Suction device, suction unit, suction method, and program

Abstract

An attachment device according to the present invention comprises: an attachment head; a movement control unit that moves the attachment head between a first position for attachment of an electronic component housed in a recess of a housing member, and a second position further separated from the electronic component than the first position; an attachment control unit that causes attachment of the electronic component to the attachment head when the attachment head is located at the first position. The attachment head has a contact part that, when located at the first position, contacts a first surface on the outer side of a region where the recess in the housing member is opened. By using this such an attachment device, it is possible to, through simple control, suppress damage to an electronic component when the electronic component is attached thereto.

Description

[Technical field]

[0001] The present invention relates to a suction device, a suction unit, a suction method, and a program. [Background technology]

[0002] Conventionally, pickup tools have been widely known as suction devices for suctioning semiconductor chips. For example, Patent Document 1 discloses a pickup tool that has multiple protrusions on the end face that suctions the semiconductor chip, reducing the contact area with the semiconductor chip and suppressing the generation of static electricity, thereby preventing the semiconductor chip from being destroyed by static electricity. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-53457 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional techniques, the semiconductor chip may be damaged due to the load acting on the semiconductor chip from the pickup tool when the semiconductor chip is picked up, which necessitates complex load control for the pickup tool.

[0005] These problems are not limited to semiconductor chips, but are common to most cases of suctioning electronic components.

[0006] The present invention has been made to solve such problems, and provides a suction device, a suction unit, a suction method, and a program that can prevent damage to electronic components when they are sucked up through simple control. [Means for solving the problem]

[0007] A first aspect of the present invention provides an suction device comprising a suction head, a movement control unit which moves the suction head between a first position for suctioning an electronic component accommodated in a recess of a storage member and a second position which is further away from the electronic component than the first position, and a suction control unit which causes the suction head to suction the electronic component when the suction head is positioned at the first position, and the suction head has an abutment portion which abuts against a first surface outside the area where the recess of the storage member is opened when the suction head is positioned at the first position.

[0008] In addition, a suction unit in a second aspect of the present invention includes a suction head, a storage member having a recess for accommodating an electronic component, a movement control unit that moves the suction head between a first position for adsorbing the electronic component accommodated in the recess of the storage member and a second position that is further away from the electronic component than the first position, and a suction control unit that causes the suction head to adsorb the electronic component when the suction head is located at the first position, and the suction head has an abutment portion that abuts against a first surface outside the area where the recess is opened in the storage member when located at the first position.

[0009] In addition, a suction method in a third aspect of the present invention includes a step of moving a suction head toward a first position where the electronic component accommodated in a recess of a accommodating member is suctioned, and abutting the abutment portion of the suction head against a first surface outside the area where the recess of the accommodating member is opened, and a step of causing the suction head to suction the electronic component when the suction head is positioned at the first position.

[0010] In addition, a program in a fourth aspect of the present invention causes a computer to execute a process of moving a suction head toward a first position for suctioning an electronic component held in a recess of a accommodating member, and abutting a contact portion of the suction head against a first surface outside the area where the recess is opened in the accommodating member, and a process of causing the suction head to suction the electronic component when the suction head is positioned at the first position. Effect of the Invention

[0011] According to the present invention, damage to an electronic component when the electronic component is sucked can be suppressed through simple control. [Brief description of the drawings]

[0012] [Figure 1] FIG. 2 is a perspective view showing a schematic view of a main part of the suction unit according to the embodiment; [Diagram 2] FIG. 2 is a side view showing a schematic view of a main part of the suction unit according to the embodiment; [Diagram 3] 4 is a plan view showing a schematic diagram of the positional relationship between the carrier tape and the suction head in the suction unit according to the embodiment; FIG. [Figure 4] FIG. 2 is a system configuration diagram of the suction unit. [Diagram 5] 13 is a flowchart showing a processing procedure of a calculation processing unit. [Figure 6] 5 is a timing chart showing a series of signal processing in the suction unit according to the embodiment. [Figure 7] 5A to 5C are diagrams illustrating the operation of the suction unit according to the embodiment. [Figure 8] 13 is a plan view showing a schematic diagram of the positional relationship between the carrier tape and the suction head in the suction unit according to another embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The present invention will be described below through embodiments of the invention, but the invention according to the claims is not limited to the following embodiments. Furthermore, not all of the configurations described in the embodiments are necessarily essential as means for solving the problems.

[0014] As shown in FIG. 1, the suction unit 100 picks up a semiconductor chip 320, which is an example of an electronic component housed in a carrier tape 310, by suction using a pickup tool 330, and places and bonds the semiconductor chip 320 on a substrate. The carrier tape 310 is an example of a housing member, and the pickup tool 330 is an example of a suction device. The carrier tape 310 is in the form of a thin plate, and its upper surface is a flat surface along a plane defined by the X-axis and the Y-axis. A plurality of recesses 312 are formed on the upper surface of the carrier tape 310. The plurality of recesses 312 have rectangular openings and are formed at intervals in the Y-axis direction. Each of the plurality of recesses 312 houses one semiconductor chip 320.

[0015] Pickup tool 330 includes, for example, a holder 332 and a suction head 334. Holder 332 holds suction head 334 and is movable in a planar direction by a moving mechanism 336. The planar direction is a direction along a plane defined by an X-axis and a Y-axis.

[0016] The suction head 334 has a cylindrical shape. The suction head 334 can be moved in the height direction by an elevating mechanism 338. The height direction is the Z-axis direction perpendicular to the planar direction. The suction head 334 sucks the semiconductor chip 320 accommodated in the recess 312 of the carrier tape 310 by means of a suction mechanism 340. The suction mechanism 340 is formed of, for example, a suction pump. The suction head 334 picks up the semiconductor chip 320 from the carrier tape 310 by moving upward while sucking the semiconductor chip 320.

[0017] Thereafter, when the pickup tool 330 places and bonds the semiconductor chip 320 on the substrate, the suction unit 100 moves the carrier tape 310 in the Y-axis direction to a position where the suction head 334 and the recesses 312 adjacent to each other in the Y-axis direction face each other in the height direction. Then, the suction unit 100 starts the suction process of the semiconductor chip 320 accommodated in the adjacent recesses 312.

[0018] As shown in FIGS. 2 and 3, the suction head 334 has a columnar large-diameter portion 334A and a columnar small-diameter portion 334B provided below the large-diameter portion 334A and having an outer diameter smaller than that of the large-diameter portion 334A. When the outer diameter of the large-diameter portion 334A is L1, the outer diameter of the small-diameter portion 334B is L2, the length of the long side of the concave portion 312 of the carrier tape 310 is L3, and the length of the short side of the concave portion 312 of the carrier tape 310 is L4, the relational expression of L2 < L4 < L3 < L1 is satisfied. The center position of the large-diameter portion 334A of the suction head 334 and the center position of the concave portion 312 of the carrier tape 310 overlap in a plan view. When the suction head 334 reaches the first position, the lower end surface 334a of the large-diameter portion 334A of the suction head 334 abuts on the upper surface 310a outside the region where the concave portion 312 opens in the carrier tape 310. The upper surface 310a of the carrier tape 310 is an example of the first surface. The lower end surface 334a of the large-diameter portion 334A of the suction head 334 is an example of the contact portion. The lower end surface 334a of the large-diameter portion 334A of the suction head 334 abuts on the upper surface 310a of the carrier tape 310 in a state of surrounding the periphery of the concave portion 312. A plurality of air flow paths 334c penetrating in the height direction are formed in the suction head 334. Each of the plurality of air flow paths 334c has a first end connected to the suction mechanism 340 and a second end opening to the lower end surface 334b of the small-diameter portion 334B of the suction head 334.

[0019] Next, the control configuration of the suction unit 100 will be described. As shown in FIG. 4, the suction unit 100 includes, for example, an arithmetic processing unit 10, a storage unit 20, a moving mechanism 336, a lifting mechanism 338, a suction mechanism 340, an encoder 342, and an input / output device 344. The arithmetic processing unit 10 is a processor (CPU: Central Processing Unit) that controls the suction unit 100 and executes program execution processing. The processor may be configured to cooperate with an arithmetic processing chip such as an ASIC (Application Specific Integrated Circuit) or a GPU (Graphics Processing Unit). The arithmetic processing unit 10 reads out the suction control program stored in the storage unit 20 and executes various processes related to suction control.

[0020] The storage unit 20 is a non-volatile storage medium, and is configured, for example, by an HDD (Hard Disk Drive). The storage unit 20 stores various parameter values, functions, lookup tables, and the like used for control and calculation, in addition to programs for executing control and processing of the suction unit 100. The load threshold value 22 is an example of a parameter value used for control and calculation.

[0021] The moving mechanism 336 moves the suction head 334 in the X and Y directions based on a drive signal output from the arithmetic processing unit 10.

[0022] The lifting mechanism 338 moves the suction head 334 in the Z direction based on the drive signal output from the calculation processing unit 10. The calculation processing unit 10 generates a drive signal based on position information of the suction head 334 in the Z direction measured by the encoder 342, and outputs the generated drive signal to the lifting mechanism 338.

[0023] The suction mechanism 340 causes the semiconductor chip 320 accommodated in the recess 312 of the carrier tape 310 to be sucked onto the suction head 334 based on a drive signal output from the arithmetic processing unit 10 .

[0024] The input / output device 344 includes, for example, a keyboard, a mouse, and a display monitor, and is a device that accepts menu operations by the user and presents information to the user. The input / output device 344 outputs a signal indicating an instruction to start suction control to the calculation processing unit 10 based on, for example, an operation by the user.

[0025] The calculation processing unit 10 also serves as a functional calculation unit that executes various calculations in response to processing instructed by the suction control program. The calculation processing unit 10 includes, for example, a movement control unit 12, a detection unit 14, and a suction control unit 16.

[0026] The movement control unit 12 moves the suction head 334 between a first position where the suction head 334 suctions the semiconductor chip 320 accommodated in the recess 312 of the carrier tape 310 and a second position that is farther away from the semiconductor chip 320 than the first position. For example, when the movement control unit 12 receives an instruction from a user via the input / output device 344 to start suction control, the movement control unit 12 moves the suction head 334 from the second position toward the first position.

[0027] The detection unit 14 detects that the bottom end surface 334a of the large diameter portion 334A of the suction head 334 has come into contact with the top surface 310a of the carrier tape 310. The detection unit 14 calculates the magnitude of the load acting on the carrier tape 310 from the suction head 334 based on, for example, the position of the suction head 334 measured by the encoder 342 and a drive signal output from the calculation processing unit 10 to the lifting mechanism 338. Then, when the calculated magnitude of the load reaches the load threshold value 22, the detection unit 14 detects that the bottom end surface 334a of the large diameter portion 334A of the suction head 334 has come into contact with the top surface 310a of the carrier tape 310.

[0028] When the suction head 334 is located at the first position, the suction control unit 16 causes the suction head 334 to suction the semiconductor chip 320. The suction control unit 16 causes the suction head 334 to suction the semiconductor chip 320 on the condition that, for example, the detection unit 14 detects that the lower end surface 334a of the large diameter portion 334A of the suction head 334 has come into contact with the upper surface 310a of the carrier tape 310.

[0029] Next, the suction control executed by the suction unit 100 according to this embodiment will be described.

[0030] Fig. 5 is a flowchart showing the processing procedure of the arithmetic processing unit 10. The flowchart shown in Fig. 5 is executed, for example, when an instruction to start suction control is received from a user via the input / output device 344.

[0031] As shown in FIG. 5, the arithmetic processing unit 10 first outputs a drive signal to the lifting mechanism 338 to lower the suction head 334 (step S10).

[0032] Next, the arithmetic processing unit 10 determines whether or not the suction head 334 has come into contact with the carrier tape 310 based on the position of the suction head 334 measured by the encoder 342 and the drive signal output to the lifting mechanism 338 (step S12). If the arithmetic processing unit 10 determines that the suction head 334 has come into contact with the carrier tape 310 (step S12=YES), it stops outputting the drive signal to the lifting mechanism 338 to stop the descent of the suction head 334 (step S14).

[0033] Next, the arithmetic processing unit 10 outputs a drive signal to the suction mechanism 340 to start the suction operation of the suction head 334 (step S16). Then, the arithmetic processing unit 10 judges whether or not a predetermined time has elapsed since the suction operation of the suction head 334 started (step S18). If the arithmetic processing unit 10 judges that the predetermined time has elapsed since the suction operation of the suction head 334 started (step S18=YES), it outputs a drive signal to the lifting mechanism 338 to lift the suction head 334 (step S20).

[0034] FIG. 6 is a timing chart showing the flow of a series of processes in the suction unit 100. As shown in FIG.

[0035] 6(a), when the suction unit 100 starts suction control, the position of the suction head 334 measured by the encoder 342 moves downward as the suction head 334 is lowered by the lifting mechanism 338. Then, at time t1, when the suction head 334 comes into contact with the carrier tape 310, the measured position of the suction head 334 is maintained.

[0036] In this case, as shown in Fig. 6(b), as the lifting mechanism 338 continues to lower the suction head 334, the load acting from the suction head 334 on the carrier tape 310 gradually increases. Then, at time t2, when the load acting from the suction head 334 on the carrier tape 310 reaches a load threshold, the lifting mechanism 338 stops lowering the suction head 334 (see Fig. 6(c)). Also, at time t2, when the load acting from the suction head 334 on the carrier tape 310 reaches a load threshold, the suction mechanism 340 starts the suction operation of the suction head 334 (see Fig. 6(d)).

[0037] Then, as shown in Fig. 6(c), at time t3, when a predetermined time T has elapsed since the start of the suction operation of the suction head 334, the lifting mechanism 338 starts to raise the suction head 334. Also, as shown in Fig. 6(a), when the lifting mechanism 338 starts to raise the suction head 334 at time t3, the position of the suction head measured by the encoder 342 moves upward. In this case, as shown in Fig. 6(d), the suction operation of the suction head 334 by the suction mechanism 340 is maintained.

[0038] FIG. 7 is a diagram showing the operation of the suction unit.

[0039] 7(a), when the suction unit 100 starts suction control, first, it drives the lifting mechanism 338 to move the suction head 334 downward so as to approach the carrier tape 310. While the suction head 334 is being moved downward by the lifting mechanism 338, the suction unit 100 controls the load acting on the carrier tape 310 from the suction head 334 based on the height position of the suction head 334 measured by the encoder 342 and the magnitude of the driving force output from the lifting mechanism 338 to the suction head 334.

[0040] 7(b), when the load acting on the carrier tape 310 from the suction head 334 reaches the load threshold value 22, the suction unit 100 stops driving the lifting mechanism 338 and stops the downward movement of the suction head 334. In this case, the lower end surface 334a of the large diameter portion 334A of the suction head 334 abuts against the upper surface 310a of the carrier tape 310. In addition, a gap S is present between the lower end surface 334a of the large diameter portion 334A of the suction head 334 and the semiconductor chip 320.

[0041] 7(c), the suction unit 100 drives the suction mechanism 340 to start the suction operation of the suction head 334. The suction unit 100 operates the suction mechanism 340 while the suction head 334 seals the recess 312 of the carrier tape 310, thereby sucking air from the recess 312 of the carrier tape 310 through the multiple air flow paths 334c. As a result, the suction unit 100 sucks the semiconductor chip 320 accommodated in the recess 312 of the carrier tape 310 to the lower end surface 334b ​​of the small diameter portion 334B of the suction head 334 by negative pressure.

[0042] 7(d), the suction unit 100 continues to drive the suction mechanism 340 to maintain the suction operation of the suction head 334, while driving the lifting mechanism 338 to move the suction head 334 upward. As a result, the suction unit 100 picks up the semiconductor chip 320 accommodated in the recess 312 of the carrier tape 310 with the suction head 334.

[0043] The above embodiment may be implemented in the following manner.

[0044] In the above embodiment, as shown in FIG. 8, when the outer diameter of the large-diameter portion 334A of the suction head 100 is L1, the outer diameter of the small-diameter portion 334B is L2, the length of the long side of the concave portion 312 of the carrier tape 310 is L3, and the length of the short side of the concave portion 312 of the carrier tape 310 is L4, the relational expression of L2 < L4 < L1 < L3 may be satisfied. In the example shown in the figure, the center position of the large-diameter portion 334A of the suction head 334 and the center position of the concave portion 312 of the carrier tape 310 overlap in a plan view. In this case, when the suction head 334 reaches the first position, the lower end surface 334a of the large-diameter portion 334A of the suction head 334 abuts on the upper surface 310a of the carrier tape 310 at least on two sides facing each other in the concave portion 312.

[0045] In the above embodiment, the shape of the suction head 334 does not necessarily have to be a columnar shape, and other shapes such as a prismatic shape may be adopted.

[0046] In the above embodiment, the longitudinal direction of the carrier tape 310 may be made to coincide with the longitudinal direction of the concave portion 312, and the lateral direction of the carrier tape 310 may be made to coincide with the lateral direction of the concave portion 312.

[0047] In the above embodiment, the suction head 334 may abut on the upper surface 310a of the carrier tape 310 at least on two adjacent sides in the concave portion 312. In short, the suction head 334 may abut on a part of the upper surface 310a of the region outside the side where the concave portion 312 in the carrier tape 310 opens.

[0048] In the above embodiment, when the suction head 334 is located at the first position, there may be no gap between the suction head 334 and the semiconductor chip 320.

[0049] In the above embodiment, the pickup tool 330 may include a sensor that detects that the suction head 334 abuts on the upper surface 310a of the region outside the side where the concave portion 312 in the carrier tape 310 opens.

[0050] The above describes an example in which the suction device of this embodiment is applied to a pick-up tool, but the suction device of this embodiment is not limited to pick-up tools and can also be applied to, for example, a die bonder or a flip chip bonder. [Explanation of symbols]

[0051] 10...arithmetic processing unit, 12...movement control unit, 14...detection unit, 16...suction control unit, 20...memory unit, 22...load threshold, 100...suction unit, 310...carrier tape, 310a...upper surface, 312...recess, 320...semiconductor chip, 330...pickup tool, 332...holding unit, 334...suction head, 334A...large diameter portion, 334B...small diameter portion, 334a...lower end surface, 334b...lower end surface, 334c...air flow path, 336...movement mechanism, 338...lifting mechanism, 340...suction mechanism, 342...encoder, 344...input / output device, S...gap.

Claims

1. A suction head; a movement control unit that moves the suction head between a first position at which the suction head picks up an electronic component accommodated in a recess of a housing member and a second position that is farther away from the electronic component than the first position; a suction control unit that causes the suction head to suck up the electronic component when the suction head is located at the first position; Equipped with the suction head has a contact portion that contacts a first surface of the housing member outside a region where the recess is opened when the suction head is located at the first position, and a holding portion that protrudes beyond the contact portion in a state where the contact portion contacts the first surface of the housing member and sucks and holds the electronic component from the recess, a detection unit that detects a load acting on the suction head based on a height position of the suction head measured by an encoder and a driving force output from the movement control unit to the suction head, and detects that the abutment portion has abutted against the first surface of the containing member based on a change in the load, the suction control unit stops movement of the suction head and causes the suction head to suction the electronic component on condition that the detection unit detects that the abutment portion of the suction head has come into contact with the first surface of the containing member. Adsorption device.

2. When the suction head is located at the first position, a gap is present between the suction head and the electronic component. The adsorption device according to claim 1 .

3. the contact portion contacts the first surface of the accommodation member on at least two opposing sides of the recess when the suction head is located at the first position; 3. The adsorption device according to claim 1 or 2.

4. When the suction head is located at the first position, the abutment portion abuts against the first surface of the storage member in a state in which the abutment portion surrounds the periphery of the recess. The adsorption device according to any one of claims 1 to 3.

5. A suction head; a housing member having a recess for housing an electronic component; a movement control unit that moves the suction head between a first position at which the suction head picks up the electronic component accommodated in the recess of the accommodation member and a second position that is farther away from the electronic component than the first position; a suction control unit that causes the suction head to suck up the electronic component when the suction head is located at the first position; Equipped with the suction head has a contact portion that contacts a first surface of the housing member outside a region where the recess is opened when the suction head is located at the first position, and a holding portion that protrudes beyond the contact portion in a state where the contact portion contacts the first surface of the housing member and sucks and holds the electronic component from the recess, a detection unit that detects a load acting on the suction head based on a height position of the suction head measured by an encoder and a driving force output from the movement control unit to the suction head, and detects that the abutment portion has abutted against the first surface of the containing member based on a change in the load, the suction control unit stops movement of the suction head and causes the suction head to suction the electronic component on condition that the detection unit detects that the abutment portion of the suction head has come into contact with the first surface of the containing member. Suction unit.

6. a step of moving a suction head toward a first position where the suction head picks up an electronic component accommodated in a recess of a housing member and bringing a contact portion of the suction head into contact with a first surface of the housing member outside a region where the recess is opened; a step of detecting a load acting on the suction head based on a height position of the suction head measured by an encoder and a driving force output to the suction head, and detecting that the contact portion has come into contact with the first surface of the containing member based on a change in the load; a step of stopping movement of the suction head on condition that it is detected that the abutment portion of the suction head has come into contact with the first surface of the container when the suction head is located at the first position, and causing a holding portion of the suction head protruding beyond the abutment portion to suck the electronic component with the abutment portion in contact with the first surface of the container; Including, Adsorption method.

7. On the computer, a process of moving a suction head toward a first position where the suction head picks up an electronic component accommodated in a recess of a housing member and bringing a contact portion of the suction head into contact with a first surface of the housing member outside a region where the recess is opened; a process of detecting a load acting on the suction head based on a height position of the suction head measured by an encoder and a driving force output to the suction head, and detecting that the abutment portion has abutted against the first surface of the containing member based on a change in the load; a process of stopping movement of the suction head and causing a holding portion of the suction head protruding beyond the abutment portion to suck the electronic component while the abutment portion is in abutment with the first surface of the container, on condition that it is detected that the abutment portion of the suction head has come into abutment with the first surface of the container when the suction head is located at the first position; Execute the program.

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