Recyclable clean wafers

Abstract

To provide a recyclable clean wafer that combines environmental protection and economical effects. [Solution] A recyclable clean wafer 3 is a single piece of one clean plate 31, one separation layer 32, and a support plate 33 that are joined together in order from top to bottom. The clean plate may be any known product with any cleaning function. The separation layer between the clean plate and the support plate has a higher adhesive force between the clean plate and the support plate than the adhesive force between the separation layer and the support plate, and the adhesive force between the separation layer and the support plate is higher than the adhesive force of the surface of the clean plate. During use, the recyclable clean wafer uses the surface of the clean plate to adsorb impurities attached to the base carrying the wafer, thereby achieving a cleaning effect. When the expiration date is reached, the entire device is collected, the separation layer is peeled off from the support plate, and a new separation layer incorporating the clean plate is attached, so that the recyclable clean wafer can be reused.

Description

[Technical field]

[0001] The present invention relates to an improvement on the structure of a wafer-based cleaning device, and relates to the technical field of achieving environmental protection effects through recycling. [Background technology]

[0002] In the manufacturing process of semiconductor wafers, the wafers need to be transported using a base, but impurities may be generated during the manufacturing process and may adhere to the base. In the process of transporting wafers by reusing the base, the subsequent wafers may be contaminated, so the equipment needs to be stopped and cleaned periodically. In the early days, manual cleaning was performed, but this has the problem of taking time and effort. To solve this problem, Nitto Denko Corporation, a Japanese company, proposes a technology entitled "Cleaning sheet, transport part with cleaning function, and cleaning method for substrate processing equipment to prevent approach of particles" (Taiwan Invention Patent No. I296423). Its structure can be seen in Figure 1, and it is mainly a layer having one (porous layer) cleaning layer (1) bonded to one rigid structure base material (2) by hot pressing at high temperature. The cleaning sheet is characterized by comprising a sheet having a porous layer and a pressure-sensitive adhesive layer formed on one side thereof, or a base material and a porous layer formed on one side thereof as a cleaning layer, or a base material, a porous layer formed on one side thereof as a cleaning layer, and a pressure-sensitive adhesive layer formed on the other side thereof, and further characterized in that the porous layer is substantially non-adhesive, or the porous layer is a porous thin film of ultra-high molecular weight polyethylene, etc. The company then proposed a patent (Taiwan Invention Patent No. I358760) for improving the properties of the cleaning sheet.

[0003] In addition to the Nitto Denko design, there are other improved designs, such as Taiwan Patents I518760, I457995, and I350818, which are related to improvements in the structure and function of cleaning sheets. The products of these known information can remove impurities on the base during use, but such cleaning sheets will have many impurities attached to them after one use stage, and re-contamination may occur if they are reused. The current method involves disposing of the entire sheet after a certain number of uses, but the substrate (2) with the cleaning layer (1) has a rigid structure, is large in volume, and is expensive, making waste disposal very difficult, uneconomical, and environmentally unfriendly. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Taiwan Invention Patent No. I296423

[0005] [Patent Document 2] Taiwan Invention Patent No. I358760 Summary of the Invention [Problem to be solved by the invention]

[0006] In order to solve the shortcomings and inconveniences of the known structures, the present invention provides an improved reusable clean wafer structure, which mainly comprises a clean plate, a separation layer, and a support plate, which are integrated from top to bottom. The clean plate can be any known product with cleaning function. The present invention lies in that a separation layer is bonded between the clean plate and the support plate. The separation layer is characterized in that the adhesion between the separation layer and the clean plate is higher than the adhesion between the separation layer and the support plate, and the adhesion between the separation layer and the support plate is higher than the adhesion between the clean plate and the surface of the clean plate. [Means for solving the problem]

[0007] In order to achieve the above object, the clean wafer of the present invention utilizes the surface of the clean plate to adsorb impurities on the base that carries the wafer, thereby achieving a cleaning effect. Then, when the expiration date is reached, the entire device is collected and the separation layer is peeled off from the support plate. Then, a new separation layer incorporating a clean plate is attached to obtain a reusable clean wafer, and the support plate can be reused, which is both environmentally friendly and economically effective. This is an issue that related parties in this field are researching and trying to improve.

[0008] The second object of the present invention is to provide a recyclable clean wafer, the standoff 2 of the present invention comprises a raised insole extending outward from the base 1, the raised insole having a second thickness 2D, and the second thickness 2D of the raised insole can be greater than the first thickness 1D of the base 1. In the above-mentioned base 1 of the present invention, the positioning unit 11 is in the form of a screw, rivet, clamp, hook, etc., and the standoff 2 is molded to the base 1 by a manner such as integral molding, welding, screwing, or riveting.

[0009] This invention was developed by taking into consideration the above problems and shortcomings, collecting related materials, conducting evaluations and studies from various angles, and using many years of experience in this field to make repeated ingenuity and improvements, leading to the invention of this new reusable clean wafer. Effect of the Invention

[0010] This invention was developed by taking into consideration the above problems and shortcomings, collecting related materials, conducting evaluations and studies from various angles, and using many years of experience in this field to make repeated ingenuity and improvements, leading to the invention of this new reusable clean wafer. [Brief description of the drawings]

[0011] [Figure 1] FIG. 11 is a cross-sectional view of a partial structure of a conventional cleaning device. [Diagram 2] FIG. 2 is a cross-sectional view of a part of the structure of a clean wafer according to the present invention; [Diagram 3]This shows the intention of peeling off the separation layer from the clean wafer of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] 2 and 3, the present invention is an environmentally friendly innovative design for a reusable clean wafer (3), the structure of which is mainly composed of a clean plate (31), a separation layer (32) and a support plate (33), which are integrated from top to bottom. The clean plate (31) can be any known product with cleaning function. The present invention lies in that a separation layer (32) is bonded between the clean plate (31) and the support plate (33). The separation layer (32) is characterized in that the adhesion between the clean plate (31) and the support plate (33) is higher than the adhesion between the clean plate (31), and the adhesion between the separation layer (32) and the support plate (33) is higher than the adhesion between the surface of the clean plate (31). In use, the clean wafer (3) of the present invention can use the surface of the clean plate (31) to adsorb impurities on the base carrying the wafer, thereby achieving a cleaning effect. When the expiration date is reached, the entire device is collected and the separation layer (32) is peeled off from the support plate (33) (see FIG. 3). Then, a new clean plate is attached to the separation layer, resulting in a reusable clean wafer (3). The support plate (33) can be reused, providing both environmental protection and economic benefits.

[0013] In order to achieve the above-mentioned objects and effects, the technical means adopted in the present invention, its structure, implementation method, etc. are described in detail below with reference to preferred embodiments of the present invention with accompanying drawings, so that the features and functions of the present invention can be clearly understood and fully understood. [Explanation of symbols]

[0014] (1) Cleaning layer (2) Base material (3) Clean wafer (31) Clean plate (32) Separation layer (33) Support plate

Claims

[Claim 1] A recyclable clean wafer comprising a clean plate, a separation layer, and a support plate, which are assembled in this order from above, wherein the adhesive strength between the separation layer and the clean plate is higher than the adhesive strength between the separation layer and the support plate, and the adhesive strength between the separation layer and the support plate is higher than the adhesive strength of the surface of the clean plate.

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