SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND MAINTENANCE METHOD FOR SUBSTRATE CLEANING APPARATUS

The substrate cleaning device addresses rotational resistance and particle generation issues by employing a non-contact seal with gas supply and exhaust holes, improving cleaning efficiency and substrate cleanliness.

JP7676279B2Active Publication Date: 2025-05-14EBARA CORP
View PDF 4 Cites 0 Cited by

Patent Information

Application Number
JP2021147973
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-09-10
Publication Date
2025-05-14
Estimated Expiration
2041-09-10

AI Technical Summary

Technical Problem

Existing substrate cleaning devices face issues with rotational resistance and particle generation due to contact seals around the transmission shaft, which hinder efficient cleaning and lead to substrate defects.

Method used

The substrate cleaning device incorporates a non-contact seal portion with a rotating portion having convex portions and a fixed portion with gas supply and exhaust holes, which reduces rotational resistance and suppresses particle generation.

Benefits of technology

This configuration effectively reduces rotational resistance and suppresses particle generation, enhancing the cleaning efficiency and maintaining substrate cleanliness.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007676279000001
    Figure 0007676279000001
  • Figure 0007676279000002
    Figure 0007676279000002
  • Figure 0007676279000003
    Figure 0007676279000003
Patent Text Reader

Abstract

To reduce the rotational resistance of a roll cleaning member and suppress the generation of particles.SOLUTION: A substrate cleaning device 31 includes a roll cleaning member 61 and a rotation holding portion 100. The rotation holding portion 100 includes a non-contact seal portion 140 that is arranged between a bearing portion 130 and the roll cleaning member 61, and seals a gap between a shaft portion 110 and a housing portion 120. The non-contact seal portion 140 includes: a rotating portion 150 that is attached to the shaft portion 110 and has a plurality of projections 151 formed on a peripheral surface 150a at intervals in the axial direction; and a fixing portion 160 which is attached to the housing portion 120, surrounds the plurality of protrusions 151, and in which a gas supply hole 161 for supplying compressed gas 200 from a position axially inner side than the projections 151 arranged at both ends in the axial direction of the plurality of projections 151 is formed in an inner peripheral surface 160a surrounding the plurality of projections 151.SELECTED DRAWING: Figure 6
Need to check novelty before this filing date? Find Prior Art

Description

[Technical field]

[0001] The present invention relates to a substrate cleaning apparatus, a substrate processing apparatus, and a maintenance method for a substrate cleaning apparatus. [Background technology]

[0002] Patent Document 1 below discloses a substrate cleaning device suitable for cleaning substrates that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, liquid crystal panels, etc. This substrate cleaning device is equipped with a cleaning tool (roll cleaning member) configured by attaching a cleaning member made of a sponge, brush, etc. to the outer surface of a hollow shaft body.

[0003] The cleaning tool is supported at both ends by a frame. One end of the frame is provided with a rotation holder including a motor, a transmission shaft that transmits the rotation of the motor to the cleaning tool, and a bearing that supports the transmission shaft. This allows the cleaning tool to rotate with the rotation of the motor, and the substrate can be scrubbed with the peripheral surface of the cleaning tool. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2000-301079 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the substrate cleaning apparatus of the above-mentioned conventional technology, since the substrate is scrubbed while being supplied with cleaning liquid, a contact seal is sometimes provided around the transmission shaft to prevent the cleaning liquid from entering the motor side along the transmission shaft. However, when a contact seal is provided, the contact with the transmission shaft creates resistance to the rotation torque of the motor. In addition, wear powder (particles) generated from the contact seal can adhere to the substrate and become a source of defects.

[0006] The present invention has been made in consideration of the above problems, and has an object to reduce the rotational resistance of the roll cleaning member and suppress the generation of particles. [Means for solving the problem]

[0007] a housing portion surrounding the shaft portion; a bearing portion disposed inside the housing portion and supporting the shaft portion; and a non-contact seal portion disposed between the bearing portion and the roll cleaning member and sealing a gap between the shaft portion and the housing portion. The non-contact seal portion comprises: a rotating portion attached to the shaft portion and having a plurality of convex portions formed on a circumferential surface thereof at intervals in the axial direction; and a fixed portion attached to the housing portion and surrounding the plurality of convex portions, the fixed portion having an inner circumferential surface surrounding the plurality of convex portions, the gas supply hole for supplying compressed gas from a position axially more inward than the convex portions disposed at both axial ends of the plurality of convex portions.

[0008] In the substrate cleaning apparatus, the gas supply hole may supply the compressed gas from a position in the axial direction that includes a central portion of an area in which the plurality of convex portions are formed.

[0009] In the substrate cleaning apparatus, the gas supply hole may open in an inner circumferential surface of the stationary part in a direction parallel to a tangent direction of a circumferential surface of the rotating part.

[0010] In the substrate cleaning apparatus, the gas supply hole may open toward a central axis of the rotating part.

[0011] In the substrate cleaning apparatus, a gas exhaust hole for exhausting the compressed gas may be formed on an inner circumferential surface of the fixing part on an opposite side to the gas supply hole.

[0012] In the substrate cleaning apparatus, a gas exhaust hole for exhausting the compressed gas may be formed on the same side of an inner circumferential surface of the fixing part as the gas supply hole.

[0013] In the substrate cleaning apparatus, the fixed part may include a first wall part that is arranged closer to the roll cleaning member in the axial direction than the multiple protrusions, extends radially inward further than tips of the multiple protrusions that are arranged at ends on the roll cleaning member side among the multiple protrusions, and faces a circumferential surface of the rotating part with a gap therebetween, and a second wall part that is arranged closer to the roll cleaning member in the axial direction than the first wall part and covers the gap between the first wall part and the circumferential surface of the rotating part as viewed in the axial direction.

[0014] In the substrate cleaning apparatus, a drain hole may be formed in an inner circumferential surface of the fixing portion between the first wall portion and the second wall portion.

[0015] A substrate processing apparatus according to one aspect of the present invention includes a polishing unit that polishes a substrate, and a cleaning unit that cleans the substrate polished in the polishing unit, the cleaning unit including the substrate cleaning apparatus described above.

[0016] a housing portion surrounding the shaft portion; a bearing portion disposed inside the housing portion and supporting the shaft portion; and a non-contact seal portion disposed between the bearing portion and the roll cleaning member and sealing a gap between the shaft portion and the housing portion, the non-contact seal portion comprising: a rotating portion attached to the shaft portion and having a peripheral surface on which a plurality of convex portions are formed at intervals in the axial direction; and a fixed portion attached to the housing portion and surrounding the plurality of convex portions, the gas supply hole being formed on an inner peripheral surface surrounding the plurality of convex portions for supplying compressed gas from a position axially more inward than convex portions disposed at both ends of the plurality of convex portions in the axial direction, and the fixed portion is removed from the housing portion and then a cover surrounding the rotating portion is attached to the position from which the fixed portion was removed, and maintenance is performed in this state. Effect of the Invention

[0017] According to the above aspect of the present invention, the rotational resistance of the roll cleaning member can be reduced, and the generation of particles can be suppressed. [Brief description of the drawings]

[0018] [Figure 1] 1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment; [Diagram 2] 1 is a perspective view showing a configuration of a substrate cleaning apparatus according to an embodiment of the present invention; [Diagram 3] FIG. 2 is a front view showing a holding structure of a roll-type cleaning member according to an embodiment of the present invention. [Figure 4] FIG. 2 is a plan view showing a holding structure of a roll-type cleaning member according to an embodiment. [Diagram 5] FIG. 4 is a view of a rotation holder according to one embodiment as viewed from the axial direction. [Figure 6] 6 is a cross-sectional view taken along line VI-VI in FIG. 5. [Figure 7] FIG. 2 is an enlarged cross-sectional view showing the configuration of a non-contact seal portion according to one embodiment. [Figure 8] 8 is a cross-sectional view taken along line VIII-VIII in FIG. 6. [Figure 9] 10A and 10B are cross-sectional views showing modified arrangements of gas supply holes and gas exhaust holes of a non-contact seal portion according to an embodiment of the present invention. [Figure 10] 1 is a perspective view showing a state of a spin holder during maintenance of a substrate cleaning apparatus according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0020] FIG. 1 is a plan view showing an overall configuration of a substrate processing apparatus 1 according to an embodiment. 1 is a chemical mechanical polishing (CMP) apparatus that polishes the surface of a substrate W such as a silicon wafer to a flat surface. The substrate processing apparatus 1 includes a rectangular box-shaped housing 2. The housing 2 is formed in a substantially rectangular shape in a plan view.

[0021] The housing 2 has a substrate transport path 3 extending in the longitudinal direction at its center. A load / unload unit 10 is disposed at one longitudinal end of the substrate transport path 3. A polishing unit 20 is disposed at one side of the substrate transport path 3 in the width direction (direction perpendicular to the longitudinal direction in a plan view), and a cleaning unit 30 is disposed at the other side. The substrate transport path 3 is provided with a substrate transport unit 40 that transports substrates W. The substrate processing apparatus 1 also has a control unit 50 (control panel) that comprehensively controls the operations of the load / unload unit 10, the polishing unit 20, the cleaning unit 30, and the substrate transport unit 40.

[0022] The load / unload unit 10 includes a front load unit 11 that houses the substrate W. A plurality of front load units 11 are provided on one longitudinal side surface of the housing 2. The plurality of front load units 11 are arranged in the width direction of the housing 2. The front load unit 11 is equipped with, for example, an open cassette, a Standard Manufacturing Interface (SMIF) pod, or a Front Opening Unified Pod (FOUP). The SMIF and FOUP are airtight containers that house cassettes for the substrate W therein and are covered with a partition wall, and can maintain an environment independent of the external space.

[0023] The load / unload section 10 also includes two transport robots 12 that take in and out the substrate W from the front load section 11, and a traveling mechanism 13 that moves each transport robot 12 along the row of the front load section 11. Each transport robot 12 has two hands, one above and one below, which are used before and after processing the substrate W. For example, the upper hand is used when returning the substrate W to the front load section 11, and the lower hand is used when removing the substrate W from the front load section 11 before processing.

[0024] The polishing section 20 includes a plurality of substrate polishing devices 21 (21A, 21B, 21C, 21D) for polishing (flattening) the substrate W. The plurality of substrate polishing devices 21 are arranged in the longitudinal direction of the substrate transport path 3. The substrate polishing device 21 includes a polishing table 23 for rotating a polishing pad 22 having a polishing surface, a top ring 24 for holding the substrate W and polishing the substrate W while pressing it against the polishing pad 22 on the polishing table 23, a polishing liquid supply nozzle 25 for supplying a polishing liquid or a dressing liquid (e.g., pure water) to the polishing pad 22, a dresser 26 for dressing the polishing surface of the polishing pad 22, and an atomizer 27 for spraying a mixed fluid of a liquid (e.g., pure water) and a gas (e.g., nitrogen gas) or a liquid (e.g., pure water) onto the polishing surface in the form of a mist.

[0025] In the substrate polishing apparatus 21, while supplying a polishing liquid onto the polishing pad 22 from the polishing liquid supply nozzle 25, the top ring 24 presses the substrate W against the polishing pad 22, and further the top ring 24 and the polishing table 23 move relatively to polish the substrate W to flatten its surface. The dresser 26 has hard particles such as diamond particles or ceramic particles fixed to a rotating part at the tip that contacts the polishing pad 22, and by rotating and oscillating the rotating part, the entire polishing surface of the polishing pad 22 is uniformly dressed to form a flat polishing surface. The atomizer 27 uses high-pressure fluid to wash away polishing debris and abrasive grains remaining on the polishing surface of the polishing pad 22, thereby cleaning the polishing surface and allowing the dresser 26, which is a mechanical contact device, to sharpen the polishing surface, i.e., regenerate the polishing surface.

[0026] Cleaning section 30 includes a plurality of substrate cleaning apparatuses 31 (31A, 31B) for cleaning substrates W, and a substrate drying apparatus 32 for drying the cleaned substrates W. The plurality of substrate cleaning apparatuses 31 and substrate drying apparatuses 32 are arranged in the longitudinal direction of substrate transport path 3. Substrate cleaning apparatus 31A is provided in a first substrate cleaning tank 37. Furthermore, substrate cleaning apparatus 31B is provided in a second substrate cleaning tank 38.

[0027] A first transfer chamber 33 is provided between the first substrate cleaning tank 37 and the second substrate cleaning tank 38. The first transfer chamber 33 is provided with a transfer robot 35 that transfers the substrate W between the substrate transfer section 40, the substrate cleaning apparatus 31A, and the substrate cleaning apparatus 31B. A second transfer chamber 34 is provided between the substrate cleaning apparatus 31B and the substrate drying apparatus 32. The second transfer chamber 34 is provided with a transfer robot 36 that transfers the substrate W between the substrate cleaning apparatus 31B and the substrate drying apparatus 32.

[0028] The substrate cleaning apparatus 31A includes a roll sponge type cleaning module, which will be described later, and performs primary cleaning of the substrate W. The substrate cleaning apparatus 31B also includes a roll sponge type cleaning module and performs secondary cleaning of the substrate W. The substrate cleaning apparatus 31A and the substrate cleaning apparatus 31B may be the same type or different types of cleaning modules, for example, a pencil sponge type cleaning module or a two-fluid jet type cleaning module. The substrate drying apparatus 32 includes, for example, a drying module that performs Rotagoni drying (IPA (Iso-Propyl Alcohol) drying). After drying, a shutter 1a provided in a partition between the substrate drying apparatus 32 and the load / unload unit 10 is opened, and the substrate W is taken out of the substrate drying apparatus 32 by the transfer robot 12.

[0029] The substrate transport section 40 includes a lifter 41, a first linear transporter 42, a second linear transporter 43, and a swing transporter 44. In the substrate transport path 3, a first transfer position TP1, a second transfer position TP2, a third transfer position TP3, a fourth transfer position TP4, a fifth transfer position TP5, a sixth transfer position TP6, and a seventh transfer position TP7 are set in this order from the loading / unloading section 10 side.

[0030] The lifter 41 is a mechanism that transports the substrate W up and down at the first transport position TP1. The lifter 41 receives the substrate W from the transport robot 12 of the load / unload section 10 at the first transport position TP1. The lifter 41 also delivers the substrate W received from the transport robot 12 to the first linear transporter 42. A shutter 1b is provided on a partition between the first transport position TP1 and the load / unload section 10, and when the substrate W is transported, the shutter 1b is opened and the substrate W is delivered from the transport robot 12 to the lifter 41.

[0031] The first linear transporter 42 is a mechanism for transporting the substrate W between the first transfer position TP1, the second transfer position TP2, the third transfer position TP3, and the fourth transfer position TP4. The first linear transporter 42 includes a plurality of transport hands 45 (45A, 45B, 45C, 45D) and a linear guide mechanism 46 for moving each of the transport hands 45 in the horizontal direction at a plurality of heights. The transport hand 45A moves between the first transport position TP1 and the fourth transport position TP4 by a linear guide mechanism 46. This transport hand 45A is a pass hand for receiving the substrate W from the lifter 41 and transferring it to the second linear transporter 43. This transport hand 45A is not provided with an elevation drive unit.

[0032] The transport hand 45B moves between a first transfer position TP1 and a second transfer position TP2 by a linear guide mechanism 46. This transport hand 45B receives the substrate W from the lifter 41 at the first transfer position TP1, and delivers the substrate W to the substrate polishing apparatus 21A at the second transfer position TP2. The transport hand 45B is provided with an elevation drive unit, which rises when delivering the substrate W to the top ring 24 of the substrate polishing apparatus 21A, and descends after delivering the substrate W to the top ring 24. Note that the transport hands 45C and 45D are also provided with similar elevation drive units.

[0033] The transport hand 45C moves between the first transport position TP1 and the third transport position TP3 by the linear guide mechanism 46. This transport hand 45C receives the substrate W from the lifter 41 at the first transport position TP1, and delivers the substrate W to the substrate polishing apparatus 21B at the third transport position TP3. The transport hand 45C also functions as an access hand that receives the substrate W from the top ring 24 of the substrate polishing apparatus 21A at the second transport position TP2, and delivers the substrate W to the substrate polishing apparatus 21B at the third transport position TP3.

[0034] The transport hand 45D moves between the second transfer position TP2 and the fourth transfer position TP4 by the linear guide mechanism 46. The transport hand 45D functions as an access hand for receiving the substrate W from the top ring 24 of the substrate polishing apparatus 21A or the substrate polishing apparatus 21B at the second transfer position TP2 or the third transfer position TP3, and for transferring the substrate W to the swing transporter 44 at the fourth transfer position TP4.

[0035] The swing transporter 44 has a hand movable between the fourth transfer position TP4 and the fifth transfer position TP5, and transfers the substrate W from the first linear transporter 42 to the second linear transporter 43. The swing transporter 44 also transfers the substrate W polished in the polishing unit 20 to the cleaning unit 30. A temporary placement table 47 for the substrate W is provided on the side of the swing transporter 44. The swing transporter 44 turns the substrate W received at the fourth transfer position TP4 or the fifth transfer position TP5 upside down and places it on the temporary placement table 47. The substrate W placed on the temporary placement table 47 is transferred to the first transfer chamber 33 by the transfer robot 35 of the cleaning unit 30.

[0036] The second linear transporter 43 is a mechanism for transporting the substrate W between the fifth transfer position TP5, the sixth transfer position TP6, and the seventh transfer position TP7. The second linear transporter 43 includes a plurality of transport hands 48 (48A, 48B, 48C) and a linear guide mechanism 49 for moving each transport hand 45 in the horizontal direction at a plurality of heights. The transport hand 48A moves between the fifth transfer position TP5 and the sixth transfer position TP6 by the linear guide mechanism 49. The transport hand 48A functions as an access hand for receiving the substrate W from the swing transporter 44 and transferring it to the substrate polishing apparatus 21C.

[0037] The transport hand 48B moves between the sixth transport position TP6 and the seventh transport position TP7. The transport hand 48B functions as an access hand for receiving the substrate W from the substrate polishing apparatus 21C and transferring it to the substrate polishing apparatus 21D. The transport hand 48C moves between the seventh transport position TP7 and the fifth transport position TP5. The transport hand 48C functions as an access hand for receiving the substrate W from the top ring 24 of the substrate polishing apparatus 21C or the substrate polishing apparatus 21D at the sixth transport position TP6 or the seventh transport position TP7 and transferring the substrate W to the swing transporter 44 at the fifth transport position TP5. Although not described, the operation of the transport hand 48 when transferring the substrate W is the same as that of the first linear transporter 42 described above.

[0038] FIG. 2 is a perspective view showing a configuration of a substrate cleaning apparatus 31 according to an embodiment. 2, the substrate cleaning apparatus 31 includes a substrate cleaning unit 60 that cleans the substrate W, and a substrate holding and rotating unit 70 that holds and rotates the substrate W. The substrate cleaning unit 60 includes a roll cleaning member 61 that rotates in contact with the substrate W, and a liquid supply nozzle 62 that supplies liquid to the substrate W.

[0039] The roll cleaning member 61 includes a cylindrical roll portion 61a and a shaft portion 61b that supports the roll portion 61a. The roll portion 61a is formed, for example, from a PVA (polyvinyl alcohol) sponge or a urethane sponge. A pair of roll cleaning members 61 are provided so as to come into contact with the front surface (polished surface) of the substrate W and the back surface of the substrate W. The pair of roll cleaning members 61 are connected to an electric drive unit such as a motor to rotate.

[0040] The upper roll cleaning member 61 that comes into contact with the front surface of the substrate W is configured to be movable up and down by an air drive unit such as an air cylinder. The lower roll cleaning member 61 that comes into contact with the back surface of the substrate W may be held at a constant height. The liquid supply nozzle 62 supplies a cleaning liquid, pure water, or the like to the substrate W. As the cleaning liquid, SC1 (ammonia / hydrogen peroxide mixed aqueous solution) or the like can be used.

[0041] The substrate holding and rotating section 70 includes a plurality of (six in this embodiment) substrate holding rollers 71 that rotate the substrate W. The substrate holding rollers 71 have a groove shape that holds the peripheral portion of the substrate W. Specifically, the substrate holding roller 71 has a lower roller portion 71a that faces the back surface of the peripheral portion of the substrate W, an upper roller portion 71b that faces the front surface of the peripheral portion of the substrate W, and a clamp groove 71c that is provided between the lower roller portion 71a and the upper roller portion 71b and into which the peripheral portion of the substrate W is inserted.

[0042] The substrate holding roller 71 is provided at the upper end of the support column 73. The substrate holding roller 71 is configured to be horizontally rotatable by an electric drive unit such as a motor (not shown) provided on the support column 73. The substrate holding roller 71 is also configured to be vertically movable by an air drive unit such as an air cylinder (not shown) provided on the support column 73.

[0043] 2, when setting the substrate W, first, the upper roll cleaning member 61 and the multiple substrate holding rollers 71 are raised. Next, the substrate W is held in a horizontal position by the raised multiple substrate holding rollers 71, and then the multiple substrate holding rollers 71 are lowered until the back surface of the substrate W comes into contact with the lower roll cleaning member 61. Finally, the upper roll cleaning member 61 is lowered to come into contact with the front surface of the substrate W.

[0044] After the substrate W is set in this manner, the substrate W is rotated by the substrate holding rollers 71 while the pair of roll cleaning members 61 are rotated to remove foreign matter (microparticles) adhering to the front and back surfaces of the substrate W. In the case of wet cleaning, a cleaning liquid and / or pure water is supplied from a nozzle (not shown) toward the front surface of the substrate W, and the substrate W is scrubbed and cleaned by the pair of roll cleaning members 61.

[0045] Fig. 3 is a front view showing the holding structure of the roll-type cleaning member 61 according to one embodiment. Fig. 4 is a plan view showing the holding structure of the roll-type cleaning member 61 according to one embodiment. In the following description, the holding structure of the roll cleaning member 61 arranged above the substrate W will be described, but the holding structure of the roll cleaning member 61 arranged below the substrate W has a similar configuration. Since the holding structure of the roll cleaning member 61 arranged below the substrate W is redundant, a description thereof will be omitted.

[0046] In the following description, the positional relationship of each component may be described based on the central axis O of the roll-type cleaning member 61. The direction in which the central axis O of the roll-type cleaning member 61 extends is referred to as the axial direction. The direction perpendicular to the central axis O of the roll-type cleaning member 61 is referred to as the radial direction. The direction going around the central axis O of the roll-type cleaning member 61 is referred to as the circumferential direction.

[0047] 3, the roll-type cleaning member 61 is supported by a holder 80. An arm 81 is connected to the center of the upper part of the holder 80. The arm 81 is attached to a moving mechanism (not shown) via an attachment plate 82, and is capable of moving up and down and horizontally. The holder 80 is provided with rotation holding units 90 and 100 that rotatably support both axial ends of the roll-type cleaning member 61.

[0048] The rotating holder 90 is provided with a spring portion (not shown) that axially biases the roll cleaning member 61 toward the other rotating holder 100, and a cleaning liquid supply portion (not shown) that supplies cleaning liquid from the end of the roll cleaning member 61 into the hollow shaft portion 61b. The cleaning liquid supplied into the shaft portion 61b seeps out from an opening in the circumferential surface of the shaft portion 61b, wetting the roll portion 61a attached to the circumferential surface.

[0049] The rotation holding part 100 is provided with a motor 101, and the rotation torque of the motor 101 is transmitted to an end of the roll cleaning member 61 to rotate the roll cleaning member 61. As shown in Fig. 4, a gas supply pipe 102 for supplying compressed gas and a gas exhaust pipe 103 for exhausting the supplied compressed gas are connected to the rotation holding part 100.

[0050] The gas supply pipe 102 and the gas exhaust pipe 103 are connected to a non-contact seal unit 140 (see Figs. 5 and 6 described later) provided in the rotary holder 100. Although nitrogen gas is preferably used as the compressed gas, an inert gas other than nitrogen gas or other gases may also be used.

[0051] Fig. 5 is a view of the rotation holder 100 according to one embodiment as viewed from the axial direction. Fig. 6 is a cross-sectional view taken along line VI-VI shown in Fig. 5. As shown in FIG. 6, the rotation holding unit 100 includes a shaft unit 110 connected to the axial end of the roll cleaning member 61, a housing unit 120 surrounding the shaft unit 110, a bearing unit 130 disposed inside the housing unit 120 and supporting the shaft unit 110, and a non-contact seal unit 140 disposed between the bearing unit 130 and the roll cleaning member 61 and sealing the gap between the shaft unit 110 and the housing unit 120.

[0052] The shaft portion 110 has a shaft connection portion 111 at an axial end portion on the roll-type cleaning member 61 side. The shaft connection portion 111 is connected to the shaft portion 61b of the roll-type cleaning member 61. A slot is formed in the end portion 61b1 of the shaft portion 61b. The shaft connection portion 111 has a protrusion portion (minus-shaped protrusion) that engages with the slot of the shaft portion 61b, and is configured to transmit rotational torque to the shaft portion 61b.

[0053] The shaft portion 110 has an axial end portion on the opposite side (motor 101 side) to the roll cleaning member 61 side, which is connected to an output shaft (not shown) of the motor 101 via a coupling (not shown).

[0054] The bearing portion 130 is disposed between the shaft connection portion 111 and a coupling (not shown), and axially supports the shaft portion 110. The bearing portions 130 are provided in a pair with a gap therebetween in the axial direction.

[0055] The housing portion 120 has a through-portion that penetrates therethrough in the axial direction, and accommodates the shaft portion 110 and the bearing portion 130 in the through-portion.

[0056] A gas flow path 123 for compressed gas 200 is formed in the housing part 120. The gas flow path 123 is formed so as to penetrate the housing part 120 in the axial direction. Note that an O-ring (not shown) may be disposed in a gap between the housing part 120 and a fixed part 160 of the non-contact seal part 140 (described later) to connect the gas flow path 123 of the housing part 120 and the gas flow path 162 of the non-contact seal part 140.

[0057] One end of a gas flow passage 123 is open in the housing portion 120, and a connection port 124 for connecting the gas supply pipe 102 shown in FIG. 4 and the like described above is attached to the opening. The non-contact seal portion 140 includes a rotating portion 150 attached to the shaft portion 110, and a fixed portion 160 attached to the housing portion 120 and surrounding the rotating portion 150 with a gap therebetween. A gas supply hole 161 is formed in an inner circumferential surface 160a of the fixed portion 160 surrounding the rotating portion 150. The gas supply hole 161 communicates with the other end of the gas flow path 123 via a gas flow path 162.

[0058] 7 is an enlarged cross-sectional view showing the configuration of the contactless seal portion 140 according to one embodiment. FIG 8 is a cross-sectional view taken along the line VIII-VIII shown in FIG 6. 7, the rotating part 150 is formed in a substantially cylindrical shape, and is attached to the periphery of the shaft connection part 111 of the shaft part 110. A plurality of protrusions 151 are formed on a peripheral surface 150a of the rotating part 150 at intervals in the axial direction.

[0059] The protruding portion 151 is formed in a disk shape extending radially from the circumferential surface 150a of the rotating portion 150. Three protruding portions 151A, 151B, and 151C are formed on the rotating portion 150 of this embodiment. The number of protruding portions 151 is not particularly limited, and may be two, four or more.

[0060] The fixing portion 160 surrounds the multiple protrusions 151, and has a gas supply hole 161 formed in an inner peripheral surface 160a surrounding the multiple protrusions 151. The gas supply hole 161 is formed to supply compressed gas 200 from a position axially inner than protrusions 151A, 151C that are arranged at both ends in the axial direction among the multiple protrusions 151. The gas supply hole 161 is also formed to supply compressed gas 200 from a position including a center of a formation region A of the multiple protrusions 151 in the axial direction.

[0061] The formation region A of the multiple protrusions 151 refers to the region from the axially outer surface of one (protrusion 151A) of the multiple protrusions arranged at both ends of the multiple protrusions 151 to the axially outer surface of the other (protrusion 151C). The central portion of the formation region A refers to the middle region when the formation region A is divided into three equal parts in the axial direction. The central portion of the formation region A preferably refers to the middle region when the formation region A is divided into five equal parts in the axial direction.

[0062] The gas supply hole 161 may be formed so as to include the center position when the formation region A is divided into two equal parts in the axial direction. In addition, the center position of the gas supply hole 161 may preferably coincide with the center position when the formation region A is divided into two equal parts in the axial direction.

[0063] 8, the gas supply holes 161 are opened in an inner circumferential surface 160a of the fixed part 160 in a direction parallel to the tangent direction of the circumferential surface 150a of the rotating part 150. This allows the compressed gas 200 to flow so as to circulate around the rotating part 150. A gas exhaust hole 166 for exhausting the compressed gas 200 is formed on the inner circumferential surface 160a of the fixed part 160 on the same upper side as the gas supply holes 161. This makes it easier to exhaust the compressed gas 200 that has circulated around the rotating part 150 from the gas exhaust hole 166.

[0064] As shown in Fig. 7, the gas exhaust hole 166 is formed in the end surface of the fixed part 160 that contacts the housing part 120. This makes it possible to prevent defects generated from the bearing part 130 from flowing into the non-contact seal part 140 or toward the roll cleaning member 61. As shown in Fig. 8, the gas exhaust hole 166 communicates with a gas exhaust flow path 167. The gas exhaust flow path 167 opens on the side surface of the fixed part 160 and is connected to the above-mentioned gas exhaust pipe 103 (see Figs. 3 to 5).

[0065] 7, the fixed part 160 includes a first wall part 163 arranged closer to the roll cleaning member 61 than the multiple protrusions 151 in the axial direction, and a second wall part 164 arranged closer to the roll cleaning member 61 than the first wall part 163 in the axial direction. The first wall part 163 extends radially inward from the tip of the protrusion 151A arranged at the end part on the roll cleaning member 61 side among the multiple protrusions 151, and faces the circumferential surface 150a of the rotating part 150 with a gap therebetween. As a result, a curved gap (labyrinth) is formed between the first wall part 163 and the protrusion 151A.

[0066] The second wall portion 164 extends radially inward from the first wall portion 163. Furthermore, the second wall portion 164 extends radially inward from the circumferential surface 150a of the rotating portion 150. The second wall portion 164 covers the gap between the first wall portion 163 and the circumferential surface 150a of the rotating portion 150 when viewed from the axial direction. This makes it possible to prevent droplets from the roll cleaning member 61 side from penetrating into the labyrinth through the gap between the first wall portion 163 and the circumferential surface 150a of the rotating portion 150. Furthermore, a drain hole 165 is formed between the first wall portion 163 and the second wall portion 164 on the inner circumferential surface 160a of the fixed portion 160. This makes it possible to discharge the liquid from the drain hole 165 at the bottom before it reaches the first wall portion 163, even if several droplets of liquid climb over the second wall portion 164.

[0067] According to the non-contact seal unit 140 having the above configuration, as shown in FIG. 6, the gas supply hole 161 is formed on the inner circumferential surface 160a of the fixed part 160 surrounding the multiple protrusions 151, and supplies the compressed gas 200 from a position axially inside the multiple protrusions 151 arranged at both ends in the axial direction. Therefore, the compressed gas supplied from the gas supply hole 161 to the inside of the fixed part 160 flows to both the roll cleaning member 61 side and the bearing part 130 side, and not only prevents the intrusion of droplets and particles from the roll cleaning member 61 side, but also serves as a gas curtain that prevents the intrusion of defects generated from the bearing part 130 side. Therefore, the periphery of the shaft part 110 can be sealed in a non-contact manner while suppressing the intrusion of defects and the generation of particles such as wear powder, and the rotation resistance of the roll cleaning member 61 can be reduced.

[0068] As described above, the substrate cleaning apparatus 31 according to the present embodiment includes the roll cleaning member 61 that scrubs the substrate W, and the rotating holder 100 that holds the axial end of the roll cleaning member 61. The rotating holder 100 includes a shaft portion 110 that is connected to the axial end of the roll cleaning member 61, a housing portion 120 that surrounds the shaft portion 110, a bearing portion 130 that is disposed inside the housing portion 120 and supports the shaft portion 110, and a bearing portion 130 that is disposed between the bearing portion 130 and the roll cleaning member 61 and supports the shaft portion 110 and the housing portion 120. and a non-contact seal part 140 that seals a gap between the roll cleaning member 61 and the roller cleaning member 120. The non-contact seal part 140 is attached to the shaft part 110 and includes a rotating part 150 having a peripheral surface 150a on which a plurality of protrusions 151 are formed at intervals in the axial direction, and a fixed part 160 attached to the housing part 120 and surrounds the plurality of protrusions 151, and has an inner peripheral surface 160a surrounding the plurality of protrusions 151, on which a gas supply hole 161 is formed for supplying compressed gas 200 from a position axially more inward than the protrusions 151 arranged at both ends in the axial direction among the plurality of protrusions 151. This configuration can reduce the rotational resistance of the roll cleaning member 61 and suppress the generation of particles.

[0069] In this embodiment, the gas supply hole 161 supplies the compressed gas 200 from a position in the axial direction including the center of the formation region A of the multiple convex portions 151. With this configuration, the compressed gas supplied from the gas supply hole 161 to the inside of the fixed part 160 flows approximately evenly to the roll cleaning member 61 side and the bearing part 130 side, thereby enhancing the effect of the gas curtain.

[0070] 8, in the present embodiment, the gas supply holes 161 are opened in a direction parallel to a tangent direction of the circumferential surface 150a of the rotating part 150 on the inner circumferential surface 160a of the fixed part 160. According to this configuration, the compressed gas 200 can be made to flow around the periphery of the rotating part 150.

[0071] In the present embodiment, a gas exhaust hole 166 for exhausting the compressed gas 200 is formed on the inner circumferential surface 160a of the fixed part 160 on the same side as the gas supply hole 161. With this configuration, the compressed gas 200 that has circulated around the rotating part 150 can be easily exhausted from the gas exhaust hole 166.

[0072] 7, the fixed part 160 includes a first wall part 163 that is disposed closer to the roll cleaning member 61 in the axial direction than the plurality of protrusions 151, extends radially inward from the tip of the protrusion 151 disposed at the end of the plurality of protrusions 151 on the roll cleaning member 61 side, and faces the circumferential surface 150a of the rotating part 150 with a gap therebetween, and a second wall part 164 that is disposed closer to the roll cleaning member 61 in the axial direction than the first wall part 163 and covers the gap between the first wall part 163 and the circumferential surface 150a of the rotating part 150 as viewed from the axial direction. With this configuration, the second wall part 164 serves as a waterproof wall, and can prevent liquid droplets from the roll cleaning member 61 side from penetrating into the labyrinth of the non-contact seal part 140 through the gap between the first wall part 163 and the circumferential surface 150a of the rotating part 150.

[0073] In this embodiment, a drain hole 165 is formed on the inner circumferential surface 160a of the fixing portion 160 between the first wall portion 163 and the second wall portion 164. With this configuration, even if several drops of liquid climb over the second wall portion 164, the liquid can be drained to the outside through the drain hole 165 at the bottom before reaching the first wall portion 163.

[0074] Moreover, the substrate processing apparatus 1 according to this embodiment includes a polishing unit 20 that polishes the substrate W, and a cleaning unit 30 that cleans the substrate W polished in the polishing unit 20, and the cleaning unit 30 includes the above-described substrate cleaning device 31. With this configuration, it is possible to reduce the rotational resistance of the roll cleaning member 61 and suppress the generation of particles.

[0075] The substrate cleaning apparatus 31 may have the following configuration.

[0076] FIG. 9 is a cross-sectional view showing a modified example of the arrangement of the gas supply holes 161 and the gas exhaust holes 166 of the contactless seal portion 140 according to one embodiment. 9 opens toward the central axis O of the rotating part 150. With this configuration, the compressed gas 200 supplied from the gas supply holes 161 can be made to flow approximately evenly on both sides in the circumferential direction of the fixed part 160.

[0077] 9 is formed on the inner circumferential surface 160a of the fixed part 160 on the opposite side to the gas supply hole 161. According to this configuration, the compressed gas 200 can be exhausted at the joining point of the compressed gas 200 flowing on both sides in the circumferential direction of the fixed part 160, so that a decrease in gas fluidity due to collision of the compressed gas 200 can be suppressed.

[0078] FIG. 10 is a perspective view showing the state of the spin holder 100 during maintenance of the substrate cleaning apparatus 31 according to one embodiment. As shown in FIG. 10, during maintenance of the substrate cleaning apparatus 31, the fixed portion 160 of the non-contact seal portion 140 is removed from the housing portion 120, and a cover 180 surrounding the rotating portion 150 is attached instead.

[0079] The cover 180 is fixed to the housing part 120 by the bolts 170 at the same fixing position as the fixing part 160 (see FIG. 5) so that the cover 180 can be attached directly to the attachment position of the fixed part 160. In this way, according to the maintenance method of the substrate cleaning apparatus 31, in which the fixed part 160 is removed from the housing part 120 and then the cover 180 surrounding the rotating part 150 is attached to the place from which the fixed part 160 was removed, the supply of compressed gas to the non-contact seal part 140 can be stopped and the inside of the module can be cleaned in a state before the roll cleaning member 61 is attached.

[0080] Although preferred embodiments of the present invention have been described and illustrated above, it should be understood that these are illustrative of the present invention and should not be considered as limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the present invention. Thus, the present invention should not be considered as limited by the foregoing description, but rather by the scope of the claims.

[0081] For example, even if gas supply hole 161 opens in an orientation parallel to the tangent direction of circumferential surface 150a of rotating part 150 on inner surface 160a of fixed part 160 as shown in FIG. 8, gas exhaust hole 166 may be formed on the opposite side of inner surface 160a of fixed part 160 from gas supply hole 161 as shown in FIG. 9. Furthermore, even if the gas supply hole 161 opens toward the central axis O of the rotating part 150 as shown in FIG. 9, the gas exhaust hole 166 may be formed on the same side as the gas supply hole 161 on the inner surface 160a of the fixed part 160 as shown in FIG. 8. [Explanation of symbols]

[0082] 1...substrate processing apparatus, 20...polishing section, 30...cleaning section, 31...substrate cleaning apparatus, 61...roll cleaning member, 100...rotation holding section, 110...shaft section, 120...housing section, 130...bearing section, 140...non-contact seal section, 150...rotating section, 150a...peripheral surface, 151...projection section, 160...fixed section, 160a...inner peripheral surface, 161...gas supply hole, 163...first wall section, 164...second wall section, 165...drainage hole, 166...gas exhaust hole, 180...cover, 200...compressed gas, A...forming area, O...central axis, W...substrate

Claims

1. A roll cleaning member that scrubs the substrate; a rotation holding part that holds an end part of the roll cleaning member in an axial direction, The rotation holding unit is a shaft portion connected to an axial end portion of the roll cleaning member; a housing portion surrounding the shaft portion; a bearing portion disposed inside the housing portion and supporting the shaft portion; a non-contact seal portion disposed between the bearing portion and the roll cleaning member and configured to seal a gap between the shaft portion and the housing portion, The non-contact seal portion is a rotating portion attached to the shaft portion and having a plurality of protrusions formed on a peripheral surface thereof at intervals in the axial direction; a fixing portion attached to the housing portion, surrounding the plurality of convex portions, and having an inner circumferential surface surrounding the plurality of convex portions, a gas supply hole being formed therein for supplying compressed gas from a position axially more inward than the convex portions located at both ends of the plurality of convex portions in the axial direction.

2. 2. The substrate cleaning apparatus according to claim 1, wherein the gas supply hole supplies the compressed gas from a position in an axial direction that includes a center of an area where the plurality of convex portions are formed.

3. 3. The substrate cleaning apparatus according to claim 1, wherein the gas supply holes are opened in an inner circumferential surface of the stationary part in a direction parallel to a tangent direction of a circumferential surface of the rotating part.

4. 3. The substrate cleaning apparatus according to claim 1, wherein the gas supply hole opens toward a central axis of the rotating part.

5. 5. The substrate cleaning apparatus according to claim 1, wherein a gas exhaust hole for exhausting the compressed gas is formed on an inner circumferential surface of the fixing part on an opposite side to the gas supply hole.

6. 5. The substrate cleaning apparatus according to claim 1, wherein a gas exhaust hole for exhausting the compressed gas is formed on the inner circumferential surface of the fixing part on the same side as the gas supply hole.

7. The fixing portion is a first wall portion that is disposed closer to the roll cleaning member in the axial direction than the plurality of protrusions, extends radially inward from tips of the protrusions that are disposed at the ends of the plurality of protrusions that are closer to the roll cleaning member, and faces a circumferential surface of the rotating portion with a gap therebetween; a second wall portion that is disposed closer to the roll cleaning member in the axial direction than the first wall portion and covers a gap between the first wall portion and a peripheral surface of the rotating portion as viewed in the axial direction.

8. 8. The substrate cleaning apparatus according to claim 7, wherein a drain hole is formed in an inner circumferential surface of the fixing portion between the first wall portion and the second wall portion.

9. a polishing unit that polishes the substrate; a cleaning unit that cleans the substrate polished in the polishing unit, 9. A substrate processing apparatus, comprising: the cleaning unit comprising: the substrate cleaning apparatus according to claim 1.

10. A roll cleaning member that scrubs the substrate; a rotation holding part that holds an end part of the roll cleaning member in an axial direction, The rotation holding unit is a shaft portion connected to an axial end portion of the roll cleaning member; a housing portion surrounding the shaft portion; a bearing portion disposed inside the housing portion and supporting the shaft portion; a non-contact seal portion disposed between the bearing portion and the roll cleaning member, the non-contact seal portion sealing a gap between the shaft portion and the housing portion, the non-contact seal portion comprising: The non-contact seal portion is a rotating portion attached to the shaft portion and having a plurality of protrusions formed on a peripheral surface thereof at intervals in the axial direction; a fixing portion attached to the housing portion, surrounding the plurality of convex portions, and having a gas supply hole formed on an inner circumferential surface surrounding the plurality of convex portions, for supplying compressed gas from a position axially more inward than convex portions disposed at both ends of the plurality of convex portions, A maintenance method for a substrate cleaning apparatus, comprising the steps of: removing the fixed part from the housing part; and then performing maintenance in a state where a cover enclosing the rotating part is attached to the place where the fixed part was removed.

Citation Information

Patent Citations

  • Carrier cleaning equipment

    JP2000173971A

  • Substrate washing device

    JP2000301079A

  • Apparatus and method for treating substrate

    JP2005142290A

  • A scrubber box and how to use it

    JP2007509749A