Transfer mount apparatus and method utilizing positive pressure to maintain wafer or die position

Abstract

To provide a die mobile mounting device and method capable of avoiding accuracy deviation of a position on a wafer or a die on a substrate by moving while one adsorption pad adsorbs the wafer or the die and simultaneously holding the position of the wafer or the die on the adsorption pad without being deviated by positive pressure from a holding device.SOLUTION: A method includes the steps in which: an adsorption pad adsorbs a wafer or a die by negative pressure; a holding device moves to a bottom part of the adsorption pad, and blows the wafer or the die upward by positive pressure to act; the adsorption pad turns off the negative pressure to make a part or the whole of the adsorption pad move over the substrate synchronously with the holding device; the adsorption pad adsorbs the wafer or the die by negative pressure, and the holding device turns of the positive pressure to be released from the adsorption pad; the adsorption pad descends until the wafer or the die is brought into contact with the substrate; and the adsorption pad turns off the negative pressure to be released from the wafer or the die, and the wafer or the die is connected to the substrate.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a moving and mounting apparatus and method, and more particularly to a moving and mounting apparatus and method that utilizes positive pressure to hold the position of a wafer or die. [Background technology]

[0002] In the semiconductor processing process, the wafer or die usually needs to be transferred onto the substrate by a moving mount device. Two conventional moving mount devices and methods are described below.

[0003] The first moving and mounting device includes a first suction pad and a second suction pad, and a corresponding moving and mounting method includes a step of the first suction pad generating a negative pressure and suctioning an upper surface of a wafer or a plurality of dies by the negative pressure, a step of the first suction pad moving onto the second suction pad, a step of the first suction pad descending until a bottom surface of the wafer or the plurality of dies contacts the second suction pad, a step of the second suction pad generating a negative pressure and suctioning an upper surface of the wafer or the plurality of dies by the negative pressure, a step of the first suction pad turning off the negative pressure and detaching from the wafer or the plurality of dies, a step of the second suction pad moving onto a substrate and rotating 180 degrees so that the top surface of the wafer or the plurality of dies faces downward, a step of the second suction pad descending until the top surface of the wafer or the plurality of dies contacts the substrate, and a step of the second suction pad turning off the negative pressure and detaching from the wafer or the plurality of dies, and the wafer or the plurality of dies being bonded onto the substrate.

[0004] However, during the period when the first suction pad transfers the wafer or the multiple dies to the second suction pad, there may be a deviation in the position of the wafer or the multiple dies, resulting in a deviation in the position at which the wafer or the multiple dies is placed on the substrate.

[0005] Furthermore, due to a deviation in the positional accuracy of the multiple dies, some of the dies may not be perfectly aligned with the through holes of the second suction pad, which may significantly weaken the force with which the second suction pad adsorbs these dies. As a result, some of the dies may detach from the second suction pad and fall down while the second suction pad is moving.

[0006] The second moving and mounting device includes a first suction pad, a stage, and a second suction pad. The second moving and mounting method includes the steps of: the first suction pad generates a negative pressure and suctions the top surface of the wafer or the multiple dies by the negative pressure; the first suction pad moves onto the stage; the first suction pad descends until the bottom surface of the wafer or the multiple dies contacts the stage; the first suction pad turns off the negative pressure and detaches from the wafer or the multiple dies; the stage moves below the second suction pad; the second suction pad descends until the top surface of the wafer or the multiple dies contacts the second suction pad; the second suction pad generates a negative pressure and suctions the top surface of the wafer or the multiple dies by the negative pressure; the second suction pad moves onto the substrate; the second suction pad descends until the bottom surface of the wafer or the multiple dies contacts the substrate; the second suction pad turns off the negative pressure and detaches from the wafer or the multiple dies, and the wafer or the multiple dies are bonded onto the substrate.

[0007] However, during the period when the first suction pad transfers the wafer or the multiple dies to the stage, and when the stage transfers the wafer or the multiple dies to the second suction pad, there may be an error in the position of the wafer or the multiple dies, resulting in an error in the position at which the wafer or the multiple dies is placed on the substrate.

[0008] Furthermore, due to a deviation in the positional accuracy of the multiple dies, some of the dies may not be perfectly aligned with the through holes of the second suction pad, which may cause some of the dies to detach from the second suction pad and fall down while the second suction pad is moving. Summary of the Invention [Problem to be solved by the invention]

[0009] SUMMARY OF THE PRESENT DISCLOSURE The main objective of the present invention is to provide a moving and placing apparatus and method for maintaining the position of a wafer or die by utilizing positive pressure, which can avoid deviation in the accuracy of the position where the wafer or die is placed on a substrate.

[0010] Another object of the present invention is to provide a moving mounting apparatus and method that utilizes positive pressure to hold the position of a wafer or die, which can prevent the die from coming off the suction pad and falling down. [Means for solving the problem]

[0011] In order to achieve the above object, the present invention provides a mobile mounting device that includes a suction pad and a holding device and uses positive pressure to hold the position of a wafer or a die. The suction pad selectively generates negative pressure to suck the top surface of the wafer or a plurality of dies by the negative pressure. The holding device is installed under the suction pad and selectively generates positive pressure to blow the bottom surface of the wafer or a plurality of dies upward by the positive pressure.

[0012] In an embodiment of the present invention, the suction pad comprises a main body, a top cover, and an exhaust pipe, the main body is provided with a plurality of through holes, the top cover is installed on the top of the main body, and a first chamber communicating with the plurality of through holes is formed, the exhaust pipe is installed on the top cover and communicates with the first chamber, the air inside the first chamber and the plurality of through holes is exhausted to the outside, generating the negative pressure, and the main body adsorbs the top surface of the wafer or the plurality of dies by the negative pressure.

[0013] The holding device further comprises a bottom cover and an intake pipe, the bottom cover is installed on the bottom of the main body to form a second chamber, the intake pipe is installed on the bottom cover and communicates with the second chamber, the intake pipe introduces outside air into the inside of the second chamber to generate positive pressure, and the bottom cover acts by blowing the bottom surfaces of the wafer or the multiple dies upwards by the positive pressure.

[0014] The above-mentioned moving and mounting device further includes a clamp mechanism that clamps the top portion around the main body and the bottom portion around the lower cover.

[0015] The retention device also includes a seal disposed circumferentially around the gap between the bottom portion around the body and the top portion around the bottom cover.

[0016] In order to achieve the above-mentioned object, the present invention provides a moving and mounting method for holding the position of a wafer or a die by utilizing positive pressure, the method comprising: (a) a suction pad generates negative pressure and sucks the top surface of the wafer or the plurality of dies by the negative pressure; (b) a holding device moves to the bottom of the suction pad and generates positive pressure and blows the bottom surface of the wafer or the plurality of dies upward by the positive pressure; and (c) the suction pad turns off the negative pressure and a part or all of the suction pad moves to the substrate in synchronization with the holding device. (d) the suction pad generates the negative pressure and adsorbs the top surface of the wafer or the multiple dies using the negative pressure, and the holding device turns off the positive pressure and detaches from the suction pad; (e) the suction pad descends until the bottom surface of the wafer or the multiple dies contacts the substrate; and (f) the suction pad turns off the negative pressure and detaches from the wafer or the multiple dies, and the wafer or the multiple dies are bonded to the substrate.

[0017] The method further includes a step of discharging air from inside the first chamber of the main body of the suction pad and inside the multiple through holes of the main body to the outside through an exhaust pipe of the suction pad, thereby generating the negative pressure, and causing the main body to adsorb the upper surface of the wafer or the multiple dies by the negative pressure.

[0018] In addition, in step (b), the method further includes a step of moving a bottom cover of a holding device to the bottom of the main body, and a step of an intake pipe of the holding device introducing outside air into the inside of a second chamber of the bottom cover of the holding device to generate positive pressure, and the bottom cover acting by blowing the bottom surfaces of the wafer or the multiple dies upward with the positive pressure.

[0019] In addition, in step (b), the clamping mechanism further includes a step of clamping the top around the main body and the bottom around the bottom cover; in step (c), the clamping mechanism further includes a step of stopping the exhaust pipe from exhausting air from inside the first chamber and inside the multiple through holes to the outside and turning off the negative pressure, a step of the top cover rising so as to move away from the main body, a step of the main body, the holding device, and the clamping mechanism synchronously moving above the substrate, and a step of the top cover moving closer to the top of the main body; and in step (d), the exhaust pipe exhausts air from inside the first chamber and inside the multiple through holes to the outside, generating the negative pressure, and the main body adsorbs the wafer or the multiple dies by the negative pressure, a step of stopping the exhaust pipe from introducing outside air into the second chamber and turning off the positive pressure, a step of the clamping mechanism moving away from the main body and the top cover, and a step of the holding device descending to separate from the suction pad.

[0020] Also, in step (b), the seal of the retainer eliminates a gap between a bottom portion around the body and a top portion around the bottom cover along a circumferential direction. Effect of the Invention

[0021] The effect of the present invention is that, during the period in which the wafer or the multiple dies are moved from the suction pad to the substrate, the wafer or the multiple dies are moved while being adsorbed by one suction pad, and at the same time, the position of the wafer or the multiple dies on the suction pad can be held without deviation by the positive pressure from the holding device, eliminating the need to transfer the wafer or the multiple dies to another suction pad or to a stage and another suction pad in sequence, thereby effectively reducing the number of transfers and making it possible to avoid deviations in the accuracy of the position at which the wafer or the multiple dies are placed on the substrate.

[0022] Furthermore, since there is no misalignment of the multiple dies on the suction pad, the multiple dies can be maintained in alignment with the multiple through holes, the suction pad's suction force on the multiple dies does not change, and the multiple dies are unlikely to come off the suction pad and fall down. [Brief description of the drawings]

[0023] [Figure 1] FIG. 1 is a perspective exploded view of an apparatus according to the present invention. [Diagram 2] 1 is a cross-sectional view of an apparatus according to the present invention; [Diagram 3] 1 is a flow chart of a method according to the present invention. [Figure 4] FIG. 2 is a schematic diagram of step S100 of the method according to the present invention. [Figure 5A] FIG. 2 is a schematic diagram of step S200 of the method according to the present invention. [Figure 5B] FIG. 2 is a schematic diagram of step S200 of the method according to the present invention. [Figure 5C] FIG. 2 is a schematic diagram of step S200 of the method according to the present invention. [Figure 5D] FIG. 2 is a schematic diagram of step S200 of the method according to the present invention. [Figure 6A] FIG. 2 is a schematic diagram of step S300 of the method according to the present invention. [Figure 6B] FIG. 2 is a schematic diagram of step S300 of the method according to the present invention. [Figure 6C]FIG. 2 is a schematic diagram of step S300 of the method according to the present invention. [Figure 6D] FIG. 2 is a schematic diagram of step S300 of the method according to the present invention. [Figure 7A] FIG. 4 is a schematic diagram of step S400 of the method according to the present invention. [Figure 7B] FIG. 4 is a schematic diagram of step S400 of the method according to the present invention. [Figure 7C] FIG. 4 is a schematic diagram of step S400 of the method according to the present invention. [Figure 7D] FIG. 4 is a schematic diagram of step S400 of the method according to the present invention. [Figure 7E] FIG. 4 is a schematic diagram of step S400 of the method according to the present invention. [Figure 8A] FIG. 2 is a schematic diagram of step S500 of the method according to the present invention. [Figure 8B] FIG. 2 is a schematic diagram of step S500 of the method according to the present invention. [Figure 9A] FIG. 2 is a schematic diagram of step S600 of the method according to the present invention. [Figure 9B] FIG. 2 is a schematic diagram of step S600 of the method according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the embodiments of the present invention will be described in more detail with reference to the accompanying drawings and reference numerals, so that those skilled in the art can practice the present invention after reading the specification.

[0025] Fig. 1 is a perspective exploded view of an apparatus according to the present invention, and Fig. 2 is a cross-sectional view of the apparatus according to the present invention. As shown in Fig. 1 and Fig. 2, the present invention provides a moving mounting device that uses positive pressure to hold the position of a wafer or die, and includes a suction pad 10, a holding device 20, and a clamping mechanism 30. The suction pad 10 includes a main body 11, an upper cover 12, and an exhaust pipe 13, and the main body 11 is provided with a plurality of through holes 111.

[0026] The top cover 12 is installed on the top of the main body 11, and a first chamber 121 is formed which communicates with the plurality of through holes 111. The exhaust pipe 13 is installed on the top cover 12, and communicates with the first chamber 121. The holding device 20 includes a bottom cover 21, an intake pipe 22, and a seal 23. The bottom cover 21 is installed on the bottom of the main body 11, and a second chamber 211 is formed. The intake pipe 22 is installed on the bottom cover 21, and communicates with the second chamber 211.

[0027] The seal 23 is installed in the gap between the bottom portion around the main body 11 and the top portion around the bottom cover 21 along the circumferential direction. The clamping mechanism 30 includes two first clamps 31 that clamp the top portions on both sides of the main body 11, respectively, and two second clamps 32 that clamp the bottom portions on both sides of the bottom cover 21, respectively.

[0028] 1, in a preferred embodiment, the suction pad 10 has a rectangular shape. However, the shape of the suction pad 10 is not limited thereto, and may be, for example, a circular shape or any other suitable shape.

[0029] The material of the suction pad 10 may be, but is not limited to, rubber, metal, plastic, or porous ceramics.

[0030] The seal 23 may be, but is not limited to, an O-ring or a rubber spacer.

[0031] Figure 3 is a flow chart of the method according to the present invention, Figure 4 is a schematic diagram of step S100 of the method according to the present invention, Figures 5A-5D are schematic diagrams of step S200 of the method according to the present invention, Figures 6A-6D are schematic diagrams of step S300 of the method according to the present invention, Figures 7A-7E are schematic diagrams of step S400 of the method according to the present invention, Figures 8A and 8B are schematic diagrams of step S500 of the method according to the present invention, and Figures 9A and 9B are schematic diagrams of step S600 of the method according to the present invention. The present invention provides a transfer mounting method for maintaining the position of a wafer or die by utilizing positive pressure, comprising the following steps:

[0032] 3 and 4, in step S100, the suction pad 10 generates negative pressure 14, and adsorbs the upper surfaces of the multiple dies 40 by the negative pressure 14. More specifically, in step S100, the exhaust pipe 13 exhausts air from inside the first chamber 121 and inside the multiple through holes 111 to the outside, generating negative pressure 14, and the main body 11 adsorbs the upper surfaces of the multiple dies 40 by the negative pressure 14.

[0033] In step S200, as shown in FIG. 3 and FIGS. 5A to 5D, the holding device 20 moves closer to the bottom of the suction pad 10 to generate positive pressure 24, which acts by blowing the bottom surfaces of the multiple dies 40 upward.

[0034] More specifically, step S200 further includes step S210 in which the holding device 20 moves below the suction pad 10, as shown in FIG. 5A; step S220 in which the holding device 20 rises so that the bottom cover 21 approaches the bottom of the main body 11, as shown in FIG. 5B, and the seal 23 eliminates the gap between the bottom around the main body 11 and the top around the bottom cover 21 along the circumferential direction; step S230 in which the multiple first clamps 31 respectively clamp the tops on both sides of the main body 11, and the multiple second clamps 32 respectively clamp the bottoms on both sides of the bottom cover 21, as shown in FIG. 5C; and step S240 in which the intake pipe 22 introduces outside air into the second chamber 211 to generate a positive pressure 24, and the bottom cover 21 acts by blowing the positive pressure 24 upward against the bottom surfaces of the multiple dies 40.

[0035] 3 and 6A-6D, the suction pad 10 turns off the negative pressure 14, and part or all of the suction pad 10 moves synchronously with the holding device 20 above the substrate 50. Specifically, the process further includes a step S310 in which the exhaust pipe 13 stops discharging air from the inside of the first chamber 121 and the inside of the plurality of through holes 111 to the outside and turns off the negative pressure 14, as shown in Fig. 6A, a step S320 in which the top cover 12 rises away from the main body 11, as shown in Fig. 6B, a step S330 in which the main body 11, the holding device 20, and the clamp mechanism 30 synchronously move above the substrate 50, as shown in Fig. 6C, and a step S340 in which the top cover 12 moves closer to the top of the main body 11, as shown in Fig. 6D.

[0036] In step S400, as shown in Figures 3 and 7A to 7E, the suction pad 10 generates negative pressure 14 and adsorbs the upper surfaces of the multiple dies 40 using the negative pressure 14, and the holding device 20 turns off the positive pressure 24 and moves away from the suction pad 10.

[0037] More specifically, in step S400, as shown in FIG. 7A, the exhaust pipe 13 exhausts air from inside the first chamber 121 and inside the multiple through holes 111 to the outside, generating negative pressure 14, and the main body 11 adsorbs the multiple dies 40 by the negative pressure 14, step S410, as shown in FIG. 7B, the intake pipe 22 stops introducing outside air into the second chamber 211 and turns off the positive pressure 24, step S420, as shown in FIG. 7C, the multiple first clamps 31 rise away from the main body 11 and the multiple second clamps 32 descend away from the top cover 12, step S430, as shown in FIG. 7C, and the holding device 20 descends to detach from the suction pad 10, step S440, as shown in FIG. 7D and FIG. 7E.

[0038] In step S500, the suction pad 10 is lowered until the bottom surfaces of the multiple dies 40 contact the substrate 50, as shown in FIGS. 3, 8A and 8B.

[0039] In step S600, as shown in FIGS. 3, 9A and 9B, the suction pad 10 turns off the negative pressure 14, and is detached from the plurality of dies 40, and the plurality of dies 40 are bonded onto the substrate 50.

[0040] Specifically, in step S600, as shown in FIG. 9A, the exhaust pipe 13 stops discharging air from inside the first chamber 121 and inside the plurality of through holes 111, and turns off the negative pressure 14, and as shown in FIG. 9B, the suction pad 10 rises to detach from the plurality of dies 40, and the plurality of dies 40 are bonded onto the substrate 50, as shown in FIG. 9B, in step S620.

[0041] In another modified embodiment, the object to be moved and placed in the moving and placing apparatus and method according to the present invention may be a wafer (not shown).

[0042] As described above, during the period in which the wafer or the multiple dies 40 are moved from the suction pad 10 to the substrate 50, the present invention uses one suction pad 10 to suction and move the wafer or the multiple dies 40, and at the same time, the position of the wafer or the multiple dies 40 on the suction pad 10 can be held without deviation by the positive pressure from the holding device 20, eliminating the need to re-transfer to another suction pad or to transfer sequentially between a stage and another suction pad. This effectively reduces the number of transfers and prevents deviations in the accuracy of the position at which the wafer or the multiple wafers 40 are placed on the substrate 50.

[0043] Furthermore, since there is no misalignment of the multiple dies 40 on the suction pad 10, the multiple dies 40 can be held in alignment with the multiple through holes 111, the suction force of the suction pad 10 to the multiple dies 40 does not change, and the multiple dies 44 are unlikely to come off the suction pad 10 and fall down.

[0044] In order to reduce the weight of the suction pad 10 when it is moved, the main body 11 and the top cover 12 are separable.

[0045] In addition, the clamp mechanism 30 can fix the main body 11 and the bottom cover 21 so that the main body 11 is not affected by the movement of the top cover 12, and is also useful for the synchronous movement of the main body 11 and the bottom cover 21.

[0046] It is worth noting that the seal 23 can prevent the air in the second chamber 211 from leaking out through the gap, thereby avoiding a pressure drop in the positive pressure 24.

[0047] The above-mentioned are only preferred embodiments for explaining the present invention, which are not intended to impose any formal limitations on the present invention, and any modifications or changes made to the present invention under the same inventive concept should be included in the intended scope of protection of the present invention. [Explanation of symbols]

[0048] 10 Suction Pad 11 Main unit 111 through hole 12 Top lid 121 First Chamber 13 Exhaust pipe 14 Negative Pressure 20 Holding device 21 Lower lid 211 Second Chamber 22 Intake pipe 23 Seal 24 Positive Pressure 30 Clamping mechanism 31 First Clamp 32 Second Clamp 40 Die 50 Substrates S100~S600 process S210~S240 process S310~S340 process S410~S440 process S610, S620 process

Claims

1. A moving and mounting device that uses positive pressure to hold a wafer or die in position, The moving and placing device includes a suction pad and a holding device, the suction pad generates a negative pressure and suctions an upper surface of the wafer or a plurality of dies by the negative pressure; The holding device is installed at the bottom of the suction pad and includes a bottom cover and an intake pipe; the bottom cover is disposed on the bottom of the suction pad body to form a second chamber; The intake pipe is installed in the lower cover and communicates with the second chamber; The intake pipe introduces outside air into the second chamber to generate a positive pressure, and the bottom cover blows the bottom surface of the wafer or the dies upward by the positive pressure. Mobile placement device.

2. The suction pad includes the main body, an upper cover, and an exhaust pipe. A plurality of through holes are provided in the body; the top cover is placed on the top of the body and defines a first chamber communicating with the plurality of through holes; The exhaust pipe is installed in the top cover and communicates with the first chamber; the exhaust pipe exhausts air in the first chamber and the through holes to the outside, generating the negative pressure, and the main body adsorbs the upper surfaces of the wafer or the dies by the negative pressure; The moving and mounting device according to claim 1 .

3. The moving and mounting device according to claim 1 , further comprising a clamping mechanism that clamps a top portion around the main body and a bottom portion around the bottom cover.

4. The retaining device further includes a seal disposed circumferentially around a gap between a bottom portion around the body and a top portion around the bottom cover. The moving and mounting device according to claim 1 or 3.

5. A transfer and placement method that utilizes positive pressure to hold the position of a wafer or die, comprising the steps of: (a) a suction pad generates a negative pressure and suctions a top surface of a wafer or a plurality of dies by the negative pressure; (b) a bottom cover of a holding device is moved to the bottom of the body of the suction pad, and an intake pipe of the holding device introduces outside air into the inside of a second chamber of the bottom cover of the holding device to generate positive pressure, and the bottom cover blows upward against the bottom surface of the wafer or the plurality of dies by the positive pressure; (c) turning off the negative pressure of the suction pad, an upper cover of the suction pad rising away from the main body, and a part or all of the suction pad moving above the substrate in synchronization with the holding device; (d) the top cover is moved closer to the top of the body, the suction pad generates the negative pressure, the negative pressure suctions the top surface of the wafer or the dies, and the holding device turns off the positive pressure and moves away from the suction pad; (e) lowering the suction pad until a bottom surface of the wafer or the plurality of dies contacts the substrate; (f) turning off the negative pressure, the suction pad detaches from the wafer or the plurality of dies, and the wafer or the plurality of dies is bonded to the substrate; and Equipped with Moving and placing method.

6. In step (a), The method further includes a step of discharging air from the inside of the first chamber of the main body of the suction pad and the inside of the plurality of through holes of the main body to the outside through an exhaust pipe of the suction pad to generate the negative pressure, and the main body adsorbs the upper surface of the wafer or the plurality of dies by the negative pressure. The moving and placing method according to claim 5.

7. In step (b), The clamping mechanism further includes clamping a top portion around the body and a bottom portion around the bottom cover; In step (c), the exhaust pipe stops exhausting the air in the first chamber and the through holes to the outside, thereby turning off the negative pressure; lifting the top cover away from the main body; synchronously moving the body, the holding device, and the clamping mechanism above the substrate; and moving the top cover closer to the top of the body, In step (d), the exhaust pipe exhausts air in the first chamber and the through holes to the outside, generating the negative pressure, and the main body adsorbs the wafer or the dies by the negative pressure; the exhaust pipe ceasing to introduce outside air into the second chamber and turning off the positive pressure; the clamp mechanism moving away from the body and the top cover; and lowering the holding device so as to separate from the suction pad. The moving and placing method according to claim 5 .

8. In step (b), The seal of the retention device eliminates gaps between the bottom around the body and the top around the bottom cover along a circumferential direction. The moving and placing method according to claim 5 or 7.

Images