Gate break device, resin molding system and unnecessary resin removal method

Abstract

To provide a gate break device, a resin molding system and an unnecessary resin removal method which can surely remove an unnecessary resin having elasticity.SOLUTION: A gate break device, which includes a long-sized electronic component substrate where a plurality of electronic components are arranged in a longitudinal direction, a mold part for molding the respective electronic components of the electronic component substrate, and an unnecessary resin molded integrally with the respective mold parts, and removes the unnecessary resin from a resin molding where the unnecessary resin is formed in a transverse direction crossing the longitudinal direction, includes a first cutting unit for cutting a cut part of the unnecessary resin, and a second cutting unit for cutting a residual part of the unnecessary resin from which the cut part has been cut.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a gate break device, a resin molding system, and a method for removing unnecessary resin. [Background technology]

[0002] It has been known to manufacture a resin-sealed semiconductor device (resin molded product) by mounting electronic components such as semiconductor chips on an electronic component substrate such as a lead frame or wiring board, and then molding (sealing) the periphery of the electronic components with an insulating resin material (mold material) by transfer molding.

[0003] Transfer molding is a molding method in which an electronic component board on which electronic components are mounted is sandwiched between a molding die, and molten molding material is then pressed and moved using a plunger or similar tool from the cull to the runner to the gate to the cavity of the molding die, thereby molding the electronic components inside the cavity.

[0004] In this type of transfer molding, not only the molded part that has hardened inside the cavity (hereinafter referred to as the "molded part"), but also the parts that have hardened in the cull, runner, and gate of the molding die (hereinafter referred to as the "cull part," the "runner part," and the "gate part," respectively, and collectively referred to as "unnecessary resin") adhere to the electronic component board.

[0005] For this reason, after molding the electronic components, a process (gate break) is performed to remove the unnecessary resin from the electronic component substrate. In removing such unnecessary resin, the cull portion of the unnecessary resin is usually pressed while the electronic component substrate is supported, and the runner portion and the cull portion are rotated around the gate portion, thereby breaking the gate portion, which has a relatively weak strength (for example, see Patent Document 1).

[0006] Also, in order to remove unnecessary resin, for example, a brush is rotated and inserted between the upper and lower dies of a molding die while the electronic component board is held on the upper die, thereby peeling off the resin burrs and separating them from the encapsulating resin (see, for example, Patent Document 2). Furthermore, the ridge of a deburring tip made of a rectangular column is brought into contact with the side of the lead frame and moved to scrape off the resin burrs adhering to the side (see, for example, Patent Document 3). Other methods of removing unnecessary resin include punching and shearing with a punch, peeling by laser sintering, and grinding with a rotating grindstone. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 07-241888 [Patent Document 2] JP 2005-347596 A [Patent Document 3] Japanese Patent Application Publication No. 07-211736 Summary of the Invention [Problem to be solved by the invention]

[0008] However, the conventional unnecessary resin removal methods disclosed in the above Patent Documents 1 to 3 remove the unnecessary resin from the electronic component board by techniques such as breaking, scraping, scraping off, shearing, and sintering peeling, and are effective for completely cured unnecessary resin, but for elastic unnecessary resin, for example, there is a problem that the applied techniques may cause resin residue or removal failure. Such resin residue and removal failure can cause product defects, so there is a demand for a gate break device that can reliably remove unnecessary resin that has elasticity.

[0009] The present invention has been made in consideration of the above circumstances, and has an object to provide a gate break device, a resin molding system, and an unnecessary resin removal method that are capable of reliably removing even unnecessary resin that has elasticity. [Means for solving the problem]

[0010] In order to achieve the above-mentioned object, the gate break device of the present invention is a gate break device that comprises a long electronic component board having a plurality of electronic components arranged along the longitudinal direction, a molded portion for molding each electronic component of the electronic component board, and unnecessary resin integrally molded into each molded portion, and removes the unnecessary resin from a resin molding in which the unnecessary resin is formed toward a short direction intersecting the longitudinal direction, and is characterized in that it comprises a first cutting unit that cuts a portion of the unnecessary resin to be cut, and a second cutting unit that cuts the remaining portion of the unnecessary resin after the portion to be cut has been cut.

[0011] In a gate break device of one embodiment of the present invention, it is preferable that the first cutting unit is configured to be movable in a direction intersecting the longitudinal direction and the transverse direction, and the second cutting unit is configured to be movable along the longitudinal direction.

[0012] In a gate break device according to another embodiment of the present invention, the first cutting unit may be configured to have a cutting blade that cuts the portion to be cut, and a forming blade that forms a cut parallel to the longitudinal direction in the unwanted resin at a position closer to the molded portion than the cutting blade.

[0013] In a gate break device according to yet another embodiment of the present invention, the second cutting unit may be configured to have a first cutting tool that cuts a first portion of the remaining unnecessary resin from the cut end of the portion to be cut to a predetermined position in the short direction, and a second cutting tool that cuts a second portion from the predetermined position to a position closer to the molded portion than the predetermined position.

[0014] In this case, the first cutting tool may be positioned so that its cutting edge reaches the remaining portion of the unnecessary resin before the second cutting tool, and the first cutting tool and the second cutting tool may be configured to move simultaneously along the longitudinal direction.

[0015] In a gate break device according to yet another embodiment of the present invention, the electronic component substrates are arranged in pairs side by side along the short side direction, the unnecessary resin is formed in a state connecting the short sides of each electronic component substrate, and the first cutting unit may be configured to have a pair of cutting blades that cut the portion to be cut of the unnecessary resin along the short side direction, and a pair of forming blades that each form a slit parallel to the longitudinal direction in the unnecessary resin at a position closer to the molded portion than each cutting blade.

[0016] In this case, in the gate break device, the pair of cutting blades preferably have elasticity that allows them to bend in the short side direction.

[0017] Furthermore, in a gate break device according to still another embodiment of the present invention, the second cutting unit may be configured to have a first cutting tool that cuts a first portion of the remaining unnecessary resin in each electronic component board from the cut end of the portion to be cut to a predetermined position in the short direction for each electronic component board after the portion to be cut of the unnecessary resin has been cut by the first cutting unit, and a second cutting tool that cuts a second portion along the slit from the predetermined position to a position closer to the molded portion than the predetermined position.

[0018] In this case, in the gate break device, the unnecessary resin is preferably made of a thermosetting resin having elasticity.

[0019] The resin molding system of the present invention is characterized in that it comprises a long electronic component board having a plurality of electronic components arranged along the longitudinal direction, a molded portion for molding each electronic component of the electronic component board, and waste resin integrally molded into each molded portion, the waste resin being molded toward a short direction intersecting the longitudinal direction, and the above-mentioned gate break device.

[0020] The method for removing unnecessary resin according to the present invention is a method for removing unnecessary resin by a gate break device from a resin molding comprising a long electronic component board having a plurality of electronic components arranged along the longitudinal direction, a molded portion for molding each electronic component of the electronic component board, and unnecessary resin integrally molded into each molded portion, the unnecessary resin being formed toward a short direction intersecting the longitudinal direction, the method comprising: a first cutting step for cutting a portion of the unnecessary resin to be cut by a first cutting unit of the gate break device; and a second cutting step for cutting a remaining portion of the unnecessary resin after the portion to be cut has been cut by a second cutting unit of the gate break device. Effect of the Invention

[0021] According to the present invention, it is possible to provide a gate break device, a resin molding system, and an unnecessary resin removal method that can reliably remove unnecessary resin even if the unnecessary resin has elasticity. [Brief description of the drawings]

[0022] [Figure 1] 1 is a diagram showing a schematic plan view of the arrangement of components in a resin molding system according to an embodiment of the present invention; [Diagram 2] 1 is a front view showing a schematic configuration of a resin molding apparatus according to an embodiment of the present invention; [Diagram 3] FIG. 2 is a plan view illustrating an example of a resin molded body. [Figure 4] FIG. 2 is a perspective view showing an external appearance of a first cutting unit of the gate break device according to the present embodiment, with some parts omitted. [Diagram 5] FIG. 5(a) is a side view that shows a schematic diagram of a state in which the unnecessary resin has been cut by the first cutting unit, and FIG. 5(b) is a side view that shows a schematic diagram of the resin molded body from which the unnecessary resin has been cut. [Figure 6] FIG. 13 is a side view illustrating an example of a procedure for disposing of unnecessary resin. [Figure 7] FIG. 13 is a side view illustrating an example of a procedure for disposing of unnecessary resin. [Figure 8] FIG. 13 is a side view illustrating an example of a procedure for disposing of unnecessary resin. [Figure 9] 2 is a perspective view showing an external appearance of a second cutting unit of the gate break device according to the present embodiment with some parts omitted. FIG. [Figure 10] 10 is a schematic external perspective view of the second cutting unit of FIG. 9 with a further portion omitted. FIG. [Figure 11] FIG. 4 is a side view illustrating a schematic view of a portion of the second cutting unit. [Figure 12] FIG. 4 is a top view illustrating a schematic view of a portion of the second cutting unit. [Figure 13] 11 is a plan view for illustrating a schematic procedure for cutting the unnecessary resin by the second cutting unit. FIG. [Figure 14] 11 is a plan view for illustrating a schematic procedure for cutting the unnecessary resin by the second cutting unit. FIG. [Figure 15] FIG. 11 is an explanatory view illustrating a third cutting tool of the second cutting unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] Hereinafter, a gate break device, a resin molding system, and an unnecessary resin removal method according to an embodiment of the present invention will be described in detail with reference to the attached drawings. However, the following embodiments do not limit the invention according to each claim, and not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention. Furthermore, in the following embodiments, the same or corresponding components are given the same reference numerals and duplicated descriptions are omitted. Furthermore, in the embodiments, the arrangement, scale, dimensions, etc. of each component may be exaggerated or minimized and shown in a state that does not match the actual ones, and some components may be omitted.

[0024] [Resin Molding System 100] First, the resin molding system 100 according to this embodiment will be described mainly with reference to Fig. 1. Fig. 1 is a diagram that shows a schematic plan view of the arrangement of each component in a resin molding system according to one embodiment of the present invention. Fig. 2 is a front view that shows a schematic view of a resin molding apparatus according to this embodiment. Fig. 3 is a plan view that shows a schematic view of an example of a resin molded body.

[0025] 1, a resin encapsulation system 100 according to this embodiment includes a press unit 2, a loader unit 4, and an unloader unit 6. The press unit 2 performs resin encapsulation molding on a lead frame W that holds electronic components such as semiconductor chips. The loader unit 4 supplies the lead frame W and a resin tablet (not shown) to the press unit 2. The unloader unit 6 collects the resin molded body P after resin encapsulation from the press unit 2 and performs post-processing.

[0026] 1, for example, a rectangular member indicated by a dashed line indicates a lead frame W. In the following description, an example will be described in which four electronic components are arranged on one lead frame W, and resin sealing molding is performed collectively for the four lead frames W in one molding cycle, that is, a total of 16 electronic components are resin sealed in one molding cycle.

[0027] The press unit 2 includes a resin sealing device (resin molding device) 1. The resin sealing device 1 is disposed between a loader unit 4 and an unloader unit 6. The resin sealing device 1 seals electronic components of a lead frame W carried in from the loader unit 4 with resin by transfer molding.

[0028] 2, the resin sealing apparatus 1 includes a lower platen 11, tie bars 12, an upper platen 13, a movable platen 14, a lifting clamping mechanism 15, a transfer mechanism 16, and a resin molding die 17. The lower platen 11 is made of a rectangular plate-shaped member placed on the floor surface.

[0029] For example, four tie bars 12 are provided extending upward from the four corners of the lower platen 11. The upper platen 13 is made of a rectangular plate-shaped member whose four corners are connected to the upper ends of these four tie bars 12. The movable platen 14 is a rectangular plate-shaped member with the four tie bars 12 penetrating its four corners, and is provided between the lower platen 11 and the upper platen 13 so as to be able to rise and fall along the tie bars 12.

[0030] The lifting and lowering mold clamping mechanism 15 is provided between the lower platen 11 and the moving platen 14, and raises and lowers the moving platen 14. The transfer mechanism 16 is provided on the upper surface of the moving platen 14. The resin molding die 17 is provided between the upper platen 13 and the transfer mechanism 16.

[0031] The transfer mechanism 16 and the resin molding die 17 are so-called multi-pot type transfer mechanism and resin molding die. Therefore, the transfer mechanism 16 and the resin molding die 17 are configured to be able to collectively perform resin encapsulation molding for a plurality of lead frames W (four in this embodiment) in one molding cycle. In the resin encapsulation system 100 according to this embodiment, the lower platen 11, the tie bar 12, the upper platen 13, the movable platen 14, the lift clamping mechanism 15, and the transfer mechanism 16 can adopt various known configurations, and therefore the description thereof will be omitted.

[0032] 2, the resin molding die 17 includes an upper die 17a and a lower die 17b. The upper die 17a is attached to the lower surface of the upper platen 13. The lower die 17b is attached to the surface of the transfer mechanism 16 that faces the upper die 17a. The lower die 17b is configured to be able to form a cavity for resin sealing molding together with the upper die 17a.

[0033] 1, the lower die 17b is configured so that, for example, four lead frames W can be arranged in two rows. The lower die 17b has a plurality of (eight in this embodiment) storage pot forming holes 18 formed between the rows L1 and L2 of the lead frames W. A plunger (not shown) of the transfer mechanism 16 is disposed in each storage pot forming hole 18. The lower die 17b is configured so that a storage pot capable of accommodating a resin tablet is formed by the inner surface of each storage pot forming hole 18 and the upper surface of each plunger.

[0034] The mold surfaces of the upper mold 17a and the lower mold 17b are formed with resin flow paths capable of molding the cull portion 106, runner portion 104, gate portion 102, and mold portion 108 of the resin molding P as shown in Fig. 3. Specifically, the mold surface of the upper mold 17a is formed with culls (not shown) for forming the cull portion 106 at positions aligned with the storage pot forming hole portion 18.

[0035] Also, on the mold surfaces of upper mold 17a and lower mold 17b, cavity-forming recesses (not shown) for forming molded portion 108 are formed at positions aligned with each electronic component of each lead frame W. Furthermore, on the mold surface of lower mold 17b, runners (not shown) for forming runner portion 104 are formed for each cavity, and by narrowing the opening at the boundary between the runner and the cavity, gate portion 102 can be formed.

[0036] The resin sealing device 1 of the press unit 2 having the above configuration pressurizes the molten molding material with each plunger while four lead frames W are sandwiched between the upper die 17a and the lower die 17b. The pressurized molding material is then caused to flow through the resin molding die 17 in the order of cull → runner → gate → cavity, and then thermally hardened. This allows two sets of resin molded bodies P with electronic components molded therein to be manufactured in one molding cycle.

[0037] A pair (set) of resin moldings P manufactured by such a resin sealing apparatus 10, as shown in FIG. 3, comprises a long lead frame W having multiple (four in this embodiment) electronic components arranged along the longitudinal direction, a molded portion 108 for molding each electronic component of the lead frame W, and unwanted resin having a gate portion 102, a runner portion 104 and a cull portion 106 integrally molded with each molded portion 108, with the unwanted resin connecting each lead frame W in the short direction intersecting the longitudinal direction.

[0038] 1, the loader unit 4 includes a loader rack 20, a frame pusher 21, an alignment device 22, a transport device 23, a tablet supply device 24, and a preheater device (not shown). The loader rack 20 accommodates a plurality of lead frames W (workpieces). The frame pusher 21 sends out the lead frames W accommodated in the loader rack 20 one by one.

[0039] The alignment device 22 aligns the lead frames W sent out from the frame pusher 21 in accordance with the arrangement of the resin molding die 17. The transport device 23 is provided so as to be able to move back and forth between the alignment device 22 and the resin sealing apparatus 1. The tablet supply device 24 supplies the resin tablets to the transport device 23 in a state where they are aligned in accordance with the arrangement of the pots of the resin molding die 17. The preheater device preheats the lead frames W before they are transported to the resin sealing apparatus 1.

[0040] The alignment device 22 has, for example, a pair of conveyor belts 22a and 22b arranged in parallel. The pair of conveyor belts 22a and 22b are configured to be rotatable in the horizontal direction. As a result, after one of the conveyor belts 22a receives a lead frame W, the other conveyor belt 22b can receive the lead frame W by rotating 180 degrees.

[0041] The pair of conveyor belts 22a, 22b are configured to be movable up and down so that they receive the lead frames W from the frame pusher 21 while aligning them at the lowered position, and then rise to deliver the lead frames W to the conveyor device 23 at the uppered position.

[0042] The conveying device 23 is configured to be movable in the vertical and horizontal directions in Fig. 1, as indicated by the solid arrows in Fig. 1. The conveying device 23 receives a plurality of lead frames W aligned by the alignment device 22 while maintaining the aligned state, and receives a plurality of resin tablets aligned in a line by the tablet supply device 24 while maintaining the aligned state. The conveying device 23 is configured to carry these lead frames W and resin tablets into the resin sealing device 1.

[0043] The loader unit 4 having the above configuration is configured to supply the number of lead frames W and resin tablets required for one molding cycle to the resin sealing apparatus 1 in a state where they are aligned according to their arrangement in the resin molding die 17. Note that the loader unit 4 can adopt various known configurations, and therefore detailed explanations thereof will be omitted. Also, the loader unit 4 is not limited to the above configuration, and any configuration can be adopted.

[0044] 1, the unloader unit 6 includes a carry-out device 30, a gate breaking device 40, an unloader device 32, a storage and transport device 34, and an unfilled detection device (not shown). The carry-out device 30 carries out the resin molding P with unnecessary resin from the resin sealing device 1. The gate breaking device 40 has a first cutting unit 50 and a second cutting unit 60, and removes the unnecessary resin from the resin molding P. The unloader device 32 stores the resin molding from which the unnecessary resin has been removed.

[0045] The storage and conveying device 34 is provided so as to be movable between the gate break device 40 and the unloader device 32. The unfilled detection device is provided between the gate break device 40 and the unloader device 32, and inspects the resin molded products being conveyed by the storage and conveying device 34 for molding defects and the like. The specific configuration of the gate break device 40 will be described later.

[0046] 1, the unloading device 30 is configured to be movable in the vertical and horizontal directions in Fig. 1. The unloading device 30 is configured to collect the resin molding P with unnecessary resin formed in the resin sealing device 1, and transport it to the gate breaking device 40.

[0047] The carry-out device 30 is equipped with, for example, a transport claw (not shown) capable of gripping the outer frame portion of the resin-sealed lead frame W, and a suction pad (not shown) capable of vacuum-suctioning the unnecessary resin portion. The carry-out device 30 is configured to transport the resin molding P with the unnecessary resin attached while being held by the transport claw and suction pad. The carry-out device 30 also has a cleaning suction means (not shown) or a cleaner head (not shown) capable of generating an air blow, and is configured to clean the mold surface of the resin molding die 17 when retreating from the resin sealing device 1.

[0048] The storage and transport device 34 has, for example, gripping claws (not shown) capable of gripping the outer frame portion of the lead frame W from which unnecessary resin has been removed. The storage and transport device 34 is configured to be capable of moving one of the lead frames W (row L1 or row L2) cut by the first cutting unit 50 between the first cutting unit 50 and the second cutting unit 60 of the gate break device 40, with the lead frame W rotated horizontally to align the row orientation, relative to the second cutting unit 60. The storage and transport device 34 is also configured to collect the resin molded product from which unnecessary resin has been removed from the gate break device 40, and store it in the unloader device 32.

[0049] The unloader unit 6 having the above configuration takes out the resin molded body P with unnecessary resin molded in the resin sealing apparatus 1 by the carry-out device 30, and removes the unnecessary resin in the gate break device 40 to produce a resin molded product. The unloader unit 6 is then configured to transport the resin molded product to the unloader device 32 by the storage and transport device 34, and recover the resin molded product in the unloader device 32. Note that the configuration of the unloader unit 6 other than the gate break device 40 can be various known configurations, and detailed description thereof will be omitted. Also, the unloader unit 6 is not limited to the above configuration, and can be any configuration.

[0050] [Gate Break Device 40] Next, the gate break device 40 according to this embodiment will be described with reference to Figures 4 to 14. In the following description, the longitudinal direction means the longitudinal direction of the lead frame W when placed on the gate break device 40, and the width direction (short side direction) means the width direction (short side direction) of the lead frame W in the same state.

[0051] As described above, the gate break device 40 includes a first cutting unit 50 that removes, for example, a portion of the unnecessary resin to be cut from the resin molding P with the unnecessary resin by cutting in a first stage, and a second cutting unit 60 that removes, for example, a remaining portion of the unnecessary resin by cutting in a second stage. First, the first cutting unit 50 will be described.

[0052] Fig. 4 is a schematic external perspective view of the first cutting unit of the gate break device according to this embodiment, with some parts omitted. Fig. 5(a) is a schematic side view of the state in which the unnecessary resin has been cut by the first cutting unit, and Fig. 5(b) is a schematic side view of the resin molding from which the unnecessary resin has been cut. Figs. 6 to 8 are side views showing an example of a procedure for disposing of the unnecessary resin.

[0053] 4, the first cutting unit 50 mainly includes a table 41, a receiving mechanism 42, a cutting mechanism 43, and a drive mechanism (not shown). The table 41 is a platform large enough to place the receiving mechanism 42 on. A through hole 41a is formed in a predetermined area on the central side of the table 41, allowing the unnecessary resin cut by the cutting mechanism 43 to fall below the table 41. Note that an unnecessary resin collection container (not shown) for collecting the unnecessary resin is disposed below the through hole 41a of the table 41.

[0054] The receiving mechanism 42 is provided on the table 41 via a pair of width-direction guide rails 44 arranged side by side in the longitudinal direction. The cutting mechanism 43 is provided above the table 41 and the receiving mechanism 42 so as to be movable up and down. The drive mechanism drives the cutting mechanism 43 to move up and down in the vertical direction, and moves base parts 45a, 45b (described later) in the width direction. The first cutting unit 50 is configured to be able to perform the first stage of cutting on two sets of resin moldings P arranged in the longitudinal direction at once, but is not limited to this.

[0055] 6 to 8, the receiving mechanism 42 includes a first receiving portion 42a, a second receiving portion 42b, and a third receiving portion 42c. The receiving mechanism 42 also includes, for example, a base portion 45a disposed below the first receiving portion 42a, and a base portion 45b disposed below the second receiving portion 42b and the third receiving portion 42c.

[0056] The first receiving portion 42a is arranged corresponding to the lead frame W in one row L1, and is configured to have the lead frame W in row L1 placed on its upper surface in a positioned state. The second receiving portion 42b is arranged corresponding to the lead frame W in the other row L2, and is configured to have the lead frame W in row L2 placed on its upper surface in a positioned state.

[0057] The third receiving portion 42c is disposed in correspondence with the waste resin between the rows L1 and L2 between the first receiving portion 42a and the second receiving portion 42b, and is configured so that the waste resin is placed on its upper surface. The upper surface of the third receiving portion 42c may be configured so as to have flexibility to allow the cutting blade 52 of the cutting mechanism 43, which will be described later, to enter therethrough.

[0058] The base portions 45a and 45b are each bridged between a pair of width-direction guide rails 44. The base portions 45a and 45b are each made of a plate-like member formed in a rectangular shape. In this embodiment, the base portion 45b is formed to be wider than the base portion 45a. The base portions 45a and 45b are attached to be slidable along the pair of width-direction guide rails 44 via a pair of slider portions 46a and 46b provided on the lower surfaces of the base portions 45a and 45b. Therefore, the receiving mechanism 42 is configured such that the first receiving portion 42a, the second receiving portion 42b, and the third receiving portion 42c can be moved apart from each other in the width direction.

[0059] The cutting mechanism 43 includes a lift base 47, a first pressing portion 48a, a second pressing portion 48b, a cutting block 49, and a notch forming block 51. The lift base 47 is made of a rectangular plate-like member. The first pressing portion 48a is arranged below the lift base 47 in association with the lead frame W of one row L1, and is configured to press the lead frame W of row L1 placed on the first receiving portion 42a from above with its lower surface. The second pressing portion 48b is arranged below the lift base 47 in association with the lead frame W of the other row L2, and is configured to press the lead frame W of row L2 placed on the second receiving portion 42b from above with its lower surface.

[0060] As shown in Figs. 5 to 8, the cutting block portion 49 is made of a block member having a downwardly convex cross section, which is provided below the block base 49a formed in the vertical plate shape shown in Fig. 4 and extends in the longitudinal direction. A pair of cutting blades 52 are attached to the left and right side walls of the cutting block portion 49 and are arranged side by side in the width direction with their blade tips facing downward. Suction pads 54 are provided on the lower surface of the cutting block portion 49 at positions corresponding to each of the unnecessary resins. Each suction pad 54 is connected to a suction hose 49b which is connected to a vacuum device (not shown).

[0061] The pair of cutting blades 52 are respectively attached between the cutting block portion 49 in the width direction via a spacer 52a for adjusting the position in the width direction. Also, the pair of cutting blades 52 are respectively attached between the cutting block portion 49 in the up-down direction via an elastic body (not shown) such as a spring or rubber. Note that the pair of cutting blades 52 may be configured to have elasticity that allows them to bend in the width direction.

[0062] As shown in Figure 5(a), when the cutting mechanism 43 is lowered to a lower position as indicated by the solid white arrow in the figure, the pair of cutting blades 52 are configured to cut, for example, the portion to be cut (the main portion of the cull portion 106) A1 of the unnecessary resin formed to bridge between the lead frames W of rows L1 and L2, from each lead frame W, as shown in Figure 5(b).

[0063] The incision forming block parts 51 are each composed of a block member having an inverted L-shaped cross section, and are provided in pairs in the longitudinal direction below the block bases 49c that are respectively attached to the underside of the lifting base part 47. A pair of forming blades 53 are attached to the side walls of the incision forming block parts 51 that face the cutting block part 49, and are arranged side by side in the width direction so as to face the cutting blades 52 with their cutting tips facing downward.

[0064] Each pair of forming blades 53 is attached between the incision forming block portion 51 in the width direction via a spacer 51a for adjusting the position in the width direction. As shown in Fig. 5(a), when the cutting mechanism 43 is lowered as shown by the solid arrow in the figure, each pair of forming blades 53 is provided to form a slit (cut) S parallel to the longitudinal direction in the unnecessary resin (part of the runner portion 104 in this embodiment) at a position closer to the molded portion 108 than the cut end 106a in the remaining portion (remainder of the cull portion 106, the runner portion 104, and the gate portion 102) A2 of the unnecessary resin from which the cut portion A1 between the lead frames W in the rows L1 and L2 is cut, as shown in Fig. 5(b).

[0065] That is, the pair of forming blades 53 is provided on the side edge of each molded portion 108 so as to leave a small amount of unnecessary resin when the remaining portion A2 of the unnecessary resin is cut by the second cutting unit 60 described below. The cutting edges of the pair of forming blades 53 are provided so as to be located higher than the cutting edges of the pair of cutting blades 52, and the pair of forming blades 53 is inserted into the unnecessary resin on the front surface side of the lead frame W with a pressure that does not deform the resin molded body P (electronic component substrate) to form a slit S.

[0066] The first cutting unit 50 having the above-mentioned configuration is configured so that, when the cutting mechanism 43 is lowered onto a set of resin moldings P positioned and placed on the receiving mechanism 42 as shown in Figure 6, the pair of cutting blades 52 cuts the unnecessary resin of the resin moldings P into a portion A1 to be cut, and the pair of forming blades 53 forms a slit S in the remaining portion A2 of the unnecessary resin from which the portion A1 to be cut has been cut.

[0067] The unnecessary resin portions A1 cut by the pair of cutting blades 52 are discarded as follows: In the first cutting unit 50 that has cut the unnecessary resin portions A1 and formed the slits S in the state shown in Fig. 6, with the unnecessary resin portions A1 being adsorbed by the suction pads 54, the cutting mechanism 43 is raised and separated from the receiving mechanism 42 as shown in Fig. 7.

[0068] 8, the base portions 45a and 45b of the receiving mechanism 42 are moved apart from each other in the width direction as shown by the solid arrows in the figure, and a gap communicating with the through hole 41a is generated between the first receiving portion 42a and the third receiving portion 43c. Then, the suction pad 54 releases the suction-holding state of the unnecessary resin portion A1 to be cut, and the unnecessary resin portion A1 is dropped into the gap as shown by the solid arrows in the figure, and is discarded into the unnecessary resin recovery container through the through hole 41a. Next, the second cutting unit 60 will be described.

[0069] Fig. 9 is an external perspective view showing a second cutting unit of the gate break device according to this embodiment with a portion omitted. Fig. 10 is an external perspective view showing a further portion of the second cutting unit of Fig. 9 with a portion omitted. Fig. 11 is a side view showing a portion of the second cutting unit with a portion omitted. Fig. 12 is a top view showing a portion of the second cutting unit with a portion omitted. Figs. 13 and 14 are plan views for explaining a procedure for cutting unnecessary resin by the second cutting unit.

[0070] 9 and 10, the second cutting unit 60 mainly includes a unit frame 61, a receiving mechanism 62, a cutting mechanism 63, and a drive mechanism (not shown). The unit frame 61 is a frame that extends in a square shape in the longitudinal direction and has a size that allows the receiving mechanism 62 to be attached.

[0071] The receiving mechanism 62 includes a plurality of frame guides 64 arranged on the unit frame 61 in a pair on the left and right, and a frame clamper 65. Each frame guide 64 supports both short side edges, one long side edge, and the bottom surface of the lead frame W from which the unnecessary resin portion A1 has been cut. The frame clamper 65 is arranged so as to be able to move up and down (open and close) relative to each frame guide 64. The frame clamper 65 supports the top surface of the lead frame W supported by each frame guide 64 by pressing it from above against each frame guide 64, as shown by the solid arrow with a white outline in FIG.

[0072] The cutting mechanism 63 is provided on either the left or right side of each frame guide portion 64 so as to be slidable in the longitudinal direction along the extension direction of the unit frame 61. The drive mechanism slides the cutting mechanism 63 in the longitudinal direction and opens and closes the frame clamper 65 in the vertical direction.

[0073] The second cutting unit 60 is configured to receive either one of the lead frames W in row L1 or row L2 from which the unwanted resin portion A1 to be cut has been cut, after being rotated horizontally 180 degrees by the storage and transport device 34 so that the position of the remaining portion A2 of the unwanted resin is the same as the position of the remaining portion A2 of the other lead frame W (i.e., so that it is at the same position on one side in the width direction), and is configured to be able to perform the second stage cutting of the remaining portion A2 of each lead frame W with the orientation of the rows of each lead frame W aligned, but is not limited to this.

[0074] The cutting mechanism 63 includes a slider body 66 and a suction hose 67 integrally connected to the slider body 66. The slider body 66 includes a cutting tool block portion 70 having a first cutting tool 68 and a second cutting tool 69 attached to a side wall thereof as shown in Fig. 10. The suction hose 67 is connected to a suction device (not shown) and configured to suck and remove the unnecessary resin cut by the first cutting tool 68 and the second cutting tool 69. Note that the cutting mechanism 63 may include a blower hose instead of the suction hose 67, which blows away the cut unnecessary resin with air supplied from a blower device.

[0075] As shown in Figures 11 and 12, the first and second cutting tools 68, 69 move simultaneously along the longitudinal direction over the top surface of the lead frame W as indicated by the solid white arrows in the figures, and are attached to the cutting tool block portion 70 so that the cutting edge 68a of the first cutting tool 68 reaches the remaining portion A2 of the unnecessary resin before the second cutting tool 69.

[0076] The first cutting tool 68 has a cutting edge 68a formed parallel to the width direction and an inclined surface 68b that inclines upward from the cutting edge 68a toward one side in the longitudinal direction (the base end side). The second cutting tool 69 has a cutting edge 69a formed parallel to the width direction and an inclined surface 69b that inclines upward from the cutting edge 69a toward one side in the longitudinal direction (the base end side).

[0077] The width H1 of the first cutting tool 68 is formed to be smaller than the width of the remaining portion A2 of the unnecessary resin after the portion A1 to be cut is cut. The width H2 of the second cutting tool 69 is formed to be larger than the width H1 of the first cutting tool 68. The first cutting tool 68 and the second cutting tool 69 are arranged such that the side surface on the cutting tool block portion 70 side is located slightly outward in the width direction from the position of the cut end 106a (to the left of the cut end 106a in FIG. 12).

[0078] In addition, the side of the second cutting tool 69 opposite the cutting tool block portion 70 is located closer to the molded portion 108 than the side of the first cutting tool 68 opposite the cutting tool block portion 70, and is positioned so as to be located inward in the width direction (to the left of the side edge of the molded portion 108 in Figure 12) so as to form a small gap between it and the side edge of the molded portion 108.

[0079] The second cutting unit 60 having the above-mentioned configuration is positioned and placed on each frame guide portion 64 of the receiving mechanism 62, and the cutting mechanism 63 moves horizontally along the longitudinal direction of one resin molding P (lead frame W) held down by the frame clamper 65 as indicated by the solid arrow with white in the figure (the movement mode indicated by the "solid arrow with white in the figure" in Figures 13 and 14 is the same below), so that the first cutting tool 68 and the second cutting tool 69 are configured to cut the remaining portion A2 of the unnecessary resin of the resin molding P in sequence, leaving a small portion remaining.

[0080] Specifically, as shown in Fig. 13(a), when the cutting mechanism 63 starts to move horizontally, first, the cutting edge 68a of the first cutting tool 68 reaches the remaining portion A2 of the unnecessary resin. Then, as the horizontal movement continues, as shown in Fig. 13(b), the cutting edge 68a of the first cutting tool 68 partially cuts a first portion A2a of the remaining portion A2 of the unnecessary resin, which is from the cut end 106a of the portion A1 to be cut to a predetermined position in the short direction, and the cut first portion A2a is turned up along the inclined surface 68b and removed.

[0081] After that, the horizontal movement of the cutting mechanism 63 continues, and as shown in FIG. 13(c), the blade tip 69a of the second blade 69 reaches the second portion A2b of the remaining portion A2 of the unnecessary resin, which is located from the predetermined position where the first portion A2a was cut to the slit S, which is a position in the vicinity of the molded portion 108 in the short side direction (a position closer to the molded portion 108 than the predetermined position). Then, as the horizontal movement continues, as shown in FIG. 13(d), the blade tip 69a of the second blade 69 cuts the second portion A2b along the slit S, and the cut second portion A2b is turned up and removed along the inclined surface 69b. As a result, the remaining portion A2 of the unnecessary resin is cut and removed while leaving a small amount of unnecessary resin (third portion A2c) on the side edge of the molded portion 108. The first portion A2a and the second portion A2b cut in sequence are sequentially sucked and removed by air sucked into the suction hose 67, and are discarded into an unnecessary resin collection container (not shown) or the like.

[0082] In the second cutting unit 60, the cutting of the remaining unnecessary resin portions A2 by the first cutting tool 68 and the second cutting tool 69 as described above is performed on a plurality of remaining unnecessary resin portions A2 at once by moving the cutting mechanism 63 horizontally once along the longitudinal direction of the lead frame W from one end of the lead frame W in the longitudinal direction (upper side in FIG. 14) to the other end of the lead frame W in the longitudinal direction (lower side in FIG. 14), as shown in FIG. 14(a) to FIG. 14(d).

[0083] That is, after the lead frame W is set on the receiving mechanism 62 (not shown) as shown in FIG. 14(a), the cutting mechanism 63 is moved horizontally, whereby first, as shown in FIG. 14(b), the remaining portion A2 of the unnecessary resin in the molded portion 108 located at the most upstream side in the movement direction of the first and second cutting tools 68, 69 is cut so as to leave a third portion A2c.

[0084] 14(c) and 14(d), the horizontal movement of the cutting mechanism 63 is continued for the second and third molded sections 108 from the most upstream side, whereby the remaining portion A2 of the unnecessary resin is successively cut off so as to leave a third portion A2c. Then, although not shown, the remaining portion A2 of the unnecessary resin of the fourth molded section 108 from the most upstream side is also cut off leaving a third portion A2c, whereby all of the remaining portions A2 of the unnecessary resin are cut off in one horizontal movement of the cutting mechanism 63.

[0085] In this way, in the cutting mechanism 63, a first cutting tool 68 of width H1 and a second cutting tool 69 of width H2 are provided, and the first portion A2a and the second portion A2b of the remaining portion A2 of the unnecessary resin are cut continuously and sequentially. Even if the remaining portion A2 of the unnecessary resin is tightly adhered to the lead frame W, the stress during cutting can be distributed and the cutting can be performed reliably (so as to obtain a clean cut).

[0086] In particular, in the gate break device 40 of this embodiment, the first cutting unit 50 not only cuts the to-be-cut portion A1, which is the main portion of the unnecessary resin, in the first cutting stage, but also forms a slit S in the remaining portion A2 of the unnecessary resin. Therefore, using this slit S as a starting point, in the second cutting stage, the second cutting unit 60 can reliably cut the remaining portion A2 of the unnecessary resin from the molded portion 108, leaving behind the third portion A2c.

[0087] As described above, the method for removing unnecessary resin by the gate break device 40 according to this embodiment is realized by carrying out a first cutting step (first-stage cutting) in which the first cutting unit 50 cuts the portion A1 of the unnecessary resin to be cut, and a second cutting step (second-stage cutting) in which the second cutting unit 60 cuts the remaining portion A2 of the unnecessary resin from which the portion A1 to be cut has been cut. With this configuration, it is possible to reliably cut and remove not only unnecessary resin made of cured thermosetting resin, but also unnecessary resin that is not completely cured and still retains elasticity.

[0088] [Operation of resin sealing system 100] Next, an operation of the resin sealing system 100 according to the present embodiment will be described. Note that the following operation of the resin sealing system 100 is performed by appropriately driving and controlling each component based on a program stored in advance in a storage unit, for example.

[0089] First, the frame pusher 21 of the loader unit 4 sends out the lead frames W one by one from the loader rack 20 to the alignment device 22. The lead frames W sent out from the loader rack 20 are aligned in the alignment device 22 according to the arrangement of the resin molding die 17, and are transferred to the transport device 23.

[0090] The transport device 23 delivers the four lead frames W received from the alignment device 22 to the preheater device, where they are preheated and then collected. At the same time, the transport device 23 receives resin tablets from the tablet supply device 24, and transports the lead frames W and resin tablets to the resin sealing device 1 of the press unit 2. Then, the transport device 23 places the four lead frames W on the lower die 17b of the resin molding die 17, and drops the resin tablets into each of the storage pot forming holes 18 of the lower die 17b.

[0091] When the lead frame W and the resin tablet are delivered to the resin sealing apparatus 1, the resin sealing apparatus 1 executes resin sealing molding. As a result, a resin molding P with unnecessary resin is manufactured in the resin sealing apparatus 1. Then, when the resin molding P with unnecessary resin is manufactured in the resin sealing apparatus 1, the carry-out device 30 of the unloader unit 6 collects the resin molding P with unnecessary resin in the resin sealing apparatus 1 and transports it toward the gate break device 40.

[0092] When the resin molding P with unwanted resin is placed on the receiving mechanism 42 of the first cutting unit 50 of the gate break device 40 by the discharge device 30, the first cutting unit 50 lowers the cutting mechanism 43 to press each lead frame W with the first and second pressing portions 48a, 48b, while cutting the unwanted resin portion A1 to be cut with a pair of cutting blades 52 and forming a slit S in the remaining portion A2 of the unwanted resin with a pair of forming blades 53.

[0093] Thereafter, the cutting mechanism 43 is raised to separate the first receiving portion 42a from the second receiving portion 42b and the third receiving portion 42c, and the unnecessary resin portion A1 to be cut is dropped toward the unnecessary resin collection container as described above, thereby performing the first stage of cutting in which the unnecessary resin portion A1 between each lead frame W is cut and removed.

[0094] Next, when the resin molding P with the remaining portion A2 of the unnecessary resin aligned in the row direction is clamped to the receiving mechanism 62 of the second cutting unit 60 of the gate break device 40 by the storage and transport device 34, the second cutting unit 60 moves the cutting mechanism 63 horizontally along the longitudinal direction to cut the first portion A2a of the remaining portion A2 of the unnecessary resin with the first cutting tool 68 and cut the second portion A2b with the second cutting tool 69 while suctioning, removing and discarding it. This performs a second-stage cutting in which the remaining portion A2 is cut and removed while leaving a small amount of the third portion A2c on the side edge of the molded portion 108 of each lead frame W.

[0095] After or in parallel with the removal of the remaining portion A2 of the unnecessary resin, the resin molding P (resin molding) including the lead frame W from which the unnecessary resin has been removed is collected by the storage and transport device 34, inspected by the unfilling detection device, and then stored in the unloader device 32. These steps are then repeatedly performed in succession to manufacture the resin moldings one by one.

[0096] As described above, the gate break device 40 of this embodiment includes a first cutting unit 50 that cuts the unnecessary resin portion A1 to be cut, and a second cutting unit 60 that cuts the remaining unnecessary resin portion A2 after the unnecessary resin portion A1 has been cut, and is configured to move the cutting mechanism 43 of the first cutting unit 50 in an upward and downward direction intersecting the longitudinal and width directions (short direction) of the lead frame W to cut the unnecessary resin portion A1 in a first stage, and to move the cutting mechanism 63 of the second cutting unit 60 along the longitudinal direction of the lead frame W to cut the remaining portion A2 in a second stage, thereby removing the unnecessary resin.

[0097] With the gate breaking device 40 configured in this manner, not only hardened unnecessary resin but also elastic unnecessary resin can be cut in stages to disperse the stress associated with cutting and reliably remove the unnecessary resin, thereby preventing the occurrence of defective products due to excess remaining resin, etc. Although the second cutting unit 60 can also remove the unnecessary resin without leaving the above-mentioned third portion A2c, it is configured to intentionally leave the third portion A2c in order to provide a margin so as not to damage (scratch) the side edge of the molded section 108 when the gate is broken.

[0098] In addition, in the gate break device 40 of this embodiment, a set of resin moldings P is formed in a state in which a pair of lead frames W (electronic component boards) are arranged side by side along the short side direction, and unwanted resin connects the short sides of each lead frame W (electronic component board).The cutting mechanism 43 of the first cutting unit 50 has a pair of cutting blades 52 that cut the unwanted resin to be cut portion A1 along the short side direction, and a pair of forming blades 53 that each form a slit S (incision) parallel to the longitudinal direction in the unwanted resin at a position closer to the molded portion 108 than each cutting blade 52, so that it is possible to simultaneously cut the unwanted resin to be cut portion A1, which is the main part of the unwanted resin, and form the slit S on the set of lead frames W.

[0099] In addition, in the gate break device 40 of this embodiment, the cutting mechanism 63 of the second cutting unit 60 has a first cutting tool 68 that cuts a first portion A2a from the cut end 106a of the portion A1 to a predetermined position in the short direction for each lead frame W (electronic component board) out of the remaining portion A2 of the unnecessary resin in each lead frame W (electronic component board) from which the portion A1 of the unnecessary resin to be cut has been cut by the first cutting unit 50, and a second cutting tool 69 that cuts a second portion A2b along the slit S (notch) from the predetermined position to a position near the molded portion 108 in the short direction. Therefore, the remaining portion A2 of the unnecessary resin can be cut further in a stepwise and continuous manner, the stress related to the cutting can be dispersed, and the remaining portion A2 of the unnecessary resin can be reliably cut and removed even if it maintains its elasticity.

[0100] In the cutting mechanism 43 of the first cutting unit 50, the set of forming blades 53 is not an essential component, and the cutting mechanism 43 may be formed without the set of forming blades 53. Also, it is possible for the first cutting unit 50 to cut the unnecessary resin at the portion A1 to be cut, not for a single lead frame W in which unnecessary resin is simply formed in the short direction, but for a lead frame W in which multiple lead frames W are not connected together. In this case, it is sufficient that the cutting mechanism 43 is provided with at least one cutting blade 52.

[0101] Although the preferred embodiments of the present invention have been described above, the technical scope of the present invention is not limited to the scope described in the above-mentioned embodiments. Various modifications and improvements can be made to the above-mentioned embodiments.

[0102] [Variations] For example, in the cutting mechanism 63 of the second cutting unit 60, the first and second cutting tools 68, 69 are used to cut the remaining portion A2 of the unnecessary resin, but the present invention is not limited to this. At least one cutting tool attached to the cutting tool block portion 70 is sufficient to cut the remaining portion A2.

[0103] FIG. 15 is an explanatory diagram that illustrates a schematic view of the third cutting tool of the second cutting unit. 15, the third cutting tool 71 is similar to the first and second cutting tools 68, 69 described above in that it has a cutting edge 71a and an inclined surface 71b, but its shape is different. That is, in the third cutting tool 71, the cutting edge 71a is formed so that the cutting edge point 72 on the side surface 74 on the cutting tool block portion 70 side is located further forward (tip side) in the movement direction indicated by the solid arrow in the figure than the cutting edge point 73 on the side surface 75 on the molded portion 108 side.

[0104] In addition, in the third cutting tool 71, the inclined surface 71b is formed so as to incline upward from the cutting edge 71a toward the rear side (base end side) in the movement direction indicated by the solid arrow in the figure with the side surface 75 side being lower than the side surface 74 side. The width H3 of the third cutting tool 71 is set to be approximately the same as the width H2 of the second cutting tool 69.

[0105] In the third blade 71 configured in this manner, the blade tip 71a reaches the remaining portion A2 of the unnecessary resin first from the blade tip point 72 side, and then the blade tip point 73 side reaches the remaining portion A2 while turning up the remaining portion A2 along the inclined surface 71b, so that the remaining portion A2 can be reliably cut (in a clean cut state) along the slit S. This can achieve the same effect as the cutting mechanism 63 using the first and second blades 68, 69, and can be configured with a single blade, so that the number of parts of the cutting mechanism 63 can be reduced. The above-mentioned cutting blade 52, forming blade 53, and first to third blades 68, 69, 71 can be made of metal or resin as appropriate.

[0106] In addition, in the above-described embodiment, an example was given of a gate break device 40 having a first cutting unit 50 and a second cutting unit 60 removing unnecessary resin from a lead frame W, but this is not limited to this, and the device may also be configured to remove unnecessary resin from a wiring board on which electronic components are mounted, etc.

[0107] In the above-described embodiment, an example has been described in which only one press unit 2 is arranged between the loader unit 4 and the unloader unit 6, but this is not limited to this, and two or more press units 2 may be arranged.

[0108] In the above-described embodiment, an example was given in which four electronic components are arranged on one lead frame W, and resin sealing molding is performed on the four lead frames W collectively in one molding cycle, but this is not limited to this, and various configurations can be adopted.

[0109] In the above embodiment, the lead frames W are arranged in two rows (a pair of lead frames W are arranged side by side in the short direction), but the present invention is not limited to this, and the lead frames W may be arranged in one row as described above, or in three or more rows. In this case, the cutting mechanism 43 of the first cutting unit 50 of the gate break device 40 preferably has cutting blades 52 arranged to be capable of cutting the cut portion A1 corresponding to each row of the lead frames W.

[0110] In the above embodiment, the lead frames W are arranged in two rows, and the cutting mechanism 43 of the first cutting unit 50 descends from above to cut the cut portion A1 of the unnecessary resin formed in a state of connecting the lead frames W, but the present invention is not limited to this, and the cutting mechanism 43 may be configured to ascend from below to cut the cut portion A1 of the unnecessary resin. Note that in the cutting mechanism 43, the pressing of the lead frames W by the first and second pressing parts 48a, 48b, the cutting of the cut portion A1 by the cutting blade 52, and the formation of the slit S in the unnecessary resin by the forming blade 53 may be configured to be performed at different times.

[0111] In the above-described embodiment, the gate break device 40 is described as having a first cutting unit 50 shown in FIG. 4 and a second cutting unit 60 shown in FIG. 9, and is configured to be able to perform a first-stage cutting on a set of resin moldings P and a second-stage cutting on a single resin molding P. However, this is not limited to this, and the device may be configured to have a plurality of first cutting units 50 and second cutting units 60, and be able to perform first-stage and second-stage cutting on multiple sets of resin moldings P at once.

[0112] In the above embodiment, it has been described that a cull is formed on the mold surface of the upper mold 17a, a cavity forming recess is formed on the mold surfaces of the upper mold 17a and the lower mold 17b, and a runner and a gate are formed on the mold surface of the lower mold 17b, but this is not limited to this and can be changed as desired. Also, in Fig. 3, a resin molded body P in which adjacent cull portions 106 are not connected to each other is illustrated, but this is not limited to this and various configurations can be adopted, such as a configuration in which adjacent cull portions 106 are connected to each other.

[0113] It is apparent from the claims that the above-mentioned modifications are included within the scope of the present invention. [Explanation of symbols]

[0114] 1 Resin sealing equipment (resin molding equipment) 40 Gate Break Device 42,62 Receiving mechanism 43,63 Cutting mechanism 50 First cutting unit 52 Cutting blade 53 Forming blade 60 Second cutting unit 68 1st cutting tool 69 2nd cutting tool 71 Third cutting tool 100 Resin sealing system

Claims

1. A gate break device comprising: an elongated electronic component substrate having a plurality of electronic components arranged along a longitudinal direction; a molded portion for molding each electronic component of the electronic component substrate; and unnecessary resin integrally molded into each molded portion, the unnecessary resin being removed from a resin molded body formed in a lateral direction intersecting the longitudinal direction, the gate break device comprising: a first cutting unit for cutting a portion of the unnecessary resin to be cut; a second cutting unit that cuts a remaining portion of the unnecessary resin after the cut portion has been cut, The first cutting unit is configured to be movable in a direction intersecting the longitudinal direction and the lateral direction, The second cutting unit is configured to be movable along the longitudinal direction. A gate break device comprising:

2. The first cutting unit has a cutting blade that cuts the portion to be cut, and a forming blade that forms a cut parallel to the longitudinal direction in the unnecessary resin at a position closer to the molded part than the cutting blade.

2. The gate break device according to claim 1.

3. The second cutting unit has a first cutting tool that cuts a first portion of the remaining unnecessary resin from a cut end of the portion to be cut to a predetermined position in the short direction, and a second cutting tool that cuts a second portion from the predetermined position to a position closer to the molded portion than the predetermined position.

3. The gate break device according to claim 1 or 2.

4. The first cutting tool is disposed so that a cutting edge thereof reaches the remaining portion of the unnecessary resin before the second cutting tool, and the first cutting tool and the second cutting tool move simultaneously along the longitudinal direction.

4. The gate break device according to claim 3.

5. The electronic component substrates are arranged in a pair in the short-side direction, the unnecessary resin is formed in a state of connecting the electronic component substrates in the short side direction, The first cutting unit has a pair of cutting blades that cut the portion to be cut of the unnecessary resin across the short side direction, and a pair of forming blades that respectively form cuts parallel to the longitudinal direction in the unnecessary resin at positions closer to the molded part than each cutting blade.

3. The gate break device according to claim 1 or 2.

6. The pair of cutting blades have elasticity to bend in the short side direction.

6. The gate break device according to claim 5.

7. The second cutting unit has a first cutting tool that cuts a first portion from a cut end of the cut portion to a predetermined position in the short direction for each electronic component board out of the remaining portion of the unnecessary resin in each electronic component board after the cut portion of the unnecessary resin has been cut by the first cutting unit, and a second cutting tool that cuts a second portion from the predetermined position to a position closer to the molded portion than the predetermined position along the slit.

6. The gate break device according to claim 5.

8. The unnecessary resin is made of a thermosetting resin having elasticity.

8. The gate break device according to claim 7.

9. a resin molding device that molds a resin molded body including: an elongated electronic component board having a plurality of electronic components arranged along a longitudinal direction; a molding section that molds each electronic component of the electronic component board; and waste resin that is integrally molded into each molding section, the waste resin being formed toward a lateral direction intersecting the longitudinal direction; a gate break device for removing the unnecessary resin from the resin molded body; Equipped with The gate break device is a first cutting unit for cutting a portion of the unnecessary resin to be cut; a second cutting unit that cuts a remaining portion of the unnecessary resin after the cut portion has been cut, The first cutting unit is configured to be movable in a direction intersecting the longitudinal direction and the lateral direction, The second cutting unit is configured to be movable along the longitudinal direction. A resin molding system comprising:

10. An unnecessary resin removal method comprising: a long electronic component substrate having a plurality of electronic components arranged along a longitudinal direction; a molded portion for molding each electronic component of the electronic component substrate; and unnecessary resin integrally molded into each molded portion, the unnecessary resin being removed from a resin molded body formed in a lateral direction intersecting with the longitudinal direction by a gate break device, the method comprising: a first cutting step of cutting a portion of the unnecessary resin by a first cutting unit of the gate break device; a second cutting step of cutting a remaining portion of the unnecessary resin from the cut portion by a second cutting unit of the gate break device, the first cutting unit moves in a direction intersecting the longitudinal direction and the lateral direction, The second cutting unit moves along the longitudinal direction. A method for removing unnecessary resin.

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