Component crimping device and method for controlling the component crimping device

Abstract

To provide a component crimping device, etc., capable of suppressing reduction of mounting accuracy.SOLUTION: A component crimping device 100 comprises: a substrate holding section 110 including a holding surface for holding a substrate in a state where an end to crimp a component protrudes; a backup section 120 including an adsorbing surface for adsorbing the end from a lower side of the substrate; an adsorption mechanism 130 which generates an adsorption force on the adsorbing surface; a crimping section 150 for crimping the component from an upper side of the substrate to the end adsorbed by the backup section 120; a position change section 140 for changing relative positions of the backup section 120 and the substrate holding section 110; and a control section 170. The control section 170 causes the position change section 140 to change the relative positions to first relative positions where the holding surface is located above the adsorbing surface in a state where the end is separated from the adsorbing surface, then to change the relative positions to second relative positions where the holding surface is located lower than the adsorbing surface, causes the adsorption mechanism 130 to adsorb the end to the adsorbing surface, and causes the crimping section 150 to crimp the component to the substrate.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a component compression bonding apparatus that thermocompresses components onto a substrate and a method for controlling the component compression bonding apparatus. [Background technology]

[0002] Conventionally, there is a component bonding device that bonds components such as a drive circuit to a substrate (for example, see Patent Document 1). The component bonding device disclosed in Patent Document 1 presses the substrate against the stage by blowing air onto the substrate placed on a stage, and then adheres the substrate to the stage by discharging air from the bottom side of the substrate, and then bonds components to the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-086214 A Summary of the Invention [Problem to be solved by the invention]

[0004] Depending on the substrate, the position where the component is to be pressure-bonded may be warped or otherwise deformed. With a deformed substrate, for example, blowing air onto the substrate as disclosed in Patent Document 1 may not be enough to press the substrate properly against the stage, and even if air is exhausted from the bottom side of the substrate, the substrate may not be able to be adsorbed to the stage. In such a state, the component may not be able to be pressure-bonded to the substrate, or even if the component is pressure-bonded to the substrate, the component may be pressure-bonded to an inappropriate position on the substrate, resulting in reduced mounting accuracy.

[0005] The present invention provides a component crimping device and the like that can suppress a decrease in mounting accuracy. [Means for solving the problem]

[0006] a back-up unit having an adsorption surface for adsorbing the end of the component from below the board; a suction mechanism for generating an adsorption force at the adsorption surface; a crimping unit for crimping the component from above the board to the end adsorbed to the backup unit; a position change unit for changing a relative position between the back-up unit and the board holding unit; and a control unit. The control unit causes the position change unit to change the relative position to a first relative position where the board is held on the holding surface and the holding surface is positioned above the suction surface with the end spaced from the suction surface, and then to a second relative position where the holding surface is positioned below the suction surface. At the second relative position, the control unit causes the suction mechanism to adsorb the end to the suction surface, and causes the crimping unit to crimp the component to the board with the end adsorbed to the suction surface.

[0007] and a position change unit that changes a relative position between the backup unit and the board holding unit, wherein, with the board held by the holding surface and the end portion spaced apart from the suction surface, the position change unit changes the relative position to a first relative position where the holding surface is positioned above the suction surface, and then changes the relative position to a second relative position where the holding surface is positioned below the suction surface, and at the second relative position, causes the suction mechanism to adsorb the end portion to the suction surface, and causes the suction mechanism to adsorb the end portion to the suction surface and causes the crimping unit to crimp the component to the board with the end portion adsorbed to the suction surface by the suction mechanism.

[0008] In addition, these comprehensive or specific aspects may be realized by a system, a method, an integrated circuit, a computer program, or a non-transitory recording medium such as a computer-readable CD-ROM, or may be realized by any combination of a system, a method, an integrated circuit, a computer program, and a recording medium. Effect of the Invention

[0009] According to the present invention, it is possible to provide a component pressure bonding device and the like that can suppress a decrease in mounting accuracy. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic side view of a component crimping device according to an embodiment. [Diagram 2] FIG. 2 is a block diagram showing a functional configuration of the component crimping device according to the embodiment. [Diagram 3] FIG. 3 is a diagram for explaining the relative positions of a board holding unit and a backup unit provided in the component pressure bonding device according to the embodiment. [Figure 4] FIG. 4 is a flowchart illustrating a process procedure of the component crimping device according to the embodiment. [Diagram 5] FIG. 5 is a schematic side view for explaining a processing procedure of the component crimping device according to the embodiment. [Figure 6] FIG. 6 is a schematic side view for explaining a processing procedure of the component crimping device according to the embodiment. [Figure 7] FIG. 7 is a schematic side view for explaining a processing procedure of the component crimping device according to the embodiment. [Figure 8] FIG. 8 is a schematic side view for explaining a processing procedure of the component crimping device according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. Note that each of the embodiments described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, the arrangement and connection of the components, steps, and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims of the present invention will be described as optional components.

[0012] In addition, each figure is a schematic diagram and is not necessarily illustrated precisely. Therefore, for example, the scales in each figure do not necessarily match. In addition, in each figure, substantially the same configurations are given the same reference numerals, and duplicated explanations are omitted or simplified.

[0013] In the present specification and drawings, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional Cartesian coordinate system. The X-axis and Y-axis are mutually orthogonal and are both orthogonal to the Z-axis. In the following embodiments, the positive direction of the Z-axis may be described as upward and the negative direction of the Z-axis may be described as downward.

[0014] (Embodiment) [composition] First, the configuration of the component crimping device according to the embodiment will be described.

[0015] Fig. 1 is a schematic side view of a component crimping apparatus 100 according to an embodiment. Fig. 2 is a block diagram showing a functional configuration of the component crimping apparatus 100 according to an embodiment. In Fig. 1, a suction mechanism 130, a position change unit 140, and a computer 300 are shown as functional blocks.

[0016] The component pressure-bonding apparatus 100 is an apparatus that pressure-bonds (more specifically, main pressure-bonds) a component 210 placed (more specifically, provisionally pressure-bonded) on a substrate 200 to the substrate 200.

[0017] The component bonding apparatus 100 is, for example, a part of a component mounting system for producing a display panel or the like. In the component mounting system, for example, an anisotropic conductive member such as an ACF (Anisotropic Conductive Film) is attached to an electrode portion provided on a substrate 200, and the substrate 200 and a component 210 are thermocompression-bonded via the anisotropic conductive member. The mounting system includes, for example, the component bonding apparatus 100, an attachment apparatus that attaches the ACF to the substrate 200, and a pre-compression-bonding apparatus that presses (pre-compresses) the component 210 to the substrate via the ACF. For example, the component bonding apparatus is a full-compression-bonding apparatus included in the mounting system. The component bonding apparatus 100 thermocompresses (full-compression-bonds) the substrate 200 that has been carried out from an upstream apparatus (for example, a pre-compression-bonding apparatus) to the substrate holding unit 110 by a substrate conveying apparatus (not shown) and the component 210 that has been pre-compressed to the substrate 200. The substrate 200 to which the components 210 are thermocompression-bonded is then transported, for example, by the substrate transport device to a downstream device.

[0018] An example of the substrate 200 is a flexible substrate made of resin, etc. The substrate 200 may be a display panel using a glass substrate, etc.

[0019] Examples of the component 210 include flexible components such as TCP (Tape Carrier Package) and FPC (Flexible Printed Circuits).

[0020] Component compression bonding apparatus 100 includes a substrate holding unit 110, a backup unit 120, a suction mechanism 130, a position changing unit 140, a compression bonding unit 150, a correction mechanism 160, and a computer 300. Computer 300 includes a control unit 170 and a storage unit 180.

[0021] Each of the devices provided in the component crimping apparatus 100, such as the suction mechanism 130, the position change unit 140, the crimping unit 150, and the correction mechanism 160, is connected to the computer 300 via a control line or the like (not shown) or wirelessly so as to be able to communicate with the computer 300, and each device performs a predetermined task by being controlled by the computer 300.

[0022] The substrate holding unit 110 is a movable stage that holds the substrate 200 on a holding surface 11. For example, the substrate 200 transported by the substrate transport device described above is placed on the substrate holding unit 110. Specifically, the substrate holding unit 110 has a holding surface 11 that holds the substrate 200 in a state in which an end 201 of the component 210 to be crimped protrudes. That is, the substrate 200 is placed on the substrate holding unit 110 in a state in which the end 201, which is the outer edge of the substrate 200, protrudes from the substrate holding unit 110 (more specifically, in a state in which the end 201 does not overlap the substrate holding unit 110 when viewed from above). The end 201 is supported by the backup unit 120.

[0023] The substrate holding unit 110 is, for example, a three-axis stage that is movable in the X-axis, Y-axis, and Z-axis directions, and is provided so as to be movable by a position changing unit 140.

[0024] The backup unit 120 is a stage (so-called backup stage) for supporting, from the back side (lower side) of the substrate 200, a portion of the substrate 200 to which the component 210 is to be crimped, i.e., an end portion 201 of the substrate 200 that protrudes from the substrate holding unit 110, when the crimping unit 150 crimps the component 210 to the substrate 200. The backup unit 120 also includes an adsorption surface 21 that adsorbs the end portion 201 from below the substrate 200. The backup unit 120 supports the end portion 201 from below while adsorbing the end portion 201 of the substrate 200 with the adsorption surface 21, for example.

[0025] The suction surface 21 is a support surface provided on the backup unit 120 for supporting the substrate 200, and suctions the substrate 200. For example, an opening (e.g., a through hole) is formed in the suction surface 21, and a suction mechanism 130 that sucks the substrate 200 onto the suction surface 21 by sucking air through the opening is connected to the opening.

[0026] The suction mechanism 130 is a device for suctioning the end 201 of the substrate 200 onto the suction surface 21 of the backup part 120. Specifically, the suction mechanism 130 generates an adsorption force on the suction surface 21 that adsorbs the substrate 200 onto the suction surface 21.

[0027] The suction mechanism 130 includes, for example, a vacuum pump that sucks air, a vacuum pipe that connects the vacuum pump to the opening, and a valve for controlling the suction. The computer 300 controls the valve to switch the suction mechanism 130 between sucking the edge 201 of the substrate 200 and not sucking it.

[0028] The valve included in the suction mechanism 130 may be, for example, a solenoid valve for switching on and off the suction of air, or a pressure adjustment valve (a so-called pressure regulator) for switching the suction force (the suction force).

[0029] The position changing unit 140 is a device that changes the relative position (relative positional relationship) between the backup unit 120 and the substrate holding unit 110. In this embodiment, the position changing unit 140 changes the relative position between the backup unit 120 and the substrate holding unit 110 by moving the substrate holding unit 110 out of the backup unit 120 and the substrate holding unit 110.

[0030] In the following description, the relative positional relationship between the backup part 120 and the substrate holding part 110 may be simply referred to as the relative position.

[0031] The position changing unit 140 is, for example, a conveyor that is configured to be able to move the substrate holding unit 110 arbitrarily on the XY plane and to be able to move up and down in the Z-axis direction.

[0032] An opening (e.g., a through hole) may be formed in the holding surface 11, and the substrate holding part 110 may hold the substrate 200 by suction on the holding surface 11. A suction device that sucks air through the opening to suck the substrate 200 on the holding surface 11 may be connected to the opening, and the suction device may suck the air to suction and hold the substrate 200 on the holding surface 11. The suction mechanism may have, for example, a vacuum pump that sucks air, a vacuum pipe that connects the vacuum pump and the opening, and a valve for controlling suction.

[0033] Alternatively, the substrate holding portion 110 may not have the above-mentioned opening or the like in the holding surface 11 , and the substrate 200 may be simply placed on the holding surface 11 , thereby holding the substrate 200 on the holding surface 11 .

[0034] The bonding unit 150 is a device that compresses (thermocompresses) the component 210 onto the substrate 200 held by the substrate holding unit 110. Specifically, the bonding unit 150 compresses the component 210 onto the end portion 201 sucked by the backup unit 120 from above the substrate 200.

[0035] The bonding unit 150 has, for example, a head for bonding the component 210 to the substrate 200, a bonding head moving mechanism having a linear guide and a linear motor for moving the head (for example, reciprocating in the Z-axis direction), and a heater such as a heating wire or a Peltier element for heating the head. The head is provided so as to be movable (for example, vertically movable) by the head moving mechanism. The computer 300 controls, for example, the heater and the head moving mechanism to cause the head to thermocompress the component 210 to the substrate 200.

[0036] The correction mechanism 160 is a gas ejector that ejects gas. Specifically, the correction mechanism 160 ejects gas from above the substrate 200 toward the end 201 at a second relative position described below. More specifically, the correction mechanism 160 ejects gas from above the substrate 200 toward the end 201 of the substrate 200 at the second relative position described below, thereby ejecting gas toward the end 201 of the substrate 200. The correction mechanism 160 ejects gas from the center of the substrate 200 held by the substrate holding unit 110 toward the end 201, for example.

[0037] The central side may be closer to the center of the substrate 200 than the end portion 201 to which the component 210 is pressure-bonded when the substrate 200 is viewed in plan view. For example, the correction mechanism 160 (more specifically, the gas outlet of the correction mechanism 160) may be located above the center of the substrate 200 when the substrate 200 is viewed in plan view, or may be located above the end of the substrate 200 on the opposite side to the end portion 201 when viewed from the central portion.

[0038] The correction mechanism 160 includes, for example, a nozzle having an outlet for ejecting gas, a pump storing gas, a pipe connecting the pump and the outlet, and a valve for switching whether or not to eject gas from the outlet. The computer 300 controls, for example, the valve to cause the correction mechanism 160 to switch whether or not to eject gas.

[0039] The computer 300 moves the substrate holding unit 110 so that the end 201 of the substrate 200 is positioned above the suction surface 21 of the backup unit 120 (for example, so that the end 201 of the substrate 200 comes into contact with the suction surface 21 of the backup unit 120), and then causes the correction mechanism 160 to eject gas. As a result, the end 201 of the substrate 200 is pressed against the suction surface 21 by the gas, making it easier for the suction mechanism 130 to suction the end 201 of the substrate 200 to the suction surface 21 of the backup unit 120.

[0040] The gas may be any gas, for example, air.

[0041] The computer 300 is a control device that controls each device included in the component crimping apparatus 100. The computer 300 is, for example, a personal computer, and is realized by a communication interface for communicating with each device included in the component crimping apparatus 100, a non-volatile memory in which a program is stored, a volatile memory that is a temporary storage area for executing the program, an input / output port for transmitting and receiving signals, a processor for executing the program, and the like.

[0042] The computer 300 includes a control unit 170 and a storage unit 180 .

[0043] The control unit 170 is a processing unit that controls the operation of each device included in the component pressure bonding device 100, such as the suction mechanism 130, the position changing unit 140, the pressure bonding unit 150, and the correction mechanism 160, as well as the timing of the operation.

[0044] For example, the control unit 170 causes the position changing unit 140 to change the relative position to a first relative position where the holding surface 11 is positioned above the suction surface 21 with the substrate 200 held by the holding surface 11 and the end portion 201 spaced apart from the suction surface 21, and then to a second relative position where the holding surface 11 is positioned below the suction surface 21. Thereafter, the control unit 170 further causes the suction mechanism 130 to suction the end portion 201 to the suction surface 21 at the second relative position. Thereafter, the control unit 170 further causes the pressure bonding unit 150 to pressure bond the component 210 to the substrate 200 with the suction mechanism 130 suctioning the end portion 201 to the suction surface 21.

[0045] The control unit 170 may cause the bonding unit 150 to bond the component 210 to the substrate 200 at the second relative position, or may change the relative position to a third relative position where the holding surface 11 and the suction surface 21 are at the same height, and then cause the bonding unit 150 to bond the component 210 to the substrate 200 at the third relative position. That is, for example, the control unit 170 causes the position change unit 140 to change the relative positions of the substrate holding unit 110 and the backup unit 120 to the second relative position, and then causes the suction mechanism 130 to further change the relative position to a third relative position where the holding surface 11 and the suction surface 21 are at the same height, with the end portion 201 being suctioned to the suction surface 21. Thereafter, the control unit 170 further causes the bonding unit 150 to bond the component 210 to the substrate 200 at the third relative position.

[0046] Furthermore, the control unit 170 controls the suction mechanism 130 to make the suction force of the suction mechanism 130 for suctioning the substrate 200 at the third relative position the same as or different from the suction force at the second relative position. For example, the control unit 170 causes the position change unit 140 to change the relative position of the substrate holding unit 110 and the backup unit 120 to the second relative position, and causes the suction mechanism 130 to suction the end portion 201 to the suction surface 21 at the second relative position with a first suction force, while causing the position change unit 140 to change the relative position of the substrate holding unit 110 and the backup unit 120 to the third relative position. After that, the control unit 170 further causes the suction mechanism 130 to suction the end portion 201 to the suction surface 21 at the third relative position with a second suction force that is higher than the first suction force.

[0047] FIG. 3 is a diagram for explaining the relative positions of substrate holding unit 110 and backup unit 120 provided in component pressure bonding apparatus 100 according to the embodiment.

[0048] Specifically, (a) of Fig. 3 is a diagram illustrating a case where the relative position between the substrate holding unit 110 and the backup unit 120 is a first relative position. (b) of Fig. 3 is a diagram illustrating a state where the relative position between the substrate holding unit 110 and the backup unit 120 is in the middle of being changed from the first relative position to the second relative position, and the holding surface 11 and the suction surface 21 are at the same height. (c) of Fig. 3 is a diagram illustrating a case where the relative position between the substrate holding unit 110 and the backup unit 120 is a second relative position. (d) of Fig. 3 is a diagram illustrating a case where the relative position between the substrate holding unit 110 and the backup unit 120 is a third relative position.

[0049] In FIG. 3, some of the components of the component crimping device 100, such as the suction mechanism 130, the position changing unit 140, the crimping unit 150, and the correction mechanism 160, are not shown.

[0050] As shown in (a) of Figure 3, for example, with the substrate 200 held by the substrate holding part 110, the control part 170 controls the position changing part 140 to move the substrate holding part 110 so that the end part 201 of the substrate 200 is positioned above the adsorption surface 21 of the backup part 120.

[0051] Conventionally, for example, as shown in (b) of Figure 3, the control unit 170 controls the position changing unit 140 to move the substrate holding unit 110 so that the holding surface 11 and the suction surface 21 are at the same height, and then adsorbs the end portion 201 of the substrate 200 onto the suction surface 21 to hold (place) the end portion 201 on the suction surface 21, and controls the crimping unit 150 to crimp the component 210 onto the substrate 200.

[0052] 3, the substrate 200 (more specifically, the end 201 of the substrate 200) may be warped or otherwise deformed. In such a case, even if the suction mechanism 130 is to suction the end 201 of the substrate 200, the end 201 may not be able to be suctioned by the suction mechanism 130 because the distance between the end 201 and the suction surface 21 is too far. In this state, the end 201 is not suctioned by the suction surface 21, and therefore the bonding unit 150 cannot properly bond the component 210 to the substrate 200. In other words, the mounting accuracy may decrease, the yield rate may decrease, or the production speed may decrease (in other words, the productivity may decrease).

[0053] Furthermore, even if the correction mechanism 160 is used to blow gas onto the end portion 201 in order to return the deformation of the substrate 200 to an appropriate state (for example, a flat, unwarped shape), depending on the degree of warping, thickness, strength (hardness), etc., of the end portion 201 of the substrate 200, the blowing pressure of the gas blown from the correction mechanism 160 may not be sufficient to cause the suction mechanism 130 to adsorb the end portion 201 of the substrate 200.

[0054] 3(c), in this embodiment, the control unit 170 controls the position changing unit 140 to change the relative positions of the substrate holding unit 110 and the backup unit 120 to a second relative position in which the holding surface 11 is located below the suction surface 21. As a result, even if the substrate 200 is warped, the end portion 201 can be easily brought close to the suction surface 21 of the backup unit 120, and therefore, by suctioning the end portion 201 with the suction mechanism 130, the end portion 201 can be easily brought into contact with the suction surface 21.

[0055] 3(d), for example, control unit 170 causes suction mechanism 130 to suction end 201 to suction surface 21 at the second relative position while causing position change unit 140 to change the relative positions of substrate holding unit 110 and backup unit 120 to a third relative position. Thereafter, control unit 170 causes compression unit 150 to compress component 210 onto substrate 200 at the third relative position.

[0056] As a result, even if the substrate 200 is warped, the substrate 200 can be returned to an appropriate shape (for example, a flat plate shape) and the compression section 150 can compression-bond the component 210 to the substrate 200.

[0057] Here, for example, the control unit 170 adsorbs the end portion 201 to the adsorption surface 21 with a first adsorption force at the second relative position, and adsorbs the end portion 201 to the adsorption surface 21 with a second adsorption force that is stronger than the first adsorption force at the third relative position.

[0058] The first and second suction forces may be set arbitrarily as long as the second suction force is stronger than the first suction force. The first suction force is, for example, an suction force that allows the end 201 to slide on the suction surface 21 while contacting the end 201 with the suction surface 21. The second suction force is, for example, an suction force that allows the end 201 to slide on the suction surface 21 while contacting the end 201 with the suction surface 21.

[0059] The suction force is, for example, the force that pulls the component 210 on the suction surface 21, and is (area of ​​the through hole) x (gauge pressure) when the suction mechanism 130 sucks through a through hole provided in the suction surface 21. The gauge pressure is the pressure of a pump that sucks through the through hole and a pipe connected to the through hole. When the pump is a vacuum pump, the gauge pressure is the vacuum pressure.

[0060] The control unit 170 may obtain information indicating the second relative position, that is, information indicating how much the holding surface 11 should be lowered relative to the height of the suction surface 21, by storing the information in advance in the storage unit 180 or by using an operation device operated by a user, such as a keyboard or a touch panel, and a communication interface that communicates with the operation device. That is, the control unit 170 may obtain information indicating the second relative position from the storage unit 180, from an external device such as an operation device, or from any device. Alternatively, for example, the control unit 170 may calculate how much the holding surface 11 should be lowered relative to the height of the suction surface 21, based on an image obtained from a camera that captures an image of the side surface of the substrate 200 (for example, the YZ plane in this embodiment). The component pressure bonding apparatus 100 may further include the camera.

[0061] Furthermore, the control unit 170 may control the correction mechanism 160 at the second relative position to blow gas onto the end 201 of the substrate 200. The control unit 170 may continue to blow gas onto the correction mechanism 160 while changing the relative position from the second relative position to the third relative position, or may not blow gas onto the correction mechanism 160 after the suction mechanism 130 has adsorbed the end 201. The control unit 170 may not cause the correction mechanism 160 to blow gas onto the end 201 after changing the relative position to the third relative position, or may cause the correction mechanism 160 to continue to blow gas onto the end 201 until the suction mechanism 130 has adsorbed the end 201 with the second suction force, or may cause the correction mechanism 160 to continue to blow gas onto the end 201 until the bonding unit 150 has bonded the component 210 to the substrate 200 with pressure. Furthermore, the control unit 170 may cause the correction mechanism 160 to start blowing gas from the first relative position, or may cause the correction mechanism 160 to start blowing gas while the relative position is being changed from the first relative position to the second relative position. Alternatively, the control unit 170 may cause the correction mechanism 160 to constantly blow gas.

[0062] The control unit 170 is realized, for example, by a computer 300 having a communication interface for communicating with each device included in the component crimping apparatus 100, a processor, and memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory). For example, the control unit 170 is realized by a control program stored in a memory included in the computer 300 for controlling each device included in the component crimping apparatus 100, and a processor included in the computer 300, such as a CPU (Central Processing Unit) that executes the control program.

[0063] The storage unit 180 stores various data necessary for component pressure bonding processing such as the size of the substrate 200, the type of the component 210 to be mounted on the substrate 200, the mounting position, the mounting direction, the operation of each device, the timing of the operation, and the control program executed by the control unit 170. For example, the storage unit 180 stores information indicating the suction force of the suction mechanism 130, information indicating the relative position, and the like.

[0064] The storage unit 180 is realized by, for example, a memory such as a ROM or a RAM included in the computer 300.

[0065] [Processing Procedure] Next, a process procedure of the component crimping apparatus 100 according to the embodiment will be described. Fig. 4 is a flowchart for explaining the process procedure of the component crimping apparatus 100 according to the embodiment. Figs. 5 to 8 are schematic side views for explaining the process procedure of the component crimping apparatus 100 according to the embodiment.

[0066] 5 to 8, some of the components of the component crimping device 100, such as the suction mechanism 130 and the position changing unit 140, are not shown.

[0067] First, substrate holding unit 110 holds substrate 200 on which component 210 is placed (e.g., temporarily bonded) at end 201 (S101). For example, control unit 170 controls a substrate conveying device (not shown) to convey substrate 200, which is arranged in an apparatus positioned upstream of component pressure bonding apparatus 100, to substrate holding unit 110, thereby causing substrate holding unit 110 to hold substrate 200.

[0068] Next, the control unit 170 controls the position changing unit 140 to change the relative position to a first relative position where the holding surface 11 is positioned above the suction surface 21 with the end portion 201 spaced apart from the suction surface 21 (S102). In this embodiment, the control unit 170 controls the position changing unit 140 to move the substrate holding unit 110 so that the holding surface 11 is positioned above the suction surface 21 with the end portion 201 spaced apart from the suction surface 21. For example, as shown in FIG. 5, the pressure bonding unit 150, the end portion 201, and the backup unit 120 are arranged in this order from the top, spaced apart from each other.

[0069] Next, the control unit 170 controls the position change unit 140 to change the relative position to a second relative position where the holding surface 11 is positioned below the suction surface 21 with the substrate 200 held on the holding surface 11 (S103). In this embodiment, the control unit 170 controls the position change unit 140 to move the substrate holding unit 110 so that the holding surface 11 is positioned below the suction surface 21. For example, as shown in FIG. 6, the control unit 170 controls the position change unit 140 to move the substrate holding unit 110 so that at least a part of the lower surface of the end portion 201 comes into contact with the suction surface 21 (or the vicinity of the portion of the backup unit 120 where the suction surface 21 is provided).

[0070] Next, the control unit 170 controls the correction mechanism 160 to eject gas from above the center of the substrate 200 toward the end portion 201, thereby causing the correction mechanism 160 to blow the gas onto the end portion 201 (S104).

[0071] Next, the control unit 170 controls the suction mechanism 130 to cause the suction mechanism 130 to suction the end portion 201 to the suction surface 21 at the second relative position (S105). As a result, for example, a wide area of ​​the lower surface of the end portion 201 is suctioned by the suction mechanism 130 and comes into contact with the suction surface 21, as shown in Fig. 7. Here, the control unit 170 causes, for example, the suction mechanism 130 to suction the end portion 201 to the suction surface 21 with a first suction force.

[0072] Next, the control unit 170 controls the position change unit 140 while the suction mechanism 130 is suctioning the end 201 of the substrate 200 on the suction surface 21, thereby causing the position change unit 140 to change the relative position to a third relative position where the holding surface 11 and the suction surface 21 are positioned at the same height (S106). For example, as shown in Fig. 8, the substrate holding unit 110 is moved so that the holding surface 11 and the suction surface 21 are positioned at the same height, whereby the substrate 200 has an appropriate shape (for example, a flat plate shape).

[0073] Next, the control unit 170 controls the compression bonding unit 150 to cause the compression bonding unit 150 to perform compression bonding of the component 210 onto the board 200 (S107).

[0074] [Effects, etc.] As described above, the component crimping apparatus 100 according to the embodiment comprises a substrate holding unit 110 having a holding surface 11 for holding the substrate 200 with the end 201 of the component 210 to be crimped protruding therefrom, a backup unit 120 having an adsorption surface 21 for adsorbing the end 201 from below the substrate 200, a suction mechanism 130 for generating an adsorption force at the suction surface 21, a crimping unit 150 for crimping the component 210 from above the substrate 200 onto the end 201 adsorbed to the backup unit 120, a position change unit 140 for changing the relative position between the backup unit 120 and the substrate holding unit 110, and a control unit 170. The control unit 170 causes the position changing unit 140 to change the relative position to a first relative position in which the holding surface 11 is positioned above the suction surface 21 with the substrate 200 held on the holding surface 11 and the end portion 201 spaced apart from the suction surface 21, and then causes the position changing unit 140 to change the relative position to a second relative position in which the holding surface 11 is positioned below the suction surface 21, and with the suction mechanism 130 adsorbing the end portion 201 to the suction surface 21 at the second relative position, causes the suction mechanism 130 to adsorb the end portion 201 to the suction surface 21, and causes the crimping unit 150 to crimp the component 210 onto the substrate 200.

[0075] This makes it possible to easily bring end portion 201 close to suction surface 21 of backup part 120 even when substrate 200 is warped or otherwise deformed. Therefore, when end portion 201 is suctioned (adsorbed) by suction mechanism 130, end portion 201 can be easily brought into contact with suction surface 21. Therefore, component pressure bonding device 100 can suppress a decrease in mounting accuracy.

[0076] Also, for example, the control unit 170 causes the position changing unit 140 to change the relative position to the second relative position, and then causes the suction mechanism 130 to change the relative position to a third relative position in which the holding surface 11 and the suction surface 21 are at the same height while the end portion 201 is adsorbed to the suction surface 21, and causes the crimping unit 150 to crimp the component 210 onto the substrate 200 at the third relative position.

[0077] According to this, since the component 210 is pressure-bonded to the substrate 200 in a state in which the substrate 200 is in an appropriate shape (for example, a flat plate shape), deterioration in mounting accuracy due to deformation of the substrate 200 or the like is further suppressed.

[0078] Also, for example, the control unit 170 causes the position changing unit 140 to change the relative position to the second relative position, and causes the suction mechanism 130 to adsorb the end portion 201 to the suction surface 21 with a first suction force at the second relative position, while causing the position changing unit 140 to change the relative position to a third relative position, and causes the suction mechanism 130 to adsorb the end portion 201 to the suction surface 21 with a second suction force that is stronger than the first suction force at the third relative position.

[0079] When changing from the second relative position to the third relative position, if the suction force of the suction mechanism 130 is too high, the end 201 does not move relative to the suction surface 21, and the substrate 200 may be distorted. Therefore, when changing from the second relative position to the third relative position, it is preferable that the suction force is such that the end 201 does not leave the suction surface 21 and the end 201 can slide relative to the suction surface 21. On the other hand, in the third relative position, it is preferable that the end 201 does not move relative to the suction surface 21 in order to press the component 210 to the substrate 200. Therefore, it is preferable that the suction force is such that the end 201 does not move from the suction surface 21 in the third relative position. Therefore, in the second relative position, the suction mechanism 130 suctions the end 201 to the suction surface 21 with a first suction force, and in the third relative position, the suction force is such that the end 201 is suctioned to the suction surface 21 with a second suction force that is higher than the first suction force. This makes it possible to suppress deformation of substrate 200 caused by changing from the second relative position to the third relative position, while also suppressing displacement of substrate 200 when component 210 is pressure-bonded to substrate 200.

[0080] Moreover, for example, component pressure bonding apparatus 100 further includes correction mechanism 160 that blows gas onto end portion 201 from above substrate 200. For example, at the second relative position, correction mechanism 160 blows gas onto end portion 201.

[0081] This allows the end portion 201 to easily come into contact with the suction surface 21. Therefore, the suction mechanism 130 can easily suction the end portion 201 to the suction surface 21 appropriately.

[0082] Also, for example, the correction mechanism 160 blows gas from the center side of the substrate 200 held by the substrate holder 110 toward the end portion 201 side.

[0083] According to this, when the end portion 201 is deformed, such as warped, the occurrence of a defect such as the gas being blown onto the lower surface of the end portion 201 and causing the substrate 200 to move is suppressed. Therefore, the end portion 201 can be more easily and appropriately adsorbed on the adsorption surface 21 by the adsorption mechanism 130.

[0084] Furthermore, a control method for component crimping apparatus 100 according to this embodiment is a control method for component crimping apparatus 100 which comprises substrate holding section 110 having holding surface 11 which holds substrate 200 with end 201 of component 210 to be crimped protruding therefrom, backup section 120 having suction surface 21 which adsorbs end 201 from below substrate 200, suction mechanism 130 which generates an adsorption force at suction surface 21, crimping section 150 which crimps component 210 from above substrate 200 onto end 201 adsorbed to backup section 120, and position change section 140 which changes the relative position of backup section 120 and substrate holding section 110. In the control method for component crimping apparatus 100, the position changing unit 140 changes the relative position to a first relative position in which the substrate 200 is held by the holding surface 11 and the end portion 201 is spaced from the suction surface 21, and the holding surface 11 is positioned above the suction surface 21 (S102), then changes the relative position to a second relative position in which the holding surface 11 is positioned below the suction surface 21 (S103). At the second relative position, the suction mechanism 130 adsorbs the end portion 201 to the suction surface 21 (S105), and with the suction mechanism 130 adsorbing the end portion 201 to the suction surface 21, the crimping unit 150 is caused to crimp the component 210 onto the substrate 200 (S107).

[0085] This provides the same effects as those of the component crimping device 100.

[0086] (Other embodiments) Although the component crimping device and the like according to the present embodiment have been described above based on the above embodiment, the present invention is not limited to the above embodiment.

[0087] For example, in the above embodiment, the component pressure-bonding apparatus 100 has been described as a full pressure-bonding apparatus in a mounting system, but it is not particularly limited as long as it is an apparatus that presses the component 210 onto the substrate 200, such as a temporary pressure-bonding apparatus.

[0088] Also, for example, in the above embodiment, the position changer 140 has been described as a device that moves the substrate holding unit 110, but it may be a device that moves the backup unit 120, or it may be a device that moves both the substrate holding unit 110 and the backup unit 120. When the position changer is a device that moves the backup unit 120, for example, it may be realized by a conveyor configured to be able to raise and lower the backup unit 120 in the Z-axis direction, or may be realized by a linear guide and a motor, or it may be realized by any configuration that can move the backup unit 120.

[0089] Furthermore, for example, in the above embodiment, the method of adsorbing the substrate 200 onto the adsorption surface 21 has been described as vacuum adsorption using a vacuum pump by the adsorption mechanism 130, but the adsorption mechanism 130 may be configured to adsorb the substrate 200 onto the adsorption surface 21 in any manner.

[0090] Furthermore, computer 300 may be a dedicated computer for controlling each device included in component pressure bonding apparatus 100, or may be a computer that also controls each device included in a mounting system including component pressure bonding apparatus 100.

[0091] Also, for example, in the above embodiment, all or some of the components of computer 300 may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a hard disk drive (HDD) or semiconductor memory.

[0092] Furthermore, the components of the computer 300 may be configured with one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

[0093] The one or more electronic circuits may include, for example, a semiconductor device, an integrated circuit (IC), or a large scale integration (LSI). The IC or LSI may be integrated into one chip or into multiple chips. Here, the IC or LSI is referred to as an IC or LSI, but the name may vary depending on the degree of integration, and may be called a system LSI, a very large scale integration (VLSI), or an ultra large scale integration (ULSI). Also, a field programmable gate array (FPGA) that is programmed after the LSI is manufactured can be used for the same purpose.

[0094] In addition, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art may think of, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope that does not deviate from the spirit of the present invention. [Industrial Applicability]

[0095] The component bonding device according to the present invention can be used as a bonding device for bonding components to a substrate. [Explanation of symbols]

[0096] 11 Holding surface 21 Adsorption surface 100 Component crimping device 110 Board holding part 120 Backup Department 130 Adsorption mechanism 140 Position change section 150 Crimping section 160 Correction mechanism 170 Control section 180 Storage section 200 boards 201 End 210 parts 300 Computers

Claims

1. a substrate holder having a holding surface for holding the substrate with an end of the component to be crimped protruding therefrom; a backup portion having an adsorption surface that adsorbs the end portion from below the substrate; an adsorption mechanism that generates an adsorption force on the adsorption surface; a crimping portion that crimps the component from above the substrate to the end portion that is sucked by the backup portion; a position changing unit that changes a relative position between the backup unit and the substrate holding unit; A control unit, The control unit is causing the position changing unit to change the relative position to a first relative position in which the substrate is held by the holding surface and the holding surface is positioned above the suction surface with the end portion spaced from the suction surface, and then causing the position changing unit to change the relative position to a second relative position in which the holding surface is positioned below the suction surface; At the second relative position, the suction mechanism is caused to suction the end portion onto the suction surface; In a state where the end portion is attracted to the suction surface of the suction mechanism, causing the position changing unit to change the relative position to a third relative position in which the holding surface and the suction surface are positioned at the same height; causing the compression bonding portion to compress the component onto the substrate at the third relative position; Component crimping device.

2. The control unit is causing the position change unit to change the relative position to the second relative position; While the suction mechanism is causing the end portion to be attracted to the suction surface with a first suction force at the second relative position, causing the position changer to change the relative position to the third relative position; and causing the suction mechanism to suction the end portion to the suction surface with a second suction force higher than the first suction force at the third relative position. The component crimping device according to claim 1 .

3. a correction mechanism for blowing gas onto the end of the substrate from above the substrate, In the second relative position, the correction mechanism blows the gas onto the end portion.

3. The component crimping device according to claim 1 or 2.

4. the correction mechanism blows the gas from a center side toward an end side of the substrate held by the substrate holder. The component crimping device according to claim 3 .

5. a substrate holder having a holding surface for holding the substrate with an end of the component to be crimped protruding therefrom; a backup portion having an adsorption surface that adsorbs the end portion from below the substrate; an adsorption mechanism that generates an adsorption force on the adsorption surface; a crimping portion that crimps the component from above the substrate to the end portion that is sucked by the backup portion; a position changing unit that changes a relative position between the backup unit and the board holding unit, causing the position changing unit to change the relative position to a first relative position where the holding surface is positioned above the suction surface while the substrate is held by the holding surface and the end portion is separated from the suction surface, and then causing the position changing unit to change the relative position to a second relative position where the holding surface is positioned below the suction surface; At the second relative position, the suction mechanism is caused to suction the end portion onto the suction surface; In a state where the end portion is attracted to the suction surface of the suction mechanism, causing the position changing unit to change the relative position to a third relative position in which the holding surface and the suction surface are positioned at the same height; causing the compression bonding portion to compress the component onto the substrate at the third relative position; A method for controlling a component crimping device.

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