Tape application device

Abstract

To provide a tape sticking device that sticks a dicing tape to a workpiece and a dicing frame with appropriate tension.SOLUTION: A tape sticking device 1 sticks a dicing tape DT to a workpiece W and a dicing frame DF along the sticking direction D1. The tape sticking device 1 includes a pressing roller 34 that presses the dicing tape DT against the workpiece W and the dicing frame DF, and a support pin 4 that extends the dicing tape DT in the width direction D2.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a tape application device. [Background technology]

[0002] In the field of semiconductor manufacturing, there is a process in which semiconductor substrates such as silicon wafers (hereinafter referred to as the "work") are cut into chips. In this process, a dicing tape attached to the work restricts the position of each chip, allowing the chips to be cut efficiently.

[0003] Patent Document 1 describes that an expandable tape E is attached to a wafer W fixed by suction to a table 211 by the pressure of an attachment roller. The reference numerals are those in Patent Document 1. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2013-4584 A Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, the dicing tape attached to the workpiece and the dicing frame is stretched in the direction in which the workpiece and the dicing frame move, and the tension acting in the width direction perpendicular to the direction of movement tends to be low.

[0006] However, if the tensions acting on the dicing tape in the movement direction and width direction are not appropriate, a proper distance between chips cannot be secured during expansion, making it difficult to detect the positions of the chips.

[0007] Therefore, a technical problem arises that must be solved in order to attach the dicing tape to the workpiece and the dicing frame with an appropriate tension, and an object of the present invention is to solve this problem. [Means for solving the problem]

[0008] In order to achieve the above-mentioned object, the dicing tape application device of the present invention is a tape application device that applies a dicing tape to a workpiece and a dicing frame along a predetermined application direction, and is equipped with a pressure roller that presses the dicing tape against the workpiece and the dicing frame, and an extension means that extends the dicing tape in at least a width direction perpendicular to the application direction when viewed from a plane.

[0009] According to this configuration, the stretching means stretches the dicing tape in the width direction, thereby applying tension in the width direction to the dicing tape. Effect of the Invention

[0010] The present invention can attach the dicing tape to the workpiece and the dicing frame while applying tension in the width direction to the dicing tape. [Brief description of the drawings]

[0011] [Figure 1] 1 is a perspective view showing a tape application device according to a first embodiment of the present invention; [Diagram 2] FIG. 4 is a perspective view showing an inner circumference side table, an outer circumference side table, and support pins. [Diagram 3] Cross-sectional view taken along line AA in Figure 2. [Figure 4] FIG. 4 is a schematic diagram showing the arrangement positions of support pins. [Diagram 5] FIG. 4 is a cross-sectional view of FIG. 3 as seen from the width direction. [Figure 6]5A to 5C are perspective views showing the procedure for applying a dicing tape, in which (a) shows the state at the start of application, (b) shows the state during application, and (c) shows the state after application is completed. [Figure 7] 1A is a schematic diagram showing how a support pin applies tension to a dicing tape, where (a) shows the state before the pressure roller passes over the support pin, (b) shows the state in which the pressure roller passes over the support pin and swings below the pressure roller, and (c) shows the state after the pressure roller has passed over the support pin. [Figure 8] FIG. 13 is a schematic diagram showing the positions of support pins arranged so as to surround substantially the entire circumference of the inner circumference table. [Figure 9] FIG. 11 is a perspective view of the main parts of a tape application device according to a second embodiment of the present invention, as viewed from the front side in the application direction. [Figure 10] FIG. 2 is a partially cutaway perspective view of the main part of the tape application device as viewed from the rear side in the application direction. [Figure 11] FIG. 2 is a vertical cross-sectional view showing a main part of the tape application device. [Figure 12] 1A is a schematic diagram showing how the support roller slides in the width direction, where (a) shows the position of the support roller at the start of application, (b) shows the position of the support roller as application progresses, and (c) shows the position of the support roller at the end of application. [Figure 13] FIG. 11 is a perspective view of a main part of a tape application device according to a modified example of the present invention, viewed from the front side in the application direction. [Figure 14] FIG. 2 is a partially cutaway perspective view of the main part of the tape application device as viewed from the rear side in the application direction. [Figure 15] FIG. 2 is a vertical cross-sectional view showing a main part of the tape application device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] A first embodiment of the present invention will be described with reference to the drawings. In the following, when the number, numerical value, amount, range, etc. of components are mentioned, the number is not limited to the specific number, and may be more or less than the specific number, unless otherwise specified or when it is clearly limited to a specific number in principle.

[0013] In addition, when referring to the shape or positional relationship of components, etc., this includes things that are substantially similar or approximate to those shapes, etc., unless otherwise specified or considered to be clearly different in principle.

[0014] In addition, in the drawings, some components may be omitted or characteristic parts may be enlarged or exaggerated to make the features easier to understand, and the dimensional ratios of the components may not be the same as the actual ones. In addition, in the cross-sectional views, hatching of some components may be omitted to make the cross-sectional structure of the components easier to understand. In this embodiment, expressions indicating directions such as up / down and left / right are not absolute, and are appropriate when each component is in the position depicted in the drawing, but if the position changes, they should be interpreted by changing the position accordingly.

[0015] 1 is a perspective view showing a tape application device 1. The tape application device 1 applies a dicing tape DT to a workpiece W and a dicing frame DF along an application direction D1. The workpiece W is, for example, a semiconductor substrate such as a silicon wafer, but is not limited to this. The dicing tape DT is, for example, an ultraviolet curing tape.

[0016] The tape application device 1 includes a transport section 2 and an application section 3.

[0017] As shown in FIG. 2, the transfer section 2 includes an inner circumference side table 21 that holds the workpiece W, and an outer circumference side table 22 on which the dicing frame DF is placed.

[0018] An adsorbent 23 made of a porous material having numerous pores is embedded in the surface of the inner circumferential table 21. The roughness of the pores of the adsorbent 23 is, for example, #400 or #800.

[0019] The inner circumference side table 21 is switchably connected to a vacuum source and a compressed air source, not shown. When the vacuum source is activated, negative pressure is supplied between the workpiece W placed on the inner circumference side table 21 and the upper surface (adsorption surface 21a) of the adsorption body 23, and the workpiece W is adsorbed and held on the adsorption surface 21a. When the compressed air source is activated, compressed air (release air) is supplied between the workpiece W and the adsorption surface 21a, and the adsorption between the workpiece W and the adsorption surface 21a is released.

[0020] The inner circumference side table 21 and the outer circumference side table 22 are placed on sliders (not shown) and configured to be slidable in the conveying direction (the opposite direction to the bonding direction D1).

[0021] As shown in Figure 1, the application unit 3 includes a feed roller 31 that supports the dicing tape DT so that it can be unwound, a take-up roller 32 that imparts a feed force to the dicing tape DT and winds it up, first to sixth guide rollers 33a to 33f that apply tension to the dicing tape DT and regulate the trajectory of the dicing tape DT, a pressure roller 34 that can be raised and lowered and that applies the dicing tape DT to the workpiece W, and a knife plate 35 that regulates the trajectory of the separator S peeled off from the dicing tape DT.

[0022] 2 and 3, the tape application device 1 is provided with a plurality of support pins 4 as extension means. The support pins 4 are provided between an inner circumference side table 21 and an outer circumference side table 22.

[0023] As shown in Fig. 4, the support pins 4 are arranged so as to surround approximately the front half of the inner circumference table 21 in the transport direction. The support pins 4 are also arranged symmetrically in the width direction D2. Note that some of the support pins 4 are omitted in Fig. 4.

[0024] The support pins 4 are arranged so as to incline toward the front side in the attachment direction D1 from the inside to the outside in the width direction D2 when viewed from above. The inclination of the support pins 4 is set so that the support pins 4 arranged closer to the front side in the attachment direction D1 are closer to being parallel to the attachment direction D1.

[0025] As shown in FIG. 5, the support pin 4 includes a pin body 41 formed in a substantially sector shape when viewed from the side, and a shaft portion 42 protruding laterally from the base end side of the pin body 41.

[0026] The shape of the pin body 41 is not limited to a substantially sector shape and may be any shape. In addition, the surface of the pin body 41 is preferably coated with, for example, a fluororesin or knurled so that the dicing tape DT does not adhere excessively to the surface.

[0027] The pin body 41 is provided on a ring table 43 so as to be freely swingable around a shaft 42. In an unloaded state in which no pressing force from the pressing roller 34 is acting, at least a portion of the pin body 41 is located above the upper surface of the dicing frame DF and the upper surface of the workpiece W in the vertical direction D3. In addition, the pin body 41 has appropriate flexibility so as to be elastically deformed when the pressing roller 34 acts on the tip side with a pressing force, as will be described later.

[0028] The operation of the tape application device 1 is controlled via a controller (not shown). The controller controls each of the components that make up the tape application device 1. The controller is, for example, a computer, and is composed of a CPU, memory, etc. The functions of the controller may be realized by control using software, or may be realized by something that operates using hardware.

[0029] Next, the operation of the tape application device 1 will be described with reference to the drawings.

[0030] <Work transport> First, the dicing frame DF is transferred onto the outer circumferential table 22 by a transfer hand or the like (not shown).

[0031] Next, the workpiece W is transferred onto the inner circumference side table 21 by a transport hand (not shown) or the like. Thereafter, when negative pressure is supplied from a compressed air source between the workpiece W and the suction surface 21a, the workpiece W is suctioned onto the inner circumference side table 21. The upper surface of the workpiece W and the upper surface of the dicing frame DF are set to be approximately flush with each other.

[0032] <Tape application> Next, the slider is driven to move the inner circumference side table 21 and the outer circumference side table 22 so that one end (attaching start position) of the dicing frame DF is located below the pressing roller .

[0033] 6(a), the take-up roller 32 rotates to unwind the dicing tape DT, and the pressure roller 34 presses the dicing tape DT against the dicing frame DF to adhere it with a predetermined pressure. Note that the support pins 4 are omitted in FIG. 6 for space reasons.

[0034] Thereafter, as the inner circumference side table 21 and the outer circumference side table 22 move along the conveying direction, the dicing tape DT is gradually applied to the dicing frame DF and the workpiece W, as shown in FIG. 6(b).

[0035] When the dicing tape DT is applied, the support pins 4 oscillate from the inside to the outside in the width direction D2 to apply tension to the dicing tape DT.

[0036] Specifically, as shown in FIGS. 7(a) and 7(b), a part of the pin body 41 is located above the dicing frame DF and the workpiece W in the no-load state.

[0037] 7(c) and (d), when the pressure roller 34 is positioned on the pin body 41, the pin body 41 swings downward around the shaft 42 due to the pressing force of the pressure roller 34. The dicing tape DT sandwiched between the pressure roller 34 and the pin body 41 is stretched from the inside to the outside in the width direction D2 as the pin body 41 swings.

[0038] 7(e) and (f), while the dicing tape DT is in the expanded state, the pressure roller 34 attaches the dicing tape DT to the dicing frame DF. This applies tension in the width direction D2 between the dicing frame DF and the workpiece W in the dicing tape DT.

[0039] Then, as shown in FIG. 6(c), when the dicing tape DT reaches the other end (application end position) of the dicing frame DF, the workpiece W and the dicing frame DF are adhered together via the dicing tape DT.

[0040] The number and installation positions of the support pins 4 are not limited to those described above, and can be changed as appropriate depending on the location where it is desired to locally stretch the dicing tape DT to apply tension in the width direction D2 and the magnitude of the tension, etc.

[0041] For example, as shown in Fig. 8, the support pins 4 may be arranged so as to surround substantially the entire circumference of the inner circumference table 21. The support pins 4 shown in Fig. 8 are arranged so as to incline toward the front side of the joining direction D1 from the inside to the outside in the width direction D2 when viewed from above. The inclination of the support pins 4 is set so that the support pins 4 arranged closer to the front side of the joining direction D1 are closer to being parallel to the joining direction D1. By providing the support pins 4 so as to surround substantially the entire circumference of the inner circumference table 21, tension can be applied to the dicing tape DT over a wide range from the inside to the outside in the width direction D2.

[0042] In this way, the tape application device 1 of this embodiment is a tape application device 1 that applies the dicing tape DT to the workpiece W and the dicing frame DF along the application direction D1, and is configured to include a pressure roller 34 that presses the dicing tape DT against the workpiece W and the dicing frame DF, and a support pin 4 that stretches the dicing tape DT in the width direction D2 when viewed from a plane.

[0043] According to this configuration, the support pins 4 stretch the dicing tape DT in the width direction D2, thereby making it possible to apply tension in the width direction D2 to the dicing tape DT.

[0044] The tape application device 1 further includes an inner table 21 that holds the workpiece W, and an outer table 22 on which the dicing frame DF is placed. The support pin 4 is provided between the inner table 21 and the outer table 22, with at least a portion of the support pin 4 positioned above the workpiece W and the dicing frame DF. When the support pin 4 oscillates downward under the pressure of the pressure roller 34, it stretches the dicing tape DT sandwiched between the pressure roller 34.

[0045] According to this configuration, after the dicing tape DT is attached to the support pins 4, the pressure roller 34 presses the support pins 4, and the dicing tape DT stretches in the width direction D2 as the support pins 4 swing, so that tension in the width direction D2 can be applied to the dicing tape DT. Note that, although the tension applied to the dicing tape DT in this embodiment has been described only in terms of the component in the width direction D2, the tension applied to the dicing tape DT may be any tension as long as it includes a component in the width direction D2.

[0046] Next, a tape application device 1 according to a second embodiment of the present invention will be described with reference to the drawings. As will be described later, the tape application device 1 according to this embodiment differs from the tape application device 1 according to the first embodiment described above only in the configuration of the extension means, so other common configurations are given the same reference numerals and duplicated explanations will be omitted. In addition, the dicing tape DT is omitted in Figures 9 and 10 for space reasons.

[0047] 9 and 10, the tape application device 1 is provided with a pair of left and right support rollers 5 as extension means. The surface of the support roller 5 is preferably coated with, for example, fluororesin or knurled so that the dicing tape DT does not stick excessively to it.

[0048] As shown in FIG. 11, the support rollers 5 are provided facing the pressing rollers 34 so that the dicing tape DT is positioned between them. The rotation shafts 51 of the support rollers 5 are supported by frames 52, and the support rollers 5 rotate around the rotation shafts 51 in conjunction with the rotation of the pressing rollers 34. The rotation shafts 51 are disposed parallel to the width direction D2. The frames 52 are connected to ball screws 53 that can be rotated by a driving motor (not shown). The frames 52 are configured to move in the width direction D2 according to the rotation direction of the ball screws 53.

[0049] Next, a procedure for applying tension to the dicing tape DT in the width direction D2 using the support rollers 5 will be described with reference to FIG.

[0050] 12(a), the inner circumference side table 21 and the outer circumference side table 22 are moved so that one end of the dicing frame DF (the application start position) is located below the pressure roller 34. Then, the winding roller 32 rotates to pay out the dicing tape DT, and the pressure roller 34 presses the dicing tape DT against one end of the dicing frame DF to apply a predetermined pressure. At this time, the support roller 5 is located approximately in the center in the width direction D2.

[0051] 12(b), the inner circumference side table 21 and the outer circumference side table 22 move along the transport direction, and the dicing tape DT is applied to the dicing frame DF and the workpiece W up to approximately the center of the dicing frame DF. At this time, the ball screw 53 moves the frame 52 of the support roller 5 so that the support roller 5 moves from the inside to the outside in the width direction D2 when viewed from above. Then, the support roller 5 stretches the dicing tape DT by pulling it outward in the width direction D2 as it moves toward the outside in the width direction D2 while rotating around the rotation shaft 51 due to friction with the dicing tape DT.

[0052] Furthermore, the inner circumference side table 21 and the outer circumference side table 22 move along the transport direction, and the dicing tape DT is applied to the dicing frame DF and the workpiece W from approximately the center of the dicing frame DF to the other end. At this time, the ball screw 53 moves the frame 52 of the support roller 5 so that the support roller 5 moves from the outside to the inside in the width direction D2 when viewed from above. Then, the support roller 5 stretches the dicing tape DT so as to pull it toward the inside of the width direction D2 as it moves toward the inside of the width direction D2 while rotating around the rotation shaft 51 due to friction with the dicing tape DT.

[0053] Then, as shown in FIG. 12(c), when the dicing tape DT reaches the other end (application end position) of the dicing frame DF, the workpiece W and the dicing frame DF are adhered together via the dicing tape DT.

[0054] The support rollers 5 are not limited to those whose rotation shafts 51 are provided parallel to the width direction D2. For example, as shown in Fig. 13, 14 and 15, the rotation shafts 51 may be provided so as to be inclined with respect to the payout direction of the dicing tape DT, specifically, the pair of support rollers 5 may be provided so as to be inclined in a substantially V-shape with respect to the payout direction of the dicing tape DT when viewed from the joining direction D1.

[0055] As a result, when the dicing tape DT is applied to the dicing frame DF and the workpiece W from one end of the dicing frame DF to approximately the center, the support roller 5 slides from the inside to the outside in the width direction D2, stretching the dicing tape DT in a kneading manner toward the outside in the width direction D2, making it easier to apply tension to the dicing tape DT.

[0056] In this way, the tape application device 1 of this embodiment is a tape application device 1 that applies the dicing tape DT to the workpiece W and the dicing frame DF along the application direction D1, and is configured to include a pressure roller 34 that presses the dicing tape DT against the workpiece W and the dicing frame DF, and a support roller 5 that stretches the dicing tape DT toward the width direction D2 when viewed from a plane.

[0057] According to this configuration, the support rollers 5 stretch the dicing tape DT in the width direction D2, thereby applying tension to the dicing tape DT in the width direction D2.

[0058] Furthermore, the present invention can be modified in various ways other than those described above without departing from the spirit of the present invention, and it goes without saying that the present invention extends to such modifications. [Explanation of symbols]

[0059] 1: Tape application device 2: Transport section 21: Inner circumference table 21a: Adsorption surface 22: Outer table 23: Adsorbent 3: Attachment part 31: Feed roller 32: Winding roller 33a to 33f: sixth guide roller 34: Pressure roller 35: Knife plate 4: Support pin (extension means) 41: Pin body 42: Shaft 43: Ring table 5: Support roller (extension means) 51: Rotation axis 52: Frame 53: Ball screw DF: Dicing frame DT: Dicing tape W: Work

Claims

1. A tape application device that applies a dicing tape to a workpiece and a dicing frame along a predetermined application direction, a pressing roller that presses the dicing tape against the workpiece and a dicing frame; stretching means for stretching the dicing tape at least in a width direction perpendicular to the joining direction when the dicing tape is viewed from above; An inner peripheral table for holding the workpiece; an outer circumferential table on which the dicing frame is placed; Equipped with the extension means is a support pin provided between the inner circumference side table and the outer circumference side table, and at least a portion of the support pin is located above the workpiece and the dicing frame, a support pin that extends the dicing tape sandwiched between the support pin and the pressure roller when the support pin swings downward under the pressure of the pressure roller, the support pin extending the dicing tape sandwiched between the support pin and the pressure roller. The tape application device described herein.

2. A tape application device that applies a dicing tape to a workpiece and a dicing frame along a predetermined application direction, a pressing roller that presses the dicing tape against the workpiece and a dicing frame; stretching means for stretching the dicing tape at least in a width direction perpendicular to the joining direction when the dicing tape is viewed from above; Equipped with The tape application device is characterized in that the stretching means is a support roller arranged opposite the pressure roller, slidably provided in the width direction, and stretches the dicing tape passing between the pressure roller and the support roller.

3. 3. The tape application device according to claim 2, wherein the rotation axis of said support roller is provided parallel to a payout direction in which said dicing tape is fed to said pressure roller.

4. 3. The tape application device according to claim 2, wherein the rotation axis of said support roller is provided at an angle with respect to the payout direction in which said dicing tape is fed to said pressure roller.

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