Component pick-up device, component mounting device

Abstract

This component pickup device 13 is configured to position a support ring 23 having a through-hole 22 passing therethrough in the vertical direction and to pick up a component C from a component attachment sheet S that is stretched over an upper surface side of the support ring 23 so as to cover the through-hole 22. The component pickup device 13 includes an ejector 41 that moves inside the through-hole 22 of the support ring 23 and pushes the component C up from below the component attachment sheet S, a chuck head 51 that chucks and picks up the component C that has been pushed up by the ejector 41, an acquisition unit 53 that acquires information on or an image of the ejector 41, and a control unit 80. The control unit 80 acquires dimensions of the ejector 41 on the basis of the information on or the image of the ejector 41 acquired by the acquisition unit 53, and, on the basis of the acquired dimensions of the ejector 41 and the dimensions of the through-hole 22, controls the movement of the ejector 41 inside the through-hole 22 so as to avoid contact of the ejector 41 with the support ring 23.

Description

[Technical field]

[0001] The present invention relates to a component pickup device and a component mounting device. [Background technology]

[0002] Patent Document 1 discloses a device (die supply device) that picks up dies separated from a semiconductor wafer and supplies them to a component mounter. In the die supply device of Patent Document 1, an information recording unit 35 is provided on a wafer pallet 22, which describes wafer information related to the wafer size and / or the pick-up operation range.

[0003] By reading the information recorded in the information recording unit 35 with the information reading unit, the movable range of the push-up pot 51 can be automatically set so that the push-up pot 51 does not interfere with (contact with) the circular opening edge of the wafer pallet 22. This eliminates the need for an operator to input the movable range, improving productivity. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2012-099680 A Summary of the Invention [Problem to be solved by the invention]

[0005] The chips (components) divided from the wafer are placed on a dicing sheet (component mounting sheet) stretched over the circular opening (through hole in the support ring) of the wafer pallet. An ejector (push-up pot) moves inside the through hole and pushes up the component to be picked up from below. The dimensions of the ejector may vary depending on the size of the component to be picked up.

[0006] In the configuration of Patent Document 1, although wafer information is acquired from the wafer pallet, the dimensions of the ejector that is actually used are not acquired. Therefore, when the ejector is changed, there is a possibility that the ejector may come into contact with the support ring when it moves inside the through hole. Note that the parts are not limited to chips obtained by dividing a wafer, and the same problem occurs with other small parts.

[0007] The present invention has been made to solve such problems. This specification discloses a technique for limiting the movement of the ejector so as to avoid contact of the ejector with the support ring based on the dimensions of the ejector and the dimensions of the through hole. [Means for solving the problem]

[0008] The component pickup device disclosed in this specification is a component pickup device that positions a support ring having a through hole penetrating vertically, and picks up components from a component mounting sheet stretched on the upper surface side of the support ring so as to cover the through hole. Such a component pickup device includes an ejector that moves within the through hole of the support ring to push up the components from below the component mounting sheet, a suction head that sucks up and picks up the components pushed up by the ejector, an acquisition unit that acquires information or an image of the ejector, and a control unit.

[0009] The control unit acquires dimensions of the ejector based on information or images of the ejector acquired by the acquisition unit, and restricts movement of the ejector within the through hole based on the acquired dimensions of the ejector and the dimensions of the through hole so as to avoid contact of the ejector with the support ring. Effect of the Invention

[0010] According to the present invention, the movement of the ejector can be restricted based on the dimensions of the ejector and the through hole actually used, thereby making it possible to avoid the ejector coming into contact with the support ring. [Brief description of the drawings]

[0011] [Figure 1] Plan view of a component mounting device to which a component pickup device is applied [Diagram 2] FIG. 2 is an exploded perspective view showing a mechanism of the component pickup device. [Diagram 3] FIG. 1 is a schematic diagram showing a state in which a chip is picked up from a component mounting sheet in the configuration of the first embodiment; [Figure 4] Block diagram showing the control system of the component mounting device [Diagram 5] Schematic diagram showing the relative positions of the support ring, ejector, and tip [Figure 6] FIG. 13 is a diagram showing information on an ejector stored in a storage unit. [Figure 7] 1 is a flowchart showing the operation of a component mounting device. [Figure 8] A diagram showing the relationship between the chip to be picked up and the support ring. [Figure 9] FIG. 11 is a schematic diagram showing a state in which a chip is picked up from a component mounting sheet in the configuration of the second embodiment; [Figure 10] A diagram showing the information recorded on an RFID tag [Figure 11] FIG. 1 is a plan view of an ejector having an identifier on its top surface. [Figure 12] A diagram showing the identifiers and the types and outer diameters R2 of the ejectors corresponding to the identifiers [Figure 13] A plan view showing the case where the entire ejector is within the field of view of the camera. [Figure 14] Plan view showing a case where the entire ejector is not within the field of view of the camera. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] <Embodiment 1> <Overview of component mounting equipment> A first embodiment of the present invention will be described in detail below with reference to Fig. 1 to Fig. 8. A component pickup device 13 according to the present invention can be applied to various devices, such as a die bonder, a taping device that stores diced chips in a tape, or a component mounting device that mounts components on a substrate. The first embodiment is an example in which the component pickup device 13 is applied to a component mounting device 10.

[0013] Fig. 1 is a plan view showing the overall configuration of a component mounting apparatus 10. Fig. 2 is an exploded perspective view mainly showing a mechanical portion of a component pickup device 13 in the component mounting apparatus 10. The component mounting apparatus 10 is an apparatus that picks up a chip (an example of a "component") C from a diced wafer W and mounts it on a mounting target M. In this specification, a chip C is given as an example of a component, but the component may be something other than a chip, and may be, for example, a passive component such as a ceramic capacitor, a molded lead frame, or the like.

[0014] The component mounting apparatus 10 includes a base 11, a conveyor 12, a pallet storage unit 70, and a component pickup device 13.

[0015] The conveyor 12 carries the mounting target M into a predetermined mounting work position, and carries the mounting target M out of the mounting work position after the mounting work is completed. The conveyor 12 includes a conveyor body extending in the X direction for transporting the mounting target M, and a positioning mechanism (not shown) for lifting and positioning the mounting target M on the conveyor body. The conveyor 12 transports the mounting target M in a substantially horizontal position from the right side to the left side in FIG. 1, and positions and fixes it at the predetermined mounting work position.

[0016] The pallet storage unit 70 is a device that stores a plurality of pallets 20, and is disposed in the center of the front side of the component mounting apparatus 10 in Fig. 1. The pallet storage unit 70 includes a rack (not shown) that stores the pallets 20 in multiple vertical tiers, and a drive means (not shown) that drives the rack to move up and down. The pallet storage unit 70 raises and lowers the rack to position the desired pallet 20 at a height position that allows it to be inserted and removed from the pallet holding table 30. The pallet 20 that has been positioned at a height that allows it to be inserted and removed from the pallet holding table 30 is then loaded onto the pallet holding table 30.

[0017] <Palette description> The basic structure of the pallet 20 will be described with reference to Figures 2 and 3. The pallet 20 has a rectangular plate-shaped pallet body 26, a support ring 23, and an expand ring 24. The pallet body 26 has a through hole that penetrates from top to bottom. An example will be described in which the through hole of the pallet body 26 has a circular shape. However, the shape of the through hole of the pallet body 26 is arbitrary and is set appropriately.

[0018] The support ring 23 is an annular member with a through hole 22 at the center. In the present disclosure, an example in which the support ring 23 has a circular ring shape will be described. However, the shape of the support ring 23 is not limited to a circular ring shape, and may be, for example, an annular member with a rectangular through hole 22 while the outer peripheral side surface has a circular shape. Furthermore, the support ring 23 may be an annular member with a through hole 22 drilled in a plate-like member, or an annular member with a cylindrical body having a predetermined thickness drilled in the through hole 22. The size and shape of the through hole 22 are appropriately set according to the through hole of the pallet body 26. The size and shape of the through hole 22 are approximately the same as the through hole of the pallet body 26.

[0019] The support ring 23 is assembled to be movable up and down relative to the pallet body 26 with the through holes 22 overlapping the through holes of the pallet body 26. The component pickup device 13 has a mechanism for moving the support ring 23 up and down relative to the pallet body 26. The inside (interior) of the through holes 22 is a movement area in which an ejector 41 moves as described below.

[0020] Four locking portions 21 are provided on the upper surface of the pallet body 26. The four locking portions 21 are arranged at equal intervals so as to surround the support ring 23. The locking portions 21 are collapsible against the upper surface of the pallet body 26 and lock the edge of the expand ring 24 from above, fixing the expand ring 24 near the upper surface of the pallet body 26. A component mounting sheet S (hereinafter simply referred to as "sheet S") is attached to the expand ring 24.

[0021] As shown in Fig. 3, when the expand ring 24 is engaged with the pallet body 26, the sheet S is stretched so as to cover the opening on the upper surface of the support ring 23. When the support ring 23 is raised relative to the pallet body 26, the sheet S is pulled diagonally downward from the edge of the opening on the upper surface of the support ring 23. At this time, because the expand ring 24 is engaged with the pallet body 26, the entire sheet S is stretched by the upward movement of the support ring 23.

[0022] The sheet S is a flexible sheet made of, for example, a light-transmitting resin. A wafer W divided into a plurality of chips C is attached to a portion of the upper surface of the sheet S that is located inside the support ring 23 in a plan view. When the sheet S is stretched, the spaces between the chips C are expanded (expanding process).

[0023] The pallets 20 are stored in the pallet storage section 70 with the gaps between the chips C attached to the sheet S expanded. The pallets 20 stored in the pallet storage section 70 may include multiple types of pallets 20 having different dimensions R1 of the through holes 22 (inner diameter of the support ring 23) depending on the size of the wafer W, etc. In order to identify these multiple types of pallets 20, identifiers 25 corresponding to each type of pallet 20 are provided on the plate surface of the pallet body 26.

[0024] Referring again to Fig. 1, the components constituting component mounting apparatus 10 will be described. To repeat, component mounting apparatus 10 has component pickup device 13. Component pickup device 13 includes a pallet holding table 30 that holds pallet 20, a push-up unit 40 (see Fig. 2), a suction unit 50, and a control unit 80.

[0025] The pallet holding table 30 holds the pallet 20 pulled out of the pallet storage section 70 in a central position. This positions the support ring 23 constituting the pallet 20 relative to the pallet holding table 30. An opening is formed through the pallet holding table 30 at a position that overlaps with the through hole 22 of the held support ring 23 in a plan view. The pallet 20 stored in the pallet storage section 70 is loaded onto the pallet holding table 30 by a pallet loading mechanism (not shown).

[0026] The pallet loading mechanism is an element constituting the component mounting apparatus 10, and pulls out the pallet 20 from the pallet storage unit 70 and loads it onto the pallet holding table 30. The component mounting apparatus 10 may also include a return mechanism (not shown) that returns the pallet 20 held by the pallet holding table 30 to the pallet storage unit 70. The loading mechanism and the return mechanism may each be configured separately and independently, or each may be configured integrally.

[0027] The pallet holding table 30 can be moved in the Y direction on the base 11 between a part removal operation position and a pallet receiving position by a table drive motor 33. Specifically, the pallet holding table 30 is movably supported on a pair of fixed rails 31 extending in the Y direction on the base 11, and moves along the fixed rails 31 by a predetermined drive means.

[0028] The driving means for moving the pallet holding table 30 includes a ball screw shaft 32 that extends parallel to the fixed rail 31 and is screwed into a nut portion of the pallet holding table 30, and a table driving motor 33 for rotating the ball screw shaft 32.

[0029] The pallet holding table 30 can pass through a position below the conveyor 12. Such a pallet holding table 30 can freely move between a predetermined part removal operation position (the position of the pallet holding table 30 in FIG. 1) and a pallet receiving position in the vicinity of the pallet storage unit 70. The pallet holding table 30 can move in the Y direction along the fixed rails 31.

[0030] <Explanation of the thrust part> At the component removal operation position, push-up unit 40 pushes up a chip C to be picked up, together with sheet S, from below to above the chip C. The pushed-up chip C is lifted while being peeled off from sheet S. As shown in FIG. 2, push-up unit 40 includes an ejector 41, a Z-axis moving unit 42, an X-axis moving unit 43, a fixed rail 44, and a push-up unit drive motor 45 (see FIG. 4).

[0031] As shown in FIG. 3, the ejector 41 is cylindrical with an outer diameter R2 with the vertical axis, and the lower surface is connected to the Z-axis moving part 42. The outer diameter R2 is an example of the "dimension of the ejector". The ejector 41 has multiple built-in pins 41a that can protrude upward. The ejector 41 lifts the chip C of the sheet S with the multiple pins 41a. Specifically, the ejector 41 protrudes the pin 41a that is located at a position overlapping the chip C to be picked up in a plan view, while leaving the other pins 41a housed in the ejector 41, thereby pushing up only the chip C to be picked up among the multiple chips C. The ejector 41 arbitrarily changes the protruding pin 41a according to the size of the chip C to be picked up.

[0032] The ejector 41 is detachable from the Z-axis moving part 42. There are multiple types of ejectors 41 with different sizes, and an ejector 41 of an appropriate size is used depending on the size of the chip C to be picked up. For example, when the chip C to be picked up is small, an ejector 41 with a small outer diameter R2 is attached to the Z-axis moving part 42. On the other hand, when the chip C to be picked up is large, an ejector 41 with a large outer diameter R2 is attached to the Z-axis moving part 42.

[0033] The Z-axis moving section 42 is disposed between the X-axis moving section 43 and the ejector 41, and its lower end is fixed to the X-axis moving section 43. The Z-axis moving section 42 is movable in the Z direction (up and down direction), and moves the ejector 41 attached to its upper end in the Z direction. When the ejector 41 is raised, it can be brought close to the sheet S stretched on the upper surface of the support ring 23 from below. In addition, when the pallet holding table 30 is moved between the part removal operation position and the pallet receiving position, the ejector 41 can be moved down in advance to retract the ejector 41 so that the support ring 23 and the ejector 41 do not come into contact with each other.

[0034] The fixed rail 44 is a rail that extends in the X direction, and is fixed onto the base 11. As shown in Fig. 2, the fixed rail 44 supports the X-axis moving part 43 so as to be movable in the X direction.

[0035] An ejector 41 is mounted on the X-axis moving unit 43. Therefore, the ejector 41 can move in the X direction via the X-axis moving unit 43. Here, the pallet holding table 30 can move in the Y direction along the fixed rail 31. Therefore, the ejector 41 can move freely in the X and Y directions (horizontally) relative to the pallet 20 held on the pallet holding table 30. This allows the ejector 41 to move to just below any chip C and push up the chip C. The movement of the ejector 41 and the protruding operation of the pin 41a are performed by the control unit 80 controlling the table driving motor 33 and the push-up unit driving motor 45.

[0036] <Description of the suction part> As shown in FIG. 1, the adsorption section 50 has a head unit 50A and a head unit driving mechanism 50B.

[0037] Head unit 50A is a device that picks up chips C attached to sheet S and mounts them on mounting surface M1. Head unit 50A is driven by head unit driving mechanism 50B provided on base 11, and moves in the XY directions (horizontal directions) within a movable area on base 11.

[0038] Specifically, the head unit drive mechanism 50B includes a pair of fixed rails 57, a unit support member 55, a pair of Y-axis ball screws 58, and a pair of Y-axis motors 59.

[0039] The pair of fixed rails 57 are fixed on the base 11 and extend parallel to the Y direction at a predetermined interval in the X direction. The unit support member 55 has a shape that is elongated in the X direction, and supports the head unit 50A to be slidable in the X direction.

[0040] The unit support member 55 is movably supported by a pair of fixed rails 57, and is slidable in the Y direction.

[0041] The Y-axis ball screw 58 has a shaft shape that is long in the Y direction, and is disposed alongside the fixed rail 57. A Y-axis motor 59 is coupled to the Y-axis ball screw 58 via a coupling. The Y-axis ball screw 58 rotates by the driving force of the Y-axis motor 59.

[0042] The Y-axis ball screw 58 constitutes a ball screw mechanism that converts the rotational force of the Y-axis motor 59 into a propulsive force in the Y direction. The Y-axis ball screw 58 applies a propulsive force in the Y direction to the unit support member 55 and the head unit 50A. This causes the unit support member 55 and the head unit 50A to move in the Y direction (Y-axis servo mechanism).

[0043] Furthermore, the head unit driving mechanism 50B is provided with an X-axis ball screw, and an X-axis motor 56 that rotates the X-axis ball screw. The X-axis ball screw is built into the unit support member 55.

[0044] The X-axis ball screw constitutes a ball screw mechanism that converts the rotational force of the X-axis motor 56 into propulsive force in the X direction, and the head unit 50A moves in the X direction by receiving the propulsive force in the X direction from the X-axis ball screw (X-axis servo mechanism).

[0045] As described above, head unit 50A is moved in the Y direction by being driven by the Y-axis servo mechanism, and is moved in the X direction by being driven by the X-axis servo mechanism.

[0046] 2, the head unit 50A includes a head unit body 61, a suction head 51, a Z-axis motor 52, and a camera 53. The suction head 51 is connected to a motor shaft of the Z-axis motor 52. The Z-axis motor 52 is fixed to the head unit body 61. The suction head 51 is movable in the up and down directions relative to the head unit body 61 by being driven by the Z-axis motor 52.

[0047] The suction head 51 has a vertically long shape, and an air supply path is provided in the center in the vertical direction. Negative pressure is applied to the tip (lower end) of the suction head 51 by supplying negative pressure to the air supply path via a vacuum pump (not shown).

[0048] The application of negative pressure generates a suction force at the lower end of the suction head 51. This causes the suction head 51 to hold the chip C. The applied pressure can also be switched to positive pressure. The application of positive pressure causes the suction head 51 to release its hold on the chip C.

[0049] <Camera description> The camera 53 is fixed to the head unit body 61 alongside the Z-axis motor 52. The camera 53 has an imaging surface facing downwards and can capture an image of the chip C affixed to the upper surface of the sheet S. The captured image is sent to the control unit 80 and processed by the image processing unit 84, so that the control unit 80 can recognize the presence of the chip C to be picked up. In addition, the control unit 80 can detect the position of the chip C within the support ring 23 based on the position of the camera 53 when capturing the image of the chip C and the position of the pallet 20 at that time.

[0050] Furthermore, the camera 53 captures images of the ejector 41 and the pallet 20. As shown in Fig. 2, the ejector 41 is located below the camera 53. When the pallet 20 moves together with the pallet holding table 30 to the pallet receiving position, the camera 53 captures an image of the ejector 41.

[0051] After receiving the pallet 20 at the pallet receiving position, the pallet holding table 30 moves to the part removal position with the pallet 20 mounted thereon. At this time, the pallet 20 is positioned below the camera 53, so the camera 53 captures an image of the pallet 20.

[0052] The purpose of capturing images of the ejector 41 and the pallet 20 is to recognize the images of the ejector 41 and the pallet 20 and to identify the types of the ejector 41 and the pallet 20, as will be described later.

[0053] <Explanation of the control unit> 4 is a block diagram showing a control system of the component mounting apparatus 10. The control unit 80 is a controller that performs overall control of the component mounting apparatus 10.

[0054] The control unit 80 is electrically connected to the table drive motor 33, the push-up unit drive motor 45, the X-axis motor 56, the Y-axis motor 59, the camera 53, the input unit 81, and the output unit (an example of a "display unit") 82. The operator of the component mounting apparatus 10 inputs various information and commands to the control unit 80 via the input unit 81.

[0055] Furthermore, output signals are input to the control unit 80 from position detection means such as an encoder (not shown) built into each drive motor. When an abnormality occurs, such as the stop of the component mounting apparatus 10 due to approach or contact between the ejector 41 and the support ring 23, the control unit 80 displays information on the occurrence of the abnormality and its type on the output unit 82 to notify the operator of the state of the component mounting apparatus 10.

[0056] The control unit 80 includes an axis control unit 83, an image processing unit 84, a storage unit 85, and a calculation unit 86. The axis control unit 83 is a driver that drives each drive motor, and operates each drive motor according to instructions from the calculation unit 86. The image processing unit 84 performs image processing on image data input from the camera 53.

[0057] The storage unit 85 stores various programs such as a mounting program and various data. Furthermore, the storage unit 85 stores an inner diameter R1 of the support ring 23, which differs for each type of pallet 20, and a registered image of the ejector 41, which differs for each type of ejector 41, and an outer diameter R2 that corresponds one-to-one to the registered image.

[0058] The control unit 80 controls each driving motor and the like based on a predetermined program to operate the conveyor 12, the pallet holding table 30, the push-up unit 40, and the suction unit 50. This adjusts the suction position of the chip C by the suction unit 50. The control unit 80 also controls a series of operations such as inserting and removing the pallet 20 into and from the pallet storage unit 70, picking up the chip C from the sheet S, and mounting the chip C by the suction head 51.

[0059] <Avoiding contact between ejector and pallet> FIG. 5 is a plan view showing the positional relationship between the support ring 23 and the ejector 41. "R1" is the inner diameter of the support ring 23, and "R2" is the outer diameter of the ejector 41. "A1" is the center of the support ring 23 and the through hole 22, and "A2" is the center of the ejector 41. Also, "A3" is the center of the chip C to be picked up. In FIG. 5, the ejector 41 is located directly below the chip C, and the center A2 of the ejector 41 overlaps with the center A3 of the chip C. The ejector 41 moves inside the support ring 23. Therefore, the center A2 is displaced relative to the support ring 23 due to the movement of the ejector 41.

[0060] Here, if the distance from the center A1 of the support ring 23 to the center A2 of the ejector 41 is defined as D, when D>(R1-R2) / 2, the ejector 41 comes into contact with the inner wall 23a of the support ring 23. On the other hand, when D<(R1-R2) / 2, the ejector 41 avoids contacting the inner wall 23a of the support ring 23.

[0061] (R1-R2) / 2 is a value obtained by converting the difference (R1-R2) between the inner diameter R1 of the support ring 23 and the outer diameter R2 of the ejector 41 into a radius. This (R1-R2) is a judgment value (threshold value) used when judging the contact of the ejector 41 with the support ring 23.

[0062] In this embodiment, the control unit 80 controls the movement of the ejector 41 with the center A1 of the support ring 23 as a reference point to be within a range that satisfies D<(R1-R2) / 2. This prevents the ejector 41 from coming into contact with the support ring 23.

[0063] There are a plurality of types with different sizes of the ejector 41. In this embodiment, the type of the ejector 41 is identified, and the outer diameter R2 of the ejector 41 is obtained for each type.

[0064] Then, the control unit 80 limits the movement of the ejector 41 based on the acquired outer diameter R2, on the condition that D<(R1-R2) / 2 is satisfied. The control unit 80 may also set the movable range of the ejector 41 so as to satisfy D<(R1-R2) / 2. This makes it possible to avoid the ejector 41 coming into contact with the support ring 23, regardless of the type of ejector 41 used.

[0065] <Example of obtaining outer diameter R2> The storage unit 85 of the control unit 80 stores in advance information corresponding to the ejector 41. An example of the stored information is shown in FIG.

[0066] In this embodiment, the storage unit 85 stores information on "registered image," "ejector type," and "outer diameter R2" for three types of ejectors (TYPE_001, 002, 003).

[0067] The calculation unit 86 acquires image data GD2 of the ejector 41 captured by the camera 53. Then, the calculation unit 86 compares the image data GD2 with a registered image stored in the storage unit 85. After that, the calculation unit 86 identifies the ejector 41 corresponding to the registered image that matches the image data GD2, and reads the type and outer diameter R2 of the ejector 41 from the storage unit 85. In this way, the calculation unit 86 can acquire the "type" and "outer diameter R2" of the ejector 41 used in production.

[0068] In this embodiment, the calculation unit 86 determines the type of support ring 23 and obtains the inner diameter R1 of the support ring 23. Then, based on the obtained inner diameter R1, the movement of the ejector 41 is restricted. This makes it possible to avoid contact of the ejector 41 with the support ring 23 regardless of the type of support ring 23 used. The inner diameter R1 of the support ring 23 can be obtained by capturing an image of the identifier 25 attached to the upper surface of the pallet body 26 with the camera 53 and determining the type of pallet 20.

[0069] In addition, the description of the ejector 41 may be used to determine the type of the pallet 20 and to obtain the inner diameter R1 of the support ring 23.

[0070] <Explanation of operation flow> 7, the operation of the component mounting apparatus 10 to pick up the chips C from the sheet S will be described. At the start, the pallet holding table 30 holding the pallet 20 is at the pallet receiving position.

[0071] The input unit 81 issues a production start instruction to the control unit 80 based on a signal input from the outside. When the production start instruction is issued to the control unit 80, the control unit 80 judges whether or not the outer diameter R2 of the ejector 41 attached to the component mounting device 10 has already been acquired (S10). If the outer diameter R2 has been acquired (S10: YES), S20 and S30 are omitted, and the process proceeds to S40 (details will be described later). If the outer diameter R2 has not been acquired, the camera 53 captures an image of the upper surface of the ejector 41 and transmits image data GD2 to the control unit 80. The control unit 80 acquires the image data GD2 transmitted from the camera 53 (S20).

[0072] The control unit 80 compares the image data GD2 with a plurality of registered images (see FIG. 6) stored in the storage unit 85, and identifies the type of the ejector 41 from the registered image that matches the image data GD2. Next, the control unit 80 reads out and acquires the outer diameter R2 corresponding to the identified type of ejector 41 from the storage unit 85 (S30).

[0073] Next, the control unit 80 moves the pallet holding table 30 holding the pallet 20 to a part removal work position (S40). At this time, the pallet 20 is positioned below the camera 53. The camera 53 captures an image of the identifier 25 formed on the plate surface of the pallet body 26, and transmits image data GD1 to the control unit 80. The control unit 80 reads the identifier 25 reflected in the image data GD1, and reads and acquires the inner diameter R1 corresponding to the identifier 25 from the storage unit 85 (S50).

[0074] The process from S60 onwards (pick-up process of chips C) will be described below with reference to FIG. 8. FIG. 8 is a plan view for explaining the relationship between the sheet S having the wafer W attached to its surface and the support ring 23. The white straight lines shown in FIG. 8 are dicing lines. The dicing lines have a lattice pattern and divide the wafer W into a plurality of chips C (rectangular). In the following example, a case will be described in which pick-up process of chips C is performed for rectangular regions 1 to 5 of the sheet S near the support ring 23, starting from rectangular region 1. Of rectangular regions 1 to 5, chips C are present in rectangular regions 1, 2 and 5, and chips C are not present in rectangular regions 3 and 4.

[0075] The control unit 80 moves the head unit 50A above the sheet S, and captures an image of the rectangular area 1 with the camera 53. Then, the control unit 80 determines from the image of the camera 53 whether the chip C can be recognized in the rectangular area 1 (S60).

[0076] If the chip C can be recognized (S60: YES), the control unit 80 calculates the position of the center A3 of the chip C in the rectangular area 1, and calculates the distance D based on the position of the center A3 (S70). The distance D is the distance from the center A1 of the support ring 23 to the center A2 of the ejector 41 when it is assumed that the ejector 41 has moved below the rectangular area 1 to push up the chip C (see FIG. 5).

[0077] Next, the control unit 80 judges whether the distance D is smaller than (R1-R2) / 2 (S80). For the above "R1" and "R2", the data acquired in S30 and S50 are used.

[0078] When the distance D is smaller than (R1-R2) / 2, the control unit 80 determines that even if the ejector 41 is moved below the rectangular area 1, it will not come into contact with the support ring 23.

[0079] When the control unit 80 determines that the ejector 41 does not contact the support ring 23 (S80: NO), the control unit 80 moves the ejector 41 below the rectangular region 1. Specifically, the control unit 80 moves the ejector 41 below the rectangular region 1 so that the center A2 of the ejector 41 and the center A3 of the chip C overlap in a plan view (see FIG. 5).

[0080] After moving below the rectangular area 1, the ejector 41 protrudes the pins 41a to push up the chips C from below the rectangular area 1. Then, the ejector 41 picks up the chips C from the sheet S by sucking the pushed-up chips C with the suction head 51 (S90).

[0081] Thereafter, the suction head 51 mounts the picked up chip C at a predetermined position on the mounting surface M1.

[0082] After mounting the chip C, the control unit 80 refers to the mounting program and judges whether or not there is another chip C on the sheet S that should be picked up.

[0083] If a chip C to be picked up is present (S100: YES), the control unit 80 counts up to the rectangular area 2 which is the next suction position (S110).

[0084] Then, the control unit 80 moves the head unit 50A and captures an image of the rectangular area 2 with the camera 53. The control unit 80 determines, based on the image of the camera 53, whether the chip C can be recognized in the rectangular area 2 (S60).

[0085] In this example, since chip C is present in rectangular area 2, the control unit 80 determines that chip C can be recognized (S60: YES). The control unit 80 calculates distance D based on the position of center A3 of chip C in rectangular area 2 (S70). Then, it determines whether distance D is smaller than (R1-R2) / 2 (S80). Below, a description will be given of the cases where D<(R1-R2) / 2 and D>(R1-R2) / 2.

[0086] [When D<(R1-R2) / 2] When the distance D is smaller than (R1-R2) / 2, the control unit 80 moves the ejector 41 to a position below the rectangular area 2, and causes the ejector 41 to push up the chip C in the rectangular area 2 from below.

[0087] Then, the suction head 51 picks up the pushed-up chip C and mounts it at a predetermined position on the mounting surface M1. After mounting, the control unit 80 counts up to the rectangular area 3, which is the next suction position (S90 to S110).

[0088] Thereafter, the process proceeds to S60, where the control unit 80 determines whether or not the chip C can be recognized in the rectangular area 3 from the image captured by the camera 53 (S60).

[0089] 8, since chip C is not present in rectangular area 3 and is not recognized, a NO result is determined in S60. The control unit 80 does not execute the process of proceeding to S70 for rectangular area 3, but proceeds to S110 and counts up to rectangular area 4, which is the next pickup position.

[0090] In this manner, the processes of S70 to S100 are executed only for a rectangular area in which the chip C can be recognized from the image of the camera 53, and when there are no more chips C to be picked up (S100: NO), the flow ends.

[0091] [When D>(R1-R2) / 2] When the distance D is greater than (R1-R2) / 2, the control unit 80 determines that when the ejector 41 is moved below the rectangular area 2, the ejector 41 will come into contact with the support ring 23 (S80: YES).

[0092] In this case, the control unit 80 proceeds to S110 without executing the processes of S90 to S100, and counts up to the rectangular area 3 which is the next pickup position.

[0093] In other words, if the control unit 80 determines that even if chip C is present in the rectangular area 2, the ejector 41 will come into contact with the support ring 23 if it moves below the rectangular area 2, it will not move the ejector 41 below the rectangular area 2 (and naturally will not pick up chip C), but will count up to the next suction position (rectangular area 3).

[0094] In this way, the control unit 80 moves the ejector 41 below the rectangular area in which the chip C is present only when it determines that the ejector 41 will not come into contact with the support ring 23, thereby avoiding contact and preventing damage to the ejector 41.

[0095] When it is determined that the ejector 41 will come into contact with the support ring 23, the control unit 80 may stop the movement of the ejector 41 to the rectangular area where the chip C is located, and stop the ejector 41. The control unit 80 may also notify the operator by displaying on the output unit 82 that the ejector 41 is stopped and whether or not the chip C can be picked up. Furthermore, when D=(R1-R2) / 2, it may be determined that the ejector 41 will come into contact with the support ring 23. The explanation for this case can be applied to the case where D>(R1-R2) / 2.

[0096] <Effect description> In this configuration, the movement of the ejector 41 is limited based on the inner diameter R1 of the support ring 23 actually used and the outer diameter R2 of the ejector 41 actually used, so that it is possible to avoid contact between the ejector 41 and the support ring 23. Also, as long as the ejector 41 is within a range where it does not come into contact with the support ring 23, it is possible for the ejector 41 to push up the chips C. This makes it possible to prevent the number of chips picked up from the sheet S from becoming less than necessary.

[0097] Furthermore, when the ejector 41 is replaced, the control unit 80 moves the camera 53 above the replaced ejector 41 and captures an image of the ejector 41 with the camera 53. This makes it possible to identify the type of the replaced ejector 41 based on the image data GD2 captured by the camera 53. Therefore, the data on the outer diameter R2 of the ejector 41 can be updated to the data after replacement (S20, S30). From the above, even if the ejector 41 is replaced and the value of the outer diameter R2 changes before and after replacement, the data on the outer diameter R2 after replacement can be used to restrict the movement of the ejector 41 so as to avoid contact of the ejector 41 with the support ring 23.

[0098] In this configuration, the storage unit 85 of the control unit 80 prestores registered images and outer diameters R2 that correspond one-to-one to the types of ejectors 41. The control unit 80 then identifies the type of ejector 41 by comparing the image data GD2 with the registered images, and acquires the outer diameter R2 that corresponds to the type of ejector 41. This makes it possible to acquire the outer diameter R2 without directly measuring the outer diameter R2 during execution of the flow, thereby improving the tact time of the component pickup device 13.

[0099] In addition, in this configuration, the component pickup device 13 has a camera 53. The camera 53 is used not only to identify the types of the pallet 20 and the ejector 41, but also to confirm the position of the chip C to be picked up (S60, S70). By using one camera 53 for multiple purposes, it is possible to suppress an increase in costs.

[0100] <Embodiment 2> The configuration of the component pickup device 113 of the second embodiment will be described with reference to Fig. 9 and Fig. 10. The configuration of the second embodiment differs from that of the first embodiment in that the ejector 141 has an RFID tag (an example of an "information recording unit") 47, and the head unit 150A has an RFID reader (an example of an "information reading unit") 60. Note that the same reference numerals will be used for the parts common to the first embodiment, and detailed description will be omitted.

[0101] The RFID tag 47 is a small piece formed by resin-molding an IC chip on which identification information unique to the ejector 141 is recorded. The RFID tag 47 is attached to the side of the ejector 141 as shown in Fig. 9. The RFID reader 60 transmits radio waves in the RF band toward the RFID tag 47 and receives the radio waves transmitted by the RFID tag 47 in response. At this time, the RFID reader 60 can read the identification information recorded in the RFID tag 47 in a non-contact manner.

[0102] The identification information of the ejector 141 recorded in the RFID tag 47 is the ejector type and the outer diameter R2. An example of the correspondence between the signals A to C transmitted by the RFID tag 47 attached to the ejector 141 and the ejector type and the ejector outer diameter is shown in FIG. 10. For example, when the RFID reader 60 receives the signal C, the RFID reader 60 reads the ejector type "TYPE_003" and the value of the outer diameter R2 "25 mm" as the identification information. The RFID reader 60 transmits the read identification information to the control unit 80, and the control unit 80 acquires the ejector type (TYPE_003) and the outer diameter R2 (25 mm).

[0103] In this configuration, the RFID reader 60 can read the identification information of the ejector 141 in a non-contact manner. Even if the ejector 141 or the RFID tag 47 is located in a position where it cannot be imaged by the camera 53, the control unit 80 can obtain the identification information of the ejector 141. For example, as shown in FIG. 9, if a sheet S or a chip C is located between the ejector 141 and the RFID reader 60, the camera 53 cannot image the ejector 141. However, by using the RFID reader 60, it is possible to obtain the identification information of the ejector 141 from the RFID tag 47 and transmit it to the control unit 80.

[0104] <Other embodiments> (1) In the above-described first embodiment, the image data GD2 of the ejector 41 is compared with the registered image to identify the type of the ejector 41. However, the means for identifying the type of the ejector 41 from the image data GD2 is not limited to this. For example, as shown in FIG. 11, the ejector 41 may have an identifier 46 at a position that does not overlap with the pin 41a. Note that FIG. 12 shows the correspondence relationship between the type and outer diameter R2 of the ejector 41 stored in the storage unit 85 and the identifier 46.

[0105] 11, a two-dimensional code is used as the identifier 46, but the identifier 46 can be various identifiers such as a barcode or a predetermined symbol, the information of which can be read via the camera 53. The calculation unit 86 identifies the type of the ejector 41 from the identifier 46 captured in the image data GD2, and obtains the outer diameter R2 corresponding to the type of the ejector 41 from the storage unit 85.

[0106] In this case, the information to be stored in advance in the storage unit 85 is the type of the ejector 41 and the value of the outer diameter R2 (both are text information) as shown in Fig. 12, and a registered image (image information) of the ejector 41 as in the first embodiment is not required. Text information generally has a smaller amount of information than image information. Therefore, even if the storage capacity of the storage unit 85 is small, the information of the ejector 41 can be stored as text information.

[0107] (2) The information recorded in the identifier 46 may be the outer diameter R2 in addition to or instead of the type of the ejector 41. The calculation unit 86 obtains the outer diameter R2 by reading the identifier 46. In this case, the storage unit 85 does not need to store the type of the ejector 41 or the value of the outer diameter R2.

[0108] (3) The outer diameter R2 may be calculated directly from the image data GD2. Fig. 13 shows a schematic diagram of a case where the entire upper surface of the ejector 41 is included within the field of view 53a of the camera 53. In this case, the outer diameter R2 can be calculated by recognizing the outer edge 41b of the ejector 41 in the image data GD2 that captures the inside of the field of view 53a with the image processing unit 84.

[0109] 14, in the case of an ejector 41 with a large outer diameter R2, the upper surface of the ejector 41 may not be entirely contained within the viewing range 53a. In this case, the outer diameter R2 can be calculated by recognizing points B1 and B2 on the outer edge 41b from image data GD2 at the 0° position and the 180° position on the circular outer edge 41b and determining the distance between the two points.

[0110] When the outer diameter R2 is calculated directly from the image data GD2, the outer diameter R2 of the ejector 41 can be obtained without comparing the image data GD2 with a registered image or reading the identifier 46. This makes it possible to obtain the outer diameter R2 based on the image data GD2 even if there is no registered image in the storage unit 85 that corresponds one-to-one to the ejector 41 or if reading the identifier 46 fails.

[0111] (4) The component mounting apparatus 10 may have a mounting head that mounts the chip C on the mounting surface M1, in addition to the suction head 51. In this case, the suction head 51 picks up the chip C from the pallet 20 and then transfers the chip C to the mounting head.

[0112] (5) In the above-described first embodiment, the calculation unit 86 obtained the inner diameter R1 based on the identifier 25 of the pallet 20 captured by the camera 53. This is not limiting, and the inner diameter R1 may be obtained by other means. For example, the pallet 20 may have an RFID tag, and the calculation unit 86 may obtain the inner diameter R1 by reading the RFID tag with an RFID reader.

[0113] (6) In the above-described first embodiment, the image data GD1 of the identifier 25 and the image data GD2 of the ejector 41 are acquired using the camera 53. However, the camera that captures the image of the identifier 25 and the camera that captures the image of the ejector 41 may be different cameras.

[0114] (7) In the above-described second embodiment, the RFID tag 47 is attached to the side surface of the ejector 41. However, the RFID tag 47 may be attached to the upper or lower surface of the ejector 41. Also, the RFID tag 47 may be embedded inside the ejector 41.

[0115] (8) In the above-described second embodiment, the identification information recorded in the RFID tag 47 may be only the “ejector type” of the ejector 141. In this case, the storage unit 85 stores the “ejector type” and the “outer diameter R2” shown in FIG. 10 , and the calculation unit 86 reads out and acquires the value of the outer diameter R2 that corresponds one-to-one to the type of the ejector 141 from the storage unit 85.

[0116] (9) In the above-described first and second embodiments, the control unit 80 identifies the type of pallet 20 by performing image recognition on the image data GD1 of the identifier 25. If there is only one type of pallet 20, the process of image recognition on the image data GD1 may be omitted. In this case, it is preferable to pre-store the dimension of the inner diameter R1 of the support ring 23 in the memory unit 85 and use that data to limit the movement range of the ejector 41.

[0117] Furthermore, when multiple types of pallets 20 are used, as described in the first and second embodiments, it is preferable to use an acquisition unit such as a camera 53 to acquire identification information or an image of the pallet 20, determine the type from the acquired identification information or image, and acquire the dimension of the inner diameter R1 of the support ring 23. Then, it is preferable to limit the movement range of the ejector 41 using the acquired inner diameter R1.

[0118] (10) In the above-mentioned first and second embodiments, the component pickup device 13, 113 has been described as holding the pallet 20 on which the sheet S is attached, and picking up the chips C from the sheet S. The pallet 20 has a structure in which the support ring 23 is assembled to the pallet body 26.

[0119] The component pickup device in the present disclosure is not limited to a mode in which the pallet 20 is held. For example, the component pickup device may be structured to directly hold the support ring 23 on which the sheet S is stretched, and pick up the chips C from the sheet S. In other words, the pallet 20 (pallet body 26) may be eliminated, and the support ring 23 may be directly assembled to the component pickup device. A component pickup device of such a mode has a mechanism for directly holding the support ring 23. As the mechanism for directly holding the support ring 23, a mechanism that is already known can be used.

[0120] Furthermore, in the above-mentioned pallet 20, an example has been described in which the support ring 23 is assembled to the pallet body 26. However, the support ring 23 may be assembled to the pallet body 26 via a connecting member. In this case, the pallet 20 has a configuration in which the pallet body 26, the connecting member, and the support ring 23 are connected in this order from bottom to top.

[0121] The connecting member may be provided with a locking portion 21. As in the content of the <Description of Pallet> in the first embodiment, a plurality of locking portions 21 are provided so as to surround the support ring 23, and the expand ring 24 is fixed to the plurality of locking portions 21. As a result, the expand ring 24 is fixed near the upper surface of the pallet body 26 by the connecting member (locking portion 21). The chips C attached to the sheet S have their spacing expanded by the connecting member (locking portion 21).

[0122] Furthermore, the support ring 23 described so far is one of the components of the pallet 20. However, the support ring 23 may be a component of the component pickup device. In this case, the component pickup device may have, for example, a conveying mechanism that conveys the expand ring 24 toward the support ring 23, a holding mechanism that holds the expand ring 24 conveyed by the conveying mechanism, and a stretching mechanism that stretches the sheet S by the expand ring 24 held by the holding mechanism. From another perspective, it can be said that the component pickup device may have an auto-expanding mechanism.

[0123] (11) In the above-described embodiment, the acquiring unit is exemplified by the camera 53 and the RFID reader 60. The acquiring unit may be, for example, a laser displacement meter that acquires the shape and dimensions of an object (ejector 41, pallet 20, etc.) using laser light.

[0124] (12) In the above-described embodiment, the outer diameter R2 (the diameter of the ejector 41 in a plan view) is used as the information of the ejector 41 stored in the storage unit 85. The information of the ejector 41 may be data including a dimension in the height direction (Z direction) in addition to the outer diameter R2.

[0125] (13) In the above-described embodiment, the support ring 23 is assembled to the pallet body 26 so as to be movable in the vertical direction. The support ring 23 may be fixed to the pallet body 26. For example, the support ring 23 may be fixed to the pallet body 26 by screwing or fitting. The support ring 23 is fixed by any method in a state where it protrudes upward from the upper surface of the pallet body.

[0126] The part pickup device 13 may have a mechanism for moving the expand ring 24 in the vertical direction relative to the pallet body 26. In this case, the expansion process is performed as follows. First, the expand ring 24 to which the sheet S is attached is placed above the support ring 23 and lowered toward the pallet body 26. After the sheet S comes into contact with the opening on the upper surface of the support ring 23, the expand ring 24 is further lowered to approach the pallet body 26 and is locked by the collapsible locking portion 21. At this time, the sheet S is pulled diagonally downward from the edge of the opening on the upper surface of the support ring 23 and stretched, and the expansion process is performed. [Explanation of symbols]

[0127] 10: Component mounting equipment 13, 113: Parts pick-up device 22:Through hole 23: Support ring 41, 141: Ejector 51: Suction head 53: Camera (an example of an "acquisition unit") 80: Control unit C: Chip (an example of a "component") S: Sheet (parts mounting sheet) R1: Inner diameter (an example of "through hole dimensions") R2: Outer diameter (an example of "ejector dimensions")

Claims

1. A component pickup device that positions a support ring having a through hole penetrating vertically, and picks up a component from a component mounting sheet attached to an upper surface side of the support ring so as to cover the through hole, an ejector that moves within the through hole of the support ring to push up the component from below the component mounting sheet; a suction head that suctions and picks up the component pushed up by the ejector; An acquisition unit that acquires information or an image of the ejector; A control unit; Including, The control unit acquires dimensions of the ejector based on information or an image of the ejector acquired by the acquisition unit, restricting movement of the ejector in the through hole so as to avoid contact of the ejector with the support ring based on the acquired dimensions of the ejector and the through hole; the acquisition unit is a camera, The control unit identifies a type of the ejector from an image of the ejector captured by the camera, and obtains dimensions of the ejector based on the identified type.

2. A part pickup device as claimed in claim 1, The control unit pre-stores data on dimensions of the ejector corresponding to the type or identification information of the ejector, and obtains the dimensions of the ejector by referring to the type or identification information in the stored data.

3. A component pickup device that positions a support ring having through holes penetrating vertically, and picks up components from a component mounting sheet attached to an upper surface side of the support ring so as to cover the through holes, an ejector that moves within the through hole of the support ring to push up the component from below the component mounting sheet; a suction head that suctions and picks up the component pushed up by the ejector; An acquisition unit that acquires information or an image of the ejector; A control unit; Including, The control unit acquires dimensions of the ejector based on information or an image of the ejector acquired by the acquisition unit, restricting movement of the ejector in the through hole so as to avoid contact of the ejector with the support ring based on the acquired dimensions of the ejector and the through hole; the acquisition unit is a camera that captures an image of the ejector, The control unit directly calculates the dimensions of the ejector from the image of the ejector captured by the camera.

4. A part pickup device according to any one of claims 1 to 3, The control unit sets a movable range of the ejector based on a dimension of the support ring and a dimension of the ejector.

5. A part pickup device according to any one of claims 1 to 4, the through hole of the support ring and the ejector are both circular in plan view, The control unit is determining that the ejector does not contact the support ring when a distance from a center of the through hole to a center of the ejector is smaller than a dimension obtained by subtracting half of an outer diameter of the ejector from half an inner diameter of the through hole; The component pickup device determines that the ejector will contact the support ring when the distance from the center of the through hole to the center of the ejector is greater than a dimension obtained by subtracting half the outer diameter of the ejector from half the inner diameter of the through hole.

6. A part pickup device according to any one of claims 1 to 5, The control unit stops movement of the ejector when it determines that the support ring and the ejector are in contact with each other.

7. A part pickup device as claimed in claim 6, The control unit has a display unit, The display unit displays information regarding whether the ejector is stopped and whether the part can be picked up.

8. A component mounting device comprising a component pickup device described in any one of claims 1 to 7.

Images