Inspection equipment, change kit, and change kit replacement method

JP7638682B2Active Publication Date: 2025-03-04TOKYO ELECTRON LTD
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Patent Information

Application Number
JP2020197194
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2020-11-27
Publication Date
2025-03-04
Estimated Expiration
2040-11-27

AI Technical Summary

Benefits of technology

【0006】 本開示によれば、矩形基板と円形基板の両方の基板を検査できる。

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Abstract

To provide a technology that can inspect both rectangular and circular substrates.SOLUTION: An inspection equipment according to one aspect of the present disclosure is an inspection equipment having a change kit that can be replaced, the change kit has a first holding section and a second holding section that can be interchangeably mounted within the inspection equipment, the first holding section is configured to absorb and hold a rectangular substrate, the second holding section is configured to absorb and hold a circular substrate, and the first holding section and second holding section are replaced according to the substrate to be inspected.SELECTED DRAWING: Figure 3
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Description

[Technical field]

[0001] The present disclosure relates to an inspection device, a change kit, and a change kit replacement method. [Background technology]

[0002] There is known a stage having a substrate holding surface that adsorbs and holds the bottom surface of a substrate, and in which a suction groove divided into multiple regions is provided on the substrate holding surface for adsorbing the substrate (see, for example, Patent Document 1). In Patent Document 1, after a portion of the substrate is adsorbed in at least one of the multiple regions, another portion of the substrate is adsorbed in a region adjacent to the first region, and this process is repeated, so that the entire substrate is adsorbed and held on the stage. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-197707 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides techniques capable of inspecting both rectangular and circular substrates. [Means for solving the problem]

[0005] An inspection apparatus according to one aspect of the present disclosure is an inspection apparatus having a replaceable change kit, the change kit having a first holding section and a second holding section that are replaceably attached within the inspection apparatus, the first holding section being configured to be capable of adsorbing and holding a rectangular substrate, and the second holding section being configured to be capable of adsorbing and holding a circular substrate; The inspection device is provided with insertion holes for attaching the first holding part and the second holding part, the first holding part includes a first suction holding part which adsorbs and holds the rectangular substrate on its upper surface, and a first insertion pin which extends downward from the center of the lower surface of the first suction holding part and can be inserted into the insertion hole, and the second holding part includes a second suction holding part which adsorbs and holds the circular substrate on its upper surface, and a second insertion pin which extends downward from the center of the lower surface of the second suction holding part and can be inserted into the insertion hole, The first holder and the second holder are replaced depending on the substrate to be inspected. Effect of the Invention

[0006] The present disclosure allows for inspection of both rectangular and circular substrates. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a diagram showing an example of an inspection apparatus according to an embodiment; [Diagram 2] Plan view of the inspection device of FIG. [Diagram 3] FIG. 1 is a schematic plan view showing an example of a rectangular substrate holding mechanism; [Figure 4] Schematic cross-sectional view showing an example of a rectangular substrate holding mechanism [Diagram 5] FIG. 13 is a diagram showing an example of a handle of a rectangular substrate holding mechanism. [Figure 6] FIG. 13 is a diagram showing an example of a shaft of a rectangular substrate holding mechanism. [Figure 7] Diagram for explaining shaft positioning [Figure 8] A block diagram showing an example of a connector for a rectangular substrate holding mechanism. [Figure 9] FIG. 1 is a schematic plan view showing an example of a circular substrate holding mechanism. [Figure 10] Block diagram showing an example of a connector for a circular substrate holding mechanism [Figure 11] FIG. 13 is a diagram showing an example of a transport mechanism to which a pick for rectangular substrates is attached. [Figure 12] FIG. 13 is a diagram showing an example of a transport mechanism before a pick for rectangular substrates is attached. [Figure 13] FIG. 13 is a diagram showing an example of a transport mechanism to which a pick for a circular substrate is attached. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all of the accompanying drawings, the same or corresponding members or parts are designated by the same or corresponding reference numerals, and duplicated descriptions will be omitted.

[0009] [Inspection equipment] An example of an inspection apparatus according to an embodiment will be described with reference to FIGS.

[0010] The inspection apparatus 1 is an apparatus capable of inspecting both rectangular and circular substrates W. The inspection apparatus 1 has a loader unit 10, an inspection unit 20, and an apparatus controller 30. Under the control of the apparatus controller 30, the inspection apparatus 1 transports the substrate W to be inspected from the loader unit 10 to the inspection unit 20, and inspects various electrical characteristics by applying electrical signals to a device under test (DUT) formed on the substrate W. The substrate W may be, for example, a rectangular substrate or a circular substrate. An example of a rectangular substrate is a panel level package (PLP). An example of a circular substrate is a semiconductor wafer.

[0011] The loader section 10 has a load port 11, an aligner 12, and a substrate transport mechanism 13. The load port 11 places a cassette C containing a substrate W therein. The aligner 12 aligns the substrate W. The substrate transport mechanism 13 transports the substrate W between the cassette C placed on the load port 11, the aligner 12, and a mounting table 21 described below. In the loader section 10, first, the substrate transport mechanism 13 transports the substrate W contained in the cassette C to the aligner 12. Next, the aligner 12 aligns the substrate W. Next, the substrate transport mechanism 13 transports the aligned substrate W from the aligner 12 to the mounting table 21 provided in the inspection section 20.

[0012] The inspection unit 20 is disposed adjacent to the loader unit 10. The inspection unit 20 includes a mounting table 21, a lifting mechanism 22, an XY stage 23, a probe card 24, and an alignment mechanism 25.

[0013] The mounting table 21 has a mounting surface. The mounting table 21 mounts the substrate W on the mounting surface. The mounting table 21 includes, for example, a vacuum chuck.

[0014] The lifting mechanism 22 is provided below the mounting table 21, and raises and lowers the mounting table 21 relative to the XY stage 23. The lifting mechanism 22 includes, for example, a stepping motor.

[0015] The XY stage 23 is provided below the lifting mechanism 22 and moves the mounting table 21 and the lifting mechanism 22 in two axial directions (X and Y directions in the figure). The XY stage 23 is fixed to the bottom of the inspection unit 20. The XY stage 23 includes, for example, a stepping motor.

[0016] The probe card 24 is disposed above the mounting table 21. A plurality of probes 24a are formed on the side of the probe card 24 facing the mounting table 21. The probe card 24 is detachably attached to a head plate 24b. A tester (not shown) is connected to the probe card 24 via a test head T.

[0017] The alignment mechanism 25 includes a camera 25a, a guide rail 25b, and an alignment bridge 25c. The camera 25a is attached facing downward in the center of the alignment bridge 25c, and captures images of the mounting table 21, the substrate W, and the like. The camera 25a is, for example, a CCD camera or a CMOS camera. The guide rail 25b supports the alignment bridge 25c so that it can move in the horizontal direction (Y direction in the figure). The alignment bridge 25c is supported by a pair of left and right guide rails 25b, and moves in the horizontal direction (Y direction in the figure) along the guide rails 25b. As a result, the camera 25a moves between a standby position and directly below the center of the probe card 24 (hereinafter referred to as the "probe center") via the alignment bridge 25c. During alignment, the camera 25a located at the probe center captures images of the electrode pads of the substrate W on the mounting table 21 from above while the mounting table 21 moves in the XY directions, processes the images, and displays the captured images on the display device 40.

[0018] In the inspection section 20, first, the alignment mechanism 25 aligns the electrode pads of the device to be inspected formed on the substrate W on the mounting table 21 with the multiple probes 24a of the probe card 24. Next, the lifting mechanism 22 raises the mounting table 21 to bring the multiple probes 24a of the probe card 24 into contact with the corresponding electrode pads. Next, the equipment controller 30 applies a test signal from the tester to the device to be inspected formed on the substrate W via the test head T and the multiple probes 24a of the probe card 24, thereby inspecting the electrical characteristics of the device to be inspected.

[0019] The equipment controller 30 is provided below the mounting table 21, and controls the overall operation of the inspection equipment 1. A CPU provided in the equipment controller 30 executes a desired inspection according to the product parameters stored in a memory such as a ROM or RAM. The product parameters may be stored in a hard disk or a semiconductor memory other than a ROM or RAM. The product parameters may be recorded on a computer-readable recording medium such as a CD-ROM or DVD, which is inserted into a predetermined position and read out.

[0020] [Change kit] An example of a change kit replaceably attached to the inspection device 1 of the embodiment will be described. The change kit includes a rectangular substrate holding mechanism and a pick for rectangular substrate used when inspecting a rectangular substrate, and a circular substrate holding mechanism and a pick for circular substrate used when inspecting a circular substrate. In the inspection device 1 of the embodiment, when inspecting a rectangular substrate, a rectangular substrate holding mechanism is attached as the mounting table 21, and a pick for rectangular substrate is attached as the pick of the substrate transport mechanism 13. In addition, in the inspection device 1 of the embodiment, when inspecting a circular substrate, a circular substrate holding mechanism is attached as the mounting table 21, and a pick for circular substrate is attached as the pick of the substrate transport mechanism 13. Below, an example of the rectangular substrate holding mechanism, the circular substrate holding mechanism, the pick for rectangular substrate, and the pick for circular substrate will be described.

[0021] (Rectangular board holding mechanism) An example of a rectangular substrate holding mechanism of an embodiment will be described with reference to Figures 3 to 8. Figure 3 is a schematic plan view showing an example of a rectangular substrate holding mechanism of an embodiment. Figure 4 is a schematic cross-sectional view showing an example of a rectangular substrate holding mechanism of an embodiment, showing a cross-section taken along dashed dotted line IV-IV in Figure 3. Note that Figure 3 shows a state in which the rectangular substrate holding mechanism is not holding a substrate, and Figure 4 shows a state in which the rectangular substrate holding mechanism is holding a substrate.

[0022] The rectangular substrate holding mechanism 100 is configured to be able to hold the rectangular substrate W1. The rectangular substrate holding mechanism 100 has a mounting table 110, a plurality of holders 120, a protrusion 130, a lifting mechanism 140, a horizontal movement mechanism 150, a handle 160, a shaft 170, and a connector 180.

[0023] The mounting table 110 has a rectangular mounting surface 111. The mounting table 110 mounts the rectangular substrate W1 on the mounting surface 111. The mounting table 110 includes, for example, a vacuum chuck. The mounting table 110 is raised and lowered by a lifting mechanism 22 connected to the lower portion.

[0024] The multiple holding parts 120 are provided corresponding to the four sides of the placement surface 111. The multiple holding parts 120 include holding parts 120a to 120e. The holding parts 120a and 120c are provided corresponding to one of the two opposing sides of the placement surface 111. The holding parts 120a and 120c are arranged opposite each other across the placement surface 111. The holding parts 120b, 120d, and 120e are provided corresponding to the other of the two opposing sides of the placement surface 111. The holding parts 120b and the holding parts 120d and 120e are arranged opposite each other across the placement surface 111. The holding parts 120a to 120e have a substantially rectangular shape whose longitudinal direction is parallel to the sides of the placement surface 111. The holding parts 120a to 120c each have a longitudinal length that is substantially the same as one side of the placement surface 111. The holding parts 120d and 120e each have a longitudinal length that is approximately ⅓ of one side of the mounting surface 111. The holding part 120d is provided at one end side of one side of the mounting surface 111, and the holding part 120e is provided at the other end side of the one side of the mounting surface 111. As a result, a gap D is formed between the holding parts 120d and 120e, and a transport arm (not shown) is inserted above the mounting table 110 through the gap D. Each of the holding parts 120a to 120e includes an upper surface 121, a lower surface 122, and a wall part 123. The upper surface 121 holds the lower surface of the peripheral part of the substrate W. The lower surface 122 presses down the upper surface of the peripheral part of the substrate W placed on the mounting table 110. The wall portion 123 extends upward from the upper surface 121 and is configured to be able to come into contact with the edge surface of the substrate W held on the upper surface 121 .

[0025] The protrusions 130 protrude from the lower surface of each of the holders 120a to 120e and come into contact with the edge surface of the substrate W placed on the mounting table 110 to correct the position of the substrate W. The protrusions 130 have, for example, a rod shape. Two protrusions 130 are provided symmetrically with respect to the center in the longitudinal direction of each of the holders 120a to 120c. Furthermore, the protrusions 130 are provided approximately at the center in the longitudinal direction of each of the holders 120d, 120e. However, the number of the protrusions 130 is just an example and is not limited thereto. Furthermore, the protrusions 130 may have, for example, a plate shape extending along the longitudinal direction of each of the holders 120a to 120e.

[0026] The lifting mechanism 140 is fixed to the outer peripheral wall of the mounting table 110. The lifting mechanism 140 raises and lowers the multiple holders 120 relative to the mounting table 110. The lifting mechanism 140 may be, for example, a guided cylinder.

[0027] The horizontal movement mechanism 150 is attached to the lifting mechanism 140 so as to be able to move up and down freely. The horizontal movement mechanism 150 horizontally moves the multiple holders 120 between a closed position and an open position. The closed position is a position where the lower surface of the peripheral portion of the substrate W is held or the upper surface of the peripheral portion of the substrate W is pressed down, and is a position where the multiple holders 120 are closer to the mounting table 110. The open position is a position farther outward from the mounting table 110 than the closed position. The horizontal movement mechanism 150 may be, for example, a rotary actuator.

[0028] The handles 160 are detachably attached to two opposing side walls 112 of the mounting table 110 by fastening members such as screws. An operator can attach and detach the rectangular substrate holding mechanism 100 while holding the handles 160, improving workability. The handles 160 are removed, for example, when inspecting the rectangular substrate W1 in the inspection device 1. Therefore, to prevent an operator from forgetting to remove the handles 160 from the rectangular substrate holding mechanism 100, it is preferable to provide an identification portion 161 in a position that is easily visible to the operator.

[0029] The identification portion 161 is preferably provided in a location that is easily visible to an operator, for example, on the upper surface of the handle 160. The identification portion 161 may be, for example, a display in a color different from that of the rectangular substrate holding mechanism 100, or letters indicating that it is a jig. In the example of Fig. 5, the identification portion 161 includes a yellow label affixed to the upper surface of the handle 160 and the word "FIXTURE" written in black on the label.

[0030] The shaft 170 is attached to the center of the lower surface 113 of the mounting table 110. The shaft 170 includes a base 171 and an insertion pin 172.

[0031] The base 171 is formed with a plurality of (for example, four) insertion holes 171a into which the shafts of the screws 173 can be inserted (FIG. 7). Each of the insertion holes 171a has an inner diameter slightly larger than the shafts of the screws 173. The base 171 is fixed to the lower surface 113 of the mounting table 110 by the screws 173 inserted into the insertion holes 171a.

[0032] The insertion pin 172 has a generally rod-like shape, and is formed so as to be insertable into an insertion hole (not shown) formed in the upper surface of the lifting mechanism 22. By inserting the insertion pin 172 into the insertion hole and turning on a suction means (not shown), the rectangular substrate holding mechanism 100 is adsorbed and fixed to the lifting mechanism 22.

[0033] When attaching the shaft 170 to the lower surface 113 of the mounting table 110, it is preferable to use a centering jig 190, as shown in FIG. 7 for example. The centering jig 190 includes a small diameter portion 191, a tapered portion 192, and a large diameter portion 193. The small diameter portion 191 is smaller than the insertion hole 171a formed in the base 171 and has approximately the same outer diameter as the screw hole 114 formed in the lower surface 113 of the mounting table 110. The tapered portion 192 is a portion between the small diameter portion 191 and the large diameter portion 193, and has an outer diameter that tapers from the outer diameter of the small diameter portion 191 to the outer diameter of the large diameter portion 193. The large diameter portion 193 has an outer diameter larger than the insertion hole 171a of the base 171. When attaching the shaft 170 to the lower surface 113 of the mounting table 110, the small diameter portions 191 of the centering jig 190 are inserted into the two insertion holes 171a that face each other with the plug pin 172 in between, and the centering jig 190 is screwed in until the tapered portion 192 stops moving. Then, with the centering jig 190 screwed in, screws 173 are inserted into the two insertion holes 171a through which the centering jig 190 is not inserted, and the screws 173 are fastened to the screw holes 114 formed in the lower surface 113 of the mounting table 110. Next, the centering jig 190 is removed, and the screws 173 are inserted into the two insertion holes 171a from which the centering jig 190 was removed, and the screws 173 are fastened to the screw holes 114 formed in the lower surface 113 of the mounting table 110. As a result, the shaft 170 is attached to the center of the lower surface 113 of the mounting table 110 with high precision. As a result, when replacing the circular substrate holding mechanism 200 with the rectangular substrate holding mechanism 100, deviation of the center position of the rectangular substrate holding mechanism 100 can be suppressed.

[0034] The connector 180 collects various tubes, cables, etc. used in the rectangular substrate holding mechanism 100 (FIG. 8). When replacing the circular substrate holding mechanism 200 with the rectangular substrate holding mechanism 100, the connector 180 on the rectangular substrate holding mechanism 100 side is connected to a connector (not shown) on the inspection device 1 side, thereby connecting various tubes, cables, etc. to each other. The connector 180 includes, for example, a vacuum tube L11, an air tube L12, a signal cable L13, a fiber cable L14, a heater cable L15, and a temperature sensor cable L16. The connector 180 may also include a recognition terminal L17 for causing the device controller 30 to recognize that the rectangular substrate holding mechanism 100 has been attached to the inspection device 1. The connectors 180 do not need to be collected into one, and may be configured to be collected according to function.

[0035] (Circular substrate holding mechanism) An example of a circular substrate holding mechanism according to an embodiment will be described with reference to Figures 9 and 10. Figure 9 is a schematic plan view showing an example of a circular substrate holding mechanism according to an embodiment.

[0036] The circular substrate holding mechanism 200 is configured to be able to hold the circular substrate W2. The circular substrate holding mechanism 200 includes a mounting table 210, a shaft 270, and a connector 280.

[0037] The mounting table 210 has a circular mounting surface 211. The mounting table 210 mounts the circular substrate W2 on the mounting surface 211. The mounting table 210 includes, for example, a vacuum chuck. The mounting table 210 is raised and lowered by a lifting mechanism 22 connected to the lower portion.

[0038] The shaft 270 is attached to the center of the lower surface of the mounting table 210. The shaft 270 may have the same configuration as the shaft 170 in the rectangular substrate holding mechanism 100 described above.

[0039] The connector 280 collects various tubes, cables, etc. used in the circular substrate holding mechanism 200 (FIG. 10). When replacing the rectangular substrate holding mechanism 100 with the circular substrate holding mechanism 200, the connector 280 on the circular substrate holding mechanism 200 side is connected to a connector (not shown) on the inspection apparatus 1 side, thereby connecting the various tubes, cables, etc. to each other. The connector 280 includes, for example, a vacuum tube L21, a heater cable L22, and a temperature sensor cable L23. The connector 280 may also include a recognition terminal L24 for causing the equipment controller 30 to recognize that the circular substrate holding mechanism 200 has been attached to the inspection apparatus 1.

[0040] (Pick for rectangular boards) An example of a pick for rectangular substrates will be described with reference to Figures 11 and 12. Figure 11 is a diagram showing an example of a transport mechanism to which a pick for rectangular substrates is attached. Figure 12 is a diagram showing an example of a transport mechanism before a pick for rectangular substrates is attached.

[0041] The pick 300 for rectangular substrates is configured to be able to deliver the rectangular substrate W1 to and from the rectangular substrate holding mechanism 100. The pick 300 for rectangular substrates has a tip portion 310 and a base end portion 320.

[0042] The tip portion 310 has a substantially U-shape. A plurality of (for example, four) vacuum suction pads 311 are provided on the upper surface of the tip portion 310. The vacuum suction pads 311 hold the rectangular substrate W1 by vacuum suction.

[0043] The base end 320 is detachably attached to the arm 14 of the substrate transport mechanism 13. The base end 320 includes a positioning portion 321. When the pick 300 for rectangular substrates is attached to the arm 14, the positioning portion 321 of the base end 320 is attached to the arm 14 according to a reference, thereby simplifying the adjustment work when replacing the pick 400 for circular substrates with the pick 300 for rectangular substrates.

[0044] 11 and 12, the arm 14 includes a seating surface 14a, a first positioning surface 14b, and a second positioning surface 14c. The positioning portion 321 of the base end portion 320 includes a placement surface 321a, a pressing surface 321b, and a positioning surface 321c. When the pick 300 for rectangular substrates is attached to the arm 14, the placement surface 321a is placed on the seating surface 14a, the pressing surface 321b is pressed against the first positioning surface 14b, and the positioning surface 321c is made flush with the second positioning surface 14c.

[0045] 11 shows a case where one tip portion 310 is attached to the base end portion 320, but is not limited thereto. For example, two or more tip portions 310 may be attached to the base end portion 320 in multiple stages. This allows multiple rectangular substrates W1 to be transported simultaneously.

[0046] (Pick for circular boards) An example of a pick for circular substrates will be described with reference to Fig. 13. Fig. 13 is a diagram showing an example of a transport mechanism to which a pick for circular substrates is attached.

[0047] The circular substrate pick 400 is configured to be able to deliver the circular substrate W2 to and from the circular substrate holding mechanism 200. The circular substrate pick 400 has a tip end 410 and a base end 420.

[0048] The tip portion 410 has a substantially U-shape. A plurality of (for example, three) vacuum suction pads 411 are provided on the upper surface of the tip portion 410. The vacuum suction pads 411 hold the circular substrate W2 by vacuum suction.

[0049] The base end 420 may have the same configuration as the base end 320 of the pick 300 for rectangular substrates.

[0050] 13 shows a case where one tip portion 410 is attached to the base end portion 420, but is not limited thereto. For example, two or more tip portions 410 may be attached to the base end portion 420 in multiple stages. This allows multiple circular substrates W2 to be transported simultaneously.

[0051] In the above embodiment, rectangular substrate holding mechanism 100 is an example of a first holding unit, mounting table 110 is an example of a first suction holding unit, and shaft 170 is an example of a first plug-in pin. Also, circular substrate holding mechanism 200 is an example of a second holding unit, mounting table 210 is an example of a second suction holding unit, and shaft 270 is an example of a second plug-in pin. Also, rectangular substrate pick 300 is an example of a first transport unit, and circular substrate pick 400 is an example of a second transport unit.

[0052] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0053] 1. Inspection equipment 100 Rectangular board holding mechanism 200 Circular substrate holding mechanism W1 Rectangular board W2 Circular board

Claims

1. A testing device having a replaceable change kit, the change kit has a first holding part and a second holding part that are replaceably attached within the inspection device; the first holding portion is configured to be able to hold a rectangular substrate by suction, the second holding portion is configured to be able to hold a circular substrate by suction, The inspection device has insertion holes for attaching the first holding portion and the second holding portion, The first holding portion includes: a first suction holding unit that suctions and holds the rectangular substrate on an upper surface thereof; a first insertion pin extending downward from a center of a lower surface of the first suction holding portion and capable of being inserted into the insertion hole; Including, The second holding portion includes: a second suction holding unit that suctions and holds the circular substrate on an upper surface thereof; a second insertion pin extending downward from a center of a lower surface of the second suction holding portion and capable of being inserted into the insertion hole; Including, The first holding part and the second holding part are replaced depending on the substrate to be inspected. Inspection equipment.

2. The first holding portion includes: a pressing section that presses down an end of the rectangular substrate held by the first suction holding section toward the first suction holding section; The inspection apparatus of claim 1 .

3. The change kit further includes a first conveying unit and a second conveying unit that are replaceably mounted in the inspection device; the first transport unit is configured to be able to deliver the rectangular substrate to and from the first holding unit, the second transport unit is configured to be able to deliver the circular substrate to and from the second holding unit, The first transport unit and the second transport unit are replaced depending on the substrate to be inspected.

3. The inspection device according to claim 1 or 2.

4. A change kit that is replaceably attached to an inspection device, a first holding portion and a second holding portion that are replaceably mounted in the inspection device; the first holding portion is configured to be able to hold a rectangular substrate by suction, the second holding portion is configured to be able to hold a circular substrate by suction, The inspection device has insertion holes for attaching the first holding portion and the second holding portion, The first holding portion includes: a first suction holding unit that suctions and holds the rectangular substrate on an upper surface thereof; a first insertion pin extending downward from a center of a lower surface of the first suction holding portion and capable of being inserted into the insertion hole; Including, The second holding portion includes: a second suction holding unit that suctions and holds the circular substrate on an upper surface thereof; a second insertion pin extending downward from a center of a lower surface of the second suction holding portion and capable of being inserted into the insertion hole; Including, The first holding part and the second holding part are replaced depending on the substrate to be inspected. Change kit.

5. A method for replacing a change kit replaceably attached to an inspection device, comprising the steps of: The change kit comprises: a first holding portion and a second holding portion that are replaceably mounted in the inspection device; the first holding portion is configured to be able to hold a rectangular substrate by suction, the second holding portion is configured to be able to hold a circular substrate by suction, The inspection device has insertion holes for attaching the first holding portion and the second holding portion, The first holding portion includes: a first suction holding unit that suctions and holds the rectangular substrate on an upper surface thereof; a first insertion pin extending downward from a center of a lower surface of the first suction holding portion and capable of being inserted into the insertion hole; Including, The second holding portion includes: a second suction holding unit that suctions and holds the circular substrate on an upper surface thereof; a second insertion pin extending downward from a center of a lower surface of the second suction holding portion and capable of being inserted into the insertion hole; Including, replacing the first holding part and the second holding part in accordance with the substrate to be inspected; How to replace the change kit.

Citation Information

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