Inspection device setup method and inspection device

Abstract

To provide a technique capable of automatically setting up an inspection device that inspects a substrate by bringing a probe into contact with an electrode pad formed on a chip on the substrate placed on a mounting table.SOLUTION: An inspection device setup method includes steps of acquiring a first image including a probe 24a of a probe card 24 attached to an inspection device 1, calculating first information including the center of gravity and angle of the probe card on the basis of probe information including the position of the probe calculated on the basis of the first image and probe information or pad information corresponding to the probe card prepared in advance, obtaining a second image including an electrode pad on the substrate W mounted on a mounting table 21, calculating second information including the center of gravity of the chip and the angle of the substrate on the basis of the pad information including the position of the electrode pad calculated on the basis of the second image and the pad information corresponding to the substrate prepared in advance, and outputting each piece of information.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to an inspection apparatus setup method and an inspection apparatus. [Background technology]

[0002] 2. Description of the Related Art A method for aligning needles of a probe card is known that enables initial alignment of the needles of a probe card to be performed automatically without manual work (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 6-349910 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides techniques that allow for automatic setup of an inspection device. [Means for solving the problem]

[0005] A setup method for an inspection apparatus according to one aspect of the present disclosure is a setup method for an inspection apparatus that inspects a substrate by contacting a probe with an electrode pad formed on a chip on a substrate placed on a mounting table, the setup method including the steps of: acquiring a first image including the probe of a probe card attached to the inspection apparatus; calculating first information including the center of gravity and angle of the probe card based on probe information including the position of the probe calculated based on the first image and probe information or pad information corresponding to the probe card prepared in advance; acquiring a second image including the electrode pads on the substrate placed on the mounting table; calculating second information including the center of gravity of the chip and the angle of the substrate based on pad information including the position of the electrode pad calculated based on the second image and pad information corresponding to the substrate prepared in advance; and outputting the first information and the second information. Effect of the Invention

[0006] According to the present disclosure, the inspection device can be set up automatically. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a diagram showing an example of an inspection apparatus according to an embodiment; [Diagram 2] Plan view of the inspection device of FIG. [Diagram 3] FIG. 1 is a diagram showing an example of the hardware configuration of an equipment controller. [Figure 4] 1 is a flowchart showing an example of a setup method for an inspection apparatus according to an embodiment. [Diagram 5] 1 is a flow chart showing an example of a process for setting up a probe card. [Figure 6] A diagram for explaining the process of setting up a probe card. [Figure 7] FIG. 13 is a diagram showing an example of an image output by a display device in a step of setting up a probe card. [Figure 8] 1 is a flow chart showing an example of a process for setting up a wafer. [Figure 9] FIG. 1 is a diagram for explaining a process for setting up a wafer. [Figure 10] FIG. 1 is a diagram for explaining a process for setting up a wafer. [Figure 11] FIG. 13 is a diagram showing an example of an image output by a display device in a process of setting up a wafer. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all of the accompanying drawings, the same or corresponding members or parts are designated by the same or corresponding reference numerals, and duplicated descriptions will be omitted.

[0009] [Inspection equipment] An example of an inspection apparatus according to an embodiment will be described with reference to Figs. 1 to 3. The inspection apparatus according to the embodiment is an apparatus that applies an electrical signal to each of a plurality of devices under test (DUTs) formed on a substrate to inspect various electrical characteristics. In the following, an example will be described in which the substrate is a semiconductor wafer (hereinafter simply referred to as a "wafer") and the devices under test are semiconductor chips (hereinafter simply referred to as "chips"). The semiconductor chips include electrode pads.

[0010] The inspection device 1 includes a loader unit 10, an inspection unit 20, and a controller 30.

[0011] The loader unit 10 has a load port 11, an aligner 12, and a substrate transfer mechanism 13. The load port 11 holds a cassette C containing a wafer W. The aligner 12 aligns the position of the wafer W. The substrate transfer mechanism 13 transfers the wafer W between the cassette C placed on the load port 11, the aligner 12, and a mounting table 21, which will be described later.

[0012] In the loader unit 10, first, the substrate transport mechanism 13 transports the wafer W accommodated in the cassette C to the aligner 12. Next, the aligner 12 aligns the wafer W. Next, the substrate transport mechanism 13 transports the wafer W aligned in the aligner 12 to a mounting table 21 provided in the inspection unit 20.

[0013] The inspection unit 20 is disposed adjacent to the loader unit 10. The inspection unit 20 includes a mounting table 21, a lifting and rotating mechanism 22, an XY stage 23, a probe card 24, and an alignment mechanism 25.

[0014] The mounting table 21 has a mounting surface 21a on which the wafer W is placed. The mounting table 21 is provided so as to be movable in the horizontal direction (X direction and Y direction) and the vertical direction (Z direction) and to be rotatable around a vertical axis (θ direction) relative to the bottom of the inspection unit 20. The mounting table 21 includes a vacuum chuck, and adsorbs and holds the wafer W placed on the mounting surface 21a.

[0015] The lifting and rotating mechanism 22 supports the mounting table 21 so as to be movable (liftable) in the vertical direction (Z direction) and rotatable around a vertical axis (θ direction). The lifting and rotating mechanism 22 includes, for example, a stepping motor.

[0016] The XY stage 23 supports the lifting and rotating mechanism 22 so as to be movable in horizontal directions (X and Y directions). The XY stage 23 moves the mounting table 21 supported by the lifting and rotating mechanism 22 in the horizontal direction via the lifting and rotating mechanism 22. The XY stage 23 includes, for example, a stepping motor.

[0017] The probe card 24 is disposed above the mounting table 21. A plurality of probes 24a are formed on the side of the probe card 24 facing the mounting table 21. The probe card 24 is detachably attached to a head plate 24b. A tester (not shown) is connected to the probe card 24 via a test head T.

[0018] The alignment mechanism 25 includes an upper camera 25a, a guide rail 25b, an alignment bridge 25c, and a lower camera 25d.

[0019] The upper camera 25a is attached facing downward in the center of the alignment bridge 25c and moves together with the alignment bridge 25c in the horizontal direction (Y direction). The upper camera 25a is provided to align the wafer W on the mounting table 21, and captures an image including the wafer W on the mounting table 21. The upper camera 25a is, for example, a CCD camera or a CMOS camera.

[0020] The guide rails 25b support the alignment bridge 25c so that the alignment bridge 25c is movable in the horizontal direction (Y direction).

[0021] The alignment bridge 25c is supported by a pair of left and right guide rails 25b, and moves in the horizontal direction (Y direction) along the guide rails 25b.

[0022] The lower camera 25d is attached facing upward to the side of the mounting table 21 and moves horizontally (X direction and Y direction) together with the mounting table 21. The lower camera 25d is provided to detect the positions of the multiple probes 24a formed on the probe card 24, and captures an image including the multiple probes 24a. The lower camera 25d is, for example, a CCD camera or a CMOS camera.

[0023] In the alignment mechanism 25, the upper camera 25a moves between a standby position and a position directly below the center of the probe card 24 (hereinafter referred to as the "probe center") via an alignment bridge 25c. During alignment, the upper camera 25a located at the probe center acquires an image including the electrode pads of each chip on the wafer W placed on the placement table 21 while the placement table 21 moves in the horizontal direction (X direction and Y direction), and outputs the acquired image to the controller 30. The lower camera 25d moves to the probe center via the placement table 21. During alignment, the lower camera 25d located at the probe center acquires an image including the multiple probes 24a formed on the probe card 24, and outputs the acquired image to the controller 30.

[0024] The controller 30 is provided below the mounting table 21, and controls the overall operation of the inspection device 1. The controller 30 also executes a setup method for the inspection device 1, which will be described later. As shown in Fig. 3, the controller 30 is a computer having a drive device 31, an auxiliary storage device 32, a memory device 33, a CPU 34, an interface device 35, a display device 36, and the like, which are all connected to each other via a bus 38.

[0025] The program for implementing the processing in the controller 30 is provided by a recording medium 37 such as a CD-ROM. When the recording medium 37 storing the program is set in the drive device 31, the program is installed from the recording medium 37 to the auxiliary storage device 32 via the drive device 31. However, the program does not necessarily have to be installed from the recording medium 37, and may be downloaded from another computer via a network.

[0026] The auxiliary storage device 32 stores various types of information, including, for example, installed programs, setup preparation information used in a setup method for the inspection device 1 described later, and information output in the setup method for the inspection device 1 described later.

[0027] When an instruction to start a program is received, the memory device 33 reads the program from the auxiliary storage device 32 and stores it.

[0028] The CPU 34 executes functions related to the inspection device 1 in accordance with the programs stored in the memory device 33 .

[0029] The interface device 35 is used as an interface for connecting to a network.

[0030] The display device 36 displays various information and also functions as an operation unit that accepts operations by an operator or the like.

[0031] In the inspection device 1, the alignment mechanism 25 aligns the wafer W with the probe card 24 so that the probes 24a of the probe card 24 accurately contact the electrode pads of each chip on the wafer W placed on the placement table 21. Then, the lifting and rotating mechanism 22 lifts the placement table 21 to bring the probes 24a of the probe card 24 into contact with the corresponding electrode pads. Then, the controller 30 applies a test signal from the tester to each chip on the wafer W via the test head T and the probes 24a, and inspects the electrical characteristics of each chip.

[0032] Incidentally, in the inspection device 1, prior to inspecting the chip, an operation (hereinafter referred to as "setup") is performed to register the positional relationship between the probe 24a of the probe card 24 and the electrode pad of the chip on the wafer W that contacts the probe 24a. Conventionally, part of the setup has been performed by an operator or the like. Therefore, the data generated by the setup (hereinafter referred to as "setup data") varies depending on the individual differences (differences in knowledge, ability, etc.) of the operators, etc.

[0033] Therefore, in the embodiment, information used to set up the inspection device 1 (hereinafter referred to as "setup preparation information") is prepared in advance in the device (for example, in the auxiliary storage device 32), and the controller 30 automatically sets up the inspection device 1 using the setup preparation information. As a result, since no operator or the like is involved, setup data that is not influenced by individual differences in the operator or the like is generated. In addition, for new types of devices (chips), the process from setup to measurement of electrical characteristics can be performed automatically.

[0034] An example of the setup preparation information will be described below, and then an example of a setup method for the inspection device 1 that is automatically performed by the controller 30 will be described.

[0035] [Setup preparation information] The setup preparation information is prepared in advance so that the controller 30 automatically sets up the inspection apparatus 1. The setup preparation information includes wafer parameter information, pad information, probe parameter information, and probe information.

[0036] The wafer parameter information includes items such as wafer size (6 inches, 8 inches, 12 inches, etc.), orientation flat position (0 degrees, 90 degrees, 180 degrees, 270 degrees, etc.), chip size (X, Y), etc. The wafer parameter information is information generated for each type of wafer W.

[0037] The pad information includes items such as pad shape (round, square, octagon, etc.), pad size (X, Y), distance of each electrode pad from the chip center (X, Y), reference pad attribute (four corners, etc.), etc. The pad information includes information on all electrode pads formed on the chips on the wafer W. The pad information is information associated with wafer parameter information.

[0038] The probe parameter information includes items such as the probe card type (cantilever type, vertical type, MEMS type, etc.), needle tip size (X, Y), etc. The probe parameter information is information generated for each type of probe card 24.

[0039] The probe information includes items such as the distance (X, Y) of each probe 24a from the center of the probe card, reference pin attributes (four corners, etc.), etc. The probe information is information associated with the probe parameter information.

[0040] The wafer parameter information, pad information, probe parameter information, and probe information may be files saved in a text format of a specified format, for example. Note that the items included in the wafer parameter information, pad information, probe parameter information, and probe information described above are merely examples, and are not limited to those described above.

[0041] [Method of setting up the inspection device] An example of a setup method for the inspection apparatus 1 of the embodiment will be described with reference to Fig. 4. The setup method for the inspection apparatus 1 of the embodiment is performed prior to inspection, for example, when changing the type of the probe card 24 or the type of the wafer W.

[0042] 4, the method for setting up the inspection apparatus 1 of the embodiment includes a step S10 for setting up a probe card and a step S20 for setting up a wafer. In this embodiment, a case will be described in which the step S10 for setting up a probe card is first performed, and then the step S20 for setting up a wafer is performed.

[0043] However, the order of performing the step S10 of setting up the probe card and the step S20 of setting up the wafer is not limited to this. For example, the step S20 of setting up the wafer may be performed first, and then the step S10 of setting up the probe card may be performed. Also, for example, the step S10 of setting up the probe card and the step S20 of setting up the wafer may be performed in parallel.

[0044] (Step S10 of setting up the probe card) An example of step S10 for setting up a probe card will be described with reference to Figures 5 to 7. Figure 5 is a flow chart showing an example of step S10 for setting up a probe card. Figure 6 is a diagram for explaining step S10 for setting up a probe card, showing position information of probes 24a used when inspecting one chip.

[0045] First, in step S11, a tip image of the probe 24a provided on the probe card 24 is acquired. In this embodiment, the controller 30 controls the XY stage 23 to move the lower camera 25d below the probe card 24. Next, the controller 30 controls the lower camera 25d to acquire an image (tip image) including the tip positions of all the probes 24a provided on the probe card 24.

[0046] Next, in step S12, a tip recognition process is executed. In this embodiment, the controller 30 performs known image processing based on the tip image captured by the lower camera 25d to recognize the tip positions of all the probes 24a. The controller 30 also generates probe information including the distance (X, Y) from the center of the probe card 24 for all the probes 24a.

[0047] Next, in step S13, setup data is generated based on the generated probe information and the previously prepared probe information. In this embodiment, as shown in Fig. 6, the controller 30 compares the probe position included in the generated probe information with the probe position included in the previously prepared probe information.

[0048] If, as a result of comparing the two, there is a probe that exists in the generated probe information but does not exist in the previously prepared probe information, the controller 30 determines that the probe is erroneously recognized (is erroneous information). Furthermore, the controller 30 deletes the erroneous information from the generated probe information. In FIG. 6, a probe that exists in the generated probe information but does not exist in the previously prepared probe information is indicated by a diagonal line circle.

[0049] Furthermore, if, as a result of comparing the two, there is a probe that does not exist in the generated probe information but exists in the previously prepared probe information, the controller 30 determines that the probe is a probe that is not visible in the generated probe information (missing information). Furthermore, the controller 30 adds the missing information to the generated probe information. In FIG. 6, a probe that does not exist in the generated probe information but exists in the previously prepared probe information is indicated by a hollow circle.

[0050] In this manner, the controller 30 corrects the probe information. Furthermore, the controller 30 calculates the center of gravity of the probe card 24 and the angle of the probe card 24 based on the corrected probe information. Furthermore, the controller 30 may calculate the degree of agreement between the generated probe information and previously prepared probe information.

[0051] 6, the total number of probes in the prepared probe information is 64, the number of erroneous information is 3, and the number of missing information is 5, so the controller 30 calculates the degree of match to be 0.875 (56 / 64). For example, when the calculated degree of match is equal to or greater than a predetermined threshold, the controller 30 determines that the generated probe information matches the prepared probe information. The center of gravity of the probe card, the angle of the probe card, and the degree of match are examples of setup data.

[0052] Next, in step S14, the setup data generated in step S13 is output. In this embodiment, the controller 30 outputs the setup data including the center of gravity of the probe card 24, the angle of the probe card 24, and the degree of coincidence. The controller 30 may also cause the display device 40 to display an image including the result of executing the step S10 of setting up the probe card. This allows an operator or the like to determine whether the setup of the probe card 24 has been executed normally by checking the image displayed on the display device 40.

[0053] 7 is a diagram showing an example of an image output by the display device 40 in step S10 of setting up a probe card. As shown in Fig. 7, an image G10 output by the display device 40 includes a probe image display section G11 and an operation button display section G12.

[0054] The probe image display unit G11 displays an image including the probe 24a formed on the probe card 24. In the example of Fig. 7, images G11a to G11d of the probe 24a acquired at four different positions A to D are displayed. The four different positions A to D may be positions automatically recognized by the controller 30, or may be positions designated in advance by an operator or the like.

[0055] The operation button display unit G12 displays images for accepting operations by an operator, etc. In the example of Fig. 7, an image G12a of "Save Setup" for accepting an operation to save the setup results and an image G12b of "Throw Setup" for accepting an operation to discard the setup results are displayed.

[0056] The operator, etc. can determine whether the setup of the probe card 24 has been performed normally by checking the images G11a to G11d displayed on the probe image display section G11. The operator, etc. can save the setup results by selecting (e.g., clicking or touching) the image G12a displayed on the operation button display section G12. The operator, etc. can discard the setup results by selecting (e.g., clicking or touching) the image G12b displayed on the operation button display section G12.

[0057] 7 is an example, and the image G10 may further include a display section for displaying other information. An example of the display section for displaying other information is an enlarged display section for displaying an enlarged image of the images G11a to G11d.

[0058] In the above example, the case where the setup data is generated based on the generated probe information and the previously prepared probe information in step S13 has been described, but the present invention is not limited to this. For example, the setup data may be generated based on the generated probe information and the previously prepared pad information in step S13. In this case, for example, the controller 30 first prepares the probe information based on the previously prepared pad information, and then compares the probe position included in the generated probe information with the probe position included in the probe information prepared based on the pad information.

[0059] (Step S20 of setting up the wafer) An example of the wafer setup step S20 will be described with reference to Fig. 8 to Fig. 11. Fig. 8 is a flow chart showing an example of the wafer setup step S20. Fig. 9 is a diagram for explaining the wafer setup step S20. Fig. 10 is a diagram for explaining the wafer setup step S20, showing position information of a plurality of electrode pads of one chip on the wafer W.

[0060] First, in step S21, the center of the wafer is aligned as shown in Fig. 9(a). In this embodiment, the controller 30 controls the XY stage 23 to move the mounting table 21 on which the wafer W is placed to a position below the upper camera 25a. Then, the controller 30 controls the upper camera 25a to acquire an image of the wafer W. Then, the controller 30 controls the XY stage 23 to move the mounting table 21 in the horizontal direction so that the center of the wafer W coincides with a predetermined position based on the image acquired by the upper camera 25a.

[0061] Next, in step S22, automatic pattern selection is performed as shown in Fig. 9(b). In this embodiment, the controller 30 controls the upper camera 25a to acquire an image of the wafer W including a plurality of chips CP formed on the surface of the wafer W while the center of the wafer W is aligned with a predetermined position. Next, the controller 30 recognizes and automatically selects a pattern P including a predetermined electrode pad EP from the image of the wafer W acquired by the upper camera 25a.

[0062] 9(c), the wafer W is aligned in the θ direction. In this embodiment, the controller 30 controls the lifting and rotating mechanism 22 to rotate the mounting table 21 so that the rotation angle of the wafer W becomes a predetermined angle (e.g., 0 degree) based on the pattern selected in step S22.

[0063] Next, in step S24, an image of the chip CP on the wafer W, which has been aligned in the wafer center and in the θ direction, is acquired. In this embodiment, the controller 30 controls the upper camera 25a to acquire an image (chip image) of the chip CP on the wafer W.

[0064] Next, in step S25, pad recognition processing is performed. In this embodiment, the controller 30 performs known image processing based on the chip image captured by the upper camera 25a to recognize the positions of all electrode pads EP of the chip CP. In addition, the controller 30 generates pad information including the distance (X, Y) from the center of the chip CP for all electrode pads EP.

[0065] Next, in step S26, setup data is generated based on the generated pad information and the previously prepared pad information. In this embodiment, as shown in Fig. 10, the controller 30 compares the pad positions included in the generated pad information with the pad positions included in the previously prepared pad information.

[0066] If, as a result of comparing the two, there is an electrode pad that exists in the generated pad information but does not exist in the previously prepared pad information, the controller 30 determines that the electrode pad is erroneously recognized (is incorrect information). Furthermore, the controller 30 deletes the incorrect information from the generated pad information. In FIG. 10, electrode pads that exist in the generated pad information but do not exist in the previously prepared pad information are indicated by hatched squares.

[0067] Furthermore, if, as a result of comparing the two, there is an electrode pad that does not exist in the generated pad information but exists in the previously prepared pad information, the controller 30 determines that the electrode pad is an invisible electrode pad in the generated pad information (missing information). Furthermore, the controller 30 adds the missing information to the generated pad information. In FIG. 10, electrode pads that do not exist in the generated pad information but exist in the previously prepared pad information are indicated by white square marks.

[0068] In this way, the controller 30 corrects the pad information. The controller 30 calculates the center of gravity of the chip CP and the angle of the wafer W based on the corrected pad information. The controller 30 may also calculate the positional relationship between the center of the wafer W and the center of gravity of the chip CP based on the corrected pad information. The controller 30 may also calculate the degree of agreement between the generated pad information and the pad information prepared in advance. In the example shown in FIG. 10, the total number of pads in the pad information prepared in advance is 64, the number of erroneous information is 6, and the number of insufficient information is 5, so the controller 30 calculates that the degree of agreement is 0.828 (53 / 64). For example, when the calculated degree of agreement is equal to or greater than a predetermined threshold, the controller 30 determines that the generated pad information and the pad information prepared in advance match. The center of gravity of the chip CP, the angle of the wafer W, the positional relationship between the center of the wafer W and the center of gravity of the chip CP, and the degree of agreement are examples of setup data.

[0069] Next, in step S27, the setup data generated in step S26 is output. In this embodiment, the controller 30 outputs the setup data including the center of gravity of the chip CP, the angle of the wafer W, the positional relationship between the center of the wafer W and the center of gravity of the chip CP, and the degree of coincidence. The controller 30 may also cause the display device 40 to display an image including the result of executing the wafer setup step S20. This allows an operator or the like to determine whether the setup of the wafer W has been executed normally by checking the image displayed on the display device 40.

[0070] Fig. 11 is a diagram showing an example of an image output by the display device 40 in the wafer setup step S20. As shown in Fig. 11, the image G20 output by the display device 40 includes a pad image display section G21 and an operation button display section G22.

[0071] The pad image display section G21 displays an image including electrode pads of a chip on the wafer W. In the example of Fig. 11, images G21a to G21e of electrode pads acquired at five different positions A to E are displayed. The five different positions A to E may be positions automatically recognized by the controller 30, or may be positions designated in advance by an operator or the like.

[0072] The operation button display section G22 displays images for accepting operations by an operator, etc. In the example of Fig. 11, an image G22a of "Save Setup" for accepting an operation to save the setup results and an image G22b of "Throw Setup" for accepting an operation to discard the setup results are displayed.

[0073] The operator or the like can determine whether the setup of the wafer W has been normally executed by checking the images G21a to G21e displayed in the pad image display section G21. The operator or the like can save the setup results by selecting (e.g., clicking or touching) the image G22a displayed in the operation button display section G22. The operator or the like can discard the setup results by selecting (e.g., clicking or touching) the image G22b displayed in the operation button display section G22.

[0074] 11 is an example, and the image G20 may further include a display section that displays other information. An example of the display section that displays other information is an enlarged display section that displays an enlarged image of the images G21a to G21e.

[0075] In the above embodiment, the upper camera 25a is an example of a pad information detector, and the lower camera 25d is an example of a probe information detector.

[0076] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims.

[0077] In the above embodiment, the inspection device 1 has one inspection unit 20 for one loader unit 10, but the present disclosure is not limited to this. For example, the inspection device may have multiple inspection units for one loader unit. Also, for example, the inspection device may have multiple loader units and multiple inspection units. [Explanation of symbols]

[0078] 1. Inspection equipment 21 Placement table 24 Probe Card 24a Probe W wafer

Claims

1. 1. A setup method for an inspection apparatus that inspects a substrate by contacting a probe with an electrode pad formed on a chip on the substrate placed on a mounting table, comprising the steps of: acquiring a first image including the probes of a probe card attached to the inspection apparatus; Calculating first information including a center of gravity and an angle of the probe card based on probe information including a position of the probe calculated based on the first image and probe information or pad information corresponding to the probe card prepared in advance; acquiring a second image including the electrode pads on the substrate placed on the placement table; calculating second information including a center of gravity of the chip and an angle of the substrate based on pad information including the positions of the electrode pads calculated based on the second image and pad information corresponding to the substrate that has been prepared in advance; outputting the first information and the second information; A method for setting up an inspection apparatus comprising the steps of:

2. The probe information includes at least one of a distance from a center of a probe card and a reference pin attribute.

2. The method for setting up an inspection apparatus according to claim 1.

3. The pad information includes at least one of a pad shape, a pad size, a distance from a chip center, and a reference pad attribute. A method for setting up the inspection apparatus according to claim 1 or 2.

4. The first information includes a degree of agreement between probe information including a position of the probe calculated based on the first image and probe information or pad information corresponding to the probe card prepared in advance. A method for setting up an inspection apparatus according to any one of claims 1 to 3.

5. the second information includes a degree of agreement between pad information including the positions of the electrode pads calculated based on the second image and pad information corresponding to the substrate prepared in advance; A method for setting up an inspection apparatus according to any one of claims 1 to 4.

6. the second information includes a positional relationship between a center of the substrate and a center of gravity of a chip on the substrate; A method for setting up an inspection apparatus according to any one of claims 1 to 5.

7. An inspection apparatus for inspecting a substrate by contacting a probe with an electrode pad formed on a chip on the substrate, comprising: a mounting table for mounting the substrate; a probe card including a probe capable of contacting the electrode pad; A control unit; having The control unit is acquiring a first image including the probes of the probe card; Calculating first information including a center of gravity and an angle of the probe card based on probe information including a position of the probe calculated based on the first image and probe information or pad information corresponding to the probe card prepared in advance; acquiring a second image including the electrode pads on the substrate placed on the placement table; calculating second information including a center of gravity of the chip and an angle of the substrate based on pad information including the positions of the electrode pads calculated based on the second image and pad information corresponding to the substrate that has been prepared in advance; outputting the first information and the second information; configured to execute Inspection equipment.

Images