Chip collection device and chip collection method

Abstract

To provide a scrap recovery device and a scrap recovery method that can prevent scraps of a tape member from flowing back toward a tape feeder to certainly recover the scraps.SOLUTION: A scrap recovery device comprises: receiving parts 42 that receive scraps KZ of a carrier tape discharged from a tape feeder from scrap receiving openings 42K; and recovery passages 41 that communicate with the inside of the receiving parts 42 through communication ports 41K. The receiving part 42 includes therein an air blower 51 that blows air toward the communication port 41K, and a partition member 61. The partition member 61 is provided to partition the inside of the receiving part 42 into a lower area SP1 where the scrap receiving opening 42 is present and an upper area SP2 where the air blower 51 is present and narrow a flow channel of air blown from the air blower 51 toward the communication port 41K from the air blower 51 toward the communication port 41K.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a chip recovery device and a chip recovery method for recovering chips of a tape member discharged from a tape feeder.

Background Art

[0002] Conventionally, a component mounting device for mounting components on a substrate is known. The component mounting device picks up components supplied from a component supply unit by a mounting head and mounts them on a substrate. As a component supply unit in the component mounting device, a tape feeder that supplies components by a carrier tape (tape member) is frequently used. The tape feeder cuts the carrier tape after supplying the components by a cutter device. Chips of the carrier tape generated by the cutting are discharged to the outside of the component supply device by falling by their own weight through a chute portion.

[0003] Chips of the carrier tape discharged from the component mounting device are usually accommodated in a container installed below the component mounting device. When collecting the chips, an operator pulls out the container from below the component mounting device. However, when the amount of generated chips is extremely large, the collection work becomes a heavy burden. For this reason, conventionally, a chip recovery device capable of automatically recovering chips has been proposed. For example, in Patent Document 1 below, after chips of a cut and falling tape member are guided into a tubular recovery path, a positive pressure is applied to the falling side of the chips and a negative pressure is applied to the discharge side of the chips, so that a chip recovery device having a configuration for moving the chips to the outlet side of the recovery path is disclosed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the conventional chip collection device, when guiding the chips to the collection path, there is a risk that the chips may flow back to the tape feeder side and the chips cannot be fully collected.

[0006] Therefore, an object of the present invention is to provide a chip collection device and a chip collection method that can prevent the chips of the tape member from flowing back to the tape feeder side and reliably collect the chips.

Means for Solving the Problems

[0007] The chip collection device of the present invention includes a receiving portion that receives the chips of the tape member discharged from a tape feeder that supplies parts using the tape member through a chip receiving opening, a collection path that communicates with the inside of the receiving portion through a communication port, an air blower that is installed in the receiving portion and blows air toward the communication port, and a partition member that partitions the inside of the receiving portion into a region on the chip receiving opening side and a region on the air blower side, and is provided so as to narrow the flow path of the air blown from the air blower toward the communication port from the air blower toward the communication port.

[0008] The chip collection method of the present invention is a chip collection method using a chip collection device including: a receiving portion that receives chips of the tape member discharged from a tape feeder that supplies components using the tape member through a chip receiving opening; a collection path that communicates with the inside of the receiving portion through a communication port; an air blower that is installed in the receiving portion and blows air toward the communication port; and a partition member that partitions the inside of the receiving portion into a region on the chip receiving opening side and a region on the air blower side, and is provided so as to narrow the flow path of the air blown from the air blower toward the communication port. After receiving the chips into the receiving portion through the chip receiving opening, air is blown from the air blower toward the communication port, and the pressure in the region on the air blower side in the receiving portion is made relatively lower than the pressure in the region on the chip receiving opening side, thereby forming a flow of air from the chip receiving opening toward the communication port in the receiving portion and moving the chips in the receiving portion into the collection path.

Advantages of the Invention

[0009] According to the present invention, it is possible to prevent the chips of the tape member from flowing back to the tape feeder side and reliably collect the chips.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Mode for Carrying Out the Invention

[0011] (Embodiment 1) FIG. 1 shows a work line 2 to which a chip collection device 1 according to Embodiment 1 of the present invention is applied. The work line 2 is configured by arranging a plurality (here, three) of component mounting devices 3 in series, and the substrate KB is transferred between adjacent component mounting devices 3 and components are mounted on the substrate KB. In the first embodiment, the direction in which the substrate KB is transferred in the work line 2 (the left-right direction as viewed from the operator OP, the direction in which the three component mounting devices 3 are arranged) is defined as the X direction, and the horizontal direction orthogonal to the X direction (the front-back direction as viewed from the operator OP) is defined as the Y direction. Also, the vertical direction is defined as the Z direction.

[0012] In FIG. 2, the component mounting device 3 has a base 11 and a cover member 12 that covers the upper part of the base 11. An operating space 13 covered by the cover member 12 is formed above the base 11. On the upper surface of the base 11, a substrate transfer path 14 extending in the X direction is installed within the operating space 13. The substrate transfer path 14 is composed of a pair of conveyor mechanisms arranged in the Y direction. The substrate transfer path 14 transfers the substrate KB in the X direction and positions the substrate KB at a predetermined working position within the operating space 13.

[0013] In FIG. 2, feeder carts 15 are attached to the front and rear ends of the base 11 respectively. A plurality of tape feeders 16 are arranged side by side in the X direction on each feeder cart 15 (FIG. 1). Each tape feeder 16 takes in a carrier tape 18 (tape member) fed out from a tape reel 17 held by the feeder cart 15 and conveys it in the Y direction (the direction toward the substrate transfer path 14), and supplies the component BH stored in the carrier tape 18 to the component supply position 16K.

[0014] In FIG. 2, two mounting heads 21 are provided above the base 11 so as to be movable by a head moving mechanism 22. Each mounting head 21 is provided with a nozzle 21N extending downward. The head moving mechanism 22 is composed of, for example, a Cartesian robot and moves the two mounting heads 21 independently within a horizontal plane. Each mounting head 21 picks up the component BH supplied by the tape feeder 16 to the component supply position 16K by adsorbing it to the lower end of the nozzle 21N.

[0015] In FIG. 2, the component mounting device 3 is provided with a control device 23. The control device 23 controls the operations of the substrate transfer path 14, the tape feeder 16, the mounting head 21, and the head moving mechanism 22.

[0016] When performing component mounting operations, the component mounting device 3 first activates the substrate conveyance path 14 to receive the substrate KB from the upstream side and position it at the working position. After positioning the substrate KB at the working position, the component mounting device 3 activates the tape feeder 16 to supply the component BH to the component supply position 16K, and at the same time activates the head movement mechanism 22 to repeatedly perform component transfer operations on the mounting head 21. The component transfer operation consists of an operation of picking up the component BH supplied by the tape feeder 16 and an operation of mounting the picked-up component BH on the substrate KB.

[0017] After each component mounting device 3 repeatedly executes the component transfer operation by the mounting head 21 to mount the component BH to be mounted on the substrate KB, it activates the substrate conveyance path 14 to carry out the substrate KB to the downstream side. As a result, when each of the three component mounting devices 3 mounts the component BH on the substrate KB and the component mounting device 3 located on the most downstream side carries out the substrate KB, the component mounting operation on the substrate KB by the work line 2 is completed.

[0018] Next, the chip collection device 1 will be described. First, the cutting of the carrier tape 18 will be described. As shown in FIG. 2, the feeder carriage 15 provided in each component mounting device 3 has a cutter device 31 and a shooter 32. The cutter device 31 is provided below the tape feeder 16 and cuts the carrier tape 18 after the tape feeder 16 has finished supplying the component BH. The shooter 32 is provided below the cutter device 31 as also shown in FIG. 3 (an enlarged view of the region RY in FIG. 2). The shooter 32 guides the chips KZ of the carrier tape 18 cut by the cutter device 31 and falling by its own weight, and discharges them from the discharge opening 32K at the lower end to the outside of the feeder carriage 15.

[0019] As such, chips KZ of the carrier tape 18 are generated from each component mounting device 3 that constitutes the work line 2, and the amount of chips KZ of the carrier tape 18 generated throughout the work line 2 is enormous. The chip collection device 1 in the first embodiment facilitates the disposal of the chips KZ by automatically collecting a large amount of chips KZ of the carrier tape 18 generated from the work line 2 without manual labor.

[0020] In FIG. 4, the chip collection device 1 includes a collection path 41, a receiving portion 42, a positive pressure supply portion 43, and a storage portion 44. The collection path 41 is a tubular member extending in the arrangement direction (X direction) of the component mounting devices 3, and two of them are arranged side by side in the front-rear direction (Y direction) and installed on the floor surface FL. The collection path 41 installed on the front side corresponds to the three feeder carts 15 located on the front side, and the collection path 41 installed on the rear side corresponds to the three feeder carts 15 located on the rear side.

[0021] In FIG. 4, the front and rear collection paths 41 each extend linearly below a plurality of component mounting devices 3 arranged in series in the X direction, and have openings at each of the upstream side (one end side) and the downstream side (the other end side) (see also FIG. 5). Hereinafter, the opening on the upstream side in each collection path 41 is referred to as an "air inlet 41A", and the opening on the downstream side is referred to as an "air outlet 41B".

[0022] In FIGS. 6(a) and 6(b), the collection path 41 has a hollow shape with a rectangular cross-section, and has an upper wall 41C, a lower wall 41D, and two side walls facing each other in the Y direction. One of the two side walls is an outer side wall 41E close to the feeder cart 15, and the other is an inner side wall 41F far from the feeder cart 15. As shown in FIGS. 4 and 5, three communication ports 41K provided corresponding to the three component mounting devices 3 arranged in the X direction are formed in the outer side wall 41E of each collection path 41.

[0023] In FIG. 2, the receiving portion 42 is installed on the floor surface FL below each feeder cart 15. Each receiving portion 42 has a box shape open to the collection path 41 side, and is provided so as to cover the communication port 41K formed in the collection path 41 from the side (FIG. 5).

[0024] In FIGS. 3, 4, and 6(a) and (b), a chip receiving opening 42K that opens upward (toward the tape feeder 16 side) is provided on the upper surface of each receiving portion 42. That is, the chip receiving opening 42K opens upward and is located directly below the shooter 32 of the corresponding feeder carriage 15 (FIG. 3). For this reason, chips KZ of the carrier tape 18 that fall by their own weight through the shooter 32 (that is, the chips KZ discharged from the tape feeder 16) are received into the receiving portion 42 through the chip receiving opening 42K located below it.

[0025] In FIGS. 4 and 5, the end portion on the air outlet 41B side of each recovery path 41 extends obliquely upward toward the downstream side. The tip that extends obliquely upward of each recovery path 41 is a horizontal portion. The air outlet 41B is provided to open on the lower surface of the horizontal portion.

[0026] In FIG. 5, ventilation holes 41H are provided in the vicinity of the air outlets 41B of the front and rear recovery paths 41, respectively. The ventilation hole 41H is an opening that communicates the inside and outside of the recovery path 41. A mesh-like member having a mesh size that does not allow the chips KZ to pass through is attached to the ventilation hole 41H.

[0027] In FIGS. 3, 5, and 6(a) and (b), an air blower 51 is provided inside each receiving portion 42. As shown in FIGS. 4 and 5, the three air blowers 51 provided in the three receiving portions 42 on the front side and the three air blowers 51 provided in the three receiving portions 42 on the rear side are respectively connected in series by a pipe line 52 that is an air supply path extending in the X direction (see also FIGS. 6(a) and (b)). Each pipe line 52 extends in the X direction, and the downstream end portion of the pipe line 52 located on the most downstream side is blocked.

[0028] In FIGS. 3 and 6(a) and (b), a plurality of air outlets 51N are provided side by side in the direction in which the pipe line 52 extends (that is, the X direction) in the air blower 51 inside each receiving portion 42. Each air outlet 51N opens facing the direction of the communication port 41K of the recovery path 41.

[0029] In FIGS. 6(a), (b) and FIG. 7, a partition member 61 is provided in each receiving portion 42. The partition member 61 is provided so as to extend obliquely downward toward the communication port 41K through between the chip receiving opening 42K and the air blower 51 inside the receiving portion 42 (FIG. 7). That is, the partition member 61 partitions the inside of the receiving portion 42 into a region on the chip receiving opening 42K side (lower region SP1) and a region on the air blower 51 side (upper region SP2), and is provided so as to narrow the flow path of the air blown from the air blower 51 toward the communication port 41K from the air blower 51 toward the communication port 41K.

[0030] The inner wall of the receiving portion 42 and the partition member 61 form a nozzle that tapers from the air blower 51 toward the communication port 41K, and form a diffuser that flares from the chip receiving opening 42K toward the communication port 41K. For this reason, when air is blown out from the air blower 51, the air with a high flow velocity flows into the recovery path 41 through the communication port 41K (arrow V1 shown in FIG. 7), and the pressure in the lower region SP1 in the receiving portion 42 becomes relatively lower than the pressure in the upper region SP2. Then, according to the principle of the ejector, an air flow from the chip receiving opening 42K toward the communication port 41K is formed (induced) in the upper region SP2 of the receiving portion 42 (arrow V2 shown in FIG. 7).

[0031] In FIGS. 6(a), (b) and FIGS. 8(a), (b), a flat shutter 62 as a shutter for opening and closing the communication port 41K is provided on the outer side wall 41E in the recovery path 41. The flat shutter 62 is composed of a single flat plate member 71. The flat shutter 62 (flat plate member 71) is attached to the inner surface of the outer side wall 41E by a hinge 72 whose proximal end side has an axis directed in the Z direction (vertical direction). For this reason, the flat plate member 71 can swing in the horizontal plane with the hinge 72 as a fulcrum.

[0032] The flat shutter 62 opens and closes the communication port 41K by moving between a closed position (Figs. 6(a) and 9(a)) that closes the communication port 41K and an open position (Figs. 6(b) and 9(b)) that opens the communication port 41K. When the flat shutter 62 is in the closed position, it extends in the X direction in a plan view and assumes a posture in which the tip of the flat member 71 (flat member tip S1) abuts against the outer side wall 41E of the recovery path 41 (Figs. 6(a) and 9(a)). On the other hand, when the flat shutter 62 is in the open position, it assumes a posture inclined from the X direction (extending in an oblique direction) in a plan view (Figs. 6(b) and 9(b)).

[0033] Thus, in the first embodiment, the flat shutter 62 is composed of a single flat member 71 attached via a hinge 72 to the inside of the recovery path 41 (the inner surface of the recovery path 41. Specifically, the inner surface of the outer side wall 41E of the recovery path 41), and is configured to move between the closed position and the open position by swinging about the hinge 72 as a fulcrum to open and close the communication port 41K.

[0034] As shown in Figs. 6(a), (b) and 8(a), (b), a stopper 73 is provided on the outer side wall 41E of the recovery path 41. The stopper 73 abuts against the side surface of the flat member 71 (specifically, the side surface on the recovery path 41 side) when the opening angle Θ (Fig. 8(a)) of the flat member 71 from the closed position reaches a specified angle Θ1 (Fig. 8(b)).

[0035] The above-specified angle Θ1 is set to an angle at which the tip of the flat member 71 (flat member tip S1) that has swung to the open position side does not contact the inner side wall 41F of the recovery path 41 (Fig. 8(b)). Therefore, the flat shutter 62 does not open at an opening angle Θ exceeding the specified angle Θ1, and thus the flat member tip S1 does not contact the side wall (inner side wall 41F) of the recovery path 41.

[0036] Thus, in the first embodiment, the stopper 73 is a regulating member that regulates the opening angle Θ of the flat plate member 71 from the closed position so that the tip S1 of the flat plate member does not contact the side wall (inner side wall 41F) of the recovery path 41 when the flat plate shutter 62 (flat plate member 71) is open to the open position side.

[0037] In FIG. 4, the positive pressure supply unit 43 incorporates a control valve 43V and is connected to a positive pressure source 82 via an external pipe 81. The air inlets 41A of the front and rear recovery paths 41, the upstream end portions of the front and rear pipelines 52, and the external pipe 81 are connected to the positive pressure supply unit 43. The operation of the control valve 43V is controlled by a management device 83 (FIG. 4) provided separately from the work line 2 or by the control device 23 of one of the component mounting devices 3 that make up the work line 2.

[0038] The positive pressure supply unit 43 supplies positive pressure to the air inlets 41A of the front and rear recovery paths 41 by controlling the positive pressure supplied from the positive pressure source 82 through the external pipe 81 with the control valve 43V. When positive pressure is supplied to the air inlet 41A of the recovery path 41, an air flow from the air inlet 41A toward the air outlet 41B is formed in the recovery path 41. The positive pressure supply unit 43 also supplies positive pressure to each of the front and rear pipelines 52 by controlling the positive pressure supplied from the positive pressure source 82 with the control valve 43V. When positive pressure is supplied into the pipeline 52, air is blown out from the air outlets 51N of all the air blowers 51 connected to the pipeline 52.

[0039] When air is blown out from the air blower 51, the flat plate shutter 62 is pushed open toward the recovery path 41 side by the air (FIG. 6(a) → FIG. 6(b) and FIG. 9(a) → FIG. 9(b)). When the flat plate shutter 62 is pushed open, the chips KZ in the receiving portion 42 move into the recovery path 41 through the communication port 41K by the air flow in the upper region SP2 induced by the air blown out from the air blower 51 (FIG. 9(b)).

[0040] In FIGS. 10(a) and 10(b), the storage unit 44 has a belt conveyor 91. The belt conveyor 91 includes a pair of frames 92 arranged to face each other in the X direction, a plurality of pulleys (a driving pulley 93K and a plurality of driven pulleys 93J) rotatably supported by the pair of frames 92, and a conveyor belt 94 wound around these plurality of pulleys. Partition members 95 extending in the width direction of the conveyor belt 94 are formed at regular intervals on the surface of the conveyor belt 94.

[0041] In FIGS. 10(a) and 10(b), a drive motor 96 is attached to one of the frames 92 of the belt conveyor 91. When the drive motor 96 rotationally drives the driving pulley 93K via a drive belt 97, the conveyor belt 94 runs. A pair of belt guides 98 are provided on the frame 92, and both ends of the conveyor belt 94 are guided by these pair of belt guides 98 to run along a predetermined path. The operation of the drive motor 96 is controlled by the management device 83 or the control device 23 of one of the plurality of component mounting devices 3.

[0042] As shown in FIG. 10(b), the conveyance area by the belt conveyor 91 includes a discharge area R1 extending substantially horizontally in the front-rear direction, a rising area R2 connected to the discharge area R1 and slanting upward, and a disposal area R3 connected to the rising area R2 and extending substantially horizontally along the Y direction. When the driving pulley 93K is rotationally driven by the drive motor 96, the conveyor belt 94 moves through these three areas in this order (in the order of discharge area R1 → rising area R2 → disposal area R3).

[0043] In FIG. 4, the belt conveyor 91 is installed such that the discharge area R1 of the conveyor belt 94 is located directly below the air outlets 41B of the two recovery paths 41. As shown in FIGS. 4, 10(a), and 10(b), a chip passage 99 is provided below the disposal area R3 of the conveyor belt 94, and a storage box 100 is installed below the chip passage 99. The storage box 100 is composed of a box-shaped member that is open upward.

[0044] Next, the chip collection operation by the chip collection device 1 will be described. As described above, the chips KZ on the carrier tape 18 discharged by the feeder carriage 15 provided in each component mounting device 3 are discharged downward through the shooter 32. Then, they are received by the receiving portion 42 through the chip receiving opening 42K formed in the receiving portion 42 (FIGS. 9(a) and 11(a)).

[0045] The management device 83 executes the chip collection operation at regular intervals while the component mounting device 3 constituting the work line 2 is performing the component mounting work. In the collection operation, the management device 83 first operates the control valve 43V of the positive pressure supply unit 43 to supply positive pressure to the front and rear pipelines 52.

[0046] When positive pressure is supplied to each of the front and rear pipelines 52, air is blown out from the air blowers 51 provided in each receiving portion 42 (arrow FD shown in FIGS. 9(b) and 11(b)), the flat shutter 62 is pushed open toward the collection path 41 side and the communication port 41K is opened, and the chips KZ in the receiving portion 42 move into the collection path 41 through the communication port 41K.

[0047] Here, as described above, a partition member 61 is provided in the receiving portion 42 (FIG. 7). When air is blown out from the air blower 51, the pressure in the lower region SP1 on the air blower 51 side in the receiving portion 42 becomes relatively lower than the pressure in the upper region SP2 on the chip receiving opening 42K side. Therefore, an air flow from the chip receiving opening 42K toward the communication port 41K is formed (induced) in the upper region SP2 of the receiving portion 42. For this reason, the chips KZ in the receiving portion 42 smoothly move into the collection path 41 without flowing backward toward the side of the tape feeder 16 (FIGS. 9(b) and 11(b)).

[0048] In addition, the flat shutter 62 is pushed open toward the side of the collection path 41 by the air blown out from the air blower 51. However, since a stopper 73 is provided in the collection path 41, the opening angle Θ of the flat shutter 62 is regulated (restricted) to be equal to or less than a specified angle Θ1. Therefore, even when the flat plate member 71 is vigorously opened toward the open position by the air blown out from the air blower 51, there is no risk that the tip S1 of the flat plate member will bite into the inner wall of the collection path 41 (specifically, the inner side wall 41F). For this reason, the flat shutter 62 located at the open position can surely return to the closed position, and it is possible to prevent problems such as the tip S1 of the flat plate member biting into the inner side wall 41F and the chip collection device 1 stopping functioning.

[0049] When the management device 83 supplies positive pressure to the front and rear pipelines 52, after stopping the supply of the positive pressure (that is, stopping the blowing of air from each air blower 51), it supplies positive pressure to the air inlets 41A of the front and rear collection paths 41 (arrow P shown in FIG. 9(c)). As a result, an air flow in the direction from the air inlet 41A to the air outlet 41B is formed inside each of the front and rear collection paths 41, and the chips KZ that have moved from each receiving portion 42 into the collection path 41 are pressure-fed toward the air outlet 41B side by the air flow (pressure) (FIGS. 9(c) and 11(c)).

[0050] At this time, each flat shutter 62 returns to the closed position and the communication port 41K is closed because the blowing of air from the air blower 51 has stopped and air is flowing in the collection path 41 from the air inlet 41A side toward the air outlet 41B side. Therefore, the chips KZ in the collection path 41 move smoothly to the downstream side.

[0051] As described above, in the chip collection device 1 according to the first embodiment, the positive pressure supply unit 43 supplies positive pressure to the air inlet 41A and forms an air flow from the air inlet 41A to the air outlet 41B in the collection path 41, thereby pressure-feeding the chips KZ discharged into the collection path 41 through the communication port 41K to the air outlet 41B.

[0052] The chips KZ pumped toward the air outlet 41B within the recovery path 41 fall downward from the air outlet 41B and are discharged to the discharge area R1 on the conveyor belt 94 of the storage part 44 located below the air outlet 41B (Fig. 12(a)). After continuously supplying positive pressure into the recovery path 41 for a predetermined time (about several seconds), the management device 83 stops supplying positive pressure to the recovery path 41 at the timing when the chips KZ in the recovery path 41 are discharged from the air outlet 41B onto the conveyor belt 94.

[0053] As described above, since the ventilation holes 41H are provided near the air outlets 41B of the front and rear recovery paths 41 respectively, while positive pressure is being supplied to the air inlet 41A of the recovery path 41, the air within the recovery path 41 escapes to the outside of the recovery path 41 through the ventilation holes 41H. For this reason, the air flow within the recovery path 41 does not stagnate even at the downstream end of the recovery path 41, and the chips KZ within the recovery path 41 are surely discharged from the air outlet 41B.

[0054] When the chips KZ in the recovery path 41 have been discharged onto the conveyor belt 94 of the storage part 44, the management device 83 activates the drive motor 96 of the storage part 44 to run the conveyor belt 94. Thereby, the chips KZ discharged to the discharge area R1 of the conveyor belt 94 are conveyed in the upward direction in the ascending area R2 (see Fig. 10(b)) (arrow H1 shown in Fig. 12(b)) and are carried to the disposal area R3 (arrow H2 shown in Fig. 12(c)). As described above, since the partition member 95 extending in the width direction of the conveyor belt 94 is provided on the surface of the conveyor belt 94, the chips KZ are surely carried to the disposal area R3 without detaching (falling) from the conveyor belt 94 even in the ascending area R2.

[0055] The chips KZ conveyed to the disposal area R3 are then discarded downward from the end of the disposal area R3. The chips KZ discarded from the end of the disposal area R3 fall through the chip passage 99 located directly below and are stored in the storage box 100. Therefore, the chips KZ recovered through the two front and rear recovery paths 41 are finally stored in one storage box 100. When the chips KZ are stored in the storage box 100, the operator OP removes the storage box 100 from the storage unit 44, disposes of the chips KZ at a predetermined location, and then returns the storage box 100 to its original position. This completes a series of chip recovery operations.

[0056] Thus, the chip recovery method for recovering the chips KZ of the carrier tape 18 by the chip recovery device 1 includes a step of receiving the chips KZ in the receiving portion 42 through the chip receiving opening 42K (chip receiving step), and blowing air from the air blower 51 toward the communication port 41K to make the pressure in the region (lower region SP1) on the air blower 51 side in the receiving portion 42 relatively lower than the pressure in the region (upper region SP2) on the chip receiving opening 42K side, thereby forming an air flow from the chip receiving opening 42K toward the communication port 41K in the receiving portion 42 to move the chips KZ in the receiving portion 42 into the recovery path 41 (chip moving step), and a step of pressure-feeding the chips KZ moved into the recovery path 41 and storing them in the storage box 100 (chip storing step).

[0057] (Embodiment 2) Embodiment 2 of the present invention will be described. The chip recovery device 1 in Embodiment 2 has the same configuration as that in Embodiment 1 except for the shutter. The shutter in Embodiment 2 is a bending type shutter 162 composed of two connected flat plate-like members as shown in FIGS. 13(a) and 13(b).

[0058] In FIGS. 13(a) and 13(b), the bending shutter 162 is configured to include a base-end side member 171, a tip-end side member 172, and a bending hinge 173. One end of the base-end side member 171 is attached to the inner surface of the outer side wall 41E in the recovery path 41 by a swing hinge 174 whose axis is provided in the Z direction, and the tip-end side member 172 is attached to the other end side of the base-end side member 171 by a bending hinge 173 whose axis is also directed in the Z-axis direction. Therefore, the base-end side member 171 can swing with the swing hinge 174 as a fulcrum, and the tip-end side member 172 can swing with the bending hinge 173 as a fulcrum.

[0059] Here, the bending hinge 173 is configured to allow the tip-end side member 172 to bend toward the receiving portion 42 side of the base-end side member 171, but to restrict bending beyond the state of being located on the same plane as the base-end side member 171 to the side opposite to the receiving portion 42 (the inner side wall 41F side). For this reason, the bending shutter 162 can assume a posture convex toward the inner side wall 41F side, but does not assume a posture convex toward the outer side wall 41E side.

[0060] The bending shutter 162 opens and closes the communication port 41K by moving between a closed position (FIGS. 13(a) and 14(a)) that closes the communication port 41K and an open position (FIGS. 13(b) and 14(b)) that opens the communication port 41K. In the state of being located at the closed position, the base-end side member 171 and the tip-end side member 172 both extend in the X direction in plan view and are located within the same plane (XZ plane), and the tip end portion of the tip-end side member 172 abuts against the outer side wall 41E of the recovery path 41 from the inner side of the recovery path 41 (FIGS. 13(a) and 14(a)). On the other hand, in the state of being located at the open position, in plan view, the base-end side member 171 is inclined from the X direction and extends obliquely, and the tip-end side member 172 swings (bends) with respect to the base-end side member 171 (FIGS. 13(b) and 14(b)).

[0061] As described above, in the second embodiment, the bending shutter 162 includes a base end side member 171 attached to the inside of the recovery path 41 (the inner surface of the recovery path 41. Specifically, the inner surface of the outer side wall 41E of the recovery path 41) via a swing hinge 174 (first hinge) at one end side, and a tip end side member 172 attached to the other end side of the base end side member via a bending hinge 173 (second hinge). The base end side member 171 swings about the swing hinge 174 as a fulcrum, and the tip end side member 172 swings (bends) about the bending hinge 173 as a fulcrum to move between the closed position and the open position to open and close the communication port 41K.

[0062] As shown in FIGS. 13(a), (b) and FIG. 15(a), a swing stopper 175 is provided on the outer side wall 41E of the recovery path 41. The swing stopper 175 abuts on the side surface of the base end side member 171 (specifically, the side surface on the recovery path 41 side) when the opening angle Θ (FIG. 15(a)) of the base end side member 171 from the closed position reaches a specified angle Θ1 (FIG. 15(b)).

[0063] The above-specified angle Θ1 is set to an angle at which the tip end portion (base end side member tip end portion S2, the same as the bending hinge 173) of the base end side member 171 swung to the open position side does not contact the inner side wall 41F of the recovery path 41 (FIG. 15(b)). For this reason, the base end side member 171 does not open at an opening angle Θ exceeding the specified angle Θ1, and thus the base end side member tip end portion S2 does not contact the side wall (inner side wall 41F) of the recovery path 41.

[0064] As described above, in the second embodiment, the swing stopper 175 is a first regulating member that regulates the opening angle Θ of the base end side member 171 from the closed position so that the base end side member tip end portion S2 (bending hinge 173) of the bending shutter 162 does not contact the side wall (inner side wall 41F) of the recovery path 41 when the base end side member 171 is in an open state to the open position side.

[0065] Also, as shown in FIGS. 13(a), (b) and 15(a), a bending stopper 176 is provided at the tip side of the base end side member 171. The bending stopper 176 is provided on the surface on the receiving portion 42 side of the tip side member 172 with respect to the base end side member 171. When the bending angle Φ (FIG. 15(a)) when the tip side member 172 bends toward the receiving portion 42 side from the state where the tip side member 172 is located in the same plane as the base end side member 171 reaches a specified angle Φ1, the bending stopper 176 abuts against the side surface of the tip side member 172 (specifically, the side surface on the chip collection path 41 side) (FIG. 15(c)).

[0066] The above-specified angle Φ1 is set to a bending angle Φ such that when the tip side member 172 returns from the open position to the closed position (FIG. 16(a) → FIG. 16(b)), the tip side member 172 enters the region on the receiving portion 42 side of the base end side member 171 (refer to the tip side member 172 indicated by the dashed-dotted line in FIG. 16(a)), and the base end side member 171 does not become a state where it cannot return to the closed position (refer to the tip side member 172 indicated by the dashed-dotted line in FIG. 16(b)). That is, the bending stopper 176 serves as a second regulating member that regulates (prevents) the tip side member 172 from being positioned at a position that inhibits the return of the base end side member 171 to the closed position.

[0067] Also in the second embodiment, similar to the case of the first embodiment, the chips KZ of the carrier tape 18 discharged from each tape feeder 16 are accommodated in the receiving portion 42 installed below the shooter 32 (FIG. 14(a)). Then, when positive pressure is supplied to the pipeline 52 and air is blown out from the air blowers 51 in each receiving portion 42 (arrow FD shown in FIG. 14(b)), the bending shutter 162 is pushed by the air and positioned at the open position (FIG. 14(b)).

[0068] In a state where the bending shutter 162 is in the open position, the base-end side member 171 swings about the swing hinge 174 as a fulcrum, and the tip-end side member 172 swings about the bending hinge 173 as a fulcrum, thereby assuming a bent posture with respect to the base-end side member 171. When the bending shutter 162 is pushed open, the chips KZ in the receiving portion 42 are moved into the recovery path 41 through the communication port 41K by the air flow in the upper region SP2 induced by the air blown out from the air blower 51 (Fig. 14(b)).

[0069] The base-end side member 171 is pushed open toward the side of the recovery path 41 by the air blown out from the air blower 51. However, since the swing stopper 175 is provided in the recovery path 41, the opening angle Θ of the base-end side member 171 is regulated (restricted) to be equal to or less than the specified angle Θ1. Therefore, as in the case of the first embodiment, even when the base-end side member 171 is vigorously opened toward the open position by the air blown out from the air blower 51, there is no risk that the tip of the base-end side member S2 will bite into the inner wall (the inner side wall 41F) of the recovery path 41. For this reason, the bending shutter 162 located in the open position can surely return to the closed position, and it is possible to prevent problems such as the tip of the base-end side member S2 biting into the inner side wall 41F and the chip recovery device 1 stopping functioning.

[0070] After the chips KZ in the receiving portion 42 are sucked into the recovery path 41, the blowing of the air from the air blower 51 is stopped, and then a positive pressure is supplied to the pipeline 52 (the arrow P shown in Fig. 14(c)). As a result, an air flow from the air inlet 41A toward the air outlet 41B is formed in the recovery path 41, and the chips KZ in the recovery path 41 from each receiving portion 42 are pumped toward the air outlet 41B side (Fig. 14(c)). At this time, since the blowing of the air from the air blower 51 has stopped and the air is flowing in the recovery path 41 from the air inlet 41A toward the air outlet 41B, the bending shutter 162 returns to the closed position. As a result, the communication port 41K is closed, and the chips KZ in the recovery path 41 smoothly move downstream.

[0071] Here, since the bending shutter 162 is provided with a bending stopper 176, when the base end side member 171 attempts to close the communication port 41K from the open position (i.e., attempts to return to the closed position), the operation of the tip end side member 172 to close the communication port 41K by the base end side member 171 is prevented from being inhibited. For this reason, the bending shutter 162 can return to the closed position, and the communication port 41K will be surely closed by the bending shutter 162.

[0072] As described above, the chip collection device 1 in the first and second embodiments includes a partition member 61 that partitions between the chip receiving opening 42K and the air blower 51 in the receiving portion 42 that receives the chips KZ discharged from the tape feeder 16, and narrows the air flow path from the air blower 51 toward the communication port 41K. When air is blown from the air blower 51 toward the communication port 41K, the pressure in the region on the air blower 51 side (lower region SP1) in the receiving portion 42 becomes relatively lower than the pressure in the region on the chip receiving opening 42K side (upper region SP2). According to the ejector principle, an air flow from the chip receiving opening 42K toward the communication port 41K is formed (induced) in the upper region SP2 of the receiving portion 42.

[0073] Therefore, the chips KZ in the receiving portion 42 move smoothly into the collection path 41 without flowing back to the tape feeder 16 side. For this reason, according to the chip collection device 1 of the first and second embodiments, it is possible to prevent the chips KZ on the carrier tape 18 from flowing back to the tape feeder 16 side, and it is possible to surely collect the chips KZ. Further, as a result, the amount of chips KZ remaining in the receiving portion 42 can be made extremely small, so the frequency of maintenance work for removing the chips KZ remaining in the receiving portion 42 can be reduced. Therefore, it can exhibit a great effect in the automatic collection of chips KZ.

[0074] Although the embodiments 1 and 2 of the present invention have been described so far, the present invention is not limited to the above-described embodiments, and various modifications are possible. For example, in the embodiments 1 and 2, the storage unit 44 is configured to convey the chips KZ discharged from the air outlet 41B of the recovery path 41 by the belt conveyor 91 and discharge them into the storage box 100. However, the storage box 100 may be installed below the air outlet 41B without using the belt conveyor 91. Further, in the above-described embodiments 1 and 2, there are two recovery paths 41, but this is an example, and the number of recovery paths 41 is not limited.

Industrial Applicability

[0075] Provided are a chip recovery device and a chip recovery method capable of preventing chips of a tape member from flowing backward to the tape feeder side and reliably recovering the chips.

Explanation of Signs

[0076] 1 Chip recovery device 16 Tape feeder 18 Carrier tape (tape member) 41 Recovery path 41A Air inlet 41B Air outlet 41F Inner side wall (side wall) 41K Communication port 42 Receiving part 42K Chip receiving opening 43 Positive pressure supply part 44 Storage part 51 Air blower 61 Partition member 62 Flat shutter (shutter) 71 Flat plate member 72 Hinge 73 Stopper (restricting member) 162 Bent shutter (shutter) 171 Base end side member 172 Tip end side member 173 Bent hinge (second hinge) 174 Swing hinge (first hinge) 175 Rocking stopper (first regulating member) 176 Bending stopper (second regulating member) S1 Tip of flat plate member (tip) S2 Tip of base end side member (tip) KZ Chip BH Component

Claims

1. A receiving portion that receives chips of the tape member discharged from a tape feeder that supplies components using the tape member through a chip receiving opening; A recovery path that communicates with the inside of the receiving portion through a communication port; An air blower installed in the receiving portion that blows out air toward the communication port; A partition member that partitions the inside of the receiving portion into a region on the chip receiving opening side and a region on the air blower side, and is provided so as to narrow the flow path of the air blown from the air blower toward the communication port from the air blower toward the communication port; A chip recovery device comprising:

2. By blowing out air from the air blower and making the pressure in the region on the air blower side in the receiving portion relatively lower than the pressure in the region on the chip receiving opening side, an air flow from the chip receiving opening toward the communication port is formed in the receiving portion to move the chips in the receiving portion into the recovery path. The chip recovery device according to claim 1.

3. The chip receiving opening is opened upward, and the partition member extends obliquely downward toward the communication port inside the receiving portion. The chip recovery device according to claim 1 or 2.

4. Comprising a positive pressure supply unit, the recovery path has an air inlet on one end side and an air outlet on the other end side, the communication port is provided in a region between the air inlet and the air outlet, and the positive pressure supply unit supplies positive pressure to the air inlet. By forming an air flow from the air inlet toward the air outlet in the recovery path, the chips discharged into the recovery path through the communication port are pressure-fed to the air outlet. The chip recovery device according to any one of claims 1 to 3.

5. A shutter that is located at a closed position for closing the communication port when positive pressure is supplied to the air inlet of the recovery path by the positive pressure supply unit, and is located at an open position for opening the communication port when positive pressure is not supplied to the air inlet of the recovery path by the positive pressure supply unit. The chip recovery device according to claim 4.

6. The shutter moves between the closed position and the open position by swinging in a horizontal plane to open and close the communication port. The chip recovery device according to claim 5.

7. The shutter is composed of a single flat plate member whose proximal end side is attached to the inside of the recovery path via a hinge. The chip recovery device according to claim 6.

8. The chip collection device according to claim 7, further comprising a regulating member that regulates the opening angle of the flat plate member from the closed position so that the tip of the flat plate member does not contact the side wall of the collection path in a state where the flat plate member is open toward the open position side.

9. The chip collection device according to claim 6, wherein the shutter includes a base end side member having one end attached to the inside of the collection path via a first hinge, and a tip end side member attached to the other end of the base end side member via a second hinge.

10. A first regulating member that regulates the opening angle of the base end side member from the closed position so that the tip of the base end side member does not contact the side wall of the collection path in a state where the base end side member is open toward the open position side, and a second regulating member that regulates the tip end side member to be located at a position that inhibits the return of the base end side member to the closed position. The chip collection device according to claim 9, comprising:

11. The chip collection device according to any one of claims 4 to 10, further comprising a storage unit that stores chips discharged from the air outlet of the collection path.

12. A chip collection method using a chip collection device, the chip collection device comprising: a receiving unit that receives chips of the tape member discharged from a tape feeder that supplies components using a tape member through a chip receiving opening; a collection path that communicates with the inside of the receiving unit through a communication port; an air blower that is installed in the receiving unit and blows air toward the communication port; and a partition member that partitions the inside of the receiving unit into a region on the chip receiving opening side and a region on the air blower side, and is provided so as to narrow the flow path of the air blown from the air blower toward the communication port. After receiving the chips in the receiving unit through the chip receiving opening, air is blown from the air blower toward the communication port, and the pressure in the region on the air blower side in the receiving unit is made relatively lower than the pressure in the region on the chip receiving opening side, thereby forming a flow of air from the chip receiving opening to the communication port in the receiving unit and moving the chips in the receiving unit into the collection path. A chip collection method.

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