Substrate Cleaning Equipment

Abstract

To provide a substrate cleaning device which is prevented from increasing in size and furthermore can efficiently clean a substrate.SOLUTION: A substrate cleaning device includes: a substrate holding portion; a first cleaning implement; a second cleaning implement; and a third cleaning implement. The substrate holding portion holds a circular substrate W in a horizontal posture. The first cleaning implement is scanned above the substrate in such a way as to pass through a point P1 of an outer edge of the substrate W in a plan view, thus the first cleaning implement W cleans an upper surface of the substrate W. The second cleaning implement comes in contact with a point P2 of an external edge of the substrate W in the plan view, and thus the second cleaning implement cleans an external peripheral end portion of the substrate W. A virtual line L1 passing through the point P1 and the point P2 and a virtual line L2 parallel to the line L1 as well as passing through a center P0 of the substrate W are defined. The third cleaning implement is arranged in a region below the substrate W and opposite to the first and second cleaning implements with the line L2 between the third cleaning implement and the first and second cleaning implements, and cleans a lower surface of the substrate W.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a substrate cleaning apparatus for cleaning a substrate. [Background technology]

[0002] Substrate processing apparatuses are used to perform various processes on various substrates such as FPD (Flat Panel Display) substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, solar cell substrates, etc. Substrate cleaning apparatuses are used to clean substrates.

[0003] For example, the substrate cleaning apparatus described in Patent Document 1 includes two suction pads that hold the peripheral portion of the back surface of the wafer, a spin chuck that holds the central portion of the back surface of the wafer, and a brush that cleans the back surface of the wafer. The two suction pads hold the wafer and move laterally. In this state, the central portion of the back surface of the wafer is cleaned with the brushes. The spin chuck then receives the wafer from the suction pads, and rotates while holding the central portion of the back surface of the wafer. In this state, the peripheral portion of the back surface of the wafer is cleaned with the brushes. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5904169 Summary of the Invention [Problem to be solved by the invention]

[0005] In the substrate cleaning apparatus described in Patent Document 1, when cleaning not only the back surface of the substrate but also the front surface of the substrate, the substrate needs to be transported to a separate cleaning apparatus for cleaning the front surface of the substrate. In this case, the throughput is reduced and the footprint of the entire system for cleaning the substrate increases. Therefore, a substrate cleaning apparatus capable of efficiently cleaning the substrate while preventing the substrate from becoming large is desired.

[0006] An object of the present invention is to provide a substrate cleaning apparatus capable of efficiently cleaning a substrate while preventing an increase in size. [Means for solving the problem]

[0007] (1) 1. A substrate cleaning apparatus according to the invention comprises a substrate holding section which holds a circular substrate in a horizontal position, a first cleaning tool which cleans an upper surface of the substrate by being scanned above the substrate so as to pass through a first point on an outer edge of the substrate in a plan view, a second cleaning tool which cleans an outer peripheral edge of the substrate by contacting a second point on the outer edge of the substrate in a plan view, and a third cleaning tool which cleans an underside of the substrate, wherein an imaginary first line passing through the first point and the second point, and an imaginary second line passing through the center of the substrate and parallel to the first line are defined, and the third cleaning tool is disposed below the substrate in an area opposite the first cleaning tool and the second cleaning tool across the second line. A virtual third straight line extending from the center of the substrate toward the geometric center of the third cleaning tool in a plan view and a third point on the outer edge of the substrate through which the third straight line passes in a plan view are further defined, and the first cleaning tool, the second cleaning tool, and the third cleaning tool are arranged so that the center of the substrate is located within a triangular area having the first point, the second point, and the third point as vertices. do.

[0008] In this substrate cleaning apparatus, the first cleaning tool, the second cleaning tool, and the third cleaning tool are arranged at a relatively large distance from each other when cleaning the substrate. Therefore, even if the upper surface, the outer peripheral edge, and the lower surface of the substrate are simultaneously cleaned by the first cleaning tool, the second cleaning tool, and the third cleaning tool, respectively, contaminants generated from one cleaning tool hardly adhere to the other cleaning tools. Therefore, there is no need to provide multiple devices for cleaning multiple parts of the substrate, and there is no need to move the substrate between the multiple devices. As a result, the substrate can be efficiently cleaned while preventing the substrate cleaning apparatus from becoming large.

[0009] AlsoWhen cleaning a substrate, the first cleaning tool, the second cleaning tool, and the third cleaning tool are spaced apart from each other by a large distance, which makes it possible to prevent contaminants generated from one cleaning tool from adhering to the other cleaning tools.

[0010] ( 2 ) A virtual fourth line extending from the center of the substrate toward the first point in a plan view and a virtual fifth line extending from the center of the substrate toward the second point in a plan view may be further defined, and each of a first angle between the third line and the fourth line, a second angle between the fourth line and the fifth line, and a third angle between the fifth line and the third line may be 80 degrees or more. In this case, the first cleaning tool, the second cleaning tool, and the third cleaning tool are spaced apart from each other more widely when cleaning the substrate. This more reliably prevents contaminants generated from any one of the cleaning tools from adhering to the other cleaning tools.

[0011] ( 3 ) Each of the first angle, the second angle, and the third angle may be 90 degrees or more. In this case, the first cleaning tool, the second cleaning tool, and the third cleaning tool are spaced apart from each other by a larger distance during cleaning of the substrate. This more reliably prevents contaminants generated from one cleaning tool from adhering to the other cleaning tools.

[0012] ( 4 ) The first angle may be larger than the second angle. In this case, the first cleaning tool and the third cleaning tool are relatively far apart when cleaning the substrate, so that contaminants generated from one of the first cleaning tool and the third cleaning tool do not adhere to the other even if the third cleaning tool is relatively large. Therefore, the underside of the substrate can be efficiently cleaned by the third cleaning tool.

[0013] ( 5) The third angle may be larger than the second angle. In this case, the second cleaning tool and the third cleaning tool are relatively far apart when cleaning the substrate, so that contaminants generated from one of the second cleaning tool and the third cleaning tool do not adhere to the other even if the third cleaning tool is relatively large. Therefore, the underside of the substrate can be efficiently cleaned by the third cleaning tool. (6) A substrate cleaning apparatus according to a second aspect of the present invention comprises a substrate holding section which holds a circular substrate in a horizontal position, a first cleaning tool which, in a plan view, cleans an upper surface of the substrate by scanning above the substrate so as to pass through a first point on an outer edge of the substrate, a second cleaning tool which, in a plan view, cleans an outer peripheral edge of the substrate by contacting a second point on the outer edge of the substrate, and a third cleaning tool which cleans an underside of the substrate, wherein an imaginary first line passing through the first point and the second point and an imaginary second line passing through the center of the substrate and parallel to the first line are defined, the third cleaning tool is positioned below the substrate in an area opposite the first cleaning tool and the second cleaning tool across the second line, and in a plan view, the second point is at a point different from a line connecting the center of the substrate and the center of the third cleaning tool.

[0014] (7) The first cleaning tool may clean the upper surface of the substrate by scanning from the center of the substrate toward the first point in a plan view. In this case, contaminants generated from the first cleaning tool hardly adhere to the second cleaning tool or the third cleaning tool. Similarly, contaminants generated from the second cleaning tool or the third cleaning tool hardly adhere to the first cleaning tool. Therefore, the upper surface of the substrate can be efficiently cleaned by the first cleaning tool with a simple configuration.

[0015] (8) Each of the substrate holder and the third cleaning tool may have a circular outer shape, and the diameter of the third cleaning tool may be larger than the diameter of the substrate holder. In this case, the underside of the substrate can be efficiently cleaned by the relatively large third cleaning tool.

[0016] (9) The third cleaning tool may have a circular outer shape and a diameter of the third cleaning tool may be larger than 1 / 3 of the diameter of the substrate. In this case, the lower surface of the substrate can be efficiently cleaned by the relatively large third cleaning tool. Effect of the Invention

[0017] According to the present invention, it is possible to efficiently clean a substrate while preventing the substrate cleaning apparatus from becoming large. [Brief description of the drawings]

[0018] [Figure 1] 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention; [Diagram 2] 2 is an external perspective view showing an internal configuration of the substrate cleaning apparatus of FIG. 1. [Diagram 3] 2 is a block diagram showing the configuration of a control system of the substrate cleaning apparatus of FIG. 1. [Figure 4] FIG. 4 is a plan view showing the positional relationship of the cleaning tools. [Diagram 5] FIG. 13 is a plan view showing a more preferable positional relationship of the cleaning tool. [Figure 6] FIG. 11 is a plan view showing a more preferable positional relationship of the cleaning tool. [Figure 7] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 8] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 9] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 10] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 11] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 12] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 13] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 14] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 15] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 16] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 17] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 18] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] A substrate cleaning apparatus according to an embodiment of the present invention will be described below with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate, a substrate for FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. The substrate used in this embodiment has at least a partially circular outer periphery. For example, the outer periphery excluding a positioning notch has a circular shape.

[0020] (1) Configuration of the substrate processing device Fig. 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention. Fig. 2 is an external perspective view showing the internal configuration of the substrate cleaning apparatus 1 of Fig. 1. In the substrate cleaning apparatus 1 according to this embodiment, mutually orthogonal X-, Y-, and Z-directions are defined to clarify the positional relationship. In Fig. 1 and certain figures following Fig. 2, the X-, Y-, and Z-directions are appropriately indicated by arrows. The X- and Y-directions are mutually orthogonal in a horizontal plane, and the Z-direction corresponds to the vertical direction.

[0021] 1, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a pedestal device 30, a delivery device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an edge cleaning device 80, and an opening / closing device 90. These components are provided in a unit housing 2. In FIG. 2, the unit housing 2 is indicated by a dotted line.

[0022] The unit housing 2 has a rectangular bottom surface portion 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom surface portion 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall portion 2b. This opening is an entrance / exit 2x for the substrate W, and is used when the substrate W is carried into and carried out of the unit housing 2. In FIG. 2, the entrance / exit 2x is indicated by a thick dotted line. In the following description, the direction from inside the unit housing 2 through the entrance / exit 2x toward the outside of the unit housing 2 (the direction from the side wall portion 2c to the side wall portion 2b) in the Y direction is referred to as the front, and the opposite direction (the direction from the side wall portion 2b to the side wall portion 2c) is referred to as the rear.

[0023] An opening / closing device 90 is provided in a portion of the side wall 2b where the loading / unloading opening 2x is formed and in an area in the vicinity thereof. The opening / closing device 90 includes a shutter 91 configured to be able to open and close the loading / unloading opening 2x, and a shutter driver 92 that drives the shutter 91. In FIG. 2, the shutter 91 is indicated by a thick two-dot chain line. The shutter driver 92 drives the shutter 91 to open the loading / unloading opening 2x when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1. The shutter driver 92 also drives the shutter 91 to close the loading / unloading opening 2x when the substrate W is cleaned in the substrate cleaning apparatus 1.

[0024] A pedestal device 30 is provided in the center of the bottom surface portion 2a. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal drive unit 33. The linear guide 31 includes two rails and is provided so as to extend in the Y direction from the vicinity of the side wall portion 2b to the vicinity of the side wall portion 2c in a plan view. The movable pedestal 32 is provided so as to be movable in the Y direction on the two rails of the linear guide 31. The pedestal drive unit 33 includes, for example, a pulse motor, and moves the movable pedestal 32 in the Y direction on the linear guide 31.

[0025] The lower holding device 20 and the lower surface cleaning device 50 are provided on the movable base 32 so as to be aligned in the Y direction. The lower holding device 20 includes an adsorption holding unit 21 and an adsorption holding drive unit 22. The adsorption holding unit 21 is a so-called spin chuck, and has a circular adsorption surface capable of adsorbing and holding the lower surface of the substrate W, and is configured to be rotatable around an axis (axis in the Z direction) extending in the vertical direction. In the following description, when the substrate W is adsorbed and held by the adsorption holding unit 21, the region of the lower surface of the substrate W to be adsorbed by the adsorption surface of the adsorption holding unit 21 is referred to as a lower surface central region. Meanwhile, the region of the lower surface of the substrate W surrounding the lower surface central region is referred to as a lower surface outer region.

[0026] The suction-holding drive unit 22 includes a motor. The motor of the suction-holding drive unit 22 is provided on the movable base 32 so that the rotation shaft protrudes upward. The suction-holding unit 21 is attached to the upper end of the rotation shaft of the suction-holding drive unit 22. A suction path is formed in the rotation shaft of the suction-holding drive unit 22 for suctioning and holding the substrate W in the suction-holding unit 21. The suction path is connected to a suction device (not shown). The suction-holding drive unit 22 rotates the suction-holding unit 21 around the rotation shaft.

[0027] A delivery device 40 is further provided on the movable base 32 near the lower holding device 20. The delivery device 40 includes a plurality of support pins 41 (three in this example), a pin connecting member 42, and a pin lifting and lowering drive unit 43. The pin connecting member 42 is formed so as to surround the suction holding unit 21 in a plan view, and connects the plurality of support pins 41. The plurality of support pins 41 extend upward a certain length from the pin connecting member 42 while being connected to one another by the pin connecting member 42. The pin lifting and lowering drive unit 43 raises and lowers the pin connecting member 42 above the movable base 32. As a result, the plurality of support pins 41 rise and lower relative to the suction holding unit 21.

[0028] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas ejection unit 53, a lifting support unit 54, a moving support unit 55, a lower surface brush rotation drive unit 55a, a lower surface brush lifting drive unit 55b, and a lower surface brush moving drive unit 55c. The moving support unit 55 is provided so as to be movable in the Y direction relative to the lower holding device 20 within a certain area on the movable base 32. As shown in Fig. 2, the lifting support unit 54 is provided on the moving support unit 55 so as to be liftable. The lifting support unit 54 has an upper surface 54u that is inclined obliquely downward in a direction away from the suction holding unit 21 (rearward in this example).

[0029] 1, the lower brush 51 has a circular outer shape in a plan view, and is formed to be relatively large in this embodiment. Specifically, the diameter of the lower brush 51 is larger than the diameter of the adsorption surface of the adsorption holding unit 21, for example, 1.3 times the diameter of the adsorption surface of the adsorption holding unit 21. The diameter of the lower brush 51 is also larger than 1 / 3 and smaller than 1 / 2 the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0030] The lower surface brush 51 has a cleaning surface capable of contacting the lower surface of the substrate W. In addition, the lower surface brush 51 is attached to the upper surface 54u of the lifting support part 54 so that the cleaning surface faces upward and so that the cleaning surface can rotate around an axis extending in the vertical direction through the center of the cleaning surface.

[0031] Each of the two liquid nozzles 52 is attached to the upper surface 54u of the lift support part 54 so as to be located near the lower surface brush 51 and so that its liquid discharge port faces upward. A lower surface cleaning liquid supply part 56 (FIG. 3) is connected to the liquid nozzle 52. The lower surface cleaning liquid supply part 56 supplies cleaning liquid to the liquid nozzle 52. When the substrate W is cleaned by the lower surface brush 51, the liquid nozzle 52 discharges the cleaning liquid supplied from the lower surface cleaning liquid supply part 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning liquid supplied to the liquid nozzle 52.

[0032] The gas ejection part 53 is a slit-shaped gas ejection nozzle having a gas ejection port extending in one direction. The gas ejection part 53 is attached to the upper surface 54u of the lift support part 54 so that it is located between the lower surface brush 51 and the suction holding part 21 in a plan view and the gas ejection port faces upward. A gas ejection supply part 57 (FIG. 3) is connected to the gas ejection part 53. The gas ejection supply part 57 supplies gas to the gas ejection part 53. In this embodiment, an inert gas such as nitrogen gas is used as the gas supplied to the gas ejection part 53. The gas ejection part 53 ejects the gas supplied from the gas ejection supply part 57 onto the lower surface of the substrate W when the substrate W is cleaned by the lower surface brush 51 and when the lower surface of the substrate W is dried, which will be described later. In this case, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding part 21.

[0033] The lower surface brush rotation drive unit 55a includes a motor and rotates the lower surface brush 51 when the lower surface brush 51 cleans the substrate W. The lower surface brush lift drive unit 55b includes a stepping motor or an air cylinder and lifts and lowers the lift support unit 54 relative to the moving support unit 55. The lower surface brush movement drive unit 55c includes a motor and moves the moving support unit 55 in the Y direction on the movable base 32. Here, the position of the lower holding device 20 on the movable base 32 is fixed. Therefore, when the moving support unit 55 is moved in the Y direction by the lower surface brush movement drive unit 55c, the moving support unit 55 moves relative to the lower holding device 20. In the following description, the position of the lower surface cleaning device 50 when it is closest to the lower holding device 20 on the movable base 32 is called the approach position, and the position of the lower surface cleaning device 50 when it is farthest from the lower holding device 20 on the movable base 32 is called the separation position.

[0034] A cup device 60 is further provided in the center of the bottom surface portion 2a. The cup device 60 includes a cup 61 and a cup drive unit 62. The cup 61 is provided so as to surround the lower holding device 20 and the base device 30 in a plan view and is movable up and down. In FIG. 2, the cup 61 is indicated by a dotted line. The cup drive unit 62 moves the cup 61 between a lower cup position and an upper cup position depending on which part of the lower surface of the substrate W is to be cleaned by the lower surface brush 51. The lower cup position is a height position where the upper end of the cup 61 is below the substrate W adsorbed and held by the adsorption holding unit 21. The upper cup position is a height position where the upper end of the cup 61 is above the adsorption holding unit 21.

[0035] A pair of upper holding devices 10A, 10B are provided at a height position above cup 61 so as to face each other across base device 30 in a plan view. Upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck driving unit 13A, and an upper chuck driving unit 14A. Upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck driving unit 13B, and an upper chuck driving unit 14B.

[0036] The lower chucks 11A, 11B are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding part 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A, 11B has two support pieces capable of supporting the peripheral portion of the lower surface of the substrate W from below the substrate W. The lower chuck driving parts 13A, 13B move the lower chucks 11A, 11B so that the lower chucks 11A, 11B approach each other or so that the lower chucks 11A, 11B move away from each other.

[0037] The upper chucks 12A, 12B, like the lower chucks 11A, 11B, are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) passing through the center of the suction holding unit 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A, 12B has two holding pieces configured to be able to hold the outer circumferential end of the substrate W by abutting against two portions of the outer circumferential end of the substrate W. The upper chuck driving units 14A, 14B move the upper chucks 12A, 12B so that the upper chucks 12A, 12B approach each other or move the upper chucks 12A, 12B away from each other.

[0038] 1, an upper surface cleaning device 70 is provided on one side of the cup 61 so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0039] The rotating support shaft 71 is supported on the bottom surface portion 2a so as to extend in the vertical direction and to be movable up and down and rotatable by an upper surface cleaning drive unit 74. As shown in Fig. 2, the arm 72 is provided at a position above the upper holding device 10B and extends horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is attached to the tip of the arm 72.

[0040] An upper surface cleaning fluid supply unit 75 (FIG. 3) is connected to the spray nozzle 73. The upper surface cleaning fluid supply unit 75 supplies a cleaning liquid and a gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid and the gas supplied from the upper surface cleaning fluid supply unit 75 to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0041] The upper surface cleaning drive unit 74 includes one or more pulse motors, an air cylinder, etc., and raises and lowers the rotary support shaft 71 and rotates the rotary support shaft 71. According to the above configuration, by moving the spray nozzle 73 in an arc above the upper surface of the substrate W that is attracted and held by the suction holding unit 21 and rotated, it is possible to clean the entire upper surface of the substrate W.

[0042] 1, an edge cleaning device 80 is provided on the other side of the cup 61 so as to be located near the upper holding device 10A in a plan view. The edge cleaning device 80 includes a rotating support shaft 81, an arm 82, a bevel brush 83, and a bevel brush driving unit 84.

[0043] The rotating support shaft 81 is supported by a bevel brush driving unit 84 on the bottom surface portion 2a so as to extend in the vertical direction and to be movable up and down and rotatable. As shown in Fig. 2, the arm 82 is provided at a position above the upper holding device 10A and extends horizontally from the upper end of the rotating support shaft 81. A bevel brush 83 is provided at the tip of the arm 82 so as to protrude downward and to be rotatable around a vertical axis.

[0044] The upper half of the bevel brush 83 has an inverted truncated cone shape, and the lower half has a truncated cone shape. With this bevel brush 83, the outer periphery edge of the substrate W can be cleaned by the central portion in the up-down direction of the outer periphery surface.

[0045] The bevel brush driving unit 84 includes one or more pulse motors and air cylinders, and raises and lowers the rotary support shaft 81 and rotates the rotary support shaft 81. According to the above configuration, by bringing the central portion of the outer circumferential surface of the bevel brush 83 into contact with the outer circumferential edge of the substrate W that is attracted and held by the attracting and holding unit 21 and rotated, the entire outer circumferential edge of the substrate W can be cleaned.

[0046] Here, the bevel brush driving unit 84 further includes a motor built into the arm 82. The motor rotates the bevel brush 83 provided at the tip of the arm 82 about an axis in the vertical direction. Therefore, when cleaning the outer circumferential edge of the substrate W, the cleaning power of the bevel brush 83 at the outer circumferential edge of the substrate W is improved by the rotation of the bevel brush 83.

[0047] Fig. 3 is a block diagram showing the configuration of a control system of substrate cleaning apparatus 1 of Fig. 1. Control unit 9 of Fig. 3 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and a storage device. The RAM is used as a working area for the CPU. The ROM stores system programs. The storage device stores control programs. The CPU executes the substrate cleaning program stored in the storage device on the RAM to control the operation of each part of substrate cleaning apparatus 1.

[0048] 3, the control unit 9 mainly controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B in order to receive the substrate W carried into the substrate cleaning apparatus 1 and hold it at a position above the suction holding unit 21. The control unit 9 also mainly controls the suction holding driving unit 22 in order to suction and hold the substrate W by the suction holding unit 21 and to rotate the suction-held substrate W.

[0049] The control unit 9 also mainly controls the pedestal drive unit 33 to move the movable pedestal 32 relative to the substrate W held by the upper holding devices 10A, 10B. The control unit 9 also controls the pin lift drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A, 10B and the height position of the substrate W held by the suction holder 21.

[0050] Furthermore, the control unit 9 controls a lower surface brush rotation drive unit 55a, a lower surface brush lift drive unit 55b, a lower surface brush movement drive unit 55c, a lower surface cleaning liquid supply unit 56, and a jet gas supply unit 57 in order to clean the lower surface of the substrate W. Furthermore, the control unit 9 controls a cup drive unit 62 in order to use a cup 61 to receive the cleaning liquid splashed from the substrate W when the substrate W adsorbed and held by the suction holding unit 21 is cleaned.

[0051] The control unit 9 also controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W adsorbed and held by the suction holding unit 21. The control unit 9 also controls the bevel brush drive unit 84 to clean the outer circumferential edge of the substrate W adsorbed and held by the suction holding unit 21. Furthermore, the control unit 9 controls the shutter drive unit 92 to open and close the load / unload opening 2x of the unit housing 2 when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1.

[0052] (2) Position of cleaning tools In this embodiment, cleaning of the upper surface of the substrate W by the spray nozzle 73, cleaning of the outer peripheral edge of the substrate W by the bevel brush 83, and cleaning of the outer region of the lower surface of the substrate W by the lower surface brush 51 are performed simultaneously within the same unit housing 2. In the following description, each of the spray nozzle 73, the bevel brush 83, and the lower surface brush 51 is referred to as a cleaning tool.

[0053] Depending on the arrangement of multiple cleaning tools, contaminants generated from one of the cleaning tools may adhere to the other cleaning tools. In this case, the contaminants adhere to the substrate W from the cleaning tool, reducing the cleaning efficiency of the substrate W. Therefore, the cleaning tools are arranged so as to reduce the influence of interference between them.

[0054] Fig. 4 is a plan view showing the positional relationship of the cleaning tools. As shown by the dashed line in Fig. 4, the spray nozzle 73 is moved above the center P0 of the substrate W by the upper surface cleaning drive unit 74 in Fig. 1 when cleaning the upper surface of the substrate W. Thereafter, as shown by the thick arrow in Fig. 4, the spray nozzle 73 is scanned outwardly of the substrate W along a circular trajectory while spraying the mixed fluid. At this time, a point on the outer edge of the substrate W that is in contact with the outer edge of the spray nozzle 73 in a plan view is called P1.

[0055] 1 contacts the outer circumferential edge of the substrate W when cleaning the outer circumferential edge of the substrate W. In a plan view, a point on the outer edge of the substrate W that contacts the bevel brush 83 is referred to as P2. Here, an imaginary line passing through points P1 and P2 is referred to as L1. In addition, an imaginary line passing through the center P0 of the substrate W and parallel to line L1 is referred to as L2.

[0056] 1, in cleaning the outer lower surface region of the substrate W. In this embodiment, the lower brush 51 is disposed so that a portion of the lower brush 51 protrudes outward from the substrate W, as shown in FIG. 4, but the embodiment is not limited to this. The lower brush 51 may be disposed so that its outer edge overlaps with the outer edge of the substrate W.

[0057] 4, the spray nozzle 73, the bevel brush 83, and the lower surface brush 51 are spaced apart from each other by a relatively large distance when cleaning the substrate W. Therefore, even when the upper surface, the outer peripheral edge, and the lower surface of the substrate W are simultaneously cleaned by the spray nozzle 73, the bevel brush 83, and the lower surface brush 51, respectively, contaminants generated from one of the cleaning tools rarely adhere to the other cleaning tools.

[0058] Fig. 5 is a plan view showing a more preferable positional relationship of the cleaning tool. As shown in Fig. 5, in a plan view, a virtual straight line (half line) extending from the center P0 of the substrate W toward the geometric center of the lower surface brush 51 is denoted as L3. In addition, in a plan view, a point on the outer edge of the substrate W through which the straight line L3 passes is denoted as P3. In this case, a triangular region R is formed with the vertices being points P1, P2, and P3.

[0059] The spray nozzle 73, the bevel brush 83, and the lower surface brush 51 are preferably arranged so that the center P0 of the substrate W is located within the region R. In this case, the spray nozzle 73, the bevel brush 83, and the lower surface brush 51 are largely separated from each other during cleaning in the substrate cleaning apparatus 1. This makes it possible to prevent contaminants generated from one cleaning tool from adhering to the other cleaning tools.

[0060] Fig. 6 is a plan view showing a more preferable positional relationship of the cleaning tool. As shown in Fig. 6, in a plan view, an imaginary line (semi-line) extending from the center of the substrate W toward point P1 is denoted as L4, and an imaginary line (semi-line) extending from the center of the substrate W toward point P2 is denoted as L5. Also, the angle between the line L3 and the line L4 is denoted as θ1, the angle between the line L4 and the line L5 is denoted as θ2, and the angle between the line L5 and the line L3 is denoted as θ3. The sum of the angle θ1, the angle θ2, and the angle θ3 is 360 degrees.

[0061] Each of the angles θ1, θ2, and θ3 is preferably equal to or greater than 80 degrees. In this case, the spray nozzle 73, the bevel brush 83, and the lower surface brush 51 are spaced apart from each other more widely when cleaning the substrate W. This more reliably prevents contaminants generated from one cleaning tool from adhering to the other cleaning tools.

[0062] Moreover, it is more preferable that each of the angles θ1, θ2, and θ3 is 90 degrees or more. In this case, the spray nozzle 73, the bevel brush 83, and the lower surface brush 51 are spaced apart from each other by a larger distance. This more reliably prevents contaminants generated from one cleaning tool from adhering to the other cleaning tools.

[0063] It is preferable that the angle θ1 is larger than the angle θ2. In this case, the spray nozzle 73 and the lower surface brush 51 are spaced apart relatively widely, so that even if the lower surface brush 51 is relatively large, contaminants generated from either the spray nozzle 73 or the lower surface brush 51 do not adhere to the other. Therefore, the lower surface of the substrate W can be efficiently cleaned by the relatively large lower surface brush 51.

[0064] It is more preferable that the angle θ3 is larger than the angle θ2. In this case, the bevel brush 83 and the lower surface brush 51 are spaced apart from each other by a relatively large distance, so that contaminants generated from either the bevel brush 83 or the lower surface brush 51 do not adhere to the other even if the lower surface brush 51 is relatively large. Therefore, the lower surface of the substrate W can be efficiently cleaned by the relatively large lower surface brush 51.

[0065] (3) Overview of the operation of the substrate cleaning device 7 to 18 are schematic diagrams for explaining the general operation of the substrate cleaning apparatus 1 of FIG. 1. In each of FIGS. 7 to 18, a plan view of the substrate cleaning apparatus 1 is shown in the upper part. A side view of the lower holding device 20 and its periphery as viewed along the Y direction is shown in the middle part, and a side view of the lower holding device 20 and its periphery as viewed along the X direction is shown in the lower part. The side view in the middle part corresponds to the side view along the AA line in FIG. 1, and the side view in the lower part corresponds to the side view along the BB line in FIG. 1. In addition, in order to facilitate understanding of the shape and operating state of each component in the substrate cleaning apparatus 1, the enlargement and reduction ratios of some components are different between the plan view in the upper part and the side views in the middle and lower parts. In addition, in FIGS. 7 to 18, the cup 61 is shown by a two-dot chain line, and the outer shape of the substrate W is shown by a thick dashed line.

[0066] In an initial state before the substrate W is loaded into the substrate cleaning apparatus 1, the shutter 91 of the opening / closing device 90 closes the loading / unloading port 2x. As shown in FIG. 1, the lower chucks 11A and 11B are maintained in a state in which the distance between them is sufficiently larger than the diameter of the substrate W. The upper chucks 12A and 12B are also maintained in a state in which the distance between them is sufficiently larger than the diameter of the substrate W. The movable base 32 of the base device 30 is disposed so that the center of the suction holding part 21 is located at the center of the cup 61 in a plan view. The lower surface cleaning device 50 is disposed at a close position on the movable base 32. The lifting support part 54 of the lower surface cleaning device 50 is disposed so that the cleaning surface (upper end) of the lower surface brush 51 is located below the suction holding part 21.

[0067] In addition, in the delivery device 40, the multiple support pins 41 are located below the suction holding unit 21. Furthermore, in the cup device 60, the cup 61 is in the lower cup position. In the following description, the center position of the cup 61 in a plan view is referred to as the planar reference position rp. Furthermore, the position of the movable base 32 on the bottom surface portion 2a when the center of the suction holding unit 21 is at the planar reference position rp in a plan view is referred to as the first horizontal position.

[0068] The substrate W is loaded into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading / unloading opening 2x immediately before the substrate W is loaded. Thereafter, as indicated by a thick solid arrow a1 in Fig. 7, a hand (substrate holding part) RH of a substrate transport robot (not shown) loads the substrate W into a substantially central position in the unit housing 2 through the loading / unloading opening 2x. At this time, the substrate W held by the hand RH is positioned between the lower chuck 11A and the upper chuck 12A and the lower chuck 11B and the upper chuck 12B as shown in Fig. 7.

[0069] 8, the lower chucks 11A and 11B approach each other so that the multiple support pieces of the lower chucks 11A and 11B are positioned below the peripheral portion of the lower surface of the substrate W. In this state, the hand RH descends and exits from the loading / unloading opening 2x. As a result, multiple portions of the peripheral portion of the lower surface of the substrate W held by the hand RH are supported by the multiple support pieces of the lower chucks 11A and 11B. After the hand RH exits, the shutter 91 closes the loading / unloading opening 2x.

[0070] Next, as shown by a thick solid arrow a3 in Fig. 9, the upper chucks 12A and 12B approach each other so that the multiple holding pieces of the upper chucks 12A and 12B come into contact with the outer peripheral end of the substrate W. The multiple holding pieces of the upper chucks 12A and 12B come into contact with multiple portions of the outer peripheral end of the substrate W, so that the substrate W supported by the lower chucks 11A and 11B is further held by the upper chucks 12A and 12B. Also, as shown by a thick solid arrow a4 in Fig. 9, the suction holder 21 is shifted a predetermined distance from the planar reference position rp and the movable base 32 moves forward from the first horizontal position so that the center of the lower surface brush 51 is located at the planar reference position rp. At this time, the position of the movable base 32 located on the bottom surface portion 2a is called the second horizontal position.

[0071] Next, as indicated by a thick solid arrow a5 in Fig. 10, the lifting support part 54 rises so that the cleaning surface of the lower surface brush 51 comes into contact with the central region of the lower surface of the substrate W. Also, as indicated by a thick solid arrow a6 in Fig. 10, the lower surface brush 51 rotates (spins) about an axis in the vertical direction. As a result, contaminants adhering to the central region of the lower surface of the substrate W are physically peeled off by the lower surface brush 51.

[0072] In the lower part of FIG. 10, an enlarged side view of the portion where the lower brush 51 contacts the lower surface of the substrate W is shown in a bubble. As shown in the bubble, with the lower brush 51 in contact with the substrate W, the liquid nozzle 52 and the gas ejection part 53 are held in a position close to the lower surface of the substrate W. At this time, the liquid nozzle 52 ejects the cleaning liquid toward the lower surface of the substrate W at a position close to the lower brush 51, as shown by the outlined arrow a51. As a result, the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W is guided to the contact part between the lower brush 51 and the substrate W, and the contaminants removed from the rear surface of the substrate W by the lower brush 51 are washed away by the cleaning liquid. In this way, in the lower surface cleaning device 50, the liquid nozzle 52 is attached to the lift support part 54 together with the lower brush 51. As a result, the cleaning liquid can be efficiently supplied to the portion of the lower surface of the substrate W cleaned by the lower brush 51. Therefore, the consumption of the cleaning liquid is reduced and excessive scattering of the cleaning liquid is suppressed.

[0073] Here, the upper surface 54u of the lifting support part 54 is inclined obliquely downward in a direction away from the suction holding part 21. In this case, when the cleaning liquid containing contaminants drops from the lower surface of the substrate W onto the lifting support part 54, the cleaning liquid received by the upper surface 54u is guided in a direction away from the suction holding part 21.

[0074] Moreover, when the lower surface of the substrate W is cleaned by the lower surface brush 51, the gas ejection unit 53 ejects gas toward the lower surface of the substrate W at a position between the lower surface brush 51 and the suction holding unit 21, as shown by the white arrow a52 in the blowout of FIG. 10. In this embodiment, the gas ejection unit 53 is attached to the lift support unit 54 so that the gas ejection port extends in the X direction. In this case, when gas is ejected from the gas ejection unit 53 toward the lower surface of the substrate W, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding unit 21. This prevents the cleaning liquid containing contaminants from scattering toward the suction holding unit 21 when the lower surface of the substrate W is cleaned by the lower surface brush 51. Therefore, when the lower surface of the substrate W is cleaned by the lower surface brush 51, the cleaning liquid containing contaminants is prevented from adhering to the suction holding unit 21, and the suction surface of the suction holding unit 21 is kept clean.

[0075] 10, the gas jetting part 53 jets gas obliquely upward from the gas jetting part 53 toward the lower surface brush 51 as shown by the outlined arrow a52, but the present invention is not limited to this. The gas jetting part 53 may jet gas from the gas jetting part 53 toward the lower surface of the substrate W along the Z direction.

[0076] 10, when cleaning of the central region of the lower surface of the substrate W is completed, the rotation of the lower surface brush 51 is stopped, and the lifting support part 54 is lowered so that the cleaning surface of the lower surface brush 51 is spaced a predetermined distance from the substrate W. In addition, the discharge of the cleaning liquid from the liquid nozzle 52 to the substrate W is stopped. At this time, the spray of gas from the gas blowing part 53 to the substrate W continues.

[0077] 11, the movable base 32 moves backward so that the suction and holding part 21 is located at the planar reference position rp. That is, the movable base 32 moves from the second horizontal position to the first horizontal position. At this time, the gas ejection part 53 continues to eject gas onto the substrate W, so that the central region of the lower surface of the substrate W is sequentially dried by the gas curtain.

[0078] Next, as shown by a thick solid arrow a8 in Fig. 12, the lifting support part 54 descends so that the cleaning surface of the lower surface brush 51 is positioned below the suction surface (upper end) of the suction holding part 21. Also, as shown by a thick solid arrow a9 in Fig. 12, the upper chucks 12A, 12B move away from each other so that the multiple holding pieces of the upper chucks 12A, 12B are separated from the outer circumferential end of the substrate W. At this time, the substrate W is supported by the lower chucks 11A, 11B.

[0079] 12, the pin connecting member 42 is raised so that the upper ends of the plurality of support pins 41 are positioned slightly above the lower chucks 11A and 11B. As a result, the substrate W supported by the lower chucks 11A and 11B is received by the plurality of support pins 41.

[0080] Next, the lower chucks 11A and 11B move away from each other as indicated by a thick solid arrow a11 in Fig. 13. At this time, the lower chucks 11A and 11B move to positions where they do not overlap the substrate W supported by the multiple support pins 41 in a plan view. As a result, both of the upper holding devices 10A and 10B return to their initial states.

[0081] 14, the pin connecting member 42 is lowered so that the upper ends of the multiple support pins 41 are positioned below the suction holding unit 21. As a result, the substrate W supported on the multiple support pins 41 is received by the suction holding unit 21. In this state, the suction holding unit 21 suction-holds the central region of the lower surface of the substrate W. Simultaneously with the descent of the pin connecting member 42 or after the descent of the pin connecting member 42 is completed, the cup 61 is raised from the lower cup position to the upper cup position, as shown by the thick solid arrow a13 in FIG.

[0082] 15, the suction holding part 21 rotates around the vertical axis (the axis of the rotation axis of the suction holding drive part 22), thereby causing the substrate W sucked and held by the suction holding part 21 to rotate in a horizontal position.

[0083] Next, the rotary support shaft 71 of the upper surface cleaning device 70 rotates and descends. As a result, as shown by a thick solid arrow a15 in Fig. 15, the spray nozzle 73 moves to a position above the center of the substrate W, and descends so that the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixed fluid of a cleaning liquid and a gas onto the upper surface of the substrate W. In addition, the rotary support shaft 71 rotates. As a result, as shown by a thick solid arrow a16 in Fig. 15, the spray nozzle 73 moves outward from the center of the rotating substrate W (point P1 in Fig. 4). The mixed fluid is sprayed onto the entire upper surface of the substrate W, so that the entire upper surface of the substrate W is cleaned.

[0084] Moreover, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the rotary support shaft 81 of the edge cleaning device 80 also rotates and descends. As a result, the bevel brush 83 moves to a position above the outer circumferential edge of the substrate W, as shown by a thick solid arrow a17 in FIG. 15. Also, the central portion of the outer circumferential surface of the bevel brush 83 descends so as to contact the outer circumferential edge of the substrate W (point P2 in FIG. 4). In this state, the bevel brush 83 rotates (spins) around an axis in the vertical direction. As a result, contaminants adhering to the outer circumferential edge of the substrate W are physically peeled off by the bevel brush 83. The contaminants peeled off from the outer circumferential edge of the substrate W are washed away by the cleaning liquid of the mixed fluid sprayed from the spray nozzle 73 onto the substrate W.

[0085] Furthermore, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the lifting support part 54 is raised so that the cleaning surface of the lower surface brush 51 comes into contact with the outer region of the lower surface of the substrate W. At this time, the lower surface brush 51 is located in a region opposite the spray nozzle 73 and the bevel brush 83 across the straight line L2 in FIG. 4 in a plan view. Also, as shown by a thick solid arrow a18 in FIG. 15, the lower surface brush 51 rotates (spins) around an axis in the vertical direction. Furthermore, the liquid nozzle 52 ejects the cleaning liquid toward the lower surface of the substrate W, and the gas ejection part 53 ejects the gas toward the lower surface of the substrate W. As a result, the lower surface brush 51 can clean the entire outer region of the lower surface of the substrate W that is sucked and held by the suction holding part 21 and rotated.

[0086] The rotation direction of the lower surface brush 51 may be opposite to that of the suction holding unit 21. In this case, the outer region of the lower surface of the substrate W can be efficiently cleaned. In this embodiment, the rotation direction of the suction holding unit 21 is clockwise, and the rotation direction of the lower surface brush 51 is counterclockwise, in a plan view. In addition, if the lower surface brush 51 is not relatively large, the moving support part 55 may move forward and backward between the approach position and the separated position on the movable base 32, as shown by the thick solid arrow a19 in FIG. 15. Even in this case, the entire outer region of the lower surface of the substrate W that is suction-held and rotated by the suction holding unit 21 can be cleaned by the lower surface brush 51.

[0087] Next, when cleaning of the upper surface, the outer peripheral end, and the outer region of the lower surface of the substrate W is completed, the spray nozzle 73 stops spraying the mixed fluid onto the substrate W. Also, as shown by a thick solid arrow a20 in FIG. 16, the spray nozzle 73 moves to a position on one side of the cup 61 (initial state position). Also, as shown by a thick solid arrow a21 in FIG. 16, the bevel brush 83 moves to a position on the other side of the cup 61 (initial state position). Furthermore, the rotation of the lower surface brush 51 is stopped, and the lift support part 54 is lowered so that the cleaning surface of the lower surface brush 51 is separated from the substrate W by a predetermined distance. Also, the discharge of the cleaning liquid from the liquid nozzle 52 onto the substrate W and the spray of the gas from the gas blowing part 53 onto the substrate W are stopped. In this state, the suction holding part 21 rotates at high speed, so that the cleaning liquid adhering to the substrate W is shaken off, and the entire substrate W is dried.

[0088] Next, the cup 61 descends from the upper cup position to the lower cup position, as shown by a thick solid arrow a22 in Fig. 17. Furthermore, in preparation for a new substrate W being carried into the unit housing 2, the lower chucks 11A and 11B approach each other to positions where they can support the new substrate W, as shown by a thick solid arrow a23 in Fig. 17.

[0089] Finally, the substrate W is unloaded from within the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the load / unload opening 2x immediately before the substrate W is unloaded. Thereafter, as indicated by a thick solid arrow a24 in Fig. 18, a hand (substrate holder) RH of a substrate transport robot (not shown) enters the unit housing 2 through the load / unload opening 2x. Next, the hand RH receives the substrate W on the suction holder 21, and exits through the load / unload opening 2x. After the hand RH exits, the shutter 91 closes the load / unload opening 2x.

[0090] (4) Effects In the substrate cleaning apparatus 1 according to the present embodiment, the spray nozzle 73, the bevel brush 83, and the lower surface brush 51 are disposed at a relatively large distance when cleaning the substrate W. Therefore, even when the upper surface, the outer peripheral edge, and the lower surface of the substrate W are simultaneously cleaned by the spray nozzle 73, the bevel brush 83, and the lower surface brush 51, respectively, contaminants generated from one of the cleaning tools hardly adhere to the other cleaning tools. Therefore, there is no need to provide multiple devices for respectively cleaning multiple parts of the substrate W, and there is no need to move the substrate W between the multiple devices. As a result, the substrate W can be efficiently cleaned while preventing the substrate cleaning apparatus 1 from becoming large.

[0091] Moreover, the spray nozzle 73 cleans the upper surface of the substrate W by being scanned from the center of the substrate W toward point P1 in a plan view. In this case, contaminants generated from the spray nozzle 73 hardly adhere to the bevel brush 83 or the lower surface brush 51. Similarly, contaminants generated from the bevel brush 83 or the lower surface brush 51 hardly adhere to the spray nozzle 73. Therefore, the upper surface of the substrate W can be efficiently cleaned by the spray nozzle 73 with a simple configuration. Furthermore, since the lower surface brush 51 is relatively large, the lower surface of the substrate W can be efficiently cleaned.

[0092] (5) Other embodiments (a) In the above embodiment, after the upper holding devices 10A, 10B clean the central region of the underside of the substrate W, the lower holding device 20 cleans the outer region of the underside of the substrate W, but the embodiment is not limited to this. After the lower holding device 20 cleans the outer region of the underside of the substrate W, the upper holding devices 10A, 10B may clean the central region of the underside of the substrate W. Also, cleaning of the central region of the underside of the substrate W may not be performed. In this case, the substrate cleaning apparatus 1 does not include the upper holding devices 10A, 10B and the delivery device 40.

[0093] (b) In the above embodiment, the spray nozzle 73 cleans the upper surface of the substrate W by scanning from the center P0 of the substrate W toward the point P1 in a plan view, but the embodiment is not limited to this. The spray nozzle 73 may clean the upper surface of the substrate W by scanning from the point P1 toward the center P0 of the substrate W in a plan view. In addition, the upper surface of the substrate W is cleaned using the spray nozzle 73 that sprays the mixed fluid, but the embodiment is not limited to this. The upper surface of the substrate W may be cleaned using a brush or a rinse nozzle that ejects a rinse liquid.

[0094] (c) In the above embodiment, substrate cleaning apparatus 1 includes control unit 9, but the embodiment is not limited to this. When substrate cleaning apparatus 1 is configured to be controllable by an external information processing device, substrate cleaning apparatus 1 does not need to include control unit 9.

[0095] (6) Correspondence between each component of the claims and each part of the embodiment Below, examples of the correspondence between each component of the claims and each element of the embodiment will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0096] In the above embodiment, substrate W is an example of a substrate, suction holding portion 21 is an example of a substrate holding portion, points P1 to P3 are examples of first to third points respectively, spray nozzle 73, bevel brush 83 and undersurface brush 51 are examples of first to third cleaning tools respectively, straight lines L1 to L5 are examples of first to fifth straight lines respectively, angles θ1 to θ3 are examples of first to third angles respectively, and the substrate cleaning apparatus is an example of substrate cleaning apparatus 1. (7) Reference form (7-1) A substrate cleaning apparatus according to this reference embodiment includes a substrate holding unit that holds a circular substrate in a horizontal position, a first cleaning tool that cleans an upper surface of the substrate by scanning above the substrate so as to pass through a first point on an outer edge of the substrate in a planar view, a second cleaning tool that cleans an outer peripheral edge of the substrate by contacting a second point on the outer edge of the substrate in a planar view, and a third cleaning tool that cleans an underside of the substrate, wherein an imaginary first line passing through the first point and the second point and an imaginary second line passing through the center of the substrate and parallel to the first line are defined, and the third cleaning tool is positioned below the substrate in an area opposite the first cleaning tool and the second cleaning tool across the second line. In this substrate cleaning apparatus, the first cleaning tool, the second cleaning tool, and the third cleaning tool are arranged at a relatively large distance from each other when cleaning the substrate. Therefore, even if the upper surface, the outer peripheral edge, and the lower surface of the substrate are simultaneously cleaned by the first cleaning tool, the second cleaning tool, and the third cleaning tool, respectively, contaminants generated from one cleaning tool hardly adhere to the other cleaning tools. Therefore, there is no need to provide multiple devices for cleaning multiple parts of the substrate, and there is no need to move the substrate between the multiple devices. As a result, the substrate can be efficiently cleaned while preventing the substrate cleaning apparatus from becoming large. (7-2) A virtual third line extending from the center of the substrate toward the geometric center of the third cleaning tool in a plan view and a third point on the outer edge of the substrate through which the third line passes in a plan view may be further defined, and the first cleaning tool, the second cleaning tool, and the third cleaning tool may be arranged so that the center of the substrate is located within a triangular region having the first point, the second point, and the third point as vertices. In this case, the first cleaning tool, the second cleaning tool, and the third cleaning tool are largely separated from each other when cleaning the substrate. This can prevent contaminants generated from any one of the cleaning tools from adhering to the other cleaning tools. (7-3) A virtual fourth line extending from the center of the substrate toward the first point in a plan view and a virtual fifth line extending from the center of the substrate toward the second point in a plan view may be further defined, and each of a first angle between the third line and the fourth line, a second angle between the fourth line and the fifth line, and a third angle between the fifth line and the third line may be 80 degrees or more. In this case, the first cleaning tool, the second cleaning tool, and the third cleaning tool are spaced apart from each other more widely when cleaning the substrate. This more reliably prevents contaminants generated from any one of the cleaning tools from adhering to the other cleaning tools. (7-4) Each of the first angle, the second angle, and the third angle may be 90 degrees or more. In this case, the first cleaning tool, the second cleaning tool, and the third cleaning tool are spaced apart from each other by a larger distance when cleaning a substrate. This more reliably prevents contaminants generated from one cleaning tool from adhering to the other cleaning tools. (7-5) The first angle may be larger than the second angle. In this case, the first cleaning tool and the third cleaning tool are relatively far apart when cleaning the substrate. Therefore, even if the third cleaning tool is relatively large, contaminants generated from one of the first cleaning tool and the third cleaning tool do not adhere to the other. Therefore, the underside of the substrate can be efficiently cleaned by the third cleaning tool. (7-6) The third angle may be larger than the second angle. In this case, the second cleaning tool and the third cleaning tool are relatively far apart when cleaning the substrate. Therefore, even if the third cleaning tool is relatively large, contaminants generated from one of the second cleaning tool and the third cleaning tool do not adhere to the other. Therefore, the underside of the substrate can be efficiently cleaned by the third cleaning tool. (7-7) The first cleaning tool may clean the upper surface of the substrate by scanning from the center of the substrate toward the first point in a plan view. In this case, contaminants generated from the first cleaning tool hardly adhere to the second cleaning tool or the third cleaning tool. Similarly, contaminants generated from the second cleaning tool or the third cleaning tool hardly adhere to the first cleaning tool. Therefore, the upper surface of the substrate can be efficiently cleaned by the first cleaning tool with a simple configuration. (7-8) Each of the substrate holder and the third cleaning tool may have a circular outer shape, and the diameter of the third cleaning tool may be larger than the diameter of the substrate holder. In this case, the underside of the substrate can be efficiently cleaned by the relatively large third cleaning tool. (7-9) The third cleaning tool may have a circular outer shape and a diameter of the third cleaning tool may be larger than 1 / 3 of the diameter of the substrate. In this case, the lower surface of the substrate can be efficiently cleaned by the relatively large third cleaning tool. [Explanation of symbols]

[0097] 1 ... substrate cleaning device, 2 ... unit housing, 2a ... bottom surface portion, 2b to 2e ... side wall portion, 2x ... loading / unloading port, 9 ... control portion, 10A, 10B ... upper holding device, 11A, 11B ... lower chuck, 12A, 12B ... upper chuck, 13A, 13B ... lower chuck drive portion, 14A, 14B ... upper chuck drive portion, 20 ... lower holding device, 21 ... suction holding portion, 22 ... suction holding drive portion, 30 ... pedestal device, 31 ... linear guide, 32 ... movable pedestal, 33 ... pedestal drive portion, 40 ... delivery device, 41 ... support pin, 42 ... pin connecting member, 43 ... pin lifting drive portion, 50 ... underside cleaning device, 51 ... underside brush, 52 ... liquid nozzle, 53 ... gas ejection portion, 54 ... lifting support portion, 54 u...upper surface, 55...moving support part, 55a...lower surface brush rotating drive part, 55b...lower surface brush lifting drive part, 55c...lower surface brush moving drive part, 56...lower surface cleaning liquid supply part, 57...ejected gas supply part, 60...cup device, 61...cup, 62...cup drive part, 70...upper surface cleaning device, 71, 81...rotating support shaft, 72, 82...arm, 73...spray nozzle, 74...upper surface cleaning drive part, 75...upper surface cleaning fluid supply part, 80...edge cleaning device, 83...bevel brush, 84...bevel brush drive part, 90...opening / closing device, 91...shutter, 92...shutter drive part, L1~L5...straight line, P0...center, P1~P3...point, R...area, rp...plane reference position, W...substrate

Claims

1. a substrate holder that holds a circular substrate in a horizontal position; a first cleaning tool that, in a plan view, cleans an upper surface of the substrate by being scanned above the substrate so as to pass through a first point on an outer edge of the substrate; a second cleaning tool that cleans the outer peripheral edge of the substrate by contacting a second point on the outer edge of the substrate in a plan view; a third cleaning tool for cleaning the lower surface of the substrate; an imaginary first straight line passing through the first point and the second point, and an imaginary second straight line passing through a center of the substrate and parallel to the first straight line are defined; the third cleaning tool is disposed below the substrate and in a region opposite the first cleaning tool and the second cleaning tool across the second straight line; A virtual third straight line extending from the center of the substrate toward the geometric center of the third cleaning tool in a plan view and a third point on the outer edge of the substrate through which the third straight line passes in a plan view are further defined; A substrate cleaning apparatus, wherein the first cleaning tool, the second cleaning tool and the third cleaning tool are arranged so that the center of the substrate is located within a triangular area having vertices of the first point, the second point and the third point.

2. A fourth imaginary straight line extending from a center of the substrate toward the first point in a plan view, and a fifth imaginary straight line extending from the center of the substrate toward the second point in a plan view are further defined; 2. The substrate cleaning apparatus of claim 1, wherein each of a first angle between the third line and the fourth line, a second angle between the fourth line and the fifth line, and a third angle between the fifth line and the third line is greater than or equal to 80 degrees.

3. The substrate cleaning apparatus of claim 2 , wherein each of the first angle, the second angle, and the third angle is greater than or equal to 90 degrees.

4. The substrate cleaning apparatus according to claim 2 , wherein the first angle is greater than the second angle.

5. The substrate cleaning apparatus according to claim 2, wherein the third angle is greater than the second angle.

6. A substrate holding section that holds a circular substrate in a horizontal position; a first cleaning tool that, in a plan view, cleans an upper surface of the substrate by being scanned above the substrate so as to pass through a first point on an outer edge of the substrate; a second cleaning tool that cleans an outer peripheral edge of the substrate by contacting a second point on the outer edge of the substrate in a plan view; a third cleaning tool for cleaning the lower surface of the substrate; an imaginary first straight line passing through the first point and the second point, and an imaginary second straight line passing through a center of the substrate and parallel to the first straight line are defined; the third cleaning tool is disposed below the substrate and in a region opposite the first cleaning tool and the second cleaning tool across the second straight line; A substrate cleaning apparatus, wherein, in a plan view, the second point is at a point other than on a straight line connecting the center of the substrate and the center of the third cleaning tool.

7. The substrate cleaning apparatus according to claim 1 , wherein the first cleaning tool cleans the upper surface of the substrate by being scanned from a center of the substrate toward the first point in a plan view.

8. each of the substrate holder and the third cleaning tool has a circular outer shape; The substrate cleaning apparatus according to claim 1 , wherein a diameter of the third cleaning tool is larger than a diameter of the substrate holding part.

9. The third cleaning tool has a circular outer shape; The substrate cleaning apparatus according to any one of claims 1 to 7, wherein a diameter of the third cleaning tool is greater than ⅓ of a diameter of the substrate.

Images