EXPANDING APPARATUS, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICONDUCTOR CHIP

Abstract

An expanding device 2 according to the present invention is provided with: a cold air supply unit 206 and a cooling unit 207, by which a stretchable sheet member W2, on which a wafer W1 that comprises a plurality of semiconductor chips Ch is arranged, and a film W4 that is provided on the wafer W1 are cooled to a cooling temperature at which the film W4 becomes harder than the sheet member W2; and an expanding unit 208 which divides the wafer W1 into a plurality of semiconductor chips Ch by expanding the sheet member W2, which has been cooled to the cooling temperature by means of the cold air supply unit 206 and the cooling unit 207.

Description

[Technical field]

[0001] The present invention relates to an expanding apparatus, a manufacturing method for a semiconductor chip, and a semiconductor chip. [Background technology]

[0002] Conventionally, an expanding device is known that cools and expands an extensible sheet member on which a wafer including a plurality of semiconductor chips is arranged. Such an expanding device is disclosed, for example, in JP 2021-082648 A.

[0003] The above-mentioned JP 2021-082648 A discloses an expanding device that cools an expandable sheet member on which a wafer including a plurality of semiconductor chips is arranged to a predetermined cooling temperature, and expands the cooled sheet member to divide the wafer. The wafer is bonded to the sheet member via an adhesive layer, and is divided into a plurality of semiconductor chips by expanding the sheet member to divide the adhesive layer together with the wafer. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-082648 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the expanding device of JP 2021-082648 A, when the sheet member is cooled to a predetermined cooling temperature and expanded, if the cooling temperature is high, the adhesive layer does not harden, making it difficult to reliably divide the adhesive layer. On the other hand, if the cooling temperature is low, the sheet member becomes too hard, making it difficult to expand the sheet member. Therefore, there is a demand for an expanding device that can reliably expand an extensible sheet member on which a wafer including multiple semiconductor chips is arranged and can reliably divide a film such as an adhesive layer provided on the wafer.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide an expanding device, a manufacturing method for semiconductor chips, and a semiconductor chip that are capable of reliably expanding an extensible sheet member on which a wafer containing a plurality of semiconductor chips is arranged, and that are capable of reliably dividing a film provided on the wafer. [Means for solving the problem]

[0007] An expanding device according to a first aspect of the present invention includes a cooling unit that cools an extensible sheet member on which a wafer including a plurality of semiconductor chips is disposed and a film to a cooling temperature at which the film provided on the wafer becomes harder than the sheet member, and an expanding unit that stretches the sheet member cooled to the cooling temperature by the cooling unit to divide the wafer into a plurality of semiconductor chips. The hardness of the sheet member and the film with respect to temperature is reversed at a predetermined temperature, and the cooling section cools the sheet member to a temperature lower than the predetermined temperature at which the film becomes harder than the sheet member. .

[0008] In the expanding device according to the first aspect of the present invention, as described above, the cooling unit cools the sheet member and the film to a cooling temperature at which the film provided on the wafer becomes harder than the sheet member. This allows the film to be divided together with the wafer, and also prevents the sheet member from breaking. As a result, the extensible sheet member on which the wafer including a plurality of semiconductor chips is disposed can be reliably expanded, and the film provided on the wafer can be reliably divided. This further improves the yield of wafer division by expanding.

[0009] The expanding device according to the first aspect So, The hardness of the sheet member and the film with respect to temperature is reversed at a predetermined temperature, and the cooling section cools the sheet member to a temperature lower than the predetermined temperature at which the film becomes harder than the sheet member. This Since the hardness of the sheet member and the film are reversed, and the film can be expanded in a state where it is harder than the sheet member, the film can be divided more reliably.

[0010] The second aspect of this invention Expanding device according to the above aspect the sheet member and the film provided on the wafer are cooled to a cooling temperature at which the sheet member and the film are harder than the stretchable sheet member on which the wafer including a plurality of semiconductor chips is disposed, and an expanding section that stretches the sheet member cooled to the cooling temperature by the cooling section to divide the wafer into a plurality of semiconductor chips; The cooling section cools the sheet member and the film to a cooling temperature within a cooling temperature range in which the film becomes harder than the sheet member and the hardness of the sheet member becomes smaller than a predetermined value. When the variation in hardness relative to temperature in the sheet member is greater than the variation in hardness in the film, the cooling unit cools the sheet member and the film to a temperature on the higher side of the cooling temperature range. The sheet member can be expanded in a state where it is cooled to a cooling temperature at which the film becomes hard without becoming too hard. Furthermore, even if the sheet member has a large variation in hardness with respect to temperature, the sheet member can be cooled to a cooling temperature that does not reach a temperature at which the sheet member breaks.

[0011] According to a third aspect of the present invention, an expanding device includes a cooling unit that cools the sheet member and the film to a cooling temperature at which the film provided on the wafer becomes harder than an extensible sheet member on which a wafer including a plurality of semiconductor chips is disposed, and an expanding unit that stretches the sheet member cooled to the cooling temperature by the cooling unit to divide the wafer into a plurality of semiconductor chips, the cooling unit cools the sheet member and the film to a cooling temperature within a cooling temperature range at which the film becomes harder than the sheet member and the hardness of the sheet member becomes smaller than a predetermined value, and when the variation in hardness of the sheet member with respect to temperature is smaller than the variation in the film, the cooling unit cools the sheet member and the film to a temperature on the lower side of the cooling temperature range. This makes it possible to cool the film to a cooling temperature at which the film can be reliably divided even when the variation in hardness with respect to temperature of the film is large.

[0012] In the expanding device of the second or third aspect described above, the hardness versus temperature relationship of the sheet member and the film is preferably reversed at a predetermined temperature, and the cooling section cools to a temperature lower than the predetermined temperature at which the film becomes harder than the sheet member. In the expanding device of the first aspect described above, the cooling section preferably cools the sheet member and the film to a cooling temperature within a cooling temperature range in which the film becomes harder than the sheet member and the hardness of the sheet member becomes smaller than a predetermined value.

[0013] The first aspect of this invention 4The method for manufacturing a semiconductor chip according to the above aspect includes a step of cooling an extensible sheet member on which a wafer including a plurality of semiconductor chips is disposed and a film to a cooling temperature at which the film provided on the wafer becomes harder than the sheet member, and a step of stretching the sheet member cooled to the cooling temperature to divide the wafer into a plurality of semiconductor chips. The hardness of the sheet member and the film with respect to temperature is reversed at a predetermined temperature, and in the step of cooling the film, the film is cooled to a temperature lower than the predetermined temperature at which the film becomes harder than the sheet member. .

[0014] The first aspect of this invention 4 In the method for manufacturing a semiconductor chip according to the aspect, as described above, the sheet member and the film are cooled to a cooling temperature at which the film provided on the wafer becomes harder than the expandable sheet member on which the wafer including the multiple semiconductor chips is disposed. This allows the film to be divided together with the wafer, and also prevents the sheet member from breaking. As a result, it is possible to provide a method for manufacturing a semiconductor chip that can reliably expand the expandable sheet member on which the wafer including the multiple semiconductor chips is disposed, and reliably divide the film provided on the wafer. This further improves the yield of dividing the wafer by expanding.

[0015] Above article 4 A method for manufacturing a semiconductor chip according to the present invention So, The hardness versus temperature relationship between the sheet member and the film is reversed at a predetermined temperature, and in the step of cooling the film, the film is cooled to a temperature lower than the predetermined temperature at which the film becomes harder than the sheet member. This Since the hardness of the sheet member and the film are reversed, and the film can be expanded in a state where it is harder than the sheet member, the film can be divided more reliably.

[0016] A method for manufacturing a semiconductor chip according to a fifth aspect of the present invention includes a step of cooling an extensible sheet member on which a wafer including a plurality of semiconductor chips is disposed and a film to a cooling temperature at which the film provided on the wafer becomes harder than the sheet member, and a step of stretching the sheet member cooled to the cooling temperature to divide the wafer into a plurality of semiconductor chips; A step of measuring the hardness of the sheet member and the film relative to temperature, and a step of determining a cooling temperature based on the measurement results; Equipped with can. This means:Based on the results of measuring the hardness of the sheet member and the film versus temperature, the cooling temperature at which the film is divided and the sheet member is not broken can be determined with high accuracy. The aforementioned method for manufacturing a semiconductor chip according to the fourth aspect preferably further comprises the steps of measuring the hardness of the sheet member and the film relative to temperature, and determining a cooling temperature based on the measurement results.

[0017] A step of measuring the hardness of the sheet member and the film with respect to temperature, and a step of determining a cooling temperature based on the measurement result, Preferably, in the step of cooling the sheet member and the film to a cooling temperature, the sheet member and the film are cooled to a cooling temperature determined within a cooling temperature range in which the film becomes harder than the sheet member and the hardness of the sheet member is smaller than a predetermined value. In this manner, the sheet member can be expanded in a state in which the sheet member does not become too hard and is cooled to a cooling temperature at which the film becomes hard.

[0018] In the above-mentioned configuration in which the sheet member and the film are cooled to a cooling temperature determined within a cooling temperature range in which the film is harder than the sheet member and the hardness of the sheet member is smaller than a predetermined value, preferably, in the step of cooling the sheet member and the film to a cooling temperature, when the variation in hardness relative to temperature in the sheet member is greater than the variation in the film, the sheet member and the film are cooled to a cooling temperature determined to be at a higher temperature within the cooling temperature range. With this configuration, even if the variation in hardness relative to temperature in the sheet member is large, it is possible to cool the sheet member to a cooling temperature that will not break.

[0019] In the configuration for cooling the sheet member and the film to a cooling temperature determined within a range in which the film is harder than the sheet member and the hardness of the sheet member is smaller than a predetermined value, preferably, in the step of cooling the sheet member and the film to a cooling temperature, when the variation in hardness relative to temperature in the sheet member is smaller than the variation in the film, the sheet member and the film are cooled to a cooling temperature determined to be on the lower side of the cooling temperature range. With this configuration, even if the film varies greatly in hardness relative to temperature, the film can be cooled to a cooling temperature at which it can be reliably split.

[0020] The first aspect of this invention 6 The semiconductor chip according to the above aspect includes a cooling unit that cools an extensible sheet member on which a wafer including a plurality of semiconductor chips is disposed and a film to a cooling temperature at which the film provided on the wafer becomes harder than the sheet member, and an expanding unit that stretches the sheet member cooled to the cooling temperature by the cooling unit to divide the wafer into a plurality of semiconductor chips. The hardness of the sheet member and the film with respect to temperature is reversed at a predetermined temperature, and the cooling unit cools the sheet member to a temperature lower than the predetermined temperature at which the film becomes harder than the sheet member. Produced using an expanding device.

[0021] The first aspect of this invention 6 In the semiconductor chip according to the aspect, as described above, the sheet member and the film are cooled to a cooling temperature at which the film provided on the wafer becomes harder than the expandable sheet member on which the wafer including the multiple semiconductor chips is disposed. This allows the film to be divided together with the wafer, and also prevents the sheet member from breaking. As a result, it is possible to provide a semiconductor chip that can reliably expand the expandable sheet member on which the wafer including the multiple semiconductor chips is disposed, and reliably divide the film provided on the wafer. This further improves the yield of wafer division by expanding. Effect of the Invention

[0022] According to the present invention, as described above, it is possible to reliably expand an extensible sheet member on which a wafer including a plurality of semiconductor chips is disposed, and also to reliably divide a film provided on the wafer. [Brief description of the drawings]

[0023] [Figure 1] 1 is a plan view showing a semiconductor wafer processing apparatus provided with a dicing device and an expanding device according to an embodiment; [Diagram 2] 1 is a plan view showing a wafer ring structure processed in a semiconductor wafer processing apparatus according to an embodiment; [Diagram 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 2 is a plan view of a dicing device disposed adjacent to an expanding device according to one embodiment. [Diagram 5] 1 is a side view of a dicing device arranged adjacent to an expanding device according to one embodiment, as viewed from the Y2 direction side. FIG. [Figure 6] FIG. 2 is a plan view of an expanding device according to one embodiment. [Figure 7] FIG. 2 is a side view of an expanding device according to one embodiment, seen from the Y2 direction side. [Figure 8] FIG. 2 is a side view of an expanding device according to one embodiment, as viewed from the X1 direction. [Figure 9] 1 is a block diagram showing a control configuration of a semiconductor wafer processing apparatus according to an embodiment; [Figure 10] 1 is a flowchart of a first half of a semiconductor chip manufacturing process of a semiconductor wafer processing apparatus according to an embodiment. [Figure 11] 11 is a flowchart of a second half of a semiconductor chip manufacturing process of a semiconductor wafer processing apparatus according to an embodiment. [Figure 12] FIG. 2 is a side view showing a state in which a clamp unit is placed in a raised position in an expanding device according to one embodiment. [Figure 13] FIG. 1 is a side view showing a state in which a clamp unit is placed in a lowered position in an expanding device according to one embodiment. [Figure 14] FIG. 2 is a side view showing a state in which an ultraviolet irradiation unit irradiates ultraviolet rays in the expanding device according to one embodiment. [Figure 15] 1 is a side cross-sectional view showing a first example of a wafer ring structure according to an embodiment. [Figure 16] 11 is a side cross-sectional view showing a second example of a wafer ring structure according to an embodiment. FIG. [Figure 17] 11 is a diagram showing the relationship between the cooling temperature and hardness of the sheet member and film of the wafer ring structure according to one embodiment. FIG. [Figure 18]13 is a diagram showing the relationship between the cooling temperature and the hardness of the sheet member and the film when the hardness of the sheet member of the wafer ring structure according to the embodiment varies. FIG. [Figure 19] 13 is a diagram showing the relationship between the cooling temperature and the hardness of a sheet member and a film in a wafer ring structure according to an embodiment when the film has varying hardness. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0025] The configuration of a semiconductor wafer processing apparatus 100 according to one embodiment of the present invention will be described with reference to FIGS.

[0026] (Semiconductor wafer processing equipment) 1, the semiconductor wafer processing apparatus 100 is an apparatus for processing a wafer W1 provided on a wafer ring structure W. The semiconductor wafer processing apparatus 100 is configured to form a modified layer on the wafer W1 and to divide the wafer W1 along the modified layer to form a plurality of semiconductor chips Ch (see FIG. 8).

[0027] 2 and 3, the wafer ring structure W will be described. The wafer ring structure W includes a wafer W1, a sheet member W2, and a ring-shaped member W3.

[0028] The wafer W1 is a circular thin plate made of crystals of a semiconductor material that is a material for semiconductor integrated circuits. A modified layer is formed inside the wafer W1 along the division line by processing in the semiconductor wafer processing device 100. That is, the wafer W1 is processed so as to be divisible along the division line. The sheet member W2 is an elastic adhesive tape. An adhesive layer is provided on the upper surface W21 of the sheet member W2. The wafer W1 is attached to the adhesive layer of the sheet member W2. The ring-shaped member W3 is a metal frame that is ring-shaped in a plan view. The ring-shaped member W3 is attached to the adhesive layer of the sheet member W2 while surrounding the wafer W1.

[0029] The semiconductor wafer processing apparatus 100 includes a dicing apparatus 1 and an expanding apparatus 2. In the following description, the vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the expanding apparatus 2 are aligned is the X direction, the expanding apparatus 2 side of the X direction is the X1 direction, and the dicing apparatus 1 side of the X direction is the X2 direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction.

[0030] (Dicing equipment) 1, 4, and 5, the dicing device 1 is configured to form a modified layer by irradiating a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets). The modified layer refers to cracks, voids, and the like formed inside the wafer W1 by the laser.

[0031] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0032] The base 11 is a base on which the chuck table 12 is mounted. The base 11 has a rectangular shape in a plan view.

[0033] <Chuck table part> The chuck table 12 has an adsorption unit 12a, a clamp unit 12b, a rotation mechanism 12c, and a table movement mechanism 12d. The adsorption unit 12a is configured to adsorb the wafer ring structure W to the upper surface on the Z1 direction side. The adsorption unit 12a is a table provided with a suction hole and a suction pipe line for adsorbing the lower surface on the Z2 direction side of the ring-shaped member W3 of the wafer ring structure W. The adsorption unit 12a is supported by the table movement mechanism 12d via the rotation mechanism 12c. The clamp unit 12b is provided at the upper end of the adsorption unit 12a. The clamp unit 12b is configured to hold the wafer ring structure W adsorbed by the adsorption unit 12a. The clamp unit 12b holds the ring-shaped member W3 of the wafer ring structure W adsorbed by the adsorption unit 12a from the Z1 direction side. In this manner, the wafer ring structure W is gripped by the adsorption unit 12a and the clamp unit 12b.

[0034] The rotating mechanism 12c is configured to rotate the suction unit 12a in a circumferential direction around a rotation center axis C extending parallel to the Z direction. The rotating mechanism 12c is attached to the upper end of the table moving mechanism 12d. The table moving mechanism 12d is configured to move the wafer ring structure W in the X direction and the Y direction. The table moving mechanism 12d has an X-direction moving mechanism 121 and a Y-direction moving mechanism 122. The X-direction moving mechanism 121 is configured to move the rotating mechanism 12c in the X1 direction or the X2 direction. The X-direction moving mechanism 121 has, for example, a linear conveyor module or a driving unit having a ball screw and a motor with an encoder. The Y-direction moving mechanism 122 is configured to move the rotating mechanism 12c in the Y1 direction or the Y2 direction. The Y-direction moving mechanism 122 has, for example, a linear conveyor module or a driving unit having a ball screw and a motor with an encoder.

[0035] <Laser section> The laser unit 13 is configured to irradiate the wafer W1 of the wafer ring structure W held by the chuck table 12 with a laser beam. The laser unit 13 is disposed on the Z1 direction side of the chuck table 12. The laser unit 13 includes a laser irradiation unit 13a, a mounting member 13b, and a Z direction movement mechanism 13c. The laser irradiation unit 13a is configured to irradiate a pulsed laser beam. The mounting member 13b is a frame to which the laser unit 13 and the imaging unit 14 are attached. The Z direction movement mechanism 13c is configured to move the laser unit 13 in the Z1 direction or the Z2 direction. The Z direction movement mechanism 13c includes, for example, a linear conveyor module, or a drive unit having a ball screw and a motor with an encoder. The laser irradiation unit 13a may be a laser irradiation unit that oscillates a continuous wave laser beam as a laser beam, other than a pulsed laser beam, as long as it can form a modified layer by multiphoton absorption.

[0036] <Imaging unit> The imaging unit 14 is configured to capture an image of the wafer W1 of the wafer ring structure W held by the chuck table 12. The imaging unit 14 is disposed on the Z1 direction side of the chuck table 12. The imaging unit 14 has a high-resolution camera 14a, a wide-angle camera 14b, a Z-direction movement mechanism 14c, and a Z-direction movement mechanism 14d.

[0037] The high-resolution camera 14a and the wide-angle camera 14b are cameras for capturing near-infrared images. The high-resolution camera 14a has a narrower viewing angle than the wide-angle camera 14b. The high-resolution camera 14a has a higher resolution than the wide-angle camera 14b. The wide-angle camera 14b has a wider viewing angle than the high-resolution camera 14a. The wide-angle camera 14b has a lower resolution than the high-resolution camera 14a. The high-resolution camera 14a is disposed on the X1 direction side of the laser irradiation unit 13a. The wide-angle camera 14b is disposed on the X2 direction side of the laser irradiation unit 13a. In this manner, the high-resolution camera 14a, the laser irradiation unit 13a, and the wide-angle camera 14b are disposed adjacent to each other in this order from the X1 direction side toward the X2 direction side.

[0038] The Z-direction moving mechanism 14c is configured to move the high-resolution camera 14a in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 14c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction moving mechanism 14d is configured to move the wide-angle camera 14b in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 14d has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0039] (Expanding device) As shown in FIG. 1, FIG. 6, and FIG. 7, the expanding device 2 is configured to divide the wafer W1 to form a plurality of semiconductor chips Ch (see FIG. 8). The expanding device 2 is also configured to form sufficient gaps between the plurality of semiconductor chips Ch. Here, a modified layer is formed on the wafer W1 in the dicing device 1 by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along a dividing line (street). In the expanding device 2, the wafer W1 is divided along the modified layer that was formed in advance in the dicing device 1, thereby forming a plurality of semiconductor chips Ch.

[0040] Therefore, in the expanding device 2, the sheet member W2 is expanded to divide the wafer W1 along the modified layer. In addition, in the expanding device 2, the sheet member W2 is expanded to widen the gaps between the multiple semiconductor chips Ch formed by division.

[0041] The expanding device 2 includes a base 201, a cassette section 202, a lift-up hand section 203, a suction hand section 204, a base 205, a cold air supply section 206, a cooling unit 207, an expanding section 208, a base 209, an expansion maintaining member 210, a heat shrink section 211, an ultraviolet ray irradiation section 212, a squeegee section 213, and a clamp section 214. The cold air supply section 206 and the cooling unit 207 are examples of the "cooling section" in the claims.

[0042] <base> The base 201 is a base on which the cassette unit 202 and the lift-up hand unit 203 are mounted. The base 201 has a rectangular shape in a plan view.

[0043] <Cassette section> The cassette unit 202 is configured to be able to accommodate a plurality of wafer ring structures W. The cassette unit 202 includes a wafer cassette 202a, a Z-direction moving mechanism 202b, and a pair of placement units 202c.

[0044] A plurality of (three) wafer cassettes 202a are arranged in the Z direction. The wafer cassette 202a has a storage space capable of storing a plurality of (five) wafer ring structures W. The wafer ring structures W are manually supplied and placed in the wafer cassette 202a. The wafer cassette 202a may store one to four wafer ring structures W, or may store six or more wafer ring structures W. One, two, or four or more wafer cassettes 202a may be arranged in the Z direction.

[0045] The Z-direction movement mechanism 202b is configured to move the wafer cassette 202a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 202b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 202b also has a mounting table 202d that supports the wafer cassette 202a from below. A plurality of mounting tables 202d (three in number) are arranged in accordance with the positions of the plurality of wafer cassettes 202a.

[0046] A plurality (five) of the pair of mounting portions 202c are arranged inside the wafer cassette 202a. On the pair of mounting portions 202c, the ring-shaped member W3 of the wafer ring structure W is placed from the Z1 direction side. One of the pair of mounting portions 202c protrudes in the X2 direction from the inner surface on the X1 direction side of the wafer cassette 202a. The other of the pair of mounting portions 202c protrudes in the X1 direction from the inner surface on the X2 direction side of the wafer cassette 202a.

[0047] <Lift-up hand section> The lift-up hand portion 203 is configured to be capable of removing the wafer ring structure W from the cassette portion 202. In addition, the lift-up hand portion 203 is configured to be capable of storing the wafer ring structure W in the cassette portion 202.

[0048] Specifically, the lift-up hand unit 203 includes a Y-direction moving mechanism 203a and a lift-up hand 203b. The Y-direction moving mechanism 203a has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The lift-up hand 203b is configured to support the ring-shaped member W3 of the wafer ring structure W from the Z2 direction side.

[0049] <Suction hand part> The suction hand portion 204 is configured to suck the ring-shaped member W3 of the wafer ring structure W from the Z1 direction side.

[0050] Specifically, the suction hand unit 204 includes an X-direction moving mechanism 204a, a Z-direction moving mechanism 204b, and a suction hand 204c. The X-direction moving mechanism 204a is configured to move the suction hand 204c in the X direction. The Z-direction moving mechanism 204b is configured to move the suction hand 204c in the Z direction. The X-direction moving mechanism 204a and the Z-direction moving mechanism 204b have, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The suction hand 204c is configured to suck and support the ring-shaped member W3 of the wafer ring structure W from the Z1 direction side. Here, the suction hand 204c generates a negative pressure to support the ring-shaped member W3 of the wafer ring structure W.

[0051] <base> 7 and 8, the base 205 is a base on which the expanding section 208, the cooling unit 207, the ultraviolet ray irradiation section 212, and the squeegee section 213 are mounted. The base 205 has a rectangular shape in a plan view. In addition, in FIG. 8, the clamp section 214 arranged at a position in the Z1 direction of the cooling unit 207 is indicated by a dotted line.

[0052] <Cold air supply section> The cool air supplying unit 206 is configured to supply cool air to the sheet member W2 from the Z1 direction side when the expanding unit 208 expands the sheet member W2.

[0053] Specifically, the cold air supply unit 206 has a supply unit main body 206a, a cold air supply port 206b, and a movement mechanism 206c. The cold air supply port 206b is configured to allow cold air supplied from a cold air supply device to flow out. The cold air supply port 206b is provided at the end of the supply unit main body 206a on the Z2 direction side. The cold air supply port 206b is disposed in the center of the end of the supply unit main body 206a on the Z2 direction side. The movement mechanism 206c has, for example, a linear conveyor module, or a motor with a ball screw and an encoder.

[0054] The cold air supply device is a device for generating cold air. The cold air supply device supplies air cooled by, for example, a heat pump. Such a cold air supply device is installed on the base 205. The cold air supply unit 206 and the cold air supply device are connected by a hose (not shown).

[0055] <Cooling unit> The cooling unit 207 is configured to cool the sheet member W2 from the Z2 direction side.

[0056] The cooling unit 207 includes a cooling member 207a having a cooling body 271 and a Peltier element 272, and a Z-direction moving mechanism 207b. The cooling body 271 is made of a material having a large heat capacity and high thermal conductivity. The cooling body 271 is made of a metal such as aluminum. The Peltier element 272 is configured to cool the cooling body 271. Note that the cooling body 271 is not limited to aluminum, and may be another material having a large heat capacity and high thermal conductivity. The Z-direction moving mechanism 207b is a cylinder.

[0057] The cooling unit 207 is configured to be movable in the Z1 direction or the Z2 direction by the Z-direction movement mechanism 207b, so that the cooling unit 207 can be moved to a position in contact with the sheet member W2 and to a position separated from the sheet member W2.

[0058] <Expanding section> The expanding section 208 is configured to expand the sheet member W2 of the wafer ring structure W, thereby dividing the wafer W1 along the dividing lines.

[0059] The expander 208 has an expand ring 281. The expand ring 281 is configured to support the sheet member W2 from the Z2 direction side, thereby expanding (expanding) the sheet member W2. The expand ring 281 has a ring shape in a plan view. The structure of the expand ring 281 will be described in detail later.

[0060] <base> The base 209 is a substrate on which the cold air supply unit 206, the expansion and retention member 210 and the heat shrink unit 211 are mounted.

[0061] <Expansion Maintenance Member> As shown in FIGS. 7 and 8, the expansion maintaining member 210 is configured to press the sheet member W2 from the Z1 direction side so that the sheet member W2 near the wafer W1 does not shrink due to heating by the heating ring 211a.

[0062] Specifically, the expansion maintaining member 210 has a pressing ring portion 210a, a lid portion 210b, and an intake portion 210c. The pressing ring portion 210a has a ring shape in a plan view. The lid portion 210b is provided on the pressing ring portion 210a so as to close the opening of the pressing ring portion 210a. The intake portion 210c is an intake ring having a ring shape in a plan view. A plurality of intake ports are formed on the lower surface of the intake portion 210c on the Z2 direction side. In addition, the pressing ring portion 210a is configured to move in the Z direction by the Z direction moving mechanism 210d. That is, the Z direction moving mechanism 210d is configured to move the pressing ring portion 210a to a position where the sheet member W2 is pressed and to a position away from the sheet member W2. The Z direction moving mechanism 210d has, for example, a linear conveyor module or a driving portion having a ball screw and a motor with an encoder.

[0063] <Heat shrink section> The heat shrink section 211 is configured to shrink the sheet member W2 expanded by the expanding section 208 by applying heat while maintaining the gaps between the multiple semiconductor chips Ch.

[0064] The heat shrink part 211 has a heating ring 211a and a Z-direction movement mechanism 211b. The heating ring 211a has a ring shape in a plan view. The heating ring 211a has a sheath heater that heats the sheet member W2. The Z-direction movement mechanism 211b is configured to move the heating ring 211a in the Z direction. The Z-direction movement mechanism 211b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0065] <Ultraviolet ray irradiation section> The ultraviolet ray irradiation unit 212 is configured to irradiate the sheet member W2 with ultraviolet rays Ut in order to reduce the adhesive strength of the adhesive layer of the sheet member W2. Specifically, the ultraviolet ray irradiation unit 212 has an ultraviolet ray illuminator. The ultraviolet ray irradiation unit 212 is disposed at an end of the squeegee unit 213 on the Z1 direction side of a pressing unit 213a described later. The ultraviolet ray irradiation unit 212 is configured to irradiate the sheet member W2 with ultraviolet rays Ut while moving together with the squeegee unit 213.

[0066] <Squeegee section> The squeegee unit 213 is configured to expand the sheet member W2 and then locally press the wafer W1 from the Z2 direction side to further divide the wafer W1 along the modified layer. Specifically, the squeegee unit 213 has a pressing unit 213a, a Z-direction moving mechanism 213b, an X-direction moving mechanism 213c, and a rotating mechanism 213d.

[0067] The pressing unit 213a is configured to generate bending stress in the wafer W1 and divide the wafer W1 along the modified layer by moving the rotating mechanism 213d and the X-direction moving mechanism 213c while pressing the wafer W1 from the Z2 direction side via the sheet member W2. The pressing unit 213a presses the wafer W1 by contacting the wafer W1 via the sheet member W2 when the pressing unit 213a is raised to an elevated position on the Z1 direction side by the Z-direction moving mechanism 213b. The pressing unit 213a is lowered to a lowered position on the Z2 direction side by the Z-direction moving mechanism 213b, and the pressing unit 213a is released from contact with the wafer W1, and is no longer pressed against the wafer W1. The pressing unit 213a is a squeegee.

[0068] The pressing unit 213a is attached to an end of the Z-direction moving mechanism 213b on the Z1 direction side. The Z-direction moving mechanism 213b is configured to linearly move the pressing unit 213a in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 213b is, for example, a cylinder. The Z-direction moving mechanism 213b is attached to an end of the X-direction moving mechanism 213c on the Z1 direction side.

[0069] The X-direction moving mechanism 213c is attached to the end of the rotating mechanism 213d on the Z1 direction side. The X-direction moving mechanism 213c is configured to move the pressing unit 213a linearly in one direction. The X-direction moving mechanism 213c has, for example, a linear conveyor module or a driving unit having a ball screw and a motor with an encoder.

[0070] In the squeegee unit 213, the pressing unit 213a is raised to a raised position by the Z-direction movement mechanism 213b. In the squeegee unit 213, the pressing unit 213a locally presses the wafer W1 from the Z2 direction side via the sheet member W2 while the pressing unit 213a is moved in the Y direction by the X-direction movement mechanism 213c, thereby dividing the wafer W1. In the squeegee unit 213, the pressing unit 213a is lowered to a lowered position by the Z-direction movement mechanism 213b. In the squeegee unit 213, after the movement of the pressing unit 213a in the Y direction is completed, the pressing unit 213a is rotated 90 degrees by the rotation mechanism 213d.

[0071] In the squeegee unit 213, the pressing unit 213a is raised to a raised position by the Z-direction moving mechanism 213b. In the squeegee unit 213, after the pressing unit 213a rotates 90 degrees, the pressing unit 213a locally presses the wafer W1 from the Z2 direction side via the sheet member W2, while the pressing unit 213a is moved in the X direction by the X-direction moving mechanism 213c, thereby dividing the wafer W1.

[0072] <Clamp section> The clamp unit 214 is configured to grip the ring-shaped member W3 of the wafer ring structure W. Specifically, the clamp unit 214 has a gripping unit 214a, a Z-direction moving mechanism 214b, and a Y-direction moving mechanism 214c. The gripping unit 214a supports the ring-shaped member W3 from the Z2 direction side and presses the ring-shaped member W3 from the Z1 direction side. In this manner, the ring-shaped member W3 is gripped by the gripping unit 214a. The gripping unit 214a is attached to the Z-direction moving mechanism 214b.

[0073] The Z-direction moving mechanism 214b is configured to move the clamp unit 214 in the Z direction. Specifically, the Z-direction moving mechanism 214b is configured to move the gripping unit 214a in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 214b has, for example, a linear conveyor module, or a drive unit having a ball screw and a motor with an encoder. The Z-direction moving mechanism 214b is attached to the Y-direction moving mechanism 214c. The Y-direction moving mechanism 214c is configured to move the Z-direction moving mechanism 214b in the Y1 direction or the Y2 direction. The Y-direction moving mechanism 214c has, for example, a linear conveyor module, or a drive unit having a ball screw and a motor with an encoder.

[0074] (Control configuration of semiconductor wafer processing device) As shown in FIG. 9, the semiconductor wafer processing apparatus 100 includes a first control unit 101, a second control unit 102, a third control unit 103, a fourth control unit 104, a fifth control unit 105, a sixth control unit 106, a seventh control unit 107, an eighth control unit 108, an expansion control calculation unit 109, a handling control calculation unit 110, a dicing control calculation unit 111, and a memory unit 112.

[0075] The first control unit 101 is configured to control the squeegee unit 213. The first control unit 101 includes a central processing unit (CPU) and a storage unit having a read only memory (ROM) and a random access memory (RAM). The first control unit 101 may include a hard disk drive (HDD) as the storage unit, in which stored information is retained even after the voltage is cut off. The HDD may be provided in common to the first control unit 101, the second control unit 102, the third control unit 103, the fourth control unit 104, the fifth control unit 105, the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108.

[0076] The second control unit 102 is configured to control the cold air supply unit 206 and the cooling unit 207. The second control unit 102 includes a CPU and a storage unit having a ROM, a RAM, and the like. The third control unit 103 is configured to control the heat shrink unit 211 and the ultraviolet ray irradiation unit 212. The third control unit 103 includes a CPU and a storage unit having a ROM, a RAM, and the like. The second control unit 102 and the third control unit 103 may include, as a storage unit, a HDD or the like in which stored information is retained even after the voltage is cut off.

[0077] The fourth control unit 104 is configured to control the cassette unit 202 and the lift-up hand unit 203. The fourth control unit 104 includes a CPU and a storage unit having a ROM, a RAM, and the like. The fifth control unit 105 is configured to control the suction hand unit 204. The fifth control unit 105 includes a CPU and a storage unit having a ROM, a RAM, and the like. The fourth control unit 104 and the fifth control unit 105 may include, as a storage unit, a HDD or the like in which stored information is retained even after the voltage is cut off.

[0078] The sixth control unit 106 is configured to control the chuck table unit 12. The sixth control unit 106 includes a CPU and a storage unit having a ROM, a RAM, and the like. The seventh control unit 107 is configured to control the laser unit 13. The seventh control unit 107 includes a CPU and a storage unit having a ROM, a RAM, and the like. The eighth control unit 108 is configured to control the imaging unit 14. The eighth control unit 108 includes a CPU and a storage unit having a ROM, a RAM, and the like. The sixth control unit 106, the seventh control unit 107, and the eighth control unit 108 may include, as a storage unit, a HDD or the like in which stored information is retained even after the voltage is cut off.

[0079] The expansion control calculation unit 109 is configured to perform calculations related to the expansion process of the sheet member W2 based on the processing results of the first control unit 101, the second control unit 102, and the third control unit 103. The expansion control calculation unit 109 includes a CPU and a storage unit having a ROM, a RAM, and the like.

[0080] The handling control calculation unit 110 is configured to perform calculations related to the movement process of the wafer ring structure W based on the processing results of the fourth control unit 104 and the fifth control unit 105. The handling control calculation unit 110 includes a CPU and a storage unit having a ROM, a RAM, and the like.

[0081] The dicing control calculation unit 111 is configured to perform calculations related to the dicing process of the wafer W1 based on the processing results of the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108. The dicing control calculation unit 111 includes a CPU and a storage unit having a ROM, a RAM, and the like.

[0082] The storage unit 112 stores programs for operating the dicing device 1 and the expanding device 2. The storage unit 19 includes a ROM, a RAM, and a HDD.

[0083] (Semiconductor chip manufacturing process) The overall operation of the semiconductor wafer processing apparatus 100 will now be described with reference to FIGS.

[0084] In step S1, the wafer ring structure W is removed from the cassette unit 202. That is, after the wafer ring structure W accommodated in the cassette unit 202 is supported by the lift-up hand 203b, the lift-up hand 203b is moved in the Y1 direction by the Y-direction moving mechanism 31, and the wafer ring structure W is removed from the cassette unit 202. In step S2, the wafer ring structure W is transferred to the chuck table unit 12 of the dicing device 1 by the suction hand 204c. That is, the wafer ring structure W removed from the cassette unit 202 is moved in the X2 direction by the X-direction moving mechanism 204a while being sucked by the suction hand 204c. Then, the wafer ring structure W moved in the X2 direction is transferred from the suction hand 204c to the chuck table unit 12, and then gripped by the chuck table unit 12.

[0085] In step S3, a modified layer is formed on the wafer W1 by the laser unit 13. In step S4, the wafer ring structure W having the wafer W1 on which the modified layer has been formed is transferred to the clamp unit 214 by the suction hand 204c. In step S5, the sheet member W2 is cooled by the cold air supply unit 206 and the cooling unit 207. That is, the wafer ring structure W held by the clamp unit 214 is moved (lowered) in the Z2 direction by the Z-direction movement mechanism 214b to contact the cooling unit 207, and cold air is supplied from the Z1 direction side by the cold air supply unit 206, thereby cooling the sheet member W2.

[0086] In step S6, the wafer ring structure W is moved to the expanding section 208 by the clamping section 214. That is, the wafer ring structure W with the cooled sheet member W2 is moved in the Y1 direction by the Y-direction moving mechanism 214c while being held by the clamping section 214. In step S7, the sheet member W2 is expanded by the expanding section 208. That is, the wafer ring structure W is moved in the Z2 direction by the Z-direction moving mechanism 214b while being held by the clamping section 214. Then, the sheet member W2 comes into contact with the expanding ring 281 and is expanded by being pulled by the expanding ring 281. As a result, the wafer W1 is divided along the dividing line (modified layer).

[0087] In step S8, the sheet member W2 in the expanded state is pressed from the Z1 direction side by the expansion maintaining member 210. That is, the pressing ring portion 210a is moved (lowered) in the Z2 direction by the Z direction moving mechanism 210d until it abuts against the sheet member W2. Then, the process proceeds from point A in FIG. 10 through point A in FIG. 11 to step S9.

[0088] 11, in step S9, after the sheet member W2 is pressed by the expansion maintaining member 210, the ultraviolet ray irradiation unit 212 irradiates the sheet member W2 with ultraviolet ray Ut while pressing the wafer W1 with the squeegee unit 213. As a result, the wafer W1 is further divided by the squeegee unit 213. In addition, the adhesive force of the sheet member W2 is reduced by the ultraviolet ray Ut irradiated from the ultraviolet ray irradiation unit 212.

[0089] In step S10, the sheet material W2 is heated and shrunk by the heat shrink unit 211, while the clamp unit 214 rises. At this time, the intake unit 210c sucks in air near the heated sheet material W2. In step S11, the wafer ring structure W is transferred from the clamp unit 214 to the suction hand 204c. That is, the wafer ring structure W is moved in the Y2 direction by the Y-direction movement mechanism 214c while being held by the clamp unit 214. Then, the wafer ring structure W is released from the clamp unit 214 at a position on the Z1 direction side of the cooling unit 207, and then is sucked by the suction hand 204c.

[0090] In step S12, the wafer ring structure W is transferred to the lift-up hand 203b by the suction hand 204c. In step S13, the wafer ring structure W is accommodated in the cassette unit 202. That is, the wafer ring structure W supported by the lift-up hand 203b is moved in the Y1 direction by the Y-direction movement mechanism 203a, and the wafer ring structure W is accommodated in the cassette unit 202. This completes the processing performed on one wafer ring structure W. Then, the process returns to step S1 from point B in FIG. 11 via point B in FIG. 10.

[0091] (Detailed configuration of the expansion unit, expansion maintaining member, ultraviolet irradiation unit, and squeegee unit) 12 and 13, detailed configurations of the expanding section 208, the expansion maintaining member 210, the ultraviolet ray irradiation section 212, and the squeegee section 213 will be described. For convenience, the heat shrink section 211 of the expanding device 2 is not shown in FIG.

[0092] 12 shows the expanding device 2 in a state before the sheet member W2 is expanded by the expansion ring 281. Here, the clamp portion 214 is disposed at the raised position Up. That is, the gripping portion 214a is disposed at the raised position Up by the Z-direction moving mechanism 214b.

[0093] 13 shows the expanding device 2 in a state in which the sheet member W2 is being expanded by the expansion ring 281. Here, the clamping portion 214 is disposed at the lowered position Lw. That is, the gripping portion 214a is moved in the Z2 direction from the raised position Up toward the lowered position Lw by the Z-direction moving mechanism 214b.

[0094] When the gripper 214a is moved in the Z2 direction from the raised position Up to the lowered position Lw, the sheet member W2 comes into contact with the upper end 281a of the expand ring 281 and expands. At this time, the wafer W1 is pulled by the sheet member W2, which generates tensile stress in the wafer W1, and the wafer W1 is divided along the modified layer formed on the wafer W1. As a result, a plurality of semiconductor chips Ch are formed.

[0095] <Expanding section> The expanding unit 208 has an expanding ring 281 that divides the wafer W1 into a plurality of semiconductor chips Ch spaced apart by a distance Mr by expanding the sheet member W2 while the clamping unit 214 grips the wafer ring structure W. That is, the expanding ring 281 is configured to expand the sheet member W2 by the clamping unit 214 that moves in the Z2 direction from the raised position Up toward the lowered position Lw by the Z-direction moving mechanism 214b.

[0096] The expand ring 281 is fixed on the base 205. An upper end 281a of the expand ring 281 is disposed at a predetermined height position Hd in the Z direction. The predetermined height position Hd is a height position based on the upper surface of the base 205. In this manner, the upper end 281a of the expand ring 281 is maintained in a state of being disposed at the predetermined height position Hd.

[0097] As shown in Fig. 14, the expansion maintaining member 210 is configured to maintain the expanded state of the sheet member W2 near the wafer W1. For convenience, the heat shrink section 211 of the expanding device 2 is not shown in Fig. 14.

[0098] Specifically, the expansion retaining member 210 has a pressure ring portion 210a and a cover portion 210b.

[0099] The pressing ring part 210a has a cylindrical shape arranged to surround the wafer W1 in a plan view. The lid part 210b is provided so as to cover the opening of the pressing ring part 210a in the Z1 direction. The lid part 210b is provided on the inner side 1210a of the pressing ring part 210a so as to close the opening of the pressing ring part 210a in the Z1 direction. The lid part 210b is provided on the end part of the inner side 1210a of the pressing ring part 210a on the Z1 direction side. The inner side 1210a is the radially inner side of the cylindrical pressing ring part 210a.

[0100] The ultraviolet ray irradiation unit 212 is configured to irradiate the expanded sheet member W2 with ultraviolet rays Ut from the Z2 direction side. The ultraviolet ray irradiation unit 212 is disposed at a position in the Z2 direction of the wafer W1 of the expanded sheet member W2.

[0101] The ultraviolet rays Ut irradiated from the ultraviolet irradiating section 212 are prevented from leaking out of the expansion maintaining member 210 by covering the wafer W1 from the Z1 direction side with the cylindrical pressing ring section 210a and the lid section 210b. In this manner, the expansion maintaining member 210 has not only the function of maintaining the expanded state of the sheet member W2 near the wafer W1, but also the function of blocking the ultraviolet rays Ut. The expansion maintaining member 210 is formed of a metal such as stainless steel to suppress deterioration of the material caused by blocking the ultraviolet rays Ut.

[0102] As shown in Fig. 15 and Fig. 16, a film W4 is provided on the wafer W1. In the example shown in Fig. 15, the film W4 is provided between the wafer W1 and the sheet member W2. In the example shown in Fig. 16, the film W4 is provided on the opposite side of the wafer W1 to the sheet member W2. The film W4 is, for example, an adhesive layer such as a DAF (die attach film) or an insulating film such as a low-k film.

[0103] As shown in FIG. 17, the sheet member W2 and the film W4 become hard by cooling. Here, if the sheet member W2 does not become hard, as in the case of cooling to temperature t1, when expanding, only the sheet member W2 on the outer part of the wafer W1 will stretch, and the wafer W1 will not be divided. On the other hand, if the sheet member W2 is too hard, as in the case of cooling to temperature t3, when expanding, the sheet member W2 will break. Also, if the film W4 does not become hard, as in the case of cooling to temperature t1, when expanding, the film W4 will stretch and will not be divided together with the wafer W1. Also, if the sheet member W2 and the film W4 are cooled extremely, as in the case of cooling to temperature t4, the sheet member W2 and the film W4 will solidify. Therefore, when expanding, it is necessary to cool the sheet member W2 and the film W4 to an appropriate cooling temperature.

[0104] In this embodiment, the cold air supplying section 206 and the cooling unit 207 cool the sheet material W2 and the film W4 provided on the wafer W1 to a cooling temperature at which the film W4 becomes harder than the sheet material W2. Specifically, the cold air supplying section 206 and the cooling unit 207 cool the sheet material W2 to a cooling temperature in a range lower than a temperature t2 at which the hardness of the sheet material W2 becomes less than the hardness of the film W4 and higher than a temperature t3 at which the sheet material W2 does not become too hard.

[0105] In other words, the method for manufacturing semiconductor chips using this expanding device 2 includes a step of cooling the sheet member W2 and the film W4 provided on the wafer W1 to a cooling temperature at which the film W4 provided on the wafer W1 becomes harder than the extensible sheet member W2 on which the wafer W1 including a plurality of semiconductor chips Ch is arranged, and a step of stretching the sheet member W2 cooled to the cooling temperature to divide the wafer W1 into a plurality of semiconductor chips Ch.

[0106] In addition, the semiconductor chips Ch manufactured by this expanding device 2 are manufactured by an expanding device 2 that includes a cold air supply section 206 and a cooling unit 207 that cool the sheet member W2 and the film W4 provided on the wafer W1 to a cooling temperature at which the film W4 provided on the wafer W1 is harder than the stretchable sheet member W2 on which the wafer W1 including multiple semiconductor chips Ch is arranged, and an expanding section 208 that stretches the sheet member W2 cooled to the cooling temperature by the cold air supply section 206 and the cooling unit 207, thereby dividing the wafer W1 into multiple semiconductor chips Ch.

[0107] In this embodiment, the relationship between the hardness of the sheet member W2 and the film W4 with respect to temperature is reversed at a predetermined temperature, and the cold air supplying section 206 and the cooling unit 207 cool the sheet member W2 to a temperature lower than the predetermined temperature at which the film W4 becomes harder than the sheet member W2. In the example shown in Fig. 17, the relationship between the hardness of the sheet member W2 and the film W4 with respect to temperature is reversed at temperature t2.

[0108] In addition, the cold air supplying section 206 and the cooling unit 207 cool the sheet material W2 and the film W4 to a cooling temperature in a cooling temperature range in which the film W4 is harder than the sheet material W2 and the hardness of the sheet material W2 is smaller than a predetermined value. In the example shown in Fig. 17, the cold air supplying section 206 and the cooling unit 207 cool the sheet material W2 and the film W4 to a cooling temperature in a cooling temperature range that is greater than temperature t3 and less than temperature t2.

[0109] As shown in Fig. 18, when the variation in hardness with respect to temperature in the sheet member W2 is greater than the variation in hardness with respect to temperature in the film W4, the cold air supplying section 206 and the cooling unit 207 cool the sheet member W2 and the film W4 to a temperature on the higher side of the cooling temperature range. In the example shown in Fig. 18, when the variation in hardness with respect to temperature in the sheet member W2 is greater, the cold air supplying section 206 and the cooling unit 207 cool the sheet member W2 and the film W4 to a temperature tb higher than the central temperature ta of the cooling temperature range (a temperature range greater than temperature t2 and less than temperature t3). In other words, when the hardness with respect to temperature of the sheet member W2 varies, the cooling temperature is set to a temperature tb higher than the central temperature ta of the cooling temperature range so that the sheet member W2 does not become too hard.

[0110] As shown in Fig. 19, when the variation in hardness with respect to temperature in the sheet member W2 is smaller than the variation in the film W4, the cold air supplying section 206 and the cooling unit 207 cool the sheet member W2 and the film W4 to a temperature on the lower side of the cooling temperature range. In the example shown in Fig. 19, when the variation in hardness with respect to temperature in the film W4 is large, the cold air supplying section 206 and the cooling unit 207 cool the sheet member W2 and the film W4 to a temperature tc lower than the central temperature ta of the cooling temperature range (a temperature range greater than temperature t2 and less than temperature t3). In other words, when the hardness with respect to temperature of the film W4 varies, the cooling temperature is set to a temperature tc lower than the central temperature ta of the cooling temperature range in order to reliably harden the film W4.

[0111] The cooling temperature by the cold air supplying part 206 and the cooling unit 207 is set (determined) in advance by an operator. Specifically, the hardness of the sheet member W2 and the film W4 with respect to temperature is measured, and the cooling temperature is determined based on the measurement result.

[0112] (Effects of the embodiment) In this embodiment, the following effects can be obtained.

[0113] In this embodiment, as described above, the cold air supply unit 206 and the cooling unit 207 cool the sheet member W2 and the film W4 to a cooling temperature at which the film W4 provided on the wafer W1 becomes harder than the sheet member W2. This allows the film W4 to be divided together with the wafer W1, and also prevents the sheet member W2 from breaking. As a result, the extensible sheet member W2 on which the wafer W1 including a plurality of semiconductor chips Ch is arranged can be reliably expanded, and the film W4 provided on the wafer W1 can be reliably divided. This allows the yield of wafer division by expansion to be further improved.

[0114] In this embodiment, as described above, the relationship between the hardness of the sheet member W2 and the film W4 with respect to temperature is reversed at a predetermined temperature, and the cold air supply section 206 and the cooling unit 207 cool the sheet member W2 to a temperature lower than the predetermined temperature at which the film W4 becomes harder than the sheet member W2. This reverses the hardness of the sheet member W2 and the film W4, and the film W4 can be expanded in a state where it is harder than the sheet member W2, so that the film W4 can be divided more reliably.

[0115] In the present embodiment, as described above, the cold air supplying section 206 and the cooling unit 207 cool the sheet member W2 and the film W4 to a cooling temperature within a cooling temperature range in which the film W4 is harder than the sheet member W2 and the hardness of the sheet member W2 is smaller than a predetermined value. This allows the sheet member W2 to be expanded in a state in which the sheet member W2 is not too hard and is cooled to a cooling temperature at which the film W4 is hard.

[0116] In this embodiment, as described above, when the variation in hardness relative to temperature in the sheet member W2 is greater than the variation in the film W4, the cold air supplying section 206 and the cooling unit 207 cool the sheet member W2 and the film W4 to a temperature on the higher side of the cooling temperature range. This allows the sheet member W2 to be cooled to a cooling temperature that does not break, even when the sheet member W2 varies greatly in hardness relative to temperature.

[0117] In this embodiment, as described above, when the variation in hardness relative to temperature in the sheet member W2 is smaller than the variation in the film W4, the cold air supplying section 206 and the cooling unit 207 cool the sheet member W2 and the film W4 to a temperature on the lower side of the cooling temperature range. This allows the film W4 to be cooled to a cooling temperature at which it can be reliably split, even when the film W4 varies greatly in hardness relative to temperature.

[0118] In the present embodiment, as described above, the hardness of the sheet member W2 and the film W4 with respect to temperature is measured, and the cooling temperature is determined based on the measurement results. This makes it possible to accurately determine the cooling temperature at which the film W4 is divided and the sheet member W2 is not broken based on the measurement results of the hardness of the sheet member W2 and the film W4 with respect to temperature.

[0119] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the embodiments above, and further includes all modifications (variations) within the meaning and scope of the claims.

[0120] For example, in the above embodiment, an example of a configuration in which a dicing device that performs dicing on a wafer is provided together with the expanding device is shown, but the present invention is not limited to this. In the present invention, the expanding device may be used alone without providing a dicing device together with the expanding device. Also, other devices may be provided in addition to the dicing device together with the expanding device. For example, a grinding device that polishes the wafer may be provided together with the expanding device and the dicing device.

[0121] In the above embodiment, the sheet member and the film are cooled by both the cold air from the cold air supply unit as the cooling unit and the Peltier element of the cooling unit, but the present invention is not limited to this. In the present invention, the sheet member and the film may be cooled by either the cold air from the cold air supply unit or the Peltier element.

[0122] In the above embodiment, the position where the cooling unit cools the sheet member and the film and the position where the expanding unit expands the sheet member are different from each other, but the present invention is not limited to this. In the present invention, the position where the cooling unit cools the sheet member and the film and the position where the expanding unit expands the sheet member may be the same position.

[0123] In the above embodiment, the dicing device irradiates the wafer with a laser to generate cracks and perform dicing, but the present invention is not limited to this. In the present invention, the dicing device may cut the wafer by irradiating a laser, or may cut the wafer with a blade.

[0124] In the above embodiment, the expansion-retaining member has a lid portion, but the present invention is not limited to this. In the present invention, the expansion-retaining member does not have to have a lid portion.

[0125] In the above embodiment, the expanding device includes an ultraviolet ray irradiation unit, but the present invention is not limited to this. In the present invention, the expanding device does not need to include an ultraviolet ray irradiation unit.

[0126] In the above embodiment, the expanding device includes a squeegee unit, but the present invention is not limited to this. In the present invention, the expanding device does not have to include a squeegee unit.

[0127] In the above embodiment, the squeegee portion of the expanding device is disposed inside the expanding ring, but the present invention is not limited to this. In the present invention, the squeegee portion of the expanding device may be disposed outside the expanding ring. In this case, the squeegee portion may be provided between the expanding portion and the cooling portion.

[0128] In the above embodiment, for convenience of explanation, an example is shown in which the control process is explained using a flow-driven flowchart in which the process is performed in order according to the process flow, but the present invention is not limited to this. In the present invention, the control process may be performed by an event-driven process in which the process is executed on an event-by-event basis. In this case, the control process may be performed completely in an event-driven manner, or may be performed in a combination of event-driven and flow-driven. [Explanation of symbols]

[0129] 2 Expanding device 206 Cold air supply section 207 Cooling unit (cooling section) 208 Expanded section Ch Semiconductor Chip W1 wafer W2 Sheet material W4 Film

Claims

1. a cooling unit that cools an extensible sheet member on which a wafer including a plurality of semiconductor chips is disposed and the film to a cooling temperature at which the film provided on the wafer becomes harder than the sheet member; an expanding unit that expands the sheet member cooled to the cooling temperature by the cooling unit to divide the wafer into a plurality of the semiconductor chips; The relationship of the hardness of the sheet member and the film relative to temperature is reversed at a predetermined temperature, The cooling section cools the film to a temperature lower than the predetermined temperature at which the film becomes harder than the sheet member.

2. A cooling section that cools an extensible sheet member on which a wafer including a plurality of semiconductor chips is disposed and the film to a cooling temperature at which the film provided on the wafer becomes harder than the sheet member; an expanding unit that expands the sheet member cooled to the cooling temperature by the cooling unit to divide the wafer into a plurality of the semiconductor chips; the cooling unit cools the sheet member and the film to a cooling temperature within a cooling temperature range in which the film becomes harder than the sheet member and the hardness of the sheet member is smaller than a predetermined value; An expanding device, wherein when the sheet member has a greater variation in hardness relative to temperature than the film, the cooling section cools the sheet member and the film to a temperature on the higher side of the cooling temperature range.

3. A cooling section that cools an extensible sheet member on which a wafer including a plurality of semiconductor chips is disposed and the film to a cooling temperature at which the film provided on the wafer becomes harder than the sheet member; an expanding unit that expands the sheet member cooled to the cooling temperature by the cooling unit to divide the wafer into a plurality of the semiconductor chips; the cooling unit cools the sheet member and the film to a cooling temperature within a cooling temperature range in which the film becomes harder than the sheet member and the hardness of the sheet member is smaller than a predetermined value; An expanding device, wherein when the variation in hardness relative to temperature in the sheet member is smaller than the variation in hardness relative to temperature in the film, the cooling section cools the sheet member and the film to a temperature on the lower side of the cooling temperature range.

4. The relationship of the hardness of the sheet member and the film relative to temperature is reversed at a predetermined temperature, The expanding device according to claim 2 or 3, wherein the cooling section cools the film to a temperature lower than the predetermined temperature at which the film becomes harder than the sheet member.

5. The expanding device according to claim 1 , wherein the cooling section cools the sheet member and the film to a cooling temperature within a cooling temperature range in which the film becomes harder than the sheet member and the hardness of the sheet member is smaller than a predetermined value.

6. cooling the extensible sheet member on which the wafer including a plurality of semiconductor chips is disposed and the film to a cooling temperature at which the film disposed on the wafer is harder than the extensible sheet member; and a step of stretching the sheet member cooled to the cooling temperature to divide the wafer into a plurality of the semiconductor chips. The relationship of the hardness of the sheet member and the film relative to temperature is reversed at a predetermined temperature, In the step of cooling the film, the film is cooled to a temperature lower than the predetermined temperature at which the film becomes harder than the sheet member.

7. A step of cooling an extensible sheet member on which a wafer including a plurality of semiconductor chips is disposed and the film to a cooling temperature at which the film provided on the wafer is harder than the extensible sheet member; stretching the sheet member cooled to the cooling temperature to divide the wafer into a plurality of the semiconductor chips; measuring the hardness of the sheet member and the film relative to temperature; and determining the cooling temperature based on a result of the measurement.

8. measuring the hardness of the sheet member and the film relative to temperature; The method for manufacturing a semiconductor chip according to claim 6 , further comprising the step of: determining the cooling temperature based on a result of the measurement.

9. 9. The method for manufacturing a semiconductor chip according to claim 7 or 8, wherein in the step of cooling the sheet member and the film to the cooling temperature, the sheet member and the film are cooled to the cooling temperature determined to be within a cooling temperature range in which the film becomes harder than the sheet member and the hardness of the sheet member is smaller than a predetermined value.

10. 10. The method for manufacturing a semiconductor chip according to claim 9, wherein in the step of cooling the sheet member and the film to the cooling temperature, when the variation in hardness relative to temperature in the sheet member is greater than the variation in hardness relative to temperature in the film, the sheet member and the film are cooled to the cooling temperature determined to be a higher temperature within the cooling temperature range.

11. 10. The method for manufacturing a semiconductor chip according to claim 9, wherein in the step of cooling the sheet member and the film to the cooling temperature, when the variation in hardness relative to temperature in the sheet member is smaller than the variation in hardness in the film, the sheet member and the film are cooled to the cooling temperature determined to be a lower temperature within the cooling temperature range.

12. A semiconductor chip manufactured by an expanding device comprising: a cooling unit that cools an extensible sheet member on which a wafer including a plurality of semiconductor chips is disposed to a cooling temperature at which the film provided on the wafer becomes harder than the sheet member; and an expanding unit that stretches the sheet member cooled to the cooling temperature by the cooling unit to divide the wafer into a plurality of semiconductor chips, wherein the hardness of the sheet member and the film relative to temperature is reversed at a predetermined temperature, and the cooling unit cools the sheet member to a temperature lower than the predetermined temperature at which the film becomes harder than the sheet member.

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