METHOD FOR MANUFACTURING ELECTROMECHANICAL STRUCTURES AND APPARATUS FOR CARRYING OUT THE METHOD - Patent application

Abstract

To provide a method and an apparatus for manufacturing a three-dimensional single-substrate electromechanical structure having an embedded component and element.SOLUTION: A method for manufacturing an electromechanical structure comprises steps of: producing a conductor and / or a graphic on a substantially flat film 106; attaching an electronic element on the film in relation to a desired three-dimensional shape of the film 108; forming the film housing the electronic element into a substantially three-dimensional shape 110; and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on the film 112. Here, a preferred layer of material is attached on the surface of the film, creating an electromechanical structure. A corresponding apparatus for carrying out the method is also presented.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] In general, the present invention relates to electromechanical structures incorporated into electronic devices. Although not intended to limit the scope of the present invention, the present invention provides a three-dimensional single substrate having embedded components and elements. It relates to a method for producing a plate electromechanical structure. [Background technology]

[0002] In particular, the manufacturing process for various electromechanical devices, such as mobile devices, has become extremely It has been improved and has many features, e.g. refined display and interaction / responsiveness. Such electromechanical devices having covers have become commonly used household appliances. Such devices include sophisticated touch screens, multi-functional keyboards, and These incorporate a wide variety of often delicate components, Need.

[0003] The ever-increasing demands of users for greater functionality and intuitiveness of products are driving the development of new This helps create a situation where users do not want the government to restrict their use. Instead, all devices are restricted to being used in a way that is immediately intuitive. Rather than restricting it, we should enable it.

[0004] At the same time, the external design of the device, as well as the components used inside, are constantly evolving to meet the needs of a dynamic market. As manufacturing has had to evolve and change with the times, it has become more agile and flexible. The need is becoming increasingly clear.

[0005] This is a manufacturing process that allows for the incorporation of a variety of different components into the housing structure. Create a real need for. The containment structure can be two or three dimensional.

[0006] Components are becoming smaller and more flexible, but many of them are They are still relatively bulky compared to integrated electronics.

[0007] Printed electronics show the way to thin, flexible and rapidly manufactured structures. However, a huge amount of parts still cannot be produced by printing.

[0008] Additionally, creating three-dimensional substrates and housing structures with embedded electronic components is currently Currently, the board is first shaped and then components are attached to the already shaped 3D board. Mounting components on such a three-dimensional substrate is difficult because the components are mounted on an inclined surface. This creates an unfavorable situation when the part is mounted on a flat surface. From a manufacturing standpoint, this creates inaccuracies and is otherwise difficult to achieve when compared to processes that can be used It is difficult and time-consuming to do so.

[0009] Some other methods involve placing components on the substrate (in the desired locations) and then The substrate then acts as an insert. This is most often done by injection molding. The parts are placed very precisely in the correct place. This method requires that the molded part must be placed in place and then kept there throughout the molding process. Another problem with this process is that the molten material and the rather drastic temperature change it causes as it cools. This leads to a very difficult situation with many defective units. The method does not provide a means to truly shape the substrate in three dimensions. The mold is then molded into a shape that does not change much during the process. Furthermore, each molding is done only once. After the board and its components are overmolded, the shape and circuit component structure The defect is set and therefore cannot be corrected.

[0010] Some other manufacturing processes involve multiple layers or substrates that are stacked and attached to one another. However, these methods also involve the use of laminated surfaces made of flat to cubic It embodies disadvantages such as limited malleability to the original. Summary of the Invention [Problem to be solved by the invention]

[0011] An object of embodiments of the present invention is in particular to provide an efficient integration of various electronic elements on a flat surface. and a method and a method of manufacturing the same that allow the surface to be shaped and coated or encapsulated prior to application. In the context of a manufacturing device, one or more of the above-mentioned deficiencies evident in prior art devices may be overcome. The object is generally to provide a method for producing a fluororesin comprising the steps of: This is achieved by using a corresponding apparatus for carrying out the method. [Means for solving the problem]

[0012] One of the most advantageous aspects of the present invention is a method for manufacturing a semiconductor device in which a plurality of electronic elements are disposed on a substantially flat surface. and then the surface housing the electronic elements can be changed from a flat surface to a flat surface in a practical situation. The present invention further provides a method for forming a filter into a desired three-dimensional shape. The device is arranged on a film that can be formed three-dimensionally according to the shape and design to be formed. The present invention includes methods and systems for placing and mounting the device.

[0013] Another advantageous aspect of the present invention is the provision of a plurality of electronic, graphic and other uses. By using only one film to house the content being In this case, the laminated film, which is the result of stacking layers, and the film structure and sheet The aim of the present invention is to minimize the need for coating the glass structure.

[0014] Another advantageous aspect of the present invention is that a plurality of electronic circuits and a plurality of elements are mounted on a flat surface. before forming the substrate into substantially three-dimensional conformity to any desired shape. Secondly, the circuits and elements can be tested to be functional.

[0015] According to one aspect of the invention, there is provided a method for manufacturing an electromechanical structure, comprising the steps of: A process for producing a plurality of conductors and / or a plurality of graphic bodies on a substantially flat film. With With respect to the desired three-dimensional shape of the film, multiple electronic elements and / or multiple functional elements Attaching, for example, a MEMS onto the film; forming the film into a substantially three-dimensional shape containing a plurality of electronic devices; As an insert in an injection molding process by subsequently molding onto said film A process using a substantially three-dimensional film, the preferred layer of material being applied to the film surface. and c) attaching the electromechanical structure to create the electromechanical structure.

[0016] According to an exemplary embodiment of the present invention, the substantially flat film is substantially flexible. According to an exemplary embodiment of the present invention, the film includes a substrate. According to an embodiment, the film is a printed circuit board (PCB) or a printed wiring board (PW B) is included.

[0017] According to an exemplary embodiment of the present invention, the substantially flat film is preferably uniform or According to an exemplary embodiment of the present invention, The qualitatively flat film may comprise a laminate structure. Accordingly, the substantially flat film may be provided with a coating.

[0018] According to an exemplary embodiment of the present invention, the step of creating a conductor on the film preferably comprises: According to another exemplary embodiment of the present invention, a conductor is printed on the film. The step of producing the wiring may include a step of wiring. For example, the step of forming a conductor on the film may include a soldering step. According to another exemplary embodiment of the present invention, the step of forming a conductor on the film comprises forming a printed circuit The process may include using a printed circuit board (PCB) or a printed wiring board (PWB).

[0019] According to an exemplary embodiment of the present invention, the step of creating a graphic body on the film comprises: , preferably including a printing step. The step of creating a graphic substance on the film can include a painting step.

[0020] According to an exemplary embodiment of the present invention, the electronic elements used are electronic, electro-optical in nature. The present invention can be based on electroacoustic, piezoelectric, electrical, and / or electromechanical. The electronic device according to another exemplary embodiment of the present invention is a surface mount technology (SMT) through-hole Alternatively, the present invention may be implemented in a flip-chip or flip-chip form. According to a further aspect of the present invention, the electronic device may comprise a substantially flexible component. According to one exemplary embodiment, the electronic element may be a printed entity. According to an exemplary embodiment, the electronic element can be a printed entity, said element being substantially According to a further exemplary embodiment of the present invention, the electronic element The child may be a printed entity, and the element may be printed elsewhere (e.g., after the printing step). or beforehand onto a separate substrate which can be cut into suitable pieces. The printed elements can be mounted on a substantially flat film.

[0021] According to an exemplary embodiment of the present invention, the electronic device may, for example, be substantially flexible, as desired. Attached to the film by soft and / or conductive adhesives, pastes, or other adhesives According to another exemplary embodiment of the present invention, the element can be attached by bonding. So it can be installed.

[0022] According to an exemplary embodiment of the present invention, the step of attaching the electronic element comprises attaching the desired During the process of forming the film from a substantially flat to a three-dimensional shape, The film and the elements assembled thereon are subject to physical stresses, such as strain, torque and These forces are only induced by bending and stretching the film. This is caused not only by the temperature but also by the temperature required for the process. The process of processing, according to the invention, involves the processing of many individual or coincident sequences (arrangements of processing). It can contain sequences.

[0023] According to an exemplary embodiment of the present invention, any sequence of steps for mounting electronic components may include: For example, the three-dimensional design of a three-dimensional film can be created by computer-aided design (CAD). For example, a uniform square grid pattern or a circular grid pattern for modeling the shape of the grid. Model building or three-dimensional surface distortion performed by means of a pattern or other suitable geometry The modeling process may include measurements of strains, forces, and other factors, as well as possible disturbances. This can include parameters of dimensional, thermal and stress analysis. Possible failures can be e.g. For example, the formation of a substantially flat film into a substantially three-dimensional shape may result in The modeling process can include stress analysis of the structure. The modeling process also includes the manufacturing process simulation. The manufacturing process may include, for example, a casting process, a molding process, and a and another forming step.

[0024] Another optional sequence of the exemplary embodiment of the present invention is to create a three-dimensional film design surface shape. This may include selecting an orientation of the element with respect to the shape of the element. This means that the element is arranged according to the shape of the surface to which it is to be attached, resulting in a flat film. The deformation of the surface area is as small as possible compared to the surface area of ​​the element relative to said surface area of ​​the film. Specifically, it is the magnitude of the curvature of the film surface, compared to the surface projection of the opposing element. In comparison, the magnitude of the curvature caused by the three dimensions of the film is minimized. When setting the orientation of the elements according to the virtual curvature on a three-dimensional surface, Curvature and / or distortion caused by the shape of the element may occur during the mounting sequence. As a result, the film surface is not yet attached / interface contact. , the curvature between the far ends or physical boundaries of the element and / or the far ends or The curvature relative to the physical boundary is caused by the three-dimensional formation of the film. The curvature between the film surface and the bottom surface of the element is smaller than that between the curved film surface. This causes significant separation and / or distance.

[0025] Another optional sequence of the exemplary embodiment of the present invention is to create a three-dimensional film design surface shape. Generally, this can include selecting a location for the electronic element with respect to the shape of the This means the process of arranging the elements according to the shape of the surface to which they are to be attached, resulting in the film The deformation of the flat surface area is possible compared to the surface area of ​​the film in the element relative to the surface area of ​​the film. More specifically, the surface protrusions of the opposing / bottom elements are The magnitude of curvature and / or distortion of the film surface, said curvature being the curvature that forms the film. The size of the third dimension should be minimized. By selecting the location of the element so that it is placed on a surface that undergoes small deformations, the The elements can be mounted in a smaller space because the curvature is not noticeable in the mounting sequence of the elements. The process of selecting the location of the element with respect to the film surface may also involve: Selecting a plurality of positions, where the bottom of the element relative to the film surface and the The touch surface of the opposing film surface is, for example, maximized. Thus, the best position of the element can be selected according to the film surface. This step means that the elements should not be placed on the far edge of the film surface. The child is partially overlying the farthest edge of the film surface.

[0026] According to an exemplary embodiment of the present invention, a film is formed on the three-dimensional Some aspects of the flexible element can be induced on the attached element. Can be alleviated by use.

[0027] According to another exemplary embodiment of the present invention, the top of the film is formed by three dimensions. Some aspects of the invention that are posed on the elements attached to the substrate include a substantially flexible attachment of the elements. This can be mitigated by the use of attachment means.

[0028] Another optional sequence of the exemplary embodiment of the present invention is with respect to the manufacturing parameters: , physical properties, such as physical strength and tolerance to temperature and temperature changes, and different This is the process of selecting elements based on their compatibility with materials.

[0029] Any other sequence of the exemplary embodiment of the present invention may be used depending on the flexibility, strength, etc. The method includes selecting a method.

[0030] Another optional sequence of the exemplary embodiment of the present invention is the same as the above-mentioned. and selecting an injection mold and an injection mold. pressed against or molded onto or across a forming wall However, the element is attached to the side of the film opposite the side of the film on which it is attached. or molded over the side.

[0031] According to an exemplary embodiment of the present invention, the film and the elements thereon are preferably thermally formed. The molded article may be formed into a substantially three-dimensional shape by molding or vacuum forming. According to an embodiment, the film and the elements thereon are formed by blow molding or rotational molding. It can be formed into substantially three-dimensional shapes.

[0032] Herein, the three-dimensional nature of the formed structures is considered to be a flat fill, among other options. The three-dimensional shape may be understood herein as deviation / deviation. The substantially flat film can be described as having two It can be thought of as a fit between parallel planar (flat) surfaces. This fit is Even the slightest deformations in the apparently flat surface are taken into account. Later, the shapes that had previously been formed from flat films were also applied between two parallel surfaces. The distance between two surfaces and either The distance measured by the length of a line extending parallel to the normal of one surface to the other surface. The separation is achieved without overlapping the film, assuming that both surfaces are substantially flat and three-dimensional. This gives the minimum distance that two parallel surfaces can be positioned from each other in both cases. The minimum distances of the two can be compared to count the percentage of deviation. The deviation referred to is the maximum distance between two parallel surfaces that do not overlap with a three-dimensionally formed film. The ratio of the short distance to the shortest distance of the same film prior to three-dimensional formation. The deviation is at least as follows: [Table 1]

[0033] According to an exemplary embodiment of the present invention, the injection molding material is applied across the film surface. Qualitatively exclusively partially molded. If necessary, the material to be injection molded can be used to mold electronic components. If necessary, the material to be injection molded may be molded into the surface of the film to be contained. The insulating layer 12 may be molded onto the surface portions of the film that do not contain the child elements.

[0034] According to another exemplary embodiment of the present invention, an injection molding process is performed on the film. The molded material encapsulates the entire film.

[0035] According to another exemplary embodiment of the present invention, the injection molding is performed on the entire film except for the electronic components. can be encapsulated.

[0036] According to another exemplary embodiment of the present invention, injection molding is performed on the entire film and electronic components. can be encapsulated.

[0037] According to an exemplary embodiment of the present invention, the method further comprises the steps of: Additional surface treatments or coatings may be included before or after.

[0038] According to another aspect of the invention, an apparatus for carrying out said method for manufacturing an electromechanical structure is provided. , an entity for producing conductive and / or graphic objects on a surface; an entity for mounting electronic elements on a surface; an entity for forming the substantially planar film into a substantially three-dimensional shape; and an entity for injection molding.

[0039] In accordance with an exemplary embodiment of the present invention, the device includes a conductive and / or graphic device having a surface. The printing method includes the steps of: forming a print body using an inkjet printer, a screen printer, and the entity is a roll-to-roll or reel-to-reel machine. It is possible.

[0040] In accordance with an exemplary embodiment of the present invention, an apparatus is provided for mounting electronic devices on a surface. The entity may include a pick and place machine.

[0041] According to an exemplary embodiment of the present invention, an apparatus is provided for forming a substantially planar film into a substantially three-dimensional a body for forming into a base shape, the body being continuously roll-fed or Either a thermoforming machine with automatic in-precut-pieces-fed or may include a vacuum former.

[0042] According to an exemplary embodiment of the present invention, the apparatus comprises an entity for injection molding, said entity can include hydraulic, mechanical, electric or hybrid injection molding machines.

[0043] According to another embodiment of the present invention, the electric motor achieved by the method and the corresponding device The mechanical structure may be, for example, an electronic device incorporating a user interface (UI). The user interface (UI) may be, for example, a desktop device, a laptop, Another embodiment of the present invention is a computer including a laptop device and a palmtop device. According to an embodiment, the electromechanical structure achieved by the method and the corresponding device is The device may incorporate touch screen or touch surface technology.

[0044] The considerations presented above regarding various embodiments of the electronic device will be understood by those skilled in the art. As will be appreciated, the present invention may be flexibly applied mutatis mutandis to the embodiments of the present method and vice versa. It is.

[0045] As briefly outlined herein, the utility of the various aspects of the present invention is dependent on the specific Several issues arise depending on the embodiment. The manufacturing costs for producing such electromechanical structures are low due to the availability of affordable and readily available materials. This can be kept low through the extensive use of materials, devices, and process technologies.

[0046] The electromechanical structure obtained by the method and the corresponding device is A viable process technology is specifically one that is merely a prototype. In addition to these types of scenarios, the present invention provides for rapid and agile industrial-scale manufacturing of devices.

[0047] As used herein, the term "multiple" refers to any positive integer starting with one (1). The term "plurality" means a positive integer beginning with two (2). It is possible.

[0048] Further embodiments of the invention are also disclosed in the accompanying dependent claims.

[0049] Embodiments of the invention will now be more closely outlined with reference to the accompanying drawings, in which: [Brief description of the drawings]

[0050] [Figure 1] FIG. 1 is a flow diagram disclosing an embodiment of a method according to the present invention. [Diagram 2] 1A-1C are diagrams illustrating, through exemplary embodiments, the concept of a process for forming a film that three-dimensionally houses electronic elements according to the present invention. [Diagram 3] 1 is a block diagram of one embodiment of an apparatus including entities according to the present invention; [Figure 4] FIG. 1 illustrates an exemplary embodiment of a measurement used to describe the three-dimensional nature of the formed structures. [Diagram 5] FIG. 1 is a block diagram of one possible embodiment for an apparatus for carrying out the manufacturing method of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0051] Please refer to FIG. 1, a flow diagram of one possible embodiment for manufacturing the solution of the present invention. do.

[0052] In 102, which refers to the start stage, the necessary tasks, e.g., selection of materials, components and tools, are performed. Selection and acquisition occurs in determining the appropriate elements and other components / electronics. The selection of individual components and materials work together and through the selected manufacturing process of the entire device. Particular care must be taken to ensure that the selected manufacturing steps of the entire device Of course, preferably, the manufacturing process is based on the data sheet of the device, or for example For example, it is checked in advance by analyzing a produced prototype.

[0053] At 104, a substantially flat film is fabricated according to a preferred shape and size. The film is preferably a substantially thin sheet. The film is preferably made of polycarbonate (PC) or polyethylene terephthalate (P ET) because these materials have an optimal thermoforming window (i.e., their optimal thermal In the shaped window, the material becomes substantially flexible so that it can stretch and shape, resulting in efficient 3D The film material can be molded to fit the needs of the final product as required. Other suitable materials may be included according to requirements and manufacturing requirements. The requirements and manufacturing requirements are, for example, flexibility, robustness, thermoformable window, strength, adhesion. , electronics and adjacent materials, or for example, available manufacturing techniques. Other material properties are met depending on the application. The other materials can be other plastics, silicones, etc. Further possible materials include polypropylene, rubber, or a mixture thereof. Methyl methacrylate (PMMA), Acrylonitrile-butadiene-styrene (ABS ), glycolized polyethylene terephthalate (PETG), high impact polystyrene (H IPS), high density polyethylene (HDPE), acrylic polymers, or mixtures thereof The thickness of the film depends on the properties required from the film, such as material strength, flexibility, etc. Depending on the required elasticity, transparency and / or size of the final product, The films can be used in electronics, e.g. as leads for electronic circuits, conductors, or components. Contains a number of recesses, cavities, or holes for receiving wires and / or sockets, etc. It is possible.

[0054] The selected film may also be processed prior to and / or at the indicated processing steps. The film can be pre-conditioned during construction. The film can be coated with other materials, e.g. injection molded coated plastics. In order to enhance adhesion to the substrate, the thickness of the substrate may be adjusted in advance.

[0055] If necessary, the material requirements, shape requirements and dimensions according to the requirements of the film material already mentioned above may be adjusted. A printed circuit board (PCB) or printed wiring board (PWB) that meets legal requirements is can be selected as

[0056] At 106, conductive and / or graphic objects are created on the film. In addition, the film may be made up of only conductors, only graphics, or both conductors and graphics. The step of producing the conductor and / or the graphic body preferably includes the steps of: or by utilizing suitable printing techniques, e.g. inkjet printing. A machine or other suitable device may then apply the conductors and / or the graphics to the film. Preferably, one device can be used to print conductors and graphics. If necessary, a separate device for making the conductors is used. Chairs and devices for creating graphic objects may also be used.

[0057] Generally, feasible techniques for printing conductive and graphic objects are screen printing. Printing, rotary screen printing, gravure printing, flexographic printing, inkjet printing, Pad printing, etching (printed wiring boards, as well as PWB substrates), transfer lamination, thin film deposition For example, in connection with conductive paste, silver-based PTF (polytetrafluoroethylene) The thick film paste is utilized to screen print the desired circuit design onto the film. Also, for example, copper-based or carbon-based PTF pastes can be used. Alternatively, the copper / aluminum layer can be obtained by etching. Conductive LTCC (low temperature co-fired ceramic) paste or HTCC (high temperature co-fired ceramic) A paste can be sintered onto the film. When selecting a material for the conductor, The film characteristics must be taken into consideration. For example, the firing temperature of LTCC paste is about 8 It can be from 50 to 900°C and may require the use of ceramic films. Silver / gold based nanoparticle inks can be used to create the conductors.

[0058] Different printing techniques have different rheologies due to the inks / pastes used, for example. Because of the required characteristics, the paste / ink is preferably made of the printing technology and film material Furthermore, different printing technologies have different ink per unit time. / Paste values ​​are given, and this variation often corresponds to the achievable conductivity values. Make an impact.

[0059] Alternatively, conductors and / or graphics may be provided within the film.

[0060] At 108, an electronic component is attached onto the film. The electronic component is preferably , Surface Mount Technology (SMT), Through-hole, Flip Chip or Printed Entity If desired, the element may be printed using a suitable printing method as shown in step 106. The printed elements can be made by printing on a substantially flat film, if desired. Printed elements can be fabricated on the film by printing on a substrate. By doing so, a substantially flat film can be formed separately, if desired. The entire substrate, or a preferred piece of substrate containing the device, is placed on a substantially flat film. It can be attached.

[0061] SMT, through-hole, flip-chip and printed entities are available as required. By bonding, gluing or other adhesive means, The mounting can be achieved by means of an adhesive, such as an epoxy adhesive (to allow electrical contact). Both conductive adhesives (for bonding) and non-conductive adhesives (for simple fixation) are available. The parts can be molded to withstand the pressures and temperatures of the three-dimensional forming that will be utilized. The three-dimensional molding used can be, for example, injection molding. Processes that establish the containment of parts, such as molding processes, as well as thermoforming processes or It is a vacuum forming process.

[0062] By way of example, the elements may be electronic, electro-optical, electro-acoustic, piezoelectric, electrical, and / or may be electromechanical, or at least some of such components In addition, such elements and / or components may include control circuits, distortion, Resistive, capacitive, (F)TIR and other touch-sensing and light-sensing components, piezoelectric actuators or tactile and / or vibrating parts such as vibration motors, light-emitting parts such as (O)LEDs , sound generation and / or reception such as microphones and speakers, memory chips, programmable Device operation parts such as logic chips and CPUs (Central Processing Units), digital signal processors DSP, ALS device, PS device, processing device (microprocessor Other processing devices such as microcontrollers and digital signal processors (DSPs) , MEMS and / or various other sensors not yet mentioned. In this regard, numerous techniques may be implemented and structures may be implemented in addition to those disclosed. In addition, as will be understood by the reader of ordinary skill in the art, the disclosed components may include The configuration of the present invention may be adapted according to the requirements of each intended use scenario in which the present invention may be utilized. It may differ from what is explicitly shown.

[0063] Optionally, the elements may be arranged in a predetermined systematic configuration, e.g., symmetric or matrix. It can be attached to and configured.

[0064] Alternatively, the electronic elements may be provided within the film.

[0065] At 110, the film is formed from substantially flat to substantially three-dimensional. The forming can be preferably carried out by thermoforming, using vacuum forming or pressure forming. Alternatively, the forming may be billow molding, drape molding, blow molding, preforming, or rotational molding. This can be done by:

[0066] Thermoforming as a process involves heating a film into a thermoformed window (i.e., The film is placed into a mold (within the window, the material becomes substantially pliable so that it can be stretched and shaped). The film is pressed against the mold so that it fits the shape of the mold. applying a vacuum to adhere the film to the substrate and simultaneously cooling the film while simultaneously removing the cooled film. and applying a vacuum to the film and removing the cooled film. or releasing the vacuum and / or applying an "air bleed" for easy removal of the film. By this, it is possible to conform to the desired shape according to the mold. Cutting of the film, for example to a desired size or for a better finish Cutting of the film can be performed before or after thermoforming. Heating the film into a thermoformed window , if desired, either inside the thermoforming machine, e.g., in the mold, or outside the thermoforming machine, e.g. , in an oven.

[0067] Consider the parameters and settings of your preferred thermoforming process using vacuum or pressure and some further guidance are provided by way of example only, as will be appreciated by those skilled in the art. Some examples for the lower limit of thermoforming temperature are 150°C for PC and 70°C for PET. , ABS 88℃ to 120℃. The pressure applied to the film, obtained either by drawing a vacuum within the For film structures it should be above approximately 100 psi, while for laminate structures it should be above approximately 100 psi. The pressure should be approximately 200 psi. The process parameters should preferably be selected so that the film does not melt. Meanwhile, the film is placed in the mold so that the film remains properly fixed. so that the fixing points do not impede molding.

[0068] At 112, an assembly is provided having a preferred element attached to a three-dimensional film. , is placed as an insert into a mold frame and injection molded.

[0069] The injection molding material that is molded across the three-dimensional film is transparent if desired, and Polymers such as polycarbonate (PC), polyethylene terephthalate (PET), Polymethyl methacrylate (PMMA), Polyamide (PA), Cycloolefin Copoly olefin copolymer (COC), cycloolefin polymer (COP), polytetrafluoroethylene ( The material may include PTFE, polyvinyl chloride (PVC), or a mixture thereof. Alternatively, or in addition, the material may include glass. flexibility, robustness, and other requirements, such as adhesive properties, and Other requirements taking into account tronics and adjacent materials or taking into account available manufacturing techniques should generally be selected so that

[0070] Considering the process parameters and settings, some further guidance is provided to those skilled in the art. As such, it should be understood that the present invention is merely given by way of example. , and for example, if the plastic to be injection molded onto the 3D film is PC, The temperature of the molten PC can be about 280 to about 320°C, and the temperature of the mold can be about 20 to about 400°C. The temperature may be from about 80° C. to 95° C., for example about 80° C. The three-dimensional film and process used The process parameters are preferably such that the film does not melt and remains substantially solid during the process. The film should be selected so that it remains properly fixed. Similarly, pre-assembled parts, graphs The material and / or electronics are attached to the substrate so that they remain static during molding. Must be installed.

[0071] The injection stage of the injection molding process melts a material selected according to the desired characteristics. and then extruding the material to inject it into a mold. The material solidifies on the insert. Preferably, the injection molded material is applied to the film surface. The entire range of pre-assembled parts, graphic bodies, and other components can be virtually exclusively molded in part. and / or a molding on the surface portion of the film that houses the electronics, Film that does not contain embedded components, graphics and / or electronics Optionally, the material may be injection molded or the like. is molded substantially over the film such that the material encapsulates the entirety of the film. The article may be a pre-assembled part, a graphic and / or electronic component. Encapsulating only a portion of the Nix, or using pre-built components, graphics, The part is molded so that the mass and / or electronics are completely embedded within the mold. Encapsulates pre-assembled components, graphics and / or electronics The present invention can have either:

[0072] Generally, in an embodiment of the present invention, the elements and electronics in a constructed housing are The thickness of the constructed enclosure as well as the mounting depth of the box may vary depending on the application. As a result, the depth and the thickness are determined based on the surface (the entire internal surface or the external surface of the electronic device). It can form part of the housing (the outer surface) or can be completely embedded or embedded inside the housing. This allows customization of the durability and protection of the embedded elements. In addition, the constructed electromechanical structure as a whole has characteristics such as toughness, elasticity, and transparency. Fully embedding the element inside the housing usually provides better protection. Optionally, leaving the element on the surface provides less protection, but Facilitates maintenance or replacement of elements. Depending on the application, other elements may be only partially filled. If embedded, the particular element may be completely embedded.

[0073] After the injection process, the injected material is held under pressure and cooled; It can then be removed.

[0074] At 114, execution of the method is terminated. Further operations, such as control of the device, quality control, etc. Quality control, surface treatment and / or finishing or polishing may be carried out.

[0075] The use of advantageously flexible materials allows the process items to be carried out by roll-to-roll processes. and, for example, considering transportation and storage, time, cost, Roll-to-roll or “reel-to-roll” methods provide additional performance and even spatial advantages. In the "reel" method, the desired entities, e.g., conductors, graphic entities and / or electronic elements, are The molecules can be deposited on a continuous "roll" substrate. A "roll" substrate can be long or widely You can also select multiple sources from a single source roll or from multiple source rolls to select the desired It can advance towards the roll at either a constant or dynamic speed. Additionally, the film may contain multiple products which are then cut separately.

[0076] Thus, the roll-to-roll or "reel-to-reel" method is step 1 of the method. At least two of 02, 104, 106, and 108 may be used in combination. All of the method steps 102, 104, 106, 108 are, i.e., method steps Virtually all are done by roll-to-roll or "reel-to-reel" techniques. Optionally, all of the steps (102-114) of the method, i.e. the entire , generally can be performed by a roll-to-roll process or a "reel-to-reel" process.

[0077] Roll-to-roll manufacturing advantageously also provides a rapid and cost-effective method for producing the products of the present invention. During the roll-to-roll process, some material layers are "on-the-fly" The conductors, the graphic objects and / or the electrical components may be coupled together by a Substrates are built on top of these layers of material before, at the same time, or after the actual bonding moment. The source layer and the resulting banded aggregate entity may be further subjected to various treatments during the process. The thickness of the layers, and any other properties, may also be adjusted to favor roll-to-roll processing. The input voltage should be selected to allow for as much power as possible.

[0078] FIG. 2 shows four different exemplary side views 202a, 202b, 202c, and 202d of a film. 2d shows the film on which electronic elements are mounted.

[0079] Side view 202a shows a substantially flat film 210, the film being substantially Before being formed into a three-dimensional shape from a flat surface, the electronic elements 204a and 204b are attached thereon. 2b, and a film 210 containing the conductors 206 and the graphic bodies 208.

[0080] Side view 202b shows an example of a three-dimensional film 212, i.e., substantially prior to the formation process. A substantially flat film having electronic elements 204a and 204b mounted thereon. 04b, conductor 206, and film containing graphic body 208. In this embodiment, the film is formed into a simple arc shape.

[0081] Side view 202c shows an example of a three-dimensional film 212, i.e., substantially prior to the formation process. A substantially flat film having electronic elements 204a and 204b mounted thereon. 04b, conductor 206, and film containing graphic body 208. In this embodiment, the film is formed into an undulating shape.

[0082] Side view 202d shows an example of a three-dimensional film 212, i.e., the solid state after the formation process. A substantially flat film having electronic elements 204a and 204b mounted thereon. 2 shows a film containing a conductor 206 and a graphic 208. In this embodiment, , the film is formed into an asymmetrical arch shape.

[0083] The shape and size of the three-dimensionally formed film 212 is not limited to any particular shape. The present invention is not limited to a specific embodiment and can therefore be manufactured to suit a wide range of applications.

[0084] FIG. 3 is an axonometric projection of an exemplary embodiment of a three-dimensional shape achieved by the forming process. The embodiment includes attached electronic elements 304a, 304b, 304c and and 304d, housing the conductors and graphic bodies thereon (not explicitly shown). The film 306 is formed into an asymmetric corrugated shape. do.

[0085] The shape and size of the three-dimensionally formed film 306 is not limited to any particular configuration. The present invention is not limited to a specific embodiment and can therefore be manufactured to suit a wide range of applications.

[0086] FIG. 4 shows an example of the measurements used to illustrate the three-dimensional nature of the structures formed. The three-dimensional shapes are shown in the figures as / through deviations described herein. A substantially flat film can be described as having two parallel planar (flat) surfaces. It can be seen that there is a fit between surfaces 402a and 404a. Even slight deformations in the otherwise flat surface are taken into account. After the 3D forming process Then, the shape of the previously flat film also changes to two parallel surfaces 402b and and 404b. It is measured by the length of a line that extends maximally parallel to the normal of one surface to the other surface. The distances d1 and d2 are calculated based on the film and the surface being both substantially flat and three-dimensional. This gives the minimum distance that the two objects can be positioned from each other without overlapping. The minimum distances between the parallel surfaces can be compared to calculate the ratio of deviations. Therefore, the deviations referred to herein do not overlap with the substantially flat film prior to three-dimensional formation. The three-dimensional shape of the shortest distance d1 between the two parallel surfaces 402a and 404a. The shortest distance between the two parallel surfaces 402b and 404b that do not overlap the deposited film. Preferably, the deviation ratio d2 / d1 is the number given earlier in this specification. At least corresponds to the value.

[0087] FIG. 5 shows an apparatus (arrangement, arrangement) 500 for carrying out the manufacturing method of the present invention. 1 shows a block diagram of one possible embodiment of the present invention.

[0088] Block 502 represents an entity for creating conductive and / or graphic objects on a surface. Such an entity may be a roll-to-roll machine or a reel-to-reel machine. Equipped with at least one of the following machines: inkjet printer and screen printer can be done.

[0089] Block 504 represents an entity for mounting electronic components on a surface. The pick and place machine may include a pick and place machine, as is well known in the art. and pick and place machines allow for fast and accurate placement of a variety of different parts. It is particularly suited for this purpose because it allows for do.

[0090] Block 506 includes performing a process for forming a substantially flat film into a substantially three-dimensional shape. Such entities may be continuous roll-fed or automated, as appropriate. Either computer-generated or in-precut-pieces-fed Controlled (CNC) machines, thermoforming machines, vacuum forming machines, pressure forming machines or blow molding machines or The present invention may include a combination of the above.

[0091] Block 508 represents the entities for injection molding. Such entities may be hydraulic, mechanical, , electric or hybrid injection molding machines or combinations thereof. .

[0092] The scope of the present invention is determined by the appended claims together with their equivalents. Those skilled in the art will again understand that the disclosed embodiments have been constructed for illustrative purposes only, and that the innovative support outlined herein will extend to further embodiments, combinations of embodiments, variations and equivalents that may be better suited to each particular use of the present invention. It should be noted that the present invention includes the following aspects. [Aspect 1] 1. A method for manufacturing an electromechanical structure, comprising: forming a plurality of conductors and / or a plurality of graphic bodies on a substantially planar film 106; attaching a plurality of electronic elements onto the film 108 in relation to a desired three-dimensional shape of the film; forming the film containing the electronic device into a substantially three-dimensional shape 110; and using the substantially three-dimensional film as an insert in an injection molding process by substantially molding onto the film 112, whereby a preferred layer of material is attached to a surface of the film to create an electromechanical structure. [Aspect 2] 2. The method of embodiment 1, wherein the film is a substrate, preferably a printed circuit board (PCB) or a printed wiring board (PWB). [Aspect 3] 3. The method of any one of the preceding claims, wherein the film is optionally substantially flexible. [Aspect 4] Aspect 4. The method of any of aspects 1 to 3, wherein the substantially flat film can comprise polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), glycolized polyethylene terephthalate (PETG), high impact polystyrene (HIPS), high density polyethylene (HDPE), an acrylic polymer, or a mixture thereof. [Aspect 5] 5. The method of any of the preceding claims, wherein the conductor and / or the graphic body are made by printing, and the printing technique is selected from at least one of screen printing, rotary screen printing, gravure printing, flexography, jet printing, pad printing, etching, transfer lamination, or thin film deposition. [Aspect 6] 6. The method of any one of aspects 1 to 5, wherein the attached electronic element is a flexible, pre-fabricated surface mount technology (SMT) entity, a flexible, pre-fabricated through-hole entity, a flexible, pre-fabricated flip-chip entity, or a flexible, pre-fabricated printed entity, as appropriate. [Aspect 7] 7. The method of any one of embodiments 1 to 6, wherein the electronic elements can be fabricated by printing onto the substantially planar film. [Aspect 8] The method of any of the preceding embodiments, wherein the electronic elements can be fabricated by printing onto a substrate (i.e., other than the substantially planar film) and then attached to the substantially planar film. [Aspect 9] 9. The method of any of the preceding aspects, wherein the step of attaching the electronic element is performed by bonding, gluing, or other adhesive, optionally using substantially flexible means. [Aspect 10] A method according to any of the preceding claims, wherein the steps of producing the conductors and / or the graphic bodies on the substantially flat film and attaching the electronic elements to the film are optionally performed by a continuous roll-to-roll or reel-to-reel process, the roll-to-roll or reel-to-reel process optionally comprising printing at least one item from a list of conductors, graphic bodies and electronic elements. [Aspect 11] 11. The method of any of the preceding claims, wherein the forming of the film containing the electronic device into a substantially three-dimensional shape is accomplished by thermoforming, e.g., vacuum or pressure forming, billow forming, drape forming, blow molding, preforming, rotational molding, or a combination thereof. [Aspect 12] 12. The method of any one of the preceding aspects, wherein the electromechanical structure is coated. [Aspect 13] An apparatus 500 for carrying out the method for manufacturing an electromechanical structure, comprising: an entity for producing a plurality of conductive and / or graphic objects on the surface 502; an entity for mounting a plurality of electronic elements on the surface 504; an entity for forming a substantially planar film in a substantially three-dimensional shape 506; an entity for injection molding 508; An apparatus comprising one or more of the following entities: [Aspect 14] The apparatus of embodiment 13, wherein the entity for creating conductors and / or graphic objects on the surface 502 comprises at least one of an inkjet printer and a screen printer, and the entity can be a roll-to-roll machine or a reel-to-reel machine. [Aspect 15] 15. The apparatus of embodiment 13 or 14, wherein the entity for mounting the electronic element on surface 504 comprises a pick-and-place machine or a printing machine. [Aspect 16] 16. The apparatus of any of aspects 13 to 15, wherein the entity for forming the substantially flat film into the substantially three-dimensional shape 506 comprises a computer numerically controlled (CNC) machine, a thermoforming machine, a vacuum forming machine, a pressure forming machine, or a blow molding machine, or a combination thereof, optionally either a continuous roll feed or an automatic cut piece feed.

Claims

1. 1. A method for manufacturing an electromechanical structure, comprising: - producing a plurality of conductors and / or a plurality of graphic bodies on a flat film; - attaching a number of electronic elements, other than a number of conductors and / or a number of graphic bodies, on the flat film, which are related to a desired three-dimensional shape of the flat film, the flat film being thermoformed into the desired three-dimensional shape after the step of attaching the number of electronic elements, the number of electronic elements being attached to a surface portion or surface portions of the flat film which are formed in the thermoforming to have a curvature greater than 0, the number of electronic elements being attached being - Surface Mount Technology (SMT) electronic components, through-hole electronic components or flip-chip entities, or a step of attaching a plurality of electronic elements, said electronic elements being printed entities made by printing on a substrate other than said flat film, said printed entities being attached to said flat film; - a step of thermoforming the flat film housing the plurality of electronic components into a three-dimensional film having the desired three-dimensional shape, the step of thermoforming comprising at least stretching the flat film, the film and the electronic components integrated thereon being subjected to physical stresses during the step of thermoforming the flat film into the three-dimensional film; and using the three-dimensional film as an insert during an injection molding process by subsequently molding onto the three-dimensional film, whereby a preferred layer of material is attached to a surface of the three-dimensional film to create an electromechanical structure.

2. The method of claim 1 , wherein the flat film is a substrate.

3. The method of claim 2 , wherein the front substrate is a printed circuit board (PCB) or a printed wiring board (PWB).

4. 4. The method of any one of claims 1 to 3, wherein the substantially flat film can comprise polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), glycolized polyethylene terephthalate (PETG), high impact polystyrene (HIPS), high density polyethylene (HDPE), or an acrylic polymer, or a mixture thereof.

5. 5. The method of claim 1, wherein the film is optionally substantially flexible and may comprise plastic, silicone, rubber or mixtures thereof.

6. 6. The method according to claim 1, wherein the conductor and / or the graphic body are produced by printing.

7. 7. The method of claim 6, wherein the printing technique can be selected from at least one of screen printing, rotary screen printing, gravure printing, flexography, jet printing, pad printing, etching, transfer lamination or thin film deposition.

8. 8. The method of claim 1, wherein the thermoforming step induces a deviation that is at least 2, the deviation being the ratio of the shortest distance between two parallel surfaces that do not overlap the three-dimensional film to the shortest distance of the flat film before the thermoforming step, and the deviation being caused by deformation to the flat film caused by the stretching.

9. 9. The method of any one of claims 1 to 8, wherein the thermoforming step includes the steps of heating the flat film into a thermoforming window so that the material of the flat film becomes flexible to stretch and shape, placing the flat film into a mold having a shape corresponding to the desired three-dimensional shape, and applying vacuum or pressure to press the flat film against the mold so that the film is molded to the shape of the mold, thereby creating the three-dimensional film.

10. 10. The method of claim 1, wherein the surface portion or selected locations of the surface portions of the three-dimensional film to which the electronic elements are attached have a curvature that is smaller than the curvature of other surface portions of the three-dimensional film, and the electronic elements are not attached to locations of the three-dimensional film having a maximum curvature.

11. 11. The method according to any one of claims 1 to 10, wherein the step of attaching the electronic element can be performed by bonding, gluing or by other adhesives, optionally using substantially flexible means.

12. 12. The method according to any one of claims 1 to 11, wherein the steps of producing the conductors and / or the graphic bodies on the substantially flat film and attaching the plurality of electronic elements to the film can be performed by a continuous roll-to-roll or reel-to-reel process capable of printing the conductors and / or the graphic.

13. 13. The method of claim 1, wherein the step of thermoforming the flat film containing the plurality of electronic elements into the three-dimensional film is accomplished by vacuum forming or pressure forming or a combination thereof.

14. 14. The method of claim 1, wherein the step of thermoforming the flat film containing the plurality of electronic elements into the three-dimensional film is accomplished by billow molding, draping, blow molding, preforming, rotational molding, or a combination thereof.

15. 15. The method according to any one of claims 1 to 14, wherein the injection molding can be selected from at least one of co-injection molding, soluble core injection molding, gas-assisted injection molding, injection compression molding, insert molding, outsert molding, in-mold labelling, in-mold decoration, lamellar injection molding, low pressure injection molding, micro-injection molding, microcellular molding, multi-component injection molding (overmolding), multiple live feed injection molding, push-pull injection molding, powder injection molding, reaction injection molding, resin transfer molding, rheomolding, structural foam injection molding, thin wall molding, vibration gas injection molding, or water-assisted injection molding.

16. 16. The method of any one of claims 1 to 15, wherein the material cast onto the film can be optionally transparent and can include polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyamide (PA), cycloolefin copolymer (COC), cycloolefin polymer (COP), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), or mixtures thereof.

17. 17. The method of any one of claims 1 to 16, wherein the injection molding material substantially molded onto the film is partially molded substantially exclusively across the film surface.

18. The method of claim 17 , wherein the injection molding material is molded onto the surface portion of the film that contains the plurality of electronic elements.

19. The method of claim 17 , wherein the injection molding material is molded onto the surface portions of the film that do not contain the plurality of electronic elements.

20. 20. The method of any one of claims 1 to 19, wherein the injection molded material that is substantially molded onto the film encapsulates the entirety of the film.

21. 21. The method of claim 1, wherein the injection molding encapsulates the entire film except for the plurality of electronic elements.

22. 21. The method of any one of claims 1 to 20, wherein the injection molding encapsulates the entirety of the injection molded film and the plurality of electronic elements.

23. 23. The method of any one of claims 1 to 22, wherein the electromechanical structure is coated.

24. Apparatus for carrying out the method according to any one of claims 1 to 23, comprising: an entity for producing a plurality of conductors and / or a plurality of graphic bodies on a surface; an entity for mounting a plurality of electronic elements on a surface; an entity for thermoforming a substantially flat film into a substantially three-dimensional shape; [0033] An entity for injection molding; An apparatus comprising one or more of the following entities:

25. 25. The apparatus of claim 24, wherein the entity for producing a plurality of conductors and / or a plurality of graphic objects on the surface can include an inkjet printer, a screen printer, and the entity can be a roll-to-roll machine or a reel-to-reel machine.

26. 25. The apparatus of claim 24, wherein the entity for mounting the plurality of electrical elements on a surface can include a pick and place machine.

27. 25. The apparatus of claim 24, wherein the entity for thermoforming a substantially flat film into a substantially three-dimensional shape can include either a continuous roll-fed or an automatic in-precut-pieces-fed, optionally computer numerically controlled (CNC) machine, a thermoforming machine, a vacuum forming machine, a pressure forming machine, or a blow molding machine, or a combination thereof.

28. 25. The apparatus of claim 24, wherein the entity for injection molding can include a hydraulic, mechanical, electric or hybrid injection molding machine or a combination thereof.

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