Wafer Transport Assembly with Integrated Buffer

Abstract

To provide adequate access to plant equipment for maintenance and a service.SOLUTION: A cluster tool system includes wafer transfer modules 102, 212, and 218 and a buffer module connected between the wafer transfer modules. Each of the modules is aligned in a unidirectional axis 270. The buffer module includes buffer stacks 240, 244, and 248 located at a first side end of the buffer module, and buffer stacks 242, 246, and 250 located at a second side end of the buffer module. The first side end defines a first side face protrusion nested between the wafer transfer modules 102 and 212, a processing module 106, and a processing module 210 (214), and the second side end defines a fourth side face protrusion 262 nested between the wafer transfer modules 212 and 218 and the processing modules 210 (214) and 216 (220).SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present embodiments relate to semiconductor wafer processing equipment, and more particularly to multi-chamber processing tool systems, apparatus, and associated methods. [Background technology]

[0002] In semiconductor manufacturing plants (commonly referred to as "fabrication plants"), space is limited, expensive, and cannot be easily expanded. Therefore, efficient space utilization is desirable to achieve maximum productivity, while still providing sufficient access to equipment within the factory for maintenance and service.

[0003] Embodiments of the present invention address these challenges. Summary of the Invention

[0004] Embodiments of the present disclosure provide methods, apparatus, and systems relating to a compact cluster tool architecture that includes a service tunnel defined below a substrate transport assembly that utilizes sub-floor space below factory floor level, and the wafer transport assembly may include multiple buffers arranged to achieve a compact footprint and provide flexibility in configuration of wafer movement through the wafer transport assembly.

[0005] According to an embodiment of the present disclosure, a cluster tool system for processing wafers is provided, comprising: a wafer transport assembly extending along a longitudinal axis of the cluster tool system, the wafer transport assembly having a front end oriented toward an equipment front end module (EFEM) and having a rear end opposite the front end; at least two processing modules connected to the wafer transport assembly along a first side of the wafer transport assembly, the wafer transport assembly configured to transport wafers to and from the at least two processing modules connected along the first side; at least two processing modules connected to the wafer transport assembly along a second side of the wafer transport assembly, the wafer transport assembly configured to transport wafers to and from the at least two processing modules connected along the second side; and a service tunnel defined below the wafer transport assembly, the service tunnel extending along the longitudinal axis of the cluster tool system from the front end to the rear end of the wafer transport assembly, the service tunnel having a vertical dimension defined between an underside of the wafer transport assembly and a service floor disposed below the wafer transport assembly, the service floor being defined at an elevation less than an elevation of a factory floor on which the cluster tool system is disposed.

[0006] In some embodiments, the wafer transport assembly includes at least two wafer transport modules connected to each other along a vertical axis, each of the wafer transport modules connecting to one of the processing modules connected along a first side of the wafer transport assembly, and each of the wafer transport modules connecting to one of the processing modules connected along a second side of the wafer transport assembly.

[0007] In some embodiments, the cluster tool system further includes: at least two processing module frames configured to support at least two processing modules connected along a first side of the wafer transport assembly and further configured to be positioned on a factory floor; and at least two processing module frames configured to support at least two processing modules connected along a first side of the wafer transport assembly and further configured to be positioned on a factory floor.

[0008] In some embodiments, a set of stairs is defined at a rear end of a service tunnel defined substantially below the rear end of the wafer transport assembly, the set of stairs being configured to define a path down from the factory floor to the service floor.

[0009] In some embodiments, the service floor height is approximately 1 foot (30.5 cm) to 2 feet (61 cm) lower than the factory floor height.

[0010] In some embodiments, the front side of the wafer transport assembly is configured to connect to a load lock that controls access to the EFEM, and the front end of the service tunnel extends substantially to the EFEM.

[0011] In some embodiments, the height of the service tunnel is between about 6 feet (183 cm) and 8 feet (244 cm).

[0012] In some embodiments, a first side of the service tunnel provides access to a processing module connected along a first side of the wafer transport assembly, and a second side of the service tunnel provides access to a processing module connected along a second side of the wafer transport assembly.

[0013] In some embodiments, a first side of the service tunnel provides access to one or more gas boxes defined for processing modules connected along the first side of the wafer transport assembly, and a second side of the service tunnel provides access to one or more gas boxes defined for processing modules connected along the second side of the wafer transport assembly.

[0014] In some embodiments, the service tunnel complies with the SEMI E72 standard.

[0015] According to an embodiment of the present disclosure, a cluster tool system for processing wafers is provided, comprising: a wafer transport assembly extending along a longitudinal axis of the cluster tool system, the wafer transport assembly having a front end oriented toward an equipment front end module (EFEM) and having a rear end opposite the front end; at least two processing modules connected to the wafer transport assembly along a first side of the wafer transport assembly, the wafer transport assembly configured to transport wafers to and from the at least two processing modules connected along the first side; at least two processing modules connected to the wafer transport assembly along a second side of the wafer transport assembly, the wafer transport assembly configured to transport wafers to and from the at least two processing modules connected along the second side; and a service tunnel defined below the wafer transport assembly, the service tunnel configured to connect the wafer transport assembly to and from the at least two processing modules connected along the longitudinal axis of the cluster tool system. a service tunnel extending from a front end to a rear end of the wafer transport assembly, the service tunnel having a vertical dimension defined between an underside of the wafer transport assembly and a service floor disposed below the wafer transport assembly, the service floor being defined at a height lower than a height of a factory floor on which the cluster tool system is disposed, the height of the service floor being approximately 1 foot (30 cm) to 2 feet (60 cm) lower than a height of the factory floor; at least two processing module frames configured to support at least two processing modules connected along a first side of the wafer transport assembly and further configured to be positioned on the factory floor; at least two processing module frames configured to support at least two processing modules connected along a first side of the wafer transport assembly and further configured to be positioned on the factory floor; a height of the service tunnel defined by a height of the service floor and a height of the processing module frames, the height of the service tunnel being approximately 6 feet (180 cm) to 8 feet (240 cm).

[0016] In some embodiments, the wafer transport assembly includes at least two wafer transport modules connected to each other along a vertical axis, each of the wafer transport modules connecting to one of the processing modules connected along a first side of the wafer transport assembly, and each of the wafer transport modules connecting to one of the processing modules connected along a second side of the wafer transport assembly.

[0017] In some embodiments, a set of stairs is defined at a rear end of a service tunnel defined substantially below the rear end of the wafer transport assembly, the set of stairs being configured to define a path down from the factory floor to the service floor.

[0018] In some embodiments, the front side of the wafer transport assembly is configured to connect to a load lock that controls access to the EFEM, and the front end of the service tunnel extends substantially to the EFEM.

[0019] In some embodiments, a first side of the service tunnel provides access to a processing module connected along a first side of the wafer transport assembly, and a second side of the service tunnel provides access to a processing module connected along a second side of the wafer transport assembly.

[0020] In some embodiments, a first side of the service tunnel provides access to one or more gas boxes defined for processing modules connected along the first side of the wafer transport assembly, and a second side of the service tunnel provides access to one or more gas boxes defined for processing modules connected along the second side of the wafer transport assembly.

[0021] In some embodiments, the service tunnel complies with the SEMI E72 standard.

[0022] According to an embodiment of the present disclosure, a wafer transport assembly is provided, comprising: a first wafer transport module; a second wafer transport module; and a buffer module connected between the first and second wafer transport modules, wherein the first wafer transport module, the second wafer transport module, and the buffer module are aligned on a unidirectional axis, the buffer module having a first buffer stack and a second buffer stack, the first buffer stack being disposed at a first side end of the buffer module disposed on a first side of the unidirectional axis, and the second buffer stack being disposed at a second side end of the buffer module disposed on a second side of the unidirectional axis, wherein a first side of the first wafer transport module disposed on the first side of the unidirectional axis is configured to connect to a first process module, and the first side of the first wafer transport module disposed on the first side of the unidirectional axis is configured to connect to a first process module. a first side of the second wafer transfer module disposed on the second side of the unidirectional axis is configured to connect to a second processing module, a first side end of the buffer module defines a first side protrusion nested between the first and second wafer transfer modules and the first and second processing modules, a second side of the first wafer transfer module disposed on the second side of the unidirectional axis is configured to connect to a third processing module, a second side of the second wafer transfer module disposed on the second side of the unidirectional axis is configured to connect to a fourth processing module, and a second side end of the buffer module defines a second side protrusion nested between the first and second wafer transfer modules and the third and fourth processing modules, and the first wafer transfer module, the second wafer transfer module, and the buffer module are configured to define a continuous controlled environment.

[0023] In some embodiments, the wafer transport assembly is configured to define a transport path for a wafer from one of the first or third processing modules, to the first wafer transport module, one of the first or second buffer stacks, the second wafer transport module, or one of the second or fourth processing modules.

[0024] In some embodiments, each of the first and second buffer stacks is configured to store approximately 5-10 wafers.

[0025] In some embodiments, the controlled environment is defined by a vacuum controlled environment.

[0026] In some embodiments, the first and second buffer stacks define a plurality of wafer storage slots, at least one of the wafer storage slots configured to store a cover wafer within the controlled environment defined by the wafer transport assembly.

[0027] In some embodiments, the wafer transport assembly further includes a second buffer module connected to the second transport module and aligned along the unidirectional axis, the second buffer module having a third buffer stack located at a first side end of the second buffer module disposed on a first side of the unidirectional axis, and a fourth buffer stack located at a second side end of the second buffer module disposed on a second side of the unidirectional axis.

[0028] In some embodiments, a first side end of the second buffer module defines a first side protrusion and a second side end of the second buffer module defines a fourth side protrusion.

[0029] In some embodiments, the wafer transport assembly further includes a third wafer transport module connected to the second buffer module and aligned along a unidirectional axis, a first side of the third wafer transport module disposed on a first side of the unidirectional axis configured to connect to a fifth processing module, and a second side of the third wafer transport module disposed on a second side of the unidirectional axis configured to connect to a sixth processing module.

[0030] In some embodiments, the third side protrusion is nested between the second and third wafer transfer modules and the second and fifth processing modules, and the fourth side protrusion is nested between the second and third wafer transfer modules and the fourth and sixth processing modules.

[0031] In some embodiments, the wafer transport assembly is defined above a service tunnel that extends from a front end of the wafer transport assembly to a rear end of the wafer transport assembly.

[0032] According to an embodiment of the present disclosure, a wafer transport assembly is provided, comprising: a housing; a first wafer transport robot disposed within the housing; a second wafer transport robot disposed within the housing; and first and second buffer stacks disposed within the housing and positioned between the first and second wafer transport robots; a first interface defined along a first side of the housing and configured to connect to a first processing module; a second interface defined along the first side of the housing and configured to connect to a second processing module; a first side protrusion defined along the first side of the housing between the first and second interfaces, the first side protrusion extending between the first buffer stack and the second processing module; a third interface is defined along a second side of the housing and configured to connect to a third processing module; a fourth interface is defined along a second side of the housing and configured to connect to a fourth processing module; a second side protrusion is defined along the second side of the housing between the third and fourth interfaces, the second side protrusion defines a position of a second buffer stack and is nested between the first and second wafer transport robots and the third and fourth processing modules; the wafer transport assembly defines a continuously controlled environment.

[0033] In some embodiments, the wafer transport assembly is configured to define a transport path for a wafer from one of the first or third processing modules, to the first wafer transport robot, to one of the first or second buffer stacks, to the second wafer transport robot, to one of the second or fourth processing modules.

[0034] In some embodiments, the wafer transport assembly further comprises a connector for connecting to a vacuum source, and the continuous controlled environment is defined by a vacuum controlled environment.

[0035] In some embodiments, an upper portion of the first buffer stack defines a plurality of first wafer storage slots, the upper portion of the first buffer stack having one or more separators defined between each of the plurality of first wafer storage slots; and a lower portion of the first buffer stack defines a plurality of second wafer storage slots, the lower portion of the first buffer stack does not have a separator defined between each of the plurality of second wafer storage slots.

[0036] In some embodiments, the lower portion of the first buffer stack is configured to store one or more cover or seasoning wafers.

[0037] In some embodiments, each of the first and second buffer stacks is configured to store approximately 5-10 wafers.

[0038] In some embodiments, the wafer transport assembly is defined above a service tunnel that extends from a front end of the wafer transport assembly to a rear end of the wafer transport assembly.

[0039] According to an embodiment of the present disclosure, a load lock assembly is provided, comprising: a first load lock configured to connect between an equipment front end module (EFEM) and a wafer transport module, where the EFEM is maintained at laboratory ambient conditions and the wafer transport module is maintained at vacuum conditions, the wafer transport module being part of the wafer transport assembly, the wafer transport assembly being configured to transport wafers to and from one or more processing modules connected to the wafer transport assembly; a second load lock disposed above the first load lock and configured to connect between the EFEM and the wafer transport module; and a post-processing module disposed above the second load lock, where the post-processing module is configured to perform post-processing operations on processed wafers processed in at least one of the processing modules connected to the wafer transport assembly, and configured to connect to the wafer transport module.

[0040] In some embodiments, the post-processing module is stacked on top of a second load lock, which is stacked on top of the first load lock.

[0041] In some embodiments, the first load lock is configured to move a wafer from the EFEM into the wafer transfer module; the second load lock is configured to move a wafer from the wafer transfer module to the EFEM.

[0042] In some embodiments, the post-processing module is configured to perform a stripping process or a passivation process on the processed wafer.

[0043] In some embodiments, the load lock assembly further comprises: a third load lock disposed adjacent to the first load lock and configured to connect between the EFEM and the wafer transfer module; a fourth load lock disposed above the third load lock and adjacent to the second load lock and configured to connect between the EFEM and the wafer transfer module; and a second post-processing module disposed above the fourth load lock, the second post-processing module configured to perform post-processing operations on processed wafers and configured to connect to the wafer transfer module.

[0044] In some embodiments, the second post-processing module is stacked above the fourth load lock, which is stacked above the third load lock.

[0045] In some embodiments, the first and second load locks are configured to move wafers from the EFEM into the wafer transfer module; and the third and fourth load locks are configured to move wafers from the wafer transfer module to the EFEM.

[0046] According to an embodiment of the present disclosure, a system is provided that includes: an equipment front end module (EFEM); a wafer transport assembly including a wafer transport module configured to connect to a first processing module and a second processing module and a robot for moving wafers to and from the first and second processing modules; first and second load locks connected between the EFEM and a front surface of the wafer transport module and configured to move wafers from the EFEM to the wafer transport module; and third and fourth load locks connected between the EFEM and a front surface of the wafer transport module and configured to move wafers from the wafer transport module to the EFEM.

[0047] In some embodiments, the first and second load locks are arranged in a stacked configuration; and the third and fourth load locks are arranged in a stacked configuration adjacent to the first and second load locks.

[0048] In some embodiments, the system further includes: a first post-processing module connected to the front side of the wafer transport module and configured to perform post-processing operations on the processed wafer; and a second post-processing module connected to the front side of the wafer transport module and configured to perform post-processing operations on the processed wafer.

[0049] In some embodiments, the first or second processing module is configured to perform an etching operation, and the first or second processing module is configured to perform a stripping operation after performing the etching operation.

[0050] In some embodiments, the robot is configured to transfer the wafer from a first load lock to a first processing module for performing an etching operation, then transfer the wafer from the first processing module to a first post-processing module for performing a strip operation, and then transfer the wafer from the first post-processing module to a third load lock for exiting the wafer transport assembly.

[0051] According to an embodiment of the present disclosure, a method for processing a wafer is provided, comprising: transferring a wafer from an equipment front end module (EFEM) through a first load lock to a wafer transport assembly, the first load lock being connected between the EFEM and the wafer transport assembly; moving the wafer to a processing module configured to perform a processing operation on the wafer and connected to the wafer transport assembly; moving the wafer after performance of the processing operation to a post-processing module configured to perform a post-processing operation on the wafer, the post-processing module being connected to the wafer transport assembly and arranged in a vertical stack configuration with the first load lock; and moving the wafer from the post-processing module to the EFEM after performance of the post-processing operation through a second load lock connected to the wafer transport assembly, the second load lock being connected between the EFEM and the wafer transport assembly.

[0052] In some embodiments, the processing operation is an etch operation and the post-processing operation is a strip operation.

[0053] In some embodiments, the second load lock is arranged in a vertical stack configuration with the first load lock.

[0054] In some embodiments, the second load lock is positioned adjacent to the vertical stack configuration defined by the first load lock and the passivation module. [Brief description of the drawings]

[0055] [Figure 1A] 1 is a schematic diagram illustrating a cross-section of a portion of a cluster tool for processing wafers in accordance with an embodiment of the present disclosure.

[0056] [Figure 1B] FIG. 1 illustrates a perspective view of a cluster tool system in accordance with an embodiment of the present disclosure.

[0057] [Figure 1C]FIG. 1 illustrates a perspective view of a cluster tool system in accordance with an embodiment of the present disclosure.

[0058] [Figure 1D] 1 illustrates a cross-sectional view of a cluster tool system in accordance with an embodiment of the present disclosure.

[0059] [Figure 1E] 1 is a schematic diagram illustrating a cross-section of a portion of a cluster tool for processing wafers in accordance with an embodiment of the present disclosure.

[0060] [Figure 1F] 1 illustrates a cutaway view of a cluster tool for processing wafers in accordance with an embodiment of the present disclosure.

[0061] [Diagram 2] 1 is a schematic diagram showing cross-sections of various devices of a cluster tool system in an overhead view in accordance with an embodiment of the present disclosure.

[0062] [Figure 3A] FIG. 2 is a perspective view showing a wafer transport assembly according to an embodiment of the present disclosure.

[0063] [Figure 3B] 3B is a perspective view of the wafer transport assembly of FIG. 3A with the cover plate removed to expose the interior of the wafer transport assembly in accordance with an embodiment of the present disclosure.

[0064] [Figure 4A] 1 is a perspective view showing a wafer transfer module according to an embodiment of the present disclosure.

[0065] [Figure 4B] 1 is a perspective view of a wafer transfer module 102 and a buffer module 410 attached thereto, in accordance with an embodiment of the present disclosure.

[0066] [Diagram 5]FIG. 5 is a schematic diagram illustrating a buffer stack 500 in cross section, in accordance with an embodiment of the present disclosure.

[0067] [Figure 6] 1 is a cross-sectional view of a portion of a buffer module showing a buffer stack in accordance with an embodiment of the present disclosure.

[0068] [Figure 7] 1 is an illustration of a cluster tool system showing the orientation of a wafer as it is moved through various components of the system in accordance with an embodiment of the present disclosure.

[0069] [Figure 8] 1 is a cross-sectional view of a portion of a cluster tool system in accordance with an embodiment of the present disclosure.

[0070] [Figure 9] FIG. 1 is a conceptual diagram illustrating a configuration of a load lock with an integrated post-processing module in accordance with an embodiment of the present disclosure.

[0071] [Figure 10] FIG. 2 is an explanatory diagram showing a control module for controlling the system of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0072] The embodiments of the present disclosure provide a method, apparatus, and system for a compact footprint cluster tool architecture with a SEMI compliant access space in the form of a service tunnel defined below the wafer transport assembly. The wafer transport assembly may further include several buffers, which are maintained in the same controlled environment (e.g., vacuum conditions) as the rest of the wafer transport assembly, providing great flexibility for configuring wafer movement through the wafer transport assembly. It should be understood that the embodiments can be embodied in various forms, such as a process, an apparatus, a system, a device, a material, or a method. Several embodiments are described below.

[0073] FIG. 1A is a cross-sectional schematic diagram illustrating a portion of a cluster tool for processing wafers according to an embodiment of the present disclosure. In the illustrated embodiment, a factory floor 116 is shown upon which equipment may be disposed. The factory floor 116 is defined as an elevated floor supported on an underlying subfloor 120. The factory floor 116 may be defined by a series of tiles, which may be perforated to allow airflow through the tiles to remove particles from the factory environment. The tiles are supported by stanchions 118 above the subfloor 120. In some embodiments, the distance between the factory floor and the subfloor 120 is about 2 feet (about 60 centimeters). In some embodiments, the distance between the factory floor and the subfloor 120 is in the range of about 1.5 to 2.5 feet (about 45 to 75 centimeters). In some embodiments, the distance between the factory floor 116 and the subfloor 120 is in the range of about 1 to 4 feet (about 0.3 to 1.2 meters).

[0074] In some embodiments, the subfloor 120 is defined by a concrete waffle slab. A subfloor space 121 defined between the factory floor 116 and the subfloor 120 can be utilized for routing various equipment lines, such as process gas lines, vacuum lines, electrical / RF lines / feeds, data cables, liquid supply lines, etc. It will be appreciated that the routing of such lines may be along the subfloor 120 or may extend through the subfloor 120 to the floor below to allow connection to auxiliary equipment located on the floor below.

[0075] Processing modules 100 and 106 are positioned at an elevated position above factory floor 116. More specifically, in the illustrated embodiment, processing modules 100 and 106 are supported by processing module frames 108 and 110, respectively. Each processing module frame is configured to elevate the respective processing module, thereby providing space below the processing module to accommodate various equipment and devices required for operation of the processing module. Locating equipment below the processing modules conserves horizontal space required for operation, which allows processing modules to be placed closer to each other within a given cluster tool system, and also allows adjacent cluster tool systems to be placed closer to each other.

[0076] In some embodiments, the space below the process module defined by the process module frame is configured to have a minimum height to accommodate an RF feed having a predetermined vertical length extending downward from the process module, and the RF feed structure may be configured to be coupled to a chuck configured to be moved up and down within the chamber of the process module such that the RF feed structure is also moved up and down, and thus the process module frame is configured to provide sufficient height to accommodate such vertical movement.

[0077] As processing modules and cluster tool systems are packed more tightly together, access space becomes more limited for a given number of devices and cluster tool systems in a given area of ​​a factory. This can be problematic because limited access to devices makes it more difficult to perform service or repair operations and may require additional steps to gain access to the required devices, such as disassembling or moving parts or all of the devices. Such additional steps increase downtime and therefore reduce some of the yield improvements achieved with compact footprint configurations.

[0078] To address these issues, in accordance with an embodiment of the present disclosure, a service tunnel 124 is provided in the space below a wafer transfer module (such as wafer transfer module 102) of a cluster tool. The service tunnel 124 is further defined by a service floor 122 below the wafer transfer module 102. The service floor 122 is a lower floor than the factory floor 116 and is defined at a height lower than the factory floor but higher than the sub-floor 120. Thus, the service floor 122 takes advantage of the sub-floor space that exists between the factory floor 116 and the sub-floor 120 and utilizes this space to provide additional height to the service tunnel 124. The service tunnel 124 is defined between the wafer transfer module 102 and the service floor 122 and has a height H1 sufficient for an average-sized person (approximately 5-6 feet (approximately 150-180 cm)) to stand. In some embodiments, the height H1 is in the range of approximately 2-8 feet (approximately 0.6-2.4 meters). In some embodiments, the height H1 is in the range of about 5.5 to 7.5 feet (about 1.7 to 2.3 meters). In some embodiments, the height H1 is about 7 feet (about 2.1 meters).

[0079] It should be appreciated that the service tunnel 124 and cluster tool architecture defined in accordance with embodiments of the present disclosure is compliant with the SEMI (Semiconductor Equipment and Materials Institute) E72 standard which defines spatial requirements for semiconductor manufacturing equipment.

[0080] In the illustrated embodiment, the robot actuator 104 that is part of the wafer transport module 102 is shown for the sake of completeness of this disclosure. The illustrated robot actuator 104 is considered to be a generally cylindrical structure that extends downwardly from the body of the wafer transport module 102. Adjacent to the robot actuator 104 (forward, rearward, and to the sides relative to the robot actuator), a height of the service tunnel space extends from the service floor 122 to the bottom of the wafer transport module 102, providing a height H1 sufficient for an average-sized person to stand without obstruction.

[0081] A service tunnel 124 is defined between the process modules 100 and 106 and between the process module frames 108 and 110. In some embodiments, gas boxes 112 and 114, which supply the process modules 100 and 106, respectively, are disposed along the sides of the service tunnel 124. The service tunnel 124 may thus have a width W1. According to some embodiments, the width W1 is in the range of about 2-6 feet (about 0.6-1.8 meters). In some embodiments, the width W1 is in the range of about 2.5-4 feet (about 0.7-1.3 meters). In some embodiments, the width W1 is in the range of about 3-3.5 feet (about 0.9-1.1 meters). Inwardly facing portions of the process module frames define the side walls of the service tunnel.

[0082] The service tunnel 124 provides access to the equipment of the cluster tool system from the interior regions of the cluster tool system. This access is important because the processing modules and other equipment of the cluster tool system are located very close to each other to reduce the footprint of the system. More specifically, the service tunnel 124 provides access to the underside of the wafer transfer module 102 and the interiors of the processing modules 100 and 106. The gas boxes 112 and 114 provide access to the gas lines that supply the processing modules 100 and 106, respectively. The gas boxes 112 and 114 are defined along the side walls of the service tunnel and are accessible from the service tunnel 124.

[0083] The interior height H1 of the service tunnel is defined by the vertical dimensions of various components of the system, such as the depth D1 of the service floor 122 below the height of the factory floor 116, and the height H2 to which the process module frames 108 and 110 are configured to raise the process modules 100 and 106. The available depth of the service floor depends on the height of the factory floor above the subfloor (i.e., height H1). Thus, in various embodiments, the depth D1 of the service floor may range from a value of 0 to H1. In some embodiments, the depth D1 ranges from about 0 to 4 feet (about 0 to 60 cm). In some embodiments, the depth D1 ranges from about 1 to 2 feet (about 30 to 60 cm). In some embodiments, the depth D1 ranges from about 1.5 to 1.8 feet (about 45 to 55 cm).

[0084] In some embodiments, the height H2 of the processing module frame ranges from about 2 to 6 feet (about 0.6 to 1.8 meters). In some embodiments, the height H2 ranges from about 3 to 6 feet (about 0.9 to 1.8 meters). In some embodiments, the height H2 ranges from about 2.5 to 4.5 feet (about 0.8 to 1.4 meters). In some embodiments, the service tunnel 124 is defined below a wafer transport assembly defined by one or more wafer transport modules (such as wafer transport module 102). In some embodiments, the service tunnel extends from a front end defined by an equipment front end module (EFEM) to a back end defined by the rear of the rearmost wafer transport module. The service floor 122 of the service tunnel 124 can be conceptualized as defining a pit disposed below the wafer transport assembly and providing sufficient vertical height to allow a person to stand unobstructed within the pit.

[0085] The service tunnel 124 may be accessed from a rear end of the service tunnel that opens to the factory floor. To provide access to the service tunnel 124, a ladder or steps / stairs may be located at the rear end of the service tunnel 124 to define a passageway from the service floor 122 to the factory floor 116. In some embodiments, a foldable stepladder may be provided that opens into a staircase but can also be folded up when not in use. In this manner, a staircase is provided for access when needed, but can be stowed when not needed, so as not to take up service floor space to meet standard service floor space requirements. In some embodiments, the stepladder when folded may be configured to block the entrance to the service tunnel, improving the safety of the system and preventing people from accidentally falling into the service tunnel.

[0086] 1B is a perspective view of a cluster tool system in accordance with an embodiment of the present disclosure. In the illustrated embodiment, the rear end opening of the service tunnel 124 is visible. As shown, the service tunnel 124 is defined to extend below the wafer transport assembly 209 from a front end of the wafer transport assembly 209 facing the EFEM 200 to a rear end of the wafer transport assembly 209 opposite the front end.

[0087] 1C is a perspective view of a cluster tool system according to an embodiment of the present disclosure. In the illustrated embodiment, a factory level and a sub-factory level are shown, with ancillary equipment for operation of the processing modules located on the sub-factory level. The front end 128 of the service tunnel 124 is visible in the illustrated embodiment. As shown according to an embodiment of the present disclosure, the front end 128 of the service tunnel 124 may extend to the EFEM 200.

[0088] 1D is a cross-sectional view of a cluster tool system in accordance with an embodiment of the present disclosure. This illustrative embodiment also illustrates the relationship between the factory level and the sub-factory levels. The people in the figure are shown approximately to scale to indicate the space available for people to move within the service tunnel 124.

[0089] FIG. 1E is a schematic cross-sectional view of a portion of a cluster tool for processing wafers, according to an embodiment of the present disclosure. In the embodiment of FIG. 1E, the floor of the service tunnel 124 is defined at the height of the factory floor 116. In some embodiments, the floor of the service tunnel 124 may be defined by the factory floor 116. However, in other embodiments, the floor of the service tunnel 124 is defined at the height of the factory floor 116, but may have a different structure than the surrounding factory floor 116. It can be seen that the height H2 of the processing module frames 108 and 110 is increased as compared to the embodiment of FIG. 1A. With continued reference to FIG. 1E, in the embodiment shown, the floor of the service tunnel 124 is defined at the height of the factory floor 116, and the height H2 of the processing module frames is typically in the range of about 2 to 6 feet (about 0.6 to 1.8 meters). In some embodiments, the height H2 is in the range of about 4.5 to 6.5 feet (about 1.4 to 2 meters). In some embodiments, the height H2 is in the range of about 4 to 7 feet (about 1.2 to 2.1 meters).

[0090] FIG. 1F is a cutaway (vertical cut along the longitudinal axis) of a cluster tool for processing wafers according to an embodiment of the present disclosure. Thus, the inside of the service tunnel 124 is shown. Gas boxes 114, 134, and 136 provide access to gas lines that feed the processing modules 106, 214, and 220, respectively. The gas boxes are positioned above the scrub exhaust duct 132, which exhausts air from the fab. In the illustrated embodiment, the side cover of the exhaust duct 132 has been removed. The gas box includes perforations 137 to allow air to flow from the fab to the exhaust duct 132. The dashed arrows in the figure indicate the direction of airflow through the gas boxes, into the exhaust duct, and ultimately through the fab subfloor for removal.

[0091] Additionally, in some embodiments, gas lines 138 are located inside the exhaust duct 132. Running the gas lines inside the exhaust duct saves space in the factory and allows the exhaust duct to perform additional functions. Additionally, locating the gas lines inside the exhaust duct minimizes the possibility of contamination in the factory due to gas line leaks, since any leaking gas species will be immediately vented through the exhaust duct. Because the risk of contamination is minimized, lower grade gas line materials may be utilized (rather than materials used if the gas lines were located outside the exhaust duct), thereby reducing costs.

[0092] 2 illustrates a schematic cross-section of various equipment of a cluster tool system in an overhead view according to an embodiment of the present disclosure. The front of the cluster tool system is defined by an equipment front-end module (EFEM) 200, which includes a number of load ports 202a, 202b, 202c, and 202d for receiving a number of wafer transport containers 204a, 204b, 204c, and 204d, respectively. In some embodiments, the wafer transport containers are front-opening integrated pods (FOUPs). The EFEM 200 may further include buffer stations 206a, 206b, and 206c. The EFEM 200 and its buffer stations 206a, 206b, and 206c may be operated under controlled ambient or atmospheric conditions.

[0093] Connected to the rear of the EFEM 200 is a load lock 208 that defines a passageway to a wafer transport assembly 209. The wafer transport assembly is defined by a number of wafer transport modules 102, 212, and 218 connected in series and extending rearwardly from the load lock 208. Each of the wafer transport modules controls access to an adjacent process module. For example, wafer transport module 102 is configured to transfer wafers to and from adjacent process modules 100 and 106. Wafer transport module 212 is configured to transfer wafers to and from adjacent process modules 210 and 214. Wafer transport module 218 is configured to transfer wafers to and from adjacent process modules 216 and 220.

[0094] Each of the wafer transport modules includes a robot (robot wafer handler) configured to engage, lift, and transport the wafer. In the illustrated embodiment, wafer transport modules 102, 212, and 218 include robots 222, 224, and 226, respectively. The robots may have end effectors configured to engage the wafer. As such, the robots of the wafer transport modules are configured to move wafers within the wafer transport assembly 209 and to transfer wafers to and from adjacent processing modules.

[0095] In the illustrated embodiment, the wafer transport assembly 209 is defined by the wafer transport modules 102, 212, and 218. The wafer transport assembly 209 extends rearward from the load lock 208 to the rear of the rearmost wafer transport module 218. As described above, a service tunnel 124 is defined below the wafer transport assembly 209. In some embodiments, the service tunnel 124 extends from the front end of the wafer transport assembly 209 (defined by the front end of the wafer transport module 102) to the rear end of the wafer transport assembly 209 (defined by the rear end of the wafer transport module 218). In some embodiments, the service tunnel extends to the EFEM 200 at its front end. The service tunnel 124 provides access to the underside of the wafer transport modules 102, 212, and 218, for example, to service the wafer transport module robots 222, 224, and 226.

[0096] Wafer transport assembly 209 further comprises gate valves that control the opening between a given wafer transport module and an adjacent process module. In the illustrated embodiment, gate valve 228 controls the opening between wafer transport module 102 and process module 100; gate valve 230 controls the opening between wafer transport module 102 and process module 106; gate valve 232 controls the opening between wafer transport module 212 and process module 210; gate valve 234 controls the opening between wafer transport module 212 and process module 214; gate valve 236 controls the opening between wafer transport module 218 and process module 216; and gate valve 238 controls the opening between wafer transport module 218 and process module 220.

[0097] A given gate valve can be opened to allow a wafer to enter or leave an adjacent processing module by the corresponding wafer transfer module. The gate valve can be closed to isolate an adjacent processing module, for example, for processing a wafer disposed therein, or for performing any other operation that requires isolation of the processing module from the wafer transfer module. In some embodiments, the gate valves 228, 230, 232, 234, 236, and 238 are integrated into the wafer transfer assembly 209. By integrating the gate valves into the wafer transfer module 209, the overall footprint of the wafer transfer assembly is reduced (compared to a wafer transfer assembly having a non-integrated gate valve). The internal environment of the wafer transfer assembly 209 is controlled and can be defined as a vacuum environment or a controlled ambient environment. In some embodiments, the wafer transfer assembly 209 is filled with an inert gas. In various embodiments, the wafer transfer assembly 209 is operated under pressure conditions ranging from atmospheric conditions to vacuum conditions. According to some embodiments of the present disclosure, the vacuum condition can be defined by an internal pressure of less than about 760 Torr. According to some embodiments of the present disclosure, the vacuum condition may be defined by an internal pressure of less than about 10 Torr. In some embodiments, the vacuum condition may be defined by an internal pressure of less than about 1×10 -9 It is defined by the internal pressure ranging from 1 Torr to about 1 Torr.

[0098] 2, in accordance with an embodiment of the present disclosure, multiple buffer stacks are defined within the wafer transport assembly 209. Buffer stacks 240 and 242 are defined between the wafer transport modules 102 and 212. Buffer stacks 244 and 246 are defined between the wafer transport modules 212 and 218. Buffer stacks 248 and 250 are defined behind the wafer transport module 218. It should be appreciated that the buffer stacks are defined within the wafer transport assembly 209, and thus, the buffer stacks share the same controlled environment as the wafer transport assembly. This is advantageous over conventional systems in that wafers do not need to leave the controlled environment of the wafer transport assembly 209 when stored. Because wafers can be buffered within the wafer transport assembly 209, they are readily accessible by the wafer transport modules when transported to a processing module or elsewhere.

[0099] In some embodiments, a given buffer stack is configured to have a capacity to store between about 2 and 20 wafers. In some embodiments, a given buffer stack is configured to have a capacity to store between about 5 and 15 wafers. In some embodiments, a given buffer stack may have a capacity to store between about 5 and 10 wafers. In some embodiments, a given buffer stack may have a capacity to store about 8 wafers. Each buffer stack defines a plurality of storage slots defined in a vertical stack configuration. The storage slots may have separators or partitions defined therebetween that isolate a given wafer from other wafers in the wafer stack.

[0100] As described above, the buffer stacks are disposed between adjacent wafer transport modules. Additionally, the buffer stacks are disposed along the sides of the wafer transport assembly, thereby achieving a compact footprint of the wafer transport assembly since the buffer stacks are positioned to take advantage of the space that exists between adjacent wafer transport modules and adjacent process modules connected to the wafer transport modules. More specifically, the central axes of the buffer stacks are offset laterally from a mid-plane defined by the central rotation axes of the robots of the wafer transport modules. The central axis of a given buffer stack is defined as a vertical axis that extends through the center of the wafer when the wafer is stored in the buffer stack. And, the central rotation axes of the robots are aligned with each other in a front-to-back arrangement that defines the mid-plane. A unidirectional axis 270 may be defined along this mid-plane, extending rearward from the EFEM 200. As described in more detail below, a buffer module may be provided that defines the buffer stack. The wafer transport module and the buffer module are aligned with the unidirectional axis 270.

[0101] 2, the buffer stack 242 is defined in a nested position between the wafer transport modules 102 and 212 and the processing modules 106 and 214. A side projection 252 of the wafer transport assembly 209 receives and defines the position of the buffer stack 242, and extends laterally beyond the side portions 252 and 254 that interact with the adjacent processing modules 214 and 106, respectively. Additional side projections of the receiving wafer transport assembly define the positions of additional buffer stacks and are similarly configured with respect to the corresponding processing modules. For example, the side projection 262 is nested between the wafer transport modules 212 and 218 and the processing modules 214 and 220. The side projection 262 is configured to define the position of the buffer stack 246.

[0102] In some embodiments, the wafer transport assembly is configured such that the peripheral edge of the wafer, when placed on the buffer stack, extends laterally at least to a plane defined by the openings of the adjacent gate valves. In some embodiments, the peripheral edge of the wafer, when placed on the buffer stack, extends laterally beyond such plane. The more laterally the buffer stack is positioned, the closer adjacent wafer transport modules are to one another, but the wider the wafer transport assembly 209 is.

[0103] In terms of the architecture concept of the wafer transport assembly, the location of the buffer stacks is located on the lateral outside, which allows the wafer transport modules to be located closer to each other. This reduces the overall length from front to back of the wafer transport assembly. In some embodiments, the front to back length of the wafer transport assembly is about 10-11 feet (about 3-3.3 meters) for a wafer transport assembly having three wafer transport modules and four buffer stacks (not including optional buffer stacks 248 and 250). In some embodiments, the front to back length of the wafer transport assembly is about 6-8 feet (about 1.8-2.4 meters) for a wafer transport assembly having two wafer transport modules and two or four buffer stacks.

[0104] Considering the arrangement of the buffer stack, and more specifically, the arrangement of the protrusions of the side portion of the wafer transport assembly that houses the buffer stack, the corner area of ​​the processing module closest to the buffer stack is cut out or rounded. For example, with continued reference to FIG. 2, corner area 258 of processing module 106 is cut out to accommodate the protrusions of the side portion 252 of the wafer transport assembly. Similarly, corner area 260 of processing module 214 is also cut out to accommodate the protrusions of the side portion 252. The corner area of ​​the further processing module closest to the buffer stack is similarly configured to accommodate the side protrusions of the side portion of the wafer transport assembly that is defined to house the buffer stack.

[0105] It should be appreciated that the cut-out corner areas of the processing modules allow the processing modules to be positioned closer to their respective wafer transport modules than would otherwise be the case, given the placement of the buffer stacks within the wafer transport assembly 209. This provides a more efficient space utilization in the fab, as it reduces the lateral space requirements of the cluster tool system. Overall, the placement of the buffer stacks, the configuration of the lateral sides of the wafer transport assembly, and the cut-out configuration of the corner areas of the processing modules together provide a very compact cluster tool architecture that also provides great flexibility in terms of handling, storage, and transport of wafers within a controlled environment.

[0106] FIG. 3A is a perspective view showing a wafer transport assembly according to an embodiment of the present disclosure. In the illustrated embodiment, the wafer transport assembly 209 is comprised of two parts, which are assembled together to define the wafer transport assembly 209 as shown. A first part of the wafer transport assembly 209 is defined to include the wafer transport modules 102 and 212 and the buffer stacks 240 and 242 defined between the wafer transport modules 102 and 212. The first part can be modularly assembled from the wafer transport modules 102 and 212 with the buffer modules (disposed between the wafer transport modules) defining the buffer stacks 240 and 242. It can be seen that the wafer transport modules and the buffer modules are aligned on a single directional axis 270. A second part of the wafer transport assembly 209 is defined to include the wafer transport module 218 and the buffer stacks 244 and 246 defined between the wafer transport modules 212 and 218. A second buffer module can be configured to define buffer stacks 244 and 246, with the wafer transport module 218 and the second buffer module aligned with a single directional axis 270. Although not shown in FIG. 3A , an optional third portion can be attached to the rear end of the second section, the third portion being a (third) buffer module defining buffer stacks 248 and 250 and aligned with the single directional axis 270.

[0107] Thus, the illustrated and described modular configuration allows the wafer transport assembly to be configured with two or three wafer transport modules and one, two, or three pairs of buffer stacks. In a basic configuration, the wafer transport assembly may be defined with only the first portion, thus having two wafer transport modules and two buffer stacks. In some embodiments, the basic configuration is designed to fit within a SEMI E72 compliant elevator, thereby facilitating entry into the fab. In another configuration, a buffer module may be added to the basic configuration to add two additional buffer stacks (for a total of four buffer stacks). In another configuration, the second portion described above may be coupled to the first portion to define a wafer transport assembly as shown in FIG. 3A with three wafer transport modules and four buffer stacks. In yet another configuration, a buffer module may be added to provide a wafer transport assembly with three wafer transport modules and six buffer stacks.

[0108] In the illustrated embodiment, a first cover plate 300 defines a top of a first portion of the wafer transport assembly 209. The first cover plate 300 includes window portals 302 and 304 that can be opened to allow visual inspection of and provide access to the interior of the wafer transport assembly. A second cover plate 306 defines a top of a second portion of the wafer transport assembly 209. The second cover plate 306 also includes a window portal 308 that can be opened to similarly allow visual inspection of and provide access to the interior.

[0109] Thus, the wafer transport assembly 209 has been described as being comprised of several modular components. The modular assembly of the wafer transport assembly provides ease of configuration to fit a particular cluster tool setup and also facilitates repair and / or replacement of individual modules. Also, assembly / disassembly of the modules facilitates easy access to and from a given factory location. When fully assembled, the various modules of the wafer transport assembly 209 together define an outer housing, i.e., a housing that defines a continuous interior area that is maintained as a controlled environment. The housing contains the various components of the wafer transport assembly 209 (such as the robot and buffer stack).

[0110] At the front end of the wafer transport assembly 209 is located a load lock module 208. The load lock module 208 controls access to and from the wafer transport assembly 209 and facilitates the transfer of wafers between the lab ambient conditions of the EFEM and the vacuum or controlled ambient conditions of the wafer transport assembly 209. In some embodiments, the load lock module 208 is a double unit, i.e., the load lock 208 includes two separate load lock slots that are independently controlled to allow for loading and / or unloading two individual wafers simultaneously from the wafer transport assembly 209. The time required to evacuate the load lock slot (e.g., when a wafer is moving from the atmospheric conditions of the EFEM to the vacuum conditions of the wafer transport assembly) and / or fill the load lock slot (e.g., when a wafer is moving from the vacuum conditions of the wafer transport assembly to the atmospheric conditions of the EFEM) can be long and become a limiting factor in the ability of the cluster tool system to process wafers. Therefore, it is desirable to provide more than one load lock slot to allow for multiple wafers to be simultaneously moved in and / or out of the wafer transport assembly 209.

[0111] 3B is a perspective view of the wafer transport assembly of FIG. 3A with the cover plate removed to expose the interior of the wafer transport assembly in accordance with an embodiment of the present disclosure. As can be seen, a first portion 310 of the wafer transport assembly 209 includes buffer stacks 240 and 242 and a robot 224 (robot 102 is not visible in FIG. 3B). The robot 224 includes an end effector 314 configured to engage and support a wafer for handling by the robot. A second portion 312 of the wafer transport assembly includes buffer stack 244 (buffer stack 246 is not visible in FIG. 3B) and an end effector 316 of the robot 226 as shown.

[0112] 4A is a perspective view of a wafer transport module according to an embodiment of the present disclosure. For ease of description and contextual understanding of the wafer transport assembly, the wafer transport module 102 will be described. However, it should be understood that the description may also apply to the wafer transport modules 212 and 218 of the wafer transport assembly 209. The wafer transport assembly 209 may be defined from modular components that can be assembled or disassembled to provide simplicity of construction and facilitate repair and replacement of individual components as needed. In the illustrated embodiment, a view of the interior of the wafer transport module 102 is provided, where the robot 222 includes an end effector 400 configured to engage and support a wafer manipulated by the robot 222 as shown.

[0113] Also visible is a gate valve 230 that controls the opening to the processing module 106. The gate valve 230 can be opened for transfer of a wafer between the wafer transfer module 102 and the processing module 106 (e.g., for loading or unloading a wafer from the processing module), and the gate valve 230 can be closed to isolate the processing module 106 from the wafer transfer module 102 (e.g., during processing of a wafer). The gate valve 230 is defined along a side 402 of the wafer transfer module 102. The side 402 of the wafer transfer module 102 is configured to connect to the processing module 106. The side 402 of the wafer transfer module 102 can further include a sealing mechanism 404 configured to form an airtight seal when the processing module 106 is attached to the wafer transfer module 102. By way of example and without limitation, the sealing mechanism 404 can be defined by a gasket, corresponding grooves and slots, and / or any other type of mechanism that can achieve an airtight seal when the processing module 106 is connected to the wafer transfer module 102.

[0114] 4A, the back side 406 of the wafer transfer module 102 (opposite the EFEM 200) is also shown, where the back side 406 is configured to connect to a buffer module 410 (shown in FIG. 4B). The back side 406 of the wafer transfer module 102 may further include a sealing mechanism 408 configured to provide an airtight seal when the buffer module 410 is attached to the wafer transfer module 102.

[0115] In some embodiments, instead of a buffer module, such as for wafer transport module 212 or 218, a back cover plate may be attached to the back of the wafer transport module, thus defining the back of the wafer transport assembly in such embodiments. The modular components described above provide a system architecture of alternating wafer transport and buffer modules that can be assembled or disassembled in sequence to define a desired configuration of wafer transport assemblies.

[0116] 4B is a perspective view of a wafer transport module 102 and a buffer module 410 attached thereto, according to an embodiment of the present disclosure. A front face of the buffer module 410 (not visible in FIG. 4B) connects to a rear face 406 of the wafer transport module 102 to form an airtight seal between the modules. A rear face 412 of the buffer module 410 is further configured to be attached to either another wafer transport module or a back cover plate. The rear face 412 of the buffer module 410 may include a seal mechanism 414 configured to form an airtight seal with an adjacent wafer transport module or a back cover plate.

[0117] The buffer module 410 defines buffer stacks 240 and 242 configured to store multiple wafers. The side ends of the buffer modules define the above-mentioned side projections of the wafer transport assembly. The buffer stacks share the same controlled environment defined for the wafer transport modules. This provides the advantage of being able to buffer wafers within the controlled environment of the system without requiring transport outside the system. This helps to limit exposure to potential contaminants and prevent cycling wafers between different environments. For example, wafers that are processed under vacuum conditions and then exposed to atmospheric conditions may react with ambient gases or be exposed to contaminants or particles. Thus, locating the buffer stacks within the controlled environment of the wafer transport system provides a wafer storage location to avoid the effects of such potential adverse effects.

[0118] Each of the buffer stacks defines a plurality of wafer storage slots, each configured to store a single wafer (e.g., wafer 420). In the illustrated embodiment, the wafer storage slots of the buffer stack 240 are defined by support arms 416 configured to support a wafer within the buffer stack. Additionally, separators may be defined that separate the wafer storage slots from one another. It should be understood that in various embodiments, the number and arrangement of separators and wafer storage slots (defined by the support arms) may vary. In the illustrated embodiment, the buffer stack 240 is illustrated as having separators 418a, 418b, and 418c that separate four pairs of wafer storage slots. Thus, the illustrated buffer stack 240 includes a total of eight wafer storage slots. The buffer stack 242 is similarly configured with eight wafer storage slots, with four pairs of wafer storage slots separated by three separators.

[0119] 5 is a cross-sectional schematic diagram illustrating a buffer stack 500 in accordance with an embodiment of the present disclosure. The buffer stack 500 includes an upper portion 502 having wafer storage slots separated from one another by physical partitions and a lower portion 504 having wafer storage slots that are not separated from one another by a physical partition. A given wafer storage slot is defined by a set of support arms 508 configured to support a wafer (e.g., wafer 510) when stored in the given wafer storage slot. The wafer storage slots in the upper portion 502 are separated from one another by separators 506a, 506b, and 506c, and the upper portion 502 is separated from the lower portion 504 by separator 506d. The separators define physical partitions between adjacent wafer storage slots.

[0120] In some embodiments, the wafer storage slots in the upper portion 502 may be utilized to store wafers that may be more sensitive or susceptible to contamination, and the wafer storage slots in the lower portion 504 may be utilized to store wafers that are less sensitive or susceptible to contamination. In some embodiments, the lower portion 504 may be used to store wafers that are reused in the cluster tool system (such as cover wafers or seasoning wafers).

[0121] A cover wafer is used to cover the chuck of a processing module during chamber maintenance operations (e.g., in-situ cleaning). In conventional systems, the cover wafer is typically stored outside the wafer transport assembly under ambient laboratory conditions. This requires that a given cover wafer enter the wafer transport assembly through an airlock every time it is used, which can be an undesirable source of particles in the system. This can be particularly problematic if the cover wafer is used frequently (e.g., used in lots). As the cover wafer is used, it becomes etched, and repeatedly moving the cover wafer in and out of the wafer transport assembly through the loadlock becomes a source of particles that can ultimately reduce yield or necessitate more frequent maintenance / cleaning. Therefore, storing the cover wafer inside the wafer transport assembly (e.g., under vacuum conditions) and not exposing the cover wafer to the pressure cycles that result from moving the cover wafer in and out of the wafer transport assembly is advantageous because it reduces the amount of contaminants that enter the system.

[0122] Furthermore, in some embodiments, the chemicals for chamber cleaning may become corrosive after exposure to air / humidity. For example, if a chlorine-based chemical is applied, a cover wafer held in a vacuum may have highly non-volatile chlorides on the cover wafer surface. However, when the cover wafer is moved out of the wafer transport assembly into the air, the chlorides may react with the moisture in the air and release gases, causing corrosion. Therefore, storing the cover wafer under vacuum in the buffer stack described above may avoid this problem and extend the useful life of the cover wafer.

[0123] It should be understood that the above discussion regarding cover wafers and particle generation / erosion also applies to seasoning wafers utilized for firing within the chamber. In the embodiment illustrated in FIG. 5, a lower portion of the buffer stack, which does not have physical partitions separating the wafer storage slots, may be provided for and / or utilized to store cover wafers or seasoning wafers, while an upper portion of the buffer stack (which may have physical partitions separating the individual wafer storage slots) is provided for and / or utilized to store wafers undergoing processing operations within the cluster tool system. However, in alternative embodiments, cover wafers or seasoning wafers may be stored in any wafer storage slot (or portion of a wafer storage slot) within a buffer stack having any particular configuration of wafer storage slots and separators.

[0124] In some embodiments, an entire buffer stack may be provided for and / or utilized for storage of cover / seasoning wafers. For example, with reference to the embodiment of FIG. 2, buffer stack 248 and / or buffer stack 250 may be configured for storage of cover / seasoning wafers, providing a dedicated buffer stack for this purpose.

[0125] FIG. 6 is a cross-sectional view of a portion of a buffer module showing a buffer stack according to an embodiment of the present disclosure. The buffer stack 600 is similar to the embodiment of FIG. 5 and includes an upper portion 602 having wafer storage slots 610a, 610b, 610c, and 610d, and a lower portion 604 having wafer storage slots 612a, 612b, and 612c. The wafer storage slots 610a-d are individually separated by separators 606a, 606b, 606c, and 606d, while the wafer storage slots 612a-c are not individually separated by physical separators. In some embodiments, the wafer storage slots 612a-c in the lower portion 604 are provided for and / or utilized for storage of cover wafers, seasoning wafers, or any other type of wafers that are reused within a process module.

[0126] The buffer stack 600 further comprises a wafer storage slot 615 disposed below the lower portion 604 and separated therefrom by a separator 614. The wafer storage slot 615 comprises a wafer orienter 616 capable of supporting and rotating a wafer disposed thereon. It can be seen that as a given wafer is transported through the wafer transport assembly according to embodiments of the present disclosure, the rotational orientation of the wafer changes. For some processing modules, it may be desirable to place the wafer into the processing module at a particular rotational orientation. Thus, it is beneficial to have a wafer orienter integrated into the buffer stack to rotate a given wafer to have a particular rotational orientation desired for the processing module. In some embodiments, the wafer orienter 616 further comprises an actuator 618 extending below the main housing of the buffer module 410. The actuator 618 is configured to drive the rotation of the wafer orienter 616.

[0127] 7 is a diagram of a cluster tool system showing the orientation of a wafer as it is moved through various components of the system in accordance with an embodiment of the present disclosure. The illustrated system is similar to the embodiment of FIG. 2 and includes wafer transport modules 102, 212, and 218 and buffer stacks 240, 242, 244, and 246, collectively defining a wafer transport assembly.

[0128] In the illustrated embodiment, the buffer stacks are offset by 33 degrees. That is, the center of each buffer stack deviates by 33 degrees from a vector defined from the center of an adjacent wafer transport module to the center of another adjacent wafer transport module. For example, if a vector is defined from the center of wafer transport module 102 to the center of wafer transport module 212, then the centers of buffer stacks 240 and 242 each deviate by 33 degrees from such vector. Because the buffer stacks are offset, if there is no active rotation of a given wafer within the system, the rotational orientation of the wafer may differ from one process module to the next as it changes as it is moved through the buffer stacks.

[0129] Continuing with reference to FIG. 7, there is further illustrated a wafer 700 having a notch, the location of which is conceptually indicated by a dot designated by the numeral 702. For example, in the illustrated embodiment, the wafer 700 is illustrated entering the wafer transport assembly through the airlock 208, with the wafer 700 at this stage aligned with the notch in a vertical direction toward the rear of the wafer transport assembly. From this position, as the wafer 700 is moved by the wafer transport module 102 into the processing module 106, the wafer is rotated 90 degrees counterclockwise, so that the notch is oriented laterally toward the opening of the processing module 106. In some embodiments, this is the desired orientation for the wafer while in the processing module 106, and therefore no further rotation of the wafer or reconfiguration of the processing module is required. After processing in the processing module 106, the wafer 700 may be moved by the wafer transport module 102 to the buffer stack 242, which causes the wafer to be rotated an additional 57 degrees counterclockwise. The notch is manipulated by the wafer transport module 102 and oriented toward the center of the wafer transport module 102 as it is moved between the load lock 208 , the processing modules 100 or 106 , and the buffer stacks 240 or 242 .

[0130] From the buffer stack 242, when the wafer 700 is moved by the wafer transfer module 212 to the processing module 214, the wafer 700 is rotated an additional 57 degrees counterclockwise. This means that the notch deviates from the vector defined from the center of the wafer 700 to the center of the wafer transfer module 212 by 114 degrees counterclockwise. Since the desired orientation of the wafer 700 for the processing module 214 may not deviate from the defined vector, it may be desirable to rotate the wafer 700 before entering the processing module 214. For example, a wafer orienter integrated into the buffer stack 242 may be configured to rotate the wafer 700 by 114 degrees in a clockwise direction to prepare the wafer 700 to be aligned in the desired orientation when transferred into the processing module 214.

[0131] Similarly, when the wafer 700 is moved from the buffer stack 242 to the processing module 210 as shown, the wafer 700 is rotated 123 degrees clockwise, again resulting in the wafer orientation deviating 114 degrees counterclockwise from the desired orientation for the processing module 210. Similarly, a wafer orienter integrated into the buffer stack 242 may be configured to rotate the wafer 700 114 degrees in a clockwise direction to prepare the wafer 700 to be aligned in the desired orientation (notch facing the center of the wafer transfer module 212) when transferred into the processing module 210.

[0132] When the wafer 700 is moved by the wafer transfer module 212 from the processing module 214 to the buffer stack 246 as shown, the wafer 700 is rotated 57 degrees clockwise. When the wafer 700 is moved by the wafer transfer module 212 from either the buffer stack 242 or the processing module 210 to the buffer stack 246 as shown, the wafer 700 achieves the same orientation. When the wafer 700 is then moved by the wafer transfer module 218 from the buffer stack 246 to the processing module 220, the wafer 700 is rotated an additional 57 degrees, which means that the orientation of the notch deviates 132 degrees clockwise from the vector defined from the center of the wafer 700 to the center of the wafer transfer module 218. When the wafer 700 is moved from the buffer stack 246 to the processing module 216 by the wafer transfer module 218, the wafer 700 is rotated 123 degrees clockwise, which also means that the orientation of the notch deviates 132 degrees clockwise from the vector defined from the center of the wafer 700 to the center of the wafer transfer module 218. A wafer orienter may be provided in the buffer stack 246 to rotate the wafer during processing, if necessary, to ensure an optimal rotational orientation when transferred to the processing module.

[0133] Although in the discussion above the buffer stack is described as being offset by 33 degrees, it will be appreciated that in other embodiments the buffer stack is offset by an angle ranging from about 30-35 degrees. In yet other embodiments the buffer stack is offset by an angle ranging from about 25-40 degrees. The concepts discussed above regarding rotation of the wafer during transport within the system apply regardless of the particular angle by which the buffer stack is offset, and the particular orientation of the wafer at any given position within the system will be apparent to one of ordinary skill in the art.

[0134] In embodiments of the present disclosure, a wafer transport assembly can include several buffer stacks that are configured to serve various purposes and help provide greater throughput advantages over prior art systems. The buffer stacks can be utilized to define the path of the wafer. For example, in some embodiments, at least some of the wafer storage slots in at least some of the buffer stacks in a given wafer transport assembly are configured such that a wafer passes through a given buffer stack only once. In some embodiments, the system is configured such that a wafer enters a given buffer stack from one side and exits the buffer stack from the other side. For example, with continued reference to FIG. 7, the buffer stack 242 can be configured such that a wafer enters the buffer stack 242 from a side facing the wafer transport module 102 (front side) and exits the buffer stack 242 from a side facing the wafer transport module 212 (back side). In this manner, the wafer travels from the wafer transport module 102 to the wafer transport module 212 in a unidirectional transport through the buffer stack 242. By moving the wafers through the buffer stack in a unidirectional manner, the possibility of cross contamination from different processes is reduced since the wafers do not return to the same buffer stack.

[0135] Extending the concept with continued reference to Figure 7, buffer stacks 242 and 246 may be configured for wafers to move from the front side to the back side through each of the buffer stacks, while buffer stacks 244 and 240 are configured for wafers to move in the opposite direction from the back side to the front side through each of the buffer stacks. Conceptually, the wafer transport modules and buffer stacks thus define a path for the wafers through the wafer transport assembly and / or cluster tool system.

[0136] As an example and without limitation, a path for wafer 700 from the load lock may be defined to wafer transport module 102, buffer stack 242, wafer transport module 212, either processing module 210 or 214, wafer transport module 212, buffer stack 240, wafer transport module 102, and load lock 208.

[0137] As another example, a pathway for wafer 700 from the load lock may be defined to wafer transport module 102, buffer stack 242, wafer transport module 212, buffer stack 246, either of processing modules 216 or 220, wafer transport module 218, buffer stack 240, wafer transport module 212, buffer stack 240, wafer transport module 102, and load lock 208.

[0138] In some embodiments, certain buffer stacks are designed as input buffer stacks that are used for temporary storage of wafers being transferred to a processing module for processing, while other buffer stacks are designed as output buffer stacks that are used for temporary storage of wafers being processed and transferred out of the system. For example, in the illustrated embodiment, buffer stacks 242 and 246 may be designed as input buffer stacks, while buffer stacks 240 and 244 may be designed as output buffer stacks. This allows the input path of wafers to be defined separately from the output path of wafers, which may help avoid cross contamination and bottlenecks.

[0139] The above discussion of the pathways and utilization of the buffer stacks is provided by way of example and not limitation, and it should be understood that the buffer stacks of the present disclosure are defined within the same controlled environment (e.g., vacuum) as the wafer transport modules and may be flexibly deployed and utilized in any suitable manner to achieve efficient storage and movement of wafers through the cluster tool system.

[0140] 8 is a cross-sectional view of a portion of a cluster tool system in accordance with an embodiment of the present disclosure. In the illustrated embodiment, a pair of load locks 800 and 802 are arranged in a parallel configuration and connected between the wafer transfer module 102 and the EFEM 200. Each of the load locks 800 and 802 may be a dual slot load lock with two slots available for wafer transfer between the EFEM and the wafer transfer module 102. In such a configuration, the load locks together provide the capability to handle four wafers simultaneously. In some embodiments, one of the load locks may be used for wafers to enter the wafer transfer assembly and one of the load locks may be used for wafers to exit the wafer transfer assembly.

[0141] 9 is a conceptual diagram illustrating a configuration of load locks with integrated post-processing modules in accordance with an embodiment of the present disclosure. Load locks 800 and 802 are arranged in a parallel configuration. Load lock 800 includes slots 900 and 902, and load lock 802 includes slots 904 and 906, each configured for the transfer of wafers into and out of a wafer transport assembly.

[0142] Additionally, post-processing modules 908 and 910 are vertically stacked with the load locks 800 and 802, respectively. In various embodiments, the post-processing modules can be configured to perform post-processing operations (such as stripping or passivation operations) on the processed wafers. In the illustrated embodiment, the post-processing modules 908 and 910 are located above the load locks 800 and 802, respectively, but in other embodiments, the post-processing modules 908 and 910 can be located below the load locks 800 and 802, respectively. The post-processing modules 908 and 910 can be configured to perform stripping or passivation operations on the processed wafers before they exit the wafer transport assembly. The post-processing modules 908 and 910 open into the interior of the wafer transport assembly.

[0143] 2, for example, a processed wafer may be placed into one of the post-processing modules by wafer transport module 102. After completion of the post-processing (e.g., stripping or passivation) operation, the wafer is removed from the post-processing module by wafer transport module 102, placed into a wafer slot in one of the load locks 800 or 802, and transferred from wafer transport assembly 209 to EFEM 200.

[0144] It should be understood that embodiments of the present disclosure are applicable to any of a variety of sizes of substrates, including 200 mm, 300 mm, and 450 mm substrates, as well as non-standard sizes and shapes, such as square substrates.

[0145] FIG. 10 illustrates a control module 1000 for controlling the above-described system. For example, the control module 1000 may include a processor, a memory, and one or more interfaces. The control module 1000 may be used to control devices in the system, such as any of the above-mentioned components of the cluster tool system, including, but not limited to, the EFEM, load locks, post-processing modules, wafer transfer modules, wafer orienters, and processing modules, according to predetermined programming and based in part on sensed values. It should be understood that the control module 1000 may control any type of operation for which a given component is defined or capable of performing that operation, according to an embodiment of the present disclosure.

[0146] By way of example only, the control module 1000 may control one or more of the valves 1002, actuators 1004, pumps 1006, RF generators 1022, and other devices 1008 based on sensed values, predefined programming / instructions, and other control parameters. The control module 1000 receives sensed values ​​from, by way of example only, a pressure gauge 1010, a flow meter 1012, a temperature sensor 1014, and / or other sensors 1016.

[0147] For a given process module, the control module 1000 may be used to control the process conditions during reactant / precursor delivery and plasma processing. The control module 1000 typically includes one or more memory devices and one or more processors.

[0148] The control module 1000 may control the operation of the reactant / precursor delivery system and the plasma processing apparatus. The control module 1000 executes a computer program that includes a set of instructions for controlling the process timing, temperature of the delivery system, pressure differential across the filter, valve position, mixture of gases, chamber pressure, chamber temperature, wafer temperature, RF power levels, wafer chuck or pedestal position, and other parameters of a particular process. The control module 1000 may monitor the pressure differential and automatically switch the delivery of vapor precursor from one or more flow paths to one or more other flow paths. Other computer programs stored in a memory device associated with the control module 1000 may be used in some embodiments.

[0149] Typically, there is a user interface associated with the control module 1000. The user interface may include a display 1018 (e.g., a display screen and / or graphical software display of equipment and / or process conditions) and user input devices 1020, such as a pointing device, keyboard, touch screen, microphone, etc.

[0150] Computer program code for controlling precursor delivery, plasma processing, and other processes in a process sequence can be written in any conventional computer readable programming language, such as assembly language, C, C++, Pascal, Fortran, etc. The compiled object code or script is executed by a processor to perform the tasks specified in the program.

[0151] The control module parameters relate to process conditions such as, for example, filter pressure differential, process gas composition and flow rate, temperature, pressure, plasma conditions (such as RF power level and low frequency RF frequency), cooling gas pressure, and chamber wall temperature.

[0152] The system software may be designed or configured in many different ways. For example, various chamber component subroutines or control objects may be written to control the operation of the chamber components necessary to perform the deposition processes of the present invention. Examples of programs or program sections for this purpose include substrate positioning code, process gas control code, pressure control code, heater control code, and plasma control code.

[0153] The substrate positioning program may include program code for controlling chamber components used to load the substrate onto the pedestal or chuck and to control the spacing between the substrate and other parts of the chamber (such as the gas inlet and / or gas target). The process gas control program may include code for controlling gas composition and flow rates, and optionally for flowing gas into the chamber before deposition to stabilize the pressure in the chamber. The filter monitoring program includes code for comparing the measured difference to a predetermined value and / or code for switching flow paths. The pressure control program may include code for controlling the pressure in the chamber, for example, by adjusting a throttle valve in the exhaust system of the chamber. The heater control program may include code for controlling current to a heating unit for heating the precursor delivery system, the substrate, and / or components in other parts of the system. Alternatively, the heater control program may control the supply of a thermally conductive gas (such as helium) to the wafer chuck.

[0154] Examples of sensors that may be monitored during processing include, but are not limited to, mass flow control modules, pressure sensors (such as pressure gauge 1010), and thermocouples (e.g., temperature sensor 1014) located in the delivery system, pedestal, or chuck. Appropriately programmed feedback and control algorithms may be used with data from these sensors to maintain desired processing conditions. The implementation of embodiments of the present invention in single or multi-chamber semiconductor processing tools has been described above.

[0155] The above description of the embodiments is for purposes of illustration and description. It is not intended to be comprehensive or to limit the invention. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment and, where applicable, can be substituted and utilized in the selected embodiment unless otherwise shown or described. The same may be modified in many ways. Such modifications are not considered as a departure from the invention, and all such modifications are intended to be included within the scope of the invention.

[0156] Although the present embodiments have been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications may be made within the scope of the appended claims. The present embodiments are therefore to be considered as illustrative and not restrictive, and the embodiments are not to be limited to the details given herein, but may be modified within the scope of the claims and their equivalents. For example, the following application examples are possible. [Application Example 1] A wafer transport assembly, a first wafer transfer module; a second wafer transfer module; a buffer module connected between the first and second wafer transfer modules, the first wafer transfer module, the second wafer transfer module, and the buffer module being aligned on a unidirectional axis, the buffer module having a first buffer stack and a second buffer stack, the first buffer stack disposed at a first side end of the buffer module disposed on a first side of the unidirectional axis, and the second buffer stack disposed at a second side end of the buffer module disposed on a second side of the unidirectional axis; Equipped with a first side of the first wafer transfer module disposed on the first side of the unidirectional axis configured to connect to a first processing module; a first side of the second wafer transfer module disposed on the first side of the unidirectional axis configured to connect to a second processing module; the first side end of the buffer module defines a first side projection nested between the first and second wafer transfer modules and the first and second process modules; a second side of the first wafer transfer module disposed on the second side of the single-directional axis configured to connect to a third processing module; a second side of the second wafer transfer module disposed on the second side of the unidirectional axis configured to connect to a fourth process module; The second side end of the buffer module defines a second side projection nested between the first and second wafer transfer modules and the third and fourth process modules, and the first wafer transfer module, the second wafer transfer module, and the buffer module are configured to define a continuous controlled environment. Wafer transport assembly. [Application Example 2] A wafer transport assembly as described in Application Example 1, wherein the wafer transport assembly is configured to define a transport path for a wafer from one of the first or third processing modules, to the first wafer transport module, one of the first or second buffer stacks, the second wafer transport module, and one of the second or fourth processing modules. [Application Example 3] A wafer transport assembly according to Application Example 1, wherein each of the first and second buffer stacks is configured to store approximately 5 to 10 wafers. [Application Example 4] A wafer transport assembly according to Application Example 1, wherein the controlled environment is defined by a vacuum-controlled environment. [Application Example 5] A wafer transport assembly as described in Application Example 1, wherein the first and second buffer stacks define a plurality of wafer storage slots, and at least one of the wafer storage slots is configured to store a cover wafer within the controlled environment defined by the wafer transport assembly. [Application Example 6] The wafer conveying assembly according to Application Example 1, further comprising: a second buffer module connected to the second transfer module and aligned along the single-directional axis; The second buffer module includes a third buffer stack located at a first side end of the second buffer module disposed on the first side of the unidirectional shaft, and a fourth buffer stack located at a second side end of the second buffer module disposed on the second side of the unidirectional shaft. Wafer transport assembly. [Application Example 7] A wafer transport assembly as described in Application Example 6, wherein the first side end of the second buffer module defines a third side protrusion, and the second side end of the second buffer module defines a fourth side protrusion. [Application Example 8] The wafer conveying assembly according to Application Example 7, further comprising: a third wafer transfer module connected to the second buffer module and aligned along the single-directional axis; A first side of the third wafer transfer module disposed on the first side of the unidirectional axis is configured to connect to a fifth processing module, and a second side of the third wafer transfer module disposed on the second side of the unidirectional axis is configured to connect to a sixth processing module. Wafer transfer module. [Application Example 9] The wafer transport assembly according to Application Example 8, the third side projection is nested between the second and third wafer transfer modules and the second and fifth process modules; The fourth side projection is nested between the second and third wafer transfer modules and the fourth and sixth process modules. Wafer transport assembly. [Application Example 10] A wafer transport assembly as described in Application Example 1, wherein the wafer transport assembly is defined above a service tunnel extending from a front end of the wafer transport assembly to a rear end of the wafer transport assembly. [Example 11] A wafer transport assembly, Housing and a first wafer transfer robot disposed within the housing; a second wafer transfer robot disposed within the housing; first and second buffer stacks disposed within the housing and positioned between the first and second wafer transport robots; Equipped with a first interface defined along a first side of the housing and configured to connect to a first processing module; a second interface defined along the first side of the housing and configured to connect to a second processing module; a first side protrusion is defined along the first side of the housing between the first and second interfaces, the first side protrusion defining a location of the first buffer stack and nested between the first and second wafer transport robots and the first and second process modules; a third interface defined along a second side of the housing and configured to connect to a third processing module; a fourth interface defined along the second side of the housing and configured to connect to a fourth processing module; a second side protrusion is defined along the second side of the housing between the third and fourth interfaces, the second side protrusion defining a location of the second buffer stack and nested between the first and second wafer transport robots and the third and fourth process modules; The wafer transport assembly defines a continuously controlled environment. Wafer transport assembly. [Application Example 12] A wafer transport assembly as described in Application Example 11, wherein the wafer transport assembly is configured to define a transport path for a wafer from one of the first or third processing modules, to the first wafer transport robot, one of the first or second buffer stacks, the second wafer transport robot, and one of the second or fourth processing modules. [Application Example 13] The wafer conveying assembly according to Application Example 11, further comprising: a connector for connecting to a vacuum source; The continuous controlled environment is defined by a vacuum controlled environment. Wafer transport assembly. [Application Example 14] The wafer transport assembly according to Application Example 11, an upper portion of the first buffer stack defining a plurality of first wafer storage slots, the upper portion of the first buffer stack having one or more separators defined between each of the plurality of first wafer storage slots; A lower portion of the first buffer stack defines a plurality of second wafer storage slots, the lower portion of the first buffer stack having no separators defined between each of the plurality of second wafer storage slots. Wafer transport assembly. [Application Example 15] A wafer transport assembly as described in Application Example 14, wherein the lower portion of the first buffer stack is configured to store one or more cover wafers or seasoning wafers. [Application Example 16] A wafer transport assembly according to Application Example 11, wherein each of the first and second buffer stacks is configured to store approximately 5 to 10 wafers. [Application Example 17] A wafer transport assembly as described in Application Example 11, wherein the wafer transport assembly is defined above a service tunnel extending from a front end of the wafer transport assembly to a rear end of the wafer transport assembly.

Claims

1. 1. A substrate processing system configured to process a substrate, comprising: a substrate transport assembly enclosing a defined controlled environment within a continuous transport space; at least two processing modules connected to the substrate transport assembly, the substrate transport assembly being configured to transport substrates to and from the at least two processing modules through the continuous transport space; at least two gas boxes configured to supply a gas mixture to the at least two processing modules; an exhaust duct configured to selectively exhaust the at least two process modules through the at least two gas boxes; A substrate processing system, wherein a surface of the at least two gas boxes has perforations configured to allow gas to flow from the at least two gas boxes to the exhaust duct.

2. 2. The substrate processing system of claim 1, The at least two gas boxes are disposed below the substrate transport assembly and the at least two processing modules.

3. 2. The substrate processing system of claim 1, further comprising: A substrate processing system comprising a plurality of gas lines configured to supply gas to the at least two gas boxes, the plurality of gas lines extending through the exhaust duct to the at least two gas boxes.

4. 4. The substrate processing system according to claim 3, The plurality of gas lines extend through the exhaust duct from a region outside the continuous transfer space to a region inside the continuous transfer space.

5. 2. The substrate processing system of claim 1, further comprising:

11. A substrate processing system comprising: a service tunnel defined below the substrate transport assembly, the at least two gas boxes being positioned along sides of the service tunnel below the substrate transport assembly and the at least two processing modules.

6. 6. The substrate processing system according to claim 5, the substrate transport assembly extends along a longitudinal axis of the substrate processing system; the at least two processing modules are connected to the substrate transport assembly along a side of the substrate transport assembly; The service tunnel extends along the longitudinal axis of the substrate processing system.

7. 7. The substrate processing system according to claim 6, The service tunnel has a vertical dimension defined between an underside of the substrate transport assembly and a service floor disposed below the substrate transport assembly.

8. 8. The substrate processing system according to claim 7, A substrate processing system, wherein the service floor is defined at an elevation lower than an elevation of a factory floor.

9. 9. The substrate processing system of claim 8, A substrate processing system, wherein the elevation of the service floor is between 30.5 cm and 61 cm lower than the elevation of the factory floor.

10. 7. The substrate processing system according to claim 6, A substrate processing system, wherein the substrate transport assembly comprises at least two substrate transport modules arranged along the longitudinal axis, each of the substrate transport modules being connected to one of the at least two processing modules.

11. The substrate processing system according to claim 6, further comprising: A substrate processing system comprising: at least two processing module frames configured to support the at least two processing modules along the sides of the substrate transport assembly above a factory floor.

12. 7. The substrate processing system according to claim 6, The substrate transport assembly has a first end oriented toward an equipment front end module and a second end opposite the first end.

13. 13. The substrate processing system of claim 12, The service tunnel extends along the longitudinal axis from the first end to the second end.

14. 14. The substrate processing system of claim 13, A substrate processing system, wherein the first end of the substrate transport assembly is configured to connect to a load lock that controls access to the equipment front end module, and a first end of the service tunnel extends substantially to the equipment front end module.

15. 7. The substrate processing system according to claim 6, A substrate processing system, wherein the height of the service tunnel ranges from 183 cm to 244 cm.

16. 2. The substrate processing system of claim 1, the substrate transport assembly includes a first substrate transport module, a second substrate transport module, and a first buffer stack disposed in the continuous transport space; a first portion of the first buffer stack defining a first plurality of substrate storage slots and having one or more separators defined between each of the first plurality of substrate storage slots; A substrate processing system, wherein a second portion of the first buffer stack defines a second plurality of substrate storage slots having no separators defined therebetween.

17. 17. The substrate processing system of claim 16, A substrate processing system, wherein at least one of the first substrate transfer module and the second substrate transfer module are configured to store at least one of a seasoning substrate and a cover substrate in the second portion of the first buffer stack.

18. 17. The substrate processing system of claim 16, A substrate processing system, wherein at least one of the first substrate transfer module and the second substrate transfer module are configured to store at least one of processed and unprocessed substrates in the first portion of the first buffer stack.

Images