Mounting Head

Abstract

To make it possible to selectively supply positive pressure and negative pressure to a suction tool without hindering a rotation operation of the suction tool and a copying operation of a copying mechanism in a mounting head including the suction tool for vacuum sucking a semiconductor chip and a copying mechanism for making a suction face (lower face) of the suction tool to be in parallel to a substrate face.SOLUTION: In a mounting head 1, a spindle 30 is attached to a vertically movable head body 10 so that the spindle can rotate around a Z axis, and a suction tool 60 for vacuum sucking a semiconductor chip is attached to a lower end of the spindle 30 via a copying mechanism 50. The mounting head includes: a housing 80 for retaining the copying mechanism 50 in a state that the copying mechanism is rotatable around the Z axis; and a whirl-stop mechanism interposed between the housing 80 and the head body 10 for restricting rotation of the housing 80 around the Z axis with respect to the head body 10. The housing is provided with an air supply / exhaust port for supplying positive pressure or negative pressure, and the air supply / exhaust port communicates to the suction tool 60 through an air channel.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a mounting head of a mounting apparatus that mounts semiconductor chips on a substrate. In this specification, the term "semiconductor chip" collectively refers to diced semiconductor elements, packaged electronic components, etc. In addition, in this specification, the term "substrate" collectively refers to a support for bonding diced semiconductor elements, a printed circuit board on which packaged electronic components are mounted, etc. [Background technology]

[0002] Conventionally, the mounting head of a mounting device is generally configured such that a spindle is attached to a head body that can move in the vertical direction so as to be rotatable around the Z-axis, which is the vertical axis of the spindle, and a suction tool such as a collet or a nozzle for vacuum-suctioning a semiconductor chip is attached to the lower end of the spindle. In order to achieve high-quality mounting with such a mounting head, it is necessary to always keep the suction surface (lower surface) of the suction tool that vacuum-suctions the semiconductor chip parallel to the substrate surface. Therefore, when the suction surface (lower surface) of the suction tool and the substrate surface are not parallel, it is conceivable to interpose a copying mechanism, such as those disclosed in Patent Documents 1 to 3, between the spindle and the suction tool in order to make the suction surface (lower surface) of the suction tool parallel to the substrate surface.

[0003] However, in a mounting head equipped with a suction tool that vacuum-sucks a semiconductor chip, it is necessary to selectively supply positive and negative pressure to the suction tool, but the configuration for this purpose is not disclosed in Patent Documents 1 to 3. Simply providing an air supply / discharge port for supplying positive or negative pressure to the suction tool is sufficient, but since the suction tool rotates around the Z axis, providing an air supply / discharge port to the suction tool will cause the air piping connected to the air supply / discharge port to be dragged and rotated along with the rotation of the suction tool, which will interfere with the rotational movement of the suction tool. In addition, the suction tool is attached to the lower surface side of the lower block (swinging body) of the copying mechanism, but if an air supply / discharge port is provided to the suction tool, the weight and piping resistance of the suction tool will increase, including the air piping connected to the air supply / discharge port, which will interfere with the copying movement due to the swinging of the lower block (swinging body). Furthermore, if an air supply / discharge port is provided to the copying mechanism, it will also interfere with the rotational movement and copying movement of the copying mechanism. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2002-141361 A [Patent Document 2] JP 2010-27988 A [Patent Document 3] JP 2016-51857 A Summary of the Invention [Problem to be solved by the invention]

[0005] The problem that the present invention aims to solve is to enable a mounting head equipped with a suction tool that vacuum-sucks a semiconductor chip and a copying mechanism for making the suction surface (lower surface) of the suction tool parallel to the substrate surface to selectively supply positive pressure and negative pressure to the suction tool without interfering with the rotational movement of the suction tool or the copying movement of the copying mechanism. [Means for solving the problem]

[0006] According to one aspect of the present invention, the following 3 A mounting head is provided. 1. A mounting head in which a spindle is attached to a head body movable in a vertical direction so as to be rotatable about a Z-axis which is an axis of the spindle in a vertical direction, and a suction tool which vacuum-sucks a semiconductor chip via a copying mechanism is attached to a lower end of the spindle, a housing that holds the copying mechanism rotatably around a Z axis, and a rotation prevention mechanism that is interposed between the housing and the head body and that restricts rotation of the housing relative to the head body around the Z axis, The housing is provided with an air supply / discharge port for supplying positive pressure or negative pressure, The air supply / discharge port is in communication with the suction device through an air passage. And, The anti-rotation mechanism allows the housing to move in the Z-axis direction relative to the head body. , mounting head. 2. A mounting head in which a spindle is attached to a head body movable in a vertical direction so as to be rotatable about a Z-axis which is an axis of the spindle in a vertical direction, and a suction tool which vacuum-sucks a semiconductor chip via a copying mechanism is attached to a lower end of the spindle, a housing that holds the copying mechanism rotatably around a Z axis, and a rotation prevention mechanism that is interposed between the housing and the head body and that restricts rotation of the housing relative to the head body around the Z axis, The housing is provided with an air supply / discharge port for supplying positive pressure or negative pressure, The air supply / discharge port is in communication with the suction tool through an air passage, The copying mechanism includes an upper block having a first copying surface, which is either a concave hemispherical surface or a convex hemispherical surface, on a lower surface thereof, and a lower block having a second copying surface, which is either a concave hemispherical surface or a convex hemispherical surface, on an upper surface thereof. The second copying surface copies the first copying surface, so that the lower block can swing relative to the upper block. The suction tool is attached to the lower surface side of the lower block. R, the upper block has a branch air passage branching from the air passage and communicating with the first copying surface, and a positive pressure supplied to the air supply / discharge port is supplied from the first copying surface to the second copying surface through the air passage and the branch air passage. Mounting head. 3. The copying mechanism further includes a piston cylinder and a piston rod disposed within the piston cylinder so as to be movable in the Z-axis direction, The piston cylinder is attached to the housing so as to be rotatable around the Z axis and immovable in the Z axis direction, a lower end of the spindle is fixed to an upper end of the piston cylinder, and the upper block is fixed to a lower end of the piston cylinder, The lower block is supported swivelably at the lower end of the piston rod. The housing is provided with an air supply port for supplying positive pressure, and the positive pressure supplied to the air supply port is supplied into the piston cylinder, and the piston rod is urged upward in the Z-axis direction by this positive pressure. 2 The mounting head according to claim 1. Effect of the Invention

[0007] According to the present invention, positive pressure and negative pressure can be selectively supplied to the suction tool without interfering with the rotational movement of the suction tool or the tracing movement of the tracing mechanism. [Brief description of the drawings]

[0008] [Figure 1] 1 is a conceptual diagram showing the overall configuration of a mounting head according to an embodiment of the present invention; [Diagram 2] FIG. 4 is a perspective view of a copying mechanism held in a housing in an embodiment of the present invention. [Diagram 3] FIG. 3 is an exploded perspective view of FIG. 2. [Figure 4] Cross section AA of Figure 2. [Diagram 5] FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] FIG. 1 conceptually shows the overall configuration of a mounting head according to one embodiment of the present invention. The mounting head 1 shown in the figure includes a head body 10 that is movable in the vertical direction. The head body 10 moves in the vertical direction by rotating a ball screw mechanism 21 using a motor 20. A spindle 30 is attached to the head body 10 so as to be rotatable around the Z-axis, which is the vertical axis of the spindle 30. The spindle 30 rotates around the Z-axis by rotating a belt mechanism 41 using a motor 40.

[0010] A collet 60 is attached to the lower end of the spindle 30 via the tracing mechanism 50 as a suction tool that vacuum-sucks the semiconductor chip. The upper end of the spindle 30 is connected to a cylinder rod 71 of an air cylinder mechanism 70. The air cylinder mechanism 70 is filled with air at a predetermined pressure and functions as an air spring. Although details will be described later, during the tracing operation by the tracing mechanism 50, the spindle 30 is lowered together with the head body 10 by driving the motor 20 so that the lower surface of the collet 60 touches the substrate surface 2, and then the spindle 30 is further lowered a predetermined amount (about 0.5 mm). At this time, the spindle 30 moves upward relative to the head body 10 due to the air spring function of the air cylinder mechanism 70. Furthermore, when the spindle 30 is raised together with the head body 10 after the tracing operation is completed, the spindle 30 moves downward relative to the head body 10 due to the air spring function of the air cylinder mechanism 70 and returns to the initial position (origin position).

[0011] Thus, in this embodiment, the spindle 30 is rotatable around the Z axis and movable in the Z direction relative to the head body 10. Note that, in this embodiment, the spindle 30 is guided by the spindle guide 31 when rotating or moving, so that the spindle 30 can rotate or move smoothly.

[0012] The copying mechanism 50 is held in a housing 80 so as to be rotatable around the Z axis. A rotation prevention mechanism 90 is interposed between the head body 10 and the housing 80.

[0013] Next, the copying mechanism 50 will be described in detail. Fig. 2 is a perspective view of the copying mechanism 50 held in a housing 80, Fig. 3 is an exploded perspective view thereof, and Fig. 4 is a cross-sectional view taken along line AA in Fig. 2. Note that Fig. 4 additionally shows a collet 60. The copying mechanism 50 has a piston cylinder 51, a piston rod 52, an upper block 53, and a lower block 54.

[0014] The piston cylinder 51 is comprised of a body portion 51a and a lid portion 51b, and is attached to the housing 80 rotatably around the Z axis via bearings 55a, 55b arranged at two positions, top and bottom. The bottom end of the spindle 30 is fixed to the lid portion 51b, which is the top end of the piston cylinder 51. Therefore, when the spindle 30 rotates around the Z axis, the piston cylinder 51 also rotates around the Z axis. The piston cylinder 51 is attached to the housing 80 so as to be immovable in the Z axis direction. The piston rod 52 is formed by integrating an upper rod 52a and a lower rod 52b, and is disposed within the piston cylinder 51 so as to be movable in the Z-axis direction. An air supply port 81 for supplying positive pressure (compressed air) is provided in the housing 80. The positive pressure (for example, about 0.5 MPa) supplied to this air supply port 81 is supplied into the piston cylinder 51 through a positive pressure passage 82, and the piston rod 52 is urged upward in the Z-axis direction by this positive pressure. Note that, in order to ensure a sufficient upward urging force in the Z-axis direction by this positive pressure, the upper ends of the piston cylinder 51 and the piston rod 52 are expanded into a flange shape.

[0015] The upper block 53 has a first copying surface 53a that is a concave semispherical surface on its lower surface, and is fixed to the lower end of the main body portion 51a of the piston cylinder 51. The lower block 54 has a second tracing surface 54a that is a convex semispherical surface on its upper surface, and is supported so as to be able to swing on a flange-shaped support portion 52b-1 formed on the lower end portion of the lower rod 52b of the piston rod 52. The second tracing surface 54a of the lower block 54 follows the first tracing surface 53a of the upper block 53, so that the lower block 54 can swing relative to the upper block 53. As shown in FIG. 4, the collet 60 is attached to the lower surface side of the lower block 54 via a collet holder 61.

[0016] The housing 80 is provided with an air supply / discharge port 83 for supplying positive or negative pressure. As shown in Fig. 4, this air supply / discharge port 83 is connected to the suction holes 60a of the collet 60 through an air passage 100. Therefore, when a negative pressure (e.g., about -0.1 MPa) is supplied from the air supply / discharge port 83, the negative pressure is supplied to the suction holes 60a of the collet 60 through the air passage 100, thereby vacuum-adsorbing the semiconductor chip to the collet 60. Thereafter, when a positive pressure (e.g., about 0.2 MPa) is supplied from the air supply / discharge port 83, the positive pressure is supplied to the suction holes 60a of the collet 60 through the air passage 100, thereby detaching the semiconductor chip from the collet 60 and mounting it on the board. During this series of mounting operations, positive pressure is constantly supplied from the air supply port 81 through the positive pressure passage 82 into the piston cylinder 51, and this positive pressure urges the piston rod 52 upward in the Z-axis direction, causing the lower block 54 to be pressed against the upper block 53 and locked so that it cannot swing.

[0017] In this embodiment, the air passage 100 passes over the vertical central axis (Z-axis) of the piston rod 52 (lower rod 52a) and communicates with the suction hole 60a of the collet 60. In this embodiment, the upper block 53 has a branch air passage 101 that branches off from the air passage 100 and leads to the first tracing surface 53a. As will be described in detail later, when positive pressure is supplied from the air supply / discharge port 83 during the tracing operation of the tracing mechanism 50, the positive pressure is radially ejected from the first tracing surface 53a toward the second tracing surface 54a through the air passage 100 and the branch air passage 101. This releases the above-mentioned locked state, and the lower block 54 enters an unlocked state in which it can swing relative to the upper block 53.

[0018] Next, the anti-rotation mechanism 90 will be described. As shown in FIG. 5, the anti-rotation mechanism 90 is interposed between the head body 10 and the housing 80, and restricts the rotation of the housing 80 relative to the head body 10 around the Z axis. In this embodiment, the anti-rotation mechanism 90 includes a anti-rotation plate 91. One end of the anti-rotation plate 91 is fixed to the head body 10. Meanwhile, a long hole (through hole) 91a that is long in the vertical direction is formed at the other end of the anti-rotation plate 91, and the bearing 84 provided in the housing 80 is fitted into this long hole 91a so as to be movable in the Z axis direction. As a result, the rotation of the housing 80 relative to the head body 10 around the Z axis is restricted, and the movement of the housing 80 in the Z axis direction relative to the head body 10 is permitted.

[0019] Next, the copying operation by the copying mechanism 50 will be described. In this embodiment, in preparation for the copying operation, the lower end of the air passage 100 leading to the collet 60 or the suction hole 60a is blocked. For example, in order to block the lower end of the air passage 100, the collet 60 can be replaced with a dummy collet (not shown). The dummy collet has the same external shape as the collet 60 and blocks the lower end of the air passage 100. It is also possible to block the lower end of the air passage 100 or the suction hole 60a by some means while keeping the collet 60 in use without using such a dummy collet. Therefore, in the following description, it is assumed that the collet 60 is still in use.

[0020] Before the tracing operation, the height position of the lower surface of the collet 60 is at the Z0 position (home position) as shown in FIG. 1. During the tracing operation, the head body 10 is lowered at high speed (for example, about 600 mm / s) until the height position of the lower surface of the collet 60 reaches the Z1 position. When the height position of the lower surface of the collet 60 reaches the Z1 position, the supply of positive pressure from the air supply port 81 is stopped and the positive pressure passage 82 is opened to the atmosphere. As a result, the piston rod 52 is no longer biased upward in the Z-axis direction, and the lower block 54 is no longer pressed against the upper block 53. After that, positive pressure is temporarily supplied from the air supply / exhaust port 83 (for example, for about 0.5 seconds). This positive pressure is jetted radially downward from the first tracing surface 53a to the second tracing surface 54a through the positive pressure air passage 100 and the branch air passage 101. As a result, the lower block 54 is in an unlocked state in which it can swing relative to the upper block 53.

[0021] Next, the head body 10 is lowered at a low speed (for example, about 2 mm / s) until the lower surface of the collet 60 touches the substrate surface 2. Whether or not the lower surface of the collet 60 has touched the substrate surface 2 can be detected by a well-known touch sensor. After the lower surface of the collet 60 has touched the substrate surface 2, the head body 10 is further lowered a predetermined amount (about 0.5 mm) to press the collet 60 into the substrate surface 2 for a predetermined time (for example, about 2 seconds). As a result, the lower block 54 of the copying mechanism 50 holding the collet 60 swings to copy the substrate surface 2, and the lower surface (suction surface) of the collet 60 and the substrate surface 2 become parallel.

[0022] After that, negative pressure is temporarily supplied (for example, for about 2 seconds) from the air supply / discharge port 83. This negative pressure attracts the lower block 54 of the copying mechanism 50 to the upper block 53, resulting in a temporary locking state. After that, positive pressure is further supplied from the air supply port 81. This positive pressure urges the piston rod 52 upward in the Z-axis direction, and the lower block 54 is pressed against the upper block 53, resulting in a locked state in which it cannot swing. Finally, the head body 10 is raised until the height position of the lower surface of the collet 60 reaches the Z0 position.

[0023] As described above, in this embodiment, the air supply port 81 and the air supply / exhaust port 83 are provided in the housing 80 that holds the copying mechanism 50 rotatably around the Z axis. The rotation of the housing 80 around the Z axis relative to the head body 10 is restricted by the rotation prevention mechanism 90. Therefore, even if the copying mechanism 50 and the collet 60 rotate around the Z axis with the rotation of the spindle 30, the housing 80 does not rotate, and the air pipes 81a and 83a connected to the air supply port 81 and the air supply / exhaust port 83 do not rotate together. As described above, according to this embodiment, positive pressure and negative pressure can be selectively supplied to the collet without interfering with the rotational operation of the collet 60 and the copying operation of the copying mechanism 50. Also, in this embodiment, the air supply port 81 and the air supply / exhaust port 83 are not provided in the copying mechanism 50 and the collet 60, so that they can be made smaller and lighter, and the rotational operation of the collet 60 and the copying operation of the copying mechanism 50 can be smoothly performed.

[0024] In this embodiment, the first tracing surface 53a on the lower surface of the upper block 53 is a concave hemispherical surface, and the second tracing surface 54a on the upper surface of the lower block 54 is a convex hemispherical surface, but it is also possible to reverse this and make the first tracing surface 53a on the lower surface of the upper block 53 a convex hemispherical surface, and the second tracing surface 54a on the upper surface of the lower block 54 a concave hemispherical surface. Also, a suction nozzle can be used instead of the collet 60 as the suction tool. [Explanation of symbols]

[0025] 1 Mounting head 2 Board surface 10 Head body 20 Motor 21 Ball screw mechanism 30 Spindle 31 Spindle guide 40 Motor 41 Belt mechanism 50 Copying mechanism 51 Piston Cylinder 51a Main body 51b Lid 52 Piston rod 52a Upper Rod 52b Lower Rod 52b-1 Support part 53 Upper Block 53a First copy surface 54 Lower Block 54a Second copy surface 55a, 55b bearings 60 Collet (suction tool) 60a suction hole 61 Collet holder 70 Air cylinder mechanism 71 Cylinder rod 80 Housing 81 Air supply port 81a Air piping 82 Positive pressure path 83 Air supply / exhaust port 83a Air piping 90 Anti-rotation mechanism 91 Anti-rotation plate 91a Long hole (through hole) 100 Air passage 101 Branch air passage

Claims

1. A mounting head in which a spindle is attached to a head body movable in a vertical direction so as to be rotatable about a Z-axis which is an axis of the spindle in a vertical direction, and a suction tool which vacuum-sucks a semiconductor chip via a copying mechanism is attached to a lower end of the spindle, a housing that holds the copying mechanism rotatably around a Z axis, and a rotation prevention mechanism that is interposed between the housing and the head body and that restricts rotation of the housing relative to the head body around the Z axis, The housing is provided with an air supply / discharge port for supplying positive pressure or negative pressure, The air supply / discharge port is in communication with the suction tool through an air passage, The anti-rotation mechanism of the mounting head allows the housing to move in the Z-axis direction relative to the head body.

2. A mounting head comprising a head body movable in an up-down direction, a spindle rotatably attached around a Z-axis which is an up-down axis of the spindle, and a suction tool which vacuum-sucks a semiconductor chip via a tracing mechanism attached to a lower end of the spindle, a housing that holds the copying mechanism rotatably around a Z axis, and a rotation prevention mechanism that is interposed between the housing and the head body and that restricts rotation of the housing relative to the head body around the Z axis, The housing is provided with an air supply / discharge port for supplying positive pressure or negative pressure, The air supply / discharge port is in communication with the suction tool through an air passage, The copying mechanism includes an upper block having a first copying surface, which is either a concave hemispherical surface or a convex hemispherical surface, on a lower surface thereof, and a lower block having a second copying surface, which is the other of the concave hemispherical surface or the convex hemispherical surface, on an upper surface thereof, and the second copying surface copies the first copying surface, thereby enabling the lower block to swing relative to the upper block, and the suction tool is attached to the lower surface side of the lower block, a mounting head, wherein the upper block has a branch air passage branching from the air passage and leading to the first copying surface, and positive pressure supplied to the air supply / exhaust port is supplied from the first copying surface to the second copying surface through the air passage and the branch air passage.

3. The copying mechanism further includes a piston cylinder and a piston rod disposed within the piston cylinder so as to be movable in the Z-axis direction, the piston cylinder is attached to the housing so as to be rotatable around the Z axis and immovable in the Z axis direction, a lower end of the spindle is fixed to an upper end of the piston cylinder, and the upper block is fixed to a lower end of the piston cylinder, The lower block is supported swivelably at the lower end of the piston rod.

3. The mounting head according to claim 2, wherein the housing is provided with an air supply port for supplying positive pressure, and the positive pressure supplied to the air supply port is supplied into the piston cylinder, and the piston rod is urged upward in the Z-axis direction by this positive pressure.

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