SUBSTRATE SUPPORT MECHANISM, SUBSTRATE CLEANING APPARATUS, AND SUBSTRATE PROCESSING METHOD

Abstract

To provide means for suppressing wear of cleaning members and unexpected generation of dust.SOLUTION: A substrate support mechanism 100 includes a first support portion 110 having a contact area capable of swinging and contacting a peripheral edge of one surface of a substrate W in a closed state, a second support portion 120 that supports the other surface of the substrate W, and a first support portion moving portion 140 that swings the first support portion 110.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a substrate supporting mechanism for supporting a substrate such as a semiconductor wafer, a substrate cleaning apparatus having the substrate supporting mechanism, and a substrate processing method using the substrate supporting mechanism. [Background technology]

[0002] Conventionally, there has been known a substrate cleaning apparatus having a chuck for supporting a substrate W and a rotation mechanism for rotating the substrate W supported by the chuck (Patent Document 1). In such a substrate processing and cleaning apparatus, the front and back surfaces of the substrate are gripped by chuck arms, and the tips of the chuck arms protrude relatively long toward the front surface side. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-153761 A Summary of the Invention [Problem to be solved by the invention]

[0004] When the chuck arm shown in Patent Document 1 is adopted, it is possible to swing the pencil cleaning member only to the inner periphery of the chuck arm so that the pencil cleaning member does not come into contact with the chuck arm, but in that case, there is a problem that the peripheral portion of the substrate cannot be cleaned by the pencil cleaning member. It is also possible to swing the pencil cleaning member all the way out to the outer periphery of the substrate in order to clean the peripheral portion of the substrate, but in that case, there is a possibility that the pencil cleaning member will come off or the chuck arm will lose grip of the substrate. Furthermore, in this case, the pencil cleaning member is likely to wear out and may cause unexpected dust to be generated. The same is true for the roll cleaning member, and if the roll cleaning member comes into contact with the tip of the chuck arm, it is likely to wear out and may cause unexpected dust to be generated.

[0005] The present invention is based on a different idea from that of conventional chuck arms, and in a first aspect, it provides a means for supporting the back surface and the front surface of the substrate at different positions in the in-plane direction, thereby providing one means for solving the above-mentioned problems. In a second aspect described below, it is possible to suppress the generation of dust, and in a third aspect, it is possible to more reliably clean the peripheral edge of the substrate. [Means for solving the problem]

[0006] A substrate support mechanism according to a first aspect of the present invention comprises: a first support portion having a contact area capable of contacting a peripheral edge of one surface of the substrate in a closed state; A second support portion that supports the other surface of the substrate; a first support portion moving portion that moves the first support portion from an open state to a closed state; The present invention may also include:

[0007] A substrate support mechanism according to a second aspect of the present invention comprises: a support portion for supporting the substrate in a closed state; the support portion has a first extension portion extending along an in-plane direction of the substrate and a second extension portion extending from the first extension portion to one side, The substrate is supported by a tip of the second extension portion; the first extension portion is located on the other surface side of the substrate, The support portion swings to a closed state, A first magnet is provided on the first extension, a second magnet is provided between the substrate and the first extension portion at a position facing the first magnet; A repulsive force between the first magnet and the second magnet may impart a rocking force inwardly to a periphery of the contact area.

[0008] A substrate cleaning apparatus according to a third aspect of the present invention comprises: A plurality of support parts for supporting the substrate in a closed state; A rotating unit that rotates the substrate; A supply unit that supplies a cleaning liquid to the substrate; Equipped with During rotation of the substrate, the supports may be opened randomly or in sequence.

[0009] The "support portion" in the second and third embodiments will be hereinafter read as a "first support portion," and further limited embodiments will be described.

[0010] In each of the above aspects of the present invention, The first support portion may not be in contact with the other surface of the substrate.

[0011] In each of the above aspects of the present invention, The second support portion may be provided on a straight line connecting the contact area and a center point of the substrate in an in-plane direction.

[0012] In each of the above aspects of the present invention, The width of the tip of the first support portion may be continuously narrowed.

[0013] In each of the above aspects of the present invention, A tip end of the first support portion may protrude inwardly and inclined from the periphery.

[0014] In each of the above aspects of the present invention, The apex or top face of the tip of the first support may be located on one side of the substrate at a position 0.5 mm or less from the one surface of the substrate.

[0015] In each of the above aspects of the present invention, The first support portion is swung to a closed state, The first support part may be oscillated by magnetic force.

[0016] In each of the above aspects of the present invention, the first support portion has a first extension portion extending along an in-plane direction of the substrate and a second extension portion extending from the first extension portion to one side, The contact area is provided at a tip of the second extension portion, The first extension portion may be located on the other surface side of the substrate.

[0017] In each of the above aspects of the present invention, The first support portion is swung to a closed state, A first magnet is provided on the first extension, a second magnet is provided between the substrate and the first extension portion at a position facing the first magnet; A repulsive force between the first magnet and the second magnet may impart a rocking force inwardly to a periphery of the contact area.

[0018] In each of the above aspects of the present invention, There are a plurality of pairs of first magnets and second magnets, The first magnet and the second magnet may rotate with the substrate as the substrate rotates.

[0019] In each of the above aspects of the present invention, a plurality of arm portions provided on the other surface side of the substrate and extending outwardly toward a periphery in an in-plane direction; The second magnet may be provided on the arm portion.

[0020] In each of the above aspects of the present invention, The second support portion may be provided on the arm portion.

[0021] In each of the above aspects of the present invention, The first support portion moving portion may be located on the other side of the first extension portion, and the tip portion of the second extension portion may be moved outwardly from the periphery by moving the first extension portion to one side.

[0022] In each of the above aspects of the present invention, A plurality of first support portions are provided, When the substrate is rotated, the first supports may be opened randomly or in sequence.

[0023] In each of the above aspects of the present invention, Four or more first support portions are provided, At any one time, three or more of the first supports may be supporting the substrate, while the remaining first supports may not be supporting the substrate.

[0024] In each of the above aspects of the present invention, The substrate support mechanism described above; a swinging unit for swinging a cleaning member for cleaning the substrate within a surface of the substrate; Equipped with The cleaning member may be moved outwardly from the periphery of the substrate.

[0025] The substrate cleaning method of the present invention comprises the steps of: supporting the other surface of the substrate by a second support portion; supporting a peripheral edge of one surface of the substrate by moving a plurality of first support parts from an open state to a closed state; rotating the substrate; applying a cleaning solution to the substrate; Equipped with When the substrate is rotated, the first supports may be opened randomly or in sequence. Effect of the Invention

[0026] According to the first aspect of the present invention, the rear surface of the substrate and the front surface of the substrate can be supported at different positions in the in-plane direction. [Brief description of the drawings]

[0027] [Figure 1] FIG. 1 is a top plan view showing an overall configuration of a substrate processing apparatus including a substrate cleaning apparatus according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a side cross-sectional view of the substrate cleaning apparatus according to the first embodiment of the present invention. [Diagram 3] FIG. 3 is a top plan view showing an arm portion and the like used in the first embodiment of the present invention. [Figure 4A] FIG. 4A is a side view showing a substrate supporting mechanism (closed state) used as one aspect of the first embodiment of the present invention. [Figure 4B] FIG. 4B is a side view showing the substrate support mechanism (in an open state) used as one aspect of the first embodiment of the present invention. [Figure 5A] FIG. 5A is a side view showing a substrate supporting mechanism (closed state) used as another aspect of the first embodiment of the present invention. [Figure 5B] FIG. 5B is a side view showing the substrate support mechanism (in an open state) used as another aspect of the first embodiment of the present invention. [Figure 6] FIG. 6 is a perspective view of a substrate supporting mechanism according to the first embodiment of the present invention. [Figure 7] FIG. 7 is a top plan view of the substrate supporting mechanism according to the first embodiment of the present invention. [Figure 8] FIG. 8 is an enlarged side view of the first support portion according to the first embodiment of the present invention. [Figure 9] FIG. 9 is a side view showing the first support portion, the second support portion, and the cleaning member according to the first embodiment of the present invention. [Figure 10] FIG. 10 is a view showing the first support portion and the cleaning member according to the first embodiment of the present invention, as viewed from the direction of arrow A in FIG. [Figure 11]FIG. 11 is a side view showing a substrate supporting mechanism used as one aspect of the second embodiment of the present invention. [Figure 12] FIG. 12 is a side view showing a substrate supporting mechanism used as another aspect of the second embodiment of the present invention. [Figure 13] FIG. 13 is a top plan view showing a pencil cleaning member used in an embodiment of the present invention. [Figure 14] FIG. 14 is a top plan view showing a roll cleaning member used in an embodiment of the present invention. [Figure 15] FIG. 15 is a side view showing an embodiment of the present invention in which a second support portion is not provided. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] First embodiment "composition" Hereinafter, an embodiment of a substrate processing apparatus having a substrate cleaning apparatus according to the present invention will be described with reference to the drawings. In this embodiment, the "front side of the substrate W" means the upper side in FIG. 2, the "rear side of the substrate W" means the lower side in FIG. 2, the normal direction of the substrate W is called the "first direction", and the in-plane direction of the substrate W is called the "in-plane direction". The in-plane direction is a plane including the second direction in FIG. 2 and the front-back direction (third direction) of the paper. The "front side of the substrate W" is also called the "one side", and the "rear side of the substrate W" is also called the "other side".

[0029] As shown in Fig. 1, the substrate processing apparatus has a substantially rectangular housing 310 and a load port 312 on which a substrate W cassette for stocking a large number of substrates W is placed. The load port 312 is disposed adjacent to the housing 310. An open cassette, a Standard Mechanical Interface (SMIF) pod, or a Front Opening Unified Pod (FOUP) can be mounted on the load port 312. The SMIF pod and FOUP are sealed containers that store substrate W cassettes therein and are covered with a partition wall to maintain an environment independent of the external space. The substrate W may be, for example, a semiconductor wafer.

[0030] The housing 310 accommodates a plurality of polishing units 314a to 314d (four in the embodiment shown in FIG. 1), a first cleaning unit 316 and a second cleaning unit 318 for cleaning the polished substrate W, and a drying unit 320 for drying the cleaned substrate W. The polishing units 314a to 314d are arranged along the longitudinal direction of the substrate processing apparatus, and the cleaning units 316, 318 and the drying unit 320 are also arranged along the longitudinal direction of the substrate processing apparatus. The substrate processing apparatus of this embodiment can polish various substrates W having diameters of 150 mm, 200 mm, 300 mm, or 450 mm in the manufacturing process of semiconductor wafers, flat panels, image sensors such as CMOS (Complementary Metal Oxide Semiconductor) and CCD (Charge Coupled Device), and magnetic films in MRAM (Magnetoresistive Random Access Memory).

[0031] A first transport robot 322 is disposed in an area surrounded by the load port 312, the polishing unit 314a located on the load port 312 side, and the drying unit 320. A transport unit 324 is disposed in parallel to the polishing units 314a to 314d, the cleaning units 316, 318, and the drying unit 320. The first transport robot 322 receives the substrate W before polishing from the load port 312 and passes it to the transport unit 324, and receives the substrate W after drying from the drying unit 320.

[0032] Between the first cleaning unit 316 and the second cleaning unit 318, a second transport robot 326 is disposed for transferring the substrate W between the first cleaning unit 316 and the second cleaning unit 318, and between the second cleaning unit 318 and the drying unit 320, a third transport robot 328 is disposed for transferring the substrate W between the second cleaning unit 318 and the drying unit 320. Furthermore, a control unit 50 for controlling the movement of each device of the substrate processing apparatus is disposed inside the housing 310. In this embodiment, a mode in which the control unit 50 is disposed inside the housing 310 is described, but this is not limited thereto, and the control unit 50 may be disposed outside the housing 310, or may be capable of being remotely operated from a remote location. In addition, the control unit 50 may be composed of a plurality of devices, and when the control unit 50 is composed of a plurality of devices, the devices constituting the control unit 50 may be installed in different rooms or different locations, and a part of the control unit 50 and the remaining part of the control unit 50 may be disposed in a remote location.

[0033] The first cleaning unit 316 may be a roll cleaning device that scrubs the surface of the substrate W by contacting the substrate W with a roll cleaning member 11b extending linearly over almost the entire diameter of the substrate W in the presence of a cleaning liquid and rotating the roll cleaning member 11b about a central axis parallel to the substrate W. The second cleaning unit 318 may be a pencil cleaning device that scrubs the surface of the substrate W by contacting a lower end contact surface of a cylindrical pencil cleaning member 11a extending vertically with the surface of the substrate W in the presence of a cleaning liquid and moving the pencil cleaning member 11a in one direction while rotating. The drying unit 320 may be a spin drying unit that sprays IPA vapor from a moving spray nozzle toward the horizontally rotating substrate W to dry the substrate W, and further rotates the substrate W at high speed to dry the substrate W by centrifugal force.

[0034] Note that instead of a roll cleaning device, the first cleaning unit 316 may be a pencil cleaning device similar to the second cleaning unit 318, or a two-fluid jet cleaning device that cleans the surface of the substrate W with a two-fluid jet. Also, instead of a pencil cleaning device, the second cleaning unit 318 may be a roll cleaning device similar to the first cleaning unit 316, or a two-fluid jet cleaning device that cleans the surface of the substrate W with a two-fluid jet. The aspects of the present invention can be applied to both the first cleaning unit 316 and the second cleaning unit 318, and can be used together with the roll cleaning device, the pencil cleaning device, and / or the two-fluid jet cleaning device.

[0035] The cleaning liquid in this embodiment includes a rinse liquid such as deionized water (DIW) and a chemical liquid such as ammonia hydrogen peroxide (SC1), hydrochloric acid hydrogen peroxide (SC2), sulfuric acid hydrogen peroxide (SPM), sulfuric acid hydrogen peroxide, hydrofluoric acid, etc. In this embodiment, unless otherwise specified, the cleaning liquid means either a rinse liquid or a chemical liquid.

[0036] As shown in FIG. 2, the substrate cleaning apparatus according to the embodiment of the present invention may include a housing 5, a substrate support mechanism 100 that supports a substrate W in the housing 5, a rotation unit 35 that rotates the substrate support mechanism 100, a cleaning unit 10 that physically cleans the substrate W supported by the substrate support mechanism 100, and a cleaning liquid supply unit 90 that supplies a cleaning liquid. The substrate support mechanism 100 is in an open state when it is not supporting the substrate W, and in a closed state when it supports the substrate W. The opening and closing of the substrate support mechanism 100 may be controlled based on a command from the control unit 50, or the substrate support mechanism 100 may be automatically closed by placing the substrate W thereon, and automatically opened when the substrate W is removed (by application of a force of a certain level or more). In the embodiment shown in FIG. 2, as an example, the cleaning liquid supply unit 90 includes a chemical liquid supply nozzle 91 that supplies a chemical liquid, a fluid jet nozzle 92 that supplies two fluids, and a rinse liquid supply nozzle 93 that supplies a rinse liquid. The supply of the cleaning liquid from the cleaning liquid supply unit 90 may be controlled by the control unit 50 reading out a recipe stored in the storage unit 60. In the present embodiment, the control unit 50 of the substrate processing apparatus controls the substrate cleaning apparatus, but the present invention is not limited to this, and the control may be performed by a dedicated control unit for controlling the substrate cleaning apparatus.

[0037] The cleaning unit 10 may have a first cleaning unit that supplies a cleaning liquid to one side of the substrate W, and a second cleaning unit that supplies a cleaning liquid to the other side of the substrate W. The cleaning unit 10 shown in Figure 2 is the first cleaning unit, and the second cleaning unit is not shown in Figure 2.

[0038] A cleaning member 11 including a roll cleaning member 11b and / or a pencil cleaning member 11a that contacts and cleans the substrate W may be provided (see FIGS. 13 and 14). The cleaning member 11 may include a first cleaning member 11 that is a component of the first cleaning section and contacts one side of the substrate W to perform cleaning, and a second cleaning member 11 that is a component of the second cleaning section and contacts the other side of the substrate W to perform cleaning.

[0039] As shown in FIG. 2, the substrate support mechanism 100 may include a first support part 110 that is freely swingable and has a contact area that can contact the peripheral edge of one side of the substrate W in a closed state, a second support part 120 that supports the other side of the substrate W, and a first support part moving part 140 that swings the first support part 110.

[0040] The first supporting part 110 may have a contact area that contacts only one surface or one surface and a side surface of the substrate W, and may be configured not to contact the other surface of the substrate W. The one surface of the substrate W is, for example, the upper surface of a bevel portion Wb of the wafer, which will be described later. However, this is not limited to this embodiment, and the first supporting part 110 may be configured to contact the other surface of the substrate W. Furthermore, when the first supporting part 110 contacts the other surface of the substrate W, the second supporting part 120 may not be provided (see FIG. 15).

[0041] The second support part 120 may be provided on a straight line connecting the first support part 110 and the center of rotation of the rotated part 20 (see FIG. 3). In this case, the second support part 120 is provided on a straight line connecting the contact area and the center point of the substrate W in the in-plane direction. When such an embodiment is adopted, it is only necessary to provide the second support part 120 on each of the extending (e.g., four) arm parts 160, which is beneficial in that the configuration can be simplified. As shown in FIG. 2, the rotating part 35 may have a motor 36, a first rotating part 31 rotated by the motor 36, and a second rotating part 32 connected to the first rotating part 31 via a belt 37 and rotating together with the first rotating part 31.

[0042] The tip 112a of the first support 110 may be tapered continuously or intermittently. In FIG. 10, the tip 112a of the first support 110 has R and is semicircular in a vertical section cut along a plane including the center in the in-plane direction of the top of the tip 112a of the first support 110 and including the first direction and the direction in which the tangent (see FIG. 6) of the substrate W extends at the center position in the width direction of the first support 110 (the third direction in FIG. 2). In FIG. 10, the pencil cleaning member 11a is moved toward the front surface side of the paper. The opening degree in the open state may be small, and the tip 112a of the first support 110 in the open state may be opened only about 1 to 2 mm compared to the closed state (see the opening degree in the left-right direction in FIG. 9). If the opening angle is this small, it is possible that the tip 112a of the first support part 110 will get caught on the substrate W when removing it, but even if this occurs, the force pulling up the substrate W may cause the tip 112a of the first support part 110 to open and escape.

[0043] The tip 112a of the first support 110 may be inclined toward the inner periphery (see FIG. 8), or may be intermittently inwardly protruding toward the inner periphery. In this embodiment, the "tip 112a" of the first support 110 includes at least a region located on one side of the substrate W, and typically means a region of about 1 mm from the end of the first support 110 on one side. The inner peripheral side surface near the tip 112a of the first support 110 may have a notch 112b. The notch 112b may have a first inclined portion 1121 that is continuously inclined toward the outer periphery toward one side, and a second inclined portion 1122 that is continuously inclined toward the inner periphery toward the one side from the first inclined portion 1121 (see FIGS. 6 to 8). When the first support 110 is in the closed state, the inner peripheral surface of the second inclined portion 1122 comes into contact with one side of the substrate, or one side and the side. In the present embodiment, the "periphery of the substrate W" means a region within 5% of the radius of the substrate from the outer edge E (the outermost position) of the substrate W when the substrate W has a circular shape like a wafer. In the present embodiment, the "side surface" means a surface extending in a direction that coincides with the thickness direction (first direction) of the substrate W, and if it deviates even slightly from the direction (first direction), it constitutes one side or the other side. In the embodiment shown in FIG. 8, the portion that is approximately arc-shaped in the vertical section becomes the bevel portion Wb, and even in this bevel portion Wb, in the portion that is inclined with respect to the first direction, the surface on one side of the center in the thickness direction of the substrate W becomes the one side, and the surface on the other side of the center in the thickness direction of the substrate W becomes the other side. The shape of the bevel portion Wb is various, and any shape (including a polygonal shape) that has been used conventionally can be adopted. As described above, the vertical section may be arc-shaped, or may be rectangular as shown in JP 2010-162624 A, or may be an embodiment in which the vertical section is close to a triangle. The contact length between the substrate W and the first supporting portion 110 may be 20% to 100% of the width Z of the first supporting portion 110 (see FIG. 10).

[0044] The apex or top surface of the tip 112a of the first support 110 may be located on one side of the substrate W at a position 0.5 mm or less from the one side of the substrate W, and may hardly protrude toward the one side of the substrate W. In the conventional embodiment, the apex or top surface of the tip 112a of the first support 110 generally protrudes about 1.0 mm from the one side of the substrate W, but in the embodiment of the present invention, the protrusion amount is significantly smaller. D1 in Figs. 8 and 9 is the amount of the tip 112a of the first support 110 protruding from the one side of the substrate W, but this D1 may be set to 0.5 mm or less. The apex or top surface of the tip 112a of the first support 110 may be located on one side of the substrate W at a position 0.4 mm or less, more specifically 0.3 mm or less, from the one end of the one side of the substrate W. The lower limit may be 0.1 mm. However, considering the case where only the bevel portion Wb is contacted, the apex or top surface of the tip portion 112a of the first support portion 110 may be located on the other side of one end portion of one surface of the substrate W (D1 in FIG. 8 may be negative). When the width of the first support portion 110 along the rotation direction of the substrate W is narrow, the tip portion 112a of the first support portion 110 becomes the apex, and when the tip portion 112a of the first support portion 110 is relatively large, the tip portion 112a of the first support portion 110 becomes the top surface. The top surface may be a flat surface.

[0045] In the closed state, the tip 112a of the first support part 110 overlaps with the substrate W in the in-plane direction, but the amount of overlap may be small. The amount of overlap between the tip 112a of the first support part 110 and the substrate W in the in-plane direction is shown as D2 in Fig. 8, but this D2 may be, for example, 0.7 mm or less, or more specifically, 0.5 mm or less, or even more specifically, 0.4 mm or less. The lower limit may be 0.1 mm.

[0046] The swinging of the first support part 110 may be realized by a magnetic force. However, the invention is not limited to such an embodiment, and the first support part 110 may be swung by applying a physical force by contact. Note that the substrate support mechanism 100 may employ a conventional gripping part.

[0047] 9, the first support portion 110 may have a first extension portion 111 extending along the in-plane direction of the substrate W, a second extension portion 112 extending from the first extension portion 111 to one side, and a bent portion 113 provided between the first extension portion 111 and the second extension portion 112. The tip of the second extension portion 112 becomes the tip portion 112a of the first support portion 110 described above, and the contact area described above is provided. On the other hand, the end of the second extension portion 112 becomes the base end portion of the first support portion 110. The first extension portion 111 may be located on the other surface side of the substrate W, and extend linearly from the rotation center of the rotated portion 20 toward the outer periphery on the other surface side of the substrate W.

[0048] A plurality of arm portions 160 extending from the rotation center of the rotated part 20 toward the outer periphery in the in-plane direction may be provided on the other surface side of the substrate W. In the embodiment shown in Fig. 3, four arm portions 160 are provided.

[0049] As shown in FIG. 4A and FIG. 4B, a first magnet 151 may be provided on the first extension portion 111. A second magnet 152 may be provided between the substrate W and the first extension portion 111 at a position facing the first magnet 151. As an example, the second magnet 152 may be provided inside the arm portion 160 described above. A repulsive force between the first magnet 151 and the second magnet 152 may be applied to the swinging force toward the inner periphery of the contact area. Specifically, the base end portion of the first extension portion 111 receives a downward force due to a force that moves the first magnet 151 away from the second magnet 152, and as a result, the tip portion 112a of the second extension portion 112 receives a force that moves toward the inner periphery. In this case, the swinging shaft 130 may be provided on any of the first extension portion 111, the second extension portion 112, and the bent portion 113. The first magnet 151, the second magnet 152, and the third magnet 143 described later may have a diameter of, for example, about 10 to 20 mm and a thickness of about 3 to 7 mm. The gripping force (supporting force) of the first support part 110 realized by the repulsive force between the first magnet 151 and the second magnet 152 is about 5 to 15 N, and preferably 8 N or more.

[0050] There may be only one pair of the first magnet 151 and the second magnet 152, but multiple pairs may be provided. As an example, the same number of arm parts 160 and first support parts 110 may be provided. In this case, the second magnet 152 may be provided on each arm part 160, and the first magnet 151 may be provided on each first support part 110, and these second magnets 152 and first magnets 151 may be provided in pairs. Each first support part 110 may be fixed to each arm part 160, and the support part may be rotated by rotating the rotating part 35 by the rotating part 35. In the embodiment shown in FIG. 4A and FIG. 4B, the first support part 110 is fixed to the arm part 160 via the swing shaft 130 so as to be swingable. More specifically, the second extension 112 of the first support 110 is provided passing through a through hole 162 provided in the arm 160, and the first support 110 is fixed to the arm 160 via the swing shaft 130 in the through hole 162 so as to be swingable relative to the arm 160. When the swing shaft 130 is provided in the through hole 162 and the distance from the substrate W in the normal direction of the substrate W becomes long, the tip 112a of the first support 110 can be swung with a long radius, and the movement can be made to approach a movement along the in-plane direction of the substrate W (for example, a horizontal movement). Therefore, the substrate W can be reliably gripped while reducing the protruding amount D1 of the substrate W to one side. In addition, when such an embodiment is adopted, it is also beneficial in that the plurality of first support parts 110 are less likely to be misaligned in the height direction.

[0051] The first magnet 151 and the second magnet 152 may rotate together with the substrate W when the substrate W rotates. In the embodiment shown in Figures 4A and 4B, the arm unit 160 is rotated by the rotating unit 35, so that the second magnet 152 provided in the arm unit 160 and the first magnet 151 fixed to the arm unit 160 so as to be able to swing are rotated together with the arm unit 160.

[0052] The arm portion 160 may be provided with a second support portion 120. In the embodiment shown in FIG. 4A and FIG. 4B, the second support portion 120 is provided on one surface of the arm portion 160, and the second support portion 120 extends linearly along the first direction. The same number of arm portions 160 and second support portions 120 may be provided, and the second support portion 120 may be provided on each arm portion 160. The apex or top surface of the second support portion 120 abuts against the other surface (rear surface) of the substrate W. Note that the first support portions 110 and the second support portions 120 may correspond to each other one-to-one and may be provided in the same number, but this is not limited to such an embodiment, and the number of the first support portions 110 and the second support portions 120 may be different.

[0053] The first support part moving part 140 may be located on the other side of the first extension part 111, and may move the tip part 112a of the second extension part 112 outward from the periphery by moving the first extension part 111 to one side. For example, the abutting part 141 of the first support part moving part 140 may abut against the other surface of the first extension part 111, thereby moving the first extension part 111 to one side (see Figs. 5A and 5B). Also, a third magnet 143 may be provided on the first support part moving part 140, and the first magnet 151 may receive a repulsive force due to a magnetic force from the third magnet 143, thereby moving the first extension part 111 to one side (see Figs. 4A and 4B). The first support part moving part 140 may be provided in the same number as the arms. Then, each first support part moving part 140 may be provided corresponding to each arm part 160. However, this is not limited to such an embodiment, and a smaller number of first support part moving parts 140 (typically one) than the arm parts 160 may be provided, or the first support part moving parts 140 may be continuously arranged in a circumferential shape when viewed in a plane, and as the first support part moving part 140 moves to one side, each of the multiple first extension parts 111 may be moved to one side simultaneously.

[0054] A moved portion 180 is provided on the other surface side of the arm portion 160, and a moving portion 170 that moves the moved portion 180 along the first direction may be provided. In the embodiment shown in Fig. 2, a moving portion 170 made of an actuator or the like is provided on the other surface side of the moved portion 180, and the moved portion 180 can be moved along the first direction by the moving portion 170. The moved portion 180 has a ring shape, for example, and may be an unclamping ring.

[0055] When the substrate W rotates, the multiple first support parts 110 may be in an open state randomly or in order. Furthermore, when the substrate W rotates, the multiple first support parts 110 may change in supporting force randomly or in order. As an example, only one non-rotating first support part moving part 140 provided with a third magnet 143 may move to one side, and when the rotating first extension part 111 passes on one side of the first support part moving part 140, the first extension part 111 may move to one side, and the tip part 112a of the second extension part 112 may be in an open state or the supporting force of the tip part 112a of the second extension part 112 on the substrate W may be weakened. However, this is not limited to this embodiment, and the first support part moving part 140 may be provided corresponding to each arm part 160 (and therefore rotated together with the arm part 160), and in response to a command from the control part 50, the first support part moving part 140 may move to one side randomly or in a fixed order, thereby weakening the supporting force of the substrate W by the tip part 112a of the second extension part 112.

[0056] When the rotation stops, the in-plane rotation stop position of first magnet 151 may be detected in order to match the in-plane position of third magnet 143 with the in-plane position of first magnet 151. At this time, position control by a servo motor may be used.

[0057] When four or more first support parts 110 are provided, at a certain time, three or more first support parts 110 may support the substrate W, but the remaining first support parts 110 may not support the substrate W. Also, at a certain time, the supporting forces of the three first support parts 110 may be equal to or greater than a threshold, and the supporting forces of the remaining first support parts 110 may be less than the threshold. In the above-mentioned example in which only one non-rotating first support part moving part 140 provided with the third magnet 143 moves to one side, and when the rotating first extension part 111 passes on one side of the first support part moving part 140, the first extension part 111 moves to one side, and when the first extension part 111 moves to the one side, the first support part 110 including the first extension part 111 becomes in an open state or the supporting force for the substrate W becomes less than the threshold, and the other first support parts 110 continue to support the substrate W, and the supporting force becomes equal to or greater than the threshold. In addition, in an example in which a first support part moving part 140 is provided corresponding to each arm and moves to one side randomly or in a fixed order in response to a command from the control part 50, the first support part 110 having the first extension part 111 corresponding to the first support part moving part 140 moved to one side in response to a command from the control part 50 will be in an open state or the supporting force of the first support part 110 on the substrate W will be less than the threshold value, and the other first support parts 110 will continue to support the substrate W and their supporting force will be equal to or greater than the threshold value.

[0058] As shown in Fig. 3, in this embodiment, four substrate support mechanisms 100 may be evenly arranged (at an angle of 90° around the center of rotation). The number of substrate support mechanisms 100 may be, for example, three, as long as they can stably support the substrate W. Fig. 2 shows an example in which the substrate W is supported in the horizontal direction, but this is not limited thereto. For example, the substrate W may be supported in the vertical direction (vertical direction), or the substrate W may be supported at an angle to the horizontal direction.

[0059] "method" An example of a method for cleaning a substrate W (substrate processing method) using the substrate cleaning apparatus of this embodiment is as follows. Note that, although it will be briefly explained since it overlaps with the above, all aspects described in the "structure" above can be applied to the "method". Conversely, all aspects described in the "method" can be applied to the "structure". Furthermore, a program for implementing the method of this embodiment may be recorded on a recording medium such as a USB, and the method of this embodiment may be implemented in the substrate processing apparatus by reading this recording medium with a computer (not shown). The recording medium may be a non-transitory tangible computer-readable recording medium.

[0060] First, the substrate W transferred into the housing 5 by the transfer unit 324 or the second transfer robot 326 is supported by the substrate supporting mechanism 100. At this time, the cleaning part 10 is located at the standby position.

[0061] At this time, the first support part moving part 140 is located on one side, and as a result, the first support part 110 is in an open state. Then, the second support part 120 abuts against the other side of the substrate W, and then the first support part moving part 140 moves to the other side, causing the first support part 110 to enter a closed state, and the substrate W is supported by the substrate support mechanism 100.

[0062] Next, the rotated part 20 is rotated by the motor 36 of the rotating part 35 or the like, and as a result, the substrate W supported by the substrate supporting mechanism 100 is rotated.

[0063] While the substrate W is being rotated, a chemical solution is supplied from a chemical solution supply nozzle 91 to one side of the substrate W. While the chemical solution is being supplied in this manner, one side of the substrate W is physically cleaned (scrubbed) by being pressed with a predetermined pressing force by a pressing means of the cleaning member, not shown, by a cleaning member 11 such as a roll cleaning member 11b or a pencil cleaning unit 11a, which is rotated at a predetermined rotation speed by a rotating means of the cleaning member, not shown (a rinse liquid such as pure water may be supplied from the rinse liquid supply nozzle 93 instead of the chemical solution). When the pencil cleaning unit 11a is used as an example, an arm 15, which is an example of a swinging unit (cleaning member swinging unit), is swung around a swinging shaft (not shown) as shown in FIG. 13. The pencil cleaning unit 11a is swung by the arm 15 to the outside of the periphery of the substrate W. At this time, the pencil cleaning unit 11a may be swung to the outside of the periphery of the substrate W without being stopped in front of the first support unit 110. In the present application, "the cleaning member 11 is swung outward from the peripheral edge of the substrate W" means that at least a part of the cleaning member 11 is swung outward beyond the peripheral edge of the substrate W.

[0064] When cleaning the substrate W in this manner, only one of the first support part moving parts 140 that does not rotate and is provided with a third magnet 143 may move to one side, and the first support part 110 passing on one side of the third magnet 143 may be in an open state or the supporting force of the first support part 110 on the substrate W may be less than a threshold value.

[0065] When cleaning by the pencil cleaning unit 11 is completed, the pencil cleaning unit 11 is moved away from the substrate W. Then, simultaneously with or immediately before the supply of the chemical liquid is stopped, the fluid jet nozzle 92 is positioned in close proximity to the substrate W, and the two-fluid is sprayed from the fluid jet nozzle 92 onto one side of the substrate W. The two-fluid nozzle may be an external mixing type nozzle in which liquid and gas are mixed outside the casing of the two-fluid nozzle to form droplets of the liquid. Alternatively, it is also possible to use an internal mixing type nozzle in which liquid and gas are mixed inside the nozzle to form droplets of the liquid as the two-fluid nozzle.

[0066] While the two fluids are being sprayed in this manner, the fluid jet nozzle 92 is mounted on an arm similar to the arm 15 on which the pencil cleaning unit 11 is mounted, and is swung around the swing axis, so that the fluid jet nozzle 92 passes through the center of the substrate W and is moved to the outer periphery of the substrate W.

[0067] Simultaneously with or immediately before the two-fluid jet cleaning is stopped, a chemical liquid is supplied to one surface of the substrate W from the chemical liquid supply nozzle 91.

[0068] Next, a rinsing liquid is supplied from the rinsing liquid supply nozzle 93 to one side of the substrate W. After a time for the rinsing liquid to reach the substrate W or a sufficient time has elapsed, the supply of the chemical liquid from the chemical liquid supply nozzle 91 is stopped. Whether or not a time for the rinsing liquid to reach the substrate W has elapsed may be determined based on a time measured in advance. In this case, for example, the control unit 50 may read out a recipe stored in the storage unit 60, thereby stopping the supply of the chemical liquid at a scheduled timing.

[0069] After one surface of the substrate W is cleaned with the rinsing liquid for a predetermined time, the rotation of the substrate W is stopped. More specifically, the rotation of the rotated part 20 by the rotating part 35 is stopped, and as a result, the rotation of the substrate W supported by the substrate supporting mechanism 100 is stopped.

[0070] The substrate W in a wet state is taken out of the housing 5 by the second transport robot 326 or the third transport robot 328. When the substrate W is thus taken out, the first support part moving part 140 is positioned on one side, and as a result, the first support part 110 is in an open state.

[0071] In the case of finish cleaning, in which the substrate W has been cleaned in the second cleaning unit 318, the substrate W may be taken out of the housing 5 by the third transport robot 328 and transported into the drying unit 320. Then, when the substrate W is transported into the drying unit 320 in this manner, the substrate W is dried by the drying unit 320.

[0072] After cleaning with rinsing, the supply of the rinsing liquid from the rinsing liquid supply nozzle 93 may be stopped, and the substrate W supported by the substrate support mechanism 100 may be rotated at high speed to shake off the rinsing liquid and dry the substrate.

[0073] In the above, a mode in which only one side of the substrate W is cleaned has been described, but the present invention is not limited to such a mode, and a mode in which both one side and the other side of the substrate W are cleaned simultaneously may be adopted. In this case, the pencil cleaning member 11a may be positioned between the arm part 160 and the back surface of the substrate W. Also, as shown in JP 2019-003977 A, a rotating part that rotates the rotated part may be provided outside the periphery of the rotated part. More specifically, the rotating part may be a stator, the rotated part may be a rotor, and the rotated part may be rotated in a non-contact state by magnetic force. In this case, the rotated part may have a magnet, and the rotating part may have a coil or a coil and a magnet. In this case, the rotating part and the rotated part constitute a so-called bearingless motor that can rotate the rotated part while controlling its position in the in-plane direction in a non-contact manner without supporting it with a bearing.

[0074] In the above description, the pencil cleaning member 11a has been used as an example of the cleaning member 11, but the present embodiment is not limited to this, and cleaning using a roll cleaning member 11b (see FIG. 14) may be used. In this case, the roll cleaning member 11b may be positioned between the arm portion 160 and the back surface of the substrate W so that both surfaces of the substrate W can be cleaned.

[0075] "effect" Next, the actions and effects of the present embodiment having the above-mentioned configuration will be described, focusing on those that have not been described yet. Note that the aspects described in the "Effects" section can also be applied to the above-mentioned "Configuration".

[0076] When using a first support part 110 that is swingable and has a contact area capable of contacting the periphery of one side of the substrate W in a closed state, and a second support part 120 that supports the other side of the substrate W, it is possible to support one side (front surface) of the substrate W by the first support part 110 while supporting the other side of the substrate W by the second support part 120. This allows the configuration of the first support part 110 to be simplified.

[0077] Moreover, by adopting the above-mentioned configuration, it is also possible to adopt an embodiment in which the protrusion amount D1 of the first supporting part 110 toward one side of the substrate W is reduced. In other words, even if an embodiment in which the protrusion amount D1 of the first supporting part 110 toward one side of the substrate W is reduced is adopted, the substrate W can be firmly gripped. For example, the apex or top surface of the tip part 112a of the first supporting part 110 can be positioned on one side at a position 0.5 mm or less, 0.3 mm or less, 0.25 mm or less, etc., from the viewpoint of stably fixing the substrate W and reducing the amount of contact between the cleaning member 11 and the first supporting part 110. Note that it is preferable that the protrusion amount D1 is 0.2 mm or less. When the above-mentioned embodiment is adopted, the amount of protrusion D1 from the substrate W to one side can be reduced, and even when the pencil cleaning member 11a is moved all the way outward from the periphery of the substrate W or the roll cleaning member 11b cleans the substrate W including its periphery, the amount of contact between the cleaning member 11, such as the pencil cleaning member 11a or the roll cleaning member 11b, and the first support portion 110 can be reduced. This makes it possible to prevent the cleaning member 11 from coming off or to prevent the support or grip of the substrate W by the support mechanism from coming off. Furthermore, according to this embodiment, the life of the cleaning member 11 can be extended, and the generation of dust due to wear of the cleaning member 11 can be suppressed. From this viewpoint, the outer surface of the tip 112a of the first support part 110 on the side opposite to the substrate W side (outer peripheral side) has a rounded or curved surface without corners, and a vertical section cut along a plane including the center in the in-plane direction of the top of the tip 112a of the first support part 110 and including the first direction and the direction in which the tangent to the substrate W (see FIG. 6) at the center position in the width direction of the first support part 110 extends (third direction in FIG. 2) is preferably approximately semicircular or semicircular. By adopting such a shape, wear of the cleaning member 11 can be suppressed even if the cleaning member 11 comes into contact with the tip 112a of the first support part 110 rotating at high speed from its side (left or right side in FIG. 10). The top of the tip 112a of the first support part 110 does not have a surface such as a flat surface, and the top may be a point (vertex).In a mode in which the top of the tip 112a of the first support part 110 is a surface, the side of the tip 112a may be an arc whose width increases toward the other side when viewed in a vertical section including the center of the top of the tip 112a. In addition, when the tip of the tip 112a is a point (vertex), the tip 112a may be semicircular when viewed in a vertical section including the center of the top of the tip 112a. In addition, by moving the pencil cleaning member 11a all the way outward from the periphery of the substrate W or cleaning the substrate W including the periphery with the roll cleaning member 11b, it is possible to meet the recent need to clean the substrate W up to the periphery. The width of the first support part 110 in the rotation direction of the substrate W (see Z in FIG. 10) may be 10 mm or more, or may be 11 mm or more. By setting the width at a certain level or more, it is advantageous in that a smooth R without corners can be formed.

[0078] A partition such as a fixed cup or a rotating cup may be provided outside the periphery of the substrate W to prevent the cleaning liquid from splashing. When a fixed cup is provided, a notch may be provided at a predetermined location of the fixed cup, and the pencil cleaning member 11a that oscillates within a plane may pass through the notch. The pencil cleaning member 11a may also move to just before the fixed cup or the rotating cup. When it is important to completely shake off the cleaning liquid outside the periphery of the substrate W, a mode in which a rotating cup is not provided may be adopted.

[0079] It is possible to suction the back surface of the substrate W in order to clean the periphery of the substrate W, but in this case, the back surface of the substrate cannot be cleaned. Furthermore, in the case where the back surface of the substrate is suctioned, roll cleaning is required after the cleaning process. In order to efficiently clean the substrate W, generally, one roll cleaning with a large cleaning area is performed followed by one pencil cleaning with a small cleaning area, so it is not preferable to perform roll cleaning after pencil cleaning. Therefore, being able to clean the periphery and back surface of the substrate W as in this embodiment brings about a very beneficial effect.

[0080] It is also beneficial in that wear of the cleaning member 11 can be suppressed even when the width of the tip 112a of the first support part 110 is continuously narrowed. The tip 112a does not have a circular shape in the vertical section as described above, and may have a shape such as a cone or a truncated cone, but from the viewpoint of suppressing wear of the cleaning member 11, it is beneficial that the tip 112a of the first support part 110 has a rounded R without corners and has a semicircular shape in the vertical section cut in the rotation direction of the substrate W (a vertical section cut by a plane including the center in the in-plane direction of the top of the tip 112a of the first support part 110 and including the first direction and the direction in which the tangent to the substrate W at the center position in the width direction of the first support part 110 (see FIG. 6) extends (the third direction in FIG. 2)).

[0081] When the first supporting part 110 has a contact area that contacts only one surface or one surface and a side surface of the substrate W and is configured not to contact the other surface of the substrate W, it is possible to prevent the other surface (rear surface) of the substrate W from coming into contact with the first supporting part 110, and to prevent the generation of dust due to such contact. Furthermore, by adopting such a configuration, it is possible to form a space on the other surface side of the periphery of the substrate W, which has a beneficial effect in terms of miniaturizing the device.

[0082] According to an embodiment in which the second support part 120 is provided on a straight line connecting the first support part 110 and the center of rotation of the rotated part 20, a balance can be achieved between support of one side of the substrate W by the first support part 110 and support of the other side of the substrate W by the second support part 120, thereby reducing the possibility of the substrate W tilting unexpectedly.

[0083] When the tip 112a of the first support part 110 protrudes at an angle toward the inner periphery, the inner surface of the first support part 110 swinging inward can be reliably brought into contact with the substrate W, thereby preventing the position of the substrate W from shifting relative to the first support part 110.

[0084] When the swinging of the tip 112a of the first support part 110 toward the inner periphery is realized by magnetic force, there is no need for contact between members when the first support part 110 is closed, or the number of members that come into contact can be reduced. Although there is a risk of dust being generated when members come into contact, this embodiment can reduce this risk. Furthermore, when a mechanical configuration is used, if a chemical solution gets in, it cannot be completely removed by cleaning, which can become a source of defects, but the use of a magnet can prevent such a situation from occurring.

[0085] The first support portion 110 has a first extension portion 111 extending along the in-plane direction of the substrate W, a second extension portion 112 extending to one side from the first extension portion 111, and a bent portion 113 provided between the first extension portion 111 and the second extension portion 112.When an embodiment is adopted in which the first extension portion 111 is located on the other side of the substrate W, a member for opening or closing the first support portion 110 can be positioned on the other side and inner side of the substrate W, thereby preventing the device from becoming large in the peripheral direction.

[0086] When a mode is adopted in which a first magnet 151 is provided on the first extension portion 111 and a second magnet 152 is provided between the substrate W and the first extension portion 111 at a position facing the first magnet 151, the first magnet 151 and the second magnet 152 for closing the tip portion 112a of the first support portion 110 can be provided as a pair. This makes it possible to more reliably open and close the tip portion 112a of the first support portion 110.

[0087] When a plurality of pairs of first magnets 151 and second magnets 152 are provided, the opening and closing of tip portion 112a of first support portion 110 can be performed more reliably in each pair.

[0088] The tip of the second support part 120 has a rounded corner, and when the tip of the second support part 120 has a semicircular shape in a vertical section cut along a plane including the center in the in-plane direction of the top of the tip of the second support part 120 and including the first direction and the direction in which the tangent (see FIG. 6) of the substrate W extends at the center position in the width direction of the first support part 110 closest to the second support part 120 (the third direction in FIG. 2) (see FIG. 6), the contact area between the tip of the second support part 120 and the other surface (rear surface) of the substrate W can be reduced, making it difficult for the rear surface of the substrate W to be contaminated and reducing liquid pools. In addition, as described above, the semicircular shape can prevent the pressure on the rear surface of the substrate W from becoming too strong. When the tip of the second support part 120 is tapered, the cleaning liquid for cleaning the substrate W is less likely to hit the second support part 120, which is also beneficial in preventing liquid splashing. Incidentally, by tapering only the tip end and making the base end located on the lower side thicker, it is also advantageous in that the rigidity when supporting the rear surface of the substrate W can be ensured.

[0089] In the case where a first support part moving part 140 is provided which is located on the other side of the first extension part 111 and moves the first extension part 111 to one side to move the tip part 112a of the second extension part 112 outward from the periphery, the tip part 112a of the second extension part 112 can be opened by simply moving the first support part moving part 140 to one side. Since the first extension part 111 is located on the inner side of the substrate W, the first extension part 111 can be moved downward about the oscillation shaft 130 by the centrifugal force applied to the first extension part 111, and a supporting force (gripping force) for the substrate W can be applied. If the first extension part 111 is located on the outer side of the substrate W, the first extension part 111 moves downward about the oscillation shaft 130, and a force in a direction away from the substrate W acts, and the supporting force (gripping force) for the substrate W is weakened.

[0090] A third magnet 143 is provided on the first support part moving part 140, and the first magnet 151 receives a repulsive force due to a magnetic force from the third magnet 143. As a result, when the first extension part 111 is moved to one side, the tip part 112a of the first support part 110 can be opened without contact between the first support part moving part 140 and the first extension part 111. This makes it possible to suppress the generation of dust.

[0091] When the first support part moving portion 140 is arranged continuously in a circumferential shape in a plan view, the first support part 110 can be put into the open state by simply moving the first support part moving portion 140 to one side regardless of the position of the first support part 110 (when multiple first support parts 110 are provided, multiple first support parts 110 can be put into the open state at the same time).

[0092] When the substrate W is rotated, if the multiple first supporting parts 110 are opened randomly or in sequence, or if a mode in which the supporting force changes is adopted, it is possible to pour a cleaning liquid between the first supporting parts 110 and the substrate W, and it is advantageous in that the area supported by the first supporting parts 110 can be cleaned. If they are opened, it is advantageous in that the cleaning liquid can be reliably poured in. Even if the supporting force becomes weak, it is possible to pour a certain amount of cleaning liquid. Note that from the viewpoint of pouring the cleaning liquid while more reliably supporting the substrate W, it is advantageous to have the supporting force of the first supporting parts 110 change randomly or in sequence.

[0093] Furthermore, in a mode for performing physical cleaning (scrubbing cleaning), in which the multiple first support portions 110 thus provided are opened randomly or sequentially, or in which the supporting force changes, when the first support portions 110 are opened, even the outer edge E of the substrate W can be reliably scrubbed, and not only the substrate surface but also at least the upper surface of the bevel portion Wb can be effectively cleaned.

[0094] When four or more first support parts 110 are provided and three or more first support parts 110 are supporting the substrate W at a given time, this is beneficial in that it more reliably prevents the substrate W from shifting due to the other first support parts 110 being in an open state or the supporting force of the first support parts 110 weakening.

[0095] Second embodiment Next, a second embodiment of the present invention will be described.

[0096] In the above, the first support portion 110 has a first extension portion 111 extending along the in-plane direction of the substrate W and a second extension portion 112 extending from the first extension portion 111 to one side, but in this embodiment, the first support portion 110 has a first direction extension portion 116 extending along the normal direction of the substrate W. When such a configuration is adopted, the cleaning liquid and the like can easily flow to the other side, which is beneficial in that liquid pools are less likely to occur. The other configurations are the same as those of the above embodiments, and any of the aspects described in the above embodiments can be adopted. The members described in the above embodiments will be described using the same reference numerals.

[0097] In this embodiment, the first support part moving part 140 is provided outside the first support part 110, and is configured so that the first support part 110 is put into an open state when the first support part moving part 140 approaches or abuts the first support part 110.

[0098] In the aspect shown in Figure 11, when the first support part moving part 140 moves inward, the abutment part 141 of the first support part moving part 140 abuts against the outer surface of the first support part 110, and the first support part 110 becomes in the open state.

[0099] As shown in FIG. 12, two first magnets 151 may be provided in the first support part 110. More specifically, the first magnet 151 may have a first inner magnet 1511 provided on the inner side for closing the first support part 110 by a repulsive force with the second magnet 152, and a first outer magnet 1512 provided on the outer side for opening the first support part 110 by a repulsive force with the approaching third magnet 143. The first inner magnet 1511 on the inner side closes the first support part 110 by a repulsive force with the second magnet 152. On the other hand, the first outer magnet 1512 on the outer side moves inward by a magnetic force from the approaching third magnet 143, and as a result, the first support part 110 opens. In this embodiment, when the third magnet 143 moves inward and approaches the first outer magnet 1512, the repulsive force between the third magnet 143 and the first outer magnet 1512 becomes greater than the repulsive force between the second magnet 152 and the first inner magnet 1511.

[0100] In the first embodiment (Figures 5, 6, etc.) and the second embodiment (Figures 11 and 12), the upper part of the second support part 120 is curved (semicircular in cross section), but this is not limited to this form, and the upper part may be a flat surface (parallel to the other side of the substrate W) when it is desired to provide more stable support for the other side (rear side) of the substrate W.

[0101] The above-mentioned description of the embodiment and the disclosure of the drawings are merely examples for explaining the invention described in the claims, and the above-mentioned description of the embodiment or the disclosure of the drawings do not limit the invention described in the claims. For example, a substrate processing apparatus having a substrate cleaning apparatus according to the present invention may include a bevel polishing apparatus for polishing an edge of a substrate W, a back polishing apparatus for polishing a back surface of a substrate W, or a substrate W plating apparatus for forming a metal film on a surface of a substrate W. In addition to a semiconductor substrate W, the substrate W in the present invention may include various substrates W such as glass substrates W for liquid crystal displays (LCDs), plasma displays (PDPs), organic light emitting diodes (OLEDs), field emission displays (Field Emission Displays), vacuum fluorescent displays (VFDs), solar cell panels, glass for magnetic and optical disks, and ceramic substrates W. [Explanation of symbols]

[0102] 100 Board support mechanism 110 First support part 111 First extension part 112 Second extension part 120 Second support part 140 First support part moving part 143 Third magnet 151 First magnet 152 Second magnet W substrate

Claims

1. a first support portion having a contact area capable of contacting a peripheral edge of one surface of the substrate in a closed state; A second support portion that supports the other surface of the substrate; a first support portion moving portion that moves the first support portion from an open state to a closed state; Equipped with the first support portion has a first extension portion extending along an in-plane direction of the substrate and a second extension portion extending from the first extension portion to one side, The contact area is provided at a tip of the second extension portion, the first extension portion is located on the other surface side of the substrate, The first support portion is swung to a closed state, A first magnet is provided on the first extension, a second magnet is provided between the substrate and the first extension portion at a position facing the first magnet; A substrate support mechanism, wherein a rocking force toward an inward peripheral edge of the contact area is applied by a repulsive force between the first magnet and the second magnet.

2. The substrate support mechanism according to claim 1 , wherein the first support portion does not contact the other surface of the substrate.

3. The substrate support mechanism according to claim 1 , wherein the second support portion is provided on a straight line connecting the contact area and a center point of the substrate in an in-plane direction.

4. The substrate support mechanism according to claim 1 , wherein a width of a tip of the first support portion continuously narrows.

5. The substrate support mechanism according to claim 1 , wherein a tip of the first support portion projects inwardly from a periphery at an incline.

6. The substrate support mechanism according to claim 1 , wherein an apex or a top surface of a tip of the first support portion is located on one side of the substrate at a position not more than 0.5 mm from the one surface of the substrate.

7. There are a plurality of pairs of first magnets and second magnets, The substrate support mechanism of claim 1 , wherein the first magnet and the second magnet rotate with the substrate as the substrate rotates.

8. a plurality of arm portions provided on the other surface side of the substrate and extending outwardly toward a periphery in an in-plane direction; The substrate support mechanism according to claim 7 , wherein the second magnet is provided on the arm portion.

9. The substrate supporting mechanism according to claim 8 , wherein the second supporting portion is provided on the arm portion.

10. A substrate support mechanism as described in any one of claims 1 to 9, wherein the first support moving portion is located on the other side of the first extension portion, and by moving the first extension portion to one side, the tip of the second extension portion is moved outwardly from the periphery.

11. A plurality of first support portions are provided, The substrate supporting mechanism according to claim 1 , wherein the first supporting parts are opened randomly or in sequence during rotation of the substrate.

12. Four or more first support portions are provided; The substrate support mechanism of claim 11 , wherein at any one time, three or more of the first supports support the substrate, while the remaining first supports do not support the substrate.

13. A substrate support mechanism according to any one of claims 1 to 12, a swinging unit for swinging a cleaning member for cleaning the substrate within a surface of the substrate; Equipped with The cleaning member is moved outwardly from the periphery of the substrate.

14. A method for cleaning a substrate using a substrate support mechanism according to any one of claims 1 to 12, comprising: supporting the other surface of the substrate by the second support portion; supporting a peripheral edge of one surface of the substrate by moving the first support portion from an open state to a closed state; rotating the substrate; applying a cleaning solution to the substrate; A method for cleaning a substrate comprising:

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