Component crimping device and component crimping method

Abstract

To provide a component crimping device capable of appropriately crimping components while suppressing upsizing.SOLUTION: A component crimping device 100 includes a substrate placement unit 37, a component supply unit 33, a holding head 34, a head transfer unit 32, a cleaning unit 38, and a control unit 2a. The control unit 2a controls the head transfer unit 32 to transfer the holding head 34 holding a component 5 from the component supply unit 33 side toward the substrate placement unit 37 side along a Y-axis direction, (a) causes the cleaning unit 38 to clean a cleaning target area on one surface of the component 5 held by the holding head 34, and (b) changes the relative position of the holding head 34 with respect to the cleaning unit 38 in an X-axis direction when the holding head 34 reaches the position of the cleaning unit 38 by moving along the Y-axis direction.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a component crimping device that crimps a component onto a substrate. [Background technology]

[0002] Conventionally, a component bonding device that bonds electronic components (hereinafter simply referred to as "components") to a substrate such as a liquid crystal panel has been provided as, for example, a component mounting device (see Patent Document 1). This component bonding device is equipped with a rotating brush, and cleans the component terminals of the components by rotating the rotating brush. This makes it possible to remove foreign matter adhering to the component terminals. As a result, it is possible to prevent foreign matter from getting between the electrodes of the substrate and the component terminals, which would otherwise result in the component being inappropriately bonded to the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-272754 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the component crimping device of Patent Document 1, depending on the size of the components, the entire device may become large.

[0005] Therefore, the present disclosure provides a component crimping device and the like that can appropriately crimp components while preventing the device from becoming too large. [Means for solving the problem]

[0006] A component crimping device according to one embodiment of the present disclosure includes a substrate mounting section on which a substrate is mounted, a component supply section that supplies components to be crimped to the substrate, a holding head that holds the components supplied from the component supply section, a head transport section that transports the holding head, a cleaning section for cleaning the components, and a control section that controls at least the head transport section and the cleaning section, wherein the control section controls the head transport section to transport the holding head holding the components along a first direction from the component supply section side toward the substrate mounting section side, and when the holding head reaches the position of the cleaning section by transporting along the first direction, (a) causes the cleaning section to clean a region to be cleaned on one side of the component held by the holding head, and (b) changes the relative position of the holding head with respect to the cleaning section to a second direction that is approximately parallel to the one side of the component and intersects the first direction.

[0007] These comprehensive or specific aspects may be realized by a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be realized by any combination of the system, the method, the integrated circuit, the computer program, and the recording medium. The recording medium may be a non-transitory recording medium. Effect of the Invention

[0008] The component crimping device of the present disclosure can appropriately crimp components while preventing the device from becoming too large.

[0009] Further advantages and benefits of certain aspects of the present disclosure will become apparent from the specification and drawings, in which such advantages and / or benefits are provided by some of the embodiments and features described in the specification and drawings, respectively, but not necessarily all of which are provided to obtain one or more identical features. [Brief description of the drawings]

[0010] [Figure 1]FIG. 1 is a diagram showing a schematic configuration of a component mounting line according to an embodiment. [Diagram 2] FIG. 2 is a plan view of a component mounting line according to the embodiment. [Diagram 3] FIG. 3 is a diagram showing a computer and each of the components controlled by the computer, which are provided in the component mounting line in the embodiment. [Figure 4] FIG. 4 is a block diagram showing a configuration of a component crimping device according to an embodiment. [Diagram 5] FIG. 5 is a diagram showing an example of a cleaning unit according to the embodiment. [Figure 6] FIG. 6 is a diagram for explaining the operation of the component crimping device in the embodiment. [Figure 7] FIG. 7 is a diagram for explaining a cleaning pattern in the embodiment. [Figure 8] FIG. 8 is a flow chart showing an example of a processing operation according to a first pattern by the component crimping device in the embodiment. [Figure 9] FIG. 9 is a flow chart showing an example of a processing operation according to the second pattern by the component crimping device in the embodiment. [Figure 10] FIG. 10 is a diagram for explaining the operation of the component crimping device according to the modified example of the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] (Findings on which this disclosure is based) The present inventors have found that the component crimping device of Patent Document 1 described in the "Background Art" section has the following problems.

[0012] For example, components such as TCP (Tape carrier package) are supplied by pulling out the tape from a reel and punching the components from the tape. Since the TCP is punched out from the tape in this manner, the TCP may have burrs attached thereto. Therefore, a component bonding device that bonds the TCP to a substrate can remove the burrs from the components by providing a rotating brush, as in the component bonding device of Patent Document 1.

[0013] In addition, components such as TCP are provided in multiple pieces on the above-mentioned tape, and their sizes are standardized. Therefore, if a component bonding device is equipped with a rotating brush that corresponds to the maximum size of the TCP, it can remove burrs and other foreign matter from various TCPs and properly bond the TCP to a substrate.

[0014] However, the size of components such as FPCs (flexible printed circuits) is not standardized and there are various sizes. In other words, the electrode part in which multiple electrodes are arranged in the FPC varies from large to small. Therefore, in order to clean the electrode part of such an FPC, the component bonding device needs to be equipped with a rotating brush of a size corresponding to the largest expected size of the electrode part. In other words, the component bonding device needs to be equipped with a large rotating brush. In addition, it is difficult to place such a large rotating brush inside the component bonding device, and there is a possibility that the component bonding device will become large.

[0015] In order to solve such problems, a component bonding device according to one embodiment of the present disclosure includes a substrate placement section on which a substrate is placed, a component supply section that supplies components to be bonded to the substrate, a holding head that holds the components supplied from the component supply section, a head transport section that transports the holding head, a cleaning section that cleans the components, and a control section that controls at least the head transport section and the cleaning section, and the control section controls the head transport section to transport the holding head holding the components from the component supply section side to the substrate placement section side along a first direction, and when the holding head reaches the position of the cleaning section by transporting it along the first direction, (a) causes the cleaning section to clean a cleaning target area on one side of the component held by the holding head, and (b) changes the relative position of the holding head with respect to the cleaning section to a second direction that is substantially parallel to the one side of the component and intersects with the first direction. For example, the cleaning target area is an area on the component where an electrode portion is formed. Also, for example, the cleaning part may be a rotating brush that rotates around a rotation axis along the second direction, and the control part, in changing the relative position, may change the relative position by moving at least one of the holding head and the cleaning part along the direction of the rotation axis.

[0016] As a result, when the holding head reaches the position of the cleaning unit, the relative position between the holding head and the cleaning unit in the second direction is changed. Therefore, even if a part of the cleaning target area of ​​the component is not cleaned by the cleaning unit before the change of the relative position, after the change of the relative position, the part that was not cleaned before the change can be cleaned. As a result, even if the cleaning unit is shorter in the second direction than the cleaning target area, the entire cleaning target area can be cleaned. Therefore, even when components of various sizes such as FPCs are pressure-bonded to a substrate, it is not necessary to make the cleaning unit large. This makes it possible to prevent the component pressure-bonding device from becoming large, and to remove foreign matter from the cleaning target area of ​​the component and properly pressure-bond the component to the substrate.

[0017] In addition, when the area to be cleaned is longer in the second direction than a contact area on one side of the component that is in contact with the cleaning part, the control unit may change the relative position by moving at least one of the holding head and the cleaning part along the second direction. Note that the length of the contact area in the second direction may be equal to the length of the cleaning part in the second direction.

[0018] This makes it possible to avoid changing the relative positions, i.e., to avoid moving at least one of the holding head and the cleaning unit along the second direction, when the length of the area to be cleaned in the second direction is equal to or less than the length of the contact area in the second direction. As a result, it is possible to eliminate the need to move at least one of the holding head and the cleaning unit even when the entire area to be cleaned of the part can be cleaned without moving at least one of the holding head and the cleaning unit along the second direction. In other words, it is possible to reduce the processing load without making unnecessary changes to the relative positions.

[0019] In addition, when the holding head reaches the position of the cleaning unit by transporting it along the first direction, the control unit may further control at least one of the holding head, the head transport unit, and the cleaning unit to switch the positioning state between one side of the component held by the holding head and the cleaning unit between a contact state in which the one side of the component is in contact with the cleaning unit and a separated state in which the one side of the component is away from the cleaning unit, and in cleaning by the cleaning unit, before and after the change in the relative position, when the positioning state is the contact state, cause the cleaning unit to clean the area to be cleaned, and in changing the relative position, when the positioning state is the separated state, change the relative position by moving at least one of the holding head and the cleaning unit along the second direction.

[0020] For example, when one of the holding head and the cleaning unit moves along the second direction to change the relative position, if the part held by the holding head is in contact with the cleaning unit, the part receives a frictional force from the cleaning unit in the second direction. As a result, the part may be displaced in the second direction relative to the holding head. However, in the above embodiment, when one of the holding head and the cleaning unit moves along the second direction, the part held by the holding head is separated from the cleaning unit. Therefore, the movement along the second direction can prevent the part from being displaced in the second direction from the holding head.

[0021] In addition, when the holding head reaches the position of the cleaning unit by transporting it along the first direction, the control unit may further control at least one of the holding head, the head transport unit, and the cleaning unit to switch the arrangement state between one side of the component held by the holding head and the cleaning unit between a contact state in which the one side of the component is in contact with the cleaning unit and a separated state in which the one side of the component is away from the cleaning unit, and in cleaning by the cleaning unit, when the arrangement state is the contact state, cause the cleaning unit to clean the area to be cleaned, and in changing the relative position, when the arrangement state is the contact state, change the relative position by moving at least one of the holding head and the cleaning unit along the second direction.

[0022] This allows cleaning of the area to be cleaned of the component and changing of the relative position to be performed simultaneously when the arrangement state is in the contact state. In other words, at least one of the holding head and the cleaning unit can be moved along the second direction while cleaning the area to be cleaned. This allows the time required for cleaning to be shortened. Furthermore, since the cleaning unit moves in the second direction relative to the component while contacting the area to be cleaned of the component, the cleaning effect can be improved.

[0023] In addition, the component bonding apparatus may further include a component mounting section arranged between the cleaning section and the substrate mounting section, and an imaging section that images the component, and the control section may further control the head transport section to transport the holding head holding the cleaned component to the component mounting section, cause the holding head to place the component on the component mounting section, cause the imaging section to image the component mounted on the component mounting section, and based on the imaging result by the imaging section, cause a bonding head to hold the component, and cause the bonding head to bond the component to the substrate mounted on the substrate mounting section.

[0024] As a result, even if the component is displaced from the holding head due to cleaning of the component, the component can be appropriately held by the crimping head based on the imaging result by the imaging unit. That is, the crimping head can be brought into contact with an appropriate position of the component to hold the component on the crimping head. As a result, the component held by the crimping head can be accurately crimped to a predetermined crimping target portion of the board. Therefore, the quality of the mounting board manufactured by crimping the component to the board can be improved.

[0025] The crimping head may be the holding head.

[0026] As a result, the holding head also functions as a crimping head, so that the number of parts in the component crimping device can be reduced and the configuration of the component crimping device can be simplified.

[0027] The component crimping device may further include a crimping head that is different from the holding head.

[0028] This allows the holding head and the crimping head to share the processing load, thereby enabling the component cleaning process by the holding head and the component crimping process by the crimping head to proceed in parallel, improving productivity.

[0029] Hereinafter, the embodiment will be specifically described with reference to the drawings.

[0030] In addition, the embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement and connection forms of components, steps, and order of steps shown in the following embodiments are examples and are not intended to limit the present disclosure. In addition, among the components in the following embodiments, components that are not described in the independent claims showing the highest concept are described as optional components. In addition, each figure is a schematic diagram and is not necessarily illustrated precisely. In addition, the same components are given the same symbols in each figure. In addition, expressions such as "approximately parallel" are used in the following embodiments. For example, "approximately parallel" does not only mean completely equal, but also means substantially parallel, that is, including an error of, for example, a few percent. In addition, "approximately parallel" means parallel within the range in which the effects of the present disclosure can be achieved. The same applies to other expressions using "approximately".

[0031] (Embodiment) [Schematic configuration of component mounting line] FIG. 1 is a diagram showing a schematic configuration of a component mounting line in this embodiment.

[0032] The component mounting line 1 in this embodiment is a system that produces mounted boards by mounting components 5 on a board 3, which is a display panel such as a liquid crystal panel or an organic EL (Electro-Luminescence) panel. The components 5 are, for example, electronic components such as a drive circuit, e.g., an FPC. Specifically, as shown in FIG. 1, the component mounting line 1 has a board carry-in section 10, a bonding section 20, a temporary pressure bonding section 30, a full pressure bonding section 40, and a board carry-out section 50. The board carry-in section 10, the bonding section 20, the temporary pressure bonding section 30, the full pressure bonding section 40, and the board carry-out section 50 are connected in this order.

[0033] The substrate carry-in section 10 receives a rectangular substrate 3 carried in by a worker or from another device on the upstream side. The substrate 3 is then carried out to the bonding section 20 on the downstream side.

[0034] The adhering section 20 receives the substrate 3 carried out from the substrate carry-in section 10, and adheres an adhesive member to each of the plurality of electrode sections 4 on the periphery of the substrate 3. Then, the substrate 3 to which the adhesive member has been adhered is carried out to the temporary pressure-bonding section 30. Each of the plurality of electrode sections 4 is, for example, composed of a plurality of electrodes.

[0035] The temporary bonding unit 30 receives the substrate 3 carried out from the attaching unit 20, and mounts and presses the component 5 on the portion of the substrate 3 to which the adhesive member is attached. Then, the substrate 3 to which the component 5 is pressed is carried out to the full pressure bonding unit 40. The pressing performed in the temporary pressure bonding unit 30 is also called temporary pressure bonding.

[0036] The final compression bonding section 40 receives the board 3 carried out from the temporary compression bonding section 30, and performs final compression bonding (also called thermocompression bonding) on ​​the components 5 temporarily bonded to the board 3. Then, the board 3 that has been subjected to the final compression bonding is carried out to the board carrying-out section 50.

[0037] The substrate unloading section 50 receives the substrate 3 unloaded from the full-pressure bonding section 40. The substrate 3 received by the substrate unloading section 50 is unloaded to the downstream side.

[0038] In this manner, the component mounting line 1 performs the component mounting work of mounting components 5 to each of the multiple electrode portions 4 provided on the periphery of the brought-in board 3, and then transports the mounted board, which is the board 3 on which the components 5 are mounted, out of the board removal section 50.

[0039] [Detailed configuration of component mounting line] Fig. 2 is a plan view of the component mounting line 1 in this embodiment. Specifically, Fig. 2 shows the configuration of the component mounting line 1 seen from above. In this embodiment, the conveying direction of the board is referred to as the X-axis direction, the vertical direction is referred to as the Z-axis direction, and the direction perpendicular to the X-axis direction and the Z-axis direction, i.e., the depth direction, is referred to as the Y-axis direction. The negative side and the positive side in the X-axis direction correspond to the upstream side and the downstream side, respectively, of the conveying direction of the board, the negative side and the positive side in the Z-axis direction correspond to the lower side and the upper side, respectively, of the vertical direction, and the negative side and the positive side in the Y-axis direction correspond to the near side and the far side, or the front side and the rear side, respectively, of the depth direction.

[0040] The substrate loading section 10 includes a base 1a on which the substrate 3 to be loaded is placed. The base 1a of the substrate loading section 10 is provided with a stage 11 on which the substrate 3 is placed. The stage 11 moves up and down in the Z-axis direction relative to the base 1a. In addition, a plurality of suction holes 11a are provided on the upper surface of the stage 11. The stage 11 holds the substrate 3, which has been loaded by an operator or from another upstream device and placed on the stage 11, by vacuum suction through the suction holes 11a using a suction device such as a pump (not shown).

[0041] The adhering unit 20 has a function of performing an adhering operation (in other words, an adhering process) of adhering an ACF (Anisotropic Conductive Film), which is an adhesive member, to the electrode portion 4 of the substrate 3. The ACF is also called an anisotropic conductive adhesive, and is a member for electrically connecting the electrode portion 4 of the substrate 3 and the component 5. The adhering unit 20 includes a substrate moving mechanism 21 and an adhering mechanism 22.

[0042] The substrate moving mechanism 21 is a mechanism that moves the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a stage 23. In the substrate moving mechanism 21, the X-axis table, the Y-axis table, the Z-axis table, and the stage 23 are stacked on top of each other on the base 1b in this order from the bottom.

[0043] The Y-axis table is provided to extend in the Y-axis direction and moves freely in the X-axis direction on the X-axis table. The Z-axis table moves freely in the Y-axis direction on the Y-axis table, and raises and lowers the stage 23 provided on the upper portion in the Z-axis direction and rotates it around the Z axis.

[0044] Furthermore, a plurality of suction holes 23a are provided on the upper surface of the stage 23, and the stage 23 holds the substrate 3 placed on its upper surface by vacuum suction. In this manner, the substrate moving mechanism 21 suctions and holds the substrate 3, moves it within a horizontal plane (specifically, in the X-axis and Y-axis directions), raises and lowers it in the vertical direction (specifically, in the Z-axis direction), and rotates it around the Z axis.

[0045] The bonding mechanism 22 is provided with, for example, two bonding heads aligned in the X-axis direction above the base 1b. Each bonding head is provided with a supply unit that supplies ACF and a bonding tool for bonding the ACF to the substrate 3. Each of the two bonding heads bonds the ACF to positions on the substrate 3 that correspond to the multiple electrode portions 4. Also, a bonding support stand is provided at a position corresponding to each of the two bonding heads below.

[0046] The pre-bonding unit 30 performs a pre-bonding step of mounting and pre-bonding a component 5 on the area of ​​the substrate 3 where the ACF is attached (i.e., the target portion for bonding). The pre-bonding unit 30 includes a substrate moving mechanism 31, a head transport unit 32, a component supply unit 33, a holding head 34, a component placement unit 35, and a support unit 36.

[0047] The substrate moving mechanism 31 has a structure similar to that of the substrate moving mechanism 21 of the adhesion unit 20. Specifically, the substrate moving mechanism 31 has a substrate placement unit 37, which is a stage on which the substrate 3 is placed. A plurality of suction holes 37a are provided on the upper surface of the substrate placement unit 37. The substrate moving mechanism 31 holds the substrate 3 placed on the substrate placement unit 37 by vacuum suction through the plurality of suction holes 37a. The substrate moving mechanism 31 also has a function of moving the substrate placement unit 37, which suction-holds the substrate 3, in a horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. By moving and rotating the substrate placement unit 37, the substrate moving mechanism 31 positions the region of the substrate 3, which is held by suction and has the ACF attached, above the lower support unit 36, which is a backup stage. Although the substrate moving mechanism 31 has the substrate placement unit 37 as described above, the substrate placement unit 37 may be moved and rotated without having the substrate placement unit 37.

[0048] The component supply unit 33 is provided on the inner side of the head transport unit 32 (i.e., on the positive side in the Y-axis direction) and protrudes from the rear of the base 1b. For example, in the component supply unit 33, two tray sets are arranged along the X-axis direction. The tray set is made up of a plurality of trays 7, and these trays 7 are stacked along the Z-axis direction. Furthermore, a plurality of components 5 are placed on these trays 7. The component supply unit 33 includes a tray moving unit 33e that moves the tray 7 on which the plurality of components 5 are placed to the negative side in the Y-axis direction, and the tray moving unit 33e supplies the plurality of components 5 together with the tray 7 to the head transport unit 32 side. In this manner, the component supply unit 33 supplies the components 5 to be pressure-bonded to the board 3.

[0049] The holding head 34 sucks and holds the component 5 supplied from the component supply unit 33. Such a holding head 34 moves up and down along the Z-axis direction. For example, the holding head 34 sucks and holds the component 5 while descending, and then rises while still holding the component 5.

[0050] The head transport section 32 transports the holding head 34. Specifically, the head transport section 32 transports the holding head 34 in the X-axis direction and the Y-axis direction.

[0051] The cleaning unit 38 is a member for cleaning the components 5 held by the holding head 34. Specifically, the cleaning unit 38 is a rotating brush that rotates about a rotation axis along the X-axis direction.

[0052] The component placement part 35 is also called a pre-alignment stage, and is disposed between the cleaning part 38 and the substrate placement part 37. On this component placement part 35, a component 5 that has been cleaned is placed.

[0053] The lower support part 36 is also called a backup stage, and supports from below a predetermined part of the substrate 3 held by the substrate mounting part 37, which is a part to be bonded. The part to be bonded is a part of the edge of the substrate 3 to which the ACF is attached.

[0054] In such a temporary bonding unit 30, the holding head 34 is moved in the X-axis direction and the Y-axis direction by the head transport unit 32, and stops on the component 5 to be bonded that is placed on the tray 7 moved by the tray movement unit 33e. Thereafter, the holding head 34 descends to adsorb (i.e., pick up) the component 5 to be bonded from above, and then rises while holding the component 5.

[0055] Then, the holding head 34 is transferred to the negative side in the Y-axis direction by the head transfer unit 32, and reaches the position of the cleaning unit 38. At this time, the component 5 held by the holding head 34 is cleaned by the cleaning unit 38. When the cleaning unit 38 has completed cleaning of the component 5, the holding head 34 places the cleaned component 5 on the component placement unit 35. Then, the holding head 34 holds the component 5 placed on the component placement unit 35 after the position is adjusted in the X-axis and Y-axis directions by the head transfer unit 32. That is, the holding head 34 aligns the held component 5 by re-holding it. Then, the holding head 34, which has re-held the component 5, is transferred to the substrate placement unit 37 side by the head transfer unit 32, and stops on the lower support unit 36. Thereafter, the holding head 34 descends in the Z-axis direction and pressure-bonds the component 5 to the pressure-bonding target portion of the substrate 3 supported by the lower support unit 36. That is, the holding head 34 places the picked-up component 5 on the ACF and presses it against the receiving part 36 together with the substrate 3, thereby pre-bonding the component 5 to the substrate 3. For example, the holding head 34 presses the component 5 to the substrate 3 in a state where it is heated to about 80° C. The pre-bonding part 30 may include a mechanism for rotating the orientation of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees.

[0056] The final bonding unit 40 performs a final bonding process (i.e., a thermocompression process) of final bonding (i.e., thermocompression bonding) of the component 5, which has been temporarily bonded to the substrate 3 by the temporary bonding unit 30, to the substrate 3. In this manner, the electrode unit 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. The final bonding unit 40 includes a substrate moving mechanism 41 and a bonding mechanism 42.

[0057] The substrate moving mechanism 41 has a structure similar to that of the substrate moving mechanism 21 of the bonding unit 20. Specifically, the substrate moving mechanism 41 has a stage 49. A plurality of suction holes 49a are provided on the upper surface of the stage 49. The substrate moving mechanism 41 holds the substrate 3 placed on the stage 49 by vacuum suction through the plurality of suction holes 49a. The substrate moving mechanism 41 also has a function of moving the stage 49 that suction-holds the substrate 3 in a horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. The substrate moving mechanism 41 positions the region where the component 5 of the substrate 3, which is suction-held and temporarily pressure-bonded, above the lower support portion 46 of the pressure bonding mechanism 42 by moving and rotating the stage 49.

[0058] The crimping mechanism 42 is provided on the base 1b, and includes a crimping tool 43 and a lower support 46.

[0059] The bonding tool 43 is heated and presses the component 5 of the substrate 3 supported by the support 46 towards the support 46. For example, the bonding tool 43 presses the component 5 in a state where it is heated to about 200° C. As a result, the component 5 is fully bonded, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF.

[0060] The substrate unloading section 50 has a function of holding the substrate 3 transported from the main pressure bonding section 40 on the stage 51 by vacuum suction. The substrate 3 held in the substrate unloading section 50 is either unloaded to another device on the downstream side or removed from the stage 51 by an operator.

[0061] The stage 51 moves up and down in the Z-axis direction relative to the base 1c. In addition, a plurality of suction holes 51a are provided on the upper surface of the stage 51, and the stage 51 holds the substrate 3 transferred from the main pressure bonding unit 40 by vacuum suction on the upper surface.

[0062] The transport unit 60 is a device that transports the substrate 3. Specifically, the transport unit 60 has a function of transferring (transporting) the substrate 3 that has been loaded into the substrate loading unit 10 to the bonding unit 20, the temporary pressure bonding unit 30, the final pressure bonding unit 40, and the substrate unloading unit 50 in this order. The transport unit 60 is disposed in a front area (i.e., on the negative side in the Y-axis direction) of the bonding unit 20, the temporary pressure bonding unit 30, and the final pressure bonding unit 40. The transport unit 60 includes a substrate transport mechanism 62A, a substrate transport mechanism 62B, a substrate transport mechanism 62C, and a substrate transport mechanism 62D that are disposed in this order from the upstream side on a moving base 61 that extends in the X-axis direction across the bases 1a, 1b, and 1c.

[0063] Each of the substrate transport mechanisms 62A to 62D includes a base 63 and one or more arm units 64. In this embodiment, a case is illustrated in which each of the substrate transport mechanisms 62A to 62D includes two arm units 64. The base 63 is provided on a moving base 61, and moves freely in the X-axis direction. The two arm units 64 are provided on the base 63 side by side in the X-axis direction. The arm unit 64 vacuum-sucks the substrate 3 from above.

[0064] Each of the substrate transport mechanisms 62A to 62D moves to a substrate transfer position where the substrate 3 held by the stage 11, 23, 37, 49, 51 is vacuum-sucked from above, and receives or transfers the substrate 3 from the rising and lowering stage 11, 23, 37, 49, 51. For example, the substrate transport mechanism 62A receives the substrate 3 placed on the stage 11 of the substrate carry-in section 10, and transfers it to the stage 23 of the bonding section 20. Also, for example, the substrate transport mechanism 62B receives the substrate 3 from the stage 23 of the bonding section 20, and transfers it to the substrate placement section 37 of the temporary pressure bonding section 30. Also, for example, the substrate transport mechanism 62C receives the substrate 3 from the substrate placement section 37 of the temporary pressure bonding section 30, and transfers it to the stage 49 of the main pressure bonding section 40. Furthermore, for example, the substrate transport mechanism 62D receives the substrate 3 from the stage 49 of the main pressure bonding section 40 and passes it to the stage 51 of the substrate unloading section 50.

[0065] FIG. 3 is a diagram showing a computer provided in the component mounting line 1 and each of the components controlled by the computer.

[0066] The component mounting line 1 includes a computer 2 as shown in Fig. 3. The computer 2 is communicatively connected to, for example, the adhering unit 20, the temporary pressure bonding unit 30, the main pressure bonding unit 40, and the transport unit 60 via, for example, control lines, and controls each of these units. The computer 2 includes a control unit 2a, a storage unit 2b, and a display unit 2c.

[0067] The display unit 2c displays images and characters, and is configured, for example, by a liquid crystal display, a plasma display, an organic EL (Electro-Luminescence) display, etc. However, the display unit 2c is not limited to these displays.

[0068] The storage unit 2b stores various data necessary for component mounting work, such as the size of the board 3, the type of components 5 to be mounted on the board 3, the mounting position, the mounting direction, and the timing of moving the board 3, as well as control programs executed by the control unit 2a, etc. The storage unit 2b is realized by, for example, a ROM (Read Only Memory) or a RAM (Random Access Memory), etc.

[0069] The control unit 2a controls the substrate moving mechanism 21 of the adhering unit 20, the substrate moving mechanism 31 of the temporary pressure bonding unit 30, the substrate moving mechanism 41 of the main pressure bonding unit 40, and the transport unit 60 to perform a substrate transfer operation for transferring the substrate 3 between each unit to the next process. The transfer of the substrate 3 from the upstream side to the downstream side in the substrate transfer operation is performed synchronously between each unit.

[0070] The control unit 2a also controls the adhering unit 20. In other words, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 31, changes the spacing between the multiple adhering heads by the head moving motor, and causes the adhering unit 20 to perform an adhering operation of adhering the ACF to the substrate 3 by the adhering mechanism 22.

[0071] Furthermore, control unit 2a controls temporary pressure bonding unit 30. That is, control unit 2a causes component supply unit 33 to supply components 5 from component supply unit 33 to head transport unit 32. Then, control unit 2a controls head transport unit 32 to cause holding head 34 to hold supplied components 5, and causes cleaning unit 38 to clean components 5. In this manner, control unit 2a in this embodiment controls at least head transport unit 32 and cleaning unit 38.

[0072] Next, control unit 2a controls head transport unit 32 and holding head 34 to place the cleaned component 5 on component placement unit 35. Control unit 2a causes imaging unit 39 provided in temporary pressure bonding unit 30 to capture an image of the placed component 5. Head transport unit 32 adjusts the position of holding head 34 in the X-axis and Y-axis directions in accordance with the image capture result, and causes holding head 34 to hold the component 5 again.

[0073] Next, the control unit 2a changes the orientation and position of the substrate 3 placed on the substrate placement unit 37 of the substrate moving mechanism 31, and causes the head transport unit 32 and the holding head 34 to temporarily press-bond the component 5 to the substrate 3. At this time, the control unit 2a causes the imaging unit 39 to capture an image of the substrate 3 and the component 5, and aligns the substrate 3 placed on the substrate placement unit 37 with the component 5 held by the holding head 34 based on the image capture result.

[0074] Furthermore, the control unit 2a controls the final bonding unit 40 to change the orientation and position of the substrate 3 held by the substrate moving mechanism 41, and causes the component 5 temporarily bonded to the substrate 3 to be final bonded by the bonding mechanism 42.

[0075] Furthermore, the control unit 2a controls the display unit 2c to display images, characters, and the like on the display unit 2c.

[0076] Such a control unit 2a is realized, for example, by a control program stored in a memory unit 2b for controlling each part and each mechanism of the component mounting line 1, and a processor such as a CPU (Central Processing Unit) that executes the control program.

[0077] [Component crimping device configuration] FIG. 4 is a block diagram showing the configuration of component crimping apparatus 100 according to the present embodiment.

[0078] The component pressure bonding apparatus 100 comprises a pre-pressure bonding section 30 in a component mounting line 1 and a control section 2 a of a computer 2 .

[0079] Specifically, component pressure bonding apparatus 100 includes a control unit 2a, a component supply unit 33, an imaging unit 39, a head transport unit 32, a holding head 34, a cleaning unit 38, a component placement unit 35, and a substrate moving mechanism 31.

[0080] The imaging unit 39 includes a first camera 39a and a second camera 39b. The first camera 39a is disposed, for example, below the lower receiving portion 36, and captures an image of the board 3 placed on the board placement portion 37 of the board moving mechanism 31 and the component 5 held by the holding head 34. The image taken by the first camera 39a is used for aligning the board 3 and the component 5. The second camera 39b is disposed, for example, above the component placement portion 35, and captures an image of the component 5 placed on the component placement portion 35. The image taken by the second camera 39b is used for aligning the holding head 34 and the component 5.

[0081] [Cleaning Department] FIG. 5 is a diagram showing an example of the cleaning unit .

[0082] 5(a), cleaning unit 38 is, for example, a cylindrical rotating brush, and is disposed so that the central axis of cleaning unit 38 is aligned along the X-axis direction. Cleaning unit 38 rotates about the central axis, and as holding head 34 descends, cleaning unit 38 comes into contact with the underside of component 5 held by holding head 34 and cleans the underside.

[0083] Specifically, as shown in FIG. 5(b), the cleaning unit 38 cleans the electrode portion 6 on the underside of the component 5 held by the holding head 34. The electrode portion 6 is a portion of the component 5 on which a plurality of electrodes are arranged. In this embodiment, the region on the underside of the component 5 on which the electrode portion 6 is formed is the region to be cleaned. If the component 5 is crimped to the crimping target portion of the substrate 3 with foreign matter adhering to this region to be cleaned, problems such as poor contact may occur between the component 5 and the substrate 3. Therefore, the cleaning unit 38 rotates to remove foreign matter from the region to be cleaned, i.e., to perform cleaning.

[0084] Here, when the component 5 is, for example, an FPC and the size of the component 5 is large, the area to be cleaned may be longer in the X-axis direction than the cleaning unit 38, as shown in FIG. 5B. That is, the length W2 of the area to be cleaned in the X-axis direction is longer than the length W1 of the cleaning unit 38 in the X-axis direction. In this case, even if the holding head 34 descends and the cleaning unit 38 contacts the area to be cleaned from below, the contact area of ​​the underside of the component 5 that contacts the cleaning unit 38 cannot cover the area to be cleaned. That is, since the area to be cleaned is longer in the X-axis direction than the contact area of ​​the cleaning unit 38, at least one of the positive and negative sides of the area to be cleaned in the X-axis direction does not come into contact with the cleaning unit 38 when the holding head 34 is merely lowered. Therefore, a part of the area to be cleaned is not cleaned.

[0085] In this embodiment, in such a case, the control unit 2a controls the head transfer unit 32 to move the holding head 34 in the X-axis direction. That is, in this embodiment, when the cleaning target area on one side of the component 5 is longer in the X-axis direction than the contact area on one side of the component 5 that is in contact with the cleaning unit 38, the control unit 2a moves the holding head 34 along the X-axis direction to change the relative position of the holding head 34 with respect to the cleaning unit 38 in the X-axis direction. This makes it possible to clean the entire cleaning target area of ​​the component 5 held by the holding head 34. In this embodiment, in order to change the relative position, the holding head 34 is moved along the X-axis direction, but the cleaning unit 38 may be moved along the X-axis direction, or both the holding head 34 and the cleaning unit 38 may be moved. That is, the control unit 2a changes the above-mentioned relative position by moving at least one of the holding head 34 and the cleaning unit 38 along the X-axis direction. In this embodiment, the Y-axis direction is an example of a first direction, and the X-axis direction is an example of a second direction. The second direction is a direction that is approximately parallel to one surface of the component 5 and intersects with the first direction.

[0086] Fig. 6 is a diagram for explaining the movement of the component crimping device 100. Note that Fig. 6(a) shows the movement of the component crimping device 100 viewed from the positive side in the X-axis direction, and Fig. 6(b) shows the movement of the component crimping device 100 viewed from the positive side in the Z-axis direction.

[0087] As shown in FIG. 6B, the head transport unit 32 in this embodiment includes a pair of Y-axis guide rails 32a and an X-axis guide rail 32b. The pair of Y-axis guide rails 32a are aligned in the X-axis direction, respectively. The X-axis guide rail 32b is attached to the pair of Y-axis guide rails 32a so as to be movable in the Y-axis direction, along the X-axis direction. The holding head 34 is attached to the X-axis guide rail 32b so as to be movable in the X-axis direction. The head transport unit 32 includes a drive mechanism such as a motor that moves the X-axis guide rail 32b in the Y-axis direction, and a drive mechanism such as a motor that moves the holding head 34 in the X-axis direction. The holding head 34 moves in the X-axis direction and the Y-axis direction by these drive mechanisms. The configuration of the head transport unit 32 is merely an example, and is not limited to this example.

[0088] When component crimping device 100 crimps components 5 supplied from component supply unit 33 onto substrate 3, holding head 34 first descends from above component 5 placed on tray 7, and then rises while holding component 5. Then, head transfer unit 32 transfers holding head 34 to the negative side in the Y-axis direction.

[0089] When the holding head 34 reaches a position above the cleaning unit 38, the head transfer unit 32 stops transferring the holding head 34. At this time, the holding head 34 descends and brings the cleaning target area of ​​the held component 5 into contact with the cleaning unit 38. The cleaning unit 38 rotates to rub the brush of the cleaning unit 38 against the cleaning target area. This cleans at least a part of the cleaning target area on the underside of the component 5. At least a part of the cleaning target area is a contact area between the component 5 and the cleaning unit 38, and when the cleaning target area is covered by the contact area, the cleaning target area is entirely cleaned. On the other hand, when the cleaning target area is not covered by the contact area, that is, when the cleaning target area is longer than the contact area in the X-axis direction, only a part of the cleaning target area is cleaned. Therefore, the control unit 2a controls the head transfer unit 32 to move the holding head 34 in the X-axis direction. This allows the cleaning unit 38 to contact the entire cleaning target area, and the entire cleaning target area can be cleaned.

[0090] Next, when cleaning of the cleaning target area of ​​the component 5 is completed, the holding head 34 rises while holding the component 5. Then, the head transport unit 32 resumes transporting the holding head 34 to the negative side in the Y axis direction.

[0091] When the holding head 34 reaches a position above the component placement section 35, the head transfer section 32 stops the transfer of the holding head 34. At this time, the holding head 34 descends, places the held component 5 on the component placement section 35, and then rises. The head transfer section 32 moves the raised holding head 34 away from above the component placement section 35. For example, the head transfer section 32 moves the holding head 34 to the positive side in the Y-axis direction. At this time, the second camera 39b captures an image of the component 5 placed on the component placement section 35 from above, thereby generating imaging data that is an image. The control section 2a identifies the position of the component 5 shown in the imaging data. The control section 2a then controls the head transfer section 32 to position the holding head 34 above the component placement section 35 again.

[0092] At this time, the control unit 2a adjusts the position of the holding head 34 in the X-axis direction and the Y-axis direction so that the holding head 34 can hold a predetermined portion of the component 5 by controlling the head transport unit 32 based on the position of the identified component 5. At this time, the control unit 2a may further specify the orientation of the component 5 shown in the imaging data, i.e., the orientation of the component 5 placed on the component placement unit 35, and rotate the holding head 34 according to the orientation. That is, the control unit 2a adjusts the angle of the holding head 34 by rotating the holding head 34 around the central axis of the holding head 34 along the Z-axis direction as the center of rotation. This adjusts not only the position of the holding head 34 in the X-axis direction and the Y-axis direction, but also the angle of the holding head 34. When these adjustments are completed, the holding head 34 descends and rises while holding the component 5 placed on the component placement unit 35. At this time, the holding head 34 holds a predetermined portion of the component 5. That is, the holding head 34 holds the appropriate portion of the component 5 by re-holding the component 5. Then, the head transport section 32 resumes transporting the holding head 34 to the negative side in the Y axis direction.

[0093] When the holding head 34 reaches a position above the lower support 36, the head transfer unit 32 ends the transfer of the holding head 34. In addition, in advance, the board 3 is placed on the board placement unit 37, and the pressure bonding target portion of the board 3 is supported from below by the lower support 36. The first camera 39a captures the board 3 placed on the board placement unit 37 and the component 5 held by the holding head 34 to generate imaging data that is the captured image of each. Then, the control unit 2a identifies the position of the board 3 and the component 5 shown in the imaging data. The control unit 2a adjusts the positions of the board 3 and the component 5 in the X-axis direction and the Y-axis direction by controlling at least one of the board moving mechanism 31 and the head transfer unit 32 based on the identified positions. Then, the holding head 34 descends. The holding head 34 provisionally pressure bonds the component 5 that it holds to the pressure bonding target portion of the board 3 placed on the board placement unit 37 that is supported from below by the lower support 36.

[0094] In this manner, the control unit 2a controls the head transfer unit 32 to transfer the holding head 34 holding the cleaned component 5 to the component placement unit 35. Then, the control unit 2a causes the holding head 34 to place the component 5 on the component placement unit 35 and causes the second camera 39b to capture an image of the component 5 placed on the component placement unit 35. Furthermore, the control unit 2a causes the holding head 34 to hold the component 5 based on the image capture result by the second camera 39b, and causes the holding head 34 to perform pressure bonding of the component 5 to the board 3 placed on the board placement unit 37. As a result, even if the component 5 is displaced from the holding head 34 due to cleaning of the component 5, the holding head 34 can appropriately hold the component 5 based on the image capture result by the second camera 39b. That is, the holding head 34 can be brought into contact with an appropriate position of the component 5 to cause the holding head 34 to hold the component 5. As a result, the component 5 held by the holding head 34 can be accurately pressure bonded to a predetermined pressure bonding target portion of the board 3. Therefore, the quality of the mounted board manufactured by pressure-bonding the components 5 to the substrate 3 can be improved.

[0095] 7 is a diagram for explaining the cleaning patterns in the present embodiment. The cleaning patterns performed by the cleaning unit 38 include a first pattern and a second pattern.

[0096] In the first pattern, when the cleaning unit 38 cleans the cleaning target area of ​​the component 5, the head transport unit 32 moves the holding head 34 in the X-axis direction while the cleaning unit 38 is spaced away from the underside of the component 5.

[0097] Specifically, as shown in (a1) and (b1) of FIG. 7, when the holding head 34 holding the component 5 reaches a position above the cleaning unit 38, it descends and brings the area to be cleaned on the underside of the component 5 into contact with the cleaning unit 38. The cleaning unit 38 rotates to rub the brush of the cleaning unit 38 against the area to be cleaned. Here, the area to be cleaned is longer in the X-axis direction than the cleaning unit 38. In other words, the area to be cleaned is longer in the X-axis direction than the contact area. Therefore, in (b1) of FIG. 7, for example, only the part of the area to be cleaned on the negative side in the X-axis direction is cleaned.

[0098] Therefore, in the first pattern, the holding head 34 rises as shown in (c1) of FIG. 7. When the holding head 34 rises, the head transfer unit 32 moves the holding head 34 to the negative side in the X-axis direction as shown in (d1) of FIG. 7. Then, as shown in (e1) of FIG. 7, the holding head 34 descends again and brings the cleaning target area of ​​the component 5 into contact with the cleaning unit 38. As in the example of (b1) of FIG. 7, the cleaning unit 38 rotates to rub the brush of the cleaning unit 38 against the cleaning target area. At this time, since the holding head 34 has moved to the negative side in the X-axis direction, the part that was not cleaned in (b1) of FIG. 7, i.e., the part of the cleaning target area on the positive side in the X-axis direction, is cleaned. When the cleaning is completed, the holding head 34 rises as shown in (f1) of FIG. 7.

[0099] The cleaning unit 38 may rotate continuously during the periods (a1) to (f1) in FIG. 7, or may rotate only during the periods (b1) and (e1) in FIG.

[0100] In the second pattern, when the cleaning unit 38 cleans the area to be cleaned of the component 5, the head transport unit 32 moves the holding head 34 in the X-axis direction with the cleaning unit 38 in contact with the underside of the component 5.

[0101] Specifically, as shown in (a2) and (b2) of FIG. 7, when the holding head 34 holding the component 5 reaches a position above the cleaning unit 38, it descends and brings the area to be cleaned on the underside of the component 5 into contact with the cleaning unit 38. At this time, the cleaning unit 38 also rotates to rub the brush of the cleaning unit 38 against the area to be cleaned. As described above, the area to be cleaned is longer in the X-axis direction than the cleaning unit 38. Therefore, in (b2) of FIG. 7, for example, only the part of the area to be cleaned on the negative side in the X-axis direction is cleaned.

[0102] Therefore, in the second pattern, as shown in (c2) of FIG. 7, the head transfer unit 32 moves the holding head 34 to the negative side in the X-axis direction while the cleaning unit 38 is in contact with the area to be cleaned of the component 5. In other words, when the holding head 34 moves in the X-axis direction, the holding head 34 continues to move downward without rising. As in the example of (b2) of FIG. 7, the cleaning unit 38 rotates to rub the brush of the cleaning unit 38 against the area to be cleaned. At this time, since the holding head 34 has moved to the negative side in the X-axis direction, the part that was not cleaned in (b2) of FIG. 7, i.e., the part of the area to be cleaned on the positive side in the X-axis direction, is cleaned. When the cleaning is completed, the holding head 34 rises as shown in (d2) of FIG. 7.

[0103] In this manner, the control unit 2a in this embodiment controls the head transport unit 32 to transport the holding head 34 holding the component 5 along the Y-axis direction from the component supply unit 33 side toward the substrate placement unit 37 side. Then, when the holding head 34 reaches the position of the cleaning unit 38 by being transported along the Y-axis direction, the control unit 2a (a) causes the cleaning unit 38 to clean the region to be cleaned on the underside of the component 5 held by the holding head 34, and (b) changes the relative position of the holding head 34 with respect to the cleaning unit 38 in the X-axis direction which is approximately parallel to the underside of the component 5 and intersects with the Y-axis direction. Specifically, in changing the relative position, the control unit 2a changes the relative position by moving the holding head 34 along the direction of the rotation axis of the cleaning unit 38.

[0104] In this embodiment, the control unit 2a changes the relative position by moving the holding head 34 in the X-axis direction (i.e., the direction of the rotation axis), but conversely, the control unit 2a may move the cleaning unit 38 in the X-axis direction. Furthermore, the control unit 2a may move both the holding head 34 and the cleaning unit 38 in the X-axis direction. In other words, the control unit 2a may change the relative position by moving at least one of the holding head 34 and the cleaning unit 38 along the X-axis direction.

[0105] As a result, when the holding head 34 reaches the position of the cleaning unit 38, the relative position in the X-axis direction between the holding head 34 and the cleaning unit 38 is changed. Therefore, even if a part of the cleaning target area of ​​the component 5 is not cleaned by the cleaning by the cleaning unit 38 before the change of the relative position, after the change of the relative position, the part that was not cleaned before the change can be cleaned. As a result, even if the cleaning unit 38 is shorter in the second direction than the cleaning target area, the entire cleaning target area can be cleaned. Therefore, even when components 5 of various sizes such as FPCs are crimped to the substrate 3, it is not necessary to make the cleaning unit 38 large. This makes it possible to prevent the component crimping device 100 from becoming large, and to remove foreign matter from the cleaning target area of ​​the component 5 and appropriately crimp the component 5 to the substrate 3.

[0106] Furthermore, the control unit 2a changes the relative position when the area to be cleaned is longer in the X-axis direction than the contact area on one side of the component 5 that is in contact with the cleaning unit 38. This makes it possible to prevent the relative position from being changed, that is, to prevent at least one of the holding head 34 and the cleaning unit 38 from moving along the X-axis direction, when the length of the area to be cleaned in the X-axis direction is equal to or less than the length of the contact area in the X-axis direction. As a result, it is possible to save the effort of moving at least one of the holding head 34 and the cleaning unit 38 even when the entire area to be cleaned of the component 5 can be cleaned without moving at least one of them along the X-axis direction. In other words, it is possible to reduce the processing load without unnecessary changes in the relative positions.

[0107] Moreover, the control unit 2a moves the holding head 34 in the X-axis direction as in the first pattern described above. That is, the control unit 2a controls the holding head 34 to switch the arrangement state between the lower surface of the component 5 held by the holding head 34 and the cleaning unit 38 between a contact state in which the lower surface of the component 5 is in contact with the cleaning unit 38 and a separated state in which the lower surface of the component 5 is separated from the cleaning unit 38. Then, the control unit 2a makes the cleaning unit 38 clean the cleaning target area when the arrangement state is the contact state before and after the change in the relative position described above. Furthermore, when the arrangement state is the separated state, the control unit 2a changes the relative position by moving the holding head 34 along the X-axis direction. Note that in this embodiment, the control unit 2a switches the arrangement state described above between the contact state and the separated state by raising and lowering the holding head 34, but the arrangement state described above may be switched by raising and lowering the cleaning unit 38. The control unit 2a may also switch the arrangement state described above by causing the head transfer unit 32 to move the holding head 34 in the Y-axis direction. In other words, the control unit 2a may control at least one of the holding head , the head transport unit 32, and the cleaning unit to switch the above-mentioned arrangement state.

[0108] For example, when the holding head 34 moves along the X-axis direction to change the relative position, if the component 5 held by the holding head 34 is in contact with the cleaning unit 38, the component 5 receives a frictional force from the cleaning unit 38 in the X-axis direction. As a result, the component 5 may be displaced in the X-axis direction relative to the holding head 34. However, in the first pattern, when the holding head 34 moves along the X-axis direction, the component 5 held by the holding head 34 is separated from the cleaning unit 38. Therefore, it is possible to prevent the component 5 from being displaced in the X-axis direction from the holding head 34 due to the movement along the X-axis direction.

[0109] Alternatively, the control unit 2a moves the holding head 34 in the X-axis direction as in the second pattern described above. That is, the control unit 2a controls the holding head 34 to switch the arrangement state between the underside of the component 5 held by the holding head 34 and the cleaning unit 38 between a contact state in which the underside of the component 5 is in contact with the cleaning unit 38 and a separated state in which the underside of the component 5 is separated from the cleaning unit 38. Then, when the arrangement state is the contact state, the control unit 2a causes the cleaning unit 38 to clean the cleaning target area. Furthermore, when the arrangement state is the contact state, the control unit 2a changes the relative position by moving the holding head 34 along the X-axis direction.

[0110] This allows cleaning of the area to be cleaned of the component 5 and changing of the relative position to be performed simultaneously when the arrangement state is in a contact state. In other words, the holding head 34 can be moved along the X-axis direction while cleaning the area to be cleaned. This makes it possible to shorten the time required for cleaning. Furthermore, since the cleaning unit 38 moves in the X-axis direction relative to the component 5 while contacting the area to be cleaned of the component 5, the cleaning effect can be improved.

[0111] [Processing Operation] FIG. 8 is a flow chart showing an example of a processing operation according to the first pattern by component crimping apparatus 100 in this embodiment.

[0112] First, component supply unit 33 of component crimping apparatus 100 supplies components 5 to be crimped onto substrate 3 placed on substrate placement unit 37 in accordance with control by control unit 2a (step S1). Specifically, component supply unit 33 supplies a tray 7 on which at least one component 5 is placed. Then, control unit 2a controls head transport unit 32 to move holding head 34 in the X-axis direction and Y-axis direction, and causes holding head 34 to hold components 5 placed on tray 7 supplied from component supply unit 33 (step S2).

[0113] Next, the control unit 2a controls the head transfer unit 32 to transfer the holding head 34 holding the component 5 along the Y-axis direction from the component supply unit 33 side toward the substrate mounting unit 37 side to a position above the cleaning unit 38 (step S3).

[0114] Next, the control unit 2a causes the cleaning unit 38 to clean the area to be cleaned of the component 5 (step S4). That is, the control unit 2a lowers the holding head 34 to bring the area to be cleaned on the underside of the component 5 into contact with the cleaning unit 38. Then, the contact area of ​​the area to be cleaned of the component 5 that comes into contact with the cleaning unit 38 is cleaned by the rotation of the cleaning unit 38.

[0115] Next, the control unit 2a determines whether the area to be cleaned of the component 5 is longer in the X-axis direction than the contact area (step S5). For example, the memory unit 2b stores the size of the area to be cleaned of the component 5 and the size of the cleaning unit 38. The control unit 2a reads out the size of the area to be cleaned and the size of the cleaning unit 38 from the memory unit 2b. The control unit 2a then specifies the length of the cleaning unit 38 in the X-axis direction as the length of the contact area in the X-axis direction, and compares it with the length of the area to be cleaned in the X-axis direction.

[0116] Here, when the control unit 2a determines that the cleaning target area is not longer than the contact area (No in step S5), it determines that cleaning of the entire cleaning target area is completed. Then, the control unit 2a causes the holding head 34 to hold the component 5 again (step S11). Specifically, the head transfer unit 32, under the control of the control unit 2a, transfers the holding head 34 to the negative side in the Y-axis direction and places it above the component placement unit 35. Then, the holding head 34 places the component 5 on the component placement unit 35. The head transfer unit 32 identifies a predetermined position of the component 5 based on the result of the image capture of the component 5 placed on the component placement unit 35 by the second camera 39b, and places the holding head 34 above the position. Then, the holding head 34 descends and contacts the predetermined position of the component 5 to hold the component 5. This makes it possible to suppress the displacement of the position of the component 5 held by the holding head 34 even if the position of the component 5 is displaced by cleaning. Therefore, the holding head 34 can contact the component 5 at a predetermined appropriate position and hold the component 5 .

[0117] Next, the head transport unit 32, under the control of the control unit 2a, transports the holding head 34 to the negative side in the Y axis direction, and places it above the compression bonding target portion of the substrate 3. Then, the holding head 34 provisionally compresses the held component 5 to the compression bonding target portion of the substrate 3 (step S12).

[0118] On the other hand, in step S5, when the control unit 2a determines that the cleaning target area is longer than the contact area (Yes in step S5), the control unit 2a raises the holding head 34 to separate the component 5 held by the holding head 34 from the cleaning unit 38 (step S6). Then, the head transfer unit 32 moves the holding head 34 in the X-axis direction according to the control of the control unit 2a (step S7). Next, the holding head 34 descends according to the control of the control unit 2a to bring the held component 5 into contact with the cleaning unit 38 (step S8). As a result, the part of the cleaning target area that was not cleaned by the cleaning unit 38 in step S4 comes into contact with the cleaning unit 38. Then, the control unit 2a causes the cleaning unit 38 to clean that part (step S9). As a result, that part is cleaned by the rotation of the cleaning unit 38. Next, the control unit 2a determines whether the entire area to be cleaned of the component 5 has been cleaned based on the length of the cleaning unit 38 in the X-axis direction, the length of the area to be cleaned in the X-axis direction, the amount of movement in the X-axis direction in step S7, etc. (step S10). If the control unit 2a determines that the entire area to be cleaned of the component 5 has not been cleaned (No in step S10), the process returns to step S6. As a result, the entire area to be cleaned of the component 5 is cleaned. If the control unit 2a determines that the entire area to be cleaned of the component 5 has been cleaned (Yes in step S10), the component crimping device 100 executes the processes of steps S11 and S12 described above.

[0119] FIG. 9 is a flow chart showing an example of a processing operation according to the second pattern by the component crimping apparatus 100 in this embodiment.

[0120] 8 in the same manner as in the first pattern. Then, in step S6, when the control unit 2a determines that the area to be cleaned is longer in the X-axis direction than the contact area (Yes in step S5), it causes the head transport unit 32 to move the holding head 34 in the X-axis direction without lifting the holding head 34 (step S21). In other words, the head transport unit 32 moves the holding head 34 in the X-axis direction while the cleaning unit 38 is cleaning the area to be cleaned of the component 5.

[0121] Then, if it is determined in step S6 that the area to be cleaned is not longer in the X-axis direction than the contact area (No in step S5), and after the processing of step S21 has been performed, the component crimping apparatus 100 performs the processing of steps S11 and S12 described above.

[0122] In this manner, in the present embodiment, the relative position of the holding head 34 with respect to the cleaning unit 38 is changed in the X-axis direction, so that the entire area to be cleaned of the component 5 can be cleaned. In other words, when components 5 of various sizes such as FPCs are pressure-bonded to the substrate 3, even if the cleaning unit 38 is shorter in the X-axis direction than the area to be cleaned of the component 5, the entire area to be cleaned can be cleaned. Therefore, there is no need to enlarge the cleaning unit 38, so that the component pressure-bonding apparatus 100 can be prevented from becoming larger. Furthermore, foreign matter in the area to be cleaned of the component 5 can be removed, so that the component 5 can be appropriately pressure-bonded to the substrate 3.

[0123] (Modification) Fig. 10 is a diagram for explaining the movement of the component crimping device 100 according to this modified example. Note that Fig. 10 shows the movement of the component crimping device 100 as viewed from the positive side in the X-axis direction.

[0124] In the above embodiment, the holding head 34 holds the component 5 placed on the component placement section 35 and crimps it onto the board 3. On the other hand, the component crimping device 100 in this modified example includes a crimping head 34a that is different from the holding head 34, as shown in Fig. 10. In this modified example, the crimping head 34a holds the component 5 placed on the component placement section 35 and crimps it onto the board 3, instead of the holding head 34.

[0125] That is, in the component crimping device 100 of this modified example, the holding head 34 holds the component 5 placed on the tray 7 and performs processing until the held component 5 is placed on the component placement unit 35. Then, based on the result of imaging by the second camera 39b, the crimping head 34a holds the component 5 placed on the component placement unit 35 and crimps it to the crimping target portion of the substrate 3. This crimping head 34a may be moved in the X-axis direction and the Y-axis direction by the head transport unit 32, or may be moved by a drive mechanism other than the head transport unit 32.

[0126] In this way, in this modified example, the processes can be shared between the holding head 34 and the crimping head 34a. As a result, the cleaning process of the component 5 by the holding head 34 and the crimping process of the component by the crimping head 34a can be performed in parallel, improving productivity.

[0127] On the other hand, in the above embodiment, the crimping head 34a can be considered to be the holding head 34. Therefore, since the holding head 34 also has the function of the crimping head 34a, the number of parts of the component crimping apparatus 100 can be reduced and the configuration of the component crimping apparatus 100 can be simplified.

[0128] (Other variations) Although the component crimping device according to one or more aspects has been described based on the above embodiment and its modified examples, the present disclosure is not limited to the above embodiment and its modified examples. As long as it does not deviate from the spirit of the present disclosure, various modifications conceivable by a person skilled in the art to the above embodiment and its modified examples, and forms constructed by combining the components of the above embodiment and its modified examples may also be included within the scope of the present disclosure.

[0129] For example, in the above embodiment and its modified example, when the area to be cleaned of the component 5 is longer in the X-axis direction than the cleaning unit 38 (i.e., the contact area), the holding head 34 moves in the X-axis direction. However, this is not the only case, and the holding head 34 may move in the X-axis direction. That is, the holding head 34 may move in the X-axis direction even when the area to be cleaned of the component 5 is shorter in the X-axis direction than the cleaning unit 38, or when the length in the X-axis direction of the area to be cleaned and the cleaning unit 38 are equal. In this case, if the holding head 34 descends and the component 5 held by the holding head 34 comes into contact with the cleaning unit 38, the contact area of ​​the component 5 that comes into contact with the cleaning unit 38 can cover the area to be cleaned. As a result, the entire area to be cleaned can be cleaned without moving the holding head 34 in the X-axis direction. However, even in such a case, the cleaning effect can be further improved by moving the holding head 34 in the X-axis direction.

[0130] In the above embodiment and its modified example, when the area to be cleaned of the component 5 is longer in the X-axis direction than the cleaning unit 38 (i.e., the contact area), the holding head 34 moves in the X-axis direction. Here, in the above-mentioned case, before the holding head 34 moves in the X-axis direction, there is a possibility that the ends of the area to be cleaned on the positive side and the negative side in the X-axis direction do not come into contact with the cleaning unit 38 and are not cleaned. Therefore, if both ends of the area to be cleaned are not cleaned, it is necessary to move the holding head 34 to the positive side and the negative side in the X-axis direction. Therefore, before the holding head 34 moves in the X-axis direction, the position of the holding head 34 may be adjusted in advance so that one end of the area to be cleaned on the positive side and the negative side in the X-axis direction comes into contact with the cleaning unit 38. As a result, when the holding head 34 is moved in the X-axis direction, it is only necessary to move the holding head 34 to the positive side or the negative side in the X-axis direction to clean the entire area to be cleaned, and cleaning efficiency can be improved.

[0131] Furthermore, in the above embodiment and its modified examples, the component 5 is an FPC, but it may be another type of component.

[0132] Furthermore, in the above embodiment and its modified examples, the cleaning portion 38 is a rotating brush, but it may be a brush other than a rotating brush, or may be made of a material other than a brush (for example, cloth).

[0133] Furthermore, in the second pattern in the above embodiment and its modified example, when the holding head 34 moves in the X-axis direction while bringing the component 5 into contact with the cleaning part 38, the cleaning part 38 rotates. However, when the holding head 34 moves in the X-axis direction in this manner, the rotation of the cleaning part 38 may be stopped.

[0134] In the above embodiment and its modified examples, the direction in which the holding head 34 moves above the cleaning unit 38 is the X-axis direction perpendicular to the Y-axis direction. However, the direction in which the holding head 34 moves is not limited to the X-axis direction, and may be any direction as long as it is approximately parallel to the bottom surface of the component 5 and intersects with the Y-axis direction.

[0135] In the above embodiment and its modified examples, the cleaning part 38 and the contact area on the underside of the component 5 that is in contact with the cleaning part 38 have the same length in the X-axis direction. However, their lengths in the X-axis direction may be different. In this case, in step S6 in Fig. 8 and Fig. 9, the control unit 2a compares, for example, the length in the X-axis direction of the area to be cleaned with the length in the X-axis direction of the contact area stored in advance in the memory unit 2b.

[0136] In the first pattern in the above embodiment and its modified examples, the holding head 34 is raised and lowered to switch the positional state between the underside of the component 5 held by the holding head 34 and the cleaning unit 38 between a contact state and a separated state. However, the holding head 34 may be moved in the Y-axis direction to switch the positional state.

[0137] In the above embodiment and its modified example, all or some of the components of the computer 2 may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a HDD (Hard Disk Drive) or a semiconductor memory. For example, the program execution unit causes the temporary compression bonding unit 30 to execute each step included in the flowcharts shown in Figures 8 and 9.

[0138] Also, the components of the computer 2 may be composed of one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit. The one or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), or an LSI (Large Scale Integration). The IC or LSI may be integrated into one chip or into multiple chips. Here, the IC or LSI is referred to as an IC or LSI, but the name may change depending on the degree of integration, and may be called a system LSI, a VLSI (Very Large Scale Integration), or an ULSI (Ultra Large Scale Integration). Also, a Field Programmable Gate Array (FPGA) that is programmed after the LSI is manufactured can be used for the same purpose. [Industrial Applicability]

[0139] The present disclosure can be used, for example, in a component pressure bonding device provided in a component mounting line that mounts components on a display panel. [Explanation of symbols]

[0140] 1. Component mounting line 1a, 1b, 1c base 2. Computer 2a Control section 2b Storage section 2c Display section 3. Substrate 4, 6 Electrode part 5 parts 7 Tray 10. Board loading section Stages 11, 23, 49, 51 11a, 23a, 37a, 49a, 51a Adsorption holes 20 Adhesive part 21, 31, 41 Substrate moving mechanism 22 Adhesion mechanism 30 Temporary crimping section 32 Head transfer section 33 Parts Supply Department 33e Tray moving part 34 Retaining Head 34a crimping head 35 Parts placement section 36, 46 Lower support 37 Substrate placement section 38 Cleaning Department 39 Imaging section 39a Camera No. 1 39b Second Camera 40 Crimping section 42 Crimping mechanism 43 Crimping Tools 50 Substrate removal section 60 Conveyor 61 Mobile Base 62A, 62B, 62C, 62D Substrate transport mechanism 63 Base 64 Arm Unit 100 Component crimping device

Claims

1. a substrate placement section on which a substrate is placed; a component supply unit that supplies components to be pressure-bonded to the substrate; a holding head for holding the component supplied from the component supply unit; a head transfer unit for transferring the holding head; a cleaning section for cleaning the part; a control unit for controlling at least the head transport unit and the cleaning unit, The control unit is by controlling the head transport unit, the holding head holding the component is transported from the component supply unit side toward the substrate placement unit side along a first direction; When the holding head reaches the position of the cleaning unit by being moved along the first direction, (a) a cleaning target area on one side of the component held by the holding head is cleaned by the cleaning unit, and (b) a relative position of the holding head with respect to the cleaning unit is changed to a second direction that is substantially parallel to the one side of the component and intersects with the first direction. Component crimping device.

2. The control unit, in changing the relative position, When the area to be cleaned is longer in the second direction than a contact area on one surface of the component that is in contact with the cleaning unit, the relative positions are changed by moving at least one of the holding head and the cleaning unit along the second direction. The component crimping device according to claim 1 .

3. The control unit is When the holding head reaches the position of the cleaning unit by being moved along the first direction, by controlling at least one of the holding head, the head transport unit, and the cleaning unit, switching an arrangement state between one side of the component held by the holding head and the cleaning unit between a contact state in which the one side of the component is in contact with the cleaning unit and a separation state in which the one side of the component is separated from the cleaning unit; In the cleaning by the cleaning unit, before and after the change in the relative position, when the arrangement state is the contact state, causing the cleaning unit to clean the area to be cleaned; In the change of the relative position, when the arrangement state is the separated state, the relative position is changed by moving at least one of the holding head and the cleaning unit along the second direction.

3. The component crimping device according to claim 1 or 2.

4. The control unit is When the holding head reaches the position of the cleaning unit by being moved along the first direction, by controlling at least one of the holding head, the head transport unit, and the cleaning unit, switching an arrangement state between one side of the component held by the holding head and the cleaning unit between a contact state in which the one side of the component is in contact with the cleaning unit and a separation state in which the one side of the component is separated from the cleaning unit; In the cleaning by the cleaning unit, When the arrangement state is the contact state, the cleaning unit is caused to clean the cleaning target area; In the change of the relative position, When the arrangement state is the contact state, the relative position is changed by moving at least one of the holding head and the cleaning unit along the second direction.

3. The component crimping device according to claim 1 or 2.

5. The component crimping device further comprises: a component placement part disposed between the cleaning part and the substrate placement part; an imaging unit that images the component, The control unit further includes: controlling the head transfer unit to transfer the holding head holding the cleaned component to the component placement unit; The component is placed on the component placement portion with respect to the holding head; causing the imaging unit to capture an image of the component placed on the component placement unit; Based on the imaging result by the imaging unit, a pressure bonding head is caused to hold the component, and the pressure bonding head is caused to perform pressure bonding of the component to the board placed on the board placement unit. The component crimping device according to any one of claims 1 to 4.

6. The crimping head is the holding head. The component crimping device according to claim 5 .

7. The component crimping device includes: Further, the crimping head is different from the holding head. The component crimping device according to claim 5 .

8. The cleaning portion is a rotating brush that rotates about a rotation axis along the second direction, The control unit, in changing the relative position, changing the relative position by moving at least one of the holding head and the cleaning unit along a direction of the rotation axis; The component crimping device according to any one of claims 1 to 7.

9. a component supply unit supplies components to be pressure-bonded to the substrate placed on the substrate placement unit; a holding head holds the component supplied from the component supply unit; The holding head holding the component is moved from the component supply unit side toward the substrate placement unit side along a first direction; When the holding head reaches a position of a cleaning section for cleaning the component by the movement along the first direction, (a) causing the cleaning unit to clean a cleaning target area on one surface of the component held by the holding head; (b) changing a relative position of the holding head with respect to the cleaning portion in a second direction that is substantially parallel to one surface of the component and intersects with the first direction; Part crimping method.

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