Gypsum board with anti-mold liner

Abstract

To provide a gypsum board having antifungal properties by adhering an antifungal agent to a liner paper to be stuck on the gypsum board. [Solution] Gypsum board is used as the core material 1, and liner papers 3 and 4 are attached to the top and bottom sides of the gypsum board using glue 2. This gives the liner paper anti-mold properties by adhering an anti-mold agent to the liner paper, and the glue between the liner paper and gypsum board makes it possible to use isomerized sugar, which could not be used in the past because it would cause mold to grow, as a component, making it possible to produce a gypsum board with an anti-mold liner that can be used, and making it possible to produce it inexpensively.

Description

[Technical Field]

[0001] This invention uses liner paper attached to the front and back sides of gypsum boards with anti-mold properties, and uses isomerized sugar, starch syrup, and liquid glucose as ingredients in the glue that bonds the gypsum boards and liner paper.

[0002] Known methods for imparting anti-mold properties to gypsum boards include the production of anti-mold gypsum panels (see Patent Document 1) and the production of anti-mold paper (see Patent Document 2). [Prior art documents]

[0003] [Patent Document 1] Special Publication 2016-532788 [Patent Document 2] Patent application 2013-113983 Summary of the Invention The problem that the invention aims to solve

[0004] In order to attach gypsum board to liner paper, adhesive components such as modified starch made from corn starch or tapioca starch, polyvinyl alcohol, latex, and carboxymethyl cellulose are used. Powdered products such as modified starch and carboxymethyl cellulose require a dissolving process before use. Furthermore, to impart anti-mold properties, anti-mold agents are mixed into the glue, but since a certain amount of anti-mold agent must be added to the glue, the cost of the processed raw materials increases. The present invention aims to solve the above-mentioned drawbacks. Means for solving the problem

[0005] This invention is characterized by the use of isomerized sugar, starch syrup, and liquid glucose as adhesives to attach the liner paper to the gypsum board, which could not be used in the past due to the significant risk of mold growth, by adhering a mold inhibitor to the liner paper attached to the gypsum board. Furthermore, this invention relates to a gypsum board with a mold-proof liner that does not require a process for dissolving powdered products, and can be manufactured with a cheaper process management. Effects of the invention

[0006] This device imparts anti-mold properties to liner paper, allowing it to use less expensive liquid types of isomerized sugar, starch syrup, liquid glucose, etc. as adhesive ingredients instead of conventionally used adhesive ingredients such as modified starch, polyvinyl alcohol, latex, and carboxymethyl cellulose.

[0007] It has been known that liner paper and gypsum board can be bonded using isomerized sugar, starch syrup, and liquid glucose. However, the storage stability of these products has been a major problem, as they are prone to mold growth compared to adhesives such as modified starch, polyvinyl alcohol, latex, and carboxymethyl cellulose.

[0008] The addition of anti-mold agents to the glue components, i.e., isomerized sugar, starch syrup, and liquid glucose, has also been considered, but this has not been adopted as a mainstream method due to the increased cost of the anti-mold agents.

[0009] This invention provides a gypsum board with anti-mold properties at low cost by attaching a thin layer of anti-mold agent to the liner paper, and by using isomerized sugar, starch syrup, and liquid glucose, which have been difficult to use in the past. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a cross-sectional view of a gypsum board with an anti-mold liner attached. [Figure 2] This is a chart showing the anti-mold effect. Form for implementing the invention

[0011] The fungicide components of this invention may be one of the following: parabens, benzimidazoles, phenoxyethanol, trichloromethylthiophthalimide, isothiazolinones, iodopropynyl butylcarbamate, dichlorophen, o-phenylphenol, dithiocarbamates, triazoles, sorbic acid, benzoic acid, and triclocarban, or a mixture of two or more of them. For organic acid fungicides, sodium and potassium salts may also be used.

[0012] Adhesive components for attaching the mildew inhibitor to the liner paper include acrylic, styrene, vinyl acetate, epoxy, cyanoacrylate, urethane, silicone, rubber, and hot melt adhesives. One type can be used, but two or more types can also be mixed without any problems.

[0013] The antifungal agent can be applied to the liner paper by brushing, spraying, immersion, etc. However, the present invention is not limited to these methods, and other methods can be used without departing from the spirit of the present invention.

[0014] The adhesive component for bonding the liner paper to the gypsum board can be one of isomerized sugar, starch syrup, or liquid glucose, but there is no problem in using a mixture of two or more types.

[0015] The amount of antifungal agent to be applied to the liner paper is not particularly limited, but 2 A range of 5 mg to 5 g per dose is suitable, preferably 10 mg to 2 g, more preferably 50 mg to 1 g.

[0016] The main component of gypsum board is calcium sulfate dihydrate, and additives such as perlite, vermiculite, glass fiber, cellulose fiber, etc. may be mixed in as appropriate.

[0017] (1) Material Liner paper for gypsum board, 170 g / m 2 (manufactured by Nippon Paper Industries Co., Ltd.), benzoic acid (manufactured by Ueno Pharmaceutical Co., Ltd.), vinyl acetate adhesive (Pegal K210 (trademark) manufactured by Koatsu Gas Kogyo Co., Ltd.), and isomerized sugar (fructose 42%) (Three Sugar (trademark) manufactured by Gun-ei Chemical Industry Co., Ltd.) were used.

[0018] The sample was prepared as follows. Add 10 parts by weight of Pegal K210 and 10 parts by weight of benzoic acid to water and stir to disperse. 2 The sample was prepared by applying 500 mg of benzoic acid per sheet evenly and letting it dry naturally.

[0019] Isomerized sugar (fructose 42%), solid content 75 wt %, was applied to the surface of the gypsum board, and the prepared sample 1 was attached and allowed to dry naturally to obtain specimen 1 (specimen 1).

[0020] The control was a liner paper with no antifungal agent applied, which was attached in the same manner as above (control).

[0021] (2) Antifungal test (Test Method) 0.01ml of Penicillium mold spore suspension (approximately 10^5cfu / ml) was inoculated onto the surface of specimen 1 and the control. The container was placed in a sterilized petri dish, sealed, and left at 30°C and a humidity of 90% or more for 10 days to observe the growth of mold. The results are shown in Table 1 and Figure 2.

[0022] [Table 1]

[0023] As is clear from Table 1 and Figure 2, no mold growth was observed on the liner paper to which the antifungal agent was attached.

[0024] In the gypsum board with the anti-mold liner according to this study, it becomes possible to use isomerized sugar as a material to bond the liner and the gypsum board, and an inexpensive manufacturing method can be provided. [Explanation of symbols]

[0025] 1. Gypsum board core 2. Adhesive between gypsum board and liner paper 3. Surface liner paper 4. Back liner paper 5. Adhesive between liner paper and mildew inhibitor 6. Antifungal agent

Claims

1. This anti-mold gypsum board is characterized in that the liner paper attached to the surface and bottom surfaces with glue has anti-mold properties and is used as a reinforcing material for the gypsum board.

2. 2. The mold-proof gypsum board according to claim 1, wherein the adhesive component for attaching the gypsum board to the liner paper comprises one of isomerized sugar, starch syrup, and liquid glucose.

3. A mildew-proof gypsum board in which the adhesive component for adhering the mildew-proofing agent component used in the liner paper according to claims 1 and 2 to the liner paper is an acrylic, styrene, vinyl acetate, epoxy, cyanoacrylate, urethane, silicone, rubber, or hot melt adhesive.

4. 3. A mildew-proofing gypsum board according to claim 1, wherein the mildew-proofing component comprises one of parabens, benzimidazoles, phenoxyethanol, trichloromethylthiophthalimide, isothiazolinones, iodopropynyl butylcarbamate, dichlorophen, orthophenylphenol, dithiocarbamates, triazoles, sorbic acid, benzoic acid, and triclocarban.

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