Wafer V-notch center positioning method, system, and computer storage medium

Abstract

The embodiments of the present disclosure disclose a method, system, and computer storage medium for locating a center of a wafer V-notch, the locating method including: determining a center of a concentric circle corresponding to an edge of the V-notch based on collected edge data of the wafer V-notch; determining whether the V-notch is at a set target center position based on a position between the center of the circle and a set reference graduation line; if the V-notch is not at the set target center position, determining a rotation direction and a rotation angle of the wafer based on a position between the center of the circle and a set reference graduation line; and rotating the wafer based on the rotation direction and the rotation angle of the wafer so that the V-notch rotates to the set target center position.

Description

[Technical field]

[0001] (CROSS REFERENCE TO RELATED APPLICATIONS) This disclosure claims priority to a Chinese patent application having application number 202111228898.4, proposed in China on October 21, 2021, the entire contents of which are incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE The present disclosure relates to the semiconductor technology field, and more particularly to a method, system and computer storage medium for locating a wafer V-notch center. [Background technology]

[0003] In the semiconductor industry, after the pulling of a single crystal silicon rod is completed and its surface is ground, according to product demand, engineers will machine a flat edge or a V-shaped notch in the specific crystal direction of the single crystal silicon rod to determine the specific crystal direction of a wafer made of the single crystal silicon rod, so as to facilitate identification and positioning of the specific crystal direction of the wafer in an integrated circuit (IC) factory. However, since the flat edge machined on the edge of the wafer affects the utilization rate of the wafer, currently, for wafers with a diameter of 200 mm or more, a V-shaped notch with a depth of 1.0 mm to 1.05 mm and an angle of 90 degrees is machined on the edge of the wafer, instead of using the flat edge to position the specific crystal direction, and the V-shaped notch is also called a V-notch groove.

[0004] However, the specific crystal direction of the current monocrystalline silicon rod is determined by using an X-ray diffractometer, and there is a certain error during the positioning of the V-notch and the processing of the V-notch, so that a deviation occurs between the crystal direction of the monocrystalline silicon rod or wafer and the center of the V-notch formed by processing. In the actual measurement process, the crystal direction deviation of the V-notch is used to judge the degree of deviation between the center position of the V-notch and the crystal direction of the monocrystalline silicon rod or wafer. Since the crystal direction deviation of the V-notch has a very important effect on the subsequent product yield and product performance, it is very important to accurately measure the crystal direction deviation of the V-notch during the production of wafers. It can be understood that if the crystal direction deviation measurement of the V-notch is not accurate, the processing pattern on the wafer edge and the crystal direction of the wafer will be inconsistent, which will ultimately affect the electrical performance of the product and even lead to the scrapping of the product.

[0005] At present, the conventional technical solution for measuring the crystal orientation deviation of the V-notch is to position the center of the V-notch, specifically, to measure the crystal orientation deviation with respect to the vertical position of the V-notch using X-ray diffraction method, thereby expressing the crystal orientation deviation of the V-notch. However, in the process of positioning the center of the V-notch, the width of the V-notch is small and the depth is shallow, and the technician needs to manually mount the positioning backplate and the wafer, and observe and judge with the naked eye whether the center of the V-notch of the wafer is aligned with the reference scale line of the positioning backplate, so the positioning error of the V-notch is large, and the measured crystal orientation deviation of the V-notch is not accurate. Summary of the Invention

[0006] In view of this situation, it is desirable for the embodiments of the present disclosure to provide a method, system, and computer storage medium for locating the center of a wafer V-notch, which can reduce the positioning error of the V-notch, improve the accuracy of measuring the crystal orientation misalignment of the V-notch, and at the same time improve the measurement efficiency and save labor costs.

[0007] The technical solutions according to the embodiments of the present disclosure are realized as follows:

[0008] In a first aspect, an embodiment of the present disclosure provides a method for locating a center of a V-notch in a wafer, the method comprising: determining a center of a concentric circle corresponding to the V-notch edge based on the collected wafer V-notch edge data; determining whether the V-notch is at a set target center position based on a position between the center of the circle and a set reference graduation line; If the V-shaped notch is not at the set target center position, determining a rotation direction and a rotation angle of the wafer based on a position between the circle center and a set reference graduation line; and rotating the wafer based on a rotation direction and a rotation angle of the wafer so that the V-shaped notch rotates to the set target center position.

[0009] In a second aspect, an embodiment of the present disclosure provides a wafer V-notch center positioning system, the positioning system including a first determining portion, a judging portion, a second determining portion, and a rotating portion; the first determining portion is configured to determine a center of a concentric circle corresponding to the V-notch edge based on collected wafer V-notch edge data; The determining unit is configured to determine whether the V-notch is at a set target center position based on a position between the circle center and a set reference scale line; the second determination unit is configured to determine a rotation direction and a rotation angle of the wafer based on a position between the circle center and a set reference graduation line when the V-shaped notch is not at a set target center position; The rotating portion is configured to rotate the wafer based on a rotation direction and a rotation angle of the wafer so that the V-shaped notch rotates to the set target center position.

[0010] In a third aspect, embodiments of the present disclosure provide a wafer V-notch center location system, comprising: The positioning system includes a positioning back plate for positioning the center of the wafer V-notch, a vacuum suction cup, a line laser contour detection sensor, a data processing device, and a servo motor; The positioning back plate is provided with a circular hole that is combined with the vacuum suction cup, and the vacuum suction cup can be fitted into the circular hole; the vacuum suction cup is configured to suck the wafer so that the back surface of the wafer is in close contact with the positioning back plate; the line laser contour detection sensor is configured to collect the V-notch edge data; The data processing device includes: determining a center of a concentric circle corresponding to the V-notch edge based on the collected edge data of the wafer V-notch; determining whether the V-notch is at the set target center position based on a position between the circle center and a set reference graduation line; If the V-shaped notch is not at the set target center position, determining a rotation direction and a rotation angle of the wafer based on a position between the circle center and a set reference graduation line; outputting a control signal based on a rotation direction and a rotation angle of the wafer; The servo motor is configured to rotate the wafer clockwise or counterclockwise so that the V-shaped notch is positioned below the line laser contour detection sensor, and to rotate the wafer based on the rotation direction and rotation angle of the wafer in response to the control signal so that the V-shaped notch rotates to a set target center position.

[0011] In a fourth aspect, an embodiment of the present disclosure provides a computer storage medium having a program for locating a center of a wafer V-notch stored thereon, the program performing, when executed by at least one processor, steps of the method for locating a center of a wafer V-notch described in the first aspect.

[0012] An embodiment of the present disclosure provides a method, system, and computer storage medium for locating the center of a wafer V-notch, in which the positioning method includes determining a center of the V-notch edge based on collected V-notch edge data, determining whether the V-notch is at a set target center position based on a position between the center of the circle and a set reference scale line, determining a rotation direction and a rotation angle of the wafer based on the position between the center of the circle and the set reference scale line if the V-notch is not at the set target center position, and rotating the wafer based on the rotation direction and rotation angle of the wafer, so that the V-notch rotates to the set target center position. In this way, the positioning method can reduce positioning errors and improve the accuracy of measurement results, as well as save labor costs and improve production efficiency. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a schematic diagram of a wafer V-notch center positioning system according to an embodiment of the present disclosure. [Diagram 2] FIG. 13 is another schematic diagram of a wafer V-notch center positioning system according to an embodiment of the present disclosure. [Diagram 3] FIG. 1 is a flow diagram of a method for locating a wafer V-notch center according to an embodiment of the present disclosure. [Figure 4] FIG. 1 is a schematic diagram of a wafer V-notch shape according to an embodiment of the present disclosure. [Diagram 5] 13 is a schematic diagram of another shape of a wafer V-notch according to an embodiment of the present disclosure. FIG. [Figure 6] 11A and 11B are schematic diagrams comparing the V-notch center positions before and after wafer rotation according to an embodiment of the present disclosure. [Figure 7] FIG. 13 is a schematic diagram of another wafer V-notch center positioning system according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure.

[0015] 1 and 2, a wafer WV-type notch center positioning system 1 is shown, which can implement the technical solution of the embodiment of the present disclosure. As shown in FIG. 1 and FIG. 2, the positioning system 1 includes a positioning back plate 10 for positioning the wafer WV-type notch center, a vacuum suction cup 20, a line laser contour detection sensor 30, a data processing device 40 and a servo motor 50.

[0016] The positioning backplate 10 is provided with a circular hole 101 which is combined with the vacuum suction cup 20 , and the vacuum suction cup 20 can be fitted into the circular hole 101 .

[0017] The vacuum suction cup 20 is configured to suck the wafer W so that the back surface of the wafer W is in close contact with the positioning back plate 10 .

[0018] The line laser contour detection sensor 30 is configured to collect edge data of the wafer WV-shaped notch.

[0019] The data processing device 40 includes: determining a center of a concentric circle corresponding to the V-notch edge based on the collected edge data of the V-notch of the wafer; determining whether the V-notch is at the set target center position based on a position between the circle center and a set reference graduation line; If the V-shaped notch is not at the set target center position, determining a rotation direction and a rotation angle of the wafer W based on a position between the circle center and a set reference graduation line; and outputting a control signal based on the rotation direction and rotation angle of the wafer W.

[0020] The servo motor 50 is configured to rotate the wafer W clockwise or counterclockwise so that the V-shaped notch is positioned below the line laser contour detection sensor 30, and to rotate the wafer W based on the rotation direction and rotation angle of the wafer W so that the V-shaped notch rotates to a set target center position in response to the control signal.

[0021] As shown in FIG. 2, a set reference graduation line is provided on the positioning back plate 10 in order to easily determine whether the center of the V-shaped notch coincides with the reference graduation line.

[0022] 1 and 2, in a specific implementation process, a data processing device 40 capable of processing data is connected to the line laser contour detection sensor 30, so that steps or tasks other than collecting edge data and rotating the wafer W can be performed through the data processing device 40. For example, the data processing device 40 may be specifically a wireless device, a mobile or mobile phone (including a so-called smartphone), a personal digital assistant (PDA), a video game console (including a video display, a mobile video game device, and a mobile video conference unit), a laptop computer, a desktop computer, a television set-top box, a tablet computing device, an e-book reader, a fixed or mobile media player, etc.

[0023] Optionally, the bottom of the positioning backplate 10 is provided with at least one pair of cam followers 60 for driving the wafer W to rotate in a clockwise or counterclockwise direction.

[0024] In the embodiment of the present disclosure, the clockwise rotation direction of the wafer W is indicated by the dotted arrow direction in FIG. 2, and the counterclockwise rotation direction of the wafer W is the direction opposite to the clockwise rotation direction.

[0025] Regarding the positioning system 1 shown in Figures 1 and 2, when using an X-ray diffractometer to measure the crystal direction deviation of the V-notch of the wafer W, the technician must first position the center of the V-notch. The specific operation is as follows: first, the edge of the wafer W with the V-notch machined therein is placed toward the line laser contour detection sensor 30, so that when the V-notch is located below the line laser contour detection sensor 30, the line laser contour detection sensor 30 can easily collect edge data of the V-notch. Then, the edge of the wafer W with no V-notch machined therein is brought into contact with the cam follower 60.

[0026] As can be seen, the vacuum suction cup 20 is provided with a tracheal interface 201 communicating with a vacuum pump (not shown), and when the mounting operation of the wafer W is completed, the vacuum pump is started to form a vacuum environment between the vacuum suction cup 20 and the wafer W, in order to facilitate the vacuum suction cup 20 to suction and fix the wafer W. In addition, the contact surface between the vacuum suction cup 20 and the back surface of the wafer W is flush with the contact surface between the positioning backplate 10 and the back surface of the wafer W, so that when the vacuum suction cup 20 suctions and fixes the wafer W, the back surface of the wafer W and the positioning backplate 10 are in close contact with each other, and the center of the V-shaped notch can be accurately positioned.

[0027] Based on the above-mentioned positioning system 1, referring to FIG. 3, a method for positioning the center of a V-shaped notch in a wafer according to an embodiment of the present disclosure is shown, which is applicable to the process of positioning the center of a V-shaped notch by the positioning system 1 shown in FIG. 1 and FIG. 2, and the positioning method includes the following S301 to S304.

[0028] In S301, the center of a concentric circle corresponding to the V-shaped notch edge is determined based on the collected edge data of the V-shaped notch on the wafer W.

[0029] In S302, it is determined whether the V-shaped notch is at the set target center position based on the position between the circle center and the set reference scale line.

[0030] In S303, if the V-shaped notch is not at the set target center position, the rotation direction and rotation angle of the wafer W are determined based on the position between the circle center and the set reference graduation line.

[0031] In S304, the wafer W is rotated based on the rotation direction and rotation angle of the wafer W so that the V-shaped notch rotates to the set target center position.

[0032] In the embodiment of the present disclosure, a Cartesian rectangular coordinate system is used with the center O1 of the wafer W as the origin, as shown in Fig. 2. Therefore, all of the coordinates described in the embodiment of the present disclosure are based on the Cartesian rectangular coordinate system constructed above.

[0033] In the technical solution shown in FIG. 3, a circle center corresponding to the V-notch edge is determined based on the collected V-notch edge data, and whether the V-notch is at the set target center position is determined based on the position between the circle center and the set reference scale line. If the V-notch is not at the set target center position, a rotation direction and a rotation angle of the wafer W are determined based on the position between the circle center and the set reference scale line. Then, the wafer W is rotated based on the rotation direction and the rotation angle of the wafer W, so that the V-notch is rotated to the set target center position. In this way, by adopting this positioning method, positioning errors can be reduced, the accuracy of measurement results can be improved, and manpower costs can be saved and production efficiency can be improved.

[0034] For the technical solution shown in FIG. 3, in some examples, determining a center of a concentric circle corresponding to the V-notch edge based on the collected edge data of the wafer WV-notch includes: Rotating the wafer W so that the V-shaped notch is rotated to below a line laser contour detection sensor 30 (see FIGS. 1 and 2); collecting edge point coordinates of the V-notch using the line laser profile detection sensor 30; Based on the coordinates of each edge point, the coordinates (X O , Y O ) to obtain the

[0035] When the bottom of the V-notch is arc-shaped as shown in Fig. 4, the concentric circle corresponding to the V-notch edge is the concentric circle corresponding to the bottom arc of the V-notch edge. On the other hand, when the contour of the V-notch is a pointed cone as shown in Fig. 5, the concentric circle corresponding to the V-notch edge is the tangent circle of the V-notch edge.

[0036] Optionally, for the above example, in some specific embodiments, the coordinates of the center O of the concentric circle corresponding to the V-shaped notch edge (X O , Y O ) is Three non-overlapping edge points are selected, and the coordinates (X O , Y O ) by fitting.

[0037] As you can understand, if you get the coordinates of the three non-overlapping edge points, you can get the circle center coordinates (X O , Y O ) can be fitted. Generally, the least square method can be used to fit the circle center coordinates, and the mathematical equation for fitting is a circle equation, which is shown in Equation (1).

[0038]

number

[0039] Here, (X, Y) are the coordinates of the V-notch edge point, and (X O , Y O) are the coordinates of the center of the concentric circle to be fitted, and r is the radius of the concentric circle to be fitted.

[0040] After expanding the fitting equation shown in equation (1), we obtain an equation of the form equation (2).

[0041]

number

[0042] Equation (2) has three unknowns, r, X O , Y O Therefore, the coordinate and radius of the center O of the concentric circle can be determined based on the coordinates of three edge points already determined, such as (X1, Y1), (X2, Y2), and (X3, Y3) in FIG. 4.

[0043] Regarding the technical solution shown in FIG. 3, in some examples, determining whether the V-shaped notch is at the set target center position based on the position between the circle center and the set reference scale line includes: Obtaining a distance L between the circle center O and a set reference scale line; determining that the V-notch is at a set target center position when the distance L=0 or when the distance L is within a set range; if the distance L is not within the set range, determining that the V-notch is not at the set target center position and continuing the V-notch center positioning operation; The set range is the distance L between the center O of the concentric circle and the set reference graduation line of 0±0.001 mm.

[0044] In addition, as shown in Figures 2 and 4, in the XO1Y plane of the Cartesian rectangular coordinate system, the reference graduation line (shown by the dashed line in Figure 4) is parallel to the Y axis, so it can be determined that the distance L between the circle center O and the set reference graduation line is equal to the X-axis coordinate value of the circle center O. As can be seen, when L is 0 or the magnitude of L is within the set range, it can be determined that the center of the V-notch is at the target center position, i.e., coincides with the reference graduation line, and at this time, the positioning operation of the V-notch center is completed and the normal wafer W crystal orientation measurement operation is started. When the magnitude of L is outside the set range, it is necessary to rotate the wafer W to continue positioning the center of the V-notch so that the center of the V-notch rotates to the target center position and coincides with the reference graduation line.

[0045] Of course, the distance L between the center O and the set reference graduation line can also be obtained by actual measurement of the scale.

[0046] Regarding the technical solution shown in FIG. 3, in some examples, when the V-shaped notch is not at the set target center position, determining the rotation direction and rotation angle of the wafer W based on the position between the circle center and the set reference scale line; If the V-shaped notch is not at the set target center position, determining a rotation angle θ of the wafer W according to the formula θ=180L / πD based on a distance L between the circle center O and a set reference graduation line and a distance D between the circle center O and a center O1 of the wafer W; and determining a rotation direction of the wafer W based on a position between the center O of the circle and a set reference graduation line.

[0047] Regarding the above example, in some specific embodiments, determining the rotation direction of the wafer W based on the position between the circle center O and the set reference graduation line includes: In the Cartesian rectangular coordinate system XO1Y plane, when the circle center O is located to the right of the reference graduation line, the distance L>0, and when the circle center O is located to the left of the reference graduation line, the distance L<0. determining that the rotation direction of the wafer W is counterclockwise if the distance L>0, or determining that the rotation direction of the wafer W is clockwise if the distance L<0.

[0048] Since the diameter of the wafer W is large, in the embodiment of the present disclosure, L is approximately regarded as the linear displacement of the outer diameter of the wafer W, as shown in Fig. 6. At the same time, in the Cartesian rectangular coordinate system XO1Y, the distance D between the center O and the center O1 of the wafer W is the Y-axis coordinate value of the center O of the concentric circle.

[0049] Furthermore, in the embodiment of the present disclosure, the positions of the center O and the reference scale line are set using the XO1Y plane shown in FIGS. 4 and 5 as an example, and when the center O is located to the right of the reference scale line on the XO1Y plane, L>0, and when the center O is located to the left of the reference scale line, L<0.

[0050] Specifically, in the above example, as shown in FIG. 6, when the center of the V-shaped notch is at position I (dotted concentric circle in the figure), the rotation angle θ of the wafer W can be calculated and obtained using the above formula θ=180L / πD in order to rotate the center of the V-shaped notch to the target center position II (two-dot chain concentric circle in the figure). As can be seen, in order to make the center of the V-shaped notch overlap (match) with the reference graduation line, since L<0 in FIG. 6, it can be determined that the rotation direction of the wafer W is clockwise as defined in the embodiment of the present disclosure. That is, by rotating the wafer W clockwise by the servo motor 50 at the rotation angle θ, the center of the V-shaped notch rotates to the target center position II, and finally, the overlap (match) between the center of the V-shaped notch and the reference graduation line can be realized.

[0051] On the other hand, in order to ensure that the center of the V-notch coincides with the reference scale line, the wafer W is rotated according to the rotation angle and rotation direction of the wafer W, and then the line laser contour detection sensor 30 is used again to collect edge data of the V-notch, and steps S301 and S302 can be executed.

[0052] Based on the same inventive idea as the above-mentioned technical solution, referring to FIG. 7 , a wafer WV-type notch center positioning system 1 according to an embodiment of the present disclosure is shown, which includes a first determination part 701, a judgment part 702, a second determination part 703 and a rotation part 704.

[0053] The first determining portion 701 is configured to determine a center of a concentric circle corresponding to the V-notch edge based on collected edge data of the wafer WV-notch.

[0054] The determining portion 702 is configured to determine whether the V-notch is at a set target center position based on the position between the circle center and a set reference scale line.

[0055] The second determination portion 703 is configured to determine the rotation direction and rotation angle of the wafer W based on the position between the circle center and a set reference scale line when the V-shaped notch is not at a set target center position.

[0056] The rotating portion 704 is configured to rotate the wafer W based on a rotation direction and a rotation angle of the wafer W so that the V-shaped notch rotates to the set target center position.

[0057] In the method, the first determination portion 701 comprises: Rotating the wafer W so that the V-shaped notch is rotated to below a line laser contour detection sensor 30 (see FIGS. 1 and 2); collecting edge point coordinates of the V-notch using the line laser profile detection sensor 30; and obtaining coordinates (XO, YO) of a center O of a concentric circle corresponding to the V-notch edge using a least squares method based on the coordinates of each edge point.

[0058] In the method, the first determination portion 701 comprises: The method is configured to select three non-overlapping edge points, and obtain the coordinates (XO, YO) of the center O of the circle corresponding to the V-notch edge by fitting using the least squares method based on the coordinates of the three non-overlapping edge points.

[0059] In the above method, the decision portion 702 includes: Obtaining a distance L between the circle center O and a set reference scale line; determining that the V-notch is at a set target center position when the distance L=0 or when the distance L is within a set range; if the distance L is not within the set range, determine that the V-notch is not at the set target center position, and continue the V-notch center positioning operation; The set range is the distance L between the center O of the concentric circle and the set reference graduation line of 0±0.001 mm.

[0060] In the method, the second determining portion 703 comprises: If the V-shaped notch is not at the set target center position, determining a rotation angle θ of the wafer W according to the formula θ=180L / πD based on a distance L between the circle center O and a set reference graduation line and a distance D between the circle center O and a center O1 of the wafer W; and determining a rotation direction of the wafer W based on a position between the circle center O and a set reference graduation line.

[0061] In the method, the second determining portion 703 comprises: In the Cartesian rectangular coordinate system XO1Y plane, when the circle center O is located to the right of the reference graduation line, the distance L>0, and when the circle center O is located to the left of the reference graduation line, the distance L<0. determining that the rotation direction of the wafer W is counterclockwise if the distance L>0; or determining that the rotation direction of the wafer W is clockwise if the distance L<0.

[0062] As can be understood, in this embodiment, a "part" may be a partial circuit, a partial processor, a partial program or software, etc., and of course may be a unit, and may be a module or a non-module.

[0063] In addition, each component element in this embodiment may be integrated into one processing unit, each unit may exist physically alone, or two or more units may be integrated into one unit. The integrated unit may be realized in the form of hardware or a software functional module.

[0064] When the integrated unit is realized in the form of a software function module that is not sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present embodiment can be expressed in the form of a software product, either essentially or in part of the contribution to the related art, or in whole or in part, and the computer software product is stored in a storage medium containing some instructions for making a computer device (which may be a personal computer, a server, or a network device, etc.) or a processor execute all or part of the steps of the method described in the present embodiment. The storage medium includes various media that can store program code, such as a U disk, a removable hard disk, a read only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0065] Therefore, this embodiment provides a computer storage medium, in which a program for locating the center of a wafer WV-type notch is stored, and when the program for locating the center of a wafer WV-type notch is executed by at least one processor, the steps of the method for locating the center of a wafer WV-type notch in the above technical solution are realized.

[0066] In addition, the technical solutions described in the embodiments of the present disclosure can be arbitrarily combined if they do not conflict with each other.

[0067] The above are only specific embodiments of the present disclosure, but the scope of protection of the present disclosure is not limited thereto, and within the technical scope disclosed in the present disclosure, a person skilled in the art can easily think of modifications and replacements, all of which should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be in accordance with the claims.

Claims

1. A method for locating a center of a V-shaped notch in a wafer, comprising the steps of: The positioning method includes: determining a center of a concentric circle corresponding to the V-notch edge based on the collected wafer V-notch edge data; determining a center of a concentric circle corresponding to the V-notch edge based on the collected wafer V-notch edge data; rotating the wafer so that the V-shaped notch is rotated to below a line laser contour detection sensor; collecting edge point coordinates of the V-notch using the line laser profile detection sensor; and obtaining coordinates (XO, YO) of a center O of a concentric circle corresponding to the V-notch edge using a least squares method based on the coordinates of each edge point; The positioning method further comprises: determining whether the V-notch is at a set target center position based on a position between the circle center and a set reference scale line; Determining whether the V-shaped notch is at a set target center position based on a position between the circle center and a set reference graduation line is Obtaining a distance L between the circle center O and a set reference scale line; determining that the V-notch is at a preset target center position when the distance L=0 or when the distance L is within a preset range; if the distance L is not within the set range, determining that the V-notch is not at the set target center position and continuing the V-notch center positioning operation; the set range is a distance L between the center O of the concentric circle and the set reference graduation line = 0 ± 0.001 mm, The positioning method further comprises: If the V-shaped notch is not at the set target center position, determining a rotation direction and a rotation angle of the wafer based on a position between the circle center and a set reference graduation line; and rotating the wafer based on a rotation direction and a rotation angle of the wafer so that the V-shaped notch rotates to the set target center position, determining a rotation direction and a rotation angle of the wafer based on a position between the circle center and a set reference graduation line when the V-shaped notch is not at a set target center position; If the V-shaped notch is not at the set target center position, determining a rotation angle θ of the wafer according to the formula θ=180L / πD based on a distance L between the circle center O and a set reference graduation line, and a distance D between the circle center O and a wafer center O 1 ; determining a rotation direction of the wafer based on a position between the center O of the circle and a set reference graduation line. A method for locating the center of a V-shaped notch in a wafer.

2. Based on the coordinates of each edge point, the coordinates (X Ｏ , Y Ｏ ) is Three non-overlapping edge points are selected, and the coordinates (X Ｏ , Y Ｏ ) by fitting The method of claim 1.

3. Determining a rotation direction of the wafer based on a position between the center O of the circle and a set reference graduation line, In the Cartesian rectangular coordinate system XOY plane, when the circle center O is located to the right of the reference graduation line, the distance L>0, and when the circle center O is located to the left of the reference graduation line, the distance L<0 is set; determining that the rotation direction of the wafer is counterclockwise if the distance L>0, or determining that the rotation direction of the wafer is clockwise if the distance L<0. The positioning method according to claim 1 .

4. A wafer V-notch center positioning system, comprising: the positioning system includes a first determining portion, a judging portion, a second determining portion, and a rotating portion; The first determining portion is configured to determine a center of a concentric circle corresponding to the V-notch edge based on collected wafer V-notch edge data; determining a center of a concentric circle corresponding to the V-notch edge based on the collected wafer V-notch edge data; rotating the wafer so that the V-shaped notch is rotated to below a line laser contour detection sensor; collecting edge point coordinates of the V-notch using the line laser profile detection sensor; Based on the coordinates of each edge point, the coordinates (X Ｏ , Y Ｏ ) and The determining unit is configured to determine whether the V-shaped notch is at a set target center position based on a position between the circle center and a set reference scale line; Determining whether the V-shaped notch is at a set target center position based on a position between the circle center and a set reference scale line is Obtaining a distance L between the circle center O and a set reference scale line; determining that the V-notch is at a set target center position when the distance L=0 or when the distance L is within a set range; if the distance L is not within the set range, determining that the V-notch is not at the set target center position and continuing the V-notch center positioning operation; the set range is a distance L between the center O of the concentric circle and the set reference graduation line = 0 ± 0.001 mm, the second determination unit is configured to determine a rotation direction and a rotation angle of the wafer based on a position between the circle center and a set reference graduation line when the V-shaped notch is not at a set target center position; the rotating portion is configured to rotate the wafer based on a rotation direction and a rotation angle of the wafer so that the V-shaped notch rotates to the set target center position; The second determination part: If the V-shaped notch is not at the set target center position, determining a rotation angle θ of the wafer according to the formula θ=180L / πD based on a distance L between the circle center O and a set reference graduation line, and a distance D between the circle center O and a wafer center O 1 ; and determining a rotation direction of the wafer based on a position between the circle center O and a set reference graduation line. Wafer V-notch center positioning system.

5. A wafer V-notch center positioning system, comprising: The positioning system includes a positioning back plate for positioning the center of the V-shaped notch of the wafer, a vacuum suction cup, a line laser contour detection sensor, a data processing device, and a servo motor; The positioning backplate is provided with a circular hole that is combined with the vacuum suction cup, and the vacuum suction cup can be fitted into the circular hole; the vacuum suction cup is configured to suck the wafer so that the back surface of the wafer is in close contact with the positioning back plate; the line laser profile detection sensor is configured to collect edge data of the V-notch; The data processing device includes: determining a center of a concentric circle corresponding to the V-notch edge based on the collected edge data of the wafer V-notch; determining a center of a concentric circle corresponding to the V-notch edge based on the collected wafer V-notch edge data; rotating the wafer so that the V-shaped notch is rotated to below a line laser contour detection sensor; collecting edge point coordinates of the V-notch using the line laser profile detection sensor; Based on the coordinates of each edge point, the coordinates (X Ｏ , Y Ｏ ) and The data processing device further comprises: and determining whether the V-notch is at a set target center position based on a position between the circle center and a set reference graduation line; Determining whether the V-shaped notch is at a set target center position based on a position between the circle center and a set reference scale line is Obtaining a distance L between the circle center O and a set reference scale line; determining that the V-notch is at a set target center position when the distance L=0 or when the distance L is within a set range; if the distance L is not within the set range, determining that the V-notch is not at the set target center position and continuing the V-notch center positioning operation; the set range is a distance L between the center O of the concentric circle and the set reference graduation line = 0 ± 0.001 mm, The data processing device further comprises: If the V-shaped notch is not at the set target center position, determining a rotation direction and a rotation angle of the wafer based on a position between the circle center and a set reference graduation line; outputting a control signal based on a rotation direction and a rotation angle of the wafer; the servo motor is configured to rotate the wafer clockwise or counterclockwise so that the V-shaped notch is positioned below the line laser contour detection sensor, and to rotate the wafer based on the rotation direction and rotation angle of the wafer in response to the control signal so that the V-shaped notch rotates to a set target center position; determining a rotation direction and a rotation angle of the wafer based on a position between the circle center and a set reference graduation line when the V-shaped notch is not at a set target center position; If the V-shaped notch is not at the set target center position, determining a rotation angle θ of the wafer according to the formula θ=180L / πD based on a distance L between the circle center O and a set reference graduation line, and a distance D between the circle center O and a wafer center O 1 ; determining a rotation direction of the wafer based on a position between the center O of the circle and a set reference graduation line. Wafer V-notch center positioning system.

6. 4. A computer storage medium having a program for locating a center of a wafer V-notch stored therein, the program implementing the steps of the method for locating a center of a wafer V-notch according to any one of claims 1 to 3 when executed by at least one processor.

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