Holding table and cutting device

Abstract

To prevent the machining of a workpiece while a wrong holding table is installed to a machining device.SOLUTION: A holding table 20 is equipped with a holding portion that has a holding surface 24a sucking and holding a workpiece, and a frame body that supports the holding portion and has a channel communicating to a suction sources and transmitting suction force to the holding portion. On the holding surface of the holding portion, a code 24b is provided, which can be converted into predetermined information relating to the holding table. The code indicates any one of a manufacturing company name of the holding table, the size of the workpiece held by the holding table, a model number of the holding table, and an identification number of the holding table, when decoded.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a holding table having a holding surface that suction-holds a workpiece, and to a cutting device to which the holding table is attached. [Background technology]

[0002] Device chips are usually mounted on electronic devices such as mobile phones, personal computers, etc. When manufacturing device chips, for example, first, a plurality of planned division lines are set in a lattice pattern on the front surface of a disk-shaped wafer (workpiece), and devices such as ICs (Integrated Circuits), LSIs (Large Scale Integrations), etc. are formed in each of the rectangular areas partitioned by the plurality of planned division lines.

[0003] Then, the back side of the workpiece is ground and thinned by a grinding device, and the thinned workpiece is cut along each planned division line using a cutting device, laser processing device, etc., to divide the workpiece into individual device chips. The above-mentioned processing devices such as the grinding device, cutting device, and laser processing device are equipped with a chuck table (holding table) for suction-holding the workpiece during processing (see, for example, Patent Document 1).

[0004] There are several types of diameters of workpieces, each determined by a predetermined standard, such as 5 inches (about 125 mm), 6 inches (about 150 mm), 8 inches (about 200 mm), 12 inches (about 300 mm), etc. Therefore, a holding table of an appropriate size according to the diameter of the workpiece to be processed is appropriately selected and attached to the processing device.

[0005] Currently, holding tables are manufactured by various manufacturers, and the appearances of holding tables from all manufacturers are very similar, but there is not complete compatibility between holding tables manufactured by different manufacturers.

[0006] Therefore, for example, if a holding table manufactured by one manufacturer is mistakenly attached to a processing device manufactured by another manufacturer, the specified suction force or processing stability may not be obtained. Therefore, if a workpiece is processed with a holding table from a different manufacturer mistakenly attached, there is a problem that the processing quality may decrease.

[0007] Furthermore, even if the holding tables are manufactured by the same manufacturer, if, for example, a 6-inch holding table is installed when a 5-inch holding table should be installed and a workpiece is processed, the processing device may malfunction. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Publication No. 8-69985 Summary of the Invention [Problem to be solved by the invention]

[0009] The present invention has been made in consideration of the above problems, and an object of the present invention is to prevent a workpiece from being processed in a state where an incorrect holding table is attached to a processing device. [Means for solving the problem]

[0010] According to one aspect of the present invention, a holding table has a holding surface for suction-holding a workpiece. porous board and, A recess is provided and the recess is fixed to the recess. Applicable porous board and supports the device and is connected to a suction source. The support surface is the upper surface of the porous plate. a frame having a flow path for transmitting a suction force to the Upper surface of the porous plate is provided with a holding table having a code that can be converted into predetermined information relating to the holding table.

[0011] Preferably, when decoded, the code indicates at least one of the name of the manufacturer of the holding table, the size of the workpiece held by the holding table, the model number of the holding table, and the identification number of the holding table.

[0012] Also preferably, porous board The holding surface is further provided with at least one of a logo indicating a manufacturer, the size of the workpiece to be held by the holding table, the model number of the holding table, and an identification number of the holding table.

[0013] According to another aspect of the present invention, there is provided a cutting device to which a holding table is attached, the holding table comprising a porous plate having a holding surface for suction-holding a workpiece, a frame having a recess for supporting the porous plate fixed to the recess, and a flow path communicating with a suction source for transmitting a suction force to the holding surface, which is the upper surface of the porous plate, the upper surface of the porous plate being provided with a code that can be converted into predetermined information relating to the holding table, the cutting device comprising a cutting unit having a spindle for cutting the workpiece with a cutting blade attached to the spindle, a camera unit capable of acquiring an image of the code, and a reading unit for reading the code included in the image, a setup control unit that stores the position of the cut area where the setup has been performed to determine the reference height position of the cutting unit and the code including the identification number of the holding table when decoded in association with each other; A cutting device comprising:

[0015] In a preferred embodiment, the setup control unit identifies an uncut area of ​​the holding table where setup has not been performed based on a stored setup history, and executes setup in the uncut area. Effect of the Invention

[0016] According to one aspect of the present invention, a code that can be converted into predetermined information about the holding table is provided on the holding surface of the holding table. If the code is captured by a camera unit provided in the processing device and read by a computer provided in the processing device, the processing device can confirm the information about the holding table. Therefore, it is possible to prevent the processing of the workpiece when an incorrect holding table is attached to the processing device.

[0017] For example, if the decoded code indicates information indicating the name of the manufacturer of the holding table, the processing device can check whether it matches the name of the manufacturer of the processing device, thereby obtaining a predetermined suction force and a specified processing stability.

[0018] Furthermore, for example, if the decoded code indicates the size of the workpiece, the processing device can check whether the size of the holding table corresponds to the diameter of the workpiece to be processed, thereby preventing malfunction of the processing device. [Brief description of the drawings]

[0019] [Figure 1] FIG. [Diagram 2] FIG. 13 is a diagram showing how a workpiece is cut. [Diagram 3] FIG. [Figure 4] FIG. 4 is a top view of the outer periphery of the chuck table. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view of a cutting device 2. In Fig. 1, some of the components of the cutting device 2 are shown in functional blocks. Also, the X-axis direction (machining feed direction), the Y-axis direction (indexing feed direction), and the Z-axis direction (up-down direction, height direction) are perpendicular to each other.

[0021] An operation panel 4 is provided on the front side (one side in the Y-axis direction) of the cutting device 2. An operator can set cutting conditions and the like for the cutting device 2 by, for example, performing predetermined input via the operation panel 4.

[0022] A monitor 6 is provided on the front side of the cutting device 2. The monitor (display device) 6 displays a guide screen that guides the operator on operations, images captured by a camera unit 36 ​​(described later), and the like.

[0023] The monitor 6 may be a display input device (for example, a touch panel). In this case, the operation panel 4 is omitted. In the cutting device 2, a disk-shaped wafer (workpiece 11) made of a semiconductor material such as silicon is cut.

[0024] A plurality of planned division lines (streets) are set in a lattice pattern on the front surface 11a of the workpiece 11. Devices (not shown), such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations), are formed in each of the rectangular regions defined by the plurality of planned division lines.

[0025] An adhesive tape (dicing tape) 13 made of resin and having a larger diameter than the workpiece 11 is attached to the back surface 11b side of the workpiece 11. The workpiece 11 is attached to the center of the adhesive tape 13, and one surface of a metal ring-shaped frame 15 is attached to the outer periphery of the adhesive tape 13.

[0026] The workpiece 11, the adhesive tape 13 and the frame 15 constitute a workpiece unit 17. The workpiece 11 is transported, cut and cleaned in the form of this workpiece unit 17. The cutting device 2 has a rectangular plate-shaped cassette table 8 at a front corner.

[0027] A cassette 10 containing a plurality of workpiece units 17 is placed on the cassette table 8. The height of the cassette 10 is adjusted by an elevator 12 provided below the cassette table 8. Note that the approximate position of the elevator 12 is shown in FIG.

[0028] A first transport unit 14 is provided behind the cassette table 8 (the other side in the Y-axis direction). The first transport unit 14 transports the workpiece unit 17 out of the cassette 10 and transports the workpiece unit 17 into the cassette 10.

[0029] A pair of guide rails 16 for adjusting the position in the X-axis direction of workpiece unit 17 are provided on both sides of the movement path of first transport unit 14. A second transport unit 18 is provided in the vicinity of the pair of guide rails 16.

[0030] The second transport unit 18 has an arm that is substantially L-shaped when viewed from above. An adsorption mechanism is provided on one end of the arm, and a rotation mechanism that rotates the arm within the XY plane and a movement mechanism that moves the rotation mechanism up and down are provided on the other end of the arm.

[0031] The second transport unit 18 transports the workpiece unit 17 to a chuck table (holding table) 20 arranged in the carry-in / carry-out area, with the frame 15 being sucked by the suction mechanism. Here, the chuck table 20 will be described with reference to FIG. 2.

[0032] 2, the chuck table 20 has a disk-shaped frame 22 made of stainless steel or the like. A disk-shaped recess 22a is formed in the upper part of the frame 22. A disk-shaped porous plate (holding portion) 24 made of porous ceramics is fixed to the recess 22a.

[0033] The porous plate 24 is supported by the frame 22 while being fixed in the recess 22a. Pores are exposed on the upper surface 24a of the porous plate 24, but the upper surface 24a of the porous plate 24 and the upper surface 22b of the outer periphery of the frame 22 are substantially flush with each other to form a flat surface.

[0034] The upper surface 24a functions as a holding surface that sucks and holds the workpiece unit 17 (workpiece 11) by negative pressure, and the upper surface 22b functions as a support surface that supports the workpiece unit 17. A plurality of annular flow paths 22c are formed in a substantially concentric pattern at the bottom of the recess 22a.

[0035] The flow paths 22c are connected to each other via connecting flow paths (not shown) that are arranged in a cross shape when the frame 22 is viewed from above, and are further connected to a flow path 22d that is formed in the center of the recess 22a.

[0036] Flow path 22d is connected to a suction source 28 such as an ejector via a solenoid valve 26. When the suction source 28 is operated to open the solenoid valve 26, flow paths 22c and 22d communicate with the suction source 28, a negative pressure is transmitted to the porous plate 24, and a suction force is generated on the upper surface 24a.

[0037] The upper surface 24a is provided with a code 24b (see FIG. 3) that can be converted into predetermined information related to the chuck table 20. Fig. 3 is a top view of the chuck table 20. The code 24b in this embodiment is a two-dimensional code, but may be a one-dimensional code.

[0038] As the two-dimensional code, for example, a matrix type such as Data Matrix, QR Code (registered trademark), VeriCode, MaxiCode, etc. is used, but a stack type may also be used.

[0039] The code 24b is imaged by a camera unit 36 ​​(described later) of the cutting device 2, and read (i.e., decoded) in accordance with a predetermined standard using a computer or the like provided in the cutting device 2, allowing the cutting device 2 to confirm information regarding the chuck table 20.

[0040] The code 24b read by a computer or the like includes at least one of the name of the manufacturer of the chuck table 20, the size of the workpiece 11 to be suction-held by the chuck table 20, the model number of the chuck table 20, and the identification number of the chuck table 20.

[0041] For example, if the decoded code 24b indicates the name of the manufacturer of the chuck table 20, the cutting device 2 confirms whether the name of the manufacturer matches the name of the manufacturer of the cutting device 2 that is pre-registered in the cutting device 2.

[0042] If they match, a predetermined suction force is obtained in the chuck table 20, and further, a predetermined processing stability is obtained, thereby preventing a deterioration in cutting quality compared to when the manufacturer of the chuck table 20 and the manufacturer of the cutting device 2 are different.

[0043] Furthermore, for example, when the decoded code 24b indicates the size (e.g., diameter) of the workpiece 11 to be used with the chuck table 20, the cutting device 2 checks whether the size of the chuck table 20 corresponds to the diameter of the workpiece 11 to be cut, which is input via the operation panel 4 or the like. This makes it possible to prevent the cutting device 2 from malfunctioning.

[0044] It should be noted that even if the same manufacturer is involved, for example, due to improvements in the cutting device 2, the type of chuck table 20 that can be attached to the cutting device 2 may be restricted. Therefore, when the decoded code 24b indicates the model number of the chuck table 20, the cutting device 2 checks whether the chuck table 20 can be attached to the cutting device 2. This makes it possible to prevent a decrease in cutting quality and malfunction of the cutting device 2.

[0045] Furthermore, even if the chuck tables 20 have the same model number, there are individual differences between the chuck tables 20. Therefore, when the decoded code 24b indicates the identification number (serial number) of the chuck table 20, the cutting device 2 stores the identification number of the chuck table 20 in a state linked to an item (e.g., a device chip) manufactured using the chuck table 20 for the purpose of traceability.

[0046] In addition to the code 24b, a logo 24c indicating the manufacturer is provided on the top surface 24a. The logo 24c shown in Fig. 3 is composed of a predetermined mark and DISCO written in English letters, but may be composed of various marks, patterns, letters, etc. By providing the logo 24c, an operator can visually check whether the name of the manufacturer of the chuck table 20 matches the name of the manufacturer of the cutting device 2.

[0047] In addition to the code 24b and the logo 24c, the upper surface 24a is further provided with size information 24d indicating the size of the workpiece 11 held by the chuck table 20. The size information 24d shown in Fig. 3 is made up of letters and numbers, and includes Φ8 and inch.

[0048] 3 indicates that the chuck table 20 should be used to hold a workpiece 11 having a diameter of 8 inches (approximately 200 mm). The size information 24d allows an operator to visually confirm whether the size of the chuck table 20 corresponds to the diameter of the workpiece 11 to be cut.

[0049] In addition to the code 24b, the logo 24c, and the size information 24d, the top surface 24a is further provided with a model number 24e and an identification number 24f of the chuck table 20. The model number 24e and the identification number 24f usually include English letters and numbers, but may also include letters, symbols, etc. other than English letters and numbers.

[0050] The model number 24e indicates whether or not the chuck table 20 can be attached to the cutting device 2. Therefore, an operator can easily confirm through the model number 24e whether or not the chuck table 20 can be attached to the cutting device 2. In addition, the identification number 24f is used, for example, for traceability of an item (e.g., a device chip) manufactured using the chuck table 20.

[0051] The code 24b, the logo 24c, the size information 24d, the model number 24e and the identification number 24f are drawn, for example, by applying pigment ink to the upper surface 24a, but may also be drawn by laser engraving on the upper surface 24a.

[0052] By drawing the code 24b, logo 24c, etc. in an appropriate size on the upper surface 24a, which is sufficiently larger than the upper surface 22b, it becomes easier for the camera unit 36 ​​to capture an image of the code 24b, and also makes it easier for the operator to visually confirm the logo 24c, etc.

[0053] In this embodiment, in addition to the logo 24c, size information 24d, model number 24e, identification number 24f, etc., a code 24b is provided on the top surface 24a. Therefore, even if an operator misreads the logo 24c, etc., the cutting device 2 can confirm the specified information regarding the chuck table 20.

[0054] In this way, by both the cutting device 2 and the operator checking the information regarding the chuck table 20, it is possible to more reliably prevent the workpiece 11 from being cut with the wrong chuck table 20 attached to the cutting device 2, compared to when only one of them checks the information.

[0055] A cylindrical protrusion 30 (see FIG. 2) is formed approximately in the center of the bottom of the frame 22. The chuck table 20 is attached to the cutting device 2 by engaging this protrusion 30 with a recess (not shown) formed in the upper part of a table holder 32 (see FIG. 1) and further by sucking the bottom of the frame 22 toward the table holder 32.

[0056] As shown in FIG. 1, a plurality of clamp units 32a, which each clamp the frame 15 in the vertical direction, are discretely arranged on the outer periphery of the table support base 32 along the circumferential direction of the cylindrical table support base 32.

[0057] A rotation mechanism (not shown), such as a motor, that rotates the chuck table 20 around a predetermined rotation axis is provided inside the table holder 32. In addition, a ball screw type processing feed unit 34 that moves the table holder 32 along the X-axis direction is connected to the lower part of the table holder 32.

[0058] 1 shows the schematic position of the processing feed unit 34, but does not show the specific shape. A camera unit 36 ​​is provided above the chuck table 20 in a manner capable of capturing an image of the upper surface 24a.

[0059] The camera unit 36 ​​includes a light source, a predetermined optical system, and an imaging element such as a CCD image sensor or a CMOS image sensor. For example, the camera unit 36 ​​captures an image of the top surface 24a to obtain an image including the code 24b. Also, for example, the camera unit 36 ​​captures an image of the workpiece 11 held by suction on the chuck table 20.

[0060] A cutting unit 38 is provided on one side in the X-axis direction of the camera unit 36. Now, the cutting unit 38 will be described with reference to Fig. 2. The cutting unit 38 has a cylindrical spindle 40 disposed along the Y-axis direction.

[0061] A rotary drive source (not shown) such as a servo motor is connected to the base end of the spindle 40, and a cutting blade 42 having an annular cutting edge is attached to the tip of the spindle 40. When the rotary drive source is operated, the cutting blade 42 rotates at high speed.

[0062] A part of the spindle 40 is rotatably accommodated in a spindle housing. A ball screw type cutting feed unit (not shown) is connected to the spindle housing. The cutting feed unit moves the cutting unit 38 along the Z-axis direction.

[0063] A ball screw type indexing feed unit (not shown) for moving the cutting feed unit along the Y-axis direction is connected to the cutting feed unit. Next, a method for cutting the workpiece 11 using the cutting unit 38 will be described.

[0064] When cutting the workpiece 11, first, one workpiece unit 17 is transferred from the cassette 10 to the chuck table 20. Then, the workpiece 11 is suction-held on the chuck table 20 via the adhesive tape 13, and the frame 15 is fixed by the multiple clamp units 32a.

[0065] Next, the front surface 11a side of the workpiece 11 is imaged by the camera unit 36, and the workpiece 11 is aligned based on the image acquired by imaging, and the cutting edge of the cutting blade 42 is positioned on an extension line of one of the planned division lines.

[0066] Then, with the lower end of the rotating cutting blade 42 positioned between the boundary between the workpiece 11 and the adhesive tape 13 and the upper surface 24a, the chuck table 20 is moved in the X-axis direction for processing while cutting water is supplied.

[0067] Thereby, a cut groove 11c is formed along one of the planned division lines. Next, the cutting unit 38 is indexed and fed in the Y-axis direction to similarly form cut grooves 11c along other planned division lines adjacent to the one planned division line in the Y-axis direction.

[0068] 2 is a diagram showing a state in which the workpiece 11 is cut. After the workpiece 11 is cut along all the planned division lines along the X-axis direction, the workpiece 11 is rotated 90 degrees in the XY plane, and cut grooves 11c are formed in the same manner.

[0069] After cutting, the workpiece unit 17 is transferred by the third transfer unit 44 (see FIG. 1) from the chuck table 20 to the spinner cleaning unit 46. In the spinner cleaning unit 46, the workpiece 11 is spin-cleaned and spin-dried.

[0070] After spin cleaning and spin drying, the workpiece unit 17 is carried into the cassette 10 by the second transport unit 18, the guide rail 16, the first transport unit 14, etc. Such an operation of the cutting device 2 is controlled by the control unit 50.

[0071] The control unit 50 is configured by a computer including, for example, a processing device such as a CPU (Central Processing Unit), a main storage device such as a DRAM (Dynamic Random Access Memory), and an auxiliary storage device such as a flash memory or a hard disk drive.

[0072] The auxiliary storage device stores software including a predetermined program. The functions of the control unit 50 are realized by operating the processing device and the like in accordance with this software.

[0073] The control unit 50 includes a reading section 52 for reading the code 24b included in the image. The reading section 52 is configured with a program stored in, for example, an auxiliary storage device, and includes a known program for decoding (i.e., reading) the code 24b.

[0074] By decoding the code 24b, it is possible to ensure high reading reliability compared to a case where a computer reads characters from an image containing characters using optical character recognition (OCR).

[0075] If the reading unit 52 reads the code 24b and finds that the name of the manufacturer of the chuck table 20 is different from the manufacturer of the cutting device 2 that has been registered in advance, the control unit 50 alerts the operator via the monitor 6 or an alarm such as a lamp or buzzer (not shown).

[0076] The same applies if the size of the workpiece 11 to be sucked and held by the chuck table 20 is incorrect, or if the model number of the chuck table 20 is not one that can be attached to the cutting device 2.

[0077] Incidentally, before cutting the workpiece 11 with the cutting unit 38, a so-called setup is performed. The setup means a task of registering in the cutting device 2 the height position (reference height position) of the cutting unit 38 when the lower end of the cutting blade 42 contacts the upper surface 22b of the frame 22.

[0078] In the setup, the cutting unit 38 is lowered at a predetermined speed by the cutting feed unit while rotating the cutting blade 42. When the lower end of the cutting blade 42 comes into contact with the upper surface 22b, electrical continuity is detected in a predetermined circuit that includes the cutting blade 42 and the frame 22 as an electrical conduction path.

[0079] By identifying the height position of the cutting unit 38 at the timing when electrical conduction is detected, a reference height position of the cutting unit 38 is determined. In the setup, the upper surface 22b side is partially cut, and a linear cutting mark 22e (see FIG. 4) is formed along the radial direction of the chuck table 20.

[0080] The control unit 50 has a setup control section 54. The setup control section 54 is configured, for example, by a program stored in an auxiliary storage device, and causes the cutting device 2 to execute setup.

[0081] A number of setups may be performed on one chuck table 20. Fig. 4 is a top view of the outer periphery of the chuck table 20 on which a number of setups have been performed.

[0082] However, if setup is performed again at a location where cutting mark 22e has already been formed, the lower end of cutting blade 42 may contact frame 22 at a height position lower than upper surface 22b, making it impossible to accurately measure the reference height position.

[0083] Therefore, the setup control unit 54 stores the position of the cut region 22f1 (see FIG. 4) where the setup was performed in association with the code 24b. For example, the setup control unit 54 stores the relative position of each cutting mark 22e with respect to the center of the upper surface 24a, thereby storing the setup history.

[0084] Based on the stored setup history, the setup control unit 54 identifies an uncut region 22f2 (see FIG. 4) where setup has not been performed on the upper surface 22b of the frame body 22. For example, when the cutting marks 22e are formed in sequence in the clockwise direction, the uncut region 22f2 is set to a rectangular region that is a predetermined distance away from the newest cutting mark 22e in the clockwise direction.

[0085] By performing the setup in this uncut region 22f2, it is possible to prevent the setup from being performed again at a position where the cutting mark 22e has already been formed, and therefore the reference height position can be determined more accurately.

[0086] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. The cutting device 2 may be provided with a reader (scanner) (not shown) for reading the code 24b in addition to the camera unit 36.

[0087] The reader is, for example, a portable type that can be held by an operator and is provided on the outside of the housing of the cutting device 2. The reader has a light source, a predetermined optical system, an imaging element, etc., and an image of the code 24b captured by the reader is transmitted to the control unit 50.

[0088] In this case, the cutting device 2 can confirm specific information regarding the chuck table 20 before attaching the chuck table 20 to the table holder 32, thereby preventing an incorrect chuck table 20 from being attached to the table holder 32 in advance.

[0089] In this way, if the chuck table 20 can be prevented from being erroneously attached, there is no need to correct the erroneous attachment, which prevents a decrease in the operating efficiency of the cutting device 2. The reading unit 52 may be provided in the reader instead of the control unit 50.

[0090] In the above embodiment, the cutting device 2 is shown as the processing device, but the chuck table 20 can also be applied to various processing devices such as a grinding device, a laser processing device, a bit cutting device, a device for replacing the adhesive tape 13, and an inspection device for the workpiece 11. [Explanation of symbols]

[0091] 2: cutting device, 4: operation panel, 6: monitor, 8: cassette table, 10: cassette 11: Workpiece, 11a: Surface, 11b: Back surface, 11c: Cutting groove 12: elevator, 14: first transport unit, 16: guide rail 13: adhesive tape, 15: frame, 17: workpiece unit 18: Second transport unit 20: Chuck table (holding table) 22: frame, 22a: recess, 22b: upper surface, 22c: flow path, 22d: flow path 22e: cutting marks, 22f1: cut area, 22f2: uncut area 24: porous plate (holding portion), 24a: upper surface, 24b: cord 24c: logo, 24d: size information, 24e: model number, 24f: identification number 26: solenoid valve, 28: suction source, 30: protrusion 32: table support, 32a: clamp unit 34: Processing feed unit, 36: Camera unit 38: cutting unit, 40: spindle, 42: cutting blade 44: third transfer unit, 46: spinner cleaning unit 50: control unit, 52: reading unit, 54: setup control unit

Claims

1. A cutting device to which a holding table is attached, The holding table is A porous plate having a holding surface that suction-holds the workpiece; a frame having a recess, supporting the porous plate fixed to the recess, and having a flow path communicating with a suction source and transmitting a suction force to the holding surface which is the upper surface of the porous plate; a code that can be converted into predetermined information related to the holding table is provided on an upper surface of the porous plate; The cutting device is a cutting unit having a spindle for cutting the workpiece with a cutting blade attached to the spindle; a camera unit capable of acquiring an image of the code; A reading unit that reads the code included in the image; a setup control unit that stores the position of the cut area where the setup has been performed to determine the reference height position of the cutting unit and the code including the identification number of the holding table when decoded in association with each other; A cutting device comprising:

2. The cutting device according to claim 1, characterized in that the setup control unit identifies an uncut area of ​​the holding table where setup has not been performed based on a stored setup history, and performs setup in the uncut area.

Images