Optical connector device with lid

Abstract

An optical connector device is provided. The optical connector device includes a semiconductor package including a receptacle and a lid. The optical connector device also includes an adapter attached to the lid of the semiconductor package and a connector removably attached to the adapter. The adapter includes a protrusion configured to fit into the adapter opening in the lid, an adapter recess configured to receive at least a portion of the connector, and a first retainer in the adapter recess that removably attaches the connector to the adapter at a predetermined position. The connector includes an optical fiber array that corresponds to the receptacle and extends perpendicular to the plane of the semiconductor package, a second retainer used in conjunction with the first retainer, and a biasing member that biases a portion of the connector toward the semiconductor package.

Description

[Technical field]

[0001] The present disclosure relates to the electrical, electronic, and computer fields. In particular, the present disclosure relates to an optical connector for an optical multi-chip module (MCM), the optical connector including a lens array that can be used to connect optical waveguides and optical fibers from one module to another. Summary of the Invention

[0002] An embodiment of the present disclosure relates to an optical connector device. The optical connector device includes a semiconductor package including a receptacle and a lid. The optical connector device also includes an adapter attached to the lid of the semiconductor package and a connector removably attached to the adapter. The adapter includes a protrusion configured to fit into an adapter opening of the lid, an adapter recess configured to accommodate at least a portion of the connector, and a first retainer in the adapter recess for removably attaching the connector to the adapter at a predetermined position. The connector includes an optical fiber array corresponding to the receptacle and extending perpendicularly to a plane of the semiconductor package, a second retainer used in conjunction with the first retainer, and a biasing member for biasing a portion of the connector toward the semiconductor package.

[0003] Another embodiment of the present disclosure relates to an optical connector device. The optical connector device includes a semiconductor package including a receptacle and a lid, a connector mountable to the receptacle, an adapter movably coupled to the connector and removably attached to the lid, and a biasing member disposed between the connector and the adapter. The biasing member is configured to bias the connector toward the semiconductor package. The connector includes an optical fiber array corresponding to the receptacle and extending in a direction perpendicular to a plane of the semiconductor package, and a protrusion configured to fit into a connector opening of the lid. The adapter also includes a first retainer configured to fit into a first retainer opening of the lid.

[0004] The above summary is not intended to describe each illustrated embodiment or every implementation of the present disclosure.

[0005] The drawings contained herein are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, explain the principles of the present disclosure. The drawings are merely illustrative of particular embodiments and are not intended to limit the disclosure in any way. [Brief description of the drawings]

[0006] [Figure 1] 1 is a cross-sectional view of a basic configuration of a multi-chip module (MCM) optical fiber connection device according to an embodiment. [Figure 2A] 1A-1D are cross-sectional views of an optical connector apparatus at intermediate stages in a manufacturing or assembly process according to an embodiment. [Figure 2B] FIG. 2B is a top view of the receptacle of the optical connector device shown in FIG. 2A according to an embodiment. [Figure 2C] 2B is a cross-sectional view of the optical connector apparatus of FIG. 2A at a subsequent stage in a manufacturing or assembly process according to an embodiment. [Figure 2D] FIG. 2D is a top view of the cover of the optical connector device shown in FIG. 2C according to an embodiment. [Figure 2E] 2C at a subsequent stage in a manufacturing or assembly process according to an embodiment. [Figure 2F] FIG. 2F is a side view of the adapter shown in FIG. 2E, according to an embodiment. [Figure 2G] FIG. 2F is a bottom view of the adapter shown in FIG. 2E, according to an embodiment. [Figure 2H] 2E at a subsequent stage in a manufacturing or assembly process according to an embodiment. [Figure 2I] FIG. 2C is a side view of the connector of the optical connector device of FIG. 2H according to an embodiment. [Figure 2J] FIG. 2C is a bottom view of the connector of the optical connector device shown in FIG. 2H according to an embodiment. [Figure 3A]1A-1D are cross-sectional views of an optical connector apparatus at intermediate stages in a manufacturing or assembly process according to an embodiment. [Figure 3B] FIG. 3B is a top view of the adapter and fiber optic bundle of FIG. 3A according to an embodiment. [Figure 3C] FIG. 3B is a top view of the connector and lid of FIG. 3A according to an embodiment. [Figure 3D] FIG. 3B is a side view of the connector and lid of FIG. 3A according to an embodiment. [Figure 3E] FIG. 3B is a side view of the adapter and lid of FIG. 3A according to an embodiment. [Figure 3F] FIG. 3B is a bottom view of the connector and lid of FIG. 3A according to an embodiment. [Figure 3G] FIG. 3B is a bottom view of the connector, lid, and adapter of FIG. 3A according to an embodiment. [Figure 3H] 3B illustrates a three-step attachment of an adapter and a connector to the lid of the optical connector device shown in FIG. 3A according to an embodiment. [Figure 3I] 3B illustrates a three-step attachment of an adapter and a connector to the lid of the optical connector device shown in FIG. 3A according to an embodiment. [Figure 3J] 3B illustrates a three-step attachment of an adapter and a connector to the lid of the optical connector device shown in FIG. 3A according to an embodiment. [Figure 4] 3B is a force diagram applied to the optical connector device shown in FIG. 3A according to an embodiment. [Diagram 5] 1 is a cross-sectional view of an optical connector device including a connector, an adapter, a lid, and a receptacle according to an embodiment. [Figure 6A] FIG. 2 is a top view of an adapter of an optical connector device according to an embodiment. [Figure 6B] 1 is a side view of an adapter of an optical connector device according to an embodiment. [Figure 6C] 1 is a cross-sectional view of an adapter of an optical connector device according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] It will be appreciated that elements in the figures have been illustrated for purposes of simplicity and clarity, and that well-understood elements that may be useful or necessary in a commercially feasible embodiment may not be shown for the sake of simplicity and to aid in understanding the illustrated embodiment.

[0008] The present disclosure describes an optical connector device. In particular, the embodiments disclosed herein include optical connector devices that include various combinations of adapters and connectors. The connector includes an optical fiber bundle array, and the adapter serves to precisely and flexibly secure the connector to a semiconductor package mounted on a substrate. Each embodiment includes components of the optical connector device that allow for both coarse and fine alignment of the adapter and connector to a receptacle of the semiconductor package. Furthermore, the embodiments allow for reducing stress that may be applied to the optical fibers of the optical fiber bundle array or to the connector itself. In related devices, tension from the optical fibers may have the effect of damaging the connector. The adapter of the present embodiment can reduce these effects.

[0009] Various embodiments of the present disclosure are described herein with reference to the associated drawings. Alternative embodiments may be devised without departing from the scope of the present disclosure. It should be noted that in the following description and drawings, various connections and positional relationships (e.g., above, below, adjacent, etc.) between elements are shown. These connections and / or positions can be either direct or indirect unless otherwise specified, and the present disclosure is not intended to be limiting in this respect. Thus, the coupling of entities can represent direct or indirect coupling, and the positional relationship between entities can be either direct or indirect. As an example of an indirect positional relationship, references herein to forming a layer "A" above a layer "B" include situations where one or more intermediate layers (e.g., layer "C") are present between layers "A" and "B", so long as the relevant properties and functions of layers "A" and "B" are not substantially altered by the intermediate layers.

[0010] The following definitions and abbreviations shall be used in interpreting the claims and the specification. As used herein, the terms "comprise," "comprising," "include," "including," "have," "having," "contain," "containing," or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a composition, mixture, process, method, article, or device comprising a list of elements is not necessarily limited to only those elements, but may also include other elements not expressly listed or other elements not inherent to such composition, mixture, process, method, article, or device.

[0011] For purposes of the following description, the terms "upper," "lower," "right," "left," "vertical," "horizontal," "top," "bottom," and derivatives thereof, refer to the structures and methods described as oriented in the figures. The terms "overlying," "atop," "on top," and "positioned on" refer to a first element, such as a first structure, being on a second element, such as a second structure, and an intervening element, such as an interface structure, may be between the first and second elements. The term "direct contact" refers to a first element, such as a first structure, and a second element, such as a second structure, being connected at the interface between the two elements without any intermediate conductive, insulating, or semiconducting layer. It should be noted that the term "selective to" (e.g., "a first element selective to a second element") means that the first element can be etched and the second element can act as an etch stop.

[0012] In the drawings referenced below, like numbers represent the same or similar elements. Referring initially to FIG. 1, this figure illustrates an example of a general conceptual configuration of an MCM fiber optic interconnect 100, in accordance with an embodiment. As shown in FIG. 1, a substrate 102 (e.g., an organic substrate) is provided that may serve as a supporting base structure for other components of the MCM fiber optic interconnect 100. A lid 104 (e.g., a heat sink lid) then covers the various components of the MCM fiber optic interconnect 100.

[0013] 1, in certain embodiments, MCM fiber optic interconnect 100 may include a chip scale package 110 (CSP) (or other circuitry electrically connected to organic substrate 102) connected to an organic substrate 102 by a first plurality of bonding pads 112 (e.g., solder bumps). Similarly, CSP 110 may have a logic chip 114 (e.g., a central processing unit or CPU) connected to it by a second plurality of bonding pads 113. In certain embodiments, lid 104 covers CSP 100 and logic chip 114.

[0014] 1, there is a light emitting section 160 and a light receiving section 162 for the MCM optical fiber connection device 100. The light emitting section 160 may include a light emitting device 150 (e.g., one or more vertical cavity surface emitting lasers or VCSELs, or any other suitable light emitting device). The light receiving section 162 may include a light receiving device 152 (e.g., one or more photodiodes or PDs, or any other suitable light receiving device). Generally, in certain embodiments, light generated in the light emitting device 150 passes through the first optical waveguide 105A (i.e., a light guide plate) by the first reflecting element 106A. The reflected light travels up to the first receptacle 132, then through the first adapter 130, the first connector 128, and the first connector cap 126 to the optical fiber array 122. The light passes through the optical fiber array 122 from the light emitter 160 to the light receiver 162. In particular, the light passes through the second connector cap 120, the second connector 118, the second adapter 116, and the second receptacle 138. The light that passes through the second receptacle is received by the second light guide 105B (i.e., a light guide plate) and passes through the second light guide 105B to the light receiver device 152 by the second reflecting element 106B. In certain embodiments, the lid 104 has holes (or perforations or openings) that accommodate at least the first adapter 130 and the second adapter 116. In certain embodiments, the holes in the lid 104 can also accommodate at least a portion of the first receptacle 132 and the second receptacle 138. Thus, in the MCM optical fiber connection device 100, the light emitter 160 and the light receiver 162 enable transmission from one side to the other side via the optical fiber array 122 and the other components described above. It will be appreciated that Figure 1 is a conceptual diagram of some of the components of an exemplary MCM optical fiber connection device 100, and is merely intended to illustrate the manner in which light is transmitted through an optical connector, and that additional components may be present, or some of the components shown in Figure 1 may not be included. Additionally, the various components shown in Figure 1 may not be drawn to scale.

[0015] Reference is now made to Figures 2A-2J, with reference first to Figure 2A, which is a cross-sectional view of one embodiment of an optical connector device 201 at an intermediate stage of a manufacturing or assembly process. As shown in Figure 2A, a substrate 200 is provided. In certain embodiments, the substrate 200 may be comprised of one or more organic materials. An optical waveguide 202 is provided on the substrate 200. The optical waveguide 202 may be similar to or different from the optical waveguides 105A and 105B described above with respect to Figure 1. A first optical fiber connection array 204 is provided on or within the optical waveguide 202. The first optical fiber connection array 204 may include, for example, an array of 12 or 24 different optical fiber lenses that receive or transmit light through the optical waveguide 202. In other words, light may pass through the lenses of the optical fiber connection array 204 from the top side or the bottom side.

[0016] As shown in FIG. 2A, a receptacle 206 is provided above the optical waveguide 202. Thus, in a particular example, the receptacle 206 is attached to the waveguide-integrated organic substrate 200 and secured thereto, for example, using an adhesive. In a particular embodiment, the receptacle 206 includes alignment recesses 207 configured to receive alignment pins from the adapter 224, as discussed in more detail below. The receptacle 206 also includes a second optical fiber connection array 208. The second optical fiber connection array 208 has the same number and pattern of lenses as the first optical fiber connection array 204 described above with respect to the optical waveguide. FIG. 2B shows a top view of the receptacle 206 including the second optical fiber connection array 208. In the example shown in FIG. 2B, the second optical fiber connection array 208 includes an array of 2×12 lenses, although it will be appreciated that any suitably sized array may be used.

[0017] Reference is now made to Figure 2C, which is a cross-sectional view of the embodiment of the optical connector device 201 shown in Figure 2A at a subsequent stage in the manufacturing or assembly process. A lid 212 is attached to the substrate 200 with an adhesive. Figure 2D shows a top view of the lid 212 of Figure 2C, where the lid 212 includes a first opening 222 corresponding to the dimensions of the receptacle 206. The lid 212 also includes, for example, two mounting holes 214. In this example, the mounting holes 214 are on either side of the first opening 222. As will be discussed in more detail below, the mounting holes 214 are configured to receive screws used to secure the adapter 224 to the lid 212.

[0018] Reference is now made to FIG. 2E, which is a cross-sectional view of the optical connector device of FIG. 2C at a subsequent stage of the manufacturing or assembly process, according to an embodiment. As shown in FIG. 2E, an adapter 224 is fitted to the receptacle 206 and screwed to the lid 212. In particular, the adapter 224 includes two studs 228 that fit into the alignment recesses 207 of the receptacle 206. As shown in the example of FIG. 2E, the studs 228 may have a tapered portion 229 (or tapered end) that may allow the studs 228 to easily slide into the alignment recesses 207 of the receptacle 206. Of course, the studs 228 may have any suitable shape or profile that may facilitate connection between the receptacle 206 and the adapter 224 as well as allow fine alignment therebetween. Thus, after mating of adapter 224 with receptacle 206 (i.e., by insertion of studs 228 into alignment recesses 207), third optical fiber connection array 234 (i.e., part of adapter 224) is aligned with first optical fiber connection array 204 and second optical fiber connection array 208. In this manner, all three optical fiber connection arrays are aligned with one another to allow light to pass from light guide 202 through receptacle 206 and adapter 224. Additionally, as shown in FIG. 2E, screws 226 are used to attach adapter 224 to lid 212.

[0019] As shown in FIG. 2E, in certain embodiments, the adapter 224 includes a connector recess 236 that allows for attachment of a connector, as discussed in more detail below. The adapter 224 is formed with two guide pin recesses 232′ that receive two guide pins 232 (see FIG. 2I). The guide pins 232 may be constructed of a metallic material (or any other suitable material) and may have a diameter of, for example, approximately 0.7 mm (or any other suitable diameter). As shown in FIG. 2E, the adapter 224 includes two leaf springs 238 that extend upward from the connector recesses 236. The leaf springs 238 are configured to guide the insertion and retention of the connector in any suitable manner, as discussed in more detail below. In this example, the leaf springs 238 include a retention portion having an angled upper surface 240 that guides the connector into the connector recess 236 of the adapter 224. Additionally, in this example, the retaining portion of leaf spring 238 includes a sloped lower surface 242 that acts as a detent or retention structure to prevent removal of the connector after it has been inserted and connected to adapter 224. Of course, the particular shape of leaf spring 238 should not be construed as limiting in any way, and any suitable shape that facilitates both insertion and retention of a connector (see connector 250 in FIG. 2H) may be used. For example, instead of sloped upper surface 240 and sloped lower surface 242 of leaf spring 238, there may be a curved surface profile on the inside of leaf spring 238.

[0020] Reference is now made to Figure 2F, which is a side cross-sectional view of the adapter 224 shown in Figure 2E, according to an embodiment. As shown in Figure 2F, the adapter 224 includes a stud 228 extending from a bottom surface of the adapter 224. The adapter 224 also includes a lower portion 244 having a width in the Y direction that corresponds approximately to the width of the first opening 222 of the lid 212 in the Y direction (i.e., the width of the lower portion 244 is slightly smaller than the width of the first opening 222 so that the lower portion 244 can fit into the first opening 222) and a length in the X direction that corresponds approximately to the length of the first opening 222 of the lid 212 in the X direction (i.e., the length of the lower portion 244 is slightly smaller than the length of the first opening 222 so that the lower portion 244 can fit into the first opening 222). 2F , adapter 224 includes an upper portion 246 that has a width in the Y-direction that is greater than the width in the Y-direction of first opening 222. Thus, a bottom surface of stud 228 (of adapter 224) contacts (or is close to) a bottom surface of alignment recess 207 of receptacle 206, and an intermediate bottom surface 247 of adapter 224 contacts a top surface of lid 212.

[0021] Reference is now made to Figure 2G, which is a bottom view of the adapter 224 shown in Figure 2E, according to an embodiment. The adapter 224 is provided with threaded holes 248 that receive the screws 226 shown in Figure 2E. Also shown is the third optical fiber connection array 234. Of course, in certain embodiments, the diameter of the threaded holes 248 is slightly larger than the diameter of the screws 226, as the screws 226 are not required for fine alignment of the adapter 224 with the receptacle 206 (i.e., this fine alignment is achieved by the studs 228 of the adapter 224 and the alignment recesses 207 of the receptacle 206).

[0022] Reference is now made to FIG. 2H, which is a cross-sectional view of a connector 250 of an optical connector device 201, according to an embodiment. As shown in FIG. 2H, the connector 250 is mated to the adapter 224 (i.e., fitted into the connector recess) by the guide pin 232. In a particular embodiment, the connector 250 includes a slider 252 movably coupled to the body of the connector 250. The connector 250 also includes a spring 254 biasing the slider 252 in a vertical Z direction away from the body of the connector 250. The body of the connector 250 also includes a first body protrusion 264 having a first inclined lower surface 260 and a second inclined upper surface 262. When the connector 250 is attached to the adapter 224, the first inclined lower surface 260 of the connector 250 first contacts the inclined upper surface 240 of the leaf spring 238. As connector 250 moves downward after this initial contact, leaf spring 238 is biased outward until connector 250 snaps into place in connector recess 236 of adapter 224. When connector 250 is connected to adapter 224, as shown in FIGURE 2H, leaf spring 238 returns to place such that angled lower surface 242 of leaf spring 238 contacts (or approaches) second angled upper surface 262 of first body projection 264 of connector 250. In this manner, leaf spring 238 acts as a detent to keep connector 250 attached to adapter 224.

[0023] 2H, when the connector 250 is snapped into place, the spring 254 biases the slider 252 downward. When the connector 250 is to be removed, the slider 252 may be pulled upward. As the connector 250 and slider 252 are pulled upward, the leaf spring 238 is biased outward, releasing the connector 250 from the adapter 224. Also, the second body projection 266 of the connector 250 extends outward from the connector 250 and is positioned above the leaf spring 238. The spring 254 is positioned between the first slider projection 270 of the slider 252 and the third body projection 268 of the connector 250. Although not shown in FIG. 2H, when the connector 250 and slider 252 are not attached to the adapter 224, the spring 254 may bias the slider 252 so that the first slider protrusion 270 contacts the second body protrusion 266 of the connector 250. However, as shown in FIG. 2H, when the connector 250 and slider 252 are attached to the adapter 224, a small gap may exist between the first slider protrusion 270 and the second body protrusion 266 of the connector 250. Also, as shown in FIG. 2H, an optical fiber bundle 258 is connected to the top of the connector 250. This optical fiber bundle 258 may be the same as or similar to the optical fiber array 122 described above with reference to FIG. 1.

[0024] 2I, which is a side cross-sectional view of the connector 250 of the optical connector arrangement shown in FIG. 2H, according to an embodiment. Two guide pins 232 are fitted into recesses of the connector 250. FIG. 2J is a bottom view of the connector 250 of the optical connector arrangement shown in FIG. 2H, according to an embodiment. In certain embodiments, the first dimension d1 (e.g., 5.2 mm) of the connector 250 may be larger than the second dimension d2 (e.g., 3.2 mm) of the connector 250. In other embodiments, these relative dimensions may be different. As shown in FIG. 2J, the body of the connector 250 is provided with a connector hole 280 to receive the guide pin 232. In other words, the guide pin 232 allows for fine alignment between the adapter 224 and the connector 250. As mentioned above, the stud 228 of the adapter 224 and the alignment recess 207 of the receptacle 206 allow for fine alignment between the adapter 224 and the receptacle 206. Thus, fine alignment between all three elements, the receptacle 206, the adapter 224, and the connector 250, may be achieved such that the first optical fiber connection array 204, the second optical fiber connection array 208, the third optical fiber connection array 234, and the fourth optical fiber connection array 282 of the connector 250 (see FIG. 2J) are all aligned with one another.

[0025] Reference is now made to Figures 3A-3J, beginning with Figure 3A, which is a cross-sectional view of one embodiment of an optical connector device 301 at an intermediate stage in the manufacturing or assembly process. In this embodiment, in contrast to the embodiment described above with respect to Figures 2A-2J, the connector is attached and aligned directly to the receptacle (rather than the adapter). Also, in this embodiment, in contrast to the first embodiment described above with respect to Figures 2A-2J, the adapter is attached to the outside of the connector (rather than the connector being outside the adapter). Additionally, the adapter does not include an optical fiber array (i.e., the optical connector device only includes a total of three optical fiber arrays compared to the four optical fiber arrays of the first embodiment).

[0026] As shown in FIG. 3A, a substrate 300 is provided. In certain embodiments, the substrate 300 may be composed of one or more organic materials. A light guide 302 is provided on the substrate 300. The light guide 302 may be similar to or different from the light guides 105A and 105B described above with respect to FIG. 1. A first optical fiber connection array 304 is provided on or within the light guide 302. The first optical fiber connection array 304 may include, for example, an array of 12 or 24 different optical fiber lenses that receive or transmit light through the light guide 302. In other words, light can pass through the lenses of the optical fiber connection array 304 from the top side or the bottom side.

[0027] 3A, a receptacle 306 is provided above the optical waveguide 302. Thus, in certain examples, the receptacle 306 is attached to the waveguide-integrated organic substrate 300 and secured thereto using, for example, an adhesive. In certain embodiments, the receptacle 306 includes alignment recesses 307 configured to receive alignment pins from a connector, as discussed in more detail below. The receptacle 306 also includes a second optical fiber connection array 308. The second optical fiber connection array 308 has the same number and pattern of lenses as the first optical fiber connection array 304 described above with respect to the optical waveguide 302.

[0028] As shown in FIG. 3A, a lid 312 is attached (e.g., with an adhesive) to the substrate 300. The lid 312 includes a first opening 322 that roughly corresponds to the dimensions of the receptacle 306 (although the dimensions of the first opening 322 may be somewhat larger than the dimensions of the receptacle 306). The lid 312 also includes, for example, two adapter mounting holes 314. In this example, the adapter mounting holes 314 are on either side of the first opening 322. As will be discussed in more detail below, the adapter mounting holes 314 are configured to receive a leaf spring 338 (or first retainer) of the adapter 324 that is used to secure the adapter 324 to the lid 312.

[0029] As shown in FIG. 3A, a connector 350 is provided with a third optical fiber connection array 382 including a plurality of lenses and an optical fiber bundle 358. Of course, in this embodiment (in contrast to the embodiment described above with respect to FIGS. 2A-2J), the optical fiber bundle 358 is attached directly to the connector 350 rather than to the adapter 324. The connector 350 includes two studs 328 that fit into alignment recesses 307 of the receptacle 306. As shown in the example of FIG. 3A, the studs 328 may have a tapered portion 329 that may allow easy sliding of the studs 328 into the alignment recesses 307 of the receptacle 306. Of course, the studs 328 may have any suitable shape or profile that may facilitate connection between the receptacle 306 and the connector 350 as well as allow fine alignment between the two. Thus, connector 350 with lens array and fiber optic bundles 358 is aligned with receptacle 306 in the X and Y directions around stud 328 and in the Z direction at the bottom of alignment recess 307. Thus, after mating of connector 350 to receptacle 306 (i.e., by insertion of stud 328 into alignment recess 307), third fiber optic connection array 382 (i.e., part of connector 350) is aligned with first fiber optic connection array 304 and second fiber optic connection array 308. In this manner, the lenses of all three fiber optic connection arrays are aligned with each other to allow light to pass from light guide 302 to receptacle 306 and connector 350.

[0030] As shown in FIG. 3A, the adapter 324 is coupled to the connector 350 by a spring 354. The spring 354 provides a biasing force that biases the adapter 324 in a vertical Z direction away from the connector 350. However, the connector 350 includes a first connector protrusion 366 that protrudes outward from a body portion of the connector 350, and the adapter 324 includes a first adapter protrusion 368 that protrudes inward. Thus, the adapter includes a first adapter protrusion 368 that overlaps the first connector protrusion 366 in a direction transverse to the plane of the semiconductor package. The adapter 324 has a cap-like configuration that covers (or surrounds) a portion of the connector 350. The first connector protrusion 366 and the first adapter protrusion 368 are configured to overlap in a horizontal X direction to prevent removal of the adapter 324 from the connector 350. As will be described in more detail with respect to FIG. 3I below, when the spring 354 is in an extended configuration, the first adapter projection 368 will directly contact the first connector projection 366. Referring again to FIG. 3A, in certain embodiments, the connector 350 may include one or more connector spring projections 390 and the adapter 324 may include one or more adapter spring projections 392. The spring 354 may be coiled around the connector spring projections 390 and the adapter spring projections 392 to hold the spring 354 in place. The projections have a length configured to allow a certain amount of movement of the adapter 324 to the connector 350 in the vertical Z direction. As will be described in more detail below, the adapter 324 includes a leaf spring 338 that allows for removable attachment of the adapter 324 to the lid 312. In an alternative embodiment, the adapter 324 may be attached to the lid by a screw (not shown) rather than the leaf spring 338. The leaf spring 338 may include detents 394 that allow the adapter 324 to be removably secured (or mounted, attached, or engaged) to the lid 312. In certain embodiments, the connector 350 is secured in the X, Y, and Z directions (i.e., pitch and roll directions) by the force of the spring 354 between the connector 350 and the adapter 324.To remove the connector 350 and adapter 324 from the receptacle 306 and board 300, the adapter is pulled upward in the Z direction until the detents 394 push up through the adapter mounting holes 314 and the structure is released.

[0031] 3B, which is a top view of the adapter 324 and the fiber optic bundle 358 shown in FIG. 3A. As shown in FIG. 3B, the adapter 324 includes an adapter hole 396. In a particular embodiment, the adapter hole 396 has length and width dimensions that are slightly larger than the length and width of the fiber optic bundle 358. In the example shown in FIG. 3B, the fiber optic bundle 358 has a length dimension of 3.0 mm in the X direction and a width dimension of 0.5 mm in the Y direction. Also, the adapter hole has a length dimension of 3.4 mm in the X direction and a width dimension of 0.9 mm in the Y direction. Thus, there is a slit "S" (i.e., a gap) between the outer circumference of the fiber optic bundle 358 and the inner circumference of the adapter hole 396. To the extent that the substrate 300 may have a certain amount of warping, the connector 350 may follow the warping of the substrate 300 with the restoring force of the spring 354. 3B, with respect to connector 350 and optical fiber bundle 358, any warpage of substrate 300 in the X and Y directions can be accommodated by slit "S" between adapter 324 and connector 350 (attached to optical fiber bundle 358). Thus, by accommodating the movement of substrate 300 due to warpage with slit "S", any misalignment of various components of optical connector device 301 can be reduced or eliminated.

[0032] Reference is now made to Figure 3C, which is a top view of the connector 350 and lid 312 shown in Figure 3A. As shown in Figure 3C, two adapter mounting holes 314 are formed on either side of the first opening 322 in the lid 312. As described in detail above with respect to Figure 3A, the adapter mounting holes 314 are sized and positioned to receive the leaf springs 338 of the adapter 324. As described above, the connector 350 includes two first connector prongs 366 on either side of the connector 350. And, the springs 354 surround the fiber optic bundle 358.

[0033] Reference is now made to Figure 3D, which is a side view of connector 350 and lid 312. Figure 3E is a side view of adapter 324, lid 312, and fiber optic bundle 358. As also shown in the side cross-sectional view of Figure 3A, the connector is received in first opening 322 in lid 312.

[0034] 3E, which is a side view of adapter 324 and lid 312. In this view, adapter 324 surrounds (or covers) connector 353 such that only the top of fiber optic bundle 358 (attached to connector 350) protrudes from the top surface of adapter 324. As also shown in the side cross-sectional view of FIG. 3A, leaf spring 338 of adapter 324 is received in adapter mounting hole 314 in lid 312.

[0035] 3F, which is a bottom view of connector 350 and lid 312. As described above, lid 312 includes first opening 322 and adapter mounting hole 314. Connector 350 is received in lid first opening 322, and the connector includes first connector prongs 366 and third optical fiber connection array 382.

[0036] Reference is now made to FIGURE 3G, which is a bottom view of the connector 350, lid 312, and adapter 324. As discussed above, the lid 312 includes a first opening 322 and an adapter mounting hole 314. The connector 350 is received in the first opening 322 of the lid, the connector including a first connector protrusion 366 and a third optical fiber connection array 382. The adapter 324 is visible at the first opening 322 and the adapter mounting hole 314. Although not apparent from this bottom view of FIGURE 3G, the detents 394 of the leaf spring 338 of the adapter 324 hook onto the bottom surface of the lid 312, as shown in FIGURE 3J and described below.

[0037] 3H-3J, these figures show a sequence of steps of mounting the adapter 324 and the connector 350 to the lid 312 of the optical connector device 301. For simplicity and ease of understanding, certain elements of the optical connector device 301 described above with reference to FIGS. 3A-3I are omitted here. FIG. 3H shows a first stage of mounting the adapter 324 and the connector 350 to the lid 312. In FIG. 3H, the adapter 324 and the connector 350 move in the direction of movement indicated by the arrow. At this stage, the spring 354 is somewhat stretched so that no gap is created between the first connector projection 366 of the connector 350 and the first adapter projection 368 of the adapter 324. In other words, since the adapter 324 and the connector 350 are movable relative to each other and the spring 354 biases these components apart, there is no gap that may exist between the first connector projection 366 of the connector 350 and the first adapter projection 368 of the adapter 324. 3H, the bottom detent of the leaf spring 338 contacts the top surface of the lid 312. In certain embodiments, the outer dimension d1 of the leaf spring 338 is greater than the inner dimension d2 of the adapter mounting hole 314.

[0038] Thus, as adapter 324 and connector 350 move further in the direction of travel, leaf spring 338 is forced to bend inward by angle α, as shown in Figure 3I. As stud 328 is inserted into alignment recess 307 (see Figure 3H) of receptacle 306, fine alignment of connector 350 to receptacle 306 is achieved, as shown in Figure 3I. As soon as the bottom of stud 328 contacts the bottom of alignment recess 307, connector 350 cannot move further downward. However, because there is still space between the bottom of leaf spring 338 and the top surface of optical waveguide 302, adapter 324 can move further downward in the direction of travel.

[0039] 3J, the adapter 324 moves further downward in the direction of movement until the detent portion of the leaf spring 338 clears the underside of the lid 312, and the spring 354 is compressed by a certain amount, forming a gap in the vertical Z direction between the first connector protrusion 366 of the connector 350 and the first adapter protrusion 368 of the adapter 324. At this stage, the adapter 324 and the connector 350 are attached and mated to the lid 312.

[0040] In the embodiment illustrated with respect to Figures 3A-3J, the restoring force of spring 354 that may be required to hold the components of the optical connector device 301 in place may be modeled as a force generated by a torque on a rigid T-bar, as shown in Figure 4. In certain embodiments, the forces acting on the optical connector device 301 may be modeled as shown in Figure 4 and as follows:

number

[0041] To hold the connector 350 in place, the following conditions must be met: F sp >F 2

[0042] Therefore, a desirable spring has a spring constant k that satisfies the following relationship:

number

[0043] In one example, h=10 mm, w=1 mm, F 1 = 0.5 N, and Δy = 1 mm, a spring constant k of greater than 5 N / mm is required to hold connector 350 in place. In certain embodiments, spring 354 may be a Belleville type spring or a disk type spring, although it will be appreciated that any suitable type of spring may be used.

[0044] 5, which is a dimensional view of the connector 550 (or adapter, depending on the embodiment discussed above) relative to the lid 512 and receptacle 506. In a particular embodiment, the receptacle 506 and lid 512 satisfy the following conditions such that when the connector 550 is fitted inside the lid hole 522 (i.e., coarse alignment), the center of the stud 528 is inside the recess circle 507 of the receptacle 506, and the stud center and recess center automatically self-align along the stud taper: x con +x rec <φ stud y con +y rec <φ stud φ stud : Stud diameter x con , y con : Gap between the connector and the lid in the X and Y directions x rec , y rec : Gap between the receptacle and the lid in the X and Y directions

[0045] It will be appreciated that although the shape of the stud 528 in FIG. 5 is a cylindrical cone, any other suitable shape (eg, cone, pyramid, etc.) may be used.

[0046] 6A-6C, which are a top view, a side view, and a cross-sectional view, respectively, of the adapter shown in FIG. 3A, where adapter 624 includes two separate parts attached together with screws 650. However, it will be appreciated that the adapter may be a single, unitary piece, or may include three or more separate parts attached together.

[0047] In certain embodiments, the optical connector device may have high fixing strength and high warpage resistance. In certain embodiments, the optical connector device may have a stable and removable fixture to simplify the assembly process. For example, the rough alignment of the connector to the lid hole becomes fine self-alignment with the receptacle. Also, the substrate used for the optical MCM may be an optoelectronic composite substrate, but if an adapter is fixed to the substrate, the fabrication process is much more complicated. However, it is convenient in terms of reliability because only metal processing is required to fix the adapter to the lid.

[0048] Although various embodiments have been described above for illustrative purposes, they are not intended to be exhaustive or to limit the disclosed embodiments. Many improvements and modifications will be apparent to those skilled in the art without departing from the scope of the above-described embodiments. The terminology used in this specification is selected for the purpose of best explaining the principles of the embodiments, practical applications or technical improvements to the technology found in the market, or to enable others skilled in the art to understand the embodiments disclosed in this specification.

Claims

1. An optical connector device for removably mounting an optical fiber array to a semiconductor package, the optical fiber array extending in a direction perpendicular to a plane of the semiconductor package, comprising: the semiconductor package includes an optical device, an optical waveguide, and a receptacle provided on the optical waveguide, and is provided with a lid that covers them; An adapter that can be attached to the lid, and a connector that can be detachably attached to the adapter, The adapter: a protrusion configured to fit into an adapter opening in the lid; an adapter recess configured to receive at least a portion of the connector; a leaf spring having a first protrusion disposed within the adapter recess; at least one stud configured to mate with and align with an alignment hole in the receptacle; Including, The connector comprises: the optical fiber array; a second protrusion corresponding to the first protrusion of the leaf spring; and a biasing member that biases at least a portion of the connector toward the semiconductor package in a direction perpendicular to a plane of the semiconductor package; Including, configured to removably attach and hold the connector to the adapter at a predetermined position and perpendicular to a plane of the semiconductor package; Optical connector device.

2. The optical connector device of claim 1 , wherein the adapter is attached to the lid of the semiconductor package by a plurality of screws.

3. the connector includes a first portion and a second portion movably coupled to the first portion; 2. The optical connector device of claim 1, wherein the biasing member is a spring disposed between the first portion of the connector and the second portion of the connector and configured to bias the first portion of the connector in the vertical direction away from the second portion of the connector.

4. the leaf spring is a leaf spring extending upward from a bottom of the adapter recess, 2. The optical connector arrangement of claim 1, wherein the second protrusion mates with the first protrusion to function as a detent for releasably mounting the connector to the adapter.

5. 2. The optical connector arrangement of claim 1, wherein said connector includes a first optical lens array corresponding to the pattern of said optical fiber array.

6. 6. The optical connector arrangement of claim 5, wherein said adapter includes a second optical lens array corresponding to the pattern of said optical fiber array and to the pattern of said first optical lens array.

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