Electronic equipment

The electronic device's innovative protruding suction surface design addresses the trade-off between aesthetics and cooling by optimizing air intake within a casing protrusion, enhancing both appearance and cooling efficiency.

JP7612905B1Active Publication Date: 2025-01-14LENOVO (SINGAPORE) PTE LTD
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Patent Information

Application Number
JP2024015031
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2024-02-02
Publication Date
2025-01-14
Estimated Expiration
2044-02-02

AI Technical Summary

Technical Problem

Conventional electronic devices face a trade-off between appearance quality and cooling performance due to the presence of air intake ports on the bottom surface, which can detract from design aesthetics and reduce fan suction efficiency.

Method used

The design incorporates a protruding suction surface with a ventilation hole in the casing, allowing the fan to draw air from an internal space within a protrusion, eliminating the need for openings on the bottom surface while maintaining high cooling efficiency.

Benefits of technology

This configuration enhances appearance quality by maintaining a smooth bottom surface while ensuring effective cooling performance through optimized air intake and discharge, thus improving usability and design cohesion.

✦ Generated by Eureka AI based on patent content.

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Abstract

Provided is an electronic device that can improve the appearance quality while ensuring cooling performance. [Solution] The electronic device comprises a housing and a fan provided within the housing and having an intake surface with an intake port formed therein, the housing having a protrusion provided to protrude from the bottom surface and extending along the width direction, the protrusion having a vertical wall extending along its longitudinal direction, an air vent formed in the vertical wall, and the suction surface positioned facing the inner space of the protrusion.
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Description

[Technical field]

[0001] The present invention relates to an electronic device equipped with a fan. [Background technology]

[0002] Electronic devices such as notebook PCs are equipped with heat generating elements such as a CPU, etc. Such electronic devices are configured to have a fan installed in the housing to absorb heat generated by the heat generating element and dissipate it to the outside (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7104832 Summary of the Invention [Problem to be solved by the invention]

[0004] Conventional electronic devices usually have an intake port with multiple slit-shaped openings arranged on the bottom surface of the housing, and a fan draws in outside air through the intake port. For this reason, such a configuration makes the intake port on the bottom surface noticeable, for example, when carrying the device or using it in an upright position, and reduces the appearance quality. On the other hand, simply removing the intake port on the bottom surface to improve the design may reduce the intake efficiency and air volume of the fan, which may result in a decrease in cooling performance.

[0005] The present invention has been made in consideration of the problems with the conventional technology described above, and has an object to provide an electronic device that can improve the appearance quality while ensuring cooling performance. [Means for solving the problem]

[0006] An electronic device according to one aspect of the present invention comprises a housing and a fan provided within the housing and having an intake surface with an intake port formed therein, the housing having a protrusion extending along a width direction and protruding from a bottom surface, the protrusion having a vertical wall extending along its longitudinal direction, an air vent formed in the vertical wall, and the intake surface positioned facing an inner space of the protrusion. Effect of the Invention

[0007] According to the above aspect of the present invention, it is possible to improve the appearance quality while ensuring the cooling performance. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic plan view of an electronic device according to an embodiment viewed from above. [Diagram 2] FIG. 2 is a plan view illustrating a schematic internal structure of the housing. [Diagram 3] FIG. 3 is a perspective view of the bottom surface of the housing as viewed obliquely from behind. [Figure 4] FIG. 4 is a perspective view of the bottom surface of the housing as viewed obliquely from the front. [Diagram 5] FIG. 5 is a side view of the electronic device. [Figure 6] FIG. 6 is a side cross-sectional view that shows a schematic internal structure of the housing including the cooling module and its surrounding area. [Figure 7] FIG. 7 is a front cross-sectional view showing a schematic internal structure of the housing including the cooling module and its peripheral portion. [Figure 8] FIG. 8 is a table showing the results of a simulation experiment comparing the cooling performance of an electronic device and the surface temperature of a housing when cooling modules with different configurations are mounted on the housing. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an electronic device according to the present invention will be described in detail with reference to the accompanying drawings.

[0010] 1 is a schematic plan view of an electronic device 10 according to an embodiment, viewed from above. As shown in FIG. 1, the electronic device 10 according to this embodiment is a clamshell-type notebook PC. The electronic device 10 has a cover 11 and a housing 12 connected by a hinge 14 so that they can rotate relative to each other. In this embodiment, the electronic device 10 is a notebook PC, but the electronic device may be other than a notebook PC, such as a tablet PC, a smartphone, or a portable game console.

[0011] The cover 11 is a thin, flat box-shaped housing. The cover 11 is equipped with a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0012] The housing 12 is a thin, flat box. A keyboard device 18 and a touch pad 19 face the upper surface (surface 12a) of the housing 12. Hereinafter, the housing 12 and each component mounted thereon will be described with reference to the posture of an operator operating the keyboard device 18, with the width direction (left and right) of the housing 12 referred to as the X1 and X2 directions, the depth direction (front and back) of the housing 12 referred to as the Y1 and Y2 directions, and the thickness direction (up and down) of the housing 12 referred to as the Z1 and Z2 directions. The X1 and X2 directions may be collectively referred to as the X direction, and the Y1, Y2 directions and the Z1, Z2 directions may be similarly referred to as the Y direction and the Z direction. These directions are determined for the sake of convenience, and may naturally change depending on the usage state or installation posture of the electronic device 10.

[0013] The housing 12 is composed of a housing member 20 that forms the top surface and the four peripheral side surfaces, and a cover material 21 that forms the bottom surface. The housing member 20 is formed by forming standing walls 20B on the four peripheral edges of a cover plate 20A that forms the surface 12a of the housing 12. Therefore, the housing member 20 has a substantially bathtub shape with an open bottom surface. The cover material 21 has a substantially flat plate shape and serves as a lid that closes the bottom opening of the housing member 20. The housing member 20 and the cover material 21 are overlapped in the thickness direction and are detachably connected to each other. The standing walls 20B may be formed on the cover material 21. In this case, the housing member 20 may be composed of only the cover plate 20A.

[0014] The hinge 14 is installed in a concave hinge arrangement groove 12b formed in the rear edge of the housing 12, and connects the housing 12 and the lid 11. The hinge 14 has a structure in which, for example, a hinge shaft 14a serving as a rotation axis is supported at both ends of the hinge housing 14b in the longitudinal direction (see FIG. 5). The hinge 14 of this embodiment is configured in a so-called one-bar shape in which the hinge housing 14b extends along the longitudinal direction of the hinge arrangement groove 12b. The hinge 14 descends diagonally backward while rotating integrally with the lid 11 (see FIG. 5). The hinge 14 has a structure that increases the rotation angle of the lid 11 in this way, that is, a so-called drop-down structure. The structure of the hinge 14 may be other than the above.

[0015] Fig. 2 is a plan view that shows a schematic internal structure of the housing 12. Fig. 2 shows the inside of the housing member 20 from the bottom side with the cover material 21 removed.

[0016] 2, a cooling module 24, a motherboard 25, and a battery device 26 are housed inside the housing 12. Inside the housing 12, various electronic components, mechanical components, and the like are also provided.

[0017] The motherboard (substrate) 25 is a circuit board that serves as a main board of the electronic device 10. The motherboard 25 is disposed toward the Y2 side of the housing 12, and extends in the X direction. The battery device 26 is a rechargeable battery that serves as a power source for the electronic device 10. The battery device 26 is disposed toward the Y1 side of the motherboard 25, and extends in the X direction.

[0018] The motherboard 25 of this embodiment is equipped with a CPU (Central Processing Unit) 25a. In addition to the CPU 25a, the motherboard 25 can also be equipped with various electronic components such as a GPU (Graphics Processing Unit), a memory, a communication module, and the like.

[0019] For example, an upper surface (first surface 25A) of the motherboard 25 serves as a mounting surface for the housing member 20, and a lower surface (second surface 25B) serves as a mounting surface for the CPU 25a and the like.

[0020] Next, a configuration example of the cooling module 24 will be described.

[0021] The CPU 25a is a heat generating element that generates the largest amount of heat among the electronic components mounted in the housing 12. The cooling module 24 can absorb and diffuse the heat generated by the CPU 25a and discharge it to the outside of the housing 12. The cooling module 24 may be configured to cool a heat generating element other than the CPU 25a, such as a GPU.

[0022] As shown in FIG. 2, the cooling module 24 of this embodiment includes a metal plate 27, a heat pipe 28, a pair of heat sinks 29, 29, and a pair of fans 30, 30.

[0023] The metal plate 27 is a thin plate made of a metal with high thermal conductivity, such as copper or aluminum. The metal plate 27 in this embodiment is a copper plate. The metal plate 27 extends in the X direction between the left and right fans 30. As a result, the metal plate 27 covers a part (part 25C) of the motherboard 25 arranged between the left and right fans 30 and the CPU 25a mounted on the part 25C from the second surface 25B side (Z2 side) (see also FIG. 7). The metal plate 27 functions as a heat diffusion member that absorbs and diffuses heat from the CPU 25a and the like. The metal plate 27 is connected to the surface of the CPU 25a. For example, thermally conductive grease and a copper block of approximately the same size as the outer shape of the CPU 25a are interposed between the metal plate 27 and the CPU 25a. A leaf spring 32 is attached to each edge 27a1, 27a2 of the metal plate 27 along the X direction. The leaf spring 32 is a component that presses the metal plate 27 against the CPU 25a.

[0024] The heat pipe 28 is a pipe-type heat transport device. The heat pipe 28 is configured by crushing a metal pipe thin and flat to form an elliptical cross section, and sealing a working fluid in the sealed space inside. Examples of the working fluid include water, alternative fluorocarbons, acetone, butane, etc. The heat pipes 28 can be used in pairs, for example. The heat pipes 28 are fixed at their longitudinal center to the back side of the connection surface of the metal plate 27 to the CPU 25a. Both ends of the heat pipe 28 are fixed to the Z2 side surfaces of the left and right heat sinks 29, respectively. The longitudinal center of each heat pipe 28 overlaps with the CPU 25a in the Z direction. This allows the heat pipes 28 to efficiently receive the heat of the CPU 25a transferred to the metal plate 27 and transport it to the heat sinks 29 at both ends with high efficiency.

[0025] The heat sink 29 has a structure in which multiple fins made of thin metal plates are arranged at equal intervals in the X direction. Each fin stands in the Z direction on a specific base plate and extends in the Y direction. A gap is formed between adjacent fins of the heat sink 29 through which air sent from the fan 30 passes. The heat sink 29 is made of a metal having high thermal conductivity such as aluminum or copper. The heat sink 29 is disposed opposite the side surface 30a (exhaust port 34a) of the fan 30 on the Y2 side.

[0026] The pair of fans 30, 30 are arranged side by side in the X direction so as to straddle the metal plate 27 between them, and face each other. Each fan 30 has an outlet 34a on the side surface 30a on the Y2 side. The outlet 34a is close to and faces the heat sink 29 behind it. Each fan 30 can also have an outlet 34b on the side surface 30b facing the opposing direction. The outlets 34b, 34b of the left and right fans 30 face each other with the metal plate 27 between them. Each fan 30 has an intake port 35 on at least the end surface 30d on the Z2 side among the upper and lower end surfaces 30c, 30d facing the Z direction. The intake port 35 can also be provided on the end surface 30c on the Z1 side. The end surfaces 30c, 30d are perpendicular to the side surfaces 30a, 30b and are also perpendicular to the axial direction of the rotation shaft of the impeller 30e.

[0027] The fan 30 is a centrifugal fan that rotates an impeller 30e housed inside a housing by a motor (see FIG. 6). This allows the fan 30 to suck in air from an inlet 35 and discharge it from outlets 34a and 34b.

[0028] Next, an intake and exhaust structure for introducing air into the housing 12 by the fan 30 and discharging the air discharged from the fan 30 to the outside of the housing 12 will be described.

[0029] Fig. 3 is a perspective view of the bottom surface 12c of the housing 12 as viewed obliquely from behind. Fig. 4 is a perspective view of the bottom surface 12c of the housing 12 as viewed obliquely from the front. Fig. 5 is a side view of the electronic device 10. Fig. 6 is a side cross-sectional view that typically shows the internal structure of the housing 12 at the cooling module 24 and its periphery. Fig. 7 is a front cross-sectional view that typically shows the internal structure of the housing 12 at the cooling module 24 and its periphery.

[0030] 2 to 6, the exhaust structure of the electronic device 10 can include exhaust ports 40, 42 formed in the standing wall 30B (outer wall 38) at the rear edge (Y2 side edge) of the housing 12. The exhaust port 40 is an opening for discharging air (hot air) that is discharged from the outlet 34b of the fan 30, passes through the surface of the metal plate 27 and cools it, to the outside of the housing 12. The exhaust port 42 is an opening for discharging air (hot air) that is discharged from the outlet 34a of the fan 30, passes through the heat sink 29 and cools it, to the outside of the housing 12.

[0031] In this embodiment, the Y2-side standing wall 30B extends along its longitudinal direction and has a hinge arrangement groove 12b recessed toward the Y1 side. The outer wall 38 is the bottom wall (front wall) of the hinge arrangement groove 12b.

[0032] The exhaust port 40 is provided near the center of the outer wall 38 in the longitudinal direction. The exhaust port 40 is composed of a plurality of openings 40a (four in FIG. 3) arranged closely in the X direction, for example. The exhaust port 40 is located between the fans 30, 30 when the arrangement direction (X direction) of the left and right fans 30, 30 is taken as the reference. The metal plate 27 extends in the X direction at a position close to the outer wall 38. Therefore, the exhaust port 40 is close to and faces the edge 27a2 on the Y2 side of the metal plate 27.

[0033] The exhaust port 42 is formed in the outer wall 38 on the same plane as the exhaust port 40. The exhaust port 42 is composed of a plurality of openings 42a (four in FIG. 3) lined up closely in the X direction, for example. A pair of exhaust ports 42 are provided and arranged to straddle the exhaust port 40 in the longitudinal direction of the outer wall 38. Each exhaust port 42 faces closely to the Y2 sides of the left and right heat sinks 29, 29, respectively, and is located near the left and right ends of the outer wall 38.

[0034] The standing wall 30B may be configured not to have the hinge arrangement groove 12b. In this case, the exhaust ports 40, 42 may be formed in the standing wall 30B itself, which is the outer wall.

[0035] As shown in FIGS. 2 to 7, the air intake structure of the electronic device 10 includes an air vent 50 formed in a protruding portion 48 provided on the bottom surface 12c of the housing 12. As shown in FIG.

[0036] The protrusion 48 protrudes from the bottom surface 12c. The protrusion 48 has a rectangular tubular shape that is long in the X direction and flat in the Z direction. The length of the protrusion 48 in the X direction is approximately the entire width of the housing 12 in the X direction. The protrusion 48 is provided at a position closer to the Y2 side in the front-rear direction (Y direction) of the bottom surface 12c. The protrusion 48 has a pair of standing walls 48a, 48b extending along its longitudinal direction (X direction). The standing wall 48b on the Y2 side is located immediately in front of the outer wall 38. In a plan view of the housing 12, the protrusion 48 is arranged at a position that vertically overlaps the left and right fans 30, 30 (see FIG. 2).

[0037] The protrusion 48 has a vent hole 50, and functions as a part of the air intake structure of the electronic device 10. The vent hole 50 is provided in the vertical wall 48a on the Y1 side. The vent hole 50 is composed of a plurality of openings 50a (three in FIG. 3) arranged closely in the X direction, for example. The openings 50a are, for example, holes with a substantially L-shaped cross section that continue from the vertical wall 48a to the cover material 21 (see FIGS. 4 and 6). The openings 50a may be formed only in the vertical wall 48a and may not extend to the cover material 21. A pair of vent holes 50 are provided, and are located on the Y1 side of the left and right fans 30, 30 in the X direction. Each vent hole 50 is provided near both the left and right ends of the vertical wall 48a. Each fan 30 does not have an outlet on the Y1 side 30f facing the vent hole 50.

[0038] 6 and 7, the end surface 30d on which the suction port 35 of each fan 30 is formed faces the inner space 48c of the protruding portion 48. Hereinafter, the end surface 30d may be referred to as the "suction surface 30d." The inner space 48c is a groove-like space that is deeper on the Z2 side by the height of the protruding portion 48 from the inner surface 21a of the cover material 21 that forms the bottom surface 12c. In other words, the inner space 48c expands the internal space of the housing 12 in the Z direction.

[0039] The suction surface 30d faces the Z2 side and is disposed so as to cover the upper portion of the inner space 48c. This allows the fan 30 to smoothly draw air from outside the housing 12 through the ventilation holes 50 provided in the standing wall 48a into the suction port 35. It is preferable that a part of the thickness of the fan 30, i.e., the suction surface 30d, is inserted into the inner space 48c.

[0040] The depth of the inner space 48c, that is, the height in the Z2 direction from the inner surface 21a of the cover material 21 to the inner bottom surface 48d of the protruding portion 48, can be, for example, about 2.5 to 4 mm. The height in the Z2 direction from the inner surface 21a to the suction surface 30d can be, for example, about 0.5 to 1.5 mm. In this case, it is preferable to secure a gap of 1 mm or more between the suction surface 30d and the inner bottom surface 48d. This allows the fan 30 to more smoothly suck in the air introduced into the inner space 48c from the ventilation opening 50 through the suction opening 35. In addition, since the inner space 48c is located directly below the fan 30, the thickness of the fan 30 can be expanded, and the air volume of the fan 30 can also be increased. The suction surface 30d may be located on the Z1 side of the inner surface 21a.

[0041] The protrusion 48 may have an input / output port 54 at each of its longitudinal ends (left and right end faces). The input / output port 54 may be compliant with the HDMI (registered trademark) standard or the USB 3.0 communication standard. As a result, the electronic device 10 has a tapered surface 56a on the side wall 56 as described below, and the input / output port 54 that requires a certain height can be installed. The protrusion 48 also functions as a rear leg that raises the rear part of the housing 12 placed on a placement surface such as a desk surface above the front part. As a result, the electronic device 10 has a keyboard device 18 inclined forward and downward during use, improving operability. Reference numeral 55 in FIGS. 3 to 7 denotes a rubber leg that serves as a leg when the electronic device 10 is placed on the placement surface. The rubber leg 55 on the Y2 side is provided on the bottom surface 48e of the protrusion 48.

[0042] The air intake structure of the electronic device 10 may also include an air intake port 58 formed in the standing wall 30B (side wall 56) of the side edge portion (X1, X2 side edge portion) of the housing 12. The air intake port 58 is an opening for introducing air outside the housing 12 into the suction port 35 of the fan 30.

[0043] The left and right side walls 56 extend in the Y direction perpendicular to the X direction, which is the longitudinal direction of the outer wall 38. Each side wall 56 has a vertical surface along the Z direction that forms the outer periphery of the housing 12, and a tapered surface 56a that gradually inclines from the vertical surface toward the center of the housing 12 toward the Z2 side. An air intake 58 is provided on the tapered surface 56a of each side wall 56. The air intake 58 is composed of a plurality of openings 58a (two in FIG. 3) that are closely arranged in the Y direction, for example. The left and right air intakes 58 are located on the opposite side of the fan 30 from the exhaust ports 40, 42 when the longitudinal direction (Y direction) of the side walls 56 is taken as a reference. In other words, the air intake 58 is located forward (on the Y1 side) of the fan 30.

[0044] By providing the suction port 35 on the end face 30c on the Z1 side as well as the end face 30d on the Z2 side, the fan 30 can more smoothly draw in air outside the housing 12 through the intake ports 58 provided in the side wall 56.

[0045] Next, a description will be given of the cooling action of the cooling module 24. The dashed and dotted arrows shown in Figures 2 to 7 diagrammatically indicate the flow of air.

[0046] In the electronic device 10, heat generated by heat generating elements such as the CPU 25a is transferred to the metal plate 27 and diffused, and is also efficiently transported to the left and right heat sinks 29 by the heat pipes 28. The left and right fans 30 draw outside air (cold air) into the inlet 35 using the vent 50 in the protrusion 48 as an air intake, and discharge it from the outlets 34a, 34b. Each fan 30 can also draw outside air (cold air) through the air intake 58.

[0047] The air discharged from the outlets 34a of the left and right fans 30 passes through the heat sink 29 and is cooled. The cooled air (hot air) is discharged to the outside of the housing 12 through exhaust ports 42 opening at both the left and right ends of the outer wall 38. At the same time, the air discharged from the outlets 34b of the left and right fans 30 flows along the surface of the metal plate 27 to cool the metal plate 27 and the heat pipe 28, and at the same time directly cools the electronic components of the CPU 25a. The cooled air (hot air) is discharged to the outside of the housing 12 through the exhaust port 40 opening at the center of the outer wall 38.

[0048] Next, the effects of the electronic device 10 of this embodiment will be described with reference to FIG.

[0049] FIG. 8 is a table showing the results of a simulation experiment comparing the cooling performance of an electronic device and the surface temperature of a housing when cooling modules with different configurations are mounted on the housing.

[0050] 8, "Housing 12" in the right column shows experimental results in which the cooling module 24 was mounted on the housing 12 described above. "Housing 12A" in the middle column shows experimental results in which the cooling module 24 was mounted on a housing 12A according to a modified example in which the intake port 58 was omitted from the housing 12 described above. "Housing 60" in the left column shows experimental results in which the cooling module 24 was mounted on a housing 60, which is a comparative example, in which the intake port 58 and the vent hole 50 were omitted from the housing 12 described above, and instead an intake port 61 was formed on the bottom surface 48e of the protrusion 48. The intake port 61 is located so as to overlap each fan 30 vertically.

[0051] 8, "top surface temperature" refers to the temperature (° C.) of a high-temperature portion on top surface 12a of housing 12. "bottom surface temperature" refers to the temperature (° C.) of a high-temperature portion on bottom surface 12c of housing 12.

[0052] As a result of the experiment, it was found that the housings 12 and 12A of the present embodiment have lower top and bottom temperatures than the housing 60 of the comparative example. That is, in the electronic device 10 of the present embodiment to which the housing 12 or the housing 12A is applied, the temperature of the surface 12a of the keyboard device 18 and its surroundings, which are often touched by the operator directly with their hands, is lowered. Furthermore, in the electronic device 10 of the present embodiment, the temperature of the bottom surface 12c, which is likely to touch the operator's lap, is also lowered. In particular, the housing 12 has lower top and bottom temperatures than the housing 12A. It was therefore confirmed that the usability of the electronic device 10 is improved.

[0053] Moreover, in the electronic device 10 of this embodiment, no openings due to air intakes are formed on the bottom surfaces 12c, 48e of the housings 12, 12A. Therefore, in the electronic device 10 including the housings 12, 12A, the bottom surfaces 12c, 48e have a substantially flat shape without any openings even when, for example, the electronic device 10 is carried or used in an upright position, improving the appearance quality.

[0054] As described above, the electronic device 10 of this embodiment is provided in the housing 12 (12A), and includes the fan 30 having the suction surface 30d on which the suction port 35 is formed. The housing 12 (12A) has a protruding portion 48 that is provided to protrude from the bottom surface 12c and extends along the width direction (X direction). The protruding portion 48 has a standing wall 48a that extends along its longitudinal direction (X direction). The standing wall 48a has an air vent 50 formed therein. The suction surface 30d of the fan 30 is disposed facing the inner space 48c of the protruding portion 48.

[0055] In this way, the electronic device 10 is disposed so that the suction surface 30d of the fan 30 faces the inner space 48c of the protruding portion 48 provided on the bottom surface 12c of the housing 12 (12A). The vertical wall 48a of the protruding portion 48 is provided with an intake port (vent 50) for introducing outside air into the suction surface 30d. Therefore, the housing 12 (12A) does not need to form an opening on its bottom surface 12c, 48e, and the appearance quality can be improved. Moreover, by providing the vent 50 on the vertical wall 48a of the protruding portion 48 having the inner space 48c facing the suction surface 30d of the fan 30, a high cooling capacity is ensured. As a result, the electronic device 10 can also reduce the surface temperature of the housing 12 (12A) compared to a configuration in which an intake port is provided on the bottom surface 48e as shown in FIG. 8.

[0056] That is, by providing the protrusion 48, the electronic device 10 can achieve a high-quality design without providing holes in the bottom surfaces 12c, 48e. On the other hand, since the electronic device 10 does not provide holes in the bottom surfaces 12c, 48e, the introduction port (air intake port) of outside air to the fan 30 becomes an issue. In this regard, the electronic device 10 has an air vent 50 provided in the protrusion 48 where the suction surface 30d of the fan 30 faces the inner space 48c. As a result, the electronic device 10 has an extremely short distance between the suction port 35 of the fan 30 and the air vent (air intake port) 50, which increases the amount of suction and the amount of air flow by the fan 30, improving the cooling capacity.

[0057] It is preferable that the fan 30 is installed at a position where it overlaps the protrusion 48 vertically, and that a part of the thickness direction (Z direction) is disposed within the inner space 48c of the protrusion 48. In this case, even if the housing 12 (12A) is made thin, a fan 30 with sufficient thickness can be mounted, and the cooling capacity is further improved. That is, the fan 30 can more smoothly suck the air introduced into the inner space 48c from the ventilation port 50 through the intake port 35, and a high cooling capacity can be ensured as shown in FIG. 8. In this case, it is preferable to ensure a predetermined gap between the intake surface 30d and the inner bottom surface 48d of the protrusion 48. In this case, the efficiency of suction from the ventilation port 50 at the intake port 35 is further improved.

[0058] The housing 12 (12A) has an outer wall 38 in which the exhaust ports 40, 42 are formed and which extends along the longitudinal direction of the protruding portion 48. The protruding portion 48 is preferably disposed immediately before the outer wall 38. This allows the protruding portion 48 of the electronic device 10 to be disposed near the rear end of the bottom surface 12c, improving the cohesiveness of the design on the bottom surface 12c side and further improving the appearance quality.

[0059] The housing 12 may also have an air intake 58 on each of the left and right side walls 56. This increases the amount of air intake by the fan 30 and increases the amount of air discharged, further improving the cooling capacity of the cooling module 24.

[0060] It should be noted that the present invention is not limited to the above-described embodiment, and can of course be freely modified without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0061] 10 Electronic equipment 11 Lid 12,12A Housing 16 Display 18 Keyboard Device 24 Cooling Module 25 Motherboard 25a CPU 27 Metal Plate 28 Heat Pipe 29 Heat sink 30 Fans 34a,34b Discharge port 35 Intake port 38 Exterior Wall 40,42 Exhaust port 48 Protrusion 48c inner space 50 Vent

Claims

1. An electronic device, A housing and a fan provided within the housing and having a suction surface with a suction port formed therein; Equipped with The housing has a protrusion that protrudes from a bottom surface and extends along a width direction, The protruding portion has a vertical wall extending along a longitudinal direction thereof, and a vent hole is formed in the vertical wall, The suction surface is disposed facing the inner space of the protruding portion, The fan is disposed at a position where it overlaps with the protruding portion in the vertical direction, and a part of the fan in the thickness direction is disposed within the inner space of the protruding portion.

1. An electronic device comprising:

2. 2. The electronic device according to claim 1, A gap is provided between the suction surface and the inner bottom surface of the protrusion.

1. An electronic device comprising:

3. 3. The electronic device according to claim 1, the housing has an outer wall in which an exhaust port is formed and which extends along a longitudinal direction of the protrusion, The protrusion is disposed immediately in front of the outer wall.

1. An electronic device comprising:

4. An electronic device, A housing and a fan provided within the housing and having a suction surface with a suction port formed therein; Equipped with The housing has a protrusion that protrudes from a bottom surface and extends along a width direction, The protruding portion has a vertical wall extending along a longitudinal direction thereof, and a vent hole is formed in the vertical wall, The suction surface is disposed facing the inner space of the protruding portion, the housing has an outer wall in which an exhaust port is formed and which extends along a longitudinal direction of the protrusion, The protrusion is disposed immediately in front of the outer wall.

1. An electronic device comprising:

5. 5. The electronic device according to claim 4, A lid body equipped with a display, a hinge that rotatably connects the cover to an edge of the housing on which the outer wall is provided; Further equipped 1. An electronic device comprising:

6. 6. The electronic device according to claim 5, The housing has a pair of side walls extending in a direction perpendicular to the outer wall and having an air intake port formed therein, The air intake is disposed on the opposite side of the protruding portion from the outer wall side when the longitudinal direction of the side wall is taken as a reference.

1. An electronic device comprising:

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