LED lamp panel repairing equipment

Abstract

The utility model provides LED lamp panel repairing equipment which is used for repairing an LED lamp panel, the LED lamp panel comprises a circuit board and at least one bad lamp bead located on the circuit board, and the LED lamp panel repairing equipment comprises a feeding assembly, a removing and die bonding assembly, a tin dispensing assembly, a surface mounting assembly and a lightening detection assembly. The feeding assembly is used for obtaining position information of bad lamp beads and bearing and conveying LED lamp panels. The rejecting and die bonding assembly is used for heating and desoldering the bad lamp beads and rejecting the bad lamp beads and the molten solder so as to expose the bonding pads corresponding to the bad lamp beads; the tin dispensing assembly is used for dispensing solder paste on the bonding pad; the surface mounting assembly is used for attaching good lamp beads to the solder paste; the laser is further used for heating and die bonding of the good lamp beads so that the good lamp beads can be installed on the circuit board. The lightening detection assembly is used for conducting lightening detection on the circuit board provided with the good lamp beads. The problem that the production efficiency of the lamp panel cannot be improved when the existing lamp panel repairing equipment is used for repairing the lamp panel is solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an LED light board repair device. Background Art

[0002] At present, small-pitch Mini-LED light boards are increasingly used in the market. Due to the small spacing between LED lamp beads, the difficulty of the production process also increases. During the production process, it is easy for the lamp bead chips to be damaged, offset, missing, or leaking during transportation, which will cause the lamp board to have abnormal display problems such as dead lights, dark lights, bright lights, string lights, and color cast after lighting. Therefore, it is necessary to repair such lamp boards with defective lamp beads. The current repair methods mainly include manual repair and equipment repair. Manual repair mainly removes the defective lamp beads on the lamp board manually and replaces new good lamp beads accordingly, but it is easy to cause low repair efficiency of the lamp board; and the current equipment repair mainly uses the repair machine to automatically complete the removal of defective lamp beads and the patching of good lamp beads. Although it can improve the repair efficiency, it cannot determine whether there are still defective lamp beads in the lamp board after repair, and it needs to be checked manually, resulting in the inability to improve the production efficiency of the lamp board. Utility Model Content

[0003] The embodiment of the present application provides an LED lamp board repair device, which solves the problem that the existing lamp board repair equipment cannot improve the lamp board production efficiency when performing lamp board repair.

[0004] The utility model is implemented as follows: an LED lamp board repair device is used to repair an LED lamp board, wherein the LED lamp board includes a circuit board and at least one defective lamp bead on the circuit board, the LED lamp board repair device includes a feeding component, a crystal removal component, a tinning component, a patch component and a lighting detection component, the feeding component includes a second conveying device and a scanner, the scanner is used to read the code on the LED lamp board to obtain the position information of the defective lamp bead, the second conveying device is used to carry and transport the LED lamp board; a die-bonding removal component comprises a laser and a die-bonding knife, the laser is used to heat and desolder the defective lamp beads, the die-bonding knife is used to remove the defective lamp beads and the melted solder so that the pads corresponding to the defective lamp beads are exposed; a tinning component is used to print solder paste on the pads; a patch component is used to attach good lamp beads to the solder paste; the laser is also used to heat and bond the good lamp beads so as to install the good lamp beads on the circuit board; a lighting detection component is used to perform lighting detection on the circuit board on which the good lamp beads are installed.

[0005] In one of the embodiments, the lighting detection component includes a plug-in mechanism and an optical detection device; the plug-in mechanism is used to plug into the circuit board so that the circuit board is powered on to light up the good lamp beads on the circuit board; the optical detection device is used to collect optical information from the powered circuit board to detect whether all the good lamp beads on the circuit board are lit normally.

[0006] In one of the embodiments, the LED lamp board rework equipment also includes a transplanting component, which is used to move the circuit board to the second conveying device when the lighting detection component detects that some of the good lamp beads on the circuit board are abnormally lit, and is also used to move the circuit board out when the lighting detection component detects that all of the good lamp beads on the circuit board are normally lit.

[0007] In one embodiment, the transplanting assembly includes an X-axis motion module 1, a Z-axis motion module 1 connected to the X-axis motion module 1, and a clamping jaw assembly connected to the Z-axis motion module 1;

[0008] The X-axis motion module 1 is used to drive the Z-axis motion module 1 to move in the X-axis direction to drive the clamping assembly to move between the feeding assembly and the lighting detection assembly. The Z-axis motion module 1 is used to drive the clamping assembly to move in the Z-axis direction. The clamping assembly is used to clamp or release the circuit board.

[0009] In one embodiment, the clamp assembly includes a support rod and a clamp and a clamp driving device arranged on the support rod; the support rod is connected to the Z-axis motion module 1, the clamp is located above the circuit board, and the clamp driving device is used to drive the clamp to contract or open to clamp or release the circuit board.

[0010] In one embodiment, the lighting detection component also includes a first conveying device, a lamp board detection sensor, a blocking cylinder and a top positioning plate, wherein the first conveying device is used to carry the circuit board on which the qualified lamp beads are installed; the lamp board detection sensor is used to detect whether the circuit board exists on the first conveying device; the blocking cylinder is used to extend the piston rod of the blocking cylinder when the lamp board detection sensor detects the circuit board, so as to block the circuit board between the first end and the second end of the first conveying device; the top positioning plate is arranged on the top surface of the first conveying device.

[0011] In one embodiment, the lighting detection component also includes a side clamping component and a lifting and fixing component. The side clamping component is arranged on either side of the first conveying device along its conveying direction, and is used to apply pressure to the side of the circuit board to limit the movement of the circuit board in the Y-axis direction; the lifting and fixing component is used to clamp and fix the circuit board between the top positioning plate and the lifting and fixing component by lifting, so as to limit the movement of the circuit board in the Z-axis direction.

[0012] In one embodiment, the top positioning plate is detachably connected to the top surface of the first conveying device.

[0013] In one of the embodiments, the lighting detection component further includes a track telescopic cylinder, and the track telescopic cylinder is used to adjust the width of the first conveying device to accommodate circuit boards of different specifications.

[0014] In one embodiment, the LED light board rework equipment also includes a rework platform assembly, which is used to move the LED light board to a rejection position for the rejection and bonding assembly to perform a rejection operation or a bonding operation; the rework platform assembly is also used to move the LED light board to a tinning position for the tinning assembly to perform a tinning operation, and for the SMD assembly to perform a SMD operation; the second conveying device is specifically used to carry the LED light board and transport the LED light board to the rework platform assembly.

[0015] In one of the embodiments, the rework platform assembly is also used to rotate the LED lamp board by 90° when the arrangement direction of the lamp beads on the LED lamp board is inconsistent with the direction of the laser spot emitted by the laser.

[0016] In one embodiment, the LED lamp panel rework equipment further includes a mounting assembly, the mounting assembly includes a mounting platform and a mounting frame provided on the mounting platform, the mounting platform is used to mount the lighting detection assembly, the rework platform assembly and the feeding assembly arranged in sequence along the X-axis direction of the mounting platform, and the mounting frame is used to mount the die-removing and bonding assembly, the tinning assembly and the patch assembly;

[0017] The mounting frame is provided with a slide rail extending along the X-axis direction, the tinning assembly and the patch assembly are slidably connected to the slide rail, and the die-bonding removal assembly is located between the tinning assembly and the patch assembly.

[0018] In one embodiment, the patch assembly includes a patch nozzle and a Z-axis motion module 2 for driving the patch nozzle to move in the Z-axis direction;

[0019] The LED lamp panel rework equipment also includes a wafer assembly, which includes a wafer tray and a ejector assembly. The wafer tray is used to place the good lamp beads, and the ejector assembly is used to eject the good lamp beads from the wafer tray for the patch nozzle to absorb.

[0020] In one embodiment, the patch component also includes a positioning vision component, a monitoring device and an R-axis motion module 1. The positioning vision component is used to obtain the relative position information between the patch nozzle and the qualified lamp beads on the wafer disk and correct the position of the patch nozzle; the monitoring device is used to monitor the angle information of the qualified lamp beads sucked by the patch nozzle and the positive and negative pole position information of the qualified lamp beads; the R-axis motion module 1 is used to drive the patch nozzle to rotate on a horizontal plane so that the angle of the qualified lamp beads sucked by the patch nozzle can be corrected.

[0021] In one embodiment, the patch assembly further includes a flow meter and a cleaning brush assembly, the flow meter being connected to the patch nozzle for detecting the air flow of the patch nozzle to determine whether the patch nozzle has sucked up the good lamp bead and whether the good lamp bead is attached to the solder paste;

[0022] The cleaning brush assembly includes a collecting groove and a brush arranged at the groove of the collecting groove. The brush is used to brush the good lamp beads sucked by the patch suction nozzle off the good lamp beads from the patch suction nozzle and collect them into the collecting groove when the good lamp beads sucked by the patch suction nozzle fail.

[0023] The beneficial effects of the LED light board rework equipment provided by the present application are: compared with the prior art, the present application includes a removal and bonding component, a tinning component, a patch component and a lighting detection component, which can sequentially complete the removal of defective lamp beads, solder paste printing, patch and bonding of good lamp beads, and lighting detection of the reworked LED light board and other operations, replacing manual labor to achieve automated rework of LED light boards, thereby improving rework efficiency. In addition, combining the rework operation of LED lamps and the lighting detection after rework can make the production of LED lamps more convenient and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the LED lamp board repair equipment provided in the embodiment of the present application;

[0025] Figure 2 is a schematic diagram of the structure of the feed assembly;

[0026] Figure 3 It is a schematic diagram of the structure of removing the die-bonding component;

[0027] Figure 4 It is a structural schematic diagram of the lighting detection component;

[0028] Figure 5 is a schematic diagram of the structure of the transplanting assembly;

[0029] Figure 6 is a schematic diagram of the structure of the rework platform assembly;

[0030] Figure 7 It is a schematic diagram of the structure of the patch component;

[0031] Figure 8 It is a schematic diagram of the structure of a wafer assembly.

[0032] Reference numerals: 100, LED light board; 101, circuit board; 200, mounting assembly; 201, mounting platform; 202, mounting frame; 2022, slide rail;

[0033] 1. Remove the die-bonding components; 11. Laser; 12. Knife; 13. CCD camera for removal; 14. Laser rangefinder; 15. Monitoring equipment; 2. Tinning components;

[0034] 3. Patch assembly; 31. Patch nozzle; 32. Z-axis motion module 2; 33. Positioning vision assembly; 34. Monitoring equipment; 35. R-axis motion module 1; 36. Flow meter; 37. Cleaning brush assembly; 371. Collection tank; 372. Brush;

[0035] 4. Lighting detection assembly; 41. Insertion mechanism; 42. Optical detection equipment; 421. Gantry; 422. Y-axis guide rail; 423. Z-axis guide rail; 43. First conveyor; 44. Light board detection sensor; 45. Blocking cylinder; 46. Side clamping assembly; 47. Top positioning plate; 48. Lifting and fixing assembly; 49. Track telescopic cylinder;

[0036] 5. Rework platform assembly; 51. X-axis motion module 2; 52. Y-axis motion module 1; 53. Drag chain 1; 54. Sheet belt conveyor line 1; 55. R-axis motion module 2;

[0037] 6. Feeding assembly; 61. Second conveying device; 62. Barcode scanner;

[0038] 7. Transplanting assembly; 71. X-axis motion module 1; 72. Z-axis motion module 1; 73. Clamping jaw assembly; 731. Support rod; 732. Clamping jaw; 733. Clamping jaw driving device;

[0039] 8. Wafer assembly; 81. Wafer plate; 82. Ejector pin assembly; 83. X-axis motion module three; 84. Y-axis motion module two; 85. Rotating platform; 86. Wafer rotation motor. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0041] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0042] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0044] It should also be noted that, in the embodiments of the present application, the same figure mark is used to represent the same component or the same part. For the same parts in the embodiments of the present application, the figure may only mark one of the parts or components as an example. It should be understood that the figure mark also applies to other identical parts or components.

[0045] The embodiment of the present application provides an LED lamp board repair device, which solves the problem that the existing lamp board repair equipment cannot improve the lamp board production efficiency when repairing the lamp board.

[0046] Figure 1 Schematic diagram of the structure of the LED lamp board repair equipment provided in the embodiment of the present application. The repair equipment can repair the LED lamp board 100 with defective lamp beads, for example, Figure 1The LED light board 100 in the repair process includes a circuit board 101 and at least one defective lamp bead (or abnormal lamp bead) located on the circuit board 101. The circuit board 101 may be, for example, a printed circuit board (PCB), but is not limited thereto; the lamp bead may be, for example, a sub-millimeter light-emitting diode (MiniLED) or any other type of LED lamp bead, but is not limited thereto. Figure 1 As shown, the LED lamp board rework equipment includes a feeding component 6, a die-bonding removal component 1, a tinning component 2, a patch component 3 and a lighting detection component 4.

[0047] refer to Figure 2 The feeding assembly 6 includes a second conveying device 61 and a barcode scanner 62. The barcode scanner 62 is used to read the code (such as a QR code or a barcode) on the LED light board 100. The operation control can read back the comma-separated values ​​(CSV) data in the manufacturing execution system (MES) through the code information to obtain the location information or coordinate information of the defective lamp beads, so as to facilitate the subsequent repair of the LED light board 100. The second conveying device 61 is used to carry and transport the LED light board 100. After the LED light board 100 is placed on the second conveying device 61, the barcode scanner 62 will read the code on the LED light board 100 to obtain the location information of the defective lamp beads on the LED light board 100. The code can be, for example, a QR code or a barcode attached to the LED light board 100, but is not limited to this.

[0048] refer to Figure 3 The die-bonding component 1 includes a laser 11 and a picker 12. The laser 11 is used to heat and desolder the defective lamp beads, for example, to heat and desolder the welding part between the defective lamp beads and the pads, so as to facilitate the defective lamp beads to be separated from the pads. The picker 12 is used to remove the defective lamp beads and the melted solder so that the pads corresponding to the defective lamp beads are exposed, so as to facilitate the subsequent addition of new good lamp beads.

[0049] The tinning component 2 is used to dip the solder paste and print the solder paste on the pad; the patch component 3 is used to attach the good lamp beads to the solder paste, that is, to the solder pad. The removal and solidification component 1 is also used to perform solidification operations. The laser 11 of the removal and solidification component 1 is also used to heat and solidify the good lamp beads, that is, to heat the solder paste so that the internal flux and other chemical substances evaporate to achieve solidification, so as to install and fix the good lamp beads on the pad, that is, to install and fix them on the circuit board 101. In other words, the laser 11 can also be reused to heat and solidify the good lamp beads without the need to set up additional heating devices, which is conducive to reducing the implementation cost of LED lamp board rework equipment. The lighting detection component 4 is used to perform lighting detection on the circuit board 101 with good lamp beads installed, so as to determine whether there are still bad lamp beads on the LED lamp board 100 after rework, so as to determine whether rework is needed.

[0050] The LED lamp board rework equipment provided in the embodiment of the present application includes a feeding component 6, a removal and solid crystal component 1, a tinning component 2, a patch component 3 and a lighting detection component 4, which can sequentially complete the operations of feeding the LED lamp board 100, removing defective lamp beads, solder paste printing, patching of good lamp beads, solid crystal of good lamp beads and lighting detection of the repaired LED lamp board 100, etc., and can replace manpower to realize automatic rework of the LED lamp board 100, thereby improving the rework efficiency of the LED lamp board 100.

[0051] The chip-bonding component 1 in the present application includes a laser 11 and a chip-bonding knife 12. The laser 11 can emit laser light to heat and desolder the defective lamp beads on the circuit board 101, and the chip-bonding knife 12 can remove the desoldered defective lamp beads and the melted solder. The purpose of removing the lamp beads is achieved through the cooperation between the laser 11 and the chip-bonding knife 12. Compared with traditional physical violence methods, the chip-bonding component 1 will not contact the circuit board 101 and the soldering pad during the entire removal process, will not cause damage to the circuit board 101 and the soldering pad, and will not leave lamp bead fragments or solder on the circuit board 101. It has a good lamp bead removal effect and can lay a good foundation for subsequent tinning, patch and chip bonding steps. In addition, the laser 11 in the embodiment of the present application is also used to heat and bond the good lamp beads, so there is no need to set up other heating devices, which is conducive to reducing the implementation cost of the rework equipment.

[0052] Before the laser 11 is used to emit laser light to heat and desolder the defective lamp beads on the circuit board 101, the laser spot size can be set according to the previous simulation results to avoid accidentally damaging the good lamp beads in the adjacent position during the heating process. In the process of removing the lamp beads, the distance between the laser 11 and the circuit board 101 can be controlled so that the focal position of the laser emitted by the laser 11 is located on the pad corresponding to the defective lamp bead, thereby achieving a good heating effect. The solder on the pad is melted by the heat, so that the defective lamp bead can be desoldered from the pad.

[0053] Optionally, the waveform of the laser emitted by the laser 11 can be a flat-top waveform, that is, the laser 11 is used to emit a laser with a flat-top waveform to heat and desolder the defective lamp beads. The laser adopts a flat-top waveform, which has a high degree of homogenization. For example, the flat-top area is 365x115um, and the homogenization degree can reach more than 90%. It can ensure that the solder pad and the lamp beads are heated evenly within the laser spot range, which provides good conditions for desoldering and is conducive to improving the lamp bead removal effect.

[0054] Furthermore, the die-bonding component 1 provided in the embodiment of the present application further includes a temperature sensor, which is used to measure the temperature at the focal position of the laser 11 when the defective lamp beads are heated and desoldered. By providing a temperature sensor, the heating temperature can be monitored in real time, and the heating temperature can be reliably controlled within a reasonable temperature range, effectively avoiding the adverse effects of too low or too high temperature on the rejection effect (desoldering).

[0055] Optionally, the temperature sensor can be a coaxial temperature probe. The coaxial temperature measurement can monitor in real time whether the desoldering temperature is kept within the required temperature range. At the same time, it has a temperature measurement response time of up to 200us, which can effectively avoid the abnormal influence of too low or too high temperature on the desoldering effect.

[0056] For further reference, Figure 3 The die-bonding component 1 further includes a three-axis manual fine-motion platform and a CCD camera 13 for a rejection position disposed on the three-axis manual fine-motion platform. The CCD camera 13 for a rejection position is used to take a picture of the circuit board 101. The CCD camera 13 for a rejection position can be used to take a picture of the circuit board 101. The position of the CCD camera 13 for a rejection position can be adjusted by the three-axis manual fine-motion platform connected thereto.

[0057] Optionally, a light source is fixedly arranged on the three-axis manual micro-motion platform, and the light source is arranged corresponding to the rejection position CCD camera 13, and the light source is used to provide light for the photographing area of ​​the rejection position CCD camera 13, so as to ensure that the rejection position CCD camera 13 can obtain a clear image. The light source can be an annular structure, and the rejection position CCD camera 13 is arranged inside the annular structure.

[0058] It should be noted that after the circuit board 101 has finished removing the defective lamp beads at the removal position, the tinning component 2 can be used to tin the position where the defective lamp beads were removed, wherein the tinning position and the removal position are at the same position, and the CCD camera 13 at the removal position can be reused to perform Mark point positioning, and the position of the circuit board 101 can be more accurately identified, and the feedback is given to the operation control, and the tinning component 2 is accurately moved to the tinning position to apply solder paste to the position where the defective lamp beads were removed on the circuit board 101. It is worth mentioning that in addition to Mark point positioning, the CCD camera 13 at the removal position also takes pictures to identify the tinning effect on the circuit board 101.

[0059] In some embodiments, reference Figure 3 The die-bonding removal assembly 1 further includes a laser rangefinder 14, which is used to measure the height information of the defective lamp beads. In some cases, the height can be characterized by the distance between the laser rangefinder 14 and the defective lamp beads. The shorter the distance between the two, the higher the defective lamp beads. The height information can be used to determine how far the picker 12 needs to descend to remove the defective lamp beads from the pads without damaging the pads.

[0060] In some embodiments, reference Figure 3 , the solid crystal rejection component 1 also includes a monitoring device 15, for example, it can be a monitoring camera, the monitoring camera can monitor the process of the picker 12 rejecting the defective lamp beads to prevent the picker 12 from accidentally damaging the solder pad. In the process of rejecting the defective lamp beads, the picker 12 can be diverse, with various shapes and tapering, and can be adapted to more products. The process of rejecting the defective lamp beads can also be combined with blowing hot air to extend the curing time of the solder paste and achieve a better rejection effect. In the process of rejecting the defective lamp beads, blowing and suction can be combined near the defective lamp beads to clean and collect the defective lamp beads and solder paste generated in the rejection process. The above process is repeated until all the defective lamp beads are removed, and the rejection process ends.

[0061] refer to Figure 4 The lighting detection component 4 includes a plug-in mechanism 41 and an optical detection device 42; the plug-in mechanism 41 is used to plug into the circuit board 101 so that the circuit board 101 is powered on to light up the qualified lamp beads on the circuit board 101; the optical detection device 42 is used to collect optical information from the powered circuit board 101 to detect whether all the qualified lamp beads on the circuit board 101 are normally lit.

[0062] Among them, all the good lamp beads on the circuit board 101 light up normally means that all the good lamp beads on the circuit board 101 can light up, and the luminous brightness and luminous color of the good lamp beads that light up are all normal. If any of the good lamp beads on the circuit board 101 do not light up normally, it means that not all the good lamp beads on the circuit board 101 light up normally, which means that there are still bad lamp beads on the LED lamp board 100 after repair, and it needs to be repaired again.

[0063] Specifically, the LED lamp board 100 is transferred to the lighting detection component 4 after rework, and the circuit board 101 is aligned with the plug-in mechanism 41. The plug-in mechanism 41 is plugged into the circuit board 101, and the circuit board 101 is powered by the plug-in mechanism 41 so that the good lamp beads on the circuit board 101 are lit. This method of lighting up the good lamp beads is simpler and more convenient, and does not require manual wiring to power on and disconnecting the circuit board 101, thereby improving the lighting detection efficiency of the good lamp beads on the circuit board 101, thereby improving the efficiency of lighting detection after the LED lamp board 100 is reworked.

[0064] After the qualified lamp beads on the circuit board 101 are lit, the optical information of the circuit board 101 is collected by the optical detection device 42. For example, the optical detection device 42 can be an optical camera, which is located above the circuit board 101. The optical camera takes pictures toward the circuit board 101, and determines whether all the qualified lamp beads on the circuit board 101 are lit normally based on the captured images. This can make the lighting detection process of the LED light board 100 simpler, and can automatically complete the lighting of the qualified lamp beads and the detection of whether they are lit normally, thereby improving the rework efficiency of the LED light board 100.

[0065] Specifically, refer to Figure 4 The lighting detection component 4 also includes a gantry 421, a Y-axis guide rail 422 is set on the gantry 421, and a Z-axis guide rail 423 perpendicular to the Y-axis guide rail 422 is slidably set on the Y-axis guide rail 422, and the optical detection device 42 is slidably set on the Z-axis guide rail 423, so that the Z-axis guide rail 423 can move along the Y-axis on the Y-axis guide rail 422, and the optical detection device 42 can move along the Z-axis on the Z-axis guide rail 423, thereby realizing the position adjustment of the optical detection device 42, so as to better capture the image of the circuit board 101.

[0066] In some embodiments, reference Figure 4The lighting detection component 4 also includes a first conveying device 43, a lamp board detection sensor 44, a blocking cylinder 45 and a top positioning plate 47. The first conveying device 43 is used to carry the circuit board 101 installed with good lamp beads; the lamp board detection sensor 44 is used to detect whether there is a circuit board 101 on the first conveying device 43. The lamp board detection sensor 44 can be, for example, an optical fiber sensor or a photoelectric switch; the blocking cylinder 45 is used to extend the piston rod of the blocking cylinder 45 when the lamp board detection sensor 44 detects the circuit board 101, so as to block the circuit board 101 between the first end and the second end of the first conveying device 43; the top positioning plate 47 is arranged on the top surface of the first conveying device 43.

[0067] The first end of the first conveying device 43 is close to the second conveying device 61 , and the second end of the first conveying device 43 is far away from the second conveying device 61 . The direction from the first end to the second end of the first conveying device 43 is the conveying direction of the first conveying device 43 .

[0068] Specifically, after the LED lamp board 100 is repaired, the first conveying device 43 carries the repaired LED lamp board 100 and moves the repaired LED lamp board 100 from the first end to the second end, and a lamp board detection sensor 44 is set at the first end of the first conveying device 43 and / or the middle position between the first end and the second end. During the movement of the repaired LED lamp board 100, the lamp board detection sensor 44 will detect that the circuit board 101 is carried on the first transmission device, that is, it is judged that there is a circuit board 101 that needs to be lit up. At this time, the piston rod of the blocking cylinder 45 is controlled to extend in time to block and limit the circuit board 101. At the same time, a top positioning plate 47 is set on the top surface of the first conveying device 43, so that the circuit board 101 can be limited between the first conveying device 43 and the top positioning plate 47, so that the circuit board 101 will not be lifted up when the insertion mechanism 41 is plugged into the circuit board 101, which is conducive to the insertion mechanism 41 to quickly and accurately plug into the circuit board 101, and improve the lighting detection efficiency of the good lamp beads on the circuit board 101.

[0069] In some embodiments, reference Figure 4 The lighting detection component 4 also includes a side clamping component 46 and a lifting and fixing component 48. The side clamping component 46 is arranged on either side of the first conveying device 43 along its conveying direction, and is used to apply pressure to the side of the circuit board 101 to limit the movement of the circuit board 101 in the Y-axis direction; the lifting and fixing component 48 is used to clamp and fix the circuit board 101 between the top positioning plate 47 and the lifting and fixing component 48 by lifting, so as to limit the movement of the circuit board 101 in the Z-axis direction.

[0070] Through the above settings, the movement of the circuit board 101 can be limited in the Y-axis direction and the Z-axis direction at the same time, so that the circuit board 101 cannot shake, which is conducive to quickly and accurately plugging the insertion mechanism 41 into the circuit board 101, completing the lighting detection of the good lamp beads on the circuit board 101, and thereby improving the lighting detection efficiency of the LED lamp board 100 after repair.

[0071] Specifically, the lifting and fixing assembly 48 may include a bottom lifting cylinder and a bottom lifting positioning plate. When the LED light board 100 is blocked by the piston rod, the bottom lifting cylinder may drive the bottom lifting positioning plate to lift up, so as to fix and clamp the LED light board 100 between the top positioning plate 47 and the bottom lifting positioning plate. After the LED light board 100 is lit and tested, the piston rod of the blocking cylinder 45 may be retracted to facilitate the transfer of the LED light board 100 from the first conveying device 43.

[0072] In some embodiments, the top positioning plate 47 is detachably connected to the top surface of the first conveyor 43. In this way, when the qualified lamp beads on the circuit board 101 need to be removed from the first conveyor 43 after lighting and testing, the top positioning plate 47 can be removed, so that the removal method of the circuit board 101 is not limited to being conveyed to the second end by the first conveyor 43, and other transfer devices can also directly take the circuit board 101 from the first conveyor 43.

[0073] In some embodiments, reference Figure 4 The lighting detection component 4 also includes a track telescopic cylinder 49, which is used to adjust the width of the first conveying device 43 to adapt to circuit boards 101 of different specifications. In this way, the lighting detection component 4 can be used to perform lighting detection on good lamp beads on circuit boards 101 of different specifications, which greatly improves the utilization rate and applicability of the lighting detection component 4.

[0074] It should be noted that the reference Figure 2 The specific structure of the feeding component 6 of the present application is the same as that of the lighting detection component 4. You can refer to the above structural description of the lighting detection component 4, which will not be repeated here.

[0075] In some embodiments, reference Figure 5 The LED lamp board rework equipment also includes a transplanting component 7, which is used to move the circuit board 101 to the second conveying device 61 when the lighting detection component 4 detects that the good lamp beads on the circuit board 101 are abnormally lit, and is also used to move the circuit board 101 out when the lighting detection component 4 detects that all the good lamp beads on the circuit board 101 are normally lit.

[0076] Through the above arrangement, when the lighting detection component 4 detects that there are abnormally lit lamp beads among the good lamp beads on the circuit board 101, that is, the repaired LED lamp board 100 needs to be repaired again, the transfer component 7 is used to directly transfer the circuit board 101 carried by the first conveying device 43 to the second conveying device 61, that is, the transferred circuit board 101 is treated as the circuit board 101 to be repaired and re-fed, rejected, tinned, mounted and solidified. In this way, the repair work and lighting detection work of the LED lamp board 100 can be integrated on the same equipment, and there is no need for manual lighting detection of the repaired LED lamp board 100 separately, and the work of selecting qualified and unqualified LED lamp boards 100 after one repair is also saved, which greatly improves the repair efficiency of the LED lamp board 100.

[0077] When the lighting detection component 4 detects that all the good lamp beads on the circuit board 101 are lit normally, the transplanting component 7 can be used to directly remove the circuit board 101 from the first conveying device 43 and place it at the LED light board 100 collection area. The LED light board 100 placed at the LED light board 100 collection area can be transferred by manual operation and other processes can be carried out.

[0078] It should be noted that when the transfer assembly 7 transfers the circuit board 101 on the first conveyor 43, the top positioning plate 47 can be first removed from the top of the first conveyor 43, and then the side pressing assembly 46 stops applying pressure to the side of the circuit board 101, and the lifting and fixing assembly 48 also descends to cancel the lifting force on the circuit board 101, so that the circuit board 101 can move in the Y-axis direction and the Z-axis direction, which is convenient for the transfer assembly 7 to remove the circuit board 101 from the first conveyor 43. Of course, if the top positioning plate 47 is not removed from the first conveyor 43, the transfer assembly 7 can also remove the circuit board 101 from the first conveyor 43, specifically, the width of the first conveyor 43 is increased by the track telescopic cylinder 49, so that the top positioning plate 47 will not be located directly above the circuit board 101, and will not limit the movement of the circuit board 101 in the Z-axis direction, and will not affect the transfer assembly 7 to remove the circuit board 101 from the first conveyor 43.

[0079] In some embodiments, reference Figure 5 The transplanting component 7 includes an X-axis motion module 71, a Z-axis motion module 72 connected to the X-axis motion module 71, and a clamping claw component 73 connected to the Z-axis motion module 72; the X-axis motion module 71 is used to drive the Z-axis motion module 72 to move in the X-axis direction to drive the clamping claw component 73 to move between the feeding component 6 and the lighting detection component 4, the Z-axis motion module 72 is used to drive the clamping claw component 73 to move in the Z-axis direction, and the clamping claw component 73 is used to clamp or release the circuit board 101.

[0080] Specifically, the process of the transplanting component 7 transferring the circuit board 101 is as follows: the clamping assembly 73 clamps the circuit board 101, the Z-axis motion module 72 drives the clamping assembly 73 to move in the Z-axis direction, so that the circuit board 101 clamped by the clamping assembly 73 leaves the first conveying device 43, the X-axis motion module 71 drives the Z-axis motion module 72 to move in the X-axis direction, so that the clamping assembly 73 moves from the position of the first conveying device 43 to the position of the second conveying device 61, at this time, the Z-axis motion module 72 drives the clamping assembly 73 to move in the Z-axis direction again, so that the circuit board 101 is placed on the second conveying device 61, and the clamping assembly 73 releases the circuit board 101, thereby completing the transfer of the circuit board 101, so that the LED lamp board 100 can be repaired again.

[0081] In some embodiments, reference Figure 5 The clamping jaw assembly 73 includes a support rod 731, a clamping jaw 732 and a clamping jaw driving device 733 arranged on the support rod 731; the support rod 731 is connected to the Z-axis motion module 72, the clamping jaw 732 is located above the circuit board 101, and the clamping jaw driving device 733 is used to drive the clamping jaw 732 to contract or open to clamp or release the circuit board 101.

[0082] Through the above arrangement, the clamping jaws 732 can be freely driven to clamp or release the circuit board 101, and it is applicable to circuit boards 101 of different specifications and sizes.

[0083] refer to Figure 6 The LED light board rework equipment provided in the embodiment of the present application also includes a rework platform assembly 5, which is used to move the LED light board 100 to a rejection position for the rejection and bonding operation of the die bonding assembly 1; the rework platform assembly 5 is also used to move the LED light board 100 to a tinning position for the tinning assembly 2 to perform a tinning operation, and for the patch assembly 3 to perform a patch operation; the second conveying device 61 is specifically used to carry the LED light board 100 and transport the LED light board 100 to the rework platform assembly 5.

[0084] The above arrangement enables the removal operation and the solid crystal operation to be performed at the removal position, so that the laser 11 and the charge-coupled device (CCD) camera and other devices for photographing and positioning the LED light board 100 can be shared when performing the above two operations, which is beneficial to saving the implementation cost of the equipment. In addition, the above arrangement also enables the tinning operation and the patch operation to be performed at the tinning position, in which case a CCD can be shared, which is beneficial to saving equipment costs, and the tinning and patch operations are performed at the same position without moving the LED light board 100 again, which is beneficial to improving the rework accuracy and improving the rework efficiency (the light board needs to be repositioned each time it is moved, which is inefficient and may have positioning errors).

[0085] In some embodiments, the rework platform assembly 5 is also used to rotate the LED light board 100 by 90° when the arrangement direction of the lamp beads on the LED light board 100 is inconsistent with the direction of the laser spot emitted by the laser 11.

[0086] The above arrangement enables the LED lamp board 100 to be repaired to be placed on the second conveying device 61 without being limited in direction, thereby improving the loading efficiency of the LED lamp board 100 to be repaired. After the second conveying device 61 transports the LED lamp board 100 to the rework platform assembly 5, the rework platform assembly 5 will adjust the placement direction of the LED lamp board 100 so that the arrangement direction of the lamp beads on the LED lamp board 100 is consistent with the direction of the laser spot emitted by the laser 11, which is beneficial for the laser emitted by the laser 11 to just irradiate the defective lamp beads on the LED lamp board 100, making it easier to remove the defective lamp beads and to perform crystal bonding on the re-attached good lamp beads.

[0087] refer to Figure 6 The rework platform assembly 5 includes an X-axis motion module 2 51, a Y-axis motion module 1 52, a drag chain 1 53, a sheet-based belt conveyor line body 1 54 and an R-axis motion module 2 55. Among them, the Y-axis motion module 1 52 is installed on the installation platform 201, the X-axis motion module 2 51 is connected to the Y-axis motion module 1 52, the sheet-based belt conveyor line body 1 54 is connected to the X-axis motion module 2 51, and the R-axis motion module 2 55 is connected to the sheet-based belt conveyor line body 1 54. The X-axis motion module 2 51 and the Y-axis motion module 1 52 are used to drive the sheet-based belt conveyor line body 1 54 to move in the XOY plane, the sheet-based belt conveyor line body 1 54 is used to transport the LED light board 100, and the R-axis motion module 2 55 is used to drive the sheet-based belt conveyor line body 1 54 to rotate in the XOY plane. Related cables (routing) can be accommodated in the drag chain 1 53.

[0088] Optionally, the X-axis motion module 2 51 and the Y-axis motion module 1 52 can both be linear motors, for example, iron core linear motors, which have a repeatability accuracy of up to ±2μm, and are equipped with a ±1μm grating ruler to ensure the rework accuracy requirements.

[0089] Optionally, the rework platform assembly 5 may also include a wire width adjustment screw (e.g., a trapezoidal screw), which is used to adjust the width of the sheet base belt conveying wire 54 to accommodate LED light boards 100 of different specifications. Through the above arrangement, the LED light board rework equipment provided by the present application can rework light boards of various sizes and specifications, thereby improving the scope of application of the LED light board rework equipment of the present application.

[0090] The line width adjustment screw can be connected to the adjustment handle, and the operator can operate the line width adjustment screw by rotating the adjustment handle to adjust the width of the sheet base belt conveyor line 54.

[0091] In some embodiments, reference Figure 1 The LED lamp board rework equipment also includes an installation component 200, which includes an installation platform 201 and a mounting frame 202 arranged on the installation platform 201. The installation platform 201 is used to install a lighting detection component 4, a rework platform component 5 and a feeding component 6 arranged in sequence along the X-axis direction of the installation platform 201, and the mounting frame 202 is used to install a removal and bonding component 1, a tinning component 2 and a patch component 3; a slide rail 2022 extending along the X-axis direction is provided on the installation frame 202, and the tinning component 2 and the patch component 3 are slidably connected to the slide rail 2022, and the removal and bonding component 1 is located between the tinning component 2 and the patch component 3.

[0092] Through the above arrangement, the feeding component 6, the lighting detection component 4, the removal and solid crystal component 1, the tinning component 2 and the patch component 3 are all arranged around the rework platform component 5, thereby simplifying the movement process of each component and facilitating each component to operate the LED light board 100. The second conveying device 61 of the feeding component 6 conveys the LED light board 100 to the rework platform component 5, and performs operations such as removal, tinning, patch and solid crystal on the LED light board 100 at the rework position. Finally, the reworked LED light board 100 is conveyed to the lighting detection component 4 for lighting detection. The entire rework process is smoother, and the LED light board 100 does not need to be moved frequently at the rework position, which is beneficial to improving the rework efficiency of the LED light board 100. In addition, the above arrangement also makes the structure of the equipment more compact and reasonable, which is beneficial to reducing the volume of the equipment.

[0093] In some embodiments, the patch component 3 can be applied to the LED light board 100 processing (production) equipment or LED light board repair equipment. For example, the patch component 3 can be connected to the slide rail 2022 of the mounting frame 202 through a driving mechanism. Figure 7 and Figure 8 The chip assembly 3 includes a chip suction nozzle 31 and a Z-axis motion module 2 32 for driving the chip suction nozzle 31 to move in the Z-axis direction; the LED light board rework equipment also includes a wafer assembly 8, the wafer assembly 8 includes a wafer disk 81 and a ejector assembly 82, the wafer disk 81 is used to place good lamp beads, and the ejector assembly 82 is used to eject the good lamp beads from the wafer disk 81 for absorption by the chip suction nozzle 31.

[0094] Through the above settings, the Z-axis motion module 2 32 drives the patch nozzle 31 to move in the Z-axis direction, so that the patch nozzle 31 is close to the good lamp beads on the wafer disk 81. The setting of the ejector assembly 82 can facilitate the good lamp beads to fall off the wafer disk 81, and then facilitate the patch nozzle 31 to absorb the good lamp beads.

[0095] refer to Figure 8 , the wafer assembly 8 also includes an X-axis motion module three 83, a Y-axis motion module two 84, a rotating platform 85 and a wafer rotation motor 86. The rotating platform 85 is installed on the mounting platform 201 through the Y-axis motion module two 84 and the X-axis motion module three 83, and the above two modules are used to drive the rotating platform 85 to move in the XOY plane. There are three wafer disks 81, which are used to place wafers of different colors respectively. The colors of the lamp beads included in the three wafers of different colors can be red, green and blue respectively. The rotating platform 85 is used to drive the wafer disk 81 to rotate under the driving action of the wafer rotation motor 86. Through the CSV file, the operation control logic planning repairs the lamp bead sequence, and the rotating platform 85 drives the wafer disk 81 to rotate through the wafer rotation motor 86 (such as a stepping motor), so that the corresponding wafer is rotated to the working position (i.e., the extraction position of the lamp bead).

[0096] Specifically, the patch nozzle 31 has an opening and can generate negative pressure inside. For example, the patch nozzle 31 can be connected to a vacuum generator. When the patch nozzle 31 is moved to the lamp bead suction position or close to the lamp bead suction position, the vacuum generator starts to work, and negative pressure can be generated inside the patch nozzle 31, so that the lamp bead can be sucked through the opening. In one case, the opening may not be completely closed by the lamp bead at this time, and there may be a gap between the edge of the opening and the lamp bead, that is, the external air can flow through the gap and the patch nozzle 31 to the vacuum generator, so that the inside of the patch nozzle 31 may maintain a small weak airflow. In another case, the lamp bead can completely close the opening of the patch nozzle 31, and the inside of the patch nozzle 31 maintains a negative pressure state without flowing airflow.

[0097] Under the action of the driving mechanism, the patch nozzle 31 that has sucked the lamp bead is moved from the lamp bead suction position along the slide rail 2022 to the patch position, which is the position of the soldering pad where the patch operation is required (i.e. the rejection position or the tinning position). At this time, the vacuum generator is controlled to make the negative pressure inside the patch nozzle 31 disappear or decrease, so that the lamp bead can be detached from the patch nozzle 31, so that the lamp bead is attached to the solder paste on the solder pad, thereby completing the entire patch process for the solder pad.

[0098] Optionally, in other cases, during the patch process, the negative pressure inside the patch nozzle 31 can also remain unchanged, and the negative pressure can always be maintained at a smaller value, so that the lamp bead can be sucked and held above the nozzle opening when it is not in contact with the solder paste. After being attached to the solder paste and during the upward movement of the patch nozzle 31, since the solder paste has a certain viscosity, it can be detached from the patch nozzle 31 and attached to the pad under the adhesion of the solder paste.

[0099] Optionally, the driving mechanism is connected to the patch component 3 in transmission. The driving mechanism here may include any power source such as an electric motor, a motor, a cylinder, and any transmission mechanism such as a guide rail, a slide groove, a gear, a cam, a belt or a mechanical arm, and this application does not limit this.

[0100] In some embodiments, the patch assembly 3 further includes a laser rangefinder 14, which is used to measure the height information of the pad. In some cases, the height can be characterized by the distance between the laser rangefinder 14 and the pad. The shorter the distance between the two, the higher the pad. The height information can be used to determine the stroke of the Z-axis motion module 2 32, that is, to determine how far the Z-axis motion module 2 32 needs to drop to accurately attach the lamp bead to the pad according to the height information.

[0101] In some embodiments, reference Figure 8 The patch component 3 also includes a positioning vision component 33, a monitoring device 34 and an R-axis motion module 35. The positioning vision component 33 is used to obtain the relative position information between the patch nozzle 31 and the qualified lamp beads on the wafer disk 81 and correct the position of the patch nozzle 31; the monitoring device 34 is used to monitor the angle information of the qualified lamp beads sucked by the patch nozzle 31 and the positive and negative pole position information of the qualified lamp beads; the R-axis motion module 35 is used to drive the patch nozzle 31 to rotate on the horizontal plane so that the angle of the qualified lamp beads sucked by the patch nozzle 31 can be corrected.

[0102] Through the above settings, before the Z-axis motion module 2 32 drives the patch nozzle 31 to move in the Z-axis direction to approach the qualified lamp beads, the relative position information between the patch nozzle 31 and the qualified lamp beads on the wafer disk 81 is first obtained through the positioning vision component 33. If the patch nozzle 31 and the qualified lamp beads on the wafer disk 81 are not directly facing each other, then the position of the patch nozzle 31 needs to be corrected to ensure that the Z-axis motion module 2 32 drives the patch nozzle 31 to move in the Z-axis direction to be close to the qualified lamp beads, so as to facilitate the absorption of the qualified lamp beads.

[0103] After the SMD suction nozzle 31 sucks up the good lamp beads, the Z-axis motion module 2 32 will drive the SMD suction nozzle 31 to move upward in the Z-axis direction. In order to avoid the good lamp beads sucked by the SMD suction nozzle 31 being inconsistent with the setting direction of the good lamp beads originally existing on the circuit board 101 after being attached to the solder paste, or the positive and negative poles of the good lamp beads sucked by the SMD suction nozzle 31 being opposite to the positive and negative poles on the pad, resulting in the good lamp beads sucked by the SMD suction nozzle 31 failing to light up after being attached to the solder paste, the monitoring device 34 can be used to monitor the angle information of the good lamp beads sucked by the SMD suction nozzle 31 and the good The positive and negative pole position information of the good lamp beads can be obtained. Once it is found that the angle of the good lamp beads sucked by the SMD suction nozzle 31 is deviated, the SMD suction nozzle 31 can be driven to rotate on the horizontal plane through the R-axis motion module 35 to correct the angle of the good lamp beads sucked by the SMD suction nozzle 31. In this way, the angle of the good lamp beads attached to the solder paste can be consistent with the setting angle of the original good lamp beads on the circuit board 101, ensuring that the good lamp beads can be aligned with the solder pads, so that the good lamp beads can be powered on and light up normally after being attached to the solder paste, which is beneficial to improving the rework quality of the LED lamp board 100.

[0104] In some embodiments, the patch assembly 3 also includes a detector for obtaining detection information, and whether the patch quality of the pad is qualified can be determined based on the detection information. The detector includes a pressure sensor, wherein the pressure sensor is used to obtain the patch pressure information borne by the pad. Therefore, the detection information includes the patch pressure information, and whether the patch quality of the pad is qualified can be determined based on the patch pressure information.

[0105] Specifically, the pressure sensor is used to obtain the patch pressure information that the pad is subjected to during the patch process. The patch pressure is the pressure exerted on the pad by the good lamp beads during patching, and it is also the pressure from the pad that the good lamp beads are subjected to. The patch pressure can be used to determine whether the good lamp beads are tightly fitted on the pad (solder paste), and then determine whether the patch quality is qualified. For example, when the patch pressure is too small, or the patch pressure is not detected (that is, the pressure is 0), it means that the good lamp beads are not tightly fitted on the pad. At this time, the depth of the good lamp beads embedded in the solder paste may be insufficient, the good lamp beads may float on the solder paste, or even the good lamp beads are not attached to the pad (for example, the good lamp beads fall off during movement), so it can be determined that the patch quality is unqualified.

[0106] When the patch stroke of the patch nozzle 31 reaches and the patch pressure on the pad is greater than or equal to the preset pressure threshold, it means that the good lamp bead is tightly and reliably attached to the pad, and the patch quality of the pad is qualified. The preset threshold can be determined in advance based on the experience value of the normal patch process in the past.

[0107] Optionally, for the convenience of detection, a pressure sensor can be used to detect the pressure from the pad on the good lamp beads. According to the principle of action and reaction, the pressure is the patch pressure on the pad during the patch process. At this time, the pressure sensor can be connected to the patch nozzle 31. After the patch nozzle 31 is squeezed by the pad, the patch nozzle 31 continues to squeeze the pressure sensor, that is, the pressure sensor indirectly detects the patch pressure information on the pad during the patch process through the patch nozzle 31. The pressure sensor can be, for example, a strain gauge pressure sensor, a piezoresistive pressure sensor, a capacitive pressure sensor, or a piezoelectric pressure sensor.

[0108] In some embodiments, reference Figure 8 The patch component 3 also includes a flow meter 36 and a cleaning brush component 37. The flow meter 36 is connected to the patch suction nozzle 31, and is used to detect the air flow of the patch suction nozzle 31 to determine whether the patch suction nozzle 31 has sucked up good lamp beads and whether the good lamp beads are attached to the solder paste; the cleaning brush component 37 includes a collecting groove 371 and a brush 372 arranged at the groove of the collecting groove 371. The brush 372 is used to brush the good lamp beads from the patch suction nozzle 31 and collect them into the collecting groove 371 when the good lamp beads sucked by the patch suction nozzle 31 fail.

[0109] Through the above settings, by using the flowmeter 36 to detect the air flow of the patch nozzle 31, it is possible to accurately determine whether the patch nozzle 31 has sucked good lamp beads and whether the good lamp beads are attached to the solder paste, thereby determining whether the patch is successful, so as to timely replace or repair the patch nozzle 31, so that the repair work of the LED lamp board 100 is not affected. When the good lamp beads sucked by the patch nozzle 31 fail, the good lamp beads can be brushed off the patch nozzle 31 by the brush 372, and a collection tank 371 is set under the brush 372, so that the good lamp beads brushed off from the patch nozzle 31 will fall into the collection tank 371, and the staff only needs to regularly collect the good lamp beads in the collection tank 371, and the staff does not need to manually brush the good lamp beads off the patch nozzle 31, which improves the efficiency of the patch nozzle 31 in absorbing good lamp beads, so as to improve the patch efficiency.

[0110] Optionally, the flow meter 36 here can be any type such as a differential pressure flow meter, a volume flow meter, a turbine flow meter, an electromagnetic flow meter, an ultrasonic flow meter, a vortex flow meter, a thermal mass flow meter or a Coriolis flow meter.

[0111] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An LED lamp board repair device, used for repairing an LED lamp board (100), wherein the LED lamp board (100) comprises a circuit board (101) and at least one defective lamp bead located on the circuit board (101), characterized in that: include: A feeding assembly (6), comprising a second conveying device (61) and a barcode scanner (62), wherein the barcode scanner (62) is used to read the code on the LED light board (100) to obtain the position information of the defective lamp beads, and the second conveying device (61) is used to carry and transport the LED light board (100); A die-bonding removal component (1) comprises a laser (11) and a picker (12), wherein the laser (11) is used to heat and desolder the defective lamp bead, and the picker (12) is used to remove the defective lamp bead and the melted solder so that the solder pad corresponding to the defective lamp bead is exposed; A tinning component (2) is used for printing tin paste on the pad; A patch assembly (3) is used to attach good quality lamp beads to the solder paste; The laser (11) is also used to heat and solidify the good-quality lamp beads, so as to install the good-quality lamp beads on the circuit board (101); A lighting detection component (4) is used to perform lighting detection on the circuit board (101) on which the good lamp beads are installed.

2. The LED lamp board repair equipment according to claim 1, characterized in that: The lighting detection component (4) comprises an insertion mechanism (41) and an optical detection device (42); The plug-in mechanism (41) is used to be plugged into the circuit board (101) so that the circuit board (101) is powered on to light up the good lamp beads on the circuit board (101); The optical detection device (42) is used to collect optical information from the powered circuit board (101) to detect whether all the good lamp beads on the circuit board (101) are normally lit.

3. The LED lamp board repair equipment according to claim 2, characterized in that: Also includes: The transplanting component (7) is used to move the circuit board (101) to the second conveying device (61) when the lighting detection component (4) detects that some of the good lamp beads on the circuit board (101) are abnormally lit, and is also used to move the circuit board (101) out when the lighting detection component (4) detects that all of the good lamp beads on the circuit board (101) are normally lit.

4. The LED lamp panel repair equipment according to claim 3, characterized in that: The transplanting assembly (7) comprises an X-axis motion module (71), a Z-axis motion module (72) connected to the X-axis motion module (71), and a clamping claw assembly (73) connected to the Z-axis motion module (72); The X-axis motion module 1 (71) is used to drive the Z-axis motion module 1 (72) to move in the X-axis direction, so as to drive the clamping jaw assembly (73) to move between the feeding assembly (6) and the lighting detection assembly (4); the Z-axis motion module 1 (72) is used to drive the clamping jaw assembly (73) to move in the Z-axis direction; and the clamping jaw assembly (73) is used to clamp or release the circuit board (101).

5. The LED lamp board repair equipment according to claim 4, characterized in that: The clamping jaw assembly (73) comprises a support rod (731), a clamping jaw (732) and a clamping jaw driving device (733) arranged on the support rod (731); The support rod (731) is connected to the Z-axis motion module 1 (72), the clamping jaw (732) is located above the circuit board (101), and the clamping jaw driving device (733) is used to drive the clamping jaw (732) to contract or open so as to clamp or release the circuit board (101).

6. The LED lamp board repair equipment according to any one of claims 2 to 5, characterized in that: The lighting detection component (4) further comprises: A first conveying device (43) is used to carry the circuit board (101) on which the good lamp beads are installed; A light board detection sensor (44) for detecting whether the circuit board (101) is present on the first conveying device (43); a blocking cylinder (45), configured to extend a piston rod of the blocking cylinder (45) when the light board detection sensor (44) detects the circuit board (101), so as to block and limit the circuit board (101) between the first end and the second end of the first conveying device (43); A top positioning plate (47) is arranged on the top surface of the first conveying device (43).

7. The LED lamp board repair equipment according to claim 6, characterized in that: The lighting detection component (4) further comprises: a side pressing assembly (46), arranged on any side of the first conveying device (43) along its conveying direction, and used to apply pressure to the side of the circuit board (101) to limit the movement of the circuit board (101) in the Y-axis direction; The lifting and fixing assembly (48) is used to clamp and fix the circuit board (101) between the top positioning plate (47) and the lifting and fixing assembly (48) by lifting, so as to limit the movement of the circuit board (101) in the Z-axis direction.

8. The LED lamp panel repair equipment according to claim 7, characterized in that: The top positioning plate (47) is detachably connected to the top surface of the first conveying device (43); And / or, the lighting detection component (4) further comprises a track telescopic cylinder (49), wherein the track telescopic cylinder (49) is used to adjust the width of the first conveying device (43) to accommodate circuit boards (101) of different specifications.

9. The LED lamp board repair equipment according to claim 8, characterized in that: Also includes: A rework platform component (5) is used to move the LED lamp panel (100) to a rejection position so that the rejection and die-bonding component (1) can perform a rejection operation or a die-bonding operation; The rework platform component (5) is also used to move the LED lamp board (100) to a tinning position so that the tinning component (2) can perform a tinning operation, and the patch component (3) can perform a patch operation; The second conveying device (61) is specifically used to carry the LED light board (100) and transport the LED light board (100) to the rework platform assembly (5).

10. The LED lamp board repair equipment according to claim 9, characterized in that: The rework platform assembly (5) is also used to rotate the LED light board (100) by 90° when the arrangement direction of the lamp beads on the LED light board (100) is inconsistent with the direction of the laser spot emitted by the laser (11).

11. The LED lamp board repair equipment according to claim 9 or 10, characterized in that: Also includes: The mounting assembly (200) comprises a mounting platform (201) and a mounting frame (202) arranged on the mounting platform (201), wherein the mounting platform (201) is used to mount the lighting detection assembly (4), the rework platform assembly (5) and the feeding assembly (6) which are sequentially arranged in parallel along the X-axis direction of the mounting platform (201), and the mounting frame (202) is used to mount the die-removing and bonding assembly (1), the tinning assembly (2) and the patch assembly (3); The mounting frame (202) is provided with a slide rail (2022) extending along the X-axis direction, the tinning assembly (2) and the patch assembly (3) are slidably connected to the slide rail (2022), and the die-removing and bonding assembly (1) is located between the tinning assembly (2) and the patch assembly (3).

12. The LED lamp board repair equipment according to any one of claims 1-5, 7-10, characterized in that: The patch assembly (3) comprises a patch suction nozzle (31) and a Z-axis motion module 2 (32) for driving the patch suction nozzle (31) to move in the Z-axis direction; The LED lamp panel repair equipment also includes a wafer assembly (8), wherein the wafer assembly (8) includes a wafer plate (81) and an ejector pin assembly (82), wherein the wafer plate (81) is used to place the good lamp beads, and the ejector pin assembly (82) is used to eject the good lamp beads from the wafer plate (81) to be sucked by the patch suction nozzle (31).

13. The LED lamp panel repair equipment according to claim 12, characterized in that: The patch assembly (3) further comprises: A positioning vision component (33) is used to obtain relative position information between the patch suction nozzle (31) and the good lamp beads on the wafer disk (81) and to correct the position of the patch suction nozzle (31); A monitoring device (34) for monitoring the angle information of the good lamp beads sucked by the patch suction nozzle (31) and the positive and negative pole position information of the good lamp beads; The R-axis motion module 1 (35) is used to drive the patch suction nozzle (31) to rotate on a horizontal plane so that the angle of the good lamp bead sucked by the patch suction nozzle (31) can be corrected.

14. The LED lamp panel repair equipment according to claim 13, characterized in that: The patch assembly (3) further comprises: A flow meter (36) connected to the patch suction nozzle (31) for detecting the air flow of the patch suction nozzle (31) to determine whether the patch suction nozzle (31) has sucked the good lamp bead and whether the good lamp bead is attached to the solder paste; A cleaning brush assembly (37) comprises a collecting groove (371) and a brush (372) arranged at the groove of the collecting groove (371); the brush (372) is used to brush the good lamp beads sucked by the patch suction nozzle (31) off the patch suction nozzle (31) and collect them into the collecting groove (371) when the good lamp beads sucked by the patch suction nozzle (31) fail.

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