Substrate cleaning apparatus and substrate cleaning method

Abstract

To provide a substrate cleaning device which can maintain cleanliness of a brush without deteriorating the throughput, and to provide a substrate cleaning method.SOLUTION: A substrate W is held at a horizontal attitude by a substrate holding part. In a processing position, a lower surface of the substrate W held by the substrate holding part is cleaned by a lower surface brush 51. In a standby position which overlaps with the substrate W held by the substrate holding part in a vertical direction and is located below the processing position, the lower surface brush 51 is cleaned by a brush cleaning part. The lower surface brush 51 is moved up or down between the processing position and the stand-by position by a lower surface brush lifting drive part.SELECTED DRAWING: Figure 18

Description

[Technical field]

[0001] The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning the underside of a substrate. [Background technology]

[0002] Substrate processing apparatuses are used to perform various processes on various substrates such as FPD (Flat Panel Display) substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, solar cell substrates, etc. Substrate cleaning apparatuses are used to clean substrates.

[0003] For example, the substrate cleaning apparatus described in Patent Document 1 includes two suction pads that hold the peripheral portion of the back surface of the wafer, a spin chuck that holds the central portion of the back surface of the wafer, and a brush that cleans the back surface of the wafer. The two suction pads hold the wafer and move laterally. In this state, the central portion of the back surface of the wafer is cleaned with the brushes. The spin chuck then receives the wafer from the suction pads, and rotates while holding the central portion of the back surface of the wafer. In this state, the peripheral portion of the back surface of the wafer is cleaned with the brushes. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5904169 Summary of the Invention [Problem to be solved by the invention]

[0005] In a substrate cleaning apparatus, the cleanliness of the brush gradually decreases as substrate cleaning is repeated. If the cleanliness of the brush decreases, the substrate cannot be cleaned efficiently. Therefore, it is required to maintain the cleanliness of the brush at a certain level or higher. However, it is not easy to maintain the cleanliness of the brush without decreasing the throughput.

[0006] An object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method capable of maintaining the cleanliness of a brush without decreasing throughput. [Means for solving the problem]

[0007] (1) A substrate cleaning apparatus according to a first aspect of the present invention includes a substrate holding unit that holds a substrate in a horizontal position, a lower surface brush that cleans the underside of the substrate held by the substrate holding unit at a processing position, a brush cleaning unit that cleans the lower surface brush at a standby position that vertically overlaps the substrate held by the substrate holding unit and is below the processing position, and a lower surface brush lift drive unit that raises and lowers the lower surface brush between the processing position and the standby position. an upper surface cleaning unit that cleans an upper surface of the substrate held by the substrate holding unit; Equipped with The lower surface brush lifting drive unit lifts and lowers the lower surface brush between the processing position and the standby position so that cleaning of the lower surface of the substrate and cleaning of the lower surface brush are performed during the period in which the upper surface of the substrate is cleaned by the upper surface cleaning unit. do.

[0008] In this substrate cleaning apparatus, the standby position of the lower brush vertically overlaps with the substrate held by the substrate holder, so that even if the lower brush is relatively large, the footprint hardly increases. Therefore, by using a relatively large lower brush, it is possible to clean the underside of the substrate in a short time. Therefore, even if a process for cleaning the lower brush is added, the throughput hardly changes. This makes it possible to maintain the cleanliness of the lower brush without reducing the throughput.

[0009] Also Since the underside of the substrate and the underside brush are cleaned during the period in which the upper surface of the substrate is cleaned by the upper surface cleaning section, the cleanliness of the lower surface brush can be maintained without reducing throughput. (2) A substrate cleaning apparatus according to a second aspect of the present invention comprises a substrate holding section which holds a substrate in a horizontal position, a bottom brush which cleans the bottom surface of the substrate held by the substrate holding section at a processing position, a brush cleaning section which cleans the bottom brush at a waiting position which overlaps vertically with the substrate held by the substrate holding section and is below the processing position, and a bottom brush lifting drive section which raises and lowers the bottom brush between the processing position and the waiting position, wherein cleaning of the bottom brush by the brush cleaning section is performed during the substrate cleaning process from when the substrate is loaded into the substrate holding section to when it is unloaded, and the brush cleaning section supplies cleaning liquid to the bottom brush when the bottom brush is in the waiting position so that the cleaning liquid does not adhere to the substrate.

[0010] (3) The lower surface brush lifting drive unit may repeatedly raise and lower the lower surface brush between the processing position and the standby position so that cleaning of the lower surface of the substrate and cleaning of the lower surface brush are performed multiple times. In this case, the lower surface brush can be cleaned in a short time.

[0011] (4) The brush cleaning unit may include a first liquid nozzle that ejects cleaning liquid to the center of the lower-surface brush and a second liquid nozzle that ejects cleaning liquid to the end of the lower-surface brush. With this configuration, even if the lower-surface brush is relatively large, the entire lower-surface brush can be easily cleaned.

[0012] (5) A substrate cleaning apparatus according to a third aspect of the present invention comprises a substrate holding section which holds a substrate in a horizontal position, a lower surface brush which cleans the lower surface of the substrate held by the substrate holding section at a processing position, a brush cleaning section which cleans the lower surface brush at a standby position which overlaps vertically with the substrate held by the substrate holding section and is below the processing position, and a lower surface brush lift drive section which lifts and lowers the lower surface brush between the processing position and the standby position; The brush cleaning unit includes a cleaning tank that stores a cleaning liquid in which the lower brush is immersed. nothing According to this configuration, even if the lower brush is relatively large, the entire lower brush can be easily washed. Also, the lower brush can be cleaned in a short time.

[0013] (6) Each of the substrate holder and the lower brush may have a circular outer shape, and the diameter of the lower brush may be larger than the diameter of the substrate holder. In this case, the lower brush can be made relatively large.

[0014] (7) The substrate and the lower brush each may have a circular outer shape, and the diameter of the lower brush may be greater than 1 / 3 of the diameter of the substrate. In this case, the lower brush can be made relatively large.

[0015] (8) 4 The method for cleaning a substrate according to the present invention includes holding a substrate in a horizontal position by a substrate holder; cleaning an upper surface of the substrate held by the substrate holding unit with an upper surface cleaning unit; The method includes cleaning the underside of the substrate held by the substrate holding unit at the processing position with a lower surface brush, cleaning the lower surface brush with a brush cleaning unit at a standby position that overlaps the substrate held by the substrate holding unit in the vertical direction and is below the processing position, and raising and lowering the lower surface brush between the processing position and the standby position. The cleaning of the lower surface of the substrate and the cleaning of the lower surface brush are performed during the period in which the upper surface of the substrate is cleaned by the upper surface cleaning unit. .

[0016] According to this substrate cleaning method, the standby position of the lower brush vertically overlaps with the substrate held by the substrate holder, so that even if the lower brush is relatively large, the footprint hardly increases. Therefore, by using a relatively large lower brush, it is possible to clean the underside of the substrate in a short time. Therefore, even if a process of cleaning the lower brush is added, the throughput hardly changes. This makes it possible to maintain the cleanliness of the lower brush without reducing the throughput.

[0017] Also Since the underside of the substrate and the underside brush are cleaned during the period in which the upper surface of the substrate is cleaned by the upper surface cleaning section, the cleanliness of the lower surface brush can be maintained without reducing throughput. (9) A fifth aspect of the present invention provides a substrate cleaning method comprising: holding a substrate in a horizontal position using a substrate holding part; cleaning an underside of the substrate held by the substrate holding part with a underside brush at a processing position; cleaning the underside brush with a brush cleaning part at a waiting position that overlaps vertically with the substrate held by the substrate holding part and is below the processing position; and raising and lowering the underside brush between the processing position and the waiting position, wherein cleaning the underside brush with the brush cleaning part is performed during the substrate cleaning process from when the substrate is loaded into the substrate holding part to when it is unloaded, and includes supplying cleaning liquid to the underside brush by the brush cleaning part to prevent the cleaning liquid from adhering to the substrate when the lower side brush is in the waiting position.

[0018] (10) The raising and lowering of the lower brush between the processing position and the standby position may be repeated so that cleaning of the lower surface of the substrate and cleaning of the lower brush are performed multiple times. In this case, the lower brush can be cleaned in a short time.

[0019] (11) Cleaning the lower-surface brush with the brush cleaner may include discharging cleaning liquid to the center of the lower-surface brush with a first liquid nozzle and discharging cleaning liquid to the end of the lower-surface brush with a second liquid nozzle. With this configuration, even if the lower-surface brush is relatively large, the entire lower-surface brush can be easily cleaned.

[0020] (12) A substrate cleaning method according to a sixth aspect of the present invention includes holding a substrate in a horizontal position with a substrate holding part, cleaning an underside of the substrate held by the substrate holding part with a underside brush at a processing position, cleaning the underside brush with a brush cleaning part at a standby position that vertically overlaps the substrate held by the substrate holding part and is below the processing position, and raising and lowering the underside brush between the processing position and the standby position, Cleaning the lower brush by the brush cleaning unit includes immersing the lower brush in cleaning liquid stored in a cleaning tank. nothing .this According to this configuration, even if the lower brush is relatively large, the entire lower brush can be easily cleaned. The lower brush can be cleaned in a short time.

[0021] (13) Each of the substrate holder and the lower brush may have a circular outer shape, and the diameter of the lower brush may be larger than the diameter of the substrate holder. In this case, the lower brush can be made relatively large.

[0022] (14) The substrate and the lower brush may each have a circular outer shape, and the diameter of the lower brush may be greater than 1 / 3 of the diameter of the substrate. In this case, the lower brush can be made relatively large. Effect of the Invention

[0023] According to the present invention, the cleanliness of the lower brush can be maintained without reducing throughput. [Brief description of the drawings]

[0024] [Figure 1] 1 is a schematic plan view of a substrate cleaning apparatus according to a first embodiment of the present invention. [Diagram 2] 2 is an external perspective view showing an internal configuration of the substrate cleaning apparatus of FIG. 1. [Diagram 3] 2 is a block diagram showing a configuration of a control system of the substrate cleaning apparatus. [Figure 4] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Diagram 5] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 6] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 7] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 8] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 9] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 10] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 11] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 12] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 13]2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 14] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 15] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 16] 13 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus in FIG. 12. [Figure 17] 13 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus in FIG. 12. [Figure 18] 13 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus in FIG. 12. [Figure 19] 13 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus in FIG. 12. [Figure 20] 13 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus in FIG. 12. [Figure 21] 13 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus in FIG. 12. [Figure 22] 4 is a flowchart showing a substrate cleaning process performed by the control device of FIG. [Diagram 23] 4 is a flowchart showing a substrate cleaning process performed by the control device of FIG. [Figure 24] 13 is an enlarged cross-sectional view showing a configuration in the vicinity of a lower surface brush of a substrate cleaning apparatus in accordance with a second embodiment. FIG. [Diagram 25] 25 is a schematic diagram for explaining the cleaning operation of the lower surface brush in FIG. 24. [Figure 26] 25 is a schematic diagram for explaining the cleaning operation of the lower surface brush in FIG. 24. [Figure 27] 25 is a schematic diagram for explaining the cleaning operation of the lower surface brush in FIG. 24. [Figure 28] 25 is a schematic diagram for explaining the cleaning operation of the lower surface brush in FIG. 24. [Figure 29] 25 is a schematic diagram for explaining the cleaning operation of the lower surface brush in FIG. 24. [Diagram 30]11 is an enlarged cross-sectional view showing a configuration in the vicinity of a lower surface brush of a substrate cleaning apparatus according to a first modified example. FIG. [Diagram 31] 13 is an enlarged cross-sectional view showing a configuration in the vicinity of a lower surface brush of a substrate cleaning apparatus according to a second modified example. FIG. [Diagram 32] 13 is an enlarged cross-sectional view showing a configuration in the vicinity of a lower surface brush of a substrate cleaning apparatus according to a second modified example. FIG. [Diagram 33] 13 is an enlarged cross-sectional view showing a configuration in the vicinity of a lower surface brush of a substrate cleaning apparatus according to a second modified example. FIG. [Diagram 34] 13 is an enlarged cross-sectional view showing a configuration in the vicinity of a lower surface brush of a substrate cleaning apparatus according to a third modified example. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Hereinafter, a substrate cleaning apparatus and a substrate cleaning method according to an embodiment of the present invention will be described with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate, a substrate for FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. The substrate used in this embodiment has at least a partially circular outer periphery. For example, the outer periphery excluding a positioning notch has a circular shape.

[0026] [1] First embodiment (1) Configuration of the substrate processing device Fig. 1 is a schematic plan view of a substrate cleaning apparatus according to a first embodiment of the present invention. Fig. 2 is an external perspective view showing the internal configuration of the substrate cleaning apparatus 1 of Fig. 1. In the substrate cleaning apparatus 1 according to this embodiment, mutually orthogonal X, Y, and Z directions are defined to clarify the positional relationship. In Fig. 1 and certain figures following Fig. 2, the X, Y, and Z directions are appropriately indicated by arrows. The X and Y directions are mutually orthogonal in a horizontal plane, and the Z direction corresponds to the vertical direction.

[0027] 1, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a pedestal device 30, a delivery device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an edge cleaning device 80, and an opening / closing device 90. These components are provided in a unit housing 2. In FIG. 2, the unit housing 2 is indicated by a dotted line.

[0028] The unit housing 2 has a rectangular bottom surface portion 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom surface portion 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall portion 2b. This opening is an entrance / exit 2x for the substrate W, and is used when the substrate W is carried into and carried out of the unit housing 2. In FIG. 2, the entrance / exit 2x is indicated by a thick dotted line. In the following description, the direction from inside the unit housing 2 through the entrance / exit 2x toward the outside of the unit housing 2 (the direction from the side wall portion 2c to the side wall portion 2b) in the Y direction is referred to as the front, and the opposite direction (the direction from the side wall portion 2b to the side wall portion 2c) is referred to as the rear.

[0029] An opening / closing device 90 is provided in a portion of the side wall 2b where the loading / unloading opening 2x is formed and in an area in the vicinity thereof. The opening / closing device 90 includes a shutter 91 configured to be able to open and close the loading / unloading opening 2x, and a shutter driver 92 that drives the shutter 91. In FIG. 2, the shutter 91 is indicated by a thick two-dot chain line. The shutter driver 92 drives the shutter 91 to open the loading / unloading opening 2x when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1. The shutter driver 92 also drives the shutter 91 to close the loading / unloading opening 2x when the substrate W is cleaned in the substrate cleaning apparatus 1.

[0030] A pedestal device 30 is provided in the center of the bottom surface portion 2a. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal drive unit 33. The linear guide 31 includes two rails and is provided so as to extend in the Y direction from the vicinity of the side wall portion 2b to the vicinity of the side wall portion 2c in a plan view. The movable pedestal 32 is provided so as to be movable in the Y direction on the two rails of the linear guide 31. The pedestal drive unit 33 includes, for example, a pulse motor, and moves the movable pedestal 32 in the Y direction on the linear guide 31.

[0031] The lower holding device 20 and the lower surface cleaning device 50 are provided on the movable base 32 so as to be aligned in the Y direction. The lower holding device 20 includes an adsorption holding unit 21 and an adsorption holding drive unit 22. The adsorption holding unit 21 is a so-called spin chuck, and has a circular adsorption surface capable of adsorbing and holding the lower surface of the substrate W, and is configured to be rotatable around an axis (axis in the Z direction) extending in the vertical direction. In the following description, when the substrate W is adsorbed and held by the adsorption holding unit 21, the region of the lower surface of the substrate W to be adsorbed by the adsorption surface of the adsorption holding unit 21 is referred to as a lower surface central region. Meanwhile, the region of the lower surface of the substrate W surrounding the lower surface central region is referred to as a lower surface outer region.

[0032] The suction-holding drive unit 22 includes a motor. The motor of the suction-holding drive unit 22 is provided on the movable base 32 so that the rotation shaft protrudes upward. The suction-holding unit 21 is attached to the upper end of the rotation shaft of the suction-holding drive unit 22. A suction path is formed in the rotation shaft of the suction-holding drive unit 22 for suctioning and holding the substrate W in the suction-holding unit 21. The suction path is connected to a suction device (not shown). The suction-holding drive unit 22 rotates the suction-holding unit 21 around the rotation shaft.

[0033] A delivery device 40 is further provided on the movable base 32 near the lower holding device 20. The delivery device 40 includes a plurality of support pins 41 (three in this example), a pin connecting member 42, and a pin lifting and lowering drive unit 43. The pin connecting member 42 is formed so as to surround the suction holding unit 21 in a plan view, and connects the plurality of support pins 41. The plurality of support pins 41 extend upward a certain length from the pin connecting member 42 while being connected to one another by the pin connecting member 42. The pin lifting and lowering drive unit 43 raises and lowers the pin connecting member 42 above the movable base 32. As a result, the plurality of support pins 41 rise and lower relative to the suction holding unit 21.

[0034] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, liquid nozzles 52a and 52b, a gas ejection unit 53, a lifting support unit 54, a moving support unit 55, a lower surface brush rotation drive unit 55a, a lower surface brush lifting drive unit 55b, and a lower surface brush moving drive unit 55c. The moving support unit 55 is provided so as to be movable in the Y direction relative to the lower holding device 20 within a certain area on the movable base 32. As shown in Fig. 2, the lifting support unit 54 is provided on the moving support unit 55 so as to be liftable. The lifting support unit 54 has an upper surface 54u that is inclined obliquely downward in a direction away from the suction holding unit 21 (rearward in this example).

[0035] 1, the lower brush 51 has a circular outer shape in a plan view, and is formed to be relatively large in this embodiment. Specifically, the diameter of the lower brush 51 is larger than the diameter of the adsorption surface of the adsorption holding unit 21, for example, 1.3 times the diameter of the adsorption surface of the adsorption holding unit 21. The diameter of the lower brush 51 is also larger than 1 / 3 and smaller than 1 / 2 the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0036] The lower surface brush 51 has a cleaning surface capable of contacting the lower surface of the substrate W. In addition, the lower surface brush 51 is attached to the upper surface 54u of the lifting support part 54 so that the cleaning surface faces upward and so that the cleaning surface can rotate around an axis extending in the vertical direction through the center of the cleaning surface.

[0037] Each of the two liquid nozzles 52 is attached to the upper surface 54u of the lift support part 54 so as to be located near the lower surface brush 51 and so that its liquid discharge port faces upward. A lower surface cleaning liquid supply part 56 (FIG. 3) is connected to the liquid nozzle 52. The lower surface cleaning liquid supply part 56 supplies cleaning liquid to the liquid nozzle 52. When the substrate W is cleaned by the lower surface brush 51, the liquid nozzle 52 discharges the cleaning liquid supplied from the lower surface cleaning liquid supply part 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning liquid supplied to the liquid nozzle 52.

[0038] Each of the two liquid nozzles 52a, 52b is attached to the upper surface 54u of the lift support part 54 so as to be located near the lower surface brush 51 and so that the liquid discharge port faces obliquely upward. A brush cleaning liquid supply part 57 (FIG. 3) is connected to the liquid nozzles 52a, 52b. The brush cleaning liquid supply part 57 supplies cleaning liquid to the liquid nozzles 52a, 52b. When cleaning the lower surface brush 51, the liquid nozzles 52a, 52b discharge the cleaning liquid supplied from the brush cleaning liquid supply part 57 onto the center and end parts of the cleaning surface of the lower surface brush 51, respectively. In this embodiment, pure water is used as the cleaning liquid supplied to the liquid nozzles 52a, 52b.

[0039] The gas ejection part 53 is a slit-shaped gas ejection nozzle having a gas ejection port extending in one direction. The gas ejection part 53 is attached to the upper surface 54u of the lift support part 54 so that it is located between the lower surface brush 51 and the suction holding part 21 in a plan view and the gas ejection port faces upward. A gas ejection supply part 58 (FIG. 3) is connected to the gas ejection part 53. The gas ejection supply part 58 supplies gas to the gas ejection part 53. In this embodiment, an inert gas such as nitrogen gas is used as the gas supplied to the gas ejection part 53. The gas ejection part 53 ejects the gas supplied from the gas ejection supply part 58 onto the lower surface of the substrate W when the substrate W is cleaned by the lower surface brush 51 and when the lower surface of the substrate W is dried, which will be described later. In this case, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding part 21.

[0040] The lower surface brush rotation drive unit 55a includes a motor and rotates the lower surface brush 51 when the lower surface brush 51 cleans the substrate W. The lower surface brush lift drive unit 55b includes a stepping motor or an air cylinder and lifts and lowers the lift support unit 54 relative to the moving support unit 55. The lower surface brush movement drive unit 55c includes a motor and moves the moving support unit 55 in the Y direction on the movable base 32. Here, the position of the lower holding device 20 on the movable base 32 is fixed. Therefore, when the moving support unit 55 is moved in the Y direction by the lower surface brush movement drive unit 55c, the moving support unit 55 moves relative to the lower holding device 20. In the following description, the position of the lower surface cleaning device 50 when it is closest to the lower holding device 20 on the movable base 32 is called the approach position, and the position of the lower surface cleaning device 50 when it is farthest from the lower holding device 20 on the movable base 32 is called the separation position.

[0041] A cup device 60 is further provided in the center of the bottom surface portion 2a. The cup device 60 includes a cup 61 and a cup drive unit 62. The cup 61 is provided so as to surround the lower holding device 20 and the base device 30 in a plan view and is movable up and down. In FIG. 2, the cup 61 is indicated by a dotted line. The cup drive unit 62 moves the cup 61 between a lower cup position and an upper cup position depending on which part of the lower surface of the substrate W is to be cleaned by the lower surface brush 51. The lower cup position is a height position where the upper end of the cup 61 is below the substrate W adsorbed and held by the adsorption holding unit 21. The upper cup position is a height position where the upper end of the cup 61 is above the adsorption holding unit 21.

[0042] A pair of upper holding devices 10A, 10B are provided at a height position above cup 61 so as to face each other across base device 30 in a plan view. Upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck driving unit 13A, and an upper chuck driving unit 14A. Upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck driving unit 13B, and an upper chuck driving unit 14B.

[0043] The lower chucks 11A, 11B are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding part 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A, 11B has two support pieces capable of supporting the peripheral portion of the lower surface of the substrate W from below the substrate W. The lower chuck driving parts 13A, 13B move the lower chucks 11A, 11B so that the lower chucks 11A, 11B approach each other or so that the lower chucks 11A, 11B move away from each other.

[0044] The upper chucks 12A, 12B, like the lower chucks 11A, 11B, are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) passing through the center of the suction holding unit 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A, 12B has two holding pieces configured to be able to hold the outer circumferential end of the substrate W by abutting against two portions of the outer circumferential end of the substrate W. The upper chuck driving units 14A, 14B move the upper chucks 12A, 12B so that the upper chucks 12A, 12B approach each other or move the upper chucks 12A, 12B away from each other.

[0045] 1, an upper surface cleaning device 70 is provided on one side of the cup 61 so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0046] The rotating support shaft 71 is supported on the bottom surface portion 2a so as to extend in the vertical direction and to be movable up and down and rotatable by an upper surface cleaning drive unit 74. As shown in Fig. 2, the arm 72 is provided at a position above the upper holding device 10B and extends horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is attached to the tip of the arm 72.

[0047] An upper surface cleaning fluid supply unit 75 (FIG. 3) is connected to the spray nozzle 73. The upper surface cleaning fluid supply unit 75 supplies a cleaning liquid and a gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid and the gas supplied from the upper surface cleaning fluid supply unit 75 to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0048] The upper surface cleaning drive unit 74 includes one or more pulse motors, an air cylinder, etc., and raises and lowers the rotary support shaft 71 and rotates the rotary support shaft 71. According to the above configuration, by moving the spray nozzle 73 in an arc above the upper surface of the substrate W that is attracted and held by the suction holding unit 21 and rotated, it is possible to clean the entire upper surface of the substrate W.

[0049] 1, an edge cleaning device 80 is provided on the other side of the cup 61 so as to be located near the upper holding device 10A in a plan view. The edge cleaning device 80 includes a rotating support shaft 81, an arm 82, a bevel brush 83, and a bevel brush driving unit 84.

[0050] The rotating support shaft 81 is supported by a bevel brush driving unit 84 on the bottom surface portion 2a so as to extend in the vertical direction and to be movable up and down and rotatable. As shown in Fig. 2, the arm 82 is provided at a position above the upper holding device 10A and extends horizontally from the upper end of the rotating support shaft 81. A bevel brush 83 is provided at the tip of the arm 82 so as to protrude downward and to be rotatable around a vertical axis.

[0051] The upper half of the bevel brush 83 has an inverted truncated cone shape, and the lower half has a truncated cone shape. With this bevel brush 83, the outer periphery edge of the substrate W can be cleaned by the central portion in the up-down direction of the outer periphery surface.

[0052] The bevel brush driving unit 84 includes one or more pulse motors and air cylinders, and raises and lowers the rotary support shaft 81 and rotates the rotary support shaft 81. According to the above configuration, by bringing the central portion of the outer circumferential surface of the bevel brush 83 into contact with the outer circumferential edge of the substrate W that is attracted and held by the attracting and holding unit 21 and rotated, the entire outer circumferential edge of the substrate W can be cleaned.

[0053] Here, the bevel brush driving unit 84 further includes a motor built into the arm 82. The motor rotates the bevel brush 83 provided at the tip of the arm 82 about an axis in the vertical direction. Therefore, when cleaning the outer circumferential edge of the substrate W, the cleaning power of the bevel brush 83 at the outer circumferential edge of the substrate W is improved by the rotation of the bevel brush 83.

[0054] Fig. 3 is a block diagram showing the configuration of a control system of substrate cleaning apparatus 1. Control device 9 in Fig. 3 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and a storage device. The RAM is used as a working area for the CPU. The ROM stores a system program. The storage device stores a control program.

[0055] 3, the control device 9 includes, as its functional parts, a chuck control part 9A, a suction control part 9B, a base control part 9C, a delivery control part 9D, a lower surface cleaning control part 9E, a cup control part 9F, an upper surface cleaning control part 9G, a bevel cleaning control part 9H, and a carry-in / carry-out control part 9I. The functional parts of the control device 9 are realized by the CPU executing, on the RAM, a substrate cleaning program stored in the storage device. Some or all of the functional parts of the control device 9 may be realized by hardware such as electronic circuits.

[0056] The chuck control unit 9A receives the substrate W carried into the substrate cleaning apparatus 1 and controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B to hold the substrate W at a position above the suction holding unit 21. The suction control unit 9B controls the suction holding driving unit 22 to suction and hold the substrate W by the suction holding unit 21 and to rotate the substrate W that is suction-held.

[0057] The pedestal control unit 9C controls the pedestal drive unit 33 to move the movable pedestal 32 relative to the substrate W held by the upper holding devices 10A, 10B. The delivery control unit 9D controls the pin lift drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A, 10B and the height position of the substrate W held by the suction holder 21.

[0058] The lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lift drive unit 55b, the lower surface brush movement drive unit 55c, the lower surface cleaning liquid supply unit 56, and the jet gas supply unit 58 in order to clean the lower surface of the substrate W. The lower surface cleaning control unit 9E also controls the brush cleaning liquid supply unit 57 in order to clean the lower surface brush 51. The cup control unit 9F controls the cup drive unit 62 in order to use a cup 61 to receive the cleaning liquid splashed from the substrate W when the substrate W adsorbed and held by the suction holding unit 21 is cleaned.

[0059] The upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W adsorbed and held by the suction holding unit 21. The bevel cleaning control unit 9H controls the bevel brush drive unit 84 to clean the outer circumferential edge of the substrate W adsorbed and held by the suction holding unit 21. The load / unload control unit 9I controls the shutter drive unit 92 to open and close the load / unload opening 2x of the unit housing 2 when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1.

[0060] (2) Overview of the operation of the substrate cleaning device 4 to 15 are schematic diagrams for explaining the general operation of the substrate cleaning apparatus 1 of FIG. 1. In each of FIGS. 4 to 15, a plan view of the substrate cleaning apparatus 1 is shown in the upper part. A side view of the lower holding device 20 and its periphery as viewed along the Y direction is shown in the middle part, and a side view of the lower holding device 20 and its periphery as viewed along the X direction is shown in the lower part. The side view in the middle part corresponds to the side view along the AA line in FIG. 1, and the side view in the lower part corresponds to the side view along the BB line in FIG. 1. In addition, in order to facilitate understanding of the shape and operating state of each component in the substrate cleaning apparatus 1, the enlargement and reduction ratios of some components are different between the plan view in the upper part and the side views in the middle and lower parts. In addition, in FIGS. 4 to 15, the cup 61 is shown by a two-dot chain line, and the outer shape of the substrate W is shown by a thick dashed line.

[0061] In an initial state before the substrate W is loaded into the substrate cleaning apparatus 1, a shutter 91 of an opening / closing device 90 closes the loading / unloading opening 2x. As shown in Fig. 1, the lower chucks 11A, 11B are maintained in a state in which the distance between them is sufficiently larger than the diameter of the substrate W. The upper chucks 12A, 12B are also maintained in a state in which the distance between them is sufficiently larger than the diameter of the substrate W.

[0062] The movable base 32 of the base device 30 is disposed so that the center of the suction holding unit 21 is located at the center of the cup 61 in a plan view. The lower surface cleaning device 50 is disposed at the approach position on the movable base 32. The lifting support unit 54 of the lower surface cleaning device 50 In In this initial state, the cleaning surface (upper end) of the lower surface brush 51 is located below the suction holding part 21. The position of the lower surface brush 51 in this initial state is called the standby position. When the substrate W is held by the suction holding part 21, the standby position is located below the substrate W.

[0063] In addition, in the delivery device 40, the multiple support pins 41 are located below the suction holding unit 21. Furthermore, in the cup device 60, the cup 61 is in the lower cup position. In the following description, the center position of the cup 61 in a plan view is referred to as the planar reference position rp. Furthermore, the position of the movable base 32 on the bottom surface portion 2a when the center of the suction holding unit 21 is at the planar reference position rp in a plan view is referred to as the first horizontal position.

[0064] The substrate W is loaded into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading / unloading opening 2x immediately before the substrate W is loaded. Thereafter, as indicated by the thick solid arrow a1 in Fig. 4, a hand (substrate holding part) RH of a substrate transport robot (not shown) loads the substrate W into a substantially central position in the unit housing 2 through the loading / unloading opening 2x. At this time, the substrate W held by the hand RH is positioned between the lower chuck 11A and the upper chuck 12A and the lower chuck 11B and the upper chuck 12B as shown in Fig. 4.

[0065] Next, as indicated by thick solid arrow a2 in Fig. 5, the lower chucks 11A, 11B approach each other so that the multiple support pieces of the lower chucks 11A, 11B are positioned below the peripheral portion of the lower surface of the substrate W. In this state, the hand RH descends and exits from the loading / unloading opening 2x. As a result, multiple portions of the peripheral portion of the lower surface of the substrate W held by the hand RH are supported by the multiple support pieces of the lower chucks 11A, 11B. After the hand RH exits, the shutter 91 closes the loading / unloading opening 2x.

[0066] Next, as shown by a thick solid arrow a3 in Fig. 6, the upper chucks 12A and 12B approach each other so that the multiple holding pieces of the upper chucks 12A and 12B come into contact with the outer peripheral end of the substrate W. The multiple holding pieces of the upper chucks 12A and 12B come into contact with multiple portions of the outer peripheral end of the substrate W, so that the substrate W supported by the lower chucks 11A and 11B is further held by the upper chucks 12A and 12B. Also, as shown by a thick solid arrow a4 in Fig. 6, the suction holding unit 21 is shifted a predetermined distance from the planar reference position rp and the movable base 32 moves forward from the first horizontal position so that the center of the lower surface brush 51 is located at the planar reference position rp. At this time, the position of the movable base 32 located on the bottom surface portion 2a is called the second horizontal position.

[0067] Next, as indicated by a thick solid arrow a5 in Fig. 7, the lifting support part 54 rises so that the cleaning surface of the lower surface brush 51 in the standby position comes into contact with the central region of the lower surface of the substrate W. The position of the lower surface brush 51 at this time is called the processing position. Also, as indicated by a thick solid arrow a6 in Fig. 7, the lower surface brush 51 rotates (spins) around an axis in the vertical direction. As a result, contaminants adhering to the central region of the lower surface of the substrate W are physically peeled off by the lower surface brush 51.

[0068] In the lower part of FIG. 7, an enlarged side view of the portion where the lower brush 51 contacts the lower surface of the substrate W is shown in a bubble. As shown in the bubble, with the lower brush 51 in contact with the substrate W, the liquid nozzle 52 and the gas ejection part 53 are held in a position close to the lower surface of the substrate W. At this time, the liquid nozzle 52 ejects the cleaning liquid toward the lower surface of the substrate W at a position close to the lower brush 51, as shown by the outlined arrow a51. As a result, the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W is guided to the contact part between the lower brush 51 and the substrate W, and the contaminants removed from the rear surface of the substrate W by the lower brush 51 are washed away by the cleaning liquid. In this way, in the lower surface cleaning device 50, the liquid nozzle 52 is attached to the lift support part 54 together with the lower brush 51. As a result, the cleaning liquid can be efficiently supplied to the portion of the lower surface of the substrate W cleaned by the lower brush 51. Therefore, the consumption of the cleaning liquid is reduced and excessive scattering of the cleaning liquid is suppressed.

[0069] Here, the upper surface 54u of the lifting support part 54 is inclined obliquely downward in a direction away from the suction holding part 21. In this case, when the cleaning liquid containing contaminants drops from the lower surface of the substrate W onto the lifting support part 54, the cleaning liquid received by the upper surface 54u is guided in a direction away from the suction holding part 21.

[0070] Moreover, when the lower surface of the substrate W is cleaned by the lower surface brush 51, the gas ejection unit 53 ejects gas toward the lower surface of the substrate W at a position between the lower surface brush 51 and the suction holding unit 21, as shown by the white arrow a52 in the blowout in FIG. 7. In this embodiment, the gas ejection unit 53 is attached on the lift support unit 54 so that the gas ejection port extends in the X direction. In this case, when gas is ejected from the gas ejection unit 53 toward the lower surface of the substrate W, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding unit 21. This prevents the cleaning liquid containing contaminants from scattering toward the suction holding unit 21 when the lower surface of the substrate W is cleaned by the lower surface brush 51. Therefore, when the lower surface of the substrate W is cleaned by the lower surface brush 51, the cleaning liquid containing contaminants is prevented from adhering to the suction holding unit 21, and the suction surface of the suction holding unit 21 is kept clean.

[0071] 7, the gas jetting part 53 jets gas obliquely upward from the gas jetting part 53 toward the lower surface brush 51 as shown by the outlined arrow a52, but the present invention is not limited to this. The gas jetting part 53 may jet gas from the gas jetting part 53 toward the lower surface of the substrate W along the Z direction.

[0072] 7, when cleaning of the central region of the lower surface of the substrate W is completed, the rotation of the lower surface brush 51 is stopped, and the lifting support part 54 is lowered so that the cleaning surface of the lower surface brush 51 is spaced a predetermined distance from the substrate W. In addition, the discharge of the cleaning liquid from the liquid nozzle 52 to the substrate W is stopped. At this time, the spray of gas from the gas blowing part 53 to the substrate W continues.

[0073] 8, the movable base 32 moves backward so that the suction and holding part 21 is located at the planar reference position rp. That is, the movable base 32 moves from the second horizontal position to the first horizontal position. At this time, the gas ejection part 53 continues to eject gas onto the substrate W, so that the central region of the lower surface of the substrate W is sequentially dried by the gas curtain.

[0074] Next, as shown by a thick solid arrow a8 in Fig. 9, the lift support part 54 descends so that the cleaning surface of the lower surface brush 51 is positioned below the suction surface (upper end) of the suction holding part 21. This causes the lower surface brush 51 to move to the standby position. Also, as shown by a thick solid arrow a9 in Fig. 9, the upper chucks 12A, 12B move away from each other so that the multiple holding pieces of the upper chucks 12A, 12B are separated from the outer circumferential end of the substrate W. At this time, the substrate W is supported by the lower chucks 11A, 11B.

[0075] 9, the pin connecting member 42 is raised so that the upper ends of the plurality of support pins 41 are positioned slightly above the lower chucks 11A and 11B. As a result, the substrate W supported by the lower chucks 11A and 11B is received by the plurality of support pins 41.

[0076] Next, the lower chucks 11A and 11B move away from each other as indicated by a thick solid arrow a11 in Fig. 10. At this time, the lower chucks 11A and 11B move to positions where they do not overlap the substrate W supported by the multiple support pins 41 in a plan view. As a result, both of the upper holding devices 10A and 10B return to their initial states.

[0077] 11, the pin connecting member 42 is lowered so that the upper ends of the multiple support pins 41 are positioned below the suction holding portion 21. As a result, the substrate W supported on the multiple support pins 41 is received by the suction holding portion 21. In this state, the suction holding portion 21 suction-holds the central region of the lower surface of the substrate W. Simultaneously with the descent of the pin connecting member 42 or after the descent of the pin connecting member 42 is completed, the cup 61 is raised from the lower cup position to the upper cup position, as shown by the thick solid arrow a13 in FIG.

[0078] 12, the suction holding part 21 rotates around the vertical axis (the axis of the rotation axis of the suction holding drive part 22), thereby causing the substrate W sucked and held by the suction holding part 21 to rotate in a horizontal position.

[0079] Next, the rotary support shaft 71 of the upper surface cleaning device 70 rotates and descends. As a result, as shown by a thick solid arrow a15 in Fig. 12, the spray nozzle 73 moves to a position above the substrate W, and descends so that the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixed fluid of a cleaning liquid and a gas onto the upper surface of the substrate W. In addition, the rotary support shaft 71 rotates. As a result, as shown by a thick solid arrow a16 in Fig. 12, the spray nozzle 73 moves to a position above the rotating substrate W. The mixed fluid is sprayed onto the entire upper surface of the substrate W, so that the entire upper surface of the substrate W is cleaned.

[0080] Moreover, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the rotary support shaft 81 of the edge cleaning device 80 also rotates and descends. As a result, the bevel brush 83 moves to a position above the outer circumferential edge of the substrate W, as shown by a thick solid arrow a17 in FIG. 12. Also, the central portion of the outer circumferential surface of the bevel brush 83 descends so as to contact the outer circumferential edge of the substrate W. In this state, the bevel brush 83 rotates (spins) around an axis in the up-down direction. As a result, contaminants adhering to the outer circumferential edge of the substrate W are physically peeled off by the bevel brush 83. The contaminants peeled off from the outer circumferential edge of the substrate W are washed away by the cleaning liquid of the mixed fluid sprayed from the spray nozzle 73 onto the substrate W.

[0081] Furthermore, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the lifting support part 54 is raised so that the cleaning surface of the lower surface brush 51 at the standby position comes into contact with the outer region of the lower surface of the substrate W. This causes the lower surface brush 51 to move to the processing position. Also, as shown by the thick solid arrow a18 in FIG. 12, the lower surface brush 51 rotates (spins) around an axis in the vertical direction. Furthermore, the liquid nozzle 52 ejects the cleaning liquid toward the lower surface of the substrate W, and the gas ejection part 53 ejects gas toward the lower surface of the substrate W. This allows the lower surface brush 51 to clean the entire outer region of the lower surface of the substrate W that is sucked and held by the suction holding part 21 and rotated.

[0082] The rotation direction of the lower surface brush 51 may be opposite to that of the suction holding part 21. In this case, the outer lower surface area of ​​the substrate W can be efficiently cleaned. If the lower surface brush 51 is not relatively large, the moving support part 55 may move forward and backward between a close position and a separated position on the movable base 32, as shown by a thick solid arrow a19 in Fig. 12. Even in this case, the entire outer lower surface area of ​​the substrate W that is suction-held and rotated by the suction holding part 21 can be cleaned by the lower surface brush 51.

[0083] Furthermore, in this embodiment, cleaning of the upper surface of the substrate W using the spray nozzle 73 takes a relatively long time, whereas cleaning of the outer region of the lower surface of the substrate W using the relatively large lower surface brush 51 can be performed in a relatively short time. Therefore, during the period for cleaning the upper surface of the substrate W, cleaning of the outer region of the lower surface of the substrate W with the lower surface brush 51 described above is performed alternately with cleaning of the lower surface brush 51 using the liquid nozzles 52a, 52b in Fig. 1. The cleaning operation of the lower surface brush 51 in Fig. 12 will be described in detail later.

[0084] Next, when cleaning of the upper surface, outer peripheral edge, and lower outer region of the substrate W is completed, spraying of the mixed fluid from the spray nozzle 73 to the substrate W is stopped. Also, as shown by the thick solid arrow a20 in FIG. 13, the spray nozzle 73 moves to a position on one side of the cup 61 (initial state position). Also, as shown by the thick solid arrow a21 in FIG. 13, the bevel brush 83 moves to a position on the other side of the cup 61 (initial state position). Furthermore, rotation of the lower surface brush 51 is stopped, and the lifting support part 54 is lowered so that the cleaning surface of the lower surface brush 51 is separated a predetermined distance from the substrate W. As a result, Bottom brush 51 moves to the standby position. Also, the discharge of the cleaning liquid from the liquid nozzle 52 onto the substrate W and the injection of the gas from the gas ejection part 53 onto the substrate W are stopped. In this state, the suction holding part 21 rotates at high speed, so that the cleaning liquid adhering to the substrate W is shaken off, and the entire substrate W is dried.

[0085] Next, the cup 61 descends from the upper cup position to the lower cup position, as shown by a thick solid arrow a22 in Fig. 14. Also, in preparation for a new substrate W being carried into the unit housing 2, the lower chucks 11A and 11B approach each other to positions where they can support the new substrate W, as shown by a thick solid arrow a23 in Fig. 14.

[0086] Finally, the substrate W is unloaded from within the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading / unloading opening 2x immediately before the substrate W is unloaded. Thereafter, as indicated by a thick solid arrow a24 in Fig. 15, a hand (substrate holder) RH of a substrate transport robot (not shown) enters the unit housing 2 through the loading / unloading opening 2x. Next, the hand RH receives the substrate W on the suction holder 21, and exits through the loading / unloading opening 2x. After the hand RH exits, the shutter 91 closes the loading / unloading opening 2x.

[0087] (3) Cleaning operation of the underside brush Figures 16 to 21 are schematic diagrams for explaining the general operation of the substrate cleaning apparatus 1 in Figure 12. As shown in Figure 16, when cleaning the upper surface of the substrate W in Figure 12, the suction holding part 21 rotates about a vertical axis while suctioning and holding the substrate W, and the spray nozzle 73 is moved above approximately the center of the substrate W. In this state, a mixed fluid of a cleaning liquid and a gas is sprayed from the spray nozzle 73 onto the upper surface of the substrate W.

[0088] 12 starts cleaning the outer peripheral edge of the substrate W. At this time, the contamination level of the outer region of the lower surface of the substrate W is 100%, and the contamination level of the lower surface brush 51 is 0%. Here, the contamination level is an index showing the low level of cleanliness, and a high contamination level means a low level of cleanliness.

[0089] Next, as shown in Fig. 17, the spray nozzle 73 is moved outward above the rotating substrate W. This movement of the spray nozzle 73 is continued until the spray nozzle 73 reaches above the outer periphery of the substrate W. Furthermore, the lower surface brush 51 is raised from the standby position to an upper processing position while rotating so that the cleaning surface of the lower surface brush 51 comes into contact with the outer region of the lower surface of the substrate W. Furthermore, a cleaning liquid is ejected from the liquid nozzle 52 in Fig. 12 onto the lower surface of the substrate W. This cleans the outer region of the lower surface of the substrate W. When the outer region of the lower surface of the substrate W is cleaned, gas is ejected from the gas ejection part 53 in Fig. 12 toward the lower surface of the substrate W.

[0090] 17, it is assumed that contaminants corresponding to a contamination level of 60% are transferred to the lower surface brush 51. It is also assumed that, of the contaminants adhering to the substrate W, contaminants corresponding to a contamination level of 20% are washed away by the cleaning liquid. In this case, the contamination level of the lower surface outer region of the substrate W falls to 20%, and the contamination level of the lower surface brush 51 rises to 60%.

[0091] 18, the lower brush 51 is lowered from the processing position to a waiting position while rotating so that the cleaning surface of the lower brush 51 is separated from the outer region of the lower surface of the substrate W. At the waiting position, cleaning liquid is discharged from the liquid nozzle 52a toward the center of the cleaning surface of the lower brush 51, and cleaning liquid is discharged from the liquid nozzle 52b toward the end of the cleaning surface of the lower brush 51. This cleans the lower brush 51. In this example, the cleaning liquid discharged from the liquid nozzle 52a is supplied parabolically from obliquely above to the center of the cleaning surface of the lower brush 51. Ultrasonic cleaning may be used in combination to clean the lower brush 51.

[0092] 18, it is assumed that contaminants adhering to the lower surface brush 51, for example, contaminants corresponding to a contamination level of 20%, are washed away by the cleaning liquid. In this case, the contamination level of the outer region of the lower surface of the substrate W remains at 20%, and the contamination level of the lower surface brush 51 drops to 40%.

[0093] 19, the lower brush 51 is raised from the standby position to an upper processing position while rotating so that the cleaning surface of the lower brush 51 comes into contact with the outer region of the lower surface of the substrate W, thereby again cleaning the outer region of the lower surface of the substrate W. The cleaning operation of the outer region of the lower surface of the substrate W in FIG. 19 is the same as the cleaning operation of the outer region of the lower surface of the substrate W in FIG.

[0094] 19, contaminants are transferred between the lower surface outer region of the substrate W and the lower surface brush 51. However, at this point in time, the degree of contamination of the lower surface brush 51 is greater than the degree of contamination of the lower surface outer region of the substrate W. Therefore, the amount of contaminants transferred from the lower surface brush 51 to the lower surface outer region of the substrate W is greater than the amount of contaminants transferred from the lower surface outer region of the substrate W to the lower surface brush 51. Therefore, essentially, the contaminants adhering to the lower surface brush 51 are transferred to the lower surface outer region of the substrate W.

[0095] Of the contaminants adhering to the lower surface brush 51, for example, contaminants corresponding to a contamination level of 20% are transferred to the outer lower surface region of the substrate W. Also, for example, contaminants corresponding to a contamination level of 20% are washed away by the cleaning liquid. In this case, the contamination level of the outer lower surface region of the substrate W remains at 20%, and the contamination level of the lower surface brush 51 decreases to 20%.

[0096] 20, the lower brush 51 is again cleaned by lowering from the processing position to a lower standby position while rotating so that the cleaning surface of the lower brush 51 is separated from the outer region of the lower surface of the substrate W. The cleaning operation of the lower brush 51 in FIG. 20 is the same as the cleaning operation of the lower brush 51 in FIG.

[0097] 20, it is assumed that contaminants adhering to the lower surface brush 51, for example, contaminants corresponding to a contamination level of 20%, are washed away by the cleaning liquid. In this case, the contamination level of the outer region of the lower surface of the substrate W remains at 20%, and the contamination level of the lower surface brush 51 drops to 0%.

[0098] The cleaning operation of the outer lower surface region of the substrate W in Fig. 19 and the cleaning operation of the lower brush 51 in Fig. 20 are repeated. In this case, in the cleaning operation of the outer lower surface region of the substrate W, contaminants are transferred between the outer lower surface region of the substrate W and the lower brush 51. Here, the degree of contamination of the outer lower surface region of the substrate W is currently greater than the degree of contamination of the lower brush 51. Therefore, the contaminants adhering to the outer lower surface region of the substrate W are essentially transferred to the lower brush 51. As a result, the degree of contamination of the outer lower surface region of the substrate W decreases.

[0099] Furthermore, even if the degree of contamination of the lower surface brush 51 increases during the cleaning operation of the outer lower surface region of the substrate W, the degree of contamination of the lower surface brush 51 decreases due to the cleaning operation of the lower surface brush 51 executed thereafter. Therefore, by repeating the cleaning operation of the outer lower surface region of the substrate W and the cleaning operation of the lower surface brush 51, it is possible to reduce both the degree of contamination of the outer lower surface region of the substrate W and the degree of contamination of the lower surface brush 51 to 0%. Furthermore, since the cleaning operation of the outer lower surface region of the substrate W and the cleaning operation of the lower surface brush 51 are repeated during the cleaning period of the upper surface of the substrate W, throughput does not decrease.

[0100] 21, the spray nozzle 73 reaches above the outer periphery of the substrate W. The spray of the mixed fluid from the spray nozzle 73 to the substrate W is stopped, thereby completing cleaning of the upper surface of the substrate W. Furthermore, the rotation of the lower surface brush 51 is stopped and the lower surface brush 51 is moved to the standby position, thereby completing cleaning of the outer region of the lower surface of the substrate W and cleaning of the lower surface brush 51.

[0101] In the present embodiment, the cleaning liquid used to clean the lower surface brush 51 is pure water, but the embodiment is not limited to this. The cleaning liquid used to clean the lower surface brush 51 may be warm water, functional water, weak alkaline water, or a chemical liquid. When the cleaning liquid is a chemical liquid, the type of the chemical liquid may be changed appropriately depending on the type of contaminant to be removed.

[0102] Also, the liquid nozzles 52a, 52b stop discharging the cleaning liquid when the lower surface brush 51 is in the processing position, but the embodiment is not limited to this. The liquid nozzles 52a, 52b may also discharge the cleaning liquid when the lower surface brush 51 is in the processing position, i.e., during cleaning of the outer region of the lower surface of the substrate W. Furthermore, the liquid nozzles 52a, 52b may also discharge the cleaning liquid during the period when the lower surface brush 51 is moving up and down between the standby position and the processing position.

[0103] (4) Substrate cleaning process Figures 22 and 23 are flow charts showing the substrate cleaning process by the control device 9 of Figure 3. The substrate cleaning process of Figures 22 and 23 is performed by the CPU of the control device 9 executing a substrate cleaning program stored in the storage device on the RAM. The substrate cleaning process will be described below using the control device 9 of Figure 3 and the substrate cleaning apparatus 1 of Figures 4 to 21 along with the flow charts of Figures 22 and 23.

[0104] First, the loading / unloading control unit 9I controls the shutter driving unit 92 to load the substrate W into the unit housing 2 (FIGS. 4, 5, and step S1). Next, the chuck control unit 9A controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B to hold the substrate W by the upper holding devices 10A, 10B (FIGS. 5, 6, and step S2).

[0105] Next, the pedestal control unit 9C controls the pedestal drive unit 33 to move the movable pedestal 32 from the first horizontal position to the second horizontal position (FIG. 6 and step S3). Thereafter, the lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lift drive unit 55b, the lower surface brush movement drive unit 55c, the lower surface cleaning liquid supply unit 56, and the jet gas supply unit 58 to clean the central region of the lower surface of the substrate W (FIG. 7 and step S4).

[0106] Next, the lower surface cleaning control unit 9E controls the jet gas supply unit 58 to dry the substrate W (FIG. 8 and step S5). Furthermore, the pedestal control unit 9C controls the pedestal driving unit 33 to move the movable pedestal 32 from the second horizontal position to the first horizontal position (FIG. 8 and step S6). In this example, steps S5 and S6 are performed substantially simultaneously. As a result, the central region of the lower surface of the substrate W is sequentially dried.

[0107] Next, the chuck control unit 9A controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B, and the delivery control unit 9D controls the pin lifting and lowering driving unit 43, thereby delivering the substrate W from the upper holding devices 10A, 10B to the lower holding device 20 (FIGS. 8 to 11 and step S7). In this state, the suction control unit 9B controls the suction hold driving unit 22 to suction the central region of the lower surface of the substrate W, thereby causing the lower holding device 20 to hold the substrate W (FIG. 11 and step S8).

[0108] Thereafter, step S9, step S10, and steps S11 to S13 are executed in parallel. When steps S9 to S13 are executed, the suction control unit 9B controls the suction hold driving unit 22 to rotate the substrate W around the axis of the rotation shaft of the suction hold driving unit 22. In addition, the cup control unit 9F controls the cup driving unit 62 to raise the cup 61 from the lower cup position to the upper cup position.

[0109] In step S9, the upper surface cleaning control unit 9G controls the upper surface cleaning driving unit 74 and the upper surface cleaning fluid supply unit 75 to clean the entire upper surface of the substrate W (FIG. 12, FIGS. 16 to 21, and step S9). In step S10, the bevel cleaning control unit 9H controls the bevel brush driving unit 84 to clean the outer circumferential edge of the substrate W (FIG. 12 and step S10).

[0110] In step S11, the lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lift drive unit 55b, the lower surface cleaning liquid supply unit 56, and the jet gas supply unit 58 to clean the outer lower surface region of the substrate W (FIGS. 12, 17, and step S11). If the lower surface brush 51 is not relatively large, the lower surface cleaning control unit 9E may further control the lower surface brush movement drive unit 55c to move the lower surface brush 51 together with the movable base 32 in the Y direction so that the outer lower surface region of the substrate W is cleaned.

[0111] Next, in step S12, the lower surface cleaning control unit 9E cleans the lower surface brush 51 by controlling the lower surface brush rotation drive unit 55a, the lower surface brush lift drive unit 55b, the brush cleaning liquid supply unit 57, and the jet gas supply unit 58 (FIG. 18 and step S12). Subsequently, in step S13, the lower surface cleaning control unit 9E determines whether the lower surface brush 51 has been cleaned a predetermined number of times (step S13).

[0112] The number of times the lower-surface brush 51 is cleaned is set in advance. The number of times the lower-surface brush 51 is cleaned may be any number of times, but is preferably two or more. In addition, the number of times the lower-surface brush 51 is cleaned is preferably the number of times that can be performed within the period in which step S9 is performed.

[0113] If the lower surface brush 51 has not been cleaned the predetermined number of times, the lower surface cleaning control unit 9E returns to step S11. In this case, in step S11, the outer lower surface region of the substrate W is cleaned again (FIG. 19). Also, in step S12, the lower surface brush 51 is cleaned again (FIG. 20). Steps S11 to S13 are repeated until the lower surface brush 51 has been cleaned the predetermined number of times. This makes it possible to reduce the degree of contamination of both the outer lower surface region of the substrate W and the lower surface brush 51 to 0%.

[0114] When the lower brush 51 has been cleaned a predetermined number of times and steps S9 to S13 are completed, the suction control unit 9B controls the suction holding drive unit 22 to rotate the suction holding unit 21 at high speed, thereby drying the entire substrate W (FIG. 13 and step S14). After drying is completed, the upper holding devices 10A, 10B and the cup 61 are returned to their initial states (FIG. 14). Finally, the carry-in / carry-out control unit 9I controls the shutter drive unit 92 to carry-out the substrate W from the unit housing 2 (FIG. 15 and step S15), thereby completing the substrate cleaning process.

[0115] (5) Effects In the substrate cleaning apparatus 1 according to this embodiment, the standby position of the lower surface brush 51 vertically overlaps with the substrate W held by the lower holding device 20, so that even if the lower surface brush 51 is relatively large, the footprint hardly increases. Therefore, by using a relatively large lower surface brush 51, it becomes possible to clean the lower surface of the substrate W in a short time.

[0116] Furthermore, since cleaning of the lower surface of the substrate W and cleaning of the lower surface brushes 51 are performed during the period in which the upper surface of the substrate W is cleaned by the upper surface cleaning device 70, the throughput does not change even if a process of cleaning the lower surface brushes 51 is provided. This makes it possible to maintain the cleanliness of the lower surface brushes 51 without reducing the throughput.

[0117] Furthermore, the lower surface brush 51 is repeatedly raised and lowered by the lower surface brush lifting drive unit 55b between the processing position and the standby position so that cleaning of the underside of the substrate W and cleaning of the lower surface brush 51 are performed multiple times. With this configuration, the lower surface brush 51 can be cleaned in a short time compared to a case in which the cleaning surface of the lower surface brush 51 is kept in contact with the underside of the substrate W for a long period of time. Also, since it is not necessary to keep the cleaning surface of the lower surface brush 51 in contact with the underside of the substrate W for a long period of time, wear on the lower surface brush 51 can be minimized.

[0118] When cleaning the lower brush 51, the liquid nozzle 52a ejects cleaning liquid onto the center of the lower brush 51, and the liquid nozzle 52b ejects cleaning liquid onto the end of the lower brush 51. With this configuration, even if the lower brush 51 is relatively large, the entire lower brush 51 can be easily cleaned.

[0119] [2] Second embodiment (1) Configuration of substrate cleaning equipment Regarding substrate cleaning apparatus 1 according to the second embodiment, differences from substrate cleaning apparatus 1 according to the first embodiment will be described. FIG. 24 is an enlarged cross-sectional view showing a configuration in the vicinity of lower surface brush 51 of substrate cleaning apparatus 1 according to the second embodiment. As shown in FIG. 24, substrate cleaning apparatus 1 according to this embodiment further includes a cleaning tank 100 arranged at a standby position. Cleaning tank 100 has a cup shape and stores a cleaning liquid. Furthermore, cleaning tank 100 accommodates lower surface brush 51 at the standby position.

[0120] The lower surface cleaning device 50 does not include a lifting support part 54, and the lower surface brush 51 is attached to the upper end of the rotation shaft of the lower surface brush rotation drive part 55a. The lower surface cleaning device 50 also includes a liquid nozzle 52c instead of the liquid nozzles 52a and 52b of FIG. 16. The liquid nozzle 52c is supported by a support member (not shown) and is connected to the brush cleaning liquid supply part 57 of FIG. 3. The brush cleaning liquid supply part 57 supplies cleaning liquid to the liquid nozzle 52c. The liquid nozzle 52c discharges the cleaning liquid supplied by the brush cleaning liquid supply part 57 into the cleaning tank 100.

[0121] Furthermore, in this embodiment, the liquid nozzle 52 and the gas jetting part 53 in Fig. 12 are supported by a support member (not shown). The operations of the liquid nozzle 52 and the gas jetting part 53 in this embodiment are similar to those of the liquid nozzle 52 and the gas jetting part 53 in the first embodiment, respectively.

[0122] A flat blocking portion 110 is attached to the rotation shaft of the lower brush rotation drive portion 55a below the lower brush 51. An opening 101 through which the rotation shaft of the lower brush rotation drive portion 55a is inserted is formed in the bottom surface of the cleaning tank 100. The cleaning liquid stored in the cleaning tank 100 is gradually discharged from the opening 101. The area of ​​the opening 101 is smaller than the area of ​​the bottom of the lower brush 51 and smaller than the area of ​​the blocking portion 110.

[0123] When the lower brush 51 descends to the standby position, the blocking portion 110 moves away from the bottom of the cleaning tank 100, while the bottom of the lower brush 51 comes into contact with the upper part of the bottom surface of the cleaning tank 100 so as to overlap with the opening 101. This closes the opening 101. When the lower brush 51 ascends to the processing position, the lower brush 51 moves away from the bottom of the cleaning tank 100, while the blocking portion 110 comes into contact with the lower part of the bottom surface of the cleaning tank 100 so as to overlap with the opening 101. This closes the opening 101.

[0124] The flow rate of the cleaning liquid discharged from the opening 101 when the opening 101 is blocked is smaller than the flow rate of the cleaning liquid discharged from the opening 101 when the opening 101 is not blocked. That is, the opening 101 does not have to be completely blocked. Therefore, when the lower brush 51 is in the standby position, the bottom of the lower brush 51 does not have to be in firm contact with the upper part of the bottom surface of the cleaning tank 100. Also, when the lower brush 51 is in the processing position, the blocking part 110 does not have to be in firm contact with the lower part of the bottom surface of the cleaning tank 100.

[0125] (2) Operation of the substrate cleaning device Figures 25 to 29 are schematic diagrams for explaining the cleaning operation of the lower surface brush 51 in Figure 24. The substrate cleaning apparatus 1 according to this embodiment operates basically in the same manner as the substrate cleaning apparatus 1 according to the first embodiment shown in Figures 4 to 15. Therefore, in Figures 25 to 29, description of the operation of the substrate cleaning apparatus 1 other than the cleaning operation of the lower surface brush 51 in Figure 12 is omitted, but cleaning of the upper surface of the substrate W is also performed in parallel.

[0126] 25, before cleaning the outer region of the lower surface of the substrate W, the lower surface brush 51 is accommodated in the cleaning tank 100 at the standby position. At this time, a portion of the cleaning liquid used in the immediately preceding cleaning step of the lower surface brush 51 may remain in the cleaning tank 100. In this case, the cleaning liquid stored in the cleaning tank 100 is gradually discharged from the opening 101.

[0127] 26, the lower surface brush 51 is raised from the standby position to the upper processing position so that the cleaning surface of the lower surface brush 51 contacts the outer region of the lower surface of the substrate W. Furthermore, cleaning liquid is discharged from the liquid nozzle 52c into the cleaning tank 100. In this case, since the opening 101 is blocked by the blocking portion 110, the amount of cleaning liquid supplied into the cleaning tank 100 per unit time is greater than the amount of cleaning liquid discharged from the cleaning tank 100.

[0128] Subsequently, as shown in Fig. 27, the lower surface brush 51 is rotated by the lower surface brush rotation drive unit 55a. At this time, the cleaning liquid is discharged from the liquid nozzle 52 in Fig. 12 onto the lower surface of the substrate W, and gas is sprayed from the gas ejection unit 53 in Fig. 12 toward the lower surface of the substrate W. This cleans the outer region of the lower surface of the substrate W. During the period in which the outer region of the lower surface of the substrate W is cleaned, the opening 101 is blocked by the blocking unit 110 while the cleaning liquid continues to be discharged from the liquid nozzle 52c, so that the liquid level of the cleaning liquid in the cleaning tank 100 rises.

[0129] After cleaning the outer underside region of the substrate W, as shown in Fig. 28, the rotation of the lower brush 51 and the discharge of the cleaning liquid from the liquid nozzle 52c are stopped. In addition, the lower brush 51 is lowered from the processing position to a lower standby position so that the cleaning surface of the lower brush 51 is separated from the outer underside region of the substrate W. In this case, the cleaning liquid is gradually discharged from the opening 101, but since the opening 101 is blocked by the lower brush 51, a sufficient amount of cleaning liquid remains in the cleaning tank 100. Therefore, the lower brush 51 is immersed in the cleaning liquid stored in the cleaning tank 100.

[0130] Finally, as shown in Fig. 29, the lower brush 51 is rotated by the lower brush rotation drive unit 55a. In this case, an outward flow of cleaning liquid is generated in the cleaning tank 100. As a result, contaminants adhering to the lower brush 51 are efficiently removed, and the removed contaminants are discharged from the opening 101 together with the cleaning liquid. As a result, the lower brush 51 is cleaned. In this embodiment as well, ultrasonic cleaning may be used in combination to clean the lower brush 51.

[0131] A small amount of chemical liquid may be added to the cleaning liquid. In this case, the cleaning liquid to which the chemical liquid has been added is stirred in the cleaning tank 100, so that the lower brush 51 is efficiently cleaned with a small amount of cleaning liquid. This makes it possible to reduce the consumption of cleaning liquid. When the contaminants are particles such as resist, the chemical liquid added may be an alkaline aqueous solution. When the contaminants contain metal components, the chemical liquid added may be an acidic aqueous solution.

[0132] Also, the liquid nozzle 52c stops discharging the cleaning liquid when the lower surface brush 51 is in the standby position, but the embodiment is not limited to this. The liquid nozzle 52c may also discharge the cleaning liquid when the lower surface brush 51 is in the standby position. Furthermore, the liquid nozzle 52c may also discharge the cleaning liquid during the period when the lower surface brush 51 moves up and down between the standby position and the processing position.

[0133] In Fig. 26, rotation of the lower brush 51 may be started before the lower brush 51 moves to the processing position. Similarly, in Fig. 29, rotation of the lower brush 51 may be started before the lower brush 51 moves to the standby position. That is, the lower brush 51 may also be rotated during movement between the standby position and the processing position. On the other hand, in the cleaning operation of the lower brush 51 in Fig. 29, the lower brush 51 is rotated at the standby position, but if the lower brush 51 is sufficiently cleaned in the cleaning tank 100, the lower brush 51 does not need to be rotated at the standby position.

[0134] (3) Effects In the substrate cleaning apparatus 1 according to this embodiment, the standby position of the lower surface brush 51 also overlaps in the vertical direction with the substrate W held by the lower holding device 20, so that even if the lower surface brush 51 is relatively large, the footprint hardly increases. Therefore, by using a relatively large lower surface brush 51, it is possible to clean the lower surface of the substrate W in a short time. Therefore, even if a process of cleaning the lower surface brush 51 is provided, the throughput does not change. This makes it possible to maintain the cleanliness of the lower surface brush 51 without reducing the throughput.

[0135] When cleaning the lower brush 51, the lower brush 51 is immersed in the cleaning liquid stored in the cleaning tank 100. With this configuration, even if the lower brush 51 is relatively large, the entire lower brush 51 can be easily cleaned. Also, since it is not necessary to keep the cleaning surface of the lower brush 51 in contact with the underside of the substrate W for a long period of time, wear of the lower brush 51 can be minimized.

[0136] (4) Variations In this embodiment, the substrate cleaning apparatus 1 includes a blocking portion 110, but the embodiment is not limited thereto. Fig. 30 is an enlarged cross-sectional view showing a configuration in the vicinity of the lower surface brush 51 of the substrate cleaning apparatus 1 according to the first modified example. As shown in Fig. 30, in this modified example, the area of ​​the opening 101 of the cleaning tank 100 is relatively small and is slightly larger than the cross-sectional area of ​​the rotation shaft of the lower surface brush rotation drive unit 55a. In this case, the amount of cleaning liquid discharged from the cleaning tank 100 per unit time is relatively small, so that the substrate cleaning apparatus 1 does not include the blocking portion 110.

[0137] 31 to 33 are enlarged cross-sectional views showing the configuration near undersurface brush 51 of substrate cleaning apparatus 1 according to a second modified example. As shown in Fig. 31, substrate cleaning apparatus 1 according to this modified example further includes a cleaning tank lifting drive unit 55d and an outer tank 120. Cleaning tank lifting drive unit 55d includes a stepping motor or an air cylinder, and lifts and lowers cleaning tank 100 relative to movement support unit 55 of Fig. 1 under the control of undersurface cleaning control unit 9E of Fig. 3.

[0138] The cleaning tank lifting drive unit 55d has a hollow drive shaft. The drive shaft of the cleaning tank lifting drive unit 55d is attached to the lower part of the bottom surface of the cleaning tank 100 so as to surround the opening 101 and the rotation shaft of the lower surface brush rotation drive unit 55a. The outer tank 120 has a cup shape, and is disposed so as to surround the cleaning tank 100 in the standby position. The bottom surface of the outer tank 120 is formed with an opening 121 through which the rotation shaft of the lower surface brush rotation drive unit 55a and the drive shaft of the cleaning tank lifting drive unit 55d are inserted.

[0139] When cleaning the outer underside region of the substrate W, the lower brush 51 is raised from the standby position to the processing position by the lower brush lifting drive unit 55b in FIG. 3, as shown in FIG. 32. Also, the cleaning tank 100 is raised from the standby position by the cleaning tank lifting drive unit 55d so as to approach the substrate W. In this state, the lower brush 51 is rotated to clean the outer underside region of the substrate W. Also, the cleaning liquid splashed from the lower brush 51 is received by the outer tank 120. This prevents the periphery of the cleaning tank 100 from being contaminated.

[0140] After cleaning the outer lower surface region of the substrate W, the lower brush 51 may be lowered from the processing position by the lower brush lifting drive unit 55b until the cleaning surface of the lower brush 51 becomes equal to or lower than the height of the upper end of the cleaning tank 100, as shown in FIG. 33. In this state, the liquid nozzle 52c may discharge into the cleaning tank 100 an amount of cleaning liquid that is greater than the amount of cleaning liquid discharged from the cleaning tank 100 per unit time. In this case, the cleaning liquid overflows from the cleaning tank 100, and a liquid column of the cleaning liquid is formed between the substrate W and the cleaning surface of the lower brush 51. The lower brush 51 is cleaned by this liquid column of the cleaning liquid. As a result, the amount of cleaning liquid used to clean the lower brush 51 can be reduced.

[0141] Fig. 34 is an enlarged cross-sectional view showing the configuration of the vicinity of the undersurface brush 51 of the substrate cleaning apparatus 1 according to the third modified example. As shown in Fig. 34, the substrate cleaning apparatus 1 according to this modified example further includes a cleaning tank rotation drive unit 55e. The cleaning tank rotation drive unit 55e includes, for example, a motor, and rotates the cleaning tank lift drive unit 55d via a power transmission member such as a belt and a pulley based on the control of the undersurface cleaning control unit 9E of Fig. 9. This allows the cleaning tank 100 to rotate.

[0142] Furthermore, a plurality of drain holes 102 are formed in the side wall of the cleaning tank 100. When the lower surface brush 51 is cleaned, the cleaning tank 100 is rotated by the cleaning tank rotation drive unit 55e. In this case, the cleaning liquid in the cleaning tank 100 is discharged from the plurality of drain holes 102, and an outward flow of the cleaning liquid is generated in the cleaning tank 100. This allows contaminants adhering to the lower surface brush 51 to be efficiently removed, and the removed contaminants are discharged from the drain holes 102 together with the cleaning liquid. As a result, the lower surface brush 51 is cleaned.

[0143] In this modification, when the lower brush 51 is cleaned, the lower brush 51 may be rotated in the direction opposite to the direction of rotation of the cleaning tank 100. In this case, an outward flow of cleaning liquid can be more easily generated in the cleaning tank 100. This makes it possible to more efficiently remove contaminants adhering to the lower brush 51. Also, in this modification, if an outward flow of cleaning liquid can be easily generated in the cleaning tank 100, the cleaning tank 100 does not need to have the drain hole 102 formed.

[0144] [3] Other embodiments (1) In the above embodiment, after the upper holding devices 10A, 10B clean the central region of the underside of the substrate W, the lower holding device 20 cleans the outer region of the underside of the substrate W and cleans the lower brush 51, but the embodiment is not limited to this. After the lower holding device 20 cleans the outer region of the underside of the substrate W and cleans the lower brush 51, the upper holding devices 10A, 10B may clean the central region of the underside of the substrate W. Also, cleaning of the central region of the underside of the substrate W may not be performed. In this case, the substrate cleaning apparatus 1 does not include the upper holding devices 10A, 10B and the delivery device 40.

[0145] (2) In the above embodiment, the upper surface of the substrate W is cleaned using the spray nozzle 73, but the embodiment is not limited to this. The upper surface of the substrate W may be cleaned using a brush, or may be cleaned using a rinse nozzle that ejects a rinse liquid. Also, the upper surface of the substrate W does not have to be cleaned. In this case, the substrate cleaning apparatus 1 does not include the upper surface cleaning device 70. Similarly, the outer circumferential edge of the substrate W does not have to be cleaned. In this case, the substrate cleaning apparatus 1 does not include the edge cleaning device 80.

[0146] (3) In the above embodiment, substrate cleaning apparatus 1 includes control device 9, but the embodiment is not limited to this. When substrate cleaning apparatus 1 is configured to be controllable by an external information processing device, substrate cleaning apparatus 1 does not need to include control device 9.

[0147] (4) In the first embodiment, the lower surface brush 51 is cleaned by the cleaning liquid discharged from the liquid nozzles 52a and 52b, but the embodiment is not limited to this. The substrate cleaning apparatus 1 may include a liquid nozzle 52c and a cleaning tank 100 instead of the liquid nozzles 52a and 52b, as in the second embodiment. In this case, the lower surface brush 51 may be cleaned by the cleaning liquid discharged from the liquid nozzle 52c in the cleaning tank 100. Furthermore, cleaning of the outer region of the lower surface of the substrate W at the processing position and cleaning of the lower surface brush 51 at the standby position may or may not be repeated.

[0148] [4] Correspondence between each component of the claims and each part of the embodiment Below, examples of the correspondence between each component of the claims and each element of the embodiment will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0149] In the above-mentioned embodiment, the substrate W is an example of a substrate, the suction holding unit 21 is an example of a substrate holding unit, the lower surface brush 51 is an example of a lower surface brush, the liquid nozzles 52a, 52b or the cleaning tank 100 is an example of a brush cleaning unit, and the lower surface brush lifting drive unit 55b is an example of a lower surface brush lifting drive unit. The substrate cleaning apparatus 1 is an example of a substrate cleaning apparatus, the upper surface cleaning apparatus 70 is an example of an upper surface cleaning unit, the liquid nozzles 52a, 52b are examples of a first liquid nozzle and a second liquid nozzle, respectively, and the cleaning tank 100 is an example of a cleaning tank. [5] Reference form (1) A substrate cleaning apparatus according to a first reference embodiment includes a substrate holding unit that holds a substrate in a horizontal position, a bottom brush that cleans the bottom surface of the substrate held by the substrate holding unit at a processing position, a brush cleaning unit that cleans the bottom brush at a standby position that overlaps vertically with the substrate held by the substrate holding unit and is below the processing position, and a bottom brush lifting drive unit that raises and lowers the bottom brush between the processing position and the standby position. In this substrate cleaning apparatus, the standby position of the lower brush vertically overlaps with the substrate held by the substrate holder, so that even if the lower brush is relatively large, the footprint hardly increases. Therefore, by using a relatively large lower brush, it is possible to clean the underside of the substrate in a short time. Therefore, even if a process for cleaning the lower brush is added, the throughput hardly changes. This makes it possible to maintain the cleanliness of the lower brush without reducing the throughput. (2) The substrate cleaning apparatus may further include an upper surface cleaning unit that cleans the upper surface of the substrate held by the substrate holding unit, and the lower surface brush lifting drive unit may raise and lower the lower surface brush between the processing position and the standby position so that cleaning of the underside of the substrate and cleaning of the lower surface brush are performed during the period in which the upper surface of the substrate is cleaned by the upper surface cleaning unit. In this case, cleaning of the underside of the substrate and cleaning of the lower surface brush are performed during the period in which the upper surface of the substrate is cleaned by the upper surface cleaning unit, so that the cleanliness of the lower surface brush can be maintained without reducing throughput. (3) The lower surface brush lifting drive unit may repeatedly raise and lower the lower surface brush between the processing position and the standby position so that cleaning of the lower surface of the substrate and cleaning of the lower surface brush are performed multiple times. In this case, the lower surface brush can be cleaned in a short time. (4) The brush cleaning unit may include a first liquid nozzle that ejects cleaning liquid to the center of the lower-surface brush and a second liquid nozzle that ejects cleaning liquid to the end of the lower-surface brush. With this configuration, even if the lower-surface brush is relatively large, the entire lower-surface brush can be easily cleaned. (5) The brush cleaning unit may include a cleaning tank that stores a cleaning liquid in which the lower brush is immersed. With this configuration, even if the lower brush is relatively large, the entire lower brush can be easily cleaned. Also, the lower brush can be cleaned in a short time. (6) Each of the substrate holder and the lower brush may have a circular outer shape, and the diameter of the lower brush may be larger than the diameter of the substrate holder. In this case, the lower brush can be made relatively large. (7) The substrate and the lower brush each may have a circular outer shape, and the diameter of the lower brush may be greater than 1 / 3 of the diameter of the substrate. In this case, the lower brush can be made relatively large. (8) A substrate cleaning method according to a second reference embodiment includes holding a substrate in a horizontal position using a substrate holding part; cleaning the underside of the substrate held by the substrate holding part with a underside brush at a processing position; cleaning the underside brush with a brush cleaning part at a standby position that overlaps vertically with the substrate held by the substrate holding part and is below the processing position; and raising and lowering the underside brush between the processing position and the standby position. According to this substrate cleaning method, the standby position of the lower brush vertically overlaps with the substrate held by the substrate holder, so that even if the lower brush is relatively large, the footprint hardly increases. Therefore, by using a relatively large lower brush, it is possible to clean the underside of the substrate in a short time. Therefore, even if a process of cleaning the lower brush is added, the throughput hardly changes. This makes it possible to maintain the cleanliness of the lower brush without reducing the throughput. (9) The substrate cleaning method may further include cleaning the upper surface of the substrate held by the substrate holder with an upper surface cleaning unit, and cleaning of the underside of the substrate and cleaning of the lower surface brush may be performed during a period in which the upper surface of the substrate is cleaned by the upper surface cleaning unit. In this case, cleaning of the underside of the substrate and cleaning of the lower surface brush are performed during a period in which the upper surface of the substrate is cleaned by the upper surface cleaning unit, so that the cleanliness of the lower surface brush can be maintained without reducing throughput. (10) The raising and lowering of the lower brush between the processing position and the standby position may be repeated so that cleaning of the lower surface of the substrate and cleaning of the lower brush are performed multiple times. In this case, the lower brush can be cleaned in a short time. (11) Cleaning the lower-surface brush with the brush cleaner may include discharging cleaning liquid to the center of the lower-surface brush with a first liquid nozzle and discharging cleaning liquid to the end of the lower-surface brush with a second liquid nozzle. With this configuration, even if the lower-surface brush is relatively large, the entire lower-surface brush can be easily cleaned. (12) The step of cleaning the lower brush by the brush cleaning unit may include immersing the lower brush in cleaning liquid stored in a cleaning tank. With this configuration, even if the lower brush is relatively large, the entire lower brush can be easily cleaned. Also, the lower brush can be cleaned in a short time. (13) Each of the substrate holder and the lower brush may have a circular outer shape, and the diameter of the lower brush may be larger than the diameter of the substrate holder. In this case, the lower brush can be made relatively large. (14) The substrate and the lower brush may each have a circular outer shape, and the diameter of the lower brush may be greater than 1 / 3 of the diameter of the substrate. In this case, the lower brush can be made relatively large. [Explanation of symbols]

[0150] 1 ... substrate cleaning device, 2 ... unit housing, 2a ... bottom surface portion, 2b to 2e ... side wall portion, 2x ... loading / unloading port, 9 ... control device, 9A ... chuck control portion, 9B ... suction control portion, 9C ... pedestal control portion, 9D ... delivery control portion, 9E ... lower surface cleaning control portion, 9F ... cup control portion, 9G ... upper surface cleaning control portion, 9H ... bevel cleaning control portion, 9I ... loading / unloading control portion, 10A, 10B ... upper holding device, 11A, 11B ... lower chuck chuck, 12A, 12B... upper chuck, 13A, 13B... lower chuck drive unit, 14A, 14B... upper chuck drive unit, 20... lower holding device, 21... suction holding unit, 22... suction holding drive unit, 30... base device, 31... linear guide, 32... movable base, 33... base drive unit, 40... transfer device, 41... support pin, 42... pin connecting member, 43... pin lift drive unit, 50... underside cleaning device, 51... underside brush, 52, 52a to 52c... liquid nozzle, 53... gas ejection section, 54... lifting support section, 54u... upper surface, 55... movement support section, 55a... lower surface brush rotation drive section, 55b... lower surface brush lifting drive section, 55c... lower surface brush movement drive section, 55d... cleaning tank lifting drive section, 55e... cleaning tank rotation drive section, 56... lower surface cleaning liquid supply section, 57... brush cleaning liquid supply section, 58... ejected gas supply section, 60... cup device, 70... upper surface Cleaning device, 71, 81...rotating support shaft, 72, 82...arm, 73...spray nozzle, 75...upper surface cleaning fluid supply unit, 74...upper surface cleaning drive unit, 80...end cleaning device, 83...bevel brush, 84...bevel brush drive unit, 90...opening / closing device, 91...shutter, 92...shutter drive unit, 100...cleaning tank, 101, 121...opening, 102...drain hole, 110...blocking unit, 120...outer tank, RH...hand

Claims

1. a substrate holder that holds the substrate in a horizontal position; a lower surface brush for cleaning a lower surface of the substrate held by the substrate holder at a processing position; a brush cleaning unit that cleans the lower surface brush at a standby position that is vertically overlapped with the substrate held by the substrate holding unit and is below the processing position; a lower surface brush lifting drive unit that lifts and lowers the lower surface brush between the processing position and the standby position; an upper surface cleaning unit that cleans an upper surface of the substrate held by the substrate holding unit, The lower surface brush lifting drive unit raises and lowers the lower surface brush between the processing position and the standby position so that cleaning of the underside of the substrate and cleaning of the lower surface brush are performed during the period in which the upper surface of the substrate is cleaned by the upper surface cleaning unit.

2. A substrate holding section that holds a substrate in a horizontal position; a lower surface brush for cleaning a lower surface of the substrate held by the substrate holder at a processing position; a brush cleaning unit that cleans the lower surface brush at a standby position that is vertically overlapped with the substrate held by the substrate holding unit and is below the processing position; a lower surface brush lifting drive unit that lifts and lowers the lower surface brush between the processing position and the standby position, cleaning of the lower surface brush by the brush cleaning unit is performed during a substrate cleaning process from when the substrate is carried into the substrate holding unit until when the substrate is carried out of the substrate holding unit; The brush cleaning unit supplies cleaning liquid to the lower surface brush so that the cleaning liquid does not adhere to the substrate when the lower surface brush is in the standby position.

3. 3. The substrate cleaning apparatus of claim 1, wherein the lower surface brush lifting drive unit repeatedly raises and lowers the lower surface brush between the processing position and the standby position so that cleaning of the underside of the substrate and cleaning of the lower surface brush are performed multiple times.

4. 4. The substrate cleaning apparatus according to claim 1, wherein the brush cleaning unit includes a first liquid nozzle that ejects cleaning liquid to a center portion of the lower surface brush, and a second liquid nozzle that ejects cleaning liquid to an end portion of the lower surface brush.

5. A substrate holding section that holds the substrate in a horizontal position; a lower surface brush for cleaning a lower surface of the substrate held by the substrate holder at a processing position; a brush cleaning unit that cleans the lower surface brush at a standby position that is vertically overlapped with the substrate held by the substrate holding unit and is below the processing position; a lower surface brush lifting drive unit that lifts and lowers the lower surface brush between the processing position and the standby position, The brush cleaning unit of the substrate cleaning apparatus includes a cleaning tank that stores a cleaning liquid in which the lower surface brush is immersed.

6. each of the substrate holder and the lower brush has a circular outer shape; 6. The substrate cleaning apparatus according to claim 1, wherein a diameter of the lower brush is larger than a diameter of the substrate holder.

7. each of the substrate and the lower brush has a circular outer shape; 6. The substrate cleaning apparatus according to claim 1, wherein the diameter of the lower brush is greater than ⅓ of the diameter of the substrate.

8. holding the substrate in a horizontal position by a substrate holding portion; cleaning an upper surface of the substrate held by the substrate holding unit with an upper surface cleaning unit; cleaning a lower surface of the substrate held by the substrate holder at a processing position with a lower surface brush; cleaning the lower surface brush by a brush cleaning unit at a standby position that overlaps in the vertical direction with the substrate held by the substrate holding unit and is below the processing position; Raising and lowering the lower surface brush between the processing position and the standby position, A substrate cleaning method, wherein cleaning of the underside of the substrate and cleaning of the underside brush are performed during a period in which the upper surface of the substrate is cleaned by the upper surface cleaning unit.

9. Holding the substrate in a horizontal position by a substrate holding portion; cleaning a lower surface of the substrate held by the substrate holder at a processing position with a lower surface brush; cleaning the lower surface brush by a brush cleaning unit at a standby position that overlaps in the vertical direction with the substrate held by the substrate holding unit and is below the processing position; Raising and lowering the lower surface brush between the processing position and the standby position, The method for cleaning a substrate includes cleaning the lower surface brush with a brush cleaning unit during a substrate cleaning process from when the substrate is loaded into the substrate holding unit until when it is unloaded, and supplying cleaning liquid to the lower surface brush with the brush cleaning unit when the lower surface brush is in the standby position so that the cleaning liquid does not adhere to the substrate.

10. 10. The substrate cleaning method according to claim 8, wherein the raising and lowering of the lower surface brush between the processing position and the standby position is repeated so that cleaning of the lower surface of the substrate and cleaning of the lower surface brush are performed a plurality of times.

11. The substrate cleaning method according to any one of claims 8 to 10, wherein cleaning the lower surface brush with a brush cleaning unit includes discharging cleaning liquid onto a central portion of the lower surface brush with a first liquid nozzle, and discharging cleaning liquid onto an end portion of the lower surface brush with a second liquid nozzle.

12. Holding the substrate in a horizontal position by a substrate holding portion; cleaning a lower surface of the substrate held by the substrate holder at a processing position with a lower surface brush; cleaning the lower surface brush by a brush cleaning unit at a standby position that overlaps in the vertical direction with the substrate held by the substrate holding unit and is below the processing position; Raising and lowering the lower surface brush between the processing position and the standby position, The substrate cleaning method, wherein cleaning the lower surface brush with a brush cleaning unit includes immersing the lower surface brush in a cleaning liquid stored in a cleaning tank.

13. each of the substrate holder and the lower brush has a circular outer shape; The method for cleaning a substrate according to any one of claims 8 to 12, wherein a diameter of the lower brush is larger than a diameter of the substrate holder.

14. each of the substrate and the lower brush has a circular outer shape; The method for cleaning a substrate according to any one of claims 8 to 12, wherein the diameter of the lower brush is greater than ⅓ of the diameter of the substrate.

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