Pickup collet, pickup device and mounting device

Abstract

To provide a pickup collet capable of positioning an electronic component while picking it up with no contact, a pickup device and a mounting device.SOLUTION: A pickup collet 200 of an embodiment is configured to suck in and hold and pick up an electronic component 2 having a rectangular outer edge. The pickup collet 200 comprises a porous member 201 which has gas permeability and ejects a gas supplied inside through pores of an opposite surface 201a opposed to the electronic component 2 in a planar shape. In the porous member 201, an opening 201d is included in the opposite surface 201a, suction hole 201c is provided for sucking in the electronic component 2 with a negative pressure, and a guide part 203 is disposed along the outer edge of the electronic component 2 and provided for regulating movements of the electronic component 2 held on the opposite surface 201a. In the guide part 203, a gas permeable part 203a is provided for bringing the side of one orthogonal guide part 203 into a relatively positive pressure rather than the side of the other orthogonal guide part 203.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a pickup collet, a pickup device, and a mounting device. [Background technology]

[0002] When mounting electronic components, such as logic, memory, image sensors, and other semiconductor elements, on a substrate, the wafer on which the semiconductor elements are formed is cut into individual chips, and these chips are then picked up one by one and transferred to the substrate for mounting.

[0003] One side of the chip, the front side, is a functional surface on which fine circuits are formed. When picking up this chip from the wafer, if the pick-up member comes into direct contact with the functional surface, there is a risk of damaging the circuits, etc., so there is a demand to avoid such contact.

[0004] In addition, the connection terminals on the surface of the chip and the connection terminals on the substrate are also bonded to each other by facing each other. In this case, in order to ensure and improve the bondability between the connection terminals, the surface of the chip may be subjected to surface treatment such as plasma treatment or surface activation treatment. In order to maintain the condition of the surface of the chip that has been treated in this way, there is a demand to avoid direct contact of the member to be picked up with the surface of the chip.

[0005] In order to meet the requirement that no parts come into contact with the surface of the chip, conventionally, in a collet, which is a part that picks up the chip, the surface that holds the chip is made tapered, and the chip is held by suction from the center, with only the peripheral part, not the surface, in contact with the tapered surface of the collet (see Patent Document 1). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Utility Model Application Publication No. 63-124746 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in the conventional technology described above, the collet contacts only the periphery of the chip, and the chip is sucked from the center. This makes the chip prone to distortion, which may lead to chipping or cracking. In addition, the collet contacts the edge of the chip periphery and supports the chip being sucked at the contact portion, so stress is concentrated on the periphery, which makes chipping and cracking more likely. Furthermore, since the position of the chip is fixed while it is held by suction, if there is any misalignment or tilt when it is held by suction, it cannot be corrected when it is transferred to the mounting device.

[0008] The embodiments of the present invention have been made to solve the above-mentioned problems, and their purpose is to provide a pickup collet, a pickup device, and a mounting device that can pick up and position electronic components in a non-contact manner. [Means for solving the problem]

[0009] An embodiment of the present invention is a pickup collet that sucks and holds an electronic component having a rectangular outer edge and picks up the electronic component, the pickup collet having a porous member that is breathable and that ejects gas supplied to the inside in a planar manner through pores in an opposing surface facing the electronic component, the porous member having an opening in the opposing surface and a suction hole that sucks in the electronic component by negative pressure, a guide portion that is arranged along the outer edge of the electronic component and restricts movement of the electronic component held on the opposing surface, and a ventilation portion that makes one perpendicular guide portion side of the guide portion relatively more positive pressure than the other perpendicular guide portion side.

[0010] Moreover, an embodiment of the present invention is a pickup device that picks up an electronic component from a sheet to which the electronic component is attached, and includes the pickup collet and a collet moving mechanism that brings the pickup collet close to a position on the sheet where the electronic component can be sucked and held, and peels the sucked and held electronic component off the sheet so that it can be transported.

[0011] In addition, the mounting apparatus of an embodiment of the present invention has a bonding head that is movable relative to the pickup collet and receives the electronic component from the pickup collet, and a mounting section that transfers the electronic component held by the bonding head to a substrate and mounts it thereon. Effect of the Invention

[0012] According to the pickup collet, pickup device, and mounting device of the present invention, it is possible to pick up and position an electronic component in a non-contact manner. [Brief description of the drawings]

[0013] [Figure 1] FIG. 2 is a front view showing a transfer device and a mounting device according to the embodiment. [Diagram 2] FIG. 2 is a plan view showing a transfer device and a mounting device according to the embodiment. [Diagram 3] 1A is a schematic cross-sectional view showing the principle of holding an electronic component by a pickup collet, and FIG. 1B is a bottom perspective view showing the base. [Figure 4] FIG. 4 is a bottom perspective view showing the pickup collet and the attachment / detachment portion. [Diagram 5] FIG. 2 is a top perspective view showing a pickup collet and a detachable portion. [Figure 6] FIG. 4 is a block diagram showing a control device of the transfer device and the mounting device. [Figure 7] 1A and 1B are schematic bottom views illustrating the principle of positioning of an electronic component by a pickup collet, showing a state before positioning and a state after positioning. [Figure 8]10 is a flowchart showing a procedure of a pick-up operation according to the embodiment. [Figure 9] FIG. 11 is an explanatory diagram showing a pick-up operation according to the embodiment. [Figure 10] FIG. 13 is a schematic cross-sectional view showing a modified example in which a guide portion having a guiding porous member is provided. [Figure 11] FIG. 13 is a schematic cross-sectional view showing a modified example in which a guide portion having an ejection port is provided. [Figure 12] FIG. 13 is a schematic cross-sectional view showing a modified example in which a guide portion having a suction port is provided. [Figure 13] 13 is a bottom view showing a modified example of the arrangement of the guide portion. FIG. [Figure 14] 13A is a bottom perspective view showing a modified example of the pickup collet, and FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] An embodiment of the present invention will be described with reference to the drawings. Note that the drawings are schematic diagrams, and the size, ratio, and the like of each part include parts that are exaggerated for ease of understanding. As shown in Figs. 1 and 2, a pickup collet 200 of this embodiment is used in a transfer device 1 for electronic components 2. The transfer device 1 includes a pickup device 20, a mounting device 30, and a control device 50, and is a device that transfers the electronic components 2 to the mounting device 30 by the pickup device 20.

[0015] The electronic component 2 is, for example, a rectangular thin piece component. In this embodiment, the electronic component 2 is a semiconductor chip obtained by dividing a wafer into individual pieces. The semiconductor chip has a functional surface that functions as a semiconductor element on one of the front and back surfaces. The mounting apparatus 100 is an apparatus that mounts the electronic component 2 supplied from the supply device 10 onto a substrate via transfer by the transfer device 1. That is, in addition to the configuration of the transfer device 1, the mounting apparatus 100 includes the supply device 10 and a substrate stage 60 that supports the substrate.

[0016] The supply device 10 is a device that supplies electronic components 2 to the pickup device 20. The supply device 10 moves the electronic components 2 to be picked up to a supply position P1. The supply position P1 is a position where the pickup device 20 picks up the electronic components 2 to be picked up. The supply device 10 includes a supply stage 12 that supports a sheet 11 to which the electronic components 2 are attached, and a stage movement mechanism 13 that moves the supply stage 12. The stage movement mechanism 13 is, for example, a ball screw mechanism driven by a servo motor.

[0017] The sheet 11 to which the electronic components 2 are attached is an adhesive wafer sheet attached to a wafer ring (not shown) in this example. The electronic components 2 are arranged in a matrix on the sheet 11. In this embodiment, the electronic components 2 are arranged in a face-up state with their functional surfaces exposed upward.

[0018] The supply stage 12 is a platform that horizontally supports the wafer ring to which the sheet 11 is attached. In other words, the supply stage 12 supports the sheet 11 to which the electronic components 2 are attached via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by a stage movement mechanism 13. Since the sheet 11 is supported horizontally by the stage movement mechanism 13 together with the supply stage 12, the sheet 11 and the electronic components 2 placed on the sheet 11 are also provided so as to be movable in the horizontal direction.

[0019] 1, the horizontal direction in which the supply device 10 and the mounting device 30 are aligned is called the X-axis direction, and the direction perpendicular to the X-axis is called the Y-axis direction. The direction perpendicular to the plane of the sheet 11 is called the Z-axis direction or the up-down direction. The upward direction is the direction toward the side on which the electronic components 2 are placed, with the plane of the sheet 11 as the boundary, and the downward direction is the direction toward the side on which the electronic components 2 are not placed, with the plane of the sheet 11 as the boundary.

[0020] [Pickup device] The pickup device 20 is a device that picks up the electronic components 2 from the supply device 10 and delivers the picked-up electronic components 2 to the mounting device 30. The pickup device 20 includes a pickup collet 200, a collet movement mechanism 22, a direction changing unit 23, and a push-up pin 24.

[0021] 3 to 5, the pickup collet 200 is a member that sucks and holds the electronic component 2 and releases the sucked and held electronic component 2. The pickup collet 200 has a porous member 201, a base 202, and a guide portion 203.

[0022] The porous member 201 is a member that has air permeability and supplies gas supplied to the inside through pores in the facing surface 201a facing the electronic component 2 (note that in the following description, the gas supplied toward the electronic component 2 is illustrated with the symbol G). The porous member 201 of this embodiment has a rectangular parallelepiped plate shape, and fine spaces that communicate as a whole are densely and uniformly formed. The porous member 201 has air permeability due to this structure, but its conductance is very small. One of the faces of the porous member 201 becomes the facing surface 201a, and when gas is supplied to the inside from the back surface 201b opposite to the facing surface 201a, the gas is ejected from the dense and uniformly present pores in the facing surface 201a. This ejection is substantially planar, spreading over the entire surface of the facing surface 201a from which the gas is ejected. This ejection is extremely gentle, so to speak, it feels like it is oozing out, and you can feel a slight air flow by bringing your finger close to it. The pores on the surfaces other than the opposing surface 201a and the rear surface 201b may be blocked.

[0023] As described above, the porous member 201 is a continuous structure in which the pores, which are minute spaces inside, are interconnected and gas can pass between the pores. Sintered metal, ceramic, resin, etc. can be used as the porous member 201. From the viewpoint that the particles inside are unlikely to separate and flow out, it is preferable to use sintered metal.

[0024] 3 and 4, the porous member 201 has an opening 201d on the opposing surface 201a, and is provided with a suction hole 201c which is a through hole that sucks the electronic component 2 by negative pressure. The suction hole 201c in this embodiment linearly penetrates from the center of the back surface 201b to the center of the opposing surface 201a.

[0025] The base 202 is a member that covers the surfaces of the porous member 201 other than the opposing surface 201a. In this embodiment, the base 202 is a rectangular box that is open at the bottom. The outer shape of the base 202 defines the rectangular outer edge of the pickup collet 200. The porous member 201 is inserted from the opening of the base 202 so that the bottom surface is exposed as the opposing surface 201a, and is assembled and fixed inside the base 202.

[0026] As shown in FIG. 3 and FIG. 5, the top surface of the base 202 is provided with an air supply hole 202a, an exhaust hole 202b, and a mounting hole 202c. The air supply hole 202a is a through hole for supplying air to the porous member 201. The air supply hole 202a is formed at a position close to the outer edge of the base 202 for a pipe connected to the air supply hole 202a. The exhaust hole 202b is a through hole for generating negative pressure in the opening 201d through the suction hole 201c. The exhaust hole 202b extends downward and is formed to match the suction hole 201c of the porous member 201. A space for gas accumulation is formed between the inner surface of the base 202 and the porous member 201 around the exhaust hole 202b. The exhaust hole 202b may penetrate the suction hole 201c and reach the opposing surface 201a. In this case, suction hole 201c and opening 201d of porous member 201 are provided so as to be in close contact with the outside of exhaust hole 202b that reaches opposing surface 201a of porous member 201. Mounting holes 202c are a pair of recessed holes for preventing misalignment when connecting with collet moving mechanism 22.

[0027] The air supply hole 202a is connected to a gas supply circuit via a pipe (not shown). The supply circuit includes a gas supply source, a pump, a valve, etc. Here, the gas supplied to the porous member 201 via the air supply hole 202a is an inert gas. The exhaust hole 202b is connected to a negative pressure generating circuit including a vacuum pump, a valve, etc. via a pipe (not shown).

[0028] The guide portion 203 is a member that is disposed along the outer edge of the electronic component 2 and restricts the movement of the electronic component 2 held on the facing surface 201a. "Along the outer edge of the electronic component 2" means that the guide portion 203 is disposed in a direction along the outer edge, and does not necessarily contact the electronic component 2. The guide portion 203 of this embodiment is disposed along the four sides of the rectangular base 202. The guide portion 203 is, for example, a plurality of plate-like bodies provided along the four side surfaces of the base 202, that is, along the four sides of the rectangular facing surface 201a, as shown in FIG. 3, FIG. 4, and FIG. 5. The guide portion 203 of this embodiment is provided on each side of the facing surface 201a, but is not limited thereto.

[0029] Each guide portion 203 has a protruding portion protruding from the facing surface 201a. The distance (protruding amount) of the guide portion 203 protruding from the facing surface 201a may be sufficient to restrict the movement of the electronic component 2 held on the facing surface 201a through the gas layer, and may be at least the extent to which the guide portion 203 extends from the facing surface 201a to the electronic component 2 held through the gas layer. However, if the protruding portion of the guide portion 203 protrudes beyond the electronic component 2 held on the facing surface 201a through the gas layer, it is necessary to take care not to contact the electronic components 2 around the electronic component 2 to be picked up when picking it up from the wafer. Therefore, it is preferable that the distance by which the protruding portion of the guide portion 203 protrudes from the facing surface 201a is within the side surface of the electronic component 2 held on the facing surface 201a through the gas layer. However, as described later, by controlling the push-up pin 24 at the time of picking up, it is possible to avoid contact with the surrounding electronic components 2 in response to various protruding amounts.

[0030] In the guide section 203, among the four guide sections 203 along each of the four sides of the opposing surface 201a, one of the two opposing guide sections 203 is provided with a ventilation section 203a. The guide sections 203 with the ventilation section 203a are provided on two adjacent sides of the opposing surface 201a. As described later, the ventilation section 203a can blow gas toward the opposing guide section 203. That is, the ventilation section 203a is provided at one of the four corners to make the one orthogonal guide section 203 side relatively more positive pressure than the other orthogonal guide section 203 side at the diagonal corner. The orthogonal here includes a case where the two guide sections 203 on adjacent sides are in contact with each other or are continuous to form a right angle, and a case where there are multiple guide sections 203 on one side, the guide sections 203 are separated, and the straight lines (planes) along which the two guide sections 203 are aligned are orthogonal to each other (see FIG. 13). In the following description, one pair of orthogonal guide portions 203 will be referred to as 203K and 203L, and the other pair of orthogonal guide portions 203 will be referred to as 203M and 203N. When no distinction is required, these will be referred to as guide portions 203.

[0031] The ventilation section 203a in this embodiment is provided inside one of the orthogonal guide sections 203K, 203L so as to communicate between the outside and the periphery of the electronic component 2 held on the opposing surface 201a. The ventilation section 203a is connected to a gas supply circuit via a pipe (not shown). An end of the ventilation section 203a is an outlet 203b facing one of the two side surfaces of the electronic component 2. Therefore, gas can be ejected from the outlet 203b toward the side surfaces of the electronic component 2.

[0032] The collet moving mechanism 22 is a mechanism for moving the pickup head 21, to which the pickup collet 200 is attached, back and forth between a supply position P1 and a transfer position P2, and also for raising and lowering the pickup head 21 at the supply position P1 and the transfer position P2. The transfer position P2 is a position where the pickup device 20 passes the electronic component 2 picked up at the supply position P1 to a bonding head 31 that functions as a receiving section, which will be described later. The supply position P1 and the transfer position P2 mainly refer to positions in the XY directions, and do not necessarily refer to positions in the Z axis direction.

[0033] Even when referring to the position (height) in the Z-axis direction, the height is assumed to have a predetermined width. The predetermined width includes the thickness of the electronic component 2, the distance the electronic component 2 is pushed up, the distance at which the electronic component 2 can be picked up, and the like when transferring the electronic component 2. In particular, when referring to the position (height) in the Z-axis direction, at the supply position P1, the height at the approach position is assumed to be H1, and the height at the peeling position is assumed to be H2 (see FIG. 9).

[0034] The collet moving mechanism 22 has an arm 222a to which the pickup head 21 is attached, and moves the pickup collet 200 attached to the pickup head 21 by moving the arm 222a. The tip of the pickup head 21 is provided with a removable part 222b, which has a magnet inside and attracts and holds the base 202 of the pickup collet 200 by the magnetic attraction. As shown in Figs. 4 and 5, a pair of pins 222c are provided on the contact surface of the removable part 222b with the base 202. The pins 222c fit into the mounting holes 202c provided in the base 202, thereby preventing the pickup collet 200 from shifting relative to the removable part 222b. Although not shown, the pipe connected to the exhaust hole 202b passes through the removable part 222b, and the pipe connected to the air supply hole 202a is supported by the removable part 222b.

[0035] The collet moving mechanism 22 includes a slide mechanism 221 and an elevation mechanism 222. The slide mechanism 221 moves the arm 222a to which the pickup head 21 is attached, thereby moving the pickup collet 200 back and forth between a supply position P1 and a delivery position P2. Here, the slide mechanism 221 extends parallel to the X-axis direction and has a rail 221b fixed to a support frame 221a, and a slider 221c that runs on the rail 221b.

[0036] The lifting mechanism 222 moves the pickup collet 200 in the up-down direction by moving the arm 222a to which the pickup head 21 is attached. Specifically, the lifting mechanism 222 can use a ball screw mechanism driven by a servo motor. That is, the pickup collet 200 is raised and lowered along the Z-axis direction by driving the servo motor. The pickup collet 200 is elastically supported by the pickup head 21 via the attachment / detachment part 222b, and is provided so as to be slidable up and down in the Z-axis direction relative to the pickup head 21. The pickup head 21 has a sensor that detects this sliding movement.

[0037] The direction changing unit 23 is provided between the pickup collet 200 and the collet moving mechanism 22. Here, the direction changing unit 23 is an actuator including a drive source such as a motor that changes the direction of the pickup collet 200. The direction of the pickup collet 200 is the direction from the base 202 side of the pickup collet 200 toward the opposing surface 201a. Changing the direction means rotating the pickup collet 200 by 0° to 180° in the vertical direction. For example, the pickup collet 200 with the opposing surface 201a facing the supply stage 12 sucks and holds the electronic component 2 at the supply position P1. After that, the direction changing unit 23 changes the direction of the pickup collet 200 so that the suction surface faces upward. At this time, the rotation angle is 180°.

[0038] The push-up pin 24 is provided below the sheet 11 of the supply device 10. The push-up pin 24 is a needle-shaped member with a sharp tip. The push-up pin 24 is provided inside the backup body 241 so that the length direction is parallel to the Z-axis direction.

[0039] The backup body 241 has a drive mechanism for advancing or retreating the thrust pin 24 from or to the inside of the backup body 241. The advancement or retreat is performed in the vertical direction. The drive mechanism is driven by, for example, an air cylinder or a cam mechanism.

[0040] [Onboard equipment] The mounting device 30 is a device that transports the electronic component 2 received from the pickup device 20 to a mounting position P3 and mounts it on a board. The mounting position P3 is a position where the electronic component 2 is mounted on the board. The mounting device 30 has a bonding head 31 and a head moving mechanism 32.

[0041] The bonding head 31 functions as a receiving unit that receives the electronic component 2 from the pickup collet 200 at the delivery position P2, and is also a device that mounts the electronic component 2 on a board at the mounting position P3. The bonding head 31 holds the electronic component 2, and after mounting, releases the held state to release the electronic component 2.

[0042] Specifically, the bonding head 31 includes a nozzle 31a. The nozzle 31a holds the electronic component 2 and releases the held state to release the electronic component 2. The nozzle 31a includes a nozzle hole. The nozzle hole opens to a suction surface at the tip of the nozzle 31a. The nozzle hole is connected to a negative pressure generating circuit (not shown) such as a vacuum pump, and the circuit generates negative pressure to suction and hold the electronic component 2 on the suction surface of the nozzle 31a. Furthermore, the held state of the electronic component 2 is released from the suction surface by releasing the negative pressure.

[0043] The head moving mechanism 32 is a mechanism for moving the bonding head 31 back and forth between the delivery position P2 and the mounting position P3, and also for raising and lowering the bonding head 31 at the delivery position P2 and the mounting position P3. Specifically, the head moving mechanism 32 includes a slide mechanism 321 and a lifting mechanism 322.

[0044] The slide mechanism 321 reciprocates the bonding head 31 between the delivery position P2 and the mounting position P3. Here, the slide mechanism 321 extends parallel to the X-axis direction and has two rails 321b fixed to a support frame 321a, and a slider 321c that runs on the rails 321b.

[0045] Although not shown, the slide mechanism 321 has a slide mechanism that slides the bonding head 31 in the Y-axis direction. This slide mechanism can also be configured with a rail in the Y-axis direction and a slider that runs on the rail. The lift mechanism 322 moves the bonding head 31 in the up and down direction. Specifically, the lift mechanism 322 can use a ball screw mechanism driven by a servo motor. That is, the bonding head 31 is lifted and lowered along the Z-axis direction by driving the servo motor.

[0046] The substrate stage 60 is a platform that supports a substrate on which the electronic component 2 is to be mounted. The substrate stage 60 is provided on a stage movement mechanism 61. The stage movement mechanism 61 is a movement mechanism that slides and moves the substrate stage 60 on the XY plane, and aligns the planned mounting position of the electronic component 2 on the substrate with the mounting position P3. The stage movement mechanism 61 is, for example, a ball screw mechanism driven by a servo motor.

[0047] The mounting device 30 has an imaging device, an image processing device, and a position recognition device, none of which are shown. The imaging device captures images of the electronic component 2 held by the bonding head 31 and the board supported by the board stage 60, and the position recognition device recognizes the positional relationship between them based on the images processed by the image processing device. Based on this positional relationship, the mounting device 30 mounts the electronic component 2 on the board. The imaging device may be a top-bottom dual-view camera that is inserted between the electronic component 2 and the board and can capture images of both simultaneously, or a camera that captures images of both separately.

[0048] [Control device] The control device 50 controls the start, stop, speed, operation timing, etc. of the supply device 10, the pickup device 20, the mounting device 30, and the substrate stage 60. In other words, the control device 50 is a control device for the transfer device 1 and the mounting device 100. The control device 50 can be realized, for example, by a dedicated electronic circuit or a computer that operates with a predetermined program. An input device through which an operator inputs instructions and information required for control, and an output device for checking the status of the device are connected to the control device 50. The input device can be a switch, a touch panel, a keyboard, a mouse, etc. The output device can be a display unit such as a liquid crystal or an organic electroluminescence (EL).

[0049] Fig. 6 is a functional block diagram of the control device 50. As shown in Fig. 6, the control device 50 has a supply device control unit 51, a push-up pin control unit 52, a pickup control unit 53, a bonding head control unit 54, a substrate stage control unit 56, and a storage unit 57.

[0050] The supply device control unit 51 controls the movement of the supply stage 12. In other words, it controls the movement of the electronic components 2 to be picked up that are placed on the sheet 11. The push-up pin control unit 52 controls the movement of the push-up pins 24, that is, the operation of the backup body 241.

[0051] The pickup control unit 53 controls the movement of the pickup collet 200. That is, the pickup control unit 53 controls the operations of the collet moving mechanism 22 and the direction changing unit 23. The pickup control unit 53 also controls a supply circuit communicating with the air supply hole 202a, a negative pressure generating circuit communicating with the exhaust hole 202b, and a supply circuit communicating with the ventilation unit 203a, and controls the holding, positioning, and release of the electronic component 2.

[0052] The bonding head control unit 54 controls the movement of the bonding head 31, i.e., the operation of the head moving mechanism 32. The bonding head control unit 54 also controls a negative pressure generating circuit that is in communication with the nozzle hole of the bonding head 31, and controls the holding and release of the electronic component 2. The substrate stage control unit 56 controls the movement of the substrate stage 60, i.e., the operation of the stage moving mechanism 61.

[0053] The storage unit 57 is a recording medium including various memories, HDD, SSD, etc. The storage unit 57 prestores data and programs necessary for the operation of the transfer device 1, and also stores data necessary for the operation of the transfer device 1. This necessary data is, for example, the amount of gas supply, exhaust pressure, position coordinates of the supply position P1, the delivery position P2, and the mounting position P3, and position coordinates of each moving mechanism. Each of the above-mentioned moving mechanisms controls the movement of each component based on these coordinates.

[0054] [Principle of suction and holding by pickup collet] Next, the principle by which the pickup collet 200 as described above can suck and hold the electronic component 2 will be described. As shown in FIG. 3(A), the gas supplied from the air supply hole 202a is ejected in a planar manner from the pores of the facing surface 201a, forming a gas layer between the electronic component 2. This layer is, for example, 2 to 10 μm. Then, the electronic component 2 is sucked and held by bringing the facing surface 201a close to the electronic component 2 while applying negative pressure to the suction hole 201c by the negative pressure generating circuit. At this time, since a gas layer is formed between the facing surface 201a and the electronic component 2, the facing surface 201a and the electronic component 2 are maintained in a non-contact state. Furthermore, by releasing the negative pressure by the negative pressure generating circuit, the negative pressure no longer acts on the suction hole 201c, and the electronic component 2 is released from the pickup collet 200.

[0055] [Principle of positioning of electronic components in a pickup collet] Furthermore, a principle for positioning the electronic component 2 in the above-described pickup collet 200 will be described. That is, by making the side of one of the orthogonal guide parts 203K, 203L relatively more positive than the side of the other orthogonal guide parts 203M, 203N, the electronic component 2 is brought closer to the other orthogonal guide parts 203M, 203N, which is the relatively negative pressure side, and is positioned at a corner of the opposing surface 201a along which the other orthogonal guide parts 203M, 203N are located.

[0056] In this embodiment, gas is ejected from the ventilation section 203a of the one of the orthogonal guide sections 203K, 203L through the ejection port 203b to the two orthogonal side surfaces of the electronic component 2 held on the opposing surface 201a as described above, as shown in Fig. 3(A) and Fig. 7(A) and (B). Then, the other two orthogonal side surfaces of the electronic component 2 are pressed against the inner walls of the other orthogonal guide sections 203M, 203N. This positions the electronic component 2 at the corners of the opposing surface 201a.

[0057] [Operation] In the transfer device 1 as described above, the operation of picking up an electronic component 2 from the supply device 10 by the pickup device 20 and transferring the electronic component 2 to the mounting device 30 will be described below with reference to the flowchart in FIG. 8 and the explanatory diagram in FIG. 9 in addition to FIGS. 1 to 7.

[0058] First, the pickup device 20 and the supply device 10 move the pickup collet 200 to the supply position P1 where the push-up pins 24 are located, and the opposing surface 201a of the pickup collet 200 and the push-up pins 24 are opposed to each other (step S01). At this time, pressurized gas is supplied to the porous member 201 through the air supply hole 202a, and the gas is blown out from the opposing surface 201a. At this time, no exhaust is being performed from the exhaust hole 202b, and no suction is being performed from the opening 201d. No gas is being blown out from the nozzle 203b.

[0059] On the other hand, the supply device 10 moves the supply stage 12 and positions the electronic component 2 to be picked up at the supply position P1 as shown in Fig. 9(A) (step S02). After that, the pickup collet 200, to which gas is supplied on the surface of the facing surface 201a, descends together with the pickup head 21 and approaches the electronic component 2. At this time, as shown in Fig. 9(B), in order to prevent the guide portion 203 from hitting the surrounding electronic components 2, the push-up pin 24 rises and pushes up the electronic component 2 to be picked up as the pickup collet 200 starts to descend, depending on the amount of protrusion of the guide portion 203 from the facing surface 201a, thereby raising the electronic component 2 to a height at which the guide portion 203 will not hit the surrounding electronic components 2.

[0060] When the descended pickup collet 200 approaches the electronic component 2, the gas supplied to the surface of the facing surface 201a is sandwiched between the facing surface 201a and the electronic component 2 to form a gas layer. The sandwiched gas layer at this time is considered to be a viscous flow layer. Then, the pickup collet 200 stops descending relative to the electronic component 2 due to the gas layer not being compressed any further (step S03). As described above, the electronic component 2 to be picked up is higher than the surrounding electronic components 2, so the guide portion 203 does not come into contact with the surrounding electronic components 2 on the sheet 11 to be picked up.

[0061] Here, when the pickup collet 200 comes into contact with the electronic component 2 through the gas layer, the pickup collet 200 itself stops. However, since the pickup collet 200 is elastically supported by the pickup head 21, even if the pickup collet 200 stops, the pickup head 21 continues to descend and slides relative to the pickup collet 200. When this sliding is detected by the sensor, the pickup control unit 53 recognizes that the pickup collet 200 has come into contact with the electronic component 2 and stops the descent of the pickup head 21. At this time, the pickup collet 200 is not in direct contact with the electronic component 2. However, since a gas layer is formed between the facing surface 201a and the electronic component 2, the facing surface 201a cannot get any closer to the electronic component 2 and stops. The height position of the pickup collet 200 at this time is the approach position H1. In other words, the approach position H1 is not set as a specific stop position in advance.

[0062] In this manner, with the pickup collet 200 stopped via the gas layer and the pickup head 21 also stopped, suction is started via the suction hole 201c by exhausting air from the exhaust hole 202b (step S04). That is, as shown in Fig. 9(C), suction is started in a state where the pickup collet 200 presses the electronic component 2 against the sheet 11 supported by the backup body 241 via the gas layer, that is, in a state where the sheet 11 and the electronic component 2 are sandwiched between the pickup collet 200 and the backup body 241.

[0063] In this state, the pickup collet 200 rises, and in synchronization therewith, the push-up pins 24 rise further and stop when they have risen a preset amount (step S05). Then, as shown in Fig. 9(D) , the pickup collet 200 further rises, and the electronic component 2 that has been sucked into the pickup collet 200 by negative pressure while maintaining a gap created by the gas layer is peeled off from the sheet 11 and picked up (step S06). In this way, the height position at which the electronic component 2 is completely peeled off is the peeling position H2, but this is not set in advance as a specific stopping position.

[0064] The pickup device 20 reverses the pickup collet 200 by the direction changing unit 23 (step S07). That is, the orientation of the pickup collet 200 is rotated 180° in the vertical direction so that the opposing surface 201a of the pickup collet 200 faces upward. Note that the reversing operation in step S07 is performed immediately after the electronic component 2 is picked up, but may be performed at any point between the supply position P1 and the transfer position P2.

[0065] The pickup device 20 moves the picked up electronic component 2 to the transfer position P2 by the collet moving mechanism 22 (step S08). At the transfer position P2, the bonding head 31 of the mounting device 30 is on standby and faces the opposing surface 201a of the pickup collet 200 with the electronic component 2 interposed therebetween.

[0066] Then, as shown in FIG. 3(A) and FIG. 7(B), gas is ejected from the ventilation portion 203a of the orthogonal guide portions 203K, 203L through the ejection port 203b to press the electronic component 2 against the inner wall of the orthogonal guide portions 203M, 203N (step S09). By positioning the electronic component 2 after it is turned over in this manner, it is possible to correct the positional deviation caused by the turning over. Also, by positioning the electronic component 2 immediately before it is transferred to the bonding head 31, it is possible to minimize the time of contact with the guide portions 203M, 203N, and to suppress the influence of the contact on the electronic component 2. However, the timing of positioning is not limited to this. Positioning may be performed immediately after picking up the electronic component 2, before turning over the electronic component 2, or during the movement of the electronic component 2 to the transfer position P2.

[0067] The bonding head 31 is lowered toward the pickup collet 200 positioned at the transfer position P2, and after the bonding head 31 holds the electronic component 2, the pickup collet 200 releases the negative pressure, thereby transferring the electronic component 2 from the pickup collet 200 to the bonding head 31 (step S10). After this, the bonding head 31 rises away from the pickup collet 200, moves to the mounting position P3, and mounts the electronic component 2 on the board.

[0068] [effect] (1) The pickup collet 200 of this embodiment is a pickup collet 200 that sucks and holds an electronic component 2 having a rectangular outer edge and picks up the electronic component 2. The pickup collet 200 has a porous member 201 that is breathable and that ejects gas supplied to the inside in a planar manner through pores in an opposing surface 201a that faces the electronic component 2. The porous member 201 has an opening 201d in the opposing surface 201a and is provided with suction holes 201c that suck the electronic component 2 by negative pressure. The porous member 201 is provided with a guide portion 203 that is arranged along the outer edge of the electronic component 2 and restricts the movement of the electronic component 2 held on the opposing surface 201a. The guide portion 203 is provided with a ventilation portion 203a that makes the side of one orthogonal guide portions 203K, 203L relatively more positively pressured than the other orthogonal guide portions 203M, 203N.

[0069] In addition, the pickup device 20 of this embodiment has a collet moving mechanism 22 that moves the pickup collet 200 close to a position where the electronic component 2 on the sheet 11 can be suction-held, and peels the suction-held electronic component 2 off the sheet 11 so that it can be transported.

[0070] Furthermore, the mounting device 100 of this embodiment has a bonding head 31 that is movable relative to the pickup collet 200 and receives the electronic component 2 from the tip of the pickup collet 200, and a mounting section that transfers the electronic component 2 held by the bonding head 31 to a substrate and mounts it thereon.

[0071] Therefore, when picking up the electronic component 2 by suction through the suction holes 201c, the layer of gas discharged from the pores of the porous member 201 can keep the electronic component 2 and the facing surface 201a out of contact with each other, thereby suppressing damage to the electronic component 2. Also, when the electronic component 2 is transferred, the electronic component 2 can be held to prevent it from falling, while reducing the possibility of the electronic component 2 being damaged by contact with the facing surface 201a.

[0072] Even if the electronic component 2 moves horizontally on the opposing surface 201a, which is held in a non-contact manner, due to the inertial force accompanying the movement of the electronic component 2 during inversion, etc., the guide portion 203 can prevent the electronic component 2 from coming off the pickup collet 200.

[0073] Furthermore, by applying a relatively positive pressure to the side of the orthogonal guide parts 203K and 203L, the electronic component 2 is positioned at a corner formed by the plane along which the other orthogonal guide parts 203M and 203N are aligned. Therefore, even if the position and angle of the electronic component 2 held on the facing surface 201a varies when the electronic component 2 is picked up, the electronic component 2 can be delivered to the bonding head 31 at a fixed position, and deviations during mounting can be reduced. When positioned, the electronic component 2 moves in a direction parallel to the facing surface 201a, but as described above, the electronic component 2 is not in contact with the facing surface 201a, so that scratches caused by rubbing of the electronic component 2 are prevented. Even if the position of the electronic component 2 is shifted within the area surrounded by the guide parts 203, as long as the suction by the opening 201d is within the projection plane of the electronic component 2, suction and holding is possible regardless of the position of the opening 201d.

[0074] Here, the reason why the above-mentioned guide portion 203 and positioning are effective in the case of the pickup collet 200 that holds the electronic component 2 in a non-contact manner as in this embodiment will be described in more detail. That is, the electronic component 2 is held in a non-contact manner by the pickup collet 200, and can be easily moved in the horizontal direction. Therefore, the electronic component 2 may move on the opposing surface 201a of the pickup collet 200 due to the inertial force acting on the electronic component 2 caused by the movement of the pickup collet 200 to the transfer position P2 or the inversion operation. Even if such a movement occurs, the movement of the electronic component 2 is restricted to a predetermined area by the guide portion 203, and therefore the electronic component 2 is prevented from falling off the pickup collet 200.

[0075] Incidentally, the distance between the guide parts 203 must be set larger than the size of the electronic component 2 in order to avoid contact with the electronic component 2 when it is picked up from the sheet 11. Therefore, a gap is provided between the electronic component 2 sucked and held by the pickup collet 200 and the guide parts 203. For this reason, when the electronic component 2 moves as described above, the holding posture of the position and angle of the electronic component 2 may move within the range of this gap. Such a holding posture state has a large variation. If there is such a variation in the holding posture, the holding posture of the electronic component 2 delivered to the bonding head 31 will also vary with respect to the reference position (fixed position) that is the reference for positioning, and when the holding position of the electronic component 2 is recognized by capturing an image of the electronic component 2 with an imaging device (not shown) or the like, it takes time or the amount of correction of the position is large, resulting in a large movement error during correction. In this embodiment, as described above, the electronic component 2 can always be positioned at a fixed position with respect to the facing surface 201a, so that the variation in the holding posture can be suppressed and the amount of correction of the position and the movement error during correction can be reduced.

[0076] The fixed position is a holding posture in which the electronic component 2 is held by the pickup collet 200 and handed over to the bonding head 31 almost as is, and also corresponds to a reference position for mounting the electronic component 2 on a board. Even if the holding posture of the electronic component 2 varies with respect to the reference position when the electronic component 2 is photographed and its position recognized by a camera, the fixed position includes the variation in the holding posture within an allowable range as long as it is within an allowable recognition time and a movement error in the correction movement.

[0077] Also, consider a case where the electronic component 2 is held by a Bernoulli chuck that generates a suction force by using a negative pressure generated by a large amount of airflow by flowing gas discharged from the space between the electronic component 2 and the surface facing the electronic component 2. In this case, even if the suction force is very weak and the electronic component 2 can be held at a certain distance from the collet, it is not possible to obtain an adhesion force that can peel off the electronic component 2 adhered to the sheet 11. In addition, in order to obtain the Bernoulli effect, it is necessary to make the flow rate of the gas per unit time very large, so that it is very difficult to adjust the suction force for holding while maintaining non-contact. Furthermore, there is a risk of particles being generated by blowing a large amount of gas around the pick-up location.

[0078] Furthermore, even if gas outlet holes of the same size as the suction holes, rather than pores like those in the porous member 201, are provided on the surface of the collet facing the electronic component 2, and gas is sprayed toward the electronic component 2 to levitate it, and then the electronic component 2 is sucked up through the suction holes against the levitation force of the electronic component 2 caused by this spray, it is extremely difficult to adjust the suction force to hold the electronic component 2 while maintaining non-contact (levitation) as described above, and there is a risk of particles being generated due to a large amount of gas being blown out around the pick-up location.

[0079] In contrast, in this embodiment, the flow rate of the gas blown out from the entire opposing surface 201a in a planar manner through the fine holes in the opposing surface 201a is extremely small. Therefore, there is no risk of generating particles. The blown out from the opposing surface 201a does not actively suspend the electronic component 2, but forms a layer of viscous gas when the opposing surface 201a and the electronic component 2 come close to each other. Therefore, the stronger the suction force, the easier it is to keep the opposing surface 201a and the electronic component 2 in a non-contact state. Even if the suction force due to the negative pressure from the suction holes 201c is sufficient to peel the electronic component 2 off the sheet 11, the layer of gas between the opposing surface 201a and the electronic component 2 can prevent contact, so that it is easy to obtain a strong suction force and to adjust the suction force.

[0080] For example, under the following conditions, the pickup collet 200 can suck and hold the electronic component 2 while maintaining non-contact with it. The porous member 201 used has an air permeability of, for example, about 0.7 L / min of gas flowing out of the porous member 201 when the supply pressure is 0.3 MPa. The pressure of the gas (nitrogen gas) supplied to the porous member 201 may be in the range of about 0.1 to 0.7 MPa, and the flow rate of the gas flowing through the porous member 201 is in the range of about 0.3 to 1.5 L / min, so that the pickup collet 200 and the electronic component 2 can be reliably maintained non-contact with each other. In addition, the suction pressure is in the range of -10 to -90 kPa, so that the electronic component 2 can be reliably picked up from the sheet 11. At this time, the pressure in the gas layer between the electronic component 2 and the facing surface 201a is 0.1 to 0.5 MPa.

[0081] (2) The ventilation portion 203a is provided so as to be able to blow out gas from one of the orthogonal guide portions 203K, 203L. Therefore, the blowing out of gas creates a relatively positive pressure on the one of the orthogonal guide portions 203K, 203L, and the electronic component 2 can be moved in a non-contact manner to the other orthogonal guide portion 203, thereby reducing damage to the electronic component 2 during positioning.

[0082] [Variations] The present invention is not limited to the above-described embodiment. The following modified examples are also applicable, provided that the basic configuration is similar to that of the above-described embodiment. (1) If the electronic component 2 comes into contact with the other orthogonal guide portions 203M, 203N, there is a possibility that the electronic component 2 may be affected. Therefore, while continuing to eject gas from guide portions 203K, 203L, guide portions 203M, 203N are made to eject gas so as to be out of contact with the side surface of the electronic component 2. Even in this case, by making the guide portions 203K, 203L relatively positive pressure, it is possible to position the electronic component 2 while preventing it from departing from the pickup collet 200 during the inversion or movement of the pickup collet 200, and to eliminate damage to the electronic component 2 caused by contact with the guide portions 203.

[0083] For example, as shown in Fig. 10, the ventilation part 203a is provided so that gas can be ejected from the other orthogonal guide parts 203M, 203N through the guide porous member 203c. That is, the guide porous member 203c is provided at a position facing the side surface of the electronic component 2 of the protruding part of the other orthogonal guide parts 203M, 203N. The ventilation part 203a that communicates the guide porous member 203c with the outside is provided inside the guide parts 203M, 203N. The ventilation part 203a is connected to a gas supply circuit through a pipe (not shown) and is controlled by the control device 50.

[0084] The guide parts 203M and 203N blow out gas through the guide porous member 203c. As a result, a gas layer is formed along the side surface of the guide parts 203M and 203N, so that when the electronic component 2 moves to the other orthogonal guide part 203M or 203N side for positioning, the electronic component 2 can be kept out of contact with the other pair of guide parts 203. Therefore, the electronic component 2 is positioned via the gas layer, chipping and cracking of the electronic component 2 are reduced, and the generation of particles due to contact can also be suppressed. Since the amount of gas blown out is small, the generation of particles due to airflow can also be suppressed. Furthermore, the displacement and falling of the electronic component 2 during transportation can also be reduced.

[0085] 11(A), gas is ejected toward the other two orthogonal side surfaces of the electronic component 2 from the ejection port 203b communicating with the ventilation portion 203a of the other orthogonal guide portion 203M, 203N in addition to the orthogonal guide portions 203K, 203L, thereby preventing the electronic component 2 from shifting or coming off during movement or inversion, and preventing contact with the electronic component 2. The ventilation portion 203a is also connected to a gas supply circuit via a pipe (not shown), and the supply circuit is controlled by the control device 50. In this case, the gas may be ejected from the guide portions 203M, 203N to such an extent that the side surfaces of the electronic component 2 do not come into contact with the guide portions 203M, 203N, or, even if they do come into contact, damage to the electronic component 2 is within an allowable range. In other words, even in this case, by making the amount of gas ejected from guide portions 203M, 203N less than the amount of gas ejected from guide portions 203K, 203L, the pressure on the side of guide portions 203K, 203L can be made relatively positive, preventing electronic component 2 from escaping from pickup collet 200 while pickup collet 200 is inverted or moving, while positioning electronic component 2 via the gas layer, and eliminating damage to electronic component 2 due to contact with guide portion 203.

[0086] Furthermore, in this case, as shown in FIG. 11B, when positioning, the gas ejection from the other orthogonal guide parts 203M, 203N is stopped and gas is ejected only from one orthogonal guide parts 203K, 203L, so that the side of one orthogonal guide parts 203K, 203L is relatively positive pressure, and the electronic component 2 can be positioned. Since the ejection from the other guide parts 203M, 203N is stopped when the electronic component 2 is in close proximity to or in contact with the other guide parts 203M, 203N, the impact on the electronic component 2 is suppressed and chipping is unlikely to occur. Then, the electronic component 2 can be pressed against the other orthogonal guide parts 203M, 203N to ensure reliable positioning. When the gas ejection from the other orthogonal guide parts 203M, 203N is stopped, the ejection may be gradually weakened and stopped. The impact on the electronic component 2 when the electronic component 2 is pressed against the guide portions 203M and 203N for positioning is further reduced, making it less likely to chip.

[0087] In this manner, in the above positioning step, gas may or may not be ejected from one of the orthogonal guide portions 203K, 203L and from the other orthogonal guide portions 203M, 203N.

[0088] Also, the gas may be blown out evenly from all the guide parts 203K, 203L, 203M, and 203N from the time when the electronic component 2 is picked up to the transfer position P2, and the blowing of the gas from the other orthogonal guide parts 203M and 203N may be stopped or weakened at the transfer position P2. This prevents the electronic component 2 from contacting the guide parts 203 until the transfer position P2, and prevents damage to the electronic component 2. In addition, at the transfer position P2, the electronic component 2 can be positioned by applying a relatively positive pressure to the one orthogonal guide parts 203K and 203L side. Therefore, the electronic component 2 can be positioned while preventing deviation of the electronic component 2 from the pickup collet 200 during the inversion or movement of the pickup collet 200, and damage to the electronic component 2 due to contact with the guide parts 203 can be eliminated.

[0089] Furthermore, as shown in FIG. 12, the ventilation section 203a can be provided so as to be able to suck in gas from the other two orthogonal sides of the guide section 203. For example, the ventilation section 230a is provided inside the other orthogonal guide sections 203M and 203N so as to communicate between the outside and the periphery of the electronic component 2 held on the opposing surface 201a. The ventilation section 203a is connected to a gas exhaust circuit (negative pressure generating circuit) via a pipe not shown, and the exhaust circuit is controlled by the control device 50. The end of the ventilation section 203a is a suction port 203d that faces the other two side surfaces of the electronic component 2. Therefore, the side surfaces of the electronic component 2 can be sucked in from the suction port 203d. As a result, the pressure on the one orthogonal guide sections 203K and 203L side is relatively more positive than the pressure on the other orthogonal guide sections 203M and 203N side, so that the electronic component 2 is positioned at the corner of the fixed position in the same manner as described above. In this case, the ventilation portion 230a may or may not be provided in one of the perpendicular guide portions 203K, 203L.

[0090] A predetermined time required for the electronic component 2 to be positioned may be obtained in advance by an experiment or the like, and the other guide parts 203M, 203N may be switched to suction after the predetermined time has elapsed. For example, at the transfer position P2, gas may be blown out from one of the guide parts 203K, 203L as described above, and the gas may be sucked in from the other guide parts 203M, 203N after the predetermined time has elapsed. Alternatively, gas may be blown out from one of the guide parts 203K, 203L after the electronic component 2 is picked up, and the gas may be sucked in from the other guide parts 203M, 203N after the predetermined time has elapsed. In this case, the electronic component 2 is switched to suction in the state of being close to or in contact with the other guide parts 203M, 203N, so that the impact on the electronic component 2 is suppressed and chipping is less likely to occur. When the electronic component 2 is ejected from one of the guide portions 203K, 203L and brought close to the other guide portion 203M, 203N, the ejection can be gradually weakened to soften the impact, and then the ejection can be stopped before sucking from the other guide portion 203M, 203N. This allows the electronic component 2 to be sucked onto the guide portions 203M, 203N after positioning, so that there is no risk of misalignment again. Therefore, positioning can be completed during movement, and the time required for positioning at the transfer position P2 can be eliminated, improving productivity.

[0091] The guide portion 203 as described above may be provided along the outer edge of the facing surface 201a so as to restrict the movement of the electronic component 2. For this reason, the guide portion 203 may be provided along the entire circumference of the facing surface 201a, or may be provided along a part of the circumference. For example, the guide portions 203 may be arranged to sandwich a corner as shown in FIG. 13(A) or continuously along a corner as shown in FIG. 13(B), and the electronic component 2 may be positioned by applying a relatively positive pressure to one of the orthogonal guide portions 203. Note that, as shown in FIG. 13(B), one orthogonal guide portion 203 and the other orthogonal guide portion 203 may be continuous with each other.

[0092] (2) The number and size of the suction holes 201c, the openings 201d, the ejection ports 203b, and the suction ports 203d are not limited to the above embodiment. The suction-holding state and the non-contact state can be maintained by balancing the area of ​​the electronic component 2 supported by the gas layer and the total area of ​​the openings 201d on the opposing surface 201a of the porous member 201. Also, the number and size of the ejection ports 203b or the suction ports 203d may be determined so that the electronic component 2 can be positioned on the other orthogonal guide portion 203.

[0093] (3) The positions and shapes of the suction holes 201c, the openings 201d, the nozzles 203b, and the suction ports 203d are not limited to the above. For example, the shape of the openings 201d may be circular or rectangular as described above, or may be other shapes such as an ellipse, a polygon, a polygon with rounded corners, or a star.

[0094] (4) The pickup collet 200 can be replaced depending on the shape and size of the electronic component 2 by making it replaceable. A structure that allows for this replacement and can be attracted and held by a magnet is a simple configuration, and the replacement work is also easy. However, any configuration that allows the pickup collet 200 to be replaceable will suffice. For example, it may be held by suction using negative pressure, or it may be a mechanically held structure.

[0095] (5) The outer edge of the pickup collet 200 is not limited to a rectangle. Also, the guide portion 203 may be arranged along the outer edge of the electronic component 2, and does not have to be provided on the outer edge of the pickup collet 200 as described above. For example, as shown in FIG. 14, the pickup collet 200 may have a base 202 with a curved outer edge, such as a cylindrical shape, and the guide portion 203 may be arranged on the bottom surface. The opposing surface 201a is also not limited to a rectangle.

[0096] [Other embodiments] The present invention is not limited to the above-described embodiment, but also includes other embodiments described below. The present invention also includes a combination of all or any of the above-described embodiment and the other embodiments described below. Furthermore, these embodiments can be omitted, replaced, or modified in various ways without departing from the scope of the invention, and such modifications are also included in the present invention. [Explanation of symbols]

[0097] 1 Transfer device 2. Electronic Components 10 Feeding device 11 sheets 12 Supply Stage 13 Stage movement mechanism 20 Pick-up device 21 Pickup Head 22 Collet movement mechanism 23 Turning Point 24 Push-up pin 30 Onboard Equipment 31 Bonding Head 31a Nozzle 32 Head movement mechanism 50 Control device 51 Supply device control section 52 Push-up pin control section 53 Pickup control section 54 Bonding head control unit 56 Substrate stage control unit 57 Memory section 60 Substrate Stage 61 Stage movement mechanism 100 Mounting device 200 Pickup collet 201 Porous Materials 201a Opposite side 201b back 201c Suction hole 201d aperture 203, 203K~203N Guide section 203a Ventilation section 203b spout 203c Porous material for guide 203d Suction port 202 Base 202a Air supply hole 202b Exhaust hole 202c Mounting hole 221 Slide mechanism 221a Support frame 221b Rail 221c slider 222 Lifting mechanism 222a Arm 222b Detachable part 222c Pin 241 Backup body 321 Slide mechanism 321a Support frame 321b Rail 321c slider 322 Lifting mechanism

Claims

1. A pickup collet that picks up an electronic component having a rectangular outer edge by suction and holding the electronic component, a porous member having air permeability and configured to eject gas supplied therein in a planar manner through pores on a surface facing the electronic component; the porous member has an opening on the opposing surface, and a suction hole is provided for sucking the electronic component by negative pressure; a guide portion is provided, the guide portion being disposed along an outer edge of the electronic component and configured to restrict movement of the electronic component held on the facing surface; A pickup collet, comprising: a ventilation section for making one of said guide sections perpendicular to said guide section relatively more positively pressured than the other of said guide sections perpendicularly to said guide section.

2. 2. The pickup collet according to claim 1, wherein the ventilation portion is provided so as to be able to blow out gas from one of the guide portions perpendicular to the guide portion.

3. 3. The pickup collet according to claim 2, wherein the ventilation portion is provided so as to be capable of blowing out gas from the other of the guide portions perpendicular to the guide portion through a porous guide member.

4. 3. The pickup collet according to claim 1, wherein the ventilation portion is provided so as to be able to suck gas from the other of the guide portions, which is perpendicular to the ventilation portion.

5. A pickup device that picks up the electronic components from a sheet to which the electronic components are attached, A pickup collet according to any one of claims 1 to 4, a collet moving mechanism that moves the pickup collet close to a position on the sheet where the electronic component can be sucked and held, and peels the sucked and held electronic component off the sheet and transfers it; A pickup device comprising:

6. A pickup device that picks up the electronic components from a sheet to which the electronic components are attached, A pickup collet according to claim 1, The ventilation portion is provided so as to be able to eject gas from one of the orthogonal guide portions, a collet moving mechanism that moves the pickup collet close to a position on the sheet where the electronic component can be sucked and held, and peels the sucked and held electronic component off the sheet and transfers it; a control device that ejects gas from one of the guide portions that is perpendicular to the pickup collet at a transfer position where the electronic component is transferred from the pickup collet to a bonding head that mounts the electronic component on a substrate; A pickup device comprising:

7. The ventilation portion is provided so as to be able to suck gas from the other of the guide portions perpendicular to the guide portion, 7. The pickup device according to claim 6, wherein the control device causes gas to be ejected from one of the orthogonal guide portions at the transfer position, and after a predetermined time has elapsed, causes gas to be sucked in from the other orthogonal guide portion.

8. A pickup device that picks up the electronic components from a sheet to which the electronic components are attached, A pickup collet according to claim 1, The ventilation section is provided so as to be able to eject gas from one of the guide sections perpendicular to the guide section, and is provided so as to be able to suck gas from the other of the guide sections perpendicular to the guide section, a collet moving mechanism that moves the pickup collet close to a position on the sheet where the electronic component can be sucked and held, and peels the sucked and held electronic component off the sheet and transfers it; a control device that ejects gas from one of the guide portions perpendicular to the pickup collet after the pickup collet picks up the electronic component, and sucks the gas from the other guide portion perpendicular to the pickup collet after a predetermined time has elapsed; A pickup device comprising:

9. A pickup device that picks up the electronic components from a sheet to which the electronic components are attached, A pickup collet according to claim 1, The ventilation portion is provided so as to be able to eject gas from one of the guide portions perpendicular to the guide portion and the other of the guide portions perpendicular to the guide portion, a collet moving mechanism that moves the pickup collet close to a position on the sheet where the electronic component can be sucked and held, and peels the sucked and held electronic component off the sheet and transfers it; a control device that, after the pickup collet picks up the electronic component, ejects gas from one of the orthogonal guide portions and the other orthogonal guide portion, and stops ejection of gas from the other orthogonal guide portion at a transfer position where the electronic component is transferred from the pickup collet to a bonding head that mounts the electronic component on a substrate; A pickup device comprising:

10. A pickup device according to any one of claims 5 to 9, a bonding head that is provided so as to be movable relative to the pickup collet and that receives the electronic component from the pickup collet; a mounting section that transfers the electronic component held by the bonding head to a substrate and mounts the electronic component on the substrate; A mounting device comprising:

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