Method for detecting conveyance deviation

The method uses a rotatable table system with imaging and conveyance means to calculate and correct conveyance deviations, enhancing alignment efficiency and productivity in processing devices.

JP7618488B2Active Publication Date: 2025-01-21DISCO CORP
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Patent Information

Application Number
JP2021065257
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-04-07
Publication Date
2025-01-21
Estimated Expiration
2041-04-07

AI Technical Summary

Technical Problem

Existing methods for transporting wafers between tables in processing devices, such as dicing machines, are inefficient and time-consuming due to the need for manual adjustments to align the conveyance direction and distance, leading to potential wafer displacement and reduced productivity.

Method used

A method involving a rotatable first and second table, imaging means, and conveyance means to determine conveyance deviation by marking the workpiece, capturing images at different table orientations, and calculating coordinate differences to correct deviations.

Benefits of technology

Enables easy determination of conveyance deviation without requiring direct measurement, improving alignment accuracy and productivity by correcting conveyance deviations in both X and Y axes.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a transport deviation amount detection method capable of easily obtaining a transport deviation amount of transport means.SOLUTION: A conveyance deviation amount detection method includes a first coordinate storing step of holding a workpiece on which a mark M is formed on a first table, imaging the workpiece with imaging means, and storing the coordinates of the mark M as X1 and Y1 coordinates, a 180-degree rotation step of conveying and holding the workpiece held on the first table by conveying means to a second table and rotating the second table by 180 degrees, a return step of conveying the workpiece held on the second table by the conveying means to the first table and holding the workpiece, a second coordinate storing step of rotating the first table by 180 degrees and capturing an image of the workpiece with the imaging means, and storing the coordinates of the mark M as X2 and Y2 coordinates, and a conveyance deviation amount calculation step of calculating (X2-X1) / 2 as the conveyance deviation amount in the X-axis direction and (Y2-Y1) / 2 as the conveyance deviation amount in the Y-axis direction.SELECTED DRAWING: Figure 1
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Description

[Technical field]

[0001] The present invention relates to a method for detecting a conveyance deviation amount of a conveyance means that conveys a workpiece from a first table to a second table. [Background technology]

[0002] A wafer having a plurality of devices such as ICs and LSIs formed on its surface along division lines is then divided into individual device chips by a dicing machine, and each of the divided device chips is used in electrical equipment such as mobile phones and personal computers.

[0003] The dicing device is generally composed of a chuck table that holds the wafer, a cutting means that cuts the wafer held on the chuck table, an X-axis feed means that relatively feeds the chuck table and the cutting means in the X-axis direction, a Y-axis feed means that relatively indexes and feeds the chuck table and the cutting means in the Y-axis direction, an imaging means that images the wafer held on the chuck table and detects the area to be cut, a cleaning means that cleans the cut wafer, and a transport means that transports the wafer from the chuck table to the cleaning means, and can cut the wafer with high precision (see, for example, Patent Document 1). The cleaning means of the dicing device includes a rotatable spinner table that holds the wafer, and a cleaning liquid spray nozzle that sprays a cleaning liquid onto the wafer held on the spinner table. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2010-36275 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, if the wafer held in the correct position on the chuck table of the dicing device cannot be transported to the correct position on the spinner table of the cleaning device by the transport device, the high speed rotation of the spinner table may cause the wafer to fly off the spinner table. Therefore, it is necessary to actually measure the direction and distance from the chuck table to the spinner table and fine-tune the transport direction and transport distance of the transport device, but such fine adjustments are time-consuming and result in poor productivity.

[0006] Such problems can also occur in various processing devices (for example, laser processing devices, grinding devices, and inspection devices) that are equipped with a mechanism for transporting wafers between two or more tables.

[0007] SUMMARY OF THE PRESENTLY PREFERRED EMBODIMENT In view of the above, an object of the present invention is to provide a method for detecting an amount of deviation in conveyance by which an amount of deviation in conveyance of a conveying means can be easily obtained. [Means for solving the problem]

[0008] According to the present invention, the following method for detecting a deviation in conveyance is provided to solve the above-mentioned problems. That is, in a processing apparatus for processing a workpiece, the processing apparatus is provided with at least a rotatable first table, a rotatable second table, a conveying means for conveying a workpiece from the first table to the second table, and an imaging means for imaging the workpiece held on the first table, and the method for detecting a deviation in conveyance of the conveying means includes a first coordinate storage step of holding a workpiece on which a mark is formed on the first table, imaging the workpiece with the imaging means, and storing the coordinates of the mark as X1, Y1 coordinates; a 180-degree rotation step of transporting a workpiece to the second table, where it is held, and rotating the second table by 180 degrees; a return step of transporting the workpiece held on the second table by the transporting means to the first table, where it is held; a second coordinate storage step of rotating the first table 180 degrees, imaging the workpiece with the imaging means, and storing the coordinates of the mark as X2, Y2 coordinates; and a transport deviation calculation step of calculating (X2-X1) / 2 as the transport deviation in the X-axis direction and (Y2-Y1) / 2 as the transport deviation in the Y-axis direction.

[0009] Preferably, (X2-X1) / 2 and (Y2-Y1) / 2 are added to the amount of movement of the conveying means to correct the conveyance deviation. Effect of the Invention

[0010] The present invention provides a method for detecting a conveyance deviation in a processing apparatus that processes a workpiece and that includes at least a rotatable first table, a rotatable second table, a conveying means for conveying a workpiece from the first table to the second table, and an imaging means for imaging the workpiece held on the first table. The method includes a first coordinate storage step of holding a workpiece on which a mark is formed on the first table, imaging the workpiece with the imaging means, and storing coordinates of the mark as X1, Y1 coordinates, and a second coordinate storage step of conveying the workpiece held on the first table by the conveying means to the second table, and then imaging the workpiece with the imaging means. The method includes a 180-degree rotation step of rotating the table 180 degrees, a return step of transporting the work held on the second table by the transporting means to the first table where it is held, a second coordinate storage step of rotating the first table 180 degrees, imaging the work with the imaging means, and storing the coordinates of the mark as X2, Y2 coordinates, and a transport deviation calculation step of calculating (X2-X1) / 2 as the transport deviation in the X-axis direction and (Y2-Y1) / 2 as the transport deviation in the Y-axis direction. Therefore, there is no need to actually measure the direction and distance from the first table to the second table, and the transport deviation of the transporting means can be easily determined from the deviation in the coordinates of the mark. [Brief description of the drawings]

[0011] [Figure 1] 1 is a perspective view of a processing apparatus in which a method for detecting a conveyance deviation according to the present invention can be implemented; [Diagram 2] FIG. 4 is a plan view of a workpiece on which a mark is formed. [Diagram 3] FIG. 2 is a schematic plan view of the first and second tables shown in FIG. 1. [Figure 4] FIG. 11 is a schematic plan view of the first and second tables in a first coordinate storage step. [Diagram 5] 4 is a schematic plan view showing a state in which a workpiece held on a first table is transported by a transport means to a second table and held thereon. FIG. [Figure 6] 6 is a schematic plan view showing a state in which the second table is rotated 180 degrees from the state shown in FIG. 5. [Figure 7]5 is a schematic plan view showing a state in which a workpiece held on a second table is transported by a transport means to a first table and held thereon. FIG. [Figure 8] 8 is a schematic plan view showing a state in which the first table is rotated 180 degrees from the state shown in FIG. 7. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the method for detecting a conveyance deviation of the present invention will be described with reference to the drawings.

[0013] First, a processing apparatus in which the transport misalignment detection method of the present invention can be implemented will be described. The processing apparatus 2 shown in Fig. 1 includes at least a rotatable first table 4, a rotatable second table 6, a transport means 8 for transporting a workpiece from the first table 4 to the second table 6, and an imaging means 10 for imaging the workpiece held on the first table 4.

[0014] The circular first table 4 is transported by an X-axis transport means (not shown) in the X-axis direction indicated by the arrow X in Fig. 1, and rotated by a first table motor (not shown) about the center C1 (see Fig. 3) of the first table 4 as its axis. The X-axis transport means may include, for example, a ball screw connected to the first table 4 and extending in the X-axis direction, and a motor for rotating the ball screw. The Y-axis direction indicated by the arrow Y in Fig. 1 is perpendicular to the X-axis direction, and the XY plane defined by the X-axis and Y-axis directions is substantially horizontal.

[0015] 1, a circular porous suction chuck 4a connected to a suction means (not shown) is disposed on the upper end of the first table 4. The first table 4 is adapted to suction-hold a disk-shaped workpiece W (see FIG. 2), such as a semiconductor wafer, by generating a suction force on the suction chuck 4a using the suction means. The processing device 2 in the illustrated embodiment is a dicing device that performs cutting processing on the workpiece W, and the first table 4 suction-holds the workpiece W when cutting the workpiece W.

[0016] The second table 6 in the illustrated embodiment is a spinner table that suctions and holds the workpiece W when cleaning the workpiece W that has been machined and has cutting chips attached thereto. The circular second table 6 is rotated by a second table motor (not illustrated) about the axis C2 (see FIG. 3) of the second table 6.

[0017] 1, a circular porous suction chuck 6a connected to a suction means (not shown) is disposed on the upper end of the second table 6, similarly to the first table 4. The second table 6 also suction-holds the workpiece W by generating a suction force on the suction chuck 6a using the suction means. The workpiece W can be washed by spraying a cleaning liquid from a cleaning liquid spray nozzle (not shown) onto the workpiece W while rotating the second table 6 holding the workpiece W by suction.

[0018] The conveying means 8 in the illustrated embodiment includes the above-mentioned X-axis conveying means which conveys the workpiece W held on the first table 4 in the X-axis direction, and Y-axis conveying means 11 which holds the workpiece W held on the first table 4, raises and lowers it, and conveys it in the Y-axis direction.

[0019] The Y-axis conveying means 11 includes an arm 12 movable in the Y-axis direction, an arm moving means (not shown) for moving the arm 12 in the Y-axis direction, a bracket piece 14 attached to the underside of the tip of the arm 12, an H-shaped plate 16 fixed to the underside of the bracket piece 14, and a number of suction pads 18 arranged on the underside of the plate 16. The arm moving means may be configured to have, for example, a ball screw connected to the arm 12 and extending in the Y-axis direction, and a motor for rotating the ball screw. The bracket piece 14 is configured to be able to freely expand and contract in the vertical direction by an appropriate actuator such as an air cylinder. Furthermore, each suction pad 18 is connected to a suction means (not shown).

[0020] In the conveying means 8, after the X-axis conveying means positions the first table 4 at a predetermined conveying start position, the suction pad 18 of the Y-axis conveying means 11 suction-holds the workpiece W on the first table 4 and receives the workpiece W from the first table 4. Then, the Y-axis conveying means 11 that has received the workpiece W moves the arm 12 and bracket piece 14 to convey the workpiece W from the first table 4 to the second table 6.

[0021] The imaging means 10 is adapted to image the workpiece W on the first table 4 that is positioned at a predetermined imaging position by the X-axis transport means. The image data captured by the imaging means 10 is sent to the control means (not shown) of the processing device 2.

[0022] The control means, which is composed of a computer, includes a central processing unit (CPU) that performs calculations according to a control program, a read-only memory (ROM) that stores the control program, etc., and a readable / writable random access memory (RAM) that stores calculation results, etc. The control means performs image analysis on the image data sent from the imaging means 10, and for example, obtains and stores the X and Y coordinates of a mark M (see FIG. 2) formed on the workpiece W. The control means also controls the operation of the processing device 2, and as an example, controls the amount of movement of the transport means 8 according to conditions input in advance to the control means.

[0023] As shown in FIG. 1, the processing apparatus 2 further includes a cutting means 20 for cutting the workpiece W held on the first table 4, a cassette stage 24 that can be raised and lowered on which a cassette 22 containing a plurality of workpieces W is placed, a loading / unloading means 28 for drawing out the unmachined workpiece W from the cassette 22 and transporting it to the temporary placement table 26 and transporting the processed workpiece W positioned on the temporary placement table 26 into the cassette 22, and a moving means 30 for moving the unmachined workpiece W transported from the cassette 22 to the temporary placement table 26 to the first table 4.

[0024] Next, a description will be given of a method for detecting a conveyance deviation amount of the conveyance means 8 in the above-mentioned processing device 2. In the illustrated embodiment, first, a first coordinate storage step is performed in which the workpiece W on which the mark M is formed is held on the first table 4, an image is captured by the imaging means 10, and the coordinates of the mark M are stored as X1, Y1 coordinates.

[0025] In the first coordinate storage step, first, the workpiece W is placed on the first table 4 with the surface on which the mark M is formed facing upward. Next, the first table 4 is moved by the X-axis transport means, and the first table 4 is positioned at a predetermined imaging position, and the workpiece W held on the first table 4 is imaged by the imaging means 10. Then, image analysis is performed by the control means on the image captured by the imaging means 10, and the coordinates of the mark M are obtained and stored as X1, Y1 coordinates (see FIG. 4).

[0026] After the first coordinate storage process is performed, a 180 degree rotation process is performed in which the workpiece W held on the first table 4 is transported to and held on the second table 6 by the transport means 8, and the second table 6 is rotated 180 degrees.

[0027] In the 180-degree rotation process, first, the first table 4 is moved by the X-axis transport means, and the first table 4 is positioned at a predetermined transport start position. Once the first table 4 is positioned at the transport start position, the arm 12 and bracket piece 14 of the Y-axis transport means 11 are operated, and the suction pads 18 are brought into close contact with the upper surface of the workpiece W on the first table 4. Next, the workpiece W is sucked and held by each suction pad 18, and the suction force of the first table 4 is released.

[0028] Next, the arm 12 and bracket piece 14 of the Y-axis transport means 11 are operated to transport the workpiece W from the first table 4 to the second table 6, and the bottom surface of the workpiece W is brought into contact with the top surface of the second table 6. Next, the workpiece W is suction-held by the second table 6, and the suction force of the suction pad 18 is released. In this manner, the workpiece W is transferred from the Y-axis transport means 11 to the second table 6 (see FIG. 5). Then, once the workpiece W has been transferred to the second table 6, the second table motor is operated, and the second table 6, which is holding the workpiece W by suction, is rotated 180 degrees as shown in FIG. 6.

[0029] After the 180-degree rotation process is performed, a return process is performed in which the workpiece W held on the second table 6 is transported by the transport means 8 to the first table 4 and held there.

[0030] In the return process, first, the suction pads 18 of the Y-axis conveying means 11 are brought into close contact with the upper surface of the workpiece W on the second table 6, and the suction pads 18 suction-hold the workpiece W while releasing the suction force of the second table 6. Next, the arm 12 and bracket piece 14 are operated to convey the workpiece W from the second table 6 to the first table 4, and the lower surface of the workpiece W is brought into contact with the upper surface of the first table 4. Then, as shown in FIG. 7, the workpiece W is suction-held by the first table 4 while releasing the suction force of the suction pads 18. In this manner, the workpiece W is returned from the second table 6 to the first table 4.

[0031] After the returning step is performed, the first table 4 is rotated 180 degrees, the workpiece W is imaged by the imaging means 10, and a second coordinate storage step is performed in which the coordinates of the mark M are stored as X2, Y2 coordinates.

[0032] In the second coordinate storage step, first, as shown in Fig. 8, the first table motor is operated to rotate the first table 4, which holds the workpiece W by suction, by 180 degrees. Next, the first table 4 is moved by the X-axis transport means and positioned at a predetermined imaging position, and the workpiece W held on the first table 4 is imaged by the imaging means 10. Then, image analysis is performed by the control means on the image captured by the imaging means 10, and the coordinates of the mark M are obtained and stored as X2, Y2 coordinates (see Fig. 8).

[0033] After the second coordinate storage step is performed, a transfer deviation calculation step is performed in which (X2-X1) / 2 is calculated as the transfer deviation in the X-axis direction, and (Y2-Y1) / 2 is calculated as the transfer deviation in the Y-axis direction. In the illustrated embodiment, the transfer deviation is calculated by the control means.

[0034] In the illustrated embodiment, as described above, the workpiece W transported from the first table 4 to the second table 6 is rotated 180 degrees on the second table 6, and the workpiece W transported (returned) from the second table 6 to the first table 4 is rotated 180 degrees on the first table 4. Therefore, if there is a transport deviation due to the transport means 8, the distance between the coordinates (X1, Y1) of the mark M before transport and the coordinates (X2, Y2) of the mark M after transport is twice the transport deviation amount of the transport means 8. Therefore, by performing the calculations of (X2-X1) / 2 and (Y2-Y1) / 2, the transport deviation amounts in the X-axis direction and the Y-axis direction can be obtained. Note that, if there is no transport deviation due to the transport means 8, the coordinates (X1, Y1) of the mark M before transport and the coordinates (X2, Y2) of the mark M after transport coincide with each other.

[0035] After carrying out the transfer deviation calculation process, it is preferable to correct the transfer deviation by adding (X2-X1) / 2 and (Y2-Y1) / 2 to the movement amount of the transfer means 8. In the illustrated embodiment, when the workpiece W is transferred from the first table 4 to the second table 6, the X-axis transfer means transfers the workpiece W in the X-axis direction, and the Y-axis transfer means 11 transfers the workpiece W in the Y-axis direction and in the up-down direction. Therefore, the transfer deviation amount in the X-axis direction is added to the movement amount of the X-axis transfer means, and the transfer deviation amount in the Y-axis direction is added to the movement amount of the Y-axis transfer means 11. This makes it possible to prevent transfer deviation from occurring when the workpiece W is transferred from the first table 4 to the second table 6, and the workpiece W can be placed at an appropriate position on the second table 6.

[0036] As described above, the illustrated embodiment includes a first coordinate storage step of holding the workpiece W on which the mark M is formed on the first table 4, capturing an image of the workpiece W by the imaging means 10, and storing the coordinates of the mark M as X1, Y1 coordinates; a 180 degree rotation step of transporting the workpiece W held on the first table 4 by the transport means 8 to the second table 6 where it is held and rotating the second table 6 by 180 degrees; a return step of transporting the workpiece W held on the second table 6 by the transport means 8 to the first table 4 where it is held; a second coordinate storage step of rotating the first table 4 180 degrees, capturing an image of the workpiece W by the imaging means 10, and storing the coordinates of the mark M as X2, Y2 coordinates; and a transport deviation calculation step of calculating (X2-X1) / 2 as the transport deviation in the X-axis direction and (Y2-Y1) / 2 as the transport deviation in the Y-axis direction, so that the transport deviation of the transport means 8 can be easily determined.

[0037] The amount of deviation in the X-axis and Y-axis directions may be (X1-X2) / 2 and (Y1-Y2) / 2, respectively, opposite to the embodiment shown in the figure. This is because half the difference between X1 and X2 and half the difference between Y1 and Y2 are the amount of deviation in the transport, and whether the sign of the calculated numerical value is positive or negative indicates the direction in which the deviation in the transport occurs.

[0038] In addition, in the illustrated embodiment, an example has been described in which the processing device 2 is configured as a dicing device that performs cutting processing on the workpiece W, but the present invention can be implemented in various processing devices as long as they are equipped with a transport means for transporting a workpiece such as a semiconductor wafer between two or more tables, including a laser processing device that performs laser processing on the workpiece, a grinding device that performs grinding processing on the workpiece, and an inspection device that inspects the workpiece. [Explanation of symbols]

[0039] 2: Processing unit 4: First table 6: Second table 8: Means of transportation 10: Imaging means W: Work

Claims

1. A processing apparatus for processing a workpiece, the processing apparatus comprising at least a rotatable first table, a rotatable second table, a transport means for transporting a workpiece from the first table to the second table, and an imaging means for imaging the workpiece held on the first table, the method comprising the steps of: a first coordinate storage step of holding a workpiece on which a mark is formed on the first table, capturing an image of the workpiece with the imaging means, and storing coordinates of the mark as X1, Y1 coordinates; a 180-degree rotation step of transporting the work held on the first table to the second table by the transport means, and rotating the second table by 180 degrees; a returning step of transporting the work held on the second table by the transport means to the first table and holding the work thereon; a second coordinate storage step of rotating the first table 180 degrees, capturing an image of the workpiece with the imaging means, and storing coordinates of the mark as X2, Y2 coordinates; a transfer deviation amount calculation step of calculating (X2-X1) / 2 as the transfer deviation amount in the X-axis direction and (Y2-Y1) / 2 as the transfer deviation amount in the Y-axis direction; A method for detecting a conveyance deviation including the steps of:

2. 2. The method for detecting an amount of deviation in conveyance according to claim 1, further comprising the step of adding (X2-X1) / 2 and (Y2-Y1) / 2 to the amount of movement of said conveying means to correct the deviation in conveyance.

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