Cleaning apparatus, cleaning method, and manufacturing method of semiconductor device

Abstract

To provide a cleaning apparatus and a cleaning method suitable for cleaning a light-emitting bar, and to provide a method for manufacturing a semiconductor device using a cleaning method suitable for cleaning a light-emitting bar.SOLUTION: A plurality of light-emitting bars are held in place by a tilted arrangement in which two sides of each of the plurality of light-emitting bars are visible from above, or by an arrangement in which the plurality of light-emitting bars are not tilted and the distance between adjacent light-emitting bars is between 20 μm and 150 μm.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a cleaning apparatus, a cleaning method, and a method for manufacturing a semiconductor device. [Background technology]

[0002] After the light-emitting element is formed on the semiconductor wafer, it is separated from the semiconductor wafer by cleavage. Among the surfaces of the light-emitting element, the light-emitting surface from which the laser light is mainly emitted and the reflecting surface, which is the surface opposite to the light-emitting surface, are surfaces obtained by cleavage. In order to protect the light-emitting surface and the reflecting surface and to resonate the laser, the light-emitting surface and the reflecting surface are coated with a laser reflecting film. However, if foreign matter such as chips of the semiconductor wafer generated during cleavage adheres to the light-emitting surface and the reflecting surface, the laser performance decreases and the light-emitting element becomes defective. Therefore, it is necessary to clean the light-emitting element before or after coating with the reflecting film. Methods for cleaning the light-emitting element include washing with water and blowing with air, but it is difficult to completely remove foreign matter using these methods.

[0003] Dry ice cleaning is a method for effectively removing foreign matter. Dry ice cleaning is a method for removing foreign matter by spraying particulate dry ice onto an object to be cleaned. Dry ice cleaning is disclosed in, for example, Patent Document 1 and Patent Document 2. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6389988 [Patent Document 2] JP 2018-078249 A Summary of the Invention [Problem to be solved by the invention]

[0005] When cleaning a light-emitting bar that includes multiple light-emitting elements, multiple light-emitting bars are lined up and cleaned at the same time. Moreover, it is necessary to not only remove foreign matter from the light-emitting surface and reflecting surface of each light-emitting bar, but also from the upper and lower electrodes, or to prevent foreign matter from adhering to the upper and lower electrodes. If foreign matter is found on the upper or lower electrodes after cleaning, it will lead to poor bonding in the subsequent mounting and wiring processes.

[0006] Conventional cleaning equipment and methods are not necessarily suitable for cleaning multiple lined-up light-emitting bars, in which all four surfaces of each bar, i.e., the light-emitting surface, the reflecting surface, the upper surface on which the upper electrode is provided, and the lower surface on which the lower electrode is provided, need to be cleaned.

[0007] An object of the present disclosure is to provide a cleaning device and a cleaning method suitable for cleaning light-emitting bars, and to provide a method for manufacturing a semiconductor device using a cleaning method suitable for cleaning light-emitting bars. [Means for solving the problem]

[0008] The cleaning device disclosed herein is a cleaning device for cleaning light-emitting bars, and includes a holder for aligning and holding a plurality of light-emitting bars in a striped pattern, and at least one spray nozzle for spraying granular dry ice onto the plurality of light-emitting bars, the holder being: A plurality of light emitting bars are held at both ends in an extension direction of the light emitting bars; and A tilted arrangement where two sides of each of the multiple light bars can be seen from above, or The cleaning device holds a plurality of light-emitting bars in an arrangement in which the interval between adjacent light-emitting bars is 20 μm or more and 150 μm or less without tilting the plurality of light-emitting bars.

[0009] The cleaning method of the present disclosure is a cleaning method using the cleaning apparatus of the present disclosure, A plurality of light emitting bars are held at both ends in an extension direction of the light emitting bars; and A tilted arrangement where two sides of each of the multiple light bars can be seen from above, orThe cleaning method involves arranging the multiple light-emitting bars without tilting them so that the interval between adjacent light-emitting bars is 20 μm or more and 150 μm or less, and while the multiple light-emitting bars are aligned and held in a striped pattern, spraying granular dry ice onto the multiple light-emitting bars with at least one spray nozzle.

[0010] The manufacturing method of a semiconductor device according to the present disclosure is a manufacturing method of a semiconductor device using the cleaning method according to the present disclosure, and includes the steps of processing a wafer to form a plurality of light-emitting bars, cleaving the plurality of light-emitting bars from the wafer, and cleaning the plurality of light-emitting bars using the cleaning method according to the present disclosure. Effect of the Invention

[0011] In the cleaning apparatus and cleaning method of the present disclosure, A plurality of light emitting bars are held at both ends in an extension direction of the light emitting bars; and A tilted arrangement where two sides of each of the multiple light bars can be seen from above, or The plurality of light emitting bars are held in an arrangement in which the interval between adjacent light emitting bars is 20 μm or more and 150 μm or less without tilting the plurality of light emitting bars. This provides a cleaning device and a cleaning method suitable for cleaning the light emitting bars.

[0012] In addition, in the manufacturing method of a semiconductor device of the present disclosure, a plurality of light emitting bars are cleaned by the cleaning method of the present disclosure, thereby providing a manufacturing method of a semiconductor device using a cleaning method suitable for cleaning light emitting bars. [Brief description of the drawings]

[0013] [Figure 1] FIG. 2 is a perspective view of a semiconductor wafer on which light emitting bars are formed. [Diagram 2] FIG. 2 is a perspective view of a light bar including a plurality of light emitting elements. [Diagram 3] 11 is a perspective view showing an example of how to arrange a plurality of light emitting bars when cleaning the same; FIG. [Figure 4] 4 is a cross-sectional view taken along a plane passing through line II in FIG. 3 and parallel to the yz plane. [Diagram 5]1 is a perspective view showing a configuration of a cleaning device according to a first embodiment. [Figure 6] 6 is a cross-sectional view of the cleaning device according to the first embodiment taken along a plane passing through line II-II in FIG. 5 and parallel to the yz plane. [Figure 7] 6 is a cross-sectional view of the cleaning device according to the first embodiment taken along a plane passing through line III-III in FIG. 5 and parallel to the xz plane. [Figure 8] 10 is a cross-sectional view showing a configuration of a modified example of the cleaning device according to the first embodiment. [Figure 9] FIG. 11 is a perspective view showing a configuration of a cleaning device according to a second embodiment. [Figure 10] 10 is a cross-sectional view of a cleaning device according to a second embodiment taken along line IV-IV of FIG. 9 and parallel to the yz plane. [Figure 11] 10 is a cross-sectional view of a cleaning device according to a second embodiment, taken along a plane passing through line VV in FIG. 9 and parallel to the xz plane. [Figure 12] 11 is a cross-sectional view showing a configuration of a first modified example of the cleaning device according to the second embodiment. FIG. [Figure 13] 13 is a cross-sectional view showing a configuration of a second modified example of the cleaning device according to the second embodiment. FIG. [Figure 14] 4 is a flowchart showing the steps of a cleaning method according to the first or second embodiment. [Figure 15] 13 is a flowchart showing the steps of a method for manufacturing a semiconductor device according to a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] First, a light-emitting bar to be cleaned by the cleaning device according to each embodiment of the present disclosure and a cleaning method other than those according to each embodiment of the present disclosure will be described.

[0015] 1 shows a perspective view of a semiconductor wafer 1. A plurality of light-emitting bars 2, each including a plurality of light-emitting elements 7, are formed on the semiconductor wafer 1 through a semiconductor manufacturing process and aligned in an in-plane direction. The light-emitting bars 2 formed on the semiconductor wafer 1 are divided by cleavage into bar shapes.

[0016] Fig. 2 shows the light-emitting bar 2. Of the surfaces of the light-emitting bar 2, one surface in the cross section obtained by cleavage that is along the extending direction of the light-emitting bar 2 is the light-emitting surface 4, and the opposite surface is the reflecting surface 6. Of the surfaces of the light-emitting bar 2, the surface that was the upper surface of the semiconductor wafer 1 is referred to as the upper surface, and the surface that was the lower surface of the semiconductor wafer 1 is referred to as the lower surface. A plurality of upper electrodes 3 are formed on the upper surface of the light-emitting bar 2, and a plurality of lower electrodes 5 are formed on the lower surface of the light-emitting bar 2, at corresponding positions on the upper and lower surfaces.

[0017] Each region of the light-emitting bar 2, which is divided by dotted lines in FIG.

[0018] Before coating the light-emitting surface 4 and the reflection surface 6 of the light-emitting bar 2 with a reflective film, the light-emitting surface 4 and the reflection surface 6 are cleaned and granular dry ice is sprayed onto the light-emitting bar 2 in order to remove foreign matter adhering to the light-emitting surface 4 and the reflection surface 6. When cleaning multiple light-emitting bars 2 together, the arrangement of multiple light-emitting bars 2 may be as shown in Figure 3.

[0019] The x, y, and z directions shown in Fig. 3 are mutually orthogonal. The x direction is the extension direction of the light emitting bars 2, and the y direction is the direction in which the light emitting bars 2 are arranged. The plane indicated by the x and y directions is the xy plane. The direction perpendicular to the xy plane is the z direction, and the planes indicated by the z and x directions, and the z and y directions are the xz and yz planes, respectively. In Fig. 4 and subsequent figures, the x, y, and z directions are mutually orthogonal, and the planes indicated by the x and y directions, the z and x directions, and the z and y directions are the xy plane, the xz plane, and the yz plane, respectively.

[0020] FIG. 4 shows a cross-sectional view taken along line II in FIG. 3 and parallel to the yz plane.

[0021] In the arrangements shown in FIGS. 3 and 4, the light-emitting bars 2 are arranged such that the light-emitting surfaces 4 thereof are aligned in the direction of the spraying nozzle 8, i.e., the z direction. Further, as shown in FIG. 4, the light-emitting bars 2 are arranged such that the upper surface electrodes 3 and the lower surface electrodes 5 of adjacent light-emitting bars 2 are in contact. Although not shown here, in FIG. 3, the plurality of light-emitting bars 2 are fixed to a jig or the like, or adsorbed on a stage.

[0022] In the arrangements shown in FIGS. 3 and 4, the light-emitting surface 4 of each light-emitting bar 2 is cleaned by dry ice sprayed from the spraying nozzle 8. Further, in order to clean the reflecting surface 6, the jig is inverted, or the light-emitting bars 2 are rearranged such that the reflecting surfaces 6 are aligned in the z direction. In the arrangements shown in FIGS. 3 and 4, between the plurality of light-emitting bars 2, minute gaps are generated due to the unevenness of the surfaces of the upper surface electrodes 3 and the lower surface electrodes 5 and the warpage of the light-emitting bars 2. When particulate dry ice is sprayed in such a state, foreign matter may enter the minute gaps and a part thereof may remain in the minute gaps. As a result, foreign matter may adhere to and remain on the surfaces of the upper surface electrode 3 and the lower surface electrode 5 even after cleaning, which may cause problems in the subsequent wiring process.

[0023] <A. Embodiment 1> <A-1. Configuration> FIG. 5 shows a perspective view showing the configuration of a cleaning device 100 according to Embodiment 1. FIG. 6 shows a cross-sectional view of the cleaning device 100 in a plane parallel to the yz plane passing through line II-II of FIG. 5.

[0024] As shown in FIG. 5, the cleaning device 100 includes a holder 9, a spraying nozzle 8, and an intake part 10. The light-emitting bar 2 shown in FIG. 5 is an object to be cleaned by the cleaning device 100, and the light-emitting bar 2 is not included in the cleaning device 100.

[0025] As shown in FIG. 5, the holder 9 holds a plurality of light-emitting bars 2 aligned in a stripe shape. In FIG. 5, the plurality of light-emitting bars 2 are arranged in the y direction such that the extending direction of each light-emitting bar 2 is along the x direction.

[0026] The holder 9 holds the plurality of light-emitting bars 2 in an inclined position so that two surfaces of each of the light-emitting bars 2 are visible from above, as shown in Figures 5 and 6. Figures 5 and 6 show a case in which the holder 9 holds each light-emitting bar 2 in an arrangement so that the light-emitting surface 4 and the lower electrode 5 on the lower surface are visible from above.

[0027] The holder 9 holds the plurality of light emitting bars 2 at both ends in the extension direction of the light emitting bars 2. Although a specific holding method is not shown in FIG. 5, the plurality of light emitting bars 2 may be held by the holder 9 mechanically or by suction. The holder 9 holds the plurality of light emitting bars 2 at regular intervals in the y direction, for example, by arranging the plurality of light emitting bars 2 in grooves such as slits provided in the holder 9. The holder 9 can also rotate around the x-axis or y-axis to invert the light emitting bars 2 and swap the side of the light emitting bars 2 facing the z direction with the side facing the -z direction.

[0028] The spray nozzle 8 sprays granular dry ice onto the light-emitting bars 2 held by the holder 9. The spray nozzle 8 is disposed above the multiple light-emitting bars 2 held by the holder 9. In FIG. 5, the upper side is the z direction of the multiple light-emitting bars 2 held by the holder 9, but it can be either side of the surface on which the multiple light-emitting bars 2 held by the holder 9 are arranged in a striped pattern, and has nothing to do with up or down due to gravity.

[0029] The air intake unit 10 is disposed below the multiple light-emitting bars 2 fixed to the holder 9, and draws in air from the side of the multiple light-emitting bars 2 opposite to the side onto which the spray nozzle 8 sprays granular dry ice. Foreign matter that is blown off the light-emitting bars 2 by the spray nozzle 8 spraying granular dry ice and that flies below the multiple light-emitting bars 2 through gaps between the multiple light-emitting bars 2 is sucked into the air intake unit 10. In this way, the cleaning device 100 is provided with a foreign matter removal mechanism that removes foreign matter removed from the surfaces of the multiple light-emitting bars 2 so that it does not reattach to the multiple light-emitting bars 2.

[0030] The spray nozzle 8 and / or the holder 9 are driven to move in the xy plane, so that the entire upward facing surface of the plurality of light emitting bars 2 can be cleaned with granular dry ice. Instead of the spray nozzle 8 and / or the holder 9 being driven to move in the xy plane, the cleaning device 100 may be configured to include a plurality of spray nozzles 8, and to be disposed above the plurality of light emitting bars 2 held by the holder 9, so that the entire upward facing surface of the plurality of light emitting bars 2 can be cleaned.

[0031] The suction unit 10 is located below the holder 9, and sucks in air from the side of the multiple light-emitting bars 2 opposite to the side where the spray nozzle 8 blows the granular dry ice. The suction unit 10 is structured so that it can suck in the entire area below the multiple light-emitting bars 2 fixed to the holder 9. In FIG. 5, the suction unit 10 is diagrammatically drawn as a block. The suction unit 10 may suck in air from the -z direction, or may suck in air from the x or y direction as long as it can suck in the entire area below the holder 9.

[0032] As described above, the holder 9 holds the multiple light-emitting bars 2 in an inclined arrangement in which two surfaces of the light-emitting bars 2 are visible from above. In the arrangement shown in Fig. 5 and Fig. 6, the lower surface of the light-emitting bars 2 on which the lower electrodes 5 are provided and the light-emitting surface 4 are visible from the z direction, but the upper surface of the light-emitting bars 2 on which the upper electrodes 3 are provided and the reflective surface 6 are not visible.

[0033] That is, when granular dry ice is sprayed, it is possible to spray granular dry ice onto two adjacent surfaces of the light-emitting bar 2, that is, the lower surface and the light-emitting surface 4 in the arrangement shown in Fig. 5 and Fig. 6. Furthermore, by rotating the holder 9 180 degrees around an axis parallel to the x-axis or y-axis from the arrangement shown in Fig. 5 and Fig. 6 and inverting it, it is possible to spray granular dry ice onto the remaining two surfaces other than the above two surfaces, that is, the upper surface on which the upper electrode 3 is provided and the reflective surface 6. In this way, the cleaning device 100 can clean all four surfaces of the light-emitting bar 2, that is, the upper surface, lower surface, light-emitting surface 4, and reflective surface 6.

[0034] In FIG. 6, the visible width of the lower surface from the z direction is W1, and the visible width of the light-emitting surface 4 from the z direction is W2. The z-axis distance between the edge that is the boundary between the lower surface and the reflecting surface 6 and the tip of the spray nozzle 8 is the lower surface distance D1, the z-axis distance between the edge that is the boundary between the light-emitting surface 4 and the upper surface and the tip of the spray nozzle 8 is the light-emitting surface distance D2, the size of the interval between adjacent light-emitting bars 2 is G1, the width of the lower surface is a, the width of the light-emitting surface 4 is b, and the light-emitting bar inclination angle is θ. The light-emitting bar inclination angle θ is the angle between the xy plane and the upper surface. However, θ satisfies 0<θ<π / 2. The z-axis distance is the difference in the z coordinate values ​​of the two objects. In FIG. 6, the edge that is the boundary between the lower surface of the light-emitting bar 2 and the reflecting surface 6 and the edge that is the boundary between the light-emitting surface 4 and the upper surface are parallel to the x-axis.

[0035] In order to increase the cleaning power of the cleaning device 100, it is desirable to maximize the sum of the bottom surface visible width W1 and the light emitting surface visible width W2. In other words, if the maximum value of W1 + W2 is W, then W=W1+W2 = a cosθ + b sinθ It is desirable to incline the light emitting bar 2 so as to satisfy the following.

[0036] By maximizing the sum of the bottom surface visible width W1 and the light emitting surface visible width W2, the sum of the areas of the bottom surface and the light emitting surface 4 as viewed from above is maximized. This maximizes the amount of granular dry ice that collides with the light emitting bar 2 per unit time and unit area, and the surface of the light emitting bar 2 can be efficiently cleaned. The area as viewed from above is the area obtained by projecting onto the xy plane. In reality, it is not necessary to maximize the sum of the areas as viewed from above. For example, the light emitting bars 2 are held by the holder 9 at an inclination such that the sum of the areas of the bottom surface and the light emitting surface 4 as viewed from above, which are the two surfaces as viewed from above, is 95% or more of the maximum value of the sum of the areas of the bottom surface and the light emitting surface 4 as viewed from above, which are the two surfaces as viewed from above.

[0037] This can also be considered as follows. In order to ensure that the lower surface and the light-emitting surface 4 are uniformly cleaned, it is desirable that the lower surface distance D1 and the light-emitting surface distance D2 are equal, that is, D1=D2. The condition D1=D2 is as follows: a sinθ=b cosθ This is expressed as:

[0038] By making the bottom surface distance D1 and the light-emitting surface distance D2 equivalent, it is possible to make the maximum time it takes for the granular dry ice sprayed from the spray nozzle 8 to reach the bottom surface the same as the maximum time it takes to reach the light-emitting surface 4. This makes it possible to make the particle sizes of the granular dry ice that reaches the bottom surface and the light-emitting surface 4 the same, thereby making it possible to equalize the cleaning power for the bottom surface and the cleaning power for the light-emitting surface 4.

[0039] The condition a·sinθ=b·cosθ is the same as the condition obtained by considering W1+W2 as a function of θ and differentiating it with respect to θ, based on the idea of ​​maximizing W1+W2=a·cosθ+b·sinθ.

[0040] It is desirable that the size of the gap G1 between adjacent light-emitting bars 2 is a value that allows foreign matter generated during the manufacturing process to pass through. If G1 is sufficiently large, the foreign matter removed from the surface of the light-emitting bar 2 by the granular dry ice will pass between the adjacent light-emitting bars 2 and be sucked into the intake section 10.

[0041] On the other hand, there may be cases where the size G1 of the gap between adjacent light-emitting bars 2 cannot be made larger than the size of foreign matter generated in the manufacturing process. In such cases, the cleaning device 100 further includes an airflow generating unit 20 as shown in Fig. 7 in addition to the configuration shown in Fig. 5. Also, the spray nozzle 8 is tilted so that the direction in which the dry ice is sprayed is not parallel to the z-axis. Fig. 7 is a cross-sectional view of the cleaning device 100 on a plane that passes through line III-III in Fig. 5 and is parallel to the xz plane.

[0042] Foreign matter larger than the interval between adjacent light-emitting bars 2 is bounced back and blown above the light-emitting bar 2 after being removed from the surface of the light-emitting bar 2 with particulate dry ice. At this time, since the spraying nozzle 8 is tilted so that the spraying direction of the dry ice is not parallel to the z-axis, the foreign matter is blown off in a certain direction when viewed in the xy plane. In Fig. 7, the spraying nozzle 8 is tilted so as to spray dry ice in the -x direction when projected in the xy plane. In Fig. 7, above the light-emitting bar 2, an air flow is generated by the air flow generating section 20 to such an extent that it does not affect the spraying of the dry ice, in the -x direction, that is, in the direction in which the foreign matter removed by the particulate dry ice is blown off.

[0043] In the configuration shown in Fig. 7, the foreign matter removal mechanism of the cleaning device 100 is a mechanism that removes foreign matter removed from the surfaces of a plurality of light-emitting bars 2 so as not to reattach to the plurality of light-emitting bars 2 by keeping the foreign matter away with the air flow generated by the air flow generating section 20 above the light-emitting bar 2 and sucking the foreign matter with the intake section 10 below the light-emitting bar 2. The foreign matter removal mechanism of the cleaning device 100 may also be a mechanism that removes foreign matter removed from the surfaces of a plurality of light-emitting bars 2 so as not to reattach to the plurality of light-emitting bars 2 by keeping the foreign matter away with the air flow generated by the air flow generating section 20 instead of sucking the foreign matter with the intake section 10 also below the light-emitting bar 2.

[0044] <A-2. Operation> The cleaning method of the present embodiment, which is a cleaning method using the cleaning device 100, will be described.

[0045] The flowchart of the cleaning method of the present embodiment is shown in Fig. 14.

[0046] First, a plurality of light-emitting bars 2 are arranged side by side and held by a holder 9 (step S10). As described in <A-1. Configuration>, the holder 9 holds the plurality of light-emitting bars 2 in a striped alignment with two surfaces of the light-emitting bar 2 visible from above in an inclined arrangement. Desirably, the plurality of light-emitting bars 2 are held by the holder 9 at an inclination such that the sum of the areas seen from above of the two surfaces visible from above is 95% or more of the maximum value of the sum of the areas seen from above of the two surfaces visible from above. This enables efficient cleaning of the light-emitting bar 2.

[0047] Next, particulate dry ice is sprayed onto the plurality of light-emitting bars 2 by a spray nozzle 8 to clean the plurality of light-emitting bars 2 (step S11). In step S11, first, the lower surface and the light-emitting surface 4 are cleaned in the arrangement shown in FIGS. 5 to 7, then the holder 9 is rotated 180 degrees around the x-axis or y-axis to reverse the orientation of the light-emitting bar 2, and thereafter, the upper surface and the reflecting surface 6 are cleaned. In order to more surely remove foreign matter from the surface of the light-emitting bar 2, the cleaning of the lower surface and the light-emitting surface 4 and the cleaning of the upper surface and the reflecting surface 6 may be repeated a plurality of times.

[0048] The holder 9 holds the plurality of light-emitting bars 2 in an inclined arrangement where two surfaces of the light-emitting bar 2 are visible from above, and the surfaces of adjacent light-emitting bars 2 do not face each other. Therefore, the problem that occurs when the light-emitting bars 2 are arranged with the upper electrode 3 and the lower electrode 5 facing each other as shown in FIGS. 3 and 4, where foreign matter enters and remains in the minute gaps formed between the facing surfaces of adjacent light-emitting bars 2, leading to problems in subsequent processes, does not occur in the cleaning method of the present embodiment.

[0049] Since the holder 9 holds the plurality of light-emitting bars 2 at both end portions in the extending direction of the light-emitting bar 2, when cleaning the light-emitting bar 2, the problem that foreign matter enters and remains in the gap between the holder 9 and the light-emitting bar 2 does not occur except at both end portions.

[0050] Foreign matter removed from the light-emitting bar 2 by the particulate dry ice sprayed from the spray nozzle 8 is removed by a foreign matter removal mechanism so as not to adhere to the light-emitting bar 2 again.

[0051] By holding the light-emitting bar 2 while tilting the holder 9, particulate dry ice can be sprayed onto both surfaces of the light-emitting bar 2 simultaneously. Therefore, compared with cleaning only one surface at a time, such as the light-emitting surface 4 and the reflecting surface 6 as shown in FIGS. 3 and 4, the light-emitting bar 2 can be cleaned efficiently, and productivity can be improved.

[0052] Thus, according to the present embodiment, a cleaning device 100 and a cleaning method suitable for cleaning the light-emitting bar 2 are provided.

[0053] <A-3. Effect> The holder 9 holds the plurality of light-emitting bars 2 in an inclined arrangement in which both surfaces of each of the plurality of light-emitting bars 2 are visible from above. Thereby, a cleaning device 100 and a cleaning method suitable for cleaning the light-emitting bar 2 are provided.

[0054] Preferably, the plurality of light-emitting bars 2 are held by the holder 9 at an inclination such that the sum of the areas seen from above of the two surfaces visible from above of each of the two surfaces visible from above is 95% or more of the maximum value of the sum of the areas seen from above of the two surfaces visible from above of each. Thereby, the light-emitting bar 2 can be cleaned efficiently.

[0055] The holder 9 holds the plurality of light-emitting bars 2 at both ends on both sides in the extending direction of the light-emitting bar 2. Thereby, when the light-emitting bar 2 is cleaned, foreign matter does not enter and stay in the gap between the holder 9 and the light-emitting bar 2 except at both ends on both sides.

[0056] The cleaning device 100 includes a foreign matter removal mechanism that removes foreign matter removed from the surfaces of the plurality of light-emitting bars 2 so as not to reattach to the plurality of light-emitting bars 2. Thereby, when the light-emitting bar 2 is cleaned, the frequency of reattachment of the foreign matter once removed to the light-emitting bar 2 can be suppressed, and the light-emitting bar 2 can be cleaned more efficiently.

[0057] The foreign matter removal mechanism is a mechanism that moves foreign matter removed from the surfaces of the plurality of light-emitting bars 2 away from the plurality of light-emitting bars by an air flow generated by the air flow generation unit 20. Thereby, the foreign matter removal mechanism can be easily realized.

[0058] The foreign object removal mechanism is a mechanism that sucks in foreign objects removed from the surfaces of the plurality of light emitting bars 2 at the intake part 10. Thereby, the foreign object removal mechanism can be easily realized.

[0059] The intake part 10 sucks in air from the side opposite to the side where the spraying nozzle 8 sprays particulate dry ice of the plurality of light emitting bars 2. Thereby, the foreign objects that have been blown off from the light emitting bar 2 by spraying particulate dry ice from the spraying nozzle 8 and have flown to the side opposite to the spraying nozzle 8 through the gaps between the plurality of light emitting bars 2 are sucked by the intake part 10.

[0060] <A-4. Modification example> FIG. 8 shows a cross-sectional view showing the configuration of a modification example of the cleaning device 100 according to the first embodiment. FIG. 8 is a cross-sectional view of a cross-section corresponding to FIG. 6. In <A-1. Configuration>, the holder 9 holds the plurality of light emitting bars 2 in an inclined arrangement where two surfaces of the light emitting bar 2 can be seen from above. As shown in FIG. 8, the holder 9 may be arranged in a state where only one surface can be visually recognized from above without inclining the light emitting bar 2. In this case, the size G1 of the interval between adjacent light emitting bars 2 may be not less than the size of foreign objects generated in the manufacturing process and not significantly reducing the productivity due to a decrease in the number of light emitting bars 2 that can be arranged. In a general semiconductor manufacturing process, G1 may be not less than several tens of μm. Also, the thickness of a general semiconductor wafer is not less than several hundreds of μm, and it is preferable that G1 is about 100 μm or less. For example, the holder 9 holds the plurality of light emitting bars 2 in an arrangement where G1 is not less than 20 μm and not more than 150 μm, that is, the interval between adjacent light emitting bars 2 is not less than 20 μm and not more than 150 μm without inclining the light emitting bars 2. Except for the inclination of the light emitting bar 2 and the size of G1, the configuration of this modification example of the cleaning device 100 is the same as that in <A-1. Configuration>.

[0061] The flowchart of the cleaning method using the present modification of the cleaning device 100 is given in FIG. 14, similar to <A-2. Operation>. In step S11, first, particulate dry ice is sprayed by the spraying nozzle 8 in the arrangement shown in FIG. 8 to clean the light emitting surface 4. Then, the holder 9 is rotated 180 degrees around the x-axis or y-axis to reverse the direction of the light emitting bar 2, and then the reflecting surface 6 is cleaned. At this time, since the interval between adjacent light emitting bars 2 is 20 μm or more and 150 μm or less, the frequency with which foreign matter removed from the light emitting surface 4 or the reflecting surface 6 is caught and retained between adjacent light emitting bars 2 is suppressed. Also, since there is an interval between adjacent light emitting bars 2, by making the size of the particulate dry ice sprayed by the spraying nozzle 8 smaller than G1, the particulate dry ice can enter between adjacent light emitting bars 2, and the upper surface and the lower surface, which are the surfaces facing each other of adjacent light emitting bars 2, can also be cleaned.

[0062] In the present modification, the holder 9 holds the plurality of light emitting bars 2 in such an arrangement that the interval between adjacent light emitting bars 2 is 20 μm or more and 150 μm or less without tilting the plurality of light emitting bars 2. Thereby, a cleaning device 100 and a cleaning method suitable for cleaning the light emitting bar 2 are provided. Also, the productivity is not significantly reduced by this cleaning method.

[0063] <B. Embodiment 2> <B-1. Configuration> FIG. 9 shows a perspective view showing the configuration of the cleaning device 101 according to Embodiment 2. FIG. 10 shows a cross-sectional view of the cleaning device 101 in a plane parallel to the yz plane passing through line IV-IV of FIG. 9. FIG. 11 shows a cross-sectional view of the cleaning device 101 in a plane parallel to the xz plane passing through line V-V of FIG. 9.

[0064] As shown in FIGS. 9 to 11, the cleaning device 101 includes a holder 9, a spraying nozzle 8, a spraying nozzle 11, and an air flow generating unit 20. The spraying nozzle 8 and the spraying nozzle 11 are the same spraying nozzle. The light emitting bar 2 shown in FIGS. 9 to 11 is the object to be cleaned by the cleaning device 101, and the light emitting bar 2 is not included in the cleaning device 101. Also, in FIG. 9, the air flow generating unit 20 is omitted for clarity.

[0065] The method of holding the light-emitting bar 2 by the holder 9 and the alignment method of the light-emitting bar 2 held by the holder 9 in the present embodiment are the same as those described in <A-1. Configuration> of Embodiment 1. The plurality of light-emitting bars 2 fixed to the holder 9 are inclined such that the light-emitting surface 4 and the lower surface electrode 5 face the z direction. From the z direction, the lower surface electrode 5 and the light-emitting surface 4 are visible, and the upper surface electrode 3 and the reflecting surface 6 are not visible, and from the -z direction, the upper surface electrode 3 and the reflecting surface 6 are visible, and the lower surface electrode 5 and the light-emitting surface 4 are not visible. In the present embodiment, unlike the case of Embodiment 1, the holder 9 may not be able to rotate around the x-axis or y-axis.

[0066] As shown in FIG. 9, in the z direction and the -z direction of the plurality of light-emitting bars 2 held by the holder 9, a spray nozzle 8 and a spray nozzle 11 are arranged, respectively. Thereby, the four surfaces of the two surfaces of the lower surface and the light-emitting surface 4 and the two surfaces of the upper surface and the reflecting surface 6 can be cleaned without rotating the holder 9 as in the case of Embodiment 1.

[0067] The spray nozzle 8 and the spray nozzle 11 are preferably arranged at the same distance in the z direction and the -z direction around the plurality of light-emitting bars 2. Thereby, the time until the dry ice jetted from the spray nozzle 8 and the spray nozzle 11 hits the light-emitting bar 2 becomes uniform, and the size of the dry ice when hitting the light-emitting bar 2 also becomes the same. Therefore, the two surfaces of the lower surface electrode 5 and the light-emitting surface 4 and the two surfaces of the upper surface electrode 3 and the reflecting surface 6 can be cleaned more uniformly.

[0068] As shown in FIG. 10, the positions of the spray nozzle 8 and the spray nozzle 11 in the xy plane direction are aligned, and as shown in FIG. 11, the spray nozzle 8 and the spray nozzle 11 are tilted from the z-axis so that the particulate dry ice is sprayed in the same direction when viewed in the xy plane direction. Thus, the foreign matter removed from the surface of the light-emitting bar 2 by the particulate dry ice can be blown away in a certain direction when viewed in the xy plane direction. In FIG. 11, the spray nozzle 8 and the spray nozzle 11 are tilted so that the foreign matter is blown in the -x direction.

[0069] The airflow generating unit 20 generates an airflow in the direction of tilting the spray nozzles 8 and 11, that is, in the -x direction in FIGS. 9, 10, and 11, to such an extent that it does not affect the spraying of dry ice. Thereby, a foreign matter removal mechanism is realized that removes foreign matter removed from the surfaces of the plurality of light emitting bars 2 so as not to adhere to the plurality of light emitting bars 2 again.

[0070] <B-2. Operation> The flowchart of the cleaning method using the cleaning device 101 is given in FIG. 14, similar to <A-2. Operation>. In step S10, as described in <B-1. Configuration>, the holder 9 holds the plurality of light emitting bars 2 in a striped arrangement in an inclined arrangement where both surfaces of each of the plurality of light emitting bars 2 are visible from above. Desirably, the plurality of light emitting bars 2 are held by the holder 9 at an inclination such that the sum of the areas seen from above of the two surfaces that are visible from above of each of the two surfaces is 95% or more of the maximum value of the sum of the areas seen from above of the two surfaces that are visible from above of each of the two surfaces. Thereby, the light emitting bars 2 can be efficiently cleaned.

[0071] In step S11, in the arrangement shown in FIG. 8, particulate dry ice is sprayed from above and below the plurality of light emitting bars 2 by the spray nozzles 8 and 11 to clean the four surfaces of the lower surface and the two surfaces of the light emitting surface 4, and the upper surface and the two surfaces of the reflecting surface 6. Foreign matter removed from the surface of the light emitting bar 2 is removed by the airflow generated by the airflow generating unit 20 so as not to adhere to the plurality of light emitting bars 2 again.

[0072] The holder 9 holds the plurality of light emitting bars 2 in an inclined arrangement where both surfaces of the light emitting bar 2 are visible from above, and the surfaces of adjacent light emitting bars 2 do not face each other. Therefore, the problem that occurs when the upper electrode 3 and the lower electrode 5 are faced to arrange the light emitting bars 2 as shown in FIGS. 3 and 4, that is, foreign matter enters and stays in the minute gaps formed between the facing surfaces of adjacent light emitting bars 2, leading to problems in subsequent processes, does not occur in the cleaning method of the present embodiment.

[0073] Since the holder 9 holds the plurality of light-emitting bars 2 at the end portions on both sides in the extending direction of the light-emitting bar 2, when the light-emitting bar 2 is cleaned, except for the end portions on both sides, there is no problem that foreign matter enters and stays in the gap between the holder 9 and the light-emitting bar 2.

[0074] The foreign matter removed from the light-emitting bar 2 by the particulate dry ice sprayed from the spray nozzle 8 is removed by the foreign matter removal mechanism so as not to adhere to the light-emitting bar 2 again.

[0075] The holder 9 holds the light-emitting bar 2 in an inclined manner, and the cleaning device 101 includes a spray nozzle 8 and a spray nozzle 11. The spray nozzle 8 and the spray nozzle 11 spray particulate dry ice from above and below the plurality of light-emitting bars 2. Thereby, particulate dry ice can be sprayed onto the four surfaces of the light-emitting bar 2, and compared with the cleaning of only one surface of the light-emitting surface 4 and the reflecting surface 6 as in the cases of FIGS. 3 and 4, the light-emitting bar 2 can be efficiently cleaned and the productivity can be improved.

[0076] As described above, according to the present embodiment, a cleaning device 101 and a cleaning method suitable for cleaning the light-emitting bar 2 are provided.

[0077] <B-3. Effect> The holder 9 holds the plurality of light-emitting bars 2 in an inclined arrangement in which two surfaces of each of the plurality of light-emitting bars 2 are visible from above. Thereby, a cleaning device 101 and a cleaning method suitable for cleaning the light-emitting bar 2 are provided.

[0078] Desirably, the plurality of light-emitting bars 2 are held by the holder 9 at an inclination such that the sum of the areas seen from above of the two surfaces visible from above of each of the plurality of light-emitting bars 2 is 95% or more of the maximum value of the sum of the areas seen from above of the two surfaces visible from above of each of the plurality of light-emitting bars 2. Thereby, the light-emitting bar 2 can be efficiently cleaned.

[0079] The holder 9 holds the plurality of light-emitting bars 2 at the end portions on both sides in the extending direction of the light-emitting bar 2. Thereby, when the light-emitting bar 2 is cleaned, except for the end portions on both sides, foreign matter does not enter and stay in the gap between the holder 9 and the light-emitting bar 2.

[0080] The cleaning device 101 is provided with a foreign matter removal mechanism that removes foreign matter removed from the surfaces of the plurality of light emitting bars 2 so as not to reattach to the plurality of light emitting bars 2. Thereby, when cleaning the light emitting bars 2, the frequency of the foreign matter once removed reattaching to the light emitting bars 2 can be suppressed, and the light emitting bars 2 can be cleaned more efficiently.

[0081] The foreign matter removal mechanism of the cleaning device 101 is a mechanism that separates foreign matter removed from the surfaces of the plurality of light emitting bars 2 from the plurality of light emitting bars 2 by an air flow generated by the air flow generation unit 20. Thereby, the foreign matter removal mechanism can be easily realized.

[0082] The cleaning device 101 includes a spraying nozzle 8 and a spraying nozzle 11, and the spraying nozzle 8 and the spraying nozzle 11 spray particulate dry ice from above and below the plurality of light emitting bars 2. Thereby, particulate dry ice can be sprayed onto the four surfaces of the light emitting bars 2, and the light emitting bars 2 can be efficiently cleaned.

[0083] <B-4. Modification Example 1> FIG. 12 shows a cross-sectional view showing the configuration of Modification Example 1 of the cleaning device 101 according to Embodiment 2. In this modification, the cleaning device 101 further includes an intake part 12 and an intake part 13 in addition to the configuration described in <B-1. Configuration>.

[0084] The plurality of intake parts 12, 13 are provided so as to intake air from their respective directions in the direction in which the plurality of spraying nozzles 8, 11 spray particulate dry ice. That is, the intake part 13 is arranged in the spraying direction of the particulate dry ice from the spraying nozzle 8, and the intake part 12 is arranged in the spraying direction of the particulate dry ice from the spraying nozzle 11.

[0085] The particulate dry ice sprayed from the spraying nozzles 8 and 11 spreads as the spraying distance increases. Therefore, the widths of the intake portions 12 and 13 are set according to the spreading width. By providing a plurality of intake portions 12 and 13 so as to intake air from respective directions above the plurality of spraying nozzles 8 and 11 that spray particulate dry ice, foreign matter that has passed through the gaps between the plurality of light-emitting bars 2 can be effectively sucked, and reattachment to the light-emitting bars 2 can be suppressed.

[0086] The cleaning method using the cleaning device 101 of this modification is the same as <B-2. Operation> except that a mechanism for sucking foreign matter by the intake portion 12 and the intake portion 13 is added to the foreign matter removal mechanism.

[0087] There is no need to generate the airflow in the -x direction, and the cleaning device 101 may not include the airflow generation unit 20.

[0088] <B-5. Modification 2> FIG. 13 shows a cross-sectional view showing the configuration of Modification 2 of the cleaning device 101 according to Embodiment 2. FIG. 13 is a cross-sectional view of a cross-section corresponding to FIG. 10.

[0089] Also in the cleaning device 101 according to Embodiment 2, instead of the arrangement as shown in FIG. 10 in which a plurality of light-emitting bars 2 are tilted, as shown in FIG. 13, the light-emitting bars 2 may be arranged in a state where only one surface is visible from above without tilting. In this modification, the arrangement of the plurality of light-emitting bars 2 is the same as in <A-4. Modification>. In FIG. 13, the size G1 of the interval between the plurality of light-emitting bars 2 may be equal to or larger than the size of foreign matter generated in the manufacturing process and not significantly reduce productivity due to a decrease in the number of light-emitting bars 2 that can be arranged. For example, the holder 9 holds the plurality of light-emitting bars 2 in an arrangement such that the interval G1 between adjacent light-emitting bars 2 is 20 μm or more and 150 μm or less without tilting.

[0090] The configuration of the cleaning device 101 of this modification example is the same as the configuration described in <B-1. Configuration> or <B-4. Modification Example 1> except for the arrangement of the plurality of light-emitting bars 2 held by the holder 9.

[0091] The flowchart of the cleaning method using the cleaning device 101 of this modification example is given in FIG. 14. In step S11, particulate dry ice is sprayed by the spray nozzle 8 and the spray nozzle 11 in the arrangement shown in FIG. 13 to clean the light-emitting surface 4 and the reflecting surface 6. At this time, since the interval G1 between adjacent light-emitting bars 2 is 20 μm or more and 150 μm or less, the frequency with which foreign matter removed from the light-emitting surface 4 and the reflecting surface 6 is sandwiched and stays between adjacent light-emitting bars 2 is suppressed. Also, since there is an interval between adjacent light-emitting bars 2, by making the size of the particulate dry ice sprayed by the spray nozzle 8 and the spray nozzle 11 smaller than G1, the particulate dry ice enters between adjacent light-emitting bars 2, and the upper surface and the lower surface, which are the surfaces facing each other of adjacent light-emitting bars 2, can also be cleaned.

[0092] In this modification example, the holder 9 holds the plurality of light-emitting bars 2 in such an arrangement that the interval between adjacent light-emitting bars 2 is 20 μm or more and 150 μm or less without tilting the plurality of light-emitting bars 2. Thereby, a cleaning device 101 and a cleaning method suitable for cleaning the light-emitting bar 2 are provided. Also, this cleaning method does not significantly reduce productivity.

[0093] <C. Embodiment 3> <C-1. Configuration> In this embodiment, a method for manufacturing a semiconductor device using a cleaning device and a cleaning method suitable for cleaning a light-emitting bar will be described. Specifically, a method for manufacturing a semiconductor device using the cleaning method according to Embodiment 1 or Embodiment 2 will be described. The cleaning method may be the one described in the modification examples of Embodiment 1 or Embodiment 2.

[0094] <C-2. Operation> The flowchart of the method for manufacturing a semiconductor device according to this embodiment is shown in FIG. 15.

[0095] In the method for manufacturing a semiconductor device according to the present embodiment, first, a semiconductor wafer is processed in a semiconductor manufacturing process to form a plurality of light-emitting bars 2 on the semiconductor wafer (step S20). In the semiconductor manufacturing process, for example, impurity ion implantation and impurity activation are performed. Also, in step S20, the upper electrode 3 and the lower electrode 5 are also formed on the upper and lower surfaces of the wafer, respectively. By step S20, as shown in FIG. 2, a semiconductor wafer 1 is obtained in which the light-emitting bars 2 are formed side by side in the in-plane direction.

[0096] Next, a plurality of light-emitting bars 2 are divided from the semiconductor wafer 1 by cleavage (step S21).

[0097] Next, the light-emitting bar 2 obtained in step S21 is cleaned by the cleaning method according to Embodiment 1 or Embodiment 2 (step S22).

[0098] By the cleaning method according to Embodiment 1 or Embodiment 2 in step S22, a light-emitting bar 2 in which not only the light-emitting surface 4 and the reflective surface 6 but also the upper and lower surfaces are cleaned is obtained.

[0099] The semiconductor device to be manufactured by the method for manufacturing a semiconductor device according to the present embodiment (hereinafter referred to as semiconductor device Tr) may be a light-emitting bar 2, a light-emitting element 7, or a module or device incorporating the light-emitting bar 2 or the light-emitting element 7. When the semiconductor device Tr is a light-emitting bar, after step S22, if necessary, a light-emitting bar 7 as the semiconductor device Tr is obtained by performing a process such as coating a reflective film on the light-emitting surface 4 and the reflective surface 6. When the semiconductor device Tr is a light-emitting element, a light-emitting element 7 as the semiconductor device Tr is obtained by dividing the light-emitting bar 2 at a location along the dotted line in FIG. 2. When the semiconductor device Tr is a module or device incorporating the light-emitting bar 2 or the light-emitting element 7, after step S22, the semiconductor device Tr is obtained by incorporating the light-emitting bar 2 or the light-emitting element 7 obtained by dividing the light-emitting bar 2 into the module or device.

[0100] <C-3. Effect> By using the cleaning method according to the first or second embodiment, a cleaning device suitable for cleaning light-emitting bars and a method for manufacturing a semiconductor device using the cleaning method are provided.

[0101] It should be noted that the embodiments can be freely combined, and each embodiment can be modified or omitted as appropriate. [Explanation of symbols]

[0102] 1 semiconductor wafer, 2 light emitting bar, 3 upper electrode, 4 light emitting surface, 5 lower electrode, 6 reflecting surface, 7 light emitting element, 8, 11 spray nozzle, 9 holder, 10, 12, 13 intake section, 20 air flow generating section, 100, 101 cleaning device.

Claims

1. A cleaning device for cleaning a light emitting bar, comprising: a holder that holds the plurality of light emitting bars in a striped arrangement; At least one spray nozzle for spraying granular dry ice onto the plurality of light bars; Equipped with The holder holds the plurality of light emitting bars at both ends in the extension direction of the light emitting bars, and holds the plurality of light emitting bars in a tilted arrangement in which two faces of each of the plurality of light emitting bars are visible from above, or in a non-tilted arrangement in which the interval between adjacent light emitting bars is 20 μm or more and 150 μm or less. Cleaning equipment.

2. A cleaning device for cleaning a light emitting bar, comprising: a holder that holds the plurality of light emitting bars in a striped arrangement; At least one spray nozzle for spraying granular dry ice onto the plurality of light bars; Equipped with The holder holds the plurality of light emitting bars in a tilted arrangement in which two surfaces of each of the plurality of light emitting bars are visible from above, or in a non-tilted arrangement in which the interval between adjacent light emitting bars is 20 μm or more and 150 μm or less; the holder holds the plurality of light-emitting bars in an inclined position such that the two surfaces of each of the plurality of light-emitting bars are visible from above; The plurality of light emitting bars are held by the holder at an inclination such that the sum of the areas of the two surfaces seen from above is 95% or more of the maximum value of the sum of the areas of the two surfaces seen from above. Cleaning equipment.

3. 3. The cleaning device according to claim 1 or 2, a foreign matter removal mechanism for removing foreign matter removed from the surfaces of the light emitting bars so as not to reattach the foreign matter to the light emitting bars; Cleaning equipment.

4. 4. The cleaning device according to claim 3, Further comprising an airflow generating unit, the foreign matter removal mechanism is a mechanism for moving foreign matter removed from the surfaces of the plurality of light emitting bars away from the plurality of light emitting bars by an airflow generated by the airflow generating unit; Cleaning equipment.

5. 5. The cleaning device according to claim 3 or 4, Further comprising at least one intake section; The foreign matter removal mechanism is a mechanism for sucking foreign matter removed from the surfaces of the plurality of light emitting bars by the at least one suction unit. Cleaning equipment.

6. 6. The cleaning device according to claim 5, the at least one spray nozzle sprays granular dry ice from one side of the plurality of light bars; The at least one air intake unit draws air from the side of the plurality of light emitting bars opposite to the side from which the at least one blowing nozzle blows the granular dry ice. Cleaning equipment.

7. A cleaning device for cleaning a light emitting bar, comprising: a holder that holds the plurality of light emitting bars in a striped arrangement; At least one spray nozzle for spraying granular dry ice onto the plurality of light bars; Equipped with The holder holds the plurality of light emitting bars in a tilted arrangement in which two surfaces of each of the plurality of light emitting bars are visible from above, or in a non-tilted arrangement in which the interval between adjacent light emitting bars is 20 μm or more and 150 μm or less; The at least one spray nozzle includes a plurality of spray nozzles, The plurality of spray nozzles spray granular dry ice from above and below the plurality of light emitting bars. Cleaning equipment.

8. A cleaning device for cleaning a light emitting bar, comprising: a holder that holds the plurality of light emitting bars in a striped arrangement; At least one spray nozzle for spraying granular dry ice onto the plurality of light bars; Equipped with The holder holds the plurality of light emitting bars in a tilted arrangement in which two surfaces of each of the plurality of light emitting bars are visible from above, or in a non-tilted arrangement in which the interval between adjacent light emitting bars is 20 μm or more and 150 μm or less; a foreign matter removal mechanism for removing the foreign matter removed from the surfaces of the light emitting bars so as not to reattach to the light emitting bars; At least one air intake; Further equipped with the foreign matter removal mechanism is a mechanism for sucking in foreign matter removed from surfaces of the plurality of light-emitting bars by the at least one suction unit; The at least one spray nozzle includes a plurality of spray nozzles, The at least one intake section includes a plurality of intake sections, The plurality of spray nozzles spray granular dry ice from above and below the plurality of light emitting bars, The plurality of suction units are provided so as to suck in air from the direction in which the plurality of spray nozzles spray the granular dry ice, Cleaning equipment.

9. A cleaning method using the cleaning apparatus according to claim 1, The holder holds the plurality of light emitting bars at both ends in the extension direction of the light emitting bars, and in a tilted arrangement in which two faces of each of the plurality of light emitting bars are visible from above, or in a non-tilted arrangement in which the interval between adjacent light emitting bars is 20 μm or more and 150 μm or less, the plurality of light emitting bars are aligned and held in the stripe shape, spraying granular dry ice onto the plurality of light bars with the at least one spray nozzle; Cleaning method:

10. A method for manufacturing a semiconductor device using the cleaning method according to claim 9, processing the wafer to form a plurality of light emitting bars; cleaving a plurality of light emitting bars from the wafer; cleaning the plurality of light bars by the cleaning method of claim 9; Equipped with A method for manufacturing a semiconductor device.

Images