Embedding presses, grinding and polishing equipment and production lines for embedding samples and processing the embedded samples

Abstract

The present invention relates to an embedding press for automatically embedding a sample in an embedding material, comprising: a pressurizing unit having a pressurizing cylinder; a dosing device for dosing the embedding material; a sample loading table having multiple loading positions on which an operator can place one sample to be embedded; a control device; 1. A grinding and / or polishing apparatus comprising: a device housing; At least one processing station for processing the lower surface of the sample, the processing station comprising an abrasive disk having an abrasive plate for abrading the lower surface of the sample or a polishing disk for polishing the lower surface of the sample; a sample supply device having a sample removal position for supplying said sample for a grinding and / or polishing process; a sample placement position for placing the sample after the grinding and polishing process; a grinding / polishing head having a sample gripper for gripping a sample; the grinding / polishing head having the sample gripper approaches the sample removal position, and the sample gripper grips the sample; the grinding / polishing head having the sample gripper delivers the sample to at least one of the processing stations, and the lower surface of the sample is ground or polished at the processing station; the grinding / polishing head with the sample gripper delivers the sample to the sample placement location after the grinding or polishing and, if necessary, further processing steps, and places the sample thereon; a grinding and / or polishing device; and an automated production line for embedding a large number of samples and for processing the samples so embedded through sample grinding and / or polishing in a program-controlled overall system including an automated embedding press and an automated grinding and polishing device.

Description

[Technical field]

[0001] The present invention relates to an embedding press for automatically embedding samples in an embedding material, in particular for hot embedding under pressure using a plastic embedding material, a laboratory scale polishing and / or polishing device, a method in particular for flat polishing and / or polishing the underside of the embedded samples, and an automated production line for embedding a large number of samples in a program-controlled overall system comprising an automated embedding press and an automated polishing and polishing device, in particular the automated polishing and polishing device, and for processing the samples so embedded through polishing and / or polishing of the samples. [Background technology]

[0002] In metallography, in order to carry out a material investigation of a sample, a relatively small sample piece is often embedded in a cylinder of plastic material, which is then ground and optionally polished so that a material investigation, such as, for example, a hardness test measurement or a structure analysis, can be carried out on the surface of the ground and optionally polished material sample.

[0003] A simple embedding press comprises a cylinder with a pressure piston and a manual closure. Small metallographic sample pieces are loaded into the cylinder for embedding, for example with embedding granules made of thermoplastics, and are hot-pressed, typically for several hours, at temperatures up to about 200° C. under pressures of up to about 250-350 bar. Such embedding presses have a control device with which the heating temperature, the heating and cooling times as well as the pressing pressure can be set. With such an embedding press, sample embedding proceeds as follows:

[0004] 1. Open the closure and move the cylinder to the upper position. 2. Load the sample and move the cylinder downwards. 3. Shovel the embedding granules into the cylinder. 4. Close the closure and start the pressing process, 5. Wait for the end of the embedding process (a few hours, depending on the parameters set) 6. Open the obturator, 7. Move the cylinder upwards so that the sample can be removed.

[0005] The operator repeats this process manually for each individual sample. The total duration of the process for embedding a sample is typically about 15 minutes, depending on the parameters set.

[0006] A modular embedding press from ATM Qness GmbH is known under the name Opal X-Press (see www.qatm.com). The basic structure and the mode of operation of the Opal X-Press are similar to the embedding presses described above. However, here several presses, possibly with different sample diameters, can be combined and operated simultaneously. Each cylinder with a pressure piston has a lever-operated closing mechanism at the top end, by means of which the pressing cavity in the pressure cylinder can be closed and locked using a handle. This modular embedding press has the advantage that the sample throughput can be correspondingly increased. However, an operator must be present practically all the time to fill the individual embedding presses and to remove the embedded samples.

[0007] Furthermore, dual presses with a dosing system are known. The operation of the dual press is similar to the above-mentioned embedding press, but the embedding granules can be introduced via a dosing device, which is turned by hand above the pressure cylinder and the embedding granules are dosing into the cylinder. This press is embodied as dual, i.e. there are two pressure cylinders which can be used to alternately turn the dosing device by hand.

[0008] All of the described systems have the drawback that an operator must be present practically all the time. Embedding is a time-consuming operation, especially due to waiting times during the embedding pressing process, i.e., pressing typically under high pressure and high temperature, which costs valuable laboratory technicians time. Furthermore, embedding is a kind of bottleneck in the overall process of sample production, since it typically requires the most working time in the overall process of sample production. This is especially true for laboratories with a high sample throughput, i.e., when a large number of samples have to be hot pressed.

[0009] After the sample is embedded, it is typically ground and subsequently polished using a laboratory grinding machine with a rotating grinding disk. Typically, such laboratory disk grinding machines are designed as a combined grinding and polishing machine, i.e., a polishing disk may also be placed on the grinding disk to provide the polishing function alternatively. Such laboratory disk grinding machines, such as those known under the trademarks Saphir and Rubin from ATM Qness GmbH, are typically used for material testing, in particular for hardness testing or texture analysis, for grinding and possibly polishing the underside of embedded samples.

[0010] Such grinding / polishing machines are available either with a single spindle or with multiple spindles. Manual grinding / polishing machines essentially have a housing with a tub, a drive motor and abrasive disks. In simple grinding / polishing machines, the embedded samples can be pressed and polished by hand. Partially automated grinding / polishing machines additionally have an apparatus head, sometimes called a polishing head, with a rotating pressing piston and a sample holder, in which typically 4-6 embedded samples can be loaded and clamped if necessary. In the case of individual contact pressure, the samples are loaded into the sample holder and only move with the sample holder. Each of the individual samples is pressed against the abrasive disk by a respective one pneumatic cylinder or spring. In the case of central contact pressure, the entire sample holder is pressed against the abrasive disk and the samples are for this reason firmly clamped in the sample holder. In the case of automated systems, the samples are typically clamped, as these usually operate with central contact pressure.

[0011] Loading and clamping the sample is a manual operation, which unfortunately has to be aligned very precisely and flat in the corresponding device, which is associated with a corresponding expenditure of time.

[0012] A conventional partially automated grinding / polishing machine comprises a magazine for, for example, 16 grinding discs, which can be loaded onto the grinding disks by an automated changing system for the individual processing steps. Starting with relatively coarse abrasive grains, followed by finer and finally polishing discs. To produce a finished sample surface, usually 4 to 6 grinding and polishing steps are required. After each processing step, one or two cleaning steps are carried out with water, methanol or in an ultrasonic bath.

[0013] Advantageously, the device is relatively compact and inexpensive. However, a disadvantage is that only six samples are automatically generated in one sample holder at any one time, and then the sample holder is changed. Furthermore, the grinding and polishing plates are changed between the grinding and polishing steps after each step. In addition, the samples are manually clamped and aligned in the sample holder.

[0014] In another essentially similar variant, the sample is clamped in a holder and the polishing disk is replaced in the same way. However, more than one sample holder can be equipped and the machine has two cleaning stations. The disadvantage of this machine, however, is the increased size.

[0015] From ATM Qness GmbH, an automatic polishing and polishing machine with several polishing / polishing stations is known. The machine can be equipped in a modular manner with several polishing / polishing disks, a washing station and a surface polishing device for dressing the samples. Besides, there are magazines with various polishing and polishing disks. The machine comprises two polishing heads, each of which can accommodate one sample holder, and two sample holders with several samples can be processed simultaneously. The machine has a sample holder magazine in which up to 12 sample holders can be accommodated. The 12 sample holders are automatically taken up or exchanged and clamped by the machine. However, the samples have to be clamped and positioned flat in the sample holder manually. Due to the modular design, the machine can be constructed with four, six or eight stations. Advantageously, a higher sample throughput can be achieved with this automatic polishing and polishing machine, which due to its modular design can be well adapted to the requirements of the operator. However, procurement is associated with relatively high investment costs. Furthermore, the machine requires a very large amount of space.

[0016] Further machines are known in which a number of sample holders are accommodated on a feed belt and transported into a first device, where they are first dressed (flattened) by a grinding wheel, cleaned and then subjected to a first fine polishing process. The sample holders are then transported into a second device, where two polishing steps with intermediate and final cleaning are performed. Both processing stations operate simultaneously, i.e. while a first sample holder is being polished in the second device, the first device is already operating with the next sample holder.

[0017] The machine is likewise constructed in a modular way, and any number of devices can be combined. The disadvantages are the high procurement costs and the very large space required, especially when several devices are combined. Summary of the Invention [Problem to be solved by the invention]

[0018] The object of the present invention is to provide an embedding press for embedding samples in an embedding material which is easy to operate and requires little operator time requiring specific skills.

[0019] A further aspect of the subject matter of the present invention is to provide an embedding press for automatically embedding a large number of samples in an embedding material.

[0020] A further aspect of the subject matter of the present invention is to provide an embedding press for embedding samples in an embedding material, which allows an operator to prepare a large number of samples for embedding in one work step, which embedding press can then automatically, in the absence of an operator, embed the prepared samples and prepare them for further processing, such as, for example, surface grinding and polishing.

[0021] A further object of the present invention is to provide a grinding and / or polishing device, in particular for planar grinding and / or polishing the underside of a sample of an embedded sample, which provides high efficiency and high comfort for the operator.

[0022] A further aspect of the object of the present invention is to provide a grinding and / or polishing apparatus for planar grinding and / or polishing of the underside of samples, in particular of embedded samples, which is inexpensive, requires little space in the laboratory and nevertheless has a high sample throughput.

[0023] A further aspect of the subject matter of the present invention is to provide a grinding and / or polishing device for planar grinding and / or polishing the underside of a sample, in particular of an embedded sample, whereby dressing / planarization of the sample can be omitted.

[0024] A further object of the present invention is to provide a grinding and / or polishing device, in particular for planar grinding and / or polishing of the underside of a sample of an embedded sample, which combines several advantageous properties, namely low cost, high working time efficiency, high sample throughput and small space requirements.

[0025] It is a further object of the present invention to simplify the production of embedded samples that are fully prepared for hardness testing, structural analysis or other metallographic investigations.

[0026] A further aspect of the subject matter of the present invention is to provide a production system that can automatically embed samples without operator intervention between samples and then process the underside of the embedded samples, in particular grinding and possibly polishing it.

[0027] A further aspect of the object of the present invention is to provide a production system for embedding, grinding and, if necessary, polishing a large number of samples, which reconciles efficiency in terms of the required operating time of the operator, on the one hand, and low space requirements in the laboratory and low costs, on the other hand. [Means for solving the problem]

[0028] The problem of the invention is solved by the subject matter of the independent claims. Preferred embodiments are the subject matter of the dependent claims.

[0029] One aspect of the invention relates to an embedding press for embedding metallographic samples in an embedding material. The diameter of such embedded samples may be in the range of e.g. 20 mm to 60 mm in order to be able to handle well small metal pieces and the corresponding preparation steps for carrying out material investigations such as hardness tests or texture analyses.

[0030] The embedding press comprises a sample receiving position for the sample to be embedded and a pressurizing unit with a pressurizing cylinder in which the sample is pressed by means of a piston, for example by a plastic embedding material, under high pressure and possibly at high temperature, such that after completion of the embedding press process the sample is firmly embedded in the embedding material. As piston drive, for example, a piston rod driven by a spindle drive or hydraulically can be used. The pressurizing cylinder is preferably heated in order to carry out the embedding press process at high temperatures, in particular to cause melting of the plastic embedding material, which can occur for example in the range of 100°C to 300°C. To achieve faster cooling, the pressurizing cylinder may also be cooled. In metallography, this process is called hot embedding or warm embedding.

[0031] The embedding press further comprises a dosing device for metering the embedding material into the pressure cylinder. When dosing the embedding material, the sample to be embedded is in particular loosely placed on a piston in the pressure cylinder, and the embedding material flows down from above onto the sample and onto the piston as embedding granules, in particular plastic granules. The dosing device can be connected to one or more reservoirs, from which the embedding granules are conveyed into the dosing device, for example by a respective conveyor screw.

[0032] The embedding press further comprises a sample loading table with multiple loading locations, on which the operator can place each sample to be embedded, i.e. intended for embedding. The sample loading table can for example be an index table with multiple loading locations on its periphery.

[0033] Furthermore, a control device is included, which automatically controls the embedding press in a program-controlled manner, and more precisely preferably at least the sample loading table, the pressure unit and the dosing device, in such a way that a number of embedding press processes can be carried out automatically one after the other and without intermediate operator intervention, in particular after the sample loading table has been loaded with a number of samples to be embedded. For this purpose, the control device is adapted to automatically control the embedding press in a number of clock cycles, each having the following clock steps:

[0034] Clock step a): The control device controls the sample loading table so that the sample loading table moves one of the loading locations together with one of the samples to be embedded to the sample receiving position of the pressurizing unit.

[0035] Clock step b): The control device then controls the pressurizing unit such that the sample to be embedded, the loading location of which has been moved to the sample receiving position in clock step a), is automatically introduced from the sample receiving position into the pressurizing cylinder.Furthermore, the control device controls the dosing device such that the embedding material is automatically dosed into the pressurizing cylinder, above the embedding.

[0036] Clock step c): The controller then controls the pressurizing unit such that an embedding press process is carried out under pressure and possibly elevated temperature to produce an embedded sample.

[0037] Clock step d): The control device then controls the pressurizing unit such that the embedded sample produced in clock step c) is expelled from the pressurizing cylinder.

[0038] The control device then controls the embedding press in such a way that a clock cycle with clock steps a) to d) is automatically repeated until all samples placed on the loading locations are embedded. The sample loading table is then controlled by the control device to advance one loading location with each clock cycle. Optionally, a check device can be provided which checks whether the loading location that is just now in the sample receiving position is actually loaded before the sample to be embedded is introduced in a program-controlled manner into the pressure cylinder. If not, the control device can automatically control the sample loading table in such a way that clock steps b) to d) are omitted for this clock cycle and the next loading location is moved to the sample receiving position. Once all samples have been embedded, the control device can automatically switch off the embedding press, for example when the same number of clock cycles as there are loading locations have been processed.

[0039] Thus, the operator only needs to load a large number of samples, for example several tens of pieces, on the sample loading table in the embedding press by placing each sample to be embedded on a respective loading place. This can possibly also be done manually, but does not require waiting times and can therefore be completed relatively quickly in one go. The operator then starts the control program of the control device, which automatically executes the above-mentioned large number of clock cycles in order to embed the samples one after the other automatically without the operator's intervention. Each clock cycle requires a certain amount of time, for example 15 minutes, in such an embedding press process, so that the embedding of, for example, 32 samples in 32 clock cycles can take a total of, for example, 8 hours, i.e. an entire shift. However, during the automatic execution of the clock cycles, no operator intervention is required, so that the operator can, for example, load the sample loading table in the evening and start the control program, and the next morning find all the samples fully embedded. This allows for considerable savings in working time, which requires specific competencies.

[0040] According to an exemplary embodiment, the sample loading table is formed as an index table, preferably as a rotating index table, with the loading locations being arranged in an annular area around the periphery of the rotating index table, and the rotating index table is further rotated by a predetermined angle step in each clock cycle to move the next loading location to the sample receiving position.

[0041] Preferably, the pressure cylinder has a first opening at the bottom and a second opening at the top, whereby the automatic introduction of the sample and the injection of the embedding material can be performed at two axially opposite ends of the pressure cylinder, which has structural advantages. Preferably, the sample is introduced into the pressure cylinder from below, i.e. through the first opening at the bottom, and the embedding material is metered into the pressure cylinder from above, i.e. through the second opening at the top.

[0042] Preferably, the pressurizing unit comprises an upper closing slide, and the control device is adapted to control the upper closing slide so that the embedding pressing process can then be carried out, i.e. after clock cycle b) and before clock cycle c), the upper closing slide automatically closes the upper second opening of the pressurizing cylinder after the embedding material has been metered in.

[0043] According to a preferred embodiment of the invention, the loading locations have a piston formed as a pressure piston for the pressure cylinder as a resting location for the sample to be embedded. For this purpose, the loading locations can each have a recess in the upper surface of the sample loading table, in which a lower resting surface, for example an annular surface as a resting edge with a central opening, can be provided. The piston loaded in the sample loading table thus has a double function, i.e. on the one hand as a resting surface for the operator to place the sample during preloading, and on the other hand as a pressure piston for the respective embedding press process. Preferably, the pressure unit comprises a piston drive, for example with a piston rod, in the sample receiving position, the piston drive or the piston rod is coupled to the piston in the respective sample receiving position in order to lift the piston with the sample to be embedded thereon from the loading location and to push it downwards through the lower first opening into the pressure cylinder, the respective piston serving as a pressure piston in the subsequent embedding press process. In other words, each sample has its own pressure piston, on which it is placed in the preparatory loading step.

[0044] Preferably, the pressurizing unit comprises an automated sample ejector. After the embedding pressing process, the embedded sample is moved upward from the pressurizing cylinder by a piston drive or a piston rod and a piston, and the control device controls the sample ejector so that the sample ejector automatically ejects the embedded sample moved upward from the pressurizing cylinder from the pressurizing unit.

[0045] Preferably, the sample ejector pushes the embedded sample downwards from the upwardly moved piston in a radial direction relative to the axis of the pressurizing cylinder in order to eject the embedded sample, for which the piston preferably moves upwards until the embedded sample is completely moved out of the pressurizing cylinder, while the piston is still fixed radially so as to be able to overcome any adhesion that may exist between the embedding material and the piston surface.

[0046] After the sample is ejected, the control device controls the embedded press so that the piston driver or piston rod is moved downward again with the piston and the empty piston is again placed in the loading location of the sample loading table before the next loading location is moved to the sample receiving position with the next piston and next sample to start the next clock cycle.

[0047] The embedding press has an insertion opening for the sample loading table in the lower area. In the case of a rotary index table, the insertion opening is preferably configured in a U-shape by the embedding press being provided with a laterally open recess below the pressure cylinder. In the case of a linear sample loading table, the introduction opening may be formed as a through-opening through which the linear sample loading table is pushed. The sample loading table moves at least partially in the recess of the embedding press and periodically introduces the loading sites with the samples to be embedded one after the other into the laterally open recess in order to move the samples to be embedded one after the other under the pressure cylinder.

[0048] According to a preferred embodiment, the embedding press comprises at least a first and a second reservoir for holding different first and second embedding materials. Both reservoirs are connected to a dosing device, so that the dosing device can meter the embedding material from both the first and the second reservoir into the pressure cylinder, the dosing of the first and the second embedding material being controlled by a control device in order to automatically meter the first and / or the second embedding material into the pressure cylinder, preferably one after the other, in a respective predetermined amount. Thereby, a two-layer embedding can be produced without operator intervention, for example consisting of a higher quality embedding material in the lower area and a cheaper embedding material in the upper area. The embedding material can be introduced from the first and / or the second reservoir into the dosing passage, for example by means of a first and / or a second conveyor screw. The reservoirs with the embedding material are preferably each equipped with an automated filling level monitor in communication with the control device. If there is no longer any embedding material in one of the reservoirs, the associated fill level sensor reports this condition to the control device, which in response stops the machine and preferably outputs an error message (e.g., no embedding granules in reservoir) to the operator via the display and possibly additionally turns on a red signal light.

[0049] One aspect of the invention relates to a method for embedding a large number of samples in an embedding material by means of an embedding press, in which a sample loading table with a large number of loading places is loaded, possibly manually, in a preparatory step with a large number of samples to be embedded. After the sample loading table has been loaded with a large number of samples to be embedded, the samples are embedded one after the other automatically in a program-controlled manner in a clock cycle having the following clock steps:

[0050] Clock step a): One of the loading locations, with the sample to be embedded already placed thereon, is moved in a program-controlled manner to the sample receiving position of the pressurizing unit.

[0051] Clock step b): The sample of step a) is pushed from the loading location of the sample receiving position into the pressure cylinder of the pressure unit in a program-controlled manner, and the embedding material is metered into the pressure cylinder in a program-controlled manner.

[0052] Clock step c): The embedding material and the sample are pressed in a pressure cylinder in a program-controlled manner to produce an embedded sample.

[0053] Clock step d): The embedded sample is ejected from the pressurized cylinder in a program-controlled manner.

[0054] The clock cycle comprising steps a) to d) is repeated in a program-controlled manner until a number of samples have been embedded.

[0055] Preferably, the sample is introduced into the pressure cylinder from below and the embedding material is metered into the pressure cylinder from above.

[0056] Preferably, the pressure cylinder is automatically closed in a program-controlled manner at its upper end after the metering of the embedding material, in order to then carry out the embedding pressing process automatically in a program-controlled manner.

[0057] In the preparatory loading step, the samples to be embedded are placed at the loading location, preferably on their own pistons, which act as pressure pistons in the pressure cylinder in the subsequent embedding press process. In clock step b), each sample is pushed axially from below into the pressure cylinder together with its own pressure piston, for example by connecting a piston rod to the respective pressure piston under the pressure cylinder and pushing the respective pressure piston together with the respective sample upwards into the pressure cylinder.

[0058] After cycle step c), the piston with the embedded sample is moved upwards and in clock step d) the embedded sample is moved out of the pressurizing cylinder by being pushed down from the piston radially relative to the axis of the pressurizing cylinder by the sample ejector to eject the sample.

[0059] After clock step d), the empty piston is moved downwards again and placed again on top of the loading location before the next loading location is moved with the next piston and the next sample into the sample receiving position to start the next clock cycle.

[0060] Thus, preferably, the sample loading table cyclically moves the loading locations with the pistons and the sample to be embedded thereon under the pressure cylinder one after the other in a manner controlled by the control device, in order to subsequently introduce each piston with the sample axially from below into the pressure cylinder. After the embedding press process, the piston again moves axially downwards out of the pressure cylinder and is again placed on the loading location before in the next clock cycle the next loading location moves under the pressure cylinder with the next piston and the next sample to be introduced into the pressure cylinder.

[0061] Preferably, to produce a two-layer embedment, at least two different embedment materials are metered into the pressurized cylinder automatically, one after the other, in a program-controlled manner.

[0062] One aspect of the invention is an embedding press for embedding a sample in an embedding material, in particular having the characteristics described above, A pressurizing cylinder having a vertical axis; a piston on which the sample to be embedded is placed; a dosing device for dosing the embedding material into the pressurized cylinder; The present invention relates to an embedding press, in which the pressure cylinder has a first opening at the bottom and a second opening at the top, and the sample to be embedded is forced together with a piston into the pressure cylinder through the first opening at the bottom, and the embedding material is metered into the pressure cylinder through the second opening at the top.

[0063] That is, it has been found to be fundamentally advantageous to introduce the sample with its own piston into the pressure cylinder from one axial side, i.e. from below, and to meter in the embedding material from the other axial side, i.e. from above. Even though this constructional arrangement may be constructionally somewhat more complicated compared to the introduction of the sample and embedding granules from above, it can simplify the embedding pressing process together with, but also independently of, the other features mentioned above.

[0064] The invention therefore also relates to a method, particularly having the characteristics described above, for embedding a sample in an embedding material, comprising the following steps: pushing the piston, together with the sample to be embedded previously placed thereon, into the pressurizing cylinder through a first opening in the lower part of the pressurizing cylinder; metering the embedding material through a second opening in the top of the pressurized cylinder onto the piston with the sample disposed thereon; closing a second opening at the top of the pressure cylinder and pressing the sample together with the embedding material into the pressure cylinder; Ejecting the embedded sample from the pressurized cylinder.

[0065] A further aspect of the invention is an embedding press for embedding samples in an embedding material, in particular having the characteristics described above, A pressurizing unit having a pressurizing cylinder; a piston drive device for driving a piston for performing an embedding pressing process in the pressure cylinder; a sample loading table having multiple loading locations; and a number of pistons, each having a piston upper surface and formed as a pressure piston for a pressure cylinder; the pistons are each mountable in one of the loading locations in such a manner that, with the piston upper surface as a mounting surface, an operator can mount a respective sample to be embedded on the piston upper surface, The piston driver is connected to one of the pistons every clock cycle, and each sample to be embedded is inserted into the pressurized cylinder by its own piston for the embedding press process, thereby allowing the piston driver to alternately engage with the pistons to embed multiple samples in a clock cycle.

[0066] Below, embodiments of the grinding and / or polishing apparatus, automated production line, and associated methods are described in further detail.

[0067] Grinding and / or polishing equipment The present disclosure further relates to an automated laboratory scale grinding and / or polishing apparatus for planar grinding and / or polishing of the underside of a sample, particularly of an embedded sample, the grinding and / or polishing being particularly useful in preparing the embedded sample for test measurements and, for example, for hardness test measurements, particularly for embedded metallographic samples.

[0068] The grinding and / or polishing apparatus includes an apparatus housing, which may house therein, for example, a drive motor for the abrasive and / or polishing disk, controls, etc., and which may have tabs formed on its upper surface into which the abrasive and / or polishing disk may be placed. The housing may further house a machine frame on which a movable apparatus head, often referred to as a grinding / polishing head, may be horizontally movably hung.

[0069] According to one aspect of the present disclosure, within the device housing there is at least one surface treatment station for grinding the underside of the sample, which surface treatment station is in particular formed as a grinding station or polishing station, i.e. comprising a rotating and / or vibrating grinding disk with a grinding plate for grinding the underside of the sample or a rotating and / or vibrating polishing disk for polishing the underside of the sample.

[0070] Furthermore, a sample supply device with a sample removal position is included for supplying and preparing the samples for the grinding and / or polishing process, whereby the preparation of the samples takes place individually and piecemeal, in particular one after the other in succession. Preferably, the embedded samples are therefore processed individually and are preferably not clamped in the sample holder in multiples. The sample supply device can be formed, for example, as a chute or conveyor belt, whereby the embedded samples can be slid down or conveyed individually, one after the other in succession, automatically to the sample removal position and removed there one after the other individually.

[0071] Furthermore, a sample placement position for placing a sample after the polishing and / or polishing process is included, where the sample can be placed after the polishing and / or polishing process in the polishing and / or polishing station is completed. The sample placement position can be formed, for example, here as part of a chute or a further conveyor belt, so that the samples automatically leave the sample placement position again one after the other, for example to be collected in a sample collection device. However, it is also possible for the polishing and / or polishing device to have multiple sample removal positions and / or multiple sample placement positions, in which case the polishing / polishing head approaches the sample removal positions and the sample placement positions, respectively, one after the other, in order to process all the samples one after the other.

[0072] The abrasive / polishing head includes a sample gripper for gripping and manipulating a sample, preferably a single embedded sample.

[0073] To grind and / or polish the embedded samples, the grinding / polishing head together with the sample gripper first approaches the sample removal position in a programmable manner, where the sample gripper preferably grips and holds an individual embedded sample.

[0074] The grinding / polishing head together with the sample gripper then approaches in a program-controlled manner at least one surface treatment station and delivers the embedded samples to at least one surface treatment station so that the lower surface of the sample can be grinded, in particular ground or polished, in said surface treatment station, where the sample gripper holds the individual embedded samples and rotates, possibly even continuously, in addition to the rotation and / or vibration of the grinding or polishing disk of the grinding surface treatment station.

[0075] After grinding or polishing and possibly further surface treatment steps, the grinding / polishing head approaches the sample placement position together with the sample gripper in a programmed manner to deliver the individual embedded samples to the sample placement position, and finally releases the embedded samples at the sample placement position in a programmed manner to place the embedded samples at the sample placement position.

[0076] In this way, the entire process from gripping the embedded sample to placing the embedded sample proceeds automatically in a program-controlled manner without the need for operator intervention between samples.

[0077] Preferably, the abrading and / or polishing apparatus comprises a linear slide, e.g., a motor-driven and programmable controller-controlled linear slide, e.g., hung on a machine frame, by which the abrading / polishing head is moved horizontally to move between a sample removal position, at least one surface treatment station and a loading position.

[0078] The grinding / polishing head comprises a vertical linear slide device, e.g. having a motor-driven linear slide controlled by a program controller, by means of which the sample gripper is moved vertically to receive the embedded sample at the sample removal position, to lower the embedded sample at at least one surface treatment station and press it against the grinding or polishing table, and to deposit the embedded sample at the sample placement position, which can be realized for example by a spindle drive.

[0079] Advantageously, the polishing and / or polishing device can handle the embedded samples one after the other fully automatically and polish and / or plane their undersides, so that the operator does not have to intervene during the ongoing polishing and / or polishing process of a large number of successively processed embedded samples. The operator can load the polishing and / or polishing device with the desired amount of embedded samples, the total processing time of which may take several hours, in the evening, and the next morning all embedded samples are ready to be removed individually in the sample collecting device in a finished state. This means high efficiency and a high degree of comfort for the operator in the polishing and / or polishing of embedded samples.

[0080] A further advantage is the possibility of a compact construction, especially when several different surface treatment stations, e.g. a grinding station and a polishing station, or several grinding stations with different abrasive grain sizes and / or several polishing stations with, e.g., different polishing suspensions, are integrated into the same apparatus housing and are accessed one after the other by the same grinding / polishing head. Preferably, all grinding and polishing stations are integrated into the same apparatus and are preferably operated by the same grinding / polishing head. However, the apparatus can also comprise two or more grinding / polishing heads, each with one sample gripper, which alternately access the same surface treatment station in the same apparatus.

[0081] Preferably, the sample gripper is adapted to grip the embedded metallographic sample without individual multiple sample gripping, strictly in an automatic program-controlled manner, in particular without operator intervention. The outer peripheral surface of the embedded metallographic sample is preferably cylindrical and is formed from the embedding material through pressing of the sample in the pressure cylinder of the hot embedding press, which is made of a thermoplastic or thermosetting embedding material. In particular, the sample gripper is adapted to grip the cylindrical outer peripheral surface of the hot-pressed plastic embedding material of the embedded metallographic sample and hold it by frictional engagement, for example by gripping fingers which are pressed radially against the cylindrical outer peripheral surface. Advantageously, in hot embedding, additional auxiliary means, such as cups with special projections for gripping by a robot arm, can be omitted. The outer peripheral surface of the cylindrical embedded metallographic sample is therefore preferably made of a plastic material hot-pressed in the pressure cylinder of the embedding press.

[0082] In terms of sample throughput, handling embedded samples individually seems unproductive for the time being. However, a high sample throughput can still be achieved, especially if all the grinding and polishing steps are performed fully automatically, preferably in the same device, i.e., especially if the grinding and / or polishing device operates fully automatically for a relatively long time, for example overnight, without operator intervention. Such a high efficiency can be achieved, especially in terms of the ratio of sample throughput to the effective working time of the operator. Furthermore, in some cases, especially when the embedded samples are individually and directly gripped by the sample gripper and held throughout the entire processing process, dressing or flattening of the embedded samples with a grinding wheel can be omitted, which further simplifies the process.

[0083] In particular, an advantageous synergy of low costs and low space requirements can be achieved with still high working efficiency on the one hand and high sample throughput on the other hand, which is an advantageous variable in the laboratory, for example in the preparation of embedded samples for hardness testing or tissue analysis.

[0084] The sample gripper can be formed, for example, as a finger gripper having at least three gripping fingers that are radially movable and are moved radially to grip and hold the embedded sample at the outer shell surface around the embedding plastic. Finger grippers, for example three-finger grippers, have been found to be suitable for gripping individual embedded samples.

[0085] Preferably, the gripping fingers each include a horizontal shelf, so that the shelf of the gripping fingers acts as a vertical stop against the upper surface of the sample during lowering of the sample gripper, in order to grip the embedded sample as horizontally as possible.

[0086] Thereby, the embedded sample can advantageously be gripped precisely, which may contribute to the fact that in some cases dressing can be omitted. Furthermore, the shelf of the sample gripper also forms a counter support for the contact pressure during grinding and / or polishing, so that the radial gripping forces can be kept within acceptable limits and nevertheless undesired slipping off of the embedded sample during grinding and / or polishing can be avoided.

[0087] Preferably, the sample gripper rotates continuously during the polishing and / or polishing process. For this purpose, the polishing / polishing head comprises a drive shaft which is driven in rotation by a motor, and the sample gripper is fixed to the lower end of the drive shaft. Thus, the sample gripper rotates at a predetermined number of revolutions during polishing and / or polishing, in particular simultaneously with the rotation or vibration of the polishing and / or polishing disks, together with the gripped embedded sample. The rotation of the sample gripper is preferably also started in a program-controlled manner, in particular in a program-controlled manner for the polishing and / or polishing process, after the embedded sample is gripped at the sample removal position, and is preferably terminated again in a program-controlled manner before the embedded sample is placed at the sample placement position.

[0088] The axis of symmetry of the embedded sample preferably extends coaxially with respect to the axis of rotation of the sample gripper when the embedded sample is gripped by the sample gripper, so that the embedded sample rotates about its axis of symmetry.

[0089] Thereby, a relatively small grinding and / or polishing disk can be used, which has an advantageous effect on the size of the grinding and / or polishing device, and in addition, in some cases, the abrasive of the grinding disk can be used efficiently.Preferably, the grinding and / or polishing disk in the surface treatment station has a diameter of 300 mm or less, preferably 250 mm or less, preferably in the range of 80 mm to 250 mm, preferably in the range of 200 mm ± 50 mm.In the case of a polishing station with a horizontally vibrating vibration disk, the polishing disk may be even smaller in some cases, for example having a diameter of at least 50 mm, preferably 50 mm to 200 mm, preferably 120 mm to 200 mm.

[0090] Preferably, the embedded samples are automatically and consecutively individually fed to the grinding and / or polishing device so that they can be gripped one after the other by the sample gripper. For this purpose, the grinding and / or polishing device is preferably equipped with an automated sample feeder, by means of which the individual embedded samples are automatically and consecutively brought into the sample removal position. When the sample gripper has gripped and removed the embedded sample currently in the sample removal position, the next embedded sample is automatically moved to the sample removal position and is ready for the sample gripper once the grinding and / or polishing process of the previous embedded sample has been completed.

[0091] This advantageously contributes to the efficiency of the overall process.

[0092] The automated feeding device can for example comprise a chute, along which the embedded samples slide down continuously under gravity in the direction of the sample removal position, or a conveyor belt, which automatically and continuously supplies the embedded samples to the sample removal position, possibly with a sample stopper defining the sample removal position, or a sample magazine, into which for example a number of embedded samples are inserted in a stack. A separator can be provided before the sample removal position to separate the embedded samples, and / or the lower part of the chute can be pivoted to a horizontal state for the removal of the samples, so that the samples can be received by the sample gripper in a horizontal direction. The separator slightly separates the samples from each other and / or prevents further samples from sliding down during the pivoting and / or gripping of the sample currently to be gripped. The lowest sample can be pushed by a sample pusher to the sample removal position.

[0093] According to a particularly preferred embodiment, the grinding and / or polishing apparatus comprises a plurality of surface treatment stations for treating the underside of the sample arranged adjacent to one another, each of the surface treatment stations comprising a rotating and / or oscillating specific grinding disk with a grinding plate for grinding the underside of the sample or a rotating and / or oscillating specific polishing disk for polishing the underside of the sample. Thus, particularly advantageously, the grinding / polishing head, together with the gripped embedded sample, approaches at least two, preferably more than two, for example 2-10, preferably 3-8, preferably 3-6, surface treatment stations depending on the surface requirements, for automatically grinding and polishing the same embedded sample one after the other and / or for grinding with different grit sizes one after the other and / or for polishing with different polishing agents one after the other. In this case, preferably the embedded sample does not need to be re-clamped but is processed for all surface treatment steps in one and the same grinding and / or polishing apparatus or remains on the same grinding / polishing head or sample holder during all surface treatment steps, advantageously without the need to replace the grinding or polishing disk (except due to wear).

[0094] This can have advantages in terms of size, workflow efficiency and / or quality of the results achieved.

[0095] Thus, preferably, the grinding and / or polishing apparatus comprises at least a first grinding station with a first grinding disk and a first polishing station with a first polishing disk. In order to first grind and then polish the same embedded sample in the same grinding and / or polishing apparatus in an automatic program-controlled manner, the grinding / polishing head, preferably together with the embedded sample gripped by the sample gripper, first approaches the first grinding station and then approaches the first polishing station, preferably with the interposition of a washing station, in particular without re-clamping the embedded sample.

[0096] Preferably, the grinding and / or polishing apparatus comprises at least two, preferably more than two, grinding stations each with a grinding disk, such as a first grinding station with a first grinding disk, a second grinding station with a second grinding disk, a third grinding station with a third grinding disk, and optionally further grinding stations each with further grinding disks and / or at least two or more polishing stations each with a polishing disk, wherein the grinding / polishing head, preferably with the gripped embedded sample, approaches at least two, three or more grinding stations and / or at least one polishing station, at least two or more polishing stations, preferably without re-clamping, with the same embedded sample in the same grinding and / or polishing apparatus in an automatically program-controlled manner, one after the other, with different grit sizes and / or then, optionally, one after the other, with different polishing agents.

[0097] According to a preferred embodiment, the polishing and / or polishing apparatus comprises at least one washing receptacle or washing tank, which the polishing / polishing head approaches in a program-controlled manner and into which the gripped embedded sample is immersed before, during and / or after the polishing and / or polishing process. Preferably, the at least one washing receptacle comprises a liquid inlet and / or a liquid outlet, such that the washing receptacle can be filled and / or emptied automatically in a program-controlled manner.

[0098] Preferably, the polishing and / or polishing apparatus comprises at least one gas nozzle, in particular in the washing vessel, for automatically and program-controlled blow-drying the gripped embedded sample before, during and / or after the polishing and / or polishing process, so that the embedded sample is first polished in the polishing station by the gripper, then immersed in a washing bath to clean the polishing debris, then blow-dried above the washing liquid level in the washing bath and then polished, strictly all in a process-controlled manner and by the same polishing / polishing head or the same sample gripper, in particular without the need to re-clamp the embedded sample.

[0099] Preferably, the grinding and / or polishing apparatus comprises one or more liquid nozzles for dispensing a cooling and / or cleaning liquid, e.g. water, during the grinding process at the grinding station. Furthermore, a polishing suspension, e.g. a diamond particle suspension, can also be dispensed into the polishing station via one of the liquid nozzles.

[0100] In addition to this, the liquid nozzles for the cooling liquid, the cleaning liquid and / or the polishing suspension are preferably arranged on the polishing / polishing head, in particular so that the polishing / polishing head and thus the embedded sample are moved together from surface treatment station to surface treatment station, so that several surface treatment stations can be operated by the same liquid nozzle. Thereby, the polishing and / or polishing apparatus only needs to be equipped with one set of liquid nozzles for each polishing / polishing head, regardless of the number of surface treatment stations. Preferably, at least two liquid nozzles are arranged on the polishing / polishing head, i.e. at least one liquid nozzle for the cooling liquid and cleaning liquid for the polishing process and at least one liquid nozzle for the polishing suspension for the polishing process, so that the liquid nozzles can automatically and programmatically dispense the cooling liquid and / or cleaning liquid into the polishing station and the polishing suspension into the polishing station, respectively. However, more than two liquid nozzles may be provided, for example for several different cooling liquids and cleaning liquids, in particular for different polishing suspensions.

[0101] According to a possible embodiment, the surface treatment stations and possibly at least one washing container are arranged along a linear arrangement in the grinding and / or polishing apparatus. The grinding / polishing head is preferably suspended linearly displaceably along this linear arrangement by a linear guide so that it can move past the surface treatment stations and possibly the washing container along a linear guide, stop at each station in an automatic program-controlled manner, and access the various surface treatment stations one after the other by lowering the embedded sample by a gripper, for example, onto a grinding plate in a grinding station for grinding, into a washing bath for cleaning, and / or onto a polishing plate in a polishing station for polishing. Such a linear arrangement can be advantageous in terms of space requirements in a laboratory.

[0102] To better utilize the space conditions in the laboratory, the surface treatment stations and possibly at least one cleaning vessel can also be arranged in a two-dimensional arrangement in a horizontal plane. For example, two polishing stations and two polishing stations can be arranged in a 2x2 arrangement, three polishing stations and two polishing stations in a 3x2 arrangement, or even more surface treatment stations. Preferably, one or more cleaning vessels are further arranged, possibly offset laterally, between the polishing and / or polishing stations. Such an arrangement may have advantages in relation to the path of access to the surface treatment stations and possibly the cleaning vessel, which may be beneficial for the process speed. In the case of a two-dimensional arrangement, the polishing / polishing heads are independently suspended displaceably in two dimensions, i.e., for example, independently in the x and y directions, so that all points in the horizontal plane can be accessed. This can be achieved, for example, by a gantry arrangement, as in the case of a container crane, so that all surface treatment stations and one or more cleaning vessels can be accessed in two dimensions, the x and y directions. For this purpose, the grinding / polishing head can for example be hung on a U-shaped bridge, on which it is suspended so as to be displaceable in the linear direction x or y, the bridge itself standing on a linear guide allowing displacement in the other linear direction y or x.

[0103] Preferably, the housing of the grinding and / or polishing apparatus comprises a safety enclosure, e.g. in the form of a protective grid, in which all moving parts, e.g. the grippers, the grinding / polishing head and / or all grinding and / or polishing stations, are accommodated in order to avoid the risk of injuries. The safety enclosure can be open to the front, the front opening being protected against intervention by a light barrier, e.g. a (laser) light grid, by the light barrier automatically triggering an emergency switch-off if an operator reaches beyond the light barrier into the inner space of the safety enclosure, e.g. to access the sample grippers, the grinding stations, the polishing stations or the cleaning vessels.

[0104] The sample holder is hung on the grinding / polishing head so as to be vertically linearly movable, in particular by means of a vertical linear guide. To move the sample holder vertically, the grinding / polishing head is preferably equipped with a vertical linear slide, on which the sample holder and / or a motor for the rotational drive of the sample holder are hung so as to be movable longitudinally in the z-direction (perpendicular to the table plane). The vertical linear slide can be equipped with, for example, a spindle drive for the vertical movement of the sample holder. In this way, vertical displaceability and simultaneous continuous rotation of the sample gripper can be made possible, so that the sample gripper can automatically, in a program-controlled manner: i) approach by the grinding / polishing head to a sample removal position, a grinding station, a polishing station, one or more washing containers and / or a sample placement position, iii) be lowered there to receive and grip the embedded sample for grinding, polishing, washing and / or placement of the embedded sample, iii) rotate, for example during grinding, polishing and / or washing, and iv) be moved upwards again before the next process step. Preferably, each embedded sample is individually and continuously gripped by the sample gripper one after the other and is guided, strictly in particular within one and the same device, in an automatically program-controlled manner through a grinding process, possibly with multiple grinding steps, through a polishing process, possibly with multiple polishing steps, and through a washing process, possibly with multiple washing steps, from the feed into the grinding and / or polishing device to a completely ground, polished and washed embedded sample. Nevertheless, the grinding and / or polishing apparatus can be constructed relatively compactly, possibly even as a table-top apparatus, and the embedded sample thus completely ground, polished and cleaned can be subjected to hardness test measurements using a hardness testing apparatus, such as Applicant's Q-series hardness testers, or a texture analysis can be performed.

[0105] Preferably, the embedded samples are present at the sample removal position as individual embedded samples separated and do not have to be manually clamped in a special sample holder, especially for multiple embedded samples.Furthermore, it is advantageous if the same grinding and / or polishing head, together with the same sample gripper, can access multiple grinding and / or polishing stations, possibly with different abrasives and / or polishing agents, especially in an automatic program-controlled manner, without the need to re-clamp the embedded samples.

[0106] For polishing and grinding the embedded sample, it is advantageous if the polishing / polishing head comprises a force sensor which measures the pressing force of the sample holder with the embedded sample against the polishing or polishing table, and a control circuit which adjusts the pressing force of the drive, preferably a spindle drive of a vertical linear slide, against the embedded sample to a predetermined value.

[0107] More preferably, the distance traveled by the sample gripper vertically (z-direction) is measured. For this, the grinding / polishing head is preferably equipped with a distance meter, by means of which the linear movement distance of the sample gripper or its vertical linear slide in the z-direction is measured. Thereby, for example, in the grinding process, a layer thickness that can be set by the operator can be removed in an automatic program-controlled manner. For this, the vertical linear slide brings the embedded sample closer to the grinding table until contact with the grinding table is detected by the force sensor and stored as the zero position for the displacement path. Subsequently, further grinding of the embedded sample is performed in an automatic program-controlled manner until the value of the grinding thickness preset by the operator in the program control device is reached. Thus, the zero point for grinding of a given layer thickness can be determined by the force sensor.

[0108] The subject of the present disclosure is also a method for automatically polishing and / or polishing, in particular the underside of an embedded sample, in an automatic program-controlled manner, in particular by means of a polishing and / or polishing device as described above, the program-controlled device automatically controlling the polishing / polishing head together with a sample gripper movable in the z-direction in contact therewith, in particular without re-clamping the sample, by at least the following steps: a) moving the grinding / polishing head close to a sample removal position, lowering a sample gripper, and gripping the individual embedded samples, particularly individual pieces, at the sample removal position by the sample gripper; b) approaching the polishing station, lowering the sample gripper together with the sample, pressing the sample with a defined pressing force onto the rotating polishing plate of the polishing station, in particular under rotation of the sample gripper and possibly under metered supply of a cooling liquid, and raising the sample gripper together with the sample; c) optionally approaching and dipping the sample gripped by the sample gripper into a washing container, lifting the sample out of the washing container, and optionally blowing the sample dry; d) optionally repeating step b) at other polishing stations having different polishing plates than step b); e) possibly repeating step c) and repeating the sequence of steps d) and / or e) a further number of times, in particular at other polishing stations having different polishing plates; f) approaching the polishing station, lowering the sample holder together with the sample, pressing the sample with a predetermined pressing force onto the polishing plate of the polishing station, optionally under rotation of the sample holder and optionally under injection of a polishing suspension, and raising the sample holder together with the sample; g) approaching a washing vessel, immersing the sample held by the sample gripper in the washing vessel (sample bath), lifting the sample out of the washing vessel, and optionally blowing the sample dry; h) optionally repeating step f) in other polishing stations, possibly with different polishing agents, for example with a different input of polishing suspension than in step f), i) possibly repeating step g) and repeating step sequence h) and / or i) a further number of times, in particular at other polishing stations having different polishing agents, e.g. different polishing suspensions, j) Approaching the grinding / polishing head to the sample placement position, placing the sample at the sample placement position by the sample gripper, in particular by sublimating the sample gripper, and releasing the sample by the sample gripper.

[0109] The subject of the present disclosure is also, in particular as described above, a grinding / polishing and / or etching device for treating the underside of an embedded sample, comprising: Device housing, a sample gripper configured to grip an individual embedded sample; At least one or more of the following stations or a combination thereof: a polishing station having an abrasive disk and a polishing plate for polishing the lower sample surface of the embedded sample; a washing station for washing the underside of the embedded sample; a polishing station with a polishing disk for polishing the underside of the embedded sample, and / or an etching station for etching the underside of the embedded sample; The embedded sample is then grasped by a sample grasper, which delivers the grasped embedded sample to one or more of the stations for processing the underside of the embedded sample at the respective station or for washing the embedded sample.

[0110] The gripping of individual embedded samples has been found to be advantageous with respect to automated workflows. Furthermore, manual clamping and possibly dressing in a sample holder can be omitted. Furthermore, the device can be constructed with relatively small dimensions and be inexpensive.

[0111] Automated Production Line The present disclosure further relates to an automated production line in which both the mounting of metallographic samples and the subsequent surface treatment of the embedded samples can be performed in an automatic, program-controlled manner, in particular without operator intervention, and which automatically processes the samples from mounting to completion with a prepared, i.e. ground and optionally polished, underside of the sample.

[0112] The production line comprises an automated embedding press, in particular as described above, for embedding and discharging a multiplicity of samples in succession, one after the other, in a program-controlled manner, and an automated surface treatment device for treating the sample undersides of a multiplicity of samples embedded by the embedding press in succession, one after the other, in a program-controlled manner. The surface treatment device further comprises a sample removal position for the embedded samples delivered from the embedding press and a sample placement position for placing the surface-treated embedded samples. The treatment of the sample undersides is performed as a polishing treatment, in particular polishing and / or polishing. The surface treatment device is therefore in particular a polishing and / or polishing device capable of polishing and / or polishing the sample undersides.

[0113] At the end of the production line, i.e. after the surface treatment device, there is a sample collection device for collecting and removing a number of embedded samples, embedded by the embedding press and polished and / or ground by the grinding and / or polishing device, and for further use by the operator.

[0114] The samples embedded and discharged by the embedding press are automatically and continuously transported one after the other by the first transport device to a sample removal position of the grinding and / or polishing device. The embedded samples polished and / or polished by the grinding and / or polishing device can be transported from the sample removal position into the sample collection device, possibly by the second transport device. The embedded samples are thus automatically supplied to the grinding and / or polishing device and / or automatically removed again from it.

[0115] The embedding press and the grinding and / or polishing device are automatically controlled by a program control device, so that the embedding press and the grinding and / or polishing device can embed, grind and / or polish multiple samples continuously, one after the other, in a program-controlled manner.

[0116] The production line advantageously allows a large number of samples to be embedded, ground, and possibly polished at once in a program-controlled manner automatically and without operator intervention, which represents a significant efficiency increase compared to conventional equipment.

[0117] Preferably, the samples are not only embedded individually, but the embedded samples are further processed individually throughout the production line, in particular without a sample holder. In particular, the first and / or second transport device transports the embedded samples individually in pieces. Furthermore, the embedded samples are polished and / or polished individually in a polishing and / or polishing device, and / or after polishing and / or polishing, they are placed individually on sample placement positions, and / or the embedded, polished and possibly polished samples are ready for removal by an operator after passing through the production line, for example in a sample collection device which comprises a magazine with multiple placement positions for each embedded, polished and possibly polished sample. The embedded samples prepared in the sample collection device can be inserted directly therefrom, in particular without further surface treatment steps on the actual material sample, into an analysis device, such as, for example, a hardness tester, a microscope, a macroscope or similar analysis device, or used for texture or other metallurgical analysis.

[0118] This advantageously avoids the operator having to clamp and remove multiple samples, e.g. six samples, into a sample holder as required in many conventional devices, which advantageously simplifies the combined embedding and surface treatment process and contributes to an increased efficiency of the process for producing embedded, ground and possibly polished samples.

[0119] For example, a chute or a motor-driven conveyor belt can be used to transport the individual, loose embedded samples from the embedding press to the grinding and / or polishing device and / or from the grinding and / or polishing device to a collection station. Since the embedded samples move further individually through the production line after the embedding press, the conveyor belt as well as the grinding and / or polishing device can be constructed relatively compact. The conveyor belt only requires a small belt width corresponding to the diameter of the individual embedded samples, which can be in the range of 15 mm to 100 mm, preferably in the range of 25 mm to 50 mm.

[0120] In particular, the entire production line, including the automated embedding press and the grinding and / or polishing device, can be constructed compactly so that it can be installed on a laboratory base cabinet. The footprint of the production line preferably has a size of at most 800 cm x 150 cm, preferably at most 600 cm x 120 cm, preferably at most 400 cm x 90 cm.

[0121] The automated embedding press may comprise a pressure unit, preferably with a pressure cylinder, a dosing device for metering in the embedding material, e.g. plastic granules, and a sample loading table with a number of loading places on which the operator can place one sample to be embedded in each case. The operator can load one sample to be embedded in each case, e.g. several tens of samples to be embedded, in a preparatory work step. After this typically only still only manual preparatory work step, the operator can start up the production line by means of a program control device, which then automatically embeds the samples one after the other, automatically transports the thus embedded samples one after the other to a polishing and / or polishing device, which automatically polishes and possibly polishes the sample undersides of the embedded samples one after the other, and transports the thus embedded, polished and / or polished samples to a sample collecting device, preferably as individual embedded samples here, strictly as already described above, without the need for a sample holder.

[0122] For embedding the samples, the pressure cylinder preferably has a first opening at the bottom and a second opening at the top. The samples to be embedded are introduced into the pressure cylinder from the respective loading locations, preferably through the first opening at the bottom, and the embedding material is metered into the pressure cylinder through the second opening at the top.

[0123] The spatial separation of the sample to be embedded and the introduction of the embedding granules into the pressure cylinder is structurally advantageous and may contribute to further efficiency improvements in the automatic, program-controlled embedding of the sample by the pressure cylinder.

[0124] After the embedding press process, the embedded sample is preferably moved upwards from a second opening at the top of the pressurizing cylinder, and the pressurizing unit includes a sample ejector that ejects the embedded sample from the pressurizing unit onto a first conveying device in a programmable manner.

[0125] The automated sample ejector contributes to the degree of automation of the production line, and the spatial separation of sample introduction into the pressurized cylinder and sample ejection of the embedded sample from the pressurized cylinder is structurally advantageous for an automated production line.

[0126] After the embedding pressing process, the pressurizing piston preferably in the pressurizing cylinder moves upwards, thereby moving the embedded sample upwards and out of the pressurizing cylinder. A sample ejector, for example formed as a motor-driven slide, then pushes the embedded sample down from the pressurizing piston onto a first conveying device transversely, i.e. substantially horizontally, to the axis of the pressurizing cylinder. The motor drive of the slide may for example comprise an electric motor, a pneumatic or a hydraulic drive.

[0127] In so doing, surface adhesion between the embedding material and the pressure cylinder can be overcome and the path of the embedded sample can be kept short, which can contribute to the compactness and structural simplicity of the production line.

[0128] The surface treatment device, which is preferably a grinding and / or polishing device for planar grinding and polishing the lower sample surface of the embedded sample, preferably comprises: a polishing station having an abrasive disk and a polishing plate for abrading the lower surface of the sample, and a polishing station having a polishing disk for polishing the lower surface of the sample.

[0129] Therefore, preferably, the surface treatment device is a combined grinding and polishing device with corresponding grinding and polishing stations. Preferably, there are multiple grinding stations and even multiple polishing stations in one and the same device, so that all the necessary grinding processes with different grit sizes and all the necessary polishing processes with different polishing suspensions can be carried out in one and the same device. Each grinding station preferably has its own grinding tab, its own grinding disc and its own grinding disk mounted on the relevant grinding disc, and each polishing station preferably has its own polishing tab and its own polishing disk with a polishing disk that may also include a polishing cloth.

[0130] The embedded samples are preferably picked up from the sample removal position by the sample gripper, by which the sample gripper grips each individual, separate embedded sample and then moves it from station to station to perform the respective surface treatment step on the lower surface of the sample. In other words, the sample gripper grips a single sample and then moves it first to one of the polishing stations to perform a first polishing process. The sample gripper can then move the same embedded sample to the next polishing station to perform a polishing process, for example with a finer grain size. The sample gripper can then move the same sample to a polishing station to perform a polishing process. Preferably, about 4-6 polishing and polishing processes are performed on each sample with different polishing and polishing agents, each polishing and polishing process being performed at a unique station. This has the advantage that changing the polishing and / or polishing disks during the polishing and polishing processes, i.e. during an ongoing process, can be avoided, except when the polishing disks have to be changed due to wear. This allows for a highly efficient grinding and polishing process.

[0131] In some cases, the grinding and / or polishing apparatus may also include a washing container, and the sample gripper moves the embedded sample to a washing station for washing the embedded sample after each grinding and polishing process.

[0132] After all desired grinding and polishing processes and possibly cleaning processes have been performed, the grinding / polishing head together with the sample gripper moves the sample to a sample placement position where the sample gripper places the sample.

[0133] As already mentioned above, the embedded samples are also processed individually, preferably in pieces, in the polishing and / or polishing apparatus, i.e. the sample gripper is adapted to grip the embedded samples individually without a sample holder and to move the individual samples thus gripped, optionally with the interposition of a cleaning station, from polishing station to polishing station, from polishing station to polishing station, through the entire polishing and / or polishing process and optionally the cleaning process.

[0134] Thereby, on the one hand, clamping of the samples in the sample holder and removal of the samples from the sample holder can be avoided. On the other hand, the handling of individual samples and the omission of multiple sample holders contribute to space savings in intermediate storage of the embedded samples between the embedding press and the grinding and polishing device, in the final storage in the sample collecting device and in the transport on the conveyor belt. However, in addition, the grinding, polishing and / or washing stations can also be embodied with smaller sizes, which additionally contributes in a synergistic manner to the compactness and cost reduction of the production line. The traditional countermeasures in the production of embedded samples, i.e. a higher degree of automation and high efficiency on the one hand, and low space requirements and low costs on the other hand, can be reconciled with each other.

[0135] Preferably, the polishing / polishing head comprises a drive shaft that is driven in rotation by a motor. The sample gripper is disposed on the drive shaft, so that the sample gripper rotates about the rotation axis. If the sample rotates during the polishing and polishing process in addition to the rotation of the polishing table or the rotation or vibration of the polishing table, high quality polishing or polishing results can be achieved. Preferably, the axis of symmetry of the sample extends coaxially with the axis of rotation of the sample gripper when the embedded sample is gripped by the sample gripper, so that the embedded sample rotates about its axis of symmetry.

[0136] It is advantageous if, within the framework of an automated production line, the same grinding and / or polishing device comprises at least two or more grinding stations, for example two, three, four, five, six, seven, eight or more grinding stations, each having its own grinding disc and its own grinding disk. In this way, different grinding disks with different grit sizes can be preloaded in different grinding stations, so that it is not necessary to change the grinding disks in order to grind the underside of the sample with a number of different grit sizes, for example two, three, four, five, six, seven, eight or more different grit sizes, in particular with all the grit sizes for grinding embedded samples. All the grinding disks required for the grinding of a production run of embedded samples, for example several tens of samples, with different grit sizes, are simultaneously mounted in different grinding stations, so that it is not necessary to change the grinding disks during the grinding process of the embedded samples, and the samples are moved from one grinding station to another without changing the grinding disks in between. In other words, one and the same grinding and / or polishing apparatus contains at least as many polishing stations as there is a unique polishing station for each grain size and all of these polishing stations belong to the same grinding and / or polishing apparatus or can be accessed by the same sample gripper.

[0137] The same applies to the polishing stations, of which at least one, preferably at least two or more, for example two, three, four or more, are present in the grinding and polishing apparatus. Each polishing station can thus be assigned to a specific polishing agent, for example a specific polishing suspension. Thereby, changing the polishing plate or completely cleaning the polishing station between samples can possibly be avoided. Here again, preferably, all polishing agents required for the polishing of embedded samples, for example a production run of several tens of samples, are simultaneously present in various polishing stations, so that there is no need to change the polishing plate and / or the polishing agent during the polishing of a large number of embedded samples, and the samples are moved from one polishing station to the next without having to change the polishing plate and / or the polishing agent in between. In other words, one and the same grinding and polishing apparatus contains at least as many polishing stations as there is a specific polishing station for each polishing plate or each polishing agent, and all of these polishing stations belong to the same grinding and polishing apparatus or can be accessed by the same sample gripper.

[0138] That is, in particular, all polishing stations with polishing disks required for an embedded sample, as well as all polishing cloths and / or polishing suspensions required for the same sample, may belong to the same polishing and polishing apparatus or be approached by the same sample gripper. Thus, each embedded sample is gripped once by a sample gripper, and then one and the same sample gripper approaches all required polishing stations (e.g., 2, 3, 4, 5, 6, 7, 8 or more) and / or all required polishing stations (e.g., 1, 2, 3, 4 or more) to perform the respective polishing and / or polishing processes with different grain sizes and possibly different polishing cloths and / or polishing suspensions, with the embedded sample remaining gripped by the sample gripper during all polishing and / or polishing processes.

[0139] The polishing and / or polishing apparatus may further include at least one washing receptacle, preferably two or more washing receptacles, which are accessed by the polishing and / or polishing head or sample gripper, and each gripped embedded sample is immersed in the washing receptacle before, during and / or after the polishing and polishing process to clean it.

[0140] One aspect of the present disclosure relates to an automated method for producing a large number of embedded samples having ground and / or polished sample undersides, in particular using the production line described above, which includes the following steps, possibly with further intervening steps: a) preparing a number of samples to be embedded in the embedding press by an operator, possibly manually, placing the samples on respective loading locations of a sample loading table in a preparation step; b) pressing the first sample to be embedded together with the embedding material in a pressure cylinder of an embedding press to produce a first embedded sample; c) ejecting the first embedded sample from the pressurized cylinder; d) transporting the first embedded sample from the embedding press to a surface treatment device; e) gripping the first embedded sample precisely and individually by a sample gripper of the surface treatment device; f) approaching with the same sample gripper at least one, preferably successively, multiple surface treatment stations, such as one or more abrasive stations and / or one or more polishing stations, of the same surface treatment device, in order to preferably successively treat the sample underside of the first embedded sample multiple times in one or more different surface treatment stations with different abrasive and / or polishing agents; g) approaching the sample gripper to a sample placement location and placing the first embedded sample at the sample placement location; h) repeating steps b)-d) and e)-g) multiple times to automatically generate multiple embedded samples having surface-treated sample undersides. All finished samples with a surface-treated sample underside are then automatically and individually fed into a sample collection device to be ready for removal by an operator, whereby steps b) to h) are carried out automatically in a program-controlled manner, specifically for all samples automatically one after the other, without any particular need for operator intervention in between, whereby the repeated cycles of steps b) to d) and e) to g) can be independent of one another or synchronously, and the embedded samples can be stored between the embedding press and the surface treatment device. In particular, if the repeated cycles of steps b) to d) and e) to g) are independent of one another and the embedding of more than one embedded sample has preceded, the embedded samples can be stored between the embedding press and the surface treatment device.

[0141] Preferably, the sample holder also approaches the washing container in a program-controlled manner after each grinding and / or polishing process and immerses the embedded sample held by the sample holder into the washing container to wash the embedded sample.

[0142] In the following, the invention will be described in detail based on embodiments and with reference to the drawings, whereby identical and similar elements are partly provided with the same reference numbers and where the features of the various embodiments can be combined with one another. [Brief description of the drawings]

[0143] [Figure 1] FIG. 2 is a three-dimensional representation of an automated embedding press. [Diagram 2] FIG. 2 is a cross-sectional view of the embedding press of FIG. [Diagram 3] 2 is a partially cut-away view of the embedding press of FIG. 1; [Figure 4] FIG. 2 is a schematic cross-sectional view of the embedding press of FIG. 1 in an initial state. [Diagram 5] FIG. 5 is a view similar to FIG. 4 when the embedding granules are being introduced. [Figure 6] 5 is a view similar to FIG. 4, but during the embedding press process. [Figure 7] FIG. 5 is a view similar to FIG. 4 upon ejection of the embedded sample. [Figure 8] FIG. 2 is a cross-sectional view of an exemplary embedded sample. [Figure 9] 1 is a three-dimensional illustration of an automated grinding and polishing apparatus. [Figure 10] FIG. 10 is a partial enlarged view of the supply chute of FIG. [Figure 11] FIG. 10 is a view similar to FIG. 9, with a feed belt. [Figure 12] FIG. 12 is a partial enlarged view of the supply belt of FIG. [Figure 13] FIG. 10 is a view similar to FIG. 9, but with a vertical feed magazine. [Figure 14]FIG. 14 is a partial enlarged view of the supply magazine of FIG. 13. [Figure 15] 10 is the grinding and polishing apparatus of FIG. 9 with a safety enclosure. [Figure 16] 16 is a partially cut-away view of a polishing station of the grinding and polishing apparatus of FIG. 15. [Figure 17] 17 is a three-dimensional view of the polishing station of FIG. 16. [Figure 18] FIG. 2 is a vertical cross-sectional view of a cleaning bath. [Figure 19] 1 is a three-dimensional view of an abrasive and polishing head without the housing. [Figure 20] 20 is a vertical cross-sectional view of the abrasive and polishing head taken along section line AA of FIG. 19. [Figure 21] 20 is a vertical cross-sectional view of the abrasive and polishing head taken along section line BB in FIG. 19. [Figure 22] 1 is a three-dimensional illustration of an automated grinding and polishing apparatus having an etching module. [Diagram 23] FIG. 23 is a three-dimensional view of the etching module of FIG. [Figure 24] FIG. 23 is a three-dimensional cutaway view of the etching module of FIG. [Diagram 25] 23 is a schematic cross-sectional view of the etching module of FIG. 22. [Figure 26] 3D illustration of a fully automated embedding line, grinding line and polishing line on a laboratory base cabinet. [Figure 27] 1 is a three-dimensional representation of a further embodiment of a fully automated embedding, grinding and polishing line; [Figure 28] 28 is the embedding line, grinding line and polishing line of FIG. 27 with safety enclosure. [Figure 29] FIG. 8 is an exemplary process sequence for embedding of samples with the embedding press of FIGS. [Diagram 30]22 is an exemplary process sequence for polishing and abrading using the polishing and abrading apparatus of FIGS. [Diagram 31] 29 is an exemplary process sequence for the production of embedded samples by the production line of FIGS. 26-28. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0144] 1. Automated Embedding Press With reference to Figures 1 to 7, an example of an automated embedding press 110 is shown. The embedding press 110 comprises a housing 112, which in this example has three reservoirs 114 for plastic granules as embedding material, with different embedding materials being held in the different reservoirs 114. By means of a metering device 115, respectively desired amounts of different embedding granules can be introduced into the pressure cylinder in a program-controlled manner without user intervention. The reservoirs 114 are for this purpose connected via a connecting tube 116 to a common hopper 118, so that selectively, respectively desired embedding granules can be introduced from the respective reservoir 114 via the hopper 118 into the pressure cylinder.

[0145] Referring to FIG. 5, embedding granules 117 are conveyed by a dosing screw 120 in a connecting tube 116 from the respective reservoir 114 into a hopper 118 having a dosing passage 119 at its outlet.

[0146] 1 and 3, the embedding press 110 has a sample loading table 122 with a number of loading locations 124, in this example 32 loading locations 124. In this example, the sample loading table 122 is formed as an index table, the loading locations 124 being arranged circumferentially in an annular area 123 at the outer edge of the sample loading table 122. Each loading location 124 comprises a cylindrical hole 127 in the sample loading table 122 and a piston 128 in the form of a metal cylinder placed in said hole. The piston 128 rests at its lower part on an edge 130 and can be pushed upwards out of the hole. The piston 128 is formed as a pressure piston for a heated pressure cylinder 132 of a pressure unit 134.

[0147] In a preparation work step, the operator loads the metallographic samples 126 to be embedded, represented in Fig. 1 as halved screws, into some or all of the loading places 124 by placing the samples 126 to be embedded on the piston upper surfaces 128b of the respective pistons 128. For this, the operator places each of the samples 126 to be embedded individually, one by one, respectively, onto the loading places 124. The pistons 128 at the loading places 124 are somewhat embedded in the sample loading table 122, which facilitates the positioning of the samples 126 to be embedded when placed onto the pressure pistons 128.

[0148] After this manual preparation work step, the operator can start the program-controlled and fully automated embedding pressing process of all the placed samples 126 to be embedded. The control device or program control device 111 controls the embedding pressing process of the samples 126 along a clock cycle. With each clock cycle, the sample loading table 122 moves in a program-controlled manner one loading location 124 respectively with the pressure piston 128 placed therein and the sample 126 to be embedded placed thereon to the sample receiving position 136 of the pressure unit 134, i.e. under the pressure cylinder 132.

[0149] 4 to 7 show diagrammatically the clock steps of a clock cycle during hot embedding of one of the samples 126 to be embedded.

[0150] In Fig. 4 the sample to be embedded 126 intended for embedding and placed on its pressure piston 128 is in a sample receiving position 136 below a pressure cylinder 132. A piston driver 138, in this example in the form of a piston rod, moves upwards, connects to the pressure piston 128 from below and forces the pressure piston 128 through an opening 132a in the lower part of the pressure cylinder 132 and into its cavity 135. The piston rod 138 can for example be part of a hydraulic cylinder or can be driven by a motor-driven spindle, not shown in detail in the figure.

[0151] 5, one or more, possibly various, embedding granules 117 are introduced into the cavity 135 by the metering device 115 through the opening 132b at the top of the pressurizing cylinder 132, onto the sample 126 and the pressurizing piston 128. Next, the introduction opening 132b of the pressurizing cylinder 132 is closed by the closing slide 140 by pressing the closing slide 140 horizontally upward of the pressurizing cylinder 132.

[0152] 6, the sample 126 between the pressure piston 128 and the closing slide 140 is then hot pressed with the embedding granules 117 by the piston rod 138 and the pressure piston 128 under the heat and high pressure of the pressure cylinder 132. In this example, two different embedding granules 117 were added, first the higher quality one, followed by the cheaper embedding granules 117 which surrounded the sample 126 on its lower side and in the upper area.

[0153] After the hot embedding pressing process is completed, the closing slide 140 is pulled aside again to open the pressurizing cylinder 132 at the top. Then, the pressurizing piston 128 is moved upward by the piston driver, and the embedded sample 142 is moved out of the pressurizing cylinder 132 through the top opening 132b.

[0154] 7, the embedded sample 142 is automatically pushed aside from the pressurizing piston 128 in a horizontal direction by the sample ejector 144, in this example being pushed out of the pressurizing unit 134 through a lateral discharge opening 147 onto a sample chute 148 on which it slides down into a collection vessel 150 (FIG. 1). In the example of the embedding press 110 shown in FIGS. 1-7, the embedded sample 142 is collected in the collection vessel 150.

[0155] The piston rod 138 then moves the pressure piston 128 downwards again in order to place it again in its loading place 124, and the piston rod 138 is again decoupled from the pressure piston 128. The piston rod 138 is for this purpose locked in the respective pressure piston 128 (not shown), so that the pressure piston 128 cannot be released from the piston rod 138 when it is withdrawn from the mould or pressure cylinder 132. The lock is embodied in such a way that it can be activated and released by the control or programmed control device 111. It is advantageous if the pressure piston 128 is decoupled from the piston rod 138 when it is placed in the sample loading table 122, and the piston rod 138 is moved further downwards, so that the sample loading table 122 can move the next sample 126 to be embedded into the pressure unit 134 or under the pressure cylinder 132.

[0156] This completes the cycle for embedding the first sample, and the next clock cycle can similarly begin by the sample loading table 122 moving the next loading location 124 to the sample receiving position 136 below the pressure cylinder 132.

[0157] In the illustrated example of the embedding press 110, the sample loading table 122 is formed as an index table and is further rotated by one position at each clock cycle by a drive 151 clocked by a program controller 111 to couple the piston rod 138 with the sample 126 to be embedded placed thereon to the next pressurizing piston 128.

[0158] The pressurizing unit 134 is generally formed approximately U-shaped in cross section (FIGS. 2, 4-6) and comprises an insertion opening 152 below the heated, possibly cooled, pressurizing cylinder 132. The loading locations 124 together with the samples 126 to be embedded and the associated pressurizing pistons 128 are introduced clockwise laterally into the insertion opening 152, which in this example is formed as a laterally open recess. In this example, this is done by rotating the index table by an angle segment corresponding to the spacing of the loading locations 124. However, it is also conceivable to use a linear sample loading table 122 in order to advance the sample loading table 122 by one clock position at each clock cycle, so that the next pressurizing piston 128 can be pushed into the pressurizing cylinder 132. The insertion opening 152 of the pressurizing unit 134 can also be protected from interference if desired (not shown).

[0159] The embedding press 110 is therefore a fully automated embedding press 110 in the sense that, except for the preparatory manual loading step, the embedding pressing process for the multiple samples 126 to be embedded and the ejection of the samples are carried out continuously, one by one, fully automatically and in a program-controlled manner. In other words, the operator loads all the samples to be embedded in the loading places 124 in a preparatory working step and starts the embedding press 110, and from this point on the embedding pressing process for all the samples 126 to be embedded proceeds fully automatically, so that the operator can load and start the embedding press 110, for example, in the evening and finds all the samples again in embedded form in the collection container 150 the next morning. Figure 8 shows a cross section of an example of an embedded sample 142.

[0160] With reference to FIG. 29, an embodiment of the embedding press method includes first a method step of preparation by an operator, i.e. loading a number of samples to be embedded onto a sample loading table in step 402, and then execution of a clock cycle, each with the following program-controlled method steps:

[0161] Step 404: A step of moving the sample loading table 122, in which the loading location 124, together with one of the pressure pistons 128 and the sample 126 to be embedded placed thereon, is moved to the sample receiving position 136 below the pressure cylinder 132 of the pressure unit 134.

[0162] Step 406 : Moving the piston driver 138 to the pressurized piston 128 and connecting the piston driver 138 to the pressurized piston 128 in the loading location 124 at the sample receiving position 136 .

[0163] Step 408: pushing the pressurizing piston 128, together with the sample 126 to be embedded placed thereon, into the cavity 135 of the pressurizing cylinder 132 from below by the piston driver 138.

[0164] Step 410: Injecting one or more embedding granules 117 into the pressurizing cylinder 132 through the upper opening 132b onto the pressurizing piston 128 and the sample 126 to be embedded placed thereon.

[0165] Step 412: Closing the upper opening 132b of the pressurizing cylinder 132.

[0166] Step 414: Hot pressing the sample with the embedding granules 117 in the press cylinder 132 under applied pressure and temperature.

[0167] Step 416: Releasing the pressurizing cylinder 132.

[0168] STEP 418: Moving the embedded sample 142 out of the pressurized cylinder 132.

[0169] STEP 420: Expelling the embedded sample 142 from the pressurizing unit 134.

[0170] Step 422 : withdrawing the pressurized piston 128 from the cavity 135 of the pressurized cylinder 132 and placing the pressurized piston 128 on a resting place, in particular on the loading place 124 of step 406 .

[0171] STEP 424: Decoupling the piston driver 138 from the pressure piston 128.

[0172] Multiple repetitions of a clock cycle having steps 404-424 in a program-controlled manner.

[0173] In summary, with the above-described embedding press 110 the embedding process can be carried out fully automatically after the preparatory loading steps, strictly without the presence of an operator for all samples 126 to be embedded. Nevertheless, the construction is relatively simple and inexpensive, so that the investment for an automated embedding press 110 can be amortized in a short period of time.

[0174] 2. Automatic grinding and polishing equipment With reference to Figures 9 to 21, an example of a fully automated polishing and polishing apparatus 210 (automatic polishing and polishing apparatus) is shown. The automated polishing and polishing apparatus 210 has a sample supplying device 212 for transporting the embedded samples 142 one after the other to a sample removal position 214. The sample supplying device 212 can be formed, for example, as a sample chute as shown in Figures 9 and 10, or as a motor-driven conveyor belt with stops 213 to define the sample removal position as shown in Figures 11 and 12, or as a sample magazine as shown in Figures 13 and 14. Thus, the individual embedded samples 142 can be transported, collected or stored by different solutions and, in some cases, can be taken over automatically by the upstream embedding press 110.

[0175] 9 and 10, optionally, the bottom embedded sample 142 can be pushed by the sample pusher 215 to the sample removal position 214. Alternatively, the bottom part of the sample chute, where the embedded samples 142 are ready for removal, can be embodied to be pivotable to move the embedded samples 142 to a horizontal position for gripping by the sample gripper 222. When pivoting the embedded sample 142 to be gripped, the remaining embedded samples 142 are preferably held back on the sample chute so that they do not slide off. This can be done, for example, by a separator. A separator 217 can also be used in the conveyor belt 212 to better be able to grip the embedded samples 142 at the sample removal position 214 individually.

[0176] In the sample magazine of FIGS. 13 and 14, the bottommost sample can be pushed into a sample removal position 214, for example, also using a sample pusher 215.

[0177] These sample delivery devices 212 have in common that they deliver embedded samples 142 individually, in particular one after the other, to the sample removal position 214 so that the currently embedded sample 142 is removed and the next embedded sample 142 is automatically delivered. Furthermore, the embedded samples 142 are generally preferably horizontally positioned at the sample removal position 214 for accurate gripping by the sample gripper 222, regardless of the method of sample delivery.

[0178] The automated grinding and polishing apparatus 210 comprises a grinding and polishing head 216, which in this example is hung on a frame or bridge 218 and is displaceable in both horizontal dimensions x and y in a horizontal x-y plane. To this end, the grinding and polishing head 216 can be displaced in the x direction along the frame 218, while the frame 218 is displaced in the y direction by a linear guide 220. Both can be motor-driven and run in a program-controlled manner. Thus, the grinding and polishing apparatus 210 shown here can be formed as a portal structure. However, other movement mechanisms for the sample gripper can also be used, such as outriggers.

[0179] The grinding and polishing head 216 includes a sample gripper 222 configured to grip the individual embedded samples 142 without sample retention. The sample gripper 222 is configured as a three-finger gripper in this example. The sample gripper 222 comprises radially movable gripping fingers 224 (three in this example) which grip the embedded sample 142 by its radially outer periphery outer shell surface 142c and hold it in a frictional connection. The gripping fingers 224 have a step 226 or inwardly facing shelf which forms a stop for the sample top surface 142b and has the result that the embedded sample 142 can be gripped by the sample gripper 222 as horizontally as possible.

[0180] 19-21, the sample gripper 222 is arranged at the lower end of a ball-bearing-supported drive shaft 228, which is driven by a drive motor 232 via a belt drive 230, so that the sample gripper 222 rotates continuously about its axis of symmetry A at a predetermined number of revolutions during the polishing and grinding process. The drive motor 232 for rotating the sample gripper 222 is connected to the belt drive 230 via a transmission 244 and a coupling 246. Furthermore, the polishing and polishing head 216 has a linear slide 234, by means of which the sample gripper 222 can be displaced axially, i.e. vertically, in the z-direction, in order to position the gripped embedded sample 142 relative to the polishing or grinding table. The axial displacement of the sample gripper 222 is also performed by driving the motor 236 in an automated and program-controlled manner. The drive shaft 228 is formed with two deep holes 252, 254, in this example, for directing pneumatic gas to and from the sample gripper 222 so that the sample gripper 222 can be opened and closed along the radial guide 238. For this purpose, each gripping finger 224 has a corresponding radial drive slide 238 and can be moved radially inwards or outwards to grip or release the embedded sample 142. However, other drive mechanisms for the gripping fingers 224 for gripping the embedded sample 142 are also possible.

[0181] The embedded samples 142 are thus gripped and held individually by the sample gripper 222, here formed as a three-finger gripper, and do not need to be clamped in a sample holder. The sample gripper 222 rotates the gripped embedded sample 142 about an axis of symmetry of the embedded sample 142, which extends coaxially with the rotation axis A of the sample gripper 222. Thus, during polishing, both the polishing disk and the gripped embedded sample 142, which is axially offset relative thereto, rotate continuously, e.g. in opposite or the same direction.

[0182] The linear movement path of the sample gripper 222 in the z-direction is monitored by an optical probe 240 and associated optical measurement tape 242, thereby forming a path measurement system 240, 242 for the displacement of the sample gripper 222 in the z-direction.

[0183] Furthermore, the grinding and polishing head 216 for the sample gripper 222 is equipped with a force sensor 248, by means of which the contact pressure of the embedded sample 142 gripped by the sample gripper 222 against the grinding or polishing plate can be measured. By means of the force sensor 248, on the one hand, grinding and polishing can be performed with a predefined contact pressure, and the operator can input the desired contact pressure beforehand into the program control device 211. Via the force sensor 248, the contact point of the embedded sample 142 on the grinding plate can also be detected during the lowering, and subsequently, by means of the path measurement system 240, 242, a material removal can be performed in a program-controlled manner, which is predefined and pre-entered by the operator into the program control device 211. Thus, the grinding and polishing head 216 can detect the contact point of the embedded sample 142 against the grinding or polishing plate, measure the actual contact pressure and / or measure the axial movement path of the sample gripper 222 in the z-direction when grinding the embedded sample 142. This is to feed back one or more of the above-mentioned measurements to the program controller 211 so that the polishing and / or abrasive removal process is controlled by a control circuit with respect to contact pressure and / or layer thickness of the abrasive removal.

[0184] In other words, the z-axis of the grinding and polishing head 216 is configured with a path measurement system 240, 242, which allows a preset layer thickness, pre-adjusted in the program control device 211, to be automatically removed from the embedded sample 142 (target preparation). To determine the zero point in the target preparation, a force sensor 248 is used, which detects when the gripped embedded sample 142 comes into contact with the respective polishing disk.

[0185] Gas for the pneumatic actuation of the gripping fingers 224 is led via a rotary feedthrough 250 to the drive spindle 228, via which pneumatic gas is supplied via a gas supply line 252 to the linear slide 238 of the gripping fingers 224. The pneumatic gas is exhausted again via a gas exhaust line 254. The rotary feedthrough 250 is thus formed in this example as a two-channel rotary feedthrough for the pneumatic actuation of the sample gripper 222.

[0186] 9-12, an embodiment of the automated grinding and polishing apparatus 210 includes four grinding stations 256, each with its own grinding disc 258, sometimes referred to as a spindle, and a tub 260 within which the respective grinding disc 258 rotates. Within the grinding tub 260, grinding debris and / or coolant may be collected and drained through an outlet port.

[0187] A polishing disk 262 is mounted on each polishing disk 258. Each of the four polishing stations 256 is preferably equipped with a different polishing disk having a different grit size, so that the sample gripper 222 holds the embedded sample 142 gripped at one time throughout the polishing process and moves them from polishing station to polishing station for successively polishing them, first coarsely and then finely. In that case, the polishing disk 262 does not have to be exchanged between the polishing processes with different grit sizes, because for each desired grit size there is a unique polishing station 256 with a corresponding polishing disk 262, which the polishing and polishing head 216 and the sample gripper 222 approach one after the other with the same embedded sample 142 gripped at one time. Thus, the polishing and polishing head 216 first approaches the sample removal position 214, where the sample gripper 222 is lowered to grip a single unfixed embedded sample 142. Then, the sample gripper 222 moves upward again and the grinding and polishing head 216 approaches the first polishing station 256, which typically includes the coarsest polishing plate 262. Upon arriving there, the sample gripper 222 moves downward in the z-direction until the gripped embedded sample 142 comes into contact with the polishing plate, which can be detected by the force sensor 248. Then, the first polishing process is performed under simultaneous rotation of the polishing plate 262 and the sample gripper 222 in a force-controlled or path-controlled manner with feedback from the control circuit. When the first polishing process is finished, the sample gripper 222 moves upward again. Next, the grinding and polishing head 216 preferably approaches the washing station 268. There, the sample gripper 222 moves downward again in this example to immerse the gripped embedded sample 142 in a washing bath. Then, the sample gripper 222 moves upward again.The polishing and polishing head 216 with the sample gripper 222 then approaches the next polishing station 256 with another polishing disk 262, preferably having a different grit size, typically a finer grit size, where the sample gripper 222 is lowered again and the next polishing process is performed, preferably in the same manner as described above. In the polishing and polishing apparatus 210 shown here, successive approaches to up to four different polishing stations 256 with four corresponding different polishing disks 262, one after the other, preferably in the same manner, can be performed.

[0188] 17, the grinding and polishing head 216 has, in this example, liquid nozzles 264, 266. Through the liquid nozzles 264, cooling liquid is metered in for wet polishing during the polishing process. Advantageously, the liquid nozzles 264, 266 are in the grinding and polishing head 216 and are therefore moved from polishing station 256 to polishing station 256 together with the sample gripper 222 and the gripped embedded sample 142, so that each polishing station 256 does not need its own cooling liquid nozzle. The cooling liquid can be discharged together with the polishing debris through the respective polishing tabs 260 in a known manner.

[0189] 9, 11 and 18, the automated grinding and polishing device 210 has two washing stations 268 with washing containers 269, which are accessed by the sample gripper 222 during the grinding process. For this purpose, the grinding and polishing head 216, after the grinding process is finished, accesses the washing containers 269, which are filled with a cleaning liquid 270 and immerses the sample in the cleaning liquid 270 in order to clean the sample. In the washing station 268, for example, water or alcohol can be used as the cleaning liquid 270. If desired, the sample gripper 222 can rotate together with the embedded sample 142 and / or an ultrasonic device 271 can be provided, so that the washing station 268 is formed as an ultrasonic bath. The washing containers 269 can optionally be automatically emptied and filled with new cleaning liquid.

[0190] In the washing container 269, radially mounted in the region above the washing liquid 270 are air nozzles 272, by means of which the embedded sample 142 can be dried by cold and / or hot air after washing. After sufficient washing, the sample holder 222 moves upward again together with the embedded sample 142, and the embedded sample 142 is blown dry by the air nozzles 272. After the washing process in the washing station 268, the sample holder 222 can approach the next polishing station 256.

[0191] In the illustrated example, the automated grinding and polishing apparatus further comprises two grinding stations 276. Thus, the illustrated example has four grinding stations 256, two cleaning stations 268 and two polishing stations 276. However, it will be apparent that other numbers and / or arrangements of stations 256, 268, 276 are possible, such as three grinding stations 256, two cleaning stations 268 and three polishing stations 276, or as shown in FIG. 13, for example, three grinding stations 256, two cleaning stations 268 and two polishing stations 276, or any other desired number and / or arrangement. Each polishing station 276 has a respective polishing disk 278 disposed in a respective polishing tub 280 on which a respective polishing disk 282 is fixed, which may also include a polishing cloth. When all desired polishing processes are completed and the embedded sample 142 is cleaned after the last polishing process, the polishing and polishing head 216, together with the sample gripper 222 and the gripped embedded sample 142, approaches the first polishing station 276 to polish the sample lower surface 142a with a first polishing agent. A polishing suspension for the polishing process can be dispensed through the liquid nozzle 266 of the polishing and polishing head 216. Preferably, during the polishing process, the contact pressure is feedback controlled by the force sensor 248 to polish with a predetermined contact pressure, which can be determined in a program control device, for example, by a user.

[0192] Thus, the metering of water cooling for the polishing process and / or the metering of polishing suspension for the polishing process is done by supply from the polishing and polishing head 216. In this way, the required liquid can be dispensed from the polishing and polishing head 116 at each surface treatment station 256, 276 without having to be provided separately at each surface treatment station 256, 276. In other words, the liquid nozzles 264, 266 move together with the sample gripper 222 or together with the gripped embedded sample 142.

[0193] Upon completion of the first polishing process at the first polishing station 276, the abrasive and polishing head 216 together with the sample gripper 222 and gripped embedded sample 142 approaches the cleaning station 268 to be cleaned as described above in connection with the polishing process. It is practical to use the first cleaning station 268 for the polishing process and the second cleaning station 268 for the polishing process, respectively, so that the abrasive debris and the polishing suspension do not cross-contaminate or the cleaning stations need not be refilled too frequently. After cleaning of the embedded sample 142 at the second cleaning station 268, it can also be further accessed by the second polishing station 276 for polishing with a different polishing agent, for example a different polishing suspension. Other polishing suspensions can be metered through the same liquid nozzle 266, or additional liquid nozzles, for example two, three, four, five, six or more liquid nozzles for cooling liquid and / or polishing suspensions, can be provided in the grinding and polishing head 216, which move together with the sample gripper 222 from stations 256, 268, 276 to stations 256, 268, 276.

[0194] Thus, in this example, the embedded sample 142 is gripped once by the sample gripper 222 and then polished successively one after the other at multiple, in this example four, polishing stations 256 with different grit sizes, and washed in washing baths 268, 270 between each polishing process. In addition, the same embedded sample 142 is polished successively one after the other at one or more, in this example two, polishing stations 276 with different polishing agents, using the same sample gripper 222. Again, between the polishing processes, the embedded sample 126 can be washed in the washing station 268. The entire process of grinding, polishing and washing is performed in a fully automated and program-controlled manner without operator involvement.

[0195] The samples are processed individually in the illustrated example and pass through each station 256 , 276 , 268 , and they are always held by the same sample gripper 222 .

[0196] The grinding and polishing head 216 can change the height of the sample holder 222 with the gripped embedded sample 142 (z-axis) and press it against the respective grinding plate 262, or against the respective polishing cloth or the respective polishing plate 282, or immerse it in the respective cleaning vessel 269. Preferably, if the grinding and polishing head 216 is equipped with a force sensor 248, each grinding plate 262 with the gripped embedded sample 142 is configured to measure the force with which the gripped embedded sample 142 is pressed against the grinding plate 262 or the polishing plate 282, and control it to a value preset in the program controller 211 by the measured value in a feedback control circuit.

[0197] At the end of the grinding and polishing process, the grinding and polishing head 216 approaches the sample placement position 284 and places the finished, ground, polished and cleaned embedded sample 142 thereon so that the embedded sample can be used directly without further processing steps for material analysis, such as hardness testing or structural analysis.

[0198] With reference to Figure 9, a sample deposition location 284 is shown diagrammatically with several individual deposition locations. With reference to Figure 11, the sample deposition location 284 is formed as part of a transport device, in this example as a motor-driven conveyor belt, by which the fully prepared embedded sample 142 is further transported to a sample collector.

[0199] In Fig. 9 and Fig. 11, the surface treatment stations, i.e. the polishing station 256 and the polishing station 276, are arranged in a 3x2 rectangular array, with two cleaning stations 268 arranged between the surface treatment stations 256, 276. The dimensions of the automatic polishing and polishing apparatus 210 with the illustrated 3x2 arrangement are about 1.0-1.2 m in length and about 0.8-0.9 m in depth, so that it can be installed in a normal laboratory line (90 cm deep). However, the polishing and polishing apparatus 210 can also be formed as an integrated stationary apparatus, in which case the control device, reservoirs for liquids, dosing system, etc. can be located under the polishing and polishing apparatus 210. All the surface treatment stations 256, 276 are arranged in the same apparatus housing 208, in which the polishing / polishing head 216 is also hung, i.e. they all belong to the same polishing and / or polishing apparatus 210.

[0200] The GUI can be, for example, a touch display that is either integrated into the grinding and polishing apparatus 210 or attached by an adjustable support arm (not shown).

[0201] With reference to FIG. 13, a substantially linear arrangement of the surface treatment stations 256, 276 and the cleaning station 268 may also be envisaged. This has the advantage that the grinding / polishing head 216 only needs to move in one dimension (x). In return, the overall length of the grinding and polishing apparatus 210 may be somewhat longer or fewer stations 256, 268, 276 may be accommodated. In order to grind and / or polish the sample lower surface 142a with increasing surface fineness by multiple surface treatment steps in the different surface treatment stations 256, 276 in an automatic sequence, multiple surface treatment stations 256, 276, again with different treatment fineness, are arranged adjacent to each other in the xy plane, as in the examples of FIGS. 9 and 11. The number of the surface treatment stations 256, 276 and the cleaning stations 268, as well as their spatial arrangement in the xy plane, may be designed according to the needs of the respective customer.

[0202] Referring to FIG. 15, the automated grinding and polishing apparatus 210 can be housed in a safety enclosure 286 having a front access opening 288 protected by a laser light grid 290 as an access protection such that the grinding and polishing apparatus will automatically be emergency switched off if a person inserts their hand into the safety enclosure 286 during operation.

[0203] Referring to FIG. 30, an embodiment of a grinding and polishing method includes the following program-controlled method steps:

[0204] Step 502 : The grinding and polishing head 216 is moved close to the sample removal position 214 , the sample gripper 222 is lowered, and the embedded sample 142 is gripped by the sample gripper 222 at the sample removal position 214 .

[0205] Step 504: Approaching the first polishing station 256, lowering the sample holder 222 together with the gripped embedded sample 142, pressing the embedded sample 142 against a rotating polishing plate 262 of the first polishing station 256 having a first grain size with a predetermined pressing force under rotation of the sample holder 222 and under the metered supply of cooling fluid, and raising the sample holder 222 together with the gripped embedded sample 142.

[0206] Step 506: if necessary, approaching the first washing container 269, immersing the embedded sample 142 grasped by the sample grasper 222 into the first washing container 269, lifting the embedded sample 142 out of the first washing container 269, and if necessary, blowing the grasped embedded sample 142 dry.

[0207] Step 508: Approaching the second polishing station 256, lowering the sample holder 222 together with the gripped embedded sample 142, pressing the embedded sample 142 against a rotating second polishing plate 262 of the second polishing station 256 having a second grain size with a predetermined pressing force under the rotation of the sample holder 222 and under the metered supply of cooling fluid, and raising the sample holder 222 together with the gripped embedded sample 142.

[0208] Step 510: if necessary, approaching a first or other washing container 269, immersing the embedded sample 142 grasped by the sample grasper 222 into the washing container 269, lifting the embedded sample 142 out of the washing container 269, and if necessary, blowing the grasped embedded sample 142 dry.

[0209] Step 512: Approaching the third polishing station 256, lowering the sample holder 222 together with the gripped embedded sample 142, pressing the embedded sample 142 against a rotating third polishing plate 262 of the third polishing station 256 having a third grain size with a predetermined pressing force under the rotation of the sample holder 222 and under the metered supply of cooling fluid, and raising the sample holder 222 together with the gripped embedded sample 142.

[0210] Step 514: If necessary, approaching a first or other washing container 269, immersing the embedded sample 142 grasped by the sample grasper 222 into the washing container 269, lifting the embedded sample 142 out of the washing container 269, and if necessary, blowing the grasped embedded sample 142 dry.

[0211] Step 516: Approaching the first polishing station 276, lowering the sample holder 222 together with the gripped embedded sample 142, pressing the embedded sample 142 against the rotating or vibrating first polishing plate 282 of the first polishing station 276 with a predetermined pressing force under the rotation of the sample holder 222 and under the metered supply of the first polishing suspension, and raising the sample holder 222 together with the gripped embedded sample 142.

[0212] If necessary, step 518: approaching a second or other washing container 269, immersing the embedded sample 142 grasped by the sample grasper 222 into the washing container 269, lifting the embedded sample 142 out of the washing container 269, and blowing the grasped embedded sample 142 dry.

[0213] Step 520: Approaching the second polishing station 276, lowering the sample holder 222 with the gripped embedded sample 142, pressing the embedded sample 142 against the rotating or vibrating second polishing plate 282 of the second polishing station 276 with a predetermined pressing force under the rotation of the sample holder 222 and under the metered supply of second polishing suspension, and raising the sample holder 222 with the gripped embedded sample 142.

[0214] Step 522: if necessary, approaching a second or other washing container 269, immersing the embedded sample 142 grasped by the sample grasper 222 into the washing container 269, lifting the embedded sample 142 out of the washing container 269, and if necessary, blowing the grasped embedded sample 142 dry.

[0215] Step 524: Approaching the grinding / polishing head 216 to the sample placement position 284 and placing the embedded sample 142 together with the sample gripper 222 at the sample placement position 284.

[0216] Steps 502-504 are repeated multiple times in a program-controlled manner.

[0217] Advantageously, an embodiment of the grinding and polishing apparatus 216 is characterized by the following: The embedded sample 142 may not necessarily need to be clamped in a sample holder. The entire grinding, polishing and cleaning process may in some cases proceed fully automatically, without human intervention. The grinding and polishing apparatus 210 is characterized by low investment costs that can be quickly amortized. The grinding and polishing apparatus 210 is characterized by compact dimensions and can be integrated into conventional laboratory lines. The grinding and polishing apparatus 210 is flexible in its use.

[0218] 22-25, the grinding and polishing apparatus 210 may further include an etching station 756 with an etching bath 758 for etching the ground and / or polished sample lower surface 142a. In the illustrated example, the etching station 756 is in a separate etching module 710 to which the grinding and polishing apparatus 210 is attached, and the loading and unloading transporters 712, 314 transport the embedded samples 142 to be etched. The sample grippers 722 each grip a single embedded sample 142 and deliver it to the etching station 756, where it is immersed in the etching bath 758. The sample grippers 722 then deliver the etched embedded samples 142 to a washing station 768, where the embedded samples 142 are immersed in a washing bath consisting of a washing solution 770 in a washing container 769. The sample gripper 722 then moves with the embedded sample 142 to the sample placement position 284 on the output transporter 314 in the illustrated example and places the embedded sample 142 thereon.

[0219] The etching module 710 further includes a hermetically closable housing 708 with a hermetically sealed door 732 and an exhaust 734 for drawing off vapors from the etching chamber 758. Furthermore, the etching chamber 758 can be closed with a cover 759 to prevent excessive evaporation of the acid in the etching chamber 758.

[0220] In the illustrated example, the etching station 756 is attached to the polishing and polishing apparatus 210 in a separate etching module 710 and preferably includes a second sample gripper 722 constructed like the sample gripper 222. However, the etching station 756 may also be integrated into the polishing and polishing apparatus 210 (not shown). Thus, the polishing and polishing apparatus 210 with the etching module 710 attached or the etching station 756 integrated therein may also be referred to as the polishing / polishing and / or etching apparatus 210.

[0221] 3.Fully automated production line 26-28, there is shown an example of a fully automated production line 310 for embedding, grinding and polishing samples. The automated production line 310 includes, among other things, the automated embedding press 110 described above and the automated grinding and polishing apparatus 210 described above.

[0222] The samples 142 embedded by the automated embedding press 110 and ejected by the sample ejector 147 of said embedding press 110 are not transported individually, i.e. in a repeating sample holder, but in particular continuously, one after the other, by a first transport device 312 from the automated embedding press 110 to the automated polishing and polishing device 210, for which purpose the first transport device 312 can be formed, for example, as a sample chute or a motor-driven conveyor belt. On the first transport device 312, some of the embedded samples 142 can be stored. In any case, the first transport device 312 transports the embedded samples 142 to a sample removal position 214 of the automated polishing and polishing device 210, so that the embedded samples 142 can be gripped there individually, in succession, one after the other, by a sample gripper 222, in order to go through the above-mentioned polishing, polishing and / or cleaning processes. Once the embedded sample 142 is then fully prepared, it is placed in the sample placement position 284 by the sample gripper 222 .

[0223] In the example shown in Fig. 26, the fully prepared embedded samples 142 are transported from the sample placement position 284 by the second transport device 314 not individually, i.e. in a repeating sample holder, but in particular continuously, one after the other, into the sample collector 316. The second transport device 314 can also be formed, for example, as a chute or a motor-driven conveyor belt. The fully prepared embedded samples 142 are thus fed one after the other into the sample collector 316, so that all samples 126 to be embedded that have passed through the automated production line 310 are embedded and fully prepared, individually, in the sample collector 316 and available for their further use by the operator.

[0224] If the fully prepared (ground, polished and / or etched) embedded sample 142 is slid over the chute, preferably the fully prepared embedded sample 142 is either turned upside down beforehand or the chute can be released in the middle so that only the outer edge of the fully prepared embedded sample 142 rests, thereby avoiding the possibility that the underside of the polished sample 126 is damaged, for example by scratches.

[0225] 27 and 28, the sample collecting device 316 can be formed as a magazine 322 with a number of sample placement locations 324, and each single fully prepared embedded sample 142 is placed on the sample placement location 324 of the magazine 322. The magazine 322 can be formed as a movable sample placement table, for example, with the sample placement locations 324 arranged in particular adjacent to each other, and in a program-controlled manner, each free sample placement location 324 is moved to the sample placement position 284, so that each fully prepared embedded sample 142 can be placed on the free sample placement location 324 that is currently located at the sample placement position 284 of the grinding and polishing device 210. At the next clock, the next free sample placement location 324 is moved to the sample placement position 284. In other words, the sample placement by the sample gripper 222 on the sample placement locations 324 is performed synchronously with the polishing and / or grinding process or in the sample processing clock of the automated polishing and polishing device 210. In the example shown in Figures 27 and 28, the sample collector 316 as a table-like magazine 322 includes an index table with, for example, 32 peripheral sample placement locations 324 corresponding to the sample loading table 122. Of course, an etching module 710 can also be included here.

[0226] Thus, in a preparation work step, an operator places all of the samples 126 to be embedded in the respective sample loading positions 124 of the sample loading table 122 and then starts the fully automated production line 310. In this case, the samples are then embedded by the embedding press 110 automatically in a program-controlled manner, transported by the first transport device 312 to the grinding and polishing device 210 where they are polished, polished and cleaned and subsequently transported or placed by the second transport device 314 into the sample collector 316. The preparation loading step can be performed by an operator, for example in the evening, and the next morning, after a complete fully automated and program-controlled process, all samples are present in the sample collector 316 in an embedded and fully prepared state, i.e. polished, polished and cleaned state. During the entire production process, the embedded samples 142 are individually handled in pieces, for example transported, gripped, ground, polished, cleaned, etched and / or finally mounted.

[0227] The control of the entire production line 310 may be carried out by a program controller 111, 211 running, for example, on a central computer.

[0228] The dimensions of the illustrated production line 310 are less than 4.8 m in length and less than 90 cm in depth, so that it can be installed on a regular laboratory line (90 cm deep).

[0229] Referring to Figure 28, the production line 310 may be housed within a safety enclosure 386 with a front access opening 388 monitored by a laser light grid 390 to ensure emergency switch-off.

[0230] Referring to FIG. 31, an embodiment of an automated method for generating a number of embedded and surface treated samples 142 includes providing a number of samples 126 to be embedded in step 602 and the following program-controlled method steps:

[0231] Step 604 : Hot embedding pressing the sample 126 to be embedded together with the embedding material 117 in the pressure cylinder 132 of the embedding press 110 to generate the embedded sample 142 .

[0232] STEP 606: Ejecting the embedded sample 142 from the pressurized cylinder 132.

[0233] STEP 608: Transporting the embedded sample 142 from the embedding press 110 to the surface treatment device 210.

[0234] Step 610 : Grasping each embedded sample 142 by the sample gripper 222 of the surface processing device 210 .

[0235] Step 612: Bringing the sample holder 222 close to the surface treatment stations 256, 276 of the surface treatment device 210 for treatment of the sample underside 142a of the embedded sample 142 at the surface treatment stations 256, 276, and, if necessary, bringing the sample holder 222 close to the cleaning station 268 of the surface treatment device 210 for cleaning of the embedded sample 142.

[0236] Optionally, STEP 614: Repeating STEP 612 one or more times at other surface treatment stations 256, 276 of the surface treatment apparatus 210 and, optionally, at other cleaning stations 268 of the surface treatment apparatus 210.

[0237] Step 616: Approaching the sample gripper 222 to the sample placement position 284 and opening the sample gripper 222 to release and place the embedded and surface treated sample 142 at the sample placement position 284.

[0238] Steps 604-608 and steps 610-616 are repeated multiple times in a program-controlled manner, with the embedded sample being allowed to pool between steps 608 and 610.

[0239] In summary, the present invention relates to an automated embedding press 110, an automated polishing and polishing apparatus 210, and an automated production line 310 comprising the embedding press 110 and the polishing and polishing apparatus 210. Thus, all features described in relation to the embedding press 110 and the polishing and polishing apparatus 210 are also deemed to be disclosed for the production line 310, and vice versa. All features disclosed in relation to the embedding press are also deemed to be disclosed for the associated method disclosed, and vice versa. All features disclosed in relation to the polishing and polishing apparatus are also deemed to be disclosed for the associated method disclosed, and vice versa. All features disclosed in relation to the production line are also deemed to be disclosed for the associated method disclosed, and vice versa.

[0240] It is clear to a person skilled in the art that the above-described embodiments should be understood as illustrative, and that the invention is not limited thereto, but can be modified in many ways without departing from the scope of protection of the claims. Moreover, as is clear to a person skilled in the art, features individually define essential elements of the invention, even if they are described together with other features, regardless of whether they are disclosed in the specification, claims, drawings or otherwise.

Claims

1. An embedding press (110) for embedding a sample (126) in an embedding material (117), comprising: a pressure unit (134) including a pressure cylinder (132); a dosing device (115) for dosing the embedding material (117); a sample loading table (122) with a number of loading locations (124) on which an operator can place one sample (126) to be embedded; a control device (111) adapted to automatically control said embedding press (110) in a program-controlled manner, said control device (111) precisely controlling at least said sample loading table (122), said pressure unit (134) and said dosing device (115) in such a way that, after a number of samples to be embedded (126) have been loaded on said sample loading table (122), a number of embedding press processes can be carried out one after the other automatically and without intermediate operator intervention, and for this purpose said control device (111) controls said embedding press (110) in accordance with the following clock steps a) to d), which are respectively repeated for embedding a number of said samples: a) the sample loading table (122) brings one of the loading locations (124) together with the sample (126) to be embedded into proximity with a sample receiving position (136) of the pressurizing unit (134); b) the sample to be embedded (126) is inserted into the pressurized cylinder (132) from the sample receiving position (136) and the embedding material (117) is metered into the pressurized cylinder (132); c) an embedding press process is performed to generate embedded samples (142); d) The sample (142) so embedded is expelled from the pressure cylinder (132). A control device (111) arranged to automatically control a number of clock cycles having a Including, the loading location (124) has a piston (128) as a placement location for the sample (126) to be embedded, the pressurizing unit (134) has a piston drive (138) which is connected to each of the pistons (128) in the sample receiving position (136) in order to raise the pistons (128) together with the embedded sample (142) out of the loading location (124) and into the pressurizing cylinder (132); Embedding press (110).

2. 2. The embedding press (110) of claim 1, wherein the sample loading table (122) is formed as an index table, and the loading locations (124) are arranged in an annular area (123) at the outer edge of the index table.

3. 3. The embedding press (110) of claim 1 or 2, wherein the pressure cylinder (132) has a first opening (132a) at a lower portion and a second opening (132b) at an upper portion, the sample (126) being inserted into the pressure cylinder (132) through the first opening (132a) at the lower portion and the embedding material (117) being introduced into the pressure cylinder (132) through the second opening (132b) at the upper portion.

4. 4. The embedding press (110) according to claim 3, wherein the pressing unit (134) comprises an upper closing slide (140), and the control device (111) is adapted to control the upper closing slide (140) so as to close the upper second opening (132b) of the pressing cylinder (132) after the embedding material (117) is introduced, for subsequently carrying out the embedding press process.

5. 2. The embedding press (110) of claim 1, wherein after the embedding press process, the embedded sample (142) is moved upwardly from the pressurizing cylinder (132) by the piston driver (138) and the piston (128), and the pressurizing unit (134) includes a sample ejector (144) that ejects the embedded sample (142) that has been moved upwardly from the pressurizing cylinder (132) from the pressurizing unit (134).

6. 6. The embedding press (110) of claim 5, wherein the sample ejector (144) pushes the embedded sample (142) downwardly from the upwardly moved piston (128) in a direction transverse to an axis of the pressurizing cylinder (132) to eject the embedded sample (142).

7. 6. The embedding press (110) of claim 5, wherein after ejecting the embedded sample (142), the piston driver (138) together with the piston (128) is again moved downward and the empty piston (128) is again placed in the loading location (124) of the sample loading table (122) before the next loading location (124) is moved to the sample receiving position (136) with the next piston (128) and the next sample (126) to start the next clock cycle.

8. An embedding press (110) for embedding a sample (126) in an embedding material (117), comprising: a pressure unit (134) including a pressure cylinder (132); a dosing device (115) for dosing the embedding material (117); a sample loading table (122) with a number of loading locations (124) on which an operator can place one sample (126) to be embedded; a control device (111) adapted to automatically control said embedding press (110) in a program-controlled manner, said control device (111) precisely controlling at least said sample loading table (122), said pressure unit (134) and said dosing device (115) in such a way that, after a number of samples to be embedded (126) have been loaded on said sample loading table (122), a number of embedding press processes can be carried out one after the other automatically and without intermediate operator intervention, and for this purpose said control device (111) controls said embedding press (110) in accordance with the following clock steps a) to d), which are respectively repeated for embedding a number of said samples: a) the sample loading table (122) brings one of the loading locations (124) together with the sample (126) to be embedded into proximity with a sample receiving position (136) of the pressurizing unit (134); b) the sample to be embedded (126) is inserted into the pressurized cylinder (132) from the sample receiving position (136) and the embedding material (117) is metered into the pressurized cylinder (132); c) an embedding press process is performed to generate embedded samples (142); d) The sample (142) so embedded is expelled from the pressure cylinder (132). A control device (111) arranged to automatically control a number of clock cycles having a Including, the embedding press (110) comprises an insertion opening (152) below the pressure cylinder (132) in which the sample loading table (122) moves at least partially in order to move the samples (126) to be embedded one after the other below the pressure cylinder (132) and periodically inserts the loading locations (124) one after the other with the samples (126) to be embedded into the insertion opening (152), Embedding press (110).

9. 9. The embedding press (110) according to any one of claims 1 to 8, wherein at least one first and second reservoirs (114) for holding different first and second embedding materials (117) are connected to the dosing device (115), so that the dosing device (115) can dosing the embedding materials (117) from both the first and second reservoirs (114) into the pressurizing cylinder (132), the dosing of the first and second embedding materials (117) being controlled by the control device (111) in order to automatically dosing a predetermined amount of the first and / or second embedding material (117), respectively, into the pressurizing cylinder (132).

10. 10. A method for embedding a multiplicity of samples in an embedding material by means of an embedding press (110) according to any one of claims 1 to 9, wherein a multiplicity of samples to be embedded (126) is loaded in a preparation step onto a sample loading table (122) with a multiplicity of loading places (124), said samples being embedded automatically one after the other in a program-controlled manner after the multiplicity of samples to be embedded (126) have been loaded onto the sample loading table (122), in a clock cycle having the following clock steps: a) moving a loading location (124) loaded with a sample (126) to be embedded to a sample receiving position (136) of a pressure unit (134); b) inserting said sample (126) of step a) from said loading location (124) into a pressurizing cylinder (132) of said pressurizing unit (134) and metering embedding material (117) into said pressurizing cylinder (132). c) pressing said embedding material (117) and said sample (126) in said pressurized cylinder (132) to produce an embedded sample (142). d) ejecting said embedded sample (142) from said pressurized cylinder (132).

11. 11. The method of claim 10, wherein the sample (126) is inserted into the pressurized cylinder (132) from below and the embedding material (117) is metered into the pressurized cylinder (132) from above.

12. 12. The method according to claim 11, wherein the pressure cylinder (132) is then closed at its upper end in a program-controlled manner after the metering of the potting material (117) in order to perform the potting pressing process automatically in a program-controlled manner.

13. The method according to any one of claims 10 to 12, wherein the sample (126) to be embedded is placed on the loading site (124) on a respective specific piston (128), and the sample (126) together with the respective specific piston (128) is pressed axially from below into the pressure cylinder (132).

14. 14. The method according to any one of claims 10 to 13, wherein after the embedding pressing process, the embedded sample (142) is moved upwards out of the pressurizing cylinder (132) and pushed down from the piston (128) transversely to the axis of the pressurizing cylinder (132) by a sample ejector (144) to eject the embedded sample (142).

15. 15. The method according to claim 10, wherein after ejecting the embedded sample (142), the empty piston (128) is again moved downwards and placed again on the loading location (124) before the next loading location (124) is moved with a next piston (128) and a next sample (126) to the sample receiving position (136) to start a next clock cycle.

16. 16. The method according to claim 10, wherein the sample loading table (122) moves the loading location (124) together with the pistons (128) and the sample (126) to be embedded placed thereon in order to introduce a respective one of the pistons (128) together with the sample (126) placed thereon in an axial direction into the pressurizing cylinder (132) and / or wherein after the embedding press process, the pistons (128) again move axially downwards out of the pressurizing cylinder (132) and are again placed on the loading location (124) before in a next clock cycle a next loading location (124) moves together with a next piston (128) and a next sample (126) under the pressurizing cylinder (132).

17. The method according to any one of claims 10 to 16, wherein at least two different potting materials (117) are metered into the pressure cylinder (132) automatically one after the other in a program-controlled manner.

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