Material for compensation of position errors in the assembly of discrete components

Abstract

The assembly includes a substrate, a coating comprising a Bingham fluid disposed on a surface of the substrate, and discrete components partially embedded within or disposed on the coating comprising a Bingham fluid. The method includes irradiating a dynamic release structure disposed on a carrier and having the discrete components attached thereto, whereby the discrete components are released from the carrier, and receiving the released discrete components in or on the coating comprising a Bingham fluid disposed on the surface of the substrate.

Description

[Technical field]

[0001] Claiming priority This application claims priority to U.S. Patent Application No. 62,859,830, filed June 11, 2019, the entire contents of which are incorporated herein by reference. [Background technology]

[0002] This disclosure relates generally to assembling discrete components onto a substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2014 / 0238592 Summary of the Invention [Means for solving the problem]

[0004] In one aspect, an assembly includes a substrate, a coating comprising a Bingham fluid disposed on a surface of the substrate, and a discrete component partially embedded within or disposed on the coating comprising Bingham fluid.

[0005] Implementations can include any one or more of the following features.

[0006] The Bingham fluid includes one or more of a flux, a solder paste, a conductive ink, a semi-conductive ink, a gel, and a chemically inert material.

[0007] Discrete components include light emitting diodes (LEDs).

[0008] The substrate includes a semiconductor wafer. The substrate includes a tape. The substrate includes a rigid substrate. The substrate includes a printed circuit board.

[0009] In one aspect, an assembly includes a substrate and a coating comprising a Bingham fluid disposed on the substrate and having a first surface in contact with the substrate, the coating configured such that when the discrete components are cast onto a second surface of the coating opposite the first surface, the discrete components are disposed on or partially embedded within the coating.

[0010] Implementations can include any one or more of the following features.

[0011] The Bingham fluid includes one or more of a flux, a solder paste, a conductive ink, a semi-conductive ink, a gel, and a chemically inert material. The Bingham fluid includes a conductive paste.

[0012] The substrate includes a printed circuit board.

[0013] In one aspect, a method includes irradiating a dynamic release structure disposed on a carrier and having discrete components attached thereto, whereby the discrete components are released from the carrier, and receiving the released discrete components in or on a coating comprising a Bingham fluid disposed on a surface of a substrate.

[0014] Implementations can include any one or more of the following features.

[0015] The step of irradiating the dynamic release layer includes irradiating the dynamic release layer with laser energy.

[0016] The irradiating step induces ablation of at least a portion of the dynamic release layer.

[0017] The method includes the step of reducing adhesion of the dynamic release layer prior to the irradiating step.

[0018] The step of irradiating the dynamic release layer includes irradiating the dynamic release layer through a carrier.

[0019] Discrete components include LEDs.

[0020] The substrate includes a tape. The substrate includes a printed circuit board.

[0021] In one aspect, a method includes forming a coating including a Bingham fluid on a surface of a target substrate and receiving within or on the coating discrete components to be transferred from a carrier by a laser-assisted transfer process.

[0022] In one embodiment, the step of forming a coating comprising a Bingham fluid includes disposing one or more of a flux, a solder paste, a conductive ink, a semi-conductive ink, a gel, and a chemically inert material on a surface of the target substrate.

[0023] In one aspect, a method includes determining an alignment error between discrete components of a discrete component assembly mounted in a laser assisted transfer system and target locations on a target substrate, the discrete component assembly including discrete components attached to a support by a dynamic release layer; determining a beam offset characteristic based on the alignment error; and providing a signal indicative of the beam offset characteristic to an optical element of the laser assisted transfer system, the optical element being configured to adjust a position of a beam pattern relative to the discrete components in accordance with the beam offset characteristic.

[0024] Implementations can include any one or more of the following features.

[0025] The method includes adjusting, with an optical element, a position of the beam pattern relative to the discrete components according to a beam offset characteristic.The method includes adjusting, with a galvanometer laser scanner, a position of the beam pattern relative to the discrete components according to a beam offset characteristic.

[0026] The step of determining the alignment error includes determining one or more of a magnitude of the alignment error and a direction of the alignment error.

[0027] The step of determining the beam offset characteristic includes determining an offset between a center of the discrete component and an offset location of the discrete component. Determining the offset includes determining one or more of a magnitude and a direction of the offset between the center of the discrete component and the offset location of the discrete component.

[0028] The method includes determining a beam offset characteristic to at least partially compensate for the alignment error, the method includes determining the beam offset characteristic such that a beam pattern incident on the discrete component assembly in accordance with the beam offset characteristic results in the discrete components being transferred to target locations on the substrate.

[0029] The method includes determining the alignment error using a machine vision system.

[0030] The method includes irradiating the dynamic release layer with a beam, where a position of the beam pattern relative to the discrete components is adjusted according to a beam offset characteristic, such that the irradiation delaminates the discrete components from the carrier substrate.

[0031] The method includes receiving a discrete component at a target location on a target substrate.

[0032] In one aspect, a system includes a computing system including one or more processors connected to a memory, the one or more processors configured to: determine an alignment error between discrete components of a discrete component assembly and target locations on a target substrate, the discrete component assembly including discrete components attached to a support by a dynamic release layer and mounted within a laser assisted transfer system; determine a beam offset characteristic based on the alignment error; and provide a signal indicative of the beam offset characteristic to an optical element of the laser assisted transfer system, the optical element configured to adjust a position of a beam pattern relative to the discrete components in accordance with the beam offset characteristic.

[0033] Implementations can include any one or more of the following features.

[0034] The system includes an optical element. The optical element includes a galvanometer laser scanner.

[0035] Determining the beam offset characteristic includes determining an offset between a center of the discrete component and an offset location of the discrete component. Determining the offset includes determining one or more of a magnitude and a direction of the offset between the center of the discrete component and the offset location of the discrete component.

[0036] The one or more processors and memory are configured to determine beam offset characteristics to at least partially compensate for alignment errors, the one or more processors and memory are configured to determine the beam offset characteristics such that when a beam pattern is incident on the discrete component assembly in accordance with the beam offset characteristics, the discrete components are transferred to target locations on a substrate.

[0037] The one or more processors and memories execute the machine vision system. [Brief description of the drawings]

[0038] [Figure 1A] FIG. 13 is a diagram of a laser assisted transfer process. [Figure 1B] FIG. 13 is a diagram of a laser assisted transfer process. [Figure 2A] FIG. 13 is a diagram of a laser assisted transfer process. [Figure 2B] FIG. 13 is a diagram of a laser assisted transfer process. [Figure 2C] FIG. 13 is a diagram of a laser assisted transfer process. [Diagram 3] FIG. 1 is a diagram of a laser assisted transfer system. [Figure 4] FIG. 2 is a diagram of a discrete component and a target substrate. [Figure 5A] FIG. 13 is a diagram of a laser assisted transfer process. [Figure 5B] FIG. 13 is a diagram of a laser assisted transfer process. [Figure 5C] FIG. 13 is a diagram of a laser assisted transfer process. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0039] Described herein are approaches to address positional errors in a laser-assisted process of transferring discrete components from a support to a target substrate. In some examples, the target substrate can include a coating including a Bingham fluid that receives the discrete components on or within it. The Bingham fluid can prevent natural misalignment of the transferred discrete components, which aids in high-precision transfer of the discrete components.

[0040] FIG. 1A illustrates a laser-assisted transfer process for high throughput, low cost, non-contact assembly of discrete components 102 on a substrate 130. The term discrete component generally refers to any unit that is part of a product or electronic device, such as, for example, an electronic, electromechanical, photovoltaic, photonic or optoelectronic component, module, or system, such as any semiconductor material with a circuit formed in the portion of the semiconductor material. In some examples, the discrete component can be a light emitting diode (LED). A discrete component can be ultra-thin, in the sense that it has a maximum thickness of 100 μm or less, 50 μm or less, 40 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, 10 μm or less, or 5 μm or less. A discrete component can be ultra-small, in the sense that it has a maximum length or width dimension of 300 μm on a side, 100 μm on a side, 50 μm on a side, 20 μm on a side, or 10 μm on a side. Discrete components can be very thin and very small.

[0041] In the laser assisted transfer process, a discrete component assembly 108 is placed in the component transfer system 100. The discrete component assembly 108 includes a support 110, on the front side of which is placed a dynamic release structure 112. The discrete components 102 are attached to the support 110 by the dynamic release structure 112. The support 110 can be a rigid support, such as a glass or rigid polymer substrate, or a flexible support, such as a tape. The dynamic release structure 112 can be a single layer structure or a multi-layer structure, such as a structure having two, three, four or more layers.

[0042] In a laser assisted transfer process, the backside of the support 110 is illuminated with radiation, such as laser light, for example in a beam pattern 116. The beam pattern 116 can be, for example, a single beam (as shown) or a multiple beam pattern from a single source or multiple sources. The support 110 is transparent to the wavelength of radiation (e.g., laser energy). An element that is transparent to a given wavelength is an element through which at least some radiation of the given wavelength passes. The radiation passes through the support 110 and impinges on an area of ​​the dynamic release structure 112, causing ablation in at least a partial thickness of the dynamic release structure in the area where the laser beam pattern 116 impinges (referred to as the illuminated area). The ablation generates trapped gas, which expands and induces stress in the dynamic release structure 112. This stress causes at least a portion of the material of the dynamic release structure 112 to deform, forming one or more blisters 118. For example, if the beam pattern 116 is a single beam or a closely spaced multiple beam pattern, a single blister 118 is formed. When the beam pattern 116 includes multiple beams that are sufficiently spaced apart, a pattern of multiple blisters 118 is formed, where the term blister 118 generally refers to either a single blister or a multiple blister pattern.

[0043] The blisters 118 exert a mechanical force on the discrete components 102. When the mechanical force exerted by the blisters 118 is sufficient to overcome the adhesion between the discrete components 102 and the dynamic release structure 112, the mechanical force exerted by the blisters 118 (in combination with gravity) pushes the discrete components away from the support 110 (e.g., downward) for transfer to the target substrate 130.

[0044] Further description of the laser assisted transfer process can be found in U.S. Patent Application Publication No. 2014 / 0238592, the contents of which are incorporated by reference in their entirety.

[0045] The transfer vector 150 indicates the direction of movement of the discrete component 102 during the release of the discrete component 102 from the support 110, and points towards the final placement of the discrete component 102 on the target substrate 130. The direction of the transfer vector 150 is a function of the position of the laser beam pattern 116 relative to the discrete component 102. When the incident laser beam pattern 116 is centered relative to the discrete component 102 as shown in FIGS. 1A and 1B, the resulting blister 118 (e.g., a single blister or a multiple blister pattern) is also centered relative to the discrete component 112, and the transfer vector 150 (referred to as the normal transfer vector) is perpendicular to the surface of the dynamic release structure 112. As a result, the discrete component 102 lands on the target substrate 130 at a position directly below the position of the discrete component 102 in the discrete component assembly 108.

[0046] The objective of the laser assisted transfer process may be to transfer the discrete component 102 to a specific target location 140 on the target substrate 130. The target location 140 may be a location on the target substrate 130 where the center of the discrete component 102 is intended to be positioned. For example, if the target substrate 130 is a device substrate such as a printed circuit board, the target location 140 may be a location on the target substrate 130 where an interconnect element, such as a bond pad, will be aligned with an interconnect element on the discrete component 102.

[0047] To align a target location 140 on the target substrate 130 with a location of a discrete component 102 in the discrete component assembly 108, the target substrate 130 may be moved relative to the discrete component assembly 108, or the discrete component assembly 108 may be moved relative to the target substrate 130, or both. The relative movement may be implemented using a mechanical adjustment mechanism, such as a linear translation stage, an actuator, or other suitable mechanical adjustment device. For example, the coordinates in a global xy coordinate system of a center of a discrete component 102 in the discrete component assembly 108 may be adjusted to line up with the global xy coordinates of the target location.

[0048] Mechanical adjustment of the relative alignment of the discrete component assembly 108 and the target substrate 130 is subject to errors, such as deviations along the x-axis, the y-axis, or both, possibly resulting from, for example, inaccuracies in the mechanical adjustment devices. Such errors may result in alignment errors between the x-y coordinates of the discrete components 102 and the x-y coordinates of the target locations 140. Other error sources may also contribute to alignment errors between the x-y coordinates of the discrete components 102 and the x-y coordinates of the target locations 140, in addition to or instead of, for example, errors due to mechanical adjustment. For example, differences between the expected position of the discrete components 102 in the discrete component assembly 108 and the actual position of the discrete components 102 in the discrete component assembly 108 may occur during pre-processing, such as during singulation of the discrete components 102 or during placement of the discrete components 102 on the support 110. If the x,y coordinate alignment between the target location 140 and the location of the discrete component 102 within the discrete component assembly 108 is based on the expected location of the discrete component 108, this difference resulting from pre-processing may result in an alignment error between the x,y coordinates of the discrete component 102 and the x,y coordinates of the target location 140. In some examples, such alignment error may be addressed, at least in part, by fine mechanical adjustment of the relative positions of the target substrate 130 and the discrete component assembly 108 prior to initiation of the laser-assisted transfer process.

[0049] 2A-2C, in some examples, the beam pattern 116 can be offset from the center of the discrete component 102 during the laser assisted transfer process, i.e., the beam pattern 116 is incident on the discrete component at a location that is offset from the center of the discrete component. The offset of the beam pattern 116 can be used, at least in part, to compensate for alignment errors between the x,y coordinates of the discrete component 102 and the x,y coordinates of the target location 140.

[0050] When the beam pattern 116 is offset (e.g., not centered) from the discrete component 102, the resulting blister 118 (e.g., single blister or multiple blister pattern) is also not centered with respect to the discrete component 102. This offset causes the transfer vector 150 (referred to as the tilted transfer vector) to deviate from the surface normal by an angle α. The angle α of the transfer vector 150 is related to the magnitude d and direction of the offset (sometimes referred to as the beam offset) of the beam pattern 116 from the center of the discrete component 102. In the case of a normal transfer vector (e.g., as shown in FIG. 1A), the discrete component 102 will be transferred to a target location 140 that is directly below the location of the discrete component 102 in the discrete component assembly. The tilted transfer vector transfers the discrete component 102 to an offset location 134 on the target substrate 130 that is offset with respect to the target location 140.

[0051] 2B and 2C are top views of a discrete component assembly 108 with a discrete component 102 attached, with the beam pattern 116 offset from the center of the discrete component 102. A dashed box 132 indicates the position of the discrete component 102 on the target substrate 130 after transfer, with the center of the dashed box being on an offset location 134. The distance between the target location 140 and the offset location 134 is the position error ε induced by the offset of the beam pattern 116. The position error ε may be along the x-axis as shown in FIG. 2B, along the y-axis (not shown), or may have components along each of the x-axis and y-axis as shown in FIG. 2C.

[0052] The magnitude of the position error ε is related to the magnitude d of the beam offset and the height g of the gap 135 between the bottom surface of the discrete component 102 in the discrete component assembly 108 and the top surface of the target substrate 130. For example, the magnitude d of the beam offset can have a direct linear relationship with the position error ε given the gap height g. The spatial direction in which the loading vector 150 points is opposite to the direction of the beam offset. For example, in FIG. 2A, the beam pattern 116 is offset to the left of the drawing, while the loading vector 150 points towards the right of the drawing.

[0053] As discussed above, alignment errors may occur between the x-y coordinates of the discrete component 102 and the x-y coordinates of the target location 140. To compensate for such errors, the beam pattern 116 may be intentionally offset such that the position error ε corresponds to the alignment error between the x-y coordinates of the discrete component 102 and the x-y coordinates of the target location 140. Compensating for the alignment error by introducing an offset into the beam pattern 116 may aid in achieving accurate alignment in the laser-assisted transfer process and may enable alignment to be achieved quickly, thereby facilitating a high throughput transfer process.

[0054] 3, in a laser-assisted transfer system 300, an alignment error α (not shown) may be between the x-y coordinates of the discrete component 102 and the x-y coordinates of the target location 140. The alignment error α may be due to, for example, inaccuracies in the mechanical alignment mechanism, positioning errors of the discrete component 102 on the support 110, or other causes. To compensate for the alignment error, the beam pattern 116 may be offset to produce a tilted transfer vector 150 resulting in a position error ε equal to the alignment error α. Thus, the discrete component 102 is directly transferred to its target location 140 despite the alignment error α between the x-y coordinates of the discrete component 102 in the discrete component assembly 108 and the x-y coordinates of the target location 140.

[0055] The laser assisted transfer system 300 includes a light source 302, such as a laser. A light beam 306 from the light source 302 can be incident on one or more optical elements 304, such as a lens or a diffractive optical element (e.g., a beam splitter), which can form a beam pattern 116 from the light beam 306 from the light source 302. The beam pattern 116 can be a single light beam (as shown) or can include multiple beamlets, which are light beams that are smaller in size (e.g., diameter) than the light beam 306.

[0056] An optical detector 310, such as a camera, is positioned to capture an image of the relative position of the discrete component 102 and the target location 140 on the target substrate 130. The image 312 from the optical detector 310 is provided to a computing system 314 including one or more processors coupled to a memory and configured to process the image 312 to determine the alignment error α. For example, the computing system 314 may implement a machine vision approach to identify the discrete component 102 and the target location 140 and to determine the magnitude and direction of the separation between the center of the discrete component 102 and the target location 140.

[0057] Based on the alignment error α, the computing system 314 determines a beam offset characteristic for the beam pattern 116 such that the discrete component 102 is transferred to the target location 140 when the beam pattern 116 is offset by the beam offset characteristic. The beam offset characteristic indicates a magnitude d of the beam offset and a direction of the beam offset. In some examples, the beam offset characteristic can indicate other parameters, such as a number or arrangement of beamlets in the beam pattern 116.

[0058] The computing system 314 provides a signal 316 indicative of the beam offset characteristic to the laser assisted transfer system 300 to control one or more optical elements 318 to adjust the position of the beam pattern 116 according to the beam offset characteristic. In one example, the one or more optical elements 318 can be a scanner, such as a galvanometer laser scanner, that can adjust the position of the beam pattern 116.

[0059] By implementing the beam offset feature through the scanner, compensation of alignment errors is achieved quickly, thereby allowing for shorter transfer times per discrete component, thus increasing the throughput of the laser assisted transfer process.

[0060] 4, in some examples, a target substrate 430 that receives the discrete components 102 in a laser-assisted transfer process can include a coating that includes a die capture material 402 disposed on its surface. The die capture material (DCM) 402 can be a material that receives the discrete components as they are transferred from a carrier substrate and holds them in a target position while reducing post-transfer movement of the discrete components on the target substrate. The process of receiving the discrete components and holding them in a target position is sometimes referred to as capturing the discrete components. The DCM can be a viscous fluid that slows down the velocity of the discrete components 102 as they are cast onto the coating 402.

[0061] In some cases, the discrete components 102 may "float" within the coating after being captured by the DCM of the coating 402. Floating of the discrete components 102 is a slow displacement of the discrete components 102 any distance from their original placement position. Floating may be caused by surface tension, thermal drift, fluid leveling after component impact, Brownian motion, or other factors, or a combination of factors. Floating of received discrete components may be undesirable, for example, in that the floating may contribute to an overall position error in the transfer process. For example, floating components may cause position errors to exceed a predefined criterion, thereby rendering the placed discrete components unusable for their intended application. In some examples, such as applications involving closely spaced discrete components, floating components may cause the incoming discrete components to come into contact with existing discrete components, thereby adding additional position errors to the existing discrete components, or causing other undesirable characteristics in the set of discrete components.

[0062] In some examples, the rheological properties of the DCM of coating 402 can be tailored to a particular application, such as a discrete component of a particular size or mass, to increase the accuracy and reliability of the laser-assisted transfer process.

[0063] 5A and 5B, in some examples, a target substrate 530 includes a coating 502 including a Bingham fluid disposed on a surface of a substrate 504. A Bingham fluid is a viscoplastic material that behaves like a rigid body at low stresses, but flows like a viscous fluid above its yield stress. A Bingham fluid may also be referred to as a Bingham liquid, a Bingham plastic body, a structured liquid, or a viscoplastic solid. A Bingham fluid may include a gel (e.g., an alcogel, a hydrogel, an organogel, or other type of gel), a synthetic polymer, an adhesive paste, a flux, a solder paste, a suspension, a conductive or semiconductive ink (e.g., an organic ink), a chemically inert material, or a combination of any two or more thereof.

[0064] When the discrete components 102 are transferred to the target substrate 530 in the laser-assisted transfer process, the discrete components 102 are captured by the coating 502 containing the Bingham fluid and are either partially embedded in the coating (as shown in FIG. 5B) or disposed on the top surface of the coating. Partially embedded means that the bottom surface 136 of the discrete components 102 is below the top surface 506 of the coating 502 and the top surface 508 of the discrete components 102 is above the top surface 506 of the coating 502. Once the discrete components 102 are partially embedded in the coating 502, the rheological properties of the Bingham fluid prevent the discrete components 102 from naturally shifting or floating out of their position. Thus, the accuracy and precision of component placement may be enhanced by using a coating containing a Bingham fluid as a die capture material.

[0065] The substrate 504 may be a tape, such as a wafer tape. The substrate 504 may be a rigid substrate, such as a glass substrate or a semiconductor substrate. The substrate 504 may be a device substrate, such as a printed circuit board (PCB). In some examples, the substrate 504 may be a semiconducting substrate, such as a semiconductor wafer or a portion thereof, intended for use in a multi-chip stack.

[0066] If the substrate 504 is a device substrate, the coating 502 containing the Bingham fluid can facilitate interconnection of the discrete components 102 with electrical contacts, such as bond pads, on the substrate 504. For example, the coating 502 containing the Bingham fluid can be a conductive paste, such as a conductive solder paste. Referring to FIG. 5C, in some examples, after the laser-assisted transfer of the discrete components 102, a processing step can be performed to contact the bottom surface 136 of the discrete components 102 with electrical contacts on the substrate 504. In one example, the coating 502 containing the Bingham fluid can be a solder flux that is removed during a soldering process. In one example, pressure is applied to the assembly of the substrate 504, including the discrete components 102 partially embedded in the coating 502, such as from a thermode, thereby forcing the Bingham fluid out from between the discrete components 102 and the substrate 504, thereby enabling electrical contact between the discrete components 102 and the substrate 504.

[0067] Although several embodiments have been described, it will be understood that various modifications may be made without departing from the spirit and scope of the present disclosure. For example, some of the steps described above may be order independent and may be performed in an order different from that described.

[0068] Other embodiments are within the scope of the following claims. [Explanation of symbols]

[0069] 100 Parts Transfer System 102 Discrete Components 108 Discrete Component Assembly 110 Support 112 Dynamic peeling structure 116 Beam Pattern 118 Blister 130 Target Board 132 dashed frame 134 Offset Position 135 Gap 136 Bottom 140 Target Location 150 Transfer Vector 300 Laser Assisted Transfer System 302 Light source 304 Optical elements 306 Light Beam 310 Photodetector 312 images 314 Computing Systems 316 Signal 318 Optical Elements 402 Die capture materials, coatings 430 target board 502 Coating 504 Substrate 506 Top surface 508 Top surface 530 target board

Claims

1. A substrate; a coating comprising a Bingham fluid disposed on a surface of the substrate; a discrete component partially embedded within the coating containing the Bingham fluid; Equipped with a bottom surface of the discrete component is below a top surface of the coating and a top surface of the discrete component is above the top surface of the coating; The assembly, wherein the coating is a die capture material configured to receive the discrete components as they are transferred from a carrier substrate and hold the discrete components in a target position.

2. 10. The assembly of claim 1, wherein the Bingham fluid comprises one or more of a flux, a solder paste, a conductive ink, a semi-conductive ink, and a gel.

3. The assembly of claim 1 or 2, wherein the discrete components include light emitting diodes (LEDs).

4. The assembly of claim 1 , wherein the substrate comprises a semiconductor wafer.

5. The assembly of claim 1 , wherein the substrate comprises a tape.

6. The assembly of claim 1 , wherein the substrate comprises a rigid substrate.

7. The assembly of claim 1 , wherein the substrate comprises a printed circuit board.

8. A substrate; a coating comprising a Bingham fluid disposed on the substrate, the coating having a first surface in contact with the substrate; Equipped with the coating is configured such that when the discrete components are cast on a second surface of the coating opposite the first surface, the discrete components are partially embedded within the coating; a bottom surface of the discrete component is below a top surface of the coating and a top surface of the discrete component is above the top surface of the coating; The assembly, wherein the coating is a die capture material configured to receive the discrete components as they are transferred from a carrier substrate and hold the discrete components in a target position.

9. 9. The assembly of claim 8, wherein the Bingham fluid comprises one or more of a flux, a solder paste, a conductive ink, a semi-conductive ink, and a gel.

10. 10. The assembly of claim 8 or 9, wherein the Bingham fluid comprises a conductive paste.

11. The assembly of claim 8 , wherein the substrate comprises a printed circuit board.

12. irradiating a dynamic release structure disposed on a carrier and having a discrete component attached thereto, whereby the discrete component is released from the carrier; and receiving the exfoliated discrete components in or on a coating comprising a Bingham fluid disposed on a surface of a substrate; Including, the discrete components are partially embedded within the coating that includes the Bingham fluid; a bottom surface of the discrete component is below a top surface of the coating and a top surface of the discrete component is above the top surface of the coating; The method, wherein the coating is a die capture material configured to receive the discrete component as it is transferred from the carrier and hold the discrete component in a target position.

13. The method of claim 12 , wherein the step of irradiating the dynamic release structure comprises irradiating the dynamic release structure with laser energy.

14. The method of claim 12 or 13, wherein the irradiating step induces ablation of at least a portion of the dynamic release structure.

15. A method according to any one of claims 12 to 14, wherein the irradiating step results in the formation of one or more blisters, the one or more blisters exerting a mechanical force on the discrete components sufficient to overcome adhesion between the discrete components and the dynamic release structure.

16. 16. The method of claim 12, wherein the step of irradiating the dynamic release structure comprises irradiating the dynamic release structure through the carrier.

17. 17. The method of claim 12, wherein the discrete components include LEDs.

18. The method of any one of claims 12 to 17, wherein the substrate comprises a tape.

19. The method of any one of claims 12 to 18, wherein the substrate comprises a printed circuit board.

20. disposing a coating comprising a Bingham fluid on a surface of a target substrate; receiving in or on said coating a discrete component transferred from a carrier by a laser assisted transfer process; Including, the discrete components are partially embedded within the coating that includes the Bingham fluid; a bottom surface of the discrete component is below a top surface of the coating and a top surface of the discrete component is above the top surface of the coating; The method, wherein the coating is a die capture material configured to receive the discrete component as it is transferred from the carrier and hold the discrete component in a target position.

21. The method of claim 20, wherein the step of disposing the coating containing the Bingham fluid includes disposing one or more of flux, solder paste, conductive ink, semi-conductive ink, and gel on the surface of the target substrate.

Images