermediate portion of the conductive roller has a spindle-shaped structure. In this application, the term "spindle-shaped structure" refers to a structure having thin ends and a thick middle portion.

[0013] In one embodiment, the conductive roller has a hollow structure.

[0014] In one embodiment, the conductive roller is made of either 304 stainless steel or 316 stainless steel.

[0015] In one embodiment, the conductive mechanism further includes an auxiliary anode, and the positive electrode of the rectifier is electrically connected to the auxiliary anode.

[0016] In one embodiment, the material of the auxiliary anode is titanium metal, and an iridium metal layer is uniformly coated on the surface of the titanium metal.

[0017] In a second aspect, the plating apparatus of the present application includes an unwinding mechanism, a winding mechanism, and a plating conductive device described in any one of the above technical means, and the unwinding mechanism and the winding mechanism are both fixed to the frame and installed at an interval in the transport path of the plated product.

[0018] In one embodiment, the plating apparatus further includes a plurality of tension elements, each of which is fixed to the frame and is uniformly distributed between the unwinding mechanism and the winding mechanism.

[0019] In one embodiment, the tension element is a tension pulley or a tension spring.

[0020] In one embodiment, the plating apparatus further includes two spray elements, both of which are fixed to the frame, and each of the spray elements has a spray orifice, one of which faces one of the two conductive rollers and the other of which faces the other of the two conductive rollers.

[0021] In one embodiment, the spray element is a spray head.

[0022] In one embodiment, the heating element is secured to the frame.

[0023] In one embodiment, the heating element is threadedly attached to the frame and is an infrared heating device. [Brief description of the drawings]

[0024] In order to more clearly describe the embodiments of the present application or the technical means in the prior art, the following briefly describes the drawings that need to be used in the description of the embodiments or the prior art. It is obvious that the drawings in the following description are only the embodiments of the present application, and those skilled in the art can obtain other drawings based on the disclosed drawings without creative labor. [Figure 1] FIG. 2 is a plan view of a plating conductor apparatus as shown in some embodiments of the present application. [Diagram 2] FIG. 2 is a front view of a plating apparatus as shown in some embodiments of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Hereinafter, the technical means in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application. It is clear that the described embodiments are only some embodiments of the present application, and are not all of them. Based on the embodiments of the present application, all other embodiments that a person skilled in the art can obtain without creative labor all belong to the protection scope of the present application.

[0026] In order to make the above objects, features and advantages of the present application clearer and easier to understand, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, many specific details are described to provide a complete understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0027] In the description of the present application, the orientations or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like are orientations or positional relationships shown in the drawings, and are used only to facilitate or simplify the description of the present application, and are not intended to represent or imply that the devices or parts shown necessarily have a specific orientation or a specific orientation structure and operation, and therefore should not be construed as limiting the present application.

[0028] Moreover, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying a relative importance or implying the number of technical features indicated. Thus, a technical feature qualified by "first" or "second" may explicitly or implicitly include at least one of the technical feature. In the description of this application, unless there is a clear and specific limitation, "plurality" means at least two, e.g., two, three, etc.

[0029] In this application, unless otherwise clearly defined and limited, the terms "attached", "coupled", "connected" and the like should be understood in a broad sense, for example, may be a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediate medium, an internal communication between two elements, or an interactive relationship between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific situation.

[0030] In this application, unless otherwise clearly specified and limited, the fact that a first technical feature is "above" or "below" a second technical feature may include direct contact between the first technical feature and the second technical feature, or indirect contact between the first technical feature and the second technical feature via an intermediate medium. In addition, the fact that a first technical feature is "above", "above" and "on the upper surface" of a second technical feature includes the fact that the first technical feature is directly above or diagonally above the second technical feature, or simply indicates that the horizontal height of the first technical feature is higher than that of the second technical feature. The fact that a first technical feature is "below", "below" and "on the lower surface" of a second technical feature includes the fact that the first technical feature is directly below or diagonally below the second technical feature, or simply indicates that the horizontal height of the first technical feature is lower than that of the second technical feature.

[0031] It should be noted that when an element is referred to as being "fixed" or "mounted" to another element, it may be directly on the other element, or there may be intervening elements present. When an element is considered to be "connected" to another element, it may be directly connected to the other element, or there may be intervening elements present as well. The terms "vertical," "horizontal," "up," "down," "left," "right," and similar terms used herein are for illustrative purposes only and do not represent the only embodiments.

[0032] As shown in FIG. 1, the present application provides a conductive apparatus 100 for plating, which includes a frame 110 and two conductive mechanisms 120, and the conductive apparatus 100 for plating is for electrolytic plating of a thin film on a surface of a plated product 200.

[0033] A plating tank (not shown) is formed in the frame 110, and the plating tank can contain a plating solution, which can be used to form a thin film on the plated product 200 and can also be used to conduct current. In order to simplify the formation process of the frame 110 and save the manufacturing cost of the frame 110, the plating tank may be integrally formed in the frame 110 by casting, pressing, etc., or the plating tank may be separately formed by other auxiliary tools after the frame 110 is formed. The plating solution may be a fluid medium capable of forming a thin film on the surface of the plated product 200, such as a copper-containing solution or an iron-containing solution, and in this embodiment, only the copper-containing solution is represented.

[0034] The two conductive mechanisms 120 are both fixed to the frame 110 by screwing or welding, and the two conductive mechanisms 120 and the frame 110 are fixedly connected to each other. The two conductive mechanisms 120 are installed facing each other at an interval along the depth direction of the plating tank, that is, there is a gap between the two conductive mechanisms 120. In this embodiment, the two conductive mechanisms 120 are installed at an interval in the vertical direction. The conductive mechanism 120 includes a conductive roller 121, a titanium basket 122, and a rectifier 123, and the conductive roller 121 and the titanium basket 122 are both fixed to the frame 110. The positive electrode of the rectifier 123 is electrically connected to the titanium basket 122, and the negative electrode of the rectifier 123 is electrically connected to the conductive roller 121. At least a portion of the titanium basket 122 is immersed in the plating solution, and in the radial direction of the conductive roller 121, one side of the conductive roller 121 is immersed in the plating solution and the other side of the conductive roller 121 is exposed to the plating solution, and since the plating solution is conductive, the rectifier 123, the titanium basket 122, the conductive roller 121, and the plating solution form a complete current circuit to provide the current required for the plating process of the plated product 200. In addition, both ends of the conductive roller 121 are cylindrical, and the diameter of the cross-sectional circle of the cylindrical body is d1, and the maximum diameter of the cross section perpendicular to the axial direction of the intermediate portion of the conductive roller 121 is d2, and d2 is smaller than d1. During the plating process, the middle part of the conductive roller 121 of the plated product 200 does not come into contact with either the plating solution or the middle part of the plated product 200, thereby preventing the middle part of the conductive roller 121 from directly or indirectly coming into contact with the plating solution, reducing the occurrence of the phenomenon of copper reverse plating or copper deposition on the conductive roller 121, reducing the risk that the conductive roller 121 will damage the thin film deposited on the surface of the plated product 200, and significantly improving the plating quality of the plated product 200.

[0035] When the plated product 200 passes through the conductive mechanism 120, one side of the plated product 200 contacts one of the two conductive rollers 121, and the other side of the plated product 200 contacts the other of the two conductive rollers 121, thereby electrolytically plating a thin film on two surfaces of the plated product 200, achieving double-sided plating of the plated product 200, and improving the electrolytic plating efficiency on the surface of the plated product 200.

[0036] In addition, when an insulator is placed on the conductive roller 121, the insulator placed in the electric field is subjected to the action of the electric field, and a "polarization" phenomenon occurs inside the insulator, causing polarization charges to be generated on both sides of the conductor, which affects the strength of the electric field and affects the plating quality at the contact position between the insulator and the thin film. However, the structure of the conductive roller 121 in the above-mentioned plating conductive device 100 can effectively avoid the above problem.

[0037] To form the conductive roller 121, in one embodiment, as shown in FIG. 1, the diameter of both ends of the conductive roller 121 is 5 cm to 20 cm, and the middle position of the conductive roller 121 is recessed by 1 cm to 3 cm compared to the end positions, in other words, both ends of the conductive roller are cylindrical, the diameter of the cross-sectional circle of the cylinder is d1, the maximum diameter of the cross section perpendicular to the axial direction of the middle part of the conductive roller is d2, and d2 is smaller than d1, the diameter d1 of the cross-sectional circle of the cylinder at both ends of the conductive roller is in the range of 5 cm to 20 cm, and the difference between d1 and d2 is in the range of 1 cm to 3 cm, that is, 1 cm≦d1-d2≦3 cm. During the electrolytic plating process, the middle part of the conductive roller 121 of the plated product 200 does not come into contact with either the plating solution or the middle part of the plated product 200, thereby preventing the middle part of the conductive roller 121 from directly or indirectly coming into contact with the plating solution, reducing the occurrence of copper reverse plating or copper deposition on the conductive roller 121, reducing the risk of the conductive roller 121 damaging the thin film deposited on the surface of the plated product 200, and significantly improving the plating quality of the plated product 200.

[0038] When installing, the diameter of the cylinder at both ends of the conductive roller 121 may be one of 5 cm, 10 cm, 15 cm, and 20 cm. Of course, the diameter of the cylinder at both ends of the conductive roller 121 is not limited to the above range value, and may be other numerical values ​​within the range of 5 cm to 20 cm. In addition, for different mounting processes or molding processes of the conductive roller 121, the diameter of the cylinder at both ends of the conductive roller 121 is not limited to the above diameter setting range, and the diameter of the cylinder at both ends of the conductive roller 121 can be set according to the mounting process or molding process of the conductive roller 121.

[0039] In addition, the middle part of the conductive roller 121 has a spindle-shaped structure, and the "spindle-shaped structure" in this application refers to a structure in which both ends are thin and the middle is thick. The titanium basket 122 connected to the positive electrode of the rectifier 123, one end of the conductive roller 121 corresponding to the cathode, and the plating solution form an electric circuit, and since the conductive ability of the middle position of the conductive roller 121 is weak, the middle part of the conductive roller 121 is designed to have a spindle-shaped structure, that is, the part connected to the cylinders at both ends of the conductive roller 121 is thin, and the middle part away from the cylinders at both ends of the conductive roller 121 is thick, thereby reducing the distance between the middle part and the titanium basket 122, effectively improving the electric field strength of the middle part of the conductive roller 121, and effectively improving the uniformity of the plating film.

[0040] 1, in order to reduce the manufacturing cost of the conductive roller 121, the middle part of the conductive roller 121 has a hollow tubular structure, which can reduce the material required in the molding process of the conductive roller 121 and can reduce the manufacturing cost of the conductive roller 121. In addition, the requirements for the load-bearing strength of the frame 110 are low, and the lightweight design of the plating conductive device 100 can be realized.

[0041] In order to facilitate the manufacture and shaping of the conductive roller 121, in one embodiment, the material of the conductive roller 121 is either 304 stainless steel or 316 stainless steel, as shown in Fig. 1. Both 304 stainless steel and 316 stainless steel have excellent formability, which is convenient for the manufacture and shaping of the conductive roller 121, and stainless steel has better corrosion resistance, toughness, etc., which can significantly improve the service life of the conductive roller 121 and prevent defects such as deformation of the conductive roller 121 during long-term use.

[0042] Of course, in other embodiments, the conductive roller 121 may be made of other materials with excellent formability and conductivity, such as 316L stainless steel, and the material of the conductive roller 121 is not limited in this application and can be selected according to process needs and budgetary costs.

[0043] To further improve the plating quality of the plated product 200, in one embodiment, as shown in FIG. 1, the conductive mechanism 120 further includes an auxiliary anode 124, and the positive electrode of the rectifier 123 is electrically connected to the auxiliary anode 124. Both ends of the conductive roller 121 are cylindrical, and the diameter of the cross-sectional circle of the cylindrical body is d1. The maximum diameter of the cross section perpendicular to the axial direction of the middle part of the conductive roller 121 is d2, and d2 is smaller than d1. Therefore, the conductive ability of the middle part of the conductive roller 121 is weak. The rectifier 123, the auxiliary anode 124, the conductive roller 121 and the plating solution form a complete current circuit. The auxiliary anode 124 improves the conductive ability of the conductive roller 121 together with the current circuit consisting of the rectifier 123, the titanium basket 122, the conductive roller 121 and the plating solution. The auxiliary anode 124 compensates for the shortcoming of the small current density of the middle part of the conductive roller 121, and greatly improves the uniformity of the thin film formed on the surface of the plated product 200, thereby improving the plating quality of the plated product 200.

[0044] By combining the above-mentioned structure of the conductive roller 121 with the auxiliary anode 124, the problem of uneven thickness of the plating film caused by the weak conductivity of the middle part of the conductive roller 121 and the problem of copper crystals in the conductive roller 121 damaging the entire film surface during plating are solved, and uniform thickness of the ultra-thin plating film is achieved.

[0045] The material of the auxiliary anode 124 is titanium metal, which is insoluble in strong acids and therefore unlikely to cause defects such as deformation and corrosion when it comes into contact with the plating solution, contributing to extending the service life of the auxiliary electrode. However, titanium metal has a weak electrical conductivity, so that an iridium metal layer is uniformly applied to its surface to improve the electrical conductivity of the auxiliary anode 124, compensate for the shortcoming of the low current density in the middle part of the conductive roller 121, greatly improve the uniformity of the thin film formed on the surface of the plated product 200, and improve the plating quality of the plated product 200.

[0046] 1 and 2, the present application further provides a plating apparatus 300, which includes an unwinding mechanism 310, a winding mechanism 320, and the plating conductive device 100 according to any one of the above technical means, and the unwinding mechanism 310 is fixed to the frame 110 by screwing, welding, or the like, and the winding mechanism 320 is also fixed to the frame 110 by screwing, welding, or the like, thereby realizing the attachment and fixation of the unwinding mechanism 310 and the winding mechanism 320. The unwinding mechanism 310 and the winding mechanism 320 are installed at intervals on the conveying path of the plated product 200, and the unwinding mechanism 310 is used to automatically convey the plated product 200 before plating, and the winding mechanism 320 is used to automatically wind up the plated product 200 after plating.

[0047] In the plating apparatus 300, both ends of the conductive roller 121 are cylindrical, the diameter of the cross-sectional circle of the cylindrical body is d1, and the maximum diameter of the cross section perpendicular to the axial direction of the middle part of the conductive roller 121 is d2, which is smaller than d1. In the electrolytic plating process of the plated product 200, the middle part of the conductive roller 121 does not contact the plating solution or the middle part of the plated product 200, so that the conductive roller 121 is prevented from directly or indirectly contacting the plating solution, the occurrence of copper reverse plating or copper deposition phenomenon in the conductive roller 121 is reduced, and the conductive roller 121 is prevented from damaging the thin film deposited on the surface of the plated product 200, and the plating quality of the plated product 200 is significantly improved.

[0048] In order to improve the plating quality of the surface of the plated product 200, in one embodiment, as shown in Figures 1 and 2, the plating apparatus 300 further includes a plurality of tension elements 330, which are all fixed to the frame 110 by screwing, riveting, etc., and the plurality of tension elements 330 are uniformly distributed between the unwinding mechanism 310 and the winding mechanism 320, in other words, the plurality of tension elements 330 are uniformly distributed on the conveying path of the plated product 200. When the plated product 200 passes through the tension element 330, the tension element 330 can pull the plated product 200, which ensures the flatness of the surface of the plated product 200, further improves the uniformity of the thin film formed on the surface of the plated product 200, and improves the plating quality of the surface of the plated product 200.

[0049] The tension element 330 is a tension pulley or a tension spring, and ensures that the tension element 330 pulls the plating product 200 when the plating product 200 passes through the tension element 330, and ensures the flatness of the surface of the plating product 200. Of course, the tension element 330 is not limited to the above-mentioned tension pulley or tension spring, and may be other elements that can pull the plating product 200, and the type of the tension element 330 is not limited in the present application.

[0050] In order to reduce the occurrence of copper reverse plating or copper deposition on the conductive roller 121, in one embodiment, as shown in FIG. 1 and FIG. 2, the plating apparatus 300 further includes two spray elements (not shown), both of which are fixed to the frame 110 by screwing, caulking, or the like. The spray elements have spray ports, one of which faces one of the two conductive rollers 121, and the other of which faces the other of the two conductive rollers 121. By cleaning the conductive roller 121 with the cleaning medium sprayed from the spray elements, the plating solution remaining on the conductive roller 121 is cleaned, and the plating solution remaining on the conductive roller 121 is prevented from being exposed to air for a long time, which would cause the phenomenon of copper reverse plating or copper deposition on the conductive roller 121.

[0051] The spray element is a spray head for cleaning the plating solution remaining on the conductive roller 121. Of course, the spray element is not limited to the spray head provided above, and may be other elements capable of cleaning the plating solution remaining on the conductive roller 121, and the type of the spray element is not limited in the present application.

[0052] In order to improve the plating efficiency of the plating apparatus 300 on the plated product 200, in one embodiment, as shown in Figures 1 and 2, the plating apparatus 300 further includes a heating element (not shown), which is fixed to the frame 110 by screwing, welding, etc., and the heating element can accelerate the formation speed of a thin film on the surface of the plated product 200 and improve the plating efficiency of the plating apparatus 300 on the plated product 200.

[0053] The heating element is an infrared heating device, and the heating element can accelerate the formation speed of a thin film on the surface of the plating product 200. Of course, the heating element is not limited to the infrared heating device provided above, and may be other elements that can accelerate the formation speed of a thin film on the surface of the plating product 200, and the type of the heating element is not limited in the present application.

[0054] The present application will now be further described with reference to specific examples.

[0055] In the examples, the plating quality of the surface of the plated product is shown by the uniformity of the sheet resistance and the morphology of the holes on the thin film surface. A four-point probe was used to measure the resistance of the thin film formed on the surface of the plated product 200, and the uniformity of the sheet resistance was JPEG0003250096000002.jpg19140, in which the plated product 200 after plating is unfolded, and the condition of the thin film formed on the surface of the unfolded plated product 200 is imaged using a CCD camera (industrial camera), and the number of holes and the size of the hole diameter are observed to show the plating quality on the surface of the plated product 200. EXAMPLES

[0056] Example 1 A thin film is plated on the surface of a polypropylene film, the thickness of the polypropylene film is 6 μm, the conductive roller 121 is a conventional conductive roller 121, and the auxiliary anode 124 is not provided.

[0057] The plating solution components are 130g / L copper sulfate, 140g / L sulfuric acid, 60mg / L hydrochloric acid, and 8ml / L brightener.

[0058] The antioxidant liquid is 5 ml / L of DP-A agent and 10 ml / L of DP-B agent, the process temperature is 20 to 30°C, and the pH is 1.8 to 3.5.

[0059] The set temperature of the infrared heating device is 80°C.

[0060] The conveying line speed of the polypropylene film is 2 m / min.

[0061] The total current on one side of the polypropylene film (hereafter referred to as side A) is 1152A, and the total current on the other side of the polypropylene film (hereafter referred to as side B) is 1164A.

[0062] The tension of the polypropylene film during transport is 80N.

[0063] The results are shown in Tables 1 and 2.

[0064] Table 1 Sheet resistance at different positions on sides A and B of a 1200 mm polypropylene film

[0065] [Table 1]

[0066] Table 2. Detection data for thin film holes on the surface of polypropylene film

[0067] [Table 2]

[0068] As can be seen from Tables 1 and 2, when the auxiliary anode 124 is not installed and the conventional conductive roller 121 is used to plate a thin film on a polypropylene film, the resistance of the thin film formed on the surface of the polypropylene film within a range of 1200 m is measured using a four-point probe. The sheet resistance uniformity of the A side of the polypropylene film is 11.6%, and the sheet resistance uniformity of the B side of the polypropylene film is 11.6%. 2 The condition of the thin film formed on the surface of the polypropylene film within the range was photographed, and the total number of holes was 1,752, and the diameter of the holes in each segment was large.

[0069] Example 2 A thin film of electrolytic plating is applied to the surface of a polypropylene film, the thickness of the polypropylene film is 6 μm, the conductive roller 121 is the conductive roller 121 of the present application (both ends of the conductive roller 121 are cylindrical, the diameter of the cross-sectional circle of the cylinder is d1, the maximum diameter of the cross section perpendicular to the axial direction of the middle part of the conductive roller 121 is d2, and d2 is smaller than d1), and an auxiliary anode 124 is not installed.

[0070] The plating solution components are 130g / L copper sulfate, 140g / L sulfuric acid, 60mg / L hydrochloric acid, and 8ml / L brightener.

[0071] The antioxidant liquid is 5 ml / L of DP-A agent and 10 ml / L of DP-B agent, the process temperature is 20 to 30°C, and the pH is 1.8 to 3.5.

[0072] The set temperature of the infrared heating device is 80°C.

[0073] The conveying line speed of the polypropylene film is 2 m / min.

[0074] The total current on the A side of the polypropylene film is 1152A and the total current on the B side of the polypropylene film is 1164A.

[0075] The tension of the polypropylene film during transport is 80N.

[0076] The results are shown in Tables 3 and 4.

[0077] Table 3 Sheet resistance at different positions on sides A and B of a 1200 mm polypropylene film

[0078] [Table 3]

[0079] Table 4. Detection data for thin film holes on polypropylene film surface

[0080] [Table 4]

[0081] As can be seen from Tables 3 and 4, when the auxiliary anode 124 is not installed, the conductive roller 121 of the present application is used to electrolytically plate a thin film on a polypropylene film. A four-point probe is used to measure the resistance of the thin film formed on the surface of the polypropylene film within a range of 1200 m. The sheet resistance uniformity of the A side of the polypropylene film is 12.2%, and the sheet resistance uniformity of the B side of the polypropylene film is 14.3%. 2 The condition of the thin film formed on the surface of the polypropylene film within the range was photographed, and the total number of holes was 492, and the diameter of the holes in each segment was small.

[0082] Example 3 A thin film of electrolytic plating is applied to the surface of a polypropylene film, the thickness of the polypropylene film is 6 μm, the conductive roller 121 is the conductive roller 121 of the present application (both ends of the conductive roller 121 are cylindrical, the diameter of the cross-sectional circle of the cylindrical body is d1, the maximum diameter of the cross section perpendicular to the axial direction of the middle part of the conductive roller 121 is d2, and d2 is smaller than d1), and an auxiliary anode 124 is installed.

[0083] The plating solution components are 130g / L copper sulfate, 140g / L sulfuric acid, 60mg / L hydrochloric acid, and 8ml / L brightener.

[0084] The antioxidant liquid is 5 ml / L of DP-A agent and 10 ml / L of DP-B agent, the process temperature is 20 to 30°C, and the pH is 1.8 to 3.5.

[0085] The set temperature of the infrared heating device is 80°C.

[0086] The conveying line speed of the polypropylene film is 2 m / min.

[0087] The total current on the A side of the polypropylene film is 1152A and the total current on the B side of the polypropylene film is 1164A.

[0088] The total current on the A side of the auxiliary anode 124 is 52A, and the total current on the B side of the auxiliary anode 124 is 64A.

[0089] The tension of the polypropylene film during transport is 80N.

[0090] The results are shown in Tables 5 and 6.

[0091] Table 5. Sheet resistance at different positions on sides A and B of a 1200 mm polypropylene film

[0092] [Table 5]

[0093] Table 6. Detection data for thin film holes on polypropylene film surface

[0094] [Table 6]

[0095] As can be seen from Tables 5 and 6, when the auxiliary anode 124 is installed and the conductive roller 121 of the present application is used to plate a thin film on a polypropylene film, the resistance of the thin film formed on the surface of the polypropylene film within a range of 1200 m is measured using a four-point probe, and the sheet resistance uniformity of the A side of the polypropylene film is 7.3%, and the sheet resistance uniformity of the B side of the polypropylene film is 7.3%. 2 The condition of the thin film formed on the polypropylene film surface within the range was imaged, and the total number of holes was 456, and the pore diameter within each segment was significantly smaller.

[0096] In summary, when the conductive roller 121 according to the present application is used (when both ends of the conductive roller 121 are cylindrical, the diameter of the cross-sectional circle of the cylindrical body is d1, and the maximum diameter of the cross section perpendicular to the axial direction of the middle part of the conductive roller 121 is d2, and d2 is smaller than d1), the number of holes in the thin film formed on the surface of the polypropylene film is obviously reduced, and the diameter of the holes in each segment is all smaller, and in the plating process of the plated product 200, the copper reverse plating or copper deposition phenomenon on the conductive roller 121 is reduced, and the risk of the conductive film damaging the thin film deposited on the surface of the plated product 200 is reduced, and the plating quality of the plated product 200 is significantly improved. In addition, when the auxiliary anode 124 is installed, the current density in the middle part of the conductive roller 121 is increased, which greatly improves the uniformity of the thin film formed on the surface of the plated product 200, and further improves the plating quality of the plated product 200.

[0097] The technical features of the above-mentioned embodiments can be combined in any combination. For the sake of brevity, all possible combinations of the technical features of the above-mentioned embodiments are not described, but these combinations should be considered to be within the scope described in this specification unless there is a contradiction.

[0098] The above examples only describe some embodiments of the present application, and although the descriptions are specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that those skilled in the art can make various modifications and improvements to the present application without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of the attached utility model registration claims. [Explanation of symbols]

[0099] 100: plating conductive device; 110: frame; 120: conductive mechanism; 121: conductive roller; 122: titanium basket; 123: rectifier; 124: auxiliary anode; 200: plating product; 300: plating device; 310: unwinding mechanism; 320: winding mechanism; 330: tension element.

Claims

1. A conductive plating device for plating a thin film on a surface of a plated product, comprising: a frame provided with a plating tank that contains a plating solution; two conductive mechanisms fixed to the frame and installed opposite to each other with a gap in between along the depth direction of the plating tank, the conductive mechanisms including a conductive roller, a titanium basket and a rectifier, a positive electrode of the rectifier being electrically connected to the titanium basket and a negative electrode of the rectifier being electrically connected to the conductive roller, the titanium basket being at least partially immersed in the plating solution, both ends of the conductive roller being cylindrical, the diameter of a cross-sectional circle of the cylindrical body being d1, the maximum diameter of a cross section perpendicular to the axial direction of the intermediate portion of the conductive roller being d2, d2 being smaller than d1, the conductive roller being partially immersed in the plating solution, and the conductive roller being installed such that the intermediate portion of the conductive roller does not come into contact with either the plating solution or the intermediate portion of a plated product during a plating process, A conductive device for plating, characterized in that when the plated product passes through the conductive mechanism, one side of the plated product contacts one of the two conductive rollers and the other side of the plated product contacts the other conductive roller.

2. The conductive roller according to claim 1, characterized in that the diameter d1 of the cross-sectional circle of the cylindrical body at both ends of the conductive roller is in the range of about 5 cm to about 20 cm, and the range of d1-d2 is about 1 cm to about 3 cm.

3. 3. The conductive device for plating according to claim 2, wherein the diameter d1 of the cross-sectional circle of the cylindrical body at both ends of the conductive roller is in the range of about 10 cm to about 15 cm.

4. 2. The electroconductive device for plating according to claim 1, wherein the intermediate portion of the electroconductive roller has a spindle-shaped structure.

5. 2. The electroconductive device for plating according to claim 1, wherein the electroconductive roller has a hollow structure.

6. 2. The electroconductive device for plating according to claim 1, wherein the material of said electroconductive roller is either 304 stainless steel or 316 stainless steel.

7. 2. The plating conducting apparatus according to claim 1, wherein the conducting mechanism further includes an auxiliary anode, and the positive electrode of the rectifier is electrically connected to the auxiliary anode.

8. 8. The conductive device for plating according to claim 7, wherein the material of the auxiliary anode is titanium metal, and an iridium metal layer is uniformly applied to the surface of the auxiliary anode.

9. A plating apparatus comprising an unwinding mechanism, a winding mechanism, and a plating conductive device as described in any one of claims 1 to 8, wherein the unwinding mechanism and the winding mechanism are both fixed to the frame and installed at an interval on a transport path for the plated product.

10. 10. The plating apparatus of claim 9, further comprising a plurality of tension elements, each of the tension elements being fixed to the frame and uniformly distributed between the unwinding mechanism and the winding mechanism.

11. 11. The plating apparatus according to claim 10, wherein the tension element is a tension pulley or a tension spring.

12. 10. The plating apparatus of claim 9, further comprising two spray elements, both of which are fixed to the frame, each of which has a spray orifice, one of which faces one of the two conductive rollers and the other of which faces the other of the two conductive rollers.

13. The plating apparatus of claim 12 , wherein the spray element is a spray head.

14. The plating apparatus of claim 9 further comprising a heating element secured to the frame.

15. 15. The plating apparatus according to claim 14, wherein the heating element is screwed to the frame and is an infrared heating device.

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