Substrate processing method

Abstract

To facilitate the lifting and lowering of a chuck, and the gripping and release of a substrate by the chuck.SOLUTION: A substrate W includes a first surface W1, and a second surface W2 closer to a chuck base 11 than the first surface W1. In a first step, a processing liquid is supplied to at least one of the first surface W1 and the second surface W2 held by the chuck 12. In a second step, gas is supplied to a second surface W2 together with the first step or after the first step is completed. In the second step, the substrate W approaches the chuck base 11 as the chuck 12 moves while being rotated by the chuck base 11 while being held by the chuck 12.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a technique for holding a substrate and a technique for processing a substrate. Substrates to be held include, for example, semiconductor wafers, substrates for liquid crystal displays, substrates for plasma displays, substrates for FEDs (Field Emission Displays), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells. [Background technology]

[0002] In the manufacturing process of semiconductor devices and liquid crystal display devices, a single-wafer type substrate processing apparatus (hereinafter referred to as "single-wafer processing apparatus") that processes substrates one by one, and a batch type substrate processing apparatus that processes multiple substrates at once are used. In a typical single-wafer processing apparatus, a single substrate is held horizontally in a processing chamber, and the substrate is rotated and a processing liquid (chemical liquid or rinsing liquid) is supplied to the substrate according to the type of processing.

[0003] A single wafer processing apparatus may have, for example, a plurality of chucks arranged along the direction of rotation on a spin base that rotates around a rotation axis. The chucks are sometimes called "chuck pins" because of their pin-like shape. The spin base equipped with the chucks is also sometimes called a "chuck base."

[0004] In such single-wafer processing apparatus, the rotation and supply of processing liquid are performed with the chuck clamping the peripheral edge of the substrate from above and below (hereinafter also referred to as "gripping"). The substrate is also removed from the chuck base without being gripped, with its lower surface supported above the chuck base (hereinafter also referred to as "placed"). Alternatively, the substrate is placed on the chuck base prior to being gripped. In the following, "holding" is used as a concept that includes both "placing" and "gripping".

[0005] For example, the following Patent Documents 1 to 6 exemplify techniques in which a substrate is held by using a plurality of chuck pins provided on a chuck base.

[0006] Patent Document 1 introduces a technique for gripping and releasing a substrate by rotating a chuck pin using magnetic force via a cam plate.

[0007] Patent Document 2 introduces a technique in which a component called a spin chuck rotates and ascends and descends while holding a wafer.

[0008] Patent Document 3 introduces a technique for raising and lowering a chuck pin by using magnetic force.

[0009] Patent Document 4 introduces a technique for gripping and releasing a substrate by rotating a chuck pin using magnetic force.

[0010] Patent Document 5 introduces a technique for raising and lowering a chuck base.

[0011] Patent Document 6 introduces a technique in which a cylindrical recess, which enables a mechanism for supporting a chuck pin to be raised and lowered, is provided on the periphery of a chuck base and rotates together with the chuck base. [Prior art documents] [Patent documents]

[0012] [Patent Document 1] JP 2016-25186 A [Patent Document 2] JP 2005-183709 A [Patent Document 3] JP 2018-50013 A [Patent Document 4] JP 2010-130018 A [Patent Document 5] Patent No. 5172884 [Patent Document 6] JP 2019-46985 A Summary of the Invention [Problem to be solved by the invention]

[0013] When a substrate is placed on the chuck base or removed from the chuck base (hereinafter, this process is referred to as "transferring" the substrate), it is not desirable to raise and lower the chuck base because the mechanism for achieving this raise and lowering would become large. From this perspective, it is desirable to raise and lower the chuck pins, as in the technology introduced in Patent Document 3.

[0014] However, in Patent Document 3, the components that drive the chuck pins to grip and release the substrate are fixed to the splash guard, so the splash guard needs to be raised and lowered in accordance with the raising and lowering of the chuck pins.

[0015] An object of the present invention is to provide a technique for easily raising and lowering a chuck and for easily gripping and releasing a substrate by the chuck, and a technique for changing the distance between a chuck base and a substrate while rotating the substrate in a processing step for the substrate. [Means for solving the problem]

[0016] A first aspect for solving the above problem is a substrate processing method carried out in a substrate holding device including a plurality of chucks used to hold a substrate and a chuck base on which the plurality of chucks are mounted. The substrate has a first surface and a second surface that is closer to the chuck base than the first surface. The substrate processing method includes a first step of supplying a processing liquid to at least one of the first surface and the second surface held by the plurality of chucks, and a second step of supplying a gas to the second surface during the first step or after the first step is completed. In the second step, the substrate is rotated by the chuck base while being held by the plurality of chucks, and moves closer to the chuck base by the movement of the plurality of chucks. and the rotation of the substrate is maintained between the first step and the second step. . A second aspect is a substrate processing method performed in a substrate holding device including a plurality of chucks used to hold a substrate and a chuck base on which the plurality of chucks are mounted, wherein the substrate has a first surface and a second surface closer to the chuck base than the first surface, and the method includes a first step of supplying a processing liquid to at least one of the first surface and the second surface held by the plurality of chucks, and a second step of supplying a gas to the second surface during the first step or after the first step is completed, wherein in the second step, the substrate is rotated by the chuck base while held by the plurality of chucks, and moves closer to the chuck base by the movement of the plurality of chucks, and holding the substrate means holding the substrate by pinching it from above and below by the periphery.

[0017] No. 3 The first aspect is or second In the aspect of the present invention, each of the plurality of chucks has a gripping portion used to grip the substrate, and the chuck base is used to rotate the substrate gripped by the gripping portion. Effect of the Invention

[0018] According to this substrate processing method, the distance between the chuck base and the substrate is changed while the substrate is being rotated. [Brief description of the drawings]

[0019] [Figure 1] 1 is a plan view illustrating a schematic configuration of a substrate processing system; [Diagram 2] 1 is an overall view illustrating a schematic configuration of one substrate processing apparatus; [Diagram 3] FIG. 2 is a cross-sectional view showing a part of a spin chuck. [Figure 4] FIG. [Diagram 5] FIG. 2 is a cross-sectional view showing a part of a spin chuck. [Figure 6] FIG. 2 is a cross-sectional view partially illustrating a chuck and a substrate. [Figure 7] FIG. [Figure 8] 11 is a top view showing the positional relationship between the gripping portion and the peripheral edge of the substrate. FIG. [Figure 9] FIG. 2 is a top view partially showing the ring, the first drive magnet, and the second drive magnet. [Figure 10] 4 is a side view showing the positional relationship between the cam plate, the shaft, the lift plate, and the second driven magnet. FIG. [Figure 11] 4 is a side view showing the positional relationship between the cam plate, the shaft, the lift plate, and the second driven magnet. FIG. [Figure 12] FIG. 2 is a cross-sectional view showing a part of a spin chuck. [Figure 13] 1 is a flowchart illustrating a substrate processing process according to an embodiment of the present invention. [Figure 14]14 is a cross-sectional view illustrating a part of the operation of the flowchart shown in FIG. 13. [Figure 15] 14 is a cross-sectional view illustrating a part of the operation of the flowchart shown in FIG. 13. [Figure 16] FIG. 2 is a cross-sectional view showing a part of a spin chuck. [Figure 17] FIG. 2 is a top view partially showing the ring, the first drive magnet, and the second drive magnet. [Figure 18] FIG. [Figure 19] FIG. [Figure 20] 4 is a side view showing the positional relationship between the cam plate, the shaft, the lift plate, and the second driven magnet. FIG. [Figure 21] 11 is a flowchart illustrating a specific operation of a step of changing over the substrate. [Figure 22] FIG. 2 is a cross-sectional view showing a part of a spin chuck. [Figure 23] FIG. [Figure 24] 11 is a top view showing the positional relationship between the gripping portion and the peripheral edge of the substrate. FIG. [Diagram 25] 4 is a side view showing the positional relationship between the cam plate, the shaft, the lift plate, and the second driven magnet. FIG. [Figure 26] FIG. 2 is a cross-sectional view showing a part of a spin chuck. [Figure 27] FIG. 2 is a cross-sectional view showing a part of a spin chuck. [Figure 28] 11 is a cross-sectional view illustrating a configuration for detecting whether or not a substrate is gripped. [Figure 29] 11 is a flowchart illustrating an operation of detecting a drop of a substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. Note that the components described in the embodiment are merely examples, and are not intended to limit the scope of the present invention. In the drawings, the dimensions and numbers of each part may be exaggerated or simplified as necessary for ease of understanding.

[0021] In this embodiment, "holding the substrate" refers to maintaining the position of the substrate, particularly in the vertical direction, "placing the substrate" refers to supporting the lower surface of the substrate and holding it above the chuck base, and "gripping the substrate" refers to holding the substrate by pinching the peripheral edge from above and below. In this embodiment, both placing and gripping the substrate are performed by the chuck.

[0022] In particular, a state in which the peripheral edge of the substrate is gripped by the chuck is referred to as a "gripped state," and a state in which the substrate is simply placed on the chuck pins without the peripheral edge of the substrate being gripped by the chuck is referred to as a "placed state." Furthermore, any state in which the substrate is held, whether in the gripped state or the placed state, is referred to as a "held state."

[0023] [Substrate processing system configuration] 1 is a plan view illustrating a schematic configuration of a substrate processing system 700. In this embodiment, a direction Z is introduced to facilitate understanding of the invention. Typically, the direction Z is a vertical upward direction.

[0024] The substrate processing system 700 includes a substrate processing apparatus 710. In Fig. 1, the substrate processing apparatus 710 is provided in four sets 71, and each set 71 includes three substrate processing apparatus 710.

[0025] The substrate processing apparatus 710 is a single-wafer processing apparatus that performs processing using a processing liquid on a substrate W. The substrate W is, for example, a semiconductor wafer and has a disk shape. The processing liquid conceptually includes a chemical liquid and a rinsing liquid.

[0026] Examples of chemical solutions include liquids containing at least one of sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, aqueous ammonia, aqueous hydrogen peroxide, organic acids (e.g., citric acid, oxalic acid), organic alkalis (e.g., TMAH: tetramethylammonium hydroxide), surfactants, and corrosion inhibitors.

[0027] Examples of the rinsing liquid include pure water (deionized water), carbonated water, electrolytic ionized water, hydrogen water, ozone water, IPA (isopropyl alcohol), and hydrochloric acid water.

[0028] The substrate processing system 700 further comprises a fluid cabinet 702 , a fluid box 703 , a load port 706 , a center robot 708 , and an indexer robot 709 .

[0029] Each load port 706 is capable of housing a plurality of substrates W. For example, the substrates W are housed in a stacked state in the load port 706.

[0030] Between the center robot 708 and the load port 706 , the substrate W is transported by an indexer robot 709 .

[0031] Between the indexer robot 709 and the substrate processing apparatus 710 , the substrate W is transported by the center robot 708 .

[0032] The fluid cabinet 702 contains the above-mentioned processing liquid and gas used in processing the substrate W. The fluid box 703 supplies the processing liquid and gas from the fluid cabinet 702 to the substrate processing apparatus 710. In the example shown in FIG. 1, the fluid box 703 is provided for each set 71.

[0033] The operations of the substrate processing apparatus 710, the center robot 708, and the indexer robot 709 are controlled by a control device 73. In the example shown in FIG.

[0034] The control device 73 includes, for example, a control unit 731 and a storage unit 732. The control unit 731 can be realized by a microcomputer. The storage unit 732 stores a computer program. The control unit 731 executes the computer program stored in the storage unit 732.

[0035] The storage unit 732 further stores recipe data. The recipe data includes information indicating a plurality of recipes. Each recipe defines the contents and procedures for transporting the substrate W and processing the substrate W.

[0036] The storage unit 732 includes a main storage device and an auxiliary storage device. The main storage device and the auxiliary storage device are realized, for example, by semiconductor memory. The auxiliary storage device may be realized by other storage devices, for example, a hard disk drive, or may be realized by removable media.

[0037] [Configuration of substrate processing equipment] 2 is an overall view illustrating an outline of the configuration of one substrate processing apparatus 710. A control device 73 controls the operation of devices provided in the substrate processing apparatus 710 and the opening and closing of valves.

[0038] The substrate processing apparatus 710 includes a chamber 74, an FFU (fan filter unit) 79, and an exhaust duct 72.

[0039] The chamber 74 includes a spin chuck 75, a processing liquid supply mechanism 76, a cup 77, and a partition wall 78. The partition wall 78 is box-shaped and has an internal space, and the spin chuck 75, the processing liquid supply mechanism 76, and the cup 77 are housed in the internal space.

[0040] The FFU 79 is an air blowing unit and is located above the partition wall 78. The FFU 79 sends clean air (air filtered by a filter) into the chamber 74 from above the chamber 74.

[0041] The spin chuck 75 functions as a substrate holding device that holds one substrate W in a horizontal position within the chamber 74. The spin chuck 75 rotates the substrate W about a substrate rotation axis Q, which is a vertical line (here, parallel to the direction Z). The substrate rotation axis Q passes through the center of the substrate W, for example.

[0042] The processing liquid supply mechanism 76 supplies a processing liquid to an upper surface (hereinafter referred to as a "first surface") W1 of the substrate W held on the spin chuck 75. The cup 77 is cylindrical and surrounds the spin chuck 75 with the substrate rotation axis Q as its center.

[0043] The exhaust duct 72 is connected to the bottom of the cup 77 and exhausts the gas inside the chamber 74. The exhausted gas is guided toward an exhaust facility (not shown) provided in a factory in which the substrate processing apparatus 710 is installed.

[0044] A downflow (descending flow) flowing downward within the chamber 74 is formed by the FFU 79 and the exhaust duct 72. For example, the processing of the substrate W is performed in a state in which the downflow is formed within the chamber 74.

[0045] The spin chuck 75 includes a chuck base 711 , a plurality of chuck pins 712 , a chuck opening / closing mechanism 713 , and a spin motor 714 .

[0046] For example, the chuck base 711 is disk-shaped and is held rotatably in a horizontal position. A plurality of chuck pins 712 are provided on a surface of the chuck base 711 exposed upward (hereinafter referred to as the "main surface"). For example, each of the chuck pins 712 is provided to protrude upward at an outer periphery of the main surface.

[0047] The chuck opening / closing mechanism 713 opens and closes the multiple chuck pins 712. The "close" of the "opening / closing" of the chuck pins 712 refers to the chuck pins 712 taking a position where a gripping state can be obtained (hereinafter also referred to as a "first position CL"). The "open" of the "opening / closing" of the chuck pins 712 refers to the chuck pins 712 taking a position where a placement state can be obtained (hereinafter also referred to as a "second position OP"). The transition of the chuck pins 712 from the second position OP to the first position CL closes the chuck pins 712 that were in the second position OP. The transition of the chuck pins 712 from the first position CL to the second position OP opens the chuck pins 712 that were in the first position CL.

[0048] Some of the chuck pins 712 may take the first position CL and some may take the second position OP (described later in <Re-gripping of the Substrate W>). It is also possible that the chuck pins 712 take the first position CL without gripping the substrate W (described later in <Detection of Dropped Substrate W>).

[0049] The spin motor 714 rotates the chuck base 711, and therefore the chuck pins 712, about the substrate rotation axis Q in, for example, a clockwise direction RDr as viewed along the direction Z.

[0050] The outer diameter of the chuck base 711 is larger than the diameter of the substrate W. The center line of the chuck base 711 is located on the substrate rotation axis Q. The multiple chuck pins 712 are positioned at intervals in the circumferential direction (the circumferential direction centered on the substrate rotation axis Q). Any of the chuck pins 712 can be used to grip or place the substrate W.

[0051] The chuck pins 712 have the function of holding the substrate W at a distance above the chuck base 711 by gripping or placing the substrate W. With a lower surface (hereinafter referred to as the "second surface") W2 of the substrate W and the main surface of the chuck base 711 separated in the vertical direction, the substrate W is held horizontally here with direction Z as the normal direction. The second surface W2 is closer to the chuck base 711 than the first surface W1. The normal direction, direction Z, is a vertically upward direction on the Earth.

[0052] When the substrate W is in the gripped state, the spin motor 714 rotates the chuck base 711 , whereby the substrate W rotates about the substrate rotation axis Q together with the chuck base 711 and the chuck pins 712 .

[0053] The processing liquid supply mechanism 76 includes a chemical liquid nozzle 734, a chemical liquid pipe 735, and a chemical liquid valve 736. The chemical liquid nozzle 734 functions as an upper surface nozzle that discharges the chemical liquid toward the first surface W1. The chemical liquid pipe 735 is connected to the chemical liquid nozzle 734. The chemical liquid valve 736 is provided midway along the chemical liquid pipe 735. The chemical liquid is supplied to the chemical liquid pipe 735 from the fluid box 703 (see FIG. 1) via the chemical liquid valve 736.

[0054] When the chemical valve 736 is opened, the chemical liquid supplied from the chemical pipe 735 to the chemical nozzle 734 is discharged downward from the chemical nozzle 734. By this discharge, the chemical liquid is supplied to the first surface W1. When the chemical valve 736 is closed, the discharge of the chemical liquid from the chemical nozzle 734 is stopped.

[0055] The substrate processing apparatus 710 includes a chemical nozzle moving device 737. The chemical nozzle moving device 737 moves the chemical nozzle 734.

[0056] The chemical nozzle moving device 737 moves the chemical nozzle 734 between a processing position where the chemical discharged from the chemical nozzle 734 lands on the first surface W1 and a retracted position where the chemical nozzle 734 is retracted to the periphery of the spin chuck 75.

[0057] The liquid nozzle moving device 737 moves the landing position of the liquid within the first surface W1 by moving the liquid nozzle 734. The liquid nozzle 734 functions as a scan nozzle that ejects the liquid while the landing position of the liquid on the first surface W1 moves between the center and the periphery.

[0058] The processing liquid supply mechanism 76 includes a rinsing liquid nozzle 738, a rinsing liquid pipe 739, and a rinsing liquid valve 740. The rinsing liquid nozzle 738 functions as an upper surface nozzle that ejects the rinsing liquid toward the first surface W1. The rinsing liquid pipe 739 is connected to the rinsing liquid nozzle 738. The rinsing liquid valve 740 is provided midway along the rinsing liquid pipe 739. The rinsing liquid is supplied to the rinsing liquid pipe 739 from the fluid box 703 (FIG. 1) via the rinsing liquid valve 740.

[0059] When the rinse liquid valve 740 is opened, the rinse liquid supplied from the rinse liquid piping 739 to the rinse liquid nozzle 738 is discharged downward from the rinse liquid nozzle 738. This discharge causes the rinse liquid to be supplied to the first surface W1. When the rinse liquid valve 740 is closed, the discharge of the rinse liquid from the rinse liquid nozzle 738 is stopped.

[0060] The substrate processing apparatus 710 includes a rinsing liquid nozzle moving device 741. The rinsing liquid nozzle moving device 741 moves the rinsing liquid nozzle 738.

[0061] The rinsing liquid nozzle moving device 741 moves the rinsing liquid nozzle 738 between a processing position where the rinsing liquid ejected from the rinsing liquid nozzle 738 lands on the first surface W1 and a retracted position where the rinsing liquid nozzle 738 is retracted to the periphery of the spin chuck 75.

[0062] The rinsing liquid nozzle moving device 741 moves the landing position of the rinsing liquid within the first surface W1 by moving the rinsing liquid nozzle 738. The rinsing liquid nozzle 738 functions as a scan nozzle that ejects the rinsing liquid while the landing position of the rinsing liquid on the first surface W1 moves between the center and the periphery.

[0063] The substrate processing apparatus 710 includes a fluid supply mechanism 742. The fluid supply mechanism 742 has a function of supplying a processing liquid and gas to the second surface W2.

[0064] A chemical liquid pipe 743, a rinse liquid pipe 745, and a gas pipe 781 are connected to the fluid supply mechanism 742, and a chemical liquid, a rinse liquid, and a gas are respectively supplied from these pipes. Examples of the gas include an inert gas or nitrogen gas.

[0065] A chemical valve 744 is provided in the middle of the chemical pipe 743. The chemical pipe 743 is supplied with the chemical from the fluid box 703 (see FIG. 1) via the chemical valve 744.

[0066] When the chemical liquid valve 744 is opened, the chemical liquid supplied from the chemical liquid pipe 743 to the fluid supply mechanism 742 is supplied toward the second surface W2. This supply causes the chemical liquid to be supplied to the second surface W2. When the chemical liquid valve 744 is closed, the supply of the chemical liquid from the fluid supply mechanism 742 is stopped.

[0067] A rinse liquid valve 746 is provided in the rinse liquid pipe 745. The rinse liquid is supplied to the rinse liquid pipe 745 from the fluid box 703 (see FIG. 1) via the rinse liquid valve 746.

[0068] When the rinsing liquid valve 746 is opened, the rinsing liquid supplied from the rinsing liquid piping 745 to the fluid supply mechanism 742 is supplied toward the second surface W2. This supply causes the rinsing liquid to be supplied to the second surface W2. When the rinsing liquid valve 746 is closed, the supply of the rinsing liquid from the fluid supply mechanism 742 is stopped.

[0069] A gas valve 782 is provided in the middle of the gas pipe 781. Gas is supplied to the gas pipe 781 from the fluid box 703 (see FIG. 1) via the gas valve 782.

[0070] When the gas valve 782 is opened, the gas supplied from the gas pipe 781 to the fluid supply mechanism 742 is supplied toward the second surface W2. This causes the gas to be supplied to the second surface W2. When the gas valve 782 is closed, the supply of gas from the fluid supply mechanism 742 is stopped.

[0071] The cup 77 is located outward (in a direction away from the substrate rotation axis Q) from the substrate W in a held state. The cup 77 includes an outer wall 747, a plurality of processing liquid cups, a plurality of guards, and a guard lifting device 755.

[0072] The outer wall 747 is cylindrical and surrounds the spin chuck 75. The multiple processing liquid cups include a first processing liquid cup 748, a second processing liquid cup 749, and a third processing liquid cup 750. The first processing liquid cup 748, the second processing liquid cup 749, and the third processing liquid cup 750 all surround the spin chuck 75 between the spin chuck 75 and the outer wall 747.

[0073] The first processing liquid cup 748 is positioned closer to the spin chuck 75 than the second processing liquid cup 749. The second processing liquid cup 749 is positioned outward than the first processing liquid cup 748. The third processing liquid cup 750 is positioned outward than the second processing liquid cup 749.

[0074] The multiple guards receive processing liquid splashed around the substrate W. The multiple guards surround the spin chuck 75 between the spin chuck 75 and the outer wall 747. The multiple guards include a first guard 751, a second guard 752, a third guard 753, and a fourth guard 754.

[0075] The first guard 751, the second guard 752, the third guard 753, and the fourth guard 754 are driven under the control of a guard lifting device 755, and are raised and lowered independently and arbitrarily. By such raising and lowering, the used processing liquid is guided to a first processing liquid cup 748, a second processing liquid cup 749, and a third processing liquid cup 750, for example, according to its type. The guard lifting device 755 raises and lowers the first guard 751, the second guard 752, the third guard 753, and the fourth guard 754 independently of one another. The third processing liquid cup 750 is raised and lowered together with the second guard 752. The third processing liquid cup 750 is, for example, integral with the second guard 752.

[0076] Each of the first processing liquid cup 748, the second processing liquid cup 749, and the third processing liquid cup 750 forms an annular groove that opens upward. The processing liquid guided to the first processing liquid cup 748, the second processing liquid cup 749, and the third processing liquid cup 750 is sent to a recovery device or waste liquid device (not shown) through these grooves.

[0077] Each of the first guard 751, the second guard 752, the third guard 753, and the fourth guard 754 includes an inclined portion 756 and a guide portion 757. The inclined portion 756 is cylindrical and extends from top to bottom as it extends outward. The guide portion 757 is cylindrical and extends downward from the lower end of the inclined portion 756. The four inclined portions 756 are positioned one above the other. The four guide portions 757 are positioned coaxially.

[0078] The upper ends of the first guard 751, the second guard 752, the third guard 753 and the fourth guard 754 are configured by the upper ends of the respective inclined portions 756. These upper ends have a diameter larger than that of the substrate W and the chuck base 711.

[0079] The guide portion 757 of the first guard 751 can enter and exit the first treatment liquid cup 748, the guide portion 757 of the second guard 752 can enter and exit the second treatment liquid cup 749, and the guide portion 757 of the third guard 753 can enter and exit the third treatment liquid cup 750, respectively.

[0080] Guard lifting device 755 lifts and lowers at least one of first guard 751, second guard 752, third guard 753, and fourth guard 754, thereby enabling cup 77 to be unfolded and folded.

[0081] The guard lifting device 755 has a function of raising and lowering the first guard 751 between an upper position where the upper end of the first guard 751 is located above the substrate W, and a lower position where the upper end of the first guard 751 is located below the substrate W, and of holding the first guard 751 at any position between the upper and lower positions. The guard lifting device 755 has a function of similarly raising and lowering and holding the second guard 752, the third guard 753, and the fourth guard 754.

[0082] The supply of the processing liquid to the substrate W and the drying of the substrate W are performed with the multiple guards facing the peripheral surface of the substrate W. For example, when the third guard 753 faces the peripheral surface of the substrate W, the first guard 751 and the second guard 752 are disposed in the lower position, and the third guard 753 and the fourth guard 754 are disposed in the upper position. When the outermost fourth guard 754 faces the peripheral surface of the substrate W, the fourth guard 754 is disposed in the upper position, and the first guard 751, the second guard 752, and the third guard 753 are disposed in the lower positions.

[0083] <Spin Chuck 75> Next, a detailed description will be given of the configuration employed in the spin chuck 75. Fig. 3 is a cross-sectional view showing a cross section parallel to direction Z of a part of the spin chuck 75, including the substrate rotation axis Q.

[0084] The chuck base 11 is adopted as the chuck base 711. The fixed base 15 is located below the chuck base 11, but to avoid complication in the drawing, only the position occupied by the fixed base 15 is shown by a dashed line. Similarly, to avoid complication in the drawing, the spin motor 714 that rotates the chuck base 11 is also omitted from the drawing.

[0085] In the following example, the chuck 12 is columnar and is used as the chuck pin 712. The chuck 12 does not necessarily have to be pin-shaped.

[0086] The chuck 12 penetrates the chuck base 11 on the outer periphery side and on the main surface 111 side of the chuck base 11. The main surface 111 is the surface of the chuck base 11 on the direction Z side, and the normal direction of the main surface 111 is parallel to the Z direction.

[0087] A bearing 112 is provided at a portion where the chuck 12 penetrates the chuck base 11. The bearing 112 enables the chuck 12 to move along direction Z (movement along direction Z is also expressed as "rising and lowering") and enables the chuck 12 to rotate about a chuck rotation axis J parallel to direction Z. The bearing 112 suppresses movement of the chuck 12 non-parallel to direction Z.

[0088] Here, the components equivalent to the chuck opening / closing mechanism 713 include, for example, the rotating plate 30, the cam plate 31, the shaft 33, the lifting plate 34, the magnet 35, and the rotating shaft 36. The rotating plate 30 is attached below the chuck 12. The rotating shaft 36 is attached coaxially to the chuck 12 via the rotating plate 30. The rotating shaft 36 is attached to the lifting plate 22 via a bearing 37. The bearing 37 supports the rotating shaft 36 so that the rotating shaft 36 can rotate about the chuck rotation axis J.

[0089] The cam plate 31 is fixed to the upper surface of the lift plate 34. The magnet 35 is fixed to the lower surface of the lift plate 34.

[0090] The weight of the chuck 12, the rotating plate 30, and the rotating shaft 36 causes the rotating shaft 36 to press down on the lift plate 22. The lift plate 22 is pressed up in the direction Z by a magnetic force, which will be described later. Therefore, the chuck 12 rises and falls as the lift plate 22 rises and falls.

[0091] Since the bearing 112 suppresses movement of the chuck 12 non-parallel to the Z direction, the movement of the lift plate 22 non-parallel to the Z direction is also indirectly suppressed.

[0092] The chuck 12 has a mounting surface 122 on its side in the direction Z. The chuck 12 further has a gripping portion 121 on the direction Z side of the mounting surface 122. The mounting surface 122 is used for mounting the substrate W, and the gripping portion 121 is used for gripping the substrate W.

[0093] The chuck 12 can be positioned at a first position H and a second position L where the height of the gripping portion 121 relative to the main surface 111 is different from each other. The chuck 12 moves (rises and descends) between the first position H and the second position L. The second position L is lower than the first position H. Specifically, the distance separating the gripping portion 121 and the main surface 111 at the second position L is shorter than the distance separating the gripping portion 121 and the main surface 111 at the first position H. However, at both the first position H and the second position L, the gripping portion 121 and the placement surface 122 are exposed from the main surface 111 in the direction Z. FIG. 3 illustrates a case where the chuck 12 is at the first position H.

[0094] The transfer step is performed when the chuck 12 is at the first position H. The substrate W can be processed using a processing liquid or a gas at either the first position H or the second position L.

[0095] The bearing 37 and the rotating shaft 36 have the function of rotating the rotating plate 30, and therefore the chuck 12, about the chuck rotation axis J, or assist this function.

[0096] A shaft 33 is provided on the rotating plate 30. For example, the shaft 33 is provided in a direction perpendicular to the direction Z. In FIG. 3, the shaft 33 protrudes outward relative to the substrate rotation axis Q.

[0097] The shaft 33 rotates about the chuck rotation axis J due to the function of the cam plate 31, which will be described later, and the rotating plate 30 rotates accordingly about the chuck rotation axis J. The rotation of the rotating plate 30 about the chuck rotation axis J results in the rotation of the chuck 12 about the chuck rotation axis J (hereinafter referred to as "chuck rotation").

[0098] <Opening and closing zipper 12> The following describes how the chuck 12 is opened and closed by the chuck rotation, that is, how the chuck 12 transitions between the first position CL and the second position OP.

[0099] 3 shows a state in which the substrate W is placed on the placement surface 122. At this time, the chuck 12 is in the second position OP.

[0100] Fig. 4 is a top view of the chuck 12 as viewed in the direction opposite to the direction Z. Fig. 4 illustrates a state in which the chuck 12 is in the second position OP. Fig. 4 also illustrates a portion of the rotating plate 30, the shaft 33, and the cam plate 31 for later explanation.

[0101] The chuck 12 makes a chuck rotation in a direction Dr2 to transition from the second position OP to the first position CL. The chuck 12 makes a chuck rotation in a direction Dr1 to transition from the first position CL to the second position OP.

[0102] Fig. 5 is a cross-sectional view including the substrate rotation axis Q and showing a cross section parallel to the direction Z of a part of the spin chuck 75. Fig. 5 shows a state in which the chuck 12 is at the first position H and the substrate W is gripped by the gripping portion 121. At this time, the chuck 12 has a first attitude CL.

[0103] 6 is a cross-sectional view partially showing the chuck 12 and the substrate W in a state in which the substrate W is gripped by the gripping portion 121. The cross section is parallel to the direction Z.

[0104] The gripping portion 121 has a concave surface 121a. When the peripheral edge of the substrate W fits into the concave surface 121a, the substrate W is sandwiched from above and below by the concave surfaces 121a and gripped by the gripping portion 121.

[0105] For example, it is desirable for the gripping portion 121 to be made of a material containing synthetic resin, from the viewpoint of making the substrate W less likely to crack when the peripheral edge of the substrate W is gripped.

[0106] Fig. 7 is a top view of the chuck 12 as viewed in the direction opposite to the direction Z. Fig. 7 illustrates a state in which the chuck 12 is in the first position CL. Fig. 7 also illustrates a portion of the rotating plate 30, the shaft 33, and the cam plate 31 for later explanation.

[0107] 8 is a top view showing the positional relationship between the gripping part 121 and position W0 of the peripheral edge of the substrate W. The gripping part 121 is shown in a solid line when the chuck 12 has the first position CL, and in a dotted line when the chuck 12 has the second position OP.

[0108] 3 and 5 both show a state in which the chuck 12 is in the first position H. When the chuck 12 is in the first position H and takes the second attitude OP (see FIG. 3), the substrate W is placed on the placement surface 122 (transfer of the substrate W to the spin chuck 75). After the substrate W is placed on the placement surface 122, the chuck rotates so that the concave surface 121a guides the periphery of the substrate W along the direction Z, and the gripping portion 121 grips the substrate W (see FIG. 5).

[0109] Alternatively, from a state in which the chuck 12 is at the first position H and takes the first attitude CL, the concave surface 121a guides the peripheral edge of the substrate W in the direction opposite to the direction Z due to the chuck rotation, and the substrate W is placed on the placement surface 122. Thereafter, the substrate W is removed from the placement surface 122 (removal of the substrate W from the spin chuck 75).

[0110] From the above, the following explanation can be made. The spin chuck 75 is a substrate holding device that holds the substrate W, and includes a chuck base 11 and a plurality of chucks 12. The chuck base 11 mounts the chucks 12. Each of the chucks 12 has a gripping portion 121 used to grip the substrate W. The main surface 111 of the chuck base 11 exposes the gripping portion 121. The substrate W is gripped by the gripping portion 121. The chuck base 11 is used to rotate the substrate W gripped by the gripping portion 121.

[0111] As described above, the first position CL and the second position OP that the chuck 12 takes are distinguished by the different directions in which the concave surface 121a of the gripping portion 121 faces. Therefore, hereinafter, the fact that the chuck 12 takes the first position CL and the second position OP may also be expressed as the gripping portion 121 taking the first position CL or the second position OP.

[0112] <Mechanism that causes chuck rotation> 3 and 5, a first driving magnet 201 and a second driving magnet 501 are housed in the fixed base 15. The first driving magnet 201 is fixed on the direction Z side with respect to the ring 20, and the second driving magnet 501 is fixed on the direction Z side with respect to the ring 50.

[0113] 9 is a top view partially showing the rings 20, 50, the first drive magnet 201, and the second drive magnet 501, as viewed in the direction opposite to the direction Z. Here, the first drive magnet 201 and the second drive magnet 501 are illustrated as having an annular shape. Either the first drive magnet 201 or the second drive magnet 501, or both of them, may be realized using a plurality of magnets arranged in an annular shape.

[0114] The rings 20, 50 can be raised and lowered while being restricted from moving in a direction non-parallel to the direction Z. The raising and lowering of the rings 20, 50 results in the raising and lowering of the first drive magnet 201 and the second drive magnet 501. Mechanisms for performing such raising and lowering are publicly known, for example from Patent Documents 1 and 4, and therefore will not be described or illustrated.

[0115] A magnetic force acts between the magnet 35 and the second drive magnet 501. More specifically, a repulsive force acts between the magnet 35 and the second drive magnet 501. The rise and fall of the second drive magnet 501 is not affected by the rise and fall of the magnet 35, and the magnet 35 rises and falls due to the rise and fall of the second drive magnet 501. Therefore, hereinafter, the magnet 35 is also referred to as the second driven magnet 35.

[0116] 10 and 11 both show the positional relationship between the cam plate 31, the shaft 33, the lift plate 34, and the second driven magnet 35. Both of Fig. 10 and Fig. 11 are side views seen from the outer periphery of the chuck base 11 along the direction toward the substrate rotation axis Q.

[0117] Fig. 10 shows the case where the chuck 12 takes the second position OP, similar to Fig. 3 and Fig. 4. Fig. 11 shows the case where the chuck 12 takes the first position CL, similar to Fig. 5 and Fig. 7.

[0118] A hole 32 is formed in the cam plate 31. A shaft 33 fits into the hole 32. Figures 3, 5, 10 and 11 show an example in which the hole 32 passes through the cam plate 31. The hole 32 does not have to pass through as long as the shaft 33 fits into it.

[0119] 3 and 5, the bearings 38 surrounding the shaft 33 are also shown, but in FIGS. 10 and 11, the bearings 38 are considered to be included in the shaft 33 and are not shown.

[0120] Hole 32 is elongated in a direction inclined with respect to both direction Z and direction RDr. In Figures 3, 4, 5, and 7, cam plate 31 is depicted in cross section along the longitudinal direction of hole 32 in order to make the position of shaft 33 in hole 32 easier to see.

[0121] As the ring 50 moves (rises) along direction Z, the second driving magnet 501 rises. Due to the repulsive force caused by the magnetic force acting between the second driving magnet 501 and the second driving magnet 501, the rise of the second driving magnet 501 causes the second driven magnet 35 to rise. The rise of the second driven magnet 35 raises the lifting plate 34. The rise of the lifting plate 34 raises the cam plate 31.

[0122] The rise of the cam plate 31 raises the hole 32. The weight of the chuck 12, the rotating plate 30, and the rotating shaft 36 suppresses the rise of the shaft 33. On the other hand, since the shaft 33 can rotate about the chuck rotation axis J, the rise of the hole 32 causes the rotation of the shaft 33 and the rotating plate 30, and thus the chuck rotation of the chuck 12. Specifically, the rise of the hole 32 causes the shaft 33 to descend relative to the hole 32, and this relative downward movement causes the hole 32 to guide the shaft 33 in the direction Dr1. The rotation of the shaft 33 in the direction Dr1 causes the chuck 12 to rotate in the direction Dr1.

[0123] As described above, the second driving magnet 501 rises, causing the chuck to rotate in the direction Dr1, and thus the chuck 12 takes the second position OP (see also the gripping portion 121 shown by the dashed line in FIG. 8).

[0124] As the ring 50 moves (descends) in the direction opposite to direction Z, the second driving magnet 501 descends. As the second driving magnet 501 descends, the second driven magnet 35 descends due to the weight of the cam plate 31, the lift plate 34, and the second driven magnet 35 while being subjected to a repulsive force due to a magnetic force acting between the second driving magnet 501 and itself.

[0125] The descent of the second driven magnet 35 lowers the lift plate 34 and the cam plate 31. The descent of the shaft 33 of the chuck 12, the rotating plate 30, and the rotating shaft 36 is suppressed by the repulsive force acting between the first driving magnet 201 and the first driven magnet 202 (described later in <Mechanism for Lifting and Lowering the Chuck 12>). On the other hand, since the shaft 33 can rotate about the chuck rotation axis J, the descent of the hole 32 rotates the shaft 33 and the rotating plate 30, and thus causes the chuck 12 to rotate on its axis. Specifically, the descent of the hole 32 causes the shaft 33 to rise relative to the hole 32, and this relative rise causes the hole 32 to guide the shaft 33 in the direction Dr2. The rotation of the shaft 33 in the direction Dr2 causes the chuck 12 to rotate on its axis in the direction Dr2.

[0126] As described above, the second driving magnet 501 descends, causing the chuck to rotate in the direction Dr2, and thus the chuck 12 takes the first position CL (see also the gripping portion 121 shown by the solid line in FIG. 8).

[0127] Since the shaft 33 fits into the hole 32, the movement range of the shaft 33 is limited between the end of the hole 32 on the direction Z side (hereinafter also referred to as the "upper end") and the end of the hole 32 opposite the direction Z. The shaft 33 is guided by the hole 32 and rotates about the chuck rotation axis J. Therefore, the range in which the shaft 33 can rotate, and therefore the range in which the chuck 12 can rotate by the chuck rotation, is determined by the positional relationship between the cam plate 31 in which the hole 32 is formed and the shaft 33.

[0128] For example, the technology disclosed in Patent Document 1 may be applied to the chuck rotation caused by the elevation of the cam plate 31. Alternatively, the chuck may rotate by using the repulsive and attractive forces of magnets without using a cam plate, as disclosed in Patent Document 4. From the viewpoint of elevation of the hole 32, the elevation plate 34 may be omitted.

[0129] The elevation and lowering of the second drive magnet 501 as described above is achieved by a mechanism (not shown) under the control of the control device 73.

[0130] Note that the chuck rotation does not necessarily occur over the entire range. This is because, when the substrate W is held by the gripper 121, the chuck rotation can be stopped by the substrate W, not by the hole 32 preventing the rotation of the shaft 33.

[0131] That is, even when the chuck 12 has the first position CL, it may rotate in the direction Dr2 more when it is not gripping the substrate W than when it is gripping the substrate W. The fact that the first position CL of the chuck 12 depends on whether or not the substrate W is gripped will be described later in <Detection of Dropped Substrate W>.

[0132] <Mechanism for raising and lowering the chuck 12> The first driving magnet 201 exerts a magnetic force between itself and the magnet 202 housed in the chuck base 11. More specifically, a repulsive force acts between the magnet 202 and the first driving magnet 201. The ascent and descent of the first driving magnet 201 is not affected by the ascent and descent of the magnet 202, and the magnet 202 ascends and descends due to the ascent and descent of the first driving magnet 201. Therefore, hereinafter, the magnet 202 is also referred to as a first driven magnet 202. The first driven magnet 202 is fixed to the lower surface of the lift plate 22.

[0133] As the ring 20 rises, the first driving magnet 201 rises. Due to a repulsive force resulting from a magnetic force acting between the first driving magnet 201 and the first driven magnet 202, the rise of the first driving magnet 201 causes the first driven magnet 202 to rise. The rise of the first driven magnet 202 raises the lift plate 22. The rise of the lift plate 22 raises the chuck 12. Due to this rise of the first driving magnet 201, the chuck 12 rises, and the chuck 12 moves to the first position H.

[0134] As the ring 20 descends, the first driving magnet 201 descends. As the first driving magnet 201 descends, the first driven magnet 202 descends due to the weight of the chuck 12, the rotating plate 30, and the rotating shaft 36 while receiving a repulsive force derived from the magnetic force acting between the first driving magnet 201 and the first driven magnet 202.

[0135] The descent of the first driven magnet 202 lowers the lift plate 22. The descent of the lift plate 22 lowers the chuck 12. Such descent of the first driving magnet 201 lowers the chuck 12, and the chuck 12 moves to the second position L.

[0136] For such lifting and lowering of the chuck 12, for example, the technique disclosed in Patent Document 3 may be applied.

[0137] The weight of the chuck 12, the rotating plate 30, and the rotating shaft 36 suppresses the ascent of the shaft 33. In addition, the repulsive force acting between the first driving magnet 201 and the first driven magnet 202 is large enough to support the weight of the chuck 12, the rotating plate 30, and the rotating shaft 36, so the descent of the shaft 33 is also suppressed. Therefore, the rotation of the shaft 33, and therefore the rotating plate 30, does not affect the ascent and descent of the chuck 12.

[0138] The rotary plate 30 moves up and down along the direction Z, and rotates about a chuck rotation axis J parallel to the direction Z. Thus, the lifting and lowering of the chuck 12 does not affect the rotation of the rotary plate 30, and therefore the chuck rotation.

[0139] Fig. 12 is a cross-sectional view including the substrate rotation axis Q and showing a cross section parallel to the direction Z of a part of the spin chuck 75. Fig. 12 illustrates a case where the chuck 12 is in the second position L and takes the first attitude CL. Compared to Fig. 5, Fig. 12 shows a state where the first drive magnet 201 has been lowered (located away from the main surface 111).

[0140] Normally, when the chucks 12 are in the second position L, they are in a state of gripping the substrate W, so that not all of the chucks 12 take the second position OP. However, as will be explained later in <Re-gripping the Substrate W>, some of the chucks 12 may take the first position CL, while the other chucks 12 may take the second position OP.

[0141] The elevation and lowering of the first driving magnet 201 as described above is achieved by a mechanism (not shown) under the control of the control device 73.

[0142] From the above, the following explanation can be made. The spin chuck 75 includes a first mechanism and a second mechanism. The first mechanism includes a first driving unit, a first driving magnet 201, and a first driven magnet 202. The second mechanism includes a second driving unit, a second driving magnet 501, and a second driven magnet 35.

[0143] The first driving unit drives the chuck 12 to move the chuck 12 between a first position H and a second position L. The height of the gripping portion 121 with respect to the main surface 111 at the first position H is higher than the height at the second position L. The first driving unit is realized by the lift plate 22, the rotating shaft 36, and the rotating plate 30.

[0144] The first driving magnet 201 is movable, and in particular can be raised and lowered. The first driven magnet 202 is fixed to the first driving unit. The first driven magnet 202 is fixed to, for example, the lift plate 22, and faces the first driving magnet 201. The first driven magnet 202 moves in accordance with the movement of the first driving magnet 201. Typically, the first driven magnet 202 rises and falls in accordance with the rise and fall of the first driving magnet 201. The first driven magnet 202 has the function of operating the first driving unit.

[0145] The second driving unit drives the chuck 12 to transition the chuck 12 between the first position CL and the second position OP. In the first position CL, the gripping portion 121 can grip the substrate W. In the second position OP, the gripping is released. The second driving unit is realized by the lift plate 34, the cam plate 31, the shaft 33, the rotating plate 30, and the rotating shaft 36.

[0146] The second driving magnet 501 is movable, and in particular can be raised and lowered. The second driven magnet 35 is fixed to the second driving unit. The second driven magnet 35 is fixed to the lift plate 34, for example, and faces the second driving magnet 501. The second driven magnet 35 moves in accordance with the movement of the second driving magnet 501. Typically, the second driven magnet 35 rises and falls in accordance with the rise and fall of the second driving magnet 501. The second driven magnet 35 has the function of operating the second driving unit.

[0147] The rotating plate 30 and the rotating shaft 36 are components that realize the function of the first driving unit and also the function of the second driving unit, because they move the chuck 12 between the first position H and the second position L by ascending and descending, and transition the chuck 12 between the first position CL and the second position OP by rotating.

[0148] The following explanation is also possible. The gripping portion 121 includes a concave surface 121a. The concave surface 121a grips the peripheral edge of the substrate W when the substrate W is gripped. The chuck rotation moves the opening direction of the concave surface 121a. The chuck rotation is the rotation of the chuck 12 in directions Dr1 and Dr2 centered on the chuck rotation axis J. The chuck rotation axis J is parallel to direction Z, which is the normal direction of the chuck base 11 (more specifically, its main surface 111).

[0149] The movement (here, up and down) of the second driving magnet 501 in direction Z causes the second driven magnet 35 to move in direction Z. The second driving unit converts the movement of the second driven magnet 35 in direction Z into chuck rotation.

[0150] The spin chuck 75 having such a structure easily moves the chuck 12 up and down, and easily grips and releases the substrate W by the chuck 12.

[0151] <Relationship between the magnitude of magnetic force> The rise of the chuck 12 also raises the rotary plate 30, and therefore also raises the cam plate 31 and the second driven magnet 35 via the shaft 33. Therefore, in order for the chuck 12 to be able to take the second position OP even when the chuck 12 is in the first position H, it is desirable that the following relationship be satisfied.

[0152] For convenience, the magnetic forces acting between the second driving magnet 501 and the second driven magnet 35 will be described by introducing a repulsive force f1 when the chuck 12 is in the first position H and takes the second position OP, a repulsive force f2 when the chuck 12 is in the second position L and takes the second position OP, a repulsive force f3 when the chuck 12 is in the first position H and takes the first position CL, and a repulsive force f4 when the chuck 12 is in the second position L and takes the first position CL.

[0153] Regardless of whether the chuck 12 is in the first position H or the second position L, when the chuck 12 takes the second position OP, the cam plate 31 is positioned higher relative to the shaft 33 than when the chuck 12 takes the first position CL. Therefore, the repulsive forces f1 and f2 are greater than the repulsive forces f3 and f4. Specifically, as can be understood by comparing Figures 3 and 5, the second driving magnet 501 rises and approaches the main surface 111, so that the repulsive force f1 is greater than the repulsive force f3.

[0154] When the chuck 12 has the first posture CL, the repulsive force f4 when the chuck 12 is in the second position L is greater than the repulsive force f3 when the chuck 12 is in the first position H. Since the shaft 33 rises and falls in conjunction with the rise and fall of the chuck 12, even if the second drive magnet 501 does not rise and fall, the repulsive force f4 when the chuck 12 is in the second position L (see FIG. 12) is greater than the repulsive force f3 when the chuck 12 is in the first position H (see FIG. 5).

[0155] It is assumed that some chucks 12 take the second posture OP not only when they are at the first position H but also when they are at the second position L (see <"Repositioning" of the substrate W> described later). In this case as well, the repulsive force f2 is greater than the repulsive force f1.

[0156] <Substrate processing flow> 13 is a flowchart illustrating a substrate processing step in this embodiment, specifically, a step of processing the substrate W held by the chuck base 11. This flowchart is executed under the control of the control device 73.

[0157] The first position CL and the second position OP can be distinguished by the orientation in which the concave surface 121a of the grip portion 121 is open, and therefore in FIG. 13, it is written as "the grip portion 121 is in the first position CL" or "the grip portion 121 is in the second position OP."

[0158] In step S101, the chuck 12 takes the second attitude OP at the first position H. After step S101 is performed, in step S102, the substrate W is placed on the placement surface 122. Specifically, the substrate W is placed on the placement surface 122 by the center robot 708. The state immediately after step S102 is performed is shown in FIG.

[0159] After step S102 is performed, in step S103, the chuck 12 takes the first posture CL while being maintained at the first position H. This causes the substrate W to be gripped by the gripper 121. The state immediately after step S103 is performed is shown in FIG.

[0160] After step S103 is executed, the substrate W starts to rotate in step S104. Specifically, with the substrate W being gripped, the chuck base 11 rotates in the direction RDr around the substrate rotation axis Q.

[0161] After step S104 is performed, in step S105, the chuck 12 moves to the second position L while maintaining the first attitude CL. Specifically, the chuck 12 moves to the second position L while the substrate W is being gripped and rotated. The state in which step S105 is being performed corresponds to FIG. 12 (however, it is not explicitly shown that the chuck base 11 is rotating).

[0162] After step S105 is performed, in step S106, the chuck 12 moves to the first position H while maintaining the first posture CL. Specifically, the chuck 12 moves to the first position H while the substrate W is gripped and rotated.

[0163] After step S106 is performed, the rotation of the substrate W is stopped in step S107. Specifically, the rotation of the chuck base 11 is stopped while the substrate W is being gripped. The state immediately after step S107 is performed is shown in FIG.

[0164] After step S107 is performed, in step S108, the chuck 12 takes the second attitude OP while being maintained at the first position H. As a result, the substrate W is placed on the placement surface 122. The state immediately after step S108 is performed is shown in FIG.

[0165] After step S108 is executed, the substrate W is removed from the mounting surface 122. Specifically, the substrate W is removed from the mounting surface 122 by the center robot 708.

[0166] 13, the process of using the treatment liquid is represented by step S120. Step S120 starts at some point after step S103 is performed, and ends thereafter at some point before step S107 is performed.

[0167] 13, the process of supplying gas to the substrate W is represented by step S110. Step S110 starts at any time after step S102 is performed, and ends thereafter at any time before step S109 is performed.

[0168] 13, step S2 is also shown. Step S2 is a process in which the chuck 12 gripping the substrate W is replaced while the substrate W is held above the main surface 111. For convenience, this process is provisionally referred to as "changing the grip" of the substrate W. Step S2 starts at any time after the execution of step S102, and ends thereafter at any time before the execution of step S108.

[0169] <Use of processing liquid and gas supply> Fig. 14 is a cross-sectional view illustrating a part of the flowchart shown in Fig. 13, specifically, the operations of steps S110 and S120. The cross section corresponds to Fig. 5, and Fig. 14 shows an enlarged view of the main surface 111 and its vicinity.

[0170] FIG. 14 illustrates a state in which both steps S110 and S120 are executed after step S104 is executed and before step S105 is executed.

[0171] Fluid supply mechanism 42 functions as fluid supply mechanism 742. In this embodiment, fluid supply mechanism 42 does not rotate. A fluid supply pipe 421 that extends along direction Z and opens on the main surface 111 side opens to fluid supply mechanism 42. Pipe 421 communicates with chemical liquid pipe 743, rinsing liquid pipe 745, and gas pipe 781 (see FIG. 2).

[0172] 14 illustrates a case in which the substrate W is held by the chuck 12 at the first position H, a chemical liquid F1 is supplied to the first surface W1 from the chemical liquid nozzle 734, and a fluid F2 is supplied from the pipe 421. A rinsing liquid may be supplied to the first surface W1 instead of the chemical liquid F1. The fluid F2 may be any of a chemical liquid, a rinsing liquid, and a gas. When the substrate W is held by the chuck 12 at the first position H, the fluid F2 does not need to be supplied.

[0173] Fig. 15 is a cross-sectional view illustrating a part of the flowchart shown in Fig. 13, specifically, the operation of step S120. The cross section corresponds to Fig. 12, and Fig. 15 shows an enlarged view of the main surface 111 and its vicinity.

[0174] FIG. 15 illustrates a state in which, after step S104 is performed, step S120 is performed and completed, and then step S105 is performed without using any processing liquid while the substrate W is still rotating, and step S110 is performed before step S106 is performed.

[0175] A gas, for example, a fluid F2, is supplied to the second surface W2 of the substrate W held by the chuck 12 at the second position L. Supplying the gas to the second surface W2 in a state in which the distance separating the second surface W2 and the pipe 421 when the chuck 12 is at the second position L is shorter than the distance separating the second surface W2 and the pipe 421 when the chuck 12 is at the first position H, is advantageous in at least the following two respects. The first is that turbulence is unlikely to occur in the gas between the main surface 111 and the second surface W2. The second is that it is easy to increase the gas velocity, and it is easy to prevent the processing liquid from flowing around from the first surface W1.

[0176] Supplying the processing liquid to the first surface W1 in a situation where the distance separating the second surface W2 and the main surface 111 when the chuck 12 is at the second position L is shorter than the distance separating the second surface W2 and the main surface 111 when the chuck 12 is at the first position H is disadvantageous in at least the following two respects. The first is that the processing liquid is likely to adhere to both the second surface W2 and the main surface 111. The second is that when impurities or dirt adhere to the main surface 111, the second surface W2 is likely to be contaminated.

[0177] Considering these two advantageous and two disadvantageous points, a desirable embodiment of the process of using a chemical liquid and supplying a gas to the gripped substrate W is exemplified as follows: (a1) With the chuck 12 in the first position H, the supply of a processing liquid to the first surface W1 is started and then stopped. (a2) Thereafter, With the chuck 12 in the second position L, gas is supplied to the second surface W2.

[0178] If the rotation of the substrate W is stopped between steps (a1) and (a2), there is an increased possibility that the processing liquid that covers the first surface W1 in step (a1) will be partially absent from the first surface W1. Such partial absence of processing liquid is likely to lead to the occurrence of so-called watermarks. Therefore, from the viewpoint of suppressing the occurrence of watermarks, it is further advantageous to maintain the rotation of the substrate W between steps (a1) and (a2). In this embodiment, the rotation of the substrate W is maintained after step S104 is performed until step S107 is performed, and therefore steps (a1) and (a2) can be performed with the substrate W rotating.

[0179] In this embodiment, the supply of the fluid F2 to the second surface W2 in the step (a1) is not excluded (see FIG. 14). In this case, it does not matter whether the fluid F2 is a processing liquid or a gas.

[0180] For example, the fluid F2 shown in Fig. 14 corresponding to the step (a1) may be a processing liquid, and the fluid F2 shown in Fig. 15 corresponding to the step (a2) may be a gas. In this case, the processing liquid is supplied to the second surface W2 from the pipe 421 while the substrate W is held high relative to the main surface 111, and the gas is supplied to the second surface W2 while the substrate W is held low relative to the main surface 111. The gas contributes to drying the processing liquid supplied to the second surface W2.

[0181] For example, both the fluid F2 shown in FIG. 14 corresponding to the step (a1) and the fluid F2 shown in FIG. 15 corresponding to the step (a2) may be a gas.

[0182] Alternatively, chamber 74 may include a mechanism for supplying gas to first surface W1 together with spin chuck 75 and processing liquid supply mechanism 76. In this case, the following step can be adopted instead of step (a1): (b1) With chuck 12 in first position H, the supply of gas to first surface W1 and the supply of processing liquid to second surface W2 are started and then stopped. In this case, the gas supplied to second surface W2 in step (a2) serves to dry the processing liquid supplied to second surface W2 in step (b1).

[0183] From the above, the following explanation is possible. The second surface W2 of the substrate W is closer to the chuck base 11, more specifically, the main surface 111, than the first surface W1. When the chuck 12 is at the first position H and the substrate W is held by the gripper 121, a processing liquid is supplied to at least one of the first surface W1 and the second surface W2 in the first step. In the second step, gas is supplied to the second surface W2 during or after the first step.

[0184] In the second step, the substrate W is rotated by the chuck base 11 while being held by the gripping portion 121, while the gripping portion 121 is moved by the chuck 12 from the first position H to the second position L. Alternatively, the substrate W is rotated by the chuck base 11 while being held by the gripping portion 121, while the substrate W approaches the chuck base 11 due to the movement of the chuck 12.

[0185] In this manner, during the processing of the substrate W, the distance between the chuck base 11 and the substrate W is changed while the substrate W is being rotated.

[0186] <Changing the board W> 16 is a cross-sectional view including the substrate rotation axis Q and showing a cross section parallel to direction Z of a part of the spin chuck 75. The chuck 12 that enables the substrate W to be changed over includes a chuck 12A and a chuck 12B. Below, a case will be illustrated in which a plurality of chucks 12A and 12B, typically three chucks 12A and three chucks 12B, are provided as the chuck 12.

[0187] The chuck 12A has the same configuration as the chuck 12 used in the description of FIGS.

[0188] The chuck 12B also has a gripping portion 121 and a mounting surface 122 similar to those of the chuck 12A, and is used to mount and grip the substrate W. Specifically, the chuck 12B has the same first mechanism as the chuck 12A, and a different second mechanism.

[0189] The chuck 12B also has a first driven magnet 202, a lift plate 22, a rotating shaft 36, and a rotating plate 30 similar to those of the chuck 12A.

[0190] The second mechanism of the chuck 12B has a second driving unit, a second driving magnet 601, and a second driven magnet 65. The second driving unit drives the chuck 12B to transition the chuck 12B between the first position CL and the second position OP.

[0191] The second drive unit is realized by the lift plate 64, the cam plate 61, the shaft 63, the rotating plate 30, and the rotating shaft .

[0192] The second drive magnet 601 is movable, in particular, movable up and down. The second drive magnet 601 is fixed on the Z direction side with respect to the ring 60. The second drive magnet 601 may be realized by using a plurality of magnets arranged in an annular shape.

[0193] Ring 60 can be raised and lowered while being restricted from moving in a direction non-parallel to direction Z. The raising and lowering of ring 60 results in the raising and lowering of second drive magnet 601. Mechanisms for performing such raising and lowering are publicly known, for example from Patent Documents 1 and 4, and therefore will not be described or illustrated.

[0194] A second driven magnet 65 is fixed to the second driving unit. The second driven magnet 65 is fixed to, for example, the lift plate 64, and faces the second driving magnet 601. The second driven magnet 65 moves in accordance with the movement of the second driving magnet 601. Typically, the second driven magnet 65 rises and falls in accordance with the rise and fall of the second driving magnet 601. The second driven magnet 65 has the function of operating the second driving unit.

[0195] The lifting plate 64, the cam plate 61, and the shaft 63 are configured similarly to the lifting plate 34, the cam plate 31, and the shaft 33 of the chuck 12A, respectively. The cam plate 61 has a hole 62. The shaft 33 fits into the hole 62. The hole 62 is long in a direction inclined with respect to both the direction Z and the direction RDr. In Fig. 16, a cross section of the cam plate 61 taken along the longitudinal direction of the hole 62 is drawn to make it easier to see the position of the shaft 63 in the hole 62.

[0196] As in the chuck 12A, in the chuck 12B, the second driven magnet 65, the lift plate 64, and the cam plate 61 are lifted and lowered by the lifting and lowering of the second driving magnet 601, and the shaft 63 and thus the rotating shaft 36 rotate about the chuck rotation axis J.

[0197] The second driving magnets 501, 601 rise and fall independently. In order to avoid interference between the operations of the rings 50, 60, the ring 50, the second driving magnet 501, the second driven magnet 35, the cam plate 31, the lift plate 34, and the shaft 33 are provided on the outer periphery side of the chuck base 11 relative to the rotating shaft 36, and the ring 60, the second driving magnet 601, the second driven magnet 65, the cam plate 61, the lift plate 64, and the shaft 63 are provided on the inner periphery side of the chuck base 11 relative to the rotating shaft 36.

[0198] 17 is a top view partially showing the rings 20, 50, 60, the first drive magnet 201, and the second drive magnets 501, 601, as viewed in the direction opposite to the direction Z. Here, the case where the first drive magnet 201 and the second drive magnets 501, 601 have an annular shape is illustrated.

[0199] 18 is a top view of the chuck base 11 as viewed in the direction opposite to the direction Z. The example shows three chucks 12A and three chucks 12B arranged at equal intervals in a ring shape. Rings 20, 50, and 60 are also shown, but because they are stored in the fixed base 15 below the chuck base 11, they are represented by dashed lines as hidden lines.

[0200] Fig. 19 is a top view of the chuck 12B as viewed in the direction opposite to the direction Z. Fig. 19 illustrates a state in which the chuck 12B is in the first position CL. Fig. 19 also illustrates a portion of the rotating plate 30, the shaft 63, and the cam plate 61. Fig. 19 illustrates a cross section of the cam plate 61 taken along the longitudinal direction of the hole 62 in order to make the position of the shaft 63 in the hole 62 easier to see.

[0201] Fig. 20 shows the positional relationship between the cam plate 61, the shaft 63, the lift plate 64, and the second driven magnet 65. Fig. 20 is a side view seen along a direction from the substrate rotation axis Q toward the outer periphery of the chuck base 11. Fig. 20 shows the case where the chuck 12B takes the first position CL.

[0202] 16 and 19, the bearings 68 surrounding the shaft 63 are also shown, but in FIG. 20, the bearings 68 are considered to be included in the shaft 63 and are not shown.

[0203] FIG. 21 is a flow chart illustrating a specific operation of step S2 (see FIG. 13) for changing the grip of the substrate W.

[0204] In step S201, the gripping portion 121 of the chuck 12A takes the second position OP, and the gripping portion 121 of the chuck 12B takes the first position CL. As a result, the substrate W is not gripped by the chuck 12A, but is gripped by the chuck 12B. Figure 16 shows the state immediately after step S201 is performed.

[0205] The substrate W is held by the three chucks 12B and does not come into contact with the support surface 122 of the chuck 12A.

[0206] For example, after step S102 is executed and before step S103 is executed, the gripping portion 121 has taken the second position OP in step S101, so that the gripping portions 121 of both chucks 12A and 12B are in the second position OP. When step S2 starts before step S103 is executed, step S201 is executed, so that chuck 12A does not rotate about its own axis, but chuck 12B rotates about its own axis.

[0207] When step S2 starts after step S103 or step S104 is executed, step S201 is executed, so that chuck 12B does not rotate on its own axis, but chuck 12A rotates on its own axis.

[0208] After step S201 is performed, in step S202, the gripping portion 121 of the chuck 12A takes the first position CL, and the gripping portion 121 of the chuck 12B also takes the first position CL. Thus, the substrate W is gripped by both the chucks 12A and 12B. By performing step S202, the chuck 12B does not rotate about its own axis, but the chuck 12A rotates about its own axis.

[0209] After execution of step S202, in step S203, the gripping portion 121 of the chuck 12A takes the first position CL, and the gripping portion 121 of the chuck 12B takes the second position OP. As a result, the substrate W is not gripped by the chuck 12B, but is gripped by the chuck 12A. By executing step S203, the chuck 12A does not rotate on its own axis, but the chuck 12B rotates on its own axis. Since the substrate W is gripped by the three chucks 12A, it does not come into contact with the mounting surface 122 of the chuck 12B. By executing step S203, step S2 ends.

[0210] By executing steps S201 and S203, the state in which the substrate W is gripped by the chuck 12B transitions to a state in which the substrate W is gripped by the chuck 12A. In this manner, the gripping of the substrate W is changed in step S2.

[0211] Transferring the substrate W is advantageous in terms of drying the processing liquid supplied to the substrate W. When the substrate W is rotated and dried while being held by the chuck 12B, the processing liquid tends not to dry easily between the gripping portion 121 of the chuck 12B and the substrate W and in the vicinity thereof. Therefore, by changing the chuck 12 that grips the substrate W from chuck 12B to chuck 12A, drying of the processing liquid is promoted in the portion of the substrate W that was held by the gripping portion 121 of the chuck 12B and in the vicinity thereof.

[0212] Therefore, one of the preferable timings for performing step S2 is after the end of step S120 (i.e., after the process using the processing liquid is completed) and before the execution of step S107 (i.e., while the rotation of the substrate W is being maintained).

[0213] And since step S2 is performed while the rotation of the substrate W is maintained, and since the substrate W is gripped while it is rotating, it is preferable that step S202 is performed between steps S201 and S203.

[0214] When both of the chucks 12A and 12B are at the second position L, it is also possible to switch the grip of the substrate W. Fig. 22 is a cross-sectional view including the substrate rotation axis Q and showing a cross section parallel to the direction Z of a part of the spin chuck 75. Fig. 22 shows a state in which both of the chucks 12A and 12B are at the second position L, the grip of the chuck 12A is released, and the substrate W is gripped by the chuck 12B.

[0215] From the above, the following explanation can be made: When the substrate W is rotated by the chuck base 11 and both of the chucks 12A and 12B are at the first position H or when both of the chucks 12A and 12B are at the second position L: when the chuck 12A takes the second position OP, the chuck 12B takes the first position CL without taking the second position OP (S201); when the chuck 12B takes the second position OP, the chuck 12A takes the first position CL without taking the second position OP (S203); both of the chucks 12A and 12B can take the first position CL (S202).

[0216] It is also possible to adopt a process in which the chucks 12A and 12B are interchanged in steps S201 and S203.

[0217] The mechanism for causing the chucks 12A, 12B to assume the first position H and the second position L is the same, and the mechanism for causing the chucks 12A, 12B to assume the first position CL and the second position OP is similar. Therefore, both the chucks 12A, 12B can be regarded as the chuck 12, and the following explanation can be given in the same manner as the above <Relationship in Magnitude of Magnetic Force>. The repulsive forces f1, f2 are greater than the repulsive forces f3, f4. The repulsive force f1 is greater than the repulsive force f3. The repulsive force f4 is greater than the repulsive force f3. The repulsive force f2 is greater than the repulsive force f1. In other words, it is desirable that the relationship be f2>f1>f4>f3.

[0218] In order to avoid interference between the operations of the rings 50, 60, the ring 60, the second driving magnet 601, the second driven magnet 65, the cam plate 61, the lifting plate 64, and the shaft 63 may be arranged on the outer periphery of the chuck base 11 rather than the ring 50, the second driving magnet 501, the second driven magnet 35, the cam plate 31, the lifting plate 34, and the shaft 33.

[0219] <Detection of fallen substrate W> When the chuck 12 transitions from the second position OP to the first position CL, the chuck rotates and the gripping portion 121 rotates in the direction Dr1. When the substrate W is gripped by the gripping portion 121, the chuck rotation may be stopped by the substrate W. Hereinafter, the stopping of the chuck rotation by the substrate W is referred to as "locking" by the substrate W.

[0220] When the chuck 12 takes the first position CL, the orientation of the gripping portion 121 is limited by being locked by the substrate W or by the shaft 33 reaching the upper end of the hole 32. Below, a case is assumed in which the shaft 33 does not reach the upper end of the hole 32 when the chuck 12 takes the first position CL and grips the substrate W. Figures 5, 7 and 11 show such a case, in which there is a gap between the shaft 33 and the upper end of the hole 32. When the chuck 12 takes the first position CL without gripping the substrate W, the chuck rotation stops when the shaft 33 reaches the upper end of the hole 32.

[0221] Fig. 23 is a top view showing the chuck 12 in the first position CL when there is no locking by the substrate W. As in Fig. 7, Fig. 23 also shows the rotating plate 30, the shaft 33, and a part of the cam plate 31, and the cam plate 31 is shown in cross section along the direction of the hole 32. When the chuck 12 is in the first position CL, if the substrate W is not gripped, there is no locking by the substrate W, and the shaft 33 reaches the upper end of the hole 32.

[0222] Fig. 24 is a top view showing the positional relationship between the gripping part 121 and position W0 of the peripheral edge of the substrate W. In Fig. 24, the dashed lines indicate the gripping part 121 and position W0 when gripping the substrate W, and show the state shown by the solid lines in Fig. 8, which corresponds to Fig. 7. In Fig. 24, the solid lines indicate the gripping part 121 when not gripping the substrate W, which corresponds to Fig. 23.

[0223] Figure 25 is a side view showing the positional relationship of the cam plate 31, shaft 33, lift plate 34, and second driven magnet 35. In Figure 25, the dashed line indicates shaft 33 when gripping substrate W, shows the state shown by the solid line in Figure 11, and corresponds to Figure 7. In Figure 25, the solid line indicates shaft 33 when not gripping substrate W, and corresponds to Figure 23.

[0224] 24, the first position CL that the chuck 12 takes varies depending on whether the gripping portion 121 grips the substrate W. Specifically, when the substrate W is gripped, the rotation angle in the chuck rotation direction Dr2 is small. As can be seen from FIG. 25, such a difference in the rotation angle leads to a difference in the relative positional relationship between the lift plate 34 and the shaft 33.

[0225] The lifting and lowering of the shaft 33 is not affected by the rotation of the shaft 33 about the chuck rotation axis J. Therefore, when the chuck 12 is in the first position CL, the position of the lifting plate 34 when the substrate W is gripped is further toward the direction Z than the position of the lifting plate 34 when the substrate W is not gripped.

[0226] Therefore, by detecting the position of the lift plate 34 along the direction Z, it is possible to detect whether the substrate W is being gripped when the chuck 12 takes the first position CL. For example, it is possible to detect that the substrate W has fallen from the chuck 12 that was gripping the substrate W.

[0227] From the above, the following explanation can be made. When the chuck 12 transitions from the second position OP to the first position CL, the chuck rotation is limited by the substrate W being gripped by the gripping portion 121. Then, by detecting the position of the lift plate 34, it is possible to detect whether the substrate W is being gripped by the chuck 12 in the first position CL. In view of the fact that the second driven magnet 35 is fixed to the lift plate 34, the position of the lift plate 34 is detected indirectly by detecting the position of the second driven magnet 35.

[0228] Whether or not the substrate W is gripped can be detected regardless of whether the chuck 12 is at the first position H or the second position L. Figures 26 and 27 are cross-sectional views showing a cross section parallel to direction Z of a part of the spin chuck 75, including the substrate rotation axis Q. Figure 26 illustrates a case where the chuck 12 is at the first position H and takes the first position CL, and the substrate W is not gripped. Figure 27 illustrates a case where the chuck 12 is at the second position L and takes the first position CL, and the substrate W is not gripped.

[0229] Fig. 28 is a cross-sectional view illustrating a configuration for detecting whether or not the substrate W is being gripped. Fig. 28 shows the lift plate 34, the second drive magnet 501, and their vicinity. A part of the chuck base 11 on the fixed base 15 side is a light-transmitting window 11a. A part of the fixed base 15 on the chuck base 11 side is a light-transmitting window 15a.

[0230] The fixed base 15 is provided with a distance measuring device 81 that measures the distance from itself to the lift plate 34. The distance measuring device 81 irradiates a light L1 onto an area 34a of the lift plate 34, and receives a light L2 generated when the area 34a reflects the light L1.

[0231] Region 34a is a region of lift plate 34 where second driven magnet 35 is not provided, and is aligned with distance measuring device 81 along direction Z, together with windows 11a and 15a. Light L1 passes through windows 15a and 11a in this order from distance measuring device 81 and is reflected by region 34a to generate light L2. Light L2 passes through windows 11a and 15a in this order and is received by distance measuring device 81.

[0232] The technology of irradiating a measurement target with light, receiving the light reflected by the measurement target, and measuring the distance to the measurement target is well known, and distance measuring device 81 is configured using well-known technology, so a detailed description will be omitted. The measurement of the distance is performed under the control of control device 73.

[0233] As described above, the lift plate 34 can be omitted from the viewpoint of lifting and lowering the hole 32, but it is preferable to provide it from the viewpoint of detecting the position of the second driven magnet 35.

[0234] 29 is a flow chart illustrating an operation for detecting a drop of the substrate W (referred to as “substrate drop detection” in FIG. 29 and below).

[0235] In step S301, it is determined whether chuck 12 is in the first position CL or the second position OP. Such a determination depends on the steps performed in the substrate processing process shown in Fig. 13. As described above, the substrate processing process is performed under the control of controller 73, and therefore the determination in step S301 can be performed by controller 73.

[0236] If it is determined in step S301 that the chuck 12 is in the second position OP, step S301 is executed again because the fact that the substrate W has fallen is detected by determining that the substrate W is not being gripped in a situation in which the substrate W should be gripped.

[0237] 13, when the substrate drop detection is performed before step S108 is performed after step S103 is performed, step S301 may be omitted because the chuck 12 takes the first posture CL by performing step S103.

[0238] When it is determined in step S301 that the chuck 12 is in the first position CL, step S302 is executed. In step S302, a difference in the measured distance is acquired. Here, the "measured distance" is the distance from the distance measuring device 81 to the lift plate 34 measured by the distance measuring device 81. The measured distance is successively notified to the control device 73, and the temporal variation of the value is acquired by the control device 73 as a difference in the measured distance.

[0239] The difference in the measured distances indicates the movement of the lift plate 34, and therefore the movement of the cam plate 31, the hole 32, and the second driven magnet 35.

[0240] After step S302 is performed, the difference is compared with a threshold in step S303. If the difference is greater than the threshold, this indicates that the lift plate 34 has moved more than the threshold. Considering that the substrate W is normally held when the chuck 12 is in the first position CL, the movement of the lift plate 34 more than the threshold is an indicator that the substrate W has fallen.

[0241] Therefore, when it is determined in step S303 that the difference is greater than the threshold (indicated as "Y" in FIG. 29), it is determined in step 304 that the substrate W has fallen. When it is determined in step S303 that the difference is equal to or smaller than the threshold (indicated as "N" in FIG. 29), it is determined in step 305 that the substrate W has not fallen and is normally held.

[0242] The flowchart for substrate drop detection ends when either step S304 or S305 is executed. However, when the substrate W drops, it is preferable to stop the processing of the substrate W. From this viewpoint, when step S304 is executed, it is preferable to stop the rotation of the chuck base 11 and the supply of the processing liquid and gas.

[0243] The same value may be used for the threshold value regardless of whether the chuck 12 is in the first position H or the second position L. This is because the raising and lowering of the chuck 12 does not affect the rotation of the rotating plate 30, and therefore the chuck rotation.

[0244] In the same manner, it is possible to detect whether the substrate W is being gripped by the chucks 12A and 12B.

[0245] Although the present invention has been described in detail, the above description is merely illustrative in all respects, and the present invention is not limited thereto. It is understood that countless variations not illustrated can be envisioned without departing from the scope of the present invention. The configurations described in the above embodiments and variations can be appropriately combined or omitted as long as they are not mutually contradictory. [Explanation of symbols]

[0246] 11 Chuck base 12,12A,12B Chuck 22,34,64 Lifting plate 30 Rotating Plate 31,61 Cam plate 33,63 axis 35,65 Second driven magnet 36 Rotating shaft 111 Main surface 121 Gripping part 121a concave 201 First drive magnet 202 First driven magnet 501,601 Second driving magnet CL 1st posture Dr1,Dr2,RDr,Z direction F1 Chemical solution F2 fluid f1,f2,f3,f4 repulsion H 1st position J Chuck rotation axis L 2nd position OP 2nd posture Q PCB Rotation Axis W substrate W0 position W1 1st page W2 Side 2

Claims

1. A substrate processing method performed in a substrate holding device including a plurality of chucks used for holding a substrate and a chuck base on which the plurality of chucks are mounted, comprising: the substrate has a first surface and a second surface closer to the chuck base than the first surface; a first step of supplying a processing liquid to at least one of the first surface and the second surface held by the plurality of chucks; a second step of supplying a gas to the second surface during or after the first step; Equipped with In the second step, the substrate is rotated by the chuck base while being gripped by the plurality of chucks, and approaches the chuck base by the movement of the plurality of chucks; A substrate processing method, wherein rotation of the substrate is maintained between the first step and the second step.

2. A substrate processing method carried out in a substrate holding device including a plurality of chucks used for gripping a substrate and a chuck base on which the plurality of chucks are mounted, comprising: the substrate has a first surface and a second surface closer to the chuck base than the first surface; a first step of supplying a processing liquid to at least one of the first surface and the second surface held by the plurality of chucks; a second step of supplying a gas to the second surface during or after the first step; Equipped with In the second step, the substrate is rotated by the chuck base while being gripped by the plurality of chucks, and approaches the chuck base by the movement of the plurality of chucks; The substrate processing method, wherein the substrate is gripped by pinching and holding the peripheral edge of the substrate from above and below.

3. Each of the plurality of chucks has a gripping portion used to grip the substrate, 3. The substrate processing method according to claim 1, wherein the chuck base is used to rotate the substrate held by the gripping portion.

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