Electronic component board dividing device

Abstract

To provide an apparatus for dividing an electronic component substrate that is capable of efficiently dividing an electronic component substrate having ultra-small electronic components of 2 mm or less each side mounted thereon into individual electronic components.SOLUTION: There is provided a conveyor belt 14 for conveying an electronic component substrate 1 on which ultra-small electronic components 3 of 2 mm or less each side are mounted in a grid pattern. A reaction force support surface 16a is arranged immediately below the conveyor belt, and a small-diameter columnar support roll 18 is arranged in the vicinity of the downstream side thereof. The support roll 18 is laterally and rotatably held in a groove portion 17a at the top portion of a tapered block 17C protruding upward from a support block 17. A small-diameter and cylindrical pressing roll 36 for pressing the vicinity of a dividing groove 4 of the electronic component substrate is arranged directly above the conveyor belt in a state where a leading portion fp of the electronic component substrate 1 is pushed up by the support roll 18. The pressing roll 36 is laterally and rotatably held in a groove portion 34a provided at the top portion of a tapered block 34D protruding downward from a slide block 34 that can slide up and down.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a dividing device that divides an electronic component board, on which a plurality of electronic components are mounted, into individual electronic components along dividing grooves. [Background technology]

[0002] Electronic component boards, for example ceramic boards, are often manufactured by mounting multiple electronic components together on the board, taking productivity into consideration. Electronic component boards have multiple electronic components mounted on the board body, and the board body is pre-drilled with dividing lines in the vertical and horizontal directions along the electronic components using a drill or V-cut. After the electronic component board is completed, the individual electronic components are separated along the dividing lines.

[0003] Known methods for dividing an electronic component board into multiple individual pieces include a method in which a bending force is applied by hand, causing a crack to develop along the dividing line, and dividing the board by placing an edge opposite the dividing line on the underside of the board and applying a downward bending force to the board (Patent Document 1), and a method in which both sides of the board are held with a board holding part, a blade is pressed against the back side of the cutting line of the board, and at the same time the board holding part is rotated in the opposite direction to the pressing direction to divide the board (Patent Document 2).

[0004] However, in recent years, advances in advanced electronic component integration technology have led to the miniaturization of electronic components, and with the dividing methods of either Patent Document 1 or Patent Document 2, it is extremely difficult to apply or press an edge or blade against the dividing processing lines on the board for small electronic components with a side length of several millimeters, making it extremely difficult to accurately divide them.For this reason, the present applicant previously proposed a dividing device for electronic component boards (Patent Document 3) that enables an electronic component board on which multiple small electronic components with a side length of several millimeters are mounted to be efficiently divided along the dividing processing grooves. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 57-4714 [Patent Document 2] Patent No. 2801453 [Patent Document 3] JP 2010-199163 A Summary of the Invention [Problem to be solved by the invention]

[0006] According to the device of Patent Document 3 previously proposed by the applicant, electronic components with a side length of several millimeters (e.g., 4 mm) mounted on an electronic component board can be efficiently separated in sequence from the top. However, as electronic components for smartphones and the like have become even smaller, the device previously proposed by the applicant has difficulty separating electronic component boards mounted with ultra-small electronic components with a side length of 2 mm or less (or even 1 mm or less).

[0007] The present invention has been made in consideration of the above-mentioned problems, and has an object to provide an electronic component board dividing device that can efficiently divide an electronic component board mounted with ultra-small electronic components with a side length of 2 mm or less into individual electronic components. [Means for solving the problem]

[0008] In order to solve the above problems, the dividing device for an electronic component board according to the present invention comprises: A dividing device for dividing an electronic component substrate along dividing grooves on which a plurality of ultra-small electronic components with sides of 2 mm or less are mounted in a lattice pattern and on which dividing grooves are formed in the vertical and horizontal directions, comprising: a conveyor belt along which the electronic component board is conveyed; a reaction force support surface that receives a reaction force when the electronic component substrate is separated is disposed immediately below the conveyor belt, and a small-diameter cylindrical support roll that supports the electronic component substrate by pushing up a leading portion of the electronic component substrate from below the conveyor belt is disposed near the downstream side of the reaction force support surface; The support roll is held sideways and rotatably in a groove provided at the top of a tapered block protruding upward from a support block disposed immediately below the conveyor belt, a small-diameter cylindrical pressing roll is disposed immediately above the conveyor belt, the small-diameter cylindrical pressing roll pressing from above the vicinity of the position of the division processing groove of the leading portion of the electronic component board while the leading portion of the electronic component board is pushed up by the support roll; The first feature is that the pressure roll is held horizontally and rotatably within a groove provided at the top of a taper block that protrudes downward from a slide block that is arranged to be slidable up and down directly above the conveyor belt.

[0009] According to the present invention, when the electronic component board is conveyed downstream on the conveyor belt and the leading portion of the electronic component board is pushed up by the downstream support roll, the upper pressure roll presses from above the position of the dividing groove of the leading portion of the electronic component board, so that an upward bending force is applied to the leading portion of the electronic component board starting from the dividing groove, and the leading portion of the electronic component board is divided. The small-diameter, cylindrical support roll is held laterally and rotatably in the groove of the top of the taper block protruding upward from the support block arranged below the conveyor belt, and the small-diameter, cylindrical pressure roll is held laterally and rotatably in the groove of the top of the taper block protruding downward from the slide black arranged above the conveyor belt, so that the deflection of the support roll and the deflection of the pressure roll during division are suppressed in the respective grooves, so that the pressing force applied near the groove of the electronic component board during division is made uniform in the lateral direction, and the electronic component board can be divided reliably. In addition, since it is possible to simultaneously reduce the diameters of the support roll and pressure roll and narrow the gap between the two rolls in the up-down and front-to-back directions, electronic component boards can be efficiently separated even for ultra-small electronic components.

[0010] The dividing device for an electronic component substrate according to the present invention comprises: The second feature is that shaft holes for supporting the ends of the pressure roll are provided at both ends within a groove provided at the top of a taper block protruding downward from the slide block. Effect of the Invention

[0011] As described above, the present invention has the excellent effect of being able to efficiently separate mounted ultra-small electronic components with a side length of 2 mm in sequence from electronic component boards or rows of electronic components transported on a transport belt. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view of a dividing device for an electronic component board according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a front view of the splitting device shown in FIG. [Diagram 3] Figure 1 shows the rear view of the splitter. [Figure 4] FIG. 2 is a perspective view showing a support block and a slide block; [Diagram 5] A longitudinal section showing the support block and the slide block; [Figure 6] A cross-sectional view taken along line AA in FIG. 5 ; [Figure 7] 1A and 1B are explanatory diagrams showing how electronic components are separated from an electronic component board; [Figure 8] FIG. 1 is an explanatory diagram showing how electronic components are separated from an electronic component substrate; [Figure 9] 1A and 1B are plan views showing how electronic components are separated from an electronic component substrate; [Figure 10] 1A and 1B are a plan view and a cross-sectional view of a main portion of an electronic component board on which ultra-small electronic components are mounted. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Next, an embodiment of the present invention will be described with reference to the drawings. Figures 1 to 10 show a first embodiment of the present invention, in which the reference character S indicates an electronic component board dividing device and the reference character 1 indicates an electronic component board.

[0014] First, the electronic component board 1 will be described. As shown in Fig. 10(A), the electronic component board 1 has a plurality of ultra-small electronic components 3... mounted vertically and horizontally in a grid pattern on a ceramic board body 2. Around each electronic component 3, division processing grooves 4 (division width dimension W = 0.8 to 1.2 mm vertically, 0.8 to 1.2 mm horizontally)... are provided extending vertically and horizontally in a grid pattern. The division processing grooves 4 are provided on the top and bottom surfaces of the board body 2 as shown in Fig. 11(B). The thickness t of the electronic component board 1 is 0.2 to 0.5 mm.

[0015] The dividing device S is composed of a lower unit 10 and an upper unit 30, as shown in FIGS.

[0016] The lower unit 10 is provided with feet 12 supported on the floor G on the underside of a base frame 11, and a conveyor belt 14 driven by a motor 13 is provided on the upper part of the base frame 11. The conveyor belt 14 serves to convey the electronic component boards 1 one by one from the upstream side (the right side in FIG. 2) to the downstream side (the left side in FIG. 2). In the drawing, reference numeral 15 denotes a pulley that supports the conveyor belt 14 in a tensioned state.

[0017] A reaction force support plate 16 located directly below the conveyor belt 14 is supported by a bracket (not shown) on the upper part of the lower unit 10. A reaction force support surface 16a (see FIG. 7) is formed on the upper surface of the reaction force support plate 16 to support the reaction force generated when the electronic component board 1 is divided on the conveyor belt 14.

[0018] A support block 17 is disposed immediately below the conveyor belt 14 and in the vicinity of the downstream side of the reaction support plate 16. The support block 17 rotatably holds a small-diameter (diameter 1.0 mm to 3.0 mm) cylindrical (shaft-shaped) support roll 18 over its entire length, and is supported by the base frame 11 via a bracket 19.

[0019] As shown in Fig. 4, the support block 17 has both side portions 17A extending forward and backward and a central portion 17B extending left and right, and further has a taper block portion 17C on the upper surface of the central portion 17B. The upper portion of the taper block portion 17C is a taper portion 17c having a triangular cross section, and a groove portion 17a is provided at the top of the taper portion 17c, extending left and right (horizontally) leaving both ends. A cylindrical (shaft-shaped) support roll 18 is rotatably housed and held in the groove portion 17a, with its upper surface slightly protruding from the upper end of the groove portion 17a, as shown in Figs. 5 and 6.

[0020] The support roll 18 lifts up and supports the leading portion of the electronic component board 1 from below when dividing the electronic component board 1 transported downstream on the transport belt 14, and is set at a position where the upper end of the support roll 18 is slightly above the reaction force support surface 16a as shown in Fig. 7 (in the illustrated example, the height H from the reaction force support surface 16a to the upper end of the support roll 18 is 0.1 mm to 0.3 mm). Here, the leading portion of the electronic component board 1 includes the peripheral portion 1A of the electronic component board 1 shown in Fig. 10(A), the electronic component rows U1 to Un shown in Fig. 9(A), and the electronic component 3 shown in Fig. 9(B). The length dimension of the support roll 18 is set to be larger than the lateral width dimension of the electronic component board 1.

[0021] The support roll 18 works in cooperation with the pressure roll 36 located immediately above the conveyor belt 14 to separate the leading portion of the electronic component board 1, but because the support roll 18 is rotatably held over its entire length in groove portion 17a at the top of tapered portion 17c of support block 17, bending during separation is suppressed and the pressing force of the pressure roll 36 is uniformly supported, ensuring separation of the electronic component board 1. A storage section 20 that stores the leading portion separated from the electronic component board 1 is located downstream of the conveyor belt 14.

[0022] The driving force from the motor 13 is transmitted to the conveyor belt 14, and is also transmitted via the transmission belt 21 from the synchronous gear 22 to the feed belt 36 of the upper unit 30. The feed belt 37 and the conveyor belt 14 drive synchronously, so that the upper feed belt 37 holds down the electronic component board 1 on the conveyor belt 14 while conveying it to the division position.

[0023] In the upper unit 30, a motor 32 for vertical movement and an air cylinder 33 are supported on an upper frame 31. A slide block 34 is supported at the lower end of the air cylinder 33, and the slide block 34 is supported so as to be slidable in the vertical direction by guide portions 35, 35 arranged on both sides of the air cylinder 33. The motor 32 determines the height of the slide block 34 and the pressing roll 36, and the air cylinder 33 supports the reaction force acting on the pressing roll 36 when the electronic component board 1 is divided by the pressing roll 36.

[0024] 4, the slide block 34 has both side portions 34A extending vertically, and upper and lower connecting portions 34B and 34C extending horizontally, with a taper block 34D provided on the underside of the lower connecting portion 34C. The taper block 34D is made up of a central taper block portion 34D1 and left and right side taper block portions 34D2, with the lower portion of each of the taper block portions 34D1-34D2 being a taper portion 34d having a triangular cross section with its apex facing downward, and a groove portion 34a is provided at the apex from the taper portion of the central taper block portion 34D1 to the taper portions of the left and right side taper block portions 34D2, leaving both ends uncovered.

[0025] In the groove 34a, a small-diameter (diameter 1.0 mm to 3.0 mm) cylindrical (shaft-shaped) pressing roll 36 is rotatably held with its lower surface slightly protruding from the lower end of the groove 34a, as shown in Fig. 6. In the inner end surfaces of the groove 34a of the left and right side taper block portions 34D2, as shown in Fig. 5, shaft holes 34b for supporting the cylindrical (shaft-shaped) pressing roll 36 are provided, and the pressing roll 36 is supported at both ends by the left and right shaft holes 34b while housed in the downward groove 34a, so that the housed state is maintained.

[0026] The pressing roll 36 presses the position of the division processing groove 4 of the electronic component board 1 conveyed downstream on the conveyor belt 14 from above, and the length dimension of the pressing roll 36 is set to be larger than the lateral width dimension of the electronic component board 1. The horizontal distance (center axis distance) between the pressing roll 36 and the support roll 18 is set to be larger than the division width dimension (W X , W Y ) and thickness t of electronic component board 1, but the horizontal distance can be adjusted by adjusting the position of support block 17 with a servo motor (not shown). Pressing rolls 36, together with support rolls 18, are prepared in sizes within the above-mentioned range of values, for example, with diameters (roll diameters) of 1.2 mm, 1.6 mm, and 2.0 mm, and the combination is determined based on thickness t of electronic component board 1 and size of electronic component 3.

[0027] The pressing roll 36 works in cooperation with the support roll 18 located directly below the conveyor belt 14 to divide the leading portion of the electronic component board 1. Since the pressing roll 36 is rotatably held over its entire length within groove portion 34a formed in the tip portion (top) of tapered portion 34d of tapered block 34D that is integral with slide block 34, deflection of the pressing roll 36 during division is suppressed and the pressing force of the pressing roll 36 acts uniformly on the division processing groove 4 of the electronic component board 1, ensuring division of the electronic component board 1.

[0028] Next, a method for dividing the electronic component board 1 into individual ultra-small electronic components 3 using the dividing apparatus S having the above configuration will be described.

[0029] First, the combination of the pressing roll 36 and the support roll 18 is determined according to the thickness t of the electronic component board 1 and the size of the electronic board 3 to be mounted, and the height and horizontal positions of the pressing roll 36 and the support roll 18 are adjusted. Next, the electronic component board 1 is placed on the conveyor belt 14, and the motor 13 is driven to convey the electronic component board 1 on the conveyor belt 14 downstream. As shown in Figures 7(A) and (B), the leading portion fp of the electronic component board 1 conveyed on the conveyor belt 14, i.e., the peripheral portion 1A of the electronic component board 1, passes under the underside of the pressing roll 36 and attempts to get over just above the support roll 18 ahead.

[0030] At this time, the upper end of the support roll 18 is positioned a predetermined height H above the reaction force support surface 16a, the pressure roll 36 presses the dividing groove 4 position of the peripheral portion 1A from above, and an upward bending force starting from the dividing groove 4 acts strongly on the leading portion fp (peripheral portion 1A), so that the leading portion fp is easily separated from the electronic component board 1, as shown in Figure 8.

[0031] Next, when the first row of electronic components U1 located at the front passes under the underside of the press roll 36 and attempts to get over just above the support roll 18 beyond, a strong upward bending force starting from the dividing processing groove 4 acts on the leading electronic component row U1 due to the cooperation of the support roll 18 and the press roll 36, so that the electronic component row U1 is easily separated from the electronic component board 1.

[0032] Similarly, when the next second row of electronic components U2 passes directly above the support roll 18, a strong upward bending force originating from the next dividing groove 4 acts on the row of electronic components U2, so that the row of electronic components U2 is easily separated from the main body of the electronic component board 1. In this way, as shown in FIG 9(A), all of the rows of electronic components U1 to Un of electronic component board 1 are successively divided, transported downstream, and stored in storage section 20.

[0033] Next, the individual electronic component rows U1-Un accommodated in the accommodation section 20 are transferred to the upstream side of the conveyor belt 14, and as shown in FIG. 9(B), the orientation of each electronic component row U1-Un is changed by 90 degrees, and one or more electronic components are placed on the conveyor belt 14 at a time. Then, the motor 13 is driven again to convey the individual electronic component rows U1-Un on the conveyor belt 14 downstream, and the individual electronic components 3... of the electronic component row U1-Un on the conveyor belt 14 are separated one by one starting from the leading electronic component 3. That is, when the leading electronic component 3 passes under the lower surface of the pressing roll 36 and attempts to get over just above the support roll 18 ahead, an upward bending force originating from the dividing groove 4 immediately behind acts strongly on the leading electronic component 3, and the electronic component 3 is separated from each main body of the electronic component row U1....

[0034] In this manner, by using dividing device S, electronic component board 1 can be easily divided into individual electronic component rows U1 to Un, and each of electronic component rows U1 to Un can be further easily divided into individual electronic components 3....

[0035] The dividing device S of this embodiment can divide an electronic component board mounted with ultra-small electronic components with a side length of 2 mm or less, or even 1 mm or less, into individual ultra-small electronic components. In the dividing device S of this embodiment, the support roll 18 directly below the conveyor belt 14 cooperates with the pressing roll 36 located directly above the conveyor belt 14 to divide the leading portion fp of the electronic component board 1.

[0036] That is, in the dividing device S of the present embodiment, when dividing the electronic component board 1, the long support roll 18 directly below the conveyor belt 14 is rotatably held over its entire length in the groove 17a at the top of the tapered portion 17c of the support block 17, so that deflection of the support roll 18 during division is suppressed and the pressing force of the pressing roll 36 is uniformly supported over its entire length, and the long pressing roll 36 directly above the conveyor belt 14 is rotatably held over its entire length in the groove 34a formed at the tip of the tapered portion 34c of the tapered block 34D that is integral with the slide block 34, so that deflection of the pressing roll 36 during division is suppressed and the pressing force of the pressing roll 36 acts uniformly on the division processing groove 4 of the electronic component board 1, and the cooperative action of both rolls 18, 36 ensures the division of the electronic component board 1.

[0037] According to the dividing device S of this embodiment, it is possible to simultaneously reduce the diameters of the support roll 18 and the pressure roll 36 and narrow the gap between the two rolls in the up-down and front-to-back directions, so that electronic component substrates can be divided efficiently for ultra-small electronic components with one side of 2 mm or less, and even for ultra-small electronic components with one side of 1 mm or less.

[0038] In the present embodiment, the dividing device S transfers the divided rows of electronic components U1 to Un upstream and then transports them again downstream on the conveyor belt 14 to divide them into individual electronic components 3; however, a second conveyor belt may be disposed downstream of the conveyor belt 14, and the divided rows of electronic components U1 to Un may be rotated 90 degrees by a robot arm and transferred to the second conveyor belt, and then divided into individual electronic components 3 on the second conveyor belt by the dividing mechanism of the dividing device S (reaction force support surface 16a, support roll 18, pressure roll 36, etc.).

[0039] Thus, according to the dividing device for electronic component boards of the present invention, electronic component boards can be efficiently divided into ultra-small electronic components with one side measuring 2 mm or less. [Industrial Applicability]

[0040] The present invention can be used as an apparatus for dividing an electronic component board on which a plurality of electronic components are mounted into individual electronic components. [Explanation of symbols]

[0041] 1 Electronic component board 1A Periphery of the board 2. Board body 3. Electronic Components 4-divided groove 10 Lower unit 11 Base frame 12 Foot 13,32 Motor 14 Conveyor belt 15 Pulley 16 Reaction support plate 16a Reaction support surface 17 Support Block 17A, 34A Side 17B Central part 17C, 34D Taper block part 17c,34d Tapered section 17a,34a Groove 18 Support roll 20 Storage unit 21 Transmission Belt 22 Synchronous gear 30 Upper Unit 31 Upper Frame 33 Air Cylinder 34 Slide Block 34B Upper connection part 34C Lower connection part 34D1 Central taper block 34D2 Side taper block 34b Shaft hole 35 Guide section 36 Press roll 37 Feed belt fp start part t Board thickness H Height from the reaction support surface to the top of the support roll U1~Un Electronic component row W: Board division width dimension

Claims

1. A dividing device for dividing an electronic component substrate along dividing grooves on which a plurality of ultra-small electronic components each having a side of 2 mm or less are mounted in a lattice pattern and on which dividing grooves are formed in the vertical and horizontal directions, comprising: a conveyor belt along which the electronic component board is conveyed; a reaction force support surface that receives a reaction force when the electronic component substrate is separated is disposed immediately below the conveyor belt, and a small-diameter cylindrical support roll that supports the electronic component substrate by pushing up a leading portion of the electronic component substrate from below the conveyor belt is disposed near the downstream side of the reaction force support surface; The support roll is held laterally and rotatably in a groove provided at the top of a tapered block protruding upward from a support block arranged immediately below the conveyor belt, a small-diameter cylindrical pressing roll is disposed immediately above the conveyor belt, the small-diameter cylindrical pressing roll pressing from above the vicinity of the position of the division processing groove of the leading portion of the electronic component board while the leading portion of the electronic component board is pushed up by the support roll; The pressing roll is held horizontally and rotatably in a groove provided at the top of a taper block that protrudes downward from a slide block that is positioned directly above the conveyor belt and can slide up and down.

2. 2. The device for dividing an electronic component board according to claim 1, wherein shaft holes for supporting the ends of the pressing roll are provided at both ends within a groove provided at the top of a taper block protruding downward from the slide block.

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