Multi-stage board connection structure

Abstract

To obtain a multistage substrate connection structure in which attachment and detachment of substrates are easy.SOLUTION: A multistage substrate connection structure includes a high-frequency signal connection portion disposed between a first substrate and a second substrate and electrically connecting a first connector and a second connector, and a DC connecting portion which is a conductive elastic body disposed between the first substrate and the second substrate and electrically connecting a first DC conductor pattern and a second DC conductor pattern, and the attractive force that pulls the first substrate and the second substrate by fitting the first connector and the second connector by the high-frequency signal connection portion is stronger than the repulsive force of the DC connection portion that acts on the first board and the second board.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a multi-stage board connection structure in which boards (circuit boards) are arranged in multiple stages. [Background technology]

[0002] Conventionally, there is a multi-stage board connection structure in which a support member that supports a circuit board in an electronic device equipped with multiple circuit boards is used as a transmission path for wireless signals (for example, see Patent Document 1). Patent Document 1 uses a waveguide as the transmission path, and does not disclose any consideration of elasticity. In addition, there is no disclosure of measures against warping of the board due to vibration / shock or differences in linear expansion coefficient.

[0003] On the other hand, although there is no suggestion of application to a multi-stage board connection structure, in a module using a multilayer board, when the lid is connected to the seal ring by soldering or the like, the metal spring coil is compressed by the lid to maintain electrical connection, as disclosed in FIG. 33 of Patent Document 2. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2010-103978 A [Patent Document 2] Japanese Patent Application Publication No. 9-321501 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the conventional multi-stage substrate connection structure has a problem in that it is not designed to facilitate attachment and detachment of each substrate. Furthermore, Patent Document 1 does not mention the application of an elastic body such as a metal spring coil to the multi-stage substrate connection structure.

[0006] The present disclosure has been made to solve the above-mentioned problems, and has an object to provide a multi-stage substrate connection structure that allows easy attachment and detachment of substrates. [Means for solving the problem]

[0007] a first connector formed on the first substrate, electrically connected to the first high frequency signal conductor pattern and capable of outputting a high frequency signal to an external device; a first DC conductor pattern formed on the first substrate, transmitting a direct current; a second substrate having a main surface disposed opposite to a main surface of the first substrate; a second high frequency signal conductor pattern formed on the second substrate, transmitting a high frequency signal; a second connector formed on the second substrate, electrically connected to the second high frequency signal conductor pattern and capable of outputting a high frequency signal to an external device; a second DC conductor pattern formed on the second substrate, transmitting a direct current; a high frequency signal connection portion disposed between the first substrate and the second substrate, electrically connecting the first connector and the second connector; The high frequency signal connection portion and the DC connection portion are each formed at a plurality of locations. The high-frequency signal connection unit generates an attractive force that pulls the first board and the second board when the first connector and the second connector are fitted together. The sum of teeth, All Repulsive force between the first substrate and the second substrate due to the DC connection portion The sum of It is characterized by a greater force than Effect of the Invention

[0008] According to the present disclosure, it is possible to obtain a multi-stage substrate connection structure in which the first substrate can be easily removed from the second substrate, or the second substrate can be easily removed from the first substrate, by opening the high-frequency signal connection portion. [Brief description of the drawings]

[0009] [Figure 1] 1 is a cross-sectional view of a multistage substrate connection structure according to a first embodiment. [Diagram 2] 1 is a cross-sectional view of a multistage substrate connection structure according to a first embodiment (illustrating attractive and repulsive forces). [Diagram 3] 4 is an explanatory diagram of a DC connection portion (leaf spring) of the multistage substrate connection structure according to the first embodiment. FIG. [Figure 4] 4 is an explanatory diagram (spring plunger) of a DC connection portion of the multistage substrate connection structure according to the first embodiment. FIG. [Diagram 5] FIG. 11 is a cross-sectional view of a multi-stage substrate connection structure according to a second embodiment. [Figure 6] FIG. 11 is an explanatory diagram of a DC connection portion according to a second embodiment (an enlarged cross-sectional view of the vicinity of a spring plunger). [Figure 7] FIG. 11 is a cross-sectional view of a multi-stage substrate connection structure according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Embodiment 1 A multistage substrate connection structure according to a first embodiment will be described below with reference to Figs. 1 to 4. Fig. 1 is a cross-sectional view of the multistage substrate connection structure, and Fig. 2 is a cross-sectional view of the multistage substrate connection structure (illustrating attractive and repulsive forces). The cross-sectional views shown in Figs. 1 and 2 are views showing cross sections in a direction perpendicular to the main surfaces of the first substrate 1 and the second substrate 2, and exemplify cross sections passing through the portions where the connectors (first connector 4, second connector 7, high-frequency signal connection portion 9) are present. Therefore, cross sections of the connectors (first connector 4, second connector 7, high-frequency signal connection portion 9) are visible. Fig. 4 is a similar cross-sectional view, showing the inside of a spring plunger 10. In the drawings, the same reference numerals indicate the same or corresponding parts, and detailed descriptions thereof will be omitted.

[0011] In the multistage board connection structure according to the first embodiment, a first board 1 and a second board 2 are disposed with their main surfaces facing each other. The boards for the multistage board connection structure, such as the first board 1 and the second board 2, are preferably printed wiring boards (PWBs) for high frequency signals. Therefore, the finally obtained multistage board connection structure according to the first embodiment can be said to be composed of multiple stages of printed circuit boards (PCBs).

[0012] 1 to 4, the first high-frequency signal conductor pattern 3 is formed on the first substrate 1 and transmits high-frequency signals. Note that the first substrate 1 has a metallized through-hole or metal block that penetrates from one main surface (front surface) to the other main surface (back surface) and serves as a high-frequency signal penetrating conductor. The first high-frequency signal conductor pattern 3 is formed on the other main surface (back surface) of the first substrate 1 and is electrically connected to the high-frequency signal penetrating conductor.

[0013] 1 to 4, the first connector 4 is formed on the first substrate 1 and is electrically connected to the first high-frequency signal conductor pattern 3, and is capable of outputting a high-frequency signal to the outside. The first connector 4 is formed on the other main surface (back surface) of the first substrate 1. The first DC conductor pattern 5 is formed on the first substrate and transmits a direct current. Note that DC stands for Direct Current. The first substrate 1 has a metallized through-hole or metal block that penetrates from one main surface (front surface) to the other main surface (back surface) and serves as a DC through-hole conductor. The first DC conductor pattern 5 is formed on the other main surface (back surface) of the first substrate 1 and is electrically connected to the DC through-hole conductor.

[0014] 1 to 4, the second high-frequency signal conductor pattern 6 is formed on the second substrate 2 and transmits high-frequency signals. Note that the second substrate 2 has a metallized through-hole or metal block that penetrates from one main surface (front surface) to the other main surface (back surface) and serves as a high-frequency signal penetrating conductor. The second high-frequency signal conductor pattern 6 is formed on one main surface (front surface) of the second substrate 2 and is electrically connected to the high-frequency signal penetrating conductor.

[0015] 1 to 4, the second connector 7 is formed on the second substrate 6 and is electrically connected to the second high-frequency signal conductor pattern 6, and is capable of outputting a high-frequency signal to the outside. The second connector 7 is formed on one of the main surfaces (front surface) of the second substrate 2. The second DC conductor pattern 8 is formed on the second substrate 2, and transmits a direct current. In addition, the second substrate 2 has a metallized through-hole or metal block that penetrates from one of the main surfaces (front surface) to the other main surface (rear surface) and serves as a DC through conductor. The second DC conductor pattern 8 is formed on one of the main surfaces (front surface) of the second substrate 2, and is electrically connected to the DC through conductor.

[0016] 1 to 4, the high frequency signal connection section 9 (connector 9) is disposed between the first substrate 1 and the second substrate 2, and electrically connects the first connector 4 and the second connector 7. The first connector 4 and the second connector 7 may be collectively referred to as the high frequency signal connection section 9. The connector 9, the first connector 4, and the second connector 7 preferably have a snap-fit ​​structure. The DC connection section 10 is disposed between the first substrate 1 and the second substrate 2, and is a conductive elastic body that electrically connects the first DC conductor pattern 5 and the second DC conductor pattern 8.

[0017] The multistage substrate connection structure according to the first embodiment is characterized in that the attractive force with which high frequency signal connection section 9 pulls the first substrate and the second substrate by fitting first connector 4 and second connector 7 together (force in the direction indicated by the open arrow in FIG. 2) is greater than the repulsive force with which DC connection section 10 acts on first substrate 1 and second substrate 2 (force in the direction indicated by the solid arrow in FIG. 2). Therefore, the multistage substrate connection structure according to the first embodiment can apply a contact load to DC connection section 10 simply by the fitting forces of connector 9, first connector 4, and second connector 7.

[0018] It is preferable that the high frequency signal connection portion 9 and the DC connection portion 10 apply an attractive force and a repulsive force in a direction perpendicular to the main surfaces of the first substrate 1 and the second substrate 2, respectively. The high frequency signal connection portion 9 enables vertical transmission of high frequency signals and supports the first substrate 1 and the second substrate 2. It is also preferable that the high frequency signal connection portion 9 and the DC connection portion 10 are each formed at a plurality of locations, as shown in Figs. 1 and 2. Of course, the attractive force (the force in the direction indicated by the white arrow in Fig. 2) is the sum of the forces due to all the high frequency signal connection portions 9, and the repulsive force (the force in the direction indicated by the black arrow in Fig. 2) is the sum of the forces due to all the DC connection portions 10.

[0019] In the multi-stage substrate connection structure according to the first embodiment, as shown in Figs. 1 and 2, it is preferable that the high frequency signal connection portion 9 is disposed outside the DC connection portion 10 in the space between the first substrate 1 and the second substrate 2, whose main surfaces face each other. As shown in the drawings, the DC connection portion 10 is preferably a leaf spring 10 or a spring plunger 10. Fig. 3 is a perspective view of the leaf spring 10. Fig. 4 is a cross-sectional view of the spring plunger 10. As shown in Fig. 3, the leaf spring 10 may be a Z-shaped leaf spring bent in a Z shape. Depending on the fastening device, configurations such as those shown in Figs. 3(A) and 3(B) may be considered, but are not limited to these.

[0020] 3(A), the leaf spring 10 is composed of a leaf spring main body 10A and a leaf spring fastening portion 10B. The leaf spring fastening portion 10B is formed on the second DC conductor pattern 8 side of the Z-shaped leaf spring main body 10A, and electrically connects the DC connection portion 10 (leaf spring) and the second DC conductor pattern 8 by fastening it to the second substrate 2 with a fastening tool such as a screw.

[0021] 3(B), the leaf spring 10 is composed of a leaf spring main body 10A and a leaf spring fastening portion 10C. The leaf spring fastening portion 10C is formed on the second DC conductor pattern 8 side of the Z-shaped leaf spring main body 10A, and is fitted into the second substrate 2 to fasten it to the second substrate 2, thereby electrically connecting the DC connection portion 10 (leaf spring 10) and the second DC conductor pattern 8.

[0022] That is, the portion of the leaf spring 10 electrically connected to the second DC conductor pattern 8 is fixed to the second substrate 2 by leaf spring fastening portion 10B or leaf spring fastening portion 10C, and the portion electrically connected to the first DC conductor pattern 5 presses the first substrate 1. Of course, the portion of the leaf spring 10 electrically connected to the first DC conductor pattern 5 may be fixed to the first substrate 1 by leaf spring fastening portion 10B or leaf spring fastening portion 10C, and the portion electrically connected to the second DC conductor pattern 8 presses the second substrate 2.

[0023] Next, a case where the DC connection portion 10 is a spring plunger 10 will be described. As shown in Fig. 4, the spring plunger 10 is composed of a pressing side plunger portion 10D that presses the first substrate 1 (first DC conductor pattern 3), a fixed side plunger portion 10E that is fitted into the second substrate 2, and a barrel portion 10G that houses the entire spring portion 10F and houses parts of the pressing side plunger portion 10D and the fixed side plunger portion 10E. A repulsive force is applied to the pressing side plunger portion 10D and the fixed side plunger portion 10E by the spring portion 10F.

[0024] That is, a portion of spring plunger 10 electrically connected to second DC conductor pattern 8 is fixed inside second substrate 2, and a portion electrically connected to first DC conductor pattern 5 presses first substrate 1. Although not shown in the drawings, spring plunger 10 may of course be configured such that a portion electrically connected to first DC conductor pattern 5 is fixed inside first substrate 1, and a portion electrically connected to second DC conductor pattern 8 presses second substrate 2.

[0025] All of the DC connection parts 10 (leaf springs 10, spring plungers 10) may be fixed to either the first substrate 1 or the second substrate 2, or each DC connection part 10 may be fixed to either the first substrate 1 or the second substrate 2. Of course, the DC connection parts 10 may be fixed to both the first substrate 1 and the second substrate 2, but it is preferable that the DC connection parts 10 can be released when the first substrate 1 is removed from the second substrate 2 or the second substrate 2 is removed from the first substrate 1. When the first substrate 1 is easily removed from the second substrate 2 or the second substrate 2 is easily removed from the first substrate 1 by opening the connection of the high frequency signal connection part 9, it is better to fix all of the DC connection parts 10 (leaf springs 10, spring plungers 10) to either the first substrate 1 or the second substrate 2.

[0026] When a floating connector is used for the high frequency signal connection portion 9 (first connector 4 and second connector 7), the high frequency signal connection portion 9 (first connector 4 and second connector 7) can provide stress relief for thermal strain, etc., of the first substrate 1 and the second substrate 2. Of course, when the DC connection portion 10 (leaf spring 10, spring plunger 10) is only fixed to either the first substrate 1 or the second substrate 2, the DC connection portion 10 (leaf spring 10, spring plunger 10) can also provide stress relief for thermal strain, etc., of the first substrate 1 and the second substrate 2.

[0027] In this way, in the multi-stage substrate connection structure of embodiment 1, a contact load is applied to the DC connection portion 10 solely by the mating force of the connector 9, the first connector 4, and the second connector 7. Therefore, by releasing the connection of the high-frequency signal connection portion 9, a multi-stage substrate connection structure can be obtained in which the first substrate 1 can be easily removed from the second substrate 2, or the second substrate 2 can be easily removed from the first substrate 1.

[0028] Embodiment 2 Hereinafter, the multi-stage substrate connection structure according to the first embodiment will be described with reference to Figs. 5, 6, and 7. The cross-sectional views shown in Figs. 5 and 7 are diagrams showing cross sections in a direction perpendicular to the mutual main surfaces of the first substrate 1 and the second substrate 2 (a direction perpendicular to the mutual main surfaces of the second substrate 2 and the third substrate 11, and a direction perpendicular to the respective main surfaces of the second substrate 2, the third substrate 11, and the nth substrate 20), and illustrate cross sections passing through portions where connectors (the first connector 4, the second connector 7, and the high-frequency signal connection portion 9) are present. Fig. 7 is an enlarged view of the vicinity of the DC connection portion 10 and the second DC connection portion 19 in Fig. 5. Therefore, cross sections of the connectors (the first connector 4, the second connector 7, and the high-frequency signal connection portion 9) are visible. In the drawings, the same reference numerals indicate the same or corresponding parts, and detailed descriptions thereof will be omitted.

[0029] The multistage board connection structure according to the second embodiment includes a first board 1 and a second board 2 arranged with their main surfaces facing each other, and further includes one or more boards such as a third board 11. The boards for the multistage board connection structure such as the first board 1, the second board 2, and the third board 11 are preferably printed wiring boards (PWBs) for high frequency signals. Therefore, the finally obtained multistage board connection structure according to the second embodiment can be said to be composed of multiple stages of printed circuit boards (PCBs).

[0030] 5, 6 and 7, the third substrate 11 is disposed on the opposite side to the first substrate 1, with its main surface facing the main surface of the second substrate 2. The third high-frequency signal conductor pattern 12 is formed on the third substrate 11, and transmits high-frequency signals. In addition, a metallized through-hole or metal block that penetrates from one main surface (front surface) to the other main surface (back surface) is formed as a high-frequency signal penetrating conductor in the third substrate 11. The third high-frequency signal conductor pattern 12 is formed on one main surface (front surface) of the third substrate 11 and is electrically connected to the high-frequency signal penetrating conductor.

[0031] 5, 6, and 7, the third connector 13 is formed on the third substrate 11 and is electrically connected to the third high-frequency signal conductor pattern 12, and is capable of outputting the high-frequency signal to the outside. The third connector 13 is formed on one main surface (front surface) of the third substrate 11. The third DC conductor pattern 14 is formed on the third substrate 3 and transmits a direct current. In addition, the third substrate 11 has a metallized through-hole or metal block that penetrates from one main surface (front surface) to the other main surface (rear surface) and serves as a DC through conductor. The third DC conductor pattern 14 is formed on one main surface (front surface) of the third substrate 11 and is electrically connected to the DC through conductor.

[0032] 5, 6, and 7, the fourth high-frequency signal conductor pattern 15 is formed on the second substrate 2 and transmits a high-frequency signal. As described in the first embodiment, the second substrate 2 has a metallized through-hole or metal block that penetrates from one main surface (front surface) to the other main surface (back surface) and serves as a high-frequency signal penetrating conductor. The fourth high-frequency signal conductor pattern 15 is formed on the other main surface (back surface) of the second substrate 2 and is electrically connected to the high-frequency signal penetrating conductor. That is, the fourth high-frequency signal conductor pattern 15 is electrically connected to the second high-frequency signal conductor pattern 6 via the high-frequency signal penetrating conductor.

[0033] 5, 6, and 7, the fourth connector 16 is formed on the second substrate 2 and is electrically connected to the fourth high-frequency signal conductor pattern 15, and is capable of outputting a high-frequency signal to the outside. The fourth connector 16 is formed on the other main surface (rear surface) of the second substrate 2. The fourth DC conductor pattern 17 is formed on the second substrate 2 and transmits a direct current. As described in the first embodiment, the second substrate 2 has a metallized through-hole or metal block that penetrates one main surface (front surface) and the other main surface (rear surface) and serves as a DC through conductor. The fourth DC conductor pattern 17 is formed on the other main surface (rear surface) of the second substrate 2 and is electrically connected to the DC through conductor. That is, the fourth DC conductor pattern 17 is electrically connected to the second DC conductor pattern 8 via the DC through conductor.

[0034] 5, 6, and 7, the second high-frequency signal connection portion 18 is disposed between the third substrate 11 and the second substrate 2, and electrically connects the third connector 13 and the fourth connector 16. The second high-frequency signal connection portion 18 has the same configuration as the high-frequency signal connection portion 9 described in the first embodiment. The third connector 13 and the fourth connector 16 may be collectively referred to as the second high-frequency signal connection portion 18. The connector 18, the third connector 13, and the fourth connector 16 are preferably of a snap-fit ​​structure, as are the connector 9, the first connector 4, and the second connector 7. The second DC connection portion 19 is disposed between the third substrate 11 and the second substrate 2, and is a conductive elastic body that electrically connects the third DC conductor pattern 14 and the fourth DC conductor pattern 17. The second DC connection portion 19 has the same configuration as the DC connection portion 10 described in the first embodiment. Therefore, it can be said that the second DC connecting portion 19 is preferably the leaf spring 10 (leaf spring 19) and the spring plunger 10 (spring plunger 19) shown in Figs. 3 and 4 and described in the first embodiment.

[0035] As shown in Fig. 6, the second DC connection portion 19 is desirably formed at a position shifted from the portion of the second substrate 2 to which the spring plunger 10 is fixed in the direction perpendicular to the main surface of the second substrate 2 (the third substrate 11 and the second substrate 2). Furthermore, when the second DC connection portion 19 is the second spring plunger 19 (spring plunger 19), it is desirably configured such that the portion of the second spring plunger 19 electrically connected to the third DC conductor pattern 14 is fixed inside the third substrate 11, and the portion electrically connected to the fourth DC conductor pattern 14 presses against the second substrate 2, as shown in Fig. 6.

[0036] In the multistage substrate connection structure according to the second embodiment, the relationship between the second substrate 2 and the third substrate 11 and the structural relationship between the second substrate 2 and the third substrate 11 are similar to the relationship between the first substrate 1 and the second substrate 2 and the structural relationship between the first substrate 1 and the second substrate 2 explained in the multistage substrate connection structure according to the first embodiment, and therefore a description thereof will be omitted. The mutual correspondence is as follows.

[0037] That is, the fourth high-frequency signal conductor pattern 15 corresponds to the first high-frequency signal conductor pattern 3. The fourth connector 16 corresponds to the first connector 4. The fourth DC conductor pattern 17 corresponds to the first DC conductor pattern 5. The third high-frequency signal conductor pattern 12 corresponds to the second high-frequency signal conductor pattern 6. The third connector 13 corresponds to the second connector 7. The third DC conductor pattern 14 corresponds to the second DC conductor pattern 8. The second high-frequency signal connection portion 18 (connector 18) corresponds to the high-frequency signal connection portion 9 (connector 9). The second DC connection portion 19 (leaf spring 19, spring plunger 19) corresponds to the DC connection portion 10 (leaf spring 10, spring plunger 10).

[0038] 5 and 6 have been described with respect to the case where there are three substrates (first substrate 1, second substrate 2, and third substrate 11), but the multistage substrate connection structure according to the second embodiment may have n substrates (n is a positive integer equal to or greater than 3) as shown in FIG. 7. In FIG. 7, the nth substrate 20 is shown, but the (n-1)th substrate is not. The relationship between the (n-1)th substrate and the nth substrate, and the structural relationship between the (n-1)th substrate and the nth substrate are similar to the relationship between the first substrate 1 and the second substrate 2 (the second substrate 2 and the third substrate 11), and the structural relationship between the first substrate 1 and the second substrate 2 (the second substrate 2 and the third substrate 11), which have been described in the multistage substrate connection structure according to the first embodiment, and the multistage substrate connection structure according to the second embodiment.

[0039] Therefore, a description of high frequency signal conductor patterns corresponding to the first high frequency signal conductor pattern 3 and the fourth high frequency signal conductor pattern 15 will be omitted. A description of connectors corresponding to the first connector 4 and the fourth connector 16 will be omitted. A description of DC conductor patterns corresponding to the first DC conductor pattern 5 and the fourth DC conductor pattern 17 will be omitted. A description of high frequency signal conductor patterns corresponding to the second high frequency signal conductor pattern 6 and the third high frequency signal conductor pattern 12 will be omitted. A description of connectors corresponding to the second connector 7 and the third connector 13 will be omitted.

[0040] Similarly, description of the DC conductor patterns corresponding to the second DC conductor pattern 8 and the third DC conductor pattern 14 will be omitted. Description of the high frequency signal connection portion (connector) corresponding to the high frequency signal connection portion 9 (connector 9) and the second high frequency signal connection portion 18 (connector 18) will be omitted. Description of the DC connection portion (leaf spring 10, spring plunger 10) and the DC connection portion (leaf spring, spring plunger) corresponding to the second DC connection portion 19 (leaf spring 19, spring plunger 19) will be omitted.

[0041] The multistage board connection structure according to the second embodiment is characterized in that the attractive force with which second high frequency signal connection portion 18 pulls third board 11 and second board 2 by fitting third connector 13 and fourth connector 16 together is greater than the repulsive force of second DC connection portion 19 on third board 11 and second board 2. For this reason, the multistage board connection structure according to the second embodiment is not only able to apply a contact load to DC connection portion 10 solely by the fitting forces of connector 9, first connector 4, and second connector 7, but also able to apply a contact load to second DC connection portion 19 solely by the fitting forces of connector 18, third connector 13, and fourth connector 16. This is also true for the (n-1)th board and the nth board.

[0042] In this way, in the multistage board connection structure according to the second embodiment, as in the first embodiment, a contact load is applied to the DC connection portion 10 only by the mating forces of the connector 9, the first connector 4, and the second connector 7, so that a multistage board connection structure can be obtained in which the first board 1 can be easily removed from the second board 2 or the second board 2 can be easily removed from the first board 1 by opening the connection of the high frequency signal connection portion 9. Furthermore, in the multistage board connection structure according to the second embodiment, a contact load is applied to the second DC connection portion 19 only by the mating forces of the connector 18, the third connector 13, and the fourth connector 16, so that a multistage board connection structure can be obtained in which the second board 2 can be easily removed from the third board 11 or the third board 11 can be easily removed from the second board 2 by opening the connection of the second high frequency signal connection portion 18. This is also true for the (n-1)th board and the nth board. [Explanation of symbols]

[0043] 1 First board 2 Second board 3 First high frequency signal conductor pattern 4 First Connector 5 First DC conductor pattern 6 Second high frequency signal conductor pattern 7 Second Connector 8 Second DC conductor pattern 9 High frequency signal connection (connector) 10 DC connection (leaf spring, spring plunger) 10A Leaf spring body 10B Leaf spring fastening part 10C Leaf spring fastening part 10D Pressing side plunger part 10E Fixed side plunger part 10F Spring section 10G barrel part 11 Third board 12 Third high frequency signal conductor pattern 13 3rd Connector 14 3rd DC conductor pattern 15 Fourth high frequency signal conductor pattern 16 4th Connector 17 4th DC conductor pattern 18 Second high frequency signal connection part (connector) 19 Second DC connection (leaf spring, spring plunger) 20 nth substrate.

Claims

1. a first substrate, a first high frequency signal conductor pattern formed on the first substrate and transmitting a high frequency signal, a first connector formed on the first substrate and electrically connected to the first high frequency signal conductor pattern and capable of outputting a high frequency signal to an outside, a first DC conductor pattern formed on the first substrate and transmitting a direct current, a second substrate having a main surface disposed opposite to a main surface of the first substrate, a second high frequency signal conductor pattern formed on the second substrate and transmitting a high frequency signal, a second connector formed on the second substrate and electrically connected to the second high frequency signal conductor pattern and capable of outputting a high frequency signal to an outside, a second DC conductor pattern formed on the second substrate and transmitting a direct current, a high frequency signal connection portion disposed between the first substrate and the second substrate and electrically connecting the first connector and the second connector, and a DC connection portion which is a conductive elastic body disposed between the first substrate and the second substrate and electrically connecting the first DC conductor pattern and the second DC conductor pattern, The high frequency signal connection portion and the DC connection portion are each formed at a plurality of locations, A multi-stage substrate connection structure characterized in that the sum of the attractive forces that all of the high-frequency signal connection parts exert on the first substrate and the second substrate by engaging the first connector and the second connector is greater than the sum of the repulsive forces exerted on the first substrate and the second substrate by all of the DC connection parts.

2. 2. The multi-stage board connection structure according to claim 1, wherein the first connector and the second connector are floating connectors.

3. The multi-stage substrate connection structure according to claim 1 or claim 2, characterized in that the high-frequency signal connection portion and the DC connection portion apply the attractive force and the repulsive force in a direction perpendicular to the main surfaces of the first substrate and the second substrate, respectively.

4. A multi-stage substrate connection structure as described in any one of claims 1, 2, and 3, characterized in that the high-frequency signal connection portion is positioned outside the DC connection portion in the space between the first substrate and the second substrate, whose main surfaces face each other.

5. 5. The multi-stage substrate connection structure according to claim 1, wherein the DC connection portion is a leaf spring.

6. 6. The multi-stage board connection structure according to claim 5, wherein the leaf spring is a Z-shaped leaf spring bent in a Z shape.

7. 5. The multi-stage substrate connection structure according to claim 1, wherein the DC connection portion is a spring plunger.

8. The multi-stage substrate connection structure described in claim 7, characterized in that the portion of the spring plunger electrically connected to the first DC conductor pattern is fixed inside the first substrate, and the portion of the spring plunger electrically connected to the second DC conductor pattern presses against the second substrate.

9. The multi-stage substrate connection structure described in claim 7, characterized in that the portion of the spring plunger electrically connected to the second DC conductor pattern is fixed inside the second substrate, and the portion of the spring plunger electrically connected to the first DC conductor pattern presses against the first substrate.

10. a third substrate having a principal surface disposed opposite to the principal surface of the second substrate on the opposite side to the first substrate; a third high frequency signal conductor pattern formed on the third substrate and transmitting a high frequency signal; a third connector formed on the third substrate and electrically connected to the third high frequency signal conductor pattern to be able to output a high frequency signal to an outside; a third DC conductor pattern formed on the third substrate and transmitting a direct current; a fourth high frequency signal conductor pattern formed on the second substrate and transmitting a high frequency signal; a fourth connector formed on the second substrate and electrically connected to the fourth high frequency signal conductor pattern to be able to output a high frequency signal to an outside; a fourth DC conductor pattern formed on the second substrate and transmitting a direct current; a second high frequency signal connection portion disposed between the third substrate and the second substrate and electrically connecting the third connector and the fourth connector; and a second DC connection portion which is a conductive elastic body disposed between the third substrate and the second substrate and electrically connecting the third DC conductor pattern and the fourth DC conductor pattern, the second high frequency signal connection portion and the second DC connection portion are each formed at a plurality of locations, A multi-stage substrate connection structure as described in any one of claims 1 to 9, characterized in that the sum of the attractive forces that all of the second high-frequency signal connection parts pull the third substrate and the second substrate by engaging the third connector and the fourth connector is greater than the sum of the repulsive forces that all of the second DC connection parts exert on the third substrate and the second substrate.

11. A multi-stage substrate connection structure as described in claim 10, which cites claim 9, characterized in that the second DC connection portion is formed at a position offset from the portion of the second substrate to which the spring plunger is fixed in a direction perpendicular to the main surfaces of the third substrate and the second substrate.

12. The multi-stage substrate connection structure described in claim 11, characterized in that the second DC connection portion is a second spring plunger, and the portion of the second spring plunger that is electrically connected to the third DC conductor pattern is fixed inside the third substrate, and the portion of the second spring plunger that is electrically connected to the fourth DC conductor pattern presses against the second substrate.

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