Liquid Material Vaporizer

Abstract

In order to provide a liquid material vaporization device which can be sufficiently cooled so that a liquid material is not vaporized upstream of a vaporization chamber, and in which the consumption amount of a refrigerant used for cooling can also be reduced, the present invention comprises: a vaporization chamber 52 in which a liquid material is heated, and a material gas is generated when the liquid material is vaporized; a material supply system 6 equipped with a material supply path 63 through which flows a gas-liquid mixture obtained by mixing the liquid material and a carrier gas, and a material ejection port 62 through which the gas-liquid mixture that passed through the material supply path 63 is ejected into the vaporization chamber 52; and a cooling system 7 equipped with a cooling flow path 73 through which flows at least a liquid-state refrigerant in which a component contained in the liquid material dissolves, said cooling flow path 73 being formed such that a material ejection port 62 side of the material supply path 63 is cooled by the refrigerant, and a solvent ejection port 72 through which the refrigerant that passed through the cooling flow path 73 is ejected into the vaporization chamber 52.

Description

[Technical field]

[0001] The present invention relates to a liquid material vaporizer for vaporizing a liquid material. [Background technology]

[0002] In the semiconductor manufacturing process, a material gas obtained by vaporizing a liquid material that is liquid at room temperature may be used as a process gas for adsorption onto the substrate surface. For example, when forming an atomic-level thin film on a substrate by the ALD (Atomic Layer Deposition) method, the liquid material may be an organometallic liquid material containing elements such as Sr (strontium), Ba (barium), and La (lanthanum), which have low vapor pressure and high viscosity, dissolved in a solvent such as ECH (ethylcyclohexane) or THF (tetrahydrofuran). In recent years, liquid materials that use a material that is solid at room temperature as a solute and are dissolved in a solvent have also begun to be used. In the following, the term "liquid material" is used regardless of the state of the solute at room temperature, and materials that do not contain a solute may also be referred to as "liquid material."

[0003] There are two types of devices for vaporizing liquid materials: the baking method, in which the liquid material is vaporized by bubbling or the like in a tank in which it is stored, and the instantaneous vaporization method, in which the liquid material is sprayed into a vaporization chamber kept at a high temperature by a heater or the like, and vaporized instantly.

[0004] In the baking method, when a liquid material in which a solid material is dissolved in a solvent as described above is vaporized, the solute with a low vapor pressure remains in the tank, and the liquid material tends to become concentrated.

[0005] On the other hand, instantaneous vaporization type liquid material vaporization devices include an internal mixing type (see Patent Document 1), in which the liquid material and carrier gas are mixed in advance and then sprayed into the vaporization chamber, and an external mixing type (see Patent Document 2), in which the liquid material and carrier gas are mixed when supplied into the vaporization chamber.

[0006] In the instantaneous vaporization method, the vicinity of the liquid material nozzle that opens into the vaporization chamber becomes hot, so that only the solvent of the liquid material evaporates near the nozzle, and the solute may remain. This may cause the supply path of the liquid material to become blocked or the nozzle to become clogged.

[0007] In order to solve such problems, Patent Document 3 proposes a liquid material vaporizer that combines an internal mixing method and an external mixing method. This liquid material vaporizer includes a material supply system having a material injection nozzle that sprays a gas-liquid mixture, which is a mixture of a liquid material and a carrier gas, into a vaporization chamber, a carrier gas supply system having a carrier gas flow path formed to pass through the outer surface of the material injection nozzle, and a ring-shaped carrier gas outlet that injects carrier gas into the vaporization chamber from around the tip opening of the material injection nozzle. That is, it is considered that the material injection nozzle is cooled by the carrier gas supplied around the material injection nozzle by the carrier gas supply system, or the heat transfer from the vaporization chamber to the material injection nozzle is prevented by the carrier gas, so that only the solvent of the liquid material can be prevented from evaporating.

[0008] However, even with the above-mentioned configuration, particularly when vaporizing a liquid material in which a solid material is a solute, it may not be possible to sufficiently prevent only the solvent from evaporating. Even if the so-called solvent skip phenomenon could be prevented, the consumption of carrier gas used for cooling or insulation would be very large. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] JP 2006-108230 A [Patent Document 2] JP 2007-46084 A [Patent Document 3] Patent No. 5004890 Summary of the Invention [Problem to be solved by the invention]

[0010] The present invention has been made in consideration of the problems described above, and aims to provide a liquid material vaporization device that can sufficiently cool the liquid material so that it does not vaporize upstream of the vaporization chamber, and that can also reduce the consumption of medium used for cooling. [Means for solving the problem]

[0011] That is, the liquid material vaporization apparatus of the present invention is characterized in comprising a material supply system comprising: a vaporization chamber in which the liquid material is heated and a material gas is produced by vaporizing the liquid material; a material supply path through which a gas-liquid mixture of the liquid material and a carrier gas flows; and a material outlet through which the gas-liquid mixture that has passed through the material supply path is ejected into the vaporization chamber; a cooling system comprising: a cooling flow path through which at least a solvent that dissolves the components contained in the liquid material flowing through the material supply path flows, and which is formed so that the material outlet side of the material supply path is cooled; and a solvent outlet through which a refrigerant that has passed through the cooling flow path is ejected into the vaporization chamber.

[0012] In this way, the solvent flows through the cooling passage, and the cooling passage is formed so as to cool the material outlet side of the material supply passage, so that the solvent can be vaporized near the material outlet, which is the hottest part, and can be sufficiently cooled by the latent heat of vaporization. This makes it possible to prevent the liquid material from vaporizing upstream of the vaporization chamber, and to prevent problems such as clogging and blockage of the passage.

[0013] In addition, the solvent flowing through the cooling flow path can be evaporated near the material outlet, allowing pinpoint cooling using the latent heat of vaporization, thereby significantly reducing the amount of medium consumed for cooling compared to cooling or insulation using carrier gas alone.

[0014] Furthermore, since the solvent evaporated in the cooling flow path is supplied into the vaporization chamber, the partial pressure of the liquid material in the vaporization chamber is reduced, and the vaporization can be further promoted. In addition, since the components contained in the liquid material are dissolved in the solvent ejected from the solvent ejection port, even if some components of the liquid material remain near the material ejection port, it is possible to expect the effect that such components are dissolved in the vaporized solvent and removed.

[0015] In order to prevent the solvent sprayed from the cooling system into the evaporation chamber from affecting the destination of the material gas supply, while making it easier to remove the solute of the liquid material remaining in the material spray outlet, it is sufficient that the liquid material is a solid material dissolved in a solvent, and the refrigerant is the solvent.

[0016] In order to make it easier for the solvent flowing through the cooling flow passage to evaporate near the material outlet, thereby enhancing the cooling effect due to the latent heat of vaporization, and also to improve the vaporization assisting effect of the solvent ejected from the solvent outlet on the liquid material in the vaporization chamber, it is sufficient that a gas-liquid mixture of solvent and carrier gas flows through the cooling flow passage, and that the gas-liquid mixture ejected from the material outlet and the solvent ejected from the solvent outlet are mixed within the vaporization chamber.

[0017] In order to enable the liquid material to begin evaporating after being sprayed into the vaporization chamber, while the solvent flowing through the cooling flow path begins to vaporize within the cooling flow path and the area near the material outlet is locally cooled by the latent heat of vaporization, the material supply path may include a first nozzle section whose flow path area decreases near the material outlet, and the cooling flow path may include a second nozzle section that is located a predetermined distance upstream from the solvent outlet and whose flow path area decreases and then increases.

[0018] A preferred configuration example of the second nozzle is one in which the first nozzle section is cooled by the latent heat of vaporization of a solvent evaporating at the outlet of the second nozzle section.

[0019] In order to extend the time that the evaporated refrigerant in the cooling flow passage remains in the vicinity of the material outlet and further enhance the cooling effect, it is sufficient that a retention chamber in which the evaporated solvent remains is formed on the outlet side of the second nozzle portion.

[0020] In order to ensure that the liquid material ejected from the material outlet and the solvent ejected from the solvent outlet are thoroughly mixed within the vaporization chamber and to facilitate further vaporization of the liquid material, the multiple solvent outlets are arranged in a circle around the material outlet, and the ejection direction of each of the multiple solvent outlets is configured to form a spiral with the ejection direction of the material outlet as the central axis.

[0021] In order to ensure that the liquid material is sufficiently mixed with the carrier gas in the vaporization chamber and sprayed to the peripheral parts of the vaporization chamber, and to promote the vaporization of the liquid material, a liquid material vaporization device may be provided which includes a material supply system comprising: a vaporization chamber in which the liquid material is heated and a material gas is produced by vaporizing the liquid material; a material supply path through which a gas-liquid mixture of the liquid material and the carrier gas flows; and a material outlet through which the gas-liquid mixture that has passed through the material supply path is ejected into the vaporization chamber; and a cooling system comprising: a cooling flow path through which a carrier gas flows and which is formed so that the material outlet side of the material supply path is cooled by the carrier gas; and a solvent outlet through which the carrier gas that has passed through the cooling flow path is ejected into the vaporization chamber, and one or more material outlets are formed to surround the periphery of the solvent outlet. Effect of the Invention

[0022] In this manner, in the liquid material vaporizer according to the present invention, the refrigerant in a liquid state flows in the material supply path through which the liquid material flows so as to cool the material outlet side, so that the vicinity of the material outlet can be pinpoint-cooled by the latent heat of vaporization of the refrigerant, thereby preventing the liquid material from evaporating in front of the vaporization chamber and realizing a reduction in the consumption of the refrigerant due to localized cooling. [Brief description of the drawings]

[0023] [Figure 1] 1 is a schematic diagram of a liquid material vaporizing device according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic cross-sectional view showing the structure of the spray according to the first embodiment. [Diagram 3] FIG. 2 is a schematic cross-sectional perspective view showing the structure of the spray according to the first embodiment. [Figure 4] FIG. 2 is a schematic partial perspective view showing an enlarged view of the vicinity of the spray nozzle of the sprayer according to the first embodiment. [Diagram 5] FIG. 6 is a schematic cross-sectional view showing the structure of a sprayer according to a second embodiment. [Figure 6] FIG. 11 is a schematic cross-sectional perspective view showing the structure of a sprayer according to a second embodiment. [Figure 7] FIG. 11 is a schematic cross-sectional view showing the structure of a spray according to a third embodiment. [Explanation of symbols]

[0024] 100 Liquid material vaporizer 1...1st gas-liquid mixing mechanism 2...Second gas-liquid mixing mechanism 3. Vaporization mechanism 4...Sprayer 5. Carburetor 51 Heater 52 Vaporization chamber 6...Material supply mechanism 61 Material introduction port 62...Material spout 63...Material supply route 64 First nozzle section 7. Refrigerant supply mechanism 71 Refrigerant inlet port 72...Solvent spout 73 Cooling Channel 74 Second nozzle section 75...retention chamber DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] A liquid material vaporizer 100 according to a first embodiment of the present invention will be described with reference to Figures 1 to 4. This liquid material vaporizer 100 is used to vaporize a liquid material and generate a material gas. The generated material gas is used as a process gas supplied for various processes on the surface of a substrate, for example.

[0026] The liquid material to be vaporized is a solute solid material dissolved in a solvent (liquid raw material), and the vapor pressure of the solid material is lower than that of the solvent. Therefore, depending on the temperature and pressure, only the solvent may evaporate first, and only the solute solid material may remain without vaporizing.

[0027] Specifically, as shown in FIG. 1, this liquid material vaporization device 100 includes a first gas-liquid mixing mechanism 1 that mixes the liquid material with a carrier gas to generate a gas-liquid mixture, a second gas-liquid mixing mechanism 2 that mixes a solvent that constitutes part of the liquid material with the carrier gas to generate a gas-liquid mixture, and an evaporation mechanism 3 in which the liquid material is heated and a material gas is generated.

[0028] The first gas-liquid mixing mechanism 1 includes a first valve unit 11 that controls the flow rate of the liquid material supplied relative to the carrier gas.

[0029] The second gas-liquid mixing mechanism 2 has the same configuration as the first gas-liquid mixing mechanism 1, and includes a second valve unit 21 that controls the flow rate of the solvent supplied to the carrier gas. In this embodiment, the carrier gas supplied to the first gas-liquid mixing mechanism 1 and the carrier gas supplied to the second gas-liquid mixing mechanism 2 are the same type of gas, and for example, N2 (nitrogen) is used. The solvent supplied to the second gas-liquid mixing mechanism is used as a refrigerant to prevent the liquid material from evaporating in the sprayer 4 described later. In addition, this solvent is the same type as the solvent constituting the liquid material supplied to the first gas-liquid mixing mechanism 1. Note that the solvent supplied to the second gas-liquid mixing mechanism 2 may be different from the solvent constituting the liquid material supplied to the first gas-liquid mixing mechanism 1 as long as it can dissolve the solid material that is the solute of the liquid material.

[0030] The vaporization mechanism 3 is composed of a sprayer 4 disposed on the upstream side and a heater 5 disposed on the downstream side. The sprayer 4 sprays the gas-liquid mixture supplied from each gas-liquid mixing mechanism into the heater 5. The heater 5 includes a vaporization chamber 52 formed therein and a heater 51 configured to keep the inside of the vaporization chamber 52 at a constant temperature.

[0031] The sprayer 4 will now be described in detail with reference to FIGS.

[0032] Sprayer 4 is configured so that each gas-liquid mixture is supplied from the base end side, and liquid material or the like is sprayed into vaporization chamber 52 from the tip surface facing the inside of vaporization chamber 52. This sprayer 4 is roughly cylindrical in shape, and has a flow path through which the gas-liquid mixture flows and a nozzle portion for adjusting the pressure formed therein. That is, sprayer 4 is equipped with a material supply system 6 that supplies the liquid material into vaporization chamber 52, and a cooling system 7 that supplies a refrigerant to prevent evaporation of the liquid material flowing in material supply system 6. The gas-liquid mixture flows synchronously through material supply system 6 and cooling system 7, respectively.

[0033] 2 and 3, the material supply system 6 is composed of one material introduction port 61 that opens on the end face on the base end side of the sprayer 4 and through which a gas-liquid mixture consisting of a liquid material and a carrier gas is supplied from the first gas-liquid mixing mechanism 1, a material outlet 62 that opens on the end face on the tip end side of the sprayer 4 and through which the gas-liquid mixture containing the liquid material is ejected into the vaporization chamber 52, and a material supply path 63 that is a flow path connecting the material introduction port 61 and the material outlet 62 and through which the gas-liquid mixture flows. This material supply system 6 is formed along the central axis of the approximately cylindrical sprayer 4.

[0034] In the material supply path 63, a first nozzle section 64 is formed in which the flow path area is reduced near the material outlet 62. The outlet of the first nozzle section 64 is aligned with the material outlet 62. Therefore, the gas-liquid mixture passing through the first nozzle section 64 is once throttled and then expands in the vaporization chamber 52.

[0035] In this embodiment, five cooling systems 7 are formed so as to surround the periphery of the material supply system 6, and the material supply system 6 and the cooling system 7 are configured to be closest to each other at the tip side of the sprayer 4 facing the vaporization chamber 52. Specifically, as shown in Figures 2 and 3, the cooling system 7 has a refrigerant inlet port 71 to which a gas-liquid mixture consisting of a solvent and a carrier gas is supplied from the second gas-liquid mixing mechanism 2, a solvent outlet 72 from which the liquid or gas introduced from the refrigerant inlet port 71 is ejected into the vaporization chamber 52, and a cooling flow path 73 that connects between the refrigerant inlet port 71 and the solvent outlet 72 and through which the gas-liquid mixture used as a refrigerant flows.

[0036] The cooling flow passage 73 is formed so that the material outlet 62 side of the material supply passage 63 is cooled by the refrigerant. Specifically, the cooling flow passage 73 is provided in parallel with the material supply passage 63 at the base end side of the sprayer 4, but is bent obliquely with respect to the axial direction of the sprayer 4 at the tip end side of the sprayer 4 so as to approach the material outlet 62 side. The cooling flow passage 73 also includes a second nozzle section 74 provided at a position separated by a predetermined distance upstream from the solvent outlet 72. The second nozzle section 74 is configured so that the flow passage area is reduced and then expanded, and is arranged so that the position of the second nozzle section 74 with respect to the axial direction of the sprayer 4 is approximately the same as that of the first nozzle section 64.

[0037] Because of this configuration, the solvent contained in the gas-liquid mixture is in a liquid state at the base end side of the cooling flow path 73, but evaporates at the tip end side of the coolant supply path when it passes through the second nozzle part 74. Therefore, the vicinity of the first nozzle part 64 and the material ejection port 62 is pinpoint-cooled by the latent heat of vaporization of the solvent flowing through the cooling flow path 73.

[0038] Next, the relative positions of the material outlet 62 and the solvent outlet 72 will be described with reference to Fig. 4. As shown in Fig. 4, the central portion of the tip face of the sprayer 4 is recessed in a cone shape, with the material outlet 62 opening at the innermost portion. The five solvent outlets 72 are arranged side by side on a circle centered on the material outlet 62. The five solvent outlets 72 open on the inclined surface of the cone, and are formed so that the respective ejection directions of the refrigerant form a spiral with the ejection direction of the material outlet 62 as the central axis.

[0039] With the liquid material vaporization device 100 configured in this manner, the liquid solvent flowing through the cooling flow passage 73 can be vaporized at the tip side of the sprayer 4 facing the inside of the vaporization chamber 52 heated by the heater 51, particularly near the material outlet 62, and the latent heat of vaporization can be used to locally cool the tip side.

[0040] Therefore, in the vicinity of the material ejection port 62, only the solvent in the liquid material flowing through the material supply passage 63 evaporates, and it is possible to prevent the solid material, which is the solute, from remaining.

[0041] Even if a small amount of the solvent constituting the liquid material vaporizes and solid material remains near the material outlet 62, the vaporized solvent is supplied from the solvent outlet 72 to the vicinity of the material outlet 62, so the remaining solid material can be dissolved again. Therefore, while the material gas is being supplied, the remaining material near the material outlet 62 can be removed in parallel. In addition, the partial pressure of the solid material in the vaporization chamber 52 can be reduced by the gasified solvent supplied from the solvent outlet 72 into the vaporization chamber 52. This can promote the vaporization of the solid material in the vaporization chamber 52.

[0042] Furthermore, since pinpoint cooling is realized using the latent heat of vaporization, the amount of refrigerant required for cooling can be significantly reduced compared to, for example, a case where only carrier gas is flowed through the cooling flow path 73 to cool the vicinity of the material jetting port 62. In addition, since the solvent and carrier gas flow in a gas-liquid mixture state in the cooling flow path 73, the solvent can be more easily vaporized at the tip side of the cooling flow path 73, and the cooling efficiency can be improved. Furthermore, the required supply pressure can be reduced compared to a case where only the solvent is flowed through the cooling flow path 73.

[0043] In addition, the liquid material vaporizer 100 of the first embodiment can realize spraying of the liquid material into the vaporization chamber 52 by the internal mixing method using the material supply system 6, while also realizing spraying by the external mixing method by supplying vaporized solvent or carrier gas using each cooling system 7. By realizing hybrid spraying of the internal mixing method and the external mixing method in this way, a spray state suitable for vaporizing the solid material contained in the liquid material can be achieved.

[0044] Next, a liquid material vaporizer 100 according to a second embodiment of the present invention will be described with reference to Figures 5 and 6. Note that the same reference numerals will be used to designate members corresponding to those described in the first embodiment.

[0045] 5 and 6, the liquid material vaporizer 100 of the second embodiment differs from the first embodiment in the configuration of the cooling flow path 73. Specifically, the position of the second nozzle portion 74 in the cooling flow path 73 is disposed further upstream, and a retention chamber 75 in which the vaporized refrigerant temporarily resides is formed at the outlet of the second nozzle portion 74. The retention chamber 75 is a roughly rectangular parallelepiped space, and is formed so as to have the largest flow path area in the cooling flow path 73. Also, the areas of the outlet port and inlet port are formed small relative to the inlet and outlet side wall surfaces of the retention chamber 75.

[0046] With this, the solvent that has passed through the second nozzle portion 74 and evaporated can be retained in the vicinity of the material ejection port 62 for a predetermined period of time, thereby further enhancing the cooling effect.

[0047] Next, a third embodiment will be described with reference to FIG.

[0048] In the third embodiment, the positional relationship between the material supply path 63 and the cooling path 73 is reversed compared to the above-mentioned embodiments. That is, the path extending along the central axis of the sprayer 4 serves as the cooling path 73, and the multiple paths provided around it serve as the material supply paths 63. Furthermore, the material ejection port 62 is formed so as to surround the periphery of the solvent ejection port 72 formed in the center of the tip face of the sprayer 4.

[0049] In the third embodiment, no liquid flows in the cooling passage 73, and only the carrier gas flows as a coolant. On the other hand, a gas-liquid mixture, which is a mixture of a liquid material in which a solid material is dissolved in a solvent and a carrier gas, flows in the material supply passage 63.

[0050] The liquid material vaporizer 100 configured in this manner can realize hybrid mixing that combines internal mixing and external mixing, and can spray the liquid material in a state where it is sufficiently mixed with the carrier gas in the vaporization chamber 52 up to the periphery of the vaporization chamber 52. This can promote the vaporization of the liquid material.

[0051] Other embodiments will now be described.

[0052] The cooling flow path is not limited to one through which a gas-liquid mixture flows, and may be one through which only a liquid refrigerant flows, for example. The refrigerant is not limited to the solvent constituting the liquid material flowing through the material supply path, and may be another type of liquid. In this case, it is sufficient if it has the property of being able to dissolve the solute constituting the liquid material. In addition, in the third embodiment, not only a carrier gas but also a liquid such as a solvent acting as a refrigerant may flow through the cooling flow path.

[0053] The liquid material is not limited to one in which the solute is a solid material, and the liquid material may be one in which the solute is, for example, an organometallic liquid material dissolved in a solvent.

[0054] In the first and second embodiments, a plurality of cooling systems are provided for a material supply system, but only one cooling system may be provided for one material supply system. Even if a plurality of cooling systems are present, the solvent outlets may be arranged to finally join together. In this case, the solvent outlet may be formed in a ring shape so as to surround the periphery of the material outlet.

[0055] The ejection directions of the material ejection port and the solvent ejection port are not limited to those shown in the respective embodiments. For example, the ejection directions of the material ejection port and the solvent ejection port may be parallel to each other.

[0056] The carrier gas and the carrier gas are not limited to being the same type of gas, and may be different types of gases.

[0057] In addition, parts of the embodiments may be combined or modified as long as it does not go against the spirit of the present invention. [Industrial Applicability]

[0058] As described above, according to the present invention, it is possible to provide a liquid material vaporizer that can prevent the liquid material from evaporating in front of the vaporization chamber and can also reduce the amount of refrigerant consumed.

Claims

1. a vaporization chamber in which a liquid material is heated and a material gas is generated by vaporizing the liquid material; a material supply system including a material supply passage through which a gas-liquid mixture obtained by mixing a liquid material and a carrier gas flows, and a material ejection port through which the gas-liquid mixture that has passed through the material supply passage is ejected into the vaporization chamber; a cooling system including a cooling flow path through which a fluid different from the gas-liquid mixture flows, the cooling flow path being formed so that at least a solvent, which is a liquid in which components contained in the liquid material flowing through the material supply path dissolves, flows, and the material supply path is cooled on the material outlet side; and a solvent outlet through which the solvent, which is a liquid that has passed through the cooling flow path, is ejected into the evaporation chamber.

2. the liquid material flowing through the material supply path is a solid material dissolved in a solvent, 2. The liquid material vaporizer according to claim 1, wherein the solvent flowing through the cooling flow passage is the same type as the solvent constituting the liquid material.

3. A gas-liquid mixture of a solvent and a carrier gas flows through the cooling flow path, 3. The liquid material vaporizing apparatus according to claim 1, wherein the gas-liquid mixture ejected from the material ejection port and the solvent ejected from the solvent ejection port are mixed in the vaporizing chamber.

4. The material supply path includes a first nozzle portion having a flow path area reduced in the vicinity of the material ejection port, 4. A liquid material vaporization device according to claim 1, wherein the cooling flow passage is provided at a predetermined distance upstream from the solvent outlet and includes a second nozzle portion whose flow passage area decreases and then increases.

5. 5. The liquid material vaporizing device according to claim 4, wherein the first nozzle portion is cooled by latent heat of vaporization of the solvent vaporizing at the outlet of the second nozzle portion.

6. 6. The liquid material vaporizing apparatus according to claim 4, wherein a retention chamber for retaining evaporated solvent is formed on the outlet side of the second nozzle portion.

7. The solvent outlets are arranged in a circle around the material outlet, 7. The liquid material vaporizing device according to claim 1, wherein each of the solvent outlets has an outlet direction that forms a spiral shape with the outlet direction of the material outlet as a central axis.

8. a vaporization chamber in which a liquid material is heated and a material gas is generated by vaporizing the liquid material; a material supply system including a material supply passage through which a gas-liquid mixture obtained by mixing a liquid material and a carrier gas flows, and a material ejection port through which the gas-liquid mixture that has passed through the material supply passage is ejected into the vaporization chamber; a cooling system including a cooling flow path through which a fluid different from the gas-liquid mixture flows, a carrier gas and a liquid solvent flow, and a cooling system formed so as to cool the material outlet side of the material supply path, and a solvent outlet through which the carrier gas and the liquid solvent that have passed through the cooling flow path are ejected into the vaporization chamber, A liquid material vaporizing device in which one or more of the material jets are formed so as to surround the periphery of the solvent jet.

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